WO2020073616A1

WO2020073616A1 - Heat exchanger, air conditioner, and refrigeration device

Info

Publication number: WO2020073616A1
Application number: PCT/CN2019/078858
Authority: WO
Inventors: 尚秀玲; 黎海华; 王新雷
Original assignee: 广东美的制冷设备有限公司; 美的集团股份有限公司
Priority date: 2018-06-05
Filing date: 2019-03-20
Publication date: 2020-04-16
Also published as: CN208920558U; CN208920559U

Abstract

A heat exchanger, an air conditioner, and a refrigeration device. The heat exchanger comprises: a plurality of fins (10) arranged side by side; a heat conduction tube (20) passing through the plurality of fins (10); and a heat conduction medium (30) disposed between and in contact with the fins (10) and the heat conduction tube (20), wherein the thermal conductivity coefficient of the heat conduction medium (30) is greater than that of air.

Description

Heat exchangers, air conditioners and refrigeration equipment

Priority information

This application requests the priority and rights of the patent application with the patent application number 201821643713.X filed with the State Intellectual Property Office of China on October 10, 2018, and the full text of which is hereby incorporated by reference.

Technical field

The present disclosure relates to the technical field of heat exchangers, and in particular, to heat exchangers, air conditioners and refrigeration equipment.

Background technique

At present, the most used heat exchangers are tube-fin type. After overlapping multiple layers of fins, they penetrate into copper tubes. In order to reduce the corrosion rate of fins and extend their service life, organic coatings are usually applied to the fins. Using more polyurethane coating, polyacrylate and epoxy resin coating as an example, the thermal conductivity of polyester is about 0.018 ～ 0.048W / m · K, and the thermal conductivity of epoxy resin is 0.15 ～ 0.20W / m · K The thermal conductivity of aluminum foil fins can reach 203.5W / m · K, so the low thermal conductivity of the organic coating makes the heat transfer efficiency between the fins and the organic coating low, further restricting the overall heat exchanger Heat exchange efficiency.

In addition, the copper tube and the fin are expanded through the copper tube to achieve contact between the two, but the copper tube and the fin cannot be in full contact, and the thermal conductivity of the copper copper tube is 383.8W / m · K, commonly used aluminum foil fin The thermal conductivity of is about 203.5W / m · K, and the thermal conductivity of air is about 0.0262W / m · K. It can be seen from the above parameters that the thermal conductivity of air is significantly lower than that of the other two metal materials, between the copper tube and the fin The existence of a part of the gap (air) will reduce the heat exchange efficiency between the copper tube and the fins. Fin heat dissipation has become a key factor restricting the heat exchange efficiency of the heat exchanger, which affects the performance of the whole machine.

Therefore, the research on improving the heat exchange efficiency of the heat exchanger needs to be deepened.

Public content

The present disclosure aims to solve one of the technical problems in the related art at least to some extent. For this reason, an object of the present disclosure is to propose a heat exchanger having the advantages of high heat exchange efficiency, strong corrosion resistance, or long service life.

In one aspect of the disclosure, the disclosure provides a heat exchanger. According to an embodiment of the present disclosure, the heat exchanger includes: a plurality of fins, the plurality of fins are arranged side by side; a heat conduction tube, the heat conduction tube is passed through the plurality of fins; an organic coating, The organic coating is provided on an outer surface of at least a portion of at least one of the fins, the organic coating includes a coating base and a thermally conductive powder dispersed in the coating base, wherein the thermally conductive powder The thermal conductivity of the body is greater than the thermal conductivity of the coated substrate. Thus, the addition of thermally conductive powder with a larger thermal conductivity can greatly increase the thermal conductivity of the organic coating, improve the heat exchange efficiency between the fins and the air, and thus improve the heat exchange efficiency of the heat exchanger.

Optionally, the shape of the thermally conductive powder is at least one selected from the group consisting of spherical, strip, needle, flat, and lamellar. Thus, the selectivity of the thermally conductive powder is wide.

According to an embodiment of the present disclosure, the largest dimension of the thermally conductive powder in the direction perpendicular to the surface of the organic coating is less than 80% of the thickness of the coating substrate. Thus, not only can the effect of increasing the thermal conductivity of the organic coating be achieved, but also the coating has good corrosion resistance.

According to an embodiment of the present disclosure, the size of the thermally conductive powder is 1 nm-5000 nm. In this way, not only can the thermal conductivity of the organic coating be greatly improved, the heat exchange efficiency between the fin and the air can be maximized, but also the corrosion resistance of the coating substrate can be maintained to the greatest extent, and the fin can be slowed down. Corrosion rate, which in turn ensures that the fins have a long service life.

According to an embodiment of the present disclosure, the thermally conductive powder is selected from boron nitride, graphene, aluminum oxide, or silicon carbide. As a result, the heat exchange efficiency between the fins and the air can be improved, thereby improving the heat exchange efficiency of the entire heat exchanger.

According to an embodiment of the present disclosure, based on the volume of the organic coating, the volume ratio of the thermally conductive powder is 0.5% to 30%. Thus, not only can the heat exchange efficiency between the fins and the air be better improved, but also the coating substrate can be maintained with better corrosion resistance, and the fins can have a longer service life.

According to an embodiment of the present disclosure, the heat exchanger further includes a heat conductive medium, the heat conductive medium is disposed between the fin and the heat pipe, and is in contact with the fin and the heat pipe, and The thermal conductivity of the thermally conductive medium is greater than that of air. Therefore, the air gap between the fin and the heat pipe can be effectively avoided, and the air gap between the fin and the heat pipe can be replaced by a heat transfer medium with a thermal conductivity greater than air, which can significantly reduce the thermal resistance between the heat pipe and the fin To further increase the heat exchange efficiency of the heat exchanger.

According to an embodiment of the present disclosure, the thermally conductive medium is thermally conductive adhesive. In this way, the thermally conductive adhesive not only has good thermal conductivity, but also is relatively easy to cure and mold, and will not adversely affect the corrosion resistance of the thermally conductive tube and the fins.

According to an embodiment of the present disclosure, thermally conductive particles are dispersed in the thermally conductive medium. As a result, the thermally conductive particles form a thermally conductive channel in the thermally conductive medium, which can further increase the thermal conductivity of the thermally conductive medium and further reduce the thermal resistance between the thermally conductive tube and the fins, that is, improve the heat transfer efficiency between the thermally conductive tube and the fins, This improves the overall heat exchange efficiency of the heat exchanger.

According to an embodiment of the present disclosure, the thermally conductive particles are selected from boron nitride, graphene, aluminum oxide, or silicon carbide. Thus, the thermally conductive particles have better thermal conductivity.

According to an embodiment of the present disclosure, the particle diameter of the thermally conductive particles is 1 nanometer to 100 micrometers. Thus, the purpose of improving the heat exchange efficiency can be better achieved.

According to an embodiment of the present disclosure, the particle diameters of the thermally conductive particles dispersed in the thermally conductive medium are unevenly set. In this way, it is more conducive to improving the thermal conductivity of the heat-conducting medium and better reducing the thermal resistance between the heat-conducting tube and the fins.

According to an embodiment of the present disclosure, based on the total volume of the heat conductive medium and the heat conductive particles, the volume ratio of the heat conductive particles is 20% to 90%. In this way, not only can the thermal resistance of the heat pipe and the fins be better reduced, but also the heat conductive medium can be guaranteed to have a certain strength, which is convenient for processing.

In another aspect of the present disclosure, the present disclosure provides an air conditioner. According to an embodiment of the present disclosure, the air conditioner includes the aforementioned heat exchanger. Therefore, the heat exchanger of the air conditioner has a higher heat exchange efficiency, which can improve the performance of the whole machine. In addition, the air conditioner has all the features and advantages of the heat exchanger described above, which will not be repeated here. .

In yet another aspect of the present disclosure, the present disclosure provides a refrigeration device. According to an embodiment of the present disclosure, the refrigeration equipment includes the aforementioned heat exchanger. As a result, the heat exchanger of the refrigeration equipment has a higher heat exchange efficiency, which can improve the performance of the refrigeration equipment. In addition, the refrigeration equipment has all the features and advantages of the heat exchanger described above, no longer one by one here Repeat.

BRIEF DESCRIPTION

FIG. 1 is a schematic structural diagram of a heat exchanger in an embodiment of the present disclosure.

FIG. 2 is a schematic structural diagram of an organic coating in still another embodiment of the present disclosure.

FIG. 3 is a schematic structural diagram of a heat exchanger in another embodiment of the present disclosure.

4 is a schematic diagram of a partial cross-sectional structure of a heat exchanger in another embodiment of the present disclosure.

Fig. 5 is a left side view of the structure of the heat exchanger in Fig. 4.

6 is a schematic diagram of a partial cross-sectional structure of a heat exchanger in another embodiment of the present disclosure.

Reference mark:

10-fin; 20-heat pipe; 30-thermal medium; 40-organic coating; 41-coating substrate; 42-thermally conductive powder

detailed description

The embodiments of the present disclosure are described in detail below. The embodiments described below are exemplary only for explaining the present disclosure, and should not be construed as limiting the present disclosure. If no specific technology or conditions are indicated in the examples, the technology or conditions described in the literature in the art or the product specification shall be followed. The reagents or instruments used do not indicate the manufacturer, and are all conventional products that are commercially available.

In one aspect of the disclosure, the disclosure provides a heat exchanger. According to an embodiment of the present disclosure, referring to FIGS. 1 and 2, the heat exchanger includes: a plurality of fins 10, the plurality of fins 10 are arranged side by side; a heat pipe 20, and the heat pipe 20 is penetrated through the plurality of fins 10 Medium; organic coating 40, organic coating 40 is disposed on at least a portion of the outer surface of at least a portion of the fin 10, the organic coating 40 includes a coating substrate 41 and a thermally conductive powder 42 dispersed in the coating substrate 41, wherein The thermal conductivity of the thermally conductive powder 42 is greater than the thermal conductivity of the coating substrate 41. Thus, the addition of thermally conductive powder with a larger thermal conductivity can greatly increase the thermal conductivity of the organic coating, improve the heat exchange efficiency between the fins and the air, and thus improve the heat exchange efficiency of the heat exchanger.

According to the embodiments of the present disclosure, the materials for forming the fins and the heat pipe are not limited, and those skilled in the art can flexibly choose according to the actual situation. In some embodiments of the present disclosure, the materials forming the fins include but are not limited to aluminum, red copper (such as TP2), oxygen-free copper and other materials with high thermal conductivity. When oxygen-free copper is used, due to impurities in the oxygen-free copper The lower content makes the fins not only have a higher heat transfer coefficient, thereby improving the heat exchange efficiency of the heat exchanger, but also have better corrosion resistance. In some embodiments of the present disclosure, the materials forming the heat pipe include but are not limited to materials with high thermal conductivity such as red copper and oxygen-free copper. When oxygen-free copper is used, due to the low impurity content in oxygen-free copper, not only can Improve the heat exchange efficiency of the heat exchanger, and also have better corrosion resistance.

It should be noted that “organic coating is provided on the outer surface of at least a part of at least one fin” herein means that the organic coating can be provided on a part of the outer surface of the fin, as shown in FIG. 1, the organic coating 40 is provided Of course, on one surface of the fin 10, the organic coating 40 can also be provided on both surfaces of the fin 10 (see FIG. 3). The arrangement of 40 on both surfaces of the fin 10 can further improve the heat exchange efficiency between the fin and the air.

According to an embodiment of the present disclosure, in order to reduce the corrosion rate of the fins and prolong their service life, the material forming the coating substrate is at least one selected from polyurethane, polyacrylate, or epoxy resin. Therefore, the coating substrate formed by the above materials can well reduce the corrosion rate of the fins, both improve the corrosion resistance of the fins and prolong their service life; in some embodiments of the present disclosure, the thickness of the coating substrate is 0.5 to 3 microns, and the above-mentioned thickness of the coating substrate can not only achieve the technical effect of protecting the fins and reducing the corrosion rate, but also will not seriously affect the heat exchange efficiency between the fins and the air due to excessive thickness.

According to an embodiment of the present disclosure, the shape of the thermally conductive powder is selected from at least one of spherical shape, strip shape, needle shape, flat shape, and lamellar shape. Therefore, the thermal conductive powder has wide selectivity and strong practicability, and can further improve the market competitiveness of the heat exchanger.

According to the embodiments of the present disclosure, due to the limitation of the adhesion between the coating substrate and the thermally conductive powder, the size of the thermally conductive powder is too large, so that the solution easily penetrates along the edge of the thermally conductive powder, which is detrimental to corrosion resistance. Therefore, in some embodiments of the present disclosure, the maximum size of the thermally conductive powder in the direction perpendicular to the surface of the organic coating is less than 80% of the thickness of the coating substrate, thus, the effect of improving the thermal conductivity of the organic coating can be achieved, and Can keep the coating with good corrosion resistance. In some embodiments of the present disclosure, in order to maintain better corrosion resistance of the coating substrate, the size of the thermally conductive powder is 1 nm-5000 nm, such as 1 nm, 100 nm, 500 nm, 1000 nm, 1500 nm, 2000 Nanometer, 250 nanometer, 3000 nanometer, 3500 nanometer, 4000 nanometer, 4500 nanometer or 5000 nanometer. In this way, not only can the thermal conductivity of the organic coating be greatly improved, the heat exchange efficiency between the fin and the air can be maximized, but also the corrosion resistance of the coating substrate can be maintained to the greatest extent, and the fin can be slowed down. Corrosion rate, which in turn ensures that the fins have a long service life.

According to the embodiments of the present disclosure, there is no limit to the specific type of thermally conductive powder, and those skilled in the art can flexibly choose according to the actual situation. In an embodiment of the present disclosure, the thermally conductive powder is selected from boron nitride, graphene, aluminum oxide, or silicon carbide. Thereby, the heat exchange efficiency between the fins and the air can be well improved, thereby improving the heat exchange efficiency of the whole heat exchanger. In the preferred embodiment of the present disclosure, as described above, when the size of the thermally conductive powder is controlled within the range of 1 nanometer to 5000 nanometers, good corrosion resistance of the coating substrate can be ensured, so in order to facilitate the thermal conductive powder The size is processed to the range of 1 nanometer to 5000 nanometers, the thermally conductive powder is boron nitride or graphene, so it is convenient for the thermally conductive powder to be processed into nano-scale thermally conductive powder. There are no restrictions on the specific forms of boron nitride, graphene, aluminum oxide or silicon carbide. Those skilled in the art can flexibly select the form of the thermally conductive powder according to actual needs, and there is no limit requirement here.

According to the embodiments of the present disclosure, in order to ensure the corrosion resistance of the coating substrate on the premise of improving the thermal conductivity of the organic coating, based on the volume of the organic coating (skilled persons in the art can understand that "the volume of the organic coating here "Refers to the volume after the organic coating is formed, does not refer to the organic coating on which the coating solution forming the organic coating is applied to the fins before forming), the volume ratio of the thermally conductive powder is 0.5% to 30% For example, 0.5%, 1%, 5%, 10%, 15%, 20%, 25% or 30%. In this way, not only can the heat exchange efficiency between the fins and the air be better improved, but also the coating substrate can be maintained with better corrosion resistance and the fins can have a longer service life; if the volume of the thermally conductive powder The ratio is less than 0.5%, compared with the coating substrate without adding thermal powder, it can still improve the thermal conductivity of the organic coating, but the improvement effect is not obvious; if the volume ratio of thermal powder is higher than 30%, it can be greatly improved The thermal conductivity of organic coatings, but due to the large proportion of thermally conductive powder added, it will seriously affect the corrosion resistance of the coating substrate, which will increase the corrosion rate of the fins and shorten their service life.

According to the embodiments of the present disclosure, based on the specific type, particle size and addition amount (volume ratio of thermally conductive powder) of the aforementioned thermal conductive powder, the specific type and particle size (different particle size) of the thermal conductive powder can be adjusted Combined use of thermally conductive powders can achieve better thermal conductivity) and the amount of addition (volume ratio of thermally conductive powders) to comprehensively adjust the thermal conductivity of the organic coating, so that the organic coating has an increased thermal conductivity of 2 compared to the coating substrate % ～ 10%, so the heat exchange efficiency between the fins and the air can be greatly improved, thereby improving the overall heat exchange efficiency of the heat exchanger.

According to an embodiment of the present disclosure, referring to FIG. 4 (the organic coating 40 is not shown in the figure) and FIG. 5, the heat exchanger further includes a heat conductive medium 30 disposed between the fin 10 and the heat pipe 20 It is in contact with the fins 10 and the heat pipe 20, and the thermal conductivity of the thermally conductive medium is greater than that of air. Therefore, the air gap between the fin and the heat pipe can be effectively avoided, and the air gap between the fin and the heat pipe can be replaced by a heat transfer medium with a thermal conductivity greater than air, which can significantly reduce the thermal resistance between the heat pipe and the fin To further increase the heat exchange efficiency of the heat exchanger.

According to the embodiment of the present disclosure, the heat conductive medium 30 only needs to be disposed between the fin 10 and the heat pipe 20 and in contact with the fin 10 and the heat pipe 20, and a specific setting method can be flexible for those skilled in the art according to actual needs select. In some embodiments of the present disclosure, referring to FIG. 4, the heat-conducting medium is only provided in the region corresponding to the fin 10 and the heat-conducting tube 20, and the heat-conducting medium 30 is not provided on the outer surface of the heat-conducting tube 20 corresponding to the fin 10, or That is to say, the heat conducting medium 30 is only provided at the through holes of the fins 10 through which the heat conducting tube 20 passes, so that the amount of heat conducting medium can be saved; in other embodiments of the present disclosure, in order to facilitate the application of the heat conducting medium, the saving In the coating process, referring to FIG. 6, the heat transfer medium can be coated on the entire outer surface of the heat pipe (that is, the heat transfer medium is provided on the entire outer surface of the heat pipe), and the heat transfer medium is in contact with the fins. The heat-conducting medium is easy to implement and easy to operate, and it is also convenient for the heat-conducting tube to pass through the fins when manufacturing the heat exchanger.

In order to ensure that the thermally conductive medium has a good thermal conductivity coefficient and prevent the thermally conductive medium from adversely affecting the corrosion resistance of the thermally conductive tube and the fins, according to an embodiment of the present disclosure, the thermally conductive medium is selected as the thermally conductive adhesive. In this way, the thermally conductive adhesive not only has good thermal conductivity, but also is relatively easy to cure and mold, and will not adversely affect the corrosion resistance of the thermally conductive tube and the fins. In some specific embodiments of the present disclosure, the thermally conductive adhesive is thermally conductive silicone rubber or a curable organic adhesive that is environmentally friendly and non-corrosive to the thermally conductive tubes and fins. In this way, it is possible to ensure that the heat transfer medium has good thermal conductivity, thereby reducing the thermal resistance between the heat transfer tube and the fins, thereby improving the heat exchange efficiency of the heat exchanger, and also ensuring that the heat transfer medium has no effect on the heat transfer tubes and fins Corrosion, which in turn guarantees a long service life of the heat exchanger.

According to an embodiment of the present disclosure, in order to further improve the thermal conductivity of the thermally conductive medium, thermally conductive particles are dispersed in the thermally conductive medium. As a result, the thermally conductive particles form a thermally conductive channel in the thermally conductive medium, which can further increase the thermal conductivity of the thermally conductive medium and further reduce the thermal resistance between the thermally conductive tube and the fins, that is, the heat transfer efficiency between the thermally conductive tube and the fins This improves the overall heat exchange efficiency of the heat exchanger.

According to the embodiments of the present disclosure, there is no limit to the specific types of thermally conductive particles, and those skilled in the art can flexibly choose according to actual needs. In an embodiment of the present disclosure, the thermally conductive particles are selected from boron nitride, graphene, aluminum oxide, or silicon carbide. Thus, the thermally conductive particles have better thermal conductivity. In some embodiments of the present disclosure, in order to avoid contact corrosion between the heat pipe and the dissimilar metal (other than the metal with the heat pipe), the heat conductive particles are selected to be non-conductive heat conductive particles such as alumina or boron nitride. Thus, the problem of contact corrosion between the heat pipe and the dissimilar metal can be avoided. There are no restrictions on the specific forms of boron nitride, graphene, aluminum oxide or silicon carbide. Those skilled in the art can flexibly select the form of the thermally conductive powder according to actual needs, and there is no limit requirement here.

According to the embodiments of the present disclosure, the specific particle size of the thermally conductive particles has no limit requirements, and those skilled in the art can flexibly set according to actual needs. In some embodiments of the present disclosure, the particle size of the thermally conductive particles is 1 nanometer to 100 micrometers. Adding the thermally conductive particles within this size range to the thermally conductive medium can better achieve the purpose of improving heat exchange efficiency. If it is large, the distance between the heat transfer tube and the fins will become larger, the thickness of the heat transfer medium between the heat transfer tubes and the fins will increase, which is not conducive to the improvement of the heat transfer efficiency. Specifically, the particle size of the thermally conductive particles may be 50 nanometers, 100 nanometers, 500 nanometers, 800 nanometers, 1 micrometer, 10 micrometers, 50 micrometers, or 100 micrometers. In some embodiments of the present disclosure, the particle diameter of the thermally conductive particles dispersed in the thermally conductive medium is unevenly set, that is, the particle size of the thermally conductive particles is uneven, and the use of thermally conductive particles of different particle sizes can make the thermally conductive particles pile up more closely. More heat transfer channels are formed, which is more conducive to improving the thermal conductivity of the heat transfer medium and better reducing the thermal resistance between the heat transfer tube and the fins.

According to the embodiments of the present disclosure, in order to ensure that the thermally conductive medium has better mechanical properties on the basis of ensuring better thermal conductivity, based on the total volume of the thermally conductive adhesive and thermally conductive particles, the volume ratio of the thermally conductive particles is 20% ~ 90%, such as 20%, 30%, 40%, 50%, 60%, 70%, 80% or 90%. In this way, not only can the thermal resistance of the heat pipe and the fins be better reduced, but also the heat conductive medium can be guaranteed to have a certain strength, which is easy to process; if the volume ratio of the heat conductive particles is less than 20%, it is still better than without adding heat conductive particles It can improve the thermal conductivity of the thermally conductive medium, but the improvement effect is not obvious; if the volume ratio of the thermally conductive particles is higher than 90%, although the thermal conductivity of the thermally conductive medium can be greatly improved and the thermal resistance between the thermally conductive tube and the fins can be reduced, the The large proportion of particles added will seriously affect the strength of the heat transfer medium, which will not be conducive to the processing and coating of the heat transfer medium, which will affect the working life of the heat transfer medium.

According to the embodiments of the present disclosure, based on the specific types, particle sizes, and addition amount (volume ratio of thermally conductive particles) of the thermally conductive particles described above, the thermal conductivity medium can be comprehensively adjusted by adjusting the specific types, particle sizes, and addition amounts of the thermally conductive particles Thermal conductivity, the thermal conductivity of the resulting thermal medium is 1.3 ~ 3.0W / m · K, thus, compared with air (the thermal conductivity of air is about 0.0262W / m · K), the thermal conductivity is greatly improved, so it can be greatly The thermal resistance between the heat pipe and the fins is reduced, thereby improving the exchange efficiency of the heat exchanger very well.

According to an embodiment of the present disclosure, by providing a heat transfer medium between the heat pipe and the fins, and providing an organic coating on the surface of the fins, the heat exchange efficiency of the heat exchanger can be increased by 2% to 10%.

Those skilled in the art can understand that the above air conditioner includes the necessary structure or components of the air conditioner in addition to the heat exchanger described above, such as a compressor, a throttle assembly, a four-way valve, a muffler, a capillary tube, a transition tube, Structures or components necessary for air conditioning such as refrigerant pipes or casings.

According to the embodiments of the present disclosure, there is no limit requirement for the specific kind of refrigeration equipment, and those skilled in the art can flexibly choose according to the actual situation. In some embodiments of the present disclosure, the refrigeration equipment includes: a refrigerator, a freezer, an ice maker, and the like.

Examples

Example 1

A heat exchanger is provided. The heat exchanger includes a plurality of fins arranged side by side and a heat conducting tube disposed in the plurality of fins, wherein an organic coating containing thermally conductive powder is provided on the outer surface of the fins, wherein the heat The powder is graphene, the size of the graphene is 100nm-500nm, the volume ratio of the graphene is 0.5%; there is a thermally conductive glue containing no thermally conductive particles between the heat pipe and the fins, and the above heat exchanger is arranged in the air conditioner The rated cooling capacity of the air conditioner is 3598W.

Example 2

A heat exchanger is provided. The heat exchanger includes a plurality of fins arranged side by side and a heat conducting tube disposed in the plurality of fins, wherein an organic coating containing thermally conductive powder is provided on the outer surface of the fins, wherein the heat The powder is graphene, the size of the graphene is 100nm-500nm, the volume ratio of the graphene is 0.5%; there is a thermally conductive glue containing thermally conductive particles between the thermally conductive tube and the fins, and the thermally conductive particles are between 1nm and 500nm in diameter The volume of the alumina particles between them accounts for 80% of the total volume of the thermally conductive adhesive and the thermally conductive particles. The heat exchanger is arranged in an air conditioner with a rated cooling capacity of 3640W.

Comparative Example 1

A heat exchanger is provided. The heat exchanger includes a plurality of fins arranged side by side and a heat conduction tube penetrating the plurality of fins, wherein the outer surface of the fins is provided with a coating base body without heat conductive powder, which conducts heat No heat-conducting glue is provided between the tube and the fins. The heat exchanger is arranged in an air conditioner with a rated cooling capacity of 3393W.

Comparative Example 2

A heat exchanger is provided. The heat exchanger includes a plurality of fins arranged side by side and a heat conduction tube penetrating the plurality of fins, wherein the outer surface of the fins is provided with a coating base body without heat conductive powder, which conducts heat Between the tube and the fins, there is a thermally conductive adhesive that does not contain thermally conductive particles, and the above heat exchanger is arranged in an air conditioner whose rated cooling capacity is 3471W.

Comparative Example 3

A heat exchanger is provided. The heat exchanger includes a plurality of fins arranged side by side and a heat conduction tube penetrating the plurality of fins, wherein the outer surface of the fins is provided with a coating base body without heat conductive powder, which conducts heat A thermally conductive glue containing thermally conductive particles is arranged between the tube and the fins. The thermally conductive particles are alumina particles with a particle size between 1 nm and 500 nm, and their volume accounts for 80% of the total volume of the thermally conductive glue and thermally conductive particles. The heat exchanger is arranged in an air conditioner with a rated cooling capacity of 3523W.

Table 1 Heat exchange efficiency improvement rate of heat exchangers in Examples 1-2 and Comparative Examples 1-3

The calculation method of the heat exchange efficiency improvement rate is: (rated cooling capacity of each embodiment and Comparative Example 2-3-rated cooling capacity of Comparative Example 1) / rated cooling capacity of Comparative Example 1.

In the description of this specification, the description referring to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means specific features described in conjunction with the embodiment or examples , Structure, material or characteristic is included in at least one embodiment or example of the present disclosure. In this specification, the schematic expression of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, without contradicting each other, those skilled in the art may combine and combine different embodiments or examples and features of the different embodiments or examples described in this specification.

Although the embodiments of the present disclosure have been shown and described above, it should be understood that the above-mentioned embodiments are exemplary and cannot be construed as limitations to the present disclosure, and those of ordinary skill in the art may understand the above within the scope of the present disclosure The embodiments are changed, modified, replaced, and modified.

Claims

A heat exchanger, characterized in that it includes:

Multiple fins, the multiple fins are arranged side by side;

A heat pipe, the heat pipe is penetrated in the plurality of fins;

An organic coating provided on at least a part of the outer surface of at least a part of the fins, the organic coating including a coating base and a thermally conductive powder dispersed in the coating base, wherein, The thermal conductivity of the thermally conductive powder is greater than the thermal conductivity of the coating substrate.
The heat exchanger according to claim 1, wherein the shape of the thermally conductive powder is at least one selected from the group consisting of spherical, strip, needle, flat, and lamellar.
The heat exchanger according to claim 1 or 2, wherein the largest dimension of the thermally conductive powder in the direction perpendicular to the surface of the organic coating is less than 80% of the thickness of the coating substrate.
The heat exchanger according to any one of claims 1 to 3, wherein the size of the thermally conductive powder is 1 nanometer to 5000 nanometers.
The heat exchanger according to any one of claims 1 to 4, wherein the thermally conductive powder is selected from boron nitride, graphene, aluminum oxide, or silicon carbide.
The heat exchanger according to any one of claims 1 to 5, characterized in that, based on the volume of the organic coating, the volume ratio of the thermally conductive powder is 0.5% to 30%.
The heat exchanger according to any one of claims 1 to 6, further comprising a heat-conducting medium, the heat-conducting medium is disposed between the fin and the heat-conducting tube, and is in contact with the fin It is in contact with the heat pipe, and the thermal conductivity of the thermally conductive medium is greater than that of air.
The heat exchanger according to claim 7, wherein the thermally conductive medium is thermally conductive adhesive.
The heat exchanger according to claim 7 or 8, wherein thermally conductive particles are dispersed in the thermally conductive medium.
The heat exchanger according to claim 9, wherein the thermally conductive particles are selected from boron nitride, graphene, aluminum oxide, or silicon carbide.
The heat exchanger according to claim 9 or 10, wherein the particle diameter of the thermally conductive particles is 1 nanometer to 100 micrometers.
The heat exchanger according to any one of claims 9 to 11, wherein the thermally conductive particles dispersed in the thermally conductive medium are unevenly provided in particle size.
The heat exchanger according to any one of claims 9 to 12, wherein the volume ratio of the heat conductive particles is 20% to 90% based on the total volume of the heat conductive medium and the heat conductive particles.
An air conditioner, characterized in that the air conditioner includes the heat exchanger according to any one of claims 1 to 13.
A refrigeration equipment, characterized in that the refrigeration equipment comprises the heat exchanger according to any one of claims 1 to 13.