WO2020051905A1 - 可弯折电子设备 - Google Patents

可弯折电子设备 Download PDF

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Publication number
WO2020051905A1
WO2020051905A1 PCT/CN2018/105816 CN2018105816W WO2020051905A1 WO 2020051905 A1 WO2020051905 A1 WO 2020051905A1 CN 2018105816 W CN2018105816 W CN 2018105816W WO 2020051905 A1 WO2020051905 A1 WO 2020051905A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
cover
bendable electronic
support frame
thermally conductive
Prior art date
Application number
PCT/CN2018/105816
Other languages
English (en)
French (fr)
Inventor
刘景�
陈松亚
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201880094131.7A priority Critical patent/CN112639661A/zh
Priority to PCT/CN2018/105816 priority patent/WO2020051905A1/zh
Publication of WO2020051905A1 publication Critical patent/WO2020051905A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements

Definitions

  • the present application relates to the field of electronic devices, and in particular, to a bendable electronic device.
  • the motherboard of an electronic device in the related art generally dissipates heat through the rear cover of the electronic device.
  • the proportion of the rear cover corresponding to the motherboard covers a small proportion of the total area of the rear cover.
  • the temperature of the corresponding back cover is high, which affects the user experience.
  • the present application provides a bendable electronic device with better heat dissipation performance.
  • the bendable electronic device includes a bendable member, a circuit board member, and a cover member.
  • the bending member includes a connecting member, a first supporting frame and a second supporting frame, and the connecting member connects the first supporting frame and the second supporting frame.
  • the cover member is connected to the bent member.
  • the covering member includes a first covering member, a covering member, and a second covering member, and the covering member connects the first covering member and the second covering member.
  • the first covering member is disposed corresponding to the first support frame
  • the second covering member is disposed corresponding to the second supporting frame
  • the covering member covers the connecting member.
  • the cover is made of graphene silica gel.
  • the circuit board component is disposed between the first support frame and the first cover.
  • the cover member of the bendable electronic device is provided corresponding to the bend member, and the cover member and the bend member are connected to each other, thereby increasing the heat dissipation area of the circuit board component through the cover member and the bend member, and the cover member.
  • Covering the connecting piece can not only prevent the user from being pinched by the connecting piece due to misoperation, etc., but also protect the connecting piece from being damaged by external moisture, impurities and other corrosion.
  • the cover is made of graphene silicone material with high thermal conductivity and strength, which can improve the performance and heat dissipation of the cover component, so as to achieve the purpose of uniform heat dissipation of the circuit board component through the overall cover component. Excessive local temperatures of the covering parts are avoided.
  • FIG. 1 is a schematic diagram of a bendable electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic exploded perspective view of a bendable electronic device according to an embodiment of the present application.
  • FIG. 3 is a schematic perspective view of a bendable electronic device according to an embodiment of the present application when it is flattened.
  • FIG. 4 is a schematic cross-sectional view of the bendable electronic device of FIG. 3.
  • FIG. 5 is a schematic perspective view of a bendable electronic device according to an embodiment of the present application when it is folded.
  • FIG. 6 is a schematic cross-sectional view of the bendable electronic device of FIG. 5.
  • FIG. 7 is a schematic perspective view of a bending member according to the embodiment of the present application.
  • FIG. 8 is a schematic perspective view of a circuit board component according to an embodiment of the present application.
  • FIG. 9 is a schematic perspective view of a covering member according to the embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.
  • the "first" or “under” of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.
  • the present application provides a bendable electronic device 100.
  • the bendable electronic device 100 of the present application includes, but is not limited to, smart terminals and display devices such as flexible smart phones, foldable smart computers, and wearable smart products. It should be noted that the shape of the bendable electronic device 100 can be set according to specific circumstances, for example, it can be rectangular parallelepiped.
  • a bendable electronic device 100 includes a bendable member 20, a circuit board member 30, and a cover member 40.
  • the bending member 20 includes a connecting member 24, a first supporting frame 22 and a second supporting frame 26.
  • the connecting member 24 connects the first supporting frame 22 and the second supporting frame 26.
  • the cover member 40 is connected to the bending member 20.
  • the covering member 40 includes a first covering member 42, a covering member 44, and a second covering member 46.
  • the covering member 44 connects the first covering member 42 and the second covering member 46.
  • the first cover 42 is provided corresponding to the first support frame 22, the second cover 26 is provided corresponding to the second support frame 46, and the cover 44 covers the connection member 24.
  • the covering member 44 is made of graphene silica gel.
  • the circuit board component 30 is disposed between the first support frame 22 and the first cover 42.
  • the covering member 40 and the bending member 20 of the bendable electronic device 100 are provided correspondingly.
  • the covering member 40 and the bending member 20 are connected to each other, which increases the circuit board member 30 through the covering member 40 and the bending member 30.
  • the covering member 44 connects the first covering member 42 and the second covering member 46.
  • the heat conducted to the first covering member 42 can be conducted to the second covering member 46 through the covering member 44 and the heat transmitted to the second covering member 46 can be It is conducted to the first cover 42 through the cover 44.
  • the covering member 44 is made of a graphene silica gel material with high thermal conductivity and strength, which can improve the performance and heat dissipation ability of the cover member 40, so that the circuit board member 30 can achieve uniform heat dissipation through the overall cover member 40.
  • the purpose is to prevent the local temperature of the covering member 40 from being too high.
  • the covering member 44 covers the connecting member 24 not only to prevent the user from being pinched by the connecting member 24 due to an erroneous operation, but also to protect the connecting member 24 from being damaged by external moisture, impurities, and the like.
  • the connecting member 24 may be a hinge, and the first supporting frame 22 and the second supporting frame 26 may be connected to the connecting member 24 by welding or screwing.
  • the connecting member 24 is made of a metal material, so that the connecting member 24 has higher strength and better thermal conductivity.
  • the connecting member 24 may also be a structure having a certain bending ability, such as a component made of plastic, polymer material, and metal material.
  • the bendable electronic device 100 can be switched between bending and flattening, and the bending and flattening of the bendable electronic device 100 is realized by the deformation of the connecting member 24.
  • the connecting member 24 is a hinge.
  • the bare connecting piece 24 may pinch the user's hand, and the bare connecting piece 24 is also easily damaged by the external environment, such as water vapor, impurities, and the like. Therefore, the connecting member 24 is covered by providing the covering member 44 to connect the first covering member 42 and the second covering member 46 to protect the connecting member 24.
  • the covering member 44 may also be made of materials such as silica gel, polymer, and metal.
  • polyimide such as polyimide (PI) material
  • PI polyimide
  • it has excellent heat resistance, excellent mechanical properties, good chemical stability, humidity and heat resistance, good radiation resistance, and good
  • polyimide also has low temperature resistance, low expansion coefficient, flame retardancy and good biocompatibility, which can better block water and gas from entering the bendable electronic device 100
  • the strength of the cover member 40 can be improved, and the strength of the bendable electronic device 100 can be further improved.
  • the covering member 44 is not limited to the above-mentioned materials such as silica gel, polymer, and metal, and may be specifically selected in the specific implementation embodiment.
  • the covering member 44 is made of a graphene silica gel material with excellent heat dissipation performance.
  • the first cover 42 corresponds to the first support frame 22 and the second cover 46 corresponds to the second support frame 26.
  • the connecting member 24 divides the bendable electronic device 100 into a first part and a second part.
  • the first part includes the first support frame 22 and the first cover 42.
  • the second part includes the second support frame 26 and the second cover 46.
  • the connecting member 24 connects the first part and the second part, and the first part and the second part can be bent and flattened by the connecting member 24.
  • first supporting frame 22, the connecting member 24, and the second supporting frame 26 may be made of a metal material. In this way, the first support frame 22 and the second support frame 26 have higher strength to support the bendable electronic device 100 and have better heat conduction effect to facilitate heat dissipation.
  • the materials of the first supporting frame 22, the connecting member 24 and the second supporting frame 26 are not limited to metal, and the strength of the first supporting frame 22, the connecting member 24 and the second supporting frame 26 is ensured. Under the premise of bearing and bearing effect, specific selections can be made.
  • the first cover 42 may be made of 3D glass material, plastic material or graphene plastic material
  • the second cover 46 may be made of 3D glass material, plastic material or graphene plastic material.
  • the 3D glass material has good thermal conductivity, and has the advantages of lightness, transparency, cleanness, anti-fingerprint, anti-glare, rigidity, scratch resistance, good weather resistance, etc.
  • the 3D appearance of this shape makes the molded product more beautiful and differentiated, so that the first cover 42 and the second cover 46 have better strength and aesthetics.
  • the graphene silica gel material can be formed by uniformly mixing graphene and silica gel by a solvent exchange method.
  • the elastic modulus and fracture toughness of the graphene silica gel material are greatly improved compared with graphene and silica gel, and at the same time have other characteristics For example, higher thermal conductivity, better thermal stability, vulcanization resistance, moisture and chemical stability, etc. can improve the performance of the first cover 42 and the second cover 46, extend the service life, and further To beautify the appearance of the bendable electronic device 100 and enhance the user experience.
  • first covering member 42 and the second covering member 46 are not limited to the above-mentioned 3D glass material, plastic material, and graphene plastic material, and may be specifically selected in the specific implementation.
  • the bendable electronic device 100 includes a flexible heat sink 10 located between the circuit board component 30 and the first cover 42.
  • the flexible heat sink 10 is thermally connected to the circuit board component 30 and the first support frame 22.
  • the flexible heat sink 10 covers the connection member 24 and is connected to the connection member 24 in a thermally conductive manner.
  • the flexible heat sink 10 is used to connect the first cover 42 and the second cover 46, and the cover 44 covers a portion of the flexible heat sink 10 corresponding to the connection member 24.
  • the flexible heat sink 10 can conduct the heat generated by the circuit board component 30 to the flexible heat sink 10 first, and then to the first cover 42 and the second cover 46 through the flexible heat sink 10, thereby increasing the heat dissipation area. Conducive to uniform heat dissipation.
  • the covering member 44 connects the first covering member 42 and the second covering member 46.
  • the heat conducted to the first covering member 42 can be conducted to the second covering member 46 through the covering member 44 and the heat transmitted to the second covering member 46 can be It is conducted to the first cover 42 through the cover 44.
  • the covering member 44 covers a portion of the flexible heat dissipation member 10 corresponding to the connecting member 24, the heat conducted to the flexible heat dissipation member 10 can also be directly radiated through the covering member 44.
  • the cover member 40 dissipates heat to the outside air of the bendable electronic device 10 through heat radiation and natural convection heat dissipation, thereby achieving the purpose of uniform heat dissipation of the circuit board component 30 through the overall cover member 40 and avoiding the cover member 40 The local temperature is too high.
  • the flexible heat sink 10 includes a first thermally conductive layer 12 and a second thermally conductive layer 14 disposed in a stack.
  • the second thermally conductive layer 14 is disposed on the cover member 40.
  • the first thermally conductive layer 12 is disposed on a side of the second thermally conductive layer 14 away from the cover member 40. Specifically, the first thermally conductive layer 12 is adhered to the connecting member 24 and the circuit board component 30, and the second thermally conductive layer 14 is adhered to the first cover 42 and the second cover 46.
  • the strength of the first thermally conductive layer 12 is greater than the strength of the second thermally conductive layer 14.
  • the second thermally conductive layer 14 and the first thermally conductive layer 12 are stacked to protect the second thermally conductive layer 14 from damage.
  • the first thermally conductive layer 12 is bonded to the connecting member 24 and the circuit board component 30, and the second thermally conductive layer 14 is bonded to the first cover 42 and the second cover 46, which can improve the flexibility between the heat dissipation member 10 and each component
  • the contact area not only facilitates the circuit board component 30 to conduct and dissipate heat through the flexible heat sink 10, but also helps to improve the tightness and connection stability of the internal structure of the bendable electronic device 10.
  • the flexible heat sink 10 may only include the second thermally conductive layer 14, that is, the second thermally conductive layer 14 simultaneously performs the thermally conductive function and the supporting function. At this time, the first thermally conductive layer 12 may be omitted.
  • the orthographic area of the first thermally conductive layer 12 on the second thermally conductive layer 14 covers the second thermally conductive layer 14.
  • the size of the first thermally conductive layer 12 may be consistent with the size of the second thermally conductive layer 14, or the size of the first thermally conductive layer 12 is slightly larger than that of the second thermally conductive layer 14, so that the first thermally conductive layer 12 can be sufficiently separated.
  • the second heat-conducting layer 14 and the battery 50, the connecting member 24 and the circuit board component 30 reduce abrasion of the second heat-conducting layer 14.
  • the first thermally conductive layer 12 is made of a metal
  • the second thermally conductive layer 14 is made of a graphene material or a graphite material.
  • the first thermally conductive layer 12 and the second thermally conductive layer 14 have better thermal conductivity.
  • the first thermally conductive layer 12 may be made of a metal steel sheet. In this way, the first thermally conductive layer 12 may increase the strength of the flexible heat sink 10 and further increase the strength of the bendable electronic device 100.
  • a graphene material such as a graphene film and a graphite material such as a graphite sheet.
  • Graphene materials and graphite materials have the advantages of stable structure, high strength, high toughness and flexibility, excellent electrical and thermal conductivity, and good thermal shock resistance, that is, graphite can withstand when used at normal temperature. The temperature changes drastically without causing damage. When the temperature changes suddenly, the volume of graphite does not change much, no cracks occur, and a better second thermally conductive layer 14 can be formed.
  • first heat-conducting layer 12 is not limited to being made of a metal material
  • second heat-conducting layer 14 is not limited to being made of the above-mentioned graphene materials and graphite materials, and an appropriate material may be specifically selected in the specific implementation.
  • the thermal conductivity of the second thermally conductive layer 14 is greater than the thermal conductivity of the first thermally conductive layer 12.
  • the bendable electronic device 100 includes a battery 50.
  • the battery 50 is disposed between the second support frame 26 and the second cover 46 and is fixedly connected to the flexible heat sink 10.
  • the battery 50 It is located on the other side of the connecting member 24 facing away from the circuit board component 30.
  • the flexible heat sink 10 is located between the battery 50 and the second cover 46, and the battery 50 is connected to the second cover 46 through the flexible heat sink 10, so that the battery 50 can dissipate heat through the second support frame 26 and the second cover 46 .
  • the heating power of the circuit board component 30 is larger and generates a larger amount of heat.
  • the heat generated by the battery 50 is smaller than that of the circuit board component 30.
  • the heat generated by the flexible heat sink circuit board component 30 can be conducted to the connection member through the flexible heat sink 10 24 and the second cover 46 corresponding to the battery 50 to evenly dissipate heat and prevent the first cover 42 corresponding to the circuit board component 30 from being relatively high in temperature.
  • first thermally conductive layer 12 is fixedly disposed with the battery 50, the connecting member 24, and the circuit board member 30, and the second thermally conductive layer 14 is fixedly disposed with the cover member 40.
  • the first heat-conducting layer 12 is fixedly connected to the battery 50, the connecting member 24, and the circuit board member 30.
  • the battery 50, the connecting member 24, and the circuit board member 30 are connected to each other through the first heat-conducting layer 12, on the one hand, the circuit board member can be connected.
  • the heat of 30 is averaged to the battery 50 and the connecting member 24, and then the heat is conducted to the second thermally conductive layer 14 to dissipate the heat through the covering member 40.
  • the first thermally conductive layer 12 can carry the battery 50, the connecting member 24 and The circuit board component 30 is used to improve the stability of the bendable electronic device 100.
  • the first support frame 22 and the first cover 42 are connected together to form a first accommodation space 422, and the second support frame 26 and the second cover 46 are connected and jointly formed to Second accommodation space 462.
  • the first covering member 42 and the second covering member 46 are connected by the covering member 44 and form a continuous plane.
  • the combination of the first accommodating space 422, the above-mentioned plane and the second accommodating space 462 can carry the remaining parts of the bendable electronic device 100.
  • the flexible heat sink 10 can be attached to the above-mentioned plane, and the circuit board component.
  • the 30 and the battery 50 are respectively accommodated in the first accommodating space 422 and the second accommodating space 462, and the bending member 20 is carried on the side wall of the peripheral edge of the covering member 40, so that a more stable connection can be formed, and the covering member 40 can be improved.
  • the space utilization rate improves the integration of the bendable electronic device 100.
  • the first covering member 42 includes a first inner surface 424 that conforms to the flexible heat sink 10.
  • the second covering member 46 includes a second inner surface 464 that is in contact with the flexible heat sink 10.
  • the second heat-conducting plate 14 is closely connected to the first inner surface 424 and the second inner surface 464.
  • the area where the flexible heat sink 10 is attached to the first inner surface 424 is larger than two thirds of the total area of the first inner surface 424.
  • the area where the flexible heat sink 10 is attached to the second inner surface 464 is larger than two thirds of the total area of the second inner surface 464.
  • the ratio of the bonding area of the flexible heat sink 10 to the area of the first inner surface 424 and the second inner surface 464 is moderate, so that the flexible heat sink 10 can better fit the first cover 42 and the second cover 46. Heat dissipation also saves the use of materials for the flexible heat sink 10.
  • the flexible heat sink 10 can cover the first inner surface 424 and the second inner surface 464 over the entire surface to increase the contact area of the flexible heat sink 10 with the first cover 42 and the second cover 46, which can help Due to the heat conduction, the heat radiation effect of the flexible heat sink 10 is further improved.
  • the attaching ratio of the flexible heat sink 10 to the first inner surface 424 and the second inner surface 464 is not limited to the above-mentioned ratios, and may be specifically selected in specific implementations.
  • the circuit board component 30 includes a first chip 31, a first shield cover 32, a first heat conductor 33, and a mainboard 34.
  • the first chip 31 is disposed on the motherboard 34.
  • the first shielding cover 32 covers the first chip 31, or in other words, the first chip 31 is housed in the first shielding cover 32.
  • the side of the first shield cover 32 away from the main board 34 is attached to the flexible heat sink 10.
  • the first heat-conducting body 33 is housed in the first shielding case 32 and connects the first shielding case 32 and the first chip 31.
  • the first chip 31 and the first heat conductor 33 are stacked and housed in the first shielding cover 32.
  • the arrangement of the first shield cover 32 can increase the heat dissipation area of the motherboard 34 and protect the first chip 31.
  • the heat dissipation between the first chip 31 and the remaining components in the bendable electronic device 100 will not affect each other, and the heat dissipation efficiency can be improved.
  • the arrangement of the first heat conductor 33 can improve the efficiency of heat conduction between the first chip 31 and the first shield cover 32.
  • the first chip 31 may be, for example, a central processing unit (CPU), an image processing unit (GPU), a digital signal processor (DSP), a modem (Modem), navigation positioning, multimedia, and other chips or processing modules.
  • the main board 34 may be a printed circuit board (PCB) and is electrically connected to the battery 50 through a wire.
  • the first chip 31 is electrically disposed on the main board 34.
  • the circuit board component 30 further includes a second chip 35, a second shield cover 36, and a second heat conductor 37.
  • the second chip 35 and the first chip 31 are respectively disposed on opposite sides of the main board 34.
  • the second shielding cover 36 houses the second chip 35, or the second chip 35 is housed in the second shielding cover 36.
  • a side of the second shield cover 36 away from the main board 34 is attached to the first support frame 22.
  • the second heat-conducting body 37 is housed in the second shielding cover 36 and connects the second shielding cover 36 and the second chip 35.
  • the second chip 35 and the second heat conductor 37 are stacked and housed in the second shielding cover 36, and the heat generated by the second chip 35 can be conducted to the first support frame 22 and dissipated by the second shielding cover 36.
  • the second shielding cover 32 can be used for protecting the second chip 35.
  • the second chip 35 may be, for example, a central processing unit (CPU), an image processing unit (GPU), a digital signal processor (DSP), a modem (Modem), navigation positioning, multimedia and other chips or processing modules.
  • the chip 35 is electrically disposed on the motherboard 34. Furthermore, the function of the second chip 35 is different from that of the first chip 36.
  • the thermal conductor includes a first thermal conductor 33 and a second thermal conductor 37, and the materials used for the first thermal conductor 33 and the second thermal conductor 37 both include thermal silica gel.
  • thermally conductive silica gel is a thermally conductive compound, which has relatively high thermal conductivity and thermal conductivity, resistance to cold and heat alternation, aging resistance, and electrical insulation, and has excellent moisture resistance, shock resistance, corona resistance, and leakage resistance. , Wider use temperature, resistance to chemical media, lower consistency and better use stability. As well as good construction performance, it has good adhesion to most metal and non-metal materials, and can have a good adhesion and protection effect on the first chip 31 and the second chip 35, and improve the safety of the circuit board component 30 Performance, to further ensure the use safety and service life of the bendable electronic device 100.
  • the bendable electronic device 100 can be switched between the unfolded state and the folded state, and the bend angle of the bendable electronic device 100 is 0 ° -180 °.
  • the bendable electronic device 100 when the bending angle of the bendable electronic device 100 is 0 °, the bendable electronic device 100 is in a flat state. As shown in FIG. 5 and FIG. 6, when the bending angle of the bendable electronic device 100 is approximately 180 °, the first support frame 22 and the second support frame 26 substantially overlap, and the circuit board component 30 and the battery 50 are now overlapped. The smaller the distance between the circuit board components 30 and the battery 50 may affect each other, which increases the difficulty of heat dissipation of the bendable electronic device 100.
  • the flexible heat sink 10 is provided to quickly dissipate heat from the cover member 40 facing away from the first support frame 22 and the second support frame 26 to ensure the temperature and normal use of the bendable electronic device 100.
  • the first supporting frame 22 and the second supporting frame 26 are close to each other when the bendable electronic device 100 is bent, and are away from each other when the bendable electronic device 100 is unfolded.
  • the cover member 40 and the flexible heat sink 10 are opposite to the bendable member 20 on the outside of the bendable electronic device 100.
  • the component 30 and the battery 50 are close to each other.
  • the first support frame 22 and the second support frame 26 are combined with the flexible heat dissipation assembly 10 and the cover member 30 located on the outside, and can dissipate the heat generated by the circuit board component 30 and the heat generated by the battery 50 ;
  • the first support frame 22 and the second support frame 26 are far away from each other, and the heat generated by the circuit board component 30 and the battery 50 can be dissipated from the cover member 30 side and can be bent from The component 20 is scattered on one side, which is beneficial for heat dissipation and prevents the bendable electronic device 100 from overheating.
  • the first cover 42 and the second cover 46 are close to each other, and the distance between the first cover 42 and the second cover 46 is greater than the first The distance between the support frame 22 and the second support frame 26.
  • the cover member 40 is located outside the bendable electronic device 100 relative to the bendable member 20. In this way, when the bendable electronic device 100 is bent, this is more conducive to heat. Distribute.
  • the bendable electronic device 100 includes a flexible support member 60 and a flexible display screen 70 disposed on the flexible support member 60.
  • the flexible supporting member 60 is disposed on the bending member 20.
  • the flexible support member 60 includes a first support plate 62 and a second support plate 64 stacked on the first support plate 62.
  • the first support plate 62 is fixed on the bending member 20.
  • the flexible display screen 70 is fixed on the second support plate 64.
  • the flexible supporting member 60 is disposed on the bending member 20.
  • the flexible supporting member 60 can be used to carry the flexible display 70 to space the flexible display 70 and the bending member 20 to prevent the flexible display 70 from being subjected to the bending member.
  • 20 A direct pulling force during deformation to protect the flexible display 70 from damage.
  • the first support frame 22 and the second support frame 26 are disposed at the upper edges of the connecting members 26.
  • the first support frame 22, the connecting members 24 and the second support frame 26 form a continuous plane.
  • a third accommodation space 222 and a fourth accommodation space 262 are formed in the first support frame 22 and the second support frame 24, respectively.
  • the third accommodation space 222 and the fourth accommodation space 262 accommodate the flexible support member 60 and the flexible display. Screen 70.
  • the flexible supporting member 60 and the flexible display screen 70 are relatively stably disposed on the bending member 20, and can form a regular and beautiful bendable electronic device 100.
  • the first support plate 62 is made of a metal material
  • the second support plate 64 is made of a liquid metal material.
  • the first support plate 62 and the second support plate 64 have higher strength and better thermal conductivity, and can form a flexible support member 60 having higher strength and better thermal conductivity, and enhance the circuit board component 30 through the flexible support member.
  • the bending member 20 and the cover member 40 respectively form two heat dissipation paths, that is, the bending member 20 and the cover member 40 can face the circuit board member 30 and the battery through two different directions. 50 heat is dissipated.
  • the first support frame 22, the second support frame 26, the first cover 42 and the second cover 46 all serve as main heat dissipation paths for heat dissipation. Since the heat of the circuit board component 30 is higher than that of the battery 50, the heat of the circuit board component 30 can be conducted to the first support frame 22 and the first support frame through the second heat conductor 37 and the second heat shield 36 in order. The heat of 22 can be conducted to the second support frame 26 through the flexible support member 60 to achieve uniform temperature heat dissipation.
  • the heat of the circuit board component 30 can also be conducted to the flexible heat sink 10 in sequence through the first heat conductor 33 and the first heat shield 32, and the heat conducted to the flexible heat sink 10 can be dissipated through the first back cover 42. It can be conducted to the second back cover 46 for uniform temperature heat dissipation.
  • the first support frame 22 and the second support frame 26 are close to each other or even contact each other, and there is less space for emitting heat to the outside, and the heat dissipation efficiency is lower. Therefore, in the folded state, heat is mainly dissipated through another heat dissipation path, that is, through the cover member 40 which is still located on the outside.
  • One part of the heat of the circuit board component 30 is conducted to the first cover 42 through the flexible heat sink 10 and dissipated, and the other is conducted to the second cover 46 through the flexible heat sink 10.
  • the heat of the battery 50 and the heat transferred by the flexible heat sink 10 The heat of the circuit board component 30 is dissipated through the second cover 46.
  • the covering member 44 connects the first covering member 42 and the second covering member 46.
  • the heat conducted to the first covering member 42 can be conducted to the second covering member 46 through the covering member 44 and the heat transmitted to the second covering member 46 can be It is conducted to the first cover 42 through the cover 44. Since the covering member 44 covers a portion of the flexible heat dissipation member 10 corresponding to the connecting member 24, the heat conducted to the flexible heat dissipation member 10 can also be directly radiated through the covering member 44.
  • the heat of the bendable and bendable electronic device 100 can achieve uniform temperature heat dissipation and large area heat dissipation through the overall heat dissipation of the cover member 40, thereby ensuring overall heat dissipation efficiency.
  • the connecting member 24 when the connecting member 24 is made of a metal material, it can also be used as a heat dissipation path to dissipate the heat of the battery 50 and the circuit board component 30. That is, the first support frame 22, the second support frame 26, the flexible heat sink 10, the first cover 42 and the second cover 46 can further transfer heat to the connecting member 24, and then radiate to the outside through the connecting member 24 to further enhance heat radiation.
  • the flexible display screen 70 of the bendable electronic device 100 belongs to a form of inversion, that is, after the bendable electronic device 100 is folded, the flexible display screen 70 is located inside the fold, and the cover member 40 is located at the folded Outside.
  • the bendable electronic device 100 of the present application is not limited to the form of inversion, and the bendable electronic device 100 that is turned out can also be applied.

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Abstract

一种可弯折电子设备(100)，其包括弯折部件(20)、电路板部件(30)与覆盖部件(40)。弯折部件(20)包括连接件(24)、第一支撑框(22)与第二支撑框(26)，连接件(24)连接第一支撑框(22)与第二支撑框(26)。覆盖部件(40)连接弯折部件(20)，覆盖部件(40)包括第一覆盖件(42)、包覆件(44)与第二覆盖件(46)，包覆件(44)连接第一覆盖件(42)与第二覆盖件(46)，第一覆盖件(42)对应第一支撑框(22)设置，第二覆盖件(46)对应第二支撑框(26)设置，包覆件(44)覆盖连接件(24)，包覆件(44)采用石墨烯硅胶制成。电路板部件(30)设置在第一支撑框(22)与第一覆盖件之间(42)。

Description

可弯折电子设备 技术领域
本申请涉及电子设备领域，尤其涉及一种可弯折电子设备。
背景技术
相关技术中的电子装置的主板一般通过电子装置的后盖来散热，然而主板对应的部分后盖所占后盖总面积的比例较小，因此主板通过后盖的导热面积较小，造成主板所对应的后盖的温度较高，影响用户体验。
发明内容
有鉴于此，本申请提供一种散热性能较好的可弯折电子设备。
本申请实施方式的可弯折电子设备包括弯折部件、电路板部件与覆盖部件。弯折部件包括连接件、第一支撑框与第二支撑框，连接件连接第一支撑框与第二支撑框。覆盖部件连接弯折部件。覆盖部件包括第一覆盖件、包覆件与第二覆盖件，包覆件连接第一覆盖件与第二覆盖件。第一覆盖件对应第一支撑框设置，第二覆盖件对应第二支撑框设置，包覆件覆盖连接件。包覆件采用石墨烯硅胶制成。电路板部件设置在第一支撑框与第一覆盖件之间。
本申请实施方式的可弯折电子设备的覆盖部件与弯折部件对应设置，覆盖部件与弯折部件相互连接，增大了电路板部件通过覆盖部件与弯折部件散热的散热面积，包覆件覆盖连接件既可避免用户因误操作而被连接件夹伤等，也可保护连接件不被外界的水汽、杂质等腐蚀损坏。并且包覆件采用有着较高的热导率和强度的石墨烯硅胶材料制成，可以提高覆盖组件的性能和散热能力，从而实现电路板部件通过整体的覆盖部件来实现均热散热的目的，避免了覆盖部件的局部温度过高。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的可弯折电子设备的示意图。
图2是本申请实施方式的可弯折电子设备的立体分解示意图。
图3是本申请实施方式的可弯折电子设备展平时的立体示意图。
图4是图3的可弯折电子设备的剖面示意图。
图5是本申请实施方式的可弯折电子设备折叠时的立体示意图。
图6是图5的可弯折电子设备的剖面示意图。
图7是本申请实施方式的弯折部件的立体示意图。
图8是本申请实施方式的电路板部件的立体示意图。
图9是本申请实施方式的覆盖部件的立体示意图。
主要元件符号说明：柔性散热件10，第一导热层12，第二导热层14，弯折部件20，第一支撑框22，第三容置空间222，连接件24，第二支撑框26，第四容置空间262，电路板部件30，第一芯片31，第一屏蔽罩32，第一导热体33，主板34，第二芯片35，第二屏蔽罩36，第二导热体37，覆盖部件40，第一覆盖件42，第一容置空间422，第一内表面424，包覆件44，第二覆盖件46，第二容置空间462，第二内表面464，电池50，柔性支撑部件60，第一支撑板62，第二支撑板64，柔性显示屏70，可弯折电子设备100。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相 连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，本申请提供一种可弯折电子设备100。本申请的可弯折电子设备100包括但不限于柔性智能手机、可折叠智能电脑、可穿戴式智能产品等智能终端与显示设备。需要说明的是，可弯折电子设备100的形状可根据具体情况进行设置，例如可呈长方体状等。
请参阅图2，本申请实施方式的可弯折电子设备100包括弯折部件20、电路板部件30与覆盖部件40。弯折部件20包括连接件24、第一支撑框22与第二支撑框26，连接件24连接第一支撑框22与第二支撑框26。覆盖部件40连接弯折部件20。覆盖部件40包括第一覆盖件42、包覆件44与第二覆盖件46，包覆件44连接第一覆盖件42与第二覆盖件46。第一覆盖件42对应第一支撑框22设置，第二覆盖件26对应第二支撑框46设置，包覆件44覆盖连接件24。包覆件44采用石墨烯硅胶制成。电路板部件30设置在第一支撑框22与第一覆盖件42之间。
本申请实施方式的可弯折电子设备100的覆盖部件40与弯折部件20对应设置，覆盖部件40与弯折部件20相互连接，增大了电路板部件30通过覆盖部件40与弯折部件30散热的散热面积。包覆件44连接第一覆盖件42与第二覆盖件46，传导至第一覆盖件42的热量可以通过包覆件44传导至第二覆盖件46，传导至第二覆盖件46的热量可以通过包覆件44 传导至第一覆盖件42。包覆件44采用有着较高的热导率和强度的石墨烯硅胶材料制成，可以提高覆盖部件40的性能和散热能力，从而实现电路板部件30通过整体的覆盖部件40来实现均热散热的目的，避免了覆盖部件40的局部温度过高。包覆件44覆盖连接件24既可避免用户因误操作而被连接件24夹伤等，也可保护连接件24不被外界的水汽、杂质等腐蚀损坏。
在一个实施例中，连接件24可以为铰链，第一支撑框22与第二支撑框26可通过焊接或螺丝锁固等方式连接于连接件24。在本实施例中，连接件24采用金属材料制成，以使连接件24具有较高的强度以及更好的导热效果。在别的实施例中，连接件24也可以为如采用塑胶、聚合物材料与金属材料等零部件组成的具备一定折弯能力的结构。
具体地，可弯折电子设备100可在弯折与展平之间切换，而可弯折电子设备100的弯折与展平靠连接件24的形变实现。在本实施例中，连接件24为铰链。当可弯折电子设备100弯折时，裸露的连接件24可能会夹伤用户的手，并且，裸露的连接件24也容易受到外界环境的影响而损坏，如水汽、杂质等。因此，通过设置包覆件44连接第一覆盖件42与第二覆盖件46，来覆盖连接件24，从而对连接件24进行保护。
在一个实施例中，包覆件44还可采用硅胶、聚合物与金属等材料制成。
具体地，以聚合物如聚酰亚胺(Polyimide Film，PI)材料为例，具备优异的耐热性、优异的机械性能、良好的化学稳定性、耐湿热性、良好的耐辐射性能和良好的介电性能，除此之外,聚酰亚胺还具有耐低温、膨胀系数低、阻燃与良好的生物相容性等特性，能够较好的隔绝水气等进入可弯折电子设备100的内部，并较好的散热，可提升覆盖部件40的强度，进一步的提升可弯折电子设备100的强度。
可以理解，包覆件44并不限于上述提到硅胶、聚合物与金属等材料制成，在具体实施的实施方式中具体选择即可。优选地，在本申请的实施方式中，包覆件44采用散热性能优良的石墨烯硅胶材料制成。
第一覆盖件42对应覆盖第一支撑框22、第二覆盖件46对应覆盖第二支撑框26。连接件24将可弯折电子设备100分为第一部分与第二部分，第一部分包括第一支撑框22、第一覆盖件42，第二部分包括第二支撑框26与第二覆盖件46，连接件24连接第一部分与第二部分，第一部分与第二部分可通过连接件24弯折与展平。
在一个实施例中，第一支撑框22、连接件24和第二支撑框26均可采用金属材料制成。如此，第一支撑框22和第二支撑框26具有更高的强度以支撑可弯折电子设备100和具有较佳的导热效果以便于散热。
可以理解，在其他的实施例中，第一支撑框22、连接件24与第二支撑框26的材料并不限于金属，在保证第一支撑框22、连接件24与第二支撑框26强度与承载效果的前提下，具体选择即可。
在一个实施例中，第一覆盖件42可采用3D玻璃材料、塑胶材料或石墨烯塑胶材料制成，第二覆盖件46可采用3D玻璃材料、塑胶材料或石墨烯塑胶材料制成。
具体地，以3D玻璃材料为例，3D玻璃材料的导热性较好，并且有着轻薄、透明洁净、抗指纹、防眩光、坚硬、耐刮伤、耐候性佳等优点，并且可塑型做出多种形状的3D外观，使成型后的产品更美观出色并存在差异化，使第一覆盖件42与第二覆盖件46有着较好的强度和美观度。
石墨烯硅胶材料可通过溶剂交换的方法将石墨烯与硅胶均匀混合形成，石墨烯硅胶材料的弹性模量和断裂韧性相比于石墨烯、硅胶有着较大的改善，并同时具有其他多种特性，比如较高的热导率、较好的热稳定性、抗硫化性、耐湿气和化学稳定性等，可以提高第一覆盖件42与第二覆盖件46的性能，延长使用寿命，并进一步的美化可弯折电子设备100的外观和增强用户的体验感。
可以理解，第一覆盖件42与第二覆盖件46并不限于上述提到的3D玻璃材料、塑胶材料与石墨烯塑胶材料制成，可在具体实施的中可以具体选择。
在某些实施方式中，可弯折电子设备100包括位于电路板部件30与第一覆盖件42之间的柔性散热件10，柔性散热件10导热地连接电路板部件30、第一支撑框22、第一覆盖件42及包覆件46，柔性散热件10覆盖连接件24并与连接件24导热地连接。
具体地，采用柔性散热件10连接第一覆盖件42和第二覆盖件46，包覆件44覆盖柔性散热件10与连接件24对应的部位。柔性散热件10可以将电路板部件30产生的热量先传导至柔性散热件10，再通过柔性散热件10传导至第一覆盖件42和第二覆盖件46，增大了热量的散发面积，有利于均匀散热。包覆件44连接第一覆盖件42与第二覆盖件46，传导至第一覆盖件42的热量可以通过包覆件44传导至第二覆盖件46，传导至第二覆盖件46的热量可以通过包覆件44传导至第一覆盖件42。由于包覆件44覆盖柔性散热件10与连接件24对应的部位，传导至柔性散热件10的热量也可以直接通过包覆件44散发。覆盖部件40通过热辐射及自然对流散热将热量散至可弯折电子设备10外界的空气中，从而实现电路板部件30通过整体的覆盖部件40来实现均热散热的目的，避免了覆盖部件40的局部温度过高。
在某些实施方式中，柔性散热件10包括堆叠设置的第一导热层12与第二导热层14。第二导热层14设置于覆盖部件40上。第一导热层12设置于第二导热层14远离覆盖部件 40的一侧。具体的，第一导热层12贴合在连接件24及电路板部件30上，第二导热层14贴合在第一覆盖件42与第二覆盖件46上。
具体地，第一导热层12的强度大于第二导热层14的强度。第二导热层14与第一导热层12堆叠设置，可以较好的保护第二导热层14的不受到损坏。第一导热层12贴合在连接件24及电路板部件30上，第二导热层14贴合在第一覆盖件42与第二覆盖件46上，可以提高柔性散热件10与各部件之间的接触面积，既有利于电路板部件30通过柔性散热件10传导与散发热量，也有利于提升可弯折电子设备10内部结构的紧密与连接稳定。
可以理解地，柔性散热件10也可以仅包括第二导热层14，即通过第二导热层14同时起到导热作用和支撑作用，此时第一导热层12可以省略。
在某些实施方式中，第一导热层12在第二导热层14上的正投影面积覆盖第二导热层14。
具体地，第一导热层12的尺寸可与第二导热层14的尺寸保持一致，或第一导热层12的尺寸稍大于第二导热层14的尺寸，这样第一导热层12能够充分隔开第二导热层14和电池50、连接件24与电路板部件30，以减少第二导热层14的磨损。
在某些实施方式中，第一导热层12采用金属制成，第二导热层14采用石墨烯材料或者石墨材料制成。
如此，第一导热层12与第二导热层14有着较好的导热效果。在一个例子中，第一导热层12可采用金属钢片制成，如此第一导热层12可以提升柔性散热件10的强度，进一步的提升可弯折电子设备100的强度。
具体地，石墨烯材料如石墨烯薄膜，石墨材料如石墨片。石墨烯材料与石墨材料有着结构稳定、强度较高、韧性较高可弯曲、优良的导电性和热传导性等优点，并且有着较好的抗热震性，即石墨在常温下使用时能经受住温度的剧烈变化而不致破坏，温度突变时，石墨的体积变化不大，不会产生裂纹，可形成较好的第二导热层14。
可以理解，第一导热层12不限于金属材料制成，第二导热层14也不限于上述提到的石墨烯材料与石墨材料制成，在具体实施的实施方式中具体选择合适的材料即可，但优选地，第二导热层14的热导率大于第一导热层12的热导率。
请参阅图2，在某些实施方式中，可弯折电子设备100包括电池50，电池50设置于第二支撑框26与第二覆盖件46之间并与柔性散热件10固定连接，电池50位于连接件24背离电路板部件30的另一侧。
可以理解，柔性散热件10位于电池50与第二覆盖件46之间，电池50通过柔性散热件 10连接第二覆盖件46，如此电池50可通过第二支撑框26与第二覆盖件46散热。电路板部件30的发热功率较大而产生较大的热量，电池50相较于电路板部件30的发热小，柔性散热件电路板部件30所产生的热量可通过柔性散热件10传导至连接件24以及电池50所对应的第二覆盖件46，以将热量平均散发，避免电路板部件30所对应的第一覆盖件42温度较高。
更多地，第一导热层12与电池50、连接件24、电路板部件30固定设置，第二导热层14与覆盖部件40固定设置。
第一导热层12与电池50、连接件24、电路板部件30固定设置可以理解为，电池50、连接件24与电路板部件30通过第一导热层12互相连接，一方面可将电路板部件30的热量平均至电池50与连接件24上，再将热量传导至第二导热层14通过覆盖部件40将热量散发出去；另一方面，第一导热层12可承载电池50、连接件24与电路板部件30，以提高可弯折电子设备100的稳定性。
请参阅图2、图4与图9，第一支撑框22和第一覆盖件42连接并共同形成有第一容置空间422，第二支撑框26和第二覆盖件46连接并共同形成有第二容置空间462。第一覆盖件42与第二覆盖件46通过包覆件44相连并形成连续的平面。
进一步地，第一容置空间422、上述平面与第二容置空间462的结合可承载可弯折电子设备100的其余零部件，如柔性散热件10可贴附于上述平面上，电路板部件30与电池50分别容置于第一容置空间422与第二容置空间462，弯折部件20承载于覆盖部件40的周缘的侧壁上，如此可形成较为稳固的连接，提高覆盖部件40的空间利用率，提升了可弯折电子设备100的集成化。
请参阅图2、图4与图9，在某些实施方式中，第一覆盖件42包括与柔性散热件10贴合的第一内表面424。第二覆盖件46包括与柔性散热件10贴合的第二内表面464。
可以理解，第二导热板14与第一内表面424、第二内表面464贴合连接。柔性散热件10与第一内表面424、第二内表面464的接触面积越大，则柔性散热件10可通过第一覆盖件42与第二覆盖件46传导热量的面积越大。
在本实施例中，柔性散热件10与第一内表面424贴合的连接的面积大于第一内表面424总面积的三分之二。柔性散热件10与第二内表面464贴合的连接的面积大于第二内表面464总面积的三分之二。
上述柔性散热件10的贴合面积与第一内表面424、第二内表面464的面积比例适中，既可使柔性散热件10较好的与第一覆盖件42、第二覆盖件46贴合散热，也节省了柔性散 热件10的材料使用。
在一个实施例中，柔性散热件10可整面覆盖第一内表面424与第二内表面464，以增大柔性散热件10与第一覆盖件42与第二覆盖件46接触面积，有助于热量的传导，进一步的提升柔性散热件10的散热效果。当然，柔性散热件10与第一内表面424、第二内表面464的贴附比例并不限于上述提到的比例，在具体的实施方式中具体选择即可。
请进一步参阅图4、图6与图8，在某些实施方式中，电路板部件30包括第一芯片31、第一屏蔽罩32、第一导热体33与主板(Mainboard)34。第一芯片31设置于主板34。第一屏蔽罩32罩设第一芯片31，或者说，第一芯片31收容于第一屏蔽罩32内。第一屏蔽罩32远离主板34的一面与柔性散热件10贴合。第一导热体33收容于第一屏蔽罩32内且连接第一屏蔽罩32与第一芯片31。
具体地，第一芯片31与第一导热体33堆叠收容于第一屏蔽罩32内。第一屏蔽罩32的设置能够增大主板34的散热面积，以及用于保护第一芯片31。第一芯片31与可弯折电子设备100内的其余零部件之间的散热相互不会影响，继而能够提高散热效率。第一导热体33的设置能够提高第一芯片31和第一屏蔽罩32之间热传导的效率。
更多的，第一芯片31例如可以为中央处理器(CPU)、图像处理器(GPU)、数字信号处理器(DSP)、调制解调器(Modem)、导航定位、多媒体等芯片或处理模块。主板34可为印制电路板(Printed Circuit Board，PCB)并通过导线与所述的电池50电性连接，第一芯片31电性设置于主板34上。
在某些实施方式中，电路板部件30还包括第二芯片35、第二屏蔽罩36与第二导热体37。第二芯片35与第一芯片31分别设置在主板34相背的两侧。第二屏蔽罩36罩设第二芯片35，或者说，第二芯片35收容于第二屏蔽罩36内。第二屏蔽罩36远离主板34的一面与第一支撑框22贴合。第二导热体37收容于第二屏蔽罩36内且连接第二屏蔽罩36与第二芯片35。
具体地，第二芯片35与第二导热体37堆叠收容于第二屏蔽罩36内，第二芯片35所产生的热量可由第二屏蔽罩36传导至第一支撑框22而散出。第二屏蔽罩32可以用于对第二芯片35起保护作用。
第二导热体37的设置能够提高第二芯片35和第二屏蔽罩36之间热传导的效率。更多的，第二芯片35例如可以为中央处理器(CPU)、图像处理器(GPU)、数字信号处理器(DSP)、调制解调器(Modem)、导航定位、多媒体等芯片或处理模块，第二芯片35电性设置于主板34上。更多的，第二芯片35的功能与第一芯片36的功能不同。
在某些实施方式中，导热体包括第一导热体33与第二导热体37，第一导热体33与第二导热体37采用的材料均包括导热硅胶。
具体地，导热硅胶是一种导热化合物，具有较的高导热率和导热性、抗冷热交变性、耐老化性和电绝缘性，并具有优异的防潮、抗震、耐电晕、抗漏电性能、较宽的使用温度、耐化学介质性能、较低的稠度和较好的使用稳定性。以及良好的施工性能，对大多数金属和非金属材料具有良好的粘接性,能对第一芯片31与第二芯片35起到较好的粘接和保护效果，提高电路板部件30的安全性，进一步的保证可弯折电子设备100的使用安全和使用寿命。
在某些实施方式中，可弯折电子设备100能够在展开状态和折叠状态之间进行切换，可弯折电子设备100的弯折角度为0°-180°。
如图3与图4所示，可弯折电子设备100的弯折角度为0°时，可弯折电子设备100为展平状态。如图5及图6所示，在可弯折电子设备100弯折角度大致为180°时，第一支撑框22和第二支撑框26基本重叠，这时电路板部件30和电池50之间的间距较小，电路板部件30和电池50之间的散热可能互相影响，而导致可弯折电子设备100的散热难度增加。
因此，设置柔性散热件10将热量从背离第一支撑框22与第二支撑框26的覆盖部件40较快的散发出去，确保可弯折电子设备100的温度和使用正常。
在某些实施方式中，第一支撑框22与第二支撑框26在可弯折电子设备100弯折时相互靠近，在可弯折电子设备100展开时相互远离。
具体地，当可弯折电子设备100弯折时，覆盖部件40与柔性散热件10相对弯折部件20位于可弯折电子设备100的外侧，如此即使可弯折电子设备100弯折而电路板部件30和电池50相互靠近，第一支撑框22与第二支撑框26结合位于外侧的柔性散热组件10与覆盖部件30也能够即使将电路板部件30产生的热量和电池50产生的热量散出；
在电子装置100展开时，第一支撑框22与第二支撑框26相互远离，电路板部件30产生的热量和电池50产生的热量则可以从覆盖部件30一侧散出，并可以从弯折部件20一侧散出，有利于散热防止可弯折电子设备100过热。
在某些实施方式中，可弯折电子设备100弯折时，第一覆盖件42与第二覆盖件46相互靠近，且第一覆盖件42与第二覆盖件46之间的距离大于第一支撑框22与第二支撑框26之间的距离。
可以理解，可弯折电子设备100弯折时，覆盖部件40相对弯折部件20位于可弯折电子设备100的外侧，如此，在可弯折电子设备100弯折时，这样更有利于热量的散发。
请参阅图2、图4与图6，在某些实施方式中，可弯折电子设备100包括柔性支撑部件 60和设置于柔性支撑部件60上的柔性显示屏70。柔性支撑部件60设置于弯折部件20上。柔性支撑部件60包括第一支撑板62与堆叠设置在第一支撑板62上的第二支撑板64。第一支撑板62固定设置于弯折部件20上。柔性显示屏70固定设置在第二支撑板64上。
具体地，柔性支撑部件60设置在弯折部件20上，一方面柔性支撑部件60可以用于承载柔性显示屏70以间隔柔性显示屏70与弯折部件20，避免柔性显示屏70受到弯折部件20形变时的直接拉力，以保护柔性显示屏70免于损坏。
请进一步参阅图2与图7，第一支撑框22与第二支撑框26设置于连接件26的上边缘处，第一支撑框22、连接件24与第二支撑框26形成连续的平面，第一支撑框22与第二支撑框24内分别形成有第三容置空间222与第四容置空间262，第三容置空间222、第四容置空间262收容柔性支撑部件60与柔性显示屏70。
如此，柔性支撑部件60与柔性显示屏70较稳固的设置于弯折部件20，并可形成规整美观的可弯折电子设备100。
在某些实施方式中，第一支撑板62采用金属材料制成，第二支撑板64采用液态金属材料制成。
如此，第一支撑板62与第二支撑板64具备较高的强度和较好导热能力，可以形成具备较高强度和较好导热能力的柔性支撑部件60，提升电路板部件30通过柔性支撑部件60向柔性显示屏70散热的能力。
综上，在可弯折电子设备100中，弯折部件20和覆盖部件40分别形成两条散热路径，即弯折部件20和覆盖部件40可通过两个不同的方向对电路板部件30及电池50的热量进行散发。
当可弯折电子设备100处于展开状态时，第一支撑框22、第二支撑框26、第一覆盖件42及第二覆盖件46均作为主要的散热路径散热。由于电路板部件30的热量较电池50的热量高，电路板部件30的热量可依序通过第二导热体37、第二隔热罩36传导至第一支撑框22，传导至第一支撑框22的热量可通过柔性支撑部件60传导至第二支撑框26，以实现均温散热。
同时，电路板部件30的热量也可以依序通过第一导热体33、第一隔热罩32传导至柔性散热件10，传导至柔性散热件10的热量可通过第一后盖42散发，也可以传导至第二后盖46进行均温散热。
然而，当可弯折电子设备100处于折叠状态时，第一支撑框22与第二支撑框26相互靠近甚至接触，向外散发热量的空间较小，散热效率较低。因此，在折叠状态时，主要是通过 另外的散热路径，即通过仍旧位于外侧的覆盖部件40进行散热。电路板部件30的热量一部分通过柔性散热件10传导至第一覆盖件42进行散发，另一部分通过柔性散热件10传导至第二覆盖件46，电池50的热量及由柔性散热件10传递过来的电路板部件30的热量通过第二覆盖件46散发。包覆件44连接第一覆盖件42与第二覆盖件46，传导至第一覆盖件42的热量可以通过包覆件44传导至第二覆盖件46，传导至第二覆盖件46的热量可以通过包覆件44传导至第一覆盖件42。由于包覆件44覆盖柔性散热件10与连接件24对应的部位，传导至柔性散热件10的热量也可以直接通过包覆件44散发。可弯折可弯折电子设备100的热量可通过覆盖部件40整体散热实现均温散热和较大面积散热，从而确保整体的散热效率。
进一步地，当连接件24采用金属材料制造时，也可作为散热路径对电池50及电路板部件30的热量进行散发。即第一支撑框22、第二支撑框26、柔性散热件10、第一覆盖件42及第二覆盖件46可将热量进一步传递给连接件24，然后通过连接件24对外散发，以进一步提升散热效果。
本申请的实施例中，可弯折电子设备100的柔性显示屏70属于内翻的形式，即在可弯折电子设备100折叠之后，柔性显示屏70位于折叠的内侧，覆盖部件40位于折叠的外侧。当然，可以理解，本申请的可弯折电子设备100并不限于内翻的形式，外翻的可弯折电子设备100同样可以适用。
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施方式，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种可弯折电子设备，其特征在于，包括：
    弯折部件，所述弯折部件包括连接件、第一支撑框与第二支撑框，所述连接件连接所述第一支撑框和所述第二支撑框；
    覆盖部件，所述覆盖部件连接于所述弯折部件，所述覆盖部件包括第一覆盖件、包覆件与第二覆盖件，所述包覆件连接所述第一覆盖件及所述第二覆盖件，所述第一覆盖件对应所述第一支撑框设置，所述第二覆盖件对应所述第二支撑框设置，所述包覆件覆盖所述连接件，所述包覆件采用石墨烯硅胶制成；及
    电路板部件，所述电路板部件设置在所述第一支撑框与所述第一覆盖件之间。
  2. 如权利要求1所述的可弯折电子设备，其特征在于，所述可弯折电子设备包括位于所述电路板部件与所述第一覆盖件之间的柔性散热件，所述柔性散热件导热地连接所述电路板部件、所述第一支撑框、所述第一覆盖件及所述包覆件，所述柔性散热件覆盖所述连接件并与所述连接件导热地连接。
  3. 如权利要求2所述的可弯折电子设备，其特征在于，所述包覆件覆盖所述柔性散热件与连接部件对应的部位。
  4. 如权利要求1所述的可弯折电子设备，其特征在于，所述连接件包括铰链。
  5. 如权利要求2所述的可弯折电子设备，其特征在于，所述柔性散热件包括堆叠设置的第一导热层与第二导热层，所述第二导热层设置于所述覆盖部件上，所述第一导热层设置于所述第二导热层远离所述覆盖部件的一侧。
  6. 如权利要求5所述的可弯折电子设备，其特征在于，所述第一导热层贴合在所述连接件与所述电路板部件上，所述第二导热层贴合在所述第一覆盖件、所述包覆件与所述第二覆盖件上。
  7. 如权利要求5所述的可弯折电子设备，其特征在于，所述第一导热层的导热率低于 所述第二导热层的导热率，所述第一导热层的硬度大于所述第二导热层的硬度。
  8. 如权利要求5所述的可弯折电子设备，其特征在于，所述第一导热层采用金属材料制成，所述第二导热层采用石墨烯材料或者石墨材料制成。
  9. 如权利要求2所述的可弯折电子设备，其特征在于，所述可弯折电子设备包括电池，所述电池设置于所述第二支撑框与所述第二覆盖件之间，所述电池与所述柔性散热件导热地连接。
  10. 如权利要求9所述的可弯折电子设备，其特征在于，所述第一支撑框与所述第一覆盖件连接并共同形成有第一容置空间，所述电路板部件收容于所述第一容置空间内；
    所述第二支撑框与所述第二覆盖件连接并共同形成有第二容置空间，所述电池收容于所述第二容置空间内。
  11. 如权利要求2所述的可弯折电子设备，其特征在于，所述第一覆盖件包括与所述柔性散热件贴合的第一内表面，所述第二覆盖件包括与所述柔性散热件贴合的第二内表面，所述柔性散热件与所述第一内表面贴合的面积大于所述第一内表面总面积的三分之二，所述柔性散热件与所述第二内表面贴合的面积大于所述第二内表面总面积的三分之二。
  12. 如权利要求2所述的可弯折电子设备，其特征在于，所述电路板部件包括：
    主板；
    设置于所述主板的第一芯片；和
    罩设所述第一芯片的第一屏蔽罩，所述第一屏蔽罩远离所述主板的一侧与所述柔性散热件导热地连接。
  13. 如权利要求12所述的可弯折电子设备，其特征在于，所述电路板部件包括导热体，所述导热体收容于所述第一屏蔽罩内且导热地连接所述第一屏蔽罩和所述第一芯片。
  14. 如权利要求12所述的可弯折电子设备，其特征在于，所述电路板部件还包括：
    设置于所述主板上的第二芯片，所述第二芯片与所述第一芯片分别设置在所述主板相背的两侧；和
    罩设所述第二芯片的第二屏蔽罩，所述第二屏蔽罩远离所述主板的一侧与所述第一支撑框导热地连接。
  15. 如权利要求14所述的可弯折电子设备，其特征在于，所述可弯折电子设备还包括导热体，所述导热体收容于所述第二屏蔽罩内且导热地连接所述第二屏蔽罩和所述第二芯片。
  16. 如权利要求13或15所述的可弯折电子设备，其特征在于，所述导热体包括导热硅胶。
  17. 如权利要求1所述的可弯折电子设备，其特征在于，所述可弯折电子设备可在弯折与展平之间切换，所述可弯折电子设备弯折时，所述第一覆盖件与所述第二覆盖件之间的距离大于所述第一支撑框与所述第二支撑框之间的距离。
  18. 如权利要求17所述的可弯折电子设备，其特征在于，所述可弯折电子设备弯折时，所述第一支撑框与所述第二支撑框相互靠近；
    所述可弯折电子设备展平时，所述第一支撑框与所述第二支撑框相互远离。
  19. 如权利要求1所述的可弯折电子设备，其特征在于，所述可弯折电子设备包括柔性支撑部件和设置于所述柔性支撑部件上的柔性显示屏，所述柔性显示屏通过所述柔性支撑部件设置于所述弯折部件上。
  20. 如权利要求19所述的可弯折电子设备，其特征在于，所述柔性支撑部件包括层叠设置的第一支撑板和第二支撑板，所述第一支撑板固定设置在所述弯折部件上，所述第二支撑板设置于所述第一支撑板远离所述弯折部件的一侧，所述柔性显示屏设置于所述第二支撑板上。
PCT/CN2018/105816 2018-09-14 2018-09-14 可弯折电子设备 WO2020051905A1 (zh)

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CN207067960U (zh) * 2017-08-03 2018-03-02 深圳市柔宇科技有限公司 折叠机构及终端
CN207531248U (zh) * 2017-11-17 2018-06-22 维沃移动通信有限公司 一种移动终端
CN108512952A (zh) * 2017-02-28 2018-09-07 华为机器有限公司 折叠终端
CN108508967A (zh) * 2017-02-23 2018-09-07 三星电子株式会社 可折叠的电子设备及其控制方法

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CN206774156U (zh) * 2017-04-11 2017-12-19 天地融科技股份有限公司 电子设备
CN108494910B (zh) * 2018-03-12 2020-02-14 Oppo广东移动通信有限公司 显示屏组件、电子设备及显示屏组件的组装方法

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CN108508967A (zh) * 2017-02-23 2018-09-07 三星电子株式会社 可折叠的电子设备及其控制方法
CN108512952A (zh) * 2017-02-28 2018-09-07 华为机器有限公司 折叠终端
CN207067960U (zh) * 2017-08-03 2018-03-02 深圳市柔宇科技有限公司 折叠机构及终端
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