JP5491717B2 - Ultrasonic transducer, ultrasonic probe, and method of manufacturing ultrasonic transducer - Google Patents

Description

  The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus, and more particularly to a technique of an ultrasonic transducer incorporated in the ultrasonic probe.

  In order to acquire information on a desired diagnostic region of a subject using an ultrasonic probe, an ultrasonic diagnostic apparatus transmits (transmits) ultrasonic waves to the region, and reflects waves from tissue boundaries in the subject having different acoustic impedances. Receive. In this way, diagnosis is performed by scanning ultrasonic waves with an ultrasonic probe, obtaining information on the body tissue of the subject, and imaging it. This ultrasonic probe has an ultrasonic transducer in order to transmit an ultrasonic wave to a subject or the like and receive a reflected wave.

  In recent years, a method of rotating and swinging a one-dimensional array of ultrasonic transducers in an ultrasonic probe, or an electronic scanning type ultrasonic using a two-dimensional array of ultrasonic transducers in which piezoelectric elements are arranged in a matrix form. Studies are underway on systems that collect and display ultrasound images in three dimensions using probes. A three-dimensional ultrasonic image is useful for diagnosing a part that is easily overlooked in a two-dimensional image, and a tomographic image suitable for diagnosis and measurement can be obtained, so that improvement in diagnostic accuracy can be expected.

  However, in the method using an electronic scanning type two-dimensional array ultrasonic transducer, the number of piezoelectric elements is increased (for example, 10 to 100 times) by arranging the piezoelectric elements in two dimensions. It will be accompanied. The piezoelectric element and the ultrasonic diagnostic apparatus main body are connected via a relay substrate that performs processing of electrical signals, transmission / reception of electrical signals to / from the piezoelectric elements, and the increase in the number of piezoelectric elements The number of electrode leads for electrical connection between the relay substrate and the piezoelectric element is greatly increased.

  This significant increase in the number of electrode leads leads to a complicated connection structure between the piezoelectric element (piezoelectric body) in the ultrasonic probe and the transmission / reception circuit and the ultrasonic diagnostic apparatus main body in the relay substrate. If the connection structure is complicated, it may be difficult to realize a two-dimensional array of ultrasonic transducers. Therefore, the connection between the piezoelectric elements arranged on the two-dimensional array and the subsequent circuit, for example, the connection structure between the electrode lead and the relay substrate and the connection structure between the piezoelectric element and the electrode lead are not complicated. A configuration that enables realization of an ultrasonic transducer in the array is required.

  As an example of the connection structure of each piezoelectric element and electrode lead to solve this problem, for example, a structure is adopted in which electrodes corresponding to the piezoelectric element array are stacked to draw out the electrode lead, and a fine piezoelectric element array is formed. A structure has been proposed in which the pitch width of the corresponding electrode lead is enlarged by pattern wiring formed on each layer of the lead relay substrate, and is aligned and drawn out to the IC substrate connection side serving as a relay circuit (for example, Patent Document 1). ). According to this structure, a large number of electrode leads can be extracted from the signal electrodes of the ultrasonic transducers arranged in a two-dimensional array in the ultrasonic probe, and the acoustic characteristics of the piezoelectric element can be maintained, and the IC can be mounted. Etc. can be easily realized.

  However, since the ultrasonic probe described in Patent Document 1 expands the pitch of the electrode leads drawn from the signal electrodes by the pattern wiring of the relay board connected to the ultrasonic transducer, the connection between the relay board and the ultrasonic transducer There is a possibility that the portion will be enlarged.

  Therefore, the inventors have prevented an increase in the size of the connection structure with the relay substrate, can draw a large number of electrode leads like the ultrasonic transducer described above, maintain the acoustic characteristics of the piezoelectric element, and mount an IC or the like. An ultrasonic transducer that can be easily realized is devised. An example of the structure of this ultrasonic transducer is shown in FIG. FIG. 9A is a schematic perspective view showing a state in which the two-dimensional array of ultrasonic transducers 300 is viewed from the side. FIG. 9B is a schematic exploded perspective view showing the configuration of the ultrasonic transducer unit 300a before the division constituting the ultrasonic transducer 300 in FIG. 9A.

  As shown in FIG. 9A, laminated piezoelectric elements (piezoelectric elements) 314 and 324 for one column of a two-dimensional array are arranged in parallel on the front and back surfaces of the printed circuit board 330 in the ultrasonic transducer 300. Furthermore, acoustic matching layers 310 and 320 are disposed adjacent to one surface (hereinafter referred to as “front surface”) of the laminated piezoelectric bodies 314 and 324 and arranged in parallel in the same manner as the laminated piezoelectric bodies 314 and 324. The Further, backing materials (loading material phases) 318 and 328 are disposed adjacent to the surface (hereinafter referred to as “rear surface”) of the laminated piezoelectric bodies 314 and 324 opposite to the acoustic matching layers 310 and 320 side. These are arranged in parallel in the same manner as the laminated piezoelectric material. Wiring patterns 331 are formed in parallel on the front and back surfaces of the printed circuit board 330 as conductive electrode leads.

  Further, as shown in FIGS. 9A and 9B, the acoustic matching layer and each laminated piezoelectric material (314, 324) are formed so as to be exposed on each surface of the laminated piezoelectric material. Front electrodes 312 and 322 are disposed. Back electrodes 316 and 326 formed so as to be exposed on the respective surfaces are disposed on the opposite side of the front electrodes 312 and 322, that is, between the backing material and the laminated piezoelectric material. Further, first internal electrodes 312a and 322a and second internal electrodes 316a and 326a are formed between the stacked piezoelectric elements.

  The front electrodes 312, 322 and the first internal electrodes 312a, 322a are both configured to be the same type (positive electrode or negative electrode). Similarly, the back electrodes 316 and 326 and the second internal electrodes 316a and 326a are both configured to be the same type of electrode and different from the front electrode and the first internal electrode. With this configuration, one piezoelectric element is sandwiched between electrodes of different polarities, and the piezoelectric element can be driven by an electric signal.

  Further, as shown in FIGS. 9A and 9B, a printed metal board 330 and laminated piezoelectric materials (314, 324) disposed on both surfaces of the printed circuit board 330 are formed by a conductive metal thin film 370. Are bonded by various methods such as sputtering and vapor deposition. That is, by using this metal thin film 370, the electrical connection between each electrode such as the front electrodes 312 and 322 and each wiring pattern 331 (electrode lead) on the printed circuit board 330 side is strengthened, and each laminated piezoelectric material and print Bonding with the substrate 330 and the wiring pattern 331 is performed.

  As shown in FIGS. 9A and 9B, the metal thin film 370 is formed from the back electrodes 316 and 326 to the front electrodes 312 and 322 on the side surfaces of the laminated piezoelectric bodies 314 and 324. Therefore, the side surface of the laminated piezoelectric body 314 is configured to contact only either the front electrode 312 and the first internal electrode 312a or the back electrode 316 and the second internal electrode 316a when the metal thin film 370 is formed. Has been. By doing in this way, it can be set as the structure which pinches | interposes one piezoelectric element in a laminated piezoelectric material by the electrode of a different polarity.

Japanese Patent Laid-Open No. 2001-292696

  Further, the end of the ultrasonic transducer 300 opposite to the ultrasonic radiation direction in the wiring pattern 331 is connected to the electronic circuit of the relay substrate. This electronic circuit transmits an electric signal to be applied to the piezoelectric element, and further receives an electric signal based on a reflected wave from the subject to perform each processing.

  In addition, the relay board is disposed in advance corresponding to the position of the wiring pattern 331 in the ultrasonic transducer 300, that is, the position of the printed board 330 on which the wiring pattern is formed. However, when generating an ultrasonic transducer, the thickness of the piezoelectric body (the length in the direction orthogonal to the ultrasonic radiation direction) may vary, or the side surface of the piezoelectric body may not be flat. The ultrasonic transducer as shown in FIG. 9 (A) is formed by stacking ultrasonic transducer units 300a as shown in FIG. 9 (B). If the unevenness is generated, there is a possibility that the positional accuracy of the printed circuit board disposed between the piezoelectric bodies is deteriorated when the piezoelectric bodies are stacked.

  Since the relay board is arranged corresponding to the position of the wiring pattern 331, if the positional accuracy of the printed board 330 is deteriorated, it becomes difficult to connect the wiring pattern 331 and the electronic circuit on the relay board. There is a risk that. That is, when the position accuracy of the printed circuit board 330 is poor, the printed circuit board 330 must be shifted in accordance with the arrangement of the relay circuit board and the position of the end of the wiring pattern 331 must be adjusted so that it can be connected to the electronic circuit. Since the position of the substrate 330 is fixed as the integrated ultrasonic transducer 300 when the ultrasonic transducer units 300a are stacked, it is not easy to adjust the position by shifting the printed circuit board 330.

  In particular, the printed circuit board 330 can be bent in the thickness direction depending on its material structure, but it is difficult to bend in the plane direction of the printed circuit board 330. Therefore, if the position of the printed circuit board 330 is shifted in the plane direction of the printed circuit board 330 when the piezoelectric bodies are stacked, it is difficult to connect the wiring pattern 331 and the electronic circuit of the relay circuit board. As a result, there is a possibility that the driving of the piezoelectric element may be difficult, and as a result, it may be difficult to generate an ultrasonic image or cause trouble.

  The present invention has been made in view of the above problems, and its purpose is to make it difficult to connect an electrode lead connected to a piezoelectric body in an ultrasonic transducer and an electronic circuit on a relay board. An object of the present invention is to provide an ultrasonic transducer capable of avoiding and reliably transmitting / receiving an electric signal to / from a piezoelectric element.

In the invention according to claim 1 for solving the above-described problem, electrodes are provided on the front surface on the radiation direction side of the ultrasonic wave and on the back surface on the opposite side of the front surface, respectively, and the direction orthogonal to the radiation direction. A plurality of piezoelectric bodies arranged in a two-dimensional manner, a substrate provided with at least an electronic circuit for transmitting an electric signal applied to the piezoelectric body, and electrically connected to the electronic circuit, and the front surface of the piezoelectric body And a flexible linear wiring lead that is electrically connected to at least one of the electrodes by being disposed on a side surface orthogonal to the back surface. .
In the invention according to claim 7 for solving the above problem, a front electrode is formed on the front surface on the ultrasonic radiation direction side, a back electrode is formed on the back surface on the opposite side, and the front surface and the back surface are formed. A first concave groove formed from the edge on the front electrode side toward the edge on the back electrode side on the first side surface orthogonal to the first side surface, and a second groove opposite to the first side surface A plurality of two-dimensionally arranged second grooves in the side surface and having a second concave groove formed from the edge on the front electrode side toward the edge on the back electrode side. A piezoelectric body and an electronic circuit for transmitting an electrical signal applied to the piezoelectric body and processing the electrical signal from the piezoelectric body are formed, and one column of a piezoelectric array arranged two-dimensionally on the back side. A substrate disposed for each and the electronic circuit, and a first of the piezoelectric body By being accommodated in the groove and directly or indirectly coupled to one of the front electrode or the back electrode of each piezoelectric body, it is electrically connected to at least one of the electrodes, has flexibility, and has a linear shape. A first electrode lead formed; and the first electrode lead that is housed in the second concave groove of the piezoelectric body and that is not coupled to the first electrode lead among the front electrode or the back electrode of the second piezoelectric body. The ultrasonic transducer includes a plurality of second electrode leads that are electrically connected to each other by being directly or indirectly coupled to the electrode and that are flexible and linear .
Also, the invention according to claim 11 for solving the above problems, an ultrasonic transducer having a plurality of piezoelectric bodies with electrodes, and a electronic circuit for transmitting an electric signal applied to the piezoelectric element A wiring lead for connecting the electronic circuit and the electrode of the piezoelectric body to the electronic circuit, and a side surface of each of the piezoelectric bodies. The wiring lead connected to the electronic circuit is disposed, the electrode exposed on the side surface is connected to the wiring lead, and the piezoelectric bodies on which the wiring lead is disposed on the side surface are arranged in parallel. A method of manufacturing an ultrasonic transducer, comprising: arranging and stacking rows of piezoelectric bodies in the same direction and in a direction perpendicular to an ultrasonic radiation direction.
In order to solve the above problem, the invention according to claim 12 is characterized in that a front electrode is formed on the front surface on the ultrasonic radiation direction side, a back electrode is formed on the back surface on the opposite side, and the front surface and the back surface are formed. A first concave groove formed from the edge on the front electrode side toward the edge on the back electrode side on the first side surface orthogonal to the first side surface, and a second groove opposite to the first side surface A plurality of two-dimensionally arranged second grooves in the side surface and having a second concave groove formed from the edge on the front electrode side toward the edge on the back electrode side. A piezoelectric body and an electronic circuit that transmits an electrical signal to be applied to the piezoelectric body and processes the electrical signal from the piezoelectric body is formed, and is arranged for each row on the back side according to the arrangement of the piezoelectric bodies. And electrically connected to the electronic circuit and housed in the first concave groove of the piezoelectric body. The first electrode which is electrically connected to at least one of the electrodes and connected to at least one of the front electrode and the back electrode of each of the piezoelectric bodies and has flexibility and a linear shape. The lead and the electrode that is housed in the second concave groove of the piezoelectric body and that is not coupled to the first electrode lead among the front electrode or the back electrode of the second piezoelectric body Or an ultrasonic probe characterized in that it comprises an ultrasonic transducer provided with a plurality of second electrode leads that are electrically connected and are flexible and have a linear shape. is there.

According to the first, seventh , eleventh and twelfth aspects of the present invention, in the ultrasonic transducer in the ultrasonic probe, a linear wiring lead arranged on the side surface of the piezoelectric body and connected to the electrode is connected to the wiring lead. The position of the end can be adjusted to an arbitrary position corresponding to the electronic circuit of the relay board by its flexibility. Therefore, the end of the wiring lead can be connected to a position corresponding to the relay board on which an electronic circuit that transmits and receives an electrical signal to and from the piezoelectric body is formed. As a result, the electrical signal to the piezoelectric body is transmitted. Transmission and reception can be performed reliably.

[First Embodiment]
Hereinafter, an ultrasonic transducer and an ultrasonic probe according to a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1A is a schematic perspective view showing a state in which the ultrasonic transducer 100 according to the first embodiment of the present invention is viewed from the side. FIG. 1B is a schematic exploded perspective view showing the configuration of the ultrasonic transducer unit 100a constituting the ultrasonic transducer 100 according to the first embodiment of the present invention. Hereinafter, the configuration of the ultrasonic transducer 100 according to the first embodiment will be described.

(Schematic configuration of ultrasonic transducer)
As shown in FIG. 1A, an ultrasonic transducer 100 according to this embodiment includes a first laminated piezoelectric body 114 and a second laminated piezoelectric body 124 in which piezoelectric elements are laminated in three layers.
As shown in FIG. 1A, in the ultrasonic transducer 100, an acoustic matching layer 110 is provided adjacent to the stacking direction of the piezoelectric elements in the first stacked piezoelectric body 114. A backing material 118 (loading material phase) is provided on the opposite side of the first laminated piezoelectric body 114 from the acoustic matching layer 110 side. The piezoelectric block 101 is configured by a combination of the acoustic matching layer 110, the first laminated piezoelectric body 114, and the backing material 118. Similarly, an acoustic matching layer 120 is provided adjacent to the stacking direction of the second laminated piezoelectric body 124, and a backing material 128 is provided on the opposite side of the acoustic matching layer 120. The piezoelectric block 102 is configured by a combination of the acoustic matching layer 120, the second laminated piezoelectric body 124, and the backing material 128.

  On the side surfaces of the piezoelectric body block 101 and the piezoelectric body block 102, wiring leads 131 are arranged in parallel according to the arrangement of the laminated piezoelectric bodies (114, 124). Further, the piezoelectric block 101 and the piezoelectric block 102 in which the wiring leads 131 are arranged are alternately stacked with the insulating sheet 130 interposed therebetween as shown in FIG. 1B and fixed as an integral ultrasonic transducer 100. (FIG. 1A). The piezoelectric block 101 and the piezoelectric block 102 are stacked so that the acoustic matching layers (110, 120) are in the same direction. Hereinafter, the structure of each part in the ultrasonic transducer 100 of the present embodiment will be described.

  Note that the ultrasonic transducer 100 according to the present embodiment has a laminated piezoelectric material (114, 124). However, in the ultrasonic transducer of the present invention, it is possible to use a piezoelectric material having a single piezoelectric element. is there. In this case, the ultrasonic transducer 100 has only front electrodes 112 and 122 and back electrodes 116 and 126, which will be described later, and the internal electrodes 112a, 116a, 122a, and 126a are not necessary.

(Configuration of each electrode in laminated piezoelectric material)
As shown in FIG. 1B, a front electrode 112 is provided on the front surface adjacent to the acoustic matching layer 110 in the first laminated piezoelectric body 114. Further, a back electrode 116 is provided on the back surface opposite to the front surface. Furthermore, internal electrodes are provided between the piezoelectric elements stacked in the first stacked piezoelectric body 114. That is, among the piezoelectric elements stacked in three layers, a first internal electrode 112a to which an electrical signal corresponding to the front electrode 112 is applied is provided between the piezoelectric element on the back side and the intermediate piezoelectric element. A second internal electrode 116a to which an electrical signal corresponding to the back electrode 116 is applied is provided between the side piezoelectric element and the intermediate piezoelectric element. In the ultrasonic transducer 100 according to the present embodiment, the first side surface and the second side surface of the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124 may have the same structure.

(Structure of side face in laminated piezoelectric material)
The first laminated piezoelectric body 114 has grooves 111 and 115 so that only the back electrode 116 and the second internal electrode 116a are exposed on the first side surface (right side surface in FIG. 1) orthogonal to the front surface and orthogonal to the back surface. It is formed. That is, the groove 111 is formed on the first side surface of the first multilayer piezoelectric body 114 on the boundary between the first multilayer piezoelectric body 114 and the acoustic matching layer 110 (on the front electrode 112). Therefore, the front electrode 112 is not exposed on the first side surface. Similarly, the groove 115 is formed on the first side surface substantially parallel to the groove 111 on the boundary (on the first internal electrode 112a) between the piezoelectric element on the back side of the first laminated piezoelectric body 114 and the intermediate piezoelectric element. . Therefore, in the first side surface, the first internal electrode 112a is not exposed.

  Further, as shown in FIG. 1B, the front electrode 112 and the first internal electrode 112a are exposed on the second side surface of the first laminated piezoelectric body 114 opposite to the first side surface. It is configured. That is, the groove 117 is formed along the edge on the back electrode 116 side on the second side surface of the first laminated piezoelectric body 114. Further, a groove 113 is formed on the second side surface along the boundary (on the second internal electrode 116a) between the intermediate piezoelectric element and the front piezoelectric element. Therefore, the back electrode 116 and the second internal electrode 116a are not exposed on the second side surface.

  Thus, the grooves (111, 113, 115, 117) on the first side surface and the second side surface of the first laminated piezoelectric body 114 are formed every other electrode in the order of the lamination direction of the piezoelectric elements. Therefore, when the wiring leads 131 are arranged on these side surfaces, they are not conducted to the electrodes where the grooves (111, 113, 115, 117) are formed on the side surfaces, but only to the electrodes exposed on the side surfaces. Is done. Therefore, since the electrical signal transmitted from the IC 205 (see FIG. 4) of the relay substrate 200 is applied only to the electrodes exposed every other electrode in the order of the stacking direction of the piezoelectric elements, one piezoelectric element has a different polarity. The piezoelectric element can be driven by the electrical signal.

  Further, in contrast to the first laminated piezoelectric body 114, in the second laminated piezoelectric body 124, as shown in FIG. 1B, the first side surface (the right side surface in FIG. 1) and the second side surface (in FIG. 1). The position where the groove is formed on the left surface is reversed. In other words, the second side surface of the second laminated piezoelectric body 124 is configured such that the back electrode 116 and the second internal electrode 116a are exposed, and the front electrode 112 and the first internal electrode are formed on the opposite first side surface. 112a is configured to be exposed.

  That is, the groove 121 is provided on the second side surface of the second laminated piezoelectric body 124 at the edge of the piezoelectric element adjacent to the front electrode 122. A groove 125 is provided at the boundary between the intermediate piezoelectric element on the second side surface of the second laminated piezoelectric body 124 and the piezoelectric element on the back side. Further, on the first side surface of the second laminated piezoelectric body 124, a groove 127 is formed at the edge on the back electrode 126 side, and a groove 123 is formed at the boundary between the intermediate piezoelectric element and the front piezoelectric element. Thus, by targeting the positions of the electrodes (112, 122, etc.) exposed on the side surfaces in the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124, the same type of electrodes (front electrode, back electrode, etc.) It is possible to connect the wiring leads 131 connected to the IC 205 to the IC 205 in the relay substrate 200 in the subsequent stage.

  Similarly to the grooves 111, 115, 113, and 117 in the first laminated piezoelectric body 114, the electrodes on the first side surface and the second side surface of the second laminated piezoelectric body 124 also have one electrode in order of the lamination direction of the piezoelectric elements. It is formed every other.

  Further, as shown in FIG. 1B, a metal thin film 170 is formed on the first side surface and the second side surface of the first multilayer piezoelectric body 114 and the second multilayer piezoelectric body 124. The metal thin film 170 adheres the wiring leads 131 disposed on the first side surface and the second side surface to the first side surface and the second side surface, and the first side surface and the second side surface. Thus, the electrical connection between the exposed electrode and the wiring lead 131 is ensured. The metal thin film 170 corresponds to an example of “conductive thin film” in the present invention.

(Wiring lead)
In the ultrasonic transducer 100 of the present embodiment, wiring leads 131 are arranged in parallel on the side surface orthogonal to the front surface on the ultrasonic radiation direction side and the back surface opposite to the front surface, as shown in FIG. And it arrange | positions in the position corresponding to a laminated piezoelectric material (114,124). The wiring lead 131 is made of a flexible wire.

  For example, as the wiring lead 131, a metal wire or a wire material obtained by twisting metal wires can be used. Further, from the viewpoints of flexibility and fatigue resistance, it is possible to use a wire material in which the surface of the resin wire is covered with a metal or a product obtained by twisting a plurality of the wire materials as the wiring lead 131.

  As shown in FIG. 1B, the wiring lead 131 is formed of the acoustic matching layer 110 on the first side face and the second side face of the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124 by the metal thin film 170. 12) to the backing materials 118 and 128. Furthermore, one end side of the wiring lead 131 is disposed so as to be in contact with at least the front electrodes 112 and 122. Further, the other end of the wiring lead 131 extends from the end of the ultrasonic transducer 100 opposite to the ultrasonic radiation direction toward the relay substrate 200 and is connected to the IC 205 of the relay substrate 200.

  The insulating sheet 130 between the piezoelectric block 101 and the piezoelectric block 102 and the wiring lead 131 are partially fixed. That is, the wiring lead 131 is fixed to the insulating sheet 130 between the laminated piezoelectric body (114, 124) and the vicinity of the center of the backing material 118, 128, and on the other hand, the wiring lead 131 is relayed. The end (rear end) on the substrate 200 side is not fixed. This is because the rear end side of the wiring lead 131 can be moved to an arbitrary position, and the rear end side can be easily aligned with the position of the IC 205 on the relay substrate 200.

  In the ultrasonic transducer 100 of the present embodiment, the insulating sheet 130 and the wiring lead 131 are partially fixed as described above from the viewpoint of facilitating connection with the relay substrate 200. However, the ultrasonic transducer in the present invention is not limited to this. For example, from the viewpoint of facilitating the connection between the ultrasonic transducer 100 and the relay substrate 200, it is possible to adopt a configuration in which the wiring lead 131 is not fixed to the insulating sheet 130 as a whole, not only on the rear end side. However, in this case, it is necessary to securely fix the piezoelectric body block 101 and the piezoelectric body block 102 so that the position of the wiring lead 131 in the ultrasonic transducer 100 does not shift.

  By configuring the wiring lead 131 in this way, it becomes easy to align the wiring lead 131 corresponding to the position of the IC 205 of the relay substrate 200. For example, even when the positional accuracy of the wiring lead 131 connected to the electrodes (112, etc.) in the laminated piezoelectric bodies (114, 124) in the ultrasonic transducer 100 cannot be ensured, the position of the end of the wiring lead 131 is fixed at least. Therefore, using the flexibility of the wiring lead 131, the position of the end of the wiring lead 131 can be adjusted to an arbitrary position corresponding to the IC 205 of the relay substrate 200. Therefore, it is possible to reliably transmit and receive electrical signals between the piezoelectric element and the IC 205. The ultrasonic transducer 100 in the present embodiment does not include an electronic circuit connected to the wiring lead 131 and a substrate on which the electronic circuit is formed. However, the ultrasonic transducer in the present invention includes these electronic circuit and substrate. It is a waste. Next, as an example of the electronic circuit and the substrate, the relay substrate 200, the IC 205, and the like will be described.

(Connection between ultrasonic transducer and IC board)
Next, an example of a connection configuration between the ultrasonic transducer 100 and the relay substrate 200 according to the present embodiment will be described with reference to FIG. FIG. 2 shows an example of a method for connecting the ultrasonic transducer 100, which is connected to the mechanism for connecting the ultrasonic transducer 100 and the relay board 200 in this embodiment, the IC 205 on the relay board 200, and the ultrasonic diagnostic apparatus main body. FIG.

  As shown in FIG. 2, the relay substrate 200 is disposed adjacent to the rear end (the end opposite to the ultrasonic radiation direction) of the ultrasonic transducer 100, and the IC 205 on the relay substrate 200 is connected to the wiring lead 131. The The relay board 200 corresponds to an example of the “board” in the present invention, and the IC 205 corresponds to an example of the “electronic circuit” in the present invention.

  As shown in FIG. 2, the relay board 200 is connected via a cable (both not shown) that is electrically connected to the ultrasonic diagnostic apparatus body, and the relay board 200 and the cable are connected to the cable connection board 210. Connected by. One end of the cable connection board 210 is connected to one end of the relay board 200 opposite to the one provided with signal leads (not shown).

  The connectors 211 are provided at the other end of the cable connection board 210 and one end of the cable, respectively. The connector 211 connects the cable connection board 210 and the cable connected to the ultrasonic diagnostic apparatus main body.

  As shown in FIG. 2, an IC 205 is formed on the relay substrate 200 provided between the ultrasonic transducer 100 and the ultrasonic diagnostic apparatus main body, and the IC 205 is connected to the wiring lead 131. The IC 205 applies a signal of the same kind to the front electrodes 112 and 122 and the first internal electrodes 112a and 122a, and an electric signal to be the same kind of electrodes to the back electrodes 116 and 126 and the second internal electrodes 116a and 126a. Is applied to drive the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124. In this way, the IC 205 causes the ultrasonic transducer 100 to transmit an ultrasonic beam.

  The IC 205 processes signals received by the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124. With such an arrangement, in the ultrasonic probe incorporating the ultrasonic transducer 100, the reflected waves received by the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124 are converted into signals, and the signals are transferred to the relay substrate 200. The IC 205 processes the signal received by the IC 205. Further, the IC 205 transmits the processed signal to the ultrasonic diagnostic apparatus main body via the cable connection board 210.

  In this embodiment, the IC 205 is used, but includes an ASIC and other means. In addition, the ultrasonic transducer 100, the relay substrate 200, and the IC 205 in FIG. 2 constitute an embodiment of the ultrasonic transducer in the present invention. As shown in FIG. 2, the ultrasonic probe 220 includes the ultrasonic transducer 100, the relay substrate 200, and the IC 205.

(Manufacturing process)
Next, a manufacturing process of the ultrasonic transducer 100 according to the first embodiment will be described with reference to FIGS. 1, 3, and 4. FIG. 3A is a schematic perspective view showing a process in which the metal thin film 170 is formed on the piezoelectric blocks 101 and 102 in the manufacturing process of the ultrasonic transducer 100 according to the first embodiment of the present invention. FIG. 3B is a schematic perspective view showing a state in which the metal thin film 170 is formed on the side surfaces of the piezoelectric blocks 101 and 102 in FIG. FIG. 3C is a schematic perspective view illustrating a state in which grooves are formed on the side surfaces of the piezoelectric body blocks 101 and 102 in FIG. FIG. 3D is a schematic partially enlarged view of FIG. FIG. 4A is a schematic perspective view showing a process of arranging the wiring leads 131 on the first side surface and the second side surface of the piezoelectric body blocks 101 and 102. 4B is a schematic perspective view showing the ultrasonic transducer 100 before being divided after the piezoelectric blocks 101 and 102 in FIG. 4A are stacked.

(Step 1)
First, piezoelectric elements are laminated in three layers, and internal electrodes are provided between the piezoelectric elements to form laminated piezoelectric bodies (114, 124) before division. Front electrodes 112 and 122 are formed on the front surface of the laminated piezoelectric body (114 and 124), and back electrodes 116 and 126 are formed on the back surface. Further, the laminated piezoelectric body (114, 124) is provided with acoustic matching layers 110, 120 on the front surface and backing materials 118, 128 on the rear surface, as shown in FIG. Piezoelectric blocks 101 and 102 are formed. The piezoelectric body blocks 101 and 102 have the same thickness as the thickness of each of the laminated piezoelectric bodies (114 and 124) of the ultrasonic transducer 100 when completed (the length in a direction perpendicular to the radiation direction of ultrasonic waves), and In the completed ultrasonic transducer 100 as shown in FIG. 1A, it has the same length as one row of the laminated piezoelectric bodies (114, 124) arranged two-dimensionally. The length direction is a direction (column direction) orthogonal to the stacking direction of the piezoelectric elements. Further, as shown in FIG. 3B, the first side surface orthogonal to the front surface and the back surface of the laminated piezoelectric material (114, 124) in the piezoelectric body blocks 101, 102 is opposite to the first side surface. A metal thin film 170 is formed on the second side surface. The piezoelectric body blocks 101 and 102 are divided in the column direction from the acoustic matching layers 110 and 120 side in the subsequent process. The stacked piezoelectric bodies (114, 124) for one row in the two-dimensional array of ultrasonic transducers 100 constitute the divided piezoelectric body blocks. Further, when the metal thin film 170 is formed on the first side surface and the second side surface, all the electrodes in which the metal thin film 170 is exposed on these side surfaces both on the first side surface and on the second side surface. Touching.

(Step 2)
After the metal thin film 170 is formed on the piezoelectric block 101 as shown in FIG. 3B, as shown in FIGS. 3C and 3D, the first side surface and the second side of the piezoelectric block 101 are shown. Grooves (111, 115, 113, 117) are formed at predetermined positions on the side surfaces. That is, each of the grooves 111 and the like is formed as follows. From the state where all the electrodes (112, 116a, 112a, 116) are exposed on the first side surface of the first laminated piezoelectric body 114, the acoustic matching in the portion where the front electrode 112 is exposed, that is, the first side surface. The boundary between the layer 110 and the first laminated piezoelectric body 114 is cut together with the metal thin film 170 in a direction orthogonal to the lamination direction of the piezoelectric elements to form a groove 111 as shown in FIGS. 3 (C) and 3 (D). Further, on the first side surface of the first laminated piezoelectric body 114, a groove 115 parallel to the groove 111 is formed at the boundary portion between the back side piezoelectric element and the intermediate piezoelectric element. On the other hand, as shown in FIGS. 3C and 3D, the backing material 118 and the first laminated piezoelectric body 114 are formed on the second side surface (the left side surface in FIG. 3B) of the first laminated piezoelectric body 114. A groove 117 as shown in FIGS. 3C and 3D is formed at the boundary. Further, on the second side surface, a groove 113 parallel to the groove 117 is formed at a boundary portion between the piezoelectric element on the front side and the intermediate piezoelectric element.

(Step 3)
Further, in the second laminated piezoelectric body 124, the position of the groove on the first side surface (the right side surface in FIG. 3B) and the second side surface corresponds to the groove (111, 115, 113, 117) and grooves (121, 125, 123, 127) are formed so as to be symmetrical. That is, on the second side surface of the second laminated piezoelectric body 124, the boundary between the acoustic matching layer 120 and the second laminated piezoelectric body 124 is scraped together with the metal thin film 170 to form the groove 121. Further, on the second side surface, a groove 125 parallel to the groove 121 is formed at a boundary portion between the back side piezoelectric element and the intermediate piezoelectric element. Further, on the first side surface of the second laminated piezoelectric body 124 with respect to the second side surface, the boundary between the backing material 128 and the second laminated piezoelectric body 124 is scraped to form a groove 127. Further, on the first side surface, a groove 123 parallel to the groove 127 is formed at a boundary portion between the piezoelectric element on the front side and the intermediate piezoelectric element.

(Step 4)
After the grooves 111, 121 and the like are formed on the first side surface and the second side surface of the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124, respectively, the piezoelectric body block 101 and the piezoelectric body block 102 include As shown in FIG. 4A, the wiring leads 131 are arranged at positions corresponding to the laminated piezoelectric bodies (114, 124). That is, one end side of the linear wiring lead 131 is arranged so as to contact the front electrodes 112 and 122, and the other end side is arranged on the rear end side of the ultrasonic transducer 100. Further, the metal thin film 170 and the wiring lead 131 are fixed by a method such as sputtering or vapor deposition.

(Step 5)
After the wiring leads 131 are arranged on the piezoelectric block 101 and the piezoelectric block 102, they are further laminated via an insulating sheet 130. That is, after the wiring leads 131 are arranged on the piezoelectric blocks 101 and 102, the portions other than the rear end side of the wiring leads 131 are fixed to the insulating sheet 130. In this way, the piezoelectric body block 101 and the piezoelectric body block 102 are stacked, and the ultrasonic transducer 100 before division is formed.

(Step 6)
After the ultrasonic transducer 100 is formed, as shown in FIG. The ultrasonic transducer 100 is divided from the acoustic matching layers 110 and 120 side in a direction parallel to the lamination direction of the piezoelectric body block 101 and the piezoelectric body block 102 and perpendicular to the direction of the groove (111 etc.) on the side surface of the piezoelectric body. Dividing grooves extending to the backing materials 118 and 128 are formed. The ultrasonic transducer 100 in which the laminated grooves formed by the division are filled with insulating resin and the laminated piezoelectric bodies (114, 124) as shown in FIG. 1A are two-dimensionally arranged is formed. The reason why the dividing grooves are formed to reach the backing materials 118 and 128 is to reliably divide the laminated piezoelectric bodies (114 and 124) in the piezoelectric blocks 101 and 102.

(Step 7)
When the ultrasonic transducer 100 as shown in FIG. 1A is formed, the ultrasonic transducer 100 and the relay substrate 200 arranged corresponding to the arrangement of the piezoelectric blocks 101 and 102 are connected. That is, the rear end portion of the wiring lead 131 extended from each of the first side surface and the second side surface of the laminated piezoelectric bodies 114 and 124 in the piezoelectric body blocks 102 and 102 and the IC 205 formed on the relay substrate 200 are provided. By connecting, electrical signals can be transmitted and received between the IC 205 and the electrodes (112, 126, etc.) in the laminated piezoelectric bodies 114, 124.

  In this embodiment, as shown in FIG. 3B, after the metal thin film 170 is formed on the first side surface and the second side surface of the laminated piezoelectric bodies 114 and 124, the grooves 111 and the like are formed at predetermined positions. The ultrasonic transducer according to the present invention is not limited to this manufacturing process. For example, after the grooves 111 and the like are formed at predetermined positions on the first side surface and the second side surface of the laminated piezoelectric bodies 114 and 124, the grooves are filled with an insulating resin, and then the first side surface and the second side surface are filled. It is also possible to use a process of forming the metal thin film 170 on the side surface of the metal.

(Action / Effect)
The operation and effect of the ultrasonic transducer 100 according to the first embodiment described above will be described.

  As described above, in the ultrasonic transducer 100 of the first embodiment, the wiring corresponding to the position of the IC 205 of the relay substrate 200 according to the configuration of the wiring lead 131 and the fixing method to the laminated piezoelectric body (114, 124). It becomes easy to align the lead 131. For example, even when the positional accuracy of the wiring lead 131 connected to the electrodes (112, etc.) in the laminated piezoelectric bodies (114, 124) in the ultrasonic transducer 100 cannot be ensured, the wiring lead 131 has flexibility and Since the position of the end of the wiring lead 131 is not fixed, the position of the end of the wiring lead 131 can be adjusted to an arbitrary position corresponding to the IC 205 of the relay substrate 200. Therefore, it is possible to reliably transmit and receive electrical signals between the piezoelectric element and the IC 205.

[Second Embodiment]
Next, an ultrasonic transducer 100 according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a schematic exploded perspective view showing a configuration of an ultrasonic transducer unit 100a constituting the ultrasonic transducer 100 according to the second embodiment of the present invention.

  The outline of the second embodiment will be described below. In the ultrasonic transducer 100 as described in the first embodiment, the wiring lead 131 is interposed between the piezoelectric block 101 and the piezoelectric block 102. When forming such a two-dimensional array of ultrasonic transducers 100, the wiring leads 131 are arranged in parallel on the side surfaces of the laminated piezoelectric bodies (114, 124), and then the piezoelectric leads in which the wiring leads 131 are arranged in parallel. The body block 101 and the piezoelectric body block 102, that is, a process of forming a two-dimensional array of the ultrasonic transducers 100 by stacking a plurality of ultrasonic transducers for one row are passed through.

  However, the piezoelectric lead 101 and the piezoelectric block 102 are not in close contact with each other by the thickness of the wiring lead 131 due to the wiring lead 131 interposed between the side surfaces of the piezoelectric piezoelectric body. That is, when a plurality of piezoelectric blocks (101, 102) for one row are stacked, there is no problem if the piezoelectric block 101 and the piezoelectric block 102 can be securely fixed. There is a possibility that the positions of the body blocks 101 and 102 are shifted. Further, the piezoelectric block (101, 102) may be displaced with respect to the wiring lead 131.

  If such a positional shift occurs, it may be difficult to connect the wiring lead 131 and the IC 205 on the relay substrate 200. Further, when each piezoelectric body of the ultrasonic transducer 100 is driven by this positional deviation, the ultrasonic wave radiated from each of the displaced piezoelectric bodies is converted into the shape of the ultrasonic beam radiated from the entire ultrasonic transducer, There is a risk of causing a deviation in the radiation direction of the ultrasonic waves. As a result, there is a possibility that the ultrasonic image generated by the ultrasonic diagnostic apparatus may be hindered.

  The ultrasonic transducer 100 according to the second embodiment has been made in view of the above problems. The outline is that, on the first side surface and the second side surface of the piezoelectric body orthogonal to the front surface and the back surface of the piezoelectric body, the concave grooves 119 and 129 having a size for accommodating the wiring lead 131 are arranged in the ultrasonic radiation direction. The ultrasonic transducer 100 is formed along. In the ultrasonic transducer 100, when the piezoelectric block 101 and the piezoelectric block 102 are stacked, the wiring leads 131 on the side surfaces of the piezoelectric body are accommodated in the concave grooves 119 and 129.

  That is, the gap for the wiring lead 131 generated between the piezoelectric body block 101 and the piezoelectric body block 102 is greatly reduced. As a result, it is possible to prevent a situation in which the positions of the piezoelectric body block 101 and the piezoelectric body block 102 are shifted by bringing the piezoelectric body blocks (101, 102) into close contact or close to each other. Further, since the wiring lead 131 is accommodated in the concave grooves 119, 12), even if a force is applied in such a direction that the piezoelectric body block 101 and the piezoelectric body block 102 are displaced, the positional deviation can be avoided. It becomes. In addition, as a result of preventing such positional displacement, the piezoelectric element arrangement in the ultrasonic transducer and the positional accuracy of the wiring lead rear end side are ensured, and it is difficult to connect the wiring lead 131 and the electronic circuit (IC 205) of the relay substrate 200. Can be prevented. Furthermore, it is possible to ensure the accuracy of the shape and direction of the ultrasonic beam emitted from the ultrasonic probe.

  Hereinafter, the configuration of the ultrasonic transducer 100 according to the second embodiment will be described.

(Overview of overall configuration of ultrasonic transducer)
Similar to the first embodiment, the ultrasonic transducer 100 according to the second embodiment includes a first laminated piezoelectric body 114 and a second laminated piezoelectric body 124 in which piezoelectric elements are laminated in three layers, and a laminated piezoelectric body. The acoustic matching layers 110 and 120 are provided on the front surface in the stacking direction of (114, 124), and the backing materials 118 and 128 are provided on the back surface opposite to the front surface. The acoustic matching layer 110, the first laminated piezoelectric body 114, and the backing material 118 constitute the piezoelectric body block 101. The acoustic matching layer 120, the second laminated piezoelectric body 124, and the backing material 128 constitute the piezoelectric block 102. Further, front electrodes 112 and 122 are provided on the front surface of the multilayered piezoelectric body (114 and 124), and back electrodes 116 and 126 are provided on the back surface. Further, internal electrodes (112a, 122a, 116a, 126a) are provided between the piezoelectric elements in the laminated piezoelectric body (114, 124). Since the function of each part of these ultrasonic transducers and the positional relationship of each part are the same as those of the ultrasonic transducer according to the first embodiment, description thereof will be omitted.

  Further, as shown in FIG. 5, as in the first embodiment, the piezoelectric element block 101 in the ultrasonic transducer 100 according to the second embodiment and the first side surface of the laminated piezoelectric element (114, 124) in the piezoelectric block 102 and the first side surface. The wiring leads 131 are arranged in parallel on the two side surfaces.

  Further, as shown in FIG. 5, the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124 and the wiring lead 131 are connected by a metal thin film 170. Thus, the ultrasonic transducer 100 is formed by arranging the wiring leads 131 in parallel with the piezoelectric blocks 101 and 102 and laminating the piezoelectric blocks 101 and 102 with the insulating sheet 130 interposed therebetween. As described above, the directions of the piezoelectric blocks 101 and 102 laminated through the insulating sheet 130 are all the same direction.

(Structure of side face in laminated piezoelectric material)
Next, the configuration of the side surfaces of the first laminated piezoelectric body 114, the second laminated piezoelectric body 124, and the backing materials 118 and 128 according to the second embodiment will be described with reference to FIG. As shown in FIG. 5, the first laminated piezoelectric body 114 of the ultrasonic transducer 100 according to the second embodiment has a concave on the first side surface orthogonal to the front surface and the back surface and on which the wiring lead 131 is disposed. A concave groove 119 having a shape is provided.

  The concave groove 119 passes through the back electrode 116 from the front electrode 112 on the first side surface of the first multilayer piezoelectric body 114 in the piezoelectric block 101, and is on the back electronic circuit side (relay substrate 200 side) in the backing material 128. Until. The width of the concave groove 119 (the length in the direction orthogonal to the stacking direction of the piezoelectric elements of the first multilayered piezoelectric body 114) is substantially the same as the width of the wiring lead 131 or slightly longer than the width of the wiring lead 131. Formed as follows. By configuring the concave groove 119 in this way, the wiring lead 131 is accommodated in the concave groove 119 when the wiring lead 131 is disposed on the first laminated piezoelectric body 114.

  Further, the depth of the concave groove 119 (the length from the first side surface of the first laminated piezoelectric body 114 to the bottom surface of the concave groove 119) may be formed longer than the width (or diameter) of the wiring lead 131. desirable. This is because when the piezoelectric block 101 and the piezoelectric block 102 are laminated with the insulating sheet 130 interposed therebetween, the positions of the wiring lead 131, the first laminated piezoelectric body 114, and the second laminated piezoelectric body 124 with respect to the entire ultrasonic transducer 100 are determined. This is to prevent deviation. By configuring the concave groove 119 in this way, it is possible to ensure the positional accuracy of the wiring lead 131 and the positional accuracy of the laminated piezoelectric bodies (114, 124). 7A, the width (or diameter) of the wiring lead 131 is shown to be higher than the depth of the concave grooves 119 and 129. In practice, however, the wiring lead 131 is better. The shorter one is preferable. From another point of view, the wiring lead 131 is formed slightly higher than the depth of the concave grooves 119 and 129, and the piezoelectric blocks are stacked and fixed, so that the wiring lead 131 and the electrodes (112, etc.) on the side surfaces of the piezoelectric body are connected. It is also possible to make the connection stronger by making the contact closer.

  In addition, it is desirable that the concave groove 119 has a shape corresponding to the shape of the wiring lead 131. That is, with this configuration, it is possible to prevent misalignment of the laminated piezoelectric material in the direction orthogonal to the piezoelectric element lamination direction, which is likely to occur when the piezoelectric material block 101 and the piezoelectric material block 102 are laminated. Become.

  Similarly to the first side surface of the first laminated piezoelectric body 114, a concave groove 119 is also provided on the second side surface (not shown). Further, as shown in FIG. 5, the first side surface and the second side surface of the second multilayer piezoelectric body 124 in the piezoelectric body block 102 are similar to the concave groove 119 of the first multilayer piezoelectric body 114 up to the backing material 128. A concave groove 129 formed so as to reach is formed. These concave grooves 119 and 129 correspond to an example of “first concave groove” and “second concave groove” in the present invention.

  In the ultrasonic transducer according to the second embodiment, the insulation treatment between the metal thin film 170 and each electrode on the side surfaces of the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124 is configured in the same manner as in the first embodiment. It is also possible. However, in this case, the depth of each concave groove 119 is formed shallower than the depth of the grooves 111, 113, 115, and 117. Further, the depth of each concave groove 129 is shallower than the depth of the grooves 121, 123, 125, 127. This is because when the concave grooves 119 and 129 are deeper, the metal thin film 170 comes into contact with the electrodes of the laminated piezoelectric material (114 and 124) to be insulated.

(Manufacturing process)
Next, the outline of the manufacturing process of the ultrasonic transducer 100 according to the present embodiment will be described with reference to FIGS. FIG. 6A shows a state before the grooves 119 and 129 and the metal thin film 170 are formed in the piezoelectric blocks 101 and 102 in the manufacturing process of the ultrasonic transducer 100 according to the second embodiment of the present invention. It is a schematic perspective view. FIG. 6B is a schematic perspective view illustrating a process in which the concave grooves 119 and 129 are formed in the piezoelectric body blocks 101 and 102 in FIG. 6A and the metal thin film 170 is formed. FIG. 6C is a schematic perspective view showing a state in which the metal thin film 170 is formed on the piezoelectric body blocks 101 and 102 through the steps of FIGS. 6A and 6B. FIG. 6D is a schematic partially enlarged view of FIG. FIG. 7A shows a process in which the wiring lead 131 is arranged on the laminated piezoelectric material (114, 124) on which the metal thin film 170 is formed in the manufacturing process of the ultrasonic transducer 100 according to the second embodiment of the present invention. It is a schematic perspective view shown. FIG. 7B is a schematic perspective view showing the ultrasonic transducer 100 after being stacked after the piezoelectric block 101 and the piezoelectric block 102 in FIG. 7A are stacked.

  Note that the process until the piezoelectric blocks 101 and 102 are formed is the same as the manufacturing process of the ultrasonic transducer according to the first embodiment, and thus description thereof is omitted.

(Step 10)
As shown in FIG. 6B, first, the front surface of the piezoelectric body blocks 101 and 102 before the formation of the concave grooves 119 and 129 as shown in FIG. Concave grooves 119 and 129 are formed from the portion where the electrodes 112 and 122 are formed to the end of the backing material 118 and 128 opposite to the boundary portion with the laminated piezoelectric material (114 and 124). The concave grooves 119 and 129 are formed in substantially the same direction as the stacking direction of the piezoelectric elements in the stacked piezoelectric bodies (114 and 124).

(Step 11)
Next, as shown in FIG. 6B, the metal is applied to the first side surface and the second side surface of the laminated piezoelectric bodies (114, 124) in the piezoelectric body blocks 101, 102 in which the concave grooves 119, 129 are formed. A thin film 170 is formed. The piezoelectric blocks 101 and 102 are divided in a subsequent process, and constitute one row of stacked piezoelectric bodies (114 and 124) in the ultrasonic transducer 100 of a two-dimensional array.

(Step 12)
After the metal thin films 170 are formed on the first side surface and the second side surface of the first multilayer piezoelectric body 114 and the second multilayer piezoelectric body 124, respectively, as shown in FIG. The wiring leads 131 are disposed in the concave grooves 119 and 129 on the first side surface and the second side surface of the second laminated piezoelectric body 124, and each electrode (112, 122, etc.) and the wiring lead 131 are fixed by the metal thin film 170. And conducting.

(Step 13)
When the wiring leads 131 are arranged on the first side surface and the second side surface of the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124, they are laminated with the insulating sheet 130 interposed therebetween as in the first embodiment. To do. In this way, the ultrasonic transducer 100 before division as shown in FIG. 7B is formed.

(Step 14)
After the ultrasonic transducer 100 is formed, as shown in FIG. 1A, from the acoustic matching layers 110 and 120 side, the ultrasonic transducer unit 100a is parallel to the stacking direction of the ultrasonic transducer unit 100a, and the grooves 111 on the side surfaces of the piezoelectric body. The ultrasonic transducer 100 is divided in a direction orthogonal to the direction. An ultrasonic transducer 100 shown in FIG. 1A is formed by filling the dividing groove formed by the division with an insulating resin.

  Note that the connection between the ultrasonic transducer 100 and the relay substrate 200 in the second embodiment is the same as that of the ultrasonic transducer according to the first embodiment, and a description thereof will be omitted.

(Action / Effect)
Operations and effects of the ultrasonic transducer 100 according to the second embodiment described above and an ultrasonic probe (not shown) using the ultrasonic transducer 100 will be described.

  The ultrasonic transducer 100 according to the second embodiment and the ultrasonic probe 220 using the ultrasonic transducer 100 include a backing material 118 from the first side surface and the second side surface orthogonal to the front surface and the back surface of the laminated piezoelectric body (114, 124). , 128 are formed in the groove 119, 129 continuously formed. The concave grooves 119 and 129 are formed in the same direction as the stacking direction of the piezoelectric elements from the edge on the front electrode side on the first side surface, and pass through the back electrodes 116 and 126 from the edge on the front electrode 112 and 122 side. Thus, the backing materials 118 and 128 are formed so as to extend to the subsequent electronic circuit (IC205) side. Further, the depth of the concave grooves 119 and 129 is formed to be substantially the same width (or diameter) as the wiring lead 131 or slightly larger.

  Therefore, when the wiring lead 131 is disposed on the side surface of the multilayer piezoelectric body (114, 124), the wiring lead 131 is accommodated in the concave grooves 119, 129. That is, the gap between the piezoelectric blocks 101 and 102 can be greatly reduced. As a result, the side surfaces of the piezoelectric body blocks 101 and 102 can be brought into close contact or close to each other, and the situation in which the positions of the piezoelectric body blocks 101 and 102 are displaced can be prevented.

  Further, since the wiring lead 131 is accommodated in the concave grooves 119 and 129, even when a force is applied in a direction in which the piezoelectric blocks 101 and 102 are displaced, the positional deviation is avoided. It becomes possible to do. In addition, as a result of preventing such positional deviation, the positional accuracy of the piezoelectric element array in the ultrasonic transducer 100 and the positional accuracy of the wiring lead 131 are ensured, and the connection between the wiring lead 131 and the IC 205 of the relay substrate 200 becomes difficult. Can be prevented. Furthermore, it is possible to ensure the accuracy of the shape and direction of the ultrasonic beam emitted from the ultrasonic probe.

  In addition, since the ultrasonic transducer 100 of the present embodiment described above can significantly reduce the gap between the piezoelectric body blocks 101 and 102, the lamination thickness can be reduced, and the ultrasonic transducer 100 and the ultrasonic transducer 100 can be reduced. It is possible to reduce the size of an ultrasonic probe having an ultrasonic transducer.

[Third Embodiment]
Next, an ultrasonic transducer 100 according to a third embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic exploded perspective view showing the configuration of the ultrasonic transducer 100 according to the third embodiment of the present invention.

  The ultrasonic transducer 100 according to the third embodiment is manufactured by a manufacturing process different from the first embodiment and the second embodiment. Further, the configuration of the wiring lead 131 may be different. The configuration of each other part in the ultrasonic transducer 100 is the same as that of the first embodiment and the second embodiment. Hereinafter, the third embodiment will be described.

(Manufacturing process)
The manufacturing process of the ultrasonic transducer 100 according to the third embodiment is as follows. In addition, since the process of forming the piezoelectric body blocks 101 and 102 is the same as the manufacturing process of the ultrasonic transducer according to the first embodiment, the description is omitted.

  As shown in FIG. 8, in the manufacturing process of the ultrasonic transducer 100 according to the present embodiment, before the wiring leads 131 are arranged on the first side surface and the second side surface of the multilayer piezoelectric body (114, 124). In addition, one end of each of the wiring leads 131 is connected to the IC 205 of the relay substrate 200.

  Next, a metal thin film 170 is provided on the first side surface and the second side surface of the multilayer piezoelectric body (114, 124) by a method such as sputtering or vapor deposition.

  Next, with respect to the first side surface and the second side surface on which the metal thin film 170 is formed, the wiring lead 131 having one end connected to the IC 205 is connected to the first side surface and the multilayer piezoelectric body (114, 124). It arrange | positions to a 2nd side surface and the 1st side surface and 2nd side surface and wiring lead 131 in a laminated piezoelectric material (114,124) are adhere | attached by the metal thin film 170. By this adhesion, the first side surface and the second side surface and the wiring lead 131 are fixed, and the electrodes (112, 122, etc.) exposed on the first side surface and the second side surface are electrically connected to the wiring lead 131. The

  When the wiring leads 131 are arranged on the first side surface and the second side surface of the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124, they are laminated with the insulating sheet 130 interposed therebetween as in the first embodiment. To do. In this way, the ultrasonic transducer 100 before the division is formed, and further, as shown in FIG. 1A, the division grooves are formed from the acoustic matching layers 110 and 120 side, and the insulating resin is filled. An ultrasonic transducer 100 as shown in FIG. 1 (A) is formed.

  According to the method of manufacturing the ultrasonic transducer 100 in the present embodiment, the wiring leads 131 and the IC 205 are connected in advance before the piezoelectric body block 101 and the piezoelectric body block 102 are laminated, and then in the laminated piezoelectric body (114, 124). Wiring leads 131 are disposed on the first side surface and the second side surface. Therefore, in the manufacturing process of the ultrasonic transducer 100, even when the positional accuracy cannot be ensured when the piezoelectric block 101 and the piezoelectric block 102 are laminated, it is difficult to connect the wiring lead 131 and the IC 205 of the relay substrate 200. Therefore, the connection process is easy, and the connection can be reliably performed.

  In this embodiment, since the wiring lead 131 and the IC 205 are connected in advance, it is not necessary to consider a situation where the connection becomes difficult. As a result, the wiring lead 131 may not have flexibility, and the rear end portion of the wiring lead 131 may be fixed to the insulating sheet 130.

  In the present embodiment, the wiring leads 131 are disposed on the first side surface and the second side surface of the multilayer piezoelectric body (114, 124). However, the present invention is not limited to this, and as shown in FIG. You may use the printed circuit board 330 in which the wiring pattern 331 was formed. That is, the piezoelectric body blocks 101 and 102 may be arranged on the front and back surfaces of the printed circuit board 330 after the IC 205 and the wiring pattern 331 in the relay board 200 are connected in advance.

(A) It is a schematic perspective view which shows the state which looked at the ultrasonic transducer concerning 1st Embodiment of this invention from the side. (B) It is a schematic exploded perspective view which shows the structure of the ultrasonic transducer unit which comprises the ultrasonic transducer concerning 1st Embodiment of this invention. It is an example of the connection method of an ultrasonic transducer, The mechanism which connects the ultrasonic transducer and relay board in this embodiment, and the mechanism which connects IC on a relay board, and the cable connected to an ultrasonic diagnostic apparatus main body It is a schematic perspective view shown. (A) It is a schematic perspective view which shows the process in which a metal thin film is formed in a piezoelectric body block in the manufacturing process of the ultrasonic transducer | vibrator concerning 1st Embodiment of this invention. (B) It is a schematic perspective view which shows the state in which the metal thin film was formed in the side surface of the piezoelectric material block of FIG. 3 (A). (C) It is a schematic perspective view which shows the state in which the groove | channel was formed in the side surface of the piezoelectric material block of FIG.3 (B). (D) It is a general | schematic fragmentary enlarged view of FIG.3 (C). (A) It is a schematic perspective view which shows the process in which the piezoelectric material block of FIG. 2 (B) is arrange | positioned on a printed circuit board. FIG. 3B is a schematic perspective view illustrating the ultrasonic transducer before being divided after the ultrasonic transducer units in FIG. (A) It is a schematic perspective view which shows the process of arrange | positioning a wiring lead on the side surface of a piezoelectric material block. FIG. 4B is a schematic perspective view showing the ultrasonic transducer before being divided after the piezoelectric blocks in FIG. It is a schematic exploded perspective view which shows the structure of the ultrasonic transducer unit which comprises the ultrasonic transducer concerning 2nd Embodiment of this invention. (A) In the manufacturing process of the ultrasonic transducer | vibrator concerning 2nd Embodiment of this invention, it is a schematic perspective view which shows the state before a ditch | groove and a metal thin film are formed in a piezoelectric material block. (B) It is a schematic perspective view which shows the process in which a ditch | groove is formed with respect to the piezoelectric material block of FIG. 6 (A), and a metal thin film is formed. (C) It is a schematic perspective view which shows the state by which the metal thin film was formed in the piezoelectric body block through the process of FIG. 6 (A), (B). (D) It is a schematic partial enlarged view of FIG. 6 (C). (A) In a manufacturing process of an ultrasonic transducer concerning a 2nd embodiment of this invention, it is a schematic perspective view showing a process in which a wiring lead is arranged in a lamination piezoelectric material in which a metal thin film was formed. FIG. 8B is a schematic perspective view showing the ultrasonic transducer before being divided after the piezoelectric blocks in FIG. It is a schematic exploded perspective view which shows the structure of the ultrasonic transducer concerning 3rd Embodiment of this invention. (A) It is a schematic perspective view which shows the state which looked at the ultrasonic transducer of the two-dimensional array from the side. FIG. 10B is a schematic exploded perspective view showing the configuration of the ultrasonic transducer unit before division that constitutes the ultrasonic transducer of FIG.

Explanation of symbols

100 Ultrasonic Transducer 100a Ultrasonic Transducer Unit 101, 102 Piezoelectric Block 110, 120 Acoustic Matching Layer 111, 113, 115, 117, 121, 123, 125, 127 Groove 112, 122 Front Electrode 112a, 122a First Internal Electrode 114 First laminated piezoelectric material 124 Second laminated piezoelectric material 116, 126 Back electrode 116a, 126a Second internal electrode 118, 128 Backing material 119, 129 Concave groove 130 Insulating sheet 131 Wiring lead 170 Metal thin film 200 Relay substrate 210 Cable connection substrate 211 Connector 220 Ultrasonic probe

Claims (12)

Electrodes are provided on the front surface on the ultrasonic radiation direction side and the back surface opposite to the front surface, and a plurality of piezoelectric bodies arranged two-dimensionally in a direction orthogonal to the radiation direction;
A substrate provided with an electronic circuit for transmitting at least an electric signal applied to the piezoelectric body;
A flexible linear wiring lead that is electrically connected to the electronic circuit and is electrically connected to at least one of the electrodes by being disposed on a side surface orthogonal to the front surface and the back surface of the piezoelectric body. And an ultrasonic transducer. The wiring lead is constituted by a wire having a substantially circular or polygonal cross section;
The ultrasonic transducer according to claim 1. A conductive thin film is formed on the side surface, and the wiring lead and the electrode in the piezoelectric body are connected via the conductive thin film on the side surface;
The ultrasonic transducer according to claim 1. On the side surface, a groove is formed from an electrode-side edge provided on the front surface toward an electrode-side edge provided on the back surface, and the wiring lead is along the groove. And being accommodated in the concave groove so as to be directed from the electrode toward the electronic circuit,
The ultrasonic transducer according to claim 1. The width of the cross section of the wiring lead is shorter than the depth of the concave groove,
The ultrasonic transducer according to claim 4. Forming a two-dimensional array of the piezoelectric bodies by stacking one row of the piezoelectric bodies in which the piezoelectric bodies are arranged in parallel in a direction perpendicular to the radiation direction via an insulating sheet;
The ultrasonic transducer according to claim 1 or 4. A front electrode is formed on the front surface in the ultrasonic radiation direction side, a back electrode is formed on the back surface on the opposite side, and the back electrode is formed from an edge on the front electrode side on the front surface and a first side surface orthogonal to the back surface. A first concave groove formed toward the side edge, and on the second side opposite to the first side, from the edge on the front electrode side toward the edge on the back electrode side. A plurality of piezoelectric bodies having a second concave groove formed and arranged two-dimensionally in a direction orthogonal to the radial direction;
An electronic circuit that transmits an electric signal to be applied to the piezoelectric body and processes the electric signal from the piezoelectric body is formed, and is arranged for each row of the piezoelectric body array that is two-dimensionally arranged on the back side. A substrate,
By being electrically connected to the electronic circuit and accommodated in the first concave groove of the piezoelectric body and coupled directly or indirectly to one of the front electrode or the back electrode of the piezoelectric body, at least one of them A first electrode lead that is conductive and flexible and has a linear shape;
Directly or indirectly with the electrode that is housed in the second concave groove of the piezoelectric body and that is not coupled to the first electrode lead among the front electrode or the back electrode of the second piezoelectric body. A plurality of second electrode leads that are electrically connected to each other and are flexible and have a linear shape;
Ultrasonic transducer characterized by. Each of the piezoelectric bodies is a laminated piezoelectric body in which a plurality of piezoelectric bodies are stacked in the direction from the front surface to the back surface, and an internal electrode is formed between each of the stacked piezoelectric bodies. Yes,
At least one of the first electrode lead and the second electrode lead is electrically connected to the internal electrode;
The ultrasonic transducer according to claim 7. Each of the first electrode leads housed in the first concave grooves of one row of the piezoelectric bodies of the two-dimensionally arranged piezoelectric bodies has only the same type of electrodes of the front electrode and the back electrode. Being combined,
The ultrasonic transducer according to claim 7. A conductive thin film is formed in the first concave groove and the second concave groove, and the first electrode lead and the front electrode in the piezoelectric body through the conductive thin film in the first concave groove Alternatively, the back electrode is connected, and the second electrode lead and the front electrode or the back electrode in the piezoelectric body are connected via a conductive thin film in the second concave groove,
The ultrasonic transducer according to claim 7. A plurality of piezoelectric bodies having electrodes, and an electronic circuit for transmitting an electric signal applied to the piezoelectric bodies;
A method of manufacturing an ultrasonic transducer having
A wiring lead that has flexibility and is linear, and connects the electronic circuit and the electrode of the piezoelectric body to the electronic circuit ; and
Disposing the wiring lead connected to the electronic circuit on each side surface of the piezoelectric body, and connecting the electrode exposed to the side surface and the wiring lead;
Each of the piezoelectric bodies in which the wiring leads are arranged on the side surfaces, and arranged in parallel to stack the rows of piezoelectric bodies in a direction perpendicular to the ultrasonic radiation direction in the same direction,
A method of manufacturing an ultrasonic transducer characterized by the above. A front electrode is formed on the front surface in the ultrasonic radiation direction side, a back electrode is formed on the back surface on the opposite side, and the back electrode is formed from an edge on the front electrode side on the front surface and a first side surface orthogonal to the back surface. A first concave groove formed toward the side edge, and on the second side opposite to the first side, from the edge on the front electrode side toward the edge on the back electrode side. A plurality of piezoelectric bodies having a second concave groove formed and arranged two-dimensionally in a direction orthogonal to the radial direction;
An electronic circuit for transmitting an electric signal to be applied to the piezoelectric body and processing the electric signal from the piezoelectric body is formed, and a substrate disposed for each row on the back side according to the arrangement of the piezoelectric body;
By being electrically connected to the electronic circuit and housed in the first concave groove of the piezoelectric body and coupled directly or indirectly to one of the front electrode or the back electrode of the piezoelectric body, at least one of them A first electrode lead that is conductive and flexible and has a linear shape;
Directly or indirectly with the electrode that is housed in the second concave groove of the piezoelectric body and that is not coupled to the first electrode lead among the front electrode or the back electrode of the second piezoelectric body. A plurality of second electrode leads that are conductive and flexible and have a linear shape by being coupled;
An ultrasonic transducer provided with
Ultrasonic probe characterized by.