CN108966568A - A kind of electronic equipment - Google Patents
A kind of electronic equipment Download PDFInfo
- Publication number
- CN108966568A CN108966568A CN201810834467.4A CN201810834467A CN108966568A CN 108966568 A CN108966568 A CN 108966568A CN 201810834467 A CN201810834467 A CN 201810834467A CN 108966568 A CN108966568 A CN 108966568A
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- Prior art keywords
- pcb
- hole
- electronic equipment
- present
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
Abstract
The embodiment of the invention discloses a kind of electronic equipment, are related to field of terminal technology, are able to solve the waste due to space on PCB, and caused by electronic equipment entire inner space waste.The specific scheme is that the 2nd PCB that electronic equipment includes the first PCB, connect with the first PCB, and at least one first element being connect with the 2nd PCB；Through-hole is provided on first PCB, the 2nd PCB is set to the side of the first PCB and the position opposite with through-hole, at least one first element is set on the 2nd PCB by through-hole.The embodiment of the present invention is applied in the scene of the PCB in layout electronic equipment and element.
Description
Technical field
The present embodiments relate to field of terminal technology more particularly to a kind of electronic equipment.
Background technique
With the development of terminal technology, the volume of the portable electronic products such as mobile terminal is smaller and smaller, in order to user
It carries.However, the function with mobile terminal is more and more, the internal components of mobile terminal are also more and more, so mobile whole
Reasonable utilize of the inner space at end is particularly important.
Currently, in order to more reasonably be laid out the internal components of mobile terminal, for receiver, camera, earphone socket
Deng the relatively high device of height, the printed circuit board (Printed Circuit Board, PCB) in mobile terminal can be dug
Hole, and by these device layouts in hole.Illustratively, this is illustrated for sentencing receiver.As shown in Figure 1, can be right
01 borehole of PCB, and receiver 02 is arranged and welds two in this hole (illustrating in Fig. 1 with virtual coil), and on PCB 01
Then two pins 03 of receiver 02 are connect with the two metallic supports 04 by a metallic support 04 respectively again, for branch
Support receiver 02.
But due to using the above method to PCB borehole after, the upper region dug up PCB then can not cabling, can not set
Other devices are set, therefore will cause the waste in space on PCB, to cause the waste of the entire inner space of mobile terminal.
Summary of the invention
The embodiment of the present invention provides a kind of electronic equipment, is able to solve the waste due to space on PCB, and caused by electronics
The problem of waste of the entire inner space of equipment.
In order to solve the above-mentioned technical problem, the embodiment of the present invention adopts the following technical scheme that
The embodiment of the present invention in a first aspect, provide a kind of electronic equipment, the electronic equipment may include: the first PCB, with
2nd PCB of the first PCB connection, and at least one first element being connect with the 2nd PCB；It is provided with through-hole on first PCB,
2nd PCB is set to the side of the first PCB and the position opposite with through-hole, at least one first element is set to by through-hole
On 2nd PCB.
In embodiments of the present invention, the 2nd PCB that electronic equipment may include the first PCB, connect with the first PCB, and
At least one first element being connect with the 2nd PCB, wherein through-hole is provided on the first PCB, the 2nd PCB is set to the first PCB
Side and the position opposite with through-hole, at least one first element be set on the 2nd PCB by through-hole.Due to the first PCB
On be provided with through-hole, and in the side of the first PCB and the position opposite with through-hole be provided with the 2nd PCB and at least one
One element is set on the 2nd PCB by through-hole, therefore quilt on the first PCB is utilized in electronic equipment provided in an embodiment of the present invention
The region (i.e. the region dug up be arranged the 2nd PCB) dug up, enables the region cabling dug up on the first PCB,
And other elements can be set, so as to avoid the waste in space on the first PCB, and then it can reasonably utilize electronic equipment
Entire inner space.
The second aspect of the embodiment of the present invention provides a kind of preparation method, which may include: in the first PCB
Upper setting through-hole；Side and opposite with through-hole position setting the 2nd PCB, the 2nd PCB and the first PCB company in the first PCB
It connects；At least one first element is set on the 2nd PCB by through-hole, which connect with the 2nd PCB.
In embodiments of the present invention, through-hole can be set on the first PCB, and the side of the first PCB and with through-hole phase
Pair position the 2nd PCB is set, and at least one first element is set on the 2nd PCB by through-hole.Due to can be
Through-hole is set, and in the side of the first PCB and position setting twoth PCB opposite with through-hole, and by logical on the first PCB
At least one first element is set on the 2nd PCB by hole, therefore preparation method provided in an embodiment of the present invention is utilized first
The region (the 2nd PCB is arranged in the region dug up) that PCB is upper to be dug up, enables the region dug up on the first PCB
Enough cablings, and other elements can be set, so as to avoid the waste in space on the first PCB, and then can reasonably utilize
The entire inner space of electronic equipment.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for a kind of electronic equipment that the prior art provides；
One of the structural schematic diagram of Fig. 2 a kind of electronic equipment provided in an embodiment of the present invention；
Fig. 3 is the top view of Fig. 2 provided in an embodiment of the present invention；
Fig. 4 is the second structural representation of a kind of electronic equipment provided in an embodiment of the present invention；
Fig. 5 is the third structural representation of a kind of electronic equipment provided in an embodiment of the present invention；
Fig. 6 is a kind of one of schematic diagram of preparation method provided in an embodiment of the present invention；
Fig. 7 is the two of a kind of schematic diagram of preparation method provided in an embodiment of the present invention；
Fig. 8 is the three of a kind of schematic diagram of preparation method provided in an embodiment of the present invention；
Fig. 9 is the four of a kind of schematic diagram of preparation method provided in an embodiment of the present invention；
Figure 10 is the five of a kind of schematic diagram of preparation method provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Term " first " and " second " in the specification and claims of the embodiment of the present invention etc. are for distinguishing not
Same object, rather than it is used for the particular order of description object.For example, the first PCB and the 2nd PCB etc. is different for distinguishing
PCB, rather than the particular order for describing PCB.In the description of the embodiment of the present invention, unless otherwise indicated, " multiples' "
Meaning refers to two or more.
The terms "and/or" is a kind of incidence relation for describing affiliated partner, indicates may exist three kinds of relationships,
For example, A and/or B, can indicate: individualism A exists simultaneously A and B, these three situations of individualism B.Symbol herein
"/" indicates that affiliated partner is relationship such as A/B expression A or B perhaps.
In embodiments of the present invention, " illustrative " or " such as " etc. words for indicate make example, illustration or explanation.This
Be described as in inventive embodiments " illustrative " or " such as " any embodiment or design scheme be not necessarily to be construed as comparing
Other embodiments or design scheme more preferably or more advantage.Specifically, use " illustrative " or " such as " etc. words purport
Related notion is being presented in specific ways.
The embodiment of the present invention provides a kind of electronic equipment, which may include the first PCB, connect with the first PCB
The 2nd PCB, and at least one first element being connect with the 2nd PCB, wherein be provided with through-hole on the first PCB, the 2nd PCB
It is set to the side of the first PCB and the position opposite with through-hole, at least one first element is set to the 2nd PCB by through-hole
On.Due to being provided with through-hole on the first PCB, and in the side of the first PCB and the position opposite with through-hole is provided with the 2nd PCB,
And at least one first element is set on the 2nd PCB by through-hole, therefore electronic equipment provided in an embodiment of the present invention benefit
With the region (i.e. the region dug up be arranged the 2nd PCB) dug up on the first PCB, so that being dug up on the first PCB
Region can cabling, and other elements can be set, so as to avoid the waste in space on the first PCB, and then can be closed
Manage the entire inner space of land productivity electronic equipment.
Electronic equipment provided in an embodiment of the present invention can be applied to the scene of the PCB and element in layout electronic equipment
In.Specifically, can be applied to that the 2nd PCB and an at least element are arranged in the electronic device (such as extremely to after the first PCB borehole
A few first element and at least one second element) scene in.
With reference to the accompanying drawing, by specific embodiment and its application scenarios to a kind of electronics provided in an embodiment of the present invention
Equipment and preparation method thereof is described in detail.
Currently, in the prior art, after to PCB borehole, the upper region dug up PCB then can not cabling, can not set
Other devices are set, therefore will cause the waste in space on PCB, to cause asking for the waste of the entire inner space of mobile terminal
Topic.
In order to solve the above-mentioned technical problem, a kind of electronic equipment provided in an embodiment of the present invention.Fig. 2 shows realities of the present invention
The possible structural schematic diagram that a kind of electronic equipment of example offer is provided, as shown in Fig. 2, the electronic equipment may include the first PCB
10, the 2nd PCB 11 being connect with the first PCB 10, and at least one first element 12 being connect with the 2nd PCB 11.
As shown in Fig. 2, be provided on the first PCB 10 through-hole (being illustrated in Fig. 2 with virtual coil) in the embodiment of the present invention, the
Two PCB 11 are set to the side of the first PCB 10 and the position opposite with through-hole, at least one first element 12 (in Fig. 2 with
Illustrate for a first element) it is set on the 2nd PCB 11 by through-hole.
The embodiment of the present invention provides a kind of electronic equipment, which may include the first PCB 10 and the first PCB
2nd PCB 11 of 10 connections, and at least one first element 12 being connect with the 2nd PCB 11, wherein on the first PCB 10
It is provided with through-hole, the 2nd PCB 11 is set to the side of the first PCB 10 and the position opposite with through-hole, and at least one first yuan
Part 12 is set on the 2nd PCB 11 by through-hole.Due to being provided with through-hole on the first PCB 10, and the one of the first PCB 10
Side and the position opposite with through-hole are provided with the 2nd PCB 11 and at least one first element 12 and are set to by through-hole
On two PCB 11, therefore electronic equipment provided in an embodiment of the present invention is utilized the region dug up on the first PCB 10 and (exists
The 2nd PCB 11 is arranged in the region dug up), enable the region cabling dug up on the first PCB 10, and can be arranged
Other elements so as to avoid the waste in space on the first PCB 10, and then can reasonably utilize the entire of electronic equipment
Inner space.
Optionally, in the embodiment of the present invention, above-mentioned 2nd PCB 11 can be connect with the first PCB 10 by welding manner.
Optionally, in the embodiment of the present invention, it is provided with the first solder joint on the first area of above-mentioned first PCB 10, second
The second solder joint is provided on the second area of PCB 11, which connect with second solder joint, and first solder joint with should
Second solder joint is located at the two sides of through-hole.
Optionally, in the embodiment of the present invention, above-mentioned first solder joint can be connect with the second solder joint by scolding tin；Alternatively, the
One solder joint can also be connect with the second solder joint by line, and the both ends of line and the two solder joint (i.e. first solder joints and second
Solder joint) connection.
Optionally, in the embodiment of the present invention, first area can be the fringe region on the first PCB, and second area can be with
For the fringe region of the 2nd PCB.
Optionally, in the embodiment of the present invention, the number of the first solder joint can be at least one, and the number of the second solder joint can be with
For at least one.
Optionally, in the embodiment of the present invention, above-mentioned 2nd PCB 11 and the first PCB 10 can also be connected by connection mode
It connects and is connected.
Optionally, in the embodiment of the present invention, at least one above-mentioned first element 12 can be receiver, camera, earphone
At least one of elements such as socket.
Optionally, in the embodiment of the present invention, the size of above-mentioned 2nd PCB 11 in a first direction is more than or equal to through-hole
Size in a first direction, and the 2nd PCB 11 is more than or equal to through-hole in the ruler of second direction in the size of second direction
Very little, first direction is different from second direction.
Optionally, in the embodiment of the present invention, above-mentioned first direction is vertical with second direction.
Illustratively, the top view of electronic equipment shown in Fig. 2 is shown in conjunction with Fig. 2, Fig. 3.As shown in figure 3, first party
Vertical with second direction 14 to 13, the size on 13 is d1 to the 2nd PCB 11 in a first direction, and in second direction 14
Having a size of d2；The size on 13 is d3 to through-hole 15 in a first direction, and the size in second direction 14 is d4；Wherein, d1
More than or equal to d3, and d2 is more than or equal to d4.
In the embodiment of the present invention, since the size of the 2nd PCB 11 in a first direction is more than or equal to through-hole in first party
To size, and the 2nd PCB 11 is more than or equal to through-hole in the size of second direction in the size of second direction, therefore can
So that through-hole can be completely covered in the 2nd PCB 11.
Optionally, in the embodiment of the present invention, above-mentioned 2nd PCB 11 can be multilayer circuit board.
Optionally, in the embodiment of the present invention, it is provided at least one first grounding point on above-mentioned first PCB 10, second
At least one second grounding point is provided on PCB 11, at least one second grounding point and at least one first grounding point connect
It connects.
In the embodiment of the present invention, due to being provided at least one first grounding point on the first PCB 10, on the 2nd PCB 11
It is provided at least one second grounding point, which connect at least one first grounding point, therefore can
To play the role of electronic shield, asking for interference is received to avoid at least one first element 12 connecting with the 2nd PCB 11
Topic.
Optionally, in the embodiment of the present invention, in conjunction with Fig. 2, as shown in figure 4, above-mentioned electronic equipment can also include: and second
At least one second element 16 of the connection of PCB 11.Wherein, at least one second element 16 can be set on the 2nd PCB 11,
And the side opposite at least one first element 12.
In the embodiment of the present invention, due to the first PCB 10 side and the position opposite with through-hole be provided with the 2nd PCB
11, and at least one second element 16 is set on the 2nd PCB 11 and the side opposite at least one first element 12, because
Space on the first PCB 10 is just more reasonably utilized in this, and then the entire inner space of electronic equipment is reasonably utilized.
Optionally, in the embodiment of the present invention, in conjunction with Fig. 2, as shown in figure 5, on above-mentioned 2nd PCB 11 and opposite with through-hole
Position setting it is fluted, direction and the through-hole of the opening of the groove are oppositely arranged, at least one first element 12 is set to recessed
In slot.
It is appreciated that at least one above-mentioned first element 12 is set to the 2nd PCB by groove in the embodiment of the present invention
On 11.
Optionally, in the embodiment of the present invention, size of the groove on third direction is less than the 2nd PCB 11 in third direction
On size (i.e. the thickness of the 2nd PCB 11), the third direction is vertical with first direction, and vertical with second direction.
In the embodiment of the present invention, since the setting of on the 2nd PCB 11 and opposite with through-hole position is fluted, and at least one
A first element 12 is arranged in the groove, thus on avoiding the first PCB 10 space waste, reasonably utilize electronic equipment
Entire inner space while, can reduce the thickness of electronic equipment.
Optionally, in the embodiment of the present invention, above-mentioned electronic equipment can also include rear cover and display screen, in above-mentioned Fig. 2
At least one first element 12 is towards display screen；At least one second element 16 in above-mentioned Fig. 4 is towards rear cover.
Optionally, in the embodiment of the present invention, above-mentioned electronic equipment can be mobile terminal.
Fig. 6 shows a kind of flow chart of preparation method provided in an embodiment of the present invention, as shown in fig. 6, the preparation method
It may include following steps 201 to step 203.
Through-hole is arranged on the first PCB in step 201.
Step 202, the first PCB side and the position opposite with through-hole the 2nd PCB is set.
In the embodiment of the present invention, above-mentioned 2nd PCB is connect with the first PCB.
At least one first element is set on the 2nd PCB by step 203 by through-hole.
In the embodiment of the present invention, at least one above-mentioned first element is connect with the 2nd PCB.
It should be noted that specific descriptions of the above-mentioned steps 201 to step 203, it can be with reference to the phase in above-described embodiment
Description is closed, details are not described herein again.
The embodiment of the present invention provides a kind of preparation method, through-hole can be arranged on the first PCB, and the one of the first PCB
Side and the 2nd PCB of the position opposite with through-hole setting, and at least one first element is set to by the 2nd PCB by through-hole
On.Since through-hole can be arranged on the first PCB, and in the side of the first PCB and the position setting second opposite with through-hole
PCB, and at least one first element is set on the 2nd PCB by through-hole, therefore preparation provided in an embodiment of the present invention
The region (the 2nd PCB is arranged in the region dug up) dug up on the first PCB is utilized in method, so that on the first PCB
The region dug up can cabling, and other elements can be set, so as to avoid the waste in space on the first PCB, in turn
The entire inner space of electronic equipment can reasonably be utilized.
Optionally, in the embodiment of the present invention, the size of above-mentioned 2nd PCB in a first direction is more than or equal to through-hole the
The size in one direction, and the 2nd PCB is more than or equal to through-hole in the size of second direction in the size of second direction.
Optionally, in the embodiment of the present invention, in conjunction with Fig. 6, as shown in fig. 7, above-mentioned steps 202 specifically can be by following
Step 202a is realized.
Step 202a, in the side of the first PCB and the position opposite with through-hole, by welding manner connect the 2nd PCB with
First PCB.
Optionally, in the embodiment of the present invention, the 2nd PCB and the first PCB can be welded using reflow soldering process.
It should be noted that the specific descriptions of above-mentioned steps 202a, it can be with reference to the associated description in above-described embodiment, this
Place repeats no more.
Optionally, in the embodiment of the present invention, at least one first grounding point is provided on above-mentioned first PCB, on the 2nd PCB
It is provided at least one second grounding point.In conjunction with Fig. 6, as shown in figure 8, the embodiment of the present invention provides after above-mentioned steps 202
Preparation method can also include the steps that following 301.
Step 301 connects at least one first grounding point and at least one second grounding point.
It should be noted that the specific descriptions of above-mentioned steps 301, it can be with reference to the associated description in above-described embodiment, this
Place repeats no more.
In the embodiment of the present invention, due to being provided at least one first grounding point on the first PCB, it is provided on the 2nd PCB
At least one second grounding point, therefore after connecting at least one second grounding point at least one first grounding point, can be with
The problem of playing the role of electronic shield, receiving interference to avoid at least one first element connecting with the 2nd PCB.
Optionally, in the embodiment of the present invention, in conjunction with Fig. 6, as shown in figure 9, the present invention is implemented after above-mentioned steps 202
The preparation method that example provides can also include the steps that following 401.
Step 401, on the 2nd PCB and the side opposite at least one first element is arranged at least one second yuan
Part.
In the embodiment of the present invention, at least one above-mentioned second element is connect with the 2nd PCB.
It should be noted that the specific descriptions of above-mentioned steps 401, it can be with reference to the associated description in above-described embodiment, this
Place repeats no more.
In the embodiment of the present invention, due to after the 2nd PCB is arranged in the side of the first PCB and the position opposite with through-hole,
Can be on the 2nd PCB and at least one second element is arranged in the side opposite at least one first element, therefore just more
Space on the first PCB is reasonably utilized, and then the entire inner space of electronic equipment is reasonably utilized.
Optionally, in the embodiment of the present invention, in conjunction with Fig. 6, as shown in Figure 10, after above-mentioned steps 202, the present invention is implemented
The preparation method that example provides can also include the steps that following 501, and above-mentioned steps 203 can specifically pass through following steps
203a is realized.
Step 501, on the 2nd PCB and groove is arranged in the position opposite with through-hole.
In the embodiment of the present invention, direction and the through-hole of the opening of above-mentioned groove are oppositely arranged.
Step 203a, at least one first element is set in groove.
It is appreciated that at least one first element can be set to the 2nd PCB by groove in the embodiment of the present invention
On.
It should be noted that the specific descriptions of above-mentioned steps 501 and step 203a, it can be with reference to the phase in above-described embodiment
Description is closed, details are not described herein again.
In the embodiment of the present invention, due to can be on the 2nd PCB and groove is arranged in the position opposite with through-hole, and recessed
At least one first element is set in slot, thus on avoiding the first PCB space waste, reasonably utilize the whole of electronic equipment
While a inner space, the thickness of electronic equipment can reduce.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can be realized by means of software and necessary general hardware platform, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on this understanding, technical solution of the present invention substantially in other words does the prior art
The part contributed out can be embodied in the form of software products, which is stored in a storage medium
(such as read-only memory (Read-Only Memory, ROM)/random access memory (Random Access Memory, RAM),
Magnetic disk, CD) in, including some instructions are used so that terminal (it can be mobile phone, computer, server, air conditioner, or
Person's network equipment etc.) execute method described in each embodiment of the present invention.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (7)
1. a kind of electronic equipment, which is characterized in that the electronic equipment includes: the first printing board PCB and described first
2nd PCB of PCB connection, and at least one first element being connect with the 2nd PCB；
Be provided with through-hole on first PCB, the 2nd PCB be set to the side of the first PCB and with the through-hole phase
Pair position, at least one described first element is set on the 2nd PCB by the through-hole.
2. electronic equipment according to claim 1, which is characterized in that the 2nd PCB and the first PCB pass through welding
Mode connects.
3. electronic equipment according to claim 2, which is characterized in that be provided on the first area of the first PCB
One solder joint is provided with the second solder joint on the second area of the 2nd PCB, and first solder joint is connect with second solder joint,
First solder joint and second solder joint are located at the two sides of the through-hole.
4. electronic equipment according to any one of claim 1 to 3, which is characterized in that be provided on the first PCB to
Lack first grounding point, is provided at least one second grounding point, at least one described second grounding point on the 2nd PCB
It is connect at least one described first grounding point.
5. electronic equipment according to claim 1, which is characterized in that the electronic equipment further include: with the 2nd PCB
At least one second element of connection；
At least one described second element is set on the 2nd PCB and opposite at least one described first element one
Side.
6. electronic equipment according to claim 1 or 5, which is characterized in that on the 2nd PCB and with the through-hole phase
Pair position setting it is fluted, the direction of the opening of the groove is opposite with the through-hole, at least one described first element is set
It is placed in the groove.
7. electronic equipment according to claim 1, which is characterized in that the size of the 2nd PCB in a first direction is big
In or equal to the size of the through-hole in said first direction, and the 2nd PCB be greater than in the size of second direction or
Person is equal to the through-hole in the size of the second direction, and the first direction is different from the second direction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810834467.4A CN108966568B (en) | 2018-07-26 | 2018-07-26 | Electronic equipment |
| PCT/CN2019/096313 WO2020020028A1 (en) | 2018-07-26 | 2019-07-17 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810834467.4A CN108966568B (en) | 2018-07-26 | 2018-07-26 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108966568A true CN108966568A (en) | 2018-12-07 |
| CN108966568B CN108966568B (en) | 2020-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810834467.4A Active CN108966568B (en) | 2018-07-26 | 2018-07-26 | Electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108966568B (en) |
| WO (1) | WO2020020028A1 (en) |
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| CN109803078A (en) * | 2019-01-30 | 2019-05-24 | 维沃移动通信有限公司 | A kind of terminal device |
| WO2020020028A1 (en) * | 2018-07-26 | 2020-01-30 | 维沃移动通信有限公司 | Electronic device |
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|---|---|---|---|---|
| WO2020020028A1 (en) * | 2018-07-26 | 2020-01-30 | 维沃移动通信有限公司 | Electronic device |
| CN109803078A (en) * | 2019-01-30 | 2019-05-24 | 维沃移动通信有限公司 | A kind of terminal device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020020028A1 (en) | 2020-01-30 |
| CN108966568B (en) | 2020-11-13 |
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