WO2020013508A1

WO2020013508A1 - Retainer ring for cmp, method for manufacturing same, and cmp device comprising retainer ring

Info

Publication number: WO2020013508A1
Application number: PCT/KR2019/008064
Authority: WO
Inventors: 한상효; 한병희
Original assignee: 주식회사 에스엠티
Priority date: 2018-07-13
Filing date: 2019-07-02
Publication date: 2020-01-16
Also published as: KR20200007529A; KR102088512B1

Abstract

A retainer ring according to an embodiment of the present invention is used in a CMP device and comprises: a frame layer which is coupled to the lower end of a carrier of the CMP device and includes a thermosetting resin; a synthetic resin layer, which is arranged at the lower end of the frame layer, has a lower part in contact with a polishing pad, and retains a wafer; and a primer resin layer arranged between the synthetic resin layer and the frame layer so as to bond together the synthetic resin layer and the frame layer.

Description

CMP retainer ring, method of making the same, and CMP apparatus including retainer ring

Cross Citation with Related Application (s)

This application claims the benefit of priority based on Korean Patent Application No. 10-2018-0081740 dated July 13, 2018, and all content disclosed in the literature of that Korean patent application is incorporated as part of this specification.

The present invention relates to a CMP retainer ring, a method of manufacturing the same, and a CMP apparatus comprising a retainer ring, and more particularly, comprising a frame layer, a resin layer, and a primer resin layer disposed between the frame layer and the resin layer. A CMP retainer ring, a method of making the same, and a CMP apparatus comprising a retainer ring.

Recently, as a device for planarizing a semiconductor wafer surface according to high density and high functionalization of a semiconductor wafer, a chemical mechanical polishing (CMP) device that simultaneously performs chemical polishing and mechanical polishing at the same time has been used.

In the semiconductor manufacturing process, the CMP process uses a slurry, which is a chemical liquid, and a polishing pad to cause a chemical reaction between the slurry and the wafer, and simultaneously transfer the mechanical force of the polishing pad to the wafer to planarize the wafer.

The polishing head of the CMP apparatus includes a retainer ring and a wafer carrier. The wafer carrier serves to position the wafer on the polishing pad in contact with the lower surface of the polishing head, and is then polished while the wafer is rotated by the rotation of the polishing pad and the polishing head.

In the polishing of the wafer, the retainer ring disposed at the bottom of the wafer carrier serves to prevent the wafer from being released from the wafer carrier during wafer polishing. The retainer ring is generally located at the bottom of the wafer carrier and is in the form of a ring surrounding the side of the wafer.

Retainer rings are generally used in the manufacturing of injection and insert injection molding. In the case of insert injection, an injection operation is performed after a separate metal core is inserted into a product.

All injection processes must be performed at a high temperature of 300 ℃ or higher, and there is a cost problem because it requires exclusive injection equipment and expensive molds, and a problem that requires a considerable degree of technical control in the work process, such as mold management under high temperature working conditions, is also required. there was.

In particular, the problem of carbonization of the resin staying in the injection equipment due to the high-temperature work, the change of the physical properties of the resin and the problem of the carbonized product is exposed to the surface of the injection product, as well as the appearance of black spots on the surface of the product due to this product quality Problems arise.

In order to solve the problems of improvement of work quality and work efficiency due to the manufacture and use of the existing retainer ring as described above, it can include a retainer ring, a manufacturing process thereof, and a retainer ring, which can provide a cost reduction effect. There is a need for development of CMP devices.

The problem to be solved by the present invention is proposed to solve the above problems of the conventionally proposed methods, the configuration included in the existing CMP retainer ring to minimize the configuration to reduce the work process efficiency or increase the cost Accordingly, the present invention provides a CMP retainer ring having a cost reduction effect, a method of manufacturing the same, and a CMP device including the retainer ring.

In addition, the upper part of the CMP retainer ring is formed using a molding method to form a frame layer composed of a thermosetting resin, and the lower part of the CMP retainer ring is easily bonded to the thermosetting resin layer by using a primer treatment technique. It is to provide a CMP retainer ring, a method of manufacturing the same, and a CMP apparatus including a retainer ring, which has an effect of improving work process.

However, the problem to be solved by the embodiments of the present invention is not limited to the above-described problem can be variously extended within the scope of the technical idea included in the present invention.

Retainer ring according to an embodiment of the present invention, in the retainer ring used in the CMP apparatus, is coupled to the lower end of the carrier of the CMP apparatus, the frame layer containing a thermosetting resin, disposed on the lower end of the frame layer And a synthetic resin layer having a lower portion in contact with the polishing pad and retaining the wafer, and a primer resin layer disposed between the synthetic resin layer and the frame layer to bond the synthetic resin layer and the frame layer.

The frame layer may be formed with one or more holes for bolting to the bottom of the carrier.

Bolts may be inserted into the one or more holes by insert bolt molding.

At the top of the synthetic resin layer, a bolt fixing part having a shape including two or more protrusions to fix the bottom of the insert bolt may be formed.

A helical coil may be inserted into the one or more holes.

One or more protrusions may be formed on the top of the synthetic resin layer.

One or more grooves may be formed in at least one of the bottom and side surfaces of the synthetic resin layer.

At least one of the bottom and side surfaces of the synthetic resin layer may be formed with one or more through holes.

The frame layer may include an epoxy resin and a curing agent as the thermosetting resin layer.

The frame layer comprises a thermosetting resin of 4,4 '-(1-methylethylidene) bisphenol polymer with (chloromethyl) oxirane (85%), (Butoxymethyl) oxirane (10%), and titanium dioxide (5%), 3- Thermal curing of aminomethyl-3,5,5-trimethylcyclo hexylamine (90%), α- (2-Aminomethylethyl) -ω- (2-aminomethylethoxy) poly [oxy (methyl-1,2-ethanediyl)] (10%) It may be made of a resin curing agent.

The thermal expansion coefficient of the frame layer may be 40 ~ 50ppm / k.

The synthetic resin layer is polyether ether ketone (PEEK), polyethylene (POM), polyphenylsulfide (PPS), polybenzimidazole (PBI), polyetherimide (PEI), polybutylene terephthalate (PBT), poly At least one of ethylenterephthalate (PET), polyimide (PI), and polyamideimide (PAI).

The thermal expansion coefficient of the synthetic resin layer may be 50 ~ 60ppm / k.

The primer resin layer may be composed of phenol-formaldehyde polymer glycidyl ether (30%), toluene (45%), Methyl ethyl ketone (20%), and Ethyl acetate (5%).

The primer resin layer is composed of (C = 18) -unsaturated dimers polymers with ethylenediamine and meta-xylenediamine (45%), Salicylic acid (5%), Toluene (45%), and Ethyl acetate (5%) It may further include.

The thermal expansion coefficient of the primer resin layer may be 35 ~ 45ppm / k.

According to one or more exemplary embodiments, a method of manufacturing a retainer ring may include: forming a synthetic resin layer having a circular ring shape; Primer-processing the top of the synthetic resin layer to form a primer resin layer; Inserting the primer-treated synthetic resin layer into a retainer ring molding mold, filling the molding mold with a thermosetting resin and curing the thermosetting resin to form a frame layer; And taking out the synthetic resin layer, the primer resin layer, and the frame layer laminated and bonded from the molding mold.

The thermosetting resin, after adding 10 phr of silica (SiO ₂ ) to the epoxy resin, using a high speed stirrer to disperse; Adding a curing agent to the dispersed epoxy resin and mixing the mixture at a mixing ratio of 50 phr to 100 phr to generate a solution; And it may be the molding solution produced through the step of defoaming to a vacuum solution of the level of 10 ⁰ ~ 10 ^-2 torr in the mixed solution, using a paste mixer to complete the molding solution.

Forming a bolt fixing part on an upper end of the synthetic resin layer; Fixing a bolt bottom to the bolt fixing part; Forming a primer resin layer and a frame layer on an upper surface of the synthetic resin layer while the resin bolt is inserted into the fixed bolt; Removing the resin bolts to form holes in the frame layer; And coupling the upper end of the frame layer to the lower end of the carrier of the CMP device by using a bolt coupled to the hole.

Forming a hole in the top of the frame layer; Tapping around the inside of the hole; Inserting a helical coil into the tapped hole; And coupling the upper end of the frame layer and the lower end of the carrier of the CMP device to the hole into which the spiral coil is inserted by using a bolt fastening method.

After forming the synthetic resin layer, further comprising the step of forming one or more protrusions on the top of the synthetic resin layer in contact with the frame layer, it is possible to increase the fixing force of the frame layer and the synthetic resin layer.

In addition, the CMP apparatus according to the embodiment of the present invention, CMP apparatus, the retainer ring; A carrier coupled to the top of the retainer ring; And a polishing pad in contact with a lower end of the retainer ring and having a wafer disposed on the upper end thereof, wherein the retainer ring includes a frame layer including a thermosetting resin, a lower surface of the frame layer, A synthetic resin layer in contact with and retaining the wafer, and a primer resin layer disposed between the synthetic resin layer and the frame layer to bond the synthetic resin layer and the frame layer.

According to embodiments of the present invention, the cost reduction effect may be provided by eliminating elements that reduce work process efficiency or increase cost as a configuration included in the existing CMP retainer ring.

In addition, by bonding the upper frame layer and the lower synthetic resin layer through a primer treatment technique, it is possible to increase the bonding strength between the layers, thereby providing a work process improvement effect.

1 is a view showing a retainer ring according to an embodiment of the present invention.

2 is a view illustrating a retainer ring coupled to a carrier according to an embodiment of the present invention.

3 is a view showing a synthetic resin layer according to an embodiment of the present invention.

4 is a diagram illustrating a frame layer and a spiral coil inserted into a hole of the frame layer according to another embodiment of the present invention.

5 is a view showing the projection formed on the top of the synthetic resin layer according to an embodiment of the present invention.

6 is a cross-sectional view of a retainer ring according to an embodiment of the present invention.

FIG. 7 is a photograph showing a cross section of a junction between a thermosetting resin layer and a polyether ether ketone (PEEK) resin layer. FIG.

8 is a flowchart illustrating a method of manufacturing a retainer ring according to an embodiment of the present invention.

9 is a view illustrating a method of manufacturing a retainer ring according to an embodiment of the present invention.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification.

In addition, since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated. In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.

In addition, throughout the specification, when a part is said to "include" a certain component, it means that it may further include other components, without excluding the other components unless otherwise stated.

1 is a view showing a retainer ring according to an embodiment of the present invention, Figure 2 is a view showing a state in which the retainer ring is coupled to a carrier according to an embodiment of the present invention.

As shown in FIGS. 1 and 2, the retainer ring 110 of the present invention may include a frame layer 112, a primer resin layer 118, and a synthetic resin layer 115.

Specifically, the retainer ring 110 used in the CMP apparatus is coupled to the lower end of the carrier 120 of the CMP apparatus 10, and includes a frame layer 112 and a frame layer 112 containing a thermosetting resin. The resin layer 115 is disposed at the lower side, and the lower portion is in contact with the polishing pad 200 and is disposed between the resin layer 115 and the frame layer 112 to retain the wafer 300. And a primer resin layer 118 that bonds the frame layer 112.

The frame layer 112 may be in the form of an integral circular ring, but in some embodiments, may be in the form of a split circular ring.

When the retainer ring 110 is coupled to the carrier 120, the top of the frame layer 112 and the bottom of the carrier 120 may be contacted and coupled, as shown in FIG. 1, the frame layer 112. One or more holes 113 for bolt coupling with the bottom of the carrier 120 may be formed.

The coupling of the carrier 120 and the retainer ring 110 will be described below.

3 is a view showing the top of the synthetic resin layer 115, it can be seen that the bolt fixing part 117 formed on the top of the synthetic resin layer 115. The bolt fixing part 117 includes two or more protrusions, and as shown in FIG. 3, a bolt (insert bolt) is disposed inside the protruding portion to fix the lower end of the insert bolt to the synthetic resin layer 115. do.

As such, when the bolt is fixed to the bolt fixing part 117, the upper part of the bolt is surrounded by the primer resin layer 118 and the frame layer 112, and the cured frame layer 112 includes the upper part of the bolt. In the hole 113 is formed.

That is, according to one embodiment of the present invention, the synthetic resin layer 115 may include one or more bolt fixing parts 117, in this case, also in the frame layer 112 corresponding to each of the bolt fixing parts 117 One or more holes 113 are to be formed.

As described above, the one or more holes 113 are bolted by insert bolt molding, and may be coupled to a bolt portion molded to the retainer ring 110. By using the retainer ring 110 and the carrier 120 can be coupled to the bottom.

FIG. 4A is an enlarged view of the hole 113 formed in the frame layer 112. As shown in FIG. 4A, the frame layer 112 is coupled to the bottom of the carrier 120 of the CMP apparatus. One or more holes 113 into which a helical coil 114 is inserted may be formed at an upper end of the upper side. The spiral coil 114 is inserted into the tapping hole 113, and the inserted spiral coil 114 may be fastened to the bottom of the carrier 120 by bolt coupling.

4 (b) shows the spiral coil 114 inserted into the hole 113 of the frame layer 112. As shown in FIG. 4 (b), the structure of the spiral coil 114 is a coil. (coil), a tang for insertion, and a notch for removal of the tang after insertion. Spiral coil 114 used in the present invention is durable, such as stainless steel, it is possible to use a metal strong in acid resistance and chemical resistance.

4C is a cross-sectional view of the spiral coil 114 inserted into the hole 113 of the frame layer 112. As shown in the spiral coil 114 portion not inserted into the hole 113 in FIG. 4C, the diameter of the spiral coil 114 before insertion may be greater than the diameter of the hole 113. .

The process of inserting the spiral coil 114 into the hole 113 can be performed by applying a torque to the tang of the spiral coil 114 to reduce the diameter of the first peak of the spiral coil 114. Each coil's acid with the spring expands outwards like a spring, allowing the product to be permanently fixed. Due to this fixing method, when the bolt fastened to the spiral coil 114 is taken out, the spiral coil 114 itself may be prevented from falling out of the hole 113.

As shown in FIGS. 5A and 5B, one or more protrusions 116 may be formed on the top of the synthetic resin layer 115. This increases the contact area between the synthetic resin layer 115 and the frame layer 112 due to the projection 116, thereby providing an effect of increasing the friction between the frame layer 112 and the synthetic resin layer 115, and finally Has the effect of increasing the mutual holding power.

The retainer ring 110 moving together with the carrier 120 may perform rotational movement and horizontal movement (X, Y-axis directions) based on the center axis of the carrier 120, and apply pressure to the wafer 300. In the vertical movement (Z-axis), where the protrusion 116 of the top of the synthetic resin layer 115, the frame layer 112 with respect to the X, Y, Z-axis force transmitted to the retainer ring 110 It is meaningful to provide strong bonding force with).

The shape of the protrusion 116 formed on the synthetic resin layer 115 may be the shape shown in FIG. 5, but is not limited thereto and may include various shapes to increase the contact area.

For example, when the structure forming the upper end of the synthetic resin layer 115 is a protrusion shape shown in FIG. 5, the arrangement of the protrusions is not limited, and the protrusion shape extending only to one side is not the protrusion shape of FIG. 5 extending to both sides. It may be. In addition, as a structure surrounding both sides of the frame layer 112 coupled to the upper portion of the synthetic resin layer 115, it may be a structure to increase the contact area of the synthetic resin layer 115 and the frame layer 112, of course.

Although not shown, one or more grooves may be formed in at least one of the bottom and side surfaces of the synthetic resin layer 115. This is to prevent the slurry liquid used in the wafer 300 polishing process from sticking to the inner space of the retainer ring 110 retaining the wafer 300. As a groove shape, the synthetic resin layer 115 may be dug into a predetermined depth, but in some embodiments, may be a through-hole penetrating from inside to outside.

As shown in FIG. 6, the retainer ring 110 of the present invention has a frame layer 112 having a predetermined thickness, a resin layer 115, and a primer resin layer bonding the frame layer 112 and the resin layer 115 to each other. 118 may be included.

First, the topmost frame layer 112 is a thermosetting resin layer, and may include an epoxy resin and a curing agent. In the present invention, the epoxy resin is not a simple contact member, but is a direct configuration of the retainer ring 110, and is characterized in that it is configured to be disposed above the ring member having a predetermined thickness.

According to an embodiment, the frame layer 112 comprises 4,4 '-(1-methylethylidene) bisphenol polymer with (chloromethyl) oxirane (85%), (Butoxymethyl) oxirane (10%), and titanium dioxide (5%). Thermosetting resin, 3-Aminomethyl-3,5,5-trimethylcyclo hexylamine (90%), α- (2-Aminomethylethyl) -ω- (2-aminomethylethoxy) poly [oxy (methyl-1,2-ethanediyl) ] (10%) of the thermosetting resin curing agent. The coefficient of thermal expansion of the frame layer 112 may be 40 ~ 50ppm / k, preferably 45ppm / k.

The synthetic resin layer 115 is made of polyether ether ketone (PEEK), polyethylene (POM), polyphenylsulfide (PPS), polybenzimidazole (PBI), polyetherimide (PEI), polybutylene terephthalate (PBT) And at least one of polyethylenterephthalate (PET), polyimide (PI), and polyamideimide (PAI).

Of course, it is not limited to the resins listed above, and may include polycarbonate (PC), acetal, engineering plastic resin having excellent heat resistance and abrasion resistance, acid resistance, chemical resistance, and the like. The coefficient of thermal expansion of the synthetic resin layer 115 may be 50 ~ 60 ppm / k, preferably 55 ppm / k.

The primer resin layer 118 serves to bond the frame layer 112 and the synthetic resin layer 115, and the primer resin layer 118 is a phenol-formaldehyde to facilitate physical bonding with the thermosetting resin. And may be composed of (phenol-formaldehyde polymer glycidyl ether (30%), toluene (45%), Methyl ethyl ketone (20%), and Ethyl acetate (5%), depending on the embodiment. .

In addition, the primer resin layer 118 is (C = 18) -unsaturated dimers polymers with ethylenediamine and meta-xylenediamine (45%), Salicylic acid (5%), Toluene (45%), and Ethyl acetate (5%). It may further include a primer resin curing agent made. The coefficient of thermal expansion of the primer resin layer 118 may be 35 ~ 45ppm / k, preferably 40ppm / k.

Polyether ether ketone (PEEK) used in the synthetic resin layer 115 of the present invention is an annealed plastic having excellent heat resistance, abrasion resistance, chemical resistance, and acid resistance, but generally has a weak contact force with a thermosetting resin, thereby bonding between the layers. This has been a difficult problem.

Figure 7 (a) is not the primer, the conventional thermosetting resin and polyether ether keketone (PEEK) is the appearance of the junction between the layers, it can be seen that the lifting phenomenon occurs in the cross-section to be bonded, from which the interlayer bond strength is weak You can see that.

Fig. 7 (b) shows the case where the primer treatment in the present invention is performed, and the junction between each layer is shown. From this, in the case of the present invention using a primer resin having excellent contact force with both the thermosetting resin and polyether ether ketone (PEEK), it can be confirmed that the bonding force is increased without lifting phenomenon in the adhesive portion of each layer.

In some embodiments, the primer resin layer 118 may be applied to the top surface of the synthetic resin layer 115 by a spray method.

As shown in Figure 8, the method for manufacturing a retainer ring according to the embodiment, in the method for manufacturing a retainer ring, forming a synthetic ring layer of a circular ring (S100), the primer treatment on top of the synthetic resin layer By forming a primer resin layer (S200), inserting the primer-treated synthetic resin layer into the retainer ring molding mold, filling the thermosetting resin in the molding mold and curing the thermosetting resin to form a frame layer ( S300), and the step of taking out the synthetic resin layer, the primer resin layer, and the frame layer laminated and bonded from the molding mold (S400).

In the present invention, the synthetic resin layer may be formed not only in the form of a circular ring of an injection molded product, but also in the form of a divided circular ring, and the synthetic resin layer may be formed of an injection molded product or a rolled tube, a plate, or the like by a mold structure. It may also be manufactured by machining.

After the take-out step (S400), the retainer ring can be machined to the use standard, in accordance with an embodiment, for coupling the carrier and the retainer ring, the top of the frame layer and the bottom of the carrier of the CMP apparatus It may further comprise the step of combining.

In order to engage the lower end of the carrier and the retainer ring, one or more holes may be formed in the frame layer disposed on the retainer ring, and bolts may be formed with the carrier through the holes.

Specifically, Figure 9 is a method of manufacturing a retainer ring using an insert bolt molding method. 9, the bolt fixing part 117 is formed on the upper end of the synthetic resin layer 115, and fixing the lower end of the bolt to the formed bolt fixing part 117 (FIG. 9 (a)). Inserting a resin bolt into the resin bolt (Fig. 9 (b)), in a state in which the resin bolt is inserted, forming a primer resin layer 118, the frame layer 112 on the top surface of the synthetic resin layer 115 ( 9 (c) can be seen. In this case, the space in which the resin bolt is inserted is the hole 113 in the frame layer 112.

That is, the next step may include removing the resin bolts to form the holes 113 in the frame layer 112 in which only the insert bolts are molded, and as a result, as shown in FIG. 9 (d). One or more holes 113 may be formed. The lower end of the carrier 120 of the CMP apparatus and the upper end of the retainer ring may be coupled to the hole 113 into which the bolt is inserted in the insert bolt molding method formed as described above using a bolt that can be coupled.

Unlike the method of forming the bolt fixing part in the synthetic resin layer described with reference to FIG. 9, according to another embodiment, a method of bolting the carrier and the retainer ring by inserting a spiral coil into the hole itself of the frame layer may be used. .

Specifically, the method may further include forming a hole in an upper portion of the frame layer taken out from the molding mold, tapping around the inside of the hole, and inserting a spiral coil into the tapped hole. The bolt fastening method may further include coupling the upper end of the frame layer and the lower end of the carrier of the CMP device.

In addition, after forming the synthetic resin layer, the method may further include forming one or more protrusions on top of the synthetic resin layer which is in contact with the frame layer. This is to increase the fixing force between the frame layer and the synthetic resin layer by widening the contact area between the synthetic resin layer and the frame layer by forming one or more protrusions.

In some embodiments, one or more grooves may be formed in at least one of the bottom and side surfaces of the synthetic resin layer, and one or more through holes may be formed. This is to prevent the slurry liquid used in the wafer polishing process from accumulating in the inner space of the retainer ring retaining the wafer.

In the thermosetting resin according to the embodiment, 10 phr of silica (SiO ₂ ) is added to the epoxy resin, followed by dispersing using a high speed stirrer. It may be a molding liquid produced by the step of, and in the mixed solution, by using a paste mixer, degassing at a vacuum level of 10 ⁰ ~ 10 ^-2 torr to complete the molding liquid.

Such a molding liquid is transferred to a molding mold into which a primer-treated synthetic resin layer is inserted, by a vacuum injector, molded in a vacuum state, and cured at about 100 ° C. for 30 minutes, whereby the thermosetting resin, that is, the molding liquid is cured. As the frame layer is located at the top is formed.

According to an embodiment of the present invention, the thermosetting resin injected using the vacuum molding method has an advantage as shown in Table 1 below compared to the insert injection method used in the prior art.

Details related to each of the steps have been described above with reference to the retainer ring 110 according to an embodiment of the present invention, and thus the detailed description thereof will be omitted.

In addition, the CMP apparatus 10 including the retainer ring according to the embodiment of the present invention is disposed at the bottom of the frame layer 112 and the frame layer 112 including the thermosetting resin as shown in FIG. 2. Retainer ring 110 having a synthetic resin layer 115, and a primer resin layer 118 disposed between the synthetic resin layer 115 and the frame layer 112 to bond the synthetic resin layer 115 and the frame layer 112. ), A carrier 120 coupled to the top of the retainer ring 110, and a polishing pad 200 contacting the bottom of the retainer ring 110 and having the wafer 300 disposed on the top thereof.

As described above, the retainer ring according to an embodiment of the present invention is a component included in the existing CMP retainer ring to remove the elements that reduce the work process efficiency or increase the cost, and the lower resin layer, the molded upper part Including a frame layer, by easily bonding the frame layer and the synthetic resin layer through a primer treatment, there is a cost reduction effect and work process improvement compared to the existing.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

[Description of the code]

10: CMP device

100: polishing head

110: retainer ring

112: frame layer

113: hall

114: spiral coil

115: resin layer

116: turning

117: bolt fixing

118: primer resin layer

120: carrier

200: polishing pad

300: wafer

Claims

In the retainer ring used for the CMP apparatus,

A frame layer bonded to a lower end of a carrier of the CMP apparatus and comprising a thermosetting resin;

A synthetic resin layer disposed at a lower end of the frame layer and having a lower portion in contact with a polishing pad and retaining a wafer; And

And a primer resin layer disposed between the synthetic resin layer and the frame layer to bond the synthetic resin layer and the frame layer.
The method of claim 1,

And a retainer ring in the frame layer having one or more holes for bolting to the bottom of the carrier.
The method of claim 2,

Retainer ring is inserted into the one or more holes in the insert bolt molding method (Insert Bolt Molding).
The method of claim 3,

Retainer ring formed on the top of the synthetic resin layer, the bolt fixing portion is formed to include a two or more protrusions for fixing the bottom of the insert bolt.
The method of claim 2,

A retainer ring into which the helical coil is inserted into the one or more holes.
The method of claim 1,

A retainer ring having one or more protrusions formed on top of the synthetic resin layer.
The method of claim 1,

Retainer ring formed with at least one groove on at least one of the bottom and side of the synthetic resin layer.
The method of claim 1,

Retainer ring formed with at least one through hole in at least one of the bottom and side of the synthetic resin layer.
The method of claim 1,

And the frame layer is a thermosetting resin layer comprising an epoxy resin and a curing agent.
The method of claim 1,

The frame layer is a thermosetting resin of 4,4 '-(1-methylethylidene) bisphenol polymer with (chloromethyl) oxirane (85%), (Butoxymethyl) oxirane (10%), and titanium dioxide (5%), 3- Thermal curing of aminomethyl-3,5,5-trimethylcyclo hexylamine (90%), α- (2-Aminomethylethyl) -ω- (2-aminomethylethoxy) poly [oxy (methyl-1,2-ethanediyl)] (10%) A retainer ring made of a resin hardener.
The method of claim 1,

And a coefficient of thermal expansion of said frame layer is 40-50 ppm / k.
The method of claim 1,

The synthetic resin layer is polyether ether ketone (PEEK), polyethylene (POM), polyphenylsulfide (PPS), polybenzimidazole (PBI), polyetherimide (PEI), polybutylene terephthalate (PBT), poly A retainer ring that is at least one of ethylenterephthalate (PET), polyimide (PI), and polyamideimide (PAI).
The method of claim 1,

Retaining ring of the expansion coefficient of the synthetic resin layer is 50 ~ 60ppm / k.
The method of claim 1,

The primer resin layer is a retainer ring consisting of phenol-formaldehyde polymer glycidyl ether (30%), Toluene (45%), Methyl ethyl ketone (20%), and Ethyl acetate (5%).
The method of claim 1,

The primer resin layer is composed of (C = 18) -unsaturated dimers polymers with ethylenediamine and meta-xylenediamine (45%), Salicylic acid (5%), Toluene (45%), and Ethyl acetate (5%) Retainer ring further comprising.
The method of claim 1,

Retaining ring of the thermal expansion coefficient of the primer resin layer is 35 ~ 45ppm / k.
In the method of manufacturing the retainer ring,

Forming a synthetic resin layer in the form of a circular ring;

Primer-processing the top of the synthetic resin layer to form a primer resin layer;

Inserting the primer-treated synthetic resin layer into a retainer ring molding mold, filling the molding mold with a thermosetting resin and curing the thermosetting resin to form a frame layer; And

Extracting the synthetic resin layer, the primer resin layer, and the frame layer laminated and bonded from the molding mold.
The method of claim 17,

The thermosetting resin,

Adding 10 phr of silica (SiO 2 ) to the epoxy resin, followed by dispersing with a high speed stirrer;

Adding a curing agent to the dispersed epoxy resin and mixing the mixture at a mixing ratio of 50 phr to 100 phr to generate a solution; And

Method for producing a retainer ring in the mixed solution, the molding solution produced by the step of defoaming to a vacuum level of 10 0 ~ 10 -2 torr using a paste mixer to complete the molding solution.
The method of claim 17,

Forming a bolt fixing part on an upper end of the synthetic resin layer;

Fixing a bolt bottom to the bolt fixing part;

Forming a primer resin layer and a frame layer on an upper surface of the synthetic resin layer while the resin bolt is inserted into the fixed bolt;

Removing the resin bolts to form holes in the frame layer; And

Coupling a top of the frame layer and a bottom of a carrier of the CMP device using bolts coupled to the holes.
The method of claim 17,

Forming a hole in the top of the frame layer;

Tapping around the inside of the hole;

Inserting a helical coil into the tapped hole; And

Coupling the upper end of the frame layer and the lower end of the carrier of the CMP device to the hole into which the spiral coil is inserted, using a bolt fastening method.
The method of claim 17,

After forming the synthetic resin layer, further comprising the step of forming one or more projections on top of the synthetic resin layer in contact with the frame layer, to produce a retainer ring to increase the fixing force of the frame layer and the synthetic resin layer How to.
The method of claim 17,

At least one of the lower and side surfaces of the synthetic resin layer, wherein the at least one groove is formed.
The method of claim 17,

At least one of the bottom and side surfaces of the synthetic resin layer to produce a retainer ring having at least one through hole.
In a CMP apparatus,

Retainer rings;

A carrier coupled to the top of the retainer ring; And

A polishing pad in contact with a lower end of the retainer ring and having a wafer disposed thereon;

The retainer ring,

A frame layer including a thermosetting resin, a bottom layer of the frame layer, a bottom layer of which is in contact with a polishing pad, and a resin layer for retaining a wafer, and disposed between the resin layer and the frame layer and the synthetic resin layer and the CMP device comprising a primer resin layer for bonding the frame layer.