WO2020037996A1 - Module d'obtention de profondeur et dispositif électronique - Google Patents

Module d'obtention de profondeur et dispositif électronique Download PDF

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Publication number
WO2020037996A1
WO2020037996A1 PCT/CN2019/081921 CN2019081921W WO2020037996A1 WO 2020037996 A1 WO2020037996 A1 WO 2020037996A1 CN 2019081921 W CN2019081921 W CN 2019081921W WO 2020037996 A1 WO2020037996 A1 WO 2020037996A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
acquisition module
depth acquisition
module according
light
Prior art date
Application number
PCT/CN2019/081921
Other languages
English (en)
Chinese (zh)
Inventor
张学勇
韦怡
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810962458.3A external-priority patent/CN108769326A/zh
Priority claimed from CN201810963377.5A external-priority patent/CN109061603A/zh
Priority claimed from CN201821367922.6U external-priority patent/CN208489881U/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020037996A1 publication Critical patent/WO2020037996A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the invention relates to the field of three-dimensional imaging technology, and more particularly, to a depth acquisition module and an electronic device.
  • Time of flight (TOF) imaging system can calculate the depth information of the measured object by calculating the time difference between the time when the light transmitting device emits the optical signal and the time when the light receiving device receives the optical signal.
  • the light emitting device and the The light receiving device is usually located at a relatively long distance, resulting in a larger overall size of the time-of-flight imaging system.
  • An embodiment of the present invention provides a depth acquisition module and an electronic device.
  • the depth acquisition module includes a first substrate, a pad, a light receiver, and a light transmitter.
  • the light receiver and the spacer are both disposed on the first substrate, and the light transmitter is disposed on the spacer.
  • An electronic device includes the depth acquisition module described above.
  • FIG. 1 is a schematic perspective structural view of a state of an electronic device according to some embodiments of the present invention.
  • FIG. 2 is a schematic perspective structural view of another state of an electronic device according to some embodiments of the present invention.
  • FIG. 3 is a perspective structural diagram of a depth acquisition module according to some embodiments of the present invention.
  • FIG. 4 is a perspective structural diagram of a depth acquisition module according to some embodiments of the present invention.
  • FIG. 5 is a schematic top view of a depth acquisition module according to some embodiments of the present invention.
  • FIG. 6 is a schematic bottom view of a depth acquisition module according to some embodiments of the present invention.
  • FIG. 7 is a schematic side view of a depth acquisition module according to some embodiments of the present invention.
  • FIG. 8 is a schematic cross-sectional view of the depth acquisition module shown in FIG. 5 along the line VIII-VIII;
  • FIG. 9 is an enlarged schematic diagram of part IX in the depth acquisition module shown in FIG. 8; FIG.
  • FIG. 10 is a schematic front structural diagram of a depth acquisition module when the flexible circuit board is not bent according to some embodiments of the present invention.
  • 11 to 14 are schematic structural diagrams of a light emitter according to some embodiments of the present invention.
  • FIG. 15 is similar to the perspective of FIG. 8, and illustrates a schematic cross-sectional view of a depth acquisition module according to another embodiment
  • 16 is a schematic cross-sectional view of a depth acquisition module according to some embodiments of the present invention, taken along line L in FIG. 5;
  • 17 and 18 are schematic structural diagrams of a housing and a pad in a depth acquisition module according to some embodiments of the present invention under different perspectives;
  • FIG. 19 is a schematic rear view of an electronic device according to some embodiments of the present invention.
  • an electronic device 100 includes a casing 10 and a depth acquisition module 20.
  • the electronic device 100 may be a mobile phone, a tablet computer, a game console, a smart watch, a headset device, a drone, etc.
  • the embodiment of the present invention is described using the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 is Not limited to mobile phones.
  • the casing 10 can be used as a mounting carrier for the functional components of the electronic device 100.
  • the casing 10 can provide protection for the functional components from dust, water, and drops.
  • the functional components can be the display screen 30, the visible light camera 40, and the receiver 50, etc. .
  • the cabinet 10 includes a main body 11 and a movable support 12.
  • the movable support 12 can move relative to the main body 11 under the driving of a driving device.
  • the movable support 12 can slide relative to the main body 11 to slide. Enter into the main body 11 (as shown in FIG. 1) or slide out from the main body 11 (as shown in FIG. 2).
  • Some functional elements can be installed on the main body 11, and other functional elements (such as the depth acquisition module 20, the visible light camera 40, and the receiver 50) can be installed on the movable bracket 12, and the movable bracket 12 can be moved.
  • the other part of the functional element is driven to retract into or protrude from the main body 11.
  • the depth acquisition module 20 is mounted on the casing 10. Specifically, the casing 10 may be provided with an acquisition window, and the depth acquisition module 20 is aligned with the acquisition window so that the depth acquisition module 20 acquires depth information.
  • the depth acquisition module 20 is installed on the movable bracket 12.
  • the user can trigger the movable bracket 12 to slide out from the main body 11 to drive the depth acquisition module 20. Extending from the main body 11, when the depth acquisition module 20 is not needed, the movable bracket 12 can be triggered to slide into the main body 11 to drive the depth acquisition module 20 to retract into the main body 11.
  • the acquisition window opened on the casing 10 The depth acquisition module 20 may be fixed and aligned with the acquisition window. In another example, the depth acquisition module 20 is fixed below the display screen 30.
  • the depth acquisition module 20 includes a first substrate assembly 21, a pad 22, a first optical device 23 and a second optical device 24.
  • the first substrate assembly 21 includes a first substrate 211.
  • the spacer 22 is disposed on the first substrate 211, and the spacer 22 and the first substrate 211 are integrally connected.
  • the first optical device 23 is disposed on the cushion block 22.
  • the second optical device 24 is disposed on the first substrate 211.
  • the first optical device 23 and the second optical device 24 are both disposed on the first substrate assembly 21.
  • the distance between the first optical device 23 and the second optical device 24 is short, and the depth acquisition
  • the overall integration of the module 20 is high, and the size is small.
  • the cushion block 22 can raise the height of the first optical device 23, thereby reducing the height difference between the first optical device 23 and the second optical device 24, avoiding two One of the first (the first optical device 23 and the second optical device 24) is blocked by the other when transmitting or receiving an optical signal.
  • the first optical device 23 is a light transmitter 23 and the second optical device 24 is a light receiver 24
  • the light signal emitted by the light transmitter 23 is not easily blocked by the light receiver 24, so that the light signal can be completely irradiated to the measured object.
  • the first optical device 23 is a light receiver and the second optical device 24 is a light transmitter, external light signals will not be blocked by the light transmitter before entering the light receiver.
  • first optical device 23 as the light transmitter 23 and the second optical device 24 as the light receiver 24 as an example. It can be understood that, in other embodiments, the first optical device 23 may be a light receiver, and the second optical device 24 may be a light transmitter.
  • the depth acquisition module 100 may be a time-of-flight module. There is no baseline requirement between the light transmitter 23 and the light receiver 24 of the time-of-flight module, and both the light transmitter 23 and the light receiver 24 are provided. When on the first substrate assembly 21, the distance between the light emitter 23 and the light receiver 24 can be set closer, and the overall size of the depth acquisition module 100 is smaller.
  • the first substrate assembly 21 includes a first substrate 211.
  • the first substrate 211 may be a printed circuit board or a flexible circuit board, and the control circuit of the depth acquisition module 20 and the like may be laid on the first substrate 211.
  • the depth acquisition module 20 further includes an electronic component 25 (shown in FIG. 15) disposed on the first substrate 211.
  • the electronic component may be a capacitor, an inductor, a transistor, a resistor, or the like.
  • the electronic component may be laid on the first substrate 211.
  • the control lines on the upper side are electrically connected and used to drive or control the operation of the light transmitter 23 or the light receiver 24.
  • the spacer 22 is disposed on the first substrate 211, and the spacer 22 and the first substrate 211 are integrally connected.
  • the material of the spacer 22 may be metal, plastic, or the like.
  • the pad 22 is in contact with the first substrate 211 and is carried on the first substrate 211.
  • the pad 22 may be combined with the first substrate 211 and connected by means such as gluing.
  • a surface where the pad 22 is combined with the first substrate 211 may be a flat surface, and a surface opposite to the combined surface of the pad 22 may also be a flat surface, so that when the light emitter 23 is disposed on the pad 22 Has better stability. As shown in FIG.
  • the spacer 22 is integrally formed with the first substrate 211.
  • the position of the first substrate 211 corresponding to the light emitter 23 can be made larger than the rest of the first substrate 211.
  • the thicker part can be used as the cushion block 22.
  • a control line can also be laid on the pad 22.
  • the light transmitter 23 When the light transmitter 23 is disposed on the pad 22, it can be directly connected to the control line on the pad 22 so that the light transmitter 23 is electrically connected to the first substrate 211. It is not necessary to provide additional connection lines outside the pad 22.
  • the light transmitter 23 is configured to emit an optical signal outwards.
  • the light signal may be infrared light, and the light signal may be a lattice spot emitted to the object to be measured.
  • the light signal is emitted from the light transmitter 23 at a certain divergence angle. .
  • the light emitter 23 is disposed on the spacer 22. In the embodiment of the present invention, the light emitter 23 is disposed on the side of the spacer 22 opposite to the first substrate 211, or in other words, the spacer 22 replaces the first substrate 211.
  • the light emitter 23 is spaced apart from the light emitter 23 so that a height difference is formed between the light emitter 23 and the first substrate 211.
  • the light receiver 24 is configured to receive an optical signal emitted by the reflected light transmitter 23.
  • the light receiver 24 is disposed on the first substrate 211, and the contact surface between the light receiver 24 and the first substrate 211 is substantially flush with the contact surface between the pad 22 and the first substrate 211 (that is, the installation starting point of the two is On the same plane).
  • the light receiver 24 includes a housing 241 and an optical element 242.
  • the casing 241 is disposed on the first substrate 211, and the optical element 242 is disposed on the casing 241.
  • the casing 241 may be a lens holder and a lens barrel of the light receiver 24, and the optical element 242 may be a lens disposed in the casing 241. And other components.
  • the light receiver 24 may further include a photosensitive chip 243 (as shown in FIG. 16), and the photosensitive chip 243 is electrically connected to the control circuit and the electronic component 25 on the first substrate 211.
  • the optical signal reflected by the measured object passes through the optical element 242 and is irradiated into the photosensitive chip 243, and the photosensitive chip 243 responds to the optical signal.
  • the depth acquisition module 20 calculates the time difference between the light signal emitted by the light transmitter 23 and the light chip 243 receiving the light signal reflected by the measured object, and further obtains the depth information of the measured object, which can be used for distance measurement, For generating depth images or for 3D modeling.
  • the pad 22 can raise the height of the light emitter 23, thereby increasing the height of the light emitting surface of the light emitter 23,
  • the emitted light signal is not easily blocked by the light receiver 24, so that the light signal can be completely irradiated on the measured object.
  • the exit surface of the light transmitter 23 may be flush with the entrance surface of the light receiver 24, or the exit surface of the light transmitter 23 may be slightly lower than the entrance surface of the light receiver 24, or it may be the exit surface of the light transmitter 23 Slightly higher than the incident surface of the light receiver 24.
  • the first substrate assembly 21 further includes a flexible circuit board 212, and the flexible circuit board 212 is bent.
  • One end of the flexible circuit board 212 is connected to the first substrate 211 and the other end is connected to the light.
  • Launcher 23 At this time, the first substrate 211 and the pad 22 may be integrally formed, or may be integrally formed after being separately formed.
  • One end of the flexible circuit board 212 is connected to the first substrate 211, and the other end is connected to the light emitter 23.
  • the flexible circuit board 212 can be bent at an angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 212 can be There are more options.
  • the flexible circuit board 212 may transmit a control signal of the light transmitter 23 from the first substrate 211 to the light transmitter 23, or transmit a feedback signal of the light transmitter 23 (for example, time information and frequency information of the light transmitter 23 to transmit the light signal). , Temperature information of the light emitter 23, etc.) are transmitted to the first substrate 211.
  • the first substrate assembly 21 further includes a reinforcing plate 213.
  • the reinforcing plate 213 is coupled to a side of the first substrate 211 opposite to the pad 22.
  • the reinforcing plate 213 may cover one side of the first substrate 211, and the reinforcing plate 213 may be used to increase the strength of the first substrate 211 and prevent deformation of the first substrate 211.
  • the reinforcing plate 213 may be made of a conductive material, such as a metal or an alloy.
  • the reinforcing plate 213 may be electrically connected to the casing 10 to make the reinforcing plate 213. Grounding and effectively reducing the interference of the static electricity of external components on the depth acquisition module 20.
  • the cushion block 22 includes a protruding portion 225 protruding from the side edge 2111 of the first substrate 211, and the flexible circuit board 212 is bent around the protruding portion 225. Specifically, a part of the cushion block 22 is directly bonded to the first substrate 211, and the other part is not in direct contact with the first substrate 211, and protrudes from the side edge 2111 of the first substrate 211 to form a protruding portion 225.
  • the flexible circuit board 212 may be connected to the side edge 2111, and the flexible circuit board 212 is bent around the protrusion 225, or the flexible circuit board 212 is bent so that the protrusion 225 is located in a space surrounded by the flexible circuit board 212.
  • the flexible circuit board 212 will not collapse inward and cause excessive bending, which will cause damage to the flexible circuit board 212.
  • the first substrate 211 and the pad 22 may be integrally formed, or may be integrally formed after being separately formed.
  • the outer surface 2251 of the protruding portion 225 is a smooth curved surface (such as the outer surface of a cylinder, etc.), that is, the outer surface 2251 of the protruding portion 225 does not form a curvature. Hence, even if the flexible circuit board 212 is bent over the outer side 2251 of the protruding portion 225, the degree of bending of the flexible circuit board 212 will not be too large, which further ensures the integrity of the flexible circuit board 212.
  • the depth acquisition module 20 further includes a connector 26 connected to the first substrate 211.
  • the connector 26 is used to connect the first substrate assembly 21 and an external device.
  • the connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211.
  • the connector 26 may be a connection base or a connector.
  • the connector 26 may be connected to the motherboard of the electronic device 100 so that the depth acquisition module 20 is electrically connected to the motherboard.
  • the connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211.
  • the connectors 26 and the flexible circuit board 212 may be respectively connected to the left and right ends of the first substrate 211, or respectively connected to the front and rear ends of the first substrate 211.
  • the light transmitter 23 and the light receiver 24 are arranged along a straight line L, and the connector 26 and the flexible circuit board 212 are located on opposite sides of the straight line L, respectively. It can be understood that, since the light transmitter 23 and the light receiver 24 are arranged in an array, the size of the depth acquisition module 20 may be larger in the direction of the straight line L.
  • the connector 26 and the flexible circuit board 212 are respectively disposed on opposite sides of the straight line L, which will not increase the size of the depth acquisition module 20 in the straight line L direction, thereby facilitating the installation of the depth acquisition module 20 in the electronic device 100.
  • a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the first substrate 211.
  • the depth acquisition module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is contained in the receiving cavity 223.
  • the electronic component 25 may be an element such as a capacitor, an inductor, a transistor, a resistor, etc.
  • the electronic component 25 may be electrically connected to a control line laid on the first substrate 211 and used to drive or control the operation of the light transmitter 23 or the light receiver 24.
  • the electronic component 25 is contained in the containing cavity 223, and the space in the pad 22 is used reasonably.
  • the number of the receiving cavities 223 may be one or more, and the plurality of receiving cavities 223 may be spaced apart from each other.
  • the positions of the receiving cavity 223 and the electronic component 25 may be aligned and the pad 22 may be disposed at On the first substrate 211.
  • a receiving cavity 223 is also defined on a side where the casing 241 is combined with the first substrate 211.
  • the plurality of accommodating chambers 223 are separated by a partition bar 227 formed at a joint between the casing 241 and the cushion block 22.
  • the casing 241 is a lens holder and a lens barrel of the light receiver 24.
  • the optical element 242 is a lens provided in the housing 241.
  • the electronic component 25 is provided not only on the first substrate 211 at a position corresponding to the receiving cavity 223 in the pad 22, but also on the first substrate 211 at a position corresponding to the receiving cavity 223 in the housing 241.
  • the photosensitive chip 243 is disposed on the first substrate 211 and is located in the receiving cavity 223 in the casing 241. The optical signal reflected by the measured object passes through the optical element 242 and is irradiated into the photosensitive chip 243, and the photosensitive chip 243 generates a response to the optical signal.
  • the cushion block 22 is provided with an escape hole 224 communicating with the at least one receiving cavity 223, and at least one electronic component 25 extends into the escape hole 224.
  • the height of the electronic component 25 is required to be not higher than the height of the containing cavity 223.
  • an avoiding through hole 224 corresponding to the receiving cavity 223 may be provided, and the electronic component 25 may partially extend into the avoiding through hole 224, so as not to increase the height of the spacer 22
  • the electronic component 25 is arranged.
  • a cover plate 226 may be provided at the avoiding through hole 224.
  • the cover plate 226 covers the electronic component 25 protruding in the avoiding through hole 224.
  • the cover plate 226 can play a role of strengthening the strength of the cushion block 22.
  • the cover plate 226 shields the electronic components 25 on the first substrate 221, and prevents the electronic components 25 on the first substrate 221 from being contaminated by dust or the like during production and transportation processes before the assembly of the light emitter 23 is completed.
  • the light emitter 23 includes a second substrate assembly 231, a light source assembly 232, and a housing 233.
  • the second substrate assembly 231 is disposed on the pad 22, and the second substrate assembly 231 is connected to the flexible circuit board 212.
  • the light source assembly 232 is disposed on the second substrate assembly 231, and the light source assembly 232 is configured to emit a light signal.
  • the casing 233 is disposed on the second substrate assembly 231.
  • the casing 233 is formed with a receiving space 2331.
  • the receiving space 2331 can be used for receiving the light source module 232.
  • the flexible circuit board 212 may be detachably connected to the second substrate assembly 231.
  • the light source assembly 232 is electrically connected to the second substrate assembly 231.
  • the casing 233 may be bowl-shaped as a whole, and the opening of the casing 233 is disposed on the second substrate assembly 231 downwardly, so as to receive the light source assembly 232 in the accommodation space 2331.
  • a light outlet 2332 corresponding to the light source component 232 is provided on the housing 233.
  • the light signal emitted from the light source component 232 passes through the light outlet 2332 and is emitted.
  • the light signal can pass directly through the light outlet 2332. It can also pass through the optical outlet 2332 after changing the optical path through other optical devices.
  • the second substrate assembly 231 includes a second substrate 2311 and a reinforcing member 2312.
  • the second substrate 2311 is connected to the flexible circuit board 212.
  • the light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the second substrate 2311.
  • a specific type of the second substrate 2311 may be a printed circuit board or a flexible circuit board, and a control circuit may be laid on the second substrate 2311.
  • the reinforcing member 2312 may be fixedly connected to the second substrate 2311 by means of gluing, riveting, or the like.
  • the reinforcing member 2312 may increase the overall strength of the second substrate assembly 231.
  • the reinforcing member 2312 can directly contact the spacer 22, the second substrate 2311 is not exposed to the outside, and does not need to be in direct contact with the spacer 22, and the second substrate 2311 is not easily affected. Contamination by dust, etc.
  • the reinforcing member 2312 and the cushion block 22 are formed separately.
  • the spacer 22 may be mounted on the first substrate 211 (in the case where the spacer 22 and the first substrate 211 are separately formed), at this time, the two ends of the flexible circuit board 212 are respectively The first substrate 211 and the second substrate 2311 are connected, and the flexible circuit board 212 may not be bent first (as shown in FIG. 10). The flexible circuit board 212 is then bent, so that the reinforcing member 2312 is disposed on the cushion block 22.
  • the reinforcing member 2312 and the spacer 22 may be integrally formed, for example, integrally formed by a process such as injection molding.
  • the depth acquisition module 20 is assembled. At this time, the spacer 22 and the light emitter 23 can be mounted on the first substrate 211 together.
  • a first positioning member 2313 is formed on the reinforcing member 2312.
  • the cushion block 22 includes a body 221 and a second positioning member 222.
  • the second positioning member 222 is formed on the body 221.
  • the first positioning member 2313 cooperates with the second positioning member 222.
  • the relative movement between the second substrate assembly 231 and the cushion block 22 can be effectively restricted.
  • the specific types of the first positioning member 2313 and the second positioning member 222 can be selected according to needs.
  • the first positioning member 2313 is a positioning hole formed in the reinforcing member 2312
  • the second positioning member 222 is a positioning column. Protrude into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the first positioning member 2313 is a positioning column formed on the reinforcing member 2312, and the second positioning member 222 is a positioning hole and the positioning column Project into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the number of the first positioning member 2313 and the second positioning member 222 are multiple, and part of the first positioning member 2313 is a positioning hole, Part of the second positioning member 222 is a positioning column, part of the first positioning member 2313 is a positioning column, and part of the second positioning member 222 is a positioning hole.
  • the positioning column projects into the positioning hole so that the first positioning member 2313 and the second positioning member 222 work cooperatively.
  • the structure of the light source component 232 will be described as an example below:
  • the light source assembly 232 includes a light source 60, a lens barrel 70, a diffuser 80 and a protective cover 90.
  • the light source 60 is connected to the second substrate assembly 231.
  • the lens barrel 70 includes a first surface 71 and a second surface 72 opposite to each other.
  • the lens barrel 11 defines a receiving cavity 75 penetrating the first surface 71 and the second surface 72.
  • the first surface 71 is recessed toward the second surface 72 to form a mounting groove 76 communicating with the receiving cavity 75.
  • the diffuser 80 is installed in the mounting groove 76.
  • the protective cover 90 is mounted on the side where the first surface 71 of the lens barrel 70 is located, and the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77 of the mounting groove 76.
  • the protective cover 90 can be mounted on the lens barrel 70 by means of screw connection, engagement, and fastener connection.
  • the protective cover 90 when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with internal threads and the lens barrel 70 is provided with external threads.
  • the protective cover The internal thread of 90 is screwed with the external thread of the lens barrel 70 to mount the protective cover 90 on the lens barrel 70; or, referring to FIG. 12, when the protective cover 90 includes a top wall 91, the protective cover 90 (top wall 91) A locking hole 95 is opened, and a hook 73 is provided at an end of the lens barrel 70.
  • the hook 73 is inserted into the locking hole 95 so that the protective cover 90 is mounted on the lens barrel 70. 13; when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with a locking hole 95, and the lens barrel 70 is provided with a hook 73.
  • the hooks 73 are inserted into the hole 95 so that the protective cover 90 is mounted on the lens barrel 70; or, referring to FIG.
  • the protective cover 90 when the protective cover 90 includes the top wall 91, The end of the lens barrel 70 is provided with a first positioning hole 74, the protective cover 90 (top wall 91) is provided with a second positioning hole 93 corresponding to the first positioning hole 74, and the fastener 94 passes through the second positioning hole 93 And locked A first positioning hole 74 to the protective cover 90 is mounted on the lens barrel 70.
  • the protective cover 90 is mounted on the lens barrel 70, the protective cover 90 is in contact with the diffuser 80 and the diffuser 80 is in contact with the bottom surface 77, so that the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77.
  • the light source assembly 232 is provided with a mounting groove 76 on the lens barrel 70 and the diffuser 80 is installed in the mounting groove 76, and is mounted on the lens barrel 70 through a protective cover 90 to clamp the diffuser 80 between the protective cover 90 and the installation. Between the bottom surfaces 77 of the grooves 76, the diffuser 80 is actually fixed to the lens barrel 70. And avoid using glue to fix the diffuser 80 on the lens barrel 70, so as to prevent the glue from diffusing and solidifying on the surface of the diffuser 80 and affecting the microstructure of the diffuser 80 after the glue is volatilized to a gaseous state, and can prevent connection and diffusion When the glue of the lens holder 70 and the lens barrel 70 decreases due to aging, the diffuser 80 falls off from the lens barrel 70.
  • the casing 10 of the electronic device 100 is a rear cover, and a collection window 101 is opened on the casing 10.
  • the collection window 101 has a long shape, and the length direction of the collection window 101 is parallel to the length direction of the casing 10. Both ends in the longitudinal direction of the mounting hole 101 are rounded.
  • the depth acquisition module 20 and the visible light camera 40 are mounted and fixed on relevant components (for example, a motherboard) in the electronic device 100, they are aligned with the acquisition window 101 and can be exposed outside the casing 10 from the acquisition window 101.
  • the visible light camera 40 may be one, or may be two or more.
  • the light emitters 23 and the light receivers 24 in the depth acquisition module 20 are arranged along the length direction of the casing 10, that is, the straight line L in FIGS. 5 and 6 is parallel to the length direction of the casing 10.
  • the electronic device 100 may further include a flash 41, and the flash 41 may be exposed to the outside of the casing 10 from another transparent hole independent of the acquisition window 101.
  • the flash 41 is aligned along the same straight line as the visible light camera 40 and the depth acquisition module 20.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un module d'obtention de profondeur, comprenant un premier substrat (211), un bloc d'amortissement (22), un récepteur optique (24) et un émetteur optique (23). Le récepteur optique (24) et le bloc d'amortissement (22) sont disposés sur le premier substrat (211), et l'émetteur optique (23) est disposé sur le bloc d'amortissement (22). L'invention concerne également un dispositif électronique.
PCT/CN2019/081921 2018-08-22 2019-04-09 Module d'obtention de profondeur et dispositif électronique WO2020037996A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201810962458.3A CN108769326A (zh) 2018-08-22 2018-08-22 深度采集模组及移动终端
CN201810963377.5A CN109061603A (zh) 2018-08-22 2018-08-22 深度获取模组及电子装置
CN201810963377.5 2018-08-22
CN201821367922.6U CN208489881U (zh) 2018-08-22 2018-08-22 深度采集模组及移动终端
CN201821367922.6 2018-08-22
CN201810962458.3 2018-08-22

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Publication Number Publication Date
WO2020037996A1 true WO2020037996A1 (fr) 2020-02-27

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PCT/CN2019/081921 WO2020037996A1 (fr) 2018-08-22 2019-04-09 Module d'obtention de profondeur et dispositif électronique

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Citations (7)

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