JP4363290B2 - Ultrasonic probe and ultrasonic diagnostic apparatus using the same - Google Patents

Description

  The present invention relates to an ultrasonic probe used in medical fields such as diagnosis and treatment, and industrial fields such as nondestructive inspection, and more particularly to an ultrasonic probe in which piezoelectric vibrators are two-dimensionally arranged.

  In recent years, using an ultrasonic probe in which piezoelectric transducers are two-dimensionally arranged, the image quality of an ultrasonic image can be improved using a technique such as dynamic focusing in the slice direction in addition to the scanning direction, or electronically. An apparatus that scans an ultrasonic beam three-dimensionally under control to create a three-dimensional ultrasonic image has been developed.

As a means to realize a conventional ultrasonic probe with two-dimensionally arranged piezoelectric transducers, it is mainly proposed how to draw out signal lead wires from each signal electrode of the two-dimensionally arranged piezoelectric transducers. Has been. In particular, as a configuration aimed at reducing electrical crosstalk between the signal lead wires, as shown in FIG. 7, the layer 3 in which the signal lead wires 1 and the ground wires 2 are alternately arranged on the same surface is laminated, As shown in FIG. 8, the layer 3 having the signal lead wire 1 disposed on one side and the layer 3 having the ground electrode surface 4 disposed on one side are alternately laminated (for example, Patent Document 1), or the signal lead is disposed on one side. There has been proposed a configuration (for example, Patent Document 2 and Patent Document 3) in which a printed circuit board having a wire disposed and a back surface of which is a ground electrode surface is sandwiched between back load materials.
JP-A-7-79498 (page 4, FIGS. 6 and 7) Japanese Patent Laid-Open No. 2001-309493 (page 6, FIG. 7) JP 2001-309497 A (page 4-6, FIG. 8)

  However, in the case of the above-described conventional ultrasonic probe, for example, in the configuration shown in FIG. 7, it is necessary to arrange the ground wire 2 between the signal lead wires 1 whose interval is approximately equal to the arrangement pitch of the piezoelectric vibrators. For this reason, when the frequency of ultrasonic waves to be handled is increased and the arrangement pitch of the piezoelectric vibrators is narrowed, it becomes difficult to form the ground wire 2 and the line width of the ground wire 2 cannot be sufficiently secured. There is a high possibility that it will not be able to fully demonstrate. In the case of the configuration shown in FIG. 8, the crosstalk between the signal lead wires 1 on the different layers 3 is reduced, but the interval is set on one layer 3 or the same surface of the printed board. There is a problem that crosstalk between adjacent signal lead wires 1 of signal lead wires 1 arranged approximately equal to the arrangement pitch of piezoelectric vibrators cannot be reduced. A configuration using a substrate has the same problem.

  The present invention has been made to solve the conventional problem, and even when the ultrasonic frequency is increased and the arrangement pitch of the piezoelectric vibrators is reduced, the crosstalk between adjacent signal lead wires is reduced. An object of the present invention is to provide an ultrasonic probe capable of reducing the above.

  The ultrasonic probe of the present invention includes a plurality of piezoelectric vibrators for transmitting and receiving ultrasonic waves, a back load material provided on the back side of the piezoelectric vibrator, a substrate provided inside the back load material, A signal lead wire provided on the substrate surface and electrically connected to an electrode on the back surface side of the piezoelectric vibrator is provided, a shield material in the substrate is disposed inside the substrate, and the signal lead wire has an arrangement thereof It is the structure which has the arrangement | sequence arrange | positioned by turns on the front and back of the said board | substrate.

  With this configuration, the shield material in the board is interposed between adjacent signal leads that are the closest to each other on the same board and are easily affected by each other's leakage electromagnetic field, thereby suppressing the occurrence of crosstalk due to the shielding effect. Can do.

  The ultrasonic probe of the present invention includes a plurality of piezoelectric vibrators for transmitting and receiving ultrasonic waves, a back load material provided on the back side of the piezoelectric vibrator, and a plurality provided inside the back load material. A signal lead wire provided on the substrate surface and electrically connected to the electrode on the back surface of the piezoelectric vibrator. And an in-board shielding material is disposed inside the substrate, and the signal lead wire has an arrangement in which the arrangement is alternately arranged on the front and back surfaces of the substrate.

  With this configuration, the shield material in the substrate is interposed between adjacent signal leads that are the closest to each other on the same substrate and easily affected by the leakage electromagnetic field, and the shield material is also interposed between different substrates. Thus, the occurrence of crosstalk can be suppressed by the shielding effect.

  Furthermore, the ultrasonic probe of the present invention has a configuration in which the plurality of piezoelectric vibrators are formed by dividing the piezoelectric vibrator, and the shield material is disposed at a position where the piezoelectric vibrator is divided. ing.

  With this configuration, when a plurality of piezoelectric vibrators are formed by dividing the piezoelectric vibrator, the division position is divided according to the position of the shield material, thereby forming an accurate-shaped piezoelectric vibrator array. Can do.

  Furthermore, the ultrasonic probe of the present invention has a configuration in which the width of the dividing groove formed by dividing the piezoelectric vibrator is larger than the thickness of the shield material.

  With this configuration, it is possible to prevent the electrode on the lower surface of the piezoelectric vibrator and the shield material from being electrically connected.

  An ultrasonic diagnostic apparatus according to the present invention includes the ultrasonic probe according to the present invention and an ultrasonic diagnostic apparatus main body connected to the ultrasonic probe.

  With this configuration, it is possible to perform highly accurate ultrasonic diagnosis by taking advantage of the ultrasonic probe of the present invention.

  An ultrasonic flaw detector according to the present invention includes the ultrasonic probe according to the present invention and an ultrasonic flaw detector main body connected to the ultrasonic probe.

  With this configuration, it is possible to perform highly accurate nondestructive inspection by taking advantage of the ultrasonic probe of the present invention.

  The present invention provides a plurality of piezoelectric vibrators for transmitting and receiving ultrasonic waves, a back load material provided on the back side of the piezoelectric vibrator, a substrate provided inside the back load material, and provided on the substrate surface. A signal lead wire electrically connected to an electrode on the back side of the piezoelectric vibrator, a shield material in the substrate is disposed inside the substrate, and the signal lead wire is arranged on the front and back surfaces of the substrate. By having the array arranged alternately, the shield material in the substrate is interposed between adjacent signal leads that are the closest to each other on the same substrate and are easily affected by each other's leakage electromagnetic field. It is possible to provide an ultrasonic probe having an effect that generation of crosstalk can be suppressed.

  Moreover, since the ultrasonic diagnostic apparatus of the present invention uses the ultrasonic probe as described above, it is possible to make a more accurate diagnosis.

  Furthermore, since the ultrasonic flaw detector according to the present invention uses the ultrasonic probe as described above, it is possible to perform a more accurate nondestructive inspection.

  Hereinafter, an ultrasonic probe according to an embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is an exploded perspective view of a part of the ultrasonic probe according to the present embodiment.

  In FIG. 1, an ultrasonic probe 5 includes a piezoelectric vibrator 6 made of, for example, piezoelectric ceramic for converting an electrical input to generate an ultrasonic wave or receiving a received ultrasonic signal as an electric signal. It has a configuration arranged in a two-dimensional matrix. The piezoelectric vibrator 6 is arranged on a back load material 7 made of an acoustic attenuation medium such as ferrite rubber, for example, and absorbs and attenuates ultrasonic waves transmitted to the back load material 7 side. The piezoelectric vibrator 6 has electrodes (not shown) on the upper and lower surfaces, the upper electrode is commonly connected to a common electrode 8 made of, for example, copper foil, and the lower electrode is embedded in the back load material 7, for example, a print It is connected to a signal lead wire 1 on a substrate 9 made of a substrate or a flexible printed circuit board. An in-substrate shield material 10 made of, for example, copper foil is disposed inside the substrate 9. As the configuration of the ultrasonic probe 5, an acoustic matching layer for efficiently transmitting and receiving ultrasonic waves and an acoustic lens for converging ultrasonic waves are attached to the upper surface of the piezoelectric vibrator 1, that is, the acoustic radiation surface side. In some cases.

  FIG. 2 shows a top view and two cross-sectional views of the back load material constituting the ultrasonic probe of the present embodiment. The substrate 9 is arranged according to the arrangement interval of the piezoelectric vibrators 6. The signal lead wires 1 on the substrate 9 are alternately arranged on both surfaces of the substrate 9 in accordance with the arrangement interval of the piezoelectric vibrators 6. Therefore, as shown in the BB cross-sectional view, the arrangement interval of the signal lead wires 1 on one side of the substrate 9 is twice the arrangement interval of the piezoelectric vibrators 6. Further, as shown in the AA cross-sectional view, an in-substrate shield material 10 is disposed in the substrate 9 at a position where the signal lead wire 1 on both surfaces of the substrate 9 is not electrically connected. In order to prevent electrical connection with the lower surface electrode, the distance is set such that the in-substrate shield material 10 does not appear on the surface of the rear load material 7.

  Next, a method for creating the ultrasonic probe 5 will be described. First, a substrate 9 is prepared. For example, the substrate 9 is formed by using a flexible printed circuit board or a printed circuit board in which three layers of conductor-base-conductor-base-conductor and conductor are formed. Thus, a substrate 9 is obtained. At this time, since the conductor (second layer) inside the laminated substrate becomes the in-substrate shield material 10, the electrode of the piezoelectric vibrator 6 is provided on the end face side connecting the electrode of the piezoelectric vibrator 6 and the signal lead wire 1. It is necessary to form in advance at a position where it is not exposed to the end face so as not to be electrically connected to the end face. As another substrate forming method, for example, two double-sided flexible printed boards or two double-sided printed boards are used, and the pattern of the signal lead wire 1 is formed on one side, and the other side is used as the board shield 10 side. A method in which the surfaces are superposed on each other, or a single-sided flexible printed circuit board or two single-sided printed circuit boards on which the pattern of the signal lead wire 1 is formed, with an in-board shielding material 10 such as a copper foil sandwiched between them. There are ways to do it. The number of the signal lead wires 1 formed on the substrate 9 and the number of the substrates 9 are matched to the number of two-dimensional arrays of the piezoelectric vibrators 6 of the ultrasonic probe 5 to be created.

  Next, the created substrate 9 and the back load material 7 are alternately stacked and bonded using, for example, an epoxy adhesive to form a block of the back load material 7. At this time, the thickness of the back load material 7 to be superimposed is adjusted in advance so that the distance between the substrates 9 is approximately equal to the arrangement distance between the piezoelectric vibrators 6. The surface on which the prepared piezoelectric vibrators 6 of the back load material 7 block are arranged is shaped by cutting, polishing or the like as necessary. At this time, it is preferable that the surface of the back load member 7 and the end face of the signal lead wire 1 are formed on substantially the same plane and shaped so that the in-board shield member 10 is not exposed on the surface. As another method for forming the back load material 7 block, it is also possible to form the back load material 7 by filling and curing the back load material 7 between the substrates 9 arranged in the arrangement interval of the piezoelectric vibrators 6. As another forming method, if the material of the back load material 7 is the same as or similar to the material of the substrate 9, it is possible to create the back load material 7 block as one laminated printed board. is there.

  Subsequently, the piezoelectric vibrator 6 is bonded and fixed to the surface of the back load material 7 using, for example, an epoxy adhesive, and the electrical connection between the electrode on the lower surface of the piezoelectric vibrator 6 and the signal lead wire 1 is simultaneously performed. Next, using a dividing device such as a dicing saw, a groove having a depth reaching from the upper side of the piezoelectric vibrator 6 to a part of the back load material 7 is formed at an interval of the two-dimensional arrangement of the piezoelectric vibrator 6 to be formed. In addition, a two-dimensional array of piezoelectric vibrators 6 is formed by dividing the piezoelectric vibrators 6 by providing them in a lattice shape.

  Next, a common electrode 8 made of, for example, copper foil is bonded to the electrode on the upper surface of the piezoelectric vibrator 6 by using, for example, an epoxy-based adhesive, and electrical connection of all the upper electrodes of the divided piezoelectric vibrator 6 is performed. This is performed to form the ultrasonic probe 5.

  The ultrasonic probe 5 is used by being connected to an apparatus main body such as an ultrasonic diagnostic apparatus or an ultrasonic flaw detection apparatus (not shown), so that electrical connection with the signal lead wire 1 and the common electrode 8 is ensured. In general, an electrical connection member such as a connector, a relay substrate, and a coaxial cable, and a member such as a housing for storing the configuration shown in FIG. 1 are added to be used as the ultrasonic probe 5. is there.

  Next, the operation and action of this ultrasonic probe will be described. A drive signal output from an apparatus main body such as an ultrasonic diagnostic apparatus or an ultrasonic flaw detection apparatus (not shown) is supplied to the piezoelectric vibrators 6 arranged two-dimensionally via the signal lead wire 1 and the common electrode 8 on the substrate 9. Thus, an ultrasonic wave is generated from the piezoelectric vibrator 6. The generated ultrasonic wave is incident on an observation object such as a human body and the reflected ultrasonic wave is received by the piezoelectric vibrator 6 in the same manner. The received ultrasonic wave is converted into an electrical signal by the piezoelectric vibrator 6 and input to the apparatus main body via the signal lead wire 1 and the common electrode 8, and useful observation information such as an ultrasonic tomographic image in the apparatus main body. Is processed as

  At this time, by controlling the timing of driving each piezoelectric vibrator 6 and the number of piezoelectric vibrators 6 that are simultaneously driven, the ultrasonic beam is controlled in the three-dimensional space, for example, a three-dimensional ultrasonic image can be obtained. Data for construction can be acquired. Since the drive signal is a high voltage of about several tens of volts to several hundred tens of volts, an electromagnetic field that leaks when propagating through the signal lead 1 acts on the adjacent signal lead 1 to the adjacent piezoelectric vibrator 6. There is a possibility that crosstalk for supplying an unintended drive signal occurs. Due to the occurrence of crosstalk, ultrasonic waves are transmitted from the unintended piezoelectric vibrator 6 at an unintended timing, so that the ultrasonic beam control is disturbed, and for example, there is a risk of degrading the image quality of a three-dimensional ultrasonic image.

  On the other hand, in the ultrasonic probe 5 of the present embodiment, the signal lead wires 1 are alternately arranged on both surfaces of the substrate 9 in which the in-substrate shield material 10 is arranged, so that the same substrate 9 is used. An in-board shield material 10 is interposed between adjacent signal lead wires 1 that are closest to each other and are easily affected by the leakage electromagnetic field of each other. Beam control becomes possible.

(Second Embodiment)
Next, FIG. 3 is an exploded perspective view of a part of the ultrasonic probe according to the second embodiment of the present invention. Furthermore, FIG. 4 shows a top view and a cross-sectional view of one place of the back load member of the ultrasonic probe according to the second embodiment of the present invention. In addition, what attached | subjected the same code | symbol as FIG.1 and FIG.2 in drawing is the same thing, The detailed description is abbreviate | omitted.

  3 and 4, a difference from FIGS. 1 and 2 is that a shield material 11 made of, for example, copper foil is disposed between the substrate 9 and the substrate 9. In FIG. 3 and FIG. 4, the shield material 11 is disposed not only between the substrates 9 and 9 but also on the outer side of the substrate 9 disposed on the outermost side in the back load material 7.

  A method of creating this ultrasonic probe will be described. The method for creating the substrate 9 is the same as that in the first embodiment, and a description thereof will be omitted. The created substrate 9, the back load material 7, and the shield material 11 are overlapped and bonded with, for example, an epoxy adhesive to form the back load material 7 block. If necessary, after the back load material 7 block surface on which the piezoelectric vibrator 6 is disposed is shaped by cutting, polishing, or the like, the piezoelectric vibrator 6 is bonded and fixed with, for example, an epoxy adhesive, and the lower surface of the piezoelectric vibrator The electrode and the signal lead wire 1 are also electrically connected at the same time. Next, using a dividing device such as a dicing saw, a groove having a depth reaching from the upper side of the piezoelectric vibrator 6 to a part of the back load material 7 is formed. A two-dimensional array of the piezoelectric vibrators 6 is formed by dividing the piezoelectric vibrators 6 by providing them in a lattice shape.

  At this time, the back load material 7 block is prepared by arranging the shield material 11 in advance at an interval equal to the arrangement interval of the piezoelectric vibrators 6 in accordance with the formation positions of the grooves 12 dividing the piezoelectric vibrator 6. For example, in the case of a dicing saw, the groove 12 is formed by adjusting the position of the dicing blade to the position of the shield material 11 by shaping the surface so that the end of the shield material 11 is exposed on the surface on which the vibrator 6 is disposed. By performing the above, it is possible to form an accurate-shaped piezoelectric vibrator 6 array. At this time, in order to prevent the electrode on the lower surface of the piezoelectric vibrator 6 and the shield material 11 from being electrically connected, the groove 12 is processed so that the width of the groove 12 to be formed is always wider than the thickness of the shield material 11. Better to do.

  Next, the common electrode 8 made of, for example, copper foil is bonded to the upper surface electrode of the piezoelectric vibrator 6 using, for example, an epoxy adhesive, and all the upper surface electrodes of the divided piezoelectric vibrator 6 are electrically connected. Form an ultrasound probe.

  Next, the operation and action of the ultrasonic probe 5 will be described. A drive signal output from an apparatus main body such as an ultrasonic diagnostic apparatus or an ultrasonic flaw detection apparatus (not shown) is supplied to the piezoelectric vibrators 6 arranged two-dimensionally via the signal lead wire 1 and the common electrode 8 on the substrate 9. Thus, an ultrasonic wave is generated from the piezoelectric vibrator 6. The generated ultrasonic wave is incident on an observation object such as a human body and the reflected ultrasonic wave is received by the piezoelectric vibrator 6 in the same manner. The received ultrasonic wave is converted into an electrical signal by the piezoelectric vibrator 6 and input to an apparatus main body (not shown) via the signal lead wire 1 and the common electrode 8, and the apparatus main body is useful, for example, as an ultrasonic tomographic image. Processed as observation information.

  At this time, by controlling the timing of driving each piezoelectric vibrator 6 and the number of piezoelectric vibrators 6 that are simultaneously driven, the ultrasonic beam is controlled in the three-dimensional space, for example, a three-dimensional ultrasonic image can be obtained. Data for construction can be acquired. Since the drive signal is a high voltage of about several tens of volts to several hundred tens of volts, an electromagnetic field that leaks when propagating through the signal lead 1 acts on the adjacent signal lead 1 to the adjacent piezoelectric vibrator 6. There is a possibility that crosstalk for supplying an unintended drive signal occurs. Due to the occurrence of crosstalk, ultrasonic waves are transmitted from the unintended piezoelectric vibrator 6 at an unintended timing, so that the ultrasonic beam control is disturbed, and for example, there is a risk of degrading the image quality of a three-dimensional ultrasonic image.

  On the other hand, in the ultrasonic probe 5 of the second embodiment of the present invention, the signal lead wires 1 are alternately arranged on both surfaces of the substrate 9 in which the in-substrate shield material 10 is arranged, An in-substrate shield material 11 is interposed between adjacent signal lead wires 1 that are closest to each other on the same substrate 9 and are easily affected by the leakage electromagnetic fields of each other. Further, by arranging the shield material 11 between the substrates 9 and 9, a configuration in which the shield material 11 is interposed between the signal lead wires 1 arranged on different substrates 9 is realized. Generation of crosstalk between the signal lead wires 1 can be suppressed, and desired ultrasonic beam control can be performed. Furthermore, in the ultrasonic probe 5 of the present embodiment, the shield material 11 is arranged on the outer side of the substrate 9 arranged on the outermost side in the back load material 7 in addition to the space between the substrates 9 and 9. Thus, the noise signal can be prevented from jumping from the outside, and at the same time, the adverse effect of the leakage electromagnetic field generated from the signal lead wire 1 on the outside can be reduced.

(Third embodiment)
Next, a schematic diagram showing an example of the ultrasonic diagnostic apparatus of the present invention is shown in FIG. Components identical to those in FIG.

  The ultrasonic diagnostic apparatus 13 includes an ultrasonic diagnostic apparatus main body 14 and an ultrasonic probe 5 electrically connected thereto. The operation will be described. First, the operator touches the ultrasonic transmission / reception surface of the ultrasonic probe 5 against the body surface of the subject 15. In this state, an electrical signal (drive signal) is transmitted from the ultrasound diagnostic apparatus main body 14 to the ultrasound probe 5. The drive signal is converted into ultrasonic waves by the piezoelectric vibrator in the ultrasonic probe 5 and transmitted to the subject 15. This ultrasonic wave is reflected in the body of the subject 15, and a part of the reflected wave is received by the piezoelectric vibrator in the ultrasonic probe 5 and converted into an electric signal (received signal) for ultrasonic diagnosis. Input to the apparatus main body 14. The input reception signal is subjected to signal processing by the ultrasonic diagnostic apparatus main body 19 and output to a display device such as a CRT, for example, as a tomographic image.

  In the ultrasonic diagnostic apparatus 13, the ultrasonic probe 5 of the present invention as described in the first to second embodiments is used as the ultrasonic probe 5. According to such an ultrasonic diagnostic apparatus 13, it is possible to perform an ultrasonic diagnosis with high accuracy by making use of the advantages of the ultrasonic probe 5 described in the above embodiments.

(Fourth embodiment)
Next, a schematic view showing an example of the ultrasonic flaw detector of the present invention is shown in FIG. Components identical to those in FIG.

  The ultrasonic flaw detector 16 includes an ultrasonic flaw detector main body 17 and an ultrasonic probe 5 electrically connected thereto. The operation will be described. First, the operator touches the ultrasonic transmission / reception surface of the ultrasonic probe 1 against the surface of the test object 18. In this state, an electrical signal (drive signal) is transmitted from the ultrasonic flaw detector main body 17 to the ultrasonic probe 5. The drive signal is converted into ultrasonic waves by the piezoelectric vibrator in the ultrasonic probe 5 and transmitted to the test object 18. This ultrasonic wave is reflected by scratches and defects inside the test object 18, and a part of the reflected wave is received by the piezoelectric vibrator in the ultrasonic probe 5 and converted into an electric signal (received signal). And input to the ultrasonic flaw detector main body 17. The input received signal is processed by the ultrasonic flaw detector main body 17 and displayed on a CRT or the like as a tomographic image, for example.

  In the ultrasonic flaw detector 16, the ultrasonic probe 5 of the present invention as described in the first and second embodiments is used as the ultrasonic probe 5. According to such an ultrasonic flaw detector 16, it is possible to perform highly accurate nondestructive inspection by taking advantage of the ultrasonic probe 5 shown in the above embodiments.

  As described above, the ultrasonic probe according to the present invention includes a plurality of piezoelectric vibrators for transmitting and receiving ultrasonic waves, a back load material provided on the back side of the piezoelectric vibrator, and the back load material inside. A signal lead wire provided on the substrate surface and electrically connected to an electrode on the back side of the piezoelectric vibrator, and an in-substrate shield material is disposed inside the substrate, and the signal Since the lead wires have an arrangement in which the arrangement is alternately arranged on the front and back surfaces of the substrate, the distance between the adjacent signal lead wires which are closest to each other on the same substrate and are easily affected by the leakage electromagnetic field is within the substrate. Since the shielding material is interposed and the occurrence of crosstalk can be suppressed by the shielding effect, the ultrasonic diagnostic apparatus using this ultrasonic probe has the effect of enabling an accurate ultrasonic diagnosis. , Diagnosis, Care is useful in medical fields such as, also ultrasonic testing apparatus using the ultrasonic probe is useful in industrial fields of non-destructive inspection.

The perspective view which decomposed | disassembled some ultrasonic probes in the 1st Embodiment of this invention The top view of the back surface load material which comprises the ultrasonic probe in the 1st Embodiment of this invention, and sectional drawing of two places The perspective view which decomposed | disassembled some ultrasonic probes in the 2nd Embodiment of this invention The top view and sectional drawing of one place of the back surface load material of the ultrasonic probe of the 2nd Embodiment of this invention Schematic which shows an example of the ultrasonic diagnosing device in the 3rd Embodiment of this invention. Schematic which shows an example of the ultrasonic flaw detector in the 4th Embodiment of this invention Schematic showing signal lead-out configuration of a conventional ultrasonic probe Schematic showing another signal lead-out configuration of a conventional ultrasonic probe

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Signal lead wire 2 Ground wire 3 Layer 4 Ground electrode surface 5 Ultrasonic probe 6 Piezoelectric vibrator 7 Back load material 8 Common electrode 9 Substrate 10 In-substrate shield material 11 Shield material 12 Groove 13 Ultrasonic diagnostic apparatus 14 Ultrasonic wave Diagnostic device main body 15 Subject 16 Ultrasonic flaw detector 17 Ultrasonic flaw detector main body 18 Test object

Claims (6)

A plurality of piezoelectric vibrators for transmitting and receiving ultrasonic waves, a back load material provided on the back side of the piezoelectric vibrator, a substrate provided inside the back load material, and the piezoelectric vibration provided on the substrate surface A signal lead wire electrically connected to the electrode on the back side of the child is provided, a shield material in the substrate is arranged inside the substrate, and the signal lead wires are alternately arranged on the front and back surfaces of the substrate An ultrasonic probe having an arranged arrangement. A plurality of piezoelectric vibrators for transmitting and receiving ultrasonic waves, a back load material provided on the back side of the piezoelectric vibrator, a plurality of substrates provided in the back load material, and provided in the back load material A shield material disposed between the substrates, and a signal lead wire provided on the substrate surface and electrically connected to an electrode on the back side of the piezoelectric vibrator, and an in-substrate shield material is provided inside the substrate. The ultrasonic probe according to claim 1, wherein the signal leads have an arrangement in which the arrangement of the signal leads is alternately arranged on the front and back surfaces of the substrate. The ultrasonic probe according to claim 2, wherein the plurality of piezoelectric vibrators are formed by dividing a piezoelectric vibrator, and the shield material is disposed at a position where the piezoelectric vibrator is divided. . The ultrasonic probe according to claim 3, wherein a width of a division groove formed by dividing the piezoelectric vibrator is larger than a thickness of the shield material. An ultrasonic diagnostic apparatus comprising: the ultrasonic probe according to any one of claims 1 to 4; and an ultrasonic diagnostic apparatus main body electrically connected to the ultrasonic probe. An ultrasonic diagnostic apparatus comprising: the ultrasonic probe according to any one of claims 1 to 4; and an ultrasonic flaw detector main body electrically connected to the ultrasonic probe.

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