WO2020061818A1 - 耳机降噪结构及耳机 - Google Patents

耳机降噪结构及耳机 Download PDF

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Publication number
WO2020061818A1
WO2020061818A1 PCT/CN2018/107620 CN2018107620W WO2020061818A1 WO 2020061818 A1 WO2020061818 A1 WO 2020061818A1 CN 2018107620 W CN2018107620 W CN 2018107620W WO 2020061818 A1 WO2020061818 A1 WO 2020061818A1
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WO
WIPO (PCT)
Prior art keywords
noise reduction
cavity
hole
horn
earphone
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Application number
PCT/CN2018/107620
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English (en)
French (fr)
Inventor
梅庆开
Original Assignee
深圳市魅动智能股份有限公司
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Publication date
Application filed by 深圳市魅动智能股份有限公司 filed Critical 深圳市魅动智能股份有限公司
Priority to PCT/CN2018/107620 priority Critical patent/WO2020061818A1/zh
Publication of WO2020061818A1 publication Critical patent/WO2020061818A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones

Definitions

  • This solution belongs to the technical field of earphones, and more specifically, relates to a noise reduction structure of earphones and earphones.
  • the earphones of the prior art generally include a sealed horn cavity for placing a horn. Since the horn cavity is a sealed structure, a certain air pressure exists in the inside of the horn cavity, which easily causes howling, diaphragm sound, and current sound, which leads to overall reduction The noise effect is poor and cannot meet user needs.
  • the purpose of this solution is to provide a headphone noise reduction structure and a headphone, so as to solve the technical problem of poor noise reduction effect of the headphone in the prior art.
  • the technical solution adopted in this solution is to provide a noise reduction structure for earphones, including a shell, a speaker, a speaker base, a speaker cover, and an earmuff, and the speaker base and the speaker cover are both mounted on the In the housing, a rear end surface of the horn base is connected with the horn cover to form a horn cavity for mounting the horn and isolated from the outside, and a front end surface of the horn base is connected with the earmuff to form the horn An isolated front cavity, the front cavity and the horn cavity are isolated from each other, the horn cover is provided with a first ventilation hole communicating with the horn cavity, and the housing is provided with the The first ventilation hole is directly opposite to the first through hole communicating with the outside, and the first ventilation hole is in communication with the first through hole.
  • a second ventilation hole communicating with the front cavity is provided on the horn base, and a second through hole communicating with the outside is opened on the housing, and the second ventilation hole and the The second through hole communicates.
  • an air guiding column is integrally extended on a rear end surface of the horn base, and an air guiding hole is opened on the air guiding column, the air guiding hole communicates with the second ventilation hole, and a bone position is provided on the horn cover.
  • the bone position is in contact with the rear end surface of the horn base and forms an air guiding cavity which is isolated from the horn cavity;
  • a third ventilation is opened on the horn cover and communicates with the air guiding cavity; Hole, the third ventilation hole is directly opposite to and communicated with the second through hole, and the air guiding column extends into the air guiding cavity to communicate the air guiding hole with the third ventilation hole.
  • the noise reduction structure of the earphone further includes a ventilating mesh, which is disposed outside the horn cover and directly faces the first ventilating hole and the third ventilating hole.
  • a rear cavity is formed between the speaker cover and the housing, and the rear cavity is isolated from the front cavity and the speaker cavity, respectively, and the earphone noise reduction structure further includes a receiver for receiving
  • the feedforward microphone of the external noise is disposed in the rear cavity, and the shell includes a shell body and outwards from an outer wall of the shell body in a radial direction of the shell body.
  • a sound receiving hole is provided on the outer wall of the shell body for the external noise to enter the rear cavity, and the sound receiving hole is directly opposite the feedforward microphone.
  • the speaker base is provided with a mounting position, and the mounting position is provided with a speaker surface, the speaker surface has a sound emitting hole for transmitting the sound emitted by the speaker, and the speaker is embedded In the installation position, and the sound emitting surface of the speaker for emitting sound is directly facing the sound emitting hole.
  • the earphone noise reduction structure further includes a feedback microphone for receiving noise in the front cavity, and the feedback microphone is disposed on the speaker surface.
  • the noise reduction structure of the earphone further includes an earmuff fixing member for fixing the earmuff to the horn holder, and the earmuff fixing member is connected and fixed to the earmuff and the horn holder, respectively. .
  • the earphone noise reduction structure further includes a first sealing ring for sealing a gap between the earmuff fixing member and the speaker base.
  • This solution also provides an earphone, which includes a headband, two brackets, and two earphone noise reduction structures.
  • One end of one of the brackets is connected to one end of the headband, and the other end of one of the brackets is connected to it.
  • One of the headphone noise reduction structure is connected, one end of the other bracket is connected to the other end of the headband, and the other end of the bracket is connected to another headphone noise reduction structure; the headphone noise reduction
  • the structure is the earphone noise reduction structure as described above.
  • the beneficial effect of the noise reduction structure and the earphone provided by this solution is that, compared with the prior art, the noise reduction structure and the earphone of the solution have a first vent hole communicating with the speaker cavity.
  • the body is provided with a first through hole that is directly opposite the first ventilation hole and communicates with the outside world, and the first ventilation hole is in communication with the first through hole, so that the speaker cavity communicates with the outside world, which effectively improves the noise reduction effect and avoids Because the horn cavity is completely sealed, the gas in the horn cavity cannot be exhausted, which causes problems such as howling, diaphragm sound and current sound.
  • FIG. 1 is a schematic three-dimensional structure diagram of a noise reduction structure of an earphone provided by an embodiment of the present solution
  • FIG. 2 is a schematic front view structure diagram of a noise reduction structure of an earphone provided by an embodiment of the present solution
  • FIG. 3 is a sectional structural view taken along line A-A in FIG. 2;
  • FIG. 4 is a partially enlarged schematic view at C in FIG. 3; FIG.
  • FIG. 5 is a sectional structural view along line B-B in FIG. 2;
  • FIG. 6 is a partially enlarged schematic diagram at D in FIG. 5; FIG.
  • FIG. 7 is an exploded exploded structural view of a noise reduction structure of an earphone provided by an embodiment of the present solution.
  • FIG. 8 is an exploded exploded structural view of the earphone noise reduction structure according to another embodiment of the present solution from another angle;
  • FIG. 9 is a schematic diagram of a three-dimensional structure of a speaker base used in a noise reduction structure of an earphone provided by an embodiment of the present solution.
  • FIG. 10 is a schematic perspective structural view of another angle of a horn used in a noise reduction structure of an earphone provided by an embodiment of the present solution;
  • FIG. 11 is a schematic diagram of a three-dimensional structure of a horn cover used in a noise reduction structure of an earphone provided by an embodiment of the present solution;
  • FIG. 12 is a schematic perspective structural view of another aspect of a horn cover used in a noise reduction structure of an earphone provided by an embodiment of the present solution;
  • FIG. 13 is a schematic diagram of a three-dimensional structure of a housing used in a noise reduction structure of an earphone provided by an embodiment of the present solution;
  • FIG. 14 is a schematic diagram of a three-dimensional structure of an earphone provided by an embodiment of the present solution.
  • 100-headphone noise reduction structure 10-shell; 11-first through hole; 12-second through hole; 13-shell body; 131-receiving hole; 14-convex edge; 15-fixed post; 20-speaker Block; 201-horn cavity; 202-front cavity; 21-rear end face; 211-air guiding column; 212-air guiding hole; 213-fixing hole; 22-front face; 23-second ventilation hole; 24-installation Position; 241-speaker surface; 242-sound hole; 25-card slot; 26-dust net; 27-position hole; 30-speaker cover; 31-first ventilation hole; 32-bone position; 33-guide Air cavity; 34-third vent hole; 35-rear cavity; 36-circuit board; 40-ear muffs; 50-breathable mesh; 60-feedforward microphone; 70-feedback microphone; 80-ear muff fixings; 81-locating column; 82-first sealing ring; 83-second sealing ring; 831-through hole; 200-headband; 300-bracket.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of this solution, the meaning of "multiple” is two or more, unless it is specifically and specifically defined otherwise.
  • the earphone noise reduction structure 100 includes a housing 10, a speaker (not shown), a speaker base 20, a speaker cover 30, and an ear cover 40.
  • the speaker base 20 and the speaker cover 30 are both installed in the housing 10.
  • the end surface 21 is connected with the horn cover 30 to form a horn cavity 201 for mounting the horn.
  • the horn cavity 201 is isolated from the outside.
  • the front end surface 22 of the horn base 20 is connected to the earmuff 40 to form a front cavity 202.
  • the front cavity 202 is connected to the outside Is isolated, and the front cavity 202 and the horn cavity 201 are isolated from each other, so that the front cavity 202 and the horn cavity 201 form an independent sealing structure respectively.
  • the horn cover 30 is provided with a first ventilation hole 31 communicating with the horn cavity 201, and the housing 10 is provided with a first through hole 11 opposite to the first ventilation hole 31 and communicating with the outside. The first through hole 11 communicates.
  • the earphone noise reduction structure 100 provided by this solution is provided with a first ventilation hole 31 communicating with the speaker cavity 201 on the speaker cover 30, and a first ventilation hole is provided on the housing 10.
  • the first through hole 11 is directly opposite the hole 31 and communicates with the outside, and the first ventilation hole 31 is in communication with the first through hole 11, so that the speaker cavity 201 communicates with the outside, which effectively improves the noise reduction effect and avoids the speaker cavity
  • the gas in the horn cavity 201 cannot be exhausted, which causes problems such as howling, diaphragm sound, and current sound.
  • the speaker base 20 is provided with a first communicating with the front cavity 202.
  • Two ventilation holes 23, the housing 10 is provided with a second through hole 12 communicating with the outside world, and the second ventilation hole 23 is communicated with the second through hole 12, thereby allowing the front cavity 202 to communicate with the outside world, further enhancing the noise reduction effect This avoids the problems of howling, diaphragm sound, and current sound caused by the fact that the gas in the front cavity 202 cannot be exhausted because the front cavity 202 is completely sealed.
  • the rear end surface 21 of the horn base 20 integrally extends out of the air guide column 211.
  • the air guide column 211 is provided with an air guide hole 212, and the air guide hole 212 communicates with the second ventilation hole 23.
  • the horn cover 30 is provided with a bone position 32, which is in contact with the rear end surface 21 of the horn base 20 and forms an air guiding cavity 33 that is isolated from the horn cavity 201, so that the air guiding cavity 33 forms an independent seal.
  • the structure avoids the communication between the air guiding cavity 33 and the horn cavity 201, which leads to the communication between the front cavity 202 and the horn cavity 201.
  • the horn cover 30 is provided with a third ventilation hole 34 communicating with the air guiding cavity 33.
  • the third ventilation hole 34 is directly opposite and communicating with the second through hole 12, and the air guiding column 211 extends into the air guiding cavity 33 so that The air guide hole 212 is in communication with the third ventilation hole 34.
  • the front cavity 202 is communicated with the outside through the air guiding column 211, so that the gas in the front cavity 202 can be exhausted to the outside in time.
  • the number of the first ventilation holes 31 may be set according to actual needs, for example, in this embodiment
  • the number of the first ventilation holes 31 is two, and the sizes and shapes of the two first ventilation holes 31 are different.
  • the earphone noise reduction structure 100 further includes a ventilation net 50, which is disposed outside the speaker cover 30. It is directly opposite to the first ventilation hole 31 and the third ventilation hole 34.
  • the arrangement of the ventilation mesh 50 can effectively increase the density of ventilation, thereby making the noise reduction effect better.
  • a rear cavity 35 and a rear cavity are formed between the speaker cover 30 and the casing 10
  • the body 35 is isolated from the front cavity 202 and the horn cavity 201, respectively.
  • a circuit board 36 or a battery (not shown) can be installed in the rear cavity 35.
  • the earphone noise reduction structure 100 further includes a feedforward microphone 60 for receiving external noise.
  • the feedforward microphone 60 is disposed in the rear cavity 35.
  • the feedforward microphone 60 can effectively reduce noise in the external environment.
  • the housing 10 includes a shell body 13 and a protruding edge 14 protruding outward from the outer wall of the shell body 13 along the radial direction of the shell body 13, that is, the diameter of the protruding edge 14 is larger than the diameter of the shell body 13, and the protruding edge 14 is located near One end of the earmuff 40.
  • a sound receiving hole 131 is provided on the outer wall of the shell body 13 for external noise to enter the rear cavity 35, and the sound receiving hole 131 is directly opposite the feedforward microphone 60. Due to the setting of the convex edge 14, the oncoming wind cannot directly blow to the position of the sound receiving hole 131, avoiding the occurrence of instant wind noise, effectively preventing wind noise, and improving the user experience.
  • the shape of the shell body 13 is a truncated cone shape, and the diameter of the shell body 13 gradually decreases in a direction away from the earmuff 40, so that the effect of preventing wind noise is better.
  • the shape of the sound-receiving hole 131 may be set in a long shape.
  • the speaker base 20 is provided with a mounting position 24 and the mounting position 24 is provided with a speaker surface 241
  • the speaker surface 241 has a sound emitting hole 242 for transmitting the sound emitted by the speaker, and the speaker is embedded in the installation position 24, so that the front cavity 202 and the speaker cavity 201 are isolated from each other and sealed.
  • the sound emitting surface (not shown) of the horn for emitting sound is directly opposite the sound output hole 242, so that the sound emitted by the horn can be transmitted through the sound output hole 242 to the front cavity 202.
  • the speaker base 20 is provided with a card slot 25 for cooperating with the speaker cover 30, and the card slot 25
  • the setting can better achieve the sealing effect of the horn cavity 201.
  • the card slot 25 is a circular card slot.
  • the speaker surface 241 is also provided with a dustproof net 26 to prevent dust from entering the speaker. Thus affecting the life of the speaker.
  • the housing 10 is provided with a fixing post 15, and the rear end surface 21 of the speaker base 20 is provided.
  • the fixing hole 213 and the fixing column 15 are inserted into the fixing hole 213 and fixed, so that the horn base 20 can be embedded in the housing 10 and connected and fixed, so that the sealing effect is better, and the front cavity 202, the horn cavity 201, and the rear can be avoided. Muting sound between the cavities 35, and at the same time isolate the influence of external noise to achieve the purpose of noise reduction.
  • the earphone noise reduction structure 100 further includes a feedback microphone for receiving noise in the front cavity 202. 70.
  • the feedback microphone 70 is disposed on the speaker surface 241. The setting of the feedback microphone 70 can effectively reduce the noise problem in the front cavity 202 and achieve better noise reduction effect through cooperation with the feedforward microphone 60.
  • the earphone noise reduction structure 100 further includes a device for fixing the earmuff 40 on the speaker base 20.
  • the earmuff fixing member 80 is connected and fixed to the earmuff 40 and the horn base 20, respectively.
  • one side of the earmuff fixing member 80 is fixedly connected to the earmuff 40
  • the other side of the earmuff fixing member 80 is provided with a positioning post 81
  • the horn 20 is provided with a positioning hole 27, and the positioning post 81 is inserted into the positioning hole 27 for positioning, so that the earmuff fixing member 80 is connected and fixed with the horn base 20.
  • the number of the positioning posts 81 can be set to be multiple, for example, it can be three, four, or the like.
  • the earphone noise reduction structure 100 further includes a structure for sealing the earpiece fixing member 80 and the speaker base 20.
  • the first sealing ring 82 between the gaps is sandwiched between the earpiece fixing member 80 and the horn base 20, so that the front cavity 202 can achieve a better sealing effect.
  • the earphone noise reduction structure 100 further includes a second seal ring 83, which is sandwiched by the second seal ring 83.
  • the sealing effect between the front cavity 202 is further strengthened between the earpiece fixing member 80 and the first sealing ring 82.
  • the second sealing ring 83 is provided with a passing hole 831, and the positioning post 81 passes through the passing hole 831 and is fixed to the positioning hole 27.
  • the first seal ring 82 and the second seal ring 83 are EVA (ethylene-vinyl acetate copo, ethylene-vinyl acetate copolymer).
  • this solution also provides a headphone including a headband 200, two brackets 300, and two headphone noise reduction structures 100.
  • One end of one bracket 300 is connected to one end of the headband 200, and one of the brackets 300 The other end is connected to one of the headphone noise reduction structures 100, one end of the other bracket 300 is connected to the other end of the headband 200, and the other end of the other bracket 300 is connected to the other headphone noise reduction structure 100.
  • the rear cavity 35 of one of the earphone noise reduction structures 100 can be used for mounting the circuit board 36, and the rear cavity 35 of the other earphone noise reduction structure 100 can be used for installing a battery.
  • the earphone provided by this solution adopts the earphone noise reduction structure 100 in the specific embodiment of this solution, therefore, the noise reduction effect is effectively improved, and the gas in the speaker cavity 201 cannot be exhausted due to the complete sealing of the speaker cavity 201, thereby preventing the Causes howling, diaphragm sound, and current sound problems.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Headphones And Earphones (AREA)

Abstract

本方案提供了一种耳机降噪结构及耳机，耳机降噪结构包括壳体（10）、喇叭、喇叭座（20）、喇叭盖（30）以及耳套（40），喇叭座（20）及喇叭盖（30）均安装于壳体（10）内，喇叭座（20）的后端面与喇叭盖（30）对接形成用于安装喇叭并与外界隔离的喇叭腔体（201），喇叭座（20）的前端面与耳套（40）对接形成与外界隔离的前腔体（202），所述前腔体（202）与所述喇叭腔体（201）彼此隔离，所述喇叭盖（30）上开设有与所述喇叭腔体（201）连通的第一透气孔（31），所述壳体（10）上开设有与所述第一透气孔（31）正对并与所述外界连通的第一通孔（11），所述第一透气孔（31）与所述第一通孔（11）连通。本方案提供的耳机降噪结构及耳机，有效提高了降噪效果，避免了喇叭腔体（201）由于完全密封导致喇叭腔体（201）内的气体无法排出从而引发啸叫、膜片声以及电流声的问题。

Description

耳机降噪结构及耳机 技术领域
本方案属于耳机技术领域，更具体地说，是涉及一种耳机降噪结构及耳机。
 背景技术
目前，随着社会的发展，人们生活水平的逐渐提高，人们对耳机的要求也越来越高，耳机的降噪效果的好坏直接影响到音乐的品质。
目前现有技术的耳机通常包括一密封的用于放置喇叭的喇叭腔体，由于喇叭腔体为密封结构，其内部存在一定的气压，容易引发啸叫、膜片声以及电流声，导致整体降噪效果较差，无法满足用户需求。
 技术问题
本方案的目的在于提供一种耳机降噪结构及耳机，以解决现有技术中的耳机存在的降噪效果较差的技术问题。
 技术解决方案
为实现上述目的，本方案采用的技术方案是：提供一种耳机降噪结构，包括壳体、喇叭、喇叭座、喇叭盖以及耳套，所述喇叭座以及所述喇叭盖均安装于所述壳体内，所述喇叭座的后端面与所述喇叭盖对接形成用于安装所述喇叭并与外界隔离的喇叭腔体，所述喇叭座的前端面与所述耳套对接形成与所述外界隔离的前腔体，所述前腔体与所述喇叭腔体彼此隔离，所述喇叭盖上开设有与所述喇叭腔体连通的第一透气孔，所述壳体上开设有与所述第一透气孔正对并与所述外界连通的第一通孔，所述第一透气孔与所述第一通孔连通。
进一步地，所述喇叭座上开设有与所述前腔体连通的第二透气孔，所述壳体上开设有与所述外界连通的第二通孔，所述第二透气孔与所述第二通孔连通。
进一步地，所述喇叭座的后端面一体延伸出导气柱，所述导气柱上开设有导气孔，所述导气孔与所述第二透气孔连通，所述喇叭盖上设置有骨位，所述骨位与所述喇叭座的后端面抵接并形成与所述喇叭腔体彼此隔离的导气腔体，所述喇叭盖上开设有与所述导气腔体连通的第三透气孔，所述第三透气孔与所述第二通孔正对并连通，所述导气柱伸入所述导气腔体内以使所述导气孔与所述第三透气孔连通。
进一步地，所述耳机降噪结构还包括透气网，所述透气网设置于所述喇叭盖外并与所述第一透气孔、所述第三透气孔正对。
进一步地，所述喇叭盖与所述壳体之间形成后腔体，所述后腔体分别与所述前腔体、所述喇叭腔体隔离，所述耳机降噪结构还包括用于接收所述外界的噪音的前馈麦克风，所述前馈麦克风设置于所述后腔体内，所述壳体包括壳本体以及自所述壳本体的外壁沿着所述壳本体的径向方向向外突出的凸沿，所述壳本体的外壁上开设有用于供所述外界的噪音进入所述后腔体内的收声孔，所述收声孔与所述前馈麦克风正对。
进一步地，所述喇叭座上设置有安装位，所述安装位上设置有扬声面，所述扬声面上具有用于传输所述喇叭发出的声音的出音孔，所述喇叭嵌装于所述安装位内，且所述喇叭的用于发出声音的出声面正对所述出音孔。
进一步地，所述耳机降噪结构还包括用于接收所述前腔体内的噪音的反馈麦克风，所述反馈麦克风设置于所述扬声面上。
进一步地，所述耳机降噪结构还包括用于将所述耳套固定于所述喇叭座上的耳套固定件，所述耳套固定件分别与所述耳套及所述喇叭座连接固定。
进一步地，所述耳机降噪结构还包括用于密封所述耳套固定件与所述喇叭座之间的间隙的第一密封圈。
本方案还提供了一种耳机，包括头带、两个支架以及两个耳机降噪结构，其中一个所述支架的一端与所述头带的一端连接，其中一个所述支架的另一端与其中一个所述耳机降噪结构连接，另一个所述支架的一端与所述头带的另一端连接，另一个所述支架的另一端与另一个所述耳机降噪结构连接；所述耳机降噪结构为如上所述的耳机降噪结构。
 有益效果
本方案提供的耳机降噪结构及耳机的有益效果在于：与现有技术相比，本方案耳机降噪结构及耳机，通过在喇叭盖上开设有与喇叭腔体连通的第一透气孔，壳体上开设有与第一透气孔正对并与外界连通的第一通孔，且第一透气孔与第一通孔连通，从而使得喇叭腔体与外界连通，有效提高了降噪效果，避免了喇叭腔体由于完全密封导致喇叭腔体内的气体无法排出从而引发啸叫、膜片声以及电流声的问题。
 附图说明
为了更清楚地说明本方案实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本方案的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本方案实施例提供的耳机降噪结构的立体结构示意图；
图2为本方案实施例提供的耳机降噪结构的主视结构示意图；
图3为沿图2中A-A线的剖视结构图；
图4为图3在C处的局部放大示意图；
图5为沿图2中B-B线的剖视结构图；
图6为图5在D处的局部放大示意图；
图7为本方案实施例提供的耳机降噪结构的爆炸分解结构图；
图8为本方案实施例提供的耳机降噪结构的另一角度的爆炸分解结构图；
图9为本方案实施例提供的耳机降噪结构所采用的喇叭座的立体结构示意图；
图10为本方案实施例提供的耳机降噪结构所采用的喇叭座的另一角度的立体结构示意图；
图11为本方案实施例提供的耳机降噪结构所采用的喇叭盖的立体结构示意图；
图12为本方案实施例提供的耳机降噪结构所采用的喇叭盖的另一角度的立体结构示意图；
图13为本方案实施例提供的耳机降噪结构所采用的壳体的立体结构示意图；
图14为本方案实施例提供的耳机的立体结构示意图。
其中，图中各附图标记：
100-耳机降噪结构；10-壳体；11-第一通孔；12-第二通孔；13-壳本体；131-收声孔；14-凸沿；15-固定柱；20-喇叭座；201-喇叭腔体；202-前腔体；21-后端面；211-导气柱；212-导气孔；213-固定孔；22-前端面；23-第二透气孔；24-安装位；241-扬声面；242-出音孔；25-卡槽；26-防尘网；27-定位孔；30-喇叭盖；31-第一透气孔；32-骨位；33-导气腔体；34-第三透气孔；35-后腔体；36-电路板；40-耳套；50-透气网；60-前馈麦克风；70-反馈麦克风；80-耳套固定件；81-定位柱；82-第一密封圈；83-第二密封圈；831-通过孔；200-头带；300-支架。
 本发明的实施方式
为了使本方案所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本方案进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本方案，并不用于限定本方案。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本方案和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本方案的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本方案的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
请一并参阅图1至图8，现对本方案提供的耳机降噪结构100进行说明。耳机降噪结构100包括壳体10、喇叭（图中未示）、喇叭座20、喇叭盖30以及耳套40，喇叭座20以及喇叭盖30均安装于壳体10内，喇叭座20的后端面21与喇叭盖30对接形成用于安装喇叭的喇叭腔体201，喇叭腔体201与外界隔离，喇叭座20的前端面22与耳套40对接形成前腔体202，前腔体202与外界隔离，且前腔体202与喇叭腔体201彼此隔离，从而使得前腔体202与喇叭腔体201分别形成独立的密封结构。喇叭盖30上开设有与喇叭腔体201连通的第一透气孔31，壳体10上开设有与第一透气孔31正对并与外界连通的第一通孔11，第一透气孔31与第一通孔11连通。
本方案提供的耳机降噪结构100，与现有技术相比，本方案通过在喇叭盖30上开设有与喇叭腔体201连通的第一透气孔31，壳体10上开设有与第一透气孔31正对并与外界连通的第一通孔11，且第一透气孔31与第一通孔11连通，从而使得喇叭腔体201与外界连通，有效提高了降噪效果，避免了喇叭腔体201由于完全密封导致喇叭腔体201内的气体无法排出从而引发啸叫、膜片声以及电流声的问题。
进一步地，请一并参阅图5、图6、图9至图13，作为本方案提供的耳机降噪结构100的一种具体实施方式，喇叭座20上开设有与前腔体202连通的第二透气孔23，壳体10上开设有与外界连通的第二通孔12，第二透气孔23与第二通孔12连通，从而使得前腔体202与外界连通，进一步加强了降噪效果，避免了前腔体202由于完全密封导致前腔体202内的气体无法排出从而引发啸叫、膜片声以及电流声的问题。优选的，在本实施例中，喇叭座20的后端面21一体延伸出导气柱211，导气柱211上开设有导气孔212，导气孔212与第二透气孔23连通。喇叭盖30上设置有骨位32，骨位32与喇叭座20的后端面21抵接并形成与喇叭腔体201彼此隔离的导气腔体33，从而使得导气腔体33形成独立的密封结构，避免了导气腔体33与喇叭腔体201连通从而导致前腔体202与喇叭腔体201的连通。喇叭盖30上开设有与导气腔体33连通的第三透气孔34，第三透气孔34与第二通孔12正对并连通，导气柱211伸入导气腔体33内以使导气孔212与第三透气孔34连通。通过导气柱211将前腔体202与外界连通，从而可以及时将前腔体202内的气体排到外界中。
进一步地，请一并参阅图11至图12，作为本方案提供的耳机降噪结构100的一种具体实施方式，第一透气孔31的数量可根据实际需要设置，例如，在本实施例中，第一透气孔31的数量为两个，且该两个第一透气孔31的大小以及形状均不相同。
进一步地，请一并参阅图3至图8，作为本方案提供的耳机降噪结构100的一种具体实施方式，耳机降噪结构100还包括透气网50，透气网50设置于喇叭盖30外并与第一透气孔31、第三透气孔34正对。透气网50的设置可以有效提高透气的密度，从而使得降噪效果更好。
进一步地，请一并参阅图3至图8、图13，作为本方案提供的耳机降噪结构100的一种具体实施方式，喇叭盖30与壳体10之间形成后腔体35，后腔体35分别与前腔体202、喇叭腔体201隔离。后腔体35内可以安装电路板36或者电池（图中未示）。耳机降噪结构100还包括用于接收外界的噪音的前馈麦克风60，前馈麦克风60设置于后腔体35内，通过前馈麦克风60，可以有效降低外界环境中的噪音。壳体10包括壳本体13以及自壳本体13的外壁沿着壳本体13的径向方向向外突出的凸沿14，即凸沿14的直径大于壳本体13的直径，且凸沿14位于靠近耳套40的一端。壳本体13的外壁上开设有用于供外界的噪音进入后腔体35内的收声孔131，收声孔131与前馈麦克风60正对。由于凸沿14的设置，使得迎面吹来的风无法直接吹到收声孔131所在的位置，避免产生即时风噪，有效防止风噪声，用户体验更佳。具体的，在本实施例中，壳本体13的形状为锥台状，该壳本体13的直径沿着远离耳套40的方向逐渐变小，从而使得防止风噪声效果更好。收声孔131的形状可以设置为长条状。
进一步地，请一并参阅图3至图8，作为本方案提供的耳机降噪结构100的一种具体实施方式，喇叭座20上设置有安装位24，安装位24上设置有扬声面241，扬声面241上具有用于传输喇叭发出的声音的出音孔242，喇叭嵌装于安装位24内，从而使得前腔体202与喇叭腔体201彼此隔离密封。喇叭的用于发出声音的出声面（图中未示）正对出音孔242，从而使得喇叭发出的声音可以穿过出音孔242传到前腔体202内。
进一步地，请一并参阅图3至图10，作为本方案提供的耳机降噪结构100的一种具体实施方式，喇叭座20上设置有用于与喇叭盖30配合的卡槽25，卡槽25的设置，可以更好地实现喇叭腔体201的密封效果。优选的，卡槽25为环形卡槽。
进一步地，请一并参阅图3至图8，作为本方案提供的耳机降噪结构100的一种具体实施方式，扬声面241上还设置有防尘网26，可以避免灰尘进入喇叭中，从而影响喇叭的使用寿命。
进一步地，请一并参阅图3至图10，作为本方案提供的耳机降噪结构100的一种具体实施方式，壳体10上设置有固定柱15，喇叭座20的后端面21上设置有固定孔213，固定柱15插入固定孔213中固定，从而使得喇叭座20可以嵌入壳体10内并连接固定，使得密封效果更好，且可避免了前腔体202、喇叭腔体201、后腔体35之间的相互窜音，同时隔绝外部噪音的影响，达到降噪的目的。
进一步地，请一并参阅图3至图8，作为本方案提供的耳机降噪结构100的一种具体实施方式，耳机降噪结构100还包括用于接收前腔体202内的噪音的反馈麦克风70，反馈麦克风70设置于扬声面241上。反馈麦克风70的设置，可以有效降低前腔体202内的噪音问题，并通过与前馈麦克风60的配合，达到更好的降噪效果。
进一步地，请一并参阅图3至图8，作为本方案提供的耳机降噪结构100的一种具体实施方式，耳机降噪结构100还包括用于将耳套40固定于喇叭座20上的耳套固定件80，耳套固定件80分别与耳套40及喇叭座20连接固定。具体的，在本实施例中，耳套固定件80的一面与耳套40连接固定，耳套固定件80的另一面上设置有定位柱81，喇叭座20上设置有定位孔27，定位柱81插入定位孔27中定位，从而使得耳套固定件80与喇叭座20连接固定。优选的，定位柱81的数量可以设置为多个，例如可以为三个、四个等。
进一步地，请一并参阅图3至图8，作为本方案提供的耳机降噪结构100的一种具体实施方式，耳机降噪结构100还包括用于密封耳套固定件80与喇叭座20之间的间隙的第一密封圈82，第一密封圈82夹设于耳套固定件80与喇叭座20之间，从而可以使得前腔体202达到更好的密封效果。
进一步地，请一并参阅图3至图8，作为本方案提供的耳机降噪结构100的一种具体实施方式，耳机降噪结构100还包括第二密封圈83，第二密封圈83夹设于耳套固定件80与第一密封圈82之间，进一步加强前腔体202的密封效果。具体的，第二密封圈83上设置有通过孔831，定位柱81穿过通过孔831后并与定位孔27固定。优选的，第一密封圈82与第二密封圈83为EVA（ethylene-vinyl acetate copo，乙烯-醋酸乙烯共聚物）材质。
请参阅图14，本方案还提供一种耳机，包括头带200、两个支架300以及两个耳机降噪结构100，其中一个支架300的一端与头带200的一端连接，其中一个支架300的另一端与其中一个耳机降噪结构100连接，另一个支架300的一端与头带200的另一端连接，另一个支架300的另一端与另一个耳机降噪结构100连接。其中一个耳机降噪结构100的后腔体35可用于安装电路板36，另一个耳机降噪结构100的后腔体35用于安装电池。
本方案提供的耳机，采用了本方案具体实施方式中的耳机降噪结构100，因此，有效提高了降噪效果，避免了喇叭腔体201由于完全密封导致喇叭腔体201内的气体无法排出从而引发啸叫、膜片声以及电流声的问题。
以上所述仅为本方案的较佳实施例而已，并不用以限制本方案，凡在本方案的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本方案的保护范围之内。

Claims (10)

  1. 耳机降噪结构，其特征在于：包括壳体、喇叭、喇叭座、喇叭盖以及耳套，所述喇叭座以及所述喇叭盖均安装于所述壳体内，所述喇叭座的后端面与所述喇叭盖对接形成用于安装所述喇叭并与外界隔离的喇叭腔体，所述喇叭座的前端面与所述耳套对接形成与所述外界隔离的前腔体，所述前腔体与所述喇叭腔体彼此隔离，所述喇叭盖上开设有与所述喇叭腔体连通的第一透气孔，所述壳体上开设有与所述第一透气孔正对并与所述外界连通的第一通孔，所述第一透气孔与所述第一通孔连通。
  2. 如权利要求1所述的耳机降噪结构，其特征在于：所述喇叭座上开设有与所述前腔体连通的第二透气孔，所述壳体上开设有与所述外界连通的第二通孔，所述第二透气孔与所述第二通孔连通。
  3. 如权利要求2所述的耳机降噪结构，其特征在于：所述喇叭座的后端面一体延伸出导气柱，所述导气柱上开设有导气孔，所述导气孔与所述第二透气孔连通，所述喇叭盖上设置有骨位，所述骨位与所述喇叭座的后端面抵接并形成与所述喇叭腔体彼此隔离的导气腔体，所述喇叭盖上开设有与所述导气腔体连通的第三透气孔，所述第三透气孔与所述第二通孔正对并连通，所述导气柱伸入所述导气腔体内以使所述导气孔与所述第三透气孔连通。
  4. 如权利要求3所述的耳机降噪结构，其特征在于：所述耳机降噪结构还包括透气网，所述透气网设置于所述喇叭盖外并与所述第一透气孔、所述第三透气孔正对。
  5. 如权利要求1所述的耳机降噪结构，其特征在于：所述喇叭盖与所述壳体之间形成后腔体，所述后腔体分别与所述前腔体、所述喇叭腔体隔离，所述耳机降噪结构还包括用于接收所述外界的噪音的前馈麦克风，所述前馈麦克风设置于所述后腔体内，所述壳体包括壳本体以及自所述壳本体的外壁沿着所述壳本体的径向方向向外突出的凸沿，所述壳本体的外壁上开设有用于供所述外界的噪音进入所述后腔体内的收声孔，所述收声孔与所述前馈麦克风正对。
  6. 如权利要求1所述的耳机降噪结构，其特征在于：所述喇叭座上设置有安装位，所述安装位上设置有扬声面，所述扬声面上具有用于传输所述喇叭发出的声音的出音孔，所述喇叭嵌装于所述安装位内，且所述喇叭的用于发出声音的出声面正对所述出音孔。
  7. 如权利要求6所述的耳机降噪结构，其特征在于：所述耳机降噪结构还包括用于接收所述前腔体内的噪音的反馈麦克风，所述反馈麦克风设置于所述扬声面上。
  8. 如权利要求1所述的耳机降噪结构，其特征在于：所述耳机降噪结构还包括用于将所述耳套固定于所述喇叭座上的耳套固定件，所述耳套固定件分别与所述耳套及所述喇叭座连接固定。
  9. 如权利要求8所述的耳机降噪结构，其特征在于：所述耳机降噪结构还包括用于密封所述耳套固定件与所述喇叭座之间的间隙的第一密封圈。
  10. 耳机，包括头带、两个支架以及两个耳机降噪结构，其中一个所述支架的一端与所述头带的一端连接，其中一个所述支架的另一端与其中一个所述耳机降噪结构连接，另一个所述支架的一端与所述头带的另一端连接，另一个所述支架的另一端与另一个所述耳机降噪结构连接；其特征在于：所述耳机降噪结构为权利要求1-9任一项所述的耳机降噪结构。
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