WO2018171054A1

WO2018171054A1 - Printed circuit board structure and electronic device

Info

Publication number: WO2018171054A1
Application number: PCT/CN2017/088292
Authority: WO
Inventors: 尹帮实; 刘秀兰; 罗建红; 郭阳
Original assignee: 华为技术有限公司
Priority date: 2017-03-24
Filing date: 2017-06-14
Publication date: 2018-09-27
Also published as: CN108702843A; CN108702843B

Abstract

A printed circuit board structure and an electronic device. The printed circuit board structure comprises: a first printed circuit board (10), the first printed circuit board (10) comprising at least one first hollow region (101), a plurality of first signal connections (103) arranged at a first side of the first hollow region (101), and a plurality of second signal connections (105) arranged at a second side of the hollow region (101), the plurality of first signal connections (103) and the plurality of second signal connections (105) being located on a first surface (107) of the first printed circuit board (10); and a second printed circuit board (20) being stacked on the first surface (107) of the first printed circuit board (10), the second printed circuit board (20) covering at least a first signal connection (103) and a second signal connection (105) corresponding to one first hollow region (101). The second printed circuit board (20) includes a plurality of wires, the opposite ends of each wire being respectively connected to at least one first signal connection (103) and at least one second signal connection (105) of the first hollow region (101). By implementing embodiments of the present invention, the wiring space and the wiring amount of the printed circuit board can be increased.

Description

Printed circuit board structure and electronic device

The present application claims priority to Chinese Patent Application No. JP-A No. No. No. No. No. No. No. No. No. Publication No.

Technical field

Embodiments of the present invention relate to the field of electronic technologies, and in particular, to a printed circuit board structure and an electronic device.

Background technique

In the field of electronic technology, printed circuit boards are providers of electrical connections for electronic components, and are widely used in mobile electronic devices, wearable devices, medical testing equipment, precision instruments, and the like. Depending on the shape of the printed circuit board or the needs of the device, it is often necessary to break through the printed circuit board and perform hollowing or opening.

At present, on the printed circuit board after hollowing or opening, any side of the punch-through area sometimes needs to be electrically connected through the wiring. As shown in FIG. 1, there are penetrating areas a and b on the printed circuit board. When the left side area c and the right side area d of the circuit board need to be connected, the punched area a is limited to be surrounded by the punching area. The trace is around the a, if the number of traces of the single-layer circuit board above the perforation is A, the number of traces of the single-layer circuit board below is B, and the number of printed circuit boards is N, then the total trace on the printed circuit board The number is X = (A + B) * N.

However, in the wiring method provided by the prior art, due to the existence of the hollowed-out area, the space available for the traces on both sides of the punch-through area on the printed circuit board becomes smaller, and the number of the traces is limited, when the punch-through area is two There is a large demand for side wiring, or when the penetration area is large, the number of line layouts on a fixed-size printed circuit board cannot be satisfied.

Summary of the invention

Embodiments of the present invention disclose a printed circuit board structure and an electronic device for increasing the routing space and the number of traces of the printed circuit board.

A first aspect discloses a printed circuit board structure, including: a first printed circuit board, the first printed circuit board including at least one first hollow area, and a plurality of first dummy sides disposed on a first side of the first hollow area a first signal connection point, and a plurality of second signal connection points disposed on the second side of the first hollow area, where the plurality of first signal connection points and the plurality of second signal connection points are located a first surface of the first printed circuit board; a second printed circuit board disposed on the first surface of the first printed circuit board, the second printed circuit board covering at least one of the first hollow areas a first signal connection point and a second signal connection point; the second printed circuit board includes a plurality of wires, and opposite ends of each of the wires are respectively associated with at least one of the first signals of the first hollow region A connection point is coupled to at least one of the second signal connection points. The second printed circuit board may be stacked in the hollow region of the first printed circuit board, and the first printed circuit board and the second printed circuit board are connected by solder joints, so that the wiring space around the hollow area can be expanded in the longitudinal range. Increases the wiring space and the number of traces of the printed circuit board.

In one embodiment, the first printed circuit board further includes a plurality of third signal connection points disposed on a first side of the first hollow region, and a second side disposed on the second side of the first hollow region a plurality of fourth signal connection points, the plurality of third signal connection points and the plurality of fourth signal connection points are both located on a second surface of the first printed circuit board; the printed circuit board structure further comprises a layer a second printed circuit board disposed on the second surface of the first printed circuit board, The second printed circuit board covers at least one of the third signal connection point and the fourth signal connection point corresponding to the first hollow area. The second printed circuit board can be added to the lower two surfaces of the first printed circuit board, and the number and thickness of the second printed circuit board can be expanded in two directions, thereby increasing the number of traces around the cutout.

In one embodiment, the second printed circuit board includes a wiring area surrounding the first hollow area, and the second hollow area is continuous with the first hollow area. A plurality of wires are disposed in the wiring area.

In one embodiment, the wiring region partially surrounds the first hollow region, or the wiring region is closed around the first hollow region. The layout area and shape of the wiring area of the second printed circuit board may be laid out according to the shape requirements of the first printed circuit board.

In one embodiment, the second printed circuit board is a single layer printed circuit board, and the plurality of wires are disposed on a surface of the single layer printed circuit board.

In one embodiment, the second printed circuit board is a multilayer printed circuit board, and the plurality of wires are disposed on a surface of at least two of the plurality of printed circuit boards.

In one embodiment, the plurality of first signal connection points, the plurality of second signal connection points, the plurality of third signal connection points, and the plurality of fourth signal connection points are solder joints, The second circuit board is connected to the solder joint by soldering.

In one embodiment, the second printed circuit board is further provided with a plurality of via holes corresponding to the positions of the first side and the second side, and the opposite ends of the plurality of wires respectively pass through the plurality of wires A via is connected to the solder joint.

In one embodiment, the first printed circuit board is a multilayer printed circuit board, and the solder joints are respectively electrically connected to at least two printed circuit boards of the first printed circuit board.

A second aspect of the invention discloses an electronic device comprising the printed circuit board structure as disclosed in the first aspect and any of the possible implementations of the first aspect.

DRAWINGS

1 is a schematic view of a trace around a hollowed out area of a printed circuit board in the prior art;

2 is a three-dimensional schematic diagram of a printed circuit board structure according to an embodiment of the present invention;

3A is a schematic structural diagram of a first printed circuit board according to an embodiment of the present invention;

3B is a schematic structural diagram of a second printed circuit board according to an embodiment of the present invention;

4 is a schematic diagram showing the positional relationship between a first printed circuit board and a second printed circuit board according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention; FIG.

6 is a schematic structural diagram of another printed circuit board according to an embodiment of the present invention;

7 is a schematic longitudinal cross-sectional structural view of a structure of a printed circuit board according to an embodiment of the present invention;

8 is a schematic longitudinal cross-sectional structural view of another printed circuit board according to an embodiment of the present invention;

FIG. 9 is a schematic longitudinal cross-sectional view showing the structure of still another printed circuit board according to an embodiment of the present invention.

detailed description

Embodiments of the present invention disclose a printed circuit board structure for increasing the routing space and the number of traces of a printed circuit board. The details are described below separately.

Referring to FIG. 2, an embodiment of the present invention provides a printed circuit board structure 100, which can be applied to terminal devices such as mobile portable terminals, desktop computers, wearable devices, medical testing devices, and experimental testing devices. To achieve centralized layout of electronic components and corresponding circuits.

The printed circuit board structure 100 includes a first printed circuit board 10 and a second printed circuit board 20. The first printed circuit board 10 includes at least one first hollow area 101, and different sides of the first hollow area 101 are respectively provided with a plurality of first signal connection points 103 and a plurality of second signal connection points 105.

The second printed circuit board 20 is stacked on the first surface 107 of the first printed circuit board 10 and covers at least one first signal connection point 103 and second signal connection point 105 corresponding to the first hollow area 101. The second printed circuit board 20 may be provided with a plurality of wires 201 (FIG. 3B) for establishing an electrical connection relationship between the first signal connection point 103 and the second signal connection point 105.

Please refer to FIG. 3A. FIG. 3A is a schematic structural diagram of a first printed circuit board 10 according to an embodiment of the present invention. In the embodiment of the present invention, the first printed circuit board 10 includes at least one first hollow area 101, a plurality of first signal connection points 103 disposed on the first side 102 of the first hollow area 101, and disposed at the first a plurality of second signal connection points 105 of the second side 104 of the first hollow region 101, the plurality of first signal connection points 103 and the plurality of second signal connection points 105 are located in the first printed circuit The first surface 107 of the board 10.

Specifically, the first hollow region 101 is a puncture region formed to meet the requirements of device occupation or printed circuit board shape, and may be a closed hole or an open notch region, and the shape of the first hollow region 101 may be according to requirements. The setting may be a rectangle, a circle, an ellipse or the like, which is not limited in this embodiment. The first hollow area 101 on the first printed circuit board 10 may be one or more. When there are a plurality of first hollow areas 101, each of the first hollow areas 101 includes a first side 102 and a first signal connection point. 103. The second side 104 and the second signal connection point 105. The first side 102 and the second side 104 of the first hollow area 101 are two sides that need to communicate through a wire, and are not limited to the illustrated case, for example, as shown in FIG. 3A. The side shown at 106 may also be the first side or the second side and include signal connection points. 106 may also be the third side and include a signal connection point that exists simultaneously with the first side and the second side.

Please refer to FIG. 3B. FIG. 3B is a schematic structural diagram of a second printed circuit board 20 according to an embodiment of the present invention. As shown in FIG. 2B, the second printed circuit board 20 includes a plurality of wires 201, and opposite ends of each of the wires 201 are respectively connected to at least one of the first signal points of the first hollow region 101. 103 is coupled to at least one of said second signal connection points 105. In this embodiment, each of the wires 201 includes an opposite first end 2011 and a second end 2012, and the first end 2011 is configured to connect at least one of the first signals corresponding to the first hollow area 101. The connection point 103 is used to connect at least one of the second signal connection points 105 corresponding to the first hollow area 101.

In the embodiment of the present invention, the second printed circuit board may be stacked in the hollow region of the first printed circuit board, and the first printed circuit board and the second printed circuit board are connected by solder joints, so that the hollow area can be aligned in the longitudinal direction The surrounding wiring space is expanded to increase the wiring space and the number of traces of the hollow printed circuit board. After stacking the second printed circuit board on the first printed circuit board, the number of connecting circuits on both sides of the first printed circuit board is X=(A+B)*N, wherein X, A, B, and N are positive integers. A and B are respectively two maximum values of the traces in the two directions on the surface of the first printed circuit board, N is the number of layers of the second printed circuit board, since the second printed circuit board can be expanded in the longitudinal direction The thickness and number of layers of the second printed circuit board can be increased, so that the space in the longitudinal direction is optimally utilized, so that N is increased to maximize the connection efficiency.

On the other hand, due to the narrow circuit board around the hollowed out area, the first printed circuit board has a weaker structural structure and is reduced. The reliability of the first printed circuit board. In the embodiment of the present invention, the second printed circuit board is connected to the periphery of the hollow area of the first printed circuit board through the signal connection point, so that the structural strength of the printed circuit board is strengthened, and the stability and impact resistance of the printed circuit board structure can be improved.

4 and FIG. 5, FIG. 4 is a schematic diagram showing the positional relationship between the first printed circuit board 10 and the second printed circuit board 20 according to an embodiment of the present invention. FIG. 5 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention. FIG. 5 is a top plan view showing the structure of a printed circuit board 100 according to an embodiment of the present invention. As shown in FIG. 4 and FIG. 5, the second printed circuit board 20 is laminated on the first surface 107 of the first printed circuit board 10, and the second printed circuit board 20 covers at least one of the first hollow areas 101. Corresponding first signal connection point 103 and second signal connection point 105.

Specifically, when there are a plurality of first hollow regions 101, each of the first hollow regions 101 may correspond to a second printed circuit board 20, and cover the first signal connection point 103 corresponding to the first hollow region 101 and The second signal is connected to point 105.

If the first printed circuit board 10 has more than one first hollow area 101 distance less than a preset threshold, the plurality of first hollow areas 101 may share a second printed circuit board 20, and at this time, the second printed circuit board 20 At least the first signal connection point 103 and the second signal connection point 105 corresponding to each of the first hollow areas 101 of the plurality of first hollow areas 101 are covered.

As a possible implementation manner, as shown in FIG. 3B, the second printed circuit board 20 includes a wiring area 203 and a second hollow area 202, and the second printed circuit board 20 is laminated on the first printed circuit board. The wiring area 203 surrounds the first hollow area 101, the second hollow area 202 penetrates the first hollow area 101, and the plurality of wires 201 are disposed in the wiring area 203. .

Specifically, the second printed circuit board 20 may include the second hollow area 202 or may not include the hollow area. When the second hollow area 202 is included, the second hollow area 202 and the first hollow area 101 are completely penetrated or partially penetrated. The first hollow region 101 may be larger than the second hollow region 202 and completely penetrate the second hollow region 202, that is, when the second printed circuit board 20 is laminated on the surface 107 of the first printed circuit board 10, from the first hollow The region 101 can completely see the edge of the second hollow region 20, and the first hollow region 101 can also be smaller than the second hollow region 202 and completely penetrated by the second hollow region 202.

When the second printed circuit board 20 does not include a cutout, if the first hollow region 101 requires mounting of a device and the second printed circuit board 20 is laminated on the first printed circuit board 10, it is necessary to reserve sufficient space for the device. The entire surface area of the second printed circuit board 20 can be used as a wiring area.

As a possible implementation, please refer to FIG. 5 and FIG. 6. FIG. 6 is a schematic structural diagram of another printed circuit board 100 according to an embodiment of the present invention. As shown in FIG. 5, the wiring area 203 is closed around the first hollow area 101. Alternatively, as shown in FIG. 6, the wiring region 203 may partially surround the first hollow region 101.

Specifically, when there is a device to be circumvented on the side of the first hollow region 101, or when there is a need for a reserved space, the wiring region 203 may partially surround the first hollow region 101 to avoid the side edges. The wiring area of the second printed circuit board 20 may be entirely disposed around the first hollow area 101.

As a possible implementation manner, the second printed circuit board 20 may be a single-layer printed circuit board, and the plurality of wires 201 are disposed on a surface of the single-layer printed circuit board.

Specifically, the wires 201 may be disposed on the upper and lower surfaces of the second printed circuit board 20.

As a possible implementation manner, as shown in FIG. 4, the second printed circuit board 20 may be a multilayer printed circuit board, and the plurality of wires 201 are disposed on at least two layers of the multilayer printed circuit board. The surface of the printed circuit board.

Specifically, the wires 201 may be disposed on the upper and lower surfaces of each of the at least two printed circuit boards.

As a possible implementation, please refer to FIG. 7. FIG. 7 is a printed circuit board 100 according to an embodiment of the present invention. A schematic diagram of a longitudinal cross-sectional structure of the structure, as shown in FIG. 7, the printed circuit board structure includes a first printed circuit board 10 and a second printed circuit board 20 laminated on the first surface 107 of the first printed circuit board 10. .

Wherein, the first hollow region 101 on the first printed circuit board 10 may be for mounting the device 30, the device 30 may longitudinally pass through the first hollow region 101 of the first printed circuit board 10, and the device 30 may also pass longitudinally The second hollowed out region 202 of the second printed circuit board 20.

As shown in FIG. 8, the structure of the printed circuit board 100 includes a first printed circuit board 10 and a plurality of first signal connection points 103 disposed on the first side 102 of the first hollow region 101, and a plurality of first portions disposed on the second side 104 of the first hollow region 101 Two signal connection points 105, the plurality of first signal connection points 103 and the plurality of second signal connection points 105 are located on the first surface 107 of the first printed circuit board 10, and the first printed circuit board 10 is further a plurality of third signal connection points 108 disposed on a first side of the first hollow region 101, and a plurality of fourth signal connection points 109 disposed on a second side of the first hollow region 101, a plurality of third signal connection points 108 and the plurality of fourth signal connection points 109 are both located on the second surface 110 of the first printed circuit board; the printed circuit board 100 structure further includes a stacked layer disposed on the first a second printed circuit board 20 of the first surface 107 of the printed circuit board 10, The printed circuit board 100 structure further includes a second printed circuit board 20' stacked on the second surface 110 of the first printed circuit board 10, the second printed circuit 20 board covering at least one of the first hollow areas 101 corresponding to the first signal connection point 103 and the second signal connection point 105, the second printed circuit board 20' covers at least one third signal connection point 108 and the fourth signal connection point corresponding to the first hollow area 101 109.

In particular, the first side and the second side on the second surface 110 may be different from the first side and the second side on the first surface 107. For example, the first side and the second side on the first surface 107 may be a pair of opposite sides of a rectangular cutout, and the first side and the second side on the second surface 110 may be another set of opposite sides of the rectangular cutout . The second printed circuit board 20' includes a plurality of wires, and opposite ends of each of the wires are respectively connected to at least one of the third signal connection points and at least one of the fourth signal connection points of the first hollow region connection. The second printed circuit board can be added to the lower two surfaces of the first printed circuit board, and the number and thickness of the second printed circuit board can be expanded in two directions, thereby increasing the number of traces around the cutout.

As a possible implementation manner, the plurality of first signal connection points 103, the plurality of second signal connection points 105, the plurality of third signal connection points 108, and the plurality of fourth signal connection points 109 are both For the solder joint, the second circuit board 20 is connected to the solder joint by soldering.

Specifically, the soldering point can turn on the wires 201 of the first printed circuit board 10 and the second printed circuit board 20, and at the same time, the second printed circuit board 20 can be fixed on the first printed circuit board 10, and the signal connection point is also Other embodiments may be used, such as a shrapnel, a board to board (BTB), etc., which are not limited in this embodiment.

As a possible implementation manner, as shown in FIG. 2B, the second printed circuit board 20 is further provided with a plurality of via holes 204 corresponding to the positions of the first side 102 and the second side 104, The opposite ends 2011 of the plurality of wires 201 are connected to the solder joints 109 through the plurality of via holes 204, respectively.

Specifically, when the wire 201 is located on the surface of the second printed circuit board 20 away from the first printed circuit board, the wire connection with the solder joint on the first printed circuit board 10 can be routed through the via 204. On the other hand, when the second printed circuit board 20 is a multilayer printed circuit board, the wires on the layers of the second printed circuit board 20 remote from the first printed circuit board 10 may pass through the first printed circuit board 10 The vias 204 on the layer are routed.

As a possible implementation, please refer to FIG. 9. FIG. 9 is a schematic longitudinal cross-sectional view showing the structure of another printed circuit board 100 according to an embodiment of the present invention. The first printed circuit board 10 is a multilayer printed circuit. The pads, the

pads

103 and 105 are respectively electrically connected to at least two layers of the printed circuit board of the first printed circuit board 10.

Specifically, when the first printed circuit board 10 is a multi-layer circuit board, the solder joints may realize the wire connection of the surface layer of the first printed circuit board 10, or the solder joint may be connected to the inner layer of the first printed circuit board 10. Implement wire connections for the inner board. In addition, wire connections between different layers of a multilayer printed circuit board can also be achieved. For example, the solder joint on the first side is electrically connected to one layer of the first printed circuit board 10, and the solder joint on the second side is electrically connected to the other layer of the first printed circuit board 10, and can pass through the second printed circuit. The wires on the board connect the two solder joints, and one layer of the first printed circuit board 10 and the other layer of the first printed circuit board 10 can be electrically connected by wires.

Embodiments of the present invention also provide an electronic device including the above printed circuit board structure. The electronic device includes, but is not limited to, a mobile portable terminal, a desktop computer, a wearable device, a medical detection device, an experimental detection device, and the like.

Claims

A printed circuit board structure, comprising:

a first printed circuit board, the first printed circuit board including at least one first hollow area, a plurality of first signal connection points disposed on a first side of the first hollow area, and disposed on the first hollow a plurality of second signal connection points on the second side of the region, the plurality of first signal connection points and the plurality of second signal connection points are both located on the first surface of the first printed circuit board;

Stacking a second printed circuit board disposed on the first surface of the first printed circuit board, the second printed circuit board covering at least one first signal connection point and the second signal connection point corresponding to the first hollow area ;

The second printed circuit board includes a plurality of wires, and opposite ends of each of the wires are respectively connected to at least one of the first signal connection points and at least one of the second signal connection points of the first hollow region connection.
The printed circuit board structure according to claim 1, wherein said first printed circuit board further comprises a plurality of third signal connection points disposed on a first side of said first hollow region, and disposed at said a plurality of fourth signal connection points on the second side of the first hollow area, the plurality of third signal connection points and the plurality of fourth signal connection points are both located on the second surface of the first printed circuit board ;

The printed circuit board structure further includes a second printed circuit board stacked on the second surface of the first printed circuit board, the second printed circuit board covering at least one third signal corresponding to the first hollow area Connection point and fourth signal connection point.
A printed circuit board structure according to claim 1 or 2, wherein said second printed circuit board includes a wiring area and a second hollow area, said wiring area surrounding said first hollow area, said second The hollowed out area is continuous with the first hollow area, and the plurality of wires are disposed in the wiring area.
The printed circuit board structure according to claim 3, wherein said wiring area partially surrounds said first hollow area, or said wiring area is closed around said first hollow area.
The printed circuit board structure according to claim 1 or 2, wherein the second printed circuit board is a single-layer printed circuit board, and the plurality of wires are disposed on a surface of the single-layer printed circuit board.
The printed circuit board structure according to claim 1 or 2, wherein the second printed circuit board is a multilayer printed circuit board, and the plurality of wires are disposed on at least two of the multilayer printed circuit boards. The surface of the printed circuit board.
The printed circuit board structure according to any one of claims 2 to 6, wherein the plurality of first signal connection points, the plurality of second signal connection points, and the plurality of third signal connection points And the plurality of fourth signal connection points are solder joints, and the second circuit board is connected to the solder joints by soldering.
The printed circuit board structure according to claim 7, wherein the second printed circuit board is further provided with a plurality of via holes corresponding to positions of the first side and the second side, the plurality of strips The opposite ends of the wire are respectively connected to the solder joint through the plurality of via holes.
The printed circuit board structure according to claim 7 or 8, wherein the first printed circuit board is a multilayer printed circuit board, and the solder joints are respectively printed on at least two layers of the first printed circuit board The board is turned on.
An electronic device comprising the printed circuit board structure according to any one of claims 1 to 9.