WO2020042293A1 - 印刷电路板的制作方法、印刷电路板及驱动电路板 - Google Patents

印刷电路板的制作方法、印刷电路板及驱动电路板 Download PDF

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Publication number
WO2020042293A1
WO2020042293A1 PCT/CN2018/110496 CN2018110496W WO2020042293A1 WO 2020042293 A1 WO2020042293 A1 WO 2020042293A1 CN 2018110496 W CN2018110496 W CN 2018110496W WO 2020042293 A1 WO2020042293 A1 WO 2020042293A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
pad
pads
printed circuit
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/110496
Other languages
English (en)
French (fr)
Inventor
赵文勤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Original Assignee
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to US16/311,566 priority Critical patent/US20200120795A1/en
Publication of WO2020042293A1 publication Critical patent/WO2020042293A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/147—Digital output to display device ; Cooperation and interconnection of the display device with other functional units using display panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Definitions

  • the present application belongs to the technical field of electronic circuits, and particularly relates to a method for manufacturing a printed circuit board, a printed circuit board, and a driving circuit board.
  • the printed circuit board is a core component of the electronic equipment. Since the printed circuit board is provided with various power supply circuits, various circuit functions can be realized through the functional circuit, so the printed circuit board is assumed in the electronic equipment. Functions such as signal processing, signal transmission, and integrated control of information; then the manufacturing process of printed circuit boards has an important impact on the overall manufacturing cost of electronic equipment and the circuit functions it implements. If it is too complicated, the manufacturing cost of electronic equipment will increase accordingly.
  • each circuit module integrates a large number of electronic components to achieve the corresponding circuit function.
  • the printed circuit board is connected to a power source and is in the normal working process It is necessary to electrically connect these discrete circuit modules to perform more complex actions and achieve corresponding circuit functions.
  • the present application provides a method for manufacturing a printed circuit board, a printed circuit board, and a driving circuit board.
  • the purpose is to solve the traditional manufacturing method of the printed circuit board that must use 0 ohm resistors to achieve electrical connection, which leads to the manufacturing cost of the printed circuit board. Higher, the production steps are too complicated, and related electronic equipment cannot be universally applied.
  • An embodiment of the present application provides a method for manufacturing a printed circuit board.
  • the printed circuit board includes a plurality of electrically isolated pads, and the pads include a pad body and a body formed by extending outward from one side of the pad body.
  • An electrical isolation area is provided between the protrusions of two adjacent pads
  • a steel mesh is covered on the surface of the printed circuit board, wherein the steel mesh is provided with an opening, and the opening is at least partially connected with two pads and an electrical isolation area between the two pads. correspond;
  • the opening corresponds to two of the pads and an electrical isolation region between the two pads.
  • soldering is performed on the surface of the stencil so that the electrical isolation area between the two pads and two adjacent pads is covered with a solder paste.
  • the electrical isolation area between the opening and the two pads is completely coincident.
  • the pad body is rectangular or oval.
  • soldering is performed on the surface of the stencil so that the electrically isolated area between two adjacent pads is covered by the solder paste.
  • the production method also includes:
  • Serial communication detection is performed on two adjacent pads to determine whether the two adjacent pads implement communication interconnection.
  • the method for manufacturing a printed circuit board further includes:
  • the brushing the surface of the stencil so that the electrically isolated area between two adjacent pads is covered with a solder paste, specifically:
  • An embodiment of the present application provides a printed circuit board including a plurality of electrically isolated pads.
  • the pads include a pad body and a protruding portion formed by extending outward from one side of the pad body.
  • the protruding portions of the two pads are oppositely disposed, and a region between the protruding portions of the two adjacent pads is covered with a solder paste.
  • the pad body is rectangular or oval.
  • the printed circuit board further includes:
  • a communication detector the communication detector is connected to the pad, and the communication detector detects whether two adjacent pads realize communication interconnection.
  • the printed circuit board further includes:
  • a status display connected to the communication detector, the status display displaying communication interconnection information of the two adjacent pads.
  • the two adjacent pads and the area between the protruding portions of the two adjacent pads are covered with a solder paste.
  • An embodiment of the present application provides a driving circuit board including a first pad and a second pad, wherein the first pad includes a first pad body and is formed by one side of the first pad body extending outward.
  • the first pad includes a second pad body and a second pad formed by extending outward from one side of the second pad body, wherein the first protrusion and the first Two protrusions are arranged opposite each other;
  • a region between the first protrusion and the second protrusion is covered with a solder paste.
  • the first pad body is rectangular or oval
  • the second pad body is rectangular or oval
  • the first pad and the second pad are communicatively connected through the solder paste.
  • the first pad, the second pad, and a region between the first protrusion and the second protrusion are all covered with the solder paste.
  • the first pad includes:
  • a control circuit which is connected to the power circuit and is used to access a display screen driving signal and generate a display screen control signal;
  • the second pad includes:
  • a gate driving circuit for receiving the display screen driving signal according to the display screen control signal
  • a source driving circuit is configured to convert the display driving signal according to the display control signal and output the converted display driving signal.
  • the power circuit includes a power management chip
  • the control circuit includes a display driving chip
  • the driving circuit board further includes:
  • a display panel status display the display panel status display being connected to the first pad and the second pad, and the display panel status display showing a communication interconnection between the first pad and the second pad information.
  • the pads on the printed circuit board include a pad body and a protruding portion formed by one side of the pad body extending outward, and two adjacent pads correspond through the protruding portions.
  • the pads on the printed circuit board include a pad body and a protruding portion formed by one side of the pad body extending outward, and two adjacent pads correspond through the protruding portions.
  • solder paste Because the solder paste has fluidity, then The solder paste flows into the electrical isolation area on the printed circuit board through the openings on the stencil, and the protruding portions of different pads are electrically connected through the solder paste. At the same time, the areas without openings in the steel mesh cannot pass through tin.
  • FIG. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present application.
  • FIG. 2 is an implementation flowchart of a method for manufacturing a printed circuit board according to an embodiment of the present application
  • FIG. 3 is an implementation flowchart of another method for manufacturing a printed circuit board according to an embodiment of the present application.
  • FIG. 4 is a module structure diagram of another printed circuit board according to an embodiment of the present application.
  • FIG. 5 is a module structure diagram of a driving circuit board provided by an embodiment of the present application.
  • FIG. 6 is a module structure diagram of a display device according to an embodiment of the present application.
  • FIG. 7 is a module structural diagram of a display system provided by an embodiment of the present application.
  • connection method between different pads is a key factor that affects the production cost of printed circuit boards and the circuit functions of printed circuit boards.
  • traditional printed circuit boards use 0 ohm resistors to establish electrical connections between adjacent pads, where 0 ohm resistors are used as jumper resistors.
  • a type of resistor used in printed circuit boards with special purposes Because the resistance value of 0 ohms is very low, it is almost close to 0. Therefore, the electrical connection between micro devices can be achieved through 0 ohms.
  • the power signal is at 0 ohms.
  • the transmission has high accuracy and low signal loss; however, 0 ohm resistors need to be made of materials with extremely low resistivity and excellent electrical conductivity, and the production environment and process generation process of 0 ohm resistors are extremely complicated, so 0 ohms
  • the production cost of the resistor itself is high. If a large number of 0 ohm resistors are used in the printed circuit board, it will lead to the manufacture of the printed circuit board. The cost has risen sharply, reducing the practical performance of the printed circuit board; and when the 0 ohm resistor is applied to the printed circuit board, the printed circuit board must be printed to make the 0 ohm resistor completely solderable on the printed circuit board. In order to realize the electrical connection between different pads, this will greatly increase the manufacturing steps of the printed circuit board, the manufacturing process of the printed circuit board is more complicated, and the difficulty of manufacturing the printed circuit board is technically increased.
  • an embodiment of the present application provides a manufacturing method of the printed circuit board.
  • the printed circuit board does not need to be provided with a 0 ohm resistor, and the electrical connection between adjacent pads can be achieved only through solder paste, thereby greatly reducing the manufacturing cost of the printed circuit board and simplifying the printed circuit board.
  • the manufacturing process enables the printed circuit board in the embodiment of the present application to have a wider application range and strong practicability; specifically, FIG. 1 shows a schematic structural diagram of the printed circuit board 10 provided in the embodiment of the present application, as shown in FIG.
  • the printed circuit board 10 includes a plurality of electrically isolated pads 101, and electrical transmission and signal transmission cannot be performed directly between different pads.
  • each pad 101 serves as an independent circuit system and performs separate operations. Work to achieve corresponding circuit functions, where the pad 101 includes a pad body 102, where the pad body 102 includes various electronic components such as resistors, capacitors, etc. The sub-components can realize corresponding circuit functions according to the corresponding control signals.
  • the pad 101 further includes a protruding portion 103 formed by extending outward from the pad body 102 side, and the peripheral contact of the pad 101 can be extended by the protruding portion 103. Area, and the two adjacent pads are oppositely disposed through protrusions; specifically, as shown in FIG.
  • the protrusions of the two adjacent pads are close to each other, and in the peripheral contact surface of the two pads,
  • the distance between the protruding portions 103 is the shortest. Furthermore, by providing the protruding portions 103 extending outward on each pad 101, the distance between adjacent pads is shorter, which is more conducive to the realization of two adjacent pads.
  • the printed circuit board 10 shown in FIG. 1 is provided with a protruding portion 103 on the pad body 102, the structure of the pad is simple, and the adjacent two portions can be greatly reduced by the protruding portion 103.
  • the spatial distance between the pads makes it easier to transmit and interact with signals between different pad bodies, thereby improving the simplicity of connection between different pads in the printed circuit board 10.
  • FIG. 2 shows an implementation flow of the method for manufacturing the printed circuit board 10 provided in the embodiment of the present application. As shown in FIG. 2, the method for manufacturing the printed circuit board 10 specifically includes:
  • Step S201 An electrical isolation area is provided between the protruding portions of two adjacent pads; specifically, with reference to the structure of the printed circuit board shown in FIG. 1, there is electrical between the protruding portions of the two adjacent pads. Isolation area, so that two adjacent pads cannot directly communicate with each other.
  • the electrical isolation area can contain conductive materials such as tin and aluminum. The distance between the protrusions is the shortest. Therefore, on the printed circuit board 10, there is an electrical isolation area in a small range between the protrusions of two adjacent pads, so that the protrusions of the two adjacent pads pass through the electrical isolation area.
  • the conductive material is electrically connected, and the communication interconnection between two adjacent pads is more convenient.
  • Step S202 covering the surface of the printed circuit board 10 with a stencil; the stencil is provided with openings, and the openings correspond to at least part of the two pads and the electrical isolation area between the two pads;
  • the conductive material can be accurately transferred to the circuit board through the steel mesh;
  • the solder paste can be The openings on the stencil flow into the partial area on the pad and the electrical isolation area. On the contrary, the unopened areas on the stencil cannot pass through the solder paste.
  • the openings on the stencil can be used to accurately and accurately The solder paste is etched in a predetermined area of the printed circuit board 10 to improve the etching accuracy of the printed circuit board 10;
  • Step S203 Brushing the surface of the stencil so that the electrically isolated area between two adjacent pads is covered with solder paste; as described above, since between the protruding portions of the two adjacent pads, There is an electrical isolation area.
  • the solder paste will be deposited in the printed circuit board 10 below through the openings on the stencil. Further, the stencil is divided into two parts. : Opening area and non-opening area.
  • solder paste In the process of brushing the steel mesh, only the open area of the steel mesh can pass through the solder paste, and the non-opening area does not pass through the solder paste; The surface of the net is brushed with tin, so that the solder paste flows through the openings on the steel net to the electrically isolated area of the printed circuit board 10 and a part of the two pads. Because the solder paste has excellent conductive properties, it is used in printed circuits. After the electrical isolation area of the board 10 is completely covered by the solder paste, the protrusions of the two adjacent pads are electrically connected through the solder paste, and the two adjacent pads can perform power transmission and signal transmission.
  • the printed circuit board 10 Pads Can be interconnected to form a power system to achieve more complex circuit functions; and the openings on the steel mesh correspond to at least part of the two pads and the electrically isolated area on the printed circuit board 10, so by An electrical isolation area is provided at a specific position of the board 10, so that there will be different power transmission lines in the printed circuit board 10.
  • the pads in each power transmission line are electrically connected through a solder paste, thereby avoiding the presence of power in the printed circuit board 10. The false triggering protects the physical security of the pads in the printed circuit board 10.
  • an electrical isolation region is provided between the protrusions of two adjacent pads, and the opening on the steel mesh and the two pads are at least partially and between the two pads.
  • the electrical isolation area can be completely covered by the solder paste, and according to the internal composition of the pad, the middle line of the pad is bare copper, and the solder paste in the electrical isolation area can be tightly attached.
  • the pad it is not easy to fall off; thereby ensuring that the protruding portions of the pads can be connected intact, so that there is a good electrical connection between two adjacent pads, and the electrical between different pads in the printed circuit board 10 is improved. Security and stability of the connection.
  • an isolation region is provided between the protrusions of two adjacent pads, and the surface of the steel mesh is brushed with tin, so that the solder paste flows into the electrical of the printed circuit board 10 through the opening on the steel mesh.
  • a large amount of solder paste is deposited in the electrically isolated area.
  • the protrusions of the two adjacent pads are electrically connected through the solder paste, so that the pads in the printed circuit board 10 pass through.
  • the electrically isolated areas are electrically connected, and different pads can be communicated and interconnected to achieve more complex circuit functions.
  • the printed circuit board 10 The solder paste on the electrical isolation area can realize the electrical connection between two adjacent pads without the need of a 0 ohm resistor, which saves the device cost of the printed circuit board during the manufacturing process and avoids the printed circuit board during the manufacturing process.
  • the device loss generated in the process; and the method for manufacturing the printed circuit board 10 in the embodiment of the present application does not need to perform a punching operation for a 0 ohm resistor, which simplifies the manufacturing process of the printed circuit board 10
  • Adjacent two pads are electrically connected through solder paste deposited in the electrically isolated area of the printed circuit board 10, which is simple and easy to implement; therefore, the method for manufacturing the printed circuit board 10 in the embodiment of the present application has extremely simplified operation steps, Lower manufacturing cost, when the printed circuit board 10 is applied in an electronic device, it can effectively promote the electronic device to realize the corresponding circuit function and improve the practicality of the corresponding electronic device; it solves the production of the printed circuit board in the exemplary technology
  • the cost is high and the manufacturing steps are too complicated, which leads to problems that the corresponding electronic equipment cannot be universally applied.
  • the method for manufacturing the printed circuit board 10 in this embodiment further includes:
  • Serial communication detection is performed on two adjacent pads to determine whether the two adjacent pads implement communication interconnection.
  • the solder paste can be used as a data communication transmission medium to enable signal transmission between different pads; in order to ensure a printed circuit
  • the secure and stable data communication can be performed between different pads in the board 10; serial communication detection is performed on the two adjacent pads to prevent the two adjacent pads after the tin is brushed on the surface of the stencil.
  • serial communication detection is performed by using two adjacent pads to determine whether the two adjacent pads are implemented.
  • Communication interconnection improves the efficiency and practical value of the method for manufacturing the printed circuit board in this embodiment; ensures that normal serial communication can always be performed between different pads in the printed circuit board 10, and reduces the occurrence of communication failures in the printed circuit 10 Rate, the manufacturing method of the printed circuit board 10 greatly improves the communication stability between different electronic components, and has a wider adaptable range.
  • the method further includes: when two adjacent pads realize communication interconnection, a communication interconnection instruction signal is issued.
  • the two adjacent pads have realized communication interconnection, it means that the electronic components on the two pads constitute A circuit system as a whole, the different pads on the printed circuit board can cooperate with each other to achieve more complex circuit functions; when the two adjacent pads are successfully connected to each other, a communication interconnection instruction signal is sent to the technician in time.
  • the interconnection instruction signal can intuitively transmit communication interconnection success information to the technician; therefore, the technician can grasp the communication interconnection status between different pads in real time according to the communication interconnection instruction signal, which improves the availability of the pads in the printed circuit in this embodiment.
  • the operability and the user can accurately obtain the working state of the electronic components in the printed circuit board 10, the method of manufacturing the printed circuit board 10 in this embodiment has higher human-computer interaction performance, ensuring that two adjacent soldering Security and stability of communication interconnection between disks.
  • the opening corresponds to the two pads and the electrical isolation area between the two pads, so that the opening on the steel mesh and the two pads and the two The electrical isolation areas between the pads are completely coincident.
  • the solder paste completely covers the two pads and the electrical isolation area between the two pads through the openings on the stencil. The electrical connection between two adjacent pads is realized, and accordingly, the printed circuit board 10 can implement more complicated circuit functions.
  • FIG. 3 illustrates another implementation process of the method for manufacturing the printed circuit board 10 provided in the embodiment of the present application, compared to the method for manufacturing the printed circuit board 10 in FIG. 2; as shown in FIG. 3
  • step S201 specifically includes:
  • Step S301 openings are provided in the stencil; by drilling holes in the stencil, when there is a fluid substance on the surface of the stencil, the fluid substance penetrates through the openings in the stencil, and then the surface of the stencil During the soldering process, the solder paste is transmitted to the surface of the printed circuit board 10 through the openings of the steel mesh, so that the soldering process of the printed circuit board 10 can be performed safely, and the manufacturing process safety of the printed circuit board 10 is guaranteed.
  • Step S302 covering the surface of the printed circuit board 10 with a steel mesh, so that the openings on the steel mesh and the electrical isolation area between the two pads completely overlap; since only the opening areas on the steel mesh can pass through the solder paste, the steel The non-opening area on the network cannot pass through the solder paste. Therefore, in step S302, the openings on the steel network and the electrical isolation area on the printed circuit board 10 completely overlap, so that the solder paste on the steel network can be transmitted to the printed circuit board.
  • the above-mentioned printed circuit board 10 includes two or three electrically isolated pads 101; the manufacturing method of the printed circuit board in the embodiment of the present application can be applied to different types and different circuit functions.
  • the application range is extremely wide.
  • a technician can set the number of pads in the printed circuit board 10 in advance according to the circuit functions required by the corresponding electronic equipment, and the method of manufacturing the printed circuit board is highly compatible. This feature enables the circuit functions implemented by the printed circuit board 10 to effectively meet the actual needs of technicians, and improves the practicability of corresponding electronic equipment.
  • the pad body 102 is rectangular or oval, and a technician can set the shape of the pad body 102 in the printed circuit board 10 in advance to meet each pad.
  • the requirements of the implemented circuit function; the method for manufacturing a printed circuit board in this embodiment enables the electrical connection of the pad bodies 102 of different shapes through solder paste, so that the different pad bodies 102 can cooperate with each other to achieve more Complex circuit functions and strong compatibility.
  • the method for manufacturing a printed circuit board in this embodiment can be applied to printed circuit boards with different circuit functions, and can be widely used in different industrial fields with higher practical value.
  • FIG. 4 shows a module structure of a printed circuit board 40 provided in an embodiment of the present application.
  • the printed circuit board 40 includes a plurality of electrically isolated pads 401.
  • the pads 401 include a pad body 402 and A protruding portion is formed on one side of the disk body 402.
  • a variety of electronic circuits are integrated on the pad body 402, and the pad 401 can implement more complicated circuit functions.
  • the protruding portions of two adjacent pads are oppositely disposed.
  • the protrusions of the two adjacent pads are close to each other; a solder paste 405 is deposited in a region 404 between the protrusions of the two adjacent pads, so that between the protrusions of the two adjacent pads
  • the area 404 is covered with a solder paste, and the protruding portions of two adjacent pads are electrically connected through the solder paste 405.
  • the pad body 402 is provided with an outwardly extending protrusion 403, and the two adjacent pads greatly shorten the space distance through the protrusion 403.
  • the solder paste 405 in the area 404 between the protrusions of the two pads can be used to replace the 0 ohm resistor in the exemplary technology to achieve electrical connection between different pads, saving the production of the printed circuit board 40.
  • the printed circuit board 40 in the embodiment of the present application has a relatively simplified circuit structure, which can be applied to different types of electronic equipment to achieve corresponding circuit functions, and has a very wide application range; thereby effectively solving In the exemplary technology, the printed circuit board must rely on a 0 ohm resistor to realize the electrical connection between different pads.
  • the manufacturing cost of traditional printed circuit boards and the cost of industrial applications High, the circuit configuration of the printed circuit board is too complicated, difficult to apply different types of electronic devices, the lower practical problems.
  • the pad body 402 is rectangular.
  • the pad body 402 is oval; therefore, the printed circuit board 40 provided in this embodiment is compatible with pad bodies 402 of different shapes to achieve different Circuit function, the technician can set the specific shape of the pad body 402 according to the actual needs, and has great flexibility; furthermore, the printed circuit board 40 in this embodiment can be applied to various industrial fields, the application range is extremely wide, which greatly improves The practical value of the printed circuit board 40 in this embodiment.
  • the printed circuit board 40 further includes: a communication detector, the communication detector is connected to the pad 401, and the communication detector detects whether two adjacent pads 401 realize communication interconnection.
  • the printed circuit board 40 is further provided with a communication detector, which can detect the serial communication status between different pads 401; since the protruding portions of two adjacent pads are tinned
  • the communication detector can detect that normal data communication is implemented between two adjacent pads, so as to ensure that different pads in the printed circuit board 40 realize stable, secure, and continuous data communication.
  • the different pads in the printed circuit board 40 can cooperate with each other to form a circuit as a whole and always remain in a normal working state.
  • the printed circuit board 40 can achieve more complicated circuit functions and increase the scope of application of the printed circuit board 40.
  • the communication detector in this embodiment may be implemented by using a two-way communication test and measurement circuit in the exemplary technology.
  • the two-way communication test and measurement circuit includes electronic components such as a central processor, a resistor, and a capacitor.
  • the model of the central processing unit is: S3C2440A;
  • the two-way communication test and measurement circuit When the two-way communication test and measurement circuit is applied in the printed circuit board 40, the two-way communication test and measurement circuit outputs a communication test signal to two adjacent pads, and two adjacent two After the pad receives the communication test signal and generates a feedback signal, the central processor can determine whether the two adjacent pads have successfully achieved communication interconnection through the feedback signal, and the operation is simple.
  • the serial communication detection between them has a very high accuracy rate; therefore, in this embodiment, the communication status between different pads can be monitored in real time through two adjacent pads, which greatly improves the performance of the printed circuit board 40. Security and stability of data communication.
  • the printed circuit board 40 further includes:
  • the status display is connected with the communication detector, and the status display displays communication interconnection information of two adjacent pads.
  • the communication detector after the communication detector detects whether two adjacent pads in the printed circuit board 40 are connected to each other, the communication detector transmits the detection result to the status display, and then the adjacent display can be displayed in real time through the status display.
  • the communication interconnection information of the two pads the technician can intuitively know whether the two pads have successfully achieved the communication interconnection through the status display, and the experience of the technician is better; the printed circuit board 40 is in the normal working process,
  • the status display can display the communication interconnection information between different pads in real time to avoid communication interruption between two adjacent pads in the printed circuit board 40. Different electronic components in the printed circuit board 40 can always form a circuit.
  • a technician can monitor the communication interconnection status between different pads in real time through a status display to avoid communication between two adjacent pads in the printed circuit board 40
  • the fault improves the communication quality between two adjacent pads in the printed circuit 40.
  • the printed circuit board 40 having a high practical value.
  • the status display may be implemented by using a video display circuit in an exemplary technology.
  • the video display circuit includes electronic components such as a resistor, a MOS tube, and a light-emitting diode.
  • the adjacent light-emitting diodes are used to display adjacent light-emitting states.
  • the display has a relatively simplified circuit structure, is easy to implement, and can effectively improve the human-computer interaction performance of the printed circuit board 40.
  • the two adjacent pads 401 and the area 404 between the protruding portions of the two adjacent pads are covered with the solder paste 405.
  • the solder paste 405 can be tightly adhered to the pad 401 to prevent the solder paste 405 from falling off the printed circuit board 40, the communication security between the two adjacent pads 401 is improved, on the other hand Since the solder paste 405 has extremely strong conductive properties, two adjacent pads 401 can perform fast communication interconnection and power transmission through the solder paste 405, and a plurality of pads 401 can cooperate with each other to achieve more complicated circuit functions.
  • the plurality of pads 401 in this embodiment can achieve communication interconnection with each other through the solder paste 405, the transmission efficiency of communication signals is high, and the manufacturing cost of the printed circuit board 40 is low. Furthermore, the application range of the printed circuit board 40 is greatly improved.
  • FIG. 5 shows a module structure of a driving circuit board 50 according to an embodiment of the present application.
  • the driving circuit board 50 can transmit and process display screen driving signals, and the display screen driving signals can drive the display screen to display corresponding images or videos.
  • the driving circuit board 50 includes a first pad 501 and a second pad 502, where corresponding functional circuits are respectively integrated on the first pad 501 and the second pad 502, and then the first The pads 501 and the second pads 502 can independently implement corresponding circuit functions; wherein the first pad 501 includes a first pad body 503 and a first protrusion formed by one side of the first pad body 503 extending outward.
  • the portion 504 and the second pad 502 include a second pad body 505 and a second protruding portion 506 formed by one side of the second pad body 505 extending outward.
  • the first protruding portion 504 and the second protruding portion 506 are oppositely disposed.
  • the distance between the first protruding portion 504 and the second protruding portion 506 is the shortest between the edge of the first pad 501 and the edge of the second pad 502, and in this embodiment, the circuit board 50 is driven.
  • Two pads including The first pad 501 and the second pad 502 greatly shorten the spatial distance by the protrusions (including the first protrusion 504 and the second protrusion 506), and the first pad 501 and the second pad 502 are easier to implement Electrical connection.
  • a solder paste 508 is deposited in a region 507 between the first protrusion 504 and the second protrusion 506, so that the region 507 is completely covered by the solder paste, and the first protrusion 504 and the second protrusion 506 pass through the solder paste.
  • 508 is electrically connected, so that the first pad 501 and the second pad 502 on the driving circuit board 50 can be communicated and interconnected to realize the overall circuit function;
  • the driving circuit board 50 in the embodiment of the present application
  • the first The pad 501 and the second pad 502 only need to be electrically connected through the solder paste 508, and no additional auxiliary equipment such as a 0 ohm resistor is needed, thereby greatly simplifying the circuit structure of the driving circuit board 50 and reducing the corresponding display screen.
  • the production cost of the corresponding display improves the practicality of the corresponding display; at the same time, during the process of transmitting the display drive signal to the driving circuit board 50, the first pad 501 and the second pad 502 can realize rapid signal transmission through the solder paste 508 And communication with each other, so that the electronic components located on different pads (including the first pad 501 and the second pad 502) can work together to achieve more complex circuit functions, and the display drive signals can be sequentially
  • the first pad 501, the solder paste 508, and the second pad 502 are output, and the electronic components on the first pad 501 and the electronic components on the second pad 502 perform function conversion and transmission of the display screen driving signal.
  • the driving circuit board 50 When the driving circuit board 50 is applied to a display screen, the display screen can receive a large number of display drive signals in real time, and the display screen displays high-definition and dynamic images according to the display drive signals; therefore, the drive circuit in the embodiment of the present application
  • the board 50 has an extremely simplified circuit structure, can realize fast transmission and conversion of display screen driving signals, can be widely used in different types of display screens, and has strong compatibility.
  • the first pad body 503 is rectangular or oval, and the second pad body 505 is rectangular or oval; further, the driving circuit board in this embodiment 50 has strong compatibility.
  • the first pad 501 and the second pad 502 can include electronic components with different functions.
  • the driving circuit board 50 can implement more comprehensive circuit functions to meet the actual needs of technicians.
  • the first pad 501 and the second pad 502 are communicatively connected through the solder paste 508, and the electronic components in the first pad 501 and the electronic components in the second pad 50 pass through.
  • the solder paste 508 performs communication interconnection to form a whole circuit, which effectively reduces the communication interconnection cost of the electronic components in the driving circuit board 50 in this embodiment.
  • the first pad 501, the second pad 502, and the region 507 between the first protruding portion 504 and the second protruding portion 506 are all solder paste. 508 coverage; further, the solder paste 508 in this embodiment can be tightly connected to the first pad 501 and the second pad 502, which improves the communication quality and communication security between the first pad 501 and the second pad 502 That is, the manufacturing cost of the driving circuit board 50 is reduced, and all electronic components in the driving circuit board 50 are always in a safe and stable operating state.
  • the first pad 501 includes a power supply circuit and a control circuit, wherein the power supply circuit outputs a DC power supply; specifically, the power supply circuit is connected to external power and converts the external power It is a direct current power supply, through which the rated voltage can be provided to the circuit module on the first pad 501 and the circuit module on the second pad 502 to ensure that the electronic components on the driving circuit board 50 can work normally.
  • the control circuit can perform centralized processing of signals and convert the output.
  • the control circuit is connected to the power circuit.
  • the power circuit transmits DC power to the control circuit to drive the control circuit to maintain a stable working state.
  • the control circuit can access the display screen.
  • Driving signals and generating display control signals wherein the display driving signals include a large amount of image data, and the display driving signals can drive the display to display dynamic and clear images or videos; the display control signals include user control instructions and Operation information, which can be controlled by this display control signal Control the working state of each circuit module in the pad (including the first pad 501 and the second pad 502); further in the embodiment of the present application, the first pad 501 can access the display screen driving signal through the control circuit, In order to realize the information interaction between the driving circuit board 50 and external electronic devices, and the display pad control signal generated by the control circuit through the first pad 501 can be used to control the working state of the display screen, the operation is simple and the practicability is strong.
  • the second pad 502 includes a gate driving circuit and a source driving circuit. As described above, since the first pad 501 and the second pad 502 are electrically connected through the solder paste 508, the circuit in the first pad 501 is further The module (including the power supply circuit and the control circuit) and the circuit module (including the gate driving circuit and the source driving circuit) in the second pad 502 can perform bidirectional signal transmission. Specifically, the gate driving circuit receives the display control signal and Display drive signal, and the gate drive circuit receives the display drive signal according to the display control signal; the display control signal can control the working state of the gate drive circuit.
  • the second pad 502 is capable of receiving a display screen driving signal, and by using the display screen driving signal, the display screen can be in a normal working state.
  • the gate driving circuit has good controllability; the source driving circuit receives the display control signal and the display driving. Signal, and furthermore, the display control signal can make the source driving circuit be in an on state or an off state.
  • the source driving circuit performs function conversion on the display driving signal according to the display control signal, so that the display driving signal output by the source driving circuit has a display driving function; therefore, in the embodiment of the present application, a gate driving circuit is combined And the source driving circuit perform conversion and transmission operations on the display screen driving signal, and then the display screen driving signal can drive the display screen to perform normal image or video display, so that the driving circuit board 50 can always be in a stable working state.
  • the circuit module (including the power supply circuit and the control circuit) in the first pad 501 and the circuit module (including the gate driving circuit and source driving circuit) in the second pad 502 pass tin.
  • the communication connection with the paste not only reduces the manufacturing cost of the driving circuit board 50 and simplifies the circuit structure in the driving circuit board 50, but also the circuit modules on different pads can cooperate with each other to convert and transmit display screen driving signals.
  • the display screen driving signals can be quickly transmitted in the driving circuit board 50, and the corresponding display screen can display clear images or videos according to the display screen driving signals, thereby improving the practical value of the display screen.
  • the driving circuit board 50 can be applied to different types of display screens.
  • the power supply circuit can use a power management chip to implement power conversion output.
  • the model of the power management chip is KA1L0380RB
  • the control circuit can use a display driver chip, where the model of the display driver chip is MST717C
  • the gate drive circuit includes a MOS tube array and a resistor, of which the MOS tube array It includes multiple interconnected MOS tubes. When the MOS tube array is connected to the display control signal, the MOS tube can be turned on or off by the level state of the display control signal.
  • the gate drive circuit can access the display drive signal in real time; for example, the source drive circuit includes electronic components such as diodes and switches.
  • the display control signal can Control the working state of the source driving circuit, and then use the diode and switch to control the display Activation signal conversion function, the display driver signal to achieve the appropriate display driver functions; therefore display the received image data of the display driving signal, you can achieve the corresponding video display function.
  • the driving circuit board 50 further includes:
  • the display panel status display is connected to the first pad 501 and the second pad 502, and the display panel status display displays communication interconnection information of the first pad 501 and the second pad 502.
  • the first pad 501 and the second pad 502 need to perform data transmission through the solder paste 508, so that all the electronic components in the driving circuit board 50 can be regarded as a circuit as a whole, so that the driving circuit board 50 can be more complete and more It is a complicated circuit function.
  • the communication between the first pad 501 and the second pad 502 in the driving circuit board 50 is interrupted, the display panel cannot be in a normal working state.
  • the display panel status display can display the communication interconnection information between the first pad 501 and the second pad 502 in real time, and then the technician can know the first pad 501 and the second pad 502 accurately through the display panel status display. Whether the communication interconnection is successfully achieved, and the communication stability between different electronic components in the driving circuit board 50 is improved; thereby avoiding the first pad 501 in the driving circuit board 50 The second pad 502 is prone to a communication failure problem. Different electronic components in the driving circuit board 50 can always communicate and interconnect to complete the corresponding circuit functions and ensure the normal display of image / video information in the display panel.
  • the display status display panel greatly improves the practical value of the driving circuit board 50 and the human-computer interaction performance in this embodiment.
  • the display panel status display may be implemented by using a fault alarm in an exemplary technology, wherein the fault alarm includes electronic components such as a resistor, a MOS tube, and a light emitting diode, where the The fault alarm can send light instruction information to the technician through the light emitting condition of the light-emitting diode, and the technician can learn the communication interconnection status of the first pad 501 and the second pad 502 according to the light instruction information; for example, if The first pad 501 and the second pad 502 successfully realized communication interconnection, and the light-emitting diode in the fault alarm immediately emitted light. The technician can intuitively draw from the light signal that communication between different pads was successfully implemented.
  • the fault alarm includes electronic components such as a resistor, a MOS tube, and a light emitting diode
  • the fault alarm can send light instruction information to the technician through the light emitting condition of the light-emitting diode, and the technician can learn the communication interconnection status of the first pad 501 and the second pad 502 according
  • the light emitting diode in the fault alarm does not emit light; therefore, in this embodiment, the first solder can be displayed intuitively and accurately through the fault alarm.
  • the communication interconnection state of the disk 501 and the second pad 502 is easy to operate and has less error; thereby ensuring that the display panel in this embodiment can be started. In normal working condition, reduce the failure rate of the communication between the first pad 501 and second pad 502, a display panel, thereby improving the experience of the skilled person.
  • FIG. 6 shows a module structure of a display device 60 provided in an embodiment of the present application.
  • the display device 60 includes: a signal collector 601, a driving circuit board 602, and a display panel 603; Capable of collecting image information and generating a display screen driving signal according to the image information, the display screen driving signal including image data, and then the signal collector 601 can encode external image information and convert it into a display screen driving signal, so that the display screen
  • the driving signal can be quickly transmitted in an internal circuit in the display device 60, and the display device 60 can display a corresponding image or video according to the display screen driving signal; therefore, in the embodiment of the present application, the display device 60 can communicate with the signal collector 601 and External electronic devices implement communication interconnection to obtain external image information.
  • the signal collector 601 described above includes a signal acquisition circuit in an exemplary technology.
  • the signal acquisition circuit includes electronic components such as an operational amplifier, a transformer, and a resistor.
  • the signal acquisition circuit can collect external signals. Physical pulses such as electrical signals read image information in the electrical signals through electronic components such as operational amplifiers and transformers, and convert the image information into display screen drive signals that can be recognized by the display device 60. Therefore, in this embodiment of the present application, signal acquisition The monitor 601 can acquire image data in real time to drive the display device 60 to implement an image display function.
  • the driving circuit board 602 is connected to the signal collector 601, and the signal collector 601 transmits the display screen driving signal to the driving circuit board 602.
  • the driving circuit board 602 can transmit the display screen driving signal, so that the display device 60 can receive the signal normally.
  • the display drive signal it should be noted that the driving circuit board 602 in FIG. 6 is the driving circuit board 50 in FIG. 5 described above, so the working principle of the driving circuit board 602 and the internal module structure in the embodiment of the present application can refer to the above. The embodiment of FIG. 5 will not be repeated here.
  • the display panel 603 is connected to the driving circuit board 602, and the driving circuit board 602 transmits the display panel driving signal to the display panel 603, and the display panel 603 performs video display according to the display panel driving signal; when the display panel 603 receives the display panel driving signal, The display panel 603 decodes the display driving signal to obtain image data, and further, the display panel 603 can drive the display panel 603 to display a corresponding image or video by using the display driving signal to meet a user's viewing requirement.
  • the display device 60 is an LED (Light Emitting Diode), an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), or an electronic device.
  • Display screen furthermore, the driving circuit board 602 in the embodiment of the present application can be applied to different types of display screens, which has strong compatibility, reduces the production cost and industrial application cost of various types of display screens, and brings good use to users. Experience.
  • the display device 60 can receive image information in real time through the signal collector 601, and quickly convert the image information into a display screen driving signal.
  • the display device 60 can transmit image data to the display device 60 in real time.
  • the image data in the display device 60 is updated in real time; referring to the embodiment of FIG. 5 described above, the display circuit drive can be quickly transmitted and converted through the driving circuit board 602, so that the display screen driving signal has a complete display screen driving function.
  • the display panel 603 can receive the display screen driving signal in real time, and the display panel 603 can drive the display panel 603 for video display to meet the user's visual requirements; therefore, the display device 60 in the embodiment of the present application has a simplified Circuit module structure, the low manufacturing cost and simple manufacturing process of each circuit module in the display device 60 greatly reduce the industrial manufacturing cost and application cost of the display device 60, and the scope of application is wide; users can view in real time through the display device 60 To high-definition images or videos, bring users It has a good visual experience, which is convenient for users. It effectively solves the high manufacturing cost of the display screen in the exemplary technology, its internal circuit structure is complex, and the user ’s experience is not good, which makes the display screen difficult to be universal. Suitable for problems in different industrial fields.
  • FIG. 7 illustrates a module structure of a display system 70 provided by an embodiment of the present application.
  • the display system 70 includes the display device 60 as described above; referring to the embodiment of FIG. 6 described above, the display system 70 can display High-definition video screen or image, and the low cost of industrial application of the display system 70, the extremely wide range of applications, can be universally applicable to various industrial fields, bring users a good sense of experience, strong practicality; effectively solve The problem that the industrial application cost of the display system in the exemplary technology is too high and the user experience is poor.
  • the manufacturing method of the printed circuit board 10 in the embodiment of the present application uses solder paste to achieve electrical connection between different pads, without the need for an additional 0 ohm resistor, which saves the manufacturing materials of the printed circuit board 10 Cost, and simplifies the manufacturing process of the printed circuit board 10.
  • the printed circuit board 10 in the embodiment of the present application has a very simplified circuit structure, can implement more complex circuit functions, is highly practical, and can be widely used in various industrial fields. , Has a strong practical application prospect.

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Abstract

一种印刷电路板的制作方法，在印刷电路板(10)中焊盘(101)一侧向外延伸形成突出部(103)，相邻的两个焊盘突出部(103)之间的电气隔离区域被锡膏覆盖。有效地解决了印刷电路板的制作方法必需采用0欧姆电阻来进行电性连接，进而导致印刷电路板的制作成本较高、制作流程过于复杂，难以普遍适用的问题。

Description

印刷电路板的制作方法、印刷电路板及驱动电路板 技术领域
本申请属于电子电路技术领域，尤其涉及一种印刷电路板的制作方法、印刷电路板及驱动电路板。
 背景技术
在传统的电子设备中，印刷电路板属于电子设备的核心组成部件，由于印刷电路板上设有各种供电电路，通过该功能电路能够实现各种电路功能，因此印刷电路板在电子设备中承担着信号处理、信号传输、以及信息的集成控制等各项功能；则印刷电路板的制造过程对于电子设备的整体制造成本及其所实现的电路功能具有重要的影响，若印刷电路板的制造过程过于复杂，则电子设备的制造成本也会相应的增加。
在传统技术中，印刷电路板上存在众多分立的电路模块，每一个电路模块中集成了众多的电子元器件，以实现相应的电路功能，当印刷电路板接入电源并处于正常工作的过程中，需要将这些分立的电路模块进行电性连接以实现执行更为复杂的动作，实现相应的电路功能；在传统的印刷电路板制作方法中，由于相邻的电路模块之间的距离较远，若要实现不同电路模块之间的电性连接，则必须采用0欧姆电阻在相邻的两个电路模块之间建立电性连接，以使印刷电路板能够实现正常的电路功能；从而传统的印刷电路板制作方法不但具有极高的工业制造成本，而且制作流程也极为繁琐，进而导致相应电子设备的适用普遍性大大降低。
 技术问题
本申请提供一种印刷电路板的制作方法、印刷电路板及驱动电路板，旨在解决传统技术中印刷电路板制造方法必需采用0欧姆电阻来实现电性连接，进而导致印刷电路板的制造成本较高，制作步骤过于复杂、及相关电子设备无法普遍适用的问题。
 技术解决方案
本申请实施例提供一种印刷电路板的制作方法，所述印刷电路板包括多个电气隔离的焊盘，所述焊盘包括焊盘本体和由所述焊盘本体一侧向外延伸形成的突出部，其中相邻的两个所述焊盘的突出部相对设置，所述印刷电路板的制作方法包括：
在相邻的两个所述焊盘的突出部之间设有电气隔离区域；
将钢网覆盖于所述印刷电路板的表面，其中所述钢网上开设有开孔，所述开孔与两个所述焊盘至少部分以及两个所述焊盘之间的电气隔离区域相对应；
在所述钢网的表面进行刷锡，以使相邻的两个所述焊盘之间的电气隔离区域被锡膏覆盖。
在其中的一个实施例中，所述开孔与两个所述焊盘以及两个焊盘之间的电气隔离区域相对应。
在其中的一个实施例中，在所述钢网的表面进行刷锡，以使两个所述焊盘以及相邻的两个所述焊盘之间的电气隔离区域被锡膏覆盖。
在其中的一个实施例中，所述开孔与两个所述焊盘之间的电气隔离区域完全重合。
在其中的一个实施例中，所述焊盘本体为矩形或者椭圆形。
在其中的一个实施例中，在所述钢网的表面进行刷锡，以使相邻的两个所述焊盘之间的电气隔离区域被所述锡膏覆盖以后，所述印刷电路板的制作方法还包括：
对相邻的两个所述焊盘进行串行通讯检测，以判断相邻的两个所述焊盘是否实现通信互联。
在其中的一个实施例中，所述印刷电路板的制作方法还包括：
当相邻的两个所述焊盘实现通信互联，则发出通信互联指示信号。
在其中的一个实施例中，所述在所述钢网的表面进行刷锡，以使相邻的两个所述焊盘之间的电气隔离区域被锡膏覆盖，具体为：
在所述钢网上进行刷锡，所述锡膏通过所述钢网上的开孔流入到相邻的两个所述焊盘之间的电气隔离区域，所述钢网上未开孔的区域无法通过所述锡膏，以使相邻的两个所述焊盘之间的电气隔离区域被所述锡膏覆盖。
本申请实施例提供一种印刷电路板，包括多个电气隔离的焊盘，所述焊盘包括焊盘本体和由所述焊盘本体一侧向外延伸形成的突出部，其中相邻的两个所述焊盘的突出部相对设置，所述相邻的两个所述焊盘的突出部之间的区域以锡膏覆盖。
在其中的一个实施例中，在所述焊盘中，所述焊盘本体为矩形或者椭圆形。
在其中的一个实施例中，所述印刷电路板还包括：
通讯检测器，所述通讯检测器与所述焊盘连接，所述通讯检测器检测相邻的两个所述焊盘是否实现通信互联。
在其中的一个实施例中，所述印刷电路板还包括：
状态显示器，所述状态显示器与所述通讯检测器连接，所述状态显示器显示所述相邻的两个所述焊盘通信互联信息。
在其中的一个实施例中，所述相邻的两个所述焊盘、以及所述相邻的两个所述焊盘的突出部之间的区域均以锡膏覆盖。
本申请实施例提供一种驱动电路板，包括第一焊盘和第二焊盘，其中所述第一焊盘包括第一焊盘本体和由所述第一焊盘本体一侧向外延伸形成的第一突出部，所述第二焊盘包括第二焊盘本体和由所述第二焊盘本体一侧向外延伸形成的第二突出部，其中所述第一突出部和所述第二突出部进相对设置；
在所述第一突出部和所述第二突出部之间的区域以锡膏覆盖。
在其中的一个实施例中，所述第一焊盘本体为矩形或者椭圆形，所述第二焊盘本体为矩形或者椭圆形。
在其中的一个实施例中，所述第一焊盘和所述第二焊盘通过所述锡膏进行通信连接。
在其中的一个实施例中，所述第一焊盘、所述第二焊盘、以及所述第一突出部和所述第二突出部之间的区域均以所述锡膏覆盖。
在其中的一个实施例中，所述第一焊盘包括：
电源电路，用于输出直流电源；以及
控制电路，与所述电源电路连接，用于接入显示屏驱动信号和生成显示屏控制信号；
所述第二焊盘包括：
栅极驱动电路，用于根据所述显示屏控制信号来接收所述显示屏驱动信号；以及
源极驱动电路，用于根据所述显示屏控制信号对所述显示屏驱动信号进行转换后输出。
在其中的一个实施例中，所述电源电路包括电源管理芯片，所述控制电路包括显示器驱动芯片。
在其中的一个实施例中，所述驱动电路板还包括：
显示面板状态显示器，所述显示面板状态显示器与所述第一焊盘以及所述第二焊盘连接，所述显示面板状态显示器显示所述第一焊盘和所述第二焊盘的通信互联信息。
 有益效果
在上述印刷电路板的制作方法中，印刷电路板上的焊盘包括焊盘本体以及焊盘本体一侧向外延伸形成的突出部，并且相邻的两个焊盘之间通过突出部进行对应设置，不同焊盘的突出部之间具有较短的空间距离，因此不同的焊盘之间通过突出部更加靠近；通过在相邻的两个焊盘的突出部之间设置电气隔离区域；将钢网覆盖于印刷电路板表面，在钢网上开设有开孔，并且开孔与两个焊盘的至少部分以及两个焊盘之间的电气隔离区域相对应，由于锡膏具有流动性，则锡膏会通过钢网上的开孔流入到印刷电路板上的电气隔离区域，不同焊盘的突出部之间通过锡膏进行电性连接；同时，钢网中没有开设开孔的区域无法通过锡膏，进而保证了焊盘在印刷电路板中的物理安全；因此本申请中印刷电路板的制造方法通过在焊盘的突出部之间添加锡膏，即可实现两个焊盘之间的电性连接，无需额外的0欧姆电阻，制造成本较低，并且在所述印刷电路板上无需进行专门的打件操作，简化了印刷电路板的制造步骤，易于实现，极大地提高印刷电路板的制作方法的适用范围，实用性较高；从而有效地解决了示例性技术中印刷电路板的制作方法必需采用0欧姆电阻来进行电性连接，进而导致印刷电路板的制作成本较高、制作流程过于复杂，难以普遍适用的问题。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种印刷电路板的结构示意图；
图2是本申请实施例提供的一种印刷电路板的制作方法的实现流程图；
图3是本申请实施例提供的另一种印刷电路板的制作方法的实现流程图；
图4是本申请实施例提供的另一种印刷电路板的模块结构图；
图5是本申请实施例提供的一种驱动电路板的模块结构图；
图6是本申请实施例提供的一种显示设备的模块结构图；
图7是本申请实施例提供的一种显示系统的模块结构图。
 本发明的实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
需要说明的是，在印刷电路板中，不同焊盘之间的连接方法是影响印刷电路板制作成本和印刷电路板电路功能的关键性因素；随着印刷电路板制作工艺的快速发展，在示例性技术中，考虑到相邻焊盘之间的距离较远，传统的印刷电路板采用0欧姆电阻在相邻的焊盘之间建立电性连接，其中0欧姆电阻作为跨接电阻器，是一种应用于印刷电路板中具有特殊用途的电阻，由于0欧姆电阻阻值非常低，几乎接近于0，因此通过0欧姆电阻能够实现微型器件之间的电性连接，电力信号在0欧姆电阻传输时具有较高的精度、信号损耗较低；然而0欧姆电阻需要采用电阻率极低、导电性能极佳的材料制作，并且0欧姆电阻的制作环境以及工艺生成流程都极为复杂，因此0欧姆电阻本身的生产成本较高，若在印刷电路板中大量地采用0欧姆电阻，将会导致该印刷电路板的制造成本大幅上升，降低了该印刷电路板的实用性能；并且在该0欧姆电阻应用在印刷电路板中时，必须要印刷电路板进行打件操作，以使0欧姆电阻能够完全焊接在印刷电路板中，以实现不同焊盘之间的电性连接，这将会极大地增加印刷电路板的制作步骤，印刷电路板的制作流程更为繁琐，在技术上增加了印刷电路板制造的难度。
因此示例性技术中印刷电路板的制作方法成本较高，制作流程繁琐，实用性较低；针对此问题，本申请实施例提供了一种印刷电路板的制作方法，在所述印刷电路板的制作方法中，印刷电路板无需设置0欧姆电阻，只需要通过锡膏即可实现相邻焊盘之间的电性连接，从而极大地降低了印刷电路板的制作成本，简化了印刷电路板的制作流程，使本申请实施例中的印刷电路板具有更广的应用范围，实用性较强；具体的，图1示出了本申请实施例提供的印刷电路板10的结构示意，如图1所示，印刷电路板10包括多个电气隔离的焊盘101，不同的焊盘之间无法直接进行电能的传输和信号的传递，此时每一个焊盘101作为一个独立的电路系统，分别进行工作以实现相应的电路功能，其中焊盘101包括焊盘本体102，其中焊盘本体102包括电阻、电容等各种电子元器件，这些电子元器件根据相应的控制信号即可实现对应的电路功能；其中焊盘101还包括焊盘本体102一侧向外延伸形成的突出部103，，通过突出部103能够延长焊盘101的外围接触面积，并且相邻的两个焊盘之间通过突出部相对设置；具体的如图1所示，相邻的两个焊盘的突出部相互靠近，在两个焊盘的外围接触面中，突出部103之间的距离最短，进而通过在每一个焊盘101上设置向外延伸的突出部103，相邻焊盘之间的距离更短，更有利于实现相邻的两个焊盘之间的电性连接，进而图1所示出的印刷电路板10中，通过在焊盘本体102上设置突出部103，焊盘的结构简单，通过突出部103可极大的减少相邻的两个焊盘之间的空间距离，不同的焊盘本体之间更容易进行信号的传输与交互，从而提高了印刷电路板10中不同焊盘之间的连接简便性。
其中，图2示出了本申请实施例提供的印刷电路板10的制作方法的实现流程，如图2所示，印刷电路板10的制作方法具体包括：
步骤S201：在相邻的两个焊盘的突出部之间设有电气隔离区域；具体结合附图1中印刷电路板的结构示意，在相邻的两个焊盘的突出部之间存在电气隔离区域，进而相邻的两个焊盘无法直接进行通信互联，其中所述电气隔离区域可容纳导体物质，如锡、铝等；由于在两个焊盘的边缘之间，相邻的两个突出部的距离最短，因此印刷电路板10上，相邻的两个焊盘的突出部之间的小范围存在电气隔离区域，从而相邻的两个焊盘的突出部通过电气隔离区域中的导体物质进行电性连接，相邻的两个焊盘之间的通讯互联更具有简便性。
步骤S202：将钢网覆盖于印刷电路板10的表面；其中钢网上开设有开孔，开孔与两个焊盘至少部分以及两个焊盘之间的电气隔离区域相对应；由于钢网由丝网制成，由于钢网具有耐腐蚀、耐高温的特性，因此在印刷电路板的制作过程中，通过钢网能够准确地将导体物质转移到电路板中；在步骤S202中，锡膏能够通过钢网上的开孔流入到焊盘上的部分区域以及电气隔离区域，相反，钢网上未开孔的区域就无法通过锡膏，进而本申请实施例通过钢网上的开孔能够准确无误地将锡膏蚀刻在印刷电路板10的预定区域，提高了印刷电路板10的蚀刻精度；
步骤S203：在钢网的表面进行刷锡，以使相邻的两个焊盘之间的电气隔离区域被锡膏覆盖；如上所述，由于在相邻的两个焊盘的突出部之间设有电气隔离区域，在钢网的表面进行均匀刷锡的过程中，锡膏就会通过钢网上的开孔沉积在下面的印刷电路板10中，进一步，由于钢网中分为两个部分：开孔区域和非开孔区域，在对钢网进行刷锡的过程中，只有钢网上的开孔区域才能够通过锡膏，而非开孔区域并不会通过锡膏；因此通过对钢网的表面进行刷锡，进而使锡膏通过钢网上的开孔流到印刷电路板10的电气隔离区域以及两个焊盘中的部分区域；由于锡膏具有极佳的导电性能，在印刷电路板10的电气隔离区域完全被锡膏覆盖后，相邻的两个焊盘的突出部通过锡膏实现电气连接，进而相邻的两个焊盘能够进行电能传输以及信号传递，印刷电路板10中各个焊盘能够互联形成一个电力系统，以实现更为复杂的电路功能；并且钢网上的开孔与两个焊盘上的至少部分以及印刷电路板10上的电气隔离区域相对应，因此，通过在印刷电路板10的特定位置设置电气隔离区域，进而印刷电路板10中会存在不同的电力传输线路，每一条电力传输线路中的焊盘通过锡膏进行电性连接，避免了印刷电路板10中存在电力误触发，保护了印刷电路板10中焊盘的物理安全。
因此在上述印刷电路板10的制作方法中，通过在相邻的两个焊盘的突出部之间设置电气隔离区域，并且钢网上的开孔与两个焊盘至少部分以及两个焊盘之间的电气隔离区域相对应，该电气隔离区域可以被锡膏完全覆盖，并且根据焊盘的内部组成材料，焊盘的中间的线为裸铜，电气隔离区域里的锡膏能够紧紧地附着在焊盘上，不易脱落；从而保证焊盘的突出部之间能够连接完好，以使相邻的两个焊盘之间具有良好的电气连接，提高印刷电路板10中不同焊盘之间电气连接的安全性和稳定性。
在本申请实施例中，在相邻的两个焊盘的突出部之间设有隔离区域，在钢网的表面进行刷锡，进而锡膏通过钢网上的开孔流入印刷电路板10的电气隔离区域以及相邻的两个焊盘上，该电气隔离区域沉积的大量的锡膏，相邻的两个焊盘的突出部通过锡膏进行电气连接，使得印刷电路板10中的焊盘通过电气隔离区域进行电性连接，不同的焊盘之间能够进行通信互联，以实现更为复杂的电路功能；因此在本申请实施例中印刷电路板10的制作方法中，通过在印刷电路板10中的电气隔离区域上的锡膏即可实现相邻的两个焊盘之间的电气连接，无需0欧姆电阻，节省了印刷电路板在制作过程中的器件成本，避免了印刷电路板在制作过程中所产生的器件损耗；并且本申请实施例中印刷电路板10的制作方法无需为0欧姆电阻进行打件操作，简化了印刷电路板10的制作流程，相邻的两个焊盘通过印刷电路板10中电气隔离区域沉积的锡膏实现电气连接，操作简便，易于实现；从而本申请实施例中印刷电路板10的制作方法具有极为简化的操作步骤、较低的制造成本，当印刷电路板10应用在电子设备中时，能够有效地促使该电子设备实现相应的电路功能，提高相应电子设备的实用性；解决了示例性技术中印刷电路板的制作成本较高、制作步骤过于复杂，进而导致相应的电子设备无法普遍适用的问题。
作为一种可选的实施方式，在步骤S203之后，本实施例中印刷电路板10的制作方法还包括：
对相邻的两个焊盘进行串行通讯检测，以判断相邻的两个焊盘是否实现通信互联。
在本实施例中，当相邻的两个焊盘之间的电气隔离区域被锡膏覆盖以后，锡膏作为数据通信的传输介质，能够实现不同焊盘之间的信号传输；为了确保印刷电路板10中不同焊盘之间能够进行安全、稳定的数据通信；通过对于相邻的两个焊盘进行串行通讯检测，以防止在钢网的表面进行刷锡以后相邻的两个焊盘仍然无法实现正常数据通信的问题，导致该印刷电路板的故障率较高；因此本实施例通过相邻的两个焊盘进行串行通讯检测，以判断出相邻的两个焊盘是否实现通信互联，提高了本实施例中印刷电路板的制作方法的效率以及实用价值；确保印刷电路板10中不同焊盘之间始终能够进行正常的串行通讯，降低了印刷电路10的通讯故障发生率，印刷电路板10的制作方法极大地提高了不同电子元器件之间的通讯稳定性，具有更广的适应范围。
作为一种可选的实施方式，在上述印刷电路板10的制作方法中，还包括：当相邻的两个所述焊盘实现通信互联，则发出通信互联指示信号。
如上所述，当相邻的两个焊盘之间的电气隔离区域被锡膏覆盖以后，若相邻的两个焊盘实现了通信互联，则说明两个焊盘上的电子元器件构成了一个电路系统整体，印刷电路板上的不同焊盘能够相互配合实现更为复杂的电路功能；当相邻的两个焊盘通信互联成功以后，则及时向技术人员发出通信互联指示信号，该通信互联指示信号能够直观地向技术人员传输通信互联成功信息；因此技术人员能够根据通信互联指示信号能够实时掌握不同焊盘之间的通信互联状态，提高了本实施例中印刷电路中焊盘的可操作性，以及用户能够准确地获取印刷电路板10中的电子元器件的工作状态，本实施例中印刷电路板10的制作方法具有更高的人机交互性能，确保了相邻的两个焊盘之间的通信互联安全性和稳定性。
作为一种可选的实施方式，在步骤S202中，开孔与两个焊盘以及两个焊盘之间的电气隔离区域相对应，进而使钢网上的开孔与两个焊盘以及两个焊盘之间的电气隔离区域完全重合，在钢网表面进行刷锡的过程中，锡膏通过钢网上的开孔将两个焊盘以及两个焊盘之间的电气隔离区域完全覆盖，以实现相邻两个焊盘的电性连接，相应的，印刷电路板10能够实现更为复杂的电路功能。
作为一种优选的实施方式，图3示出了本申请实施例提供的印刷电路板10的制作方法的另一种实现流程，相比于图2中印刷电路板10的制作方法；如图3所示，步骤S201具体包括：
步骤S301：在钢网上开设有开孔；通过在钢网上进行打孔，当钢网的表面存在流体物质的时候，该流体物质通过钢网上的开孔进行渗透，进而在对钢网的表面进行刷锡的过程中，锡膏通过钢网的开孔传输至印刷电路板10的表面，使印刷电路板10的焊锡过程能够安全进行，保障了印刷电路板10的制造过程安全性。
步骤S302：将钢网覆盖于印刷电路板10的表面，使钢网上的开孔与两个焊盘之间的电气隔离区域完全重合；由于只有钢网上的开孔区域才能通过锡膏，而钢网上的非开孔区域并不能通过锡膏，因此在步骤S302中，钢网上的开孔与印刷电路板10上的电气隔离区域完全重合，使钢网上面的锡膏能够传输至印刷电路板上的电气隔离区域，进而保证只有印刷电路板10上的电气隔离区域能够流入锡膏，而钢网上的非开孔区域无法通过任何锡膏，提高了印刷电路板的焊锡精准性，避免了在印刷电路板10的制作方法中锡膏被浪费的问题，相邻的两个焊盘的突出部能够通过电气隔离区域中的锡膏实现准确的电性连接，使印刷电路板10能够实现稳定、复杂的电路功能。
作为一种可选的实施方式，上述印刷电路板10包括2个或者3个电气隔离的焊盘101；本申请实施例中的印刷电路板的制作方法可应用在不同类型和具有不同电路功能的焊盘中，适用范围极广，技术人员可根据相应电子设备所需要实现的电路功能来提前设定印刷电路板10中焊盘的数量，进而所述印刷电路板的制作方法具有极强的兼容性，使印刷电路板10所实现的电路功能能够有效地满足技术人员的实际需求，提高相应电子设备的实用性。
作为一种可选的实施方式，在上述印刷电路板10中，焊盘本体102为矩形或者椭圆形，技术人员可提前设定印刷电路板10中焊盘本体102的形状，以满足各个焊盘所实现电路功能的需求；本实施例中印刷电路板的制作方法可使不同形状的焊盘本体102之间通过锡膏实现电性连接，进而不同焊盘本体102之间能够相互配合实现更为复杂的电路功能，兼容性极强，本实施例中印刷电路板的制作方法能够适用于具有不同电路功能的印刷电路板中，可广泛地应用于不同的工业领域中，实用价值更高。
图4示出了本申请实施例提供的印刷电路板40的模块结构，如图4所示，印刷电路板40包括多个电气隔离的焊盘401，焊盘401包括焊盘本体402和由焊盘本体402一侧向外延伸形成的突出部，其中焊盘本体402上集成了多种电子电路，进而焊盘401能够实现较为复杂的电路功能；相邻的两个焊盘的突出部相对设置，则相邻的两个焊盘的突出部相互靠近；相邻的两个焊盘的突出部之间的区域404中沉积有锡膏405，使相邻的两个焊盘的突出部之间的区域404以锡膏覆盖，相邻的两个焊盘的突出部通过锡膏405进行电气连接；参照上述图1-图3的具体实施方式，由于在本申请实施例中，通过焊盘本体402上增设了向外延伸的突出部403，则相邻的两个焊盘通过突出部403极大地缩短了空间距离，在印刷电路板40的制作过程中，在钢网上进行打孔，进而使锡膏通过钢网上的开孔流入到相邻的两个焊盘的突出部之间的区域404，印刷电路板40中的相邻的两个焊盘通过区域404中的锡膏405进行电气连接；当不同的焊盘实现电气连接后，印刷电路板40上的多个焊盘能够相互配合以实现更为复杂的电路功能，进而极大地简化了印刷电路板40上的电路结构，兼容性更强；因此本申请实施例中的印刷电路板40能够利用两个焊盘的突出部之间的区域404中的锡膏405来替代示例性技术中的0欧姆电阻，以实现不同焊盘之间的电气连接，节省了印刷电路板40的制作成本及其工业应用成本，本申请实施例中的印刷电路板40具有较为简化的电路结构，能够适用于不同类型的电子设备中，以实现相应的电路功能，适用范围极广；从而有效地解决了示例性技术中印刷电路板必须依靠0欧姆电阻来实现不同焊盘之间的电气连接，传统的印刷电路板的制造成本、工业应用成本较高，该印刷电路板上的电路结构过于复杂，难以适用不同类型的电子设备中，实用性较低的问题。
作为一种可选的实施方式，在焊盘401中，所述焊盘本体402为矩形。
作为一种可选的实施方式，在焊盘401中，所述焊盘本体402为椭圆形；因此本实施例所提供的印刷电路板40可兼容不同形状的焊盘本体402，以实现不同的电路功能，技术人员可依据实际需要设定焊盘本体402的具体形状，灵活性极强；进而本实施例中的印刷电路板40能够适用于各个工业领域中，适用范围极广，极大地提高本实施例中印刷电路板40的实用价值。
作为一种可选的实施方式，印刷电路板40还包括：通讯检测器，所述通讯检测器与焊盘401连接，所述通讯检测器检测相邻的两个焊盘401是否实现通信互联。
在本实施例中，印刷电路板40还设置有通讯检测器，该通讯检测器能够检测不同焊盘401之间的串行通讯状态；由于相邻的两个焊盘的突出部之间被锡膏覆盖，本实施例通过通讯检测器能够检测出相邻的两个焊盘之间实现了正常的数据通讯，以保障印刷电路板40中不同的焊盘实现稳定、安全、持续性的数据通讯，印刷电路板40中的不同焊盘能够相互配合以形成一个电路整体，始终保持在正常的工作状态，该印刷电路板40能够实现更加复杂的电路功能，提高了印刷电路板40的适用范围。
可选的，本实施例中的通讯检测器可采用示例性技术中的双向通信测试测量电路来实现，其中该双向通信测试测量电路包括中央处理器、电阻以及电容等电子元器件，可选的，该中央处理器的型号为：S3C2440A；当该双向通信测试测量电路应用在印刷电路板40中时，双向通信测试测量电路向相邻的两个焊盘输出通信测试信号，相邻的两个焊盘接收到该通信测试信号后并生成反馈信号，中央处理器通过该反馈信号即可判断出相邻的两个焊盘是否成功实现了通信互联，操作简便，对于相邻的两个焊盘之间的串行通讯检测具有极高的准确率；从而本实施例通过相邻的两个焊盘即可对不同焊盘之间的通信状态进行实时监控，极大地提高了印刷电路板40中数据通讯的安全性和稳定性。
作为一种可选的实施方式，上述印刷电路板40还包括：
状态显示器，状态显示器与通讯检测器连接，状态显示器显示相邻的两个所述焊盘通信互联信息。
在本实施例中，当通讯检测器检测出印刷电路板40中相邻的两个焊盘是否实现通信互联以后，通讯检测器将检测结果传输至状态显示器，进而通过状态显示能够实时显示相邻两个焊盘的通信互联信息；技术人员可通过该状态显示器能够直观地获知两个焊盘是否成功地实现了通信互联，技术人员的使用体验更佳；印刷电路板40在正常工作过程中，通过状态显示器能够实时显示不同焊盘之间的通信互联信息，避免印刷电路板40中相邻的两个焊盘出现通信中断的现象，印刷电路板40中不同的电子元器件始终能够形成一个电路系统，以发挥更为复杂的电路功能；因此在本实施例中，技术人员可通过状态显示器实时监控不同焊盘之间的通信互联状态，避免印刷电路板40中相邻两个焊盘出现通信故障，提高了印刷电路40中相邻两个焊盘之间的通信质量，进而本实施例中的印刷电路板40具有更高的实用价值。
可选的，状态显示器可采用示例性技术中的视频显示电路来实现，所述视频显示电路包括：电阻、MOS管以及发光二极管等电子元器件，其中通过发光二极管的发光状态来显示相邻的两个焊盘之间的通信互联信息；示例性，当印刷电路板40中相邻的两个焊盘成功地实现了通信互联，则发光二极管正常发光；当印刷电路板40中相邻的两个焊盘并未实现了通信互联，则发光二极管不发光，进而通过发光二极管的发光情况能够准确地反映印刷电路板40中相邻的两个焊盘的通信互联状态；因此本实施例中状态显示器具有较为简化的电路结构，易于实现，能够有效地提高印刷电路板40的人机交互性能。
作为一种可选的实施方式，在上述印刷电路板40中，所述相邻的两个焊盘401、以及相邻的两个焊盘的突出部之间的区域404均以锡膏405覆盖，一方面，由于锡膏405能够紧紧地吸附在焊盘401上，防止锡膏405从印刷电路板40上脱落，提高了相邻的两个焊盘401之间的通信安全，另一方面，由于锡膏405具有极强的导电性能，进而相邻的两个焊盘401能够通过锡膏405进行快速的通信互联以及电源传输，多个焊盘401能够相互配合以实现较为复杂的电路功能，具有较高的实用价值；因此本实施例中的多个焊盘401通过锡膏405即可实现彼此之间的通信互联，通信信号的传输效率高，印刷电路板40的制造成本较低，进而极大地提高印刷电路板40的适用范围。
图5示出了本申请实施例提供的驱动电路板50的模块结构，通过该驱动电路板50能够传输并处理显示屏驱动信号，通过该显示屏驱动信号能够驱动显示屏显示相应的图像或者视频，具体的，如图5所示，驱动电路板50包括第一焊盘501和第二焊盘502，其中第一焊盘501和第二焊盘502上分别集成相应的功能电路，进而第一焊盘501和第二焊盘502能够分别独立地实现相应的电路功能；其中第一焊盘501包括第一焊盘本体503以及由第一焊盘本体503一侧向外延伸形成的第一突出部504，第二焊盘502包括第二焊盘本体505以及由第二焊盘本体505一侧向外延伸形成的第二突出部506，其中第一突出部504和第二突出部506相对设置，则在第一焊盘501的边缘和第二焊盘502的边缘之间，第一突出部504和第二突出部506之间的距离最短，进而在本申请实施例中，驱动电路板50中的两个焊盘（包括第一焊盘501和第二焊盘502）通过突出部（包括第一突出部504和第二突出部506）极大地缩短了空间距离，第一焊盘501和第二焊盘502更容易实现电性连接。
其中，在第一突出部504和第二突出部506电之间的区域507中沉积有锡膏508，使区域507完全被锡膏覆盖，第一突出部504和第二突出部506通过锡膏508进行电气连接，进而使驱动电路板50上的第一焊盘501和第二焊盘502能够进行通信互联，以实现整体的电路功能；需要说明的是，本申请实施例中驱动电路板50的制造过程及其工作原理可参照上述图1至图3的实施例，此处将不再赘述；结合上文中的内容，由于在本申请实施例中驱动电路板50的模块结构中，第一焊盘501和第二焊盘502之间只需要通过锡膏508来进行电气连接，无需额外的0欧姆电阻等辅助设备，从而极大地简化了驱动电路板50的电路结构，降低了相应显示屏的制作成本，提高了相应显示屏的实用性；同时在驱动电路板50传输显示屏驱动信号的过程中，第一焊盘501和第二焊盘502可通过锡膏508实现快速的信号传递与通信互联，进而使位于不同焊盘（包括第一焊盘501和第二焊盘502）上的电子元器件能够实现协同工作，以实现更为复杂的电路功能，显示屏驱动信号能够依次通过第一焊盘501、锡膏508以及第二焊盘502并输出，第一焊盘501上的电子元器件和第二焊盘502上的电子元器件对显示屏驱动信号进行功能转换和传输；当驱动电路板50应用于显示屏中，该显示屏能够实时接收到大量的显示屏驱动信号，该显示屏根据显示屏驱动信号显示高清、动态的图像；因此本申请实施例中的驱动电路板50具有极为简化的电路结构，能够实现显示屏驱动信号的快速传输与转换，可广泛地适用于不同类型的显示屏中，兼容性极强。
作为一种可选的实施方式，在上述驱动电路板50中，第一焊盘本体503为矩形或者椭圆形，第二焊盘本体505为矩形或者椭圆形；进而本实施例中的驱动电路板50具有较强的兼容性，第一焊盘501和第二焊盘502能够包括具有不同功能的电子元器件，该驱动电路板50能够实现更加全面的电路功能，以满足技术人员的实际需求。
在本实施例中，第一焊盘501和第二焊盘502通过锡膏508进行通信连接，进而第一焊盘501中的电子元器件和第二焊盘50中的电子元器件之间通过锡膏508进行通信互联，以形成一个电路整体，有效地降低了本实施例驱动电路板50中电子元器件的通信互联成本。
作为一种可选的实施方式，在上述驱动电路板50中，第一焊盘501、第二焊盘502、以及第一突出部504和第二突出部506之间的区域507均以锡膏508覆盖；进而本实施例中的锡膏508能够与第一焊盘501以及第二焊盘502紧紧连接，提高了第一焊盘501和第二焊盘502之间的通信质量和通信安全；即降低了驱动电路板50的制造成本，又保障了驱动电路板50中的所有电子元器件始终能够处于安全、稳定的运行状态。
作为一种具体的实施方式，在上述驱动电路板50中，第一焊盘501包括电源电路和控制电路，其中电源电路输出直流电源；具体的，电源电路接入外界电能，并将外界电能转换为直流电源，通过该直流电源能够向第一焊盘501上的电路模块和第二焊盘502上的电路模块提供额定的电压，以保障驱动电路板50上的电子元器件能够处于正常的工作状态；控制电路能够对信号进行集中处理并转换输出，其中控制电路与电源电路连接，电源电路将直流电源传输至控制电路，以驱动控制电路能够维持稳定的工作状态，控制电路能够接入显示屏驱动信号和生成显示屏控制信号，其中显示屏驱动信号包括大量的图像数据，通过该显示屏驱动信号可驱动显示屏能够显示动态、清晰的图像或者视频；显示屏控制信号包括用户的控制指令和操作信息，通过该显示屏控制信号能够控制焊盘（包括第一焊盘501和第二焊盘502）中各个电路模块的工作状态；进而在在本申请实施例中，第一焊盘501通过控制电路能够接入显示屏驱动信号，以实现驱动电路板50与外界电子设备的信息交互，并且第一焊盘501通过控制电路所生成的显示屏控制信号，可用于操控显示屏的工作状态，操作简便，实用性较强。
第二焊盘502包括栅极驱动电路和源极驱动电路，如上所述，由于第一焊盘501和第二焊盘502通过锡膏508进行电性连接，进而第一焊盘501中的电路模块（包括电源电路和控制电路）和第二焊盘502中的电路模块（包括栅极驱动电路和源极驱动电路）能够进行双向信号传输，具体的，栅极驱动电路接收显示屏控制信号和显示屏驱动信号，并且栅极驱动电路根据显示屏控制信号来接收显示屏驱动信号；通过显示屏控制信号能够控制栅极驱动电路的工作状态，若栅极驱动电路导通，则第二焊盘502能够接收显示屏驱动信号，通过该显示屏驱动信号能够使显示屏处于正常的工作状态，该栅极驱动电路具有良好的可控性能；源极驱动电路接收该显示屏控制信号和显示屏驱动信号，进而通过该显示屏控制信号能够使源极驱动电路处于导通状态或者关断状态，进一步地，该源极驱动电路根据显示屏控制信号对显示屏驱动信号进行功能转换，使源极驱动电路所输出的显示屏驱动信号具有显示屏驱动功能；因此在本申请实施例中，通过结合栅极驱动电路和源极驱动电路对显示屏驱动信号进行转换和传输操作，进而通过该显示屏驱动信号能够驱动该显示屏进行正常的图像或者视频显示，使驱动电路板50能够始终处于稳定的工作状态。
在本申请实施例中，由于在第一焊盘501中的电路模块（包括电源电路和控制电路）和第二焊盘502中的电路模块（包括栅极驱动电路和源极驱动电路）通过锡膏进行通信连接，不但降低了驱动电路板50的制作成本，简化了驱动电路板50中的电路结构，而且不同焊盘上的电路模块能够相互协同配合，对显示屏驱动信号进行转换和传输，进而使显示屏驱动信号能够在驱动电路板50中进行快速地传递，相应的显示屏能够根据显示屏驱动信号显示清晰的图像或者视频，提高该显示屏的实用价值，从而本申请实施例中的驱动电路板50能够适用于不同类型的显示屏中。
需要说明的是，上述电源电路、控制电路、栅极驱动电路以及源极驱动电路都可以通过示例性技术中具体的电路结构来实现，例如，电源电路可采用电源管理芯片来实现电源转换输出的功能，其中，电源管理芯片的型号为KA1L0380RB；又比如，控制电路可采用显示器驱动芯片，其中显示器驱动芯片的型号为MST717C；又比如，栅极驱动电路包括MOS管阵列和电阻，其中MOS管阵列包括多个相互连接的MOS管，当MOS管阵列接入显示屏控制信号时，通过显示屏控制信号的电平状态即可控制MOS管导通或者关断，当MOS管阵列导通时，该栅极驱动电路能够实时地接入显示屏驱动信号；又比如，源极驱动电路包括二极管和开关管等电子元器件，当源极驱动电路接入显示屏控制信号时，通过显示屏控制信号能够控制源极驱动电路的工作状态，进而通过二极管和开关管对显示屏驱动信号进行功能转换，该显示屏驱动信号能够实现相应的显示屏驱动功能；因此显示屏接收到该显示屏驱动信号中的图像数据，即可实现相应的视频显示功能。
作为一种可选的实施方式，驱动电路板50还包括：
显示面板状态显示器，显示面板状态显示器与第一焊盘501以及第二焊盘502连接，显示面板状态显示器显示第一焊盘501和第二焊盘502的通信互联信息。
在本实施例中，如上所述，由于在第一焊盘501中集成了大量的电子元器件，第二焊盘502中集成了大量的电子元器件，当显示面板进行视频/图像显示时，则第一焊盘501和第二焊盘502需要通过锡膏508进行数据传输，进而驱动电路板50中的所有电子元器件能够作为一个电路整体，使驱动电路板50能够实现更为完整、更为复杂的电路功能；相反，若驱动电路板50中的第一焊盘501和第二焊盘502出现通信中断的现象，将会导致显示面板无法处于正常的工作状态；为此，本实施例显示面板状态显示器能够实时显示第一焊盘501和第二焊盘502之间的通信互联信息，进而技术人员通过该显示面板状态显示器能够准取地获知第一焊盘501和第二焊盘502是否成功地实现了通信互联，提高了驱动电路板50中不同电子元器件之间的通讯稳定性；从而避免了驱动电路板50中第一焊盘501和第二焊盘502容易出现通信故障的问题，驱动电路板50中不同的电子元器件始终能够通信互联，以完整地实现相应的电路功能，保障了显示面板中能够正常的显示图像/视频信息，通过显示面板状态显示器极大地提高了本实施例中驱动电路板50的实用价值以及人机交互性能。
作为一种可选的实施方式，所述显示面板状态显示器可采用示例性技术中的故障报警器来实现，其中所述故障报警器包括：电阻、MOS管以及发光二极管等电子元器件，其中该故障报警器通过发光二极管的发光情况即可向技术人员发出灯光指示信息，技术人员可根据该灯光指示信息来获知第一焊盘501和第二焊盘502的通信互联状态；示例性的，若第一焊盘501和第二焊盘502成功地实现了通信互联，则故障报警器中的发光二极管立即发光，技术人员可根据该光信号直观地得出：不同焊盘之间成功实现了通信互联；若第一焊盘501和第二焊盘502并未实现通信互联，则故障报警器中的发光二极管并不发光；因此，本实施例通过故障报警器能够直观、准确地显示第一焊盘501和第二焊盘502的通信互联状态，操作简便，误差较少；从而保障了本实施例中显示面板能够始终处于正常的工作状态，减少了显示面板中第一焊盘501和第二焊盘502之间的通信故障率，进而提高了技术人员的使用体验。
图6示出了本申请实施例提供的显示设备60的模块结构，如图6所示，显示设备60包括：信号采集器601、驱动电路板602以及显示面板603；其中，通过信号采集器601能够采集图像信息，并根据该图像信息生成显示屏驱动信号，该显示屏驱动信号包括图像数据，进而信号采集器601能够将外界的图像信息进行编码后转换为显示屏驱动信号，使该显示屏驱动信号能够在显示设备60中的内部电路进行快速传输，显示设备60能够根据该显示屏驱动信号显示相应的图像或者视频；因此在本申请实施例中，显示设备60能够通过信号采集器601与外界的电子设备实现通信互联，以获取外界的图像信息。
作为一种可选的实施方式，上述信号采集器601包括示例性技术中的信号采集电路，该信号采集电路包括运算放大器、变压器以及电阻等电子元器件，进而通过该信号采集电路能够收集外界的电信号等物理脉冲，通过运算放大器和变压器等电子元器件读取电信号中的图像信息，并将该图像信息转换为显示设备60可识别的显示屏驱动信号，因此本申请实施例通过信号采集器601能够实时地获取图像数据，以驱动显示设备60实现图像显示功能。
其中，驱动电路板602与信号采集器601连接，信号采集器601将显示屏驱动信号传输至驱动电路板602，通过驱动电路板602能够传输显示屏驱动信号，使显示设备60能够正常地接收到该显示屏驱动信号；需要说明的是，图6中驱动电路板602即为上述图5中驱动电路板50，因此本申请实施例中驱动电路板602的工作原理及其内部模块结构可参照上述图5的实施例，此处将不再赘述。
显示面板603与驱动电路板602连接，驱动电路板602将显示屏驱动信号传输至显示面板603，进而显示面板603根据显示屏驱动信号进行视频显示；当显示面板603接收到显示屏驱动信号时，显示面板603对显示屏驱动信号进行解码后获取图像数据，进而通过该显示屏驱动信号能够驱动显示面板603显示相应的图像或者视频，以满足用户的观赏需求。
作为一种可选的实施方式，所述显示设备60为LED（Light Emitting Diode，发光二极管）、LCD（Liquid Crystal Display，液晶显示屏）、OLED（Organic Light-Emitting Diode，有机发光二极管）或者电子显示屏；进而本申请实施例中驱动电路板602可适用在不同类型的显示屏中，兼容性极强，降低了各种类型显示屏的制作成本和工业应用成本，给用户带来良好的使用体验感。
在本申请实施例中，显示设备60通过信号采集器601能够实时接收图像信息，并将图像信息快速地转换为显示屏驱动信号，通过该显示屏驱动信号可向显示设备60实时传输图像数据，以实时更新显示设备60中的图像数据；参照上述图5的实施例，通过驱动电路板602能够对显示屏驱动进行快速地传输并转换，使该显示屏驱动信号具有完整的显示屏驱动功能，进而使显示面板603能够实时地接收到该显示屏驱动信号，通过显示屏驱动信号能够驱动显示面板603进行视屏显示，以满足用户的视觉需求；从而本申请实施例中的显示设备60具有较为简化的电路模块结构，显示设备60中的各个电路模块制造成本低廉以及制造流程简单，极大地降低了显示设备60的工业制造成本和应用成本，适用范围较广；用户可通过显示设备60能够实时观赏到高清的图像或者视频，给用户带来了良好的视觉体验感，方便了用户的使用；有效地解决了示例性技术中显示屏的制造成本过高，其内部电路结构复杂，用户的使用体验感不佳，进而导致该显示屏难以普遍适用于不同工业领域的问题。
图7示出了本申请实施例提供的显示系统70的模块结构，如图7所示，显示系统70包括如上所述的显示设备60；参考上述图6的实施例，通过显示系统70能够显示高清的视屏或者图像，并且显示系统70的工业应用成本较低，适用范围极广，可普遍地适用于各个工业领域中，给用户带来良好的使用体验感，实用性极强；有效地解决了示例性技术中显示系统的工业应用成本过高，用户的使用体验感不佳的问题。
综上所述，本申请实施例中的印刷电路板10的制作方法采用锡膏即可实现不同焊盘之间的电气连接，无需额外的0欧姆电阻，即节省了印刷电路板10的制造材料成本，又简化了印刷电路板10的制作流程；本申请实施例中的印刷电路板10具有极为简化的电路结构，能够实现较为复杂的电路功能，实用性强，可广泛地应用在各个工业领域中，具有很强的实际应用前景。
需要说明的是,在本文中，诸如多个和多种之类的词语是指大于1的数量，诸如第一和第二之类的关系术语仅仅用来将一个实体与另一个实体区分开来，而不一定要求或者暗示这些实体之间存在任何这种实际的关系或者顺序。而且术语“包括”、“包含”或者任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的产品或者结构所固有的要素。在没有更多限制的情况下，由语句“包括……”或者“包含……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者终端设备中还存在另外的要素。此外，在本文中，“大于”、“小于”、“超过”等理解为不包括本数；“以上”、“以下”、“以内”等理解为包括本数。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种印刷电路板的制作方法，所述印刷电路板包括多个电气隔离的焊盘，其中，所述焊盘包括焊盘本体和由所述焊盘本体一侧向外延伸形成的突出部，其中相邻的两个所述焊盘的突出部相对设置，所述印刷电路板的制作方法包括：
    在相邻的两个所述焊盘的突出部之间设有电气隔离区域；
    将钢网覆盖于所述印刷电路板的表面，其中所述钢网上开设有开孔，所述开孔与两个所述焊盘至少部分以及两个所述焊盘之间的电气隔离区域相对应；
    在所述钢网的表面进行刷锡，以使相邻的两个所述焊盘之间的电气隔离区域被锡膏覆盖。
  2. 根据权利要求1所述的制作方法，其中，所述开孔与两个所述焊盘以及两个焊盘之间的电气隔离区域相对应。
  3. 根据权利要求2所述的制作方法，其中，在所述钢网的表面进行刷锡，以使两个所述焊盘以及相邻的两个所述焊盘之间的电气隔离区域被锡膏覆盖。
  4. 根据权利要求1所述的制作方法，其中，所述开孔与两个所述焊盘之间的电气隔离区域完全重合。
  5. 根据权利要求1所述的制作方法，其中，所述焊盘本体为矩形或者椭圆形。
  6. 根据权利要求1所述的制作方法，其中，在所述钢网的表面进行刷锡，以使相邻的两个所述焊盘之间的电气隔离区域被所述锡膏覆盖以后，所述印刷电路板的制作方法还包括：
    对相邻的两个所述焊盘进行串行通讯检测，以判断相邻的两个所述焊盘是否实现通信互联。
  7. 根据权利要求6所述的制作方法，其中，所述印刷电路板的制作方法还包括：
    当相邻的两个所述焊盘实现通信互联，则发出通信互联指示信号。
  8. 根据权利要求1所述的制作方法，其中，所述在所述钢网的表面进行刷锡，以使相邻的两个所述焊盘之间的电气隔离区域被锡膏覆盖，具体为：
    在所述钢网上进行刷锡，所述锡膏通过所述钢网上的开孔流入到相邻的两个所述焊盘之间的电气隔离区域，所述钢网上未开孔的区域无法通过所述锡膏，以使相邻的两个所述焊盘之间的电气隔离区域被所述锡膏覆盖。
  9. 一种印刷电路板，包括多个电气隔离的焊盘，其中，所述焊盘包括焊盘本体和由所述焊盘本体一侧向外延伸形成的突出部，其中相邻的两个所述焊盘的突出部相对设置，所述相邻的两个所述焊盘的突出部之间的区域以锡膏覆盖。
  10. 根据权利要求9所述的印刷电路板，其中，在所述焊盘中，所述焊盘本体为矩形或者椭圆形。
  11. 根据权利要求9所述的印刷电路板，其中，所述印刷电路板还包括：
    通讯检测器，所述通讯检测器与所述焊盘连接，所述通讯检测器检测相邻的两个所述焊盘是否实现通信互联。
  12. 根据权利要求11所述的印刷电路板，其中，所述印刷电路板还包括：
    状态显示器，所述状态显示器与所述通讯检测器连接，所述状态显示器显示所述相邻的两个所述焊盘通信互联信息。
  13. 根据权利要求9所述的印刷电路板，其中，所述相邻的两个所述焊盘、以及所述相邻的两个所述焊盘的突出部之间的区域均以锡膏覆盖。
  14. 一种驱动电路板，其中，包括第一焊盘和第二焊盘，其中所述第一焊盘包括第一焊盘本体和由所述第一焊盘本体一侧向外延伸形成的第一突出部，所述第二焊盘包括第二焊盘本体和由所述第二焊盘本体一侧向外延伸形成的第二突出部，其中所述第一突出部和所述第二突出部进相对设置；
    在所述第一突出部和所述第二突出部之间的区域以锡膏覆盖。
  15. 根据权利要求14所述的驱动电路板，其中，所述第一焊盘本体为矩形或者椭圆形，所述第二焊盘本体为矩形或者椭圆形。
  16. 根据权利要求14所述的驱动电路板，其中，所述第一焊盘和所述第二焊盘通过所述锡膏进行通信连接。
  17. 根据权利要求14所述的驱动电路板，其中，所述第一焊盘、所述第二焊盘、以及所述第一突出部和所述第二突出部之间的区域均以所述锡膏覆盖。
  18. 根据权利要求14所述的驱动电路板，其中，所述第一焊盘包括：
    电源电路，用于输出直流电源；以及
    控制电路，与所述电源电路连接，用于接入显示屏驱动信号和生成显示屏控制信号；
    所述第二焊盘包括：
    栅极驱动电路，用于根据所述显示屏控制信号来接收所述显示屏驱动信号；以及
    源极驱动电路，用于根据所述显示屏控制信号对所述显示屏驱动信号进行转换后输出。
  19. 根据权利要求18所述的驱动电路板，其中，所述电源电路包括电源管理芯片，所述控制电路包括显示器驱动芯片。
  20. 根据权利要求18所述的驱动电路板，其中，所述驱动电路板还包括：
    显示面板状态显示器，所述显示面板状态显示器与所述第一焊盘以及所述第二焊盘连接，所述显示面板状态显示器显示所述第一焊盘和所述第二焊盘的通信互联信息。
PCT/CN2018/110496 2018-08-27 2018-10-16 印刷电路板的制作方法、印刷电路板及驱动电路板 Ceased WO2020042293A1 (zh)

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