WO2020037601A1 - 射频传输组件及电子设备 - Google Patents

射频传输组件及电子设备 Download PDF

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Publication number
WO2020037601A1
WO2020037601A1 PCT/CN2018/101957 CN2018101957W WO2020037601A1 WO 2020037601 A1 WO2020037601 A1 WO 2020037601A1 CN 2018101957 W CN2018101957 W CN 2018101957W WO 2020037601 A1 WO2020037601 A1 WO 2020037601A1
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WO
WIPO (PCT)
Prior art keywords
radio frequency
coupling
frequency transmission
circuit board
connecting members
Prior art date
Application number
PCT/CN2018/101957
Other languages
English (en)
French (fr)
Inventor
兰尧
王文
孙树辉
陈崇录
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201880073876.5A priority Critical patent/CN111344907B/zh
Priority to PCT/CN2018/101957 priority patent/WO2020037601A1/zh
Publication of WO2020037601A1 publication Critical patent/WO2020037601A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures

Definitions

  • the present application relates to the technical field of radio frequency signal transmission, and in particular, to a radio frequency transmission component and an electronic device using the radio frequency transmission component.
  • the application provides a radio frequency transmission component and an electronic device using the radio frequency transmission component.
  • the present application provides a radio frequency transmission component.
  • RF transmission components can be applied to electronic equipment.
  • the radio frequency path of the electronic device includes a first circuit board, a second circuit board, and a radio frequency transmission component connected between the first circuit board and the second circuit board.
  • the radio frequency transmission assembly includes at least two connectors.
  • Each connecting member includes a main body portion, two connecting end portions, and a coupling portion.
  • the two connecting end portions are respectively connected to both ends of the main body portion.
  • the coupling portion is connected to a middle portion of the main body portion.
  • the middle portion of the main body portion is located between both ends of the main body portion.
  • the coupling portion has a coupling surface.
  • the coupling surfaces of two adjacent connecting members are oppositely disposed and form a capacitor between each other.
  • the coupling surfaces of two adjacent connectors are equivalent to two electrodes of a capacitor, and the air (or other insulating medium) between the coupling surfaces of two adjacent connectors is equivalent to the dielectric between two electrodes of a capacitor.
  • the RF transmission component increases the coupling area between two adjacent connectors by adding a coupling part to the connectors. Due to the large coupling area between two adjacent connectors in the RF transmission assembly, the impedance of the RF transmission assembly is small, the impedance of the RF transmission assembly is controllable, and the impedance of the RF transmission assembly can be compared with the first circuit board and the second circuit board.
  • the impedance matching of the RF transmission line on the antenna is beneficial to the impedance matching of the RF path of the electronic device, thereby effectively transmitting the RF signal.
  • the RF transmission component can also reduce the insertion loss of the RF path and improve the transmission efficiency of the RF path.
  • the coupling surfaces of two adjacent connecting members are parallel to each other. At this time, the projections of the coupling surfaces of the two adjacent connectors on the coupling center plane partially or completely overlap.
  • the coupling center plane is perpendicular to the signal radiation path between two adjacent connectors.
  • Adjacent two connecting members have two adjacent coupling faces, the two coupling faces face each other, and the projections of the two coupling faces on the coupling center plane overlap, and the overlap includes partial overlap and full overlap.
  • the projected overlapping area of the coupling surfaces of the two connecting members on the coupling center plane is large, and the coupling area between the coupling surfaces of two adjacent connecting members is also large.
  • the coupling area is approximately the overlapping area of the projections of the coupling surfaces of two adjacent connecting members on the coupling center plane.
  • a certain included angle may be formed between the coupling surfaces of two adjacent connecting members. For example, an angle between 0 ° and 45 ° is formed between two coupling surfaces facing each other.
  • the coupling surface is a plane.
  • the coupling surface may be a curved surface of other shapes, such as an arc surface or a wave surface.
  • the coupling portion includes two coupling surfaces, and the two coupling surfaces are respectively located on opposite sides of the main body portion.
  • the two coupling surfaces are respectively located on opposite sides of the main body portion.
  • the radio frequency transmission component includes one or more sets of connectors.
  • Each set of connectors includes three connectors arranged in the same direction.
  • the two coupling surfaces of the connecting members located in the middle are respectively opposite to the coupling surfaces of the connecting members located on both sides.
  • each group of connectors includes a first connector, a second connector, and a third connector.
  • the second connector is a connector in the middle, and the first connector and the third connector are connectors on both sides.
  • a coupling surface of the second connection member facing the first connection member is disposed opposite to the coupling surface of the first connection member, and a capacitor is formed between the two coupling surfaces.
  • a coupling surface of the second connection member facing the third connection member is disposed opposite to the coupling surface of the third connection member, and a capacitor is formed between the two coupling surfaces.
  • the connectors located in the middle are used to transmit radio frequency signals, and the connectors located on both sides are used to transmit ground signals.
  • the connectors located on both sides can shield the RF signal (transmit in the connector located in the middle), reduce the radiation of the RF signal, and reduce the loss of the RF signal.
  • the RF signals transmitted in different groups of connectors have less interference with each other.
  • the two coupling surfaces of the connecting member located in the middle are completely opposite to the coupling surfaces of the connecting members located on both sides, respectively. That is, the projection of the coupling surface of the connecting piece located in the middle on the corresponding coupling surface completely falls into the corresponding coupling surface.
  • the connector located in the middle is the second connector, and the connectors located on both sides are the first connector and the third connector.
  • the projection of the coupling surface of the second connection member facing the first connection member onto the coupling surface of the first connection member completely falls into the coupling surface of the first connection member, and the two coupling surfaces face each other.
  • the projection of the coupling surface of the second connection member facing the third connection member onto the coupling surface of the third connection member completely falls into the coupling surface of the third connection member, and the two coupling surfaces face each other.
  • the RF transmission component has a higher utilization rate of the coupling surface of the connecting member located in the middle, and the coupling area between the coupling surfaces of two adjacent connecting members is relatively large, so that the impedance of the RF transmitting component is more Controllable.
  • the connectors on both sides can fully shield the RF signals (transmitted in the connectors in the middle) to reduce the loss of RF signals.
  • the coupling surface of each connector is perpendicular to the arrangement direction of the three connectors. At this time, when the area of each coupling surface is limited, the coupling area between the coupling surfaces of two adjacent connectors is larger.
  • the connecting member is a metal elastic piece.
  • the coupling portion is bent relative to the main body portion.
  • the coupling portion is integrally formed with the main body portion.
  • the connecting member can be formed by bending the integrated elastic piece into a main body portion, two connecting end portions and a coupling portion.
  • the processing method of the connecting piece is relatively simple, and the shaped connecting piece is an integral piece, and the structural strength is high.
  • an angle of 85 ° to 95 ° is formed between the coupling portion and the main body portion.
  • the two coupling portions on both sides of the main body portion are substantially perpendicular to the main body portion, and the required arrangement space of the connecting members is approximately square, so that when a plurality of connecting members are arranged in one direction, two adjacent connecting members They can be closer to each other, the structure of the RF transmission component is more compact, and the impedance is smaller.
  • connection ends includes a first end, a second end, and a middle portion connected between the first end and the second end.
  • the first end is fixedly connected to the main body portion, the second end is suspended, and the middle portion projects relative to the first end and the second end in a direction away from the main body portion.
  • the middle portion of the connection end portion when the middle portion of the connection end portion is against other components, it has a certain displacement deformation relative to the main body portion, so that the connection piece can absorb part of the assembly tolerance, the assembly yield is higher, and the application range is wider.
  • connection end may be provided with a resisting contact.
  • the abutting contact is located in the middle.
  • the end surface of the abutting contact opposite to the middle part is protruded, thereby ensuring contact reliability with other components.
  • the abutment contact may be formed by stamping.
  • the connecting member is a pogo pin.
  • the coupling portion is attached to the outer peripheral side of the main body portion.
  • the coupling part and the main body part are integrally formed to simplify the processing process of the connecting member and increase the structural strength of the connecting member.
  • the main body portion may be substantially cylindrical, and the coupling portion is sleeved on the outer side of the main body portion.
  • the coupling portion includes a coupling surface.
  • the coupling portion may have a substantially cylindrical shape with an inner circle and an outer circle.
  • the “circle” in “inner circle and outer side” is embodied in the inside of the coupling portion with a circular through hole, which is adapted to the shape of the main body portion.
  • the “square” in the “inner circle and outer side” is mainly reflected in that the outer peripheral side surface of the coupling portion includes a flat coupling surface.
  • the coupling portion includes two coupling surfaces, and the two coupling surfaces are respectively located on opposite sides of the main body portion.
  • the two coupling surfaces can be connected by a plane or an arc.
  • the coupling portion may also include three or four coupling surfaces, and the three or four coupling surfaces may be directly connected to each other, or may be connected through a plane or an arc.
  • the arrangement position and number of the connecting members are different, the arrangement position and number of the coupling surfaces are also different.
  • connection ends are both ejectors; or, one of the connection ends is an ejector and the other connection end is a conductive elastic piece.
  • the connecting end portion is a thimble, it is possible to reliably abut the connecting end portion of another connecting member when the host casing and the charging casing are assembled.
  • the connection end portion is a conductive elastic sheet, the connection end portion can be soldered on the second circuit board, so that the connection member is reliably connected to the second circuit board.
  • the present application also provides an electronic device.
  • the electronic device may be a wireless hotspot device.
  • Electronic equipment includes a radio frequency path.
  • the radio frequency path includes a first circuit board, a second circuit board, and the above-mentioned radio frequency transmission component.
  • the radio frequency transmission component is electrically connected between the first circuit board and the second circuit board.
  • the RF transmission component is provided with a coupling portion having a coupling surface on the connecting member, and the coupling surfaces of two adjacent connecting members are oppositely disposed and form a capacitor between each other, thereby increasing the distance between the two adjacent connecting members.
  • the coupling area is reduced, so that the impedance of the RF transmission component is controllable.
  • the impedance of the RF transmission component matches the impedance of the RF transmission line on the first circuit board and the second circuit board, which is beneficial to the impedance of the RF path of the electronic device. Matching to effectively pass RF signals.
  • the RF transmission component can also reduce the insertion loss of the RF path and improve the transmission efficiency of the RF path.
  • a radio frequency signal pad and a ground pad are provided on the first circuit board.
  • a connection end portion of one of the two adjacent connection pieces of the RF transmission component contacts a radio frequency signal pad, and a connection end portion of the other connection piece contacts a ground pad.
  • the number of connectors is three, the connectors in the middle contact the RF traces, and the connectors on both sides contact the ground pads.
  • the number of RF transmission components is at least two groups, and at least two RF transmission components are connected in series between the first circuit board and the second circuit board. Since the number of radio frequency transmission components can be at least two groups, the relative position between the first circuit board and the second circuit board is highly adjustable, and the specific structure and arrangement position of at least two groups of radio frequency transmission components are flexible. The higher performance makes the RF path more applicable and has a wider application range.
  • a connection end portion of each connector of one group of RF transmission components of the adjacent two groups of RF transmission components has a resisting plane, and a connection end portion of each connector of the other group of RF transmission components It has a resisting contact, and the resisting contact resists the resisting plane.
  • two sets of RF transmission components are connected in series, and each connection member of the two sets of RF transmission components is serially connected in series between the first circuit board and the second circuit board.
  • One of the two connecting pieces connected in series is provided with a resisting plane, and the other connecting piece is provided with a resisting contact, the resisting contact resists the resisting plane, so that the resistive connection between the two connecting members Relationships are more reliable.
  • the electronic device further includes a host casing, a first group of antennas, a radio frequency chip, a charging casing, and a second group of antennas.
  • the first circuit board, the first group of antennas, and the radio frequency chip are housed in the host casing.
  • the radio frequency chip is electrically connected to the first circuit board
  • the first group of antennas is electrically connected to the radio frequency chip
  • the second circuit board and the second group of antennas are housed in a charging case
  • the second group of antennas are electrically connected to the second circuit board
  • the radio frequency transmission component is installed in Host case and / or charging case.
  • the electronic device can collectively send and receive signals through the first group of antennas and the second group of antennas connected to the radio frequency chip, so that the host casing is not added.
  • the number of antennas used to transmit and receive signals of the electronic device is increased, and the channel capacity of the electronic device is increased.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in this application in a use state
  • FIG. 2 is a schematic structural diagram of the electronic device shown in FIG. 1 in another use state
  • FIG. 3 is an exploded view of a part of the structure of the electronic device shown in FIG. 1;
  • FIG. 4 is a schematic diagram of a part of the structure of the electronic device at line A-A shown in FIG. 1;
  • FIG. 5 is a schematic structural diagram of a radio frequency path of the electronic device shown in FIG. 1 in an embodiment
  • FIG. 6 is a schematic structural diagram of a group of radio frequency transmission components in the radio frequency path shown in FIG. 5;
  • FIG. 7 is a schematic structural diagram of a connecting member of the radio frequency transmission component shown in FIG. 6;
  • FIG. 8 is a schematic diagram of an equivalent circuit when a signal is transmitted in the two connectors shown in FIG. 6;
  • FIG. 9 is a schematic diagram of an equivalent model of two conventional shrapnels and two connectors shown in FIG. 6; FIG.
  • FIG. 10 is a graph showing a relationship between a possible insertion loss and frequency based on the equivalent model shown in FIG. 9; FIG.
  • FIG. 11 is a schematic structural diagram of another group of RF transmission components of the RF path shown in FIG. 5;
  • FIG. 12 is a schematic structural diagram of a connecting member of the radio frequency transmission component shown in FIG. 11;
  • FIG. 13 is a test comparison chart of the initial efficiency of a possible antenna and the switching efficiency after switching through the radio frequency path shown in FIG. 5;
  • FIG. 14 is a schematic structural diagram of a radio frequency path of the electronic device shown in FIG. 1 in another embodiment
  • FIG. 15 is a schematic diagram of a possible insertion loss after the antenna is switched through the radio frequency path shown in FIG. 14; FIG.
  • FIG. 16 is a schematic structural diagram of a radio frequency path of the electronic device shown in FIG. 1 in still another embodiment
  • FIG. 17 is a schematic structural diagram of a group of radio frequency transmission components in the radio frequency path shown in FIG. 16;
  • FIG. 18 is a graph of a relationship between a possible insertion loss and a frequency obtained based on the radio frequency path shown in FIG. 16.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided in the present application in one use state
  • FIG. 2 is an electronic device 100 shown in FIG. 1 in another use state. Schematic.
  • the electronic device 100 may be a wireless hotspot device, a tablet computer, a mobile phone, a personal computer (PC), a notebook computer, a vehicle-mounted device, a network television, a wearable device, and the like.
  • the embodiment of the present application uses the electronic device 100 as a wireless hotspot device as an example for description.
  • the electronic device 100 includes a host case 10 and a charging case 20. Parts of the electronic device 100 are partially located in the host case 10 and partially located in the charging case 20.
  • the host casing 10 and the charging casing 20 are in a detachable connection relationship. As shown in FIG. 1, the host case 10 may be fixed to the charging case 20; as shown in FIG. 2, the host case 10 may be detached from the charging case 20.
  • the host casing 10 and the charging casing 20 can be mated through a concave-convex structure.
  • the host housing 10 is provided with one or more grooves or through holes 101
  • the charging housing 20 is provided with one or more protrusions 201, and the protrusions 201 are snapped into the grooves or through holes 101 to fix the host.
  • An adsorption member such as a magnet assembly, can be disposed between the wall surface of the groove or the through hole 101 and the protrusion 201.
  • the protrusion 201 extends into the groove or the through hole 101, the inner peripheral wall surface of the groove or the through hole 101 and the outer side wall of the protrusion 201 are in an interference fit.
  • the electronic device 100 includes two casings (10, 20), and the components in the electronic device 100 may be distributed in the host casing 10 and the charging casing 20 according to requirements.
  • the body 10 and a part accommodated in the host case 10 together form a part of the electronic device 100, and the charging case 20 and its part accommodated in the charging case 20 constitute another part of the electronic device 100, and the two parts are detachably connected.
  • the electronic device 100 may include a housing, for example, a complete machine housing, and all components of the electronic device 100 are housed in the complete machine housing.
  • the electronic device 100 may include three or more cases, and the components of the electronic device 100 are distributed in these cases.
  • FIG. 3 is an exploded view of a part of the structure of the electronic device 100 shown in FIG. 1, and FIG.
  • the electronic device 100 further includes a first component 40, a second component 50 and a radio frequency path 30.
  • the radio frequency path 30 is connected between the first component 40 and the second component 50.
  • the first component 40 includes, but is not limited to, an antenna, a radio frequency chip, a baseband chip, a power amplifier (PA), a filter, a central processing unit (CPU), or a system-on-chip. SOC).
  • the second component 50 includes, but is not limited to, one or more of an antenna, a radio frequency chip, a baseband chip, a power amplifier, a filter, a central processing unit, or a system level chip.
  • the radio frequency path 30 is capable of transmitting one or more of a radio frequency signal, a ground signal, and a power signal between the first component 40 and the second component 50.
  • the radio frequency signal includes high frequency, very high frequency, and ultra high frequency, and its frequency is in a range of 300 kHz (kilohertz) to 300 GHz (gigahertz).
  • Radio frequency signals can include, but are not limited to, Wireless-Fidelity (Wi-Fi) signals, Bluetooth signals, Global Navigation Satellite System (GNSS), 2G (2-Generation wireless telephone technology, second-generation mobile phone communication Technical specifications) signal, 3G (3-Generation wireless telephone technology, third generation mobile phone communication technology specifications) signal, 4G (4-Generation wireless telephone technology, 4th mobile phone communication technology specification) signal or 5G (5-Generation wireless telephone technology, the fifth generation mobile phone communication technical specifications) signal.
  • GNSS Global Navigation Satellite System
  • 2G (2-Generation wireless telephone technology, second-generation mobile phone communication Technical specifications 2G (2-Generation wireless telephone technology, second-generation mobile phone communication Technical specifications
  • 3G (3-Generation wireless telephone technology, third generation mobile phone communication technology specifications) signal 3G (4-Generation wireless telephone technology, 4th mobile phone communication technology specification
  • 4G (4-Generation wireless telephone technology, 4th mobile phone communication technology specification 4th mobile phone communication technology specification
  • 5G 5-Generation wireless telephone technology, the fifth
  • the first component 40 can be accommodated in the host casing 10.
  • the second component 50 can be housed in the charging case 20.
  • the radio frequency path 30 is mounted on the host casing 10 and / or the charging casing 20.
  • the radio frequency path 30 may be installed in the host case 10; or, the radio frequency path 30 may be installed in the charging case 20; or, part of the radio frequency path 30 is installed in the host case 10 and part of the radio frequency path 30 is installed in the charging case 20.
  • FIG. 2 and FIG. 4 the embodiment of the present application is described by taking a part of the radio frequency path 30 installed in the host casing 10 and a part of the radio frequency path 30 installed in the charging case 20 as an example.
  • the first component 40 includes a baseband chip 401, a radio frequency chip 402, and a first group of antennas 403.
  • the radio frequency chip 402 is electrically connected to the baseband chip 401, and the first group antenna 403 is connected to the radio frequency chip 402.
  • the signal is transmitted between "baseband chip 401-radio frequency chip 402-first group antenna 403".
  • the first set of antennas 403 includes one or more antennas 404.
  • the second component 50 includes a second group of antennas 501.
  • the second group of antennas 501 includes one or more antennas 502.
  • the radio frequency path 30 is used for transmitting radio frequency signals between the radio frequency chip 402 and the second group of antennas 501.
  • the second component 50 of the electronic device 100 may further include a charging component 503.
  • the electronic device 100 can collectively send and receive signals through the first group of antennas 403 and the second group of antennas 501 connected to the radio frequency chip 402. Therefore, without increasing the volume of the host casing 10, the number of antennas for transmitting and receiving signals of the electronic device 100 is increased, and the channel capacity of the electronic device 100 is increased.
  • the electronic device 100 includes a total of eight antennas (404, 502).
  • the host casing 10 can be connected to the charging casing 20, and eight antennas (404, 502) can be used to satisfy 8 ⁇ 8 Multiple-Input Multiple-Output (MIMO)
  • MIMO Multiple-Input Multiple-Output
  • the transmission and reception requirements of the system make the channel capacity of the electronic device 100 increase.
  • the electronic device 100 can perform charging synchronously.
  • the host housing 10 can also be separated from the charging housing 20, and the four antennas 404 in the host housing 10 can fulfill the transmission and reception requirements of a 4 ⁇ 4 MIMO system.
  • the radio frequency path 30 includes a first circuit board 60, a second circuit board 70, and a radio frequency transmission component 80.
  • the radio frequency transmission component 80 is electrically connected between the first circuit board 60 and the second circuit board 70.
  • the radio frequency transmission component 80 is capable of transmitting radio frequency signals between the first circuit board 60 and the second circuit board 70.
  • the first circuit board 60 is housed in the host casing 10.
  • the first antenna 403 and the radio frequency chip 402 are housed in the host casing 10.
  • the radio frequency chip 402 is electrically connected to the first circuit board 60.
  • the first group of antennas 403 is electrically connected to the radio frequency chip 402.
  • the radio frequency chip 402 may be fixed on the first circuit board 60.
  • the baseband chip 401 may be fixed on the first circuit board 60.
  • the first group of antennas 403 may be fixed on one or more of two board surfaces opposite to the first circuit board 60. In other embodiments, the first group of antennas 403 may be fixed on the host casing 10.
  • the second circuit board 70 is housed in the charging case 20.
  • the second group antenna 501 is housed in the charging case 20.
  • the second group antenna 501 is electrically connected to the second circuit board 70.
  • the second group of antennas 501 may be fixed on one or more of two board surfaces opposite to the second circuit board 70. In other embodiments, the antenna 501 of the second group may also be fixed on the charging case 20.
  • the radio frequency transmission assembly 80 is mounted on the host casing 10 and / or the charging casing 20.
  • the RF transmission module 80 is installed in the host casing 10; or, the RF transmission module 80 is installed in the charging casing 20; or, a portion of the RF transmission module 80 is installed in the host casing 10 and a portion of the RF transmission module 80 is installed in the charging casing 20.
  • a part of the radio frequency transmission module 80 is installed in the host casing 10 and a part of the radio frequency transmission module 80 is installed in the charging casing 20 are taken as examples for description.
  • the radio frequency path 30 includes two sets of radio frequency transmission components 80. Two sets of RF transmission components 80 are connected in series between the first circuit board 60 and the second circuit board 70. One set of RF transmission components 80 is installed in the host casing 10, and the other set of RF transmission components 80 is installed in the charging casing 20.
  • the number of the radio frequency transmission components 80 may be three groups, four groups, or the like. That is, the number of RF transmission components 80 is at least two groups, and at least two RF transmission components 80 are connected in series between the first circuit board 60 and the second circuit board 70. Since the number of radio frequency transmission components 80 can be at least two groups, the relative position between the first circuit board 60 and the second circuit board 70 is highly adjustable. The specific structure and arrangement of at least two groups of radio frequency transmission components 80 The design flexibility of the location is higher, which makes the RF path 30 more applicable and has a wider application range. For example, the first circuit board 60 is fixed on the host case 10 and the second circuit board 70 is fixed on the charging case 20. At least two sets of radio frequency transmission components 80 are partially installed in the host casing 10 and partially installed in the charging casing 20.
  • the number of the radio frequency transmission components 80 may be a group.
  • the radio frequency transmission assembly 80 is mounted on the host casing 10 or the charging casing 20.
  • the RF transmission assembly 80 When the RF transmission assembly 80 is installed in the host casing 10, one end of the RF transmission assembly 80 contacts the first circuit board 60, and the other end contacts the second circuit board 70 when the host casing 10 is connected to the charging case 20.
  • the RF transmission assembly 80 When the RF transmission assembly 80 is installed in the charging case 20, one end of the RF transmission assembly 80 contacts the second circuit board 70, and the other end contacts the first circuit board 60 when the host case 10 is connected to the charging case 20.
  • the host casing 10 is provided with a first communication hole 102.
  • the charging case 20 is provided with a second communication hole 202.
  • One end of the radio frequency transmission component 80 mounted on the host casing 10 contacts the first circuit board 60, and the other end (defined as the first connection end) is exposed or protruded from the host casing 10 through the first communication hole 102.
  • One end of the RF transmission assembly 80 mounted on the charging case 20 contacts the second circuit board 70, and the other end (defined as the second connection end) is exposed or protruded from the charging case 20 through the second communication hole 202.
  • the first connection end is connected to the second connection end, and two sets of RF transmission components 80 in series are electrically connected to the first circuit board 60 and the second circuit board 70 so that the radio frequency path 30 is connected
  • the first component 40 such as the radio frequency chip 402
  • the second component 50 such as the second group antenna 501
  • the radio frequency path 30 can be conducted at one time, so the communication manner of the radio frequency path 30 is simple and easy to implement.
  • the host housing 10 and the charging housing 20 are matched, the first communication hole 102, the second communication hole 202, and the radio frequency path 30 are all surrounded or covered by these two housings, so the overall appearance of the electronic device 100 is good .
  • the structure of each group of the radio frequency transmission components 80 in the multiple radio frequency transmission components 80 may be the same or different.
  • FIG. 5 is a schematic structural diagram of an embodiment of the radio frequency path 30 of the electronic device 100 shown in FIG. 1, and FIG. 6 is a set of radio frequency transmissions of the radio frequency path 30 shown in FIG. 5.
  • FIG. 7 is a schematic structural diagram of the module 80.
  • FIG. 7 is a schematic structural diagram of the connecting member 8 of the radio frequency transmission module 80 shown in FIG.
  • the structures of the two sets of RF transmission assemblies 80 are substantially the same, but there are also differences in some detailed structures.
  • Each group of radio frequency transmission assemblies 80 includes at least two connecting members 8. At least two connecting members 8 are connected side by side between the first circuit board 60 and the second circuit board 70.
  • the structure of each of the at least two connecting members 8 may be the same, or there may be differences. In the embodiment of the present application, the structure of each connection member 8 in at least two connection members 8 in a group of radio frequency transmission assemblies 80 is described as an example. The same structure of each connecting member 8 is not only conducive to mass production of the radio frequency transmission module 80 but also facilitates the assembly process of the radio frequency transmission module 80.
  • Each connecting member 8 includes a main body portion 81, two connecting end portions 82, and a coupling portion 83.
  • the two connection end portions 82 are respectively connected to both ends 811 of the main body portion 81.
  • the coupling portion 83 is connected to the middle portion 812 of the main body portion 81.
  • a middle portion 812 of the main body portion 81 is located between two ends 811 of the main body portion 81.
  • the coupling portion 83 is located between the two connection ends 82.
  • the coupling section 83 includes a coupling surface 831.
  • the coupling surfaces 831 of two adjacent connecting members 8 are oppositely disposed and form a capacitor between each other.
  • the coupling surface 831 of two adjacent connecting members 8 is equivalent to two electrodes of a capacitor, and the air (or other insulating medium) between the coupling surfaces 831 of two adjacent connecting members 8 is equivalent to between two electrodes of a capacitor. Dielectric.
  • the frequency transmission component 80 increases the coupling area between two adjacent connecting members 8 by adding a coupling portion 83 to the connecting member 8.
  • the coupling surfaces 831 of two adjacent connecting members 8 are parallel to each other. At this time, the projections of the coupling surfaces 831 of the two adjacent connecting members 8 on the coupling center plane 801 partially or completely overlap.
  • the coupling center plane 801 is perpendicular to the signal radiation path 802 between two adjacent connecting members 8. Adjacent two connecting members 8 have two adjacent coupling surfaces 831 that face each other, and the projections of the two coupling surfaces 831 on the coupling center plane 801 overlap, and the overlap includes partial overlap and All overlap.
  • the coupling center plane 801 is a dummy plane that is substantially perpendicular to the signal radiation path 802 between two adjacent connecting members 8.
  • two adjacent connecting members 8 include two coupling surfaces 831 facing each other.
  • the projection of one coupling surface 831 on the plane where the other coupling surface 831 is located overlaps with the other coupling surface 831.
  • the overlap includes partial overlap and All overlap.
  • the projection overlap area of the coupling surface 831 of the two connecting members 8 on the coupling center plane 801 is large, and the coupling area between the coupling surfaces 831 of two adjacent connecting members 8 is also large.
  • the coupling area is approximately the overlapping area of the projections of the coupling surfaces 831 of the two adjacent connecting members 8 on the coupling center plane 801.
  • the connecting member 8 can greatly increase the distance between the two adjacent connecting members 8 with a smaller volume. Coupling area.
  • a certain included angle may be formed between the coupling surfaces 831 of two adjacent connecting members 8.
  • the two coupling surfaces 831 facing each other form an included angle within 0 ° to 45 °.
  • the coupling surface 831 is a flat surface. In other embodiments, the coupling surface 831 may also be a curved surface of other shapes, such as an arc surface or a wave surface.
  • the coupling portion 83 includes two coupling surfaces 831.
  • the two coupling surfaces 831 are respectively located on opposite sides of the main body portion 81.
  • the number of the coupling portions 83 is two.
  • the two coupling portions 83 are respectively connected to two side edges 813 of the middle portion 812 of the main body portion 81, and the two side edges 813 are connected between two ends 811 of the main body portion 81.
  • the two coupling surfaces 831 are respectively located on the two coupling portions 83.
  • the number of the connecting members 8 of the radio frequency transmission assembly 80 is three.
  • the three connecting members 8 are aligned in the same direction.
  • the positions of the three connectors 8 can be reversed.
  • the two coupling surfaces 831 of the connecting member 8 located in the middle are respectively opposite to the coupling surfaces 831 of the connecting members 8 located on both sides (on the side close to the connecting member 8 located in the middle).
  • the connecting member 8 is a metal elastic piece.
  • the coupling portion 83 is bent with respect to the main body portion 81.
  • the coupling portion 83 is formed integrally with the main body portion 81.
  • the connecting member 8 may be formed by bending an integrated elastic piece into a main body portion 81, two connecting end portions 82, and a coupling portion 83.
  • the processing method of the connecting member 8 is relatively simple, and the formed connecting member 8 is an integral piece, which has a high structural strength.
  • an angle of 85 ° to 95 ° is formed between the coupling portion 83 and the main body portion 81.
  • the two coupling portions 83 on both sides of the main body portion 81 are substantially perpendicular to the main body portion 81, and the required arrangement space of the connecting members 8 is substantially square, so that when a plurality of connecting members 8 are arranged in one direction, the phase Adjacent two connecting members 8 can be closer to each other, and the structure of the RF transmission assembly 80 is relatively compact.
  • connection end portions 82 includes a first end 821, a second end 822, and a middle portion 826 connected between the first end 821 and the second end 822.
  • the first end 821 is fixed to the main body portion 81, and the second end 822 is suspended.
  • the middle portion 826 projects from the first end 821 and the second end 822 in a direction away from the main body portion 81.
  • the connection end portion 82 may be substantially “ ⁇ ” shaped or inverted “ ⁇ ” shaped.
  • the middle portion 826 of the connecting end portion 82 may have a certain amount of displacement deformation relative to the main body portion 81 when resisting other components, so that the connecting member 8 can absorb part of the assembly tolerance, the assembly yield is higher, and the application range is wider.
  • connection end 82 may be provided with a resisting contact 823.
  • the contact point 823 is provided in the middle portion 826.
  • the abutting contact 823 protrudes from the end surface 824 of the middle portion 826, thereby ensuring contact reliability with other components.
  • the abutting contact 823 may be formed by stamping.
  • FIG. 8 is a schematic diagram of an equivalent circuit when a signal is transmitted through the two connecting members 8 shown in FIG. 6, and FIG. 9 is two traditional shrapnels and two connecting members shown in FIG. 6. Schematic of the equivalent model of 8.
  • the connecting member 8 When a signal is transmitted in the two connecting members 8, the connecting member 8 is equivalent to an inductance L and a resistance R, and the signal coupling between the two connecting members 8 forms an equivalent capacitor C and a conductance G.
  • the impedance Z when the signal is transmitted in the two connectors 8 is:
  • FIG. 9 the left side of FIG. 9 is a schematic diagram of an equivalent model of a conventional elastic piece.
  • the traditional elastic piece includes a main body portion and two connecting ends connected to both ends of the main body portion. Line 41.
  • the impedance Z can easily reach a large value. If you want to control the impedance Z to be close to the impedance of the RF transmission line (50 ohms), the distance between the two shrapnels needs to be controlled to be extremely small, and production cannot be achieved.
  • FIG. 9 is a schematic diagram of an equivalent model of the connecting member 8 of the present application. Since the connecting member 8 is additionally provided with a coupling portion 83 having a coupling surface 831, the coupling surfaces 831 of two adjacent connecting members 8 are opposite to each other and each other. A capacitor is formed therebetween, so the coupling area between two adjacent connecting members 8 is increased, and the connecting member 8 is roughly equivalent to a coupling wall 42 having a certain height.
  • the capacitance C and the conductance G between the two connecting members 8 increase, and the inductance L and the resistance R in the connecting members 8 are reduced, so that the impedance Z can be effectively reduced, so that the radio frequency
  • the impedance Z of the transmission component 80 is controllable, and the impedance Z can be close to the impedance of the RF transmission line, so that the RF path 30 can achieve impedance matching.
  • FIG. 10 is a relationship curve (ie, S21 curve) of a possible insertion loss based on the equivalent model shown in FIG. 9.
  • the abscissa of FIG. 10 represents frequency, and the unit is gigahertz (GHz); the ordinate represents insertion loss, and the unit is decibel (dB).
  • 901 corresponds to the left equivalent model in FIG. 9; 902 corresponds to the right equivalent model in FIG.
  • the insertion loss corresponding to the 902 curve is significantly smaller than the insertion loss corresponding to the 901 curve.
  • the gap S between the coupling surfaces 831 of two adjacent connecting members 8 can also be adjusted, that is, adjusting the phase
  • the gap between two adjacent connecting members 8 is better to better control the impedance of the RF transmission component 80.
  • FIG. 11 is a schematic structural diagram of another group of RF transmission components 80 of the RF path 30 shown in FIG. 5, and FIG. 12 is a connection member 8 of the RF transmission component 80 shown in FIG. 11. Schematic diagram of the structure.
  • the difference between the radio frequency transmission module 80 shown in FIG. 12 and the radio frequency transmission module 80 shown in FIG. 6 is that one of the connection ends 82 of the connecting members 8 in the radio frequency transmission module 80 shown in FIG. 12 has a resisting plane 825.
  • the resisting plane 825 may be disposed on the middle portion 826 of the connecting end portion 82.
  • the connection end portion 82 of each connector 8 of one group of RF transmission components 80 (corresponding to FIG. 12) in two adjacent groups of RF transmission components 80 has an abutting plane 825, and the other group of RF transmission components 80 (Corresponding to FIG. 6)
  • the connecting end portion 82 of each connecting member 8 has a resisting contact 823, and the resisting contact 823 resists the resisting plane 825.
  • FIG. 13 is a test comparison chart of the initial efficiency of a possible antenna and the switching efficiency after switching through the radio frequency path 30 shown in FIG. 5.
  • the antenna under test is equivalent to one antenna 502 in the second group of antennas 501 in the present application.
  • the abscissa of FIG. 13 represents the frequency in megahertz (MHz); the ordinate represents the efficiency in decibels (dB).
  • 903 represents the initial efficiency of the antenna in the range of 2500 MHz to 2700 MHz
  • 904 represents the switching efficiency of the antenna in the range of 2500 MHz to 2700 MHz
  • 905 represents the initial efficiency of the antenna in the range of 3400 MHz to 3580 MHz
  • the difference between 904 and 903 and the difference between 906 and 905 represent insertion loss. It can be seen from FIG. 13 that after the RF path 30 is switched, the insertion loss of the RF path 30 is less than 2 dB, and the antenna efficiency of the entire system (including the RF path 30 and the antenna) is still higher than -3 dB, that is, 50%. Meet the requirements of multiple input and output systems in the B41 frequency band (working frequency: 2496 to 2690MHz) and B42 frequency band (working frequency: 3400 to 3600MHz).
  • FIG. 14 is a schematic structural diagram of a radio frequency path 30 of the electronic device 100 shown in FIG. 1 in another embodiment.
  • the radio frequency transmission assembly 80 includes one or more sets of connectors 8. Each group of connection members 8 includes three connection members 8 arranged in the same direction. As shown in FIG. 5, the radio frequency transmission component 80 in the radio frequency path 30 includes a set of connecting members 8. The radio frequency transmission assembly 80 in the radio frequency path 30 shown in FIG. 14 includes two sets of connecting members 8. The part enclosed by a dashed box in FIG. 14 is illustrated as a group of connecting members 8.
  • each group of connectors 8 includes a first connector, a second connector, and a third connector.
  • the second connector is a connector in the middle, and the first connector and the third connector are connectors on both sides.
  • a coupling surface of the second connection member facing the first connection member is disposed opposite to the coupling surface of the first connection member, and a capacitor is formed between the two coupling surfaces.
  • a coupling surface of the second connection member facing the third connection member is disposed opposite to the coupling surface of the third connection member, and a capacitor is formed between the two coupling surfaces.
  • the connecting members 8 located in the middle are used to transmit radio frequency signals, and the connecting members 8 located on both sides are used to transmit ground signals.
  • the connectors 8 located on both sides can shield the radio frequency signals (transmitted in the connector 8 located in the middle), reduce the radiation of the radio frequency signals, and reduce the loss of the radio frequency signals.
  • the interference of the radio frequency signals transmitted in the different groups of the connecting members 8 to each other is small.
  • this application uses the radio frequency path 30 shown in FIG. 5 as an example for description.
  • the first circuit board 60 is provided with a radio frequency signal pad 61 and a ground pad 62.
  • the radio frequency signal pad 61 and the ground pad 62 are insulated from each other.
  • the first circuit board 60 is further provided with a radio frequency wiring 63.
  • One end of the RF trace 63 is used to electrically connect the first component 40 (eg, the RF chip 402).
  • the other end of the RF trace 63 is connected to a RF signal pad 61.
  • a connection end portion 82 of one of the two adjacent connection members 8 of the RF transmission assembly 80 contacts the RF signal pad 61, and a connection end portion 82 of the other connection member 8 contacts the ground pad 62.
  • the connecting member 8 located in the middle contacts the radio frequency signal pad 61
  • the connecting members 8 located on both sides contact the ground pad 62.
  • the second circuit board 70 is provided with a radio frequency signal pad 71 and a ground pad 72.
  • the radio frequency signal pad 71 and the ground pad 72 are insulated from each other.
  • the second circuit board 70 is further provided with a radio frequency trace 73.
  • One end of the radio frequency trace 73 is used to electrically connect the second component 50 (for example, one antenna 502 of the second group antenna 501).
  • the other end of the RF trace 73 is connected to a RF signal pad 71.
  • a connection end portion 82 of one of the two adjacent connection members 8 of the RF transmission assembly 80 contacts the RF signal pad 71, and a connection end portion 82 of the other connection member 8 contacts the ground pad 72.
  • the connecting member 8 located in the middle contacts the radio frequency signal pad 71
  • the connecting members 8 located on both sides contact the ground pad 72.
  • the two coupling surfaces 831 of the connecting member 8 located in the middle are completely opposite to the coupling surfaces 831 of the connecting members 8 located on both sides, respectively. That is, the projection of the coupling surface 831 of the connecting member 8 located on the middle onto the corresponding coupling surface 831 completely falls into the corresponding coupling surface 831.
  • the connecting piece 8 located in the middle is the second connecting piece
  • the connecting pieces 8 located on both sides are the first connecting piece and the third connecting piece.
  • the projection of the coupling surface of the second connection member facing the first connection member onto the coupling surface of the first connection member completely falls into the coupling surface of the first connection member, and the two coupling surfaces face each other.
  • the projection of the coupling surface of the second connection member facing the third connection member onto the coupling surface of the third connection member completely falls into the coupling surface of the third connection member, and the two coupling surfaces face each other.
  • the coupling surface 831 of each connecting member 8 is perpendicular to the arrangement direction of the three connecting members 8. At this time, when the area of each coupling surface 831 is limited, the coupling area between the coupling surfaces 831 of two adjacent connectors 8 is larger.
  • each radio frequency transmission component 80 includes a group of connecting members 8 for connecting an antenna 502 to a radio frequency chip 402.
  • each radio frequency transmission component 80 includes two sets of connectors 8 for connecting the two antennas 502 and the radio frequency chip 402.
  • each RF transmission assembly 80 may include four sets of connecting members 8 so that the four antennas 502 in the charging case 20 can be connected to the RF chip 402 in the host case 10.
  • the two connection ends 82 of the connecting member 8 located in the middle connect the RF signal pads 61 and the second circuit board 70 on the first circuit board 60 respectively.
  • the two RF signal pads 71 on the upper side, the two connection ends 82 of the connecting members 8 on both sides are connected to the ground pad 62 on the first circuit board 60 and the ground pad 72 on the second circuit board 70, respectively.
  • each group of connecting members 8 in the radio frequency transmission assembly 80 may also include two connecting members 8.
  • FIG. 15 is a schematic diagram of a possible insertion loss after the antenna is transferred through the radio frequency path 30 shown in FIG. 14.
  • the antenna under test is equivalent to one antenna 502 in the second group of antennas 501 in the present application.
  • the insertion loss is the difference between the initial efficiency of the antenna and the switching efficiency after switching through the radio frequency path 30 shown in FIG. 14.
  • the abscissa of FIG. 15 represents frequency in megahertz (MHz); the ordinate represents insertion loss in decibels (dB).
  • the insertion loss of the RF path 30 is less than 2 decibels, and the insertion loss of the RF path 30 is small, so that the entire system (including the RF path 30 and the antenna) can still maintain a high level.
  • the insertion loss of the signals in the two sets of connectors 8 is close, and both can meet the requirements of the multiple input and output system in the B41 and B42 frequency bands.
  • FIG. 16 is a schematic structural diagram of a radio frequency path 30 of the electronic device 100 shown in FIG. 1 in still another embodiment; A schematic structural diagram of the transmission assembly 80.
  • the difference between the radio frequency path 30 shown in FIG. 16 and the radio frequency path 30 shown in FIG. 5 is that one of the connecting members 8 of a group of radio frequency transmission components 80 in the radio frequency path 30 shown in FIG. 16 is a pogo pin.
  • the following mainly describes the differences between the connection member 8 when it is a pogo pin and the connection member 8 when it is a metal spring, and the same points are not described again.
  • the radio frequency path 30 includes two sets of radio frequency transmission components 80.
  • the connecting member 8 of the radio frequency transmission component 80 near the first circuit board 60 is an elastic piece, and the radio frequency transmission component 80 near the second circuit board 70 is a pogo pin.
  • the connecting member 8 includes a main body portion 81, two connecting end portions 82, and a coupling portion 83.
  • the two connection end portions 82 are respectively connected to opposite ends of the main body portion 81.
  • the coupling portion 83 is attached to the outer peripheral side of the main body portion 81.
  • the coupling portion 83 is integrally formed with the main body portion 81 to simplify the processing steps of the connecting member 8 and increase the structural strength of the connecting member 8.
  • the coupling portion 83 may be fixedly connected to the main body portion 81 by an assembly method.
  • the main body portion 81 may be substantially cylindrical, and the coupling portion 83 is sleeved on the outer side of the main body portion 81.
  • the coupling portion 83 includes a coupling surface 831.
  • the coupling portion 83 may have a substantially cylindrical shape with an inner circle and an outer circle.
  • the “round” body in the “inner circle and outer side” now has a circular through hole inside the coupling portion 83, which is adapted to the shape of the main body portion 81.
  • the “square” in the “inner circle and outer side” is mainly embodied in that the outer peripheral side surface of the coupling portion 83 includes a flat coupling surface 831.
  • one connection end portion 82 of the connecting member 8 is a thimble
  • the other connection end portion 82 is a conductive elastic piece.
  • the connecting end portion 82 of the other group of RF transmission components 80 is a thimble, so that when the host housing 10 and the charging case 20 are assembled, it is easy to resist the connection ends of the connecting members 8 of the other group of RF transmission components 80. ⁇ 82 ⁇ 82.
  • the exposed part of the charging case 20 has only the end of the thimble, which makes the electronic device 100 more beautiful, at the same time it is not easy to scratch the user, and makes the user experience better.
  • the connection end portion 82 near the second circuit board 70 is a conductive elastic piece.
  • the conductive elastic sheet can be soldered on the second circuit board 70, so that the connecting member 8 is reliably connected to the second circuit board 70.
  • both connecting ends 82 of the connecting member 8 may also be thimbles. At this time, the material quantity of the connecting member 8 is small.
  • the main body portion 81, the two connection end portions 82, and the coupling portion 83 of the connector 8 may be integrally formed.
  • the structure of the connecting members 8 of each group of RF transmission components 80 in the RF path 30 can be flexibly combined as required, such as a combination of metal dome and metal dome, a combination of dome and spring pin, or a spring pin and spring pin combination.
  • FIG. 18 is a graph of a relationship between a possible insertion loss and a frequency obtained based on the radio frequency path 30 shown in FIG. 16 (that is, an S21 graph).
  • the abscissa of FIG. 18 represents frequency, and the unit is gigahertz (GHz); the ordinate represents insertion loss, and the unit is decibel (dB).
  • GHz gigahertz
  • dB decibel
  • the coupling surface 831 can be added so that the insertion loss of the radio frequency path 30 to which the connecting member 8 is applied can be controlled within a small range to meet multiple input and output. System requirements in the B41 and B42 frequency bands.
  • the RF transmission assembly 80 is provided with a coupling portion 83 having a coupling surface 831 on the connecting member 8 (which may be a metal spring sheet or a pogo pin), and the coupling surfaces 831 of two adjacent connecting members 8 are opposite to each other and are opposite each other.
  • a capacitor is formed between the two to increase the coupling area between two adjacent connecting members 8 so as to reduce the impedance, so that the impedance of the RF transmission component 80 is controllable.
  • the impedance of the RF transmission component 80 is the same as that of the first circuit board 60 and the second circuit. Matching the impedance of the RF transmission line on the board 70 facilitates the impedance matching of the RF path 30, thereby effectively transmitting the RF signal.
  • the RF transmission component 80 can also reduce the insertion loss of the RF path 30 and improve the transmission efficiency of the RF path 30.

Abstract

本申请公开一种射频传输组件，包括至少两个连接件。各连接件均包括主体部、两个连接端部及耦合部，两个连接端部分别连接于主体部的两端，耦合部连接于主体部的中部，耦合部具有耦合面，相邻两个连接件的耦合面相对设置且彼此之间形成电容器。上述射频传输组件的阻抗可控。本申请还公开一种电子设备。

Description

射频传输组件及电子设备 技术领域
本申请涉及射频信号传输技术领域，尤其涉及一种射频传输组件及应用该射频传输组件的电子设备。
背景技术
在电子设备中，通常需要在两个部件之间建立射频通路，以传输射频信号。为了降低对组装公差的要求、增加容错性，业内人士提出可以将弹簧针(pogo pin)或弹片应用于射频通路。然而，传统射频通路中的弹簧针或弹片大多没有做阻抗控制，只能适用于非常短的距离，一旦传输路径较长，则弹簧针或弹片的阻抗大幅度增加，导致射频通路的阻抗严重失配。
发明内容
本申请提供一种射频传输组件及应用该射频传输组件的电子设备。
第一方面，本申请提供了一种射频传输组件。射频传输组件可应用于电子设备。电子设备的射频通路包括第一电路板、第二电路板及连接在第一电路板与第二电路板之间的射频传输组件。
射频传输组件包括至少两个连接件。各连接件均包括主体部、两个连接端部及耦合部。两个连接端部分别连接于主体部的两端。信号在连接件中传输时，信号自其中一个连接端部经主体部向另一个连接端部传输。耦合部连接于主体部的中部。主体部的中部位于主体部的两端之间。耦合部具有耦合面。相邻两个连接件的耦合面相对设置且彼此之间形成电容器。相邻两个连接件的耦合面相当于电容器的两个电极，相邻两个连接件的耦合面之间的空气(或其他绝缘介质)相当于电容器的两个电极之间的电介质。
在本实施方式中，由于相邻两个连接件的耦合面相对设置且彼此之间形成电容器，因此相邻两个连接件的耦合面之间具有一定的耦合面积。故而，射频传输组件通过在连接件上增设耦合部，增加了相邻两个连接件之间的耦合面积。由于射频传输组件中相邻两个连接件的耦合面积较大，因此射频传输组件的阻抗较小，射频传输组件的阻抗可控，射频传输组件的阻抗得以与第一电路板和第二电路板上的射频传输线的阻抗相匹配，有利于电子设备的射频通路实现阻抗匹配，从而有效传递射频信号。同时，射频传输组件也能够降低射频通路的插损，提高射频通路的传输效率。
一种可选实施方式中，相邻两个连接件的耦合面彼此平行。此时，相邻两个连接件的耦合面在耦合中心面上的投影部分重叠或全部重叠。耦合中心面垂直于相邻两个连接件之间的信号辐射路径。相邻两个连接件具有相邻的两个耦合面，这两个耦合面面向彼此，并且这两个耦合面在耦合中心面上的投影发生重叠，重叠情况包括部分重叠和全部重叠。
在本实施例中，两个连接件的耦合面在耦合中心面上的投影的重叠面积较大，相邻两个连接件的耦合面之间的耦合面积也较大。其中，耦合面积大致为相邻两个连接件的耦合面在耦合中心面上的投影的重叠面积。当相邻两个连接件的耦合面在耦合中心面上的投影全部重叠时，连接件能够在增加较小体积的情况下，较大幅度地增加相邻两个连接件之间 的耦合面积。
在其他实施例中，相邻两个连接件的耦合面之间也可以形成一定的夹角。例如，面向彼此的两个耦合面之间形成0°至45°之内的夹角。
一种可选实施方式中，耦合面为平面。或者，耦合面也可以为其他形状的曲面，例如弧面、波浪面。
一种可选实施方式中，耦合部包括两个耦合面，两个耦合面分别位于主体部的相背两侧。两个耦合面分别位于主体部的相背两侧。本实施方式中，至少两个连接件在排列时，可以互相调换各连接件的相对位置关系，而不影响射频传输组件的性能，从而降低了射频传输组件的组装难度。
一种可选实施方式中，射频传输组件包括一组或多组连接件。各组连接件包括三个在同一方向上排列的连接件。位于中间的连接件的两个耦合面分别与位于两侧的连接件的耦合面相对设置。换言之，各组连接件包括第一连接件、第二连接件及第三连接件，第二连接件为位于中间的连接件，第一连接件和第三连接件为位于两侧的连接件。第二连接件的朝向第一连接件的耦合面与第一连接件的耦合面相对设置，且两个耦合面之间形成电容器。第二连接件的朝向第三连接件的耦合面与第三连接件的耦合面相对设置，且两个耦合面之间形成电容器。
其中，位于中间的连接件用于传输射频信号，位于两侧的连接件用于传输地信号。位于两侧的连接件能够对射频信号(在位于中间的连接件中传输)起到屏蔽作用，减少射频信号的辐射，以降低射频信号的损耗。并且，当连接件为多组时，在不同组连接件中传输的射频信号对彼此的干扰较小。
位于中间的连接件的两个耦合面分别完全正对位于两侧的连接件的耦合面。也即，位于中间的连接件的耦合面在与其对应的耦合面上的投影完全落入对应的耦合面中。换言之，位于中间的连接件为第二连接件，位于两侧的连接件为第一连接件和第三连接件。第二连接件的朝向第一连接件的耦合面在第一连接件的耦合面上的投影完全落入第一连接件的耦合面内，这两个耦合面面向彼此。第二连接件的朝向第三连接件的耦合面在第三连接件的耦合面上的投影完全落入第三连接件的耦合面内，这两个耦合面面向彼此。
本实施方式中，射频传输组件对位于中间的连接件的耦合面的利用率更高，较大幅度地相邻两个连接件的耦合面之间的耦合面积，使得射频传输组件的阻抗更为可控。同时，位于两侧的连接件能够对射频信号(在位于中间的连接件中传输)起到充分的屏蔽作用，以降低射频信号的损耗。
其中，在一组连接件中，各连接件的耦合面垂直于三个连接件的排列方向。此时，在各耦合面的面积有限的情况下，相邻两个连接件的耦合面之间的耦合面积更大。
一种可选实施方式中，连接件为金属弹片。耦合部相对主体部弯折。其中，耦合部与主体部一体成型。连接件可以由一体的弹片通过弯折形成主体部、两个连接端部及耦合部。本实施方式中，连接件的加工方法较为简单，且成形后的连接件为一体件，结构强度较高。
其中，耦合部与主体部之间形成85°至95°的角。此时，主体部两侧的两个耦合部大致垂直于主体部，连接件的所需求的排布空间大致呈方形，使得多个连接件大致在一个方向上排列时，相邻两个连接件可以较为靠近彼此，射频传输组件的结构较为紧凑，且阻抗 较小。
其中，各连接端部均包括第一端、第二端及连接在第一端与第二端之间的中部。第一端固接主体部，第二端悬空设置，中部相对第一端及第二端向远离主体部的方向凸出。此时，连接端部的中部可在抵持其他部件时，相对主体部具有一定的位移形变量，从而使得连接件可吸收部分装配公差，装配良率更高，适用范围更广。
其中，连接端部上可设有抵持触点。抵持触点设于中部。抵持触点相对中部的端部表面凸出，从而保证与其他部件的接触可靠性。抵持触点可通过冲压形成。
一种可选实施方式中，连接件为弹簧针。耦合部安装于主体部的外周侧。其中，耦合部与主体部一体成型，以简化连接件的加工工序，并增加连接件的结构强度。
其中，主体部可大致呈圆柱状，耦合部套设在主体部的外侧。耦合部包括耦合面。耦合部可以是大致呈内圆外方的柱体形状。“内圆外方”中的“圆”体现在耦合部内侧具有一个圆通孔，该圆通孔与主体部的形状相适配。“内圆外方”中的“方”主要体现在耦合部的外周侧面包括平整的耦合面。例如，耦合部包括两个耦合面，两个耦合面分别位于主体部的相背两侧。此时两个耦合面之间可通过平面或弧面连接。或者，在其他实施例中，耦合部也可包括三个或四个耦合面，三个或四个耦合面可直接连接彼此，也可通过平面或弧面连接。连接件的排布位置和数量不同时，耦合面的排布位置及数量也不同。
一种可选实施方式中，两个连接端部均为顶针；或，其中一个连接端部为顶针，另一个连接端部为导电弹片。例如，连接端部为顶针时，能够在主机壳体与充电壳体相装配时，可靠地抵持另一个连接件的连接端部。连接端部为导电弹片时，连接端部可焊接在第二电路板上，使得连接件可靠地连接第二电路板。
第二方面，本申请还提供一种电子设备。电子设备可以是无线热点装置。电子设备包括射频通路。射频通路包括第一电路板、第二电路板及上述射频传输组件。射频传输组件电连接在第一电路板与第二电路板之间。
在本申请中，射频传输组件通过在连接件上设置具有耦合面的耦合部，且相邻两个连接件的耦合面相对设置且彼此之间形成电容器，增加了相邻两个连接件之间的耦合面积，从而降低阻抗，使得射频传输组件的阻抗可控，射频传输组件的阻抗与第一电路板和第二电路板上的射频传输线的阻抗相匹配，有利于电子设备的射频通路实现阻抗匹配，从而有效传递射频信号。同时，射频传输组件也能够降低射频通路的插损，提高射频通路的传输效率。
一种可选实施方式中，第一电路板上设有射频信号焊盘和接地焊盘。射频传输组件的相邻两个连接件中的其中一个连接件的连接端部接触射频信号焊盘，另一个连接件的连接端部接触接地焊盘。例如，连接件的数量为三个，位于中间的连接件接触射频走线，位于两侧的连接件接触接地焊盘。
一种可选实施方式中，射频传输组件的数量为至少两组，至少两组射频传输组件串联在第一电路板与第二电路板之间。由于射频传输组件的数量可以为至少两组，因此第一电路板与第二电路板之间的相对位置的可调性较强，至少两组射频传输组件的具体结构及排布位置的设计灵活性较高，使得射频通路的适用性较高，适用范围较广。
一种可选实施方式中，相邻两组射频传输组件中的其中一组射频传输组件的各连接件 的连接端部具有抵持平面，另一组射频传输组件的各连接件的连接端部具有抵持触点，抵持触点抵持抵持平面。
在本实施方式中，两组射频传输组件相串联，两组射频传输组件中的各连接件一一对应地串联在第一电路板与第二电路板之间。相串联的两个连接件的其中一个连接件设有抵持平面，另一个连接件设有抵持触点，抵持触点抵持抵持平面，使得两个连接件之间的抵持连接关系更为可靠。
一种可选实施方式中，电子设备还包括主机壳体、第一组天线、射频芯片、充电壳体及第二组天线，第一电路板、第一组天线及射频芯片收容于主机壳体，射频芯片电连接第一电路板，第一组天线电连接射频芯片，第二电路板和第二组天线收容于充电壳体，第二组天线电连接第二电路板，射频传输组件安装于主机壳体和/或充电壳体。
在本实施方式中，由于第二组天线可以通过射频通路连接至射频芯片，因此电子设备能够通过射频芯片所连接的第一组天线和第二组天线共同收发信号，从而在不增加主机壳体的体积的情况下，增加电子设备的用于收发信号的天线数量，提高电子设备的信道容量。
附图说明
图1是本申请提供的一种电子设备在一种使用状态中的结构示意图；
图2是图1所示电子设备在另一种使用状态中的结构示意图；
图3是图1所示电子设备的部分结构分解图；
图4是图1所示电子设备在A-A线处的部分结构的示意图；
图5是图1所示电子设备的射频通路在一种实施方式中的结构示意图；
图6是图5所示射频通路的其中一组射频传输组件的结构示意图；
图7是图6所示射频传输组件的连接件的结构示意图；
图8是信号在图6所示的两个连接件中传输时的等效电路示意图；
图9是两个传统弹片和图6所示两个连接件的等效模型的示意图；
图10是基于图9所示等效模型得到的一种可能的插损与频率的关系曲线图；
图11是图5所示射频通路的另一组射频传输组件的结构示意图；
图12是图11所示射频传输组件的连接件的结构示意图；
图13是一种可能的天线的初始效率和经图5所示射频通路转接后的转接效率的测试比对图；
图14是图1所示电子设备的射频通路在另一种实施方式中的结构示意图；
图15是一种可能的天线经图14所示射频通路转接后的插损的示意图；
图16是图1所示电子设备的射频通路在再一种实施方式中的结构示意图；
图17是图16所示射频通路的其中一组射频传输组件的结构示意图；
图18是基于图16所示射频通路得到的一种可能的插损与频率的关系曲线图。
具体实施方式
下面结合本申请实施方式中的附图对本申请实施方式进行描述。
请一并参阅图1和图2，图1是本申请提供的一种电子设备100在一种使用状态中的结构示意图，图2是图1所示电子设备100在另一种使用状态中的结构示意图。
本申请实施方式涉及的电子设备100可以是无线热点装置、平板电脑、手机、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等设备。本申请实施方式以电子设备100是无线热点装置为例进行说明。
电子设备100包括主机壳体10和充电壳体20。电子设备100的零部件部分位于主机壳体10中，部分位于充电壳体20中。主机壳体10与充电壳体20之间为可拆卸连接关系。如图1所示，主机壳体10可与充电壳体20相固定；如图2所示，主机壳体10也可脱离充电壳体20。
主机壳体10与充电壳体20之间可通过凹凸结构实现配合。例如，主机壳体10上设有一个或多个凹槽或通孔101，充电壳体20上设有一个或多个凸起201，凸起201卡入凹槽或通孔101，以固定主机壳体10与充电壳体20。凹槽或通孔101的壁面与凸起201之间可设置如磁铁组件等彼此吸附的吸附件。或者，凸起201伸入凹槽或通孔101时，凹槽或通孔101的内周壁面与凸起201的外周侧壁之间为过盈配合。
可以理解的是，在本实施方式中，电子设备100包括两个壳体(10、20)，电子设备100中的零部件可依据需求分布在主机壳体10和充电壳体20中，主机壳体10与收容于主机壳体10的零部件共同构成电子设备100的一部分，充电壳体20与其收容于充电壳体20的零部件构成电子设备100的另一部分，这两部分可拆卸连接。
在其他实施方式中，电子设备100可以包括一个壳体，例如包括整机壳体，电子设备100的所有零部件均收容于整机壳体。或者，电子设备100也可以包括三个壳体或更多的壳体，电子设备100的零部件分布在这些壳体中。
请一并参阅图3和图4，图3是图1所示电子设备100的部分结构分解图，图4是图1所示电子设备100在A-A线处的部分结构的示意图。
电子设备100还包括第一部件40、第二部件50及射频通路30。射频通路30连接在第一部件40与第二部件50之间。第一部件40包括但不限于天线、射频芯片、基带芯片、功率放大器(Power Amplifier，PA)、滤波器(filter)、中央处理器(Central Processing Unit，CPU)或系统级芯片(System on Chip，SOC)中的一者或多者。第二部件50包括但不限于天线、射频芯片、基带芯片、功率放大器、滤波器、中央处理器或系统级芯片中的一者或多者。射频通路30能够在第一部件40与第二部件50之间传输射频信号、地信号、电源信号中的一者或多者。其中，射频信号包括高频、甚高频和超高频，其频率在300kHz(千赫兹)至300GHz(吉赫兹)范围中。射频信号可以包括但不限于无线局域网(Wireless-Fidelity，Wi-Fi)信号、蓝牙信号、全球导航卫星系统(Global Navigation Satellite System，GNSS)、2G(2-Generation wireless telephone technology，第二代手机通信技术规格)信号、3G(3-Generation wireless telephone technology，第三代手机通信技术规格)信号、4G(4-Generation wireless telephone technology，第四代手机通信技术规格)信号或5G(5-Generation wireless telephone technology，第五代手机通信技术规格)信号。
其中，第一部件40可收容于主机壳体10。第二部件50可收容于充电壳体20。射频通路30安装于主机壳体10和/或充电壳体20。换言之，射频通路30可安装于主机壳体10；或者，射频通路30可安装于充电壳体20；或者，部分射频通路30安装于主机壳体10、部 分射频通路30安装于充电壳体20。如图2和图4所示，本申请实施方式以部分射频通路30安装于主机壳体10、部分射频通路30安装于充电壳体20为例进行说明。
在一种实施方式中，第一部件40包括基带芯片401、射频芯片402及第一组天线403。射频芯片402电连接基带芯片401，第一组天线403连接射频芯片402。信号在“基带芯片401——射频芯片402——第一组天线403”之间传输。第一组天线403包括一个或多个天线404。
第二部件50包括第二组天线501。第二组天线501包括一个或多个天线502。射频通路30用于在射频芯片402与第二组天线501之间传输射频信号。其中，电子设备100的第二部件50还可包括充电组件503。
在本实施方式中，由于第二组天线501可以通过射频通路30连接至射频芯片402，因此电子设备100能够通过射频芯片402所连接的第一组天线403和第二组天线501共同收发信号，从而在不增加主机壳体10的体积的情况下，增加电子设备100的用于收发信号的天线数量，提高电子设备100的信道容量。
例如，第一组天线403包括4个天线404，第二组天线501包括4个天线502，则电子设备100共包括8个天线(404、502)。在一些使用环境(例如室内)中，主机壳体10能够连接充电壳体20，8个天线(404、502)可以用于满足8×8的多输入多输出(Multiple-Input Multiple-Output，MIMO)系统的收发需求，使得电子设备100的信道容量增大。此时，电子设备100可以同步进行充电。在另一些使用环境(例如户外移动环境)中，主机壳体10也可以脱离充电壳体20，主机壳体10中的4个天线404能够实现4×4的多输入多输出系统的收发需求。
请一并参阅图3和图4，射频通路30包括第一电路板60、第二电路板70及射频传输组件80。射频传输组件80电连接在第一电路板60与第二电路板70之间。射频传输组件80能够在第一电路板60与第二电路板70之间传输射频信号。
其中，第一电路板60收容于主机壳体10。第一组天线403、射频芯片402收容于主机壳体10。射频芯片402电连接第一电路板60。第一组天线403电连接射频芯片402。射频芯片402可固定在第一电路板60上。基带芯片401可固定在第一电路板60上。第一组天线403可固定在第一电路板60相背的两个板面的一者或多者上。其他实施例中，第一组天线403也可固定在主机壳体10上。
第二电路板70收容于充电壳体20。第二组天线501收容于充电壳体20。第二组天线501电连接第二电路板70。第二组天线501可固定在第二电路板70相背的两个板面的一者或多者上。其他实施例中，第二组天线501也可固定在充电壳体20上。
射频传输组件80安装于主机壳体10和/或充电壳体20。换言之，射频传输组件80安装于主机壳体10；或者，射频传输组件80安装于充电壳体20；或者，部分射频传输组件80安装于主机壳体10，部分射频传输组件80安装于充电壳体20。
本申请实施方式以部分射频传输组件80安装于主机壳体10、部分射频传输组件80安装于充电壳体20为例进行说明。
请一并参阅图3和图4，射频通路30包括两组射频传输组件80。两组射频传输组件80串联在第一电路板60与第二电路板70之间。一组射频传输组件80安装于主机壳体10， 另一组射频传输组件80安装于充电壳体20。
在其他实施方式中，射频传输组件80的数量也可以为三组、四组等。也即，射频传输组件80的数量为至少两组，至少两组射频传输组件80串联在第一电路板60与第二电路板70之间。由于射频传输组件80的数量可以为至少两组，因此第一电路板60与第二电路板70之间的相对位置的可调性较强，至少两组射频传输组件80的具体结构及排布位置的设计灵活性较高，使得射频通路30的适用性较高，适用范围较广。例如，第一电路板60固定在主机壳体10上，第二电路板70固定在充电壳体20上。至少两组射频传输组件80部分安装于主机壳体10，部分安装于充电壳体20。
在其他实施方式中，射频传输组件80的数量也可以为一组。例如，射频传输组件80安装于主机壳体10或充电壳体20。射频传输组件80安装于主机壳体10时，射频传输组件80的一端接触第一电路板60，另一端在主机壳体10连接充电壳体20时接触第二电路板70。射频传输组件80安装于充电壳体20时，射频传输组件80的一端接触第二电路板70，另一端在主机壳体10连接充电壳体20时接触第一电路板60。
请结合参阅图2和图4，主机壳体10上设有第一连通孔102。充电壳体20上设有第二连通孔202。安装于主机壳体10的射频传输组件80的一端接触第一电路板60，另一端(定义为第一连接端)经第一连通孔102露出或伸出主机壳体10。安装于充电壳体20的射频传输组件80的一端接触第二电路板70，另一端(定义为第二连接端)经第二连通孔202露出或伸出充电壳体20。主机壳体10与充电壳体20相连接时，第一连接端连接第二连接端，串联的两组射频传输组件80电连接第一电路板60和第二电路板70，使得射频通路30连接第一部件40(例如射频芯片402)与第二部件50(例如第二组天线501)。如图2所示，主机壳体10与充电壳体20相分离时，第一连接端脱离第二连接端。
在本实施方式中，只需将主机壳体10固定在充电壳体20上，即能够一次性地导通射频通路30，因此射频通路30的连通方式简单、易实现。由于主机壳体10与充电壳体20相配合时，第一连通孔102、第二连通孔202及射频通路30均被这两个壳体所包围或覆盖，因此电子设备100的整机外观良好。
在本申请中，射频通路30的射频传输组件80的数量为多组时，多组射频传输组件80中各组射频传输组件80的结构可以相同，也可以不同。
请一并参阅图5至图7，图5是图1所示电子设备100的射频通路30在一种实施方式中的结构示意图，图6是图5所示射频通路30的其中一组射频传输组件80的结构示意图，图7是图6所示射频传输组件80的连接件8的结构示意图。两组射频传输组件80的结构大致相同，但也存在部分细节结构的差异。
各组射频传输组件80包括至少两个连接件8。至少两个连接件8并排地连接在第一电路板60与第二电路板70之间。至少两个连接件8中的各连接件8的结构可以是相同的，也可以是存在差异的。本申请实施方式以一组射频传输组件80中的至少两个连接件8中的各连接件8的结构是相同的为例进行说明。各连接件8结构相同不仅有利于射频传输组件80的批量化生产，也有利于简化射频传输组件80的组装工序。
各连接件8均包括主体部81、两个连接端部82及耦合部83。两个连接端部82分别连接于主体部81的两端811。信号在连接件8中传输时，信号自其中一个连接端部82经主 体部81向另一个连接端部82传输。耦合部83连接于主体部81的中部812。主体部81的中部812位于主体部81的两端811之间。耦合部83位于两个连接端部82之间。耦合部83具有耦合面831。相邻两个连接件8的耦合面831相对设置且彼此之间形成电容器。相邻两个连接件8的耦合面831相当于电容器的两个电极，相邻两个连接件8的耦合面831之间的空气(或其他绝缘介质)相当于电容器的两个电极之间的电介质。
在本实施方式中，由于相邻两个连接件8的耦合面831相对设置且彼此之间形成电容器，因此相邻两个连接件8的耦合面831之间具有一定的耦合面积。故而，频传输组件80通过在连接件8上增设耦合部83，增加了相邻两个连接件8之间的耦合面积。
如图6所示，一种实施例中，相邻两个连接件8的耦合面831彼此平行。此时，相邻两个连接件8的耦合面831在耦合中心面801上的投影部分重叠或全部重叠。耦合中心面801垂直于相邻两个连接件8之间的信号辐射路径802。相邻两个连接件8具有相邻的两个耦合面831，这两个耦合面831面向彼此，并且这两个耦合面831在耦合中心面801上的投影发生重叠，重叠情况包括部分重叠和全部重叠。耦合中心面801是一个虚设的平面，该平面大致垂直于相邻两个连接件8之间的信号辐射路径802。当两个连接件8的信号辐射路径802发生变化时，耦合中心面801的位置也发生变化。例如，相邻两个连接件8包括两个面向彼此的耦合面831，其中一个耦合面831在另一个耦合面831所在平面上的投影与另一个耦合面831发生重叠，重叠情况包括部分重叠和全部重叠。
在本实施例中，两个连接件8的耦合面831在耦合中心面801上的投影的重叠面积较大，相邻两个连接件8的耦合面831之间的耦合面积也较大。其中，耦合面积大致为相邻两个连接件8的耦合面831在耦合中心面801上的投影的重叠面积。当相邻两个连接件8的耦合面831在耦合中心面801上的投影全部重叠时，连接件8能够在增加较小体积的情况下，较大幅度地增加相邻两个连接件8之间的耦合面积。
在其他实施例中，相邻两个连接件8的耦合面831之间也可以形成一定的夹角。例如，面向彼此的两个耦合面831之间形成0°至45°之内的夹角。
如图6所示，一种实施例中，耦合面831为平面。其他实施例中，耦合面831也可以为其他形状的曲面，例如弧面、波浪面。
如图5和图6所示，一种实施例中，耦合部83包括两个耦合面831。两个耦合面831分别位于主体部81的相背两侧。其中，耦合部83的数量为两个，两个耦合部83分别连接主体部81的中部812的两条侧边813，这两条侧边813连接在主体部81的两端811之间。两个耦合面831分别位于两个耦合部83上。本实施例中，至少两个连接件8在排列时，可以互相调换各连接件8的相对位置关系，而不影响射频传输组件80的性能，从而降低了射频传输组件80的组装难度。
例如，射频传输组件80的连接件8的数量为三个。三个连接件8沿同一方向排列。这三个连接件8的位置可以进行对调。位于中间的连接件8的两个耦合面831，分别与位于两侧的连接件8的耦合面831(处于靠近位于中间的连接件8的一侧)相对设置。
如图7所示，连接件8为金属弹片。耦合部83相对主体部81弯折。耦合部83与主体部81一体成型。例如，连接件8可以由一体的弹片通过弯折形成主体部81、两个连接端部82及耦合部83。本实施例中，连接件8的加工方法较为简单，且成形后的连接件8为 一体件，结构强度较高。
其中，耦合部83与主体部81之间形成85°至95°的角。此时，主体部81两侧的两个耦合部83大致垂直于主体部81，连接件8的所需求的排布空间大致呈方形，使得多个连接件8大致在一个方向上排列时，相邻两个连接件8可以较为靠近彼此，射频传输组件80的结构较为紧凑。
其中，各连接端部82均包括第一端821、第二端822及连接在第一端821与第二端822之间的中部826。第一端821固接主体部81，第二端822悬空设置。中部826相对第一端821及第二端822向远离主体部81的方向凸出。此时，连接端部82可大致呈“√”形或倒“√”形。连接端部82的中部826可在抵持其他部件时，相对主体部81具有一定的位移形变量，从而使得连接件8可吸收部分装配公差，装配良率更高，适用范围更广。
其中，连接端部82上可设有抵持触点823。本实施例中，抵持触点823设于的中部826。抵持触点823相对中部826的端部表面824凸出，从而保证与其他部件的接触可靠性。抵持触点823可通过冲压形成。
其中，主体部81上可设有一个或多个通孔814。
请一并参阅图8和图9，图8是信号在图6所示的两个连接件8中传输时的等效电路示意图，图9是两个传统弹片和图6所示两个连接件8的等效模型的示意图。
信号在两个连接件8中传输时，连接件8等效成电感L和电阻R，两个连接件8之间信号耦合形成等效的电容C和电导G。信号在两个连接件8中传输时的阻抗Z为：
Figure PCTCN2018101957-appb-000001
如图9所示，图9中左侧图示是传统弹片的等效模型的示意图，传统弹片包括主体部和连接在主体部两端的两个连接端部，因此传统弹片大致相当于扁平的走线41。信号在两个传统弹片中传输时，由于两个传统弹片之间的耦合面积(主要由两个传统弹片的主体部所形成)很小，因此阻抗Z很容易达到一个很大的值。如果想要将阻抗Z控制到靠近射频传输线阻抗(50欧)，则两个弹片之间的间距需要控制到极小，生产无法实现。图9中右侧图示是本申请连接件8的等效模型的示意图，由于连接件8增设了具有耦合面831的耦合部83，相邻两个连接件8的耦合面831相对设置且彼此之间形成电容器，因此增加了相邻两个连接件8之间的耦合面积，连接件8大致相当于具有一定高度的耦合墙42。由于两个连接件8的耦合面积增加，因此两个连接件8之间的电容C和电导G增加，连接件8中的电感L和电阻R减小，从而能够有效减小阻抗Z，使得射频传输组件80的阻抗Z可控，阻抗Z能够靠近射频传输线阻抗，使得射频通路30实现阻抗匹配。
请参阅图10，图10是基于图9所示等效模型得到的一种可能的插损与频率的关系曲线图(也即S21曲线图)。图10的横坐标代表频率，单位为吉赫(GHz)；纵坐标代表插损，单位为分贝(dB)。图10中901对应于图9中左侧等效模型；902对应于图9中右侧等效模型。由图10可知，在相同频率下，902曲线所对应的插损明显小于901曲线所对应的插损。本申请连接件8通过增设耦合面831，使得应用连接件8的射频通路30在使用中的插损相较于应用传统弹片的射频通路30的插损大幅度降低，改善明显。
一种实施例中，参阅图6，在调节各连接件8的耦合面831的位置与大小时，还可以 调节相邻两个连接件8的耦合面831之间的间隙S，也即调节相邻两个连接件8之间的间隙，以更好地控制射频传输组件80的阻抗。当相邻两个连接件8较为靠近彼此，相邻两个耦合面831之间的距离较小时，电容C增加，射频传输组件80的阻抗Z减小。
请一并参阅图5、图11以及图12，图11是图5所示射频通路30的另一组射频传输组件80的结构示意图，图12是图11所示射频传输组件80的连接件8的结构示意图。
图12所示的射频传输组件80与图6所示的射频传输组件80的区别在于：图12所示的射频传输组件80中的连接件8的其中一个连接端部82具有抵持平面825。抵持平面825可设于连接端部82的中部826上。具体而言，相邻两组射频传输组件80中的其中一组射频传输组件80(对应于图12)的各连接件8的连接端部82具有抵持平面825，另一组射频传输组件80(对应于图6)的各连接件8的连接端部82具有抵持触点823，抵持触点823抵持抵持平面825。
在本实施方式中，两组射频传输组件80相串联，两组射频传输组件80中的各连接件8一一对应地串联在第一电路板60与第二电路板70之间。相串联的两个连接件8的其中一个连接件8设有抵持平面825，另一个连接件8设有抵持触点823，抵持触点823抵持抵持平面825，使得两个连接件8之间的抵持连接关系更为可靠。
本实施方式的射频传输组件80和连接件8的其他部分设计参阅图6所示射频传输组件80和图7所示连接件8，具体方案不再赘述。
进一步地，请参阅图13，图13是一种可能的天线的初始效率和经图5所示射频通路30转接后的转接效率的测试比对图。其中，测试中的天线相当于本申请中第二组天线501中的一个天线502。图13的横坐标代表频率，单位为兆赫(MHz)；纵坐标代表效率，单位为分贝(dB)。图13中903代表在2500兆赫到2700兆赫范围内天线的初始效率；904代表在2500兆赫到2700兆赫范围内天线的转接效率；905代表在3400兆赫到3580兆赫范围内天线的初始效率；906代表在3400兆赫到3580兆赫范围内天线的转接效率。904和903之间的差值及906和905之间的差值代表插损。由图13可知，经过射频通路30的转接后，射频通路30的插损小于2分贝，并且整个系统(包括射频通路30和天线)的天线效率仍然高于-3分贝，即50％，从而满足多输入输出系统在B41频段(工作频率：2496至2690MHz)和B42频段(工作频率：3400至3600MHz)的指标要求。
故而，在本申请中，射频传输组件80通过在连接件8(例如金属弹片)上设置具有耦合面831的耦合部83，且相邻两个连接件8的耦合面831相对设置且彼此之间形成电容器，能够增加相邻两个连接件8之间的耦合面积，从而降低阻抗，使得射频传输组件80的阻抗可控，射频传输组件80的阻抗与第一电路板60和第二电路板70上的射频传输线的阻抗相匹配，有利于射频通路30实现阻抗匹配，同时，也能够降低射频通路30的插损，提高射频通路30的传输效率。
请一并参阅图5和图14，图14是图1所示电子设备100的射频通路30在另一种实施方式中的结构示意图。
射频传输组件80包括一组或多组连接件8。各组连接件8包括三个在同一方向上排列的连接件8。如图5所示射频通路30中的射频传输组件80包括一组连接件8。如图14所示的射频通路30中的射频传输组件80包括两组连接件8。图14中一个虚线框所包括的部 分示意为一组连接件8。
其中，位于中间的连接件8的两个耦合面831分别与位于两侧的连接件8的耦合面831相对设置。换言之，各组连接件8包括第一连接件、第二连接件及第三连接件，第二连接件为位于中间的连接件，第一连接件和第三连接件为位于两侧的连接件。第二连接件的朝向第一连接件的耦合面与第一连接件的耦合面相对设置，且两个耦合面之间形成电容器。第二连接件的朝向第三连接件的耦合面与第三连接件的耦合面相对设置，且两个耦合面之间形成电容器。
一种实施例中，位于中间的连接件8用于传输射频信号，位于两侧的连接件8用于传输地信号。此时，位于两侧的连接件8能够对射频信号(在位于中间的连接件8中传输)起到屏蔽作用，减少射频信号的辐射，以降低射频信号的损耗。并且，当连接件8为多组时，在不同组连接件8中传输的射频信号对彼此的干扰较小。
请参阅图5，本申请以图5所示射频通路30为例进行说明。
第一电路板60上设有射频信号焊盘61和接地焊盘62。射频信号焊盘61与接地焊盘62彼此绝缘。第一电路板60上还设有射频走线63。射频走线63的一端用于电连接第一部件40(例如射频芯片402)。射频走线63的另一端连接射频信号焊盘61。射频传输组件80的相邻两个连接件8中的其中一个连接件8的连接端部82接触射频信号焊盘61，另一个连接件8的连接端部82接触接地焊盘62。具体而言，靠近第一电路板60的射频传输组件80的三个连接件8中，位于中间的连接件8接触射频信号焊盘61，位于两侧的连接件8接触接地焊盘62。
第二电路板70上设有射频信号焊盘71和接地焊盘72。射频信号焊盘71与接地焊盘72彼此绝缘。第二电路板70上还设有射频走线73。射频走线73的一端用于电连接第二部件50(例如第二组天线501的一个天线502)。射频走线73的另一端连接射频信号焊盘71。射频传输组件80的相邻两个连接件8中的其中一个连接件8的连接端部82接触射频信号焊盘71，另一个连接件8的连接端部82接触接地焊盘72。具体而言，靠近第二电路板70的射频传输组件80的三个连接件8中，位于中间的连接件8接触射频信号焊盘71，位于两侧的连接件8接触接地焊盘72。
其中，位于中间的连接件8的两个耦合面831分别完全正对位于两侧的连接件8的耦合面831。也即，位于中间的连接件8的耦合面831在与其对应的耦合面831上的投影完全落入对应的耦合面831中。换言之，位于中间的连接件8为第二连接件，位于两侧的连接件8为第一连接件和第三连接件。第二连接件的朝向第一连接件的耦合面在第一连接件的耦合面上的投影完全落入第一连接件的耦合面内，这两个耦合面面向彼此。第二连接件的朝向第三连接件的耦合面在第三连接件的耦合面上的投影完全落入第三连接件的耦合面内，这两个耦合面面向彼此。
在本实施例中，射频传输组件80对位于中间的连接件8的耦合面831的利用率更高，较大幅度地相邻两个连接件8的耦合面831之间的耦合面积，使得射频传输组件80的阻抗更为可控。同时，位于两侧的连接件8能够对射频信号(在位于中间的连接件8中传输)起到充分的屏蔽作用，以降低射频信号的损耗。
其中，在一组连接件8中，各连接件8的耦合面831垂直于三个连接件8的排列方向。 此时，在各耦合面831的面积有限的情况下，相邻两个连接件8的耦合面831之间的耦合面积更大。
可以理解的，图5所示实施方式中，各射频传输组件80包括一组连接件8，用于实现一个天线502与射频芯片402的连接。图14所示实施方式中，各射频传输组件80包括两组连接件8，用于实现两个天线502与射频芯片402的连接。其他实施方式中，对应于图4，各射频传输组件80可包括四组连接件8，以使充电壳体20中的四个天线502能够与主机壳体10中的射频芯片402相连接。
在其他实施方式中，射频传输组件80的数量为一组时，位于中间的连接件8的两个连接端部82分别连接第一电路板60上的射频信号焊盘61和第二电路板70上的射频信号焊盘71，位于两侧的连接件8的两个连接端部82分别连接第一电路板60上的接地焊盘62和第二电路板70上的接地焊盘72。
在其他实施方式中，射频传输组件80中的各组连接件8也可包括两个连接件8。
进一步地，请参阅图15，图15是一种可能的天线经图14所示射频通路30转接后的插损的示意图。其中，测试中的天线相当于本申请中第二组天线501中的一个天线502。插损为天线的初始效率与经图14所示射频通路30转接后的转接效率之间的差值。图15的横坐标代表频率，单位为兆赫(MHz)；纵坐标代表插损，单位为分贝(dB)。图15中907代表在2500兆赫到2700兆赫范围内，天线信号经过第一组连接件8的插损；908代表在2500兆赫到2700兆赫范围内，天线信号经过第二组连接件8的插损；909代表在3400兆赫到3580兆赫范围内，天线信号经过第一组连接件8的插损；9010代表在3400兆赫到3580兆赫范围内，天线信号经过第二组连接件8的插损。由图15可知，经过射频通路30的转接后，射频通路30的插损小于2分贝，射频通路30的插损很小，使得整个系统(包括射频通路30和天线)仍可以保持较高的效率，以满足多输入输出系统在B41和B42频段的指标要求。同时，由图15也可知，信号在两组连接件8中的插损是接近的，且均能够满足多输入输出系统在B41和B42频段的指标要求。
请一并参阅图16和图17，图16是图1所示电子设备100的射频通路30在再一种实施方式中的结构示意图；图17是图16所示射频通路30的其中一组射频传输组件80的结构示意图。
图16所示射频通路30与图5所示射频通路30的区别在于：图16所示射频通路30中的其中一组射频传输组件80的连接件8为弹簧针。以下主要描述连接件8为弹簧针时与连接件8为金属弹片时所具有的不同点，相同地方则不再赘述。
射频通路30包括两组射频传输组件80。靠近第一电路板60的射频传输组件80的连接件8为弹片，靠近第二电路板70的射频传输组件80为弹簧针。
连接件8包括主体部81、两个连接端部82及耦合部83。两个连接端部82分别连接在主体部81相背的两端。耦合部83安装于主体部81的外周侧。耦合部83与主体部81一体成型，以简化连接件8的加工工序，并增加连接件8的结构强度。其他实施例中，耦合部83可通过组装方式固定连接主体部81。
其中，主体部81可大致呈圆柱状，耦合部83套设在主体部81的外侧。耦合部83包括耦合面831。耦合部83可以是大致呈内圆外方的柱体形状。“内圆外方”中的“圆”体 现在耦合部83内侧具有一个圆通孔，该圆通孔与主体部81的形状相适配。“内圆外方”中的“方”主要体现在耦合部83的外周侧面包括平整的耦合面831。例如，耦合部83包括两个耦合面831，两个耦合面831分别位于主体部81的相背两侧。此时两个耦合面831之间可通过平面或弧面连接。或者，在其他实施例中，耦合部83也可包括三个或四个耦合面831，三个或四个耦合面831可直接连接彼此，也可通过平面或弧面连接。连接件8的排布位置和数量不同时，耦合面831的排布位置及数量也不同。
一种实施例中，如图17所示，连接件8的其中一个连接端部82为顶针，另一个连接端部82为导电弹片。例如，靠近另一组射频传输组件80的连接端部82为顶针，以在主机壳体10与充电壳体20相装配时，容易抵持另一组射频传输组件80的连接件8的连接端部82。同时，露出充电壳体20的部分只有顶针的端部，使得电子设备100更为美观，同时也不易划伤用户，使得用户体验更佳。靠近第二电路板70的连接端部82为导电弹片。导电弹片可焊接在第二电路板70上，使得连接件8可靠地连接第二电路板70。
在其他实施例中，连接件8的两个连接端部82也可以均为顶针。此时，连接件8的物料数量较少。连接件8的主体部81、两个连接端部82及耦合部83可以一体成型。
其中，相邻两组射频传输组件80中的其中一组射频传输组件80的各连接件8的连接端部82具有抵持平面825，另一组射频传输组件80的各连接件8的连接端部82具有抵持触点823(也即顶针的端部)，抵持触点823抵持抵持平面825。
在其他实施例中，射频通路30中的各组射频传输组件80的连接件8的结构可以依据需要进行灵活组合，例如金属弹片与金属弹片组合、金属弹片与弹簧针组合或弹簧针与弹簧针组合。
请参阅图18，图18是基于图16所示射频通路30得到的一种可能的插损与频率的关系曲线图(也即S21曲线图)。图18的横坐标代表频率，单位为吉赫(GHz)；纵坐标代表插损，单位为分贝(dB)。由图18可知，点M1至点M2之间的曲线所在频率对应于B41频段和B42频段，点M1至点M2之间的曲线所对应的插损在0.87分贝到1.10分贝之间。故而，本申请中连接件8为弹簧针时，可通过增设耦合面831，使得应用连接件8的射频通路30在使用中的插损能够控制在一个较小的范围内，以满足多输入输出系统在B41频段和B42频段的指标要求。
在本申请中，射频传输组件80通过在连接件8(可以为金属弹片或弹簧针)上设置具有耦合面831的耦合部83，且相邻两个连接件8的耦合面831相对设置且彼此之间形成电容器，以增加相邻两个连接件8之间的耦合面积，从而降低阻抗，使得射频传输组件80的阻抗可控，射频传输组件80的阻抗与第一电路板60和第二电路板70上的射频传输线的阻抗相匹配，有利于射频通路30实现阻抗匹配，从而有效传递射频信号。同时，射频传输组件80也能够降低射频通路30的插损，提高射频通路30的传输效率。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (17)

  1. 一种射频传输组件，其特征在于，包括至少两个连接件，各所述连接件均包括主体部、两个连接端部及耦合部，所述两个连接端部分别连接于所述主体部的两端，所述耦合部连接于所述主体部的中部，所述耦合部具有耦合面，相邻两个所述连接件的所述耦合面相对设置且彼此之间形成电容器。
  2. 如权利要求1所述的射频传输组件，其特征在于，相邻两个所述连接件的所述耦合面彼此平行。
  3. 如权利要求1或2所述的射频传输组件，其特征在于，所述耦合部包括两个所述耦合面，两个所述耦合面分别位于所述主体部的相背两侧。
  4. 如权利要求3所述的射频传输组件，其特征在于，所述射频传输组件包括一组或多组所述连接件，各组所述连接件包括三个在同一方向上排列的所述连接件，位于中间的所述连接件的两个所述耦合面分别与位于两侧的所述连接件的所述耦合面相对设置。
  5. 如权利要求4所述的射频传输组件，其特征在于，位于中间的所述连接件用于传输射频信号，位于两侧的所述连接件用于传输地信号，位于中间的所述连接件的两个所述耦合面分别完全正对位于两侧的所述连接件的所述耦合面。
  6. 如权利要求4或5所述的射频传输组件，其特征在于，在一组所述连接件中，各所述连接件的所述耦合面垂直于三个所述连接件的排列方向。
  7. 如权利要求1至6中任意一项所述的射频传输组件，其特征在于，所述连接件为金属弹片，所述耦合部相对所述主体部弯折。
  8. 如权利要求7所述的射频传输组件，其特征在于，所述耦合部与所述主体部之间形成85°至95°的角。
  9. 如权利要求7或8所述的射频传输组件，其特征在于，各所述连接端部均包括第一端、第二端及连接在所述第一端与所述第二端之间的中部，所述第一端固接所述主体部，所述第二端悬空设置，所述中部相对所述第一端及所述第二端向远离所述主体部的方向凸出。
  10. 如权利要求1至6中任意一项所述的射频传输组件，其特征在于，所述连接件为弹簧针，所述耦合部安装于所述主体部的外周侧。
  11. 如权利要求10所述的射频传输组件，其特征在于，两个所述连接端部均为顶针；或，其中一个所述连接端部为顶针，另一个所述连接端部为导电弹片。
  12. 如权利要求7至11中任意一项所述的射频传输组件，其特征在于，所述耦合部与所述主体部一体成型。
  13. 一种电子设备，其特征在于，包括第一电路板、第二电路板及权利要求1至12中任意一项所述的射频传输组件，所述射频传输组件电连接在所述第一电路板与所述第二电路板之间。
  14. 如权利要求13所述的电子设备，其特征在于，所述第一电路板上设有射频信号焊盘和接地焊盘，所述射频传输组件的相邻两个所述连接件中的其中一个所述连接件的连接端部接触所述射频信号焊盘，另一个所述连接件的连接端部接触所述接地焊盘。
  15. 如权利要求13或14所述的电子设备，其特征在于，所述射频传输组件的数量为 至少两组，至少两组所述射频传输组件串联在所述第一电路板与所述第二电路板之间。
  16. 如权利要求15所述的电子设备，其特征在于，相邻两组所述射频传输组件中的其中一组所述射频传输组件的各所述连接件的连接端部具有抵持平面，另一组所述射频传输组件的各所述连接件的连接端部具有抵持触点，所述抵持触点抵持所述抵持平面。
  17. 如权利要求13至16中任意一项所述的电子设备，其特征在于，所述电子设备还包括主机壳体、第一组天线、射频芯片、充电壳体及第二组天线，所述第一电路板、所述第一组天线及所述射频芯片收容于所述主机壳体，所述射频芯片电连接所述第一电路板，所述第一组天线电连接所述射频芯片，所述第二电路板和所述第二组天线收容于所述充电壳体，所述第二组天线电连接所述第二电路板，所述射频传输组件安装于所述主机壳体和/或所述充电壳体。
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