WO2020020028A1

WO2020020028A1 - Electronic device

Info

Publication number: WO2020020028A1
Application number: PCT/CN2019/096313
Authority: WO
Inventors: 沈建伟
Original assignee: 维沃移动通信有限公司
Priority date: 2018-07-26
Filing date: 2019-07-17
Publication date: 2020-01-30
Also published as: CN108966568B; CN108966568A

Abstract

Disclosed is an electronic device, relating to the technical field of terminals. The specific solution is: an electronic device comprising a first PCB, a second PCB connected to the first PCB, and at least one first element connected to the second PCB, wherein a through hole is provided on the first PCB; the second PCB is arranged at a position located at one side of the first PCB and opposite the through hole; and the at least one first element is arranged on the second PCB by means of the through hole. The embodiments of the present disclosure are applied to a scenario where a PCB and an element in an electronic device are laid out.

Description

Electronic equipment

Cross-reference to related applications

This application claims the priority of a Chinese patent application filed on July 26, 2018 with an application number of 201810834467.4 and an application name of "an electronic device", the entire contents of which are incorporated herein by reference.

Technical field

Embodiments of the present disclosure relate to the technical field of terminals, and in particular, to an electronic device.

Background technique

With the development of terminal technology, the size of portable electronic products such as mobile terminals is getting smaller and smaller, which is convenient for users to carry. However, with more and more functions of the mobile terminal, more and more internal devices of the mobile terminal, so the reasonable use of the internal space of the mobile terminal is particularly important.

At present, in order to lay out the internal components of the mobile terminal in a more reasonable manner, the printed circuit board (PCB) in the mobile terminal can be dug for high-level devices such as receivers, cameras, and headphone jacks, and these The device is laid out in a hole. Exemplarily, a receiver is taken as an example for description herein. As shown in Figure 1, you can dig a hole in the PCB 01, and set the receiver 02 in this hole (illustrated by a dashed circle in Figure 1), and weld two metal brackets 04 on the PCB 01, and then place the receiver 02 The two pins 03 are respectively connected to the two metal brackets 04 for supporting the receiver 02.

However, after digging a hole in the PCB by using the above method, the excavated area on the PCB cannot be routed, and other devices cannot be set, so the space on the PCB will be wasted, and the entire internal space of the mobile terminal will be wasted.

Summary of the Invention

In a first aspect, an embodiment of the present disclosure provides an electronic device. The electronic device may include a first PCB, a second PCB connected to the first PCB, and at least one first component connected to the second PCB; the first PCB A through hole is disposed on the second PCB, and the second PCB is disposed on one side of the first PCB and opposite to the through hole. At least one first component is disposed on the second PCB through the through hole.

In a second aspect, an embodiment of the present disclosure provides a manufacturing method. The manufacturing method may include: setting a through hole on a first PCB; setting a second PCB on a side of the first PCB and at a position opposite to the through hole, the The second PCB is connected to the first PCB; at least one first element is disposed on the second PCB through the through hole, and the at least one first element is connected to the second PCB.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of an electronic device provided by related technologies; FIG.

FIG. 2 is one of the schematic diagrams of an electronic device according to an embodiment of the present disclosure; FIG.

3 is a schematic plan view of the schematic diagram shown in FIG. 2 according to an embodiment of the present disclosure;

4 is a second schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

5 is a third schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 6 is one of the schematic diagrams of a preparation method provided by an embodiment of the present disclosure; FIG.

7 is a second schematic view of a preparation method provided by an embodiment of the present disclosure;

8 is a third schematic view of a preparation method provided by an embodiment of the present disclosure;

9 is a fourth schematic view of a preparation method provided by an embodiment of the present disclosure;

FIG. 10 is a fifth schematic diagram of a preparation method provided by an embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without making creative efforts fall within the protection scope of the present disclosure.

The terms "first" and "second" in the specification and claims of the embodiments of the present disclosure are used to distinguish different objects, rather than to describe a specific order of the objects. For example, the first PCB and the second PCB are used to distinguish different PCBs, rather than to describe a specific order of the PCBs. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of “plurality” means two or more.

The term "and / or" herein is an association relationship describing an associated object, which means that there can be three kinds of relationships, for example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone These three situations. The symbol "/" in this text indicates that the associated object is or, for example, A / B means A or B.

In the embodiments of the present disclosure, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present disclosure should not be construed as more preferred or advantageous over other embodiments or designs. Rather, the use of the words "exemplary" or "for example" is intended to present the relevant concept in a concrete manner.

An embodiment of the present disclosure provides an electronic device. The electronic device may include a first PCB, a second PCB connected to the first PCB, and at least one first component connected to the second PCB. Hole, the second PCB is disposed on one side of the first PCB and opposite to the through hole, and at least one first component is disposed on the second PCB through the through hole. Since the first PCB is provided with a through hole, and a second PCB is provided on one side of the first PCB and opposite to the through hole, and at least one first component is provided on the second PCB through the through hole, therefore The electronic device provided by the disclosed embodiment uses a cut-out area on the first PCB (that is, sets a second PCB in the cut-out area), so that the cut-out area on the first PCB can be routed and can be set. Other components, so that the waste of space on the first PCB can be avoided, and the entire internal space of the electronic device can be used reasonably.

The electronic device provided by the embodiment of the present disclosure can be applied to a scenario in which PCBs and components in the electronic device are laid out. Specifically, it can be applied to a scenario in which a second PCB and at least one component (such as at least one first component and at least one second component) are set in an electronic device after a hole is digged in the first PCB.

An electronic device and a manufacturing method thereof provided in the embodiments of the present disclosure will be described in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.

At present, in the related technology, after digging holes in the PCB, the area cut out on the PCB cannot be routed, and other devices cannot be set. Therefore, the space on the PCB is wasted and the entire internal space of the mobile terminal is wasted The problem.

In order to solve the above technical problems, an electronic device provided by an embodiment of the present disclosure is provided. FIG. 2 shows a possible structural diagram of an electronic device according to an embodiment of the present disclosure. As shown in FIG. 2, the electronic device may include a first PCB 10, a second PCB 11 connected to the first PCB 10, and At least one first element 12 connected to the second PCB 11.

As shown in FIG. 2, in the embodiment of the present disclosure, a through hole is provided on the first PCB 10 (indicated by a dotted circle in FIG. 2), and a second PCB 11 is provided on one side of the first PCB 10 and is opposite to the through hole Position, at least one first element 12 (illustrated as a first element in FIG. 2) is disposed on the second PCB 11 through a through hole.

An embodiment of the present disclosure provides an electronic device. The electronic device may include a first PCB 10, a second PCB 11 connected to the first PCB 10, and at least one first element 12 connected to the second PCB 11, where the first A through hole is provided on the PCB 10, and a second PCB 11 is provided on one side of the first PCB 10 and opposite to the through hole. At least one first element 12 is provided on the second PCB 11 through the through hole. Because the first PCB 10 is provided with a through hole, and a side of the first PCB 10 is provided with a second PCB 11 opposite to the through hole, and at least one first element 12 is provided on the second PCB through the through hole. Therefore, the electronic device provided in the embodiment of the present disclosure utilizes a region that is dug out on the first PCB 10 (that is, sets a second PCB 11 in the dug out area), so that the first PCB 10 is dug out. The area can be routed and other components can be arranged, so that the waste of space on the first PCB 10 can be avoided, and the entire internal space of the electronic device can be reasonably used.

Optionally, in the embodiment of the present disclosure, the second PCB 11 and the first PCB 10 may be connected by soldering.

Optionally, in the embodiment of the present disclosure, a first solder joint is provided on a first region of the first PCB 10 described above, and a second solder joint is provided on a second region of the second PCB 11, the first solder joint and the The second solder joint is connected, and the first solder joint and the second solder joint are located on two sides of the through hole.

Optionally, in the embodiment of the present disclosure, the first solder joint and the second solder joint may be connected by solder; or, the first solder joint and the second solder joint may also be connected by a wire, and both ends of the wire are connected with These two solder joints (ie, the first solder joint and the second solder joint) are connected.

Optionally, in the embodiment of the present disclosure, the first region may be an edge region on the first PCB, and the second region may be an edge region on the second PCB.

Optionally, in the embodiment of the present disclosure, the number of the first solder joints may be at least one, and the number of the second solder joints may be at least one.

Optionally, in the embodiment of the present disclosure, the above-mentioned second PCB 11 and the first PCB 10 may also be connected and conducted through a wiring method.

Optionally, in the embodiment of the present disclosure, the at least one first element 12 may be at least one of a receiver, a camera, and a headphone socket.

Optionally, in the embodiment of the present disclosure, the size of the second PCB 11 in the first direction is greater than or equal to the size of the through hole in the first direction, and the size of the second PCB 11 in the second direction is greater than or equal to the size of the through hole. The size of the second direction is different from the first direction.

Optionally, in the embodiment of the present disclosure, the first direction is perpendicular to the second direction.

Exemplarily, in conjunction with FIG. 2, FIG. 3 shows a top view of the electronic device shown in FIG. 2. As shown in FIG. 3, the first direction 13 is perpendicular to the second direction 14, and the size of the second PCB 11 in the first direction 13 is d1 and the size of the second PCB 14 is d2; the through hole 15 is in the first direction The dimension in the direction 13 is d3 and the dimension in the second direction 14 is d4; wherein d1 is greater than or equal to d3 and d2 is greater than or equal to d4.

In the embodiment of the present disclosure, since the size of the second PCB 11 in the first direction is greater than or equal to the size of the through hole in the first direction, and the size of the second PCB 11 in the second direction is greater than or equal to the size of the through hole in the second direction Size, so that the second PCB 11 can completely cover the through hole.

Optionally, in the embodiment of the present disclosure, the second PCB 11 may be a multi-layer circuit board.

Optionally, in the embodiment of the present disclosure, at least one first ground point is provided on the first PCB 10, and at least one second ground point is provided on the second PCB 11, the at least one second ground point and at least one first ground point A ground point is connected.

In the embodiment of the present disclosure, since at least one first ground point is provided on the first PCB 10 and at least one second ground point is provided on the second PCB 11, the at least one second ground point is connected to the at least one first ground point Therefore, it can function as an electronic shield to avoid the problem that the at least one first component 12 connected to the second PCB 11 receives interference.

Optionally, in the embodiment of the present disclosure, as shown in FIG. 2, as shown in FIG. 4, the above electronic device may further include: at least one second element 16 connected to the second PCB 11. Among them, at least one second element 16 may be disposed on the second PCB 11 and on a side opposite to the at least one first element 12.

In the embodiment of the present disclosure, the second PCB 11 is disposed on one side of the first PCB 10 and opposite to the through hole, and at least one second element 16 is disposed on the second PCB 11 and is connected to at least one first The component 12 is on the opposite side, so the space on the first PCB 10 is used more reasonably, and the entire internal space of the electronic device is used reasonably.

Optionally, in the embodiment of the present disclosure, as shown in FIG. 2, as shown in FIG. 5, a groove is provided on the second PCB 11 opposite to the through hole, and the direction of the opening of the groove is opposite to the through hole. The at least one first element 12 is disposed in the groove.

It can be understood that, in the embodiment of the present disclosure, the at least one first element 12 is disposed on the second PCB 11 through a groove.

Optionally, in the embodiment of the present disclosure, the size of the groove in the third direction is smaller than the size of the second PCB in the third direction (that is, the thickness of the second PCB 11), the third direction is perpendicular to the first direction, and Perpendicular to the second direction.

In the embodiment of the present disclosure, since a groove is provided on the second PCB 11 and opposite to the through hole, and at least one first element 12 is disposed in the groove, a waste of space on the first PCB 10 is avoided. While rationally using the entire internal space of the electronic device, the thickness of the electronic device can be reduced.

Optionally, in the embodiment of the present disclosure, the electronic device may further include a back cover and a display screen, at least one of the first elements 12 in FIG. 2 facing the display screen, and at least one of the second elements 16 in FIG. 4 facing rear. cover.

Optionally, in the embodiment of the present disclosure, the electronic device may be a mobile terminal.

FIG. 6 shows a flowchart of a preparation method provided by an embodiment of the present disclosure. As shown in FIG. 6, the preparation method may include steps 201 to 203 described below.

Step 201: Set a through hole on the first PCB.

Step 202: Set a second PCB on one side of the first PCB and at a position opposite to the through hole.

In the embodiment of the present disclosure, the second PCB is connected to the first PCB.

Step 203: Set at least one first component on the second PCB through the through hole.

In the embodiment of the present disclosure, the at least one first component is connected to the second PCB.

It should be noted that, for specific descriptions of the foregoing steps 201 to 203, reference may be made to related descriptions in the foregoing embodiments, and details are not described herein again.

An embodiment of the present disclosure provides a manufacturing method. A through hole may be provided on a first PCB, a second PCB may be provided on a side of the first PCB and opposite to the through hole, and at least one first The component is disposed on the second PCB. Since a through hole can be provided on the first PCB, and a second PCB is provided on one side of the first PCB opposite to the through hole, and at least one first component is provided on the second PCB through the through hole, The preparation method provided in the embodiment of the present disclosure utilizes a cut-out area on the first PCB (that is, sets a second PCB in the cut-out area), so that the cut-out area on the first PCB can be routed, and By providing other components, the waste of space on the first PCB can be avoided, and the entire internal space of the electronic device can be reasonably used.

Optionally, in the embodiment of the present disclosure, the size of the second PCB in the first direction is greater than or equal to the size of the through hole in the first direction, and the size of the second PCB in the second direction is greater than or equal to the size of the through hole in the second direction. Directional dimensions.

Optionally, in the embodiment of the present disclosure, with reference to FIG. 6, as shown in FIG. 7, the above step 202 may be specifically implemented by the following step 202 a.

Step 202a: Connect the second PCB and the first PCB by soldering on one side of the first PCB and at a position opposite to the through hole.

Optionally, in the embodiment of the present disclosure, the second PCB and the first PCB may be soldered by a reflow soldering process.

It should be noted that, for the specific description of the above step 202a, reference may be made to the related description in the foregoing embodiment, and details are not described herein again.

Optionally, in the embodiment of the present disclosure, at least one first ground point is provided on the first PCB, and at least one second ground point is provided on the second PCB. With reference to FIG. 6, as shown in FIG. 8, after the above step 202, the preparation method provided by the embodiment of the present disclosure may further include the following step 301.

Step 301: Connect at least one first ground point and at least one second ground point.

It should be noted that, for the detailed description of the foregoing step 301, reference may be made to related descriptions in the foregoing embodiments, and details are not described herein again.

In the embodiment of the present disclosure, since at least one first ground point is provided on the first PCB and at least one second ground point is provided on the second PCB, at least one second ground point is connected to at least one first ground point. After that, it can function as an electronic shield to avoid the problem that the at least one first component connected to the second PCB receives interference.

Optionally, in the embodiment of the present disclosure, with reference to FIG. 6 and FIG. 9, after the above step 202, the preparation method provided by the embodiment of the present disclosure may further include the following step 401.

In step 401, at least one second component is disposed on the second PCB and on a side opposite to the at least one first component.

In the embodiment of the present disclosure, the at least one second element is connected to the second PCB.

It should be noted that, for the detailed description of the foregoing step 401, reference may be made to related descriptions in the foregoing embodiments, and details are not described herein again.

In the embodiment of the present disclosure, after the second PCB is disposed on one side of the first PCB and opposite to the through hole, at least one first PCB may be disposed on the second PCB and on the side opposite to the at least one first element. Two components, therefore, the space on the first PCB is more reasonably used, and the entire internal space of the electronic device is reasonably used.

Optionally, in the embodiment of the present disclosure, in combination with FIG. 6 and as shown in FIG. 10, after the above step 202, the preparation method provided by the embodiment of the present disclosure may further include the following step 501, and the above step 203 may specifically pass The following step 203a is implemented.

In step 501, a groove is provided on the second PCB at a position opposite to the through hole.

In the embodiment of the present disclosure, the direction of the opening of the groove is opposite to the through hole.

In step 203a, at least one first element is disposed in the groove.

It can be understood that in the embodiments of the present disclosure, at least one first element may be disposed on the second PCB through a groove.

It should be noted that, for specific descriptions of the foregoing

steps

501 and 203a, reference may be made to related descriptions in the foregoing embodiments, and details are not described herein again.

In the embodiment of the present disclosure, since a groove can be provided on the second PCB and opposite to the through hole, and at least one first element is provided in the groove, a waste of space on the first PCB is reasonably avoided. While utilizing the entire internal space of the electronic device, the thickness of the electronic device can be reduced.

It should be noted that, in this article, the terms "including", "including" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, It also includes other elements not explicitly listed, or elements inherent to such a process, method, article, or device. Without more restrictions, an element limited by the sentence "including a ..." does not exclude that there are other identical elements in the process, method, article, or device that includes the element.

Through the description of the above embodiments, those skilled in the art can clearly understand that the methods in the above embodiments can be implemented by means of software plus a necessary universal hardware platform, and of course, also by hardware, but in many cases the former is better. Implementation. Based on such an understanding, the technical solution of this application that is essentially or contributes to related technologies can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, and optical disk) ) Includes several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in the embodiments of the present application.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the specific implementations described above, and the specific implementations described above are merely schematic and not restrictive. Those of ordinary skill in the art at Under the enlightenment of this application, many forms can be made without departing from the scope of the present application and the scope of protection of the claims, all of which fall into the protection of this application.

Claims

An electronic device includes a first printed circuit board PCB, a second PCB connected to the first PCB, and at least one first element connected to the second PCB;

The first PCB is provided with a through hole, the second PCB is provided on one side of the first PCB and is opposite to the through hole, and the at least one first element is provided through the through hole. On the second PCB.
The electronic device according to claim 1, wherein the second PCB and the first PCB are connected by soldering.
The electronic device according to claim 2, wherein a first solder joint is provided on a first region of the first PCB, a second solder joint is provided on a second region of the second PCB, and the first solder joint It is connected to the second solder joint, and the first solder joint and the second solder joint are located on two sides of the through hole.
The electronic device according to any one of claims 1 to 3, at least one first ground point is provided on the first PCB, at least one second ground point is provided on the second PCB, and the at least one A second ground point is connected to the at least one first ground point.
The electronic device according to claim 1, further comprising: at least one second element connected to the second PCB;

The at least one second element is disposed on the second PCB and on a side opposite to the at least one first element.
The electronic device according to claim 1 or 5, wherein a groove is provided on the second PCB and opposite to the through hole, and an opening direction of the groove is opposite to the through hole. At least one first element is disposed in the groove.
The electronic device according to claim 1, the size of the second PCB in the first direction is greater than or equal to the size of the through hole in the first direction, and the size of the second PCB in the second direction is The size is greater than or equal to the size of the through hole in the second direction, and the first direction is different from the second direction.