WO2020073591A1 - 电子装置及其制作方法 - Google Patents

电子装置及其制作方法 Download PDF

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Publication number
WO2020073591A1
WO2020073591A1 PCT/CN2019/076571 CN2019076571W WO2020073591A1 WO 2020073591 A1 WO2020073591 A1 WO 2020073591A1 CN 2019076571 W CN2019076571 W CN 2019076571W WO 2020073591 A1 WO2020073591 A1 WO 2020073591A1
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WIPO (PCT)
Prior art keywords
wire
stretchable wire
flexible substrate
stretchable
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/076571
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English (en)
French (fr)
Inventor
王涛
李旭娜
翟峰
贾松霖
程卫高
任雅磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan New Flat Panel Display Technology Center Co Ltd
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan New Flat Panel Display Technology Center Co Ltd
Kunshan Govisionox Optoelectronics Co Ltd
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Publication date
Application filed by Kunshan New Flat Panel Display Technology Center Co Ltd, Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan New Flat Panel Display Technology Center Co Ltd
Publication of WO2020073591A1 publication Critical patent/WO2020073591A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits

Definitions

  • This application relates to the field of flexible electronic technology, for example, to an electronic device and a manufacturing method thereof.
  • Flexible electronic technology can be summarized as an emerging electronic technology that makes electronic devices made of organic or inorganic materials on flexible or ductile plastics or thin metal substrates to make electronic equipment flexible or ductile.
  • the present application provides an electronic device and a manufacturing method thereof, and a stretchable wire.
  • An electronic device including:
  • a plurality of electronic components respectively arranged on the plurality of islands;
  • a stretchable wire is electrically connected to each electronic component, a part of the stretchable wire is embedded in the island, the rest of the stretchable wire is embedded in the flexible substrate, and the stretchable wire The wire extends along a curve in a plane parallel to the flexible substrate;
  • the rigidity of the island is greater than the rigidity of the flexible substrate.
  • the island-shaped portion has a first routing slot into which a portion of the stretchable wire is embedded
  • the flexible substrate has a second wiring groove for embedding the remaining part of the stretchable wire
  • the stretchable wire includes a wire portion formed of a conductive material
  • the flexible substrate has a first side where the first wiring groove and the second wiring groove are opened, and a second side opposite to the first side;
  • the orthographic projection of the wire portion toward the second side falls within the range of the orthographic projection of the first wiring groove and the second wiring groove toward the second side.
  • the dimension of the stretchable wire in the direction perpendicular to the flexible substrate is larger than the dimension of the stretchable wire in the direction parallel to the flexible substrate.
  • the ratio of the dimension of the stretchable wire in the direction perpendicular to the flexible substrate to the dimension of the stretchable wire in the direction parallel to the flexible substrate is less than 10 .
  • the ratio of the dimension of the stretchable wire in the direction perpendicular to the flexible substrate to the dimension of the stretchable wire in the direction parallel to the flexible substrate is equal to 5 .
  • the stretchable wire has an S shape.
  • the number of the stretchable wires is multiple.
  • a connection layer is provided between the stretchable wire and the side wall of the first wire groove, and between the stretchable wire and the side wall of the second wire groove.
  • connection layer is a silicon oxide layer.
  • the surface of the stretchable wire close to the side of the flexible substrate where the stretchable wire is embedded is provided with a protective layer.
  • the protective layer has a plurality of connection openings exposing a portion of the wire portion, and the electronic component is electrically connected to the stretchable wire through the corresponding connection opening.
  • the manner in which the stretchable wire is electrically connected to each electronic component includes at least one of the following:
  • Two adjacent or non-adjacent electronic components are electrically connected to each other through the stretchable wire;
  • the plurality of electronic components are electrically connected to another one or more electronic components through the stretchable wire;
  • the plurality of electronic components are led out by being electrically connected to the stretchable wire to be electrically connected to devices other than the flexible substrate.
  • the electronic component is a metal and / or semiconductor component.
  • the electronic component is an electrode, a chip, a sensor, an OLED (organic electroluminescence diode) display device, or a Micro LED display device.
  • An electronic device manufacturing method includes:
  • a transition substrate is provided on the side of the carrier substrate with the filling groove
  • the method before forming the stretchable wire in the filling groove, the method further includes: forming a connection layer on the sidewall of the filling groove.
  • the method before forming a plurality of electronic components on the carrier substrate, the method further includes: forming a side covering the stretchable wire on the side of the stretchable wire away from the bottom wall of the filling slot The protective layer.
  • FIG. 1 is a schematic cross-sectional view of an electronic device in an embodiment of this application.
  • FIG. 2 is a top view of the electronic device shown in FIG. 1 after removing the protective layer.
  • FIG. 3 is a flowchart of a method for manufacturing an electronic device in an embodiment of this application.
  • FIG. 4 is a schematic cross-sectional view of a stretchable wire in an embodiment of the present application.
  • FIG. 5 is a flowchart of a method for manufacturing a stretchable wire in an embodiment of this application.
  • Electronic devices generally include multiple electronic components, and electrical connections are required between the various electronic components to achieve the transmission of various electrical signals. Therefore, wires need to be routed between various electronic components. However, when the electronic device is stretched or bent, the wires are subjected to tensile stress and are easily broken, so that the electrical connection between the electronic components is broken, resulting in poor tensile performance of the electronic device. Therefore, there is a need to provide an electronic device with better tensile properties.
  • the electronic device according to the embodiment of the present application is suitable for devices applied in the case of stretching or bending.
  • the sensing skin of the robot, the stretchable display device, the wearable device, the body can be embedded or attachable to the biological device, the vehicle-mounted equipment, and the like.
  • an electronic device provided by an embodiment of the present application includes a substrate 10, a stretchable wire 20 and a plurality of electronic components 30.
  • the base 10 includes a flexible substrate 12 and a plurality of islands 14 embedded in the flexible substrate 12 from a side of the flexible substrate 12 and spaced apart from each other.
  • the rigidity of the island 14 is greater than the rigidity of the flexible substrate 12.
  • the plurality of electronic components 30 are respectively provided on the plurality of islands 14.
  • the stretchable wire 20 is electrically connected to each electronic component 30. A portion of the stretchable wire 20 is embedded in the island 14, and the rest of the stretchable wire 20 is embedded in the flexible substrate 12.
  • the stretchable wire 20 extends along a curve in a plane parallel to the flexible substrate 12.
  • the island-shaped portion 14 is provided on the flexible substrate 12 with a relatively low rigidity
  • the electronic component 30 is provided on the island-shaped portion 14 with a relatively high rigidity
  • the stretchable wire 20 is provided on the flexible substrate by embedding In the bottom 12 and the island 14, the electrical connection of each electronic component 30 is realized.
  • the flexible substrate 12 undergoes greater elastic deformation and bears greater tensile stress. In this way, the tensile stress to which the stretchable wire 20 is embedded in the flexible substrate 12 is reduced, and the stretchability of the stretchable wire 20 is improved, so that the stretchable wire 20 is not easily broken, thereby improving the electronic The tensile properties of the device.
  • the island-shaped portion 14 does not generate elastic deformation or generates less elastic deformation. In this way, neither the portion of the stretchable wire 20 embedded in the island portion nor the electronic component 30 is subjected to tensile stress or elastic deformation, so that the electrical connection between the stretchable wire 20 and the electronic component 30 is stable without breakage Open, further improve the tensile properties of electronic devices.
  • the wire is generally designed to be S-shaped, so that the wire has a certain stretchability.
  • the inventors of the present application found in research that the tensile properties of such S-shaped wires are proportional to the radius of curvature of the wires, that is, the larger the radius of curvature of the wires, the better the tensile properties of the wires and the less likely to break .
  • the larger the radius of curvature of the wire the greater the space occupied.
  • the radius of curvature of the wire cannot be designed to be infinite, so the tensile performance of the wire is limited, that is, the tensile performance of the wire is not good, which in turn leads to the Poor tensile properties.
  • the stretchable wire 20 is embedded in the flexible substrate 12.
  • the flexible substrate 12 is subjected to a large tensile stress, which can improve the tensile performance of the stretchable wire 20, so there is no need to increase the radius of curvature of the stretchable wire 20 To improve the tensile performance of the stretchable wire 20. That is to say, even if the radius of curvature of the stretchable wire 20 is appropriately reduced, the stretchability of the stretchable wire 20 can be guaranteed to meet the needs of electronic equipment, thereby reducing the area occupied by the stretchable wire 20, and more Adapt to the design requirements of electronic devices that are thinner and lighter. Meanwhile, when there are a plurality of stretchable wires, since the stretchable wires 20 are embedded in the flexible substrate 12, it is possible to effectively avoid conduction between the wires, and it is not easy to short-circuit.
  • each electronic component 30 may include one or more of the following ways:
  • the electronic component 30 is led out by being electrically connected to the stretchable wire 20, which is convenient for electrical connection with devices other than the flexible substrate 12.
  • the electronic component 30 is a metal and / or semiconductor component, such as an electrode, chip, sensor, OLED (organic electroluminescence diode) display device, Micro LED display device, or the like.
  • a metal and / or semiconductor component such as an electrode, chip, sensor, OLED (organic electroluminescence diode) display device, Micro LED display device, or the like.
  • the island 14 is embedded on one side of the flexible substrate 12.
  • the island 14 is surrounded by the flexible substrate 12. Since the rigidity of the island 14 is greater than the rigidity of the flexible substrate 12, the flexible substrate 12 can better protect the island 14 when the electronic device is stretched or bent, and further avoid being disposed on the island The electronic components on 14 are damaged.
  • the island 14 has a first routing slot 16 into which a part of the stretchable wire 20 is embedded, and the flexible substrate 12 has a second into which the rest of the stretchable wire 20 is embedded Route trough 18.
  • the first routing slot 16 and the second routing slot 18 communicate with each other to form a routing channel for the stretchable wire 20 to extend along a curve in a plane.
  • the flexible substrate 12 bears greater tensile stress and the rigidity of the island 14 is greater than the rigidity of the flexible substrate 12, the island 14 deforms less or It hardly deforms, so that the tensile stress of the portion of the stretchable wire 20 embedded in the first wiring groove 16 is also small; at the same time, the flexible substrate 12 is also a stretchable wire embedded in the second wiring groove 18
  • the extension wires 20 share most of the tensile stress; moreover, the tensile stress on the flexible substrate 12 is distributed less on the side walls of the second wiring groove 18, so that the embedded in the second wiring groove 18
  • the tensile stress to which the stretchable wire 20 bears is small, which improves the stretchability of the stretchable wire 20, thereby improving the stretchability of the electronic device.
  • the stretchable wire 20 includes a wire portion 21 formed of a conductive material.
  • the flexible substrate 12 has a first side 19 where the first wiring groove 16 and the second wiring groove 18 are opened, and a second side 191 opposite to the first side 19.
  • the orthographic projection of the wire portion 21 toward the second side 191 falls within the range of the orthographic projection of the first wiring groove 16 and the second wiring groove 18 toward the second side 191.
  • the orthographic projection of the wire portion 21 toward the second side 191 falls within the range of the orthographic projection of the first wiring groove 16 and the second wiring groove 18 toward the second side 191, the wire portion embedded in the first wiring groove 16
  • the opposite sides of 21 do not protrude from both side walls of the first wiring slot 16
  • the opposite sides of the wire portion 21 embedded in the second wiring slot 18 do not protrude from both side walls of the second wiring slot 18 Therefore, the tensile stress received by the wire portion 21 embedded in the first wiring groove 16 is the stress distributed on both side walls of the first wiring groove 16, and the wire portion 21 embedded in the second wiring groove 18 is subjected to the tensile stress
  • the tensile stress is the stress distributed on the two sidewalls of the second routing slot 18.
  • the curved inner concave side of the wire bears tensile stress
  • the curved outer convex side of the wire bears compressive stress.
  • the inventor of the present application found in research that when the width of the wire (that is, the vertical distance between the arc-shaped concave side of the wire and the arc-shaped convex side) is wider, the arc-shaped concave side of the wire and the arc-shaped convex side respectively bear The greater the tensile and compressive stresses, the worse the tensile properties of the wire. That is, the tensile performance of the wire is inversely proportional to the width of the wire. However, reducing the width of the wire will increase the resistance of the wire and affect the conductivity.
  • the dimension of the stretchable wire 20 in the direction perpendicular to the flexible substrate 12 is larger than its dimension in the direction parallel to the flexible substrate 12.
  • the direction perpendicular to the flexible substrate 12 is the vertical direction
  • the direction parallel to the flexible substrate 12 is the horizontal direction
  • the size of the stretchable wire 20 in the vertical direction is defined as the thickness of the stretchable wire 20; the size of the stretchable wire 20 in the horizontal direction is defined as the width of the stretchable wire 20.
  • the thickness of the stretchable wire 20 can be increased while reducing the width of the stretchable wire 20 to improve the stretchability of the stretchable wire 20, Make it larger than the width of the stretchable wire 20, so as to ensure that the resistance of the stretchable wire 20 remains unchanged.
  • the longitudinal section of the stretchable wire 20 is rectangular.
  • the ratio of the thickness of the stretchable wire 20 to its width is less than 10. Specifically, the ratio of the thickness of the stretchable wire 20 to its width is equal to 5. In this way, it is possible to avoid the problem that the process is difficult because the thickness of the stretchable wire 20 is too large and the width is too small.
  • the flexible substrate 12 may be made of silicone rubber, polyurethane-based elastic material, acrylic-based elastic material, or the like.
  • the stretchable wire 20 can be made of any conductive material, such as copper, aluminum, gold, molybdenum, tungsten, titanium, and the like.
  • the flexible substrate 12 is formed using polydimethylsiloxane (PDMS).
  • PDMS polydimethylsiloxane
  • a connecting layer 40 is provided between the stretchable wire 20 and the sidewalls of the first routing slot 16 and the sidewalls of the second routing slot 18. In this way, the adhesion of the stretchable wire 20 to the side walls of the first wire groove 16 and the side walls of the second wire groove 18 can be increased.
  • the material of the connection layer 40 is silicon oxide (SiOx).
  • the surface of the stretchable wire 20 away from the second side 191 of the flexible substrate 12 is provided with a protective layer 15 that covers the stretchable wire 20. In this way, the stretchable wire can be protected.
  • the protective layer 15 has a plurality of connection openings 151 that expose a portion of the stretchable wire 20, and the electronic component 30 is electrically connected to the stretchable wire 20 through the corresponding connection opening 151.
  • the arrangement of the connection opening 151 facilitates the electrical connection of the electronic component 30 and the stretchable wire 20.
  • the embodiments of the present application also provide a method for manufacturing an electronic device.
  • a method for manufacturing an electronic device in an embodiment of the present application includes:
  • Step S110 forming a filling groove extending along the curve on the carrier substrate.
  • a photoresist is coated on the carrier substrate, the photoresist is exposed and developed, and a photomask is formed to expose the area where the filling groove needs to be formed. Then, an etching process, such as a dry etching process, is used to form a filling groove on the carrier substrate.
  • Step S120 forming the stretchable wire 20 in the filling groove.
  • a vapor deposition or electroplating process is used to form a layer of conductive material on the carrier substrate to fill the filling groove.
  • a polishing process such as a chemical mechanical polishing process (Chemical Mechanical Polishing, CMP)
  • CMP Chemical Mechanical Polishing
  • the method before step S120, further includes the step of forming a connection layer 40 on the sidewall of the filling groove.
  • connection layer 40 may be silicon oxide (SiO X ).
  • connection material on the surface of the carrier substrate (that is, the connection material other than the connection material deposited in the filling tank) can be removed in step S120 by using a polishing process to remove the conductive material on the surface of the carrier substrate. And remove.
  • Step S130 forming a plurality of electronic components 30 on the carrier substrate so that the stretchable wire 20 is electrically connected to each electronic component 30.
  • Step S140 Set a transition substrate on the side of the carrier substrate with the filling groove.
  • the transition substrate may be disposed on the side of the carrier substrate with the filling groove in a temporary bonding manner.
  • the transition substrate is a glass substrate.
  • the transition substrate may also be a rigid substrate of other materials, which is not limited herein.
  • Step S150 Remove a part of the carrier substrate to form a plurality of islands 14 for disposing the electronic component 30, and expose the stretchable wire 20 outside the islands 14.
  • a chemical mechanical polishing process is used to remove the portion of the carrier substrate on the side of the stretchable wire 20 away from the transition substrate to expose the surface of the stretchable wire 20 away from the transition substrate.
  • the connecting material on the side of the stretchable wire away from the transition substrate may also be removed.
  • a photoresist is coated on the side of the carrier substrate away from the transition substrate, and the photoresist is exposed and developed to form a photomask covering the stretchable wire 20 and the region of the carrier substrate corresponding to the electronic component 30.
  • an etching process such as a dry etching process, is used to remove the carrier substrate not covered by the photomask.
  • Step S160 forming a flexible substrate 12 on the transition substrate to fill the area between the plurality of islands 14 so that a portion of the stretchable wire 20 is embedded in the flexible substrate 12.
  • a flexible substrate 12 is formed by coating an elastic material on the side of the transition substrate having the stretchable wire 20.
  • Step S170 remove the transition substrate.
  • a step may be further included: forming a protective layer 15 covering the stretchable wire 20 on the side of the stretchable wire 20 away from the bottom wall of the filling groove to cover the stretchable wire 20.
  • a photoresist is coated on the side of the carrier substrate having the stretchable wire 20, the photoresist is exposed and developed to form a photomask to cover the surface area of the carrier substrate, and the stretchable is exposed ⁇ 20 ⁇ 20.
  • a plasma-enhanced chemical vapor deposition (PECVD) or atomic deposition (ALD) process may be used to deposit the protective layer material on the side of the carrier substrate having the photomask.
  • PECVD plasma-enhanced chemical vapor deposition
  • ALD atomic deposition
  • a photomask covering the surface of the carrier substrate and part of the stretchable wire 20 may be formed. After the photomask is subsequently removed, the protective layer 15 having the connection opening 151 is formed, and the electronic component is electrically connected to the stretchable wire 20 through the connection opening 151.
  • the number of the connection openings 151 may include a plurality of electrical connections for the plurality of electronic components 30 and the stretchable wire 20.
  • an embodiment of the present application further provides a stretchable wire, including a flexible substrate 100 and a wire portion 200 formed of a conductive material.
  • the wire part 200 is completely embedded in one side of the flexible substrate 100 and extends along a curve on the plane where the flexible substrate is located.
  • the wire part 200 is completely embedded in one side of the flexible substrate 100. Therefore, when the stretchable wire is stretched, the flexible substrate 100 is subjected to a large tensile stress, and most of the tensile stress is shared for the wire part 200. In this way, the tensile stress that the wire portion 200 bears is reduced, and the risk of the wire portion 200 breaking is reduced, thereby improving the tensile performance of the stretchable wire. Furthermore, the radius of curvature of the wire portion 200 can be reduced, and the space occupied by the stretchable wire can be reduced, which satisfies the design requirements of thinning and miniaturization of electronic equipment.
  • one side of the flexible substrate 100 has an insertion groove 102 for providing the wire part 200.
  • the wire part 200 is completely fitted into the fitting groove 102. In this way, when the stretchable wire is stretched, the distribution of the tensile stress received by the flexible substrate 100 on the sidewall of the embedding groove 102 is small, so that the tensile stress experienced by the wire portion 200 is also small, which further improves Tensile properties of stretchable wires.
  • the embedding groove 102 also extends along the curve on the plane where the flexible substrate 100 is located.
  • the flexible substrate 100 may have a plurality of embedding grooves 102 on one side, and each embedding groove 102 is provided with a wire part 200.
  • the plurality of lead portions 200 may be connected or not connected, which is not limited herein.
  • the flexible substrate 100 includes a first side 104 provided with an embedded groove 102 and a second side 106 opposite to the first side 104.
  • the orthographic projection of the wire portion 200 toward the second side 106 falls within the range of the orthographic projection of the insertion groove 102 toward the second side 106.
  • the orthographic projection of the wire portion 200 toward the second side 106 falls within the range of the orthographic projection of the insertion groove 102 toward the second side 106, so the opposite sides of the wire portion 200 do not protrude from the side walls of the insertion groove 102, so
  • the tensile stress received by the wire part 200 embedded in the insertion groove 102 is the stress distributed on both side walls of the insertion groove 102.
  • the tensile stress that the wire portion 200 bears is also small, which further improves the tensile performance of the conductive portion 200, that is, the tensile strength of the stretchable wire performance.
  • the inner side of the arc of the wire is subjected to tensile stress
  • the outer side of the wire is subjected to compressive stress.
  • the inventor of the present application found in research that the wider the width of the wire, the greater the tensile stress on the arc inside and outside of the arc, and the worse the tensile performance of the wire. That is, the tensile performance of the wire is inversely proportional to the width of the wire. However, reducing the width of the wire will increase the resistance of the wire and affect the conductivity.
  • the size of the wire portion 200 in the direction perpendicular to the flexible substrate 100 is larger than its size in the direction parallel to the flexible substrate 100.
  • the direction perpendicular to the flexible substrate 100 is the vertical direction
  • the direction parallel to the flexible substrate 100 is the horizontal direction.
  • the dimension of the lead portion 200 in the vertical direction is defined as the thickness of the lead portion 200
  • the dimension of the lead portion 200 in the horizontal direction is defined as the width of the lead portion 200.
  • the thickness of the stretchable wire 20 can be increased while reducing the width of the stretchable wire 20 to improve the stretchability of the stretchable wire 20, Make it larger than the width of the stretchable wire 20, so as to ensure that the resistance of the stretchable wire 20 remains unchanged.
  • the wire section 200 has a rectangular cross section.
  • the ratio of the thickness of the wire portion 200 to its width is less than 10. In this embodiment, the ratio of the thickness of the lead portion 200 to its width is 5. In this way, it is possible to avoid the problem of increased difficulty in the processing process due to the excessively large thickness of the lead portion 200 and the excessively small width.
  • the flexible substrate 100 may be made of silicone rubber, polyurethane-based elastic material, acrylic-based elastic material, or the like.
  • the wire part 200 may be made of any conductive material, such as copper, aluminum, gold, molybdenum, tungsten, titanium, and the like.
  • the flexible substrate 100 is formed using polydimethylsiloxane (PDMS).
  • PDMS polydimethylsiloxane
  • the lead part 200 is formed of copper.
  • the depth of the embedding groove 102 is 2-50 ⁇ m.
  • the width of the embedded groove 102 is 1 ⁇ m to 10 ⁇ m.
  • the wire portion 200 may have an S shape, a square waveform, a sinusoidal shape, a zigzag shape, or the like.
  • a connecting layer 300 is provided between the wire part 200 and the sidewall of the embedding groove 102, so that the wire part 200 is attached to the sidewall of the embedding groove 102 through the connecting layer 300 .
  • the adhesion of the lead portion 200 to the flexible substrate 100 can be increased, and on the other hand, the lead portion 200 can be more closely attached to the side wall of the insertion groove 102.
  • the stretchable wire is stretched, the flexible substrate 100 can share a larger tensile stress, so that the tensile stress distributed on the sidewall of the embedded groove 102 is smaller.
  • connection layer 300 is attached to the side wall of the insertion groove 102 through the connection layer 300, which can further reduce the tensile stress experienced by the wire portion 200, thereby improving the tensile performance of the wire portion 200.
  • the material of the connection layer 300 is silicon oxide (SiOx).
  • the thickness of the connection layer 300 may be 10 nm to 1 ⁇ m.
  • the surface of the wire portion 200 facing away from the second side 106 of the flexible substrate 100 is provided with a protective layer (not shown), which covers the wire portion 200.
  • the protective layer can protect the lead portion 200 well.
  • the material of the protective layer and the connection layer 300 are the same. In this way, the protective layer and the connection layer 300 can be formed in one process, which simplifies the process flow.
  • the thickness of the protective layer may be 10 nm to 1 ⁇ m.
  • the protective layer has at least two connection openings (not shown) that expose a portion of the wire part 200.
  • the electronic component is electrically connected to the lead part 200 through the corresponding connection opening.
  • the embodiments of the present application also provide a method for manufacturing a stretchable wire.
  • the manufacturing method of a stretchable wire in an embodiment of the present application includes:
  • Step S210 forming a filling groove extending along the curve on the carrier substrate.
  • a photoresist is coated on the carrier substrate, the photoresist is exposed and developed, and a photomask is formed to expose the area where the filling groove needs to be formed. Then, an etching process, such as a dry etching process, may be used to form a filling groove on the carrier substrate.
  • Step S220 Fill the filling groove with a conductive material to form the wire part 200.
  • a vapor deposition or electroplating process is used to form a layer of conductive material on the carrier substrate to fill the filling groove.
  • a polishing process such as a chemical mechanical polishing process (Chemical Mechanical Polishing, CMP)
  • CMP Chemical Mechanical Polishing
  • Step S230 Remove a part of the carrier substrate to completely expose the wire part 200.
  • a layer of photoresist is coated on the carrier substrate, the photoresist is exposed and developed, and a photomask is formed to cover the lead part 200. Then, an etching process, such as a dry etching process, is used to remove part of the carrier substrate to completely expose the wire part 200.
  • Step S240 forming a flexible substrate 100 on the carrier substrate, so that the wire part 200 is completely embedded in the flexible substrate 100.
  • a flexible material is coated on the side of the carrier substrate with the wire portion 200 by a coating process to form the flexible substrate 100.
  • Step S250 Remove the remaining part of the carrier substrate.
  • a polishing process such as a chemical mechanical polishing process (Chemical Mechanical Polishing, CMP) is used to remove the remaining portion of the carrier substrate.
  • CMP Chemical Mechanical Polishing
  • the method before step S220, further includes the steps of: forming a connection layer 300 on the side wall of the filling trench, and forming a protective layer on the bottom wall of the filling trench.
  • connection layer 300 is deposited on the carrier substrate to form a connection layer 300 on the side wall of the filling tank and a protective layer on the bottom wall of the filling tank .
  • the materials of the connection layer 300 and the protective layer are the same, for example: silicon oxide (SiO X ).
  • connection material on the surface of the carrier substrate can be removed in step S220 by using a polishing process to remove the conductive material on the surface of the carrier substrate. And remove.
  • the protective layer may be removed to facilitate the electrical connection of the lead part 200 with other electronic components.
  • a polishing process may be used to remove the remaining portion of the carrier substrate, and then continue polishing to remove the protective layer.
  • the protective layer may not be removed to protect the wire part 200 and prevent the wire part 200 from directly contacting with water, oxygen, etc. in the external environment.
  • a step may be further provided after step 250: using an etching process, at least two connection openings are opened in the protective layer to expose part of the conductive portion 200, so as to facilitate electrical connection with other devices .

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Abstract

本申请涉及一种电子装置及其制作方法。该电子装置包括：柔性衬底，以及设置于柔性衬底一侧且彼此间隔开的多个岛状部；多个电子元件，分别设置在多个岛状部上；及可拉伸导线，与每个电子元件电连接，可拉伸导线的一部分嵌入岛状部，其余部分嵌入柔性衬底，且可拉伸导线在平行于柔性衬底的平面内沿曲线延伸。岛状部的刚度大于柔性衬底的刚度。

Description

电子装置及其制作方法
相关申请的交叉引用
本申请要求于2018年10月12日提交中国专利局、申请号为201811190621.5、发明名称为“电子装置及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及柔性电子技术领域，例如是涉及一种电子装置及其制作方法。
背景技术
柔性电子技术可概括为在柔性或可延性塑料或薄金属基板上制作由有机或无机材料制成的电子器件，以使电子设备具有柔性或延展性的新兴电子技术。
随着柔性电子技术的不断发展，柔性电子装置的应用前景将越来越广阔，例如机器人的传感器皮肤、可穿戴通信设备、身体可嵌入或可附接的生物设备、可拉伸显示装置以及类似领域。
然而，由于柔性电子技术还处于起步阶段，在对电子装置进行拉伸或弯折的可靠性试验时，电子装置存在拉伸性能不佳的缺陷。
因此，如何提高电子装置的拉伸性能，是本领域技术人员亟待解决的问题。
发明内容
本申请提供一种电子装置及其制作方法，以及一种可拉伸导线。
一种电子装置，包括：
柔性衬底，以及从所述柔性衬底一侧嵌入所述柔性衬底内且彼此间隔开的多个岛状部；
多个电子元件，分别设置在所述多个岛状部上；及
可拉伸导线，与每个电子元件电连接，所述可拉伸导线的一部分嵌入所述岛状部，所述可拉伸导线的其余部分嵌入所述柔性衬底，且所述可拉伸导线在平行于所述柔性衬底的平面内沿曲线延伸；
其中，所述岛状部的刚度大于所述柔性衬底的刚度。
在其中一个实施例中，所述岛状部具有供所述可拉伸导线的一部分嵌入的第一走线槽；
所述柔性衬底具有供所述可拉伸导线的其余部分嵌入的第二走线槽；
所述第一走线槽与所述第二走线槽彼此连通，以形成一供所述可拉伸导线在所述平面内沿曲线延伸的走线通道。在其中一个实施例中，所述可拉伸导线包括由导电材料形成的导线部；
所述柔性衬底具有开设有所述第一走线槽和所述第二走线槽的第一侧，以及与所述第一侧相对的第二侧；
所述导线部朝向所述第二侧的正投影，落入所述第一走线槽和所述第二走线槽朝向所述第二侧的正投影的范围内。
在其中一个实施例中，所述可拉伸导线在垂直于所述柔性衬底的方向上的尺寸大于所述可拉伸导线在平行于所述柔性衬底的方向上的尺寸。
在其中一个实施例中，所述可拉伸导线在垂直于所述柔性衬底的方向上的尺寸与所述可拉伸导线在平行于所述柔性衬底的方向上的尺寸之比小于10。
在其中一个实施例中，所述可拉伸导线在垂直于所述柔性衬底的方向上的尺寸与所述可拉伸导线在平行于所述柔性衬底的方向上的尺寸之比等于5。
在其中一个实施例中，所述可拉伸导线呈S形。
在其中一个实施例中，所述可拉伸导线的数量为多条。
在其中一个实施例中，所述可拉伸导线与所述第一走线槽的侧壁、所述可拉伸导线与所述第二走线槽的侧壁之间均设有连接层。
在其中一个实施例中，所述连接层为硅氧化层。
在其中一个实施例中，所述可拉伸导线靠近所述柔性衬底供所述可拉伸导线嵌入的一侧的表面设置有保护层。
在其中一个实施例中，所述保护层具有暴露部分所述导线部的多个连接开口，所述电子元件通过对应的所述连接开口电连接于所述可拉伸导线。在其中一个实施例中，所述可拉伸导线与每个电子元件电连接的方式包括以下中的至少一种：
相邻或不相邻的两电子元件之间通过所述可拉伸导线相互电连接；
所述多个电子元件通过所述可拉伸导线电连接于另外一个或另外多个电子元件；及
所述多个电子元件通过与所述可拉伸导线电连接而被引出，以与所述柔性衬底以外的其它器件电连接。
在其中一个实施例中，所述电子元件为金属和/或半导体元件。
在其中一个实施例中，所述电子元件为电极、芯片、传感器、OLED(有机电致发光二极管)显示器件、或Micro LED显示器件。一种电子装置的制作方法，包括：
在承载基板上形成沿曲线延伸的填充槽；
在所述填充槽内形成可拉伸导线；
在所述承载基板上形成多个电子元件，以使所述可拉伸导线与每个电子元件电连接；
在所述承载基板具有填充槽的一侧设置一过渡基板；
去除部分所述承载基板，形成用于设置所述电子元件的多个岛状部，暴露岛状部外的可拉伸导线；
在所述过渡基板上形成柔性衬底，以填充所述多个岛状部之间的区域，从而使所述可拉伸导线嵌入所述柔性衬底；及
去除所述过渡基板。
在其中一个实施例中，在所述填充槽内形成可拉伸导线之前，还包括：在所述填充槽的侧壁形成连接层。
在其中一个实施例中，在在所述承载基板上形成多个电子元件之前，还包括：在所述可拉伸导线远离所述填充槽底壁的一侧形成覆盖所述可拉伸导线的保护层。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其它特征、目的和优点将根据说明书、附图以及权利要求书的描述变得明显。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为本申请一实施方式中的电子装置的剖面示意图。
图2为图1所示的电子装置去除保护层后的俯视图。
图3为本申请一实施方式中的电子装置的制作方法的流程图。
图4为本申请一实施方式中的可拉伸导线的剖面示意图。
图5为本申请一实施方式中的可拉伸导线的制作方法的流程图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
电子装置一般包括多个电子元件，并且各个电子元件之间需要电连接以实现各种电信号的传输。因此，各个电子元件之间需要布设导线。但是，在电子装置被拉伸或弯折的过程中，导线承受拉伸应力，容易断裂，使得各电子元件之间的电连接断开，导致电子装置拉伸性能不佳。因此，需要提供一种具有较好拉伸性能的电子装置。
需要说明的是，本申请实施例的电子装置适用于拉伸或弯折情况下应用 的装置。例如，机器人的传感皮肤、可拉伸的显示装置、可穿戴装置、身体可嵌入或可附接生物装置、车载设备以及类似领域。
下面，将参照附图详细描述本申请实施例中的电子装置。
如图1及图2所示，本申请一实施例提供的电子装置，包括基底10、可拉伸导线20及多个电子元件30。
基底10包括柔性衬底12，以及从柔性衬底12一侧嵌入柔性衬底12内且彼此间隔开的多个岛状部14。岛状部14的刚度大于柔性衬底12的刚度。多个电子元件30分别设置在多个岛状部14上。可拉伸导线20与每个电子元件30电连接。可拉伸导线20的一部分嵌入岛状部14，可拉伸导线20的其余部分嵌入柔性衬底12。可拉伸导线20在平行于柔性衬底12的平面内沿曲线延伸。
在上述电子装置中，岛状部14设置于刚度较小的柔性衬底12上，电子元件30设置于刚度较大的岛状部14上，可拉伸导线20通过嵌入的方式设置于柔性衬底12和岛状部14中，从而实现各个电子元件30的电连接。在电子设备被拉伸或弯折的过程中，柔性衬底12产生较大的弹性变形，承受较大的拉伸应力。如此，减小了可拉伸导线20嵌入柔性衬底12的部分所承受的拉伸应力，提升了可拉伸导线20的拉伸性能，使得可拉伸导线20不容易断裂，进而提升了电子装置的拉伸性能。
需要说明的是，在电子装置被拉伸或弯折的过程中，岛状部14不产生弹性变形或产生较小的弹性变形。如此，可拉伸导线20嵌入岛状部的部分以及电子元件30均不承受拉伸应力，也不产生弹性变形，从而使得可拉伸导线20与电子元件30的电连接稳定，不会发生断开，进一步提升了电子装置的 拉伸性能。
还需要说明的是，一般将导线设计为S形，使得导线具有一定的可拉伸性能。然而，本申请的发明人在研究中发现，这种呈S形的导线的拉伸性能与导线的曲率半径成正比，即导线的曲率半径越大导线的拉伸性能越好，越不容易断裂。但是，导线的曲率半径越大所占空间越大。由于受到电子设备的轻薄化、小型化的设计需求的限制，导线的曲率半径不可能设计成无限大，因此导线的拉伸性能受到限制，即导线的拉伸性能不佳，进而导致电子设备的拉伸性能不佳。
本申请中，可拉伸导线20被嵌入柔性衬底12。在电子装置被拉伸或弯折时，柔性衬底12承受较大的拉伸应力，能够提高可拉伸导线20的拉伸性能，因此不必通过增大可拉伸导线20的曲率半径的方式来提升可拉伸导线20的拉伸性能。也就是说，即使适当地减小可拉伸导线20的曲率半径，也能保证可拉伸导线20的拉伸性能满足电子设备的需求，从而减小可拉伸导线20所占用的面积，更加适应电子设备的轻薄化、小型化的设计需求。同时，当可拉伸导线具有多条时，由于可拉伸导线20被嵌入柔性衬底12，因此能够有效避免各导线之间相互导通，不易短路。
还需要说明的是，可拉伸导线20与每个电子元件30电连接的方式可以包括以下方式中的一种或多种：
1)相邻或不相邻的两电子元件30之间通过可拉伸导线20相互电连接；
2)多个(即两个或两个以上)电子元件30通过可拉伸导线20电连接于另外一个或另外多个电子元件30；及
3)电子元件30通过与可拉伸导线20电连接而被引出，便于与柔性衬底 12以外的其它器件电连接。
具体地，本实施例中，电子元件30为金属和/或半导体元件，例如电极、芯片、传感器、OLED(有机电致发光二极管)显示器件、Micro LED显示器件等。
本申请的实施例中，岛状部14被嵌入柔性衬底12的一侧。岛状部14被柔性衬底12围绕。由于岛状部14的刚度大于柔性衬底12的刚度，因此在电子装置被拉伸或弯折的过程中，柔性衬底12能够更好地保护岛状部14，进一步避免设置于岛状部14上的电子元件被损坏。
在本申请的一个实施例中，岛状部14具有供可拉伸导线20的一部分嵌入的第一走线槽16，且柔性衬底12具有供可拉伸导线20的其余部分嵌入的第二走线槽18。第一走线槽16与第二走线槽18彼此连通，以形成一供可拉伸导线20在平面内沿曲线延伸的走线通道。在电子装置被拉伸或弯折的过程中，由于柔性衬底12承担了较大的拉伸应力且岛状部14的刚度大于柔性衬底12的刚度，使得岛状部14变形较小或几乎不变形，因此使得可拉伸导线20嵌入第一走线槽16的部分承受的拉伸应力也较小；同时，柔性衬底12也为嵌设于第二走线槽18内的可拉伸导线20分担了大部分的拉伸应力；并且，柔性衬底12承受的拉伸应力在第二走线槽18的侧壁分布较小，从而使得嵌设于第二走线槽18内的可拉伸导线20承受的拉伸应力较小，提升了可拉伸导线20的拉伸性能，进而提升了电子装置的可拉伸性能。
一些实施例中，可拉伸导线20包括由导电材料形成的导线部21。柔性衬底12具有开设有第一走线槽16和第二走线槽18的第一侧19，以及与第一侧19相对的第二侧191。导线部21朝向第二侧191的正投影落入第一走 线槽16和第二走线槽18朝向第二侧191的正投影的范围内。
由于导线部21朝向第二侧191的正投影落入第一走线槽16和第二走线槽18朝向第二侧191的正投影的范围内，嵌入第一走线槽16内的导线部21的相对两侧均没有突出于第一走线槽16的两侧壁，且嵌入第二走线槽18的导线部21的相对两侧均没有突出于第二走线槽18的两侧壁，因此，嵌入第一走线槽16的导线部21受到的拉伸应力即为分布在第一走线槽16的两侧壁的应力，嵌入第二走线槽18的导线部21受到的拉伸应力即为分布在第二走线槽18两侧壁的应力。由于在电子装置被拉伸或弯折的过程中，第一走线槽16的两侧壁几乎没有应力分布，第二走线槽18的两侧壁的应力分布较小，因此，导线部21承受的拉伸应力也较小，提升了电子装置的拉伸性能。
需要说明的是，呈S形的导线在拉伸过程中，导线的弧形内凹侧承受的是拉应力，导线的弧形外凸侧承受的是压应力。本申请的发明人在研究中发现，当导线的宽度(即导线弧形内凹侧与弧形外凸侧的垂直间距)越宽，导线的弧形内凹侧与弧形外凸侧分别承受的拉应力和压应力均越大，导线的拉伸性能越差。即，导线的拉伸性能与导线的宽度呈反比。但是，减小导线的宽度会导致导线的电阻增加，影响导电性能。
基于此，本申请的一些实施例中，可拉伸导线20在垂直于柔性衬底12的方向上的尺寸大于其在平行于柔性衬底12的方向上的尺寸。
在如图1所示的实施例中，垂直于柔性衬底12的方向即为竖直方向，平行于柔性衬底12的方向即为水平方向。
本实施例中，可拉伸导线20在竖直方向上的尺寸被定义为可拉伸导线20的厚度；可拉伸导线20在水平方向上的尺寸被定义为可拉伸导线20的宽 度。为使可拉伸导线20的电阻满足电子设备的要求，可在减小可拉伸导线20的宽度以提升可拉伸导线20的拉伸性能的同时，增大可拉伸导线20的厚度，使其大于可拉伸导线20的宽度，从而保证可拉伸导线20的电阻保持不变。具体地，可拉伸导线20的纵截面呈矩形。
在一些实施例中，可拉伸导线20的厚度与其宽度之比小于10。具体地，可拉伸导线20厚度与其宽度之比等于5。如此，能够避免因可拉伸导线20的厚度过大而宽度过小所导致的加工工艺难度过大的问题。
在一些实施例中，柔性衬底12可采用硅橡胶、聚氨酯类弹性材料或丙烯酸类弹性材料等制成。可拉伸导线20可以采用任何导电材料制成，例如铜、铝、金、钼、钨、钛等。本实施例中，柔性衬底12采用聚二甲基硅氧烷(PDMS)形成。可拉伸导线20采用铜形成。
在一些实施例中，可拉伸导线20与第一走线槽16的侧壁和第二走线槽18的侧壁之间均设有连接层40。如此，能够增加可拉伸导线20与第一走线槽16侧壁和第二走线槽18侧壁的粘附力。可选地，连接层40的材料为硅氧化物(SiOx)。
一些实施例中，可拉伸导线20远离柔性衬底12的第二侧191的表面设置有保护层15，该保护层15覆盖可拉伸导线20。如此，能够保护可拉伸导线。
具体地，一实施例中，保护层15具有暴露部分可拉伸导线20的多个连接开口151，电子元件30通过对应的连接开口151电连接于可拉伸导线20。连接开口151的设置方便了电子元件30与可拉伸导线20的电连接。
为便于进一步理解本申请的技术方案，本申请的实施例还提供一种电子 装置的制作方法。
请参见图3，本申请的一实施例中的电子装置的制作方法，包括：
步骤S110：在承载基板上形成沿曲线延伸的填充槽。
具体地，首先，在承载基板上涂布光阻，对光阻曝光显影，形成光罩，以暴露出需要形成填充槽的区域。然后，采用蚀刻工艺，例如干法蚀刻工艺，在承载基板上形成填充槽。
步骤S120：在填充槽内形成可拉伸导线20。
具体地，首先，采用气相沉积或电镀工艺，在承载基板上形成一层导电材料，以填充该填充槽。然后，采用抛光工艺，例如化学机械抛光工艺(Chemical Mechanical Polishing，CMP)，将承载基板表面的导电材料去除，保留填充槽内的导电材料，以形成可拉伸导线20。
本申请的实施例中，在步骤S120之前，还包括步骤：在填充槽的侧壁形成连接层40。
具体地，采用等离子体增强化学气相沉积(PECVD)或者原子沉积(ALD)工艺，在承载基板上沉积一层连接材料，以在填充槽侧壁形成连接层40。本实施例中，连接层40的材料可以是氧化硅(SiO X)。
需要说明的是，位于承载基板表面的连接材料(即除了沉积于填充槽内的连接材料之外的连接材料)，可在步骤S120中的采用抛光工艺去除承载基板表面的导电材料的步骤中一并去除。
步骤S130：在承载基板上形成多个电子元件30，以使可拉伸导线20与每个电子元件30电连接。
步骤S140：在承载基板的具有填充槽的一侧设置一过渡基板。
具体地，可采用临时键合的方式将过渡基板设置于承载基板的具有填充槽的一侧。
可选地，该过渡基板为玻璃基板。可选地，该过渡基板也可为其它材质的刚性基板，在此不作限定。
步骤S150：去除部分承载基板，以形成用于设置电子元件30的多个岛状部14，且暴露岛状部14外的可拉伸导线20。
具体地，采用化学机械抛光工艺(CPM)，去除承载基板的位于可拉伸导线20远离过渡基板一侧的部分，以暴露可拉伸导线20远离过渡基板的一侧表面。可选地，该步骤中也可一并将可拉伸导线远离过渡基板一侧的连接材料去除。然后，在承载基板远离过渡基板的一侧涂布光阻，对光阻曝光显影，形成覆盖可拉伸导线20和承载基板的与电子元件30相对应的区域的光罩。再然后，采用蚀刻工艺，例如干法蚀刻工艺，去除未被光罩覆盖的承载基板。
步骤S160：在过渡基板上形成柔性衬底12，以填充多个岛状部14之间的区域，从而使可拉伸导线20的一部分嵌入柔性衬底12。
具体地，在过渡基板具有可拉伸导线20的一侧涂布弹性材料，形成柔性衬底12。
步骤S170：去除过渡基板。
本申请的实施例中，在步骤S130之前还可包括步骤：在可拉伸导线20远离填充槽底壁的一侧形成覆盖可拉伸导线20的保护层15，以覆盖可拉伸导线20。
具体地，本实施例中，首先，在承载基板具有可拉伸导线20的一侧涂布光阻，对光阻曝光显影，形成光罩，以覆盖承载基板的表面区域，而暴露可 拉伸导线20。然后，可采用等离子体增强化学气相沉积(PECVD)或者原子沉积(ALD)工艺在承载基板具有光罩的一侧沉积保护层材料。最后，去除光罩，以形成覆盖可拉伸导线20的保护层15。
为了便于可拉伸导线20与电子元件30电连接，在一些实施例中，在形成保护层15的步骤中，可形成覆盖承载基板的表面以及部分可拉伸导线20的光罩。后续去除光罩，就形成具有连接开口151的保护层15，电子元件通过连接开口151与可拉伸导线20电连接。可选地，连接开口151的数目可包括多个，用于多个电子元件30与可拉伸导线20的电连接。
如图4所示，本申请一实施例还提供一种可拉伸导线，包括柔性衬底100及由导电材料形成的导线部200。该导线部200完全嵌入柔性衬底100的一侧，且在柔性衬底所在的平面上沿曲线延伸。
在上述可拉伸导线中，导线部200完全嵌入柔性衬底100的一侧。因此，在可拉伸导线被拉伸的过程中，柔性衬底100承受较大的拉伸应力，为导线部200分担了大部分的拉伸应力。如此，减小了导线部200所承受的拉伸应力，降低了导线部200断裂的风险，从而提升了可拉伸导线的拉伸性能。进而可减小导线部200的曲率半径，减小可拉伸导线所占用的空间，满足电子设备的轻薄化及小型化的设计需求。
本发明实施例中，柔性衬底100的一侧具有用于设置导线部200的嵌入槽102。导线部200完全嵌入该嵌入槽102。如此，在可拉伸导线拉伸时，柔性衬底100所承受的拉伸应力在嵌入槽102侧壁上的分布较小，从而导线部200所承受的拉伸应力也较小，进一步提升了可拉伸导线的拉伸性能。
可选地，由于导线部200在柔性衬底100所在平面上沿曲线延伸，因此， 嵌入槽102也在柔性衬底100所在平面上沿曲线延伸。
可选地，柔性衬底100的一侧可具有多条嵌入槽102，每个嵌入槽102内均设有导线部200。根据实际需要，多个导线部200之间可以连接，也可以不连接，在此不作限定。
本申请的实施例中，柔性衬底100包括设有嵌入槽102的第一侧104，以及相对第一侧104的第二侧106。导线部200朝向所述第二侧106的正投影，落入嵌入槽102朝向第二侧106的正投影的范围内。如此，由于导线部200朝向第二侧106的正投影落入嵌入槽102朝向第二侧106的正投影的范围内，使得导线部200相对两侧均没有突出于嵌入槽102两侧壁，因此，嵌入嵌入槽102的导线部200受到的拉伸应力即为分布在嵌入槽102两侧壁的应力。由于分布在嵌入槽102的两侧壁的应力较小，因此，导线部200承受的拉伸应力也较小，进一步提升了导电部200的拉伸性能，即提升了可拉伸导线的拉伸性能。
需要说明的是，呈S形的导线在拉伸过程中，导线的弧形内侧承受的是拉应力，导线的弧形外侧承受的是压应力。本申请的发明人在研究中发现，当导线的宽度越宽，导线的弧形内侧与弧形外侧承受的拉伸应力均越大，导线的拉伸性能越差。即，导线的拉伸性能与导线的宽度呈反比。但是，减小导线的宽度会导致导线的电阻增加，影响导电性能。
基于此，本申请的实施例中，导线部200在垂直于柔性衬底100的方向上的尺寸大于其在平行于柔性衬底100且方向上的尺寸。在如图4所示的实施例中，垂直于柔性衬底100的方向即为竖直方向，平行于柔性衬底100的方向即为水平方向。
本实施例中，导线部200在竖直方向上的尺寸被定义为导线部200的厚度，导线部200在水平方向上的尺寸被定义为导线部200的宽度。为使可拉伸导线20的电阻满足电子设备的要求，可在减小可拉伸导线20的宽度以提升可拉伸导线20的拉伸性能的同时，增大可拉伸导线20的厚度，使其大于可拉伸导线20的宽度，从而保证可拉伸导线20的电阻保持不变。具体地，导线部200的横截面呈矩形。
在一些实施例中，导线部200的厚度与其宽度之比小于10。本实施例中，导线部200的厚度与其宽度之比为5。如此，能够避免因导线部200的厚度过大而宽度过小所导致的加工工艺难度增大的问题。
在一些实施例中，柔性衬底100可采用硅橡胶、聚氨酯类弹性材料或丙烯酸类弹性材料等制成。导线部200可以采用任何导电材料制成，例如铜、铝、金、钼、钨、钛等。本实施例中，柔性衬底100采用聚二甲基硅氧烷(PDMS)形成。导线部200采用铜形成。可选地，嵌入槽102的深度为2μm～50μm。嵌入槽102的宽度为1μm～10μm。
可选地，导线部200可呈S形、方波形、正弦形、锯齿形等。
请一并参见图3，本申请的实施例中，导线部200与嵌入槽102的侧壁之间设置有连接层300，以使导线部200通过连接层300贴附于嵌入槽102的侧壁。如此，一方面能够增加导线部200与柔性衬底100的粘附力，另一方面使得导线部200更加紧贴于嵌入槽102的侧壁。由于在可拉伸导线被拉伸的过程中，柔性衬底100能够分担较大的拉伸应力，使得分布在嵌入槽102的侧壁的拉伸应力较小。因此，导线部200通过连接层300贴附于嵌入槽102的侧壁，能够进一步的减小导线部200承受的拉伸应力，从而提升导线部200 的拉伸性能。可选地，连接层300的材料为氧化硅(SiOx)。可选地，连接层300的厚度可为10nm～1μm。
一些实施例中，导线部200背离柔性衬底100的第二侧106的表面设置有保护层(图未示)，该保护层覆盖导线部200。如此，保护层能够很好地保护导线部200。可选地，保护层与连接层300的材质相同。如此，可在一道工序中形成保护层和连接层300，简化了工艺流程。可选地，保护层的厚度可为10nm～1μm。
具体到实施例中，保护层具有至少两个暴露部分导线部200的连接开口(图未示)。电子元件通过对应的连接开口电连接于导线部200。
为便于进一步理解本申请的技术方案，本申请的实施例还提供一种可拉伸导线的制作方法。
请一并参见图5，本申请一实施例中的可拉伸导线的制作方法，包括：
步骤S210：在承载基板上形成沿曲线延伸的填充槽。
具体地，首先，在承载基板上涂布光阻，对光阻曝光显影，形成光罩，以暴露出需要形成填充槽的区域。然后，可采用刻蚀工艺，例如干法刻蚀工艺，在承载基板上形成填充槽。
步骤S220：在填充槽内填充导电材料，以形成导线部200。
具体地，首先，采用气相沉积或电镀工艺，在承载基板上形成一层导电材料，以填充该填充槽。然后，采用抛光工艺，例如化学机械抛光工艺(Chemical Mechanical Polishing，CMP)，将承载基板表面的导电材料去除，保留填充槽内的导电材料，以形成导线部200。
步骤S230：去除部分承载基板，以完全暴露导线部200。
具体地，在承载基板上涂布一层光阻，对光阻曝光显影，形成光罩，以覆盖导线部200。然后，采用刻蚀工艺，例如干法刻蚀工艺，去除部分承载基板，以完全暴露导线部200。
步骤S240：在承载基板上形成柔性衬底100，以使导线部200完全嵌入柔性衬底100。
具体地，在承载基板具有导线部200的一侧采用涂布工艺涂布弹性材料，形成柔性衬底100。
步骤S250：去除承载基板的剩余部分。
具体地，采用抛光工艺，例如化学机械抛光工艺(Chemical Mechanical Polishing，CMP)，将承载基板的剩余部分去除。
本申请的实施例中，在步骤S220之前，还包括步骤：在填充槽的侧壁形成连接层300，在填充槽的底壁形成保护层。
具体地，采用等离子体增强化学气相沉积(PECVD)或者原子沉积(ALD)工艺，在承载基板上沉积一层连接材料，以在填充槽侧壁形成连接层300，在填充槽底壁形成保护层。可选地，连接层300和保护层的材料相同，例如：氧化硅(SiO X)。
需要说明的是，位于承载基板表面的连接材料(即除了沉积于填充槽内的连接材料之外的连接材料)，可在步骤S220中的采用抛光工艺去除承载基板表面的导电材料的步骤中一并去除。
需要说明的是，保护层在一些实施例中可以去除，以方便导线部200与其它电子元件电连接。如此，可在步骤250中的采用抛光工艺，将承载基板的剩余部分去除之后，继续进行抛光，以去除保护层。
在另一些实施例中，保护层也可不去除，以保护导线部200，防止导线部200与外部环境中的水、氧气等直接接触。进一步地，为方便导线与电子元件30电连接，可在步骤250之后还设置步骤：采用蚀刻工艺，在保护层开设至少两个连接开口，以暴露部分导电部200，以便于与其它器件电连接。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (18)

  1. 一种电子装置，包括：
    柔性衬底，以及从所述柔性衬底一侧嵌入所述柔性衬底内且彼此间隔开的多个岛状部；
    多个电子元件，分别设置在所述多个岛状部上；及
    可拉伸导线，与每个电子元件电连接，所述可拉伸导线的一部分嵌入所述岛状部，所述可拉伸导线的其余部分嵌入所述柔性衬底，且所述可拉伸导线在平行于所述柔性衬底的平面内沿曲线延伸；
    其中，所述岛状部的刚度大于所述柔性衬底的刚度。
  2. 根据权利要求1所述的电子装置，其中，所述岛状部具有供所述可拉伸导线的一部分嵌入的第一走线槽；
    所述柔性衬底具有供所述可拉伸导线的其余部分嵌入的第二走线槽；
    所述第一走线槽与所述第二走线槽彼此连通，以形成供所述可拉伸导线在所述平面内沿曲线延伸的走线通道。
  3. 根据权利要求2所述的电子装置，其中，所述可拉伸导线包括由导电材料形成的导线部；
    所述柔性衬底具有开设有所述第一走线槽和所述第二走线槽的第一侧，以及与所述第一侧相对的第二侧；
    所述导线部朝向所述第二侧的正投影，落入所述第一走线槽和所述第二走线槽朝向所述第二侧的正投影的范围内。
  4. 根据权利要求1所述的电子装置，其中，所述可拉伸导线在垂直于所述柔性衬底的方向上的尺寸大于所述可拉伸导线在平行于所述柔性衬底的方向上的尺寸。
  5. 根据权利要求4所述的电子装置，其中，所述可拉伸导线在垂直于所述柔性衬底的方向上的尺寸与所述可拉伸导线在平行于所述柔性衬底的方向上的尺寸之比小于10。
  6. 根据权利要求4所述的电子装置，其中，所述可拉伸导线在垂直于所 述柔性衬底的方向上的尺寸与所述可拉伸导线在平行于所述柔性衬底的方向上的尺寸之比等于5。
  7. 根据权利要求1所述的电子装置，其中，所述可拉伸导线呈S形。
  8. 根据权利要求1所述的电子装置，其中，所述可拉伸导线的数量为多条。
  9. 根据权利要求2所述的电子装置，其中，所述可拉伸导线与所述第一走线槽的侧壁、所述可拉伸导线与所述第二走线槽的侧壁之间均设有连接层。
  10. 根据权利要求9所述的电子装置，其中，所述连接层为硅氧化层。
  11. 根据权利要求2所述的电子装置，其中，所述可拉伸导线靠近所述柔性衬底供所述可拉伸导线嵌入的一侧的表面设置有保护层。
  12. 根据权利要求11所述的电子装置，其中，所述保护层具有暴露部分所述可拉伸导线的多个连接开口，所述电子元件通过对应的所述连接开口与所述可拉伸导线电连接。
  13. 根据权利要求1所述的电子装置，其中，所述可拉伸导线与每个电子元件电连接的方式包括以下中的至少一种：
    相邻或不相邻的两电子元件之间通过所述可拉伸导线相互电连接；
    所述多个电子元件通过所述可拉伸导线电连接于另外一个或另外多个电子元件；及
    所述多个电子元件通过与所述可拉伸导线电连接而被引出，以与所述柔性衬底以外其它器件电连接。
  14. 根据权利要求1所述的电子装置，其中，所述电子元件为金属和/或半导体元件。
  15. 根据权利要求1所述的电子装置，其中，所述电子元件为电极、芯片、传感器、OLED(有机电致发光二极管)显示器件、或Micro LED显示 器件。
  16. 一种电子装置的制作方法，包括：
    在承载基板上形成沿曲线延伸的填充槽；
    在所述填充槽内形成可拉伸导线；
    在所述承载基板上形成多个电子元件，以使所述可拉伸导线与每个电子元件电连接；
    在所述承载基板具有填充槽的一侧设置一过渡基板；
    去除部分所述承载基板，形成用于设置所述电子元件的多个岛状部，暴露所述岛状部外的可拉伸导线；
    在所述过渡基板上形成柔性衬底，以填充所述多个岛状部之间的区域，从而使所述可拉伸导线嵌入所述柔性衬底；及
    去除所述过渡基板。
  17. 根据权利要求16所述的方法，在所述填充槽内形成可拉伸导线之前，还包括：在所述填充槽的侧壁形成连接层。
  18. 根据权利要求16所述的方法，在所述承载基板上形成多个电子元件之前，还包括：在所述可拉伸导线远离所述填充槽底壁的一侧形成覆盖所述可拉伸导线的保护层。
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