WO2020024583A1 - 波长转换元件及其制备方法 - Google Patents

波长转换元件及其制备方法 Download PDF

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Publication number
WO2020024583A1
WO2020024583A1 PCT/CN2019/076649 CN2019076649W WO2020024583A1 WO 2020024583 A1 WO2020024583 A1 WO 2020024583A1 CN 2019076649 W CN2019076649 W CN 2019076649W WO 2020024583 A1 WO2020024583 A1 WO 2020024583A1
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Prior art keywords
light
wavelength conversion
transmitting substrate
conversion element
optical unit
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PCT/CN2019/076649
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English (en)
French (fr)
Inventor
徐梦梦
胡飞
王霖
王杰
李屹
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Shenzhen Appotronics Corp Ltd
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Appotronics Corp Ltd
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

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  • the present invention relates to a wavelength conversion element and a method for manufacturing the same, and in particular, to a wavelength conversion element and a method for manufacturing the same that reduce the difficulty of manufacturing a pixelated wavelength conversion element.
  • the display method mainly uses DMD or LCD as a light modulator to modulate the illumination light to obtain image light.
  • DMD technology is in the hands of American companies, while LCD technology is in the hands of Japanese companies, forming a technology monopoly. New companies enter the display field and cannot bypass these technologies, which is not conducive to reducing the cost of the display field.
  • display devices based on DMD or LCD technology have defects in their efficiency, which severely restricts high-brightness displays.
  • the applicant has proposed a display system with a fluorescent chip structure, and also proposed a specific structure and a manufacturing method of a pixelated wavelength conversion element suitable for the display system.
  • Osram Corporation has proposed the structure of a wavelength conversion element suitable for a pixelated light-emitting device and a method for preparing the same in patent applications with publication numbers of WO2016087600, DE102013105533, CN105684171, and CN106030836.
  • FIG. 1 shows a schematic diagram of such a pixelated wavelength conversion element 100, wherein reference numeral 110 represents a wavelength conversion material, reference numeral 120 represents a light blocking material, and reference numeral 130 represents a substrate.
  • FIG. 1 shows a plan view of the wavelength conversion element in the upper part, and a longitudinal sectional view of the wavelength conversion element in the lower part.
  • the wavelength conversion material 110 is formed to be spaced apart from each other by the light blocking material 120, thereby forming a pixel point array to convert incident light into light with another wavelength distribution.
  • the light blocking material 120 does not transmit ultraviolet or / and visible light to prevent light crosstalk between different pixels.
  • the display system using this structure can effectively improve the utilization rate of light, which is a development direction of future display systems.
  • an array of pits is formed on a barrier material, and then the wavelength conversion material is filled.
  • an array of pits is formed on the wavelength conversion material and then filled with a blocking material.
  • FIG. 2 illustrates such a manufacturing method of a pixelated wavelength conversion element generally used in the prior art.
  • the first preparation method directly or indirectly patterns the wavelength conversion material 110.
  • Direct patterning is, for example, mechanical processing or laser etching
  • indirect patterning is, for example, patterning using a photoresist as a template.
  • the pit array 111 is filled with the barrier material 120 to obtain a pixelated wavelength conversion element.
  • the second preparation method first performs similar direct or indirect patterning on the barrier material 120. After the pit array 121 is formed in the barrier material 120 by the above patterning, the pit array 121 is filled with the wavelength conversion material 110, thereby obtaining a pixelated wavelength conversion element.
  • the substrate 130 may be omitted in (b) of FIG. 2.
  • the present invention is made in view of the above problems, and aims to provide a pixelated wavelength conversion element and a manufacturing method thereof.
  • the structure of the pixelated wavelength conversion element includes a light-transmitting substrate such as a lens array or a prism array. It plays the role of mold during the preparation process.
  • the pixelated wavelength conversion with this structure uses a lens array or a prism array as a mold, which greatly reduces the difficulty of preparing the pixelated wavelength conversion element.
  • process parameters and material parameters can be controlled so that an air gap is generated at the surface of the lens array or prism array, thereby exerting its own light-shaping effect, light-shaping the light emitted by the wavelength conversion material, and obtaining pixels with specific angular distribution Into outgoing light.
  • a wavelength conversion element may include: a light-transmitting substrate, the light-transmitting substrate including an array of first optical units having protrusions, and a blocking portion.
  • the blocking portion includes second optical units with grooves arranged in an array, and the transparent substrate is arranged on the blocking portion, so that the first optical unit of the transparent substrate and the blocking The second optical units of the first optical unit correspond to each other and face each other; and a wavelength conversion unit disposed on top of the protrusions of the first optical unit of the transparent substrate and A bottom of the groove of the second optical unit of the blocking portion is interposed between the blocking portion and the transparent substrate.
  • the light-transmitting substrate may be a lens array including a hemispherical lens unit as the first optical unit.
  • the transparent substrate may be a prism array including a prism-shaped prism unit as the first optical unit.
  • an air gap may be formed between the light-transmitting substrate and the blocking portion and / or between the light-transmitting substrate and the wavelength conversion portion.
  • the blocking portion may be formed by dispersing scattering particles in silica gel, photo-curing glue, or glass and curing.
  • the scattering particles may be one or more of TiO 2 , Al 2 O 3 , MgO, and BaSO 4 .
  • the wavelength conversion portion may be formed by dispersing a light-emitting material in silica gel, a photo-curing adhesive, or glass and curing it.
  • the light emitting material may be a rare earth phosphor or a quantum dot.
  • a method for preparing a wavelength conversion element includes: in a first step, coating a luminescent material slurry on a flat substrate to form a luminescent material slurry. Layer; in a second step, covering the light-emitting material paste layer with a light-transmitting substrate including a first optical unit having protrusions arranged in an array, so that The luminescent material paste is adhered at the top; in a third step, the light-transmitting substrate to which the luminescent material paste is adhered is removed, and the adhered luminescent material paste is pre-cured To form a pre-cured wavelength conversion portion; and in a fourth step, a blocking portion is formed on the structure to include a second optical unit with grooves arranged in an array.
  • the fourth step is performed by one of the following methods: (a) flip the structure obtained in the third step, and apply the scattering particle slurry on the convex side of the light-transmitting substrate to form the scattering particle slurry Layer, and curing the structure obtained at this time, thereby obtaining the wavelength conversion element including the light-transmitting substrate, the blocking portion, and the wavelength conversion portion; and (b) coating the scattering particle slurry on another Forming a scattering particle slurry layer on a flat substrate, covering the structure obtained in the third step on the scattering particle slurry layer, curing the structure obtained at this time, and removing the other flat substrate, Thereby, the wavelength conversion element including the light-transmitting substrate, the blocking portion, and the wavelength conversion portion is obtained.
  • the light-transmitting substrate may be a lens array including a hemispherical lens unit as the first optical unit.
  • the transparent substrate may be a prism array including a prism-shaped prism unit as the first optical unit.
  • the second step to the third step may be repeatedly performed two or more times so that the wavelength conversion section has a predetermined thickness.
  • the expansion or contraction rate of the material of the light-transmitting substrate may be different from the expansion or contraction rate of the luminescent material slurry and / or the scattering particle slurry, so that during the curing in the fourth step, the An air gap is formed between the light-transmitting substrate and the blocking portion and / or between the light-transmitting substrate and the wavelength conversion portion.
  • the scattering particle slurry layer may be formed by dispersing scattering particles in silica gel, light-curing glue, or glass.
  • the scattering particles may be one or more of TiO 2 , Al 2 O 3 , MgO, and BaSO 4 .
  • the luminescent material paste layer may be formed by dispersing a luminescent material in silica gel, a photo-curing glue, or glass.
  • the light emitting material may be a rare earth phosphor or a quantum dot.
  • the prism array functions as a mold, thereby greatly simplifying the preparation difficulty of the pixelated wavelength conversion element during the preparation process of the wavelength conversion element.
  • an air gap is formed at the surface of the light-transmitting substrate by controlling process parameters, material parameters, and the like, and the light-shaping effect of the light-transmitting substrate itself can be exerted to light-shape the light emitted by the wavelength conversion material To obtain the pixelated outgoing light with a specific angular distribution.
  • FIG. 1 illustrates a configuration of a pixelated wavelength conversion element according to the related art.
  • FIG. 2 illustrates a method of preparing a pixelated wavelength conversion element according to the related art.
  • FIG. 3 is a cross-sectional view showing a specific configuration of the wavelength conversion element according to the first embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating a method of manufacturing a wavelength conversion element according to the first embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a specific configuration of a wavelength conversion element according to a second embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing a specific configuration of the wavelength conversion element according to the first embodiment of the present invention.
  • the wavelength conversion element according to the first embodiment of the present invention includes a wavelength conversion portion 11, a blocking portion 12 for optically isolating and / or light scattering the wavelength conversion portion 11, and a light-transmitting substrate.
  • Lens array 13 Specifically, the lens array 13 is disposed on the blocking portion 12, and the wavelength conversion portion 11 is interposed between the blocking portion 12 and the lens array 13.
  • the forming material of the light-transmitting substrate is a light-transmitting material, that is, it allows transmission of the excitation light to be converted by the wavelength conversion element and also allows the converted light to transmit; the light-transmitting material transmits light The rate is greater than 30%. Therefore, the lens array 13 as a light-transmitting substrate shapes the incident excitation light and guides it to the wavelength conversion section 11. At the same time, the light converted by the wavelength conversion section 11 can be emitted to the outside through the lens array 13.
  • the lens unit of the lens array 13 has a hemispherical protrusion.
  • the present invention is not limited to this.
  • the shape of the lens unit of the lens array 13 may have any convex shape according to actual needs.
  • the protrusion of the lens unit can play the role of mold and positioning during the preparation of the wavelength conversion element, thereby greatly simplifying the difficulty of preparing the pixelated wavelength conversion element.
  • the arrangement of the plurality of lens units in the lens array 13 may be, but is not limited to, a matrix array similar to that shown in FIG. 1, and may also be another array, for example.
  • the lens units in the lens array 13 may be arranged in a compound eye structure.
  • the surfaces facing each other between the blocking portion 12 and the lens array 13 have a substantially matching shape.
  • a surface of the lens array 13 facing the blocking portion 12 is formed with a convex lens unit, and at the same time, a surface of the blocking portion 12 facing the lens array 13 is formed with each lens unit Corresponding or matching grooves.
  • a light isolation and / or light scattering unit is formed on the blocking portion 12.
  • the light isolation and / or light scattering units on the blocking portion 12 correspond to the lens units of the lens array 13 one-to-one.
  • the light-isolation and / or light-scattering unit can be used to avoid light crosstalk between adjacent wavelength conversion sections, and can also make more light emitted from the upper surface of the lens array 13 by its own diffuse reflection characteristics.
  • the material for forming the barrier portion 12 is formed by dispersing scattering particles for scattering excitation light in silica gel, light-curing glue, or glass, so that the barrier portion 12 has optical isolation and / or diffuse reflection characteristics.
  • the scattering particles may be one or more of white particles such as TiO 2 , Al 2 O 3 , MgO, and BaSO 4 .
  • the blocking portion 12 can avoid light crosstalk between the adjacent wavelength conversion portions 11. At the same time, the diffuse reflection characteristic of the blocking portion 12 also allows more light to be emitted from the upper surface of the lens array 13.
  • the wavelength conversion section 11 may be provided to correspond to the light isolation and / or light scattering unit of each lens unit and the blocking section 12 in the lens array 13, and thus has light corresponding to the light of the lens unit and the blocking section 12 in the lens array 13. Corresponding number of isolation and / or light scattering units. Specifically, each wavelength conversion portion 11 may be disposed at the convex top of the corresponding lens unit and the bottom of the groove of the light isolating and / or light scattering unit on the blocking portion 12, and thus interposed between the blocking portion 12 and the lens array 13 between.
  • the forming material of the wavelength conversion portion 11 is formed by dispersing a light-emitting material in silica gel, a photo-curing adhesive, or glass.
  • the light-emitting material may be a common rare earth phosphor or a quantum dot, etc., and is preferably a rare earth phosphor.
  • the wavelength conversion element can receive a modulating excitation light incident from above (upper side in FIG. 3).
  • a blue laser light may be selected as the excitation light
  • a preferred blue laser light may be a wavelength of 473 nm, such as a laser light obtained from a semiconductor laser.
  • the excitation light is incident through the upper surface of the lens array 13 and passes through the lens array 13 so as to reach the wavelength conversion section 11.
  • the wavelength conversion section 11 performs wavelength conversion on the incident excitation light to convert it into light with a specific wavelength distribution.
  • the wavelength conversion portion 11 and the lens array 13 and / or the blocking portion 12 and the lens array 13 may be optical contact or non-optical contact, and preferably non-optical contact.
  • the lens array 13 functions only as a support and a template.
  • an air gap that causes non-optical contact is formed between the wavelength conversion section 11 and / or the blocking section 12 and the lens array 13 so that each lens unit can function independently.
  • the light emitted from each of the wavelength conversion sections 11 (that is, pixels) is subjected to light shaping to obtain pixelated emitted light having a specific angular distribution.
  • FIG. 4 is a cross-sectional view illustrating a method of manufacturing a wavelength conversion element according to the first embodiment of the present invention.
  • a luminescent material paste prepared in advance is coated on a flat substrate to form a paste layer containing a luminescent material.
  • the luminescent material paste is a mixed paste prepared by dispersing the luminescent material in silica gel, light-curing glue, or glass powder.
  • the lens array 13 is covered on the luminescent material paste layer so that a certain amount of the luminescent material paste is adhered to the top of the lens unit in the lens array 13.
  • the lens array 13 to which the luminescent material paste is adhered is removed from the luminescent material paste layer, and the adhered luminescent material paste is heated or light irradiated, so that The wavelength conversion material adhered to the lens unit is pre-cured to obtain a structure in which the wavelength conversion portion 11 is formed on the lens array 13.
  • the process of (b) to (c) of FIG. 4 may be repeatedly performed two or more times.
  • a barrier portion 12 is formed on the structure shown in FIG. 4 (c).
  • two different manufacturing methods may be used to form the barrier portion 12.
  • the structure obtained in the process shown in FIG. 4 (c) is reversed, and the convex side of the lens array 13 is coated by a method such as blade coating.
  • the scattering particle slurry is a mixed slurry prepared by dispersing the scattering particles in silica gel, light-curing glue, or glass frit.
  • the structure obtained at this time is cured by, for example, heating or light irradiation to form the barrier portion 12, thereby obtaining a pixelated wavelength conversion element as shown in FIG. 4 (e).
  • the scattering particle slurry is first coated on a flat substrate to form a slurry layer containing the scattering particles. Then, as shown in FIG. 4 (d2), the scattering particle slurry layer is covered with the structure shown in FIG. 4 (c) so that the convex side of the lens array 13 faces the scattering particle slurry layer.
  • the scattering particle slurry can completely or partially fill the gap between adjacent lens units of the lens array.
  • the obtained structure is cured by heating or light irradiation to form the barrier portion 12, and the flat substrate is removed, thereby obtaining a pixelated wavelength conversion element as shown in FIG. 4 (e).
  • a surface of the obtained light shielding portion 12 facing the lens array 13 is formed A light isolation and / or light scattering unit corresponding to the lens units of the lens array 13 one-to-one.
  • the light isolating and / or light scattering unit has a groove shape substantially corresponding to or matching the convex shape of the lens unit.
  • the wavelength conversion portion 11 and / or the blocking portion 12 undergo a volume shrinkage during the thermal curing or light curing process shown in FIG. 4 (e).
  • the material of the lens array 13 and the material of the wavelength conversion portion 11 and / or the blocking portion 12 are selected so that the expansion or contraction rate of the material of the lens array 13 is different from that of the wavelength conversion portion 11 and / or the blocking portion 12. Expansion or contraction.
  • an air gap causing non-optical contact is formed between the wavelength conversion section 11 and / or the blocking section 12 and the lens array 13, so that each lens unit can function independently, and the wavelength conversion section 11
  • the emitted light is subjected to light shaping to obtain pixelated emitted light with a specific angular distribution.
  • the lens array functions as a mold, thereby greatly simplifying the difficulty of manufacturing the pixelated wavelength conversion element.
  • the light shaping effect of the lens array itself can be exerted to the wavelength conversion material.
  • the light undergoes light shaping to obtain pixelated outgoing light with a specific angular distribution.
  • FIG. 5 is a cross-sectional view showing a specific configuration of a wavelength conversion element according to a second embodiment of the present invention.
  • the wavelength conversion element according to this embodiment is different in that, for a light-transmitting substrate, a prism array 23 is used instead of the lens array 13.
  • the prism array 23 includes a plurality of prism units having prism-shaped protrusions.
  • the prism array 23 can be directly obtained by using a mature prism film (BEF) manufacturing process.
  • BEF mature prism film
  • the other configurations of the wavelength conversion element according to the second embodiment are the same as those of the wavelength conversion element according to the first embodiment.
  • the wavelength conversion element according to the second embodiment includes a wavelength conversion section 21, a blocking section 22 for optically isolating and / or light scattering the wavelength conversion section 21, and a lens array 23 as a light-transmitting substrate.
  • the prism array 23 is disposed on the blocking portion 22, and the wavelength conversion portion 21 is interposed between the blocking portion 22 and the prism array 23.
  • the prism unit of the prism array 23 has a prism protrusion.
  • the present invention is not limited to this.
  • the shape of the prism unit of the prism array 23 may have any convex shape according to actual needs.
  • the protrusion of the prism unit can play a role of mold and positioning during the preparation of the wavelength conversion element, thereby greatly simplifying the difficulty of preparing the pixelated wavelength conversion element.
  • the wavelength conversion portion 21 and the prism array 23 and / or the blocking portion 22 and the prism array 23 may be optical contact or non-optical contact.
  • the prism array 23 only functions as a support and a template.
  • the prism array can also play a role of light shaping the light emitted by the wavelength conversion section 21 at the same time.
  • the wavelength conversion portion 21 and the prism array 23 and / or the blocking portion 22 and the prism array 23 are in non-optical contact.
  • each prism unit can function independently and perform light shaping on the light emitted by the wavelength conversion unit 21 to obtain pixelated emitted light with a specific angular distribution.
  • the method of manufacturing the wavelength conversion material according to the second embodiment is similar to the method of manufacturing the wavelength conversion element according to the first embodiment. The only difference between them is that the prism array 23 is used instead of the lens array 13 in the manufacturing process according to the second embodiment.
  • the prism array plays a role of mold and positioning, thereby greatly simplifying the difficulty of manufacturing the pixelated wavelength conversion element.
  • the second embodiment during the preparation of the wavelength conversion element, by controlling the process parameters and material parameters, there is an air gap at the surface of the prism array, which can play the role of light shaping of the prism array itself , Performing light shaping on the light emitted by the wavelength conversion material to obtain pixelated outgoing light with a specific angular distribution.
  • the light-transmitting substrate is described using the lens array 13 and the prism array 23 in the first and second embodiments of the present invention
  • the light-transmitting substrate of the present invention can also be used with Transparent substrate.
  • the protrusion of the optical unit of the transparent substrate can play the role of mold and positioning during the preparation of the wavelength conversion element, thereby greatly simplifying the difficulty of preparing the pixelated wavelength conversion element.

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Abstract

本发明涉及波长转换元件及其制备方法。波长转换元件包括透光衬底、阻隔部和波长转换部。透光衬底包括阵列排布的具有凸起的第一光学单元。阻隔部包括阵列排布的具有凹槽的第二光学单元，其中，透光衬底布置在阻隔部上，使得第一光学单元的第一光学单元与阻隔部的第二光学单元一一对应，且彼此面对。波长转换部布置在透光衬底的第一光学单元的凸起的顶部以及阻隔部的第二光学单元的凹槽的底部，并介于阻隔部与所述透光衬底之间。

Description

波长转换元件及其制备方法 技术领域
本发明涉及波长转换元件及其制备方法，并特别地涉及降低了像素化波长转换元件的制备难度的波长转换元件及其制备方法。
背景技术
在目前的显示领域中，显示方法主要利用DMD或LCD作为光调制器，以对照明光进行调制，从而得到图像光。然而，DMD技术掌握在美国企业手中，而LCD技术掌握在日本企业手中，形成技术垄断。新企业进入显示领域，无法绕开这些技术，从而不利于显示领域成本的降低。此外，以DMD或LCD为技术基础的显示设备，均有其效率方面的缺陷，严重制约了高亮度显示。
针对这一问题，本申请人曾经提出了一种荧光芯片结构的显示系统，且还提出了适用于该显示系统的像素化的波长转换元件的具体结构和制备方法。另外，欧司朗公司在公开号为WO2016087600、DE102013105533、CN105684171和CN106030836的专利申请中分别提出了适用于像素化发光装置的波长转换元件的结构及其制备方法。
图1示出了这种像素化波长转换元件100的示意图，其中，附图标记110表示波长转换材料，附图标记120表示光阻隔材料，且附图标记130表示基板。图1在上部示出了波长转换元件的平面图，且在下部示出了波长转换元件的纵向截面图。如图1所示，在基板130上，波长转换材料110形成为被光阻隔材料120彼此间隔开，从而形成像素点阵列，以将入射光转换为另一波长分布的光。光阻隔材料120不透射紫外或/和可见光，以防止不同像素间的光串扰。使用该结构的显示系统可以有效的提高光的利用率，是未来显示系统的一个发展方向。
在相关技术的像素化波长转换元件的制备方法中，通常，在阻隔材料上形成凹坑阵列，并然后填入波长转换材料。或者，在波长转换材料上形成凹坑阵列，并然后填入阻隔材料。
具体地，图2示出了现有技术中通常采用的像素化波长转换元件的这种制备方法。
如图2的(a)所示，第一种制备方法对波长转换材料110进行直接图案化或间接图案化。直接图案化例如为机械加工或激光刻蚀等方式，而间接图案化例如利用光刻胶作为模板进行图案化。在通过上述图案化在波长转换材料中形成凹坑阵列111之后，使用阻隔材料120填充凹坑阵列111，从而得到像素化波长转换元件。
如图2的(b)所示，第二种制备方法首先对阻隔材料120进行类似的直接图案化或间接图案化。在通过上述图案化在阻隔材料120中形成凹坑阵列121之后，使用波长转换材料110填充凹坑阵列121，从而得到像素化波长转换元件。诸如，在图2的(b)中可以省略基板130。
在这两种制备方法中，由于要求单个凹坑尺寸为几十到几百微米，所以在这类制备方法中，波长转换材料或阻隔材料的直接或间接图案化通常需要使用精密机械加工或激光刻蚀、光刻等方法来加工出凹坑阵列。由此，这些制备过程复杂，对设备要求较高。
发明内容
本发明是鉴于以上问题提出的，且旨在提供如下的像素化波长转换元件及其制备方法，该像素化波长转换元件的结构包括诸如透镜阵列或棱镜阵列等透光衬底，该衬底在制备过程中起到模具作用。具有该结构的像素化波长转换利用透镜阵列或棱镜阵列作为模具，极大地降低了像素化波长转换元件的制备难度。
另外，可以控制工艺参数、材料参数等使得在透镜阵列或棱镜阵列的表面处产生空气隙，从而发挥本身的光整形作用，对波长转换材料发出的光进行光整形，并得到特定角分布的像素化出射光。
根据本发明的一个方面，提出了一种波长转换元件，该波长转换元件可以包括：透光衬底，所述透光衬底包括阵列排布的具有凸起的第一光学单元；阻隔部，所述阻隔部包括阵列排布的具有凹槽的第二光学单元，所述透光衬底布置在所述阻隔部上，使得所述透光衬底的所述第一光学单元与所述阻隔部的所述第二光学单元一一对应，且彼此面对；及 波长转换部，所述波长转换部布置在所述透光衬底的所述第一光学单元的所述凸起的顶部以及所述阻隔部的所述第二光学单元的所述凹槽的底部，并介于所述阻隔部与所述透光衬底之间。
另外，所述透光衬底可以是透镜阵列，所述透镜阵列包括作为所述第一光学单元的半球形透镜单元。或者，所述透光衬底可以是棱镜阵列，所述棱镜阵列包括作为所述第一光学单元的棱柱形棱镜单元。
另外，在所述透光衬底和所述阻隔部之间并且/或者在所述透光衬底和所述波长转换部之间可以形成有空气隙。
另外，所述阻隔部可以是通过将散射颗粒分散到硅胶、光固化胶或玻璃中并进行固化形成的。
另外，所述散射颗粒可以为TiO 2、Al 2O 3、MgO、BaSO 4中的一种或多种。
另外，所述波长转换部可以是通过将发光材料分散到硅胶、光固化胶或玻璃中并进行固化形成的。
另外，所述发光材料可以为稀土荧光粉或量子点。
根据本发明的另一方面，提出了一种用于制备波长转换元件的方法，该方法包括：在第一步骤中，将发光材料浆料涂覆在平板衬底上，以形成发光材料浆料层；在第二步骤中，将包括阵列排布的具有凸起的第一光学单元的透光衬底覆盖在所述发光材料浆料层上，使得在所述光学单元的所述凸起的顶部处粘附有所述发光材料浆料；在第三步骤中，移开粘附有所述发光材料浆料的所述透光衬底，并将粘附的所述发光材料浆料预固化，以形成预固化的波长转换部；及在第四步骤中，在第三步骤中获得结构上形成包括阵列排布的具有凹槽的第二光学单元的阻隔部。第四步骤通过如下方式中的一者来进行：(a)翻转在第三步骤中获得的结构，将散射颗粒浆料涂覆在所述透光衬底的凸起侧以形成散射颗粒浆料层，并将此时获得的结构固化，从而获得包括所述透光衬底、所述阻隔部和波长转换部的所述波长转换元件；和(b)将散射颗粒浆料涂覆在另一平板衬底上以形成散射颗粒浆料层，将第三步骤中获得的结构覆盖在所述散射颗粒浆料层上，将此时获得的结构固化，并移除所述另一平板衬 底，从而获得包括所述透光衬底、所述阻隔部和所述波长转换部的所述波长转换元件。
另外，所述透光衬底可以是透镜阵列，所述透镜阵列包括作为所述第一光学单元的半球形透镜单元。或者，所述透光衬底可以是棱镜阵列，所述棱镜阵列包括作为所述第一光学单元的棱柱形棱镜单元。
另外，可以重复执行第二步骤至第三步骤两次以上，使得所述波长转换部具有预定厚度。
另外，所述透光衬底的材料的膨胀或收缩率可以不同于所述发光材料浆料和/或所述散射颗粒浆料的膨胀或收缩率，使得在第四步骤中的固化中，在所述透光衬底和所述阻隔部之间并且/或者在所述透光衬底和所述波长转换部之间形成有空气隙。
另外，所述散射颗粒浆料层可以是通过将散射颗粒分散到硅胶、光固化胶或玻璃中形成的。
另外，所述散射颗粒可以为TiO 2、Al 2O 3、MgO、BaSO 4中的一种或多种。
另外，所述发光材料浆料层可以是通过将发光材料分散到硅胶、光固化胶或玻璃中形成的。
另外，所述发光材料可以为稀土荧光粉或量子点。
根据本发明，棱镜阵列起到模具作用，从而在波长转换元件的制备过程中极大地简化了像素化波长转换元件的制备难度。
另外，根据本发明，通过控制工艺参数、材料参数等使得在透光衬底的表面处形成有空气隙，能够发挥透光衬底本身的光整形作用，对波长转换材料发出的光进行光整形，以得到特定角分布的像素化出射光。
下面结合附图和具体实施例，对本发明的技术方案进行详细说明。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，以下将对实施例描述中所需要使用的附图作简单地介绍，以下描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员而言，在不付出创 造性劳动的前提下，还可以根据这些附图所示实施例得到其它的实施例及其附图。
图1示出根据相关技术的像素化波长转换元件的构造。
图2示出根据相关技术的像素化波长转换元件的准备方法。
图3是示出根据本发明的第一实施例的波长转换元件的具体构造的横截面图。
图4是示出了根据本发明的第一实施例的波长转换元件的制备方法的横截面图。
图5是示出根据本发明的第二实施例的波长转换元件的具体构造的横截面图。
具体实施方式
以下将结合附图对本发明各实施例的技术方案进行清楚、完整的描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所得到的所有其它实施例，都属于本发明所保护的范围。
注意，附图是示意性的，且不是基于实际比例绘制的。附图中图示的部件的相对尺度和比例在尺寸方面被放大或缩小，且任何尺度仅是示例性的且不具有限制性。附图中的相同的结构、元件或部件由相同的附图标记表示。
第一实施例
<波长转换元件的构造>
图3是示出根据本发明的第一实施例的波长转换元件的具体构造的横截面图。
如图3所示，根据本发明的第一实施例的波长转换元件包括波长转换部11、用于对波长转换部11进行光隔离和/或光散射的阻隔部12以及作为透光衬底的透镜阵列13。具体地，透镜阵列13设置在阻隔部12上，且波长转换部11介于阻隔部12和透镜阵列13之间。
这里，透光衬底的形成材料是透光材料，也就是说其允许待被波长转换元件转换的激发光透过，同时也允许转换后的光透过；该透光材料对光的透过率大于30％以上。因此，作为透光衬底的透镜阵列13对入射的激发光进行光整形，并将其引导至波长转换部11。同时，由波长转换部11转换的光可以经由透镜阵列13出射到外部。
在本实施例中，透镜阵列13的透镜单元具有半球形凸起。然而，本发明不限于此。在本发明中，根据实际需要，透镜阵列13的透镜单元的形状可以具有任意的凸起形状。
透镜单元的凸起能够在波长转换元件的制备过程中起到模具作用和定位作用，从而极大地简化了像素化波长转换元件的制备难度。
例如，在平面布置中，透镜阵列13中的多个透镜单元的排布可以是但不限于类似于图1所示的矩阵阵列，并例如也可以是其它阵列。例如，透镜阵列13中的透镜单元可以排布成复眼结构。
阻隔部12和透镜阵列13之间的彼此面对的表面具有基本上匹配的形状。具体地，如图3所示，透镜阵列13的面对阻隔部12的表面形成有具有凸起的透镜单元，且同时阻隔部12的面对透镜阵列13的表面上形成有与各个透镜单元的凸起相对应或相匹配的凹槽。由此，阻隔部12上形成有光隔离和/或光散射单元。阻隔部12上的光隔离和/或光散射单元与透镜阵列13的透镜单元一一对应。光隔离和/或光散射单元能够用于避免相邻的波长转换部之间的光串扰，且还能够通过自身的漫反射特性使更多的光从透镜阵列13的上表面出射。
阻隔部12的形成材料是通过将用于散射激发光的散射颗粒分散于硅胶、光固化胶或玻璃中形成的，使得阻隔部12具有光隔离和/或漫反射特性。这里，例如，散射颗粒可以为TiO 2、Al 2O 3、MgO、BaSO 4等白色颗粒中的一种或多种。
阻隔部12可避免相邻的波长转换部11之间的光串扰，同时，阻隔部12的漫反射特性也使得更多的光从透镜阵列13的上表面出射。
波长转换部11可以设置成与透镜阵列13中的各个透镜单元和阻隔部12的光隔离和/或光散射单元一一对应，并因此具有与透镜阵列13中 的透镜单元和阻隔部12的光隔离和/或光散射单元的数量对应的数量。具体地，每个波长转换部11可以设置在相应透镜单元的凸起顶部和阻隔部12上的光隔离和/或光散射单元的凹槽底部处，并因而介于阻隔部12和透镜阵列13之间。
波长转换部11的形成材料是通过将发光材料分散在硅胶、光固化胶或玻璃中形成的。这里，例如，发光材料可以为常用的稀土荧光粉或量子点等，优选为稀土荧光粉。
波长转换元件可接收从其上方(图3中的上侧)入射的可调制激发光。这里，例如，可以选择蓝激光作为激发光，优选的蓝激光可以是波长为473nm，例如从半导体激光器获得的激光。
具体地，激发光经由透镜阵列13的上表面入射，并穿过透镜阵列13，从而到达波长转换部11。波长转换部11对入射的激发光执行波长转换，以将其转换为特定波长分布的光。
波长转换部11和透镜阵列13之间和/或阻隔部12与透镜阵列13之间可以为光学接触或非光学接触，且优选为非光学接触。
在光学接触的情况下，透镜阵列13只起到支承和模板作用。
另一方面，在非光学接触的情况下，在波长转换部11和/或阻隔部12与透镜阵列13之间形成有引起非光学接触的空气隙，使得各个透镜单元可独自地发挥作用，对各个波长转换部11(即，像素)发出的光进行光整形，从而得到特定角分布的像素化出射光。
<波长转换元件的制备方法>
图4是示出了根据本发明的第一实施例的波长转换元件的制备方法的横截面图。
如图4的(a)所示，首先，将预先制备的发光材料浆料涂覆在平板衬底上，以形成包含发光材料的浆料层。例如，发光材料浆料是通过将发光材料分散在硅胶、光固化胶或玻璃粉中制备的混合浆料。
然后，如图4的(b)所示，将透镜阵列13覆盖在发光材料浆料层上，使得透镜阵列13中的透镜单元的顶部粘附一定量的发光材料浆料。
然后，如图4的(c)所示，将粘附有发光材料浆料的透镜阵列13从发光材料浆料层上移开，并对粘附的发光材料浆料进行加热或光照射，从而将粘附在透镜单元上的波长转换材料预固化，以得到在透镜阵列13上形成波长转换部11的结构。
通过控制发光材料浆料层的厚度、在将透镜阵列覆盖在发光材料浆料层上时施加在透镜阵列上的作用力等参数，能够控制粘附在透镜阵列13的单个透镜单元上的波长转换部11的尺寸。
为得到预定厚度的波长转换部11，可重复执行图4的(b)至图4的(c)的过程两次以上。
然后，在图4的(c)所示的结构上形成阻隔部12。例如，可以采用两种不同的制备方法来形成阻隔部12。
如图4的(d1)所示，在第一种制备方法中，将在图4(c)所示的过程中得到的结构翻转，并利用刮涂等方法在透镜阵列13的凸起侧涂覆预先制备的散射颗粒浆料，以形成包含散射颗粒的浆料层。例如，散射颗粒浆料使通过将散射颗粒分散在硅胶、光固化胶或玻璃粉中制备的混合浆料。
最后，例如通过加热或光照射对此时获得的结构进行固化以形成阻隔部12，从而得到如图4的(e)所示的像素化波长转换元件。
另一方面，在第二种制备方法中，首先将散射颗粒浆料涂覆在平板衬底上，以形成包含散射颗粒的浆料层。然后，如图4的(d2)所示，以使透镜阵列13的凸起侧面对散射颗粒浆料层的方式，将图4的(c)所示的结构覆盖在散射颗粒浆料层上。
通过控制散射颗粒浆料层的厚度、施加在透镜阵列13上的作用力等参数，可以使散射颗粒浆料全部填充或部分填充透镜阵列的相邻透镜单元之间的间隙。
最后，例如通过加热或光照射对此时获得结构进行固化以形成阻隔部12，并移除平板衬底，从而得到如图4的(e)所示的像素化波长转换元件。
不论采用图4的(d1)所示的第一种制备方法还是采用图4的(d2)所示的第二种制备方法，在获得的遮光部12的面对透镜阵列13的表面上形成了与透镜阵列13的透镜单元一一对应的光隔离和/或光散射单元。而且，光隔离和/或光散射单元具有基本上对应于或匹配于透镜单元的凸起形状的凹槽形状。
波长转换部11和/或阻隔部12在图4的(e)所示的热固化或光固化过程中会发生体积收缩。优选地，对透镜阵列13的材料与波长转换部11和/或阻隔部12的材料进行选择，使得透镜阵列13的材料的膨胀或收缩率不同于波长转换部11和/或阻隔部12的材料的膨胀或收缩率。在这种情况下，在固化之后，波长转换部11和/或阻隔部12与透镜阵列13之间形成引起非光学接触的空气隙，使得各个透镜单元可独自地发挥作用，对波长转换部11发出的光进行光整形，从而得到特定角分布的像素化出射光。
根据第一实施例，在波长转换元件的制备过程中，透镜阵列起到模具作用，从而极大地简化了像素化波长转换元件的制备难度。
另外，根据第一实施例，在波长转换元件的制备过程中，通过控制工艺参数、材料参数使得透镜阵列的表面处有空气隙，能够发挥透镜阵列本身的光整形作用，对波长转换材料发出的光进行光整形，以得到特定角分布的像素化出射光。
第二实施例
<波长转换元件的构造>
图5是示出根据本发明的第二实施例的波长转换元件的具体构造的横截面图。
与第一实施例的波长转换元件相比，根据本实施例的波长转换元件的区别在于，对于透光衬底，使用棱镜阵列23代替透镜阵列13。棱镜阵列23包括多个具有棱柱形凸起的棱镜单元。棱镜阵列23可直接使用成熟的棱镜膜(BEF)制备工艺得到。除此之外，根据第二实施例的波长转换元件的其它构造与根据第一实施例的波长转换元件相同。
具体地，根据第二实施例的波长转换元件包括波长转换部21、用于 对波长转换部21进行光隔离和/或光散射的阻隔部22以及作为透光衬底的透镜阵列23。类似于第一实施例，棱镜阵列23设置在阻隔部22上，且波长转换部21介于阻隔部22和棱镜阵列23之间。
类似于第一实施例，在本实施例中，棱镜阵列23的棱镜单元具有棱柱凸起。然而，本发明不限于此。在本发明中，根据实际需要，棱镜阵列23的棱镜单元的形状可以具有任意的凸起形状。棱镜单元的凸起能够在波长转换元件的制备过程中起到模具作用和定位作用，从而极大地简化了像素化波长转换元件的制备难度。
类似于第一实施例，在本实施例中，波长转换部21和棱镜镜阵列23之间和/或阻隔部22与棱镜镜阵列23之间可以为光学接触或非光学接触。在光学接触的情况下，棱镜镜阵列23只起到支承和模板作用。另一方面，在非光学接触的情况下，棱镜镜阵列还可以同时起到对波长转换部21发出的光进行光整形的作用。优选地，波长转换部21和棱镜镜阵列23之间和/或阻隔部22与棱镜镜阵列23之间为非光学接触。
当棱镜镜阵列23与波长转换部21、阻隔材料22之间为非光学接触时，在波长转换部21和/或阻隔部22与透镜阵列23之间形成有引起非光学接触的空气隙，使得各个棱镜单元可独自地发挥作用，对波长转换部21发出的光进行光整形，从而得到特定角分布的像素化出射光。
<波长转换元件的制备方法>
根据第二实施例的波长转换材料的制备方法类似于根据第一实施例的波长转换元件的制备方法。它们之间的唯一不同点在于在根据第二实施例的制备过程中使用了棱镜阵列23以取代透镜阵列13。
类似于第一实施例，根据第二实施例，在波长转换元件的制备过程中，棱镜阵列起到模具作用和定位作用，从而极大地简化了像素化波长转换元件的制备难度。
另外，类似于第一实施例，根据第二实施例，在波长转换元件的制备过程中，通过控制工艺参数、材料参数使得棱镜阵列的表面处有空气隙，能够发挥棱镜阵列本身的光整形作用，对波长转换材料发出的光进行光整形，以得到特定角分布的像素化出射光。
虽然在本发明的第一实施例和第二实施例中利用透镜阵列13和棱镜阵列23说明了透光衬底，然而本发明的透光衬底还可以使用包括具有其它凸起的光学单元的透光衬底。透明衬底的光学单元的凸起能够在波长转换元件的制备过程中起到模具作用和定位作用，从而极大地简化了像素化波长转换元件的制备难度。
尽管在上面已经参照附图说明了本发明的实施例，但是本发明不限于此，且本领域技术人员应理解，在不偏离本发明随附权利要求书限定的精神或范围的情况下，可以做出各种改变、组合、次组合以及变型。

Claims (15)

  1. 一种波长转换元件，其包括：
    透光衬底，所述透光衬底包括阵列排布的具有凸起的第一光学单元；
    阻隔部，所述阻隔部包括阵列排布的具有凹槽的第二光学单元，所述透光衬底布置在所述阻隔部上，使得所述透光衬底的所述第一光学单元与所述阻隔部的所述第二光学单元一一对应，且彼此面对；及
    波长转换部，所述波长转换部布置在所述透光衬底的所述第一光学单元的所述凸起的顶部以及所述阻隔部的所述第二光学单元的所述凹槽的底部，并介于所述阻隔部与所述透光衬底之间。
  2. 根据权利要求1所述的波长转换元件，其中，
    所述透光衬底是透镜阵列，所述透镜阵列包括作为所述第一光学单元的半球形透镜单元，或者
    所述透光衬底是棱镜阵列，所述棱镜阵列包括作为所述第一光学单元的棱柱形棱镜单元。
  3. 根据权利要求1或2所述的波长转换元件，其中，在所述透光衬底和所述阻隔部之间并且/或者在所述透光衬底和所述波长转换部之间形成有空气隙。
  4. 根据权利要求1或2所述的波长转换元件，其中，所述阻隔部是通过将散射颗粒分散到硅胶、光固化胶或玻璃中并进行固化形成的。
  5. 根据权利要求4所述的波长转换元件，其中，所述散射颗粒为TiO 2、Al 2O 3、MgO、BaSO 4中的一种或多种。
  6. 根据权利要求1或2所述的波长转换元件，其中，所述波长转换部是通过将发光材料分散到硅胶、光固化胶或玻璃中并进行固化形成的。
  7. 根据权利要求6所述的波长转换元件，其中，所述发光材料为稀 土荧光粉或量子点。
  8. 一种用于制备波长转换元件的方法，其包括：
    在第一步骤中，将发光材料浆料涂覆在平板衬底上，以形成发光材料浆料层；
    在第二步骤中，将包括阵列排布的具有凸起的第一光学单元的透光衬底覆盖在所述发光材料浆料层上，使得在所述光学单元的所述凸起的顶部处粘附有所述发光材料浆料；
    在第三步骤中，移开粘附有所述发光材料浆料的所述透光衬底，并将粘附的所述发光材料浆料预固化，以形成预固化的波长转换部；及
    在第四步骤中，在第三步骤中获得结构上形成包括阵列排布的具有凹槽的第二光学单元的阻隔部，
    其中，第四步骤通过如下方式中的一者来进行：
    (a)翻转在第三步骤中获得的结构，将散射颗粒浆料涂覆在所述透光衬底的凸起侧以形成散射颗粒浆料层，并将此时获得的结构固化，从而获得包括所述透光衬底、所述阻隔部和波长转换部的所述波长转换元件；和
    (b)将散射颗粒浆料涂覆在另一平板衬底上以形成散射颗粒浆料层，将第三步骤中获得的结构覆盖在所述散射颗粒浆料层上，将此时获得的结构固化，并移除所述另一平板衬底，从而获得包括所述透光衬底、所述阻隔部和所述波长转换部的所述波长转换元件。
  9. 根据权利要求8所述的方法，其中，
    所述透光衬底是透镜阵列，所述透镜阵列包括作为所述第一光学单元的半球形透镜单元，或者
    所述透光衬底是棱镜阵列，所述棱镜阵列包括作为所述第一光学单元的棱柱形棱镜单元。
  10. 根据权利要求8或9所述的方法，其中，重复执行第二步骤至第三步骤两次以上，使得所述波长转换部具有预定厚度。
  11. 根据权利要求8或9所述的方法，其中，所述透光衬底的材料的膨胀或收缩率不同于所述发光材料浆料和/或所述散射颗粒浆料的膨胀或收缩率，使得在第四步骤中的固化中，在所述透光衬底和所述阻隔部之间并且/或者在所述透光衬底和所述波长转换部之间形成有空气隙。
  12. 根据权利要求8或9所述的方法，其中，所述散射颗粒浆料层是通过将散射颗粒分散到硅胶、光固化胶或玻璃中形成的。
  13. 根据权利要求12所述的方法，其中，所述散射颗粒为TiO 2、Al 2O 3、MgO、BaSO 4中的一种或多种。
  14. 根据权利要求8或9所述的方法，其中，所述发光材料浆料层是通过将发光材料分散到硅胶、光固化胶或玻璃中形成的。
  15. 根据权利要求14所述的方法，其中，所述发光材料为稀土荧光粉或量子点。
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