WO2020040202A1 - Ｒｆｉｄタグ用基板、ｒｆｉｄタグ及びｒｆｉｄシステム - Google Patents

Ｒｆｉｄタグ用基板、ｒｆｉｄタグ及びｒｆｉｄシステム Download PDF

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Publication number
WO2020040202A1
WO2020040202A1 PCT/JP2019/032650 JP2019032650W WO2020040202A1 WO 2020040202 A1 WO2020040202 A1 WO 2020040202A1 JP 2019032650 W JP2019032650 W JP 2019032650W WO 2020040202 A1 WO2020040202 A1 WO 2020040202A1
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WO
WIPO (PCT)
Prior art keywords
conductor
electrode
rfid tag
distance
capacitance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/032650
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English (en)
French (fr)
Japanese (ja)
Inventor
周一 山本
林　拓也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to US17/269,051 priority Critical patent/US11354557B2/en
Priority to JP2020538437A priority patent/JP7062772B2/ja
Priority to EP19851820.1A priority patent/EP3843009B1/en
Priority to CN201980054128.7A priority patent/CN112602093B/zh
Publication of WO2020040202A1 publication Critical patent/WO2020040202A1/ja
Anticipated expiration legal-status Critical
Priority to US17/720,973 priority patent/US11783155B2/en
Priority to JP2022069140A priority patent/JP7379580B2/ja
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/0779—Antenna details the antenna being foldable or folded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration

Definitions

  • the present disclosure relates to a substrate for an RFID (Radio Frequency Identifier) tag, an RFID tag, and an RFID system.
  • RFID Radio Frequency Identifier
  • an RFID system that transmits and receives information to and from an RFID tag by wireless communication has been used for the purpose of article management and the like.
  • an RFID tag a tag having an RFID tag substrate provided with an antenna such as a plate-shaped inverted-F antenna and a semiconductor integrated circuit mounted on the plate surface of the RFID tag substrate are widely used (for example, International Publication No. WO 2013/1455312).
  • Such an RFID tag can transmit radio waves including information stored in the semiconductor integrated circuit or write information included in the received radio waves to the semiconductor integrated circuit through an antenna of the RFID tag substrate. it can.
  • an RFID tag is attached to an article, information about the article is acquired from the RFID tag by a predetermined reader / writer, or necessary information is written to the RFID tag. By doing so, articles can be managed.
  • the RFID tag substrate includes: An RFID tag substrate having a plate surface on which a semiconductor integrated circuit is mounted, wherein the plate surface and the semiconductor integrated circuit are used by being sealed with a sealing member, An insulating substrate having one surface forming the plate surface, A first surface conductor provided on the one surface of the insulating substrate; A second surface conductor provided on a surface of the insulating substrate opposite to the one surface; A short-circuit portion penetrating conductor that penetrates the insulating substrate in a thickness direction and electrically connects the first surface conductor and the second surface conductor; A capacitive conductor provided inside the insulating substrate and forming a capacitive element facing at least a part of the first surface conductor or at least a part of the second surface conductor; A capacitance portion penetrating conductor that is provided inside the insulating substrate and electrically connects the capacitance conductor and one of the first surface conductor and the second surface conductor that does not face the capacitance conductor; A first electrode
  • An RFID tag includes: Said RFID tag substrate, The semiconductor integrated circuit mounted on the plate surface of the RFID tag substrate, The sealing member for sealing the plate surface of the RFID tag substrate and the semiconductor integrated circuit; Is provided.
  • An RFID system includes: The above RFID tag, A reader / writer that transmits and receives radio waves to and from the RFID tag; Is provided.
  • FIG. 2 is a diagram illustrating an RFID system.
  • FIG. 4 is a diagram illustrating a radio wave emission state according to the structure of an RFID tag.
  • FIG. 4 is a diagram illustrating a radio wave emission state according to the structure of an RFID tag.
  • FIG. 2 is a cross-sectional view illustrating a configuration of the RFID tag according to the first embodiment.
  • FIG. 4 is an exploded perspective view of the RFID tag of FIG. 3.
  • FIG. 4 is an exploded perspective view illustrating another aspect of the RFID tag of the first embodiment. It is sectional drawing which shows the structure of the board
  • FIG. 8 is an exploded perspective view of the RFID tag of FIG. 7. It is a sectional view showing the composition of the RFID tag of a 3rd embodiment.
  • FIG. 10 is an exploded perspective view of the RFID tag of FIG. 9.
  • FIG. 1 is a diagram illustrating an RFID system 1 according to the first embodiment of the present disclosure.
  • the RFID system 1 includes an RFID tag 10 and a reader / writer 2 that transmits and receives radio waves to and from the RFID tag 10.
  • the RFID tag 10 is used, for example, by being attached to the surface of the article 3 to be managed.
  • the RFID tag 10 is a type that does not include a battery, receives power from the reader / writer 2 via an electromagnetic wave, and operates using the power. Note that the RFID tag 10 may be of a type that incorporates a battery.
  • the RFID tag 10 includes an RFID tag substrate 100, an RFID tag IC (Integrated Circuit) 200 (semiconductor integrated circuit) mounted on the surface of the RFID tag substrate 100, and an RFID tag substrate 100 of the RFID tag substrate 100.
  • a sealing member 300 that seals the plate surface on which the IC 200 is mounted and the RFID tag IC 200.
  • the RFID tag substrate 100 is a rectangular parallelepiped plate-like member having a plate-shaped inverted-F antenna formed therein, and a detailed configuration thereof will be described later.
  • the RFID tag IC 200 includes a control unit that performs control related to transmission and reception of radio waves, a storage unit that stores information related to the article 3, and a power supply terminal 201 (see FIG. 1) that is electrically connected to the antenna of the RFID tag substrate 100. 3) and a reference potential terminal 202 (see FIG. 3).
  • the RFID tag IC 200 acquires the command information included in the radio wave received by the antenna under the control of the control unit, and performs a process (for example, rewriting the information stored in the storage unit) according to the command information.
  • a radio wave including information specified by the command information is transmitted (emitted) from the antenna.
  • the sealing member 300 covers and protects the RFID tag IC 200.
  • the sealing member 300 is formed such that the structure including the RFID tag substrate 100 and the sealing member 300 has a rectangular parallelepiped shape as a whole.
  • an epoxy resin, a polyimide resin, a silicone resin, or the like can be used as the sealing member 300.
  • filler particles such as silica particles or glass particles may be added to these resin materials. The filler particles are added, for example, to adjust various characteristics of the sealing member 300 such as mechanical strength, moisture resistance, and electrical characteristics.
  • the reader / writer 2 has an antenna 2a for transmitting and receiving radio waves to and from the RFID tag 10.
  • the reader / writer 2 transmits, to the RFID tag 10, a radio wave including command information for commanding rewriting of information and transmission of information. Further, the reader / writer 2 receives a radio wave transmitted from the RFID tag 10 in response to the command information, acquires information included in the radio wave, and performs a predetermined process (for example, a predetermined storage device) using the information. (A writing process to the device or a display process on a predetermined display device).
  • a predetermined process for example, a predetermined storage device
  • FIG. 2A and FIG. 2B are diagrams for explaining a radio wave radiation state according to the structure of the RFID tag 10.
  • the RFID tags include a cavity-type RFID tag 10C as shown in FIG. 2A and a flat-type RFID tag 10 as shown in FIGS. 1 and 2B.
  • a flat-type RFID tag 10 is used.
  • 2A and 2B show orthogonal coordinates x, y, and z fixedly defined in the RFID tag 10C and the RFID 10.
  • the z direction is also referred to as the height direction of the RFID tag 10C and the RFID 10.
  • the height is merely a name for convenience, and does not always match the actual height direction (vertical direction) when the RFID tag 10C and the RFID 10 are used.
  • a concave portion (cavity) is provided on the upper surface of the RFID tag substrate 100, the RFID tag IC 200 is mounted on the bottom surface of the concave portion, and the inside of the concave portion is sealed by the sealing member 300. It is sealed.
  • the entire upper surface of the flat-type RFID tag substrate 100 is sealed by the flat sealing member 300.
  • Such a flat-type RFID tag 10 does not require a step of forming a concave portion in the RFID tag substrate 100, and the sealing member 300 is formed on the entire surface of the composite substrate including the large number of RFID tag substrates 100. The manufacturing cost can be reduced for the cavity-type RFID tag 10C because it can be efficiently manufactured by a method of dividing after being formed.
  • the radio wave transmitted from the RFID tag substrate 100 is radiated from the side surface (one of the surfaces parallel to the yz plane) of the RFID tag substrate 100. In the + z direction.
  • the transmittable distance of the radio wave in the + z direction from the mounting surface of the RFID tag 10, 10C on the article 3 depends on the magnitude of the power received from the reader / writer 2, the size of the RFID tag 10, 10C, and the like. It is about cm to several meters.
  • radio waves have a property of trying to pass through a substance having a higher dielectric constant (relative dielectric constant). For this reason, in the flat-type RFID tag 10 of FIG. 2B, a part of the radio wave radiated from the side surface of the RFID tag substrate 100 to the external space easily enters the sealing member 300, and the radio wave is transmitted in a desired direction (+ z direction). ). On the other hand, in the cavity-type RFID tag 10C of FIG. 2A, since the sealing member 300 is embedded in the concave portion, radio waves are hardly incident on the sealing member 300, and such a problem is unlikely to occur.
  • the reach L2 of the radio wave from the flat-type RFID tag 10 in the + z direction is equal to the cavity-type RFID tag.
  • the radio wave from 10C is shorter than the arrival distance L1 in the + z direction. That is, the communication distance of the flat-type RFID tag 10 tends to be shorter than that of the cavity-type RFID tag 10C.
  • the RFID tag 10 of the present embodiment employs a flat-plate structure to reduce the manufacturing cost and optimize the configuration of the RFID tag substrate 100 to increase the communication distance. It is possible.
  • the configuration of the RFID tag 10 of the present embodiment will be described focusing on the structure of the RFID tag substrate 100.
  • FIG. 3 is a cross-sectional view illustrating the configuration of the RFID tag 10 according to the present embodiment.
  • FIG. 4 is an exploded perspective view of the RFID tag 10 of FIG.
  • the RFID tag substrate 100 includes an insulating substrate 110 and an upper surface provided on one surface (a surface facing in the + z direction; hereinafter also referred to as an upper surface 110 a) of the insulating substrate 110.
  • the conductor 121 first surface conductor
  • the first electrode 124, the second electrode 125 and the surface of the insulating substrate 110 opposite to the one surface (the surface facing in the -z direction.
  • a capacitor provided inside the insulating substrate 110 and opposed to a part of the lower surface conductor 122 to form a capacitive element 140 (capacitor) together with the lower surface conductor 122.
  • a capacitor through-hole conductor 132 electrically connecting the upper surface conductor 121; and an interlayer through-conductor 133 (the first through-hole conductor 133) provided inside the insulating substrate 110 and electrically connecting the first electrode 124 and the capacitor conductor 123.
  • the RFID tag substrate 100 is attached and fixed to the article 3 such that the lower surface 110 b (the lower conductor 122) of the insulating substrate 110 faces the article 3.
  • the RFID tag 10 of the present embodiment operates even if the surface of the article 3 is a conductor such as a metal. That is, when attached to such an article 3, the conductor portion of the article 3 also functions as the ground conductor of the antenna of the RFID tag 10.
  • the RFID tag IC 200 is mounted on the upper surface of the insulating substrate 110.
  • the sealing member 300 covers and seals the upper surface of the insulating substrate 110 and the RFID tag IC 200. That is, the upper surface of the insulating substrate 110 constitutes the above-described plate surface on which the RFID tag IC 200 is mounted on the RFID tag substrate 100 and which is to be sealed by the sealing member 300.
  • the insulating substrate 110 is a plate-like member having a structure in which a plurality of (here, four) laminated substrates 111a to 111d of a dielectric (in the present embodiment, ceramic) are laminated in this order from the bottom.
  • the insulating substrate 110 has an upper surface 110a and a lower surface 110b that are parallel to the xy plane, and the height (the length in the z direction) is greater than the width (the length in the x direction) and the depth (the length in the y direction). It has a rectangular parallelepiped shape that is short and has a longer width in the x direction than the depth.
  • the laminated substrates 111a to 111d constituting the insulating substrate 110 can be, for example, a dielectric such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body.
  • the insulating substrate 110 can be formed, for example, by stacking a plurality of (here, four layers) ceramic green sheets in a sheet shape and sintering them.
  • a first electrode 124 and a second electrode 125 that are rectangular as viewed from the + z direction are provided.
  • the shapes of the first electrode 124 and the second electrode 125 are not limited to rectangles, but may be other polygons or circles.
  • the first electrode 124 is electrically connected to a power supply terminal 201 from among a plurality of terminals included in the RFID tag IC 200, which outputs a voltage signal related to a transmission radio wave, via a bonding wire.
  • the first electrode 124 is provided on the ⁇ x direction side of the second electrode 125.
  • the second electrode 125 is electrically connected to a reference potential terminal 202 serving as a reference potential among a plurality of terminals included in the RFID tag IC 200 via a bonding wire.
  • the reference potential of the present embodiment is a ground potential
  • the reference potential terminal 202 is a ground terminal.
  • the reference potential is not limited to the ground potential, and a predetermined potential other than the ground potential may be used as the reference potential.
  • the connection method between the first electrode 124 and the second electrode 125 and the terminal of the RFID tag IC 200 is not limited to the method using the bonding wire, and may be, for example, flip-chip mounting.
  • the upper surface conductor 121 is provided on the upper surface 110 a of the insulating substrate 110.
  • the upper surface conductor 121 is a plate-shaped conductor elongated in the x direction, and is provided on substantially the entire surface of the upper surface 110 a of the insulating substrate 110 except for a region where the first electrode 124 and the second electrode 125 are formed. I have. That is, the upper surface conductor 121 is provided in a shape having an opening 121 a for securing a formation region of the first electrode 124 and the second electrode 125.
  • the lower surface conductor 122 is a plate-like conductor elongated in the x direction, and is provided on almost the entire lower surface 110 b of the insulating substrate 110.
  • the capacitive conductor 123 is a plate-shaped conductor provided between the lowermost laminated substrate 111 a and the second lowermost laminated substrate 111 b of the insulating substrate 110, and faces a part of the lower surface conductor 122.
  • the capacitor 140 is formed. That is, when the pair of conductors forming the capacitive element 140 are the first conductor C1 and the second conductor C2, of these, the first conductor C1 on the + z direction side is constituted by the capacitive conductor 123, and -z The second conductor C2 on the direction side is constituted by the lower surface conductor 122.
  • the capacitor conductor 123 is provided with a circular opening 123a through which the interlayer through conductor 134 passes. The opening 123a is formed in such a size that an interval (clearance) of a predetermined distance from the interlayer through conductor 134 is secured.
  • the upper surface conductor 121, the lower surface conductor 122, the capacitance conductor 123, the first electrode 124, and the second electrode 125 are formed by applying a metal paste by using a method such as screen printing when the laminated substrates 111a to 111d are ceramic green sheets. It can be formed by printing on the corresponding position of the ceramic green sheet and sintering them together. Specifically, first, a metal paste corresponding to the lower conductor 122 is printed on the lower surface of the ceramic green sheet corresponding to the laminated substrate 111a, and a metal paste corresponding to the capacitor conductor 123 is printed on the lower surface of the ceramic green sheet corresponding to the laminated substrate 111b. Print.
  • a metal paste corresponding to the capacitor conductor 123 may be printed on the upper surface of the ceramic green sheet corresponding to the laminated substrate 111a, and a metal paste corresponding to the lower surface conductor 122 may be printed on the lower surface. Further, a metal paste corresponding to the upper surface conductor 121, the first electrode 124, and the second electrode 125 is printed on the upper surface of the ceramic green sheet corresponding to the laminated substrate 111d. Next, after laminating four layers of ceramic green sheets corresponding to the laminated substrates 111a to 111d, the whole is sintered.
  • the upper conductor 121, the lower conductor 122, the capacitor conductor 123, the first electrode 124, and the second electrode 125 can be formed on the insulating substrate 110.
  • the metal paste for example, a material in which copper powder is mixed with an organic solvent and an organic binder can be used.
  • the exposed surfaces of the upper conductor 121, the lower conductor 122, the first electrode 124, and the second electrode 125 may be coated with a plating layer of nickel, cobalt, palladium, gold, or the like, thereby suppressing oxidative corrosion. Can be.
  • the bonding characteristics with the bonding wire are also improved by coating the plating layer.
  • the short-circuit portion through conductor 131 penetrates between the upper surface 110a and the lower surface 110b of the insulating substrate 110 in the z direction, and electrically connects the upper surface conductor 121 and the lower surface conductor 122.
  • the short-circuit portion through conductor 131 is provided at an end on the ⁇ x direction side in the longitudinal direction (x direction) of the insulating substrate 110. Therefore, the short-circuit portion through conductor 131 is connected to the end of the upper conductor 121 and the lower conductor 122 on the ⁇ x direction side in the longitudinal direction (x direction).
  • the end in the longitudinal direction of the insulating substrate 110 may be, for example, a region within 10% of the longitudinal length of the insulating substrate 110 from one end in the longitudinal direction.
  • the short-circuit portion through conductor 131 has a narrower width in the x direction and the y direction than the upper surface conductor 121 and the lower surface conductor 122, and has a pin shape in the present embodiment.
  • the capacitive through conductor 132 is provided in a layer of the insulating substrate 110 between the upper conductor 121 and the capacitive conductor 123 (that is, penetrates the laminated substrates 111b to 111d in the z direction). And the capacitor conductor 123 are electrically connected.
  • the capacitive through conductor 132 is provided at an end on the + x direction side of the insulating substrate 110 in the longitudinal direction. Therefore, the capacitance portion through conductor 132 is connected to the end of the upper surface conductor 121 and the capacitance conductor 123 on the + x direction side in the longitudinal direction.
  • the capacitance portion through conductor 132 has a narrower width in the x and y directions than the upper surface conductor 121 and the lower surface conductor 122, and has a pin shape in the present embodiment.
  • one short-circuit portion through conductor 131 and one capacitance portion through conductor 132 are provided, but as shown in FIG. 5, the end of the insulating substrate 110 on the ⁇ x direction side is provided.
  • a plurality of short-circuit portion through conductors 131 may be provided at the portion, and a plurality of short-circuit portion through-conductors 131 may be provided at the end of the insulating substrate 110 on the + x direction side. Further, a plurality of only one of the short-circuit portion through conductor 131 and the capacitance portion through conductor 132 may be provided.
  • the interlayer through conductor 133 is provided in a layer of the insulating substrate 110 between the first electrode 124 and the capacitor conductor 123 (that is, penetrates the laminated substrates 111b to 111d in the z direction), and Electrode 124 and the capacitor conductor 123 are electrically connected.
  • the interlayer through conductor 133 is provided at a position overlapping the first electrode 124 when viewed from the z direction.
  • the interlayer through conductor 134 penetrates between the upper surface 110a and the lower surface 110b of the insulating substrate 110 in the z direction, and electrically connects the second electrode 125 and the lower surface conductor 122.
  • the interlayer through conductor 134 is provided at a position overlapping the second electrode 125 when viewed from the z direction.
  • the interlayer through conductor 134 is provided so as to pass through the opening 123 a of the capacitor conductor 123.
  • the interlayer through conductors 133 and 134 have a width in the x-direction and the y-direction smaller than that of the upper surface conductor 121 and the lower surface conductor 122, similarly to the short-circuit portion through conductor 131, and are pin-shaped in the present embodiment.
  • the short-circuit portion penetrating conductor 131, the capacitance portion penetrating conductor 132, and the interlayer penetrating conductors 133 and 134 are formed by forming a ceramic green sheet on the laminated substrates 111a to 111d before printing a metal paste to form the upper surface conductor 121 and the like.
  • the green sheet can be formed by providing a through hole or an interlayer hole, filling a metal paste into the through hole or sintering the metal paste together. Similar to the material of the upper surface conductor 121, for example, a material in which copper powder is mixed with an organic solvent and an organic binder can be used as the metal paste.
  • a plate-shaped inverted-F antenna is formed by the upper surface conductor 121, the lower surface conductor 122, the capacitance conductor 123, the short-circuit portion through conductor 131, the capacitance portion through conductor 132, and the interlayer through conductors 133 and 134. Be composed. Among them, a continuous conductor composed of the upper surface conductor 121, the capacitance conductor 123, and the capacitance portion penetrating conductor 132 acts as a radiation conductor of the plate-shaped inverted F antenna, and the lower conductor 122 is a ground conductor (ground plate) of the plate-shaped inverted F antenna. Or a reference potential conductor).
  • the short-circuit portion penetrating conductor 131 functions as an electric wall of the plate-shaped inverted-F antenna
  • the interlayer penetrating conductor 133 functions as a feed line of the plate-shaped inverted-F antenna
  • the interlayer penetrating conductor 134 functions as a plate-shaped inverted-F antenna. Acts as a ground line for
  • radio waves are mainly radiated from the opening ends 140 a of the pair of conductors in the capacitive element 140 on the + x direction side. After the radio wave is radiated in the + x direction, the radio wave travels around the + z direction.
  • the plate-shaped inverted-F antenna electrically extends the radiation conductor and the short-circuit conductor on the + x direction side of the electric wall to the other side ( ⁇ x direction side) of the electric wall with the electric wall as a symmetry axis. It corresponds to a patch antenna having a shape. That is, according to the configuration of the plate-shaped inverted-F antenna in which the radiation conductor and the short-circuit conductor are connected by the electric wall, the area can be reduced by half with respect to the patch antenna having the same function.
  • a part of the radiation conductor (capacitive conductor 123) and a part of the short-circuit conductor (lower surface conductor 122) form the capacitive element 140, so that a wavelength shortening effect can be obtained. This also realizes miniaturization.
  • connection position P1 a position of the radiating conductor of the plate-shaped inverted-F antenna at which the electrical connection with the first electrode 124 is made is referred to as a connection position P1.
  • the connection position P1 is a position where the capacitance conductor 123 and the interlayer through conductor 133 are connected (an electric connection position of the capacitance conductor 123 with the first electrode 124). Since the interlayer through conductor 133 extends from the first electrode 124 in the ⁇ z direction, the connection position P1 is at the same position as the first electrode 124 in the x direction and the y direction.
  • connection position P2 a position of the grounded conductor of the plate-shaped inverted-F antenna at which the electrical connection with the second electrode 125 is made is referred to as a connection position P2.
  • the connection position P2 is a position where the lower conductor 122 and the interlayer through conductor 134 are connected (an electrical connection position of the lower conductor 122 with the second electrode 125). Since the interlayer through conductor 134 extends in the ⁇ z direction from the second electrode 125, the connection position P2 is at the same position as the second electrode 125 in the x direction and the y direction.
  • the first electrode 124 is provided on the ⁇ x direction side of the second electrode 125. Therefore, the connection position P1 is located on the ⁇ x direction side of the connection position P2. Further, since the first electrode 124 and the second electrode 125 are in the above positional relationship, the distance A1 between the first electrode 124 and the short-circuit portion penetrating conductor 131 is larger than the distance A1 between the second electrode 125 and the short-circuit portion. It is shorter than the distance A2 from the through conductor 131.
  • the distance A1 between the connection position P1 and the short-circuit portion through conductor 131 is shorter than the distance A2 between the connection position P2 and the short-circuit portion through conductor 131.
  • the distance B1 between the first electrode 124 and the through conductor 132 is longer than the distance B2 between the second electrode 125 and the through conductor 132.
  • the distance B1 between the connection position P1 and the through conductor 132 is longer than the distance B2 between the connection point P2 and the through conductor 132.
  • connection position P1 is provided at a position closer to the short-circuit portion penetrating conductor 131 than the connection position P2, the section R can be secured longer. Advantages of this configuration will be described in comparison with the configuration of the RFID tag substrate 100r of the comparative example.
  • FIG. 6 is a cross-sectional view illustrating the configuration of the RFID tag substrate 100r of the comparative example.
  • the positional relationship of the first electrode 124 and the second electrode 125 in the x direction is opposite to that of the RFID tag substrate 100 of FIG. Therefore, the positional relationship in the x direction between the interlayer through conductor 133 (feeding line) and the interlayer through conductor 134 (ground line) is also opposite to that of the RFID tag substrate 100 in FIG.
  • the distance A1 between the connection position P1 and the short-circuit portion through conductor 131 is longer than the distance A2 between the connection position P2 and the short-circuit portion through conductor 131.
  • the distance B1 between the connection position P1 and the through conductor 132 is shorter than the distance B2 between the connection position P2 and the through conductor 132.
  • the section R from the connection position P1 to the connection position P3 where the current flows during the operation of the antenna is shorter than the section R of the RFID tag substrate 100 in FIG. . For this reason, electric charges are less likely to accumulate in the capacitor 140.
  • the section R in which the electric charge is accumulated in the capacitive element 140 is longer than the section R in the RFID tag substrate 100r of the comparative example in FIG. . Accordingly, more charges are accumulated in the capacitor 140 than in the comparative example, and the potential difference generated between the pair of conductors of the capacitor 140 can be further increased. As a result, a stronger radio wave is emitted from the plate-shaped inverted-F antenna, so that the transmission distance of the radio wave, that is, the communication distance can be made longer.
  • the RFID tag substrate 100 of the first embodiment has the plate surface on which the RFID tag ID 200 is mounted, and the plate surface and the RFID tag ID 200 are sealed by the sealing member 300.
  • An RFID tag substrate 100 to be used, the insulating substrate 110 having one surface forming the plate surface, the upper surface conductor 121 provided on the one surface of the insulating substrate 110, and the one surface of the insulating substrate 110 A lower conductor 122 provided on a surface opposite to the first substrate, a short-circuit portion penetrating conductor 131 penetrating the insulating substrate 110 in the thickness direction, and electrically connecting the upper conductor 121 and the lower conductor 122; And a capacitor conductor 123 that is formed inside the insulating substrate 110 and faces the at least part of the lower conductor 122 to form the capacitor element 140.
  • the first conductor C1 (capacitive conductor 123) of the pair of conductors forming the capacitive element 140 is electrically connected to the first electrode 124 without passing through the short-circuit portion through conductor 131
  • the second conductor C2 (lower surface conductor 122) of the pair of conductors is electrically connected to the second electrode 125 without passing through the short-circuit portion through conductor 131, and extends from the first electrode 124 to the short-circuit portion through conductor 131.
  • Distance A1 is shorter than the distance A2 to the short circuit part through conductor 131 from the second electrode 125.
  • connection position P1 between the first electrode 124 and the capacitor conductor 123 can be easily set to be greater than the connection position P2 between the second electrode 125 and the lower surface conductor 122 (ground conductor).
  • the section R in which charge is accumulated in the capacitor 140 can be lengthened. More specifically, by making the connection position P1 which is the end position of the section R on the short-circuit portion through conductor 131 side close to the short-circuit portion through conductor 131 side, the section R can be lengthened. Accordingly, more charge accumulates in the capacitor 140, and the potential difference generated between the pair of conductors of the capacitor 140 can be further increased. As a result, a stronger radio wave can be emitted from the plate-shaped inverted-F antenna.
  • connection position P2 between the second electrode 125 and the lower surface conductor 122 (ground conductor) is close to the opening end 140a of the capacitor 140, the potential (reference) of the opening end 140a on the lower surface conductor 122 side. Potential) can be further stabilized.
  • This also makes it possible to further enhance the radio waves emitted from the inverted inverted-F antenna.
  • a stronger radio wave is emitted from the plate-shaped inverted-F antenna, even when the upper surface 110a of the insulating substrate 110 is sealed with the sealing member 300, The transmission distance, that is, the communication distance can be made longer.
  • the distance B1 from the first electrode 124 to the capacitive through conductor 132 is longer than the distance B2 from the second electrode 125 to the capacitive through conductor 132.
  • the connection position P3 between the capacitance portion through conductor 132 and the capacitance conductor 123 can be greatly separated from the connection position P1 between the first electrode 124 and the capacitance conductor 123. Therefore, the section R having both ends of the connection position P1 and the connection position P3 can be made longer. Accordingly, the potential difference between the pair of conductors of the capacitor 140 can be further increased, the intensity of the emitted radio wave can be further increased, and the communication distance can be further increased.
  • the capacitance conductor 123 faces at least a part of the lower surface conductor 122 to form a capacitance element 140
  • the first conductor C1 of the capacitance element 140 is the capacitance conductor 123
  • the second conductor C2 is
  • the first electrode 124 is a conductor 122, and is electrically connected to the capacitor conductor 123 via an interlayer penetrating conductor 133 provided in a layer between the first electrode 124 and the capacitor conductor 123 in the insulating substrate 110.
  • the second electrode 125 is electrically connected to the lower surface conductor 122 via an interlayer penetrating conductor 134 penetrating the insulating substrate 110, and from the electrical connection position P 1 with the first electrode 124 in the capacitance conductor 123.
  • the distance A1 to the short-circuit portion through conductor 131 is shorter than the distance A2 from the electrical connection position P2 of the lower surface conductor 122 to the second electrode 125 to the short-circuit portion through conductor 131. This makes it possible to lengthen the section R with a simple layer structure.
  • the distance B1 from the electrical connection position P1 of the capacitance conductor 123 to the first electrode 124 to the capacitance portion penetrating conductor 132 is the distance from the electrical connection position P2 of the lower surface conductor 122 to the second electrode 125, and the capacitance. It is longer than the distance B2 to the through conductor 132. Thereby, the section R can be made longer with a simple layer structure.
  • the RFID tag 10 of the above embodiment includes the above-described RFID tag substrate 100, an RFID tag IC 200 mounted on the plate surface of the RFID tag substrate 100, and a plate surface of the RFID tag substrate 100 and an RFID tag.
  • a sealing member 300 for sealing the IC 200 According to such a configuration, the communication distance can be further lengthened even when sealing is performed by the sealing member 300.
  • the RFID system 1 includes the RFID tag 10 and a reader / writer 2 that transmits and receives radio waves to and from the RFID tag 10. According to such a configuration, the RFID system 1 having a long communication distance between the RFID tag 10 and the reader / writer 2 can be realized.
  • FIG. 7 is a cross-sectional view illustrating a configuration of the RFID tag 10 according to the second embodiment.
  • FIG. 8 is an exploded perspective view of the RFID tag 10 of FIG.
  • the capacitive conductor 123 faces a part of the upper conductor 121, and forms the capacitive element 140 together with the upper conductor 121. That is, the first conductor C ⁇ b> 1 of the capacitive element 140 is configured by the upper conductor 121, and the second conductor C ⁇ b> 2 is configured by the capacitive conductor 123.
  • the capacitance portion penetrating conductor 132 is provided in a layer of the insulating substrate 110 between the capacitance conductor 123 and the lower surface conductor 122 (that is, penetrates the laminated substrates 111a to 111c in the z direction) and has a capacitance.
  • the conductor 123 and the lower conductor 122 are electrically connected.
  • the first electrode 124 is electrically connected to the upper surface conductor 121 by a connection electrode 126 provided in a region connecting the first electrode 124 and the upper surface conductor 121 on the upper surface 110 a of the insulating substrate 110. ing.
  • the upper surface conductor 121 constitutes the radiation conductor of the plate-shaped inverted F antenna
  • the capacitance conductor 123, the capacitance portion penetrating conductor 132, and the lower surface conductor 122 form the plate-shaped inverted F antenna. Configure the ground conductor.
  • connection position between the connection electrode 126 and the upper surface conductor 121 corresponds to the connection position P1.
  • a connection position between the interlayer through conductor 134 and the lower surface conductor 122 corresponds to a connection position P2.
  • the distance A1 between the connection position P1 and the short-circuit portion through conductor 131 is shorter than the distance A2 between the connection position P2 and the short-circuit portion through conductor 131.
  • the distance B1 between the connection position P1 and the through conductor 132 is longer than the distance B2 between the connection position P2 and the through conductor 132.
  • the capacitive conductor 123 faces the at least a part of the upper surface conductor 121 to form the capacitive element 140.
  • the position of the opening end 140a of the pair of conductors in the capacitive element 140 (that is, the position where radio waves are mainly emitted from the inverted inverted-F antenna) is determined. It can approach the sealing member 300. More specifically, the position where the radio wave is emitted can be the position directly below the sealing member 300. The radio wave emitted in the + x direction from such a position is hardly incident on the sealing member 300 because the distance from the sealing member 300 is extremely short.
  • the radio waves need to have a certain spatial spread in order to turn in the traveling direction (in other words, the radio waves cannot be turned sharply in a narrow space).
  • the emitted radio waves are less likely to be affected by the sealing member 300, so that the communication distance can be further increased.
  • the first conductor C1 is the upper conductor 121
  • the second conductor C2 is the capacitor conductor 123
  • the second electrode 125 is connected via the second interlayer through conductor penetrating the insulating substrate 110.
  • the distance A1 from the electrical connection position P1 of the upper surface conductor 121 to the first electrode 124 to the short-circuit portion penetrating conductor 131 is electrically connected to the lower surface conductor 122
  • the distance A1 from the second electrode 125 of the lower surface conductor 122 is It is shorter than the distance A2 from the electrical connection position P2 to the short-circuit portion through conductor 131. This makes it possible to lengthen the section R where electric charges are accumulated in the capacitor 140 with a simple layer configuration.
  • connection position P1 which is the end position of the section R on the short-circuit portion through conductor 131 side close to the short-circuit portion through conductor 131 side
  • the section R can be lengthened. Accordingly, the potential difference between the pair of conductors of the capacitor 140 can be further increased, the intensity of the emitted radio wave can be further increased, and the communication distance can be further increased.
  • the distance B1 from the electrical connection position P1 of the upper surface conductor 121 to the first electrode 124 to the capacitance portion penetrating conductor 132 is the capacitance from the electrical connection position P2 of the lower surface conductor 122 to the second electrode 125. It is longer than the distance B2 to the through conductor 132. Thereby, the connection position P3 between the capacitance portion through conductor 132 and the lower surface conductor 122 can be configured to be far away from the connection position P1 between the first electrode 124 and the capacitance conductor 123. Thereby, the section R can be made longer with a simple layer structure.
  • FIG. 9 is a cross-sectional view illustrating a configuration of the RFID tag 10 according to the third embodiment.
  • FIG. 10 is an exploded perspective view of the RFID tag 10 of FIG.
  • the capacitor conductor 123 is electrically connected to the second electrode 125 via the interlayer through conductor 135 (third interlayer through conductor). It is connected to the.
  • the interlayer through conductor 135 is provided only in a layer of the insulating substrate 110 between the second electrode 125 and the capacitor conductor 123 (that is, penetrates the laminated substrate 111d in the z direction).
  • the interlayer through conductor 135 is provided at a position overlapping the second electrode 125 when viewed from the z direction.
  • connection position between the interlayer through conductor 135 and the capacitance conductor 123 corresponds to the connection position P2.
  • the connection position P1 is the same as in the second embodiment. Also in the present embodiment having such a configuration, the distance A1 between the connection position P1 and the short-circuit portion through conductor 131 is shorter than the distance A2 between the connection position P2 and the short-circuit portion through conductor 131. Further, the distance B1 between the connection position P1 and the through conductor 132 is longer than the distance B2 between the connection position P2 and the through conductor 132.
  • the first conductor C1 is the upper conductor 121
  • the second conductor C2 is the capacitor conductor 123
  • the second electrode 125 is
  • a third conductive layer provided between the second electrode 125 and the capacitive conductor 123 in the insulating substrate 110 and electrically connected to the capacitive conductor 123 via a third interlayer penetrating conductor.
  • the distance A1 from the electrical connection position P1 to the electrode 124 to the short-circuit portion through conductor 131 is greater than the distance A2 from the electrical connection position P2 to the second electrode 125 in the capacitance conductor 123 to the short-circuit portion through conductor 131.
  • the section R in which electric charges are accumulated in the capacitor 140 can be extended with a simple layer configuration. More specifically, by making the connection position P1 which is the end position of the section R on the short-circuit portion through conductor 131 side close to the short-circuit portion through conductor 131 side, the section R can be lengthened. Accordingly, the potential difference between the pair of conductors of the capacitor 140 can be further increased, the intensity of the emitted radio wave can be further increased, and the communication distance can be further increased. Further, in the configuration of the present embodiment, as shown in FIG.
  • the first electrode 124 is provided in a region between the capacitor 140 and the lower conductor 122 (hereinafter, referred to as a “lower region” of the capacitor 140).
  • a lower region of the capacitor 140.
  • electric charges can be intensively accumulated in the first conductor C1 (upper surface conductor 121) and the second conductor C2 (capacitor conductor 123) of the capacitor 140, so that the opening end of the capacitor 140 is opened. A strong radio wave can be emitted from the point 140a. Thereby, the communication distance can be made longer.
  • the distance B1 from the electrical connection position P1 of the upper surface conductor 121 to the first electrode 124 to the capacitance portion penetrating conductor 132 is the distance from the electrical connection position P2 of the capacitance conductor 123 to the second electrode 125. It is longer than the distance B2 to the through conductor 132. Thereby, the connection position P3 between the capacitance portion through conductor 132 and the lower surface conductor 122 can be configured to be far away from the connection position P1 between the first electrode 124 and the capacitance conductor 123. Therefore, the section R can be made longer with a simple layer structure.
  • the capacitance conductor 123 faces the upper surface conductor 121 and the capacitance element 140 is provided immediately below the sealing member 300 (that is, the radio wave is transmitted to the sealing member 300).
  • the second electrode 125 is electrically connected to the ground conductor by the interlayer through conductor 135 penetrating only between the second electrode 125 and the capacitor conductor 123. The effect is as follows.
  • the present disclosure is not limited to the above embodiment, and various modifications are possible.
  • the example in which the capacitance conductor 123 faces a part of the upper surface conductor 121 or a part of the lower surface conductor 122 has been described.
  • the present invention is not limited thereto.
  • all the lower surface conductors 122 may be configured.
  • the present invention is not limited to this. It may be a long shape.
  • the configuration in which the insulating substrate 110 includes four laminated substrates 111a to 111d has been described as an example.
  • the present invention is not limited to this, and the insulating substrate 110 is composed of three or less laminated substrates or five or more laminated substrates. There may be.
  • the present disclosure can be used for an RFID tag substrate, an RFID tag, and an RFID system.

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  • Physics & Mathematics (AREA)
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PCT/JP2019/032650 2018-08-22 2019-08-21 Ｒｆｉｄタグ用基板、ｒｆｉｄタグ及びｒｆｉｄシステム Ceased WO2020040202A1 (ja)

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US17/269,051 US11354557B2 (en) 2018-08-22 2019-08-21 RFID tag board, RFID tag, and RFID system
JP2020538437A JP7062772B2 (ja) 2018-08-22 2019-08-21 Ｒｆｉｄタグ用基板、ｒｆｉｄタグ及びｒｆｉｄシステム
EP19851820.1A EP3843009B1 (en) 2018-08-22 2019-08-21 Rfid tag substrate, rfid tag, and rfid system
CN201980054128.7A CN112602093B (zh) 2018-08-22 2019-08-21 Rfid标签用基板、rfid标签以及rfid系统
US17/720,973 US11783155B2 (en) 2018-08-22 2022-04-14 RFID tag board, RFID tag, and RFID system
JP2022069140A JP7379580B2 (ja) 2018-08-22 2022-04-20 Ｒｆｉｄタグ用基板、ｒｆｉｄタグ及びｒｆｉｄシステム

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US17/720,973 Continuation US11783155B2 (en) 2018-08-22 2022-04-14 RFID tag board, RFID tag, and RFID system

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US20220121898A1 (en) * 2018-11-29 2022-04-21 Kyocera Corporation Rfid tag
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CN112602093B (zh) 2023-07-21
US11354557B2 (en) 2022-06-07
US20210279543A1 (en) 2021-09-09
US20220261611A1 (en) 2022-08-18
US11783155B2 (en) 2023-10-10
CN112602093A (zh) 2021-04-02
EP3843009A4 (en) 2022-05-11
EP3843009A1 (en) 2021-06-30
JP2022097533A (ja) 2022-06-30

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