JP4982135B2 - Ultrasonic transducer - Google Patents

Description

  The present invention relates to an ultrasonic transducer used in an ultrasonic diagnostic apparatus or the like and constituting an ultrasonic probe.

  An ultrasonic diagnostic apparatus transmits (transmits) an ultrasonic wave to a desired diagnostic region of a subject using an ultrasonic probe, and receives a reflected wave from a tissue boundary in the subject having different acoustic impedances, that is, an ultrasonic probe. The diagnosis is performed by scanning the ultrasonic beam using the laser to obtain information on the body tissue of the subject and image it. This ultrasonic probe has an ultrasonic transducer in order to transmit an ultrasonic wave to a subject or the like and receive a reflected wave.

  Conventionally, as an ultrasonic transducer used in an ultrasonic probe of an ultrasonic diagnostic apparatus, a one-dimensional ultrasonic array probe in which the ultrasonic vibration elements are arranged in an array has been used. As a scanning method of the ultrasonic one-dimensional array probe, a method generally called an electronic scanning method is used. The electronic scanning method is a method in which a delay time is given to each of the arrayed ultrasonic transducer elements to focus a transmission pulse or a reception signal. This method enables high-speed scanning of transmission / reception ultrasonic beams and high-speed focus point change, and is currently the mainstream of the ultrasonic scanning method.

  This ultrasonic one-dimensional array probe performs high-frequency electronic focusing in the arrangement direction of the ultrasonic transducers by the above-described electronic scanning method, and also high-speed in the arrangement direction of the ultrasonic vibration elements (piezoelectric elements). By scanning with an ultrasonic beam, a two-dimensional image can be provided in real time. On the other hand, in recent years, a three-dimensional ultrasonic image is obtained by a method using a one-dimensional array probe by rotating and swinging, or a method using an ultrasonic two-dimensional array probe in which ultrasonic transducers are arranged in a matrix. A system for collecting and displaying is being studied. A three-dimensional ultrasonic image is useful for diagnosing a part that is easily overlooked in a two-dimensional image, and a tomographic image suitable for diagnosis and measurement can be obtained, so that improvement in diagnostic accuracy can be expected.

  However, among the methods related to the three-dimensional image related to these ultrasonic diagnostic apparatuses, the method using a one-dimensional array probe uses a method of mechanically moving or rotating the one-dimensional array probe. It takes a lot of time to collect data, and it is difficult to display a three-dimensional image in real time.

  On the other hand, in the method using a two-dimensional array probe, ultrasonic transducers are arranged two-dimensionally, ultrasonic omnidirectional focusing, and high-speed three-dimensional scanning compared to the case of a one-dimensional array probe. Can be realized. However, in any case, the number of elements of the ultrasonic vibration element increases (for example, 10 to 100 times), and transmission / reception with respect to this ultrasonic vibration element occurs as the number of elements increases. The number of transmission / reception circuits to be performed and the cables connecting the transmission / reception circuits and the ultrasonic vibration elements are also increased. As a result, the ultrasonic probe and the ultrasonic transmission / reception circuit become extremely complicated and increase in size and weight, so that the operability is significantly lowered.

  To solve this problem, there is a method that employs a structure in which signal leads are drawn out by stacking substrates corresponding to the ultrasonic transducer array, and it is easy to draw out the signal leads of the transducer in the two-dimensional array probe. It has been proposed (for example, Patent Document 1).

  The ultrasonic transducer array has a structure in which a printed circuit board for drawing out signal leads and grounds from each ultrasonic transducer is arranged in each column interval of elements arranged in a matrix, and corresponding to one column on the printed substrate. A method of configuring a two-dimensional array transducer by arranging printed circuit boards on which ultrasonic transducers are mounted in the row direction after mounting is proposed (for example, Patent Document 2).

  Furthermore, a configuration and manufacturing method of a backing material in which signal leads are embedded and a two-dimensional array electrode pad is formed on the bottom surface has been proposed (for example, Patent Document 3). By using this backing material, it is possible to constitute a two-dimensional array transducer in which signal leads are drawn from two-dimensionally arranged ultrasonic vibration elements.

Japanese Patent Laid-Open No. 2001-292696 JP 2001-309493 A JP 2000-166923 A

  As an example of these ultrasonic two-dimensional array probes capable of collecting three-dimensional images, FIG. 14 shows a two-dimensional array ultrasonic probe in which a large number of ultrasonic vibration elements constituting an ultrasonic transducer are arranged in a matrix. 14 is a schematic diagram showing a conventional configuration of a two-dimensional array ultrasonic transducer constituting the two-dimensional array ultrasonic probe, and FIG. 14A is a perspective view of the two-dimensional array ultrasonic transducer 90. FIG.14 (b) is BB sectional drawing seen from the arrow direction in Fig.14 (a).

  As shown in FIGS. 14A and 14B, the two-dimensional array ultrasonic transducer 90 includes an acoustic matching layer 11, an earth electrode 92, an ultrasonic vibration element (piezoelectric body) 14, a signal electrode 96, a backing material 18 ( Load material phase) and a signal lead 901 (see, for example, Patent Document 1).

  The acoustic matching layer 11 is provided so as to be positioned between the acoustic lens and the ultrasonic vibration element 14 and matches the acoustic impedance between the subject and the ultrasonic vibration element 14.

  The ground electrode 92 is provided so as to be sandwiched between each ultrasonic vibration element 14 and the acoustic matching layer 11. The ground electrode 92 is an electrode for applying electric power to each ultrasonic vibration element 14 in order to obtain a piezoelectric effect, and is grounded.

  The ultrasonic vibration elements (piezoelectric bodies) 14 are piezoelectric elements made of two-component or three-component piezoelectric ceramics, and are arranged in a two-dimensional matrix. The two-dimensional arrangement of the ultrasonic vibration elements 14 enables omnidirectional focusing of ultrasonic waves and high-speed three-dimensional scanning.

  The signal electrode 96 is provided at the other end of each ultrasonic vibration element 14 (that is, one end different from the ground electrode 92), and is applied with electric power for the piezoelectric effect or electricity based on the ultrasonic wave received from the subject. An electrode for inputting a signal.

  The backing material 18 is provided on the back surface of the ultrasonic vibration element 14 and mechanically supports the ultrasonic vibration element 14. The backing material 18 brakes the movement of the ultrasonic vibration element 14 in order to shorten the ultrasonic pulse. Here, the back surface refers to a surface on the side facing the front surface when the acoustic matching layer 11 side is the front surface of the side surfaces of the ultrasonic transducer element 14 in the ultrasonic transducer 10.

  The backing material 18 is formed with a path through which a signal lead 901 described later can be pulled out. This drawable path is for two-dimensionally arranging the end portions 901a of the signal lead 901, and is formed in a direction perpendicular to the arrangement surface of the ultrasonic vibration element 14 from the signal electrode 96.

  The signal lead 901 has an end 901a of the signal lead 901 at one end, and is connected to the signal electrode 96 of each ultrasonic vibration element 14 at the other end. Further, the signal lead 96 is extended in a direction perpendicular to the arrangement surface of the ultrasonic vibration elements 14 from the connection portion with the signal electrode 96, and is passed through a path provided in the above-described backing material 18, so that the end portion 901 a of the signal lead 901 is formed. Has been pulled out. Therefore, the end portion 901a of the signal lead 901 is arranged in a two-dimensional array on the surface of the backing material 18 opposite to the ultrasonic vibration element 14.

  Thus, conventionally, the signal lead 901 has been drawn from each signal electrode 96 provided on the back surface of each ultrasonic vibration element 14, but in recent years, the lead wire drawn from the ground electrode 92 side has also been drawn. It has come to be pulled out from each of the sonic vibration elements 14. For example, the pulse inversion video method is used. In this pulse inversion video method, an ultrasonic pulse is transmitted to a subject twice with a phase difference of 180 degrees, two echo signals are added, and only a harmonic component is extracted and imaged. More specifically, a pulsar is connected to each pole (front electrode and back electrode) of the ultrasonic vibration element, and a bipolar pulse is output by operating alternately. This alternating operation is performed by two transmissions. By reversing, a bipolar pulse having a waveform with good positive / negative symmetry can be output between the first transmission and the second transmission, and as a result, the harmonic imaging image can be improved.

  Unlike the conventional case, for example, when generating an ultrasonic diagnostic image by the pulse inversion imaging method, it is necessary to draw out signal leads individually from both poles of each ultrasonic vibration element. In that case, it is necessary to form a circuit configuration that can apply a high-frequency pulse to both poles of each ultrasonic vibration element for a conventional ground electrode as a common electrode.

  The ultrasonic probe has a basic configuration in which an ultrasonic transducer and an ultrasonic diagnostic apparatus main body are connected by a cable assembly, and a signal received by the ultrasonic transducer is converted by an IC or the like.

  Compared with the one-dimensional array ultrasonic probe, in the two-dimensional array ultrasonic probe, the ultrasonic vibration elements are finely arranged. In this case, since the ultrasonic vibration elements become fine, one channel (simultaneously) As the capacitance of each driven ultrasonic vibration element group) decreases and the length of the cable assembly increases, a loss occurs in the transmission process.

  Therefore, in order to efficiently transmit and receive signals and the like, it is necessary to make the length of the cable assembly appropriate. For this purpose, it is necessary to shorten the distance from the electronic circuit connected to the cable assembly to the ultrasonic vibration element, and it is necessary to install the electronic circuit in the vicinity of the transducer.

  Further, compared with the conventional one-dimensional ultrasonic array probe, since the ultrasonic vibration elements are arranged in a matrix in the ultrasonic two-dimensional array probe, the number of ultrasonic vibration elements is enormous. As a result, the number of cable cores of the cable assembly becomes enormous. Further, considering that the cable assembly is extended to the apparatus main body, the diameter thereof is larger than the conventional one. Due to the increase in the number of cores and the diameter of the cable, the operability is significantly lowered in terms of the size and weight of the ultrasonic probe.

  Therefore, an ultrasonic two-dimensional array probe requires a structure that reduces the weight and the like and does not impair operability, and an electronic circuit that adds received signals so as to collect a large number of signal leads. Is required. However, since these electronic circuits must be arranged in the vicinity of the ultrasonic transducer so that no loss occurs during transmission and reception as described above, these electronic circuits are required to be mounted at a high density.

  In addition to this, as in the above-described pulse inversion imaging method, from the front electrode lead drawn from the front electrode formed on the ultrasonic radiation surface side of the ultrasonic vibration element and the back electrode formed facing the front electrode A configuration is also used in which the drawn back electrode lead is drawn independently for each ultrasonic vibration element channel, and the front electrode lead and the back electrode lead are connected to different electronic circuits.

  In this case, the lead drawn from the conventional earth (ground) electrode is not required for each channel of the ultrasonic vibration element, whereas the front electrode lead is required for each ultrasonic vibration element. Therefore, the number of cores of the cable assembly that has been enormous in the past will further increase.

  In the pulse inversion video method, an electronic circuit (pulse circuit) for driving both ends of the ultrasonic vibration element is required. However, as described above, in the ultrasonic two-dimensional array probe, the size must be in consideration of operability, but if an electronic circuit is formed on the assumption of the size, the performance and function of the circuit are restricted. Depending on the restrictions, it may be difficult to realize the pulse inversion video method.

  From the above, in an ultrasonic two-dimensional array probe with a large number of signal leads, it is necessary to arrange the electronic circuit at a high density while arranging the electronic circuit near the ultrasonic transducer. In this regard, in forming an electronic circuit, it is very high that only a plurality of electronic circuits connected to the back electrode are collected as a dedicated IC, and only a plurality of electronic circuits connected to the front electrode are combined into another dedicated IC. It is known that it is effective in terms of densification.

  Therefore, when the connection leads are independently pulled out from the front electrode and the back electrode and connected to different electronic circuits, the connection leads are connected to a large number of connection leads, a circuit group connected to the back electrode, and the front electrode. Therefore, a configuration for electrically connecting the circuit group with high density and space-saving is required.

  The present invention has been made in view of the above problems, and the object thereof is to achieve high density electrical connection with an electronic circuit installed at a subsequent stage and contribute to downsizing of the electronic circuit. As a result, it is an object of the present invention to provide an ultrasonic transducer that can reduce the size of a two-dimensional array probe.

In order to solve the above problem, the invention according to claim 1
A multilayer circuit board having two conductive layers , one of which is sandwiched between insulating layers, a plurality of ultrasonic vibration elements arranged along one side of one surface of the multilayer circuit board, and the ultrasonic vibration element A front electrode and a back electrode provided on a surface in a direction orthogonal to the arrangement direction thereof, and a different conductive layer of the multilayer circuit board , and a predetermined direction from each of the front electrode and the back electrode And the multi-layered circuit board is superposed so that the one side is aligned with each other.

The invention described in claim 2
The said connection lead is extended to the surface on the opposite side to the front surface in which the said ultrasonic transducer | vibration element was arranged among the surfaces of the said ultrasonic transducer, and the surface orthogonal to this front surface. Ultrasonic transducer.

The invention according to claim 3
The ultrasonic transducer according to claim 1, wherein a connection pad is formed at a tip portion of the connection lead.

The invention according to claim 4
The ultrasonic wave according to claim 1, wherein the connection lead is divided into a first connection lead connected to each back electrode and a second connection lead connected to each front electrode. It is a transducer.

The invention described in claim 5
The connection pad is divided into a first connection pad that is conducted from the back electrode by the first connection lead and a second connection pad that is conducted from the front electrode by the second connection lead. The ultrasonic transducer according to claim 4.

The invention described in claim 6
The first connection lead and the second connection lead are separately extended in the first connection pad direction and the second connection pad direction through different layers of the multilayer circuit board. The ultrasonic transducer according to claim 5.

The invention described in claim 7
The first connection pads and the second connection pads are alternately arranged in a predetermined number in the stacking direction of the printed circuit board or in the direction in which the ultrasonic vibration elements are arranged. The ultrasonic transducer according to claim 5 or 6, wherein wiring of the second connection lead and the second connection lead is provided.

The invention according to claim 8 provides:
7. The ultrasonic transducer according to claim 5, wherein each of the first connection pads is formed as a set, and each of the second connection pads is set as a set.

The invention according to claim 9 is:
Only one of the first connection pad group or the second connection pad group is formed on the surface opposite to the front surface, and the second connection pad group is formed on the surface orthogonal to the front surface. Alternatively, only the other of the first connection pad groups is formed. The ultrasonic transducer according to claim 5 or 6.

  According to the present invention, since the wiring of the connection lead drawn from the front electrode and the back electrode is formed so that the connection pads as the front end portion of the connection lead are arranged together, the individual ultrasonic transducers It is possible to pull out a huge number of connection leads (signal leads) that are drawn independently from both poles. Therefore, the signal can be transmitted efficiently, and arbitrary drawing can be performed. Therefore, the electronic circuits connected to the connection leads can be mounted with high density and integration. As a result, it is possible to provide an ultrasonic probe suitable for real-time three-dimensional image diagnosis.

  Hereinafter, an ultrasonic transducer and an ultrasonic probe according to embodiments of the present invention will be described with reference to the drawings.

[First embodiment]
1 to 4 are diagrams showing a first embodiment of an ultrasonic transducer according to the present invention, and FIG. 1A is an ultrasonic transducer constituting the ultrasonic transducer 10 according to the first embodiment. It is a perspective view which shows the unit 10a, and FIG.1 (b) is AA sectional drawing of Fig.1 (a). Hereinafter, the configuration of the first embodiment of the ultrasonic transducer of this embodiment will be described.

(Schematic configuration of the ultrasonic transducer 10)
As shown in FIG. 1, the ultrasonic transducer unit 10a of this embodiment includes a multilayer printed circuit board 100, an acoustic matching layer 11, an ultrasonic vibration element (piezoelectric body) 14, a backing material 18 (loading material phase), and The first connection lead 101 and the second connection lead 102 are provided. The ultrasonic transducer units 10a are stacked in the same direction to form the ultrasonic transducer 10. That is, a one-dimensional ultrasonic transducer is laminated to form a two-dimensional ultrasonic transducer. Here, the acoustic matching layer 11, the ultrasonic vibration element (piezoelectric body) 14, and the backing material 18 play the same role as those used in the conventional ultrasonic transducer 90.

(Configuration of ultrasonic transducer unit 10a)
A plurality of ultrasonic vibration elements (piezoelectric bodies) 14 are arranged along one side of the multilayer printed circuit board 100. Thereby, one row of the two-dimensional ultrasonic transducer is formed. An acoustic matching layer 11 is formed between the plurality of ultrasonic vibration elements (piezoelectric bodies) 14 and, for example, an acoustic lens (not shown) that focuses the ultrasonic waves.

  A front electrode 12 is formed between the acoustic matching layer 11 and each ultrasonic vibration element 14. The front electrode 12 is provided independently for each ultrasonic vibration element 14, and is provided in contact with the acoustic matching layer 11 and the ultrasonic vibration element 14. The front electrode 12 inputs an electric signal based on the application of electric power for the piezoelectric effect and the ultrasonic wave received from the subject.

  A backing material 18 is formed in a direction opposite to the side on which the acoustic matching layer 11 is formed (referred to as “back electrode side”; hereinafter the same) with respect to the ultrasonic vibration element 14. A back electrode 16 is formed between the backing material 18 and each ultrasonic transducer 14. The back electrode 16 is provided independently for each ultrasonic vibration element 14 and is provided in contact with the ultrasonic vibration element 14 and the backing material 18. The back electrode 16 receives an electric signal based on the application of electric power for the piezoelectric effect and the ultrasonic wave received from the subject.

  The first connection lead 101 is drawn from the front electrode 12 via one or a plurality of conductive layers of the printed circuit board 100 having a multilayer structure. The extracted first connection lead 101 is extended and connected to the first connection pad 101a to be conducted. The first connection lead 101 transmits a high-frequency pulse or a control signal for transmitting a high-frequency pulse in order to transmit an ultrasonic wave to the subject, and transmits an echo signal received from the subject to an electronic circuit (IC , ASIC, etc.). The first connection lead 101 may be, for example, an in-board wiring of the multilayer printed circuit board 100 or may be arranged as a circuit.

  Similarly, the second connection lead 102 is led out from the back electrode 16 via one or a plurality of conductive layers of the printed circuit board 100 having a multilayer structure. The drawn second connection lead 102 is extended and connected to the second connection pad 102a to be conducted. The second connection lead 102 transmits a high-frequency pulse or a control signal for transmitting a high-frequency pulse in order to transmit an ultrasonic wave to the subject, and transmits an echo signal received from the subject to an electronic circuit (IC , ASIC, etc.). The second connection lead 102 may be, for example, an in-board wiring of the multilayer printed circuit board 100 or may be arranged as a circuit.

With the configuration as described above, the first connection lead 101 and the second connection lead 102 can be formed in different conductive layers in the printed circuit board 100. Therefore, the first connection lead 101 and the second connection lead 102 can be formed. While reducing the electrical coupling (crosstalk) between the connection leads 102, the extension path of the connection leads can be freely determined.
Next, an example of the wiring means of the first connection lead 101 and the second connection lead 102 of the ultrasonic transducer unit 10a in the ultrasonic transducer 10 according to the present embodiment will be described.

(Wiring means for the first connection lead 101 and the second connection lead 102)
As shown in FIG. 1B, each of the first connection leads 101 connected to each front electrode 12 is connected to one of the printed circuit boards 100 from the front electrode 12 by means of, for example, a through hole. It extends to each connection pad 101a via a plurality of conductive layers. As a means for extending this, it is conceivable that the first connection lead 101 is arranged on the conductive layer of the printed board 100 as an in-board wiring or a circuit. For example, as shown in FIG. 3A, each of the first connection leads 101 drawn out in a large number can be collected in the extended first connection pad 101a. Similarly, since the second connection leads 102 are also extended from the back electrode 16 to the second connection pads 102a via the respective conductive layers, the second connection leads 102 can be collected in the extended first connection pads 101a. .

  Therefore, even when the first connection lead 101 and the second connection lead 102 are pulled out independently from each of the ultrasonic vibration elements 14, the first connection lead 101 and the second connection lead 102 are extended by another conductive layer. The connection with the electronic circuit is not difficult, and the connection can be easily performed. In addition, a large number of first connection leads 101 or second connection leads 102 can be concentrated and connected to a subsequent electronic circuit in conduction with the front electrode 12 or the back electrode 16. As a result, a huge number of signals can be processed efficiently. Furthermore, the first connection pad 101a and the second connection pad 102a can be freely arranged. As a result, for example, when connecting to an electronic circuit or the like (for example, IC45) connected to the subsequent stage, for each electrode Can be summarized.

(Example of manufacturing process)
Next, an example of a process for manufacturing the ultrasonic transducer unit 10a according to the present embodiment based on the printed circuit board 100 will be described with reference to FIGS.

  2 to 4 are diagrams for explaining a process for forming the ultrasonic transducer 10 using the ultrasonic transducer unit 10a shown in FIG. 1, in which FIG. FIG. FIG. 2 is a diagram showing a “sealing process” and a “cutting process”. FIG. 3A is a diagram showing wiring means of the ultrasonic transducer unit 10a in the first embodiment of the ultrasonic transducer according to the present invention. FIG. 3B is a diagram conceptually showing that the ultrasonic transducer 10 according to the first embodiment of the present invention is formed by laminating ultrasonic transducer units 10a. FIG. 4 is a diagram illustrating an example of a method for connecting the ultrasonic transducer 10.

  First, a continuity test is performed on the ultrasonic transducer unit 10a. As shown in FIG. 1A, a plurality of test pads 103 are formed on the printed board 100 along the opposite side of the side on which the acoustic matching layer 11 is formed.

  As shown in FIG. 1B, the test pad 103 is provided and connected to each of the first connection lead 101 and the second connection lead 102. In addition, the continuity of the first connection lead 101 and the second connection lead 102, the front electrode 12, the back electrode 16, and the ultrasonic vibration element 14 connected thereto is individually inspected by the inspection pad 103.

  As described above, since the inspection pad 103 is provided on the printed circuit board 100 in order to inspect the continuity of the ultrasonic vibration element 14 and the like, the ultrasonic vibration element 14 corresponding to the inspection pad 103 is selected by selecting the specific inspection pad 103. It is possible to easily inspect the operation status of. That is, the conduction failure can be removed at the initial stage of assembly of the ultrasonic transducer, and as a result, the manufacturing cost can be reduced as compared with the case where the conduction failure is found after the assembly of the ultrasonic transducer.

  Next, the ultrasonic transducer units 10a that have passed the continuity test are stacked in the front and back direction of the printed circuit board 100 as shown in the lamination step FIG. At this time, the acoustic matching layers 11 on each printed circuit board 100 are stacked so as to gather in the same direction, and the sides of each printed circuit board 100 are stacked so that the sides are not displaced. 1 (c) and 3 (b) show that the acoustic matching layer 11, the ultrasonic vibration element 14, and the backing material 18 are laminated by laminating the ultrasonic transducer units 10a. It is conceptual. Further, here, the first connection pad 101a is indicated by “●”, and the second connection pad 102a is indicated by “◯”.

  Next, as shown in FIG. 2A, resin sealing is performed with a sealing resin 19 on the stacked ultrasonic transducer units 10a, and the stacked ultrasonic transducer units 10a are obtained. Fix it. In addition, the sealing resin 19 in this embodiment is good to use the material (for example, epoxy resin etc.) which has an acoustic attenuation effect and plays the role of a backing material.

  Thereafter, as shown in FIG. 2B, a plurality of laminated and resin-sealed ultrasonic transducer units 10a are cut by machining at arbitrarily set cutting planes S1. As shown in FIG. 3A, the first connection lead 101, the second connection lead 102, and the sealing resin 19 are cut between the backing material 18 and the inspection pad 103 by this cutting step. Further, as shown in FIG. 3B, the cut portion of the first connection lead 101 exposed by this cutting step is connected to the first connection pad 101a. Similarly, the second connection lead 102 is connected to the second connection pad 102a.

  The first connection pad 101a is for electrically connecting the front electrode 12 to an electronic circuit or the like through a first connection lead. Similarly, the second connection pad 102a also electrically connects the back electrode 16 to the electronic circuit or the like through the second connection lead. Here, the electronic circuit is not limited to the electronic circuit itself, and includes, for example, an IC, an ASIC, and other means.

(Connection between the ultrasonic transducer 10 and the ultrasonic diagnostic apparatus main body)
FIG. 4 shows an example of a method for connecting the ultrasonic transducer 10. The mechanism for connecting the ultrasonic transducer 10 and the IC substrate 40 according to the first embodiment of the present invention, and the IC 45 and ultrasonic diagnosis on the IC substrate 40. It is a figure for demonstrating the mechanism which connects an apparatus main body.

  As shown in FIG. 4, an IC 45 is formed on the IC substrate 40, provided between the ultrasonic transducer 10 and the ultrasonic diagnostic apparatus main body, and electrically connected. The IC 45 drives the ultrasonic vibration element 14 to transmit or receive an ultrasonic wave by the ultrasonic transducer 10 and processes the received signal.

  As described above, according to the present invention, the wiring of the first connection lead 101 and the second connection lead 102 can be freely configured in various ways. Accordingly, the arrangement of the first connection pads 101a and the second connection pads 102a can be arbitrarily formed. When connecting the first connection pad 101a and the second connection pad 102a to the IC 45, it is possible to concentrate as a dedicated IC 45 for each channel including the ultrasonic vibration elements 14 that are simultaneously driven. . By doing so, a huge number of signals are collected and processed in a specific IC 45, so that the number of signals can be reduced, thereby contributing to miniaturization of the ultrasonic probe itself.

  The ultrasonic diagnostic apparatus main body and the IC substrate 40 are electrically connected by a cable (not shown) and a cable connection substrate 50. This cable is provided on the cable connection board 50. The cable connection board 50 is made of flexible FPC, and one end of the cable connection board 50 is electrically connected to one end of the cable by a connector 52.

  With such a configuration, a signal processed by each IC 45 on the IC substrate 40 is transmitted to the ultrasonic diagnostic apparatus body via the cable connection substrate 50.

  As shown in FIG. 4, a relay substrate 60 may be interposed between the ultrasonic transducer 10 and the IC substrate 40. As the connecting means, for example, a first relay pad is disposed on the surface of the relay substrate 60 facing the ultrasonic transducer 10, and the first surface is opposite to the surface of the relay substrate 60, that is, the surface facing the IC substrate 40. A means in which two relay pads are arranged is conceivable. Here, it is assumed that the second relay pad is electrically connected to each of the first relay pads. Furthermore, by changing the arrangement of the second relay pads on the relay board, the arrangement of the first connection pads 101a and the second connection pads 102a in the ultrasonic transducer can be further changed. For this reason, the optimal arrangement of the second relay pads can be determined in accordance with the IC substrate 40 and consequently the IC 45. As the relay board 60, it is desirable to use a flat board made of resin or ceramics.

  As described above, when the relay substrate 60 is interposed between the ultrasonic transducer 10 and the IC substrate 40, the second relay pad is formed on the backing material 18 made of a material such as rubber or resin. Since the connection pad 101a and the second connection pad 102a can be connected more firmly, the ultrasonic transducer 10 and the IC substrate 40 can be securely connected.

  As described above, according to the present embodiment, the first connection lead 101 or the second connection lead 102 can be intensively connected to the specific IC 45, and the back surface is previously set according to the specifications of the electronic circuit to be connected. The lead connected to the electrode and the lead connected to the front electrode can be rearranged in the ultrasonic transducer. For example, an electronic circuit coupled to the first connection lead 101 and the second connection lead 102 Can be formed as a dedicated IC for a plurality of channels, so that electrical connection with an electronic circuit (a circuit group connected to the back electrode or a circuit group connected to the front electrode) installed in the subsequent stage is high. It becomes density. As a result, the electronic circuit itself can be miniaturized, and the two-dimensional array probe can be miniaturized. In addition, a huge number of signals can be appropriately processed.

[Second Embodiment]
FIG. 5 is a view showing a second embodiment of the ultrasonic transducer according to the present invention. Specifically, FIG. 5A is an ultrasonic transducer in the second embodiment of the ultrasonic transducer according to the present invention. FIG. 5B is a diagram showing wiring means of the unit 20a, and FIG. 5B conceptually shows that the ultrasonic transducer 20 according to the second embodiment of the present invention is formed by stacking the ultrasonic transducer units 20a. FIG.

Also in the ultrasonic transducer 20 according to the second embodiment shown in FIG. 5, the ultrasonic transducer unit 20a similar to the ultrasonic transducer unit 10a according to the first embodiment described above is laminated to form a two-dimensional ultrasonic wave. A transducer is formed. In addition,
The acoustic matching layer 11, the front electrode 12, the ultrasonic vibration element 14, the back electrode 16, the backing material 18, the printed circuit board 100, etc. It is the same as the transducer 10 and will not be described.

(Wiring means for the first connection lead 201 and the second connection lead 202)
Similar to the wiring means (FIG. 1B) of the first connection lead 101 and the second connection lead 102 in the first embodiment, the first connection lead 201 is also connected to the front surface in this embodiment. The electrode 12 is extended to each first connection pad 201a via each conductive layer of the printed circuit board 100 by means such as a through hole. Further, as in the first embodiment, the extending means depends on the wiring in the substrate and the circuit arrangement in this embodiment.

  In the first embodiment according to FIG. 3A described above, the first connection is performed such that two first connection pads 101a and two second connection pads 102a are alternately arranged on the cut surface S1. The lead 101 and the second connection lead 102 are wired. On the other hand, in the present embodiment, the first connection leads 201a and the second connection pads 202a are arranged in two regions on the cut surface S2 (for example, FIG. 5b). A feature is that 201 and the second connection lead 202 are wired on and in the printed circuit board 100.

  FIG. 5B shows an example of the ultrasonic transducer 20 according to the present embodiment. However, in the case of the ultrasonic transducer 20 according to the present embodiment, the first transducer connected to the front electrode 12 is shown. Since the connection lead 201 and the second connection lead 202 connected to the back electrode 16 divide the surface into two regions on the cut surface S2 of the ultrasonic transducer, the region connected to the front electrode 12 And a region connected to the back electrode 16 can be clearly separated, so that a predetermined number can be concentrated and connected for each IC 45, and the density of electronic circuits can be further increased. Is possible.

  In addition, the manufacturing process of the ultrasonic transducer 20 according to the present embodiment can be manufactured by the above-described manufacturing process, and the description is omitted.

[Third embodiment]
6 to 9 are diagrams showing a third embodiment of the ultrasonic transducer according to the present invention, and FIG. 6A is an ultrasonic transducer in the third embodiment of the ultrasonic transducer according to the present invention. FIG. 6B is a perspective view showing the configuration of the unit 30a, and FIG. 6B is a diagram showing wiring means of the ultrasonic transducer unit 30a in the third embodiment of the ultrasonic transducer according to the present invention.

  As shown in FIG. 6A, the ultrasonic transducer unit 30a of the present embodiment includes an acoustic matching layer 11, an ultrasonic vibration element (piezoelectric body) 14, a backing material 18 (load material phase), and a first connection lead. 301, a second connection lead 302, and the like. The ultrasonic transducer units 30a are stacked in the same direction to form the ultrasonic transducer 30. That is, a one-dimensional ultrasonic transducer is laminated to form a two-dimensional ultrasonic transducer. Here, the acoustic matching layer 11, the ultrasonic vibration element (piezoelectric body) 14, and the backing material 18 play the same role as a conventional ultrasonic transducer.

(Configuration of the ultrasonic transducer unit 30a)
A plurality of ultrasonic vibration elements (piezoelectric bodies) 14 are arranged on one side of the multilayer printed circuit board 100 on the multilayer printed circuit board 100. Thereby, one row of the two-dimensional ultrasonic transducer is formed. An acoustic matching layer 11 is formed between the plurality of ultrasonic vibration elements (piezoelectric bodies) 14 and, for example, an acoustic lens (not shown) that focuses the ultrasonic waves.

  A front electrode 12 is formed between the acoustic matching layer 11 and each ultrasonic vibration element 14. The front electrode 12 is provided independently for each ultrasonic transducer 14, and is provided in contact with the acoustic matching layer 11 and the ultrasonic vibration element 14. As in the first embodiment, the front electrode 12 receives an electric signal based on the application of electric power for the piezoelectric effect and the ultrasonic wave received from the subject.

  Here, also in the present embodiment, the backing material 18 is formed on the back electrode side as in the first embodiment. A back electrode 16 is formed between the backing material 18 and each ultrasonic transducer 14. The back electrode 16 is provided independently for each ultrasonic vibration element 14 and is provided in contact with the ultrasonic vibration element 14 and the backing material 18. Similarly to the first embodiment, the back electrode 16 receives an electric signal based on application of electric power for the piezoelectric effect and ultrasonic waves received from the subject.

  From the front electrode 12, the first connection lead 301 is drawn out via one or a plurality of conductive layers of the printed circuit board 100 having a multilayer structure. The extracted first connection lead 301 is extended and connected to the first connection pad 301a to be conducted. As in the first embodiment, the first connection lead 301 transmits a control signal for transmitting a high-frequency pulse or a high-pressure impulse in order to transmit an ultrasonic wave to the subject. This is for transmitting the echo signal received from the specimen to an electronic circuit (IC, ASIC, etc.). The first connection lead 301 may be, for example, an in-board wiring of the multilayer printed circuit board 100 or may be arranged as a circuit.

  Similarly, the second connection lead 302 is led out from the back electrode 16 through one or a plurality of conductive layers of the multilayer printed circuit board 100. The drawn out second connection lead 302 is extended and connected to the second connection pad 302a to be conducted. As in the first embodiment, the second connection lead 302 transmits a control signal for transmitting a high-frequency pulse or a high-pressure impulse in order to transmit an ultrasonic wave to the subject. This is for transmitting the echo signal received from the specimen to an electronic circuit (IC, ASIC, etc.). The second connection lead 302 may be, for example, an in-board wiring of the multilayer printed circuit board 100 or may be arranged as a circuit.

With the configuration as described above, the first connection lead 301 and the second connection lead 302 can be formed in different conductive layers in the printed circuit board 100. Therefore, the first connection lead 301 and the second connection lead 302 can be formed. While extending the electrical coupling (crosstalk) between the connecting leads 302, the lead extending path can be freely determined.
Next, an example of the wiring means of the first connection lead 301 and the second connection lead 302 in the ultrasonic transducer 30a according to this embodiment will be described.

(Wiring means for the first connection lead 301 and the second connection lead 302)
Similarly to the means shown in FIG. 1B, in the present embodiment, each of the first connection leads 301 connected to each front electrode 12 is connected to the front electrode 12 by means such as a through hole. Through one or more conductive layers of the printed circuit board 100. Each first connection lead 301 via the conductive layer is extended to each connection pad 301a. As a means for extending this, it is conceivable that the first connection lead 301 is arranged on the conductive layer of the printed board 100 as an in-board wiring or a circuit.

  As an example of the wiring means of the first connection lead 301 and the second connection lead 302 in the present embodiment, for example, as shown in FIG. It is conceivable that the conductive layer is bent and extended in a direction perpendicular to the arrangement direction of the ultrasonic vibration elements 14. According to this wiring means, as shown in FIG. 9B, each of the first connection leads 301 drawn out in large numbers is placed on a specific surface of the ultrasonic transducer 30 in the extended first connection pad 301a. Can be summarized. Similarly, since the second connection leads 302 are also extended from the back electrode 16 to the second connection pads 302a via the respective conductive layers, the second connection leads 302 can be integrated in the extended first connection pads 301a. .

  Therefore, even when the first connection lead 301 and the second connection lead 302 are pulled out independently from each of the ultrasonic vibration elements 14, the second connection lead 302 is extended by another conductive layer. The connection with the electronic circuit is not difficult, and the connection can be easily performed. In addition, a large number of first connection leads 301 or second connection leads 302 can be concentrated and connected to a subsequent electronic circuit in conduction with the front electrode or the back electrode. As a result, an enormous number of signals can be processed efficiently in the vicinity of the ultrasonic vibration element 14. Furthermore, the first connection pad 301a and the second connection pad 302a can be freely arranged. As a result, for example, when connecting to an electronic circuit or the like (for example, IC45) connected to a subsequent stage, for each electrode Can be summarized.

(Example of manufacturing process)
Next, an example of a process for manufacturing the ultrasonic transducer 30 according to the present embodiment based on the printed circuit board 100 will be described with reference to FIGS.
6 to 9 are diagrams illustrating a process of configuring the ultrasonic transducer 30 using the ultrasonic transducer unit 30a illustrated in FIG. FIG. 7B is a diagram showing a “stacking step”. FIG. 8 is a diagram showing a “sealing step” and a “cutting step”. FIG. 9 is a diagram showing an example of the configuration of the ultrasonic transducer 30 manufactured as described above.

  First, a continuity test is performed on the ultrasonic transducer unit 30a. As shown in FIG. 6A, the printed circuit board 100 includes a test pad 103 along the opposite side of the side on which the acoustic matching layer 11 is formed and the side orthogonal to the side on which the acoustic matching layer 11 is formed. A plurality of are formed. As shown in FIG. 6B, the test pad 103 is provided and connected to each of the first connection lead 301 and the second connection lead 302.

With this inspection pad 103, the continuity of the first connection lead 301 and the second connection lead 302, the front electrode 12, the back electrode 16 and the ultrasonic vibration element 14 connected thereto is individually inspected.
As described above, since the inspection pad 103 is provided on the printed circuit board 100 in order to inspect the continuity of the ultrasonic vibration element 14 and the like, the ultrasonic vibration element 14 corresponding to the inspection pad 103 is selected by selecting the specific inspection pad 103. It is possible to easily inspect the operation status of. That is, in the initial stage of assembly of the ultrasonic transducer, the conduction failure can be removed, and as a result, the manufacturing cost of the ultrasonic transducer can be reduced.

  Next, the ultrasonic transducer units 30a that have passed the continuity test are stacked in the front and back direction of the printed circuit board 100 as shown in the lamination step FIG. At this time, the acoustic matching layers 11 on each printed circuit board 100 are stacked so as to gather in the same direction, and the sides of each printed circuit board 100 are stacked so that the sides are not displaced. FIG. 9B conceptually shows that the acoustic matching layer 11, the ultrasonic vibration element 14, and the backing material 18 are laminated by laminating the ultrasonic transducer units 30a. is there. In FIG. 9B, the first connection pad 301a is indicated by “●” and the second connection pad 302a is indicated by “◯”.

  Next, as shown in FIG. 8A, resin sealing is performed with a sealing resin 19 on the stacked ultrasonic transducer units 30a, and the stacked ultrasonic transducer units 30a are assembled. Fix it. In addition, it is good to use the material (for example, epoxy resin etc.) which has the acoustic attenuation effect and plays the role of a backing material as sealing resin in this embodiment.

Thereafter, as shown in FIG. 8 (b), a plurality of laminated and resin-sealed ultrasonic transducer units 30a are arbitrarily set on a cut surface S ₄ , a cut surface S ₅ and a cut surface S ₆ . Cut by machining. As shown in FIG. 9A, the first connection lead 301, the second connection lead 302, and the sealing resin 19 are cut between the backing material 18 and the test pad 103 by this cutting step. Further, the cut portion of the first connection lead 301 exposed by this cutting step is connected to the first connection pad 301a. Similarly, the second connection lead 302 is connected to the second connection pad 302a.

  The first connection pad 301 a is for electrically connecting the front electrode 12 and an electronic circuit or the like through the first connection lead 301. Similarly, the second connection pad 302a also electrically connects the back electrode 16 and an electronic circuit or the like through the second connection lead 302. Here, the electronic circuit is not limited to the electronic circuit itself, and includes, for example, an IC, an ASIC, and other means.

(Connection between the ultrasonic transducer 30 and the ultrasonic diagnostic apparatus main body)
As shown in FIG. 9B, in the ultrasonic transducer 30 according to the third embodiment of the present invention, unlike the ultrasonic transducer 10 according to the first embodiment, a plurality of surfaces of the ultrasonic transducer 30 are provided. A first connection pad 301a and a second connection pad 302a are formed. Therefore, since the area in which the first connection pad 301a and the second connection pad 302a are installed is larger than that in the first embodiment, it is possible to increase the installation pitch.

Further, as described above, since the first connection lead 301 and the second connection lead 302 are wired on or in the substrate through the plurality of conductive layers of the printed circuit board 100, the first connection pads The arrangement of the 301a and the second connection pads 302a is not limited to the arrangement in the form of an array or a matrix, and an arbitrary arrangement is possible.
Therefore, as a connection means between the ultrasonic transducer 30 and the ultrasonic diagnostic apparatus main body, it is possible to use a completely different means from the first embodiment.

  For example, as shown in FIG. 13, the IC 35 (or ASIC, electronic circuit, etc.) is directly installed on the surface of the ultrasonic transducer 30, and the first connection pad 301a and the second connection pad 302a are formed around the IC 35. Is possible. According to such an embodiment, it is possible to connect to an IC or the like in an overcrowded and concentrated manner for each channel including the ultrasonic vibration elements 14 that are simultaneously driven, and to efficiently process a huge number of signals. This also contributes to the miniaturization of the ultrasonic probe itself.

Also in this embodiment, the ultrasonic diagnostic apparatus main body and the IC are electrically connected by a cable, a cable connection board, or the like.
With such a configuration, a signal that is received, transmitted, and processed by the ultrasonic vibration element 14 is transmitted to the ultrasonic diagnostic apparatus main body via the cable connection board 50.

  Further, a relay substrate may be interposed between the IC, ASIC, electronic circuit, or the like formed on the plurality of surfaces of the ultrasonic transducer 30 and the above-described cable. This relay substrate covers the entire surface of the ultrasonic transducer 30 on which an IC or the like is formed. As the connecting means, for example, there is a means in which the first relay pad is disposed on the surface on the side where the relay substrate is in contact with the ultrasonic transducer 30 and the second relay pad is disposed on the opposite surface. Conceivable. Here, it is assumed that the second relay pad is electrically connected to each of the first relay pads. As a result, it is possible to determine the optimal arrangement of the second relay pads for the cable wiring to the ultrasonic diagnostic apparatus main body. As this relay board, it is desirable to use a flat board made of resin, ceramics or the like.

  As described above, according to the present embodiment, the first connection lead 301 or the second connection lead 302 can be intensively connected to a specific IC, ASIC, etc., according to the specifications of the electronic circuit to be connected. The rear electrode lead and the front electrode lead can be rearranged in the transducer in advance. For example, an electronic circuit coupled to the first connection lead 301 and the second connection lead 302 can be used as a dedicated IC for a plurality of channels. Therefore, the electrical connection with an electronic circuit (a circuit group connected to the back electrode or a circuit group connected to the front electrode) installed in the subsequent stage becomes high density. As a result, the electronic circuit itself can be miniaturized, and the two-dimensional array probe can be miniaturized. In addition, a huge number of signals can be appropriately processed.

(Other embodiments)
Next, another embodiment of the ultrasonic transducer according to the present invention will be described below.

  In the first embodiment, the case where the first connection pads 101a and the second connection pads 102a are arranged in two alternating rows as shown in FIG. 3 is shown. However, the present invention is not limited to this embodiment, and any arrangement means may be used as long as it contributes to increasing the density of electronic circuits and the like, simplifying connections, and reducing the size of ultrasonic probes. For example, the first connection pads 101a and the second connection pads 102a are alternately arranged in three or four rows by the wiring means of the first connection leads 101 and the second connection leads 102 in the ultrasonic transducer unit 10a. It is also possible to do.

  In the second embodiment, as shown in FIG. 5, the surface of the ultrasonic transducer 20 is divided into a region where the first connection pad 201 a is formed and a region where the second connection pad 202 a is formed. The case of arranging is shown. However, the present invention is not limited to this embodiment, and any arrangement means may be used as long as it contributes to increasing the density of electronic circuits and the like, simplifying connections, and reducing the size of ultrasonic probes. For example, the region where the first connection pad 201a is formed on the one surface of the ultrasonic transducer 20 by the wiring means of the first connection lead 201 and the second connection lead 202 in the ultrasonic transducer unit 20a and the second connection lead. The regions where the connection pads 202a are formed may be arranged to be four regions or eight regions.

  In the third embodiment, the case where an IC or the like is directly formed on a plurality of surfaces of the ultrasonic transducer 30 is shown, but the present invention is not limited to this embodiment, Any arrangement means may be used as long as it contributes to simplification of connection and miniaturization of the ultrasonic probe. For example, the first connection pad 301a and the second connection pad 302a formed on a plurality of surfaces of the ultrasonic transducer 30 may be connected to the IC substrate with a cable as in the first embodiment. In that case, it is possible to use a slightly wider IC substrate than in the first embodiment.

  In the third embodiment, the first connection pad 301a is formed on a specific surface of the ultrasonic transducer 30, the second connection pad 302a is formed on the other surface, and the first connection pad 301a is formed on one surface. Although the case where the connection pad 301a and the second connection pad 302a are formed so as not to be mixed is shown, the present invention is not limited to this embodiment, and the density of electronic circuits and the like, the simplification of connection, Any form that contributes to miniaturization of the acoustic probe may be used. For example, the first connection pad 301a and the second connection pad 302a may be formed on one surface of the ultrasonic transducer 30 according to the third embodiment as in the first embodiment.

  Next, another method for manufacturing the ultrasonic transducer according to the present invention will be described below.

  In the ultrasonic transducer 70 according to this embodiment, as shown in FIG. 10B, each ultrasonic vibration element 74 and acoustic matching layer 71 are arranged in a two-dimensional array in advance. Each ultrasonic transducer unit 70a is connected to the two-dimensional array of ultrasonic vibration elements 74 group.

  The connecting means will be described in more detail. The ultrasonic vibration element 74 has a front electrode or a ground electrode (not shown) on one surface, and a signal electrode (not shown) on the surface facing the surface. A connection lead (not shown) is drawn from the front electrode or the ground electrode in the direction of the inspection pad 703 in FIG. In addition, an electrode is provided at one end of the ultrasonic transducer unit 70a opposite to the inspection pad 703 side. By connecting this electrode to the signal electrode / connection lead of the ultrasonic vibration element 74, the ultrasonic transducer unit 70a and the ultrasonic vibration element 74 are electrically connected.

  Then, as shown in FIG. 11, the plurality of stacked ultrasonic transducer units 70a are resin-sealed with a sealing resin 19 to fix the plurality of stacked ultrasonic transducer units 70a. In addition, the sealing resin in this embodiment selected the material which has an acoustic attenuation effect and plays the role of a backing material. Therefore, the portion sealed with the sealing resin 19 functions as a backing material.

  Thereafter, as shown in FIG. 12A, a plurality of ultrasonic transducer units 70a laminated and resin-sealed are cut by machining on the arbitrarily set cutting plane S.

  As described above, the manufacturing process of the ultrasonic transducer according to the present invention is not limited to the manufacturing process according to the first to third embodiments, and various methods are conceivable.

  Note that the connection mode between the ultrasonic transducer 70 created in this embodiment and the subsequent electronic circuit (IC45) can be the same as in the first embodiment (see FIG. 5). Description is omitted.

Further, according to the description of the first embodiment, the first connection lead 101 is extended to the first connection pad 101a through the same conductive layer as shown in FIG. 1B. However, the present invention is not limited to this embodiment, and various wiring means can be considered. For example, there is a means for wiring such that each first connection lead 101 extends from the front electrode 12 toward the test pad 103 and is collected on the same conductive layer by means of a through hole or the like on the lower surface of the backing material 18. Conceivable. The same applies to the wiring means of the second connection lead 102.
The same applies to the wiring means of the first connection lead 101 and the second connection lead 102 in the second embodiment and the third embodiment.

  As described above, according to the present invention, the connection leads are independently drawn from the front electrode and the back electrode of each ultrasonic transducer, and the connected electronic circuit is formed as a dedicated IC for a plurality of channels. The electrical connection with the electronic circuit (the circuit group connected to the back electrode and the circuit group connected to the front electrode) is high density, and the electronic circuit itself can be miniaturized. It is possible to provide an ultrasonic transducer that can reduce the size of a three-dimensional array probe.

  Each above-mentioned embodiment is an example of the present invention, and the present invention is not limited to each embodiment. In addition, various modifications can be made according to the design and the like as long as they do not depart from the technical idea of the present invention.

(A) The perspective view which shows the structure of the ultrasonic transducer unit 10a in 1st Embodiment of the ultrasonic transducer which concerns on this invention. (B) Sectional drawing in the said perspective view AA part of the ultrasonic transducer unit 10a which concerns on 1st Embodiment. (C) The figure which shows the lamination process of the ultrasonic transducer unit 10a in 1st Embodiment of an ultrasonic transducer. (A) The perspective view which shows the process of resin-sealing the several ultrasonic transducer unit 10a laminated | stacked in order to comprise the ultrasonic transducer 10, in 1st Embodiment of the ultrasonic transducer which concerns on this invention. (B) In the first embodiment of the ultrasonic transducer according to the present invention, a perspective view showing a step of cutting the ultrasonic transducer 10 configured by resin-sealing a plurality of stacked ultrasonic transducer units 10a. Figure. (A) The figure which shows the wiring means of the ultrasonic transducer unit 10a in 1st Embodiment of the ultrasonic transducer which concerns on this invention (b) The ultrasonic transducer 10 in 1st Embodiment of the ultrasonic transducer which concerns on this invention Perspective view. The figure for demonstrating the mechanism which connects the ultrasonic transducer 10 and IC board 40 in 1st Embodiment of the ultrasonic transducer which concerns on this invention. (A) The figure which shows the wiring means of the ultrasonic transducer unit 20a in 2nd Embodiment of the ultrasonic transducer which concerns on this invention (b) The ultrasonic transducer 20 in 2nd Embodiment of the ultrasonic transducer which concerns on this invention Perspective view. (A) The perspective view which shows the structure of the ultrasonic transducer unit 30a in 3rd Embodiment of the ultrasonic transducer which concerns on this invention. (B) The figure which shows the wiring means of the ultrasonic transducer unit 30a in 3rd Embodiment of the ultrasonic transducer which concerns on this invention. (A) The perspective view which shows the structure of the ultrasonic transducer unit 30a in 3rd Embodiment of the ultrasonic transducer which concerns on this invention. (B) The figure which shows the lamination process of the ultrasonic transducer unit 30a in 3rd Embodiment of an ultrasonic transducer. (A) The perspective view which shows the process of resin-sealing the several ultrasonic transducer unit 30a laminated | stacked in order to comprise the ultrasonic transducer 30, in 3rd Embodiment of the ultrasonic transducer | vibrator which concerns on this invention. (B) In the third embodiment of the ultrasonic transducer according to the present invention, a perspective view showing a step of cutting the ultrasonic transducer 30 configured by resin sealing a plurality of stacked ultrasonic transducer units 30a. Figure. (A) Top view showing the wiring means of the ultrasonic transducer unit 30a and the cut surface in the cutting step in the third embodiment of the ultrasonic transducer according to the present invention (b) Third embodiment of the ultrasonic transducer according to the present invention The perspective view of the ultrasonic transducer 30 in a form. (A) The perspective view which shows the process of laminating | stacking the several ultrasonic transducer unit 70a in order to comprise an ultrasonic transducer as a manufacturing process of other embodiment of the ultrasonic transducer which concerns on this invention. (B) As a manufacturing process of another embodiment of the ultrasonic transducer according to the present invention, a plurality of ultrasonic transducer units 70a are connected to two-dimensionally arranged ultrasonic vibration elements in order to configure the ultrasonic transducer. The perspective view which shows a process. The perspective view which shows the process of resin-sealing the several ultrasonic transducer unit 70a laminated | stacked in other embodiment of the ultrasonic transducer which concerns on this invention, in order to comprise an ultrasonic transducer. The perspective view which shows the process of cut | disconnecting the ultrasonic transducer comprised by resin-sealing the several ultrasonic transducer unit 70a laminated | stacked in other embodiment of the ultrasonic transducer which concerns on this invention. The perspective view of the ultrasonic transducer 30 in the modification of 3rd Embodiment of the ultrasonic transducer which concerns on this invention. (A) The perspective view which shows the conventional structure of an ultrasonic probe. (B) BB sectional drawing seen from the arrow direction in Fig.14 (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Ultrasonic transducer 10a Ultrasonic transducer unit 11 Acoustic matching layer 12 Front electrode 14 Ultrasonic vibration element 16 Back electrode 18 Backing material 19 Sealing resin 40 IC substrate 45 IC
DESCRIPTION OF SYMBOLS 50 Cable connection board 52 Connector 60 Relay board 92 Ground electrode 96 Signal electrode 100 Printed circuit board 101 1st connection lead 101a 1st connection pad 102 2nd connection lead 102a 2nd connection pad 103 Inspection pad S Cut surface

Claims (9)

A multilayer circuit board having two conductive layers , one of which is sandwiched between insulating layers ;
A plurality of ultrasonic vibration elements arranged along one side of one surface of the multilayer circuit board;
A front electrode and a back electrode provided on a surface in a direction perpendicular to the arrangement direction for each ultrasonic vibration element;
Connection leads formed in different conductive layers of the multilayer circuit board and led out independently from each of the front electrodes and the back electrodes in a predetermined direction,
With
2. The ultrasonic transducer according to claim 1, wherein a plurality of the multilayer circuit boards are stacked so as to match the one side. The said connection lead is extended to the surface on the opposite side to the front surface in which the said ultrasonic transducer | vibration element was arranged among the surfaces of the said ultrasonic transducer, and the surface orthogonal to this front surface. Ultrasonic transducer. The ultrasonic transducer according to claim 1, wherein a connection pad is formed at a tip portion of the connection lead. The ultrasonic wave according to claim 1, wherein the connection lead is divided into a first connection lead connected to each back electrode and a second connection lead connected to each front electrode. Transducer. The connection pad is divided into a first connection pad that is conducted from the back electrode by the first connection lead and a second connection pad that is conducted from the front electrode by the second connection lead. The ultrasonic transducer according to claim 4. The first connection lead and the second connection lead are separately extended in the first connection pad direction and the second connection pad direction through different layers of the multilayer circuit board. The ultrasonic transducer according to claim 5.   The first connection pads and the second connection pads are alternately arranged in a predetermined number in the stacking direction of the printed circuit board or in the direction in which the ultrasonic vibration elements are arranged. The ultrasonic transducer according to claim 5 or 6, wherein wiring of said connection lead and said second connection lead is provided. Forming each of the first connection pads together;
The ultrasonic transducer according to claim 5 or 6, wherein each of the second connection pads is formed as a group. On the surface opposite to the front surface, only one of the first connection pad group or the second connection pad group is formed,
The ultrasonic transducer according to claim 5 or 6, wherein only the other of the second connection pad group or the first connection pad group is formed on a surface orthogonal to the front surface.

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