JP2010219774A - Ultrasound transducer, ultrasound probe, and ultrasound diagnostic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasound transducer capable of avoiding a situation where it is hard to perform connection to an ultrasound diagnostic apparatus body even when the number of piezoelectric elements is increased in the ultrasound transducer, and also reliably transmitting/receiving the ultrasound wave of the ultrasound transducer. <P>SOLUTION: Front surface side substrates to be arranged on the front surfaces of ultrasound vibrators commonly perform the connection of the respective front surface electrodes of a first vibrator group being a part of a plurality of ultrasound vibrators. Electrode pads are individually formed at positions respectively corresponding to the front surface electrodes of a second vibrator group different from the first vibrator group. Rear side substrates to be arranged on the rear surface sides of the ultrasound vibrators commonly perform the connection of the respective rear surface electrodes of the second vibrator group. Electrode pads are individually formed at positions respectively corresponding to the rear surface electrodes of the first vibrator group. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus, and more particularly to a technique of an ultrasonic transducer provided in the ultrasonic probe.

  In order to acquire information on a desired diagnostic region of a subject using an ultrasonic probe, an ultrasonic diagnostic apparatus transmits (transmits) ultrasonic waves to the region, and reflects waves from tissue boundaries in the subject having different acoustic impedances. Receive. In this way, diagnosis is performed by scanning ultrasonic waves with an ultrasonic probe, obtaining information on the body tissue of the subject, and imaging it. This ultrasonic probe has an ultrasonic transducer for transmitting an ultrasonic wave to a subject or the like and receiving a reflected wave.

  In recent years, a method of rotating and swinging a one-dimensional array of ultrasonic transducers in an ultrasonic probe, or an electronic scanning type using a two-dimensional array of ultrasonic transducers in which ultrasonic transducers are arranged in a matrix are used. Studies on a system for acquiring and displaying three-dimensional ultrasonic images using an ultrasonic probe are in progress. A three-dimensional ultrasonic image is useful for diagnosing a part that is easily overlooked in a two-dimensional image, and a tomographic image suitable for diagnosis and measurement can be obtained, so that improvement in diagnostic accuracy can be expected.

  As an example of such an ultrasonic probe, there is one in which an electronic circuit that transmits and receives an electric signal is incorporated inside the grip portion. The electronic circuit disposed in the ultrasonic probe is connected to each ultrasonic transducer in the ultrasonic transducer, and generates a transmission pulse based on a control signal from the ultrasonic diagnostic apparatus main body to generate the ultrasonic transducer. Send to each. In the electronic circuit, the electrical signal converted by the ultrasonic transducer is subjected to a bundling process or the like and then transmitted to the ultrasonic diagnostic apparatus main body. As another example of an ultrasonic probe, a plurality of ultrasonic transducers are connected together as a group via a switch having a variable connection pattern, so that the plurality of ultrasonic transducers are collectively connected to an ultrasonic diagnostic apparatus. Connected to the transmitter / receiver circuit of the main body.

  Here, an example of the above-described conventional ultrasonic probe and an ultrasonic transducer provided in the ultrasonic probe will be described with reference to FIGS. 9 to 14 are schematic views showing a conventional ultrasonic transducer, an electronic circuit, and a wiring board for connecting them, which are provided in the ultrasonic probe.

  As shown in FIG. 9, the ultrasonic transducer 300 has ultrasonic transducers 314 arranged in a two-dimensional manner. Further, the first acoustic matching layers 310 are arranged adjacent to each other corresponding to the ultrasonic transducers 314, respectively. Furthermore, the second acoustic matching layer 311 is disposed on the opposite side of the first acoustic matching layer 310 from the surface on the ultrasonic transducer 314 side. That is, in the ultrasonic transducer 300, as shown in FIG. 9, the ultrasonic transducer 314, the first acoustic matching layer 310, and the second acoustic matching layer 311 are arranged in this order. Further, as shown in FIG. 9, on the surface opposite to the first acoustic matching layer 310 side (hereinafter referred to as “back surface”) in the two-dimensionally arranged ultrasonic transducers 314, a plurality of ultrasonic transducers 314 are entirely disposed. On the other hand, one backing material 318 having sound absorption is provided. As described above, the ultrasonic transducer 300 is laminated in the order of the backing material 318, the ultrasonic transducer 314, the first acoustic matching layer 310, and the second acoustic matching layer 311, and ultrasonic waves are radiated in the lamination direction.

  As shown in FIG. 9, a ground electrode 312 is formed on the ultrasonic transducer 314, the first acoustic matching layer 310, and the boundary surface (hereinafter referred to as “front surface”) in the ultrasonic transducer 300. In addition, a signal electrode 316 is provided on a boundary surface (back surface) between the ultrasonic transducer 314 and the backing material 318. By using the ground electrode 312 and the signal electrode 316 as electrodes having different polarities, one ultrasonic transducer 314 is sandwiched between the electrodes having different polarities, and the ultrasonic transducer is generated by an electric signal from an electronic circuit. Can be driven.

  In such a conventional ultrasonic transducer 300, the wiring pattern (not shown) formed on the flexible printed circuit (FPC) 322 is connected to the ground electrode 312 and the transmission / reception circuit as shown in FIG. Do by. That is, the first acoustic matching layer 310 and the second acoustic matching layer 311 adjacent to the ground electrode 312 of the ultrasonic transducer 314 have conductivity. Through these, the ground electrode 312 and the wiring pattern of the flexible wiring board 322 are connected, and these wiring patterns are connected in common and led to the electronic circuit.

  On the other hand, the signal electrode 316 and the transmission / reception circuit in the ultrasonic transducer 300 are connected by a wiring pattern 321 formed on the flexible wiring board 320 as shown in FIG. However, in the two-dimensional array of ultrasonic transducers, the number of elements of the ultrasonic transducer is increased as compared to the one-dimensional array of ultrasonic transducers (for example, 10 by arranging the ultrasonic transducers two-dimensionally). Times to 100 times). With the increase in the number of ultrasonic vibrators, the number of wiring patterns is also greatly increased.

  For example, as shown in FIG. 11, in the ultrasonic transducer 300, a connection pad 321 a is formed on the flexible wiring board 320 in order to connect each signal electrode 316 of the ultrasonic transducer 314 and the wiring pattern 321. Therefore, the connection pads 321a are formed on the connection surface of the flexible wiring board 320 with each ultrasonic transducer 314 by the number of ultrasonic transducers 314 that are two-dimensionally arranged. However, it is necessary to form wiring patterns 321 corresponding to the number of ultrasonic transducers 314 between a large number of connection pads 321a (see FIG. 11). In such a configuration, the pitch of the wiring pattern 321 and the connection pad 321a is very dense, and it is very difficult to realize. There exists patent document 1 as an example of such a conventional ultrasonic transducer.

  Therefore, in the conventional ultrasonic transducer 300 as shown in FIGS. 9 to 11, the flexible wiring board 320 is disposed between the backing material 318 and the ultrasonic transducer 314, and the subsequent transmission / reception circuit is formed by the wiring pattern 321. In order to realize a configuration in which the ultrasonic transducers 314 are connected to each other, the entire two-dimensional array of the ultrasonic transducers 314 is divided into a plurality of modules (ultrasonic transducer groups), and flexible wiring boards 320 and 322 are provided for each module.

  That is, as shown in FIG. 12, a predetermined number of units of ultrasonic transducers 314 are used as a single module, and the modules are arranged two-dimensionally to form the ultrasonic transducer 300. As shown in FIG. 12, the number of wiring patterns 321 assigned to one module is reduced by assigning the flexible wiring board 320 to each module comprising the ultrasonic transducer 314 group. With this configuration, the transmission / reception circuits 332 and 334 on the relay substrate 330 arranged in accordance with each module can be connected to the signal electrode 316 of the ultrasonic transducer 314.

  In the ultrasonic transducer 300 as shown in FIG. 12, flexible wiring boards 320 and 322 are interposed between the modules. For example, four flexible wiring boards 320 and 322 are interposed between the ultrasonic transducer 314 modules shown in FIG. Therefore, the pitch L2 between the adjacent ultrasonic transducers 314 modules becomes longer than the pitch L1 (see FIG. 12) between the ultrasonic transducers 314 in the module. That is, the element arranged at the end of the module and the element at the end of another module adjacent to the element are separated by the thickness and arrangement interval of the flexible wiring boards 320 and 322 interposed therebetween.

  However, the greater the pitch between the ultrasonic transducers 314, the greater the influence of sidelobe artifacts, which may cause problems with the reliability of the ultrasonic image. Furthermore, if a plurality of flexible wiring boards 320 and 322 are interposed between the ultrasonic transducers 314, the positional accuracy between modules may be deteriorated. As a result, the accuracy of the convergence / deflection of the ultrasonic beam may be deteriorated by affecting the delay control of the pulse. Further, in the manufacturing process of the ultrasonic transducer, the number of processes for forming the ultrasonic transducer module is increased, which is complicated and increases the cost. Further, the increase in the number of flexible wiring boards 320 and 322 may lead to an increase in the size of the ultrasonic probe.

  Therefore, with respect to the ultrasonic transducer 300 as shown in FIGS. 9 to 11 and FIG. 12, an electrode lead is embedded in the backing material, and the electrode is placed on the surface opposite to the ultrasonic radiation direction side in the backing material. An ultrasonic transducer configured to expose a lead has been proposed (for example, Patent Document 2). A connection configuration between the electrodes of the ultrasonic transducer and the ultrasonic diagnostic apparatus in such an ultrasonic transducer will be described with reference to FIG. FIG. 13 is a schematic cross-sectional view showing a configuration of a conventional ultrasonic transducer.

  In the ultrasonic transducer 300 shown in FIG. 13, for example, a needle-like electrode lead 325 connected to the signal electrode 316 of the ultrasonic transducer 314 is embedded in the backing material 318. The electrode lead 325 passes from the boundary surface of the backing material 318 with the ultrasonic transducer 314 to reach the opposite end surface through the backing material 318 and is exposed to the end surface. An electronic circuit 336 is disposed adjacent to the end surface of the backing material 318. Further, the electronic circuit 336 and the end portion of the electrode lead 325 exposed on the end surface of the backing material 318 are conductively bonded, and the electronic circuit 336 and the electrode lead 325 are connected, whereby the signal electrode 316 and the electronic circuit 336 are electrically connected. It becomes possible to make it.

  In the ultrasonic transducer 300 shown in FIG. 13, signals from a large number of two-dimensionally arranged ultrasonic transducers 314 are bundled by the electronic circuit 336 and then transmitted to the ultrasonic diagnostic apparatus main body. Therefore, in the ultrasonic transducer 300 in FIG. 13, the pitch of the wiring pattern formed on the flexible wiring board 320 is extremely dense without forming the module of the ultrasonic transducer 314 like the ultrasonic transducer in FIG. It prevents the situation that becomes.

  However, in the ultrasonic transducer 300 shown in FIG. 13, the following problems may occur when the electrode lead 325 is embedded in the backing material 318. That is, the backing material 318 is provided for acoustic braking of the ultrasonic vibrator 314, and it is difficult to embed the electrode lead 325 so as not to affect the original acoustic characteristics of the backing material 318. Even if it is realized, the manufacturing process is complicated.

  In addition, it is necessary to avoid crosstalk between the electrode leads 325, but each of the electrode leads 325 is formed at almost equal intervals with the arrangement pitch of the ultrasonic transducers 314, so that crosstalk is avoided. In addition, it is difficult to ensure the distance between the electrode leads 325. Further, the backing material 318 is configured to have a certain length for acoustic braking of the ultrasonic vibrator 314. However, when the length of the electrode lead 325 embedded in the backing material 318 is increased. There is a risk of crosstalk. Moreover, the process of processing both ends of the electrode lead 325 so as to be exposed from the respective end faces of the backing material 318 is very complicated.

  Therefore, for the ultrasonic transducer 300 as shown in FIGS. 9 to 13, a multilayer FPC is used as a wiring means for connecting each electrode of the ultrasonic transducer and the transmission / reception circuit, and the number of wirings between the through holes is set. Additional configurations of ultrasonic transducers have been proposed. That is, the multilayer FPC in this ultrasonic transducer has a plurality of conductive layers, and each conductive layer connects the signal electrode of the ultrasonic transducer and the transmission / reception circuit. The layers of the multilayer FPC are connected by through holes or via holes. According to the FPC having such a configuration, the pitch of the wiring pattern between the ultrasonic transducer and the transmission / reception circuit in each layer does not become too narrow, and the difficulty related to wiring is solved.

  However, in the ultrasonic transducer as described above, the following problems may occur by using the multilayer FPC. That is, first, the use of a multilayer FPC increases the thickness of the FPC. Since the FPC wiring pattern is connected to the electrodes of the ultrasonic transducer, it is arranged between the ultrasonic transducer and the backing material or between the ultrasonic transducer and the acoustic matching layer. Or between the acoustic matching layer and the acoustic lens. Therefore, when the thickness of the FPC increases, the influence of the acoustic impedance gap between the FPC and the ultrasonic transducer, the backing material, the acoustic matching layer, etc. increases, which may interfere with the transmission / reception of ultrasonic waves. is there. Secondly, in a multi-layer FPC, there is a possibility that flexibility is low and bending becomes difficult. In this case, the manufacture of the ultrasonic transducer itself is complicated, which may increase the manufacturing cost. Furthermore, the difficulty in bending the FPC may cause an increase in the head size of the ultrasonic probe.

  In addition to the ultrasonic transducers as shown in FIGS. 9, 12, and 13 described above, there has conventionally been proposed an ultrasonic transducer having a configuration in which an electronic circuit 327 is arranged and connected directly to the back surface of the ultrasonic transducer 314. (For example, see FIG. 14 and Patent Document 3). As shown in FIG. 14, this ultrasonic transducer 300 has an electronic circuit 327 disposed adjacent to the back side of the signal electrode 316 in the ultrasonic transducer 314, and between the electronic circuit 327 and the backing material 318. The flexible wiring board 320 is arranged. In this ultrasonic transducer 300, the signal electrode 316 and the electronic circuit 327 for each ultrasonic transducer 314 are connected, and the electronic circuit 327 performs a process of bundling a large number of signals. The processed signal is transmitted through the flexible wiring board 320 disposed on the back surface of the electronic circuit 327. Therefore, in the ultrasonic transducer 300 as shown in FIG. 14, it is not necessary to embed an electrode lead in the backing material 318, and processing for reducing the number of signal paths directly under the ultrasonic transducer 314 is performed. The difficulty related to wiring is eliminated.

  In the conventional ultrasonic transducer 300 as shown in FIG. 14, the electronic circuit 327 receives an input from the signal electrode 316 connected to the front side and outputs it to the wiring pattern of the flexible wiring board 320 connected to the back side. To do. For this reason, the electronic circuit 327 requires electrodes for connection on both the front side and the back side. As a semiconductor process for realizing such an electronic circuit 327 in the ultrasonic transducer 300, for example, there is a through silicon via (TSV / Through Silicon Via).

  Here, in the ultrasonic transducer 300 as shown in FIG. 14, the electronic circuit 327 is disposed between the ultrasonic transducer 314 and the backing material 318. The electronic circuit 327 is made of a semiconductor material (silicon or the like). This semiconductor material may not be compatible with the ultrasonic transducer 314 and the backing material 318 in terms of acoustic characteristics such as acoustic impedance. For example, the acoustic impedance Z of silicon is about 19.5 MRayl. On the other hand, the acoustic impedance of the ultrasonic vibrator 314 made of a general PZT piezoelectric material is about 35 MRayl, which is a big difference. In such a case, the reflectance at the interface is large, and the influence of reflection is exerted. As a result, there is a possibility that the transmission / reception of ultrasonic waves by the ultrasonic transducer may be hindered.

  Therefore, in the ultrasonic transducer 300 as shown in FIG. 14, the length of the electronic circuit 327 in the direction from the front side to the back side is as short as possible, that is, by reducing the thickness, the electronic circuit 327 for transmitting and receiving ultrasonic waves. It is necessary to reduce the influence of the acoustic characteristics of the image as much as possible and to avoid a situation in which the generated ultrasonic image is hindered.

  However, in order to reduce the acoustic effect of the electronic circuit 327 and to realize a through silicon via that connects the signal electrode 316 and the wiring pattern of the flexible wiring board 320, the thickness of the electronic circuit 327 can be realized. Have difficulty. That is, if it is formed thin in order to reduce the acoustic effect of the electronic circuit 327, it is difficult to use the silicon through electrode, and it is difficult to connect both sides of the electronic circuit 327. On the other hand, if it is assumed that a through silicon via is used in the electronic circuit 327, the thickness increases, so that there is a possibility that the transmission and reception of ultrasonic waves may be hindered due to the acoustic effect of the electronic circuit 327.

  In addition, the electronic circuit 327 can be connected to the flexible wiring board 320 by wire bonding or the like without using the silicon through electrode, but in such a configuration, bonding to both the electronic circuit 327 and the flexible wiring board 320 is possible. Since a pad is required and a bonding wire from the electronic circuit 327 is formed, the size of the ultrasonic transducer 300 increases. As a result, the size of the ultrasonic probe is increased.

  Also proposed is a technology (sparse array, sparse method) that limits the number of wiring leads that connect the electrodes of the ultrasonic transducer and the transmitter / receiver circuit by connecting only a certain number of channels in the ultrasonic transducer to the transmitter / receiver circuit. (For example, Patent Document 4). According to this ultrasonic transducer, among a large number of ultrasonic transducers arranged two-dimensionally, there are predetermined effective transducers and other invalid transducers. Let's send and receive. For example, the back electrodes are formed in a dispersed manner with respect to the two-dimensionally arranged ultrasonic transducers. Of all the arranged ultrasonic transducers, the ultrasonic transducer on which the back electrode is formed is an effective transducer, and the other portions are invalid transducers.

JP 2005-342337 A JP 2002-27593 A JP-T-2007-515268 Special table 2004-7309 gazette

  The effective transducer pattern in the two-dimensional array of ultrasonic transducers is determined according to a predetermined dispersion condition (constant density, constant linear density). However, in some cases, it is difficult to obtain a reflected wave without bias. Therefore, verification is executed with different effective vibrator patterns by trial and error, and the best effective vibrator pattern is finally determined.

  However, with an ultrasonic transducer using a sparse array, the effective transducer area that can perform ultrasonic transmission / reception is smaller than the total ultrasonic transducer array area, which adversely affects the sound field and sensitivity and lowers the resolution. There is a problem.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an ultrasonic diagnostic apparatus main body and an ultrasonic transducer, even if the number of ultrasonic transducers in the ultrasonic transducer increases. An object of the present invention is to provide an ultrasonic transducer capable of avoiding a situation where connection is difficult and capable of reliably transmitting and receiving ultrasonic waves of the ultrasonic transducer.

According to a first aspect of the present invention for solving the above problem, a front electrode and a rear electrode are provided on the front surface on the radial side of the ultrasonic wave and on the back surface on the opposite side of the front surface, respectively. A plurality of ultrasonic transducers, and each of the front electrodes of the first transducer group disposed on the front side of the plurality of ultrasonic transducers and being a part of the plurality of ultrasonic transducers A front-side substrate on which electrode pads are individually formed at positions corresponding to the front electrodes of the other second vibrator group of the first vibrator group, A plurality of ultrasonic transducers are disposed on the back side, and have signal lead lines that commonly connect the back electrodes of the second transducer group, and each of the back electrodes of the first transducer group. Individual at corresponding position Further comprising a back-side substrate on which the electrode pads are formed, to an ultrasound transducer, characterized in.
According to a twelfth aspect of the present invention for solving the above problem, a front electrode and a back electrode are provided on the front surface on the radial side of the ultrasonic wave and on the back surface on the opposite side of the front surface, respectively. An ultrasonic probe in which an ultrasonic transducer having a plurality of ultrasonic transducers is provided, which is disposed on the front surface side of the plurality of ultrasonic transducers, and of the plurality of ultrasonic transducers It has a signal lead line for commonly connecting each of the front electrodes of the first vibrator group that is a part, and at a position corresponding to each of the front electrodes of another second vibrator group of the first vibrator group A front substrate on which electrode pads are individually formed, and a signal lead line disposed on the back side of the plurality of ultrasonic transducers and commonly connecting the back electrodes of the second transducer group. Then And an ultrasonic transducer having a back side substrate on which electrode pads are individually formed at positions corresponding to the back electrodes of the first transducer group. .

  According to the first and twelfth aspects of the present invention, in the ultrasonic transducer of the ultrasonic probe, in addition to the first transducer group that is a part of the plurality of ultrasonic transducers and the first transducer group, In the second vibrator group, the commonly connected electrodes are divided into a front side and a back side. Accordingly, since the electrodes in the first transducer group are connected in common on the front substrate, the wiring space is reduced even if the electrodes of the ultrasonic transducers in the second transducer group are connected separately. Since it is ensured, it is possible to avoid a situation where wiring becomes difficult. Similarly, even on the back side substrate, even if the electrodes of the ultrasonic transducers in the first transducer group are connected independently, it is possible to avoid a situation where wiring becomes difficult. As a result, even if the number of ultrasonic transducers in the ultrasonic transducer increases, the ultrasonic diagnostic apparatus main body and the ultrasonic transducer can be easily connected, and the ultrasonic transducer can reliably transmit and receive ultrasonic waves. It becomes possible.

It is a schematic perspective view which shows the state which looked at the ultrasonic transducer concerning embodiment of this invention from the side. It is a schematic sectional drawing of the ultrasonic transducer in FIG. The ultrasonic transducer concerning embodiment of this invention WHEREIN: The figure which shows the connection structure of the front electrode and front side board | substrate in the 1st vibrator group and the 2nd vibrator group, and the connection structure of a back electrode and a back side board | substrate FIG. (A) is the schematic which shows notionally the wiring pattern of the surface by the side of the ultrasonic transducer | vibrator in the back side board | substrate of the ultrasonic transducer concerning 1st Embodiment of this invention. (B) is the schematic which shows notionally the wiring pattern of the surface by the side of the backing material in the back surface side board | substrate of the ultrasonic transducer concerning 1st Embodiment of this invention. (A) is the schematic which shows notionally the wiring pattern of the surface by the side of the ultrasonic transducer | vibrator in the front side board | substrate of the ultrasonic transducer | vibrator concerning 1st Embodiment of this invention. (B) is a schematic diagram conceptually showing a wiring pattern of a surface on the subject side in the front substrate of the ultrasonic transducer according to the first embodiment of the present invention. It is a schematic block diagram which shows the structure of the ultrasonic probe and ultrasonic diagnostic apparatus concerning embodiment of this invention. It is the schematic which shows notionally the distribution of the subarray of the ultrasonic transducer concerning 2nd Embodiment of this invention. (A)-(D) are the schematic which shows notionally the wiring pattern pulled out to the X1 direction of FIG. 7 in the front side board | substrate and back side board | substrate of the ultrasonic transducer concerning 2nd Embodiment of this invention. . It is a schematic perspective view which shows the conventional ultrasonic transducer provided in the ultrasonic probe, and the wiring board which connects the said ultrasonic transducer and an electronic circuit. It is a schematic perspective view which shows the conventional ultrasonic transducer provided in the ultrasonic probe, and the wiring board which connects the said ultrasonic transducer and an electronic circuit. It is a schematic perspective view which shows the backing material, the wiring board, and wiring pattern in the conventional ultrasonic transducer provided in the ultrasonic probe. It is a schematic sectional drawing which shows the conventional ultrasonic transducer, the electronic circuit, and the wiring board which connect these provided in the ultrasonic probe. It is a schematic sectional drawing which shows the conventional ultrasonic transducer, the electronic circuit, the wiring lead which connects these, and a wiring board provided in the ultrasonic probe. It is a schematic sectional drawing which shows the conventional ultrasonic transducer, the electronic circuit, and the wiring board which connect these provided in the ultrasonic probe.

[First embodiment]
Hereinafter, an ultrasonic transducer, an ultrasonic probe, and an ultrasonic diagnostic apparatus according to a first embodiment of the present invention will be described with reference to FIGS.

(Schematic configuration of ultrasonic transducer)
FIG. 1 is a schematic perspective view showing a state in which an ultrasonic transducer 100 according to the first embodiment of the present invention is viewed from the side. FIG. 2 is a schematic cross-sectional view of the ultrasonic transducer 100 in FIG. Hereinafter, the configuration of the ultrasonic transducer 100 according to the present embodiment will be described. In the ultrasonic transducer 100 shown in each figure, the number of arrangements of the ultrasonic transducers 114 is different, but the number of arrangements in each figure is conceptually shown and is different from the actual. In FIG. 1, illustration of the front substrate 123 is omitted.

  As shown in FIG. 1, the ultrasonic transducer 100 according to this embodiment is provided with a first acoustic matching layer 110 adjacent to the ultrasonic transducer 114. Further, the second acoustic matching layer 111 is provided adjacent to the surface of the first acoustic matching layer 110 opposite to the ultrasonic transducer 114 side. Further, a backing material 118 (loading material phase) is provided on the opposite side of the ultrasonic transducer 114 from the first acoustic matching layer 110 side, and a back surface is provided between the backing material 118 and the ultrasonic transducer 114. A side substrate 120 is provided.

  As shown in FIG. 1, in the ultrasonic transducer 114, a front electrode 112 is provided on the front surface adjacent to the first acoustic matching layer 110. Further, a back electrode 116 is provided on the back surface opposite to the front surface. In the present embodiment, among all the ultrasonic transducers 114 arranged in the ultrasonic transducer 100, in some ultrasonic transducers 114, the front electrode 112 is on the ultrasonic transducer 114 side of the front substrate 123. Are commonly connected to each other to form a ground electrode. Further, in the ultrasonic transducers 114 other than the ultrasonic transducers 114, the back electrode 116 is commonly connected on the ultrasonic transducer 114 side surface of the back side substrate 120 and becomes a ground electrode. The group of ultrasonic transducers 114 to which the front electrode 112 is commonly connected is referred to as a first transducer group 150, and the group of ultrasonic transducers 114 to which the back electrode 116 is commonly connected is referred to as a second transducer group 160. Each electrode in the ultrasonic transducer 114 is connected to the ultrasonic diagnostic apparatus main body 200 by each wiring pattern (see reference numerals 120a, 123b, etc. in FIG. 3) on the front substrate 123 and the rear substrate 120. .

The ultrasonic transducer 114 in the ultrasonic transducer 100 includes PZT (lead zirconate titanate / Pb (Zr, Ti) O ₃ ), barium titanate (BaTiO ₃ ), PZNT (Pb (Zn 1/3 Nb 2 / 3) A piezoelectric element using a single crystal of O3-PbTiO3), a PMNT (Pb (Mg1 / 3Nb2 / 3) O3-PbTiO3) single crystal, or the like can be used.

  The front substrate 123 and the back substrate 120 in the ultrasonic transducer 100 are based on a flexible resin film, and have independent wiring patterns 120a, common wiring patterns 120b, independent wiring on both surfaces (front and back surfaces). A flexible printed circuit board (FPC / Flexible Printed Circuits) on which a pattern 123a and a common wiring pattern 123b are formed can be used. Further, the back side substrate 120 in this embodiment corresponds to an example of a “substrate” according to the present invention. In addition, the independent wiring patterns 120a and 123a and the common wiring patterns 120b and 123b in this embodiment correspond to an example of “signal lead lines” according to the present invention. Hereinafter, the structure of each part in the ultrasonic transducer 100 of the present embodiment will be described.

(Connection between ultrasonic transducer and wiring board)
Next, in the ultrasonic transducer 100 according to the present embodiment, the connection structure between the front electrode 112 of the ultrasonic transducer 114 and the front substrate 123 and the connection structure between the back electrode 116 of the ultrasonic transducer 114 and the rear substrate 120. Will be described with reference to FIGS. FIG. 3 shows a connection structure between the front electrode 112 and the front substrate 123 of the ultrasonic transducer 114 in the first transducer group 150 and the second transducer group 160 in the ultrasonic transducer 100 according to the embodiment of the present invention. FIG. 3 is a schematic partially enlarged view of FIG. 2 showing a connection structure between the back electrode 116 and the back side substrate 120.

  As shown in FIGS. 1 and 2, a back-side substrate 120 is provided adjacent to the back surface of the ultrasonic transducer 114 in the ultrasonic transducer 100. On the other hand, the front substrate 123 is provided on the front side of the ultrasonic transducer 114 adjacent to the front surface of the second acoustic matching layer 111. Accordingly, each wiring pattern of the front substrate 123 is connected to the front electrode 112 through the first acoustic matching layer 110 and the second acoustic matching layer 111. That is, the wiring patterns 123a and 123b of the front substrate 123 and the front electrode 112 must be electrically connected. For this reason, the first acoustic matching layer 110 and the second acoustic matching layer 111 are configured to have a conductive material, a lead for connecting the wiring pattern and the front electrode 112, or the like. As the conductive material used for the acoustic matching layers (110, 111), for example, a material containing carbon can be used.

  The front substrate 123 is not necessarily disposed at the above position, and can be disposed between the first acoustic matching layer 110 and the ultrasonic transducer 114. However, an extra structure is provided between the ultrasonic transducer 114 and the acoustic matching layers (110, 111) by disposing the front substrate 123 on the front side of the second acoustic matching layer 111 as in the present embodiment. Therefore, the acoustic influence due to the presence of the front substrate 123 can be reduced. Moreover, although the ultrasonic transducer 100 in this embodiment has two acoustic matching layers (110, 111), it is not limited to this and can be a single acoustic matching layer. However, when the front substrate 123 is made of polyimide or the like, it is preferable in terms of acoustic matching to use two acoustic matching layers (110, 111) as in this embodiment.

  In addition, the front-side substrate 123 has an independent wiring pattern 123a and a common wiring pattern 123b as shown in FIG. 3, and the rear-side substrate 120 has an independent wiring pattern 120a and a common wiring pattern 120b as follows. It is formed.

  That is, as shown in FIG. 3, the independent wiring pattern 123 a is formed on the surface (front surface) on the ultrasonic radiation direction side (subject side) of the front substrate 123, and the common wiring pattern 123 b is formed on the front substrate 123. It is formed on the surface (back surface) on the ultrasonic transducer 114 side. The independent wiring pattern 120a is formed on the surface (back surface) of the back substrate 120 on the backing material 118 side, and the common wiring pattern 120b is formed on the surface (front surface) of the back substrate 120 on the ultrasonic transducer 114 side. The

  As shown in FIG. 3, a connection pad 124 that is electrically connected to the front electrode 112 of each ultrasonic transducer 114 in the second transducer group 160 is provided on the back surface of the front substrate 123. The connection pads 124 are opposite to the independent wiring pattern 123a across the front substrate 123 on the front substrate 123, and correspond to the arrangement of the ultrasonic transducers 114 of the second transducer group 160. Are arranged on the back surface of the front substrate 123. Similarly, the connection pads 125 are on the back side substrate 120 on the opposite side of the independent wiring pattern 120a across the back side substrate 120, and are arranged in the respective arrays of the ultrasonic transducers 114 of the first transducer group 150. Correspondingly, they are arranged on the front surface of the rear substrate 120. Therefore, when the front substrate 123 is attached to the surface of the second acoustic matching layer 111 on the acoustic lens (not shown) side, the front electrode 112 and the connection pads 124 of the front substrate 123 are connected to the acoustic matching layer (110, 110). 111), and when the back substrate 120 is attached to the back surface of the ultrasonic transducer 114, the back electrode 116 and the connection pad 125 of the back substrate 120 are connected. The connection pads 124 and 125 according to the present embodiment correspond to an example of “electrode pads” according to the present invention.

  Further, as shown in FIG. 3, conduction between the front surface and the rear surface of the front substrate 123 and the rear substrate 120, that is, conduction between the connection pad 124 and the independent wiring pattern 123a, and conduction between the connection pad 125 and the independent wiring pattern 120a. Is made by a through electrode (electrode hole) 121. The through electrode 121 can be configured as a through hole or a via hole. In addition, pads (not shown) for connecting the independent wiring patterns 123a and 120a and the through electrodes 121 are formed at the ends of the through electrodes 121 opposite to the connection pads 124 and 125, respectively. The through electrode 121 according to the present embodiment corresponds to an example of the “conductive hole” according to the present invention.

  As shown in FIG. 3, the end portions of the independent wiring patterns 123 a and 120 a are connected to pads (not shown) in the through electrode 121. The common wiring pattern 123b is formed on a portion of the front substrate 123 on the ultrasonic transducer 114 side that is the first transducer group 150, and commonly connects the front electrodes 112. Similarly, the common wiring pattern 120b is formed on a part on the ultrasonic transducer 114 side which is the second transducer group 160 in the back substrate 120, and commonly connects the back electrodes 116. The positions of the first transducer group 150 and the second transducer group 160 will be described next.

(Array and wiring pattern of ultrasonic transducers)
Next, each wiring pattern (120a, 120b, 123a, 123b) of the front substrate 123 and the rear substrate 120 in the ultrasonic transducer 100 according to the first embodiment will be described with reference to FIGS. FIG. 4A is a schematic diagram conceptually showing the common wiring pattern 120b on the surface (back surface) on the ultrasonic transducer 114 side in the back substrate 120 of the ultrasonic transducer 100 according to the first embodiment of the present invention. is there. FIG. 4B is a schematic diagram conceptually showing the independent wiring pattern 120a on the surface (front surface) on the backing material 118 side in the back substrate 120 of the ultrasonic transducer 100 according to the first embodiment of the present invention. . FIG. 5A is a schematic diagram conceptually showing the common wiring pattern 123b on the surface (rear surface) on the ultrasonic transducer 114 side of the front substrate 123 of the ultrasonic transducer 100 according to the first embodiment of the present invention. is there. FIG. 5B is a schematic diagram conceptually showing the independent wiring pattern 123a on the subject side surface (front surface) of the front substrate 123 of the ultrasonic transducer 100 according to the first embodiment of the present invention.

  4 and 5, for convenience of explanation, not only each wiring pattern on the substrate but also a part of the arrangement state of the ultrasonic transducers 114 is shown. Moreover, the arrangement | sequence of the ultrasonic transducer | vibrator 114, the 1st transducer group 150, and the 2nd transducer group 160 which are shown in FIG. Is also possible.

  In the ultrasonic transducer 100 according to the present embodiment, the front electrode 112 of the ultrasonic transducer 114 in the first transducer group 150 among all the arranged ultrasonic transducers 114 is on the back surface of the front substrate 123, respectively. The common wiring pattern 123b is commonly connected to form a ground electrode. In addition, the back electrodes 116 of the ultrasonic transducers 114 in the second transducer group 160 are connected in common by the common wiring pattern 120b on the front surface of the back substrate 120, and become ground electrodes. Further, the common wiring pattern 123b and the common wiring pattern 120b (ground line) on the front substrate 123 and the rear substrate 120 are drawn out to the edge side (outside) of the two-dimensional arrangement of the ultrasonic transducers 114 arranged in two dimensions. It is.

  For example, in the two-dimensional array of the ultrasonic transducers 114, it is assumed that the subarray 126 is formed by dividing the ultrasonic transducers 114 into a plurality of blocks in which M ultrasonic transducers 114 are arranged in the row direction and N in the column direction. Further, as shown in FIGS. 4A and 5A, the sub-array 126 includes an ultrasonic transducer by connecting each electrode of the ultrasonic transducer 114 to the common wiring pattern 120b or the common wiring pattern 123b. 114 are alternately divided into a first transducer group 150 and a second transducer group 160 in the row direction in the two-dimensional array. The row direction is a direction substantially orthogonal to the direction in which each wiring pattern is drawn out from the ultrasonic transducer array to the outside of each substrate (the arrow direction in FIGS. 4 and 5A).

  That is, as shown in FIG. 4A, the common wiring pattern 120b on the front surface of the back substrate 120 has a common back electrode 116 of the ultrasonic transducer 114 belonging to the sub array 126 every other sub array 126 in the row direction. Formed to connect. In this way, the common wiring pattern 120b of the back substrate 120 defines the sub-array 126 connected to the common wiring pattern 120b as the second transducer group 160.

  Further, as shown in FIG. 5A, the common wiring pattern 123b on the back surface of the front substrate 123 has an ultrasonic transducer 114 belonging to the subarray 126 that is not connected to the common wiring pattern 120b on the back substrate 120 on the back surface. The front electrodes 112 are commonly connected. Therefore, the common wiring pattern 123b is also formed every other subarray in the row direction. In this way, the common wiring pattern 123b of the front substrate 123 defines the sub-array 126 connected to the common wiring pattern 123b as the first transducer group 150. The back electrode 116 of the ultrasonic transducer 114 in the first transducer group 150 that is not connected to the common wiring pattern 120b is drawn out to the back surface of the back substrate 120 on which the independent wiring pattern 120a that is a ground line is formed. Similarly, the front electrode 112 of the second transducer group 160 that is not connected to the common wiring pattern 123b is drawn to the front surface of the front substrate 123 on which the independent wiring pattern 123a is formed. Hereinafter, the specific content of the structure for each surface of each substrate (120, 123) will be described.

<Front side of back side board>
For example, as shown in FIG. 4A, a common wiring pattern 120b is formed every other subarray 126 in the row direction on the front surface of the rear substrate 120, and the common wiring pattern 120b is arranged in the column direction (wiring drawing direction). ) Are arranged in a row so as to be drawn toward the edge of the ultrasonic transducer 114 (corresponding to an example of “one side” or “opposite side” according to the present invention). . The sub-array 126 connected to the common wiring pattern 120b becomes the second transducer group 160. Accordingly, the sub-array 126 in the first and second columns is in the order of the first transducer group 150 and the second transducer group 160 by the common wiring pattern 120b.

  Further, the common wiring pattern 120b connected to the third and fourth sub-arrays 126, as compared to the common wiring pattern 120b connected to the first and second sub-arrays 126, is as shown in FIG. The subarray 126 is formed at a position shifted by one block. That is, the first and second sub-arrays 126 and the third and fourth sub-arrays 126 are arranged in the reverse order of the transducer groups (150, 160). The common wiring pattern 120b is formed so as to be in the order of one transducer group 150.

  Therefore, the common wiring pattern 120b on the back side of the back side substrate 120 in this example is, as shown in FIG. 4A, adjacent sub-arrays 126 in the first and second columns, that is, second adjacent in the column direction. Each back electrode 116 of the transducer group 160 is connected in common, and is drawn out to the edge side (upward in the drawing) of the two-dimensional array. Similarly, the sub-arrays 127 adjacent in the column direction of the third column and the fourth column, that is, the respective back electrodes 116 of the second transducer group 160 are commonly connected to the opposite end of the two-dimensional array (downward in the figure). Pulled out. That is, the drawing direction of the common wiring pattern 120b connected to the back electrodes 116 of the second transducer group 160 in the first and second rows and the back electrodes 116 of the second transducer group 160 in the third and fourth columns. The drawing directions of the common wiring pattern 120b connected to are opposite to each other. Further, the common wiring pattern 120 b on the front surface of the back side substrate 120 is formed only in a region overlapping the second transducer group 160.

  The common wiring pattern 120b drawn to the edge is further drawn to the electronic circuit 180 (see FIG. 6) side through the back substrate 120 (see FIG. 2). In addition, in the front surface of the back substrate 120, the region overlapping the first transducer group 150 corresponds to the connection pads 124 corresponding to the arrangement of the ultrasonic transducers 114 of the second transducer group 160 as described above. Is provided (see FIG. 3).

<Back of front side board>
As shown in FIG. 5A, the common wiring pattern 123b is provided only in the portion overlapping the first transducer group 150 on the back surface side of the front substrate 123. The common wiring pattern 123b connects the front electrodes 112 of the ultrasonic transducers 114 in the first transducer group 150 in common. Further, in the region overlapping the second transducer group 160 on the back surface of the front substrate, connection pads 125 are provided corresponding to the arrangements of the ultrasonic transducers 114 of the second transducer group 160. That is, the position of the common wiring pattern 120b on the back surface of the front substrate 123 as shown in FIG. 5A and the common wiring pattern 123b on the front surface of the front substrate 123 as shown in FIG. The position to be formed is opposite to the ultrasonic transducer 114. In the example of the ultrasonic transducer 100 described above, the common wiring pattern 120b on the front surface of the back substrate 120 is formed at a position where the front surface and the second transducer group 160 face each other. On the other hand, the common wiring pattern 123b on the back surface of the front substrate 123 is formed at a position where the back surface and the first transducer group 150 face each other.

  In FIG. 5A, the front electrodes 112 of the subarrays 126 adjacent to each other in the first and second columns, that is, the adjacent first transducer groups 150 are connected in common, and the edges of the two-dimensional array (see FIG. It is the structure pulled out to the upper part in FIG. Similarly, the common wiring pattern 123b connects the front electrodes 112 of the first transducer group 150 adjacent in the third and fourth rows to the opposite edge of the two-dimensional array (downward in the drawing). Pull out. Therefore, also on the rear surface of the front substrate 123 shown in FIG. 5A, the subarrays 126 in the first and second columns are commonly connected in the same manner as the front surface of the rear substrate 120 as shown in FIG. The drawing direction of the wiring pattern 123b and the drawing direction of the common wiring pattern 123b in the third and fourth columns are opposite to each other.

  Similarly to the common wiring pattern 120b, the common wiring pattern 123b drawn to the edge of the two-dimensional array of the ultrasonic transducers 114 on the front side substrate 123 is further connected to the electronic circuit 180 (see FIG. (See 6). Further, as shown in FIG. 2, the ultrasonic transducer 100 is provided with a conductive connection portion 130 connected to the front surface of the back-side substrate 120 at the end of the back surface of the front-side substrate 123. Further, as shown in FIG. 2, the rear surface of the front substrate 123 on which the common wiring pattern 123b is formed and the front surface of the rear substrate 120 on which the common wiring pattern 120b is formed are arranged to face each other (FIG. 2). reference). Therefore, the common wiring pattern 123b can be wired together with the common wiring pattern 120b through the conductive connection portion 130.

《Back of back side substrate》
As described above, the connection pad 125 on the front surface of the back substrate 120 and the independent wiring pattern 120a on the back surface are electrically connected by the through electrode 121 (FIG. 3). That is, the independent wiring pattern 120 a is individually drawn out from each of the back electrodes 116 of the ultrasonic transducer 114 in the first transducer group 150 and led to the electronic circuit 180. The wiring space of each independent wiring pattern 120a on the front surface of the rear substrate 120 is as follows.

  First, the independent wiring pattern 120a drawn from the sub-array 126 on the edge side in the two-dimensional array of the ultrasonic transducers 114 is directly drawn substantially linearly toward the edge of the two-dimensional array of the ultrasonic transducers 114. That is, the wiring space is a portion where the first transducer group 150 and the back side substrate 120 overlap, and is passed between pads (not shown) at the end of the through electrode 121 exposed on the back side of the back side substrate 120. It is formed. In the example shown in FIG. 4B, the ultrasonic transducers 114 of the first transducer group 150 in the first and fourth columns (the uppermost and lowermost portions in the drawing) are indicated by the arrow directions in the drawing. The connected independent wiring pattern 120a is drawn out to the edge of the two-dimensional array in the upper part or the lower part of the drawing, with the overlapping portion (between the pads of the through electrode 121) with the ultrasonic transducer 114 as a wiring space.

  For the independent wiring pattern 120a drawn from the edge side subarray 126 in the two-dimensional array of the ultrasonic transducers 114, the wiring space of the independent wiring pattern 120a drawn from the center side subarray 126 in the array is the second This is a portion where the transducer group 160 and the back side substrate 120 overlap. That is, the independent wiring pattern 120a drawn from the pad (not shown) at the end of the through electrode 121 on the back surface of the back substrate 120 in the central sub-array 126 has the second vibration in which the through electrode 121 is not exposed once. It is drawn out to the side overlapping with the child group 160, that is, the side opposite to the region where the common wiring pattern 120b is formed. The independent wiring pattern 120a is further drawn out to the edge side of the two-dimensional array of the ultrasonic transducers 114 with a portion overlapping the second transducer group 160 as a wiring space. In the example of FIG. 4B, as indicated by the arrow direction in the figure, the independent wiring pattern 120a connected to the subarray 126 in the second and third columns (substantially the center in the figure) is once drawn in the column direction. Then, it is indirectly drawn to the two-dimensional array edge at the upper or lower side of the figure through the overlapping portion with the second transducer group 160.

  According to the ultrasonic transducer 100 of the present embodiment described above, in the two-dimensional array of the ultrasonic transducers 114, the independent wiring patterns 120a are individually provided from the ultrasonic transducers 114 group arranged on the substantially central side in the array. In order to draw out, it is configured to use an empty area where the pad of the through electrode 121 on the back surface of the back substrate 120 is not exposed. Therefore, the wiring space of the ultrasonic transducer 114 in the sub-array 126 on the edge side of the two-dimensional array of the ultrasonic transducers 114 and the wiring space of the ultrasonic transducer 114 on the center side are different areas. Thus, it is possible to provide a margin for the wiring space on the back surface of the back substrate 120.

  For example, the two-dimensional array of the ultrasonic transducers 114 is 48 rows × 32 columns, and the independent wiring pattern 120a is drawn out in one direction in the column direction and the other two directions on the opposite side as in the present embodiment. Assuming this (see FIGS. 2 and 4), if the entire array is equally divided into two in the column direction, two subarrays 126 of 48 rows × 16 columns of ultrasonic transducers 114 can be formed. That is, at least it is necessary to individually draw out the independent wiring pattern 120a from each of the sub-array 126 groups of the ultrasonic transducers 114 of 48 rows × 16 columns.

  Here, as an example, when the arrangement pitch of the ultrasonic transducers 114 is about 0.4 mm × 0.4 mm and the pad diameter φ of the through electrode 121 is about 0.1 mm, the gap between the pads is about 0. 3 mm. Further, it is assumed that the independent wiring patterns 120a and 123a are about 40 μm. In this case, seven patterns can be passed through a gap of about 0.3 mm between the pads of the through electrode 121. Therefore, in this example, if one block (subarray 126) of the ultrasonic transducer 114 block on the edge of the two-dimensional array is 64 elements of 8 rows × 8 columns, the first column at the end of the two-dimensional array is the first. An independent wiring pattern (about 48 μm) is directly drawn out of the two-dimensional array directly from each of the ultrasonic transducers 114 in the eye (or the eighth row), and the remaining seven rows are interposed between the pads of the through electrodes 121 on the substrate. By passing the pattern of the ultrasonic transducer 114, 6 blocks, that is, 48 rows × 8 columns of independent wiring patterns (120a, 123a) can be drawn.

  Next, one block (subarray 126) of the ultrasonic transducer 114 block on the center side of the two-dimensional array also has 64 elements of 8 rows × 8 columns. The independent wiring patterns 120a and 123a are drawn from the ultrasonic transducer 114 in the 8th row (or 1st row) of the ultrasonic transducer 114 block into a vacant area where there is no pad (not shown) of the through electrode 121. Thereafter, the independent wiring patterns 120a and 123a are drawn out in a direction orthogonal to the direction in which the independent wiring patterns 120a and 123a are drawn, that is, outside the two-dimensional array. In this way, 6 blocks on the center side of the two-dimensional array, that is, 48 rows × 8 columns of independent wiring patterns can be drawn. In addition, since the pad is not formed in the area, it is easier to draw out the ultrasonic transducer 114 block wiring on the edge side of the two-dimensional array.

  As described above, in the ultrasonic transducer 100 according to the present embodiment, the above-described example, that is, a configuration in which the array of the ultrasonic transducers 114 of 48 columns × 32 rows is drawn in two directions, and 48 rows × 48 on the edge side. With the configuration in which the wiring space between the 8 rows of ultrasonic transducers 114 and the 48 rows × 8 columns of ultrasonic transducers 114 on the center side is dispersed, wiring can be drawn from all 1536 elements.

<Front side of front substrate>
Each front electrode 112 of the ultrasonic transducer 114 in the second transducer group 160 is individually connected to the front independent wiring pattern 123a via the connection pad 124 and the through electrode 121 on the rear surface of the front substrate 123 ( FIG. 3). In the example of FIG. 5B, as indicated by the arrow direction in the figure, the independent wiring pattern 123a connected to the subarray 126 in the first and fourth columns (the uppermost and lowermost parts in the figure) The space between the pads of the through electrode 121 at the overlapping portion with the second transducer group 160 is used as a wiring space, and is drawn substantially linearly to the edge of the two-dimensional array in the upper or lower part of the figure.

  In contrast to the independent wiring pattern 123a drawn from the edge side subarray 126, the independent wiring pattern 123a drawn from the pad at the end of the through electrode 121 on the front surface of the front substrate 123 in the central subarray 126 is temporarily The through-electrode 121 is drawn to a portion overlapping the first transducer group 150 where the through-electrode 121 is not exposed, that is, to the opposite side of the region where the common wiring pattern 123b is formed. It is pulled out to the edge side of the two-dimensional array. In the example of FIG. 5B, as indicated by the arrow direction in the drawing, the independent wiring pattern 123a connected to the sub-array 126 in the second and third columns (substantially the center in the drawing) is the first transducer group. The two-dimensional array edge is drawn indirectly through the overlap with 150 to the upper or lower part of the figure.

  According to the configuration of the front substrate 123 of the ultrasonic transducer 100 of the present embodiment described above, the ultrasonic transducers arranged on the substantially central side in the two-dimensional arrangement of the ultrasonic transducers 114, as with the rear substrate 120. In order to individually draw out the independent wiring patterns 123a from the group 114, a free area in the front surface of the front substrate 123 where the through electrodes 121 are not exposed is used. Accordingly, the wiring space of the ultrasonic transducer 114 in the sub-array 126 on the edge side of the two-dimensional array of the ultrasonic transducers 114 and the wiring space of the ultrasonic transducer 114 on the center side are different areas, respectively. It is possible to provide a margin for the wiring space on the front surface of the front substrate 123.

(Control configuration)
Next, an outline of a control configuration of the ultrasonic diagnostic apparatus including the ultrasonic probe according to the embodiment of the present invention will be described with reference to FIG. FIG. 6 is a schematic block diagram showing an outline of a control configuration of the ultrasonic diagnostic apparatus according to the embodiment of the present invention.

  As shown in FIG. 6, the ultrasonic probe 170 includes the ultrasonic transducer 100 and the electronic circuit 180 and is connected to the ultrasonic diagnostic apparatus main body 200. The ultrasonic diagnostic apparatus main body 200 includes a main control unit 210, a transmission unit 220, a reception unit 221, a B-mode signal processing unit 230, a Doppler signal processing unit 231, a display unit 240, and an operation unit 250. Hereinafter, processing of each unit in the ultrasonic diagnostic apparatus main body 200 will be described. Note that the electronic circuit 180 is mounted directly on the back-side substrate 120 or the like, for example, or on a substrate connected by an anisotropic conductive film (ACF / Anisotropic Conductive Film) or the like.

  The transmission unit 220 includes a voltage circuit and a pulser circuit that repeatedly generates rate pulses of a predetermined rate frequency. The transmission unit 220 transmits this rate pulse to the ultrasonic probe 170. This rate pulse is for generating an ultrasonic wave radiated by the ultrasonic transducer 114 of the ultrasonic transducer 100. Further, transmission of rate pulses from the transmission unit 220 of the ultrasonic diagnostic apparatus main body 200 to the ultrasonic probe 170 is performed via a cable, a connector, or the like.

  The ultrasonic probe 170 receives the rate pulse received from the ultrasonic diagnostic apparatus main body 200, and the electronic circuit 180 applies a voltage based on the rate pulse to each electrode in the ultrasonic transducer 114 of the ultrasonic transducer 100. Each transducer 114 is excited and emits an ultrasonic beam. Here, in the ultrasonic transducer 100 according to the present embodiment, the front electrode 112 in the ultrasonic transducer 114 depends on whether the ultrasonic transducer 114 is the first transducer group 150 or the second transducer group 160. The connection structure of the back electrode 116, the front side substrate 123, and the back side substrate 120 is configured to be reversed. That is, depending on the position of the ultrasonic transducer 114 in the two-dimensional array, whether the signal electrode / ground electrode is positioned on the first acoustic matching layer 110 side or the backing material 118 side of the ultrasonic transducer 114 is different. Therefore, the ultrasonic transducers 114 in the first transducer group 150 and the ultrasonic transducers 114 in the second transducer group 160 have opposite polarization directions when excited by applying a voltage.

  In the ultrasonic transducer 100 having such a configuration, when the ultrasonic transducers 114 of the first transducer group 150 and the second transducer group 160 are driven with the same voltage waveform, the generated ultrasonic waves have opposite phases. Therefore, when the element arrangement and pitch of the ultrasonic transducers 114 in the ultrasonic transducer 100 are uniform, the ultrasonic transducers 114 adjacent to each other particularly at the boundary portion between the first transducer group 150 and the second transducer group 160 are mutually connected. Then, the generated ultrasonic waves are canceled out. In addition, even when receiving a reflected wave from the subject, if a reflected wave having the same sound pressure is received, the waveform of the voltage generated by the ultrasonic transducer 114 is reversed due to the reverse polarization direction. . If such a problem occurs, there is a possibility that the generation of an ultrasonic image by transmission / reception of ultrasonic waves may be hindered.

  In order to solve the above-described problem, the ultrasonic transducer 100 in the present embodiment has the following configuration. That is, when the electronic circuit 180 in the ultrasonic probe 170 receives a rate pulse from the ultrasonic diagnostic apparatus main body 200, the electronic circuit 180 applies to the ultrasonic transducer 114 belonging to one of the first transducer group 150 and the second transducer group 160. On the other hand, an antiphase voltage is applied. That is, the ultrasonic transducer 114 in the first transducer group 150 and the ultrasonic transducer 114 in the second transducer group 160 of the present embodiment are driven by electrical signals having opposite phases.

  Therefore, even if the polarization directions of the ultrasonic transducer 114 of the first transducer group 150 and the ultrasonic transducer 114 of the second transducer group 160 are opposite, a voltage having an opposite phase is applied to one of them. Therefore, it is possible to avoid a possibility that the ultrasonic wave generated from the ultrasonic transducer 114 in the first transducer group 150 and the waveform of the ultrasonic wave generated from the ultrasonic transducer 114 in the second transducer group 160 are reversed. It becomes possible. As a result, ultrasonic waves can be transmitted and received by avoiding a situation in which the ultrasonic waves 114 adjacent to each other at the boundary between the first vibrator group 150 and the second vibrator group 160 cancel each other. It is possible to prevent the possibility of disturbing the generation of the ultrasonic image by reliably performing the operation.

  When the ultrasonic transducer 114 receives a reflected wave from the subject and generates a voltage, the electronic circuit 180 further generates a signal from the first transducer group 150 whose polarization direction is reversed, and the second transducer group 160. The process of inverting the waveform is performed on one of the signals from the above. The electronic circuit 180 performs the process on the signal based on the reflected wave from the subject, and then transmits the signal to the ultrasonic diagnostic apparatus main body 200 via the connector, cable, and the like of the ultrasonic probe 170.

  That is, in the ultrasonic transducer 100 in the present embodiment, when the ultrasonic transducer 114 in the first transducer group 150 and the ultrasonic transducer 114 in the second transducer group 160 are excited by the reflected wave, the polarization direction is changed. Vice versa. Therefore, the generated voltage waveforms of the ultrasonic transducer 114 in the first transducer group 150 and the ultrasonic transducer 114 in the second transducer group 160 are in opposite phases. Since the process of inverting one of the waveforms is performed, it is possible to avoid the possibility of causing troubles in signal processing and ultrasonic image generation in the ultrasonic diagnostic apparatus main body 200.

  When the entire two-dimensional array of all the ultrasonic transducers 114 in the ultrasonic transducer 100 is divided into a plurality of M × N blocks (subarrays), the electronic circuit 180 is an ultrasonic wave as a switch circuit. It is possible to configure to perform transmission / reception control. In this case, since the electronic circuit 180 reduces the number of signal paths from each ultrasonic transducer 114 by performing addition processing on the detection signal from the subject, the ultrasonic probe 170 and the ultrasonic diagnostic apparatus main body Connection with 200 becomes easy.

The receiving unit 221 includes an amplifier circuit, an A / D converter, an adder, and the like. The receiving unit 221 receives a signal based on a reflected wave from the subject processed by the electronic circuit 180 in the ultrasonic probe 170. Further, the receiving unit 221 amplifies the signal and performs digital conversion processing. Furthermore, the receiving unit 221 stores the digitized detection signal in a memory. Thereafter, the receiving unit 221 scans the subject by sequentially changing the focusing delay time for focusing the ultrasonic reflected wave from a predetermined depth and the reception directivity of the ultrasonic reflected wave on the detection signal. A deflection delay time is provided. Further, phasing addition (addition processing is performed after the phases of received signals obtained from a predetermined direction are matched with the output subjected to such beam forming.

  The B-mode signal processing unit 230 receives the signal subjected to the addition processing from the reception unit 221 and performs logarithmic amplification, envelope detection processing, and the like. Thereafter, the B mode signal processing unit 230 transmits the processed signal to the main control unit 210.

  The Doppler signal processing unit 231 receives the signal after the addition processing from the receiving unit 221, analyzes the frequency of the velocity information, extracts blood flow, tissue, and contrast agent echo components due to the Doppler effect, and average velocity, dispersion, power, etc. Blood flow information is obtained for multiple points. The Doppler signal processing unit 231 transmits the obtained blood flow information data to the main control unit 210.

  The main control unit 210 includes a scan converter, a cine memory, an image synthesis unit, and the like (not shown). The main control unit 210 converts data from the B-mode signal processing unit 230 into a predetermined video format, and generates displayable ultrasonic image data. In addition, an average velocity image, a dispersion image, a power image, or a combination image thereof is generated based on blood flow information data from the Doppler signal processing unit 231. The main control unit 210 stores these image data in the cine memory. It is also possible to perform control to display an ultrasonic moving image by continuously displaying the stored image data and the like. Further, the main control unit 210 performs control to combine these image data and the like together with character information and scales of various parameters and display them on the display unit 240. The main control unit 210 executes control of each unit in the ultrasonic diagnostic apparatus based on a control program stored in advance, an operation of the operation unit 250, and the like.

  In the ultrasonic probe 170 according to the present embodiment, the ultrasonic transducer 114 in the first transducer group 150 and the ultrasonic transducer in the second transducer group 160 are transmitted from the electronic circuit 180 based on the rate pulse from the transmission unit 220. 114 is configured to apply a voltage having an opposite phase to either of them. However, the ultrasonic diagnostic apparatus having the ultrasonic transducer 100 and the ultrasonic probe 170 according to the present invention is not limited to this. For example, the electronic circuit 180 locally reverses the polarization direction of the ultrasonic transducer 114. It may be configured. For example, in the manufacturing process of the ultrasonic transducer 100, the lattice-shaped ultrasonic vibrator 114 is divided to connect the front substrate 123 and the rear substrate 120 to the ultrasonic transducer 114 group, and then the front substrate 123 and The polarization process can be performed by applying a high DC voltage through the signal line exposed portion of the rear substrate 120.

  According to this configuration, the ultrasonic waves generated by the ultrasonic transducer 114 in the first transducer group 150 and the ultrasonic transducer 114 in the second transducer group 160 have the same phase and are generated in response to the reflected wave. Since the voltage also has the same phase, it is possible to avoid a situation that hinders the generation of the ultrasonic image. In addition, the electronic circuit 180 itself that performs any of these processes can be provided not on the ultrasonic probe 170 side but on the ultrasonic diagnostic apparatus main body 200 side.

  It is also possible to adopt a configuration in which at least one of the transmission unit 220 and the reception unit 221 in the ultrasonic diagnostic apparatus main body 200 is provided in the ultrasonic probe 170. Further, the transmission unit 220 and the reception unit 221 in the ultrasonic diagnostic apparatus main body 200 apply voltages having opposite phases to the ultrasonic transducers 114 belonging to one of the first transducer group 150 and the second transducer group 160. You may comprise.

(Action / Effect)
The operation and effect of the ultrasonic transducer 100 according to the embodiment described above will be described.

  As described above, in the ultrasonic transducer 100 according to the embodiment, the first vibration is prevented so that the independent wiring patterns 120a and 123a connected to the signal electrodes are not concentrated on one of the front substrate 123 and the rear substrate 120. It is dispersed in the child group 150 and the second vibrator group 160. In addition, in the ultrasonic transducer 100, in the two-dimensional array of the ultrasonic transducers 114, the individual wiring patterns 120 a and 123 a are individually drawn out from the group of ultrasonic transducers 114 arranged approximately on the center side of the array. The open area on the back surface of the side substrate 120 where the through electrode 121 is not exposed is used.

  Accordingly, in the sub-arrays 126 and 126 on the edge side of the two-dimensional array of the ultrasonic transducers 114, wiring spaces such as the independent wiring patterns 120a and 123a connected to the electrodes serving as the signal electrodes of the ultrasonic transducer 114, and the center The wiring space on the side is a separate area. As a result, it is possible to provide a margin for the wiring space on the back surface of the back substrate 120. As a result, even when a huge number of ultrasonic transducers 114 are present in the ultrasonic transducer 100, it is possible to realize the ultrasonic transducer 100 having a two-dimensional array without difficulty in wiring.

  Further, since it is not necessary to directly mount the electronic circuit 180 on the ultrasonic transducer 100 in order to reduce the number of signal paths from the ultrasonic transducer 114, it is necessary to develop a dedicated IC (ASIC) for each ultrasonic transducer specification. There is no. Further, it is possible to reduce the scale (area, etc.) of one electronic circuit and process all elements of the ultrasonic transducer 100 using a plurality of ICs. Therefore, development costs, manufacturing costs, product costs, etc. are reduced.

  In addition, the ultrasonic transducer 100 of the present embodiment described above has a configuration in which a plurality of wiring drawing substrates are sandwiched between the ultrasonic transducers 114 or the ultrasonic transducer 114 blocks as a wiring drawing structure. Since it is not necessary, it is possible to avoid the problem of side lobes.

  In addition, in the two-dimensional array of the ultrasonic transducers 100 according to the present embodiment, even when thinning out the ultrasonic transducers 114 (sparse array), the ratio of the invalid transducers not connected to the electronic circuit 119 is calculated. It can be greatly reduced. Further, when the number of arrangements of the ultrasonic transducers 114 becomes enormous, the conventional module division as described with reference to FIG. 9 may be necessary. However, even in this case, the number of modules to be divided can be reduced.

[Second Embodiment]
Next, an ultrasonic transducer 100 according to a second embodiment of the present invention and an ultrasonic probe 170 provided with the ultrasonic transducer 100 will be described with reference to FIGS. 7 and 8. FIG. 7 is a schematic diagram conceptually showing the distribution of the subarray 126 and the like of the ultrasonic transducer 100 according to the second embodiment of the present invention. In addition, about 2nd Embodiment, only a different part from 1st Embodiment is demonstrated, and description is abbreviate | omitted about the other overlapping part.

(Ultrasonic transducer array)
The ultrasonic transducer 100 according to the second embodiment is an effective transducer that generates ultrasonic waves, that is, a signal line and a ground line, as shown in FIG. Are arranged in a substantially circular shape with the center of the array at the center. Further, as shown by X1 to X4 in FIG. 7, the wiring is drawn in four directions. Further, regarding the ultrasonic transducers 114 at the four corners other than the effective transducers in the two-dimensional array of ultrasonic transducers 100 and the few ultrasonic transducers 114 between the sub-arrays 127 (white ultrasonic transducers 114 in FIG. 7). Are both grounded by connecting both the front side and the back side in common.

  According to such a configuration, in the case of sector scanning, side lobes can be reduced compared to a rectangular two-dimensional array. Furthermore, the number of ultrasonic transducers 114 connected to the electronic circuit 180 can be reduced, and wiring can be simplified. The arrangement shape of the effective vibrators is not limited to a substantially circular shape as shown in FIG. 7, but a similar effect can be obtained even if it is a substantially elliptical shape or an octagonal shape in which four corners are linearly cut. is there.

(Wiring pattern)
Next, FIGS. 8A to 8D show independent wiring patterns 123a drawn in the X1 direction of FIG. 7 on the front substrate 123 and the rear substrate 120 of the ultrasonic transducer 100 according to the second embodiment of the present invention. , 120a is a schematic diagram conceptually showing. 8A shows the wiring area on the back surface of the front substrate 123, FIG. 8B shows the wiring area on the front surface of the front substrate 123, and FIG. FIG. 8D shows the wiring area on the front surface of the front side substrate 123. FIG.

  As shown in FIG. 7, the effective transducers in the ultrasonic transducer 114 in the ultrasonic transducer 100 according to the second embodiment are arranged in a substantially circular shape, and the entire arrangement including the invalid transducer is rectangular. It is. In the case of such an arrangement, in order to draw out the independent wiring patterns 120a, 120b, 123a, 123b in four directions, for example, a configuration as shown in FIG. 7 can be adopted. That is, the entire two-dimensional array of ultrasonic transducers 114 is represented by an approximately isosceles triangle having one side that is an edge of the array of rectangular ultrasonic transducers 114 as a base and the center of the two-dimensional array as a vertex. The circuit is divided into four so as to be formed, and each wiring pattern is drawn out toward the base (the edge of the array) for each of the divided blocks. Hereinafter, each wiring pattern on each surface of each substrate will be described with reference to FIGS.

<Back of front side board>
As shown in FIG. 8A, the portion of the front substrate 123 that does not overlap with the second transducer group 165 is the ground wiring region 190 on the back side. A common wiring pattern 123b (for example, a solid ground) in the ground wiring region 190 commonly connects the front electrodes 112 of the ultrasonic transducers 114 in the first transducer group 155, and the edges of the two-dimensional array of the ultrasonic transducers 114. The wiring is pulled out to the outside. Further, in the region overlapping the second transducer group 165 on the back surface of the front substrate 123, connection pads 125 are provided corresponding to the arrangement of the ultrasonic transducers 114 of the second transducer group 165.

  Further, as described above, in the ultrasonic transducer 100 according to the second embodiment, all the ultrasonic transducers 114 are divided into four by substantially isosceles triangles whose base is the edge of the entire array of the rectangles. In order to distribute the first vibrator group 155 and the second vibrator group 165 in the substantially isosceles triangle, as shown in FIG. 8A, for example, a part of the first vibrator group 155 and the second vibration group. It is possible to adopt a configuration in which both of a part of the child group 165 are arranged so as to be adjacent to the base (the edge of the array). With this configuration, wiring is easy on both the back surface of the front substrate 123 and the front surface of the back substrate 120. That is, when either one of the first vibrator group 155 or part of the second vibrator group 165 is not adjacent to the bottom side, the ground wiring is provided on either the back surface of the front substrate 123 or the front surface of the back substrate 120. This is because it may be difficult to pull out the card.

<Front side of front substrate>
As shown in FIG. 8B, the connection pad 124 on the back surface of the front substrate 123 is also connected to the front independent wiring pattern 123a by the through electrode 121, and is individually wired from the front electrode 112 of each ultrasonic transducer 114. Has been pulled out. Further, as shown in FIG. 8B, the independent wiring pattern 123a is directly drawn out in the direction of the edge from the ultrasonic transducer 114 of the second transducer group 165 adjacent to the edge of the two-dimensional array. In addition, from the ultrasonic transducer 114 of the second transducer group 165 that is not adjacent to the edge of the two-dimensional array, the part where the independent wiring pattern 123a does not overlap the second transducer group 165, for example, the through electrode 121, is provided. The first transducer group 155 having no pad is pulled out to a portion that overlaps with the first transducer group 155 or a portion of the invalid transducer (in the drawing), and then pulled out toward the edge of the array.

<Front side of back side board>
As shown in FIG. 8C, the ground wiring region 190 on the front surface of the back substrate 120 is in the opposite position to the back surface of the front substrate. This is the same as in the first embodiment.

《Back of back side substrate》
As shown in FIG. 8D, the wiring space of the independent wiring pattern 120a on the back surface of the back substrate 120 is opposite to the front surface of the front substrate. This is also the same as in the first embodiment. Further, as shown in FIG. 8D, all of the independent wiring patterns 120a on the back surface of the back-side substrate 120 are temporarily not overlapped with the first transducer group 155, for example, the second vibration without the pad of the through electrode 121. It is pulled out in the direction of the edge through a portion overlapping with the child group 165 and an invalid vibrator portion.

  Also in the ultrasonic transducer 100 according to the second embodiment, the front electrode 112 of the ultrasonic transducer 114 is dispersed into the ground electrode and the signal electrode, and the back electrode 116 is also dispersed into the ground electrode and the signal electrode, whereby a signal is obtained. It is possible to provide a margin in the wiring space such as the independent wiring patterns 120a and 123a connected to the electrodes to be electrodes. As a result, even when a huge number of ultrasonic transducers 114 are present in the ultrasonic transducer 100, it is possible to realize the ultrasonic transducer 100 having a two-dimensional array without difficulty in wiring.

DESCRIPTION OF SYMBOLS 100 Ultrasonic transducer 110 1st acoustic matching layer 111 2nd acoustic matching layer 112 Front electrode 114 Ultrasonic vibrator 116 Back electrode 118 Backing material 120 Back side board 120a, 123a Independent wiring pattern 120b, 123b Common wiring pattern 121 Through electrode 123 Front side substrate 124, 125 Connection pad 126, 127 Subarray 130 Conductive connection 150, 155 First transducer group 160, 165 Second transducer group 170 Ultrasonic probe 180 Electronic circuit 190 Ground wiring region 200 Ultrasonic diagnostic apparatus body 210 Main control unit 220 Transmission unit 221 Reception unit 230 B-mode signal processing unit 231 Doppler signal processing unit 240 Display unit 250 Operation unit

Claims (14)

A plurality of ultrasonic transducers each having a front electrode and a back electrode provided on the front surface on the radiation direction side of the ultrasonic wave and the back surface on the opposite side of the front surface, and having piezoelectricity;
A signal lead line that is disposed on the front side of the plurality of ultrasonic transducers and commonly connects the front electrodes of the first transducer group that is a part of the plurality of ultrasonic transducers; And a front substrate on which electrode pads are individually formed at positions corresponding to the front electrodes of the other second vibrator group of the first vibrator group,
Each of the plurality of ultrasonic transducers has a signal lead line that is arranged on the back side and commonly connects the back electrodes of the second transducer group, and each of the back electrodes of the first transducer group. A back side substrate in which electrode pads are individually formed at positions corresponding to
Ultrasonic transducer characterized by. The signal lead lines on the front side substrate and the back side substrate share the front electrode or the back electrode with an independent wiring pattern that is independently drawn from the front electrode or the back electrode of the ultrasonic transducer. There is a common wiring pattern to connect,
The front electrodes of the first vibrator group are connected in common by the common wiring pattern of the front side substrate,
The back electrodes of the second vibrator group are connected in common by the common wiring pattern of the back side substrate,
The common wiring pattern connected to the front electrode of the first transducer group and the common wiring pattern connected to the back electrode of the second transducer group are edges in the arrangement of the ultrasonic transducers. Being conductive on the outside of the part,
The ultrasonic transducer according to claim 1. The front substrate and the back substrate have a common wiring pattern formed on the surface on the ultrasonic transducer side, and the independent wiring pattern is formed on the opposite surface. Conductive holes connecting the independent wiring pattern and the front electrode or the back electrode of the ultrasonic transducer are provided,
Only the electrodes of the first transducer group are connected to the common wiring pattern on the surface on the ultrasonic transducer side of the front substrate, and the independent wiring pattern on the opposite surface includes Only the electrodes of the second vibrator group are connected via the conductive holes,
Only the electrodes of the second transducer group are connected to the common wiring pattern on the ultrasonic transducer side surface of the back side substrate, and the independent wiring pattern on the opposite side surface includes the Only the electrodes of the first vibrator group are connected via the conductive holes;
The ultrasonic transducer according to claim 2. The front substrate and the back substrate have a common wiring pattern formed on the surface on the ultrasonic transducer side, and the independent wiring pattern is formed on the opposite surface. Conductive holes connecting the independent wiring pattern and the front electrode or the back electrode of the ultrasonic transducer are provided,
Only the electrodes of the second transducer group are connected to the common wiring pattern on the surface on the ultrasonic transducer side of the front substrate, and the independent wiring pattern on the opposite surface includes Only the electrodes of the first vibrator group are connected via the conductive holes,
Only the electrodes of the first transducer group are connected to the common wiring pattern on the ultrasonic transducer side surface of the back side substrate, and the independent wiring pattern on the opposite side surface includes the Only the electrodes of the second vibrator group are connected via the conductive holes;
The ultrasonic transducer according to claim 2. Each of the independent wiring patterns includes a space between end portions of the conductive holes on the opposite surface of the front substrate and the rear substrate, and a space opposite to the region where the common wiring pattern is formed. Passed through,
The ultrasonic transducer according to claim 3 or 4. The ultrasonic transducers are arranged in a substantially rectangular shape and two-dimensionally,
One of the independent wiring pattern and the common wiring pattern is drawn to at least the outer side of the peripheral edge of the array of the ultrasonic transducers, and the other is drawn to at least the outer side of the opposite side to the one side.
Of the ultrasonic transducers two-dimensionally arranged on the surface on the opposite side of the front-side substrate, connected to the front electrode of the ultrasonic transducers arranged on the second transducer group and the peripheral side. The independent wiring pattern is passed through the space between the end portions of the conductive holes, and the front electrode of the ultrasonic transducer disposed on the center side of the second transducer group and the two-dimensional array. The connected independent wiring pattern is passed through the space on the opposite side of the common wiring pattern,
Of the ultrasonic transducers two-dimensionally arranged on the opposite surface of the back substrate, the second transducer group is connected to the back electrode of the ultrasonic transducer disposed on the peripheral side. The independent wiring pattern is passed through the space between the end portions of the conductive holes, and the front electrode of the ultrasonic transducer disposed on the center side of the first transducer group and the two-dimensional array. The connected independent wiring pattern is passed through a space on the opposite side of the common wiring pattern;
The ultrasonic transducer according to claim 3. The front side substrate and the back side substrate are made of a flexible resin film,
The ultrasonic transducer according to claim 2. The polarization direction of each of the ultrasonic transducers in the first transducer group is opposite to the polarization direction of the ultrasonic transducer in the second transducer group;
The ultrasonic transducer according to claim 3 or 4. The ultrasonic transducers of the first transducer group and the ultrasonic transducers of the second transducer group are driven by electrical signals having opposite phases, respectively.
The ultrasonic transducer according to claim 8. The ultrasonic transducers are arranged in a substantially rectangular shape and two-dimensionally,
The independent wiring pattern and the common wiring pattern in the front-side substrate and the back-side substrate are drawn in four directions toward the peripheral edge of the array of the plurality of ultrasonic transducers;
The ultrasonic transducer according to claim 2. The two-dimensional array of ultrasonic transducers includes an invalid transducer that is not driven and an effective transducer that is driven. The contour of the shape formed by the array of effective transducers is substantially elliptical, circular, or octagonal. There is,
The ultrasonic transducer according to claim 10. Ultrasound in which an ultrasonic transducer having a plurality of ultrasonic transducers each provided with a front electrode and a back electrode is provided inside on the front surface on the radiation direction side of the ultrasonic wave and on the back surface opposite to the front surface A probe,
A signal lead line that is disposed on the front side of the plurality of ultrasonic transducers and commonly connects the front electrodes of the first transducer group that is a part of the plurality of ultrasonic transducers; And a front substrate on which electrode pads are individually formed at positions corresponding to the front electrodes of the other second vibrator group of the first vibrator group,
Each of the plurality of ultrasonic transducers has a signal lead line that is arranged on the back side and commonly connects the back electrodes of the second transducer group, and each of the back electrodes of the first transducer group. An ultrasonic transducer having a back substrate on which electrode pads are individually formed at positions corresponding to
Ultrasonic probe characterized by. The polarization direction of each of the ultrasonic transducers in the first transducer group in the ultrasonic transducer is opposite to the polarization direction of the transducers in the second transducer group,
A further transmission / reception circuit in which an electrical signal transmitted / received to / from the first transducer group and an electrical signal transmitted / received to / from the second transducer group have opposite phases;
The ultrasonic probe according to claim 12. An ultrasonic transducer having a plurality of ultrasonic transducers each provided with a front electrode and a back electrode on the front surface on the radial side of the ultrasonic wave and on the back surface opposite to the front surface, and the ultrasonic transducer inside An ultrasonic diagnostic apparatus comprising: an ultrasonic probe provided on the main body; and a main body that transmits and receives electrical signals to and from the ultrasonic probe,
The ultrasonic transducer is
A signal lead line that is disposed on the front side of the plurality of ultrasonic transducers and commonly connects the front electrodes of the first transducer group that is a part of the plurality of ultrasonic transducers; And a front substrate on which electrode pads are individually formed at positions corresponding to the front electrodes of the other second vibrator group of the first vibrator group,
Each of the plurality of ultrasonic transducers has a signal lead line that is arranged on the back side and commonly connects the back electrodes of the second transducer group, and each of the back electrodes of the first transducer group. A back side substrate on which electrode pads are individually formed at positions corresponding to
Further, the ultrasonic transducer and the second transducer group of the first transducer group are arranged via the wiring pattern, the front electrode and the back electrode in the ultrasonic transducer of the ultrasonic probe. The electrical signal transmitted from the ultrasonic transducer of the first transducer group or the second transducer group to the ultrasonic transducer of the first transducer group is transmitted. A transmission / reception circuit for inverting the phase of the signal,
An ultrasonic diagnostic apparatus characterized by the above.