WO2020059929A1 - Method for manufacturing carbon nanotube heat dissipation material and led luminaire having same - Google Patents

Abstract

The present invention relates to a method for manufacturing a carbon nanotube heat dissipation material and an LED luminaire having same, in which: thermal conductivity, heat release speed, and heat release rate can be significantly increased by replacing the material of a heat sink part and auxiliary heat sinks with a carbon nanotube heat dissipation material instead of the conventional aluminum; heat generated from an LED module can be efficiently dissipated by maximizing a heat dissipation area through a structural change of a frame body and inducing a natural convection phenomenon at the same time; a heat dissipation effect can be maintained for a long time through simple replacement of only the auxiliary heat sinks of the carbon nanotube heat dissipation material without disassembling other parts, by configuring the auxiliary heat sinks to be detachable from the inner surface of the frame body; the uniformity of light can be improved by forming a front diffusion cover into a curved surface; and the heat dissipation effect can be further improved by forming discharge grooves formed inward on the upper surface of the heat sink part and extending to the outer surface of the heat sink part. Representative drawing figure 9

Description

Carbon nanotube heat dissipation material manufacturing method and LED luminaire

The present invention relates to a method for manufacturing a heat dissipation material for carbon nanotubes and an LED luminaire equipped with the same. Specifically, the heat sink is manufactured using a heat dissipation material for carbon nanotubes to increase heat dissipation efficiency and produce at the same time as compared to conventional aluminum. It relates to a method for manufacturing a carbon nanotube heat dissipation material that can reduce the cost and maximize heat dissipation efficiency through a simple structure change of the heat dissipation frame, and an LED luminaire equipped with the same.

Typically, a lighting device is a device that converts light energy into electrical energy to emit light. As the lighting infrastructure is developed and the fields of lighting are diversified, 20% of the total electricity consumption is used for lighting purposes. Accordingly, various studies have been conducted on high-intensity lighting with high energy efficiency.

In particular, the LED lighting device is an eco-friendly material that can not only save energy resources due to low power consumption, but also reduce waste emissions such as mercury and greenhouse gas (CO2). Therefore, it is widely used as a light source element for various lighting lamps.

However, such an LED lighting device has a disadvantage of generating local heat in a device because it emits high-brightness light from a small device. Particularly, when the LED chips are densely installed as the products have been miniaturized and integrated in recent years, the circuit may not operate normally due to the heat generated during LED emission, or the life of the LED may be shortened and the problem of reduced illumination occurs.

In other words, if the LED lighting device does not properly dissipate heat generated during LED emission, various studies have been conducted to maximize the heat dissipation efficiency since it has a significant effect on the original performance and life.

Accordingly, the applicant of the present invention is registered in Korea Patent No. 10-1147962 (invention name: LED luminaire), domestic registration patent No. 10-1239123 (invention name: LED luminaire), domestic registration patent No. 10-1256865 ( Name of the invention: LED lamp for lighting), and through domestic registration patent No. 10-1200309 (invention name: LED luminaire), researched and registered a patent for a heat dissipation frame capable of increasing heat dissipation efficiency. The LED module is configured to be installed on the substrate contact surface formed on each side to improve the uniformity of light, and at the same time, the ventilation portion of the heat dissipation frame protrudes outward from the diffusion cover so that the ventilation portion is exposed to the air so that heat exchange can be actively performed. It was possible to maximize the heat dissipation efficiency.

However, the LED luminaires have the disadvantage that they do not meet the recent trend of miniaturization and integration due to an excessively increased weight and volume of the product in order to have a desired heat dissipation effect due to the characteristic that aluminum has a high specific gravity.

In addition, the LED luminaires have a problem of increasing the manufacturing cost of the product as the frame is made of expensive aluminum material.

In order to solve this problem, the applicant of the present invention applies carbon nanotubes to the heat dissipation frame, and has applied for a heat dissipation frame to receive a patent registration.

1 is a perspective view showing a heat dissipation frame disclosed in Korean Patent No. 10-1783392 (Invention name: carbon nanotube heat dissipation material manufacturing method and heat dissipation frame for lighting device having the same).

The heat dissipation frame of FIG. 1 (hereinafter referred to as the prior art) 100 is composed of a heat dissipation plate 101, a heat dissipation body 103, and a heat dissipation assembly 105.

The heat dissipation plate 101 is formed of a disk, and a through hole penetrating both surfaces is formed in the center.

The heat dissipation body 103 is formed in a cylindrical shape in which the upper and lower portions are opened to form air moving holes therein, and is formed inward on the outer surface, extending in the height direction, and forming guide grooves formed at intervals along the arc, and air The moving hole is vertically installed on one surface of the heat dissipation plate 101 so as to be connected to the through hole of the heat dissipation plate 101.

The heat dissipation assembly 105 corresponds to a contact plate to which the LED substrate 111 on which the LED modules 112 are mounted is treated, a plate-shaped support portion vertically connected to one surface of the treatment plate, and vertically connected to an end portion of the support portion. It consists of an insert that is inserted in a sliding manner into the guide groove.

The conventional technology 100 configured as described above can replace the materials of the heat dissipating body 103 and the heat dissipation assembly 105 with carbon nanotube heat dissipation materials instead of conventional aluminum, thereby significantly increasing heat conductivity, heat dissipation rate, and heat dissipation rate. Have an advantage

However, the prior art 100 has the disadvantage that the manufacturing cost increases as the heat dissipation body 103 and the heat dissipation assembly 105 are made of an expensive carbon nanotube heat dissipation material.

In general, carbon nanotube (CNT, Carbon nanotube) has the disadvantage that long term stability (Long term stability) is lowered because the performance is degraded by the deformation of the polymer material when subjected to the lapse of time and continuous heat.

However, the prior art 100 does not take into account the characteristics of the carbon nanotubes at all, and as the heat dissipation body 103 and the heat dissipation assembly 105 are both made of a carbon nanotube heat dissipation material, long-term reliability decreases. If long-term reliability is low, the corresponding equipment has to be replaced individually, and thus, it has a disadvantage in that assembly is not only poor, but also increases the cost of equipment replacement.

The present invention is to solve this problem, the problem of the present invention is to replace the material of the heat sink and the auxiliary radiators with conventional carbon nanotube heat dissipation material instead of aluminum, significantly reducing the thermal conductivity, heat release rate and heat release rate The present invention relates to a method for manufacturing a heat dissipation material for carbon nanotubes that can be increased, and an LED luminaire equipped with the same.

In addition, another problem of the present invention is a carbon nanotube heat dissipation material, the primary ball milling step and the secondary ball milling step through the high thermal conductivity carbon composite material and metal powder to crush and mix into fine particles and at the same time the dispersion step By ensuring the dispersibility of the carbon composite material through, it is superior in thermal conductivity compared to conventional aluminum, and at the same time, it can reduce the volume and volume and induce lighter weight production. And LED luminaires having the same.

In addition, another problem of the present invention is to maximize the heat dissipation area by changing the structure of the frame body, and at the same time, induce natural convection and efficiently dissipate heat generated from the LED module. It relates to an LED luminaire equipped with it.

In addition, another problem of the present invention is that the auxiliary heat radiators of the carbon nanotube heat dissipation material can be detachably attached to the inner surface of the frame body, so that the heat dissipation effect can be maintained for a long time through simple replacement of the auxiliary heat radiators without disassembling other parts. The present invention relates to a method for manufacturing a heat dissipation material for carbon nanotubes and an LED lamp having the same.

In addition, another problem of the present invention relates to a method for manufacturing a heat dissipation material for carbon nanotubes that can improve the uniformity of light by forming a front diffusion cover with a curved surface, and an LED lamp having the same.

In addition, another problem of the present invention is a carbon nanotube heat dissipation material manufacturing method capable of further improving the heat dissipation effect by forming discharge grooves formed inward on the upper surface of the heat sink but extending to the outer surface, and the LED luminaire equipped with the same. It is about.

The solution of the present invention for solving the above problems is in the LED luminaire including the second LED substrates and the heat dissipation frame: the heat dissipation frame is formed in a polygonal column shape in which the upper and lower parts are opened, and the outer surface forming each surface. A frame body on which the substrate contact surfaces on which the second LED substrates are respectively treated are formed; It is made of a carbon nanotube heat dissipation material to further include auxiliary heat dissipating elements that are detachably attached to the inner surfaces corresponding to the substrate contact surfaces of the frame body.

In addition, in the present invention, the frame body is formed in a cylindrical shape in which the upper and lower portions are opened and through-holes are formed, and the through-holes are vertically arranged in the center of the inner space of the frame body; Each inner surface of the frame body and the outer circumferential surface of the through-hole are connected, further comprising reinforcing walls extending in the height direction, and the auxiliary heat-radiating bodies are formed in a '∪' shape on one surface facing the through-hole during assembly. It is preferable that the radiating blades extending in the height direction are formed to protrude.

In addition, in the present invention, each inner surface of the frame body is formed outwardly from the inner surface, and auxiliary groove inserting grooves extending to the upper and lower parts of the frame body are formed to face each other in the width direction, and the secondary body insert of the frame body is inserted. Grooves are formed outward from the inner surface of the frame body, the ends are extended to further form extended grooves, and the auxiliary radiators are formed in a rod shape having a length, and the heat dissipation blade protrudes on one surface, and when assembled, the frame A fixed body which is inserted in a sliding manner in a direction from the top to the bottom through the insertion groove of the auxiliary heat sink of the body; It is preferable to further include inserts that extend from both side portions adjacent to the other surface of the fixing body to both sides and are inserted into each of the extension grooves of the auxiliary heat sink insert groove of the frame body.

In addition, in the present invention, the LED luminaire has a heat sink portion that is coupled to the lower surface of the frame body to dissipate heat; Further comprising a base coupled to the lower portion of the heat sink, it is preferable that the heat sink portion is formed with a plurality of discharge grooves that are formed inward from the top surface to extend to the outer surface.

In addition, in the present invention, the heat sink portion and the auxiliary heat sinks are made of a carbon nanotube heat dissipation material, and the method of manufacturing the carbon nanotube heat dissipation material is 70 to 90% by weight of a metal powder and 10 to 30% by weight of a carbon composite material. Stirring step of stirring; A ball milling step of mixing the metal powder and the carbon composite material stirred by the stirring step in an organic solvent and then performing ball milling; It includes a heat treatment and dispersion step of mixing a crushed material crushed into fine particles by the ball milling step, polyethylene glycol (PEG, polyethylene glycol), and a polyester-based binder and blending while heating the mixed mixture to produce a heat dissipation material. And, the ball milling step is to supply the metal powder and the carbon composite material stirred by the agitation step to a ball mill jar in which the balls are accommodated, and rotate at a speed of 200 to 250 rpm to rotate the agitated metal powder and carbon. A primary ball milling step of first crushing the composite material; And a secondary ball milling step in which the crushed material crushed by the primary ball milling step is rotated at a speed of 200 to 250 rpm by using balls having a smaller diameter than the ball used in the primary ball milling step. , The primary ball milling step and the secondary ball milling step are milled by mixing 15 to 20% by weight of a mixture of a metal powder and a carbon composite material and 80 to 85% of an organic solvent, and the ball milling step comprises the carbon composite material. It is preferable that stearic acid (Stearic acid) for promoting the dispersion of 1.5 to 2.5% by weight based on the total weight.

In addition, in the present invention, the heat treatment and dispersion step simultaneously rotates the polyethylene glycol (PEG) at a rate of 50 to 70 rpm for a predetermined time, and heats it, and the crushed material and the polyester-based binder are heated in the polyethylene glycol (PEG). After mixing, the mixed mixture is rotated and heated at the same time, and the heating temperature of the heat treatment and dispersion step is the melting point of the polyethylene glycol (PEG), and the volume fraction of the polyethylene glycol (PEG) and the metal powder is 4, carbon. The volume fraction of the composite material-PEG precursor is 6, and the first ball milling step is performed for 1 hour cycle, then the process is stopped for 30 minutes, and the process performed for 1 hour cycle is repeated 4 times, The second ball milling step is preferably performed for about 3 to 5 hours.

In the present invention, the carbon composite material is a single-walled carbon nanotube (SWCNT, single-walled carbon nanotube), double-walled carbon nanotube (DWCNT, double-walled carbon nanotube), multi-walled carbon nanotube (MWCNT, multi-walled carbon) nanotube), a bundle carbon nanotube, or a combination thereof, and the polyethylene glycol (PEG) in the heat treatment and dispersion step preferably has a molecular weight of 15,000 to 20,000MW.

In addition, in the present invention, each of the connecting portions between the adjacent substrate contact surfaces of the frame body is formed inward from the outer surface to form through holes connected to the inner space of the frame body, and the through holes are adjacent substrate contact surfaces. Connected to each but formed to extend in the height direction to the upper and lower parts of the frame body, adjacent substrate contact surfaces are formed to be spaced apart from each other by a through hole, and each connecting portion of the frame body has a side portion of each of the adjacent substrate contact surfaces. It is preferable that the auxiliary extensions in the form of a plate material protruding obliquely from the outside but extending in the height direction and spaced apart from each other to expose the corresponding through hole to the outside.

Also, in the present invention, at least one bolt hole is formed on the fixing body of the auxiliary heat sinks, and bolt grooves corresponding to the bolt holes of the auxiliary heat sinks are formed on inner surfaces of the frame body, so that the frame body and the auxiliary heat sinks are formed. The body is fixed by bolt fastening, and sliding grooves are formed on both sides of the substrate contact surfaces of the frame body in which both sides of the second LED substrates are inserted in a sliding manner, and the LED luminaires are provided as sliding grooves of the substrate contact surfaces. It further includes second diffusion covers that are inserted and emit light from a second LED substrate that is abutted against the substrate contact surfaces, and the LED luminaire includes a power supply installed inside the base, and the power supply The main power supply module for supplying power to the second LED substrate; The auxiliary power supply module further includes an auxiliary power supply module connected to a connector to be detachable from the main power supply module, and the auxiliary power supply module is connected in parallel between the output terminal of the main power supply module and the second LED substrates. After detecting the ripple of the main power supply module, if the detected ripple is greater than or equal to a preset reference value, the ripple is removed at the output voltage, and the LED luminaire is a first LED substrate installed on the upper end of the frame body, and the first LED substrate. It includes a front diffusion cover for diffusing the light, the front diffusion cover is preferably formed in a spherical shape with one side open.

According to the present invention having the above-described problems and solving means, the heat conductivity, heat release rate and heat release rate can be significantly increased by replacing the material of the heat sink and the auxiliary heat radiators with a carbon nanotube heat dissipation material instead of conventional aluminum.

In addition, according to the present invention, when carbon nanotube heat dissipation material is manufactured, the carbon composite material and metal powder having high thermal conductivity are crushed and mixed into fine particles through the primary ball milling step and the secondary ball milling step, and at the same time, the carbon composite is made through the dispersion step. By ensuring the dispersibility of the material, compared to conventional aluminum, the thermal conductivity is excellent, and at the same time, the volume and volume can be reduced to induce lighter weight production, and the production cost can be reduced.

In addition, according to the present invention, the heat dissipation area is maximized by changing the structure of the frame body, and at the same time, natural convection is induced to efficiently dissipate heat generated from the LED module.

In addition, according to the present invention, by configuring the auxiliary heat radiators of the carbon nanotube heat dissipation material to be detachably attached to the inner surface of the frame body, the heat dissipation effect can be maintained for a long time through simple replacement of the auxiliary heat radiators without disassembling other parts.

In addition, according to the present invention, the uniformity of light can be improved by forming the front diffusion cover as a curved surface.

In addition, according to the present invention, it is possible to further improve the heat dissipation effect by forming discharge grooves formed inwardly on the upper surface of the heat sink but extending to the outer surface.

1 is a perspective view showing a heat dissipation frame disclosed in Korean Patent No. 10-1783392 (Invention name: carbon nanotube heat dissipation material manufacturing method and heat dissipation frame for lighting device having the same).

2 is a process flow chart showing a method of manufacturing a carbon nanotube heat dissipation material applied to a heat dissipation frame according to an embodiment of the present invention.

3 is a SEM (Scanning Electron Microscope) photograph showing the surfaces of Example 1 and Comparative Examples 1 and 2 measured by FESEM (Field Emission Scanning Electron Microscope) surface analysis.

4 is a graph showing the XRD pattern results of Examples 1 and 2 and Comparative Example 1.

5 is a graph showing the structural analysis by FT-IR of Examples 1, 2 and Comparative Example 3.

6 is a graph showing thermal conductivity of Examples 1 and 2 and Comparative Example 3.

7 is a graph of measuring the temperature for 2 hours when light is emitted by installing Example 1, 2 and Comparative Example 2 on an LED lamp.

Figure 8 (a) shows the heat dissipation characteristics of the conventional aluminum material is applied to the heat dissipation, (b) shows the heat dissipation characteristics of the heat dissipation body is applied to the carbon nanotube heat dissipation material of the present invention.

9 is an exploded perspective view showing an LED luminaire as an embodiment of the present invention.

10 is a perspective view showing the heat radiation frame of FIG. 9.

11 is a partially exploded perspective view of FIG. 10.

12 is a plan view of FIG. 10.

13 is a perspective view showing the frame body of FIG. 10.

14 is a perspective view showing the auxiliary heating element of FIG. 10.

15 is a plan view illustrating a heat dissipation structure of the heat dissipation frame of FIG. 10.

FIG. 16A is an exemplary view for explaining the heat dissipation structure of the heat dissipation frame and heat sink portion of FIG. 9, and (B) is another illustration of (A).

17 is an exemplary view showing a power supply installed inside the base of FIG. 9.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

2 is a process flow chart showing a method of manufacturing a carbon nanotube heat dissipation material applied to a heat dissipation frame according to an embodiment of the present invention.

The method for manufacturing a carbon nanotube heat dissipation material (S1) is a carbon nanotube heat dissipation material that is a composition applied to the heat sink 4 of the LED luminaire 1 of FIGS. 9 to 17 described later for dissipating heat generated during light emission. It relates to a method for manufacturing.

That is, the carbon nanotube heat dissipation material is installed in the lighting device and can be applied as a heat dissipation material for dissipating local heat generated from the LED.

In addition, the manufacturing method of the carbon nanotube heat dissipation material (S1), as shown in Figure 2, the stirring step (S10), the primary ball milling step (S20), the secondary ball milling step (S30), heat treatment and dispersion step (S40).

The stirring step (S10) is a process step of stirring the metal powder 70 to 90% by weight, and the carbon composite material 10 to 30% by weight. At this time, the carbon composite material is single-walled carbon nanotube (SWCNT), double-walled carbon nanotube (DWCNT), multi-walled carbon nanotube (MWCNT, multi-walled carbon nanotube), bundle Type carbon nanotubes (rope carbon nanotube) or a combination thereof, carbon nanotubes (CNT) is a hexagonal shape consisting of six carbons are connected to each other to form a tube shape, multi-walled carbon nanotubes (MWCNT) are a plurality The dog's tubes form a concentric shape.

At this time, the metal powder may be composed of a metal powder having high thermal conductivity, and in detail, it is preferable that it is an aluminum powder.

In addition, in the stirring step (S10), the carbon composite material does not affect the shape of the radiator, but if the content is less than 10% by weight, the content of the carbon composite material is excessively reduced, and the thermal conductivity, heat release rate, and heat release rate decrease. , If the content is more than 30% by weight, dispersion becomes difficult, which causes a problem in that the physical properties of the radiator are deteriorated.

In addition, the mixture of the metal powder and the carbon composite material stirred by the stirring step (S10) is supplied to the first ball milling step (S20).

The first ball milling step (S20) is a process step of primary grinding and crushing of a mixture of metal powder and carbon composite material stirred by the stirring step (S10) using a known ball milling equipment.

In addition, the first ball milling step (S20) supplies 15 to 20% by weight of a mixture of agitated metal powder and carbon composite material, and 80 to 85% by weight of an organic solvent to a ball mill jar, a port for receiving the balls. The metal powder and carbon composite material are crushed by rotating the ball mill at a rotation speed of 200 to 250 rpm. At this time, as the organic solvent, ether, acetone, alcohol, etc. may be applied, and in detail, it is preferable that it is ethanol.

In addition, the first ball milling step (S20) may add a dispersion accelerator of 1.5 to 2.5% by weight relative to the weight of the metal powder, carbon composite material and organic solvent, wherein the dispersion accelerator promotes dispersion of the carbon composite material. It is preferred to have stearic acid.

In addition, the first ball milling step (S20) performs the process for a period of approximately 1 hour (T), and taking into account the characteristics of ethanol generating heat during friction, the process is stopped by rotating for about 30 minutes after one process. When not performed, the process performed for a period of 1 hour (T) is called 4 times, and the process is performed 4 times.

In addition, the primary crushed material primary crushed by the primary ball milling step (S20) is supplied to the secondary ball milling step (S30).

The secondary ball milling step (S30) is a process step for more finely crushing the primary crushed primary crushed material by the primary ball milling step (S20) using a known ball milling equipment.

At this time, the balls applied in the second ball milling step (S30) are made of a smaller diameter than the balls applied in the first ball milling step (S20).

In addition, the second ball milling step (S30) is the primary crushed primary crushed material (metal powder + carbon composite material) and the organic solvent by the primary ball milling step (S20) into a ball mill jar in which the balls are accommodated. After feeding, the primary crushed material is further finely crushed by rotating the ball mill for approximately 3 to 5 hours at a rotational speed of 200 to 250 rpm.

In addition, the secondary crushed material (metal powder + carbon composite material) crushed by the secondary ball milling step (S30) is supplied to the heat treatment and dispersion step (S40).

In the heat treatment and dispersion step (S40), the carbon composite material of the secondary crushed material supplied from the secondary ball milling step (S30) has a high cohesive force and thus has a low dispersion force, and at the same time, the mechanical properties of the metal powder and the carbon composite material are different and difficult to embed. This is a process step for dispersing and embedding the carbon composite material into the finely crushed metal powder in consideration of characteristics.

At this time, the embedded is defined as a phenomenon in which the carbon composite material is attached to a part of the metal powder whose surface is amorphized while being finely crushed through the primary and secondary ball milling steps (S20) and (S30).

In addition, in the heat treatment and dispersion step (S40), polyethylene glycol (hereinafter referred to as PEG) is used as a solvent for mixing the metal powder and the carbon composite material of the secondary crushed material supplied from the second ball milling step (S30). .

At this time, polyethylene glycol (PEG) is applied to the polyethylene glycol having a molecular weight of approximately 15,000 ~ 20,000MW.

In addition, in the heat treatment and dispersion step (S40), a polyester-based binder is added to increase the viscosity of the mixture.

In addition, in the heat treatment and dispersion step (S40), first, polyethylene glycol (PEG) is rotated at a speed of 50 to 70 rpm using a known twin screw mixer, and at the same time, the melting point of polyethylene glycol (PEG) is 65 to 75 ° C, approximately 20 minutes. Heat up. Subsequently, a secondary crushed material (metal powder + carbon composite material) and a polyester-based binder are added to heated polyethylene glycol (PEG), and these compounds (PED + metal powder + carbon composite material + polyester-based binder) are added. It rotates at a speed of 50 to 70 rpm and heats at a temperature of 65 to 75 ° C for 30 minutes.

That is, in the heat treatment and dispersion step (S40), the carbon nanotube heat dissipation material of the present invention is manufactured by uniformly dispersing and embedding the carbon composite material in a metal powder by blending while melting the compound.

At this time, in the heat treatment and dispersion step (S40), the volume fraction of the polyethylene glycol (PEG) and the metal powder is 4, and the volume fraction of the carbon composite material-PEG precursor is preferably 6.

As described above, the carbon nanotube heat dissipation material manufactured by FIG. 2 includes a metal powder, a carbon composite material, a binder, and PEG, and when heat is applied for processing during heat dissipation, the binder is dissipated and PEG is fine as it is volatilized. The pores of the structure are formed, and through these pores, high-temperature heat is emitted from the LED heat dissipation structure, thereby increasing heat dissipation efficiency.

Example 1 is a heat sink made of a heat dissipation material to which 20% by weight of carbon nanotubes (CNT) and 80% by weight of aluminum powder are added in the stirring step (S10) of FIG. 2.

Example 2 is a heat sink made of a heat dissipation material to which 30% by weight of carbon nanotubes (CNT) and 70% by weight of aluminum powder are added in the stirring step (S10).

Comparative Example 1 is a heat sink made of a heat dissipation material to which 100% by weight of aluminum powder is added without adding carbon nanotubes (CNT) in the stirring step (S10).

Comparative Example 2 is a heat sink made of a heat dissipation material to which 40% by weight of carbon nanotubes (CNT) and 60% by weight of aluminum powder are added in the stirring step (S10).

3 is a SEM (Scanning Electron Microscope) photograph showing the surfaces of Example 1 and Comparative Examples 1 and 2 measured by FESEM (Field Emission Scanning Electron Microscope) surface analysis.

In Comparative Example 1, since only the aluminum powder is added without the addition of carbon nanotubes (CNT) in the stirring step (S10), it is found that many defects occur on the fracture surface as shown in (a) of FIG. 3. You can.

In Example 1, since 20% by weight of carbon nanotubes (CNT) and 80% by weight of aluminum are added in the stirring step (S10), as shown in FIG. 3 (b), 20% by weight of carbon nanotubes (CNT) As it is added, it can be seen that voids are generated in the fracture surface, and in Comparative Example 2, 40% by weight of carbon nanotubes (CNT) is added, and as shown in FIG. 3 (c), more voids are generated in the fracture surface. You can see that

At this time, the pores are formed as the binder is destroyed and PEG is volatilized when a heat dissipation sample is produced by applying heat after preparing a carbon nanotube heat dissipation material.

That is, it can be seen that as the content of the carbon nanotubes (CNT) increases, the voids are actively formed and the heat emission efficiency increases.

Referring to (b) and (c) of FIG. 3, as the content of carbon nanotubes (CNT) increases, the number of carbon nanotubes (CNT) that binds to the aluminum powder on the surface of the radiator increases, and relatively carbon It can be seen that the dispersion of the nanotubes (CNT) is uniform.

4 is a graph showing the XRD pattern results of Examples 1 and 2 and Comparative Example 1.

Referring to Figure 4, the carbon nanotube heat dissipation material of the present invention 2

= Crystallization at 26.50, 54.60, 2

= 26.50, it can be seen that the main crystallization is achieved, and the intensity of the crystallization peak of the carbon nanotube heat dissipation material decreases as the content of the carbon nanotube (CNT) increases.

In particular, when the carbon nanotube heat dissipation material contains more than 30% by weight of carbon nanotubes (CNT), the intensity of the main peak is reduced to the greatest extent, so the content of carbon nanotubes (CNT) affects the intensity of the peak. It can be seen that the intensity of the peak of the heat dissipation material decreases as the content of the carbon nanotubes (CNT) increases.

That is, as shown in FIGS. 3 and 4, the content of carbon nanotubes (CNT) affects the microstructure, micropores, and crystallization of the carbon nanotube heat dissipation material.

5 is a graph showing the structural analysis by FT-IR of Examples 1, 2 and Comparative Example 3.

Looking at the present invention with reference to Figure 5, the carbon nanotube heat dissipation material shows the intensity at a similar peak regardless of the content of the carbon nanotube (CNT).

Also, 2,937 carbon nanotube heat dissipation materials

And 3,450

Peaks represent typical C-H and -OH groups, respectively,

And 1,200

The peak of represents the peak of C = O bond and acetyl, respectively.

Also in the FT-IR spectrum 1,266

, 1,369

, 1,446

It can be seen that the peak of the back increases with the content of carbon nanotubes (CNT).

That is, the peak of the heat dissipation material is determined by the intrinsic peak of the carbon nanotubes (CNT), and consequently, the binding of the carbon nanotubes (CNT) included in the heat dissipation material of the carbon nanotubes is increased.

FIG. 6 is a graph showing the thermal conductivity of Examples 1, 2 and Comparative Example 3, and FIG. 7 is a graph measuring Examples 2, 2 and Comparative Example 2 on the LED lamp and measuring the temperature for 2 hours during which light is emitted. In Figure 8, (a) shows the heat dissipation characteristics of the radiator to which the conventional aluminum material is applied, and (b) shows the heat dissipation characteristics of the radiator to which the carbon nanotube heat dissipation material of the present invention is applied.

Looking at the present invention with reference to Figure 6, it can be seen that as the content of the carbon nanotubes (CNT) increases, the thermal conductivity of the heat dissipation material of the carbon nanotubes increases. That is, it can be seen that the thermal conductivity of the carbon nanotube heat dissipation material is improved according to the characteristics of the carbon nanotube (CNT) having excellent thermal conductivity.

At this time, since the carbon nanotube (CNT) has a thermal conductivity value of approximately 3,000 W / m.k or less, not only can the thermal conductivity of the carbon nanotube heat dissipation material be improved, but also the thermal conductivity may be improved by controlling the content with the aluminum powder.

Looking at the present invention with reference to Figure 7, Example 1, 2 and Comparative Examples 1, 2, the initial temperature measured in the heat sink is 27 ℃, but as time passes, the temperature is increased by the heat generated by the LED lamp .

After 1 hour in this state, it can be seen that Comparative Example 1 in which carbon nanotubes (CNT) were not added was overheated to 72 ° C or higher.

However, looking at Examples 1, 2 and Comparative Example 2 in which carbon nanotubes (CNT) are added, it can be confirmed that the heat dissipation efficiency is improved as the temperature range for 2 hours is measured at less than 70 ° C.

That is, the present invention, as shown in Figure 8 (a), (b), contains a carbon composite material having excellent thermal conductivity can significantly increase the heat dissipation rate and heat dissipation efficiency compared to a conventional heat dissipation material made of aluminum. have.

9 is an exploded perspective view showing an LED luminaire as an embodiment of the present invention.

As shown in FIG. 9, the LED luminaire 1, which is an embodiment of the present invention, has a heat dissipation frame 3, a heat sink 4, a base 5, a first LED substrate 6, and a front diffusion cover ( 7), consisting of second LED substrates (8), side diffusion covers (9), and packing means (10).

The base 5 is coupled to the lower portion of the heat sink portion 4, and the connection portion 51 for connecting with an external socket (not shown) is formed at the end portion, so that power from the outside is transferred to the LED substrates 6, 8 Feed them.

At this time, the power supply device 20 of FIG. 17 to be described later is installed inside the base 5.

The heat sink 4 has an upper surface coupled to the heat dissipation frame 3 and a lower surface coupled to the base 5.

In addition, a plurality of discharge grooves 41 for discharging internal heat to the outside are formed on the heat sink 4.

In addition, the upper surface of the heat sink 4 is formed in a shape corresponding to the shape of the heat dissipation frame 3 in contact, so that the heat dissipation frame 3 can be firmly coupled.

In addition, the heat sink 4 was made of the carbon nanotube heat dissipation material of FIGS. 2 to 8 described above to maximize the heat dissipation effect.

The first LED substrate 6 is a substrate on which a circuit for lighting and flashing the LED modules 61 mounted with the plurality of LED modules 61 mounted thereon is printed. At this time, the LED modules 61 emit light toward the top.

In addition, the first LED substrate 6 is coupled to the upper end of the heat dissipation frame 3 to emit light toward the top. At this time, the packing means 10 may be installed at the joining point of the first LED substrate 6 and the heat dissipation frame 3 to improve water tightness.

The front diffusion cover 7 is formed in a hemisphere shape in which one side is opened, and the first LED substrate 6 is inserted into the opening to diffuse light emitted from the first LED substrate 6.

At this time, the front diffusion cover 7 was formed to have an outer surface of a hemispherical curved surface 71 to improve the uniformity of light.

The second LED substrates 8 are substrates on which a circuit for lighting and flashing the LED modules 81 on which the plurality of LED modules 81 are mounted is mounted.

In addition, the second LED substrates 8 are installed to face each of the substrate contact surfaces 313 of the heat dissipation frame 3 of FIG. 6 to be described later, so that light can be emitted at various angles toward the side.

At this time, the LED modules 81 emit light toward the side.

FIG. 10 is a perspective view showing the heat dissipation frame of FIG. 9, FIG. 11 is a partially exploded perspective view of FIG. 10, and FIG. 12 is a plan view of FIG. 10.

As shown in FIGS. 10 to 12, the heat dissipation frame 3 is formed of a square pillar-shaped frame body 31 in which a space is formed inside the upper and lower openings, and a frame body 31 formed of a carbon nanotube heat dissipation material. ) Is made of plate-shaped auxiliary heat sinks (33) that are detachably attached.

13 is a perspective view showing the frame body of FIG. 10.

The frame body 31 is formed in a square pillar shape in which a space is formed inside the upper and lower portions as shown in FIG. 13, and the lower portion is coupled to the heat sink portion 4, and the upper portion has a front diffusion cover 7 ) And the first LED substrate 6 are combined.

In addition, the frame body 31 has the same length therein, the upper and lower portions are opened, and a through portion 311 in which a through hole 3111 is formed in a height direction is installed.

At this time, between the through portion 311 and each inner surface of the frame body 31 are connected to each other by reinforcing walls 312.

The through-hole 311 is configured such that cold air flows in from the lower opening, and internal hot air is discharged to the outside through the upper opening, thereby activating air circulation to effectively heat-exchange and heat-dissipate the heat dissipation frame 3.

That is, the through-hole portion 311 receives heat from the frame body 31 through the reinforcing walls 312, and discharge heat is transferred to the outside through the through-hole 3111 to increase heat dissipation efficiency.

In addition, on each of the surfaces of the frame body 31, the substrate contact surfaces 313 are formed of a flat plate material and the second LED substrates 8 are respectively treated. At this time, in the present invention, for convenience of explanation, the frame body 31 is formed in a quadrangular prism shape, and the substrate contact surfaces 313 are formed in four, for example, but the shape of the frame body 31 is not limited thereto. , It may be formed in a cylindrical or polygonal shape, it is natural that the quantity of the substrate contact surface 313 may be configured in a quantity corresponding to the shape of the frame body 31.

In addition, sliding grooves 3131 and 3131 'are formed to extend in the height direction on both sides of the substrate contact surfaces 313, and the second LED substrates are the sliding grooves 3131 and 3131' of the substrate contact surfaces 313. (8) by inserting the both sides of the sliding direction in the direction from the top to the bottom, so as to increase the assembly. At this time, the substrate contact surface 313 and the second LED substrate 8 are installed so that the opposite surfaces are opposed to each other, and the sliding grooves 3131 and 3131 'of the substrate contact surface 313 on which the second LED substrate 8 is installed. ) To both sides of the side diffusion cover 9 is reinserted to be coupled.

In addition, through-holes 3151 formed inward from the outer surface and connected to the inner space are formed in the connecting portions 315 between the adjacent substrate contact surfaces 313 of the frame body 31, respectively. At this time, the through holes 3151 are formed on the adjacent substrate contact surfaces 313, but are formed to extend in the height direction to the upper and lower parts, so that the adjacent substrate contact surfaces 313 of the frame body 31 pass through the through holes 3151. It is formed to be spaced apart from each other.

The through holes 3151 of the connecting portions 315 can increase the heat dissipation efficiency by further increasing the heat dissipation area of the heat dissipation frame 3.

In addition, in each of the connecting portions 315 of the frame body 31, auxiliary extension portions 3153 and 3154 that protrude inclined outwardly from each side of the adjacent substrate contact surfaces 313 and are formed to extend in the height direction. The protrusion is formed. At this time, the auxiliary extension portion 3153 is formed to be spaced apart from the opposite auxiliary extension portion 3154, thereby extending the through hole 3151 to the outside, thereby making air circulation more active.

In addition, the inner surface 316 of the frame body 31 is formed on the outside from the inner surface 316, extending in the height direction extending to the upper and lower surfaces of the frame body 31, the secondary heating element insertion grooves 317, 317 ' ) Are formed to face in the width direction.

At this time, the auxiliary heat sink insert grooves 317 and 317 'are formed outward from the inner surface 316 of the frame body 31, and extended grooves 3171 and 3317' extending to both sides are formed. Reinforcing walls 312 are vertically connected to the inner surface 316 of the frame body 31 between them.

In addition, the carbon nanotube heat dissipation material to form the auxiliary heat sink 33 by inserting the auxiliary heat sink 33 of FIG. 7 to be described later in a sliding direction from the top to the bottom as the auxiliary heat sink insert groove 317 The periodic replacement of the auxiliary heat radiator 33 can be performed simply and quickly in consideration of a characteristic in which long-term reliability decreases as time elapses at a high temperature.

14 is a perspective view showing the auxiliary heating element of FIG. 10.

The auxiliary heat sink 33 of FIG. 14 is made of the carbon nanotube heat dissipation material of FIGS. 2 to 8 described above, and the auxiliary heat sink insert groove 317 of each inner surface 316 of the frame body 31 of FIG. 13 described above is 317. ) Is inserted in a sliding manner from the top to the bottom to be contacted with the substrate contact surface 313, thereby effectively dissipating heat transmitted from the second LED substrate 8 through the substrate contact surface 313, and at the same time, an auxiliary radiator ( Periodic replacement of 33) becomes possible.

In addition, the auxiliary radiator 33 has a rod-shaped fixture 351 having a length and area, and inserts 353 and 354 extending outwardly on both sides of the fixture 351, and '과' It is formed in a ruler shape and is formed of a radiating blade 355 protrudingly formed on the front surface of the fixing body 351 and extending in a height direction.

At this time, when a plurality of bolt holes 3511 are formed on the front surface of the fixing body 351 of the auxiliary heat sink 33, when the auxiliary heat sink 33 is inserted into the auxiliary heat sink insert groove 317 of the frame body 31, , It can be coupled to the frame body 31 more firmly through the bolt (B) fastening.

In addition, when the auxiliary radiator 33 is assembled, the fixing body 351 is inserted into the radiator insert groove 317 of the frame body 31, and the inserts 353 and 354 are inserted into the radiator insert groove 317. ) Even if external shock and vibration occur by being inserted into the extended grooves 3171 and 3171 ', the inserts 353 and 354 are supported on the sidewalls forming the extended grooves 3171 and 3317'. As a result, the auxiliary heat radiator 33 can be firmly fixed to the frame body 31.

FIG. 15 is a plan view for explaining the heat dissipation structure of the heat dissipation frame of FIG. 10, and FIG. 16 (a) is an illustration for explaining the heat dissipation structure of the heat dissipation frame and heat sink of FIG. 9, and (b) is It is another example of (a).

15, the heat generated from the LED module of the second LED substrate is transferred through the substrate contact surface-> auxiliary heat radiator and heat dissipation wall-> junction and through hole. At this time, the substrate contact surface of the heat dissipation frame 3 is formed with a large area and a through hole is formed therein, and through holes are formed in each joint to maximize the heat dissipation area, and carbon nanotubes are located inside each substrate contact surface. It is possible to further improve the heat dissipation efficiency by installing an auxiliary heat radiator of heat dissipation material.

At this time, the hot air discharged to the inside of the through hole is quickly exchanged by the natural convection phenomenon of the through hole, and the hot air discharged outside the through hole does not stay in the inner space and passes through the through holes of the junction. Since it is quickly discharged, it is possible to effectively dissipate heat generated from the LED.

In addition, as shown in (a), (b) of FIG. 16, the heat sink portion 4 coupled to the lower portion of the heat dissipation frame 3 is formed with discharge grooves on the upper surface to be contacted, thereby allowing the heat dissipation frame 3 to pass through. And it is possible to quickly discharge the air flowing through the interior space to the outside.

17 is an exemplary view showing a power supply installed inside the base of FIG. 9.

The power supply device 20 of the present invention, as shown in Figure 17, the main power supply module 21 and the main power supply module 21 is connected to the auxiliary power supply module 23 for supplying auxiliary power , Made of a connector 25 connected between them. At this time, the auxiliary power supply module 23 is electrically connected to the output terminal of the main power supply module 21 to supply power to the LED substrates 6 and 8 in a transfer operation.

In addition, the auxiliary power supply module 23 is connected in parallel between the output terminal of the main power supply module 21 and the LED substrates 6 and 8, and detects a ripple from the output terminal of the main power supply module 21. Then, when the detected ripple value exceeds the preset reference value, power is normally supplied due to damage to the electrolytic capacitor due to the occurrence of ripple in the main power supply module 23 by outputting the voltage with the ripple removed to the output voltage to the LED substrates. The phenomenon that cannot be achieved can be prevented.

In addition, the connector 25 is installed to electrically connect or disconnect the main power supply module 21 and the auxiliary power supply module 23.

That is, since the auxiliary power supply module 23 is configured to be connected to or disconnected from the main power supply module 21 through the connector 25, for example, when the auxiliary power supply module 23 is defective or broken, the connector 25 ) By being separated from the main power supply module 21, only the auxiliary power supply module 23 can be replaced without replacing both the main power supply module 21 and the auxiliary power supply module 23, and accordingly replacement work And time.

In this way, the LED luminaire 1, which is an embodiment of the present invention, can replace the materials of the heat sink and the auxiliary radiators with conventional carbon nanotube heat dissipation materials rather than aluminum, so that the heat conductivity, heat release rate, and heat release rate can be significantly increased. do.

In addition, the LED luminaire (1) of the present invention crushes and mixes carbon composite material and metal powder having high thermal conductivity into fine particles through the primary ball milling step and the secondary ball milling step when producing carbon nanotube heat dissipation material, and simultaneously disperses and disperses them. By ensuring the dispersibility of the carbon composite material through the steps, it is possible to induce lighter weight production by reducing the volume and volume while at the same time having superior thermal conductivity compared to conventional aluminum, and reducing production cost.

In addition, the LED luminaire 1 of the present invention maximizes the heat dissipation area by changing the structure of the frame body, and at the same time, induces natural convection to efficiently dissipate heat generated from the LED module.

In addition, the LED luminaire 1 of the present invention is configured so that the auxiliary heat radiators of the carbon nanotube heat dissipation material can be detachably attached to the inner surface of the frame body, so that the heat dissipation effect can be continued for a long time through simple replacement of the auxiliary heat radiators without disassembling other parts. You can.

In addition, the LED luminaire 1 of the present invention can improve the uniformity of light by forming the front diffusion cover as a curved surface.

In addition, the LED luminaire (1) of the present invention is formed on the upper surface of the heat sink, but by forming discharge grooves extending to the outer surface, it is possible to further improve the heat dissipation effect.

S1: Manufacturing method of carbon nanotube heat dissipation material S10: Stirring step

S20: 1st ball milling step S30: 2nd ball milling step

S40: heat treatment and dispersion step;

1: LED luminaire 3: Heat dissipation frame 4: Heat sink

5: Base 6: 1st LED substrate 7: Front diffusion cover

8: 2nd LED substrate 9: Side diffusion cover 10: Packing means

20: power supply 21: main power supply module 23: auxiliary power supply module

25: connector 31: frame body 33: auxiliary heating element

311: through hole 312: reinforcement wall 313: substrate contact surface

315: Connection 316: Inner 317: Auxiliary heating element insertion groove

351: fixed body 353, 354: inserts 355: radiating blade

As described above, related contents have been described in the best mode for carrying out the invention.

The present invention can be used in manufacturing devices, LED luminaires, lighting devices, and the like.

Claims (9)

1. In the LED luminaires including the second LED substrates and the heat dissipation frame:

   The heat dissipation frame

   A frame body formed in a polygonal column shape in which upper and lower portions are opened, and substrate contact surfaces on which the second LED substrates are respectively adjoined on an outer surface forming each surface;

   LED luminaires made of carbon nanotube heat dissipation material and further comprising auxiliary heat dissipating elements which are detachably attached to inner surfaces corresponding to the substrate contact surfaces of the frame body.
2. The method according to claim 1, wherein the frame body

   A through-hole formed in a cylindrical shape in which the upper and lower portions are opened and through-holes are formed, and vertically disposed in the center of the inner space of the frame body;

   It connects each inner surface of the frame body and the outer peripheral surface of the through-hole, and further includes reinforcing walls extending in the height direction,

   When the assembly is assembled, the LED luminaire is characterized in that a heat dissipation blade extending in the height direction is formed protrudingly in a '∪' shape on one surface facing the through-hole.
3. The method according to claim 2, wherein each inner surface of the frame body is formed to the outside from the inner surface, the secondary heating element insertion grooves extending to the upper and lower parts of the frame body are formed to face in the width direction,

   The auxiliary heating element insertion grooves of the frame body are formed outward from the inner surface of the frame body, but the ends are extended to further form extension grooves,

   The auxiliary heating elements

   It is formed in the shape of a rod having a length, the heat dissipation blade protrudes on one surface, the fixing body is inserted in a sliding manner in the direction from the top to the bottom into the auxiliary heat sink insert groove of the frame body during assembly;

   LED luminaires further comprising inserts extending from both sides adjacent to the other surface of the fixture to both sides and being inserted into each of the extension grooves of the auxiliary heat sink insert groove of the frame body.
4. The method according to claim 3, wherein the LED luminaire

   A heatsink unit having an upper surface coupled to a lower portion of the frame body to radiate heat;

   Further comprising a base coupled to the lower portion of the heat sink,

   The heat sink portion is formed on the upper surface from the inside of the LED luminaire, characterized in that a plurality of discharge grooves extending to the outer surface is formed.
5. The method according to claim 4, wherein the heat sink and the auxiliary heat sink are made of a carbon nanotube heat dissipation material,

   Method of manufacturing the carbon nanotube heat dissipation material

   Agitation step of stirring the metal powder 70 to 90% by weight and 10 to 30% by weight of the carbon composite material;

   A ball milling step of mixing the metal powder and the carbon composite material stirred by the stirring step in an organic solvent and then performing ball milling;

   It includes a heat treatment and dispersion step of mixing the crushed material crushed into fine particles by the ball milling step, polyethylene glycol (PEG, polyethylene glycol), and a polyester-based binder and blending while heating the mixed mixture to produce a heat dissipation material. and,

   The ball milling step

   After supplying the metal powder and the carbon composite material stirred by the stirring step to a ball mill jar in which the balls are accommodated, rotating at a speed of 200 to 250 rpm to primary crush the stirred metal powder and carbon composite material. Primary ball milling step;

   And a secondary ball milling step in which the crushed material crushed by the primary ball milling step is rotated at a speed of 200 to 250 rpm by using balls having a smaller diameter than the ball used in the primary ball milling step. ,

   The primary ball milling step and the secondary ball milling step are milled by mixing 15 to 20% by weight of a mixture of a metal powder and a carbon composite material and 80 to 85% of an organic solvent,

   In the ball milling step, LED luminaires characterized in that stearic acid for promoting dispersion of the carbon composite material is added in an amount of 1.5 to 2.5% by weight relative to the total weight.
6. The method according to claim 5, wherein the heat treatment and dispersion step

   The polyethylene glycol (PEG) is rotated at a rate of 50 to 70 rpm for a predetermined period of time and heated at the same time, the crushed material and the polyester-based binder are mixed with the heated polyethylene glycol (PEG), and then the mixed mixture is rotated. And simultaneously heated,

   The heating temperature of the heat treatment and dispersion step is the melting point of the polyethylene glycol (PEG), the volume fraction of the polyethylene glycol (PEG) and the metal powder is 4, the volume fraction of the carbon composite material-PEG precursor is 6,

   In the first ball milling step, the process is performed for a period of 1 hour, and then the process is stopped for 30 minutes, the process performed for a period of 1 hour is repeated 4 times, and the secondary ball milling step is performed for about 3 to 5 hours LED luminaire, characterized by performing a milling process.
7. The method according to claim 6, The carbon composite material is single-walled carbon nanotubes (SWCNT, single-walled carbon nanotube), double-walled carbon nanotubes (DWCNT, double-walled carbon nanotube), multi-walled carbon nanotubes (MWCNT, multi -walled carbon nanotube), bundle carbon nanotube, or a combination thereof,

   The polyethylene glycol (PEG) of the heat treatment and dispersion step is a LED luminaire, characterized in that it has a molecular weight of 15,000 ~ 20,000MW.
8. The method according to claim 4 or 6, In each of the connecting portions between the adjacent substrate contact surfaces of the frame body, through holes formed inward from the outer surface and connected to the inner space of the frame body are respectively formed,

   The through holes are connected to each of the adjacent substrate contact surfaces, but are formed to extend in the height direction to the upper and lower parts of the frame body, so that adjacent substrate contact surfaces are spaced apart from each other by the through holes,

   Each joint portion of the frame body protrudes outwardly from each side of each of the adjacent substrate contact surfaces but extends in the height direction and is formed to be spaced apart from each other to form auxiliary extensions in the shape of a plate that exposes the through hole to the outside. LED luminaire characterized in that.
9. The method according to claim 4, At least one bolt hole is formed in the fixing body of the auxiliary heat radiators,

   On the inner surfaces of the frame body, a bolt groove corresponding to the bolt hole of the auxiliary heat sinks is formed so that the frame body and the auxiliary heat sinks are fixed by bolt fastening,

   Sliding grooves are formed on both sides of the substrate contact surfaces of the frame body in which both sides of the second LED substrates are inserted in a sliding manner,

   The LED luminaire further includes second diffusion covers that are inserted into sliding grooves of the substrate contact surfaces and emit light from a second LED substrate that is opposite to the substrate contact surfaces,

   The LED luminaire includes a power supply installed inside the base,

   The power supply

   A main power supply module that supplies power to the second LED substrates;

   Further comprising an auxiliary power supply module connected to the connector to be detachable from the main power supply module,

   The auxiliary power supply module is connected in parallel between the output terminal of the main power supply module and the second LED substrates, and after detecting the ripple of the main power supply module, if the detected ripple is greater than or equal to a preset reference value, it is connected to the output voltage. Remove the ripple,

   The LED luminaire

   It includes a first LED substrate installed on the upper end of the frame body, and a front diffusion cover for diffusing the light of the first LED substrate,

   The front diffusion cover is an LED luminaire, characterized in that formed on a spherical shape with one side open.

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