WO2020033475A1 - Polymers for use in electronic devices - Google Patents

Polymers for use in electronic devices Download PDF

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Publication number
WO2020033475A1
WO2020033475A1 PCT/US2019/045403 US2019045403W WO2020033475A1 WO 2020033475 A1 WO2020033475 A1 WO 2020033475A1 US 2019045403 W US2019045403 W US 2019045403W WO 2020033475 A1 WO2020033475 A1 WO 2020033475A1
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Prior art keywords
formula
conversion process
thermal conversion
unsubstituted
polyamic acid
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PCT/US2019/045403
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English (en)
French (fr)
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Viacheslav V. DIEV
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Dupont Electronics, Inc.
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Priority to JP2021506711A priority Critical patent/JP7491902B2/ja
Priority to KR1020217006454A priority patent/KR20210031519A/ko
Priority to CN201980059665.0A priority patent/CN112673011A/zh
Publication of WO2020033475A1 publication Critical patent/WO2020033475A1/en

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • C07D491/12—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains three hetero rings
    • C07D491/14—Ortho-condensed systems
    • C07D491/147—Ortho-condensed systems the condensed system containing one ring with oxygen as ring hetero atom and two rings with nitrogen as ring hetero atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/58—[b]- or [c]-condensed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present disclosure relates to novel polymeric compounds.
  • the disclosure further relates to methods for preparing such polymeric compounds and electronic devices having at least one layer comprising these materials.
  • Polyimides represent a class of polymeric compounds that has been widely used in a variety of electronics applications. They can serve as a flexible replacement for glass in electronic display devices provided that they have suitable properties. These materials can function as a component of Liquid Crystal Displays (“LCDs”), where their modest consumption of electrical power, light weight, and layer flatness are critical properties for effective utility.
  • LCDs Liquid Crystal Displays
  • Other uses in electronic display devices that place such parameters at a premium include device substrates, substrates for color filter sheets, cover films, touch screen panels, and others.
  • OLEDs organic light emitting diode
  • OLEDs are promising for many display applications because of their high power conversion efficiency and applicability to a wide range of end-uses. They are increasingly being used in cell phones, tablet devices, handheld / laptop computers, and other commercial products. These applications call for displays with high information content, full color, and fast video rate response time in addition to low power consumption.
  • Polyimide films generally possess sufficient thermal stability, high glass transition temperature, and mechanical toughness to merit consideration for such uses. Also, polyimides generally do not develop haze when subject to repeated flexing, so they are often preferred over other transparent substrates like polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) in flexible display applications.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • Polyimides are generally stiff, highly aromatic materials; and the polymer chains tend to orient in the plane of the film / coating as the film / coating is being formed. This leads to differences in refractive index in the parallel vs. perpendicular directions of the film (birefringence) which produces optical retardation that can negatively impact display
  • New monomers with novel structural features can potentially lead to polyimides with improved properties for specific applications.
  • Q 1 is selected from the group consisting of H, R 1 , and R 9 ;
  • Q 2 is selected from the group consisting of H, R 2 , and R 9 ;
  • Q 3 is selected from the group consisting of R 3 and R 9 ;
  • Q 4 is selected from the group consisting of R 4 and R 9 ;
  • Q 5 is selected from the group consisting of R 7 and R 9 ;
  • R 1 and R 2 are the same or different at each occurrence and are selected from the group consisting of F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, and unsubstituted or substituted aryloxy;
  • R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different and are selected from the group consisting of H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, and unsubstituted or substituted aryloxy;
  • R 8 is selected from the group consisting of alkyl, silyl, unsubstituted or substituted hydrocarbon aryl, and unsubstituted or substituted heteroaryl;
  • R 9 is the same or different at each occurrence and is selected from the group consisting of NH 2 and ArNH 2 ;
  • Ar is the same or different at each occurrence and is an
  • R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and R b is the same or different at each occurrence and represents one or more aromatic diamine residues;
  • R b is a diamine residue from one or more diamines having Formula I.
  • composition comprising (a) the polyamic acid having a repeat unit of Formula II and (b) a high-boiling, aprotic solvent.
  • R a and R b are as defined in Formula II.
  • polyimide film comprising a polyimide having the repeat unit of Formula III.
  • the flexible replacement for glass is a polyimide film comprising a polyimide having the repeat unit of Formula III.
  • an electronic device having at least one layer comprising a polyimide film comprising a polyimide having the repeat unit of Formula III.
  • an organic electronic device such as an OLED, wherein the organic electronic device contains a flexible
  • FIG. 1 includes an illustration of one example of a polyimide film that can act as a flexible replacement for glass.
  • FIG. 2 includes an illustration of one example of an electronic device that includes a flexible replacement for glass.
  • composition comprising (a) the polyamic acid having repeat units of Formula II and (b) a high-boiling, aprotic solvent.
  • the flexible replacement for glass is a polyimide film comprising a polyimide having the repeat unit of Formula III.
  • an electronic device having at least one layer comprising a polyimide film comprising a polyimide having the repeat unit of Formula III.
  • an organic electronic device such as an OLED, wherein the organic electronic device contains a flexible
  • R, R a , R b , R’, R are generic designations and may be the same as or different from those defined in the formulas.
  • alignment layer is intended to mean a layer of organic polymer in a liquid-crystal device (LCD) that aligns the molecules closest to each plate as a result of its being rubbed onto the LCD glass in one preferential direction during the LCD manufacturing process.
  • LCD liquid-crystal device
  • alkyl includes branched and straight- chain saturated aliphatic hydrocarbon groups. Unless otherwise indicated, the term is also intended to include cyclic groups. Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, isobutyl, secbutyl, tertbutyl, pentyl, isopentyl, neopentyl, cyclopentyl, hexyl, cyclohexyl, isohexyl and the like.
  • the term“alkyl” further includes both substituted and
  • the alkyl group may be mono-, di- and tri-substituted.
  • One example of a substituted alkyl group is trifluoromethyl.
  • Other substituted alkyl groups are formed from one or more of the substituents described herein.
  • alkyl groups have 1 to 20 carbon atoms.
  • the group has 1 to 6 carbon atoms.
  • the term is intended to include heteroalkyl groups. Heteroalkyl groups may have from 1-20 carbon atoms.
  • aprotic refers to a class of solvents that lack an acidic hydrogen atom and are therefore incapable of acting as hydrogen donors.
  • Common aprotic solvents include alkanes, carbon tetrachloride (CCI4), benzene, dimethyl formamide (DMF), N-methyl-2-Pyrrolidone (NMP), dimethylacetamide (DMAc), and many others.
  • aromatic compound is intended to mean an organic compound comprising at least one unsaturated cyclic group having 4n+2 delocalized pi electrons.
  • the term is intended to encompass both aromatic compounds having only carbon and hydrogen atoms, and heteroaromatic compounds wherein one or more of the carbon atoms within the cyclic group has been replaced by another atom, such as nitrogen, oxygen, sulfur, or the like.
  • aryl or“aryl group” a moiety formed by removal of one or more hydrogen (“H”) or deuterium (“D”) from an aromatic compound.
  • the aryl group may be a single ring (monocyclic) or have multiple rings (bicyclic, or more) fused together or linked covalently.
  • A“hydrocarbon aryl” has only carbon atoms in the aromatic ring(s).
  • A“heteroaryl” has one or more heteroatoms in at least one aromatic ring.
  • hydrocarbon aryl groups have 6 to 60 ring carbon atoms; in some embodiments, 6 to 30 ring carbon atoms.
  • heteroaryl groups have from 4-50 ring carbon atoms; in some
  • alkoxy is intended to mean the group -OR, where R is alkyl.
  • aryloxy is intended to mean the group -OR, where R is aryl.
  • R’ and R is independently an optionally substituted alkyl, cycloalkyl, or aryl group.
  • R’ and R together with the nitrogen atom to which they are bound, can form a ring system in certain embodiments.
  • Substituents may also be crosslinking groups.
  • amine is intended to mean a compound that contains a basic nitrogen atom with a lone pair, where lone pair refers to a set of two valence electrons that are not shared with another atom.
  • amino refers to the functional group -NH2, -NHR, or -NR2, where R is the same or different at each occurrence and can be an alkyl group or an aryl group.
  • diamine is intended to mean a compound that contains two basic nitrogen atoms with associated lone pairs.
  • polyamine is intended to mean a compound that contains two or more basic nitrogen atoms with associated lone pairs.
  • aromatic diamine is intended to mean an aromatic compound having two amino groups.
  • aromatic polyamine is intended to mean an aromatic compound having two or more amino groups.
  • term“bent diamine” is intended to mean a diamine wherein the two basic nitrogen atoms and associated lone pairs are asymmetrically disposed about the center of symmetry of the corresponding compound or functional group, e.g. m- phenylenediamine:
  • aromatic diamine residue is intended to mean the moiety bonded to the two amino groups in an aromatic diamine.
  • aromatic polyamine residue is intended to mean the moiety bonded to the two or more amino groups in an aromatic polyamine.
  • aromatic diisocyanate residue is intended to mean the moiety bonded to the two isocyanate groups in an aromatic diisocyanate compound.
  • aromatic polyisocyanate residue is intended to mean the moiety bonded to the two or more isocyanate groups in an aromatic
  • diamine residue and“diisocyanate residue” are intended to mean the moiety bonded to two amino groups or two isocyanate groups, respectively, where the moiety is aliphatic or aromatic.
  • polyamine residue and“polyisocyanate residue” are intended to mean the moiety bonded to two or more amino groups or two or more isocyanate groups, respectively, where the moiety is aliphatic or aromatic.
  • b * is intended to mean the b * axis in the CIELab Color Space that represents the yellow / blue opponent colors. Yellow is represented by positive b * values, and blue is represented by negative b * values. Measured b * values may be affected by solvent, particularly since solvent choice may affect color measured on materials exposed to high- temperature processing conditions. This may arise as the result of inherent properties of the solvent and/or properties associated with low levels of impurities contained in various solvents. Particular solvents are often preselected to achieve desired b * values for a particular application.
  • birefringence is intended to mean the difference in the refractive index in different directions in a polymer film or coating. This term usually refers to the difference between the x- or y-axis (in-plane) and the z-axis (out-of-plane) refractive indices.
  • charge transport when referring to a layer, material, member, or structure is intended to mean such layer, material, member, or structure facilitates migration of such charge through the thickness of such layer, material, member, or structure with relative efficiency and small loss of charge.
  • Hole transport materials facilitate positive charge; electron transport materials facilitate negative charge.
  • light-emitting materials may also have some charge transport properties, the term “charge transport layer, material, member, or structure” is not intended to include a layer, material, member, or structure whose primary function is light emission.
  • compound is intended to mean an electrically uncharged substance made up of molecules that further include atoms, wherein the atoms cannot be separated from their corresponding molecules by physical means without breaking chemical bonds.
  • the term is intended to include oligomers and polymers.
  • linear coefficient of thermal expansion (DI_ / Lo) / DT
  • Measured CTE values disclosed herein are made via known methods during the first or second heating scan.
  • the understanding of the relative expansion / contraction characteristics of materials can be an important consideration in the fabrication and/or reliability of electronic devices.
  • the term“dopant” is intended to mean a material, within a layer including a host material, that changes the electronic characteristic(s) or the targeted wavelength(s) of radiation emission, reception, or filtering of the layer compared to the electronic characteristic(s) or the wavelength(s) of radiation emission, reception, or filtering of the layer in the absence of such material.
  • electroactive refers to a layer or a material, is intended to indicate a layer or material which electronically facilitates the operation of the device.
  • electroactive materials include, but are not limited to, materials which conduct, inject, transport, or block a charge, where the charge can be either an electron or a hole, or materials which emit radiation or exhibit a change in concentration of electron-hole pairs when receiving radiation.
  • inactive materials include, but are not limited to, planarization materials, insulating materials, and environmental barrier materials.
  • tensile elongation or“tensile strain” is intended to mean the percentage increase in length that occurs in a material before it breaks under an applied tensile stress. It can be measured, for example, by ASTM Method D882.
  • the prefix“fluoro” is intended to indicate that one or more hydrogens in a group have been replaced with fluorine.
  • glass transition temperature is intended to mean the temperature at which a reversible change occurs in an amorphous polymer or in amorphous regions of a semi crystalline polymer where the material changes suddenly from a hard, glassy, or brittle state to one that is flexible or elastomeric. Microscopically, the glass transition occurs when normally-coiled, motionless polymer chains become free to rotate and can move past each other. T g ’s may be measured using differential scanning calorimetry (DSC), thermo-mechanical analysis (TMA), or dynamic-mechanical analysis (DMA), or other methods.
  • DSC differential scanning calorimetry
  • TMA thermo-mechanical analysis
  • DMA dynamic-mechanical analysis
  • hetero indicates that one or more carbon atoms have been replaced with a different atom.
  • the heteroatom is O, N, S, or combinations thereof.
  • high-boiling is intended to indicate a boiling point greater than 130°C.
  • the term“host material” is intended to mean a material to which a dopant is added.
  • the host material may or may not have electronic characteristic(s) or the ability to emit, receive, or filter radiation. In some embodiments, the host material is present in higher concentration.
  • isothermal weight loss is intended to mean a material’s property that is directly related to its thermal stability. It is generally measured at a constant temperature of interest via thermogravimetric analysis (TGA). Materials that have high thermal stability generally exhibit very low percentages of isothermal weight loss at the required use or processing temperature for the desired period of time and can therefore be used in applications at these temperatures without significant loss of strength, outgassing, and/or change in structure.
  • TGA thermogravimetric analysis
  • laser particle counter test refers to a method used to assess the particle content of polyamic acid and other polymeric solutions whereby a representative sample of a test solution is spin coated onto a 5” silicon wafer and soft baked / dried. The film thus prepared is evaluated for particle content by any number of standard measurement techniques. Such techniques include laser particle detection and others known in the art.
  • liquid composition is intended to mean a liquid medium in which a material is dissolved to form a solution, a liquid medium in which a material is dispersed to form a dispersion, or a liquid medium in which a material is suspended to form a suspension or an emulsion.
  • matrix is intended to mean a foundation on which one or more layers is deposited in the formation of, for example, an electronic device.
  • Non-limiting examples include glass, silicon, and others.
  • the term“1 % TGA Weight Loss” is intended to mean the temperature at which 1 % of the original polymer weight is lost due to decomposition (excluding absorbed water).
  • optical retardation is intended to mean the difference between the average in-plane refractive index and the out-of- plane refractive index (i.e. , the birefringence), this difference then being multiplied by the thickness of the film or coating.
  • Optical retardation is typically measured for a given frequency of light, and the units are reported in nanometers.
  • organic electronic device or sometimes“electronic device” is herein intended to mean a device including one or more organic semiconductor layers or materials.
  • particle content is intended to mean the number or count of insoluble particles that is present in a solution. Measurements of particle content can be made on the solutions themselves or on finished materials (pieces, films, etc.) prepared from those films. A variety of optical methods can be used to assess this property.
  • photoactive refers to a material or layer that emits light when activated by an applied voltage (such as in a light emitting diode or chemical cell), that emits light after the absorption of photons (such as in down-converting phosphor devices), or that responds to radiant energy and generates a signal with or without an applied bias voltage (such as in a photodetector or a photovoltaic cell).
  • an applied voltage such as in a light emitting diode or chemical cell
  • photons such as in down-converting phosphor devices
  • an applied bias voltage such as in a photodetector or a photovoltaic cell
  • polyamic acid solution refers to a solution of a polymer containing amic acid units that have the capability of intramolecular cyclization to form imide groups.
  • polyanhydride refers to a compound having two or more acid anhydride groups.
  • polyanhydride residue is intended to mean the moiety bonded to the two or more anhydride groups. This is further illustrated below.
  • polyimide refers to condensation polymers resulting from the reaction of one or more polyfunctional carboxylic acid components with one or more primary polyamines or polyisocyanates. They contain the imide structure -CO-NR-CO- as a linear or heterocyclic unit along the main chain of the polymer backbone.
  • the term“satisfactory,” when regarding a materials property or characteristic, is intended to mean that the property or characteristic fulfills all requirements / demands for the material in-use.
  • an isothermal weight loss of less than 1 % at 350 °C for 3 hours in nitrogen can be viewed as a non-limiting example of a“satisfactory” property in the context of the polyimide films disclosed herein.
  • soft-baking is intended to mean a process commonly used in electronics manufacture wherein coated materials are heated to drive off solvents and solidify a film. Soft-baking is commonly performed on a hot plate or in exhausted oven at temperatures between 90 °C and 1 10 °C as a preparation step for subsequent thermal treatment of coated layers or films.
  • substrate refers to a base material that can be either rigid or flexible and may include one or more layers of one or more materials, which can include, but are not limited to, glass, polymer, metal or ceramic materials or combinations thereof.
  • the substrate may or may not include electronic components, circuits, or conductive members.
  • siloxane refers to the group R3SiOR2Si-, where R is the same or different at each occurrence and is H, C1 -20 alkyl, fluoroalkyl, or aryl. In some embodiments, one or more carbons in an R alkyl group are replaced with Si.
  • silicoxy refers to the group R 3 S1O-, where R is the same or different at each occurrence and is H, C1-20 alkyl, fluoroalkyl, or aryl.
  • sil refers to the group R 3 S1-, where R is the same or different at each occurrence and is H, C1 -20 alkyl, fluoroalkyl, or aryl. In some embodiments, one or more carbons in an R alkyl group are replaced with Si.
  • spin coating is intended to mean a process used to deposit uniform thin films onto flat substrates. Generally, a small amount of coating material is applied on the center of the substrate, which is either spinning at low speed or not spinning at all. The substrate is then rotated at specified speeds in order to spread the coating material uniformly by centrifugal force.
  • spiro group refers to a group having a bicyclic organic portion where the two rings have a single atom in common.
  • the rings can be different in nature or identical, and may form part of other ring systems.
  • the common atom has two bonds in each ring and is called the spiroatom.
  • the spiroatom is selected from the group consisting of C and Si.
  • tensile modulus is intended to mean the measure of the stiffness of a solid material that defines the initial relationship between the stress (force per unit area) and the strain (proportional deformation) in a material like a film. Commonly used units are giga pascals (GPa).
  • tetracarboxylic acid component is intended to mean any one or more of the following: a tetracarboxylic acid, a tetracarboxylic acid monoanhydride, a tetracarboxylic acid dianhydride, a tetracarboxylic acid monoester, and a tetracarboxylic acid diester.
  • tetracarboxylic acid component residue is intended to mean the moiety bonded to the four carboxy groups in a tetracarboxylic acid component. This is further illustrated below.
  • transmittance refers to the percentage of light of a given wavelength impinging on a film that passes through the film so as to be detectable on the other side.
  • Light transmittance measurements in the visible region are particularly useful for characterizing film-color characteristics that are most important for understanding the properties-in-use of the polyimide films disclosed herein.
  • yellowness index refers to the magnitude of yellowness relative to a standard.
  • a positive value of Yl indicates the presence, and magnitude, of a yellow color. Materials with a negative Yl appear bluish.
  • Yl can be solvent dependent.
  • the magnitude of color introduced using DMAC as a solvent may be different than that introduced using NMP as a solvent. This may arise as the result of inherent properties of the solvent and/or properties associated with low levels of impurities contained in various solvents. Particular solvents are often preselected to achieve desired Yl values for a particular application.
  • a substituent bond passes through one or more rings as shown below,
  • substituent R may be bonded at any available position on the one or more rings.
  • the phrase“adjacent to,” when used to refer to layers in a device, does not necessarily mean that one layer is immediately next to another layer.
  • the phrase“adjacent R groups,” is used to refer to R groups that are next to each other in a chemical formula (i.e. , R groups that are on atoms joined by a bond). Exemplary adjacent R groups are shown below:
  • “or” refers to an inclusive or and not to an exclusive or.
  • a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
  • the polyamine described herein has Formula I wherein:
  • Q 1 is selected from the group consisting of H, R 1 , and R 9 ;
  • Q 2 is selected from the group consisting of H, R 2 , and R 9 ;
  • Q 3 is selected from the group consisting of R 3 and R 9 ;
  • Q 4 is selected from the group consisting of R 4 and R 9 ;
  • Q 5 is selected from the group consisting of R 7 and R 9 ;
  • R 1 and R 2 are the same or different at each occurrence and are selected from the group consisting of F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, and unsubstituted or substituted aryloxy;
  • R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different and are selected from the group consisting of H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, and unsubstituted or substituted aryloxy;
  • R 8 is selected from the group consisting of alkyl, silyl, unsubstituted or substituted hydrocarbon aryl, and unsubstituted or substituted heteroaryl;
  • R 9 is the same or different at each occurrence and is selected from the group consisting of NH 2 and ArNH 2 ;
  • Ar is the same or different at each occurrence and is an
  • Q 1 and Q 2 are R 9 .
  • Q 3 and Q 4 are R 9 .
  • Q 1 and Q 5 are R 9 .
  • Q 1 is R 9 .
  • Q 1 is H.
  • Q 1 is F.
  • Q 1 is CN.
  • Q 1 is a C 1-20 alkyl; in some embodiments C 1 -10 alkyl.
  • Q 1 is a C 1-20 fluoroalkyl; in some embodiments C 1-10 fluoroalkyl.
  • Q 1 is a C 1-20
  • perfluorofluoroalkyl in some embodiments C 1-10 perfluoroalkyl.
  • Q 1 is a C 1-20 alkoxy; in some embodiments C 1 -10 alkoxy.
  • Q 1 is a C 1-20 fluoroalkoxy; in some embodiments C 1-10 fluoroalkoxy.
  • Q 1 is a C 1-20 perfluoroalkoxy; in some embodiments C 1-10 perfluoroalkoxy.
  • Q 1 is SiH 3 .
  • Q 1 is a C 1-12 silyl; in some embodiments C 3-6 silyl.
  • Q 1 is a C 1-12 siloxy; in some embodiments C 3-6 siloxy.
  • Q 1 is an unsubstituted or substituted C 6-30 hydrocarbon aryl; in some embodiments, an
  • Q 1 is an unsubstituted or substituted C 3-30 heteroaryl; in some embodiments, an unsubstituted or substituted C 3-18 heteroaryl; in some embodiments, unsubstituted. In some embodiments of Formula I, Q 1 is an unsubstituted or substituted C 6-30 hydrocarbon aryloxy; in some embodiments, an unsubstituted or substituted Ce-ie hydrocarbon aryloxy; in some
  • any of the above hydrocarbon aryl, heteroaryl, and aryloxy groups are further substituted with one or more substituents selected from the group consisting of F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, and siloxy.
  • a 1.
  • a 2.
  • a > 0 and at least one R 1 is F.
  • a > 0 and at least one R 1 is CN.
  • a > 0 and at least one R 1 is a
  • C 1-20 alkyl in some embodiments C 1-10 alkyl.
  • a > 0 and at least one R 1 is a C 1-20 fluoroalkyl; in some embodiments C 1-10 fluoroalkyl.
  • a > 0 and at least one R 1 is a C 1-20 perfluorofluoroalkyl; in some embodiments C 1 -10 peril uoroalkyl.
  • a > 0 and at least one R 1 is a C 1-20 alkoxy; in some embodiments C 1 -10 alkoxy.
  • a > 0 and at least one R 1 is a C 1-20 fluoroalkoxy; in some embodiments C 1-10 fluoroalkoxy.
  • a > 0 and at least one R 1 is a C 1-20 perfluoroalkoxy; in some embodiments C 1-10 perfluoroalkoxy.
  • a > 0 and at least one R 1 is
  • a > 0 and at least one R 1 is a C 1-12 silyl; in some embodiments C 3-6 silyl. In some embodiments of Formula I, a > 0 and at least one R 1 is a Ci- 12 siloxy; in some embodiments C 3-6 siloxy.
  • a > 0 and at least one R 1 is an unsubstituted or substituted C 6-30 hydrocarbon aryl; in some embodiments, an unsubstituted or substituted Ce-ie hydrocarbon aryl; in some
  • a > 0 and at least one R 1 is an unsubstituted or substituted C 3-30 heteroaryl; in some embodiments, an unsubstituted or substituted C 3-18 heteroaryl; in some embodiments, unsubstituted.
  • a > 0 and at least one R 1 is an unsubstituted or substituted C 6-30 hydrocarbon aryloxy; in some
  • an unsubstituted or substituted Ce-ie hydrocarbon aryloxy in some embodiments, unsubstituted.
  • any of the above hydrocarbon aryl, heteroaryl, and aryloxy groups are further substituted with one or more substituents selected from the group consisting of F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, and siloxy.
  • b 1.
  • b > 0 and at least one R 2 is CN.
  • C 1-20 alkyl in some embodiments C 1-10 alkyl.
  • R 2 is a C 1-20 fluoroalkyl; in some embodiments C 1-10 fluoroalkyl.
  • R 2 is a C 1-20 perfluorofluoroalkyl; in some embodiments C 1 -10 peril uoroalkyl.
  • b > 0 and at least one R 2 is a C 1-20 alkoxy; in some embodiments C 1 -10 alkoxy. In some embodiments of Formula I, b > 0 and at least one R 2 is a C 1-20 fluoroalkoxy; in some embodiments C 1-10 fluoroalkoxy.
  • R 2 is a C 1-20 perfluoroalkoxy; in some embodiments C 1-10 perfluoroalkoxy.
  • R 2 is a Ci- 12 silyl; in some embodiments C 3-6 silyl.
  • R 2 is a C 1-12 siloxy; in some embodiments C 3-6 siloxy.
  • R 2 is an unsubstituted or substituted C 6-30 hydrocarbon aryl; in some embodiments, an unsubstituted or substituted Ce-ie hydrocarbon aryl; in some
  • R 2 is an unsubstituted or substituted C 3-30 heteroaryl; in some embodiments, an unsubstituted or substituted C 3-18 heteroaryl; in some embodiments, unsubstituted.
  • R 2 is an unsubstituted or substituted C 6-30 hydrocarbon aryloxy
  • an unsubstituted or substituted Ce-ie hydrocarbon aryloxy in some embodiments, unsubstituted.
  • any of the above hydrocarbon aryl, heteroaryl, and aryloxy groups are further substituted with one or more substituents selected from the group consisting of F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, and siloxy.
  • R 5 R 6 .
  • R 5 1 R 6 In some embodiments of Formula I, R 5 1 R 6 .
  • R 5 s H In some embodiments of Formula I, R 5 s H.
  • R 5 s F In some embodiments of Formula I, R 5 s F.
  • R 5 s CN In some embodiments of Formula I, R 5 s CN.
  • R 5 s a C 1-20 alkyl; in some embodiments C 1 -10 alkyl. In some embodiments of Formula I, R 5 is a C 1-20 fluoroalkyl; in some embodiments C 1-10 fluoroalkyl.
  • R 5 is a C 1-20
  • perfluorofluoroalkyl in some embodiments C 1-10 perfluoroalkyl.
  • R 5 is a C 1-20 alkoxy; in some embodiments C 1 -10 alkoxy.
  • R 5 is a C 1-20 fluoroalkoxy; in some embodiments C 1-10 fluoroalkoxy.
  • R 5 is a C 1-20 perfluoroalkoxy; in some embodiments C 1-10 perfluoroalkoxy.
  • R 5 is SiH 3 .
  • R 5 is a C 1-12 silyl; in some embodiments C 3-6 silyl.
  • R 5 is a C 1-12 siloxy; in some embodiments C 3-6 siloxy.
  • R 5 is an unsubstituted or substituted C 6-30 hydrocarbon aryl; in some embodiments, a C 6-18 hydrocarbon aryl; in some embodiments, unsubstituted.
  • R 5 is an unsubstituted or substituted C 3-30 heteroaryl; in some embodiments, a C 3-18 heteroaryl; in some embodiments, unsubstituted.
  • R 5 is an unsubstituted or substituted C 6-30 hydrocarbon aryloxy; in some embodiments, a C 6-18 hydrocarbon aryloxy; in some embodiments, unsubstituted.
  • any of the above hydrocarbon aryl, heteroaryl, and aryloxy groups are further substituted with one or more substituents selected from the group consisting of F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, and siloxy.
  • R 8 is a C 1-20 alkyl; in some embodiments C 1 -10 alkyl.
  • R 8 is a C 1-12 silyl; in some embodiments C 3-6 silyl. In some embodiments of Formula I, R 8 is an unsubstituted or substituted C 6-30 hydrocarbon aryl; in some embodiments, a Ce-ie hydrocarbon aryl; in some embodiments, unsubstituted.
  • R 8 is an unsubstituted or substituted C 3-30 heteroaryl; in some embodiments, a C 3-18 heteroaryl; in some embodiments, unsubstituted.
  • any of the above hydrocarbon aryl and heteroaryl groups are further substituted with one or more substituents selected from the group consisting of F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, and siloxy.
  • two R 9 groups are present and are the same.
  • two R 9 groups are present and are different.
  • three R 9 groups are present and are all the same. In some embodiments, two or three of the R 9 groups are different.
  • R 9 groups are present and are all the same. In some embodiments, two, three, or four of the R 9 groups are different.
  • R 9 groups are present and are all the same. In some embodiments, two, three, four, or five of the R 9 groups are different.
  • At least one R 9 is NH 2 .
  • At least one R 9 is AGNH 2 .
  • At least one R 9 is ArNH 2 , where Ar has Formula a
  • R 10 and R 11 are the same or different at each occurrence and are selected from the group consisting of F, CN, alkyl, fluoroalkyl, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, alkoxy, fluoroalkoxy, unsubstituted or substituted aryloxy, silyl, and siloxy, where adjacent R 10 and/or R 11 groups may be joined together to form a fused ring;
  • p and q are the same or different and are an integer from 0-4; s is an integer from 0-3; and
  • Ar is selected from the group consisting of phenyl, biphenyl, and naphthyl, which can be unsubstituted or substituted.
  • Ar has at least one substituent selected from the group consisting of F, alkyl, fluoroalkyl, alkoxy, and fluoroalkoxy.
  • the polyamine has Formula IA
  • R 1 through R 9 , a, and b are as defined in Formula I. All of the above-described embodiments for R 1 through R 9 , a, and b in Formula I, apply equally to R 1 through R 9 , a, and b in Formula IA.
  • the polyamine has Formula IB
  • R 1 , R 2 , R 5 through R 9 , a, and b are as defined in Formula I. All of the above-described embodiments for R 1 , R 2 , R 5 through R 9 , a, and b in Formula I, apply equally to R 1 , R 2 , R 5 through R 9 , a, and b in Formula IB.
  • the polyamine has Formula IC
  • R 1 through R 6 , R 8 , R 9 , a, and b are as defined in Formula I. All of the above-described embodiments for R 1 through R 6 , R 8 , R 9 , a, and b in Formula I, apply equally to R 1 through R 6 , R 8 , R 9 , a, and b in Formula IC.
  • the new compounds can be made using any technique that will yield a C-C or C-N bond.
  • a variety of such techniques are known, such as Suzuki, Yamamoto, Stille, Negishi, and metal-catalyzed C-N couplings as well as metal catalyzed and oxidative direct arylation, and Diels-Alder cycloaddition. Exemplary preparations are given in the Examples.
  • any of the above embodiments for Formula I can be combined with one or more of the other embodiments, so long as they are not mutually exclusive.
  • the skilled person would understand which embodiments were mutually exclusive and would thus readily be able to determine the combinations of embodiments that are contemplated by the present application.
  • the polyamic acid described herein is the reaction product of one or more polyanhydrides with one or more polyamines, wherein 10-100 mol% of the one or more polyamines have Formula I.
  • a single polyamine having Formula I is reacted.
  • two different polyamines having Formula I are reacted.
  • polyamic acid In some embodiments of the polyamic acid, three different polyamines having Formula I are reacted. In some embodiments of the polyamic acid, four different polyamines having Formula I are reacted.
  • 20-100 mol% of the one or more polyamines have Formula I; in some embodiments, 30-100 mol%; in some embodiments, 40-100 mol%; in some embodiments, 50- 100 mol%; in some embodiments, 60-100 mol%; in some embodiments, 70-100 mol%; in some embodiments, 80-100 mol%; in some
  • 90-100 mol% in some embodiments, 100%.
  • At least one additional polyamine is reacted with the polyamine(s) having Formula I.
  • one additional polyamine is reacted with the polyamine(s) having Formula I.
  • two additional polyamines are reacted with the polyamine(s) having Formula I.
  • polyamic acid In some embodiments of the polyamic acid, three additional polyamines are reacted with the polyamine(s) having Formula I.
  • polyamic acid In some embodiments of the polyamic acid, four additional polyamines are reacted with the polyamine(s) having Formula I.
  • the polyamic acid has a repeat unit structure of Formula II
  • R a is the same or different at each occurrence and represents one or more tetracarboxylic acid residues
  • R b is the same or different at each occurrence and represents one or more diamine residues
  • R a represents a single tetracarboxylic acid component residue.
  • R a represents two different tetracarboxylic acid component residues.
  • R a represents three different tetracarboxylic acid residues.
  • R a represents four different tetracarboxylic acid residues.
  • R a represents one or more tetracarboxylic acid dianhydride residues.
  • aromatic tetracarboxylic acid dianhydrides include, but are not limited to, pyromellitic dianhydride (PMDA), 3, 3', 4,4'- biphenyl tetracarboxylic dianhydride (BPDA), 4,4'-oxydiphthalic anhydride (ODPA), 4,4'-hexafluoroiso-propylidenebisphthalic polyanhydride (6FDA), 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), 3, 3', 4,4'- diphenylsulfone tetracarboxylic dianhydride (DSDA), 4,4'-bisphenol-A dianhydride (BPADA), hydroquinone diphthalic anhydride (HQDEA), ethylene glycol bis (trimellitic anhydride) (TMEG-100), 4-(2,5- dioxotetrahydrofuran-3-yl)-1 ,2,3,4-tetrahydronapt
  • R’ and R is independently an optionally substituted alkyl, cycloalkyl, or aryl group.
  • R’ and R together with the nitrogen atom to which they are bound, can form a ring system in certain embodiments.
  • Substituents may also be crosslinking groups.
  • R a represents one or more residues from tetracarboxylic acid dianhydrides selected from the group consisting of PMDA, BPDA, 6FDA, and BTDA. In some embodiments of Formula R a represents a PMDA residue.
  • Formula R a represents a BPDA residue. In some embodiments of Formula R a represents a 6FDA residue. In some embodiments of Formula R a represents a BTDA residue. In some embodiments of Formula R a represents a PMDA residue and a BPDA residue.
  • Formula R a represents a PMDA residue and a 6FDA residue.
  • Formula R a represents a PMDA residue and a BTDA residue.
  • Formula R a represents a BPDA residue and a 6FDA residue.
  • Formula R a represents a BPDA residue and a BTDA residue.
  • Formula R a represents a 6FDA residue and a BTDA residue.
  • Formula R a represents a PMDA residue a BPDA residue, and a 6FDA residue.
  • R b represents a diamine residue from one or more diamines having Formula I, as shown above.
  • 10-100 mol% of R b represents a diamine residue from one diamine having Formula I, as shown above.
  • 10-100 mol% of R b represents a diamine residue from two different diamines which both have Formula I, as shown above.
  • 10-100 mol% of R b represents a diamine residue from three different diamines which all have Formula I, as shown above.
  • 10-100 mol% of R b represents a diamine residue from four or more different diamines which all have Formula I, as shown above.
  • 20-100 mol% of R b is a residue from one or more diamines having Formula I; in some embodiments, 30- 100 mol%; in some embodiments, 40-100 mol%; in some embodiments, 50-100 mol%; in some embodiments, 60-100 mol%; in some
  • R b represents a diamine residue from one or more diamines having Formula I and at least one additional diamine residue.
  • R b represents a diamine residue from one or more diamines having Formula I and one additional diamine residue.
  • R b represent a diamine residue from one or more diamines having Formula I and two additional diamine residues.
  • R b represents a diamine residue from one or more diamines having Formula I and three additional diamine residues.
  • the one or more additional diamine residues are residues from one or more additional aromatic diamines.
  • the additional aromatic diamine is selected from the group consisting of p-phenylene diamine (PPD), 2,2'-dimethyl- 4,4'-diaminobiphenyl (m-tolidine), 3,3'-dimethyl-4,4'-diaminobiphenyl (o- tolidine), 3,3'-dihydroxy-4,4'-diaminobiphenyl (HAB), 9,9'-bis(4- aminophenyl)fluorene (FDA), o-tolidine sulfone (TSN), 2,3,5,6-tetramethyl- 1 ,4-phenylenediamine (TMPD), 2, 4-diamino-1 , 3, 5-trimethyl benzene (DAM), 3,3',5,5'-tetramethylbenzidine (3355TMB), 2,2'-bis(trifluoromethyl) benzidine (22TFMB or TFMB), 2,2-bis[4-(4-aminophenoxy)phenyl]prop
  • PPD
  • R b represents a diamine residue from one or more diamines having Formula I and the diamine residue from at least one additional diamine, where the additional diamine is selected from the group consisting of PPD, 4,4’-ODA, 3,4’-ODA, TFMB, Bis-A-AF, Bis-AT-AF, and Bis-P.
  • moieties resulting from monoanhydride monomers are present as end-capping groups.
  • the monoanhydride monomers are selected from the group consisting of phthalic anhydrides and the like and derivatives thereof.
  • the monoanhydrides are present at an amount up to 5 mol% of the total tetracarboxylic acid composition.
  • moieties resulting from monoamine monomers are present as end-capping groups.
  • the monoamine monomers are selected from the group consisting of aniline and the like and derivatives thereof.
  • the monoamines are present at an amount up to 5 mol% of the total amine composition.
  • the polyamic acid has a weight average molecular weight (Mw) greater than 100,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a weight average molecular weight (Mw) greater than 150,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a molecular weight (M w ) greater than 200,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a weight average molecular weight (Mw) greater than 250,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a weight average molecular weight (Mw) greater than 300,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a weight average molecular weight (Mw) between 100,000 and 400,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a weight average molecular weight (Mw) between 200,000 and 400,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a weight average molecular weight (M w ) between 250,000 and 350,000 based on gel permeation chromatography with polystyrene standards.
  • the polyamic acid has a weight average molecular weight (Mw) between 200,000 and 300,000 based on gel permeation chromatography with polystyrene standards.
  • any of the above embodiments for the polyamic acid can be combined with one or more of the other embodiments, so long as they are not mutually exclusive.
  • polyamic acid compositions can be designated via the notation commonly used in the art.
  • a polyamic acid having a tetracarboxylic acid component that is 100% ODPA, and a diamine component that is 90 mol% Bis-P and 10 mol% TFMB would be represented as:
  • liquid composition comprising (a) the polyamic acid having a repeat unit of Formula II, and (b) a high-boiling aprotic solvent.
  • the liquid composition is also referred to herein as the “polyamic acid solution”.
  • the high-boiling aprotic solvent has a boiling point of 150°C or higher.
  • the high-boiling aprotic solvent has a boiling point of 175°C or higher.
  • the high-boiling aprotic solvent has a boiling point of 200°C or higher.
  • the high-boiling aprotic solvent is a polar solvent. In some embodiments, the solvent has a dielectric constant greater than 20.
  • high-boiling aprotic solvents include, but are not limited to, N-methyl-2-pyrrolidone (NMP), dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), dimethyl formamide (DMF), y-butyrolactone, dibutyl carbitol, butyl carbitol acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like, and combinations thereof.
  • NMP N-methyl-2-pyrrolidone
  • DMAc dimethyl acetamide
  • DMSO dimethyl sulfoxide
  • DMF dimethyl formamide
  • y-butyrolactone dibutyl carbitol, butyl carbitol acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like, and combinations thereof.
  • the solvent is selected from the group consisting of NMP, DMAc, and DMF.
  • the solvent is NMP.
  • the solvent is N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl
  • the solvent is DMF.
  • the solvent is y-butyrolactone.
  • the solvent is dibutyl carbitol. In some embodiments of the liquid composition, the solvent is butyl carbitol acetate.
  • the solvent is diethylene glycol monoethyl ether acetate.
  • the solvent is propylene glycol monoethyl ether acetate.
  • more than one of the high-boiling aprotic solvents identified above is used in the liquid composition.
  • additional cosolvents are used in the liquid composition.
  • the liquid composition is ⁇ 1 weight % polyamic acid in > 99 weight % high-boiling aprotic solvent.
  • the liquid composition is 1 - 5 weight % polyamic acid in 95 - 99 weight % high-boiling aprotic solvent.
  • the liquid composition is 5 - 10 weight % polyamic acid in 90 - 95 weight % high-boiling aprotic solvent.
  • the liquid composition is 10 - 15 weight % polyamic acid in 85 - 90 weight % high-boiling aprotic solvent.
  • the liquid composition is 15 - 20 weight % polyamic acid in 80 - 85 weight % high-boiling aprotic solvent.
  • the liquid composition is 20 - 25 weight % polyamic acid in 75 - 80 weight % high-boiling aprotic solvent.
  • the liquid composition is 25 - 30 weight % polyamic acid in 70 - 75 weight % high-boiling aprotic solvent.
  • the liquid composition is 30 - 35 weight % polyamic acid in 65 - 70 weight % high-boiling aprotic solvent.
  • the liquid composition is 35 - 40 weight % polyamic acid in 60 - 65 weight % high-boiling aprotic solvent.
  • the liquid composition is 40 - 45 weight % polyamic acid in 55 - 60 weight % high-boiling aprotic solvent.
  • the liquid composition is 45 - 50 weight % polyamic acid in 50 - 55 weight % high-boiling aprotic solvent.
  • the liquid composition is 50 weight % polyamic acid in 50 weight % high-boiling aprotic solvent.
  • the polyamic acid solutions can optionally further contain any one of a number of additives.
  • additives can be: antioxidants, heat stabilizers, adhesion promoters, coupling agents (e.g. silanes), inorganic fillers or various reinforcing agents so long as they don’t adversely impact the desired polyimide properties.
  • the polyamic acid solutions can be prepared using a variety of available methods with respect to the introduction of the components (i.e. , the monomers and solvents). Some methods of producing a polyamic acid solution include:
  • polyanhydride components are preliminarily mixed together and then the mixture is added in portions to a solvent while stirring.
  • a polyamic acid solution can be obtained from any one of the polyamic acid solution preparation methods disclosed above.
  • the polyamic acid solution can then be filtered one or more times in order to reduce the particle content.
  • the polyimide film generated from such a filtered solution can show a reduced number of defects and thereby lead to superior performance in the electronics applications disclosed herein.
  • An assessment of the filtration efficiency can be made by the laser particle counter test wherein a representative sample of the polyamic acid solution is cast onto a 5” silicon wafer. After soft baking / drying, the film is evaluated for particle content by any number of laser particle counting techniques on instruments that are commercially available and known in the art.
  • the polyamic acid solution is prepared and filtered to yield a particle content of less than 40 particles as measured by the laser particle counter test.
  • the polyamic acid solution is prepared and filtered to yield a particle content of less than 30 particles as measured by the laser particle counter test.
  • the polyamic acid solution is prepared and filtered to yield a particle content of less than 20 particles as measured by the laser particle counter test.
  • the polyamic acid solution is prepared and filtered to yield a particle content of less than 10 particles as measured by the laser particle counter test. In some embodiments, the polyamic acid solution is prepared and filtered to yield particle content of between 2 particles and 8 particles as measured by the laser particle counter test.
  • the polyamic acid solution is prepared and filtered to yield particle content of between 4 particles and 6 particles as measured by the laser particle counter test.
  • polyimide resulting from imidization of the above-described polyamic acid.
  • imidization is meant intramolecular cyclization of the amic acid groups to form imide groups.
  • thermal imidization is used.
  • chemical imidization is used.
  • a combination of thermal and chemical imidization is used.
  • the polyimide has a repeat unit structure of Formula III
  • R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and R b is the same or different at each occurrence and represents one or more aromatic diamine residues;
  • R b is a residue from one or more diamines having Formula I.
  • Polyimides can be made from any suitable polyimide precursor such as a polyamic acid, a polyamic acid ester, a polyisoimide, and a polyamic acid salt.
  • polyimide film wherein the polyimide has a repeat unit structure of Formula III, as described above.
  • Polyimide films can be made by coating a polyimide precursor onto a substrate and subsequently imidizing. This can be accomplished by a thermal conversion process or a chemical conversion process.
  • the polyimide is soluble in suitable coating solvents, it can be provided as an already-imidized polymer dissolved in the suitable coating solvent and coated as the polyimide.
  • the polyimide film comprising a polyimide having repeat units of Formula III has both a high glass transition temperature and a low coefficient of thermal expansion (CTE).
  • the glass transition temperature (T g ) is greater than 300 °C for a polyimide film cured at a temperature above 325 °C; in some embodiments, greater than 350 °C; in some embodiments, greater than 375 °C.
  • the in-plane coefficient of thermal expansion is less than 50 ppm/°C between 50 °C and 200 °C, for the first measurement; in some embodiments, less than 35 ppm/°C; in some embodiments, less than 20 ppm/°C; in some
  • the in-plane coefficient of thermal expansion is less than 50 ppm/°C between 50 °C and 200 °C, for the second measurement; in some embodiments, less than 40 ppm/°C.
  • the 1 % TGA weight loss temperature is greater than 350 °C; in some embodiments, greater than 400 °C; in some embodiments, greater than 450 °C.
  • the tensile modulus is between 1.5 GPa and 15.0 GPa; in some embodiments, between 1 .5 GPa and 10.0 GPa; in some embodiments, between 1.5 and 7.5 GPa; in some embodiments, between 1 .5 and 5.0 GPa.
  • the elongation to break is greater than 10%.
  • the birefringence is less than 1.0; in some embodiments, less than 0.1 ; in some embodiments, less than 0.05.
  • the optical retardation is less than 500 at 550 nm; in some embodiments, less than 400; in some embodiments, less than 350.
  • the haze is less than 1.0%; in some embodiments less than 0.5%.
  • the b * is less than 7.5; in some embodiments, less than 5.0.
  • the Yl is less than 12; in some embodiments, less than 10.
  • the transmittance at 450 nm is greater than 50%; in some embodiments, greater than 80%.
  • the transmittance at 550 nm is greater than 70%; in some embodiments, greater than 80%.
  • the transmittance at 750 nm is greater than 70%; in some embodiments, greater than 80%.
  • any of the above embodiments for the polyimide film can be combined with one or more of the other embodiments, so long as they are not mutually exclusive.
  • polyimide films can be prepared from polyimide precursors by chemical or thermal conversion.
  • the films are prepared from the corresponding polyamic acid solutions by chemical or thermal conversion processes.
  • the polyimide films disclosed herein, particularly when used as flexible replacements for glass in electronic devices, are prepared by thermal conversion processes.
  • polyimide films can be prepared from the corresponding polyamic acid solutions by chemical or thermal conversion processes.
  • polyimide films disclosed herein are prepared by thermal conversion or modified-thermal conversion processes, versus chemical conversion processes.
  • the conversion chemicals found to be useful in the present invention include, but are not limited to, (i) one or more dehydrating agents, such as, aliphatic acid anhydrides (acetic anhydride, etc.) and acid anhydrides; and (ii) one or more catalysts, such as, aliphatic tertiary amines (triethylamine, etc.), tertiary amines (dimethylaniline, etc.) and heterocyclic tertiary amines (pyridine, picoline, isoquinoilne, etc.).
  • the anhydride dehydrating material is typically used in a slight molar excess of the amount of amide acid groups present in the polyamic acid solution.
  • the amount of acetic anhydride used is typically about 2.0-3.0 moles per equivalent of the polyamic acid. Generally, a comparable amount of tertiary amine catalyst is used.
  • Thermal conversion processes may or may not employ conversion chemicals (i.e. , catalysts) to convert a polyamic acid casting solution to a polyimide. If conversion chemicals are used, the process may be considered a modified-thermal conversion process. In both types of thermal conversion processes, only heat energy is used to heat the film to both dry the film of solvent and to perform the imidization reaction.
  • conversion chemicals i.e. , catalysts
  • Thermal conversion processes with or without conversion catalysts are generally used to prepare the polyimide films disclosed herein.
  • the polyamic acids should be imidized at a temperature at, or higher than, the highest temperature of any subsequent processing steps (e.g. deposition of inorganic or other layer(s) necessary to produce a functioning display), but at a temperature which is lower than the temperature at which significant thermal degradation / discoloration of the polyimide occurs. It should also be noted that an inert atmosphere is generally preferred, particularly when higher processing temperatures are employed for imidization.
  • temperatures of 300 °C to 320 °C are typically employed when subsequent processing temperatures in excess of 300 °C are required. Choosing the proper curing temperature allows a fully cured polyimide which achieves the best balance of thermal and mechanical properties. Because of this very high temperature, an inert atmosphere is required. Typically, oxygen levels in the oven of ⁇ 100 ppm should be employed. Very low oxygen levels enable the highest curing temperatures to be used without significant degradation / discoloration of the polymer. Catalysts that accelerate the imidization process are effective at achieving higher levels of imidization at cure temperatures between about 200 °C and 300 °C. This approach may be optionally employed if the flexible device is prepared with upper cure temperatures that are below the T g of the polyimide.
  • the amount of time in each potential cure step is also an important process consideration. Generally, the time used for the highest- temperature curing should be kept to a minimum. For 320 °C cure, for example, cure time can be up to an hour or so under an inert atmosphere; but at higher cure temperatures, this time should be shortened to avoid thermal degradation. Generally speaking, higher temperature dictates shorter time. Those skilled in the art will recognize the balance between temperature and time in order to optimize the properties of the polyimide for a particular end use.
  • the polyamic acid solution is converted into a polyimide film via a thermal conversion process.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 50 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 40 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 30 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 20 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is between 10pm and 20 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is between 15pm and 20 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is 18 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 10 pm.
  • the coated matrix is soft baked on a hot plate in proximity mode wherein nitrogen gas is used to hold the coated matrix just above the hot plate.
  • the coated matrix is soft baked on a hot plate in full-contact mode wherein the coated matrix is in direct contact with the hot plate surface.
  • the coated matrix is soft baked on a hot plate using a combination of proximity and full-contact modes. In some embodiments of the thermal conversion process, the coated matrix is soft-baked using a hot plate set at 80 °C.
  • the coated matrix is soft-baked using a hot plate set at 90 °C.
  • the coated matrix is soft-baked using a hot plate set at 100 °C.
  • the coated matrix is soft-baked using a hot plate set at 1 10 °C.
  • the coated matrix is soft-baked using a hot plate set at 120 °C.
  • the coated matrix is soft-baked using a hot plate set at 130 °C.
  • the coated matrix is soft-baked using a hot plate set at 140 °C.
  • the coated matrix is soft-baked for a total time of more than 10 minutes.
  • the coated matrix is soft-baked for a total time of less than 10 minutes.
  • the coated matrix is soft-baked for a total time of less than 8 minutes.
  • the coated matrix is soft-baked for a total time of less than 6 minutes.
  • the coated matrix is soft-baked for a total time of 4 minutes.
  • the coated matrix is soft-baked for a total time of less than 4 minutes.
  • the coated matrix is soft-baked for a total time of less than 2 minutes.
  • the soft- baked coated matrix is subsequently cured at 2 pre-selected temperatures for 2 pre-selected time intervals, the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 3 pre-selected temperatures for 3 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 4 pre-selected temperatures for 4 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 5 pre-selected temperatures for 5 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 6 pre-selected temperatures for 6 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 7 pre-selected temperatures for 7 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 8 pre-selected temperatures for 8 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 9 pre-selected temperatures for 9 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft- baked coated matrix is subsequently cured at 10 pre-selected
  • temperatures for 10 pre-selected time intervals each of which of the latter of which may be the same or different.
  • the pre- selected temperature is greater than 80 °C.
  • the pre- selected temperature is equal to 100 °C. In some embodiments of the thermal conversion process, the pre- selected temperature is greater than 100 °C.
  • the pre- selected temperature is equal to 150 °C.
  • the pre- selected temperature is greater than 150 °C.
  • the pre- selected temperature is equal to 200 °C.
  • the pre- selected temperature is greater than 200 °C.
  • the pre- selected temperature is equal to 250 °C.
  • the pre- selected temperature is greater than 250 °C.
  • the pre- selected temperature is equal to 300 °C.
  • the pre- selected temperature is greater than 300 °C.
  • the pre- selected temperature is equal to 350 °C.
  • the pre- selected temperature is greater than 350 °C.
  • the pre- selected temperature is equal to 400 °C.
  • the pre- selected temperature is greater than 400 °C.
  • the pre- selected temperature is equal to 450 °C.
  • the pre- selected temperature is greater than 450 °C.
  • one or more of the pre-selected time intervals is 2 minutes.
  • one or more of the pre-selected time intervals is 5 minutes. In some embodiments of the thermal conversion process, one or more of the pre-selected time intervals is 10 minutes.
  • one or more of the pre-selected time intervals is 15 minutes.
  • one or more of the pre-selected time intervals is 20 minutes.
  • one or more of the pre-selected time intervals is 25 minutes.
  • one or more of the pre-selected time intervals is 30 minutes.
  • one or more of the pre-selected time intervals is 35 minutes.
  • one or more of the pre-selected time intervals is 40 minutes.
  • one or more of the pre-selected time intervals is 45 minutes.
  • one or more of the pre- selected time intervals is 50 minutes.
  • one or more of the pre-selected time intervals is 55 minutes.
  • one or more of the pre-selected time intervals is 60 minutes.
  • one or more of the pre-selected time intervals is greater than 60 minutes.
  • one or more of the pre-selected time intervals is between 2 minutes and 60 minutes.
  • one or more of the pre-selected time intervals is between 2 minutes and 90 minutes.
  • one or more of the pre-selected time intervals is between 2 minutes and 120 minutes.
  • the method for preparing a polyimide film comprises the following steps in order: coating the above-described polyamic acid solution onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are
  • the method for preparing a polyimide film consists of the following steps in order: coating the above-described polyamic acid solution onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are
  • the method for preparing a polyimide film consists essentially of the following steps in order: coating the above-described polyamic acid solution onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
  • the polyamic acid solutions / polyimides disclosed herein are coated / cured onto a supporting glass substrate to facilitate the processing through the rest of the display making process.
  • the polyimide coating is removed from the supporting glass substrate by a mechanical or laser lift off process.
  • this polyimide film with deposition layers is then bonded to a thicker, but still flexible, plastic film to provide support for subsequent fabrication of the display.
  • the polyamic acid solution is converted into a polyimide film via a modified-thermal conversion process.
  • the polyamic acid solution further contains conversion catalysts.
  • the polyamic acid solution further contains conversion catalysts selected from the group consisting of tertiary amines.
  • the polyamic acid solution further contains conversion catalysts selected from the group consisting of tributylamine, dimethylethanolamine, isoquinoline, 1 ,2-dimethylimidazole, N-methylimidazole, 2- methylimidazole, 2-ethyl-4-imidazole, 3,5-dimethylpyridine, 3,4- dimethylpyridine, 2,5-dimethylpyridine, 5-methylbenzimidazole, and the like.
  • conversion catalysts selected from the group consisting of tributylamine, dimethylethanolamine, isoquinoline, 1 ,2-dimethylimidazole, N-methylimidazole, 2- methylimidazole, 2-ethyl-4-imidazole, 3,5-dimethylpyridine, 3,4- dimethylpyridine, 2,5-dimethylpyridine, 5-methylbenzimidazole, and the like.
  • the conversion catalyst is present at 5 weight percent or less of the polyamic acid solution.
  • the conversion catalyst is present at 3 weight percent or less of the polyamic acid solution.
  • the conversion catalyst is present at 1 weight percent or less of the polyamic acid solution.
  • the conversion catalyst is present at 1 weight percent of the polyamic acid solution.
  • the polyamic acid solution further contains tributylamine as a conversion catalyst.
  • the polyamic acid solution further contains dimethylethanolamine as a conversion catalyst. In some embodiments of the modified-thermal conversion process, the polyamic acid solution further contains isoquinoline as a conversion catalyst.
  • the polyamic acid solution further contains 1 ,2-dimethylimidazole as a conversion catalyst.
  • the polyamic acid solution further contains 3,5-dimethylpyridine as a conversion catalyst.
  • the polyamic acid solution further contains 5-methylbenzimidazole as a conversion catalyst.
  • the polyamic acid solution further contains N-methylimidazole as a conversion catalyst.
  • the polyamic acid solution further contains 2-methylimidazole as a conversion catalyst.
  • the polyamic acid solution further contains 2-ethyl-4-imidazole as a conversion catalyst.
  • the polyamic acid solution further contains 3,4-dimethylpyridine as a conversion catalyst.
  • the polyamic acid solution further contains 2,5-dimethylpyridine as a conversion catalyst.
  • the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 50 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 40 pm. In some embodiments of the modified-thermal conversion process, the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 30 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 20 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is between 10pm and 20 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is between 15pm and 20 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is 18 pm.
  • the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 10 pm.
  • the coated matrix is soft baked on a hot plate in proximity mode wherein nitrogen gas is used to hold the coated matrix just above the hot plate.
  • the coated matrix is soft baked on a hot plate in full-contact mode wherein the coated matrix is in direct contact with the hot plate surface.
  • the coated matrix is soft baked on a hot plate using a combination of proximity and full-contact modes.
  • the coated matrix is soft-baked using a hot plate set at 80 °C.
  • the coated matrix is soft-baked using a hot plate set at 90 °C.
  • the coated matrix is soft-baked using a hot plate set at 100 °C. In some embodiments of the modified-thermal conversion process, the coated matrix is soft-baked using a hot plate set at 1 10 °C.
  • the coated matrix is soft-baked using a hot plate set at 120 °C.
  • the coated matrix is soft-baked using a hot plate set at 130 °C.
  • the coated matrix is soft-baked using a hot plate set at 140 °C.
  • the coated matrix is soft-baked for a total time of more than 10 minutes.
  • the coated matrix is soft-baked for a total time of less than 10 minutes.
  • the coated matrix is soft-baked for a total time of less than 8 minutes.
  • the coated matrix is soft-baked for a total time of less than 6 minutes.
  • the coated matrix is soft-baked for a total time of 4 minutes.
  • the coated matrix is soft-baked for a total time of less than 4 minutes.
  • the coated matrix is soft-baked for a total time of less than 2 minutes.
  • the soft-baked coated matrix is subsequently cured at 2 pre-selected temperatures for 2 pre-selected time intervals, the latter of which may be the same or different.
  • the soft-baked coated matrix is subsequently cured at 3 pre-selected temperatures for 3 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft-baked coated matrix is subsequently cured at 4 pre-selected temperatures for 4 pre-selected time intervals, each of which of the latter of which may be the same or different. In some embodiments of the modified- thermal conversion process, the soft-baked coated matrix is subsequently cured at 5 pre-selected temperatures for 5 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft-baked coated matrix is subsequently cured at 6 pre-selected temperatures for 6 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft-baked coated matrix is subsequently cured at 7 pre-selected temperatures for 7 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft-baked coated matrix is subsequently cured at 8 pre-selected temperatures for 8 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft-baked coated matrix is subsequently cured at 9 pre-selected temperatures for 9 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the soft-baked coated matrix is subsequently cured at 10 pre-selected temperatures for 10 pre-selected time intervals, each of which of the latter of which may be the same or different.
  • the pre-selected temperature is greater than 80 °C.
  • the pre-selected temperature is equal to 100 °C.
  • the pre-selected temperature is greater than 100 °C.
  • the pre-selected temperature is equal to 150 °C.
  • the pre-selected temperature is greater than 150 °C. In some embodiments of the modified-thermal conversion process, the pre-selected temperature is equal to 200 °C.
  • the pre-selected temperature is greater than 200 °C.
  • the pre-selected temperature is equal to 220 °C.
  • the pre-selected temperature is greater than 220 °C.
  • the pre-selected temperature is equal to 230 °C.
  • the pre-selected temperature is greater than 230 °C.
  • the pre-selected temperature is equal to 240 °C.
  • the pre-selected temperature is greater than 240 °C.
  • the pre-selected temperature is equal to 250 °C.
  • the pre-selected temperature is greater than 250 °C.
  • the pre-selected temperature is equal to 260 °C.
  • the pre-selected temperature is greater than 260 °C.
  • the pre-selected temperature is equal to 270 °C.
  • the pre-selected temperature is greater than 270 °C.
  • the pre-selected temperature is equal to 280 °C.
  • the pre-selected temperature is greater than 280 °C.
  • the pre-selected temperature is equal to 290 °C. In some embodiments of the modified-thermal conversion process, the pre-selected temperature is greater than 290 °C.
  • the pre-selected temperature is equal to 300 °C.
  • the pre-selected temperature is less than 300 °C.
  • the pre-selected temperature is less than 290 °C.
  • the pre-selected temperature is less than 280 °C.
  • the pre-selected temperature is less than 270 °C.
  • the pre-selected temperature is less than 260 °C.
  • the pre-selected temperature is less than 250 °C.
  • one or more of the pre-selected time intervals is 2 minutes.
  • one or more of the pre-selected time intervals is 5 minutes.
  • one or more of the pre-selected time intervals is 10 minutes.
  • one or more of the pre-selected time intervals is 15 minutes.
  • one or more of the pre-selected time intervals is 20 minutes.
  • one or more of the pre-selected time intervals is 25 minutes.
  • one or more of the pre-selected time intervals is 30 minutes.
  • one or more of the pre-selected time intervals is 35 minutes.
  • one or more of the pre-selected time intervals is 40 minutes. In some embodiments of the modified-thermal conversion process, one or more of the pre-selected time intervals is 45 minutes.
  • one or more of the pre-selected time intervals is 50 minutes.
  • one or more of the pre-selected time intervals is 55 minutes.
  • one or more of the pre-selected time intervals is 60 minutes.
  • one or more of the pre-selected time intervals is greater than 60 minutes.
  • one or more of the pre-selected time intervals is between 2 minutes and 60 minutes.
  • one or more of the pre-selected time intervals is between 2 minutes and 90 minutes.
  • one or more of the pre-selected time intervals is between 2 minutes and 120 minutes.
  • the method for preparing a polyimide film comprises the following steps in order: coating the above-described polyamic acid solution including a conversion chemical onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
  • the method for preparing a polyimide film consists of the following steps in order: coating the above-described polyamic acid solution including a conversion chemical onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
  • the method for preparing a polyimide film consists essentially of the following steps in order: coating the above-described polyamic acid solution including a conversion chemical onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre- selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
  • the polyimide films disclosed herein can be suitable for use in a number of layers in electronic display devices such as OLED and LCD Displays.
  • Nonlimiting examples of such layers include device substrates, touch panels, substrates for color filter sheets, cover films, and others.
  • the particular materials’ properties requirements for each application are unique and may be addressed by appropriate composition(s) and processing condition(s) for the polyimide films disclosed herein.
  • the flexible replacement for glass in an electronic device is a polyimide film comprising a polyimide having the repeat unit of Formula III, as described in detail above.
  • an organic electronic device having at least one layer comprising a polyimide film having a repeat unit of Formula III, as described in detail above.
  • Organic electronic devices that may benefit from having one or more layers including at least one compound as described herein include, but are not limited to, (1 ) devices that convert electrical energy into radiation (e.g., a light-emitting diode, light emitting diode display, lighting device, luminaire, or diode laser), (2) devices that detect signals through electronics processes (e.g., photodetectors, photoconductive cells, photoresistors, photoswitches, phototransistors, phototubes, IR detectors, biosensors), (3) devices that convert radiation into electrical energy, (e.g., a photovoltaic device or solar cell), (4) devices that convert light of one wavelength to light of a longer wavelength, (e.g., a down-converting phosphor device); and (5) devices that include one or more electronic components that include one or more organic semi-conductor layers (e.g., a transistor or diode).
  • Other uses for the compositions according to the present invention include coating materials for memory storage devices, antistatic films, biosensors, electrochro
  • FIG. 1 One illustration of a polyimide film that can act as a flexible replacement for glass as described herein is shown in FIG. 1.
  • the flexible film 100 can have the properties as described in the embodiments of this disclosure.
  • the polyimide film that can act as a flexible replacement for glass is included in an electronic device.
  • FIG. 2 illustrates the case when the electronic device 200 is an organic electronic device.
  • the device 200 has a substrate 100, an anode layer 1 10 and a second electrical contact layer, a cathode layer 130, and a photoactive layer 120 between them. Additional layers may optionally be present. Adjacent to the anode may be a hole injection layer (not shown), sometimes referred to as a buffer layer.
  • Adjacent to the hole injection layer may be a hole transport layer (not shown), including hole transport material.
  • Adjacent to the cathode may be an electron transport layer (not shown), including an electron transport material.
  • devices may use one or more additional hole injection or hole transport layers (not shown) next to the anode 1 10 and/or one or more additional electron injection or electron transport layers (not shown) next to the cathode 130. Layers between 1 10 and 130 are individually and collectively referred to as the organic active layers. Additional layers that may or may not be present include color filters, touch panels, and / or cover sheets. One or more of these layers, in addition to the substrate 100, may also be made from the polyimide films disclosed herein.
  • the different layers have the following range of thicknesses: substrate 100, 5-100 microns, anode 1 10, 500-5000 A, in some embodiments, 1000-2000 A; hole injection layer (not shown), 50- 2000 A, in some embodiments, 200-1000 A; hole transport layer (not shown), 50-3000 A, in some embodiments, 200-2000 A; photoactive layer 120, 10-2000 A, in some embodiments, 100-1000 A; electron transport layer (not shown), 50-2000 A, in some embodiments, 100-1000 A; cathode 130, 200-10000 A, in some embodiments, 300-5000 A.
  • the desired ratio of layer thicknesses will depend on the exact nature of the materials used.
  • the organic electronic device contains a flexible replacement for glass as disclosed herein.
  • an organic electronic device wherein the device substrate comprises the polyimide film disclosed herein.
  • the device is an organic light emitting diode (OLED).
  • an organic electronic device includes a substrate, an anode, a cathode, and a photoactive layer therebetween, and further includes one or more additional organic active layers.
  • the additional organic active layer is a hole transport layer.
  • the additional organic active layer is an electron transport layer. In some embodiments, the additional organic layers are both hole transport and electron transport layers.
  • the anode 1 10 is an electrode that is particularly efficient for injecting positive charge carriers. It can be made of, for example materials containing a metal, mixed metal, alloy, metal oxide or mixed-metal oxide, or it can be a conducting polymer, and mixtures thereof. Suitable metals include the Group 1 1 metals, the metals in Groups 4, 5, and 6, and the Group 8-10 transition metals. If the anode is to be light-transmitting, mixed-metal oxides of Groups 12, 13 and 14 metals, such as indium-tin- oxide, are generally used.
  • the anode may also include an organic material such as polyaniline as described in“Flexible light-emitting diodes made from soluble conducting polymer,” Nature vol. 357, pp 477 479 (1 1 June 1992). At least one of the anode and cathode should be at least partially transparent to allow the generated light to be observed.
  • Optional hole injection layers can include hole injection materials.
  • the term“hole injection layer” or“hole injection material” is intended to mean electrically conductive or semiconductive materials and may have one or more functions in an organic electronic device, including but not limited to, planarization of the underlying layer, charge transport and/or charge injection properties, scavenging of impurities such as oxygen or metal ions, and other aspects to facilitate or to improve the performance of the organic electronic device.
  • Hole injection materials may be polymers, oligomers, or small molecules, and may be in the form of solutions, dispersions, suspensions, emulsions, colloidal mixtures, or other compositions.
  • the hole injection layer can be formed with polymeric materials, such as polyaniline (PANI) or polyethylenedioxythiophene (PEDOT), which are often doped with protonic acids.
  • the protonic acids can be, for example, poly(styrenesulfonic acid), poly(2-acrylamido-2-methyl-1- propanesulfonic acid), and the like.
  • the hole injection layer 120 can include charge transfer compounds, and the like, such as copper phthalocyanine and the tetrathiafulvalene-tetracyanoquinodimethane system (TTF-TCNQ).
  • TTF-TCNQ tetrathiafulvalene-tetracyanoquinodimethane system
  • the hole injection layer 120 is made from a dispersion of a conducting polymer and a colloid-forming polymeric acid. Such materials have been described in, for example, published U.S. patent applications 2004-0102577, 2004-0127637, and 2005-0205860.
  • hole transport materials examples include hole transport materials. Examples of hole transport materials for the hole transport layer have been summarized for example, in Kirk-Othmer Encyclopedia of Chemical Technology, Fourth Edition, Vol. 18, p. 837-860, 1996, by Y. Wang. Both hole transporting small molecules and polymers can be used.
  • hole transporting molecules include, but are not limited to: 4,4’,4”-tris(N,N- diphenyl-amino)-triphenylamine (TDATA); 4,4’,4”-tris(N-3-methylphenyl-N- phenyl-amino)-triphenylamine (MTDATA); N,N'-diphenyl-N,N'-bis(3- methylphenyl)-[1 ,T-biphenyl]-4,4'-diamine (TPD); 4, 4’-bis(carbazol-9- yl)biphenyl (CBP); 1 ,3-bis(carbazol-9-yl)benzene (mCP); 1 ,1 -bis[(di-4- tolylamino) phenyljcyclohexane (TAPC); N,N'-bis(4-methylphenyl)-N,N'- bis(4-ethylphenyl)-[1 ,T
  • the polycarbonate In some cases, triarylamine polymers are used, especially triarylamine-fluorene copolymers. In some cases, the polymers and copolymers are crosslinkable. Examples of crosslinkable hole transport polymers can be found in, for example, published US patent application 2005-0184287 and published PCT application WO 2005/052027. In some embodiments, the hole transport layer is doped with a p-dopant, such as tetrafluorotetracyanoquinodimethane and perylene-3,4,9,10- tetracarboxylic-3, 4, 9, 10-dianhydride.
  • a p-dopant such as tetrafluorotetracyanoquinodimethane and perylene-3,4,9,10- tetracarboxylic-3, 4, 9, 10-dianhydride.
  • the photoactive layer 120 can be a light-emitting layer that is activated by an applied voltage (such as in a light-emitting diode or light-emitting electrochemical cell), a layer of material that absorbs light and emits light having a longer wavelength (such as in a down-converting phosphor device), or a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage (such as in a photodetector or photovoltaic device).
  • an applied voltage such as in a light-emitting diode or light-emitting electrochemical cell
  • a layer of material that absorbs light and emits light having a longer wavelength such as in a down-converting phosphor device
  • a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage such as in a photodetector or photovoltaic device.
  • the photoactive layer includes a compound comprising an emissive compound having as a photoactive material.
  • the photoactive layer further comprises a host material.
  • host materials include, but are not limited to, chrysenes, phenanthrenes, triphenylenes, phenanthrolines, naphthalenes, anthracenes, quinolines, isoquinolines, quinoxalines, phenylpyridines, carbazoles, indolocarbazoles, furans, benzofurans, dibenzofurans, benzodifurans, and metal quinolinate complexes.
  • the host materials are deuterated.
  • the photoactive layer comprises (a) a dopant capable of electroluminescence having an emission maximum between 380 and 750 nm, (b) a first host compound, and (c) a second host compound. Suitable second host compounds are described above.
  • the photoactive layer includes only (a) a dopant capable of electroluminescence having an emission maximum between 380 and 750 nm, (b) a first host compound, and (c) a second host compound, where additional materials that would materially alter the principle of operation or the distinguishing characteristics of the layer are not present.
  • the first host is present in higher
  • the weight ratio of first host to second host in the photoactive layer is in the range of 10:1 to 1 :10. In some
  • the weight ratio is in the range of 6:1 to 1 :6; in some embodiments, 5:1 to 1 :2; in some embodiments, 3:1 to 1 :1.
  • the weight ratio of dopant to the total host is in the range of 1 :99 to 20:80; in some embodiments, 5:95 to 15:85.
  • the photoactive layer comprises (a) a red light-emitting dopant, (b) a first host compound, and (c) a second host compound.
  • the photoactive layer comprises (a) a green light-emitting dopant, (b) a first host compound, and (c) a second host compound.
  • the photoactive layer comprises (a) a yellow light-emitting dopant, (b) a first host compound, and (c) a second host compound.
  • Optional layers can function both to facilitate electron transport, and also serve as a confinement layer to prevent quenching of the exciton at layer interfaces.
  • this layer promotes electron mobility and reduces exciton quenching.
  • such layers include other electron transport materials.
  • electron transport materials which can be used in the optional electron transport layer, include metal chelated oxinoid compounds, including metal quinolate derivatives such as tris(8- hydroxyquinolato)aluminum (AIQ), bis(2-methyl-8-quinolinolato)(p- phenylphenolato) aluminum (BAIq), tetrakis-(8-hydroxyquinolato)hafnium (HfQ) and tetrakis-(8-hydroxyquinolato)zirconium (ZrQ); and azole compounds such as 2- (4-biphenylyl)-5-(4-t-butylphenyl)-1 ,3,4-oxadiazole (PBD), 3-(4-biphenylyl)-4-phenyl-5-(4-t-butylphenyl)-1 ,2,4-triazole (TAZ), and 1 ,3,5-tri(phenyl-2-benzimidazole
  • AIQ
  • the electron transport material is selected from the group consisting of metal quinolates and phenanthroline derivatives.
  • the electron transport layer further includes an n-dopant.
  • N-dopant materials are well known.
  • tetrathianaphthacene bis(ethylenedithio)tetrathiafulvalene
  • heterocyclic radicals or diradicals and the dimers, oligomers, polymers, dispiro compounds and polycycles of heterocyclic radical or diradicals.
  • An optional electron injection layer may be deposited over the electron transport layer.
  • electron injection materials include, but are not limited to, Li-containing organometallic compounds, LiF, Li 2 0, Li quinolate, Cs-containing organometallic compounds, CsF, Cs 2 0, and Cs 2 C0 3 . This layer may react with the underlying electron transport layer, the overlying cathode, or both.
  • the amount of material deposited is generally in the range of 1- 100 A, in some embodiments 1-10 A.
  • the cathode 130 is an electrode that is particularly efficient for injecting electrons or negative charge carriers.
  • the cathode can be any metal or nonmetal having a lower work function than the anode.
  • Materials for the cathode can be selected from alkali metals of Group 1 (e.g., Li, Cs), the Group 2 (alkaline earth) metals, the Group 12 metals, including the rare earth elements and lanthanides, and the actinides. Materials such as aluminum, indium, calcium, barium, samarium and magnesium, as well as combinations, can be used.
  • anode 1 10 there can be layers (not shown) between the anode 1 10 and hole injection layer (not shown) to control the amount of positive charge injected and/or to provide band-gap matching of the layers, or to function as a protective layer.
  • Layers that are known in the art can be used, such as copper phthalocyanine, silicon oxy-nitride, fluorocarbons, silanes, or an ultra-thin layer of a metal, such as Pt.
  • some or all of anode layer 1 10, active layer 120, or cathode layer 130 can be surface-treated to increase charge carrier transport efficiency.
  • the choice of materials for each of the component layers is preferably determined by balancing the positive and negative charges in the emitter layer to provide a device with high electroluminescence efficiency.
  • each functional layer can be made up of more than one layer.
  • the device layers can generally be formed by any deposition technique, or combinations of techniques, including vapor deposition, liquid deposition, and thermal transfer. Substrates such as glass, plastics, and metals can be used. Conventional vapor deposition techniques can be used, such as thermal evaporation, chemical vapor deposition, and the like.
  • the organic layers can be applied from solutions or dispersions in suitable solvents, using conventional coating or printing techniques, including but not limited to coating, dip-coating, roll-to-roll techniques, ink- jet printing, continuous nozzle printing, screen-printing, gravure printing and the like. For liquid deposition methods, a suitable solvent for a particular compound or related class of compounds can be readily determined by one skilled in the art.
  • non-aqueous solvents can be relatively polar, such as Ci to C20 alcohols, ethers, and acid esters, or can be relatively non-polar such as C1 to C12 alkanes or aromatics such as toluene, xylenes, trifluorotoluene and the like.
  • suitable liquids for use in making the liquid composition includes, but not limited to, chlorinated hydrocarbons (such as methylene chloride, chloroform, chlorobenzene), aromatic hydrocarbons (such as substituted and non-substituted toluenes and xylenes), including triflurotoluene), polar solvents (such as tetrahydrofuran (THP), N-methyl pyrrolidone) esters (such as ethylacetate) alcohols (isopropanol), ketones (cyclopentatone) and mixtures thereof.
  • chlorinated hydrocarbons such as methylene chloride, chloroform, chlorobenzene
  • aromatic hydrocarbons such as substituted and non-substituted toluenes and xylenes
  • triflurotoluene including triflurotoluene
  • polar solvents such as tetrahydrofuran (THP), N-methyl pyrrolidone) esters (
  • electroluminescent materials have been described in, for example, published PCT application WO 2007/145979.
  • the device is fabricated by liquid deposition of the hole injection layer, the hole transport layer, and the photoactive layer, and by vapor deposition of the anode, the electron transport layer, an electron injection layer and the cathode onto the flexible substrate.
  • the efficiency of devices can be improved by optimizing the other layers in the device.
  • more efficient cathodes such as Ca, Ba or LiF can be used.
  • Shaped substrates and novel hole transport materials that result in a reduction in operating voltage or increase quantum efficiency are also applicable.
  • Additional layers can also be added to tailor the energy levels of the various layers and facilitate electroluminescence.
  • the device has the following structure, in order: substrate, anode, hole injection layer, hole transport layer, photoactive layer, electron transport layer, electron injection layer, cathode.
  • This example illustrates the preparation of a diamine having Formula I, Compound 4.
  • Example 2 This example illustrates the preparation of a liquid composition including a polyamic acid having Formula II.
  • This example illustrates the preparation of a polyimide film, where the polyimide has Formula III.
  • the polyamic acid solution from Example 2 was filtered through a microfilter, spin coated onto clean silicon wafers, soft-baked at 90°C on hotplate, placed into a furnace.
  • the furnace was purged with nitrogen and heated to a maxiumum temperature of 320°C. Wafers were removed from the furnace, soaked in water and manually delaminated to yield samples of polyimide films.
  • a polyimide film having a thickness of 8.62 pm had the following properties:

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