WO2020004164A1 - Exposure device and height adjustment method - Google Patents

Exposure device and height adjustment method Download PDF

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Publication number
WO2020004164A1
WO2020004164A1 PCT/JP2019/024230 JP2019024230W WO2020004164A1 WO 2020004164 A1 WO2020004164 A1 WO 2020004164A1 JP 2019024230 W JP2019024230 W JP 2019024230W WO 2020004164 A1 WO2020004164 A1 WO 2020004164A1
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WO
WIPO (PCT)
Prior art keywords
unit
support portion
support
sliding surface
column
Prior art date
Application number
PCT/JP2019/024230
Other languages
French (fr)
Japanese (ja)
Inventor
米澤　良
Original Assignee
株式会社ブイ・テクノロジー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ブイ・テクノロジー filed Critical 株式会社ブイ・テクノロジー
Priority to KR1020207033454A priority Critical patent/KR20210023820A/en
Priority to CN201980041745.3A priority patent/CN112334836B/en
Publication of WO2020004164A1 publication Critical patent/WO2020004164A1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Definitions

  • the present invention relates to an exposure apparatus and a height adjusting method.
  • Patent Literature 1 discloses a drawing apparatus in which a ball screw is engaged with one end of a holding plate, and a drawing head moves vertically within a predetermined range by a servomotor connected to the ball screw. .
  • Patent Literature 1 a ball screw is used for moving the drawing head, so that a random walking error (uneven speed of the female screw member with respect to one rotation of the lead screw) occurs, and the drawing head is accurately moved. There is a problem that you can not do.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide an exposure apparatus and a height adjustment method capable of accurately adjusting the height of an optical device that emits light.
  • an exposure apparatus includes, for example, a substrate holding unit on which a substrate is placed, and a substantially bar-shaped support unit formed of a magnetic material, the longitudinal direction of which is substantially horizontal.
  • a frame provided with a support portion provided so as to be provided, and a rod-shaped column provided such that a longitudinal direction thereof is substantially vertical at both ends of the support portion.
  • a moving mechanism having a rack provided on the support portion, a pinion rotatably provided on the column, meshing with the rack, and a rotation drive portion for rotating the pinion; and a moving mechanism provided on the support portion.
  • a permanent electromagnet having a permanent magnet and an electromagnet, and driving the rotation drive unit to move the support unit, and applying a current to the coil of the electromagnet to cause the permanent magnet to attract the support unit.
  • a control unit wherein the permanent electromagnet attracts the support portion to bring the support portion side sliding surface into close contact with the column side sliding surface, and the support portion side sliding surface and the column side sliding surface.
  • the support is fixed to the pillar by frictional force between the support and the surface.
  • the rotation drive section is driven to rotate the pinion, and the support section provided with the rack meshing with the pinion is moved in the height direction.
  • a current is applied to the electromagnet coil of the permanent electromagnet having the permanent magnet and the electromagnet, and the permanent electromagnet attracts the support portion, thereby bringing the support portion side sliding surface and the column side sliding surface into close contact with each other, thereby supporting the electromagnet.
  • the support portion is fixed by a frictional force between the part side sliding surface and the column side sliding surface.
  • the permanent electromagnet is used for attracting the support portion, the energization time is short and the support portion is not deformed or expanded due to heat, so that the height of the optical device can be accurately adjusted.
  • a measuring unit provided on the support unit, a measuring unit having a scale provided substantially along the vertical direction, and a head that reads a value of the scale and outputs position information
  • the permanent electromagnet attracts the support unit with a second attraction force that is weaker than a first attraction force that is an attraction force when the moving mechanism does not move the support unit.
  • the second suction force may be approximately 20% to approximately 30% of the first suction force.
  • the support portion includes a substantially thin plate-shaped guide member provided between the support portion and the optical device, and a drive portion provided on the frame body for vertically moving the optical device.
  • a plate-like portion arranged substantially horizontally, a circular hole penetrating in a substantially vertical direction is formed in the plate-like portion, and the guide member has a substantially disk shape in plan view, and the circular hole
  • the guide member is provided with a mounting hole substantially at the center thereof, the mounting hole is disposed substantially concentrically with the round hole, and the optical device has an optical axis. May be inserted into the mounting hole so as to substantially coincide with the center of the mounting hole and fixed to the guide member. Thereby, the fluctuation of the optical axis when the drive unit moves the optical device in the height direction can be reduced to several nm or less.
  • a moving unit that moves the substrate holding unit in a scanning direction, and a measuring unit that is provided on the support unit and measures a distance to the substrate includes: the control unit, via the moving unit The distance to the substrate is measured via the measurement unit while moving the substrate holding unit in the scanning direction, and a median value is obtained from a maximum value and a minimum value of the distance to the substrate, based on the median value.
  • the driving amount of the driving unit may be obtained by the above. Thereby, even if the height of the substrate changes, the optical device can always be focused on the substrate.
  • the optical device has an AF processing unit having an AF light source that emits downward light and an AF sensor that receives reflected light, and the control unit operates the AF processing unit while operating the AF processing unit.
  • the support unit may be moved, and when the optical device is located at a position where it is determined that the focus is achieved, the support unit side sliding surface and the column side sliding surface may be brought into close contact with each other. Thereby, even if the height of the substrate changes, the optical device can always be focused on the substrate.
  • a height adjusting method includes, for example, a substrate holding portion on which a substrate is placed, and a substantially rod-shaped support portion formed of a magnetic material, the longitudinal direction of which is substantially A frame having a support portion provided so as to be in a horizontal direction, and a rod-shaped pillar provided such that a longitudinal direction is substantially vertical at both ends of the support portion, and the support portion has Is a frame having a supporting part side sliding surface formed thereon, and a column body having a pillar side sliding surface facing the supporting part side sliding surface formed on the column, and a movement for vertically moving the supporting part.
  • a mechanism comprising: a rack provided substantially along the vertical direction on the support portion, a pinion rotatably provided on the column, meshing with the rack, and a rotation driving portion for rotating the pinion.
  • a mechanism, a measurement unit provided on the support unit, and the support unit A height adjusting method for adjusting the height of the supporting portion using an apparatus provided and irradiating the substrate with light, and a device provided on the column and having a permanent magnet and an electromagnet.
  • the height adjustment of the light irradiation unit can be accurately performed.
  • FIG. 1 is a perspective view schematically showing an exposure apparatus 1 according to a first embodiment.
  • FIG. 4 is a schematic diagram illustrating a state where a measurement unit and a laser interferometer measure the position of a mask holding unit. It is the perspective view which shows the outline of the support part 15a of the frame 15, and was seen from the back side (+ x side). It is the perspective view which shows the outline of the support part 15a of the frame 15, and is the figure seen from the front side (-x side). It is a figure which shows the outline when the frame 15 is cut
  • FIG. 7 is a view showing a positional relationship between the guide member 70A and the guide member 70A.
  • FIG. 9 is an exploded perspective view of an attachment structure for attaching the light irradiation unit 30a to a support plate 153.
  • FIG. 4 is a diagram showing a state in which a light irradiation unit 30a is attached to a frame 15;
  • A is a diagram showing a state in which the light irradiation unit 30a has not moved (the center of the stroke), and
  • B is a diagram showing a state in which the light irradiation unit 30a has moved downward (the lower end of the stroke).
  • C is a diagram showing a state in which the light irradiation unit 30a has moved upward (upper stroke).
  • FIG. 2 is a block diagram illustrating an electrical configuration of the exposure apparatus 1.
  • 4 is a flowchart illustrating a flow of a height adjustment process of the exposure apparatus 1. It is an example of the measurement result in step S20.
  • the photosensitive substrate for example, quartz glass having a very low coefficient of thermal expansion (for example, about 5.5 ⁇ 10 ⁇ 7 / K) is used.
  • the photomask generated by the exposure device is, for example, an exposure mask used for manufacturing a substrate for a liquid crystal display device.
  • the photomask is formed by forming one or a plurality of transfer patterns for an image device on a large, substantially rectangular substrate having a side of, for example, more than 1 m (for example, 1400 mm ⁇ 1220 mm).
  • the term “mask M” is used as a concept including the photosensitive substrate before, during, and after processing.
  • the exposure apparatus of the present invention is not limited to a mask manufacturing apparatus.
  • the exposure apparatus of the present invention is a concept including various devices that irradiate light (including laser, UV, polarized light, and the like) while moving a substrate held in a substantially horizontal direction in a scanning direction.
  • the optical device of the present invention is not limited to the light irradiation unit that irradiates light to the photosensitive substrate.
  • FIG. 1 is a perspective view schematically showing an exposure apparatus 1 according to the first embodiment.
  • the exposure apparatus 1 mainly includes a surface plate 11, a plate portion 12, rails 13, 14, a frame 15, a mask holding portion 20, a light irradiation portion 30, a measurement portion 40 (see FIG. 2). , A laser interferometer 50 (see FIG. 2) and a measuring unit 61 (61a, 61d, 61g).
  • FIG. 1 illustration of a part of the configuration is omitted.
  • the exposure apparatus 1 is maintained at a constant temperature by a temperature adjustment unit (not shown) that covers the entire apparatus.
  • the surface plate 11 is a member having a substantially rectangular parallelepiped shape (thick plate shape), and is formed of, for example, a stone (for example, granite) or a low expansion coefficient casting (for example, a nickel-based alloy).
  • the platen 11 has an upper surface 11a that is substantially horizontal (substantially parallel to the xy plane) on the upper side (+ z side).
  • the surface plate 11 is placed on a plurality of vibration isolation tables (not shown) placed on an installation surface (for example, a floor). Thereby, the surface plate 11 is placed on the installation surface via the vibration isolation table. Since the anti-vibration table is already known, a detailed description will be omitted. Note that the vibration isolation table is not essential. On the + x side of the surface plate 11, a loader (not shown) for installing the mask M on the mask holding unit 20 is provided.
  • the rail 13 is an elongated plate-shaped member made of ceramic, and is fixed to the upper surface 11 a of the surface plate 11 so that the longitudinal direction is along the scanning direction (x direction).
  • the three rails 13 have substantially the same height (position in the z direction), and the upper surface is formed with high precision and high flatness.
  • the rail 13 on the loader side (+ x side) has an end disposed at the end of the upper surface 11a, and the rail 13 on the opposite loader side ( ⁇ x side) is disposed inside the end of the upper surface 11a.
  • the plate-shaped part 12 is placed on the rail 13.
  • the plate-shaped portion 12 is a substantially plate-shaped member made of ceramic, and has a substantially rectangular shape as a whole.
  • a guide portion (not shown) is provided on the lower surface (the surface on the ⁇ z side) of the plate portion 12 so that the longitudinal direction is along the x direction. Thereby, the moving direction of the plate-shaped portion 12 is regulated so that the plate-shaped portion 12 does not move in directions other than the x direction.
  • a rail 14 is provided on the upper surface 12a of the plate-shaped portion 12.
  • the rail 14 is fixed so that the longitudinal direction is along the y direction.
  • the rails 14 have substantially the same height, and the upper surface is formed with high precision and high flatness.
  • the mask holding section 20 has a substantially plate shape having a substantially rectangular shape in a plan view, and is formed using a low expansion ceramic having a thermal expansion coefficient of about 0.5 to 1 ⁇ 10 ⁇ 7 / K. Thereby, the deformation of the mask holding unit 20 can be prevented.
  • the mask holding section 20 can also be formed using an ultra-low-expansion glass ceramic having a coefficient of thermal expansion of about 5 ⁇ 10 ⁇ 8 / K. In this case, even if an uncontrollable temperature change occurs, deformation of the mask holding unit 20 can be reliably prevented.
  • the mask holding portion 20 may be formed of a material that expands and contracts in the same manner as the mask M.
  • the mask holder 20 is mounted on the rail 14.
  • the mask holding unit 20 is provided on the upper surface 11a via the plate-like portion 12 and the rails 13 and 14.
  • a guide portion (not shown) is provided on the lower surface of the mask holding portion 20 so that the longitudinal direction is along the y direction. Thereby, the moving direction of the mask holding unit 20, that is, the plate-like unit 12 is restricted so as not to move in directions other than the y direction.
  • the mask holding section 20 (the plate-shaped section 12) is provided so as to be movable in the x direction along the rail 13, and the mask holding section 20 is provided so as to be movable in the y direction along the rail 14.
  • the mask holder 20 has a substantially horizontal upper surface 20a.
  • a mask M (not shown) is placed on the upper surface 20a.
  • bar mirrors 21, 22, and 23 are provided on the upper surface 20a (see FIG. 2).
  • the exposure apparatus 1 has driving units 81 and 82 (not shown) (see FIG. 13).
  • the driving units 81 and 82 are, for example, linear motors.
  • the driving unit 81 moves the mask holding unit 20 (plate-like portion 12) in the x direction along the rail 13, and the driving unit 82 moves the mask holding unit 20 in the y direction along the rail 14.
  • Various known methods can be used as a method in which the driving units 81 and 82 move the plate-shaped unit 12 and the mask holding unit 20.
  • a frame 15 is provided on the surface plate 11.
  • the frame 15 is formed of a magnetic material, for example, a casting having a low expansion coefficient (for example, a nickel-based alloy).
  • the frame 15 has a support portion 15a and two columns 15c that support the support portion 15a at both ends.
  • the frame body 15 holds the light irradiation unit 30 above the mask holding unit 20 (in the + z direction).
  • the light irradiation unit 30 is attached to the support 15a.
  • the frame 15 will be described later in detail.
  • the light irradiation unit 30 irradiates the mask M with light (in this embodiment, laser light).
  • the light irradiation units 30 are provided at regular intervals (for example, approximately every 200 mm) along the y direction. In the present embodiment, there are seven light irradiation units 30a, light, light irradiation unit 30b, light irradiation unit 30c, light irradiation unit 30d, light irradiation unit 30e, light irradiation unit 30f, and light irradiation unit 30g.
  • the moving mechanism 161 moves the entire light irradiation units 30a to 30g in the vertical direction (z direction) within a range of about 10 mm so that the focal positions of the light irradiation units 30a to 30g are aligned with the upper surface of the mask M. Let it.
  • the drive unit 39 (39a (see FIG. 6) to 39g, detailed later) adjusts the light irradiation units 30a to 30g to about 30 ⁇ m (micrometer) for fine adjustment of the focal position of the light irradiation units 30a to 30g. Fine movement in the z direction within the range.
  • the light irradiation unit 30 will be described later in detail.
  • a reading unit (not shown) is provided in each of the light irradiation units 30a to 30g.
  • the reading unit reads a pattern formed on the mask M.
  • the measurement unit 40 (see FIG. 2) is, for example, a linear encoder, and the laser interferometer 50 that measures the position of the mask holding unit 20 has laser interferometers 51 and 52 (not shown in FIG. 1, see FIG. 2). .
  • a laser interferometer 51 is provided on a column provided on the ⁇ y side of the frame 15.
  • a laser interferometer 52 (not shown in FIG. 1) is provided on the + x side surface of the surface plate 11.
  • FIG. 2 is a schematic diagram showing how the measuring unit 40 and the laser interferometer 50 measure the position of the mask holding unit 20.
  • FIG. 2 only a part of the rails 13 and 14 is shown.
  • FIG. 2 only the light irradiation units 30a and 30g are shown, and the light and light irradiation units 30b to 30f are not shown.
  • the measuring section 40 has position measuring sections 41 and 42.
  • the position measuring units 41 and 42 have scales 41a and 42a and detection heads 41b and 42b, respectively.
  • the scale 41a is provided on the + y side end face of the + y side rail 13 and the ⁇ y side end face of the ⁇ y side rail 13.
  • the detection head 41b is provided on the + y-side and -y-side end surfaces of the plate portion 12 (not shown in FIG. 2). In FIG. 2, the illustration of the scale 41a and the detection head 41b on the + y side is omitted.
  • the scale 42a is provided on the + x side end face of the + x side rail 14 and the ⁇ x side end face of the ⁇ x side rail 13.
  • the detection head 42b is provided on the + x side and ⁇ x side end surfaces of the mask holding unit 20. In FIG. 2, illustration of the scale 42a and the detection head 42b on the ⁇ x side is omitted.
  • the scales 41 a and 42 a are, for example, laser hologram scales, and memories are formed at a pitch of 0.512 ⁇ m (nanometer).
  • the detection heads 41b and 42b irradiate light (for example, laser light), acquire the light reflected by the scales 41a and 42a, divide a signal generated thereby by 512 equally to obtain 1 nm, and generate the signal. Divide the signal by 1024 to obtain 0.5 nm. Since the position measuring units 41 and 42 are already known, detailed description will be omitted.
  • the mirror 55a having a reflection surface substantially parallel to the xz plane is provided in the light irradiation unit 30a.
  • the light irradiating unit 30g is provided with mirrors 55b and 55c having reflecting surfaces substantially parallel to the xz plane.
  • the mirrors 55a, 55b, and 55c are provided so that the positions in the x direction do not overlap.
  • a mirror 56a having a reflecting surface substantially parallel to the yz plane is provided in the light irradiation unit 30a.
  • the light irradiation unit 30g is provided with a mirror 56g having a reflection surface substantially parallel to the yz plane.
  • the laser interferometers 51 and 52 emit four laser beams.
  • the laser interferometer 51 has laser interferometers 51a, 51b, and 51c.
  • the laser interferometer 52 has laser interferometers 52a and 52g.
  • the path of the laser beam is indicated by a two-dot chain line.
  • Two of the lights emitted from the laser interferometers 51a, 51b, and 51c are reflected by the bar mirror 23, and the reflected lights are received by the laser interferometers 51a, 51b, and 51c.
  • the remaining two of the lights emitted from the laser interferometer 51a are reflected by the mirror 55a, and the reflected light is received by the laser interferometer 51a.
  • the remaining two of the lights emitted from the laser interferometer 51b are reflected by the mirror 55b, and the reflected light is received by the laser interferometer 51b.
  • the remaining two of the lights emitted from the laser interferometer 51c are reflected by the mirror 55c, and the reflected light is received by the laser interferometer 51c.
  • the laser interferometers 51a to 51c measure the position of the bar mirror 23 with reference to the positions of the mirrors 55a to 55c, respectively, to measure the positional relationship between the light irradiation units 30a and 30g and the mask holding unit 20 in the y direction.
  • Two of the lights emitted from the laser interferometer 52a are reflected by the bar mirror 22, and the reflected light is received by the laser interferometer 52a.
  • Two of the lights emitted from the laser interferometer 52g are reflected by the bar mirror 21, and the reflected light is received by the laser interferometer 52g.
  • the remaining two of the lights emitted from the laser interferometer 52a are reflected by the mirror 56a, and the reflected light is received by the laser interferometer 52a.
  • the remaining two of the lights emitted from the laser interferometer 52g are reflected by the mirror 56g, and the reflected light is received by the laser interferometer 52g.
  • the laser interferometers 52a and 52g measure the positions of the bar mirrors 21 and 22 with reference to the positions of the mirrors 56a and 56g, respectively, to measure the positional relationship between the light irradiation units 30a to 30g and the mask holding unit 20 in the x direction. I do.
  • no mirror is provided in the light irradiation units 30b to 30f, and no laser interferometer for measuring the position of the mirror is provided.
  • the deflection of the optical axis is as small as several nanometers or less (to be described in detail later). This is because it is obtained by interpolation based on the positions of 30a and 30g. As a result, the size of the device can be reduced, and the cost can be reduced.
  • FIGS. 3 and 4 are perspective views schematically showing the support 15 a of the frame 15.
  • FIG. 3 is a view from the back side ( ⁇ x side)
  • FIG. 4 is a view from the front side (+ x side).
  • the support portion 15a and the column 15c are illustrated with a slight distance therebetween for the sake of explanation, but the support portion 15a and the column 15c are actually adjacent to each other.
  • the support portion 15a is substantially rod-shaped with a substantially rectangular cross section, and has a hollow inside.
  • the support portion 15a is arranged so that its longitudinal direction is substantially horizontal (here, the y direction).
  • the pillars 15c are provided at both ends of the support portion 15a.
  • the support portion 15a mainly includes a bottom plate 151, a support plate 153, side plates 152 and 154 provided on both sides of the bottom plate 151 and the support plate 153, and a partition wall 159.
  • the bottom plate 151 and the support plate 153 are disposed substantially horizontally, and the side plates 152 and 154 are disposed substantially vertically.
  • the thickness of the bottom plate 151, the support plate 153, and the side plates 152, 154 is approximately 15 mm to 20 mm, and the length of the bottom plate 151, the support plate 153, and the side plates 152, 154 in the y direction (W1 in FIG. 9). ) Is approximately 2.2 m.
  • Round holes 155a to 155g and 156a to 156g are formed in the bottom plate 151 and the support plate 153 along the y direction, respectively.
  • the circular holes 155a to 155g and 156a to 156g are holes that penetrate the bottom plate 151 and the support plate 153 in a substantially vertical direction, and have a substantially circular shape in plan view. In a plan view, the positions of the centers of the round holes 155a to 155g substantially coincide with the positions of the centers of the round holes 156a to 156g.
  • Guide members 70 and 70A are provided in the round holes 155a to 155g and 156a to 156g so as to cover the round holes 155a to 155g and 156a to 156g, respectively.
  • 30a to 30g are attached.
  • the light irradiation units 30a to 30g are provided on the frame 15 via the guide members 70 and 70A.
  • the attachment structure for attaching the light irradiation units 30a to 30g to the frame 15 will be described later in detail.
  • round holes 157a to 157g are formed adjacent to the round holes 155a to 155g.
  • a lens barrel of a reading unit (not shown) is inserted into the round holes 157a to 157g.
  • the holes 152a to 152i and 154a to 154i are formed in the side plates 152 and 154, respectively.
  • the holes 152a to 152g and 154a to 154g are provided such that the positions in the y direction overlap the round holes 155a to 155g and 156a to 156g, respectively.
  • the holes 152a to 152g and 154a to 154g are used for attaching the reading unit 60 to the round holes 157a to 157g.
  • the holes 152h and 152i are provided on both sides of the holes 152a to 152g, respectively, and the holes 154h and 154i are provided on both sides of the round holes 154a to 154g, respectively.
  • the frame 15 is a casting, and the holes 152a to 152i and 154a to 154i are used as cast holes for discharging casting sand and forming an internal space during casting.
  • a partition wall 159 is provided inside the support portion 15a for reinforcement.
  • the partition wall 159 is a plate-shaped member, and its end surface is in contact with the bottom plate 151, the support plate 153, and the side plates 152 and 154. Accordingly, at the position where the partition wall 159 is provided, the cavity inside the support portion 15a is eliminated, and the vibration and deformation (bending, twisting, etc.) of the support portion 15a are prevented.
  • the frame 15 has a moving mechanism 161 that moves the support 15a in the z direction along the column 15c.
  • the moving mechanism 161 moves the support portion 15a in the range of about 10 mm in the z direction.
  • the moving mechanism 161 of the present embodiment includes a rack 161a provided along the z direction on an end surface substantially orthogonal to the longitudinal direction of the support portion 15a, a pinion 161b rotatably provided on the column 15c, and a pinion 161b. And a rotation drive unit 161f (see FIG. 13) for rotating.
  • the rack 161a is provided substantially at the center of an end surface substantially perpendicular to the longitudinal direction of the support portion 15a, and is fixed to a convex portion 158 projecting outward from a side surface of the support portion 15a using a screw or the like (not shown). .
  • the pinion 161b is rotatably provided on the column 15c, and meshes with the rack 161a.
  • the column 15c is provided with two permanent magnets 163.
  • the two permanent magnets 163 are provided on the column 15c, and are arranged near both ends in the longitudinal direction of the support 15a.
  • the permanent magnet 163 is provided along the side plate 154 adjacent to the end face on which the rack 161a is provided.
  • the permanent electromagnet 163 is a permanent electromagnetic type having a permanent magnet 163a (see FIG. 13) and an electromagnet 163b (see FIG. 13), and supplies a current to the coil of the electromagnet 163b only during magnetization and demagnetization, and is built in.
  • the permanent magnet 163a is turned on and off. Since the low expansion alloy used for the frame 15 is a magnetic material, it can be moved by the permanent magnet 163. Since the permanent electromagnet 163 only needs to be energized for a short time (for example, about 0.2 seconds) during ON-OFF, there is almost no heat generation. Further, the permanent magnet 163 does not change its magnetic force after the permanent magnet is turned on.
  • the permanent magnet 163 has an adjustment dial 163c (see FIG. 13).
  • the adjustment dial 163c adjusts the current flowing through the coil of the electromagnet 163b, and is configured to be able to adjust the current in, for example, 10 steps from 1 to 10.
  • the value of the adjustment dial 163c is "10"
  • the attraction force of the permanent electromagnet 163 to attract the support portion 15a becomes the first attraction force (described in detail later), and the value of the adjustment dial 163c is "2".
  • the attraction force by which the permanent magnet 163 attracts the support portion 15a is the second attraction force ( The details will be described later). Since the current value is proportional to the magnetic flux density and the attractive force, adjusting the adjustment dial 163c changes the magnetic flux density and the attractive force of the permanent magnet 163.
  • the measuring unit 164 is provided on the supporting unit 15a.
  • the measurement unit 164 has a scale 164a (see FIG. 5) provided substantially along the vertical direction, and a detection head 164b (see FIG. 5) that reads the value of the scale 164a and outputs position information.
  • the scale 164a is, for example, a laser hologram scale like the scales 41a and 42a. Like the detection heads 41b and 42b, the detection head 164b irradiates light (for example, laser light), acquires light reflected by the scale 164a, and obtains position information based on a signal generated thereby.
  • the scale 164a is provided on the side plate 152 opposite to the side plate 154.
  • the side plate 152 is provided with a measuring unit 61 (61a, 61d, 61g) for measuring the distance to the mask M.
  • the measurement units 61a, 61d, and 61g are, for example, displacement sensors that detect the height of an object (here, a mask M) based on laser light emitted from the sensors.
  • the measurement section 61a is provided adjacent to the light irradiation section 30a
  • the measurement section 61d is provided adjacent to the light irradiation section 30d
  • the measurement section 61g is provided adjacent to the light irradiation section 30g.
  • FIG. 5 is a view schematically showing the frame 15 cut along the plane C in FIG.
  • the pillar 15c has a convex portion 161c formed thereon.
  • the surface on the + x side of the convex portion 161c is a sliding surface 161d, and is subjected to scraping, which is polishing to reduce frictional resistance.
  • the ⁇ x side surface of the support portion 15a is a sliding surface 161e.
  • the sliding surface 161e is provided at a position facing the sliding surface 161d.
  • the sliding surface 161e is subjected to scraping similarly to the sliding surface 161d.
  • an oil film of about several ⁇ m is formed by lubricating oil accumulated on minute irregularities of the sliding surfaces 161d and 161e.
  • a mineral oil having a low viscosity at room temperature is used as the lubricating oil.
  • the support 15a to which the rack 161a is fixed moves up and down.
  • the moving mechanism 161 moves the support portion 15a up and down, the sliding surface 161d and the sliding surface 161e slide smoothly due to the oil film formed between the sliding surface 161d and the sliding surface 161e.
  • the teeth of the rack 161a are located on the center line c of the support portion 15a in the x direction.
  • the teeth of the rack 161a are located on a line that passes through the center of gravity of the support 15a and is substantially parallel to the z direction. Therefore, no moment is generated when the pinion 161b rotates to move the rack 161a (the support portion 15a) up and down.
  • a sliding surface 161d subjected to scraping is also formed on the column 15c on the side where the rack 161a and the pinion 161b are not provided.
  • a sliding surface 161e (see FIG. 5) on which a scraping process has been performed is formed on the support portion 15a so as to be in contact with the sliding surface.
  • An elastic member 160 is provided at an end of the support portion 15a along the column 15c. 3 and 4, only the elastic member 160 provided at the end on the ⁇ y side is shown, and illustration of the elastic member 160 provided at the end on the + y side is omitted. As shown in FIG. 5, the elastic member 160 is provided below the support portion 15a. A positioning member 162 is provided between the elastic member 160 and the support portion 15a. By inserting the elastic member 160 into the concave portion 162a formed on the bottom surface of the positioning member 162, the position of the elastic member 160 in the xy direction is determined, and the elastic member 160 can expand and contract with the vertical movement of the support portion 15a. Become. Thus, the elastic members 160 provided at both ends of the support 15a support the weight of the support 15a. The supporting portion 15a weighs approximately 660 kg to 700 kg, and the elastic member 160 can support a weight of approximately 600 kg.
  • the weight of the supporting portion 15a that cannot be supported by the elastic member 160 is supported by the frictional force between the sliding surface 161d and the sliding surface 161e.
  • the permanent electromagnet 163 is provided on the column 15c, and attracts the support portion 15a by passing a current through the coil of the electromagnet 163b (see FIG. 13).
  • the support portion 15a that is, the rack 161a and the sliding surface 161e are drawn by the permanent magnet 163 attracting the support portion 15a with the first suction force. 5 and move to the left (see the arrow in FIG. 5), and the sliding surface 161d and the sliding surface 161e come into close contact with each other.
  • the first attractive force is approximately 12000 N
  • the magnetic flux density of the permanent electromagnet 163 when the permanent electromagnet 163 attracts the support 15 a with the first attractive force is approximately 0.3 T (tesla).
  • the surface pressure generated between the sliding surface 161d and the sliding surface 161e when the permanent electromagnet 163 attracts the support portion 15a with the first attractive force is approximately 0.8 MPa.
  • the surface pressure generated between the sliding surface 161d and the sliding surface 161e is increased, and the sliding surface 161d and the sliding surface 161e are brought into close contact with each other (compressed strongly).
  • the oil film formed between the surface 161e and the surface 161e is eliminated. As a result, friction occurs between the sliding surface 161d and the sliding surface 161e.
  • the sliding surface 161d and the sliding surface 161e It supports a weight of 150 kg by the friction between it and. Since there are two sliding surfaces on both sides of the support portion 15a, the weight ta (approximately 60 to 100 kg) of the support portion 15a that cannot be supported by the elastic member 160 can be supported by frictional force. As described above, when the moving mechanism 161 does not move the support 15a up and down, the support 15a is supported so that the position of the support 15a in the height direction (z direction) does not change.
  • the permanent magnet 163 attracts the support portion 15a with a weak force (second attraction force).
  • the attraction force (second attraction force) when the support portion 15a is moved up and down is weaker than the attraction force (first attraction force) when the support portion 15a is not moved up and down.
  • the second suction force is approximately 20% to approximately 30% of the first suction force.
  • the second attractive force is approximately 2400 to approximately 3600 N, and the magnetic flux density of the permanent electromagnet 163 when the permanent electromagnet 163 attracts the support 15 a with the first attractive force is approximately 0.06 to approximately 0.09 T.
  • the surface pressure generated between the sliding surface 161d and the sliding surface 161e when the permanent magnet 163 attracts the support portion 15a with the second attraction force is approximately 0.16 to approximately 0.24 MPa.
  • the supporting portion 15a does not tilt with respect to the column 15c when the supporting portion 15a moves up and down. Due to restrictions on the arrangement position, the permanent magnet 163 and the measuring unit 164 are arranged on the opposite side with the moving mechanism 161 interposed therebetween. However, in the present embodiment, since the supporting unit 15a does not tilt, the measuring unit 164 is moved from the permanent magnet 163. Even if it is at a distant position, the measurement result of the measurement unit 164 is stable, and the support unit 15a can be moved up and down accurately.
  • Tables 1 and 2 are tables showing the torque of the rotation drive unit 161f (here, a motor) when the magnetizing force of the permanent magnet 163 is changed. Tables 1 and 2 show the results of experiments using different motors. Tables 1 and 2 are obtained by driving the rotation driving unit 161f to rotate the pinion 161b to move the support unit 15a in the height direction, and measuring the torque of the rotation driving unit 161f at that time. The value of each cell is torque (N ⁇ m).
  • the attraction force is proportional to the magnetic flux density of the permanent magnet 163, that is, the voltage applied to the permanent magnet 163.
  • the attraction force in Tables 1 and 2 is determined based on the ratio between the voltage applied to the permanent magnet 163 and the voltage applied to the permanent magnet 163 when the magnetic flux density of the permanent magnet 163 is maximized. It should be noted that the adsorption force of 0% indicates a demagnetized state.
  • the torque of the rotary drive unit 161f when the attraction force is 18.5% and 24% is almost the same as the torque of the rotary drive unit 161f in the demagnetized state. That is, if the second suction force is approximately 24% or less of the first suction force, the oil film formed between the sliding surface 161d and the sliding surface 161e is not eliminated, and the sliding surface 161d and the sliding surface are not removed. No friction occurs with the 161e.
  • the torque of the rotary drive 161f when the attraction force is 39% is about twice the torque of the rotary drive 161f in the demagnetized state, and the torque of the rotary drive 161f in the demagnetized state. Is very different.
  • the suction force is 39%, the oil film formed between the sliding surface 161d and the sliding surface 161e is eliminated, and friction occurs between the sliding surface 161d and the sliding surface 161e. You can see that.
  • the second attraction force is not appropriate to set the second attraction force to approximately 39% of the first attraction force from the viewpoint that no friction occurs between the sliding surface 161d and the sliding surface 161e. Is desirably about 30% or less of the first suction force.
  • the second suction force is smaller than approximately 20% of the first suction force
  • the state is changed from the state in which the support portion 15a is sucked by the second suction force to the state in which the support portion 15a is sucked by the first suction force.
  • the measurement result in the measurement unit 164 changes. Accordingly, when the second attraction force is smaller than approximately 20% of the first attraction force, the sliding surface 161d and the sliding surface 161e are not in contact with each other, and when the support portion 15a moves up and down, the column 15c is moved. It can be seen that the support portion 15a is inclined with respect to. From the above, it is desirable that the second attraction force be approximately 20% to approximately 30% of the first attraction force.
  • FIG. 6 is a perspective view of a main part schematically showing the light irradiation unit 30a.
  • the light irradiation section 30a mainly includes a DMD 31a, an objective lens 32a, a light source section 33a, an AF processing section 34a, a cylindrical section 35a, a flange 36a, mounting sections 37a and 38a, and a driving section 39a.
  • the light irradiating units 30b to 30g include DMDs 31b to 31g, objective lenses 32b to 32g, light source units 33b to 33g, AF processing units 34b to 34g, cylindrical units 35b to 35g, and flanges 36b to 30g, respectively.
  • the light irradiating units 30b to 30g have the same configuration as the light irradiating unit 30a, and thus description thereof is omitted.
  • the DMD 31a is a digital mirror device (Digital Mirror Device, DMD), and can emit a planar laser beam.
  • the DMD 31a has a number of movable micromirrors (not shown), and one micromirror irradiates light of one pixel.
  • the micromirrors are approximately 10 ⁇ m in size and are arranged two-dimensionally.
  • the DMD 31a is irradiated with light from a light source unit 33a (described in detail later), and the light is reflected by each micro mirror.
  • the micromirror is rotatable about an axis substantially parallel to its diagonal, and can be switched between ON (reflects light toward the mask M) and OFF (does not reflect light toward the mask M). is there. Since the DMD 31a is already known, a detailed description will be omitted.
  • the objective lens 32a forms an image of the laser beam reflected by each micro mirror of the DMD 31a on the surface of the mask M.
  • light is irradiated from each of the light irradiation units 30a to 30g, and the light forms an image on the mask M, whereby a pattern is drawn on the mask M.
  • the light source unit 33a mainly includes a light source 331, a lens 332, a fly-eye lens 333, lenses 334 and 335, and a mirror 336.
  • the light source 331 is, for example, a laser diode, and light emitted from the light source 331 is guided to the lens 332 via an optical fiber or the like.
  • the light is guided from the lens 332 to the fly-eye lens 333.
  • the fly-eye lens 333 is a two-dimensional arrangement of a plurality of lenses (not shown), and the fly-eye lens 333 forms a large number of point light sources.
  • the light that has passed through the fly-eye lens 333 becomes parallel light through lenses 334 and 335 (for example, condenser lenses), and is reflected by the mirror 336 toward the DMD 31a.
  • the AF processing unit 34a focuses light irradiated on the mask M to the mask M, and mainly includes an AF light source 341, a collimator lens 342, an AF cylindrical lens 343, pentaprisms 344 and 345, It has a lens 346 and AF sensors 347 and 348.
  • the light emitted from the AF light source 341 becomes parallel light by the collimator lens 342, becomes linear light by the AF cylindrical lens 343, is reflected by the pentaprism 344, and forms an image on the surface of the mask M.
  • the light reflected by the mask M is reflected by the pentaprism 345, collected by the lens 346, and made incident on the AF sensors 347 and 348.
  • the pentaprisms 344 and 345 bend light at a bending angle of about 97 degrees.
  • a mirror may be used instead of the pentaprisms 344 and 345, but it is preferable to use a pentaprism because defocusing occurs due to a misalignment of the mirror.
  • the AF processing unit 34a performs an autofocus process for obtaining a focus position based on the results received by the AF sensors 347 and 348. It should be noted that such an auto-focusing process using an optical lever is already known, and a detailed description thereof will be omitted.
  • the light irradiation unit 30a has a substantially cylindrical tubular portion 35a in which an optical system (including the objective lens 32a) is provided.
  • a flange 36a is provided at an upper end of the cylindrical portion 35a.
  • the flange 36a holds the lens 332, the fly-eye lens 333, and the lenses 334, 335 on the upper side. Therefore, the center of gravity of the light irradiation unit 30a is shifted leftward in FIG. 6 from the optical axis ax.
  • Mounting portions 37a and 38a are provided on the cylindrical portion 35a.
  • the attachment portions 37a and 38a are used for attachment to the frame body 15.
  • the mounting portion 37a is provided near the flange 36a, and the mounting portion 38a is provided near the lower end of the tubular portion 35a.
  • a hollow portion 372 having a diameter larger than the outer diameter of the mounting portion 38a is formed in the mounting portion 37a. Thereby, the cylindrical portion 35a can be pulled out upward.
  • screw holes 371 and 381 (described later in detail) formed in the mounting portions 37a and 38a are omitted.
  • FIG. 7 is a side view schematically showing the driving section 39a.
  • the driving section 39a mainly includes a piezoelectric element 391 and a connecting section 392.
  • the piezoelectric element 391 is a solid actuator (piezo element) that is displaced by applying a voltage.
  • a portion of the piezoelectric element 391 that is not displaced is provided on the support portion 15a of the frame 15 via the attachment portion 395 (see FIG. 11).
  • the piezoelectric element 391 When a voltage is applied to the piezoelectric element 391, the piezoelectric element 391 expands, and the upper end of the piezoelectric element 391 moves upward.
  • the dotted line in FIG. 7 shows a state where the piezoelectric element 391 is contracted, and the solid line in FIG. 7 shows a state where the piezoelectric element 391 is extended.
  • the connecting portion 392 is a substantially columnar member whose lower end is screwed to the piezoelectric element 391.
  • the connecting portion 392 moves up and down as the piezoelectric element 391 expands and contracts.
  • a convex portion 393 having an arc-shaped tip is provided at the upper end of the connecting portion 392.
  • the tip of the convex portion 393 contacts the lower side of the mounting portion 37a (see FIG. 6). Therefore, when the piezoelectric element 391 expands, the light irradiation unit 30a moves in the + z direction, and when the piezoelectric element 391 contracts, the light irradiation unit 30a moves in the -z direction.
  • a plurality of grooves 394 are formed on the side surface of the connecting portion 392.
  • the groove 394 is formed so as to cut obliquely downward as it approaches the central axis. Therefore, even if the piezoelectric element 391 is bent and expanded (see the two-dot chain line in FIG. 7), the connecting portion 392 is deformed at the groove 394, and the convex portion 393 is moved only in the vertical direction without moving in the horizontal direction. Can be.
  • the guide members 70 are attached to the bottom plate 151, the guide members 70A are attached to the support plates 153, and the light irradiation units 30a to 30g are attached to the guide members 70, 70A.
  • 30 g is attached to the frame 15. That is, the guide members 70 and 70A are provided between the light irradiation unit 30a and the frame 15 (here, the support plate 153).
  • the guide members 70 and 70A are substantially thin plate-shaped members provided between the support 15a (the bottom plate 151 and the support plate 153) and the light irradiation unit 30.
  • FIG. 8A is a diagram schematically illustrating the guide member 70
  • FIG. 8B is a diagram schematically illustrating the guide member 70A.
  • the guide member 70 and the guide member 70A have different diameters.
  • the guide members 70 and 70A have a substantially thin plate shape and a substantially disc shape in plan view.
  • the guide members 70 and 70A are formed of a metal having a thickness of about 0.5 to 1 mm.
  • the guide member 70 is approximately 0.5 mm
  • the guide member 70A is approximately 1 mm.
  • the metal stainless steel, phosphor bronze, or the like can be used, and it is preferable to use more homogeneous phosphor bronze.
  • approximately 0.5 to 1 mm includes an error of approximately 0.5 mm or less with respect to approximately 0.5 to 1 mm.
  • ⁇ ⁇ Attachment holes 74, 74A are formed substantially at the center of the guide members 70, 70A.
  • a plurality of holes 77 are formed along the outer circumference of the guide members 70 and 70A, and a plurality of holes 78 are formed along the mounting holes 74 and 74A.
  • a plurality of cutout holes 79A and 79B each having a substantially arc shape are formed in the guide member 70 so that the guide member 70 is easily deformed.
  • the cutout holes 79A and 79B are respectively arranged at equal intervals along the circumferential direction.
  • the radius of the cutout hole 79A is smaller than the radius of the cutout hole 79B, and the cutout hole 79B is arranged outside the cutout hole 79A.
  • the end region 79Aa including the end of the cutout hole 79A and the end region 79Ba including the end of the cutout hole 79B have substantially the same circumferential position.
  • the end regions 79Aa and 79Ba exist at both ends of the cutout holes 79A and 79B, respectively.
  • a plurality of substantially arc-shaped cutout holes 79C and 79D are formed in the guide member 70A so that the guide member 70A is easily deformed.
  • the cutout holes 79C and 79D are respectively arranged at equal intervals along the circumferential direction.
  • the radius of the cutout hole 79C is smaller than the radius of the cutout hole 79D, and the cutout hole 79D is arranged outside the cutout hole 79C.
  • the end region 79Ca including the end of the cutout hole 79C and the end region 79Da including the end of the cutout hole 79D substantially coincide with each other in the circumferential direction.
  • the end regions 79Ca and 79Da are located at both ends of the cutout holes 79C and 79D, respectively.
  • the number of the cutout holes 79A, 79B, 79C, and 79D is four, but the positions and the number of the cutout holes 79A, 79B, 79C, and 79D are not limited to this.
  • Circumferential positions of the end region 79Aa and the end region 79Ba substantially coincide with each other, and the overlapping positions are arranged uniformly (for example, approximately every 45 degrees) in the circumferential direction.
  • the circumferential positions of the end region 79Ca and the end region 79Da substantially coincide with each other, and the overlapping positions are arranged evenly in the circumferential direction (for example, approximately every 45 degrees). Therefore, when a line extending radially from the center point of the guide members 70, 70A is drawn, the line always passes through at least one of the cutout holes 79A to 79D. Therefore, the amount of deformation of the guide members 70, 70A is substantially constant irrespective of the location in the circumferential direction.
  • the guide members 70, 70A can be adjusted in accordance with the vertical movement of the cylindrical portion 35a of approximately 30 ⁇ m.
  • the members 70 and 70A expand and contract.
  • FIG. 9A shows a positional relationship between the bottom plate 151 and the guide member 70 when the guide member 70 is attached to the bottom plate 151
  • FIG. 9B shows a support plate when the guide member 70A is attached to the support plate 153
  • 15 shows a positional relationship between the motor 153 and the guide member 70A.
  • Seven guide members 70 are provided on the bottom plate 151 so as to cover the round holes 155a to 155g.
  • Seven guide members 70A are provided on the support plate 153 so as to cover the round holes 156a to 156g.
  • the mounting holes 74 and 74A are arranged substantially concentrically with the round holes 155a to 155g and 156a to 156g.
  • the guide member 70 and the round holes 155a to 155g are evenly arranged in the center of the bottom plate 151, and the guide member 70A and the round holes 156a to 156g are evenly arranged in the center of the support plate 153.
  • the interval between the adjacent round holes 155a to 155g (ie, the guide member 70) and the interval W2 between the adjacent round holes 156a to 156g (ie, the guide member 70A) are substantially the same as the interval between the light irradiation units 30a to 30g.
  • the cylindrical members 35 of the light irradiation unit 30a are provided on the guide members 70 and 70A provided in the round holes 155a and 156a.
  • the guide members 70 and 70A provided in the round holes 155b and 156b are provided with light and a light irradiation unit 30b.
  • light irradiation sections 30c to 30g are provided in the guide members 70 and 70A provided in the round holes 155c to 155g and 156c to 156g, respectively.
  • the round hole 155a and the round hole 156a are formed such that their positions in plan view overlap.
  • the round holes 155b to 155g and the round holes 156b to 156g are formed such that their positions in plan view overlap.
  • FIG. 10 is an exploded perspective view of an attachment structure for attaching the light irradiation unit 30a to the support plate 153.
  • the mounting structure for mounting the light irradiation units 30b to 30g to the bottom plate 151 and the mounting structure for mounting the light irradiation units 30b to 30g to the support plate 153 are the same as the mounting structure for mounting the light irradiation unit 30a to the bottom plate 151. The description is omitted.
  • the guide member 70A is provided on the support plate 153 so as to cover the round hole 156a.
  • the guide member 70A is fixed to the support plate 153 by inserting the screw 85 into the hole 77 and screwing the screw 85 into the screw hole 156h formed in the support plate 153.
  • the light irradiation section 30a (that is, the cylindrical section 35a) is provided on the guide member 70A via the mounting section 37a.
  • the guide member 70A is fixed to the mounting portion 37a by inserting the screw 86 into the hole 78 and screwing the screw 86 into the screw hole 371.
  • the light irradiation section 30a is inserted into the mounting hole 74A so that the optical axis substantially coincides with the center of the mounting hole 74A, and is fixed to the guide member 70A.
  • FIG. 11 is a diagram schematically showing a state in which the light irradiation unit 30a is attached to the frame 15 (here, the support unit 15a).
  • FIG. 11 shows a state of cutting along a plane passing through the center of the mounting hole 74 and the holes 75 and 76.
  • FIG. 11 some of the constituent elements are shown in cross section.
  • illustration of fastening members such as screws 85 and 86 and holes in which these are provided are omitted.
  • the cylindrical portion 35a is inserted into the mounting holes 74, 74A of the guide members 70, 70A.
  • the mounting portion 38a is located above the guide member 70, and the guide member 70 and the mounting portion 38a are fixed in a state where the portion of the cylindrical portion 35a below the mounting portion 38a is positioned below the guide member 70. I have.
  • the mounting portion 37a is located above the guide member 70A, and the guide member 70A and the mounting portion 37a are fixed in a state where the portion of the tubular portion 35a below the mounting portion 37a is located below the guide member 70A. Have been.
  • a holding ring may be used. By using the holding ring, deformation of the guide members 70 and 70A can be prevented.
  • the light irradiation unit 30a is attached to the support unit 15a such that the optical axis ax is substantially vertical.
  • the hole 79A has a horizontal position coincident with the AF light source 341 and the AF sensors 347 and 348 so that the light emitted downward from the AF light source 341 and the reflected light from the mask M can pass through.
  • the position of the hole 79A overlaps with the positions of the AF light source 341 and the AF sensors 347 and 348 in plan view.
  • the drive unit 39a is provided on the support unit 15a via the attachment unit 395, and pushes up the attachment unit 37a to move the attachment unit 37a in the vertical direction.
  • the center of gravity G of the light irradiation unit 30a is located near the position where the driving unit 39a pushes up the mounting unit 37a. Therefore, the drive unit 39a pushes up the light irradiation unit 30a near the center of gravity G. Thereby, the vertical movement of the light irradiation unit 30a is stabilized.
  • FIG. 12A shows a state in which the light irradiation unit 30a has not moved (the center of the stroke)
  • FIG. 12B shows a state in which the light irradiation unit 30a has moved downward (the lower end of the stroke)
  • the amount of movement of the cylindrical portion 35a by the drive portion 39a is approximately 40 ⁇ m ( ⁇ approximately 20 ⁇ m). Since the guide members 70 and 70A are made of thin metal, the guide members 70 and 70A expand and contract (elastically deform) in accordance with the vertical movement of the cylindrical portion 35a of approximately 40 ⁇ m. Since the guide members 70 and 70A have a substantially circular shape in plan view, the amount of deformation of the guide members 70 and 70A is substantially constant irrespective of the location, and the cylindrical portion 35a does not move in the xy directions.
  • FIG. 13 is a block diagram showing an electrical configuration of the exposure apparatus 1.
  • the exposure apparatus 1 includes a CPU (Central Processing Unit) 201, a RAM (Random Access Memory) 202, a ROM (Read Only Memory) 203, an input / output interface (I / F) 204, and a communication interface (I / F). 205, a media interface (I / F) 206, and these are the light irradiation unit 30, the position measurement units 41 and 42, the laser interferometers 51 and 52, the measurement unit 61, the drive units 81 and 82, and the rotation drive unit. 161f, the permanent magnet 163, the measuring unit 164, the piezoelectric element 391, and the like are connected to each other.
  • the CPU 201 operates based on the programs stored in the RAM 202 and the ROM 203, and controls each unit. Signals are input to the CPU 201 from the position measuring units 41 and 42, the laser interferometers 51 and 52, the measuring unit 61, the measuring unit 164, and the like. The signal output from the CPU 201 is output to the light irradiation unit 30, the driving units 81 and 82, the rotation driving unit 161f, the permanent magnet 163, the piezoelectric element 391, and the like.
  • the RAM 202 is a volatile memory.
  • the ROM 203 is a nonvolatile memory in which various control programs and the like are stored.
  • the CPU 201 operates based on programs stored in the RAM 202 and the ROM 203, and controls each unit.
  • the ROM 203 stores a boot program executed by the CPU 201 when the exposure apparatus 1 is started, a program depending on hardware of the exposure apparatus 1, drawing data on the mask M, and the like. Further, the RAM 202 stores a program executed by the CPU 201, data used by the CPU 201, and the like.
  • the CPU 201 controls the input / output device 211 such as a keyboard and a mouse via the input / output interface 204.
  • the communication interface 205 receives data from another device via the network 212 and transmits the data to the CPU 201, and transmits the data generated by the CPU 201 to the other device via the network 212.
  • the media interface 206 reads a program or data stored in the storage medium 213 and stores the program or data in the RAM 202.
  • the storage medium 213 is, for example, an IC card, an SD card, a DVD, or the like.
  • the program for realizing each function is read, for example, from the storage medium 213, installed in the exposure apparatus 1 via the RAM 202, and executed by the CPU 201.
  • the CPU 201 has a function of a control unit 201a that controls each unit of the exposure apparatus 1 based on an input signal.
  • the control unit 201a is constructed by executing a predetermined program read by the CPU 201.
  • the control unit 201a drives the rotation drive unit 161f to move the support unit 15a in the z direction.
  • the control unit 201a applies a current to the coil of the electromagnet 163b, and attracts the support unit 15a with the first attraction force or the second attraction force.
  • the processing performed by the control unit 201a will be described later in detail.
  • the configuration of the exposure apparatus 1 shown in FIG. 13 describes the main configuration in describing the features of the present embodiment, and does not exclude, for example, the configuration of a general information processing apparatus.
  • the components of the exposure apparatus 1 may be classified into more components according to the processing content, or one component may execute the processing of a plurality of components.
  • FIG. 14 is a flowchart showing the flow of the height adjustment processing of the exposure apparatus 1.
  • the control unit 201a installs the mask M on the mask holding unit 20 using a loader (not shown) (Step S10). Thereafter, the control unit 201a moves the mask holding unit 20 via the driving units 81 and 82 to adjust the position of the mask M (Step S12). Note that the processes of steps S10 and S12 are already known, and thus description thereof will be omitted.
  • the control unit 201a moves the support unit 15a in the height direction, and moves the position of the support unit 15a in the height direction to the origin position (step S14).
  • the origin position is determined by the height (previously stored) of the mask holding unit 20 and the standard of the installed mask M. When these components are at standard values, the focus of the light irradiation unit 30 is determined. Are positions tied on the mask M. Note that the position of the support portion 15a in the x direction in step S14 is the center position (x center).
  • the control unit 201a supplies a current to the coil of the electromagnet 163b. Since the current is adjusted by the adjustment dial 163c, the permanent magnet 163 attracts the support portion 15a with the second attractive force. Thereafter, the control unit 201a drives the rotation drive unit 161f to rotate the pinion 161b, thereby moving the rack 161a, that is, the support unit 15a in the height direction. At this time, the control unit 201a continuously acquires the measurement result of the measurement unit 164, and drives the rotation driving unit 161f until the measurement result of the measurement unit 164 reaches a target value.
  • the sliding surface 161d and the sliding surface 161e are in contact with each other because the permanent magnet 163 is attracting the supporting portion 15a with the second attractive force, but the sliding surface 161d is formed between the sliding surface 161d and the sliding surface 161e. Spilled oil slicks are not excluded. Therefore, when the support portion 15a moves in the z direction, the sliding surface 161e slides along the sliding surface 161d. As described above, since the support portion 15a does not tilt with respect to the column 15c when the support portion 15a moves in the z direction, the measurement result of the measurement unit 164 is stabilized.
  • step S10 to S14 are the preparation stages for adjusting the height of the light irradiation unit 30.
  • the control unit 201a measures the height of the mask M by the measuring units 61a and 61g while moving the mask holding unit 20 in the x direction via the driving units 81 and 82 (step S20). Then, the control unit 201a calculates the amount of movement of the light irradiation unit 30 in the height direction (the amount of drive of the drive unit 39a and the amount of movement of the support unit 15a) based on the measurement result in step S20 (step S22). .
  • the processing in step S22 will be described in detail.
  • FIG. 15 is an example of the measurement result in step S20.
  • the measurement result in the measurement unit 61a is illustrated, and the obtained value is a value for the light irradiation unit 30a.
  • the control unit 201a calculates the center position (thickness center) of the minimum value (BOTTOM) and the maximum value (PEAK) of the measurement result using Expression (1).
  • the control unit 201a calculates the difference between the measurement result at the center position (x center) in the x direction and the thickness center as PZT-OFS.
  • the PZT-OFS is such that when the position of the support portion 15a in the x direction is located at the x center and the piezoelectric element 391 is located at the stroke center, the focus position of the light irradiation unit 30 is at the thickness center. Is the driving amount of the piezoelectric element 391 when the height of the supporting portion 15a is adjusted.
  • PZT-OFS is a positive value when the measurement result is larger than the thickness center, and is a negative value when the measurement result is smaller than the thickness center.
  • the support 15a is moved to the x center in step S14, and the PZT-OFS is obtained based on the measurement result in the x center in step S22.
  • the support 15a is moved to -x in step S14.
  • the PZT-OFS may be obtained based on the measurement result at the ⁇ x end in step S22. That is, the x center in steps S14 and S22 is an example, and the position in the x direction is not limited to the x center.
  • the control unit 201a calculates a value obtained by adding a value (here, 20 ⁇ m) for arranging the piezoelectric element 391 at the stroke center to PZT-OFS as a vertical movement amount of the light irradiation unit 30. Note that the value of 20 ⁇ m changes depending on the type of the piezoelectric element 391.
  • step S20 since the measurement is performed using the measurement units 61a and 61g, the movement amount of the light irradiation units 30a and 30g in the height direction is obtained from the measurement result.
  • the control unit 201a determines the amount of movement of the light irradiation units 30b to 30f in the height direction (thickness center and PZT) based on the amount of movement of the light irradiation units 30a and 30g in the height direction directly obtained from the measurement results. -OFS) is calculated by interpolation.
  • the control unit 201a drives the piezoelectric element 391 from the lower end position by the value calculated in step S22 (PZT-OFS plus 20 ⁇ m) for each of the piezoelectric elements 391 provided in the light irradiation units 30a to 30g. (Step S24).
  • control unit 201a rotates each of the light irradiation units 30a to 30g while checking whether or not the light irradiated to the mask M via the AF processing unit 34 is in focus on the mask M.
  • the driving unit 161f is driven to move the support unit 15a in the height direction (Step S26).
  • step S14 Since the support portion 15a is attracted by the second attractive force in step S14, the permanent magnet 163 continuously attracts the support portion 15a by the second attractive force. Therefore, also in step S26, the sliding surface 161d is in contact with the sliding surface 161e, and the sliding surface 161e slides along the sliding surface 161d.
  • the AF processing unit 34 continuously determines how much it needs to be moved to the in-focus position, and the control unit 201a continuously obtains the result.
  • the control unit 201a drives the rotation drive unit 161f while continuously acquiring the measurement result of the measurement unit 164, and moves the support unit 15a in the height direction by the movement distance obtained by the AF processing unit 34.
  • step S24 since the piezoelectric element 391 is driven by the value obtained by adding 20 ⁇ m to PZT-OFS from the lower end position, the light is output when the piezoelectric element 391 is at the stroke center as a result of the movement of the support 15a in step S26. Light emitted from the irradiation unit 30 is focused on the thickness center. Thus, even if the height of the mask M changes, the focus of the light irradiation unit 30 can be always adjusted to the mask M by the movement of the piezoelectric element 391.
  • the control unit 201a determines whether the light irradiated from the light irradiation unit 30 via the AF processing unit 34 is focused on the mask M (Step S28). Since the light irradiation unit 30 has been moved in steps S24 and S26, the light irradiated from the light irradiation unit 30 is usually focused on the mask M in step S28. If the light irradiation unit 30 is not located at the position where it is determined that the camera is in focus (NO in step S28), the control unit 201a returns the process to step S26.
  • the control unit 201a supplies a current to the coil of the electromagnet 163b to cause The sliding portion 161d and the sliding surface 161e are brought into close contact with each other by adsorbing the support portion 15a with one suction force (step S30). As a result, friction occurs between the sliding surface 161d and the sliding surface 161e, and the support portion 15a is fixed to the column 15c by the frictional force.
  • step S14 Since the permanent magnet 163 attracts the support 15a with the second attractive force in step S14, the permanent magnet 163 continues to attract the support 15a with the second attractive force before step S30.
  • the value of the adjustment dial 163c is moved to "10" in this state, the value of the current flowing through the coil of the electromagnet 163b increases, and the attraction force of the permanent magnet 163 changes from the second attraction force to the first attraction force. Due to the nature of the permanent magnet 163, the attraction force can be increased from the second attraction force to the first attraction force (the attraction force cannot be reduced from the first attraction force to the second attraction force).
  • the sliding surface 161d and the sliding surface 161e come into contact with each other when the supporting portion 15a moves, and the sliding surface 161d slides along the sliding surface 161e. Even if the sliding surface 161d and the sliding surface 161e are brought into close contact, the sliding surface 161d, that is, the support portion 15a does not tilt. Therefore, the measurement result of the measurement unit 164 does not change regardless of whether the support unit 15a is moving or not.
  • the support portion 15a is large.
  • the measurement unit 164 since the measurement unit 164 must be provided on the surface opposite to the surface on which the permanent magnet 163 is provided, a non-negligible error occurs in the measurement result of the measurement unit 164. On the other hand, as shown in FIG.
  • the control unit 201a moves the mask holding unit 20 in the x direction and the y direction via the driving units 81 and 82, and controls the AF processing units 34a to 34g.
  • control unit 201a moves the support unit 15a in the direction in which the driving amount of the piezoelectric element 391 exceeds ⁇ 20 ⁇ m.
  • processing shown in FIG. 14 ends.
  • the processing illustrated in FIG. 14 is an example, and the order of processing and processing contents are not limited thereto.
  • the control unit 201a moves the mask holding unit 20 in the x direction and the y direction based on the measurement results of the position measurement units 41 and 42.
  • the control unit 201a irradiates light from the light irradiating unit 30 when the mask M passes below the light irradiating unit 30 while moving the mask holding unit 20, and performs a drawing process. Since the drawing process is performed several hours after the mask M is placed on the mask holding unit 20, there is enough room for the control unit 201a to perform the process of step S32.
  • the support unit 15a provided with the light irradiation unit 30 is moved up and down by using the moving mechanism 161 including the rack 161a and the pinion 161b, a random walking error does not occur unlike the case where a ball screw is used. . Therefore, the height of the light irradiation unit can be accurately adjusted.
  • the supporting portion 15a is attracted by the first attracting force using the permanent magnet 163, and the sliding surface 161d and the sliding surface 161e are brought into close contact with each other, so that the sliding surface 161d and the sliding surface By removing the oil film between the sliding surface 161e and the sliding surface 161e, the supporting portion 15a can be held by the frictional force generated between the sliding surface 161d and the sliding surface 161e. Further, the supporting portion 15a is attracted by the second attracting force (second attracting force ⁇ first attracting force) using the permanent magnet 163, and the supporting portion 15a is brought into contact with the sliding surface 161d and the sliding surface 161e. By moving the support 15a up and down, the measurement result of the measurement unit 164 does not change whether the support 15a is moving or not, and errors caused by the inclination of the support 15a can be eliminated.
  • the energization time is short, and the deformation and expansion of the support portion 15a due to heat do not occur. Therefore, the height of the support portion 15a, that is, the height of the light irradiation portion can be accurately adjusted.
  • “substantially” is a concept including not only the case of exactly the same but also an error or a deformation that does not lose the identity.
  • “substantially horizontal” is not limited to a strictly horizontal case, and is a concept that includes, for example, an error of about several degrees.
  • the expression “parallel, orthogonal, etc.” includes not only the case of strictly parallel, orthogonal, etc., but also the case of approximately parallel, approximately orthogonal, etc.
  • “near” means that a region in a certain range (can be arbitrarily determined) near a reference position is included. For example, when the term “near A” is used, it is a concept indicating that it is a region in a certain range near “A” and may or may not include “A”.
  • Exposure device 11 Surface plate 11a: Upper surface 12: Plate portion 12a: Upper surface 13, 14: Rail 15: Frame 15a: Support portion 15c: Column 20: Mask holding portion 20a: Upper surface 21, 22, 23: Bar mirror 30 (30a-30g): Light irradiator 31 (31a-31g): DMD 32 (32a to 32g): Objective lens 33 (33a to 33g): Light source section 34 (34a to 34g): AF processing section 35 (35a to 35g): Cylindrical section 36 (36a to 36g): Flange 37 (37a to 37g) 37g), 38 (38a to 38g): mounting part 39 (39a to 39g): driving part 40: measuring part 41, 42: position measuring part 41a, 42a: scale 41b, 42b: detecting head 50, 51 (51a, 51b) , 51c), 52 (52a, 52g): laser interferometers 55a, 55b, 55c, 56a, 56g: mirror 60: reading unit 61 (61a,

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Microwave Amplifiers (AREA)
  • Exposure Control For Cameras (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention makes it possible to accurately adjust the height of a light emission part. According to the present invention, a rotational drive part is driven to rotate a pinion (161b), and a support part (15a) that has a rack (161a) that engages the pinion (161b) moves in the height direction. Current is passed through a coil of an electromagnet of a permanent electromagnet (163) that includes the electromagnet and a permanent magnet, the permanent electromagnet (163) attracts the support part (15a) and thereby causes a support-part-side sliding surface (161e) to come into contact with a column-side sliding surface (161d), and the support part (15a) is held in place by the friction between the support-part-side sliding surface (161e) and the column-side sliding surface (161d).

Description

露光装置および高さ調整方法Exposure apparatus and height adjustment method
　本発明は、露光装置および高さ調整方法に関する。 The present invention relates to an exposure apparatus and a height adjusting method.
　特許文献１には、保持プレートの一端にボールねじが係合されており、このボールねじに連結されたサーボモータによって描画ヘッドが上下方向に所定の範囲内で移動する描画装置が開示されている。 Patent Literature 1 discloses a drawing apparatus in which a ball screw is engaged with one end of a holding plate, and a drawing head moves vertically within a predetermined range by a servomotor connected to the ball screw. .
特開平９－３２０９４３号公報JP-A-9-320943
　しかしながら、特許文献１に記載の発明では、描画ヘッドの移動にボールねじを用いているため、酔歩誤差（リードスクリュ１回転に対する雌ねじ部材の進み速度のむら）が発生し、描画ヘッドを正確に移動させることが出来ないという問題がある。 However, in the invention described in Patent Literature 1, a ball screw is used for moving the drawing head, so that a random walking error (uneven speed of the female screw member with respect to one rotation of the lead screw) occurs, and the drawing head is accurately moved. There is a problem that you can not do.
　本発明はこのような事情に鑑みてなされたもので、光を照射する光学装置の高さ調整を正確に行うことができる露光装置および高さ調整方法を提供することを目的とする。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide an exposure apparatus and a height adjustment method capable of accurately adjusting the height of an optical device that emits light.
　上記課題を解決するために、本発明に係る露光装置は、例えば、基板が載置される基板保持部と、磁性材料で形成された略棒状の支持部であって、長手方向が略水平方向となるように設けられた支持部と、前記支持部の両端にそれぞれ長手方向が略鉛直方向となるように設けられた棒状の柱と、を有する枠体であって、前記支持部には支持部側摺動面が形成され、前記柱には柱側摺動面が前記支持部側摺動面と対向する位置に形成された枠体と、前記支持部を鉛直方向に移動させる移動機構であって、前記支持部に設けられたラックと、前記柱に回転可能に設けられ、前記ラックと噛み合うピニオンと、前記ピニオンを回転させる回転駆動部と、を有する移動機構と、前記支持部に設けられ、前記基板に光を照射する光学装置と、前記柱に設けられ、永久磁石と電磁石とを有する永電磁石と、前記回転駆動部を駆動して前記支持部を移動させ、かつ、前記電磁石のコイルに電流を流して前記永久磁石に前記支持部を吸着させる制御部と、を備え、前記永電磁石が前記支持部を吸着して前記支持部側摺動面と前記柱側摺動面とを密着させ、前記支持部側摺動面と前記柱側摺動面との間の摩擦力により前記支持部を前記柱に固定することを特徴とする。 In order to solve the above-described problems, an exposure apparatus according to the present invention includes, for example, a substrate holding unit on which a substrate is placed, and a substantially bar-shaped support unit formed of a magnetic material, the longitudinal direction of which is substantially horizontal. A frame provided with a support portion provided so as to be provided, and a rod-shaped column provided such that a longitudinal direction thereof is substantially vertical at both ends of the support portion. A frame body in which a column-side sliding surface is formed, and a pillar-side sliding surface is formed on the column at a position facing the support-portion-side sliding surface, and a moving mechanism that moves the support portion in a vertical direction. A moving mechanism having a rack provided on the support portion, a pinion rotatably provided on the column, meshing with the rack, and a rotation drive portion for rotating the pinion; and a moving mechanism provided on the support portion. An optical device for irradiating the substrate with light; And a permanent electromagnet having a permanent magnet and an electromagnet, and driving the rotation drive unit to move the support unit, and applying a current to the coil of the electromagnet to cause the permanent magnet to attract the support unit. And a control unit, wherein the permanent electromagnet attracts the support portion to bring the support portion side sliding surface into close contact with the column side sliding surface, and the support portion side sliding surface and the column side sliding surface. The support is fixed to the pillar by frictional force between the support and the surface.
　本発明に係る露光装置によれば、回転駆動部を駆動してピニオンを回転させて、ピニオンと噛み合うラックが設けられた支持部を高さ方向に移動する。また、永久磁石と電磁石とを有する永電磁石が有する電磁石のコイルに電流を流し、永電磁石が支持部を吸着することで支持部側摺動面と柱側摺動面とを密着させて、支持部側摺動面と柱側摺動面との間の摩擦力により支持部を固定する。これにより、光学装置の高さ調整を正確に行うことができる。また、支持部の吸着に永電磁石を用いるため、通電時間が短く、熱による支持部の変形、膨張等が発生しないため、光学装置の高さ調整を正確に行うことができる。 According to the exposure apparatus of the present invention, the rotation drive section is driven to rotate the pinion, and the support section provided with the rack meshing with the pinion is moved in the height direction. In addition, a current is applied to the electromagnet coil of the permanent electromagnet having the permanent magnet and the electromagnet, and the permanent electromagnet attracts the support portion, thereby bringing the support portion side sliding surface and the column side sliding surface into close contact with each other, thereby supporting the electromagnet. The support portion is fixed by a frictional force between the part side sliding surface and the column side sliding surface. Thus, the height of the optical device can be accurately adjusted. Further, since the permanent electromagnet is used for attracting the support portion, the energization time is short and the support portion is not deformed or expanded due to heat, so that the height of the optical device can be accurately adjusted.
　ここで、前記支持部に設けられた計測部であって、鉛直方向に略沿って設けられたスケールと、前記スケールの値を読み取って位置情報を出力するヘッドと、を有する計測部と、備え、前記支持部の移動時には、前記永電磁石は、前記移動機構が前記支持部を移動させないときの吸着力である第１吸着力より弱い第２吸着力で前記支持部を吸着し、前記計測部は、前記支持部の高さを連続して計測し、前記支持部側摺動面は、前記柱側摺動面に沿って摺動してもよい。これにより、支持部側摺動面と柱側摺動面とを密着させたときに支持部が傾かないため、支持部の傾きに起因する計測部の計測誤差をなくすことができる。 Here, a measuring unit provided on the support unit, a measuring unit having a scale provided substantially along the vertical direction, and a head that reads a value of the scale and outputs position information, When the support unit moves, the permanent electromagnet attracts the support unit with a second attraction force that is weaker than a first attraction force that is an attraction force when the moving mechanism does not move the support unit. May continuously measure the height of the support portion, and the support portion side sliding surface may slide along the column side sliding surface. Accordingly, the support portion does not tilt when the support portion side sliding surface and the column side sliding surface are brought into close contact with each other, so that a measurement error of the measuring portion due to the tilt of the support portion can be eliminated.
　ここで、前記第２吸着力は、前記第１吸着力の略２０％から略３０％であってもよい。これにより、支持部を第２吸着力で吸着した時の計測部での計測結果と、支持部を第１吸着力で吸着した時の計測部での計測結果との差が最も小さくなる。 Here, the second suction force may be approximately 20% to approximately 30% of the first suction force. Thereby, the difference between the measurement result of the measurement unit when the support unit is suctioned with the second suction force and the measurement result of the measurement unit when the support unit is suctioned with the first suction force is minimized.
　ここで、前記支持部と前記光学装置との間に設けられる略薄板状のガイド部材と、前記枠体に設けられ、前記光学装置を鉛直方向に移動させる駆動部と、を備え、前記支持部は、略水平に配置された板状部を有し、前記板状部には略鉛直方向に貫通する丸孔が形成され、前記ガイド部材は、平面視略円板形状であり、前記丸孔を覆うように前記板状部に設けられ、前記ガイド部材には、略中央に取付孔が形成され、前記取付孔は、前記丸孔と略同心円状に配置され、前記光学装置は、光軸が前記取付孔の中心と略一致するように前記取付孔に挿入されて前記ガイド部材に固定されていてもよい。これにより、駆動部が光学装置を高さ方向に移動させるときの光軸の振れを数ｎｍ以下と小さくことができる。 Here, the support portion includes a substantially thin plate-shaped guide member provided between the support portion and the optical device, and a drive portion provided on the frame body for vertically moving the optical device. Has a plate-like portion arranged substantially horizontally, a circular hole penetrating in a substantially vertical direction is formed in the plate-like portion, and the guide member has a substantially disk shape in plan view, and the circular hole The guide member is provided with a mounting hole substantially at the center thereof, the mounting hole is disposed substantially concentrically with the round hole, and the optical device has an optical axis. May be inserted into the mounting hole so as to substantially coincide with the center of the mounting hole and fixed to the guide member. Thereby, the fluctuation of the optical axis when the drive unit moves the optical device in the height direction can be reduced to several nm or less.
　ここで、前記基板保持部を走査方向に移動させる移動部と、前記支持部に設けられ、前記基板までの距離を測定する測定部と、を備え、前記制御部は、前記移動部を介して前記基板保持部を前記走査方向に移動させながら前記測定部を介して前記基板までの距離を測定し、当該基板までの距離の最大値と最小値とから中央値を求め、当該中央値に基づいて前記駆動部の駆動量を求めてもよい。これにより、基板の高さが変化しても、常に基板に光学装置の焦点を合わせることができる。 Here, a moving unit that moves the substrate holding unit in a scanning direction, and a measuring unit that is provided on the support unit and measures a distance to the substrate, includes: the control unit, via the moving unit The distance to the substrate is measured via the measurement unit while moving the substrate holding unit in the scanning direction, and a median value is obtained from a maximum value and a minimum value of the distance to the substrate, based on the median value. The driving amount of the driving unit may be obtained by the above. Thereby, even if the height of the substrate changes, the optical device can always be focused on the substrate.
　ここで、前記光学装置は、下向きの光を照射するＡＦ用光源と、反射光が入射するＡＦセンサと、を有するＡＦ処理部を有し、前記制御部は、前記ＡＦ処理部を動作させながら前記支持部を移動させ、合焦していると判断される位置に前記光学装置が位置したら前記支持部側摺動面と前記柱側摺動面とを密着させてもよい。これにより、基板の高さが変化しても、常に基板に光学装置の焦点を合わせることができる。 Here, the optical device has an AF processing unit having an AF light source that emits downward light and an AF sensor that receives reflected light, and the control unit operates the AF processing unit while operating the AF processing unit. The support unit may be moved, and when the optical device is located at a position where it is determined that the focus is achieved, the support unit side sliding surface and the column side sliding surface may be brought into close contact with each other. Thereby, even if the height of the substrate changes, the optical device can always be focused on the substrate.
　上記課題を解決するために、本発明に係る高さ調整方法は、例えば、基板が載置される基板保持部と、磁性材料で形成された略棒状の支持部であって、長手方向が略水平方向となるように設けられた支持部と、前記支持部の両端にそれぞれ長手方向が略鉛直方向となるように設けられた棒状の柱と、を有する枠体であって、前記支持部には支持部側摺動面が形成され、前記柱には柱側摺動面が前記支持部側摺動面と対向する位置に形成された枠体と、前記支持部を鉛直方向に移動させる移動機構であって、前記支持部に鉛直方向に略沿って設けられたラックと、前記柱に回転可能に設けられ、前記ラックと噛み合うピニオンと、前記ピニオンを回転させる回転駆動部と、を有する移動機構と、前記支持部に設けられた計測部と、前記支持部に設けられ、前記基板に光を照射する光学装置と、前記柱に設けられ、永久磁石と電磁石とを有する永電磁石と、を有する装置を用いて前記支持部の高さを調整する高さ調整方法であって、前記電磁石のコイルに電流を流して前記永電磁石に前記支持部を第２吸着力で吸着させて、前記支持部側摺動面と前記柱側摺動面と当接させるステップと、前記計測部で前記支持部の高さを計測しながら、前記回転駆動部を駆動して前記ピニオンを回転させて、前記支持部を高さ方向に移動させるステップと、前記コイルに電流を流して前記永電磁石に前記支持部を前記第２吸着力より強い第１吸着力で吸着させて、前記支持部側摺動面と前記柱側摺動面と密着させて前記支持部を前記柱に固定するステップと、を含むことを特徴とする。これにより、支持部を第２吸着力で吸着したときと支持部を第１吸着力で吸着したときとで支持部が傾かないため、支持部の傾きに起因する計測部の計測誤差をなくすことができる。 In order to solve the above problem, a height adjusting method according to the present invention includes, for example, a substrate holding portion on which a substrate is placed, and a substantially rod-shaped support portion formed of a magnetic material, the longitudinal direction of which is substantially A frame having a support portion provided so as to be in a horizontal direction, and a rod-shaped pillar provided such that a longitudinal direction is substantially vertical at both ends of the support portion, and the support portion has Is a frame having a supporting part side sliding surface formed thereon, and a column body having a pillar side sliding surface facing the supporting part side sliding surface formed on the column, and a movement for vertically moving the supporting part. A mechanism, comprising: a rack provided substantially along the vertical direction on the support portion, a pinion rotatably provided on the column, meshing with the rack, and a rotation driving portion for rotating the pinion. A mechanism, a measurement unit provided on the support unit, and the support unit A height adjusting method for adjusting the height of the supporting portion using an apparatus provided and irradiating the substrate with light, and a device provided on the column and having a permanent magnet and an electromagnet. A step of causing a current to flow through the coil of the electromagnet to cause the permanent magnet to adsorb the support portion with a second attraction force, thereby bringing the support portion side sliding surface into contact with the column side sliding surface. Driving the rotation drive unit to rotate the pinion while moving the support unit in the height direction while measuring the height of the support unit with the measurement unit; and flowing an electric current to the coil. Then, the supporting portion is attracted to the permanent magnet by the first attracting force stronger than the second attracting force, and the supporting portion side sliding surface and the column side sliding surface are brought into close contact with each other, so that the supporting portion is attached to the column. Fixing. Accordingly, since the support portion does not tilt when the support portion is suctioned by the second suction force and when the support portion is suctioned by the first suction force, the measurement error of the measurement portion due to the tilt of the support portion is eliminated. Can be.
　本発明によれば、光照射部の高さ調整を正確に行うことができる。 According to the present invention, the height adjustment of the light irradiation unit can be accurately performed.
第１の実施の形態に係る露光装置１の概略を示す斜視図である。FIG. 1 is a perspective view schematically showing an exposure apparatus 1 according to a first embodiment. 測定部４０及びレーザ干渉計５０がマスク保持部２０の位置を測定する様子を示す概略図である。FIG. 4 is a schematic diagram illustrating a state where a measurement unit and a laser interferometer measure the position of a mask holding unit. 枠体１５の支持部１５ａの概略を示す斜視図であり、背面側（＋ｘ側）から見た図である。It is the perspective view which shows the outline of the support part 15a of the frame 15, and was seen from the back side (+ x side). 枠体１５の支持部１５ａの概略を示す斜視図であり、正面側（－ｘ側）から見た図である。It is the perspective view which shows the outline of the support part 15a of the frame 15, and is the figure seen from the front side (-x side). 図３の面Ｃで枠体１５を切断したときの概略を示す図であるIt is a figure which shows the outline when the frame 15 is cut | disconnected by the surface C of FIG. 光照射部３０ａの概略を示す要部透視図である。It is a principal part perspective view which shows the outline of the light irradiation part 30a. 駆動部３９ａの概略を示す側面図である。It is a side view which shows the outline of the drive part 39a. （Ａ）は、ガイド部材７０の概略を示す図であり、（Ｂ）は、ガイド部材７０Ａの概略を示す図である。(A) is a figure which shows the outline of the guide member 70, (B) is a figure which shows the outline of 70 A of guide members. （Ａ）は底板１５１にガイド部材７０を取り付けたときの底板１５１とガイド部材７０との位置関係を示す図であり、（Ｂ）は支持板１５３にガイド部材７０Ａを取り付けたときの支持板１５３とガイド部材７０Ａとの位置関係を示す図である。(A) is a figure which shows the positional relationship between the bottom plate 151 and the guide member 70 when the guide member 70 is attached to the bottom plate 151, and (B) is the support plate 153 when the guide member 70A is attached to the support plate 153. FIG. 7 is a view showing a positional relationship between the guide member 70A and the guide member 70A. 光照射部３０ａを支持板１５３に取り付ける取付構造の分解斜視図である。FIG. 9 is an exploded perspective view of an attachment structure for attaching the light irradiation unit 30a to a support plate 153. 枠体１５に光照射部３０ａが取り付けられた状態を示す図である。FIG. 4 is a diagram showing a state in which a light irradiation unit 30a is attached to a frame 15; （Ａ）は光照射部３０ａが移動していない状態（ストローク中央）を示す図であり、（Ｂ）は光照射部３０ａが下側に移動した状態（ストローク下端）を示す図であり、（Ｃ）は光照射部３０ａが上側に移動した状態（ストローク上端）を示す図である。(A) is a diagram showing a state in which the light irradiation unit 30a has not moved (the center of the stroke), and (B) is a diagram showing a state in which the light irradiation unit 30a has moved downward (the lower end of the stroke). (C) is a diagram showing a state in which the light irradiation unit 30a has moved upward (upper stroke). 露光装置１の電気的な構成を示すブロック図である。FIG. 2 is a block diagram illustrating an electrical configuration of the exposure apparatus 1. 露光装置１の高さ調整処理の流れを示すフローチャートである。4 is a flowchart illustrating a flow of a height adjustment process of the exposure apparatus 1. ステップＳ２０での測定結果の一例である。It is an example of the measurement result in step S20. 支持部１５ａを上下動させる時の様子を模式的に示す図であり、（Ａ）は支持部１５ａを吸着する場合（本実施の形態）であり、（Ｂ）、（Ｃ）は支持部１５ａを吸着しない場合である。It is a figure which shows typically the mode at the time of moving the support part 15a up and down, (A) is a case where the support part 15a is adsorbed (this Embodiment), (B), (C) is the support part 15a. Is not adsorbed.
　以下、本発明を、略水平方向に保持した感光性基板（例えば、ガラス基板）を走査方向に移動させながらレーザ等の光を照射してフォトマスクを生成する露光装置に適用した実施の形態を例に、図面を参照して詳細に説明する。各図面において、同一の要素には同一の符号が付されており、重複する部分については説明を省略する。 Hereinafter, an embodiment in which the present invention is applied to an exposure apparatus that generates a photomask by irradiating light such as a laser while moving a photosensitive substrate (eg, a glass substrate) held in a substantially horizontal direction in the scanning direction will be described. An example will be described in detail with reference to the drawings. In each of the drawings, the same elements are denoted by the same reference numerals, and description of overlapping parts will be omitted.
　感光性基板としては、例えば、熱膨張率が非常に小さい（例えば、約５．５×１０－７／Ｋ程度）石英ガラスが用いられる。露光装置により生成されるフォトマスクは、例えば液晶表示装置用の基板を製造するために用いられる露光用マスクである。フォトマスクは、一辺が例えば１ｍを超える（例えば、１４００ｍｍ×１２２０ｍｍ）大型の略矩形形状の基板上に、１個または複数個のイメージデバイス用転写パターンが形成されたものである。以下、加工前、加工中及び加工後の感光性基板を包括する概念として、マスクＭという用語を使用する。 As the photosensitive substrate, for example, quartz glass having a very low coefficient of thermal expansion (for example, about 5.5 × 10 −7 / K) is used. The photomask generated by the exposure device is, for example, an exposure mask used for manufacturing a substrate for a liquid crystal display device. The photomask is formed by forming one or a plurality of transfer patterns for an image device on a large, substantially rectangular substrate having a side of, for example, more than 1 m (for example, 1400 mm × 1220 mm). Hereinafter, the term “mask M” is used as a concept including the photosensitive substrate before, during, and after processing.
　ただし、本発明の露光装置は、マスク製造装置に限定されない。本発明の露光装置は、略水平方向に保持した基板を走査方向に移動させながら光（レーザ、ＵＶ、偏光光等を含む）を照射する様々な装置を含む概念である。また、本発明の光学装置も、感光性基板に光を照射する光照射部に限定されない。 However, the exposure apparatus of the present invention is not limited to a mask manufacturing apparatus. The exposure apparatus of the present invention is a concept including various devices that irradiate light (including laser, UV, polarized light, and the like) while moving a substrate held in a substantially horizontal direction in a scanning direction. Further, the optical device of the present invention is not limited to the light irradiation unit that irradiates light to the photosensitive substrate.
　図１は、第１の実施の形態に係る露光装置１の概略を示す斜視図である。露光装置１は、主として、定盤１１と、板状部１２と、レール１３、１４と、枠体１５と、マスク保持部２０と、光照射部３０と、測定部４０（図２参照）と、レーザ干渉計５０（図２参照）と、測定部６１（６１ａ、６１ｄ、６１ｇ）と、を有する。なお、図１においては、一部の構成について図示を省略している。また、露光装置１は、装置全体を覆う図示しない温度調整部により、一定温度に保たれている。 FIG. 1 is a perspective view schematically showing an exposure apparatus 1 according to the first embodiment. The exposure apparatus 1 mainly includes a surface plate 11, a plate portion 12, rails 13, 14, a frame 15, a mask holding portion 20, a light irradiation portion 30, a measurement portion 40 (see FIG. 2). , A laser interferometer 50 (see FIG. 2) and a measuring unit 61 (61a, 61d, 61g). In FIG. 1, illustration of a part of the configuration is omitted. The exposure apparatus 1 is maintained at a constant temperature by a temperature adjustment unit (not shown) that covers the entire apparatus.
　定盤１１は、略直方体形状（厚板状）の部材であり、例えば、石（例えば、花崗岩）や低膨張率の鋳物（例えば、ニッケル系の合金）で形成される。定盤１１は、上側（＋ｚ側）に略水平（ｘｙ平面と略平行）な上面１１ａを有する。 The surface plate 11 is a member having a substantially rectangular parallelepiped shape (thick plate shape), and is formed of, for example, a stone (for example, granite) or a low expansion coefficient casting (for example, a nickel-based alloy). The platen 11 has an upper surface 11a that is substantially horizontal (substantially parallel to the xy plane) on the upper side (+ z side).
　定盤１１は、設置面（例えば、床）上に載置された複数の除振台（図示せず）の上に載置される。これにより、定盤１１が除振台を介して設置面上に載置される。除振台はすでに公知であるため、詳細な説明を省略する。なお、除振台は必須ではない。定盤１１の＋ｘ側には、マスクＭをマスク保持部２０に設置するローダ（図示せず）が設けられる。 The surface plate 11 is placed on a plurality of vibration isolation tables (not shown) placed on an installation surface (for example, a floor). Thereby, the surface plate 11 is placed on the installation surface via the vibration isolation table. Since the anti-vibration table is already known, a detailed description will be omitted. Note that the vibration isolation table is not essential. On the + x side of the surface plate 11, a loader (not shown) for installing the mask M on the mask holding unit 20 is provided.
　レール１３は、セラミック製の細長い板状の部材であり、定盤１１の上面１１ａに、長手方向が走査方向（ｘ方向）に沿うように固定される。３本のレール１３は、高さ（ｚ方向の位置）が略同一であり、上面が高精度及び高平坦度で形成される。 The rail 13 is an elongated plate-shaped member made of ceramic, and is fixed to the upper surface 11 a of the surface plate 11 so that the longitudinal direction is along the scanning direction (x direction). The three rails 13 have substantially the same height (position in the z direction), and the upper surface is formed with high precision and high flatness.
　ローダ側（＋ｘ側）のレール１３は、端が上面１１ａの端部に配置され、反ローダ側（－ｘ側）のレール１３は、端が上面１１ａの端部より内側に配置される。 (4) The rail 13 on the loader side (+ x side) has an end disposed at the end of the upper surface 11a, and the rail 13 on the opposite loader side (−x side) is disposed inside the end of the upper surface 11a.
　板状部１２は、レール１３の上に載置される。板状部１２は、セラミック製の略板状の部材であり、全体として略矩形形状である。板状部１２の下面（－ｚ側の面）には、長手方向がｘ方向に沿うようにガイド部（図示せず）が設けられる。これにより、板状部１２がｘ方向以外に移動しないように板状部１２の移動方向が規制される。 The plate-shaped part 12 is placed on the rail 13. The plate-shaped portion 12 is a substantially plate-shaped member made of ceramic, and has a substantially rectangular shape as a whole. A guide portion (not shown) is provided on the lower surface (the surface on the −z side) of the plate portion 12 so that the longitudinal direction is along the x direction. Thereby, the moving direction of the plate-shaped portion 12 is regulated so that the plate-shaped portion 12 does not move in directions other than the x direction.
　板状部１２の上面１２ａには、レール１４が設けられる。レール１４は、長手方向がｙ方向に沿うように固定される。レール１４は、高さが略同一であり、上面が高精度及び高平坦度で形成される。 レ ー ル A rail 14 is provided on the upper surface 12a of the plate-shaped portion 12. The rail 14 is fixed so that the longitudinal direction is along the y direction. The rails 14 have substantially the same height, and the upper surface is formed with high precision and high flatness.
　マスク保持部２０は、平面視略矩形形状の略板状であり、熱膨張係数が略０．５～１×１０－７／Ｋの低膨張性セラミックを用いて形成される。これにより、マスク保持部２０の変形を防止することができる。なお、マスク保持部２０は、熱膨張係数が略５×１０－８／Ｋの超低膨張性ガラスセラミックを用いて形成することもできる。この場合には、制御しきれない温度変化が発生したとしても、マスク保持部２０の変形を確実に防止することができる。なお、マスク保持部２０をマスクＭと同様に伸び縮みする材料で形成してもよい。 The mask holding section 20 has a substantially plate shape having a substantially rectangular shape in a plan view, and is formed using a low expansion ceramic having a thermal expansion coefficient of about 0.5 to 1 × 10 −7 / K. Thereby, the deformation of the mask holding unit 20 can be prevented. Note that the mask holding section 20 can also be formed using an ultra-low-expansion glass ceramic having a coefficient of thermal expansion of about 5 × 10 −8 / K. In this case, even if an uncontrollable temperature change occurs, deformation of the mask holding unit 20 can be reliably prevented. Note that the mask holding portion 20 may be formed of a material that expands and contracts in the same manner as the mask M.
　マスク保持部２０は、レール１４の上に載置される。言い換えれば、マスク保持部２０は、板状部１２及びレール１３、１４を介して上面１１ａに設けられる。 The mask holder 20 is mounted on the rail 14. In other words, the mask holding unit 20 is provided on the upper surface 11a via the plate-like portion 12 and the rails 13 and 14.
　マスク保持部２０の下面には、長手方向がｙ方向に沿うようにガイド部（図示せず）が設けられる。これにより、マスク保持部２０、すなわち板状部１２がｙ方向以外に移動しないようにマスク保持部２０の移動方向が規制される。 ガ イ ド A guide portion (not shown) is provided on the lower surface of the mask holding portion 20 so that the longitudinal direction is along the y direction. Thereby, the moving direction of the mask holding unit 20, that is, the plate-like unit 12 is restricted so as not to move in directions other than the y direction.
　このように、マスク保持部２０（板状部１２）は、レール１３に沿ってｘ方向に移動可能に設けられ、マスク保持部２０は、レール１４に沿ってｙ方向に移動可能に設けられる。 よ う As described above, the mask holding section 20 (the plate-shaped section 12) is provided so as to be movable in the x direction along the rail 13, and the mask holding section 20 is provided so as to be movable in the y direction along the rail 14.
　マスク保持部２０は、略水平な上面２０ａを有する。上面２０ａには、マスクＭ（図示省略）が載置される。また、上面２０ａには、バーミラー２１、２２、２３が設けられる（図２参照）。 The mask holder 20 has a substantially horizontal upper surface 20a. A mask M (not shown) is placed on the upper surface 20a. Further, bar mirrors 21, 22, and 23 are provided on the upper surface 20a (see FIG. 2).
　露光装置１は、図示しない駆動部８１、８２（図１３参照）を有する。駆動部８１、８２は、例えばリニアモータである。駆動部８１はマスク保持部２０（板状部１２）をレール１３に沿ってｘ方向に移動させ、駆動部８２はマスク保持部２０をレール１４に沿ってｙ方向に移動させる。駆動部８１、８２が板状部１２やマスク保持部２０を移動させる方法は、既に公知の様々な方法を用いることができる。 The exposure apparatus 1 has driving units 81 and 82 (not shown) (see FIG. 13). The driving units 81 and 82 are, for example, linear motors. The driving unit 81 moves the mask holding unit 20 (plate-like portion 12) in the x direction along the rail 13, and the driving unit 82 moves the mask holding unit 20 in the y direction along the rail 14. Various known methods can be used as a method in which the driving units 81 and 82 move the plate-shaped unit 12 and the mask holding unit 20.
　定盤１１には、枠体１５が設けられる。枠体１５は、磁性材料、例えば低膨張率の鋳物（例えば、ニッケル系の合金）で形成される。枠体１５は、支持部１５ａと、支持部１５ａを両端で支える２本の柱１５ｃと、を有する。枠体１５は、マスク保持部２０の上方（＋ｚ方向）に光照射部３０を保持する。支持部１５ａには、光照射部３０が取り付けられる。枠体１５については後に詳述する。 A frame 15 is provided on the surface plate 11. The frame 15 is formed of a magnetic material, for example, a casting having a low expansion coefficient (for example, a nickel-based alloy). The frame 15 has a support portion 15a and two columns 15c that support the support portion 15a at both ends. The frame body 15 holds the light irradiation unit 30 above the mask holding unit 20 (in the + z direction). The light irradiation unit 30 is attached to the support 15a. The frame 15 will be described later in detail.
　光照射部３０は、マスクＭに光（本実施の形態では、レーザ光）を照射する。光照射部３０は、ｙ方向に沿って一定間隔（例えば、略２００ｍｍおき）で設けられる。本実施の形態では、７個の光照射部３０ａ、光、光照射部３０ｂ、光照射部３０ｃ、光照射部３０ｄ、光照射部３０ｅ、光照射部３０ｆ、光照射部３０ｇを有する。移動機構１６１（後に詳述）は、光照射部３０ａ～３０ｇの焦点位置がマスクＭの上面に合うように、光照射部３０ａ～３０ｇ全体を１０ｍｍ程度の範囲で鉛直方向（ｚ方向）に移動させる。また、駆動部３９（３９ａ（図６参照）～３９ｇ、後に詳述）は、光照射部３０ａ～３０ｇの焦点位置の微調整のため、光照射部３０ａ～３０ｇを３０μｍ（マイクロメートル）程度の範囲でｚ方向に微動させる。光照射部３０については後に詳述する。 The light irradiation unit 30 irradiates the mask M with light (in this embodiment, laser light). The light irradiation units 30 are provided at regular intervals (for example, approximately every 200 mm) along the y direction. In the present embodiment, there are seven light irradiation units 30a, light, light irradiation unit 30b, light irradiation unit 30c, light irradiation unit 30d, light irradiation unit 30e, light irradiation unit 30f, and light irradiation unit 30g. The moving mechanism 161 moves the entire light irradiation units 30a to 30g in the vertical direction (z direction) within a range of about 10 mm so that the focal positions of the light irradiation units 30a to 30g are aligned with the upper surface of the mask M. Let it. The drive unit 39 (39a (see FIG. 6) to 39g, detailed later) adjusts the light irradiation units 30a to 30g to about 30 μm (micrometer) for fine adjustment of the focal position of the light irradiation units 30a to 30g. Fine movement in the z direction within the range. The light irradiation unit 30 will be described later in detail.
　光照射部３０ａ～３０ｇには、それぞれ図示しない読取部が設けられる。読取部は、マスクＭに形成されたパターンを読み取るものである。 読 取 A reading unit (not shown) is provided in each of the light irradiation units 30a to 30g. The reading unit reads a pattern formed on the mask M.
　測定部４０（図２参照）は、例えばリニアエンコーダであり、マスク保持部２０の位置を測定するレーザ干渉計５０は、レーザ干渉計５１、５２（図１では図示省略、図２参照）を有する。枠体１５の－ｙ側に設けられた柱には、レーザ干渉計５１が設けられる。また、定盤１１の＋ｘ側の側面には、レーザ干渉計５２（図１では図示省略）が設けられる。 The measurement unit 40 (see FIG. 2) is, for example, a linear encoder, and the laser interferometer 50 that measures the position of the mask holding unit 20 has laser interferometers 51 and 52 (not shown in FIG. 1, see FIG. 2). . A laser interferometer 51 is provided on a column provided on the −y side of the frame 15. A laser interferometer 52 (not shown in FIG. 1) is provided on the + x side surface of the surface plate 11.
　図２は、測定部４０及びレーザ干渉計５０がマスク保持部２０の位置を測定する様子を示す概略図である。なお、図２では、レール１３、１４の一部のみ図示している。また、図２では、光照射部３０ａ、３０ｇのみ図示し、光、光照射部３０ｂ～３０ｆについては図示を省略する。 FIG. 2 is a schematic diagram showing how the measuring unit 40 and the laser interferometer 50 measure the position of the mask holding unit 20. In FIG. 2, only a part of the rails 13 and 14 is shown. In FIG. 2, only the light irradiation units 30a and 30g are shown, and the light and light irradiation units 30b to 30f are not shown.
　測定部４０は、位置測定部４１、４２を有する。位置測定部４１、４２は、それぞれ、スケール４１ａ、４２ａと、検出ヘッド４１ｂ、４２ｂとを有する。 The measuring section 40 has position measuring sections 41 and 42. The position measuring units 41 and 42 have scales 41a and 42a and detection heads 41b and 42b, respectively.
　スケール４１ａは、＋ｙ側のレール１３の＋ｙ側の端面及び－ｙ側のレール１３の－ｙ側の端面に設けられる。検出ヘッド４１ｂは、板状部１２（図２では図示省略）の＋ｙ側及び－ｙ側の端面に設けられる。図２では、＋ｙ側のスケール４１ａ及び検出ヘッド４１ｂについての図示を省略する。 The scale 41a is provided on the + y side end face of the + y side rail 13 and the −y side end face of the −y side rail 13. The detection head 41b is provided on the + y-side and -y-side end surfaces of the plate portion 12 (not shown in FIG. 2). In FIG. 2, the illustration of the scale 41a and the detection head 41b on the + y side is omitted.
　スケール４２ａは、＋ｘ側のレール１４の＋ｘ側の端面及び－ｘ側のレール１３の－ｘ側の端面に設けられる。検出ヘッド４２ｂは、マスク保持部２０の＋ｘ側及び－ｘ側の端面に設けられる。図２では、－ｘ側のスケール４２ａ及び検出ヘッド４２ｂについての図示を省略する。 The scale 42a is provided on the + x side end face of the + x side rail 14 and the −x side end face of the −x side rail 13. The detection head 42b is provided on the + x side and −x side end surfaces of the mask holding unit 20. In FIG. 2, illustration of the scale 42a and the detection head 42b on the −x side is omitted.
　スケール４１ａ、４２ａは、例えばレーザホログラムスケールであり、０．５１２μｍ（ナノメートル）ピッチでメモリが形成されている。検出ヘッド４１ｂ、４２ｂは、光（例えば、レーザ光）を照射し、スケール４１ａ、４２ａで反射された光を取得し、これにより発生する信号を５１２等分して１ｎｍを得、これにより発生する信号を１０２４等分して０．５ｎｍを得る。位置測定部４１、４２はすでに公知であるため、詳細な説明を省略する。 The scales 41 a and 42 a are, for example, laser hologram scales, and memories are formed at a pitch of 0.512 μm (nanometer). The detection heads 41b and 42b irradiate light (for example, laser light), acquire the light reflected by the scales 41a and 42a, divide a signal generated thereby by 512 equally to obtain 1 nm, and generate the signal. Divide the signal by 1024 to obtain 0.5 nm. Since the position measuring units 41 and 42 are already known, detailed description will be omitted.
　光照射部３０ａには、ｘｚ平面と略平行な反射面を有するミラー５５ａが設けられる。光照射部３０ｇには、ｘｚ平面と略平行な反射面を有するミラー５５ｂ、５５ｃが設けられる。ミラー５５ａ、５５ｂ、５５ｃは、ｘ方向の位置が重ならないように設けられる。 The mirror 55a having a reflection surface substantially parallel to the xz plane is provided in the light irradiation unit 30a. The light irradiating unit 30g is provided with mirrors 55b and 55c having reflecting surfaces substantially parallel to the xz plane. The mirrors 55a, 55b, and 55c are provided so that the positions in the x direction do not overlap.
　光照射部３０ａには、ｙｚ平面と略平行な反射面を有するミラー５６ａが設けられる。光照射部３０ｇには、ｙｚ平面と略平行な反射面を有するミラー５６ｇが設けられる。 A mirror 56a having a reflecting surface substantially parallel to the yz plane is provided in the light irradiation unit 30a. The light irradiation unit 30g is provided with a mirror 56g having a reflection surface substantially parallel to the yz plane.
　レーザ干渉計５１、５２は、４本のレーザ光を照射する。レーザ干渉計５１は、レーザ干渉計５１ａ、５１ｂ、５１ｃを有する。レーザ干渉計５２は、レーザ干渉計５２ａ、５２ｇを有する。 The laser interferometers 51 and 52 emit four laser beams. The laser interferometer 51 has laser interferometers 51a, 51b, and 51c. The laser interferometer 52 has laser interferometers 52a and 52g.
　図２において、レーザ光の経路を２点鎖線で示す。レーザ干渉計５１ａ、５１ｂ、５１ｃから照射される光のうちの２本は、バーミラー２３で反射されて、その反射光がレーザ干渉計５１ａ、５１ｂ、５１ｃで受光される。 に お い て In FIG. 2, the path of the laser beam is indicated by a two-dot chain line. Two of the lights emitted from the laser interferometers 51a, 51b, and 51c are reflected by the bar mirror 23, and the reflected lights are received by the laser interferometers 51a, 51b, and 51c.
　レーザ干渉計５１ａから照射される光のうちの残りの２本はミラー５５ａで反射して、その反射光がレーザ干渉計５１ａで受光される。レーザ干渉計５１ｂから照射される光のうちの残りの２本はミラー５５ｂで反射して、その反射光がレーザ干渉計５１ｂで受光される。レーザ干渉計５１ｃから照射される光のうちの残りの２本はミラー５５ｃで反射して、その反射光がレーザ干渉計５１ｃで受光される。 The remaining two of the lights emitted from the laser interferometer 51a are reflected by the mirror 55a, and the reflected light is received by the laser interferometer 51a. The remaining two of the lights emitted from the laser interferometer 51b are reflected by the mirror 55b, and the reflected light is received by the laser interferometer 51b. The remaining two of the lights emitted from the laser interferometer 51c are reflected by the mirror 55c, and the reflected light is received by the laser interferometer 51c.
　レーザ干渉計５１ａ～５１ｃは、それぞれミラー５５ａ～５５ｃの位置を基準としバーミラー２３の位置を測定することで、光照射部３０ａ、３０ｇとマスク保持部２０とのｙ方向の位置関係を測定する。 The laser interferometers 51a to 51c measure the position of the bar mirror 23 with reference to the positions of the mirrors 55a to 55c, respectively, to measure the positional relationship between the light irradiation units 30a and 30g and the mask holding unit 20 in the y direction.
　レーザ干渉計５２ａから照射される光のうちの２本は、バーミラー２２で反射されて、その反射光がレーザ干渉計５２ａで受光される。レーザ干渉計５２ｇから照射される光のうちの２本は、バーミラー２１で反射されて、その反射光がレーザ干渉計５２ｇで受光される。 (2) Two of the lights emitted from the laser interferometer 52a are reflected by the bar mirror 22, and the reflected light is received by the laser interferometer 52a. Two of the lights emitted from the laser interferometer 52g are reflected by the bar mirror 21, and the reflected light is received by the laser interferometer 52g.
　レーザ干渉計５２ａから照射される光のうちの残りの２本はミラー５６ａで反射して、その反射光がレーザ干渉計５２ａで受光される。レーザ干渉計５２ｇから照射される光のうちの残りの２本はミラー５６ｇで反射して、その反射光がレーザ干渉計５２ｇで受光される。 The remaining two of the lights emitted from the laser interferometer 52a are reflected by the mirror 56a, and the reflected light is received by the laser interferometer 52a. The remaining two of the lights emitted from the laser interferometer 52g are reflected by the mirror 56g, and the reflected light is received by the laser interferometer 52g.
　レーザ干渉計５２ａ、５２ｇは、それぞれミラー５６ａ、５６ｇの位置を基準としバーミラー２１、２２の位置を測定することで、光照射部３０ａ～３０ｇとマスク保持部２０とのｘ方向の位置関係を測定する。 The laser interferometers 52a and 52g measure the positions of the bar mirrors 21 and 22 with reference to the positions of the mirrors 56a and 56g, respectively, to measure the positional relationship between the light irradiation units 30a to 30g and the mask holding unit 20 in the x direction. I do.
　本実施の形態では、光照射部３０ｂ～３０ｆにはミラーが設けられず、そのミラーの位置を測定するレーザ干渉計も設けられない。これは、光照射部３０ａ～３０ｇを３０μｍ程度の範囲でｚ方向に移動させるときの光軸の振れが数ｎｍ以下と小さく（後に詳述）、光照射部３０ｂ～３０ｆの位置を光照射部３０ａ、３０ｇの位置に基づいて内挿により求められるためである。これにより、装置を小型化することができ、かつコストを下げることができる。 In the present embodiment, no mirror is provided in the light irradiation units 30b to 30f, and no laser interferometer for measuring the position of the mirror is provided. This is because when the light irradiators 30a to 30g are moved in the z direction within a range of about 30 μm, the deflection of the optical axis is as small as several nanometers or less (to be described in detail later). This is because it is obtained by interpolation based on the positions of 30a and 30g. As a result, the size of the device can be reduced, and the cost can be reduced.
　次に、枠体１５について説明する。図３、４は、枠体１５の支持部１５ａの概略を示す斜視図である。図３は背面側（－ｘ側）から見た図であり、図４は正面側（＋ｘ側）から見た図である。図３、４は、説明のため、支持部１５ａと柱１５ｃとを多少離して図示しているが、実際は支持部１５ａと柱１５ｃとは隣接している。 Next, the frame 15 will be described. FIGS. 3 and 4 are perspective views schematically showing the support 15 a of the frame 15. FIG. 3 is a view from the back side (−x side), and FIG. 4 is a view from the front side (+ x side). 3 and 4, the support portion 15a and the column 15c are illustrated with a slight distance therebetween for the sake of explanation, but the support portion 15a and the column 15c are actually adjacent to each other.
　支持部１５ａは、断面形状が略矩形形状の略棒状であり、内部は空洞になっている。支持部１５ａは、長手方向が略水平方向（ここではｙ方向）となるように配置されている。柱１５ｃは、支持部１５ａの両端にそれぞれ設けられている。 The support portion 15a is substantially rod-shaped with a substantially rectangular cross section, and has a hollow inside. The support portion 15a is arranged so that its longitudinal direction is substantially horizontal (here, the y direction). The pillars 15c are provided at both ends of the support portion 15a.
　支持部１５ａは、主として、底板１５１と、支持板１５３と、底板１５１及び支持板１５３の両側に設けられた側板１５２、１５４と、仕切り壁１５９とを有する。底板１５１及び支持板１５３は略水平に配置され、側板１５２、１５４は略鉛直に配置される。 The support portion 15a mainly includes a bottom plate 151, a support plate 153, side plates 152 and 154 provided on both sides of the bottom plate 151 and the support plate 153, and a partition wall 159. The bottom plate 151 and the support plate 153 are disposed substantially horizontally, and the side plates 152 and 154 are disposed substantially vertically.
　本実施の形態では、底板１５１、支持板１５３及び側板１５２、１５４の板厚は略１５ｍｍ～２０ｍｍであり、底板１５１、支持板１５３及び側板１５２、１５４のｙ方向の長さ（図９におけるＷ１）は略２．２ｍである。 In the present embodiment, the thickness of the bottom plate 151, the support plate 153, and the side plates 152, 154 is approximately 15 mm to 20 mm, and the length of the bottom plate 151, the support plate 153, and the side plates 152, 154 in the y direction (W1 in FIG. 9). ) Is approximately 2.2 m.
　底板１５１及び支持板１５３には、それぞれ、ｙ方向に沿って丸孔１５５ａ～１５５ｇ、１５６ａ～１５６ｇが形成される。丸孔１５５ａ～１５５ｇ、１５６ａ～１５６ｇは、それぞれ底板１５１及び支持板１５３を略鉛直方向に貫通する孔であり、平面視略円形である。平面視において、丸孔１５５ａ～１５５ｇの中心の位置と、丸孔１５６ａ～１５６ｇの中心の位置とは略一致する。 丸 Round holes 155a to 155g and 156a to 156g are formed in the bottom plate 151 and the support plate 153 along the y direction, respectively. The circular holes 155a to 155g and 156a to 156g are holes that penetrate the bottom plate 151 and the support plate 153 in a substantially vertical direction, and have a substantially circular shape in plan view. In a plan view, the positions of the centers of the round holes 155a to 155g substantially coincide with the positions of the centers of the round holes 156a to 156g.
　丸孔１５５ａ～１５５ｇ、１５６ａ～１５６ｇには、それぞれ、丸孔１５５ａ～１５５ｇ、１５６ａ～１５６ｇを覆うようにガイド部材７０、７０Ａ（後に詳述）が設けられ、ガイド部材７０、７０Ａに光照射部３０ａ～３０ｇが取り付けられる。言い換えれば、光照射部３０ａ～３０ｇは、ガイド部材７０、７０Ａを介して枠体１５に設けられる。光照射部３０ａ～３０ｇを枠体１５に取り付ける取付構造については後に詳述する。 Guide members 70 and 70A (described later in detail) are provided in the round holes 155a to 155g and 156a to 156g so as to cover the round holes 155a to 155g and 156a to 156g, respectively. 30a to 30g are attached. In other words, the light irradiation units 30a to 30g are provided on the frame 15 via the guide members 70 and 70A. The attachment structure for attaching the light irradiation units 30a to 30g to the frame 15 will be described later in detail.
　また、底板１５１には、丸孔１５５ａ～１５５ｇに隣接して丸孔１５７ａ～１５７ｇが形成される。丸孔１５７ａ～１５７ｇには、読取部（図示せず）の鏡筒が挿入される。 丸 Further, in the bottom plate 151, round holes 157a to 157g are formed adjacent to the round holes 155a to 155g. A lens barrel of a reading unit (not shown) is inserted into the round holes 157a to 157g.
　側板１５２、１５４には、それぞれ孔１５２ａ～１５２ｉ、１５４ａ～１５４ｉが形成される。孔１５２ａ～１５２ｇ、１５４ａ～１５４ｇは、それぞれ、丸孔１５５ａ～１５５ｇ、１５６ａ～１５６ｇとｙ方向の位置が重なるように設けられる。孔１５２ａ～１５２ｇ、１５４ａ～１５４ｇは、丸孔１５７ａ～１５７ｇへ読取部６０を取り付けるのに用いられる。孔１５２ｈ、１５２ｉは、孔１５２ａ～１５２ｇの両側にそれぞれ設けられ、孔１５４ｈ、１５４ｉは、丸孔１５４ａ～１５４ｇの両側にそれぞれ設けられる。枠体１５は鋳物であり、孔１５２ａ～１５２ｉ、１５４ａ～１５４ｉは鋳造時に鋳砂を排出して内部空間を形成するための鋳抜き穴として用いられる。 The holes 152a to 152i and 154a to 154i are formed in the side plates 152 and 154, respectively. The holes 152a to 152g and 154a to 154g are provided such that the positions in the y direction overlap the round holes 155a to 155g and 156a to 156g, respectively. The holes 152a to 152g and 154a to 154g are used for attaching the reading unit 60 to the round holes 157a to 157g. The holes 152h and 152i are provided on both sides of the holes 152a to 152g, respectively, and the holes 154h and 154i are provided on both sides of the round holes 154a to 154g, respectively. The frame 15 is a casting, and the holes 152a to 152i and 154a to 154i are used as cast holes for discharging casting sand and forming an internal space during casting.
　支持部１５ａの内部は空洞であるが、補強として支持部１５ａの内部に仕切り壁１５９を設けている。仕切り壁１５９は、板状の部材であり、端面が底板１５１、支持板１５３及び側板１５２、１５４に当接している。これにより、仕切り壁１５９が設けられた位置においては支持部１５ａの内部の空洞がなくなり、支持部１５ａの振動や変形（撓み、捩れ等）が防止される。 が Although the inside of the support portion 15a is hollow, a partition wall 159 is provided inside the support portion 15a for reinforcement. The partition wall 159 is a plate-shaped member, and its end surface is in contact with the bottom plate 151, the support plate 153, and the side plates 152 and 154. Accordingly, at the position where the partition wall 159 is provided, the cavity inside the support portion 15a is eliminated, and the vibration and deformation (bending, twisting, etc.) of the support portion 15a are prevented.
　枠体１５は、支持部１５ａを柱１５ｃに沿ってｚ方向に移動させる移動機構１６１を有する。移動機構１６１は、支持部１５ａをｚ方向に１０ｍｍ程度の範囲で移動させる。本実施の形態の移動機構１６１は、支持部１５ａの長手方向と略直交する端面にｚ方向に沿って設けられたラック１６１ａと、柱１５ｃに回転可能に設けられたピニオン１６１ｂと、ピニオン１６１ｂを回転させる回転駆動部１６１ｆ（図１３参照）とを有する。ラック１６１ａは、支持部１５ａの長手方向と略直交する端面の略中央に設けられ、支持部１５ａの側面から外側に向けて突出する凸部１５８にねじ等（図示省略）を用いて固定される。ピニオン１６１ｂは、柱１５ｃに回転可能に設けられており、ラック１６１ａと噛み合う。 The frame 15 has a moving mechanism 161 that moves the support 15a in the z direction along the column 15c. The moving mechanism 161 moves the support portion 15a in the range of about 10 mm in the z direction. The moving mechanism 161 of the present embodiment includes a rack 161a provided along the z direction on an end surface substantially orthogonal to the longitudinal direction of the support portion 15a, a pinion 161b rotatably provided on the column 15c, and a pinion 161b. And a rotation drive unit 161f (see FIG. 13) for rotating. The rack 161a is provided substantially at the center of an end surface substantially perpendicular to the longitudinal direction of the support portion 15a, and is fixed to a convex portion 158 projecting outward from a side surface of the support portion 15a using a screw or the like (not shown). . The pinion 161b is rotatably provided on the column 15c, and meshes with the rack 161a.
　柱１５ｃには、２つの永電磁石１６３が設けられる。２つの永電磁石１６３は、柱１５ｃに設けられており、支持部１５ａの長手方向の両端近傍に配置される。永電磁石１６３は、ラック１６１ａが設けられた端面に隣接する側板１５４に沿って設けられる。 The column 15c is provided with two permanent magnets 163. The two permanent magnets 163 are provided on the column 15c, and are arranged near both ends in the longitudinal direction of the support 15a. The permanent magnet 163 is provided along the side plate 154 adjacent to the end face on which the rack 161a is provided.
　永電磁石１６３は、永久磁石１６３ａ（図１３参照）と電磁石１６３ｂ（図１３参照）とを有する永電磁式であり、着磁及び脱磁時のみ電磁石１６３ｂのコイルに電流を流し、内蔵されている永久磁石１６３ａのＯＮ－ＯＦＦを行う。枠体１５に用いられる低膨張合金は磁性材料であるため、永電磁石１６３により移動可能である。永電磁石１６３はＯＮ－ＯＦＦ時に短時間（例えば０．２秒程度）だけ通電すればよいため、発熱がほとんどない。また、永電磁石１６３は、永久磁石がＯＮされた後の磁力が変化しない。 The permanent electromagnet 163 is a permanent electromagnetic type having a permanent magnet 163a (see FIG. 13) and an electromagnet 163b (see FIG. 13), and supplies a current to the coil of the electromagnet 163b only during magnetization and demagnetization, and is built in. The permanent magnet 163a is turned on and off. Since the low expansion alloy used for the frame 15 is a magnetic material, it can be moved by the permanent magnet 163. Since the permanent electromagnet 163 only needs to be energized for a short time (for example, about 0.2 seconds) during ON-OFF, there is almost no heat generation. Further, the permanent magnet 163 does not change its magnetic force after the permanent magnet is turned on.
　また、永電磁石１６３は、調整ダイヤル１６３ｃ（図１３参照）を有する。調整ダイヤル１６３ｃは、電磁石１６３ｂのコイルに流す電流を調整するものであり、例えば１～１０の１０段階で電流が調整可能に構成されている。本実施の形態では、調整ダイヤル１６３ｃの値が“１０”のときには永電磁石１６３が支持部１５ａを吸着する吸着力が第１吸着力（後に詳述）となり、調整ダイヤル１６３ｃの値が“２”又は“３”のとき（調整ダイヤル１６３ｃの値が“１０”のときの電流値の略２０％から略３０％）には永電磁石１６３が支持部１５ａを吸着する吸着力が第２吸着力（後に詳述）となる。電流値と磁束密度及び吸着力とは比例するため、調整ダイヤル１６３ｃを調整することで、永電磁石１６３の磁束密度及び吸着力が変化する。 The permanent magnet 163 has an adjustment dial 163c (see FIG. 13). The adjustment dial 163c adjusts the current flowing through the coil of the electromagnet 163b, and is configured to be able to adjust the current in, for example, 10 steps from 1 to 10. In the present embodiment, when the value of the adjustment dial 163c is "10", the attraction force of the permanent electromagnet 163 to attract the support portion 15a becomes the first attraction force (described in detail later), and the value of the adjustment dial 163c is "2". Alternatively, when the value is “3” (approximately 20% to approximately 30% of the current value when the value of the adjustment dial 163c is “10”), the attraction force by which the permanent magnet 163 attracts the support portion 15a is the second attraction force ( The details will be described later). Since the current value is proportional to the magnetic flux density and the attractive force, adjusting the adjustment dial 163c changes the magnetic flux density and the attractive force of the permanent magnet 163.
　支持部１５ａには、計測部１６４が設けられる。計測部１６４は、鉛直方向に略沿って設けられたスケール１６４ａ（図５参照）と、スケール１６４ａの値を読み取って位置情報を出力する検出ヘッド１６４ｂ（図５参照）とを有する。スケール１６４ａは、スケール４１ａ、４２ａと同様に、例えばレーザホログラムスケールである。検出ヘッド１６４ｂは、検出ヘッド４１ｂ、４２ｂと同様に、光（例えば、レーザ光）を照射し、スケール１６４ａで反射された光を取得し、これにより発生する信号に基づいて位置情報を得る。スケール１６４ａは、側板１５４と反対側の側板１５２に設けられる。 計 測 A measuring unit 164 is provided on the supporting unit 15a. The measurement unit 164 has a scale 164a (see FIG. 5) provided substantially along the vertical direction, and a detection head 164b (see FIG. 5) that reads the value of the scale 164a and outputs position information. The scale 164a is, for example, a laser hologram scale like the scales 41a and 42a. Like the detection heads 41b and 42b, the detection head 164b irradiates light (for example, laser light), acquires light reflected by the scale 164a, and obtains position information based on a signal generated thereby. The scale 164a is provided on the side plate 152 opposite to the side plate 154.
　また、側板１５２には、マスクＭまでの距離を測定する測定部６１（６１ａ、６１ｄ、６１ｇ）が設けられる。測定部６１ａ、６１ｄ、６１ｇは、例えば、センサから発光されたレーザ光に基づいて対象物（ここではマスクＭ）の高さを検知する変位センサである。測定部６１ａは光照射部３０ａに隣接して設けられ、測定部６１ｄは光照射部３０ｄに隣接して設けられ、測定部６１ｇは光照射部３０ｇに隣接して設けられる。 測定 Further, the side plate 152 is provided with a measuring unit 61 (61a, 61d, 61g) for measuring the distance to the mask M. The measurement units 61a, 61d, and 61g are, for example, displacement sensors that detect the height of an object (here, a mask M) based on laser light emitted from the sensors. The measurement section 61a is provided adjacent to the light irradiation section 30a, the measurement section 61d is provided adjacent to the light irradiation section 30d, and the measurement section 61g is provided adjacent to the light irradiation section 30g.
　図５は、図３の面Ｃで枠体１５を切断したときの概略を示す図である。柱１５ｃには、凸部１６１ｃが形成されている。凸部１６１ｃの＋ｘ側の面は摺動面１６１ｄであり、摩擦抵抗を減らす磨き加工であるキサゲ加工が施される。 FIG. 5 is a view schematically showing the frame 15 cut along the plane C in FIG. The pillar 15c has a convex portion 161c formed thereon. The surface on the + x side of the convex portion 161c is a sliding surface 161d, and is subjected to scraping, which is polishing to reduce frictional resistance.
　支持部１５ａの－ｘ側の面は摺動面１６１ｅである。摺動面１６１ｅは摺動面１６１ｄと対向する位置に設けられる。摺動面１６１ｅには、摺動面１６１ｄと同様にキサゲ加工が施される。摺動面１６１ｅと摺動面１６１ｄとの間には、摺動面１６１ｄ、１６１ｅの微小な凹凸に溜まった潤滑油により数μｍ程度の油膜を有する。本実施の形態では、潤滑油として、常温下で液体の粘度の低い鉱物油を使用する。 －The −x side surface of the support portion 15a is a sliding surface 161e. The sliding surface 161e is provided at a position facing the sliding surface 161d. The sliding surface 161e is subjected to scraping similarly to the sliding surface 161d. Between the sliding surface 161e and the sliding surface 161d, an oil film of about several μm is formed by lubricating oil accumulated on minute irregularities of the sliding surfaces 161d and 161e. In this embodiment, a mineral oil having a low viscosity at room temperature is used as the lubricating oil.
　柱１５ｃに設けられたピニオン１６１ｂを回転させることで、ラック１６１ａが固定された支持部１５ａが上下動する。移動機構１６１が支持部１５ａを上下動させるときに、摺動面１６１ｄと摺動面１６１ｅとの間に形成された油膜により、摺動面１６１ｄと摺動面１６１ｅとが滑らかに摺動する。 By rotating the pinion 161b provided on the column 15c, the support 15a to which the rack 161a is fixed moves up and down. When the moving mechanism 161 moves the support portion 15a up and down, the sliding surface 161d and the sliding surface 161e slide smoothly due to the oil film formed between the sliding surface 161d and the sliding surface 161e.
　ラック１６１ａは、ｙ方向に沿って見たときに、ラック１６１ａの歯が支持部１５ａのｘ方向における中心線ｃ上に位置する。言い換えれば、ラック１６１ａの歯は、支持部１５ａの重心を通り、かつｚ方向と略平行な線上に位置する。したがって、ピニオン１６１ｂが回転してラック１６１ａ（支持部１５ａ）を上下動させるときにモーメントを発生させない。 When the rack 161a is viewed along the y direction, the teeth of the rack 161a are located on the center line c of the support portion 15a in the x direction. In other words, the teeth of the rack 161a are located on a line that passes through the center of gravity of the support 15a and is substantially parallel to the z direction. Therefore, no moment is generated when the pinion 161b rotates to move the rack 161a (the support portion 15a) up and down.
　図３、４に示すように、ラック１６１ａ及びピニオン１６１ｂが設けられていない側の柱１５ｃにも、キサゲ加工が施された摺動面１６１ｄが形成される。そして、この摺動面と当接するように支持部１５ａにはキサゲ加工が施された摺動面１６１ｅ（図５参照）が形成される。 (3) As shown in FIGS. 3 and 4, a sliding surface 161d subjected to scraping is also formed on the column 15c on the side where the rack 161a and the pinion 161b are not provided. A sliding surface 161e (see FIG. 5) on which a scraping process has been performed is formed on the support portion 15a so as to be in contact with the sliding surface.
　支持部１５ａの端には、柱１５ｃに沿って弾性部材１６０が設けられている。図３、４では、－ｙ側の端に設けられた弾性部材１６０についてのみ表示し、＋ｙ側の端に設けられた弾性部材１６０については図示を省略している。図５に示すように、弾性部材１６０は、支持部１５ａの下側に設けられる。弾性部材１６０と支持部１５ａとの間には、位置決め部材１６２が設けられる。位置決め部材１６２の底面に形成された凹部１６２ａに弾性部材１６０が挿入されることで、弾性部材１６０のｘｙ方向の位置が決められ、支持部１５ａの上下動にともなって弾性部材１６０が伸縮可能となる。このように、支持部１５ａの両端に設けられた弾性部材１６０が支持部１５ａの重さを支える。支持部１５ａは略６６０ｋｇ～７００ｋｇであり、弾性部材１６０は略６００ｋｇの重さを支持可能である。 弾 性 An elastic member 160 is provided at an end of the support portion 15a along the column 15c. 3 and 4, only the elastic member 160 provided at the end on the −y side is shown, and illustration of the elastic member 160 provided at the end on the + y side is omitted. As shown in FIG. 5, the elastic member 160 is provided below the support portion 15a. A positioning member 162 is provided between the elastic member 160 and the support portion 15a. By inserting the elastic member 160 into the concave portion 162a formed on the bottom surface of the positioning member 162, the position of the elastic member 160 in the xy direction is determined, and the elastic member 160 can expand and contract with the vertical movement of the support portion 15a. Become. Thus, the elastic members 160 provided at both ends of the support 15a support the weight of the support 15a. The supporting portion 15a weighs approximately 660 kg to 700 kg, and the elastic member 160 can support a weight of approximately 600 kg.
　弾性部材１６０が支えきれない支持部１５ａの重量は、摺動面１６１ｄと摺動面１６１ｅとの間の摩擦力により支える。永電磁石１６３は、柱１５ｃに設けられており、電磁石１６３ｂ（図１３参照）のコイルに電流を流すことで支持部１５ａを吸着する。 重量 The weight of the supporting portion 15a that cannot be supported by the elastic member 160 is supported by the frictional force between the sliding surface 161d and the sliding surface 161e. The permanent electromagnet 163 is provided on the column 15c, and attracts the support portion 15a by passing a current through the coil of the electromagnet 163b (see FIG. 13).
　移動機構１６１が柱１５ｃに沿って支持部１５ａを上下動させないときには、永電磁石１６３が支持部１５ａを第１吸着力で吸着することで、支持部１５ａ、すなわちラック１６１ａ及び摺動面１６１ｅが図５左方向（図５の矢印参照）に移動し、摺動面１６１ｄと摺動面１６１ｅとが密着する。第１吸着力は略１２０００Ｎであり、永電磁石１６３が支持部１５ａを第１吸着力で吸着するときの永電磁石１６３の磁束密度は略０．３Ｔ（テスラ）である。また、永電磁石１６３が支持部１５ａを第１吸着力で吸着するときの摺動面１６１ｄと摺動面１６１ｅとの間に生じる面圧は、略０．８ＭＰａである。 When the moving mechanism 161 does not move the support portion 15a up and down along the column 15c, the support portion 15a, that is, the rack 161a and the sliding surface 161e are drawn by the permanent magnet 163 attracting the support portion 15a with the first suction force. 5 and move to the left (see the arrow in FIG. 5), and the sliding surface 161d and the sliding surface 161e come into close contact with each other. The first attractive force is approximately 12000 N, and the magnetic flux density of the permanent electromagnet 163 when the permanent electromagnet 163 attracts the support 15 a with the first attractive force is approximately 0.3 T (tesla). The surface pressure generated between the sliding surface 161d and the sliding surface 161e when the permanent electromagnet 163 attracts the support portion 15a with the first attractive force is approximately 0.8 MPa.
　このように摺動面１６１ｄと摺動面１６１ｅとの間に生じる面圧を高くし、摺動面１６１ｄと摺動面１６１ｅとを密着（強く圧縮）することで、摺動面１６１ｄと摺動面１６１ｅとの間に形成された油膜を排除する。その結果、摺動面１６１ｄと摺動面１６１ｅとの間に摩擦が発生する。 As described above, the surface pressure generated between the sliding surface 161d and the sliding surface 161e is increased, and the sliding surface 161d and the sliding surface 161e are brought into close contact with each other (compressed strongly). The oil film formed between the surface 161e and the surface 161e is eliminated. As a result, friction occurs between the sliding surface 161d and the sliding surface 161e.
　油膜が排除されたときの摺動面１６１ｄと摺動面１６１ｅとの摩擦係数が０．１～０．２であり、永電磁石１６３の吸着力が１５００ｋｇだとすると、摺動面１６１ｄと摺動面１６１ｅとの間の摩擦により１５０ｋｇの重さを支える。摺動面は支持部１５ａの両側に２箇所存在するため、弾性部材１６０が支えきれない支持部１５ａの重さｔａ（略６０ｋｇ～１００ｋｇ）は摩擦力により支持可能である。このように、移動機構１６１が支持部１５ａを上下動させないときには、支持部１５ａの高さ方向（ｚ方向）の位置が変わらないように、支持部１５ａが支えられる。 Assuming that the friction coefficient between the sliding surface 161d and the sliding surface 161e when the oil film is removed is 0.1 to 0.2 and the attraction force of the permanent magnet 163 is 1500 kg, the sliding surface 161d and the sliding surface 161e It supports a weight of 150 kg by the friction between it and. Since there are two sliding surfaces on both sides of the support portion 15a, the weight ta (approximately 60 to 100 kg) of the support portion 15a that cannot be supported by the elastic member 160 can be supported by frictional force. As described above, when the moving mechanism 161 does not move the support 15a up and down, the support 15a is supported so that the position of the support 15a in the height direction (z direction) does not change.
　移動機構１６１が柱１５ｃに沿って支持部１５ａを上下動させるときには、永電磁石１６３が支持部１５ａを弱い力（第２吸着力）で吸着する。支持部１５ａを上下動させるときの吸着力（第２吸着力）は、支持部１５ａを上下動させないときの吸着力（第１吸着力）より弱い。本実施の形態では、第２吸着力が第１吸着力の略２０％から略３０％である。第２吸着力は略２４００～略３６００Ｎであり、永電磁石１６３が支持部１５ａを第１吸着力で吸着するときの永電磁石１６３の磁束密度は略０．０６～略０．０９Ｔである。また、永電磁石１６３が支持部１５ａを第２吸着力で吸着するときの摺動面１６１ｄと摺動面１６１ｅとの間に生じる面圧は、略０．１６～略０．２４ＭＰａである。 (4) When the moving mechanism 161 moves the support portion 15a up and down along the column 15c, the permanent magnet 163 attracts the support portion 15a with a weak force (second attraction force). The attraction force (second attraction force) when the support portion 15a is moved up and down is weaker than the attraction force (first attraction force) when the support portion 15a is not moved up and down. In the present embodiment, the second suction force is approximately 20% to approximately 30% of the first suction force. The second attractive force is approximately 2400 to approximately 3600 N, and the magnetic flux density of the permanent electromagnet 163 when the permanent electromagnet 163 attracts the support 15 a with the first attractive force is approximately 0.06 to approximately 0.09 T. The surface pressure generated between the sliding surface 161d and the sliding surface 161e when the permanent magnet 163 attracts the support portion 15a with the second attraction force is approximately 0.16 to approximately 0.24 MPa.
　永電磁石１６３が支持部１５ａを第２吸着力で吸着することにより、摺動面１６１ｄと摺動面１６１ｅとが当接する。このとき摺動面１６１ｄと摺動面１６１ｅとは密着しておらず、摺動面１６１ｄと摺動面１６１ｅとの間に形成された油膜は排除されない。 (4) The sliding surface 161d and the sliding surface 161e come into contact with each other by the permanent electromagnet 163 attracting the support portion 15a with the second attractive force. At this time, the sliding surface 161d and the sliding surface 161e are not in close contact with each other, and the oil film formed between the sliding surface 161d and the sliding surface 161e is not excluded.
　摺動面１６１ｄと摺動面１６１ｅとが当接しているため、支持部１５ａが上下動するときに柱１５ｃに対して支持部１５ａが傾かない。配置位置の制約上、永電磁石１６３と計測部１６４とは移動機構１６１を挟んで反対側に配置されるが、本実施の形態では支持部１５ａが傾かないため、計測部１６４が永電磁石１６３から離れた位置にあったとしても、計測部１６４の計測結果が安定し、支持部１５ａを正確に上下動させることができる。 た め Since the sliding surface 161d is in contact with the sliding surface 161e, the supporting portion 15a does not tilt with respect to the column 15c when the supporting portion 15a moves up and down. Due to restrictions on the arrangement position, the permanent magnet 163 and the measuring unit 164 are arranged on the opposite side with the moving mechanism 161 interposed therebetween. However, in the present embodiment, since the supporting unit 15a does not tilt, the measuring unit 164 is moved from the permanent magnet 163. Even if it is at a distant position, the measurement result of the measurement unit 164 is stable, and the support unit 15a can be moved up and down accurately.
　ここで、第２吸着力が第１吸着力の略２０％から略３０％であることが望ましい理由について説明する。表１、２は、永電磁石１６３の着磁力を変えたときの回転駆動部１６１ｆ（ここでは、モータ）のトルクを示す表である。表１、２は、異なるモータを用いて実験を行った結果を示すものである。表１、２は、回転駆動部１６１ｆを駆動してピニオン１６１ｂを回転させることで支持部１５ａを高さ方向に移動させ、そのときの回転駆動部１６１ｆのトルクを測定して得られたものであり、各セルの値はトルク（Ｎ・ｍ）である。 Here, the reason why it is desirable that the second suction force is approximately 20% to approximately 30% of the first suction force will be described. Tables 1 and 2 are tables showing the torque of the rotation drive unit 161f (here, a motor) when the magnetizing force of the permanent magnet 163 is changed. Tables 1 and 2 show the results of experiments using different motors. Tables 1 and 2 are obtained by driving the rotation driving unit 161f to rotate the pinion 161b to move the support unit 15a in the height direction, and measuring the torque of the rotation driving unit 161f at that time. The value of each cell is torque (N · m).
　吸着力は、永電磁石１６３の磁束密度、すなわち永電磁石１６３に加える電圧に比例する。表１、２における吸着力は、永電磁石１６３に加える電圧と、永電磁石１６３の磁束密度が最大となるときに永電磁石１６３に加えられた電圧と、の比に基づいて求められる。なお、吸着力０％は、脱磁状態を示す。
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
 The attraction force is proportional to the magnetic flux density of the permanent magnet 163, that is, the voltage applied to the permanent magnet 163. The attraction force in Tables 1 and 2 is determined based on the ratio between the voltage applied to the permanent magnet 163 and the voltage applied to the permanent magnet 163 when the magnetic flux density of the permanent magnet 163 is maximized. It should be noted that the adsorption force of 0% indicates a demagnetized state.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
　表1、２に示すように、吸着力が１８．５％及び２４％のときの回転駆動部１６１ｆのトルクは、脱磁状態のときの回転駆動部１６１ｆのトルクとほとんど変わらない。つまり、第２吸着力が第１吸着力の略２４％以下であれば、摺動面１６１ｄと摺動面１６１ｅとの間に形成された油膜は排除されず、摺動面１６１ｄと摺動面１６１ｅとの間に摩擦が発生しない。 ト ル ク As shown in Tables 1 and 2, the torque of the rotary drive unit 161f when the attraction force is 18.5% and 24% is almost the same as the torque of the rotary drive unit 161f in the demagnetized state. That is, if the second suction force is approximately 24% or less of the first suction force, the oil film formed between the sliding surface 161d and the sliding surface 161e is not eliminated, and the sliding surface 161d and the sliding surface are not removed. No friction occurs with the 161e.
　それに対して、吸着力が３９％のときの回転駆動部１６１ｆのトルクは、脱磁状態のときの回転駆動部１６１ｆのトルクの倍程度であり、脱磁状態のときの回転駆動部１６１ｆのトルクに対して大きく異なっている。これにより、吸着力が３９％のときは、摺動面１６１ｄと摺動面１６１ｅとの間に形成された油膜が排除され、摺動面１６１ｄと摺動面１６１ｅとの間に摩擦が発生していることが分かる。 On the other hand, the torque of the rotary drive 161f when the attraction force is 39% is about twice the torque of the rotary drive 161f in the demagnetized state, and the torque of the rotary drive 161f in the demagnetized state. Is very different. Thus, when the suction force is 39%, the oil film formed between the sliding surface 161d and the sliding surface 161e is eliminated, and friction occurs between the sliding surface 161d and the sliding surface 161e. You can see that.
　以上より、摺動面１６１ｄと摺動面１６１ｅとの間に摩擦が発生しないという観点からは、第２吸着力を第１吸着力の略３９％とするのは適切でなく、第２吸着力を第１吸着力の略３０％以下とすることが望ましい。 From the above, it is not appropriate to set the second attraction force to approximately 39% of the first attraction force from the viewpoint that no friction occurs between the sliding surface 161d and the sliding surface 161e. Is desirably about 30% or less of the first suction force.
　ただし、第２吸着力が第１吸着力の略２０％より小さい場合には、支持部１５ａを第２吸着力で吸着した状態から支持部１５ａを第１吸着力で吸着した状態へと変化させたときに計測部１６４での計測結果が変化してしまう。これにより、第２吸着力が第１吸着力の略２０％より小さい場合には、摺動面１６１ｄと摺動面１６１ｅとが当接しておらず、支持部１５ａが上下動するときに柱１５ｃに対して支持部１５ａが傾いてしまっていることが分かる。以上より、第２吸着力を第１吸着力の略２０％から略３０％とすることが望ましい。 However, when the second suction force is smaller than approximately 20% of the first suction force, the state is changed from the state in which the support portion 15a is sucked by the second suction force to the state in which the support portion 15a is sucked by the first suction force. The measurement result in the measurement unit 164 changes. Accordingly, when the second attraction force is smaller than approximately 20% of the first attraction force, the sliding surface 161d and the sliding surface 161e are not in contact with each other, and when the support portion 15a moves up and down, the column 15c is moved. It can be seen that the support portion 15a is inclined with respect to. From the above, it is desirable that the second attraction force be approximately 20% to approximately 30% of the first attraction force.
　次に、光照射部３０について説明する。図６は、光照射部３０ａの概略を示す要部透視図である。光照射部３０ａは、主として、ＤＭＤ３１ａと、対物レンズ３２ａと、光源部３３ａと、ＡＦ処理部３４ａと、筒状部３５ａと、フランジ３６ａと、取付部３７ａ、３８ａと、駆動部３９ａとを有する。光照射部３０ｂ～光照射部３０ｇは、それぞれＤＭＤ３１ｂ～３１ｇと、対物レンズ３２ｂ～３２ｇと、光源部３３ｂ～３３ｇと、ＡＦ処理部３４ｂ～３４ｇと、筒状部３５ｂ～３５ｇと、フランジ３６ｂ～３６ｇと、取付部３７ｂ～３７ｇ、３８ｂ～３８ｇと、駆動部３９ｂ～３９ｇとを有する。光照射部３０ｂ～光照射部３０ｇは、光照射部３０ａと同一の構成であるため説明を省略する。 Next, the light irradiation unit 30 will be described. FIG. 6 is a perspective view of a main part schematically showing the light irradiation unit 30a. The light irradiation section 30a mainly includes a DMD 31a, an objective lens 32a, a light source section 33a, an AF processing section 34a, a cylindrical section 35a, a flange 36a, mounting sections 37a and 38a, and a driving section 39a. . The light irradiating units 30b to 30g include DMDs 31b to 31g, objective lenses 32b to 32g, light source units 33b to 33g, AF processing units 34b to 34g, cylindrical units 35b to 35g, and flanges 36b to 30g, respectively. 36g, mounting portions 37b to 37g, 38b to 38g, and driving portions 39b to 39g. The light irradiating units 30b to 30g have the same configuration as the light irradiating unit 30a, and thus description thereof is omitted.
　ＤＭＤ３１ａは、デジタルミラーデバイス（Ｄｉｇｉｔａｌ　Ｍｉｒｒｏｒ　Ｄｅｖｉｃｅ、ＤＭＤ）であり、面状のレーザ光が照射可能である。ＤＭＤ３１ａは、多数の可動式のマイクロミラー（図示省略）を有し、１枚のマイクロミラーから１画素分の光が照射される。マイクロミラーは、大きさが略１０μｍであり、２次元状に配置されている。ＤＭＤ３１ａには光源部３３ａ（後に詳述）から光が照射され、光は各マイクロミラーで反射される。マイクロミラーは、その対角線と略平行な軸を中心に回転可能であり、ＯＮ（マスクＭに向けて光を反射させる）とＯＦＦ（マスクＭに向けて光を反射させない）との切り替えが可能である。ＤＭＤ３１ａはすでに公知であるため、詳細な説明を省略する。 The DMD 31a is a digital mirror device (Digital Mirror Device, DMD), and can emit a planar laser beam. The DMD 31a has a number of movable micromirrors (not shown), and one micromirror irradiates light of one pixel. The micromirrors are approximately 10 μm in size and are arranged two-dimensionally. The DMD 31a is irradiated with light from a light source unit 33a (described in detail later), and the light is reflected by each micro mirror. The micromirror is rotatable about an axis substantially parallel to its diagonal, and can be switched between ON (reflects light toward the mask M) and OFF (does not reflect light toward the mask M). is there. Since the DMD 31a is already known, a detailed description will be omitted.
　対物レンズ３２ａは、ＤＭＤ３１ａの各マイクロミラーで反射されたレーザ光をマスクＭの表面に結像させる。描画時には、光照射部３０ａ～光照射部３０ｇのそれぞれから光が照射され、この光がマスクＭ上で結像することにより、マスクＭにパターンが描画される。 The objective lens 32a forms an image of the laser beam reflected by each micro mirror of the DMD 31a on the surface of the mask M. At the time of drawing, light is irradiated from each of the light irradiation units 30a to 30g, and the light forms an image on the mask M, whereby a pattern is drawn on the mask M.
　光源部３３ａは、主として、光源３３１と、レンズ３３２と、フライアイレンズ３３３と、レンズ３３４、３３５と、ミラー３３６とを有する。光源３３１は、例えばレーザダイオードであり、光源３３１から出射された光は、光ファイバ等を介してレンズ３３２に導かれる。 The light source unit 33a mainly includes a light source 331, a lens 332, a fly-eye lens 333, lenses 334 and 335, and a mirror 336. The light source 331 is, for example, a laser diode, and light emitted from the light source 331 is guided to the lens 332 via an optical fiber or the like.
　光は、レンズ３３２からフライアイレンズ３３３に導かれる。フライアイレンズ３３３は複数枚のレンズ（図示せず）を２次元状に配置したものであり、フライアイレンズ３３３において多数の点光源が作られる。フライアイレンズ３３３を通過した光は、レンズ３３４、３３５（例えば、コンデンサレンズ）を通って平行光となり、ミラー３３６でＤＭＤ３１ａに向けて反射される。 The light is guided from the lens 332 to the fly-eye lens 333. The fly-eye lens 333 is a two-dimensional arrangement of a plurality of lenses (not shown), and the fly-eye lens 333 forms a large number of point light sources. The light that has passed through the fly-eye lens 333 becomes parallel light through lenses 334 and 335 (for example, condenser lenses), and is reflected by the mirror 336 toward the DMD 31a.
　ＡＦ処理部３４ａは、マスクＭへ照射される光の焦点をマスクＭに合わせるものであり、主として、ＡＦ用光源３４１と、コリメータレンズ３４２と、ＡＦ用シリンドリカルレンズ３４３、ペンタプリズム３４４、３４５と、レンズ３４６と、ＡＦセンサ３４７、３４８とを有する。ＡＦ用光源３４１から照射された光は、コリメータレンズ３４２で平行光となり、ＡＦ用シリンドリカルレンズ３４３で線状の光となり、ペンタプリズム３４４で反射されてマスクＭの表面に結像する。マスクＭで反射した光は、ペンタプリズム３４５で反射され、レンズ３４６で集光されて、ＡＦセンサ３４７、３４８に入射する。ペンタプリズム３４４、３４５は、略９７度の曲げ角度で光を曲げる。なお、ペンタプリズム３４４、３４５の代わりにミラーを用いてもよいが、ミラーの角度ズレにより焦点ボケを起こすため、ペンタプリズムを用いることが望ましい。ＡＦ処理部３４ａは、ＡＦセンサ３４７、３４８で受光された結果に基づいて合焦位置を求めるオートフォーカス処理を行う。なお、このような光テコ式によるオートフォーカス処理はすでに公知であるため、詳細な説明を省略する。 The AF processing unit 34a focuses light irradiated on the mask M to the mask M, and mainly includes an AF light source 341, a collimator lens 342, an AF cylindrical lens 343, pentaprisms 344 and 345, It has a lens 346 and AF sensors 347 and 348. The light emitted from the AF light source 341 becomes parallel light by the collimator lens 342, becomes linear light by the AF cylindrical lens 343, is reflected by the pentaprism 344, and forms an image on the surface of the mask M. The light reflected by the mask M is reflected by the pentaprism 345, collected by the lens 346, and made incident on the AF sensors 347 and 348. The pentaprisms 344 and 345 bend light at a bending angle of about 97 degrees. Note that a mirror may be used instead of the pentaprisms 344 and 345, but it is preferable to use a pentaprism because defocusing occurs due to a misalignment of the mirror. The AF processing unit 34a performs an autofocus process for obtaining a focus position based on the results received by the AF sensors 347 and 348. It should be noted that such an auto-focusing process using an optical lever is already known, and a detailed description thereof will be omitted.
　光照射部３０ａは、内部に光学系（対物レンズ３２ａを含む）が設けられた略円筒形状の筒状部３５ａを有する。筒状部３５ａの上側の端には、フランジ３６ａが設けられる。フランジ３６ａは、上側にレンズ３３２、フライアイレンズ３３３及びレンズ３３４、３３５を保持する。そのため、光照射部３０ａの重心は、光軸ａｘよりも図６における左方向にずれる。 The light irradiation unit 30a has a substantially cylindrical tubular portion 35a in which an optical system (including the objective lens 32a) is provided. A flange 36a is provided at an upper end of the cylindrical portion 35a. The flange 36a holds the lens 332, the fly-eye lens 333, and the lenses 334, 335 on the upper side. Therefore, the center of gravity of the light irradiation unit 30a is shifted leftward in FIG. 6 from the optical axis ax.
　また、筒状部３５ａには、取付部３７ａ、３８ａが設けられる。取付部３７ａ、３８ａは、枠体１５への取り付けに用いられる。取付部３７ａは、フランジ３６ａの近傍に設けられ、取付部３８ａは、筒状部３５ａの下端近傍に設けられる。取付部３７ａには、取付部３８ａの外径より大きい直径を有する中空部３７２が形成される。これにより、筒状部３５ａが上方に引き抜き可能となる。なお図６では、取付部３７ａ、３８ａに形成されたねじ孔３７１、３８１（後に詳述）の図示を省略している。 取 付 Mounting portions 37a and 38a are provided on the cylindrical portion 35a. The attachment portions 37a and 38a are used for attachment to the frame body 15. The mounting portion 37a is provided near the flange 36a, and the mounting portion 38a is provided near the lower end of the tubular portion 35a. A hollow portion 372 having a diameter larger than the outer diameter of the mounting portion 38a is formed in the mounting portion 37a. Thereby, the cylindrical portion 35a can be pulled out upward. In FIG. 6, screw holes 371 and 381 (described later in detail) formed in the mounting portions 37a and 38a are omitted.
　取付部３７ａ（すなわち、光照射部３０ａ）は、駆動部３９ａにより鉛直方向（ｚ方向）に移動される。図７は、駆動部３９ａの概略を示す側面図である。駆動部３９ａは、主として、圧電素子３９１と、連結部３９２とを有する。 The mounting part 37a (that is, the light irradiation part 30a) is moved in the vertical direction (z direction) by the driving part 39a. FIG. 7 is a side view schematically showing the driving section 39a. The driving section 39a mainly includes a piezoelectric element 391 and a connecting section 392.
　圧電素子３９１は、電圧を印加することで変位が生じる固体アクチュエータ（ピエゾ素子）である。圧電素子３９１は、変位しない部分（たとえば、下端）が取付部３９５を介して枠体１５の支持部１５ａに設けられる（図１１参照）。圧電素子３９１に電圧を印加すると、圧電素子３９１が伸び、圧電素子３９１の上側の端が上方向に移動する。図７の点線は圧電素子３９１が縮んだ状態を示し、図７の実線は圧電素子３９１が延びた状態を示す。 The piezoelectric element 391 is a solid actuator (piezo element) that is displaced by applying a voltage. A portion of the piezoelectric element 391 that is not displaced (for example, the lower end) is provided on the support portion 15a of the frame 15 via the attachment portion 395 (see FIG. 11). When a voltage is applied to the piezoelectric element 391, the piezoelectric element 391 expands, and the upper end of the piezoelectric element 391 moves upward. The dotted line in FIG. 7 shows a state where the piezoelectric element 391 is contracted, and the solid line in FIG. 7 shows a state where the piezoelectric element 391 is extended.
　連結部３９２は、下端が圧電素子３９１に螺合された略円柱形状の部材である。連結部３９２は、圧電素子３９１の伸び縮みに伴って上下動する。 The connecting portion 392 is a substantially columnar member whose lower end is screwed to the piezoelectric element 391. The connecting portion 392 moves up and down as the piezoelectric element 391 expands and contracts.
　連結部３９２の上端には、先端が円弧形状の凸部３９３が設けられる。凸部３９３の先端は、取付部３７ａ（図６参照）の下側に当接する。したがって、圧電素子３９１が伸びると光照射部３０ａが＋ｚ方向に移動し、圧電素子３９１が縮むと光照射部３０ａが－ｚ方向に移動する。 凸 At the upper end of the connecting portion 392, a convex portion 393 having an arc-shaped tip is provided. The tip of the convex portion 393 contacts the lower side of the mounting portion 37a (see FIG. 6). Therefore, when the piezoelectric element 391 expands, the light irradiation unit 30a moves in the + z direction, and when the piezoelectric element 391 contracts, the light irradiation unit 30a moves in the -z direction.
　連結部３９２の側面には、複数の溝３９４が形成されている。溝３９４は、中心軸に近づくにつれて斜め下方向に切り込むように形成されている。したがって、圧電素子３９１が曲がって伸びた（図７二点鎖線参照）としても、連結部３９２が溝３９４の部分で変形し、凸部３９３を水平方向に移動させず鉛直方向にだけ移動させることができる。 複数 A plurality of grooves 394 are formed on the side surface of the connecting portion 392. The groove 394 is formed so as to cut obliquely downward as it approaches the central axis. Therefore, even if the piezoelectric element 391 is bent and expanded (see the two-dot chain line in FIG. 7), the connecting portion 392 is deformed at the groove 394, and the convex portion 393 is moved only in the vertical direction without moving in the horizontal direction. Can be.
　次に、光照射部３０ａ～３０ｇを枠体１５に取り付ける取付構造について説明する。本実施の形態の取付構造では、底板１５１にガイド部材７０を取り付け、支持板１５３にガイド部材７０Ａを取り付け、ガイド部材７０、７０Ａに光照射部３０ａ～３０ｇを取り付けることで、光照射部３０ａ～３０ｇを枠体１５に取り付ける。つまり、ガイド部材７０、７０Ａは、光照射部３０ａと枠体１５（ここでは、支持板１５３）との間に設けられる。 Next, an attachment structure for attaching the light irradiation units 30a to 30g to the frame 15 will be described. In the mounting structure of the present embodiment, the guide members 70 are attached to the bottom plate 151, the guide members 70A are attached to the support plates 153, and the light irradiation units 30a to 30g are attached to the guide members 70, 70A. 30 g is attached to the frame 15. That is, the guide members 70 and 70A are provided between the light irradiation unit 30a and the frame 15 (here, the support plate 153).
　まず、ガイド部材７０、７０Ａについて説明する。ガイド部材７０、７０Ａは、支持部１５ａ（底板１５１、支持板１５３）と光照射部３０との間に設けられる略薄板状の部材である。 First, the guide members 70 and 70A will be described. The guide members 70 and 70A are substantially thin plate-shaped members provided between the support 15a (the bottom plate 151 and the support plate 153) and the light irradiation unit 30.
　図８（Ａ）は、ガイド部材７０の概略を示す図であり、図８（Ｂ）は、ガイド部材７０Ａの概略を示す図である。ガイド部材７０とガイド部材７０Ａとは直径が異なる。 FIG. 8A is a diagram schematically illustrating the guide member 70, and FIG. 8B is a diagram schematically illustrating the guide member 70A. The guide member 70 and the guide member 70A have different diameters.
　ガイド部材７０、７０Ａは、略薄板状であり、平面視略円板形状である。ガイド部材７０、７０Ａは、厚さが略０．５～１ｍｍ程度の金属で形成される。本実施の形態では、ガイド部材７０は略０．５ｍｍであり、ガイド部材７０Ａは略１ｍｍである。金属としては、ステンレス鋼、リン青銅等を用いることができるが、より均質なリン青銅を用いることが望ましい。なお、本発明における略０．５～１ｍｍ程度とは、略０．５～１ｍｍに対して略０．５ｍｍ以下の誤差を含むものである。 The guide members 70 and 70A have a substantially thin plate shape and a substantially disc shape in plan view. The guide members 70 and 70A are formed of a metal having a thickness of about 0.5 to 1 mm. In the present embodiment, the guide member 70 is approximately 0.5 mm, and the guide member 70A is approximately 1 mm. As the metal, stainless steel, phosphor bronze, or the like can be used, and it is preferable to use more homogeneous phosphor bronze. In the present invention, approximately 0.5 to 1 mm includes an error of approximately 0.5 mm or less with respect to approximately 0.5 to 1 mm.
　ガイド部材７０、７０Ａには、略中央に取付孔７４、７４Ａが形成される。また、ガイド部材７０、７０Ａには、孔７７が外周に沿って複数形成され、取付孔７４、７４Ａに沿って孔７８が複数形成される。 取 付 Attachment holes 74, 74A are formed substantially at the center of the guide members 70, 70A. A plurality of holes 77 are formed along the outer circumference of the guide members 70 and 70A, and a plurality of holes 78 are formed along the mounting holes 74 and 74A.
　ガイド部材７０には、ガイド部材７０が変形しやすいように、略円弧形状の切抜き孔７９Ａ、７９Ｂがそれぞれ複数形成される。切抜き孔７９Ａ、７９Ｂは、それぞれ、周方向に沿って等間隔に配置される。切抜き孔７９Ａの半径は切抜き孔７９Ｂの半径より小さく、切抜き孔７９Ｂは切抜き孔７９Ａの外側に配置される。また、切抜き孔７９Ａの端を含む端部領域７９Ａａと、切抜き孔７９Ｂの端を含む端部領域７９Ｂａとは、周方向の位置が略一致する。なお、端部領域７９Ａａ、７９Ｂａは、それぞれ切抜き孔７９Ａ、７９Ｂの両端に存在する。 A plurality of cutout holes 79A and 79B each having a substantially arc shape are formed in the guide member 70 so that the guide member 70 is easily deformed. The cutout holes 79A and 79B are respectively arranged at equal intervals along the circumferential direction. The radius of the cutout hole 79A is smaller than the radius of the cutout hole 79B, and the cutout hole 79B is arranged outside the cutout hole 79A. Further, the end region 79Aa including the end of the cutout hole 79A and the end region 79Ba including the end of the cutout hole 79B have substantially the same circumferential position. The end regions 79Aa and 79Ba exist at both ends of the cutout holes 79A and 79B, respectively.
　ガイド部材７０Ａには、ガイド部材７０Ａが変形しやすいように、略円弧形状の切抜き孔７９Ｃ、７９Ｄがそれぞれ複数形成される。切抜き孔７９Ｃ、７９Ｄは、それぞれ、周方向に沿って等間隔に配置される。切抜き孔７９Ｃの半径は切抜き孔７９Ｄの半径より小さく、切抜き孔７９Ｄは切抜き孔７９Ｃの外側に配置される。また、切抜き孔７９Ｃの端を含む端部領域７９Ｃａと、切抜き孔７９Ｄの端を含む端部領域７９Ｄａとは、周方向の位置が略一致する。なお、端部領域７９Ｃａ、７９Ｄａは、それぞれ切抜き孔７９Ｃ、７９Ｄの両端に存在する。 A plurality of substantially arc-shaped cutout holes 79C and 79D are formed in the guide member 70A so that the guide member 70A is easily deformed. The cutout holes 79C and 79D are respectively arranged at equal intervals along the circumferential direction. The radius of the cutout hole 79C is smaller than the radius of the cutout hole 79D, and the cutout hole 79D is arranged outside the cutout hole 79C. Further, the end region 79Ca including the end of the cutout hole 79C and the end region 79Da including the end of the cutout hole 79D substantially coincide with each other in the circumferential direction. The end regions 79Ca and 79Da are located at both ends of the cutout holes 79C and 79D, respectively.
　本実施の形態では、切抜き孔７９Ａ、７９Ｂ、７９Ｃ、７９Ｄは各４個であるが、切抜き孔７９Ａ、７９Ｂ、７９Ｃ、７９Ｄの位置及び数はこれに限られない。 In the present embodiment, the number of the cutout holes 79A, 79B, 79C, and 79D is four, but the positions and the number of the cutout holes 79A, 79B, 79C, and 79D are not limited to this.
　端部領域７９Ａａと端部領域７９Ｂａとの周方向の位置が略一致し、この重なる位置は周方向に均等（例えば略４５度毎）に配置される。また、端部領域７９Ｃａと端部領域７９Ｄａとの周方向の位置が略一致し、この重なる位置は周方向に均等（例えば略４５度毎）に配置される。したがって、ガイド部材７０、７０Ａの中心点から径方向に放射状に伸びる線を引くと、その線は必ず切抜き孔７９Ａ～７９Ｄの少なくとも１つを通過する。そのため、ガイド部材７０、７０Ａの変形量は、周方向の場所によらず略一定である。また、このように切抜き孔７９Ａ～７９Ｄを配置することで、厚さが１ｍｍ程度の厚めの薄板をガイド部材７０、７０Ａに用いても、略３０μｍの筒状部３５ａの上下動に合わせてガイド部材７０、７０Ａが伸び縮みする。 周 Circumferential positions of the end region 79Aa and the end region 79Ba substantially coincide with each other, and the overlapping positions are arranged uniformly (for example, approximately every 45 degrees) in the circumferential direction. The circumferential positions of the end region 79Ca and the end region 79Da substantially coincide with each other, and the overlapping positions are arranged evenly in the circumferential direction (for example, approximately every 45 degrees). Therefore, when a line extending radially from the center point of the guide members 70, 70A is drawn, the line always passes through at least one of the cutout holes 79A to 79D. Therefore, the amount of deformation of the guide members 70, 70A is substantially constant irrespective of the location in the circumferential direction. Also, by arranging the cutout holes 79A to 79D in this way, even if a thin plate having a thickness of about 1 mm is used for the guide members 70, 70A, the guide can be adjusted in accordance with the vertical movement of the cylindrical portion 35a of approximately 30 μm. The members 70 and 70A expand and contract.
　図９（Ａ）は底板１５１にガイド部材７０を取り付けたときの底板１５１とガイド部材７０との位置関係を示し、図９（Ｂ）は支持板１５３にガイド部材７０Ａを取り付けたときの支持板１５３とガイド部材７０Ａとの位置関係を示す。 9A shows a positional relationship between the bottom plate 151 and the guide member 70 when the guide member 70 is attached to the bottom plate 151, and FIG. 9B shows a support plate when the guide member 70A is attached to the support plate 153. 15 shows a positional relationship between the motor 153 and the guide member 70A.
　ガイド部材７０は、丸孔１５５ａ～１５５ｇを覆うように、底板１５１に７個設けられる。ガイド部材７０Ａは、丸孔１５６ａ～１５６ｇを覆うように、支持板１５３に７個設けられる。取付孔７４、７４Ａは、丸孔１５５ａ～１５５ｇ、１５６ａ～１５６ｇと略同心円状に配置される。 Seven guide members 70 are provided on the bottom plate 151 so as to cover the round holes 155a to 155g. Seven guide members 70A are provided on the support plate 153 so as to cover the round holes 156a to 156g. The mounting holes 74 and 74A are arranged substantially concentrically with the round holes 155a to 155g and 156a to 156g.
　ガイド部材７０及び丸孔１５５ａ～１５５ｇは、底板１５１の中央部分に均等に配置され、ガイド部材７０Ａ及び丸孔１５６ａ～１５６ｇは、支持板１５３の中央部分に均等に配置される。隣接する丸孔１５５ａ～１５５ｇ（すなわちガイド部材７０）の間隔及び隣接する丸孔１５６ａ～１５６ｇ（すなわちガイド部材７０Ａ）の間隔Ｗ２は、光照射部３０ａ～３０ｇの間隔と略同一である。 The guide member 70 and the round holes 155a to 155g are evenly arranged in the center of the bottom plate 151, and the guide member 70A and the round holes 156a to 156g are evenly arranged in the center of the support plate 153. The interval between the adjacent round holes 155a to 155g (ie, the guide member 70) and the interval W2 between the adjacent round holes 156a to 156g (ie, the guide member 70A) are substantially the same as the interval between the light irradiation units 30a to 30g.
　丸孔１５５ａ、１５６ａに設けられたガイド部材７０、７０Ａには、光照射部３０ａの筒状部３５が設けられる。丸孔１５５ｂ、１５６ｂに設けられたガイド部材７０、７０Ａには、光、光照射部３０ｂが設けられる。同様に、丸孔１５５ｃ～１５５ｇ、１５６ｃ～１５６ｇに設けられたガイド部材７０、７０Ａには、それぞれ光照射部３０ｃ～３０ｇが設けられる。 筒 The cylindrical members 35 of the light irradiation unit 30a are provided on the guide members 70 and 70A provided in the round holes 155a and 156a. The guide members 70 and 70A provided in the round holes 155b and 156b are provided with light and a light irradiation unit 30b. Similarly, light irradiation sections 30c to 30g are provided in the guide members 70 and 70A provided in the round holes 155c to 155g and 156c to 156g, respectively.
　丸孔１５５ａと丸孔１５６ａとは、平面視における位置が重なるように形成される。同様に、丸孔１５５ｂ～１５５ｇと丸孔１５６ｂ～１５６ｇとは、それぞれ平面視における位置が重なるように形成される。 The round hole 155a and the round hole 156a are formed such that their positions in plan view overlap. Similarly, the round holes 155b to 155g and the round holes 156b to 156g are formed such that their positions in plan view overlap.
　次に、光照射部３０ａの取り付けについて説明する。図１０は、光照射部３０ａを支持板１５３に取り付ける取付構造の分解斜視図である。なお、光照射部３０ｂ～３０ｇを底板１５１に取り付ける取付構造及び光、光照射部３０ｂ～３０ｇを支持板１５３に取り付ける取付構造は、光照射部３０ａを底板１５１に取り付ける取付構造と同一であるため、説明を省略する。 Next, attachment of the light irradiation unit 30a will be described. FIG. 10 is an exploded perspective view of an attachment structure for attaching the light irradiation unit 30a to the support plate 153. The mounting structure for mounting the light irradiation units 30b to 30g to the bottom plate 151 and the mounting structure for mounting the light irradiation units 30b to 30g to the support plate 153 are the same as the mounting structure for mounting the light irradiation unit 30a to the bottom plate 151. The description is omitted.
　ガイド部材７０Ａは、丸孔１５６ａを覆うように支持板１５３に設けられる。ねじ８５を孔７７に挿入し、支持板１５３に形成されたねじ孔１５６ｈにねじ８５を螺合させることで、ガイド部材７０Ａが支持板１５３に固定される。 The guide member 70A is provided on the support plate 153 so as to cover the round hole 156a. The guide member 70A is fixed to the support plate 153 by inserting the screw 85 into the hole 77 and screwing the screw 85 into the screw hole 156h formed in the support plate 153.
　光照射部３０ａ（すなわち、筒状部３５ａ）は、取付部３７ａを介してガイド部材７０Ａに設けられる。ねじ８６を孔７８に挿入し、ねじ孔３７１にねじ８６を螺合させることで、ガイド部材７０Ａが取付部３７ａに固定される。これにより、光照射部３０ａは、光軸が取付孔７４Ａの中心と略一致するように取付孔７４Ａに挿入されてガイド部材７０Ａに固定される。 The light irradiation section 30a (that is, the cylindrical section 35a) is provided on the guide member 70A via the mounting section 37a. The guide member 70A is fixed to the mounting portion 37a by inserting the screw 86 into the hole 78 and screwing the screw 86 into the screw hole 371. Thereby, the light irradiation section 30a is inserted into the mounting hole 74A so that the optical axis substantially coincides with the center of the mounting hole 74A, and is fixed to the guide member 70A.
　図１１は、枠体１５（ここでは、支持部１５ａ）に光照射部３０ａが取り付けられた状態を模式的に示す図である。図１１では、取付孔７４及び孔７５、７６の中心を通る面で切断した状態を示す。図１１では、一部の構成要件を断面表示している。また、図１１では、ねじ８５、８６等の締結部材及びこれらが設けられる穴の図示を省略する。 FIG. 11 is a diagram schematically showing a state in which the light irradiation unit 30a is attached to the frame 15 (here, the support unit 15a). FIG. 11 shows a state of cutting along a plane passing through the center of the mounting hole 74 and the holes 75 and 76. In FIG. 11, some of the constituent elements are shown in cross section. In FIG. 11, illustration of fastening members such as screws 85 and 86 and holes in which these are provided are omitted.
　筒状部３５ａは、ガイド部材７０、７０Ａの取付孔７４、７４Ａに挿入されている。ガイド部材７０の上側に取付部３８ａが位置し、筒状部３５ａの取付部３８ａより下側の部分がガイド部材７０より下側に位置した状態でガイド部材７０と取付部３８ａとが固定されている。また、ガイド部材７０Ａの上側に取付部３７ａが位置し、筒状部３５ａの取付部３７ａより下側の部分がガイド部材７０Ａより下側に位置した状態でガイド部材７０Ａと取付部３７ａとが固定されている。 The cylindrical portion 35a is inserted into the mounting holes 74, 74A of the guide members 70, 70A. The mounting portion 38a is located above the guide member 70, and the guide member 70 and the mounting portion 38a are fixed in a state where the portion of the cylindrical portion 35a below the mounting portion 38a is positioned below the guide member 70. I have. The mounting portion 37a is located above the guide member 70A, and the guide member 70A and the mounting portion 37a are fixed in a state where the portion of the tubular portion 35a below the mounting portion 37a is located below the guide member 70A. Have been.
　なお、ガイド部材７０、７０Ａを枠体１５及び光照射部３０に取り付けるときに押さえリングを用いてもよい。押さえリングを用いることで、ガイド部材７０、７０Ａの変形を防止することができる。 When the guide members 70, 70A are attached to the frame 15 and the light irradiation unit 30, a holding ring may be used. By using the holding ring, deformation of the guide members 70 and 70A can be prevented.
　平面視において、丸孔１５５ａの中心と丸孔１５６ａの中心とは略一致するため、光軸ａｘが略鉛直方向となるように光照射部３０ａが支持部１５ａに取り付けられる。 (4) In plan view, since the center of the round hole 155a and the center of the round hole 156a substantially coincide with each other, the light irradiation unit 30a is attached to the support unit 15a such that the optical axis ax is substantially vertical.
　孔７９Ａは、ＡＦ用光源３４１から下向きに照射された光及びマスクＭでの反射光が通過できるように、それぞれＡＦ用光源３４１及びＡＦセンサ３４７、３４８と水平方向の位置が一致する。言い換えれば、孔７９Ａの位置は、面視においてＡＦ用光源３４１及びＡＦセンサ３４７、３４８の位置と重なる。 The hole 79A has a horizontal position coincident with the AF light source 341 and the AF sensors 347 and 348 so that the light emitted downward from the AF light source 341 and the reflected light from the mask M can pass through. In other words, the position of the hole 79A overlaps with the positions of the AF light source 341 and the AF sensors 347 and 348 in plan view.
　駆動部３９ａは、取付部３９５を介して支持部１５ａに設けられており、取付部３７ａを押し上げて鉛直方向に移動させる。光照射部３０ａの重心Ｇは、駆動部３９ａが取付部３７ａを押し上げる位置の近傍に位置する。したがって、駆動部３９ａは重心Ｇの近くで光照射部３０ａを押し上げる。これにより、光照射部３０ａの上下動が安定する。 The drive unit 39a is provided on the support unit 15a via the attachment unit 395, and pushes up the attachment unit 37a to move the attachment unit 37a in the vertical direction. The center of gravity G of the light irradiation unit 30a is located near the position where the driving unit 39a pushes up the mounting unit 37a. Therefore, the drive unit 39a pushes up the light irradiation unit 30a near the center of gravity G. Thereby, the vertical movement of the light irradiation unit 30a is stabilized.
　図１２は、（Ａ）は光照射部３０ａが移動していない状態（ストローク中央）を示し、（Ｂ）は光照射部３０ａが下側に移動した状態（ストローク下端）を示し、（Ｃ）は光照射部３０ａが上側に移動した状態（ストローク上端）を示す。 12A shows a state in which the light irradiation unit 30a has not moved (the center of the stroke), FIG. 12B shows a state in which the light irradiation unit 30a has moved downward (the lower end of the stroke), and FIG. Indicates a state in which the light irradiation unit 30a has moved upward (upper stroke).
　ガイド部材７０、７０Ａが取付部３７ａ、３８ａ（図１２では図示省略）を介して筒状部３５ａに固定されているため、駆動部３９ａにより筒状部３５ａが上下動すると、それに伴ってガイド部材７０、７０Ａが変形する。 Since the guide members 70, 70A are fixed to the tubular portion 35a via the attachment portions 37a, 38a (not shown in FIG. 12), when the drive portion 39a moves the tubular portion 35a up and down, the guide member is accordingly moved. 70, 70A are deformed.
　駆動部３９ａによる筒状部３５ａの移動量は略４０μｍ（±略２０μｍ）である。ガイド部材７０、７０Ａは薄い金属製であるため、略４０μｍの筒状部３５ａの上下動に合わせてガイド部材７０、７０Ａが伸び縮み（弾性変形）する。ガイド部材７０、７０Ａは平面視略円形状であるため、ガイド部材７０、７０Ａの変形量は場所によらず略一定であり、筒状部３５ａがｘｙ方向に移動しない。 移動 The amount of movement of the cylindrical portion 35a by the drive portion 39a is approximately 40 μm (± approximately 20 μm). Since the guide members 70 and 70A are made of thin metal, the guide members 70 and 70A expand and contract (elastically deform) in accordance with the vertical movement of the cylindrical portion 35a of approximately 40 μm. Since the guide members 70 and 70A have a substantially circular shape in plan view, the amount of deformation of the guide members 70 and 70A is substantially constant irrespective of the location, and the cylindrical portion 35a does not move in the xy directions.
　図１３は、露光装置１の電気的な構成を示すブロック図である。露光装置１は、ＣＰＵ（Ｃｅｎｔｒａｌ Ｐｒｏｃｅｓｓｉｎｇ Ｕｎｉｔ）２０１と、ＲＡＭ（Ｒａｎｄｏｍ Ａｃｃｅｓｓ Ｍｅｍｏｒｙ）２０２と、ＲＯＭ（Ｒｅａｄ Ｏｎｌｙ Ｍｅｍｏｒｙ）２０３と、入出力インターフェース（Ｉ／Ｆ）２０４と、通信インターフェース（Ｉ／Ｆ）２０５と、メディアインターフェース（Ｉ／Ｆ）２０６とを有し、これらは光照射部３０、位置測定部４１、４２、レーザ干渉計５１、５２、測定部６１、駆動部８１、８２、回転駆動部１６１ｆ、永電磁石１６３、計測部１６４、圧電素子３９１等と互いに接続されている。 FIG. 13 is a block diagram showing an electrical configuration of the exposure apparatus 1. As shown in FIG. The exposure apparatus 1 includes a CPU (Central Processing Unit) 201, a RAM (Random Access Memory) 202, a ROM (Read Only Memory) 203, an input / output interface (I / F) 204, and a communication interface (I / F). 205, a media interface (I / F) 206, and these are the light irradiation unit 30, the position measurement units 41 and 42, the laser interferometers 51 and 52, the measurement unit 61, the drive units 81 and 82, and the rotation drive unit. 161f, the permanent magnet 163, the measuring unit 164, the piezoelectric element 391, and the like are connected to each other.
　ＣＰＵ２０１は、ＲＡＭ２０２、ＲＯＭ２０３に格納されたプログラムに基づいて動作し、各部の制御を行う。ＣＰＵ２０１には、位置測定部４１、４２、レーザ干渉計５１、５２、測定部６１、計測部１６４等から信号が入力される。ＣＰＵ２０１から出力された信号は、光照射部３０、駆動部８１、８２、回転駆動部１６１ｆ、永電磁石１６３、圧電素子３９１等に出力される。 The CPU 201 operates based on the programs stored in the RAM 202 and the ROM 203, and controls each unit. Signals are input to the CPU 201 from the position measuring units 41 and 42, the laser interferometers 51 and 52, the measuring unit 61, the measuring unit 164, and the like. The signal output from the CPU 201 is output to the light irradiation unit 30, the driving units 81 and 82, the rotation driving unit 161f, the permanent magnet 163, the piezoelectric element 391, and the like.
　ＲＡＭ２０２は、揮発性メモリである。ＲＯＭ２０３は、各種制御プログラム等が記憶されている不揮発性メモリである。ＣＰＵ２０１は、ＲＡＭ２０２、ＲＯＭ２０３に格納されたプログラムに基づいて動作し、各部の制御を行う。また、ＲＯＭ２０３は、露光装置１の起動時にＣＰＵ２０１が行うブートプログラムや、露光装置１のハードウェアに依存するプログラム、マスクＭへの描画データなどを格納する。また、ＲＡＭ２０２は、ＣＰＵ２０１が実行するプログラム及びＣＰＵ２０１が使用するデータなどを格納する。 The RAM 202 is a volatile memory. The ROM 203 is a nonvolatile memory in which various control programs and the like are stored. The CPU 201 operates based on programs stored in the RAM 202 and the ROM 203, and controls each unit. The ROM 203 stores a boot program executed by the CPU 201 when the exposure apparatus 1 is started, a program depending on hardware of the exposure apparatus 1, drawing data on the mask M, and the like. Further, the RAM 202 stores a program executed by the CPU 201, data used by the CPU 201, and the like.
　ＣＰＵ２０１は、入出力インターフェース２０４を介して、キーボードやマウス等の入出力装置２１１を制御する。通信インターフェース２０５は、ネットワーク２１２を介して他の機器からデータを受信してＣＰＵ２０１に送信すると共に、ＣＰＵ２０１が生成したデータを、ネットワーク２１２を介して他の機器に送信する。 (4) The CPU 201 controls the input / output device 211 such as a keyboard and a mouse via the input / output interface 204. The communication interface 205 receives data from another device via the network 212 and transmits the data to the CPU 201, and transmits the data generated by the CPU 201 to the other device via the network 212.
　メディアインターフェース２０６は、記憶媒体２１３に格納されたプログラム又はデータを読み取り、ＲＡＭ２０２に格納する。なお、記憶媒体２１３は、例えば、ＩＣカード、ＳＤカード、ＤＶＤ等である。 The media interface 206 reads a program or data stored in the storage medium 213 and stores the program or data in the RAM 202. Note that the storage medium 213 is, for example, an IC card, an SD card, a DVD, or the like.
　なお、各機能を実現するプログラムは、例えば、記憶媒体２１３から読み出されて、ＲＡＭ２０２を介して露光装置１にインストールされ、ＣＰＵ２０１によって実行される。 The program for realizing each function is read, for example, from the storage medium 213, installed in the exposure apparatus 1 via the RAM 202, and executed by the CPU 201.
　ＣＰＵ２０１は、入力信号に基づいて露光装置１の各部を制御する制御部２０１ａの機能を有する。制御部２０１ａは、ＣＰＵ２０１が読み込んだ所定のプログラムを実行することにより構築される。制御部２０１ａは、回転駆動部１６１ｆを駆動して支持部１５ａをｚ方向に移動させる。また、制御部２０１ａは、電磁石１６３ｂのコイルに電流を流し、第１吸着力又は第２吸着力で支持部１５ａを吸着する。制御部２０１ａが行う処理については、後に詳述する。 The CPU 201 has a function of a control unit 201a that controls each unit of the exposure apparatus 1 based on an input signal. The control unit 201a is constructed by executing a predetermined program read by the CPU 201. The control unit 201a drives the rotation drive unit 161f to move the support unit 15a in the z direction. In addition, the control unit 201a applies a current to the coil of the electromagnet 163b, and attracts the support unit 15a with the first attraction force or the second attraction force. The processing performed by the control unit 201a will be described later in detail.
　図１３に示す露光装置１の構成は、本実施形態の特徴を説明するにあたって主要構成を説明したのであって、例えば一般的な情報処理装置が備える構成を排除するものではない。露光装置１の構成要素は、処理内容に応じてさらに多くの構成要素に分類されてもよいし、１つの構成要素が複数の構成要素の処理を実行してもよい。 The configuration of the exposure apparatus 1 shown in FIG. 13 describes the main configuration in describing the features of the present embodiment, and does not exclude, for example, the configuration of a general information processing apparatus. The components of the exposure apparatus 1 may be classified into more components according to the processing content, or one component may execute the processing of a plurality of components.
　このように構成された露光装置１の作用について説明する。以下の処理は、主として制御部２０１ａによって行われる。 作用 The operation of the exposure apparatus 1 configured as described above will be described. The following processing is mainly performed by the control unit 201a.
　図１４は、露光装置１の高さ調整処理の流れを示すフローチャートである。制御部２０１ａは、ローダ（図示せず）を用いてマスクＭをマスク保持部２０に設置する（ステップＳ１０）。その後、制御部２０１ａは、駆動部８１、８２を介してマスク保持部２０を移動して、マスクＭの位置を調整する（ステップＳ１２）。なお、ステップＳ１０、Ｓ１２の処理は既に公知であるため、説明を省略する。 FIG. 14 is a flowchart showing the flow of the height adjustment processing of the exposure apparatus 1. The control unit 201a installs the mask M on the mask holding unit 20 using a loader (not shown) (Step S10). Thereafter, the control unit 201a moves the mask holding unit 20 via the driving units 81 and 82 to adjust the position of the mask M (Step S12). Note that the processes of steps S10 and S12 are already known, and thus description thereof will be omitted.
　次に、制御部２０１ａは、支持部１５ａを高さ方向に移動して、支持部１５ａの高さ方向の位置を原点位置へ移動させる（ステップＳ１４）。原点位置とは、マスク保持部２０の高さ（あらかじめ記憶されている）及び設置されたマスクＭの規格により求められるものであり、これらの部品が規格値にある場合に光照射部３０の焦点がマスクＭ上に結ばれる位置である。なお、ステップＳ１４における支持部１５ａのｘ方向の位置は、中心位置（ｘセンター）である。 Next, the control unit 201a moves the support unit 15a in the height direction, and moves the position of the support unit 15a in the height direction to the origin position (step S14). The origin position is determined by the height (previously stored) of the mask holding unit 20 and the standard of the installed mask M. When these components are at standard values, the focus of the light irradiation unit 30 is determined. Are positions tied on the mask M. Note that the position of the support portion 15a in the x direction in step S14 is the center position (x center).
　ここで、制御部２０１ａが支持部１５ａを高さ方向への移動させる処理について説明する。まず制御部２０１ａは、電磁石１６３ｂのコイルに電流を流す。調整ダイヤル１６３ｃにより電流が調整されているため、永電磁石１６３は第２吸着力で支持部１５ａを吸着する。その後、制御部２０１ａは、回転駆動部１６１ｆを駆動してピニオン１６１ｂを回転させることで、ラック１６１ａすなわち支持部１５ａを高さ方向に移動させる。このとき制御部２０１ａは、計測部１６４での計測結果を連続的に取得し、計測部１６４での計測結果が目的の値となるまで回転駆動部１６１ｆを駆動する。 Here, the process in which the control unit 201a moves the support unit 15a in the height direction will be described. First, the control unit 201a supplies a current to the coil of the electromagnet 163b. Since the current is adjusted by the adjustment dial 163c, the permanent magnet 163 attracts the support portion 15a with the second attractive force. Thereafter, the control unit 201a drives the rotation drive unit 161f to rotate the pinion 161b, thereby moving the rack 161a, that is, the support unit 15a in the height direction. At this time, the control unit 201a continuously acquires the measurement result of the measurement unit 164, and drives the rotation driving unit 161f until the measurement result of the measurement unit 164 reaches a target value.
　永電磁石１６３が第２吸着力で支持部１５ａを吸着しているため、摺動面１６１ｄと摺動面１６１ｅとが当接しているが、摺動面１６１ｄと摺動面１６１ｅとの間に形成された油膜は排除されていない。したがって、支持部１５ａがｚ方向に移動する時には、摺動面１６１ｄに沿って摺動面１６１ｅが摺動する。このように、支持部１５ａがｚ方向に移動するときに柱１５ｃに対して支持部１５ａが傾かないため、計測部１６４での計測結果が安定する。 The sliding surface 161d and the sliding surface 161e are in contact with each other because the permanent magnet 163 is attracting the supporting portion 15a with the second attractive force, but the sliding surface 161d is formed between the sliding surface 161d and the sliding surface 161e. Spilled oil slicks are not excluded. Therefore, when the support portion 15a moves in the z direction, the sliding surface 161e slides along the sliding surface 161d. As described above, since the support portion 15a does not tilt with respect to the column 15c when the support portion 15a moves in the z direction, the measurement result of the measurement unit 164 is stabilized.
　ここまで（ステップＳ１０～Ｓ１４）が、光照射部３０の高さ調整を行うための準備段階である。次に、制御部２０１ａは、駆動部８１、８２を介してマスク保持部２０をｘ方向に移動させながら、測定部６１ａ、６１ｇによりマスクＭの高さを計測する（ステップＳ２０）。そして、制御部２０１ａは、ステップＳ２０での測定結果に基づいて、光照射部３０の高さ方向の移動量（駆動部３９ａの駆動量及び支持部１５ａの移動量）を算出する（ステップＳ２２）。以下、ステップＳ２２の処理に付いて詳細に説明する。 The steps up to this point (steps S10 to S14) are the preparation stages for adjusting the height of the light irradiation unit 30. Next, the control unit 201a measures the height of the mask M by the measuring units 61a and 61g while moving the mask holding unit 20 in the x direction via the driving units 81 and 82 (step S20). Then, the control unit 201a calculates the amount of movement of the light irradiation unit 30 in the height direction (the amount of drive of the drive unit 39a and the amount of movement of the support unit 15a) based on the measurement result in step S20 (step S22). . Hereinafter, the processing in step S22 will be described in detail.
　図１５は、ステップＳ２０での測定結果の一例である。ここでは、測定部６１ａでの測定結果を例示しており、求められる値は光照射部３０ａに対する値である。制御部２０１ａは、測定結果の最低値（ＢＯＴＴＯＭ）と最高値（ＰＥＡＫ）の中心位置（厚みセンター）を数式（１）を用いて算出する。
　［数１］
　　　（ＰＥＡＫ＋ＢＯＴＴＯＭ）／２＝厚みセンター　・・・（１） FIG. 15 is an example of the measurement result in step S20. Here, the measurement result in the measurement unit 61a is illustrated, and the obtained value is a value for the light irradiation unit 30a. The control unit 201a calculates the center position (thickness center) of the minimum value (BOTTOM) and the maximum value (PEAK) of the measurement result using Expression (1).
[Equation 1]
(PEAK + BOTTOM) / 2 = thickness center (1)
　また制御部２０１ａは、ｘ方向の中心位置（ｘセンター）における測定結果と、厚みセンターとの差異をＰＺＴ－ＯＦＳとして算出する。ＰＺＴ－ＯＦＳは、支持部１５ａのｘ方向の位置がｘセンターに位置し、かつ、圧電素子３９１がストロークセンターに位置しているときに、光照射部３０の合焦位置が厚みセンターになるように支持部１５ａの高さを調整したときの、圧電素子３９１の駆動量である。ＰＺＴ－ＯＦＳは、厚みセンターより測定結果が大きいときは正の値であり、厚みセンターより測定結果が小さいときは負の値である。 The control unit 201a calculates the difference between the measurement result at the center position (x center) in the x direction and the thickness center as PZT-OFS. The PZT-OFS is such that when the position of the support portion 15a in the x direction is located at the x center and the piezoelectric element 391 is located at the stroke center, the focus position of the light irradiation unit 30 is at the thickness center. Is the driving amount of the piezoelectric element 391 when the height of the supporting portion 15a is adjusted. PZT-OFS is a positive value when the measurement result is larger than the thickness center, and is a negative value when the measurement result is smaller than the thickness center.
　なお本実施の形態では、ステップＳ１４で支持部１５ａをｘセンターに移動し、ステップＳ２２でｘセンターにおける測定結果に基づいてＰＺＴ－ＯＦＳを求めたが、例えば、ステップＳ１４で支持部１５ａを－ｘ端に移動し、ステップＳ２２で－ｘ端における測定結果に基づいてＰＺＴ－ＯＦＳを求めてもよい。つまり、ステップＳ１４、Ｓ２２におけるｘセンターは一例であり、ｘ方向の位置はｘセンターに限られない。 In the present embodiment, the support 15a is moved to the x center in step S14, and the PZT-OFS is obtained based on the measurement result in the x center in step S22. For example, the support 15a is moved to -x in step S14. The PZT-OFS may be obtained based on the measurement result at the −x end in step S22. That is, the x center in steps S14 and S22 is an example, and the position in the x direction is not limited to the x center.
　制御部２０１ａは、ＰＺＴ－ＯＦＳに圧電素子３９１をストロークセンターに配置するための値（ここでは、２０μｍ）を加えた値を光照射部３０の鉛直方向の移動量として算出する。なお、２０μｍという値は、圧電素子３９１の種類によって変化する。 The control unit 201a calculates a value obtained by adding a value (here, 20 μm) for arranging the piezoelectric element 391 at the stroke center to PZT-OFS as a vertical movement amount of the light irradiation unit 30. Note that the value of 20 μm changes depending on the type of the piezoelectric element 391.
　ステップＳ２０では測定部６１ａ、６１ｇを用いて測定しているため、測定結果からは光照射部３０ａ、３０ｇの高さ方向の移動量が求められる。ステップＳ２２において、制御部２０１ａは、測定結果から直接求められる光照射部３０ａ、３０ｇの高さ方向の移動量に基づいて、光照射部３０ｂ～３０ｆの高さ方向の移動量（厚みセンター及びＰＺＴ－ＯＦＳ）を内挿により算出する。 In step S20, since the measurement is performed using the measurement units 61a and 61g, the movement amount of the light irradiation units 30a and 30g in the height direction is obtained from the measurement result. In step S22, the control unit 201a determines the amount of movement of the light irradiation units 30b to 30f in the height direction (thickness center and PZT) based on the amount of movement of the light irradiation units 30a and 30g in the height direction directly obtained from the measurement results. -OFS) is calculated by interpolation.
　図１４の説明に戻る。制御部２０１ａは、光照射部３０ａ～３０ｇに設けられた圧電素子３９１のそれぞれについて、ステップＳ２２で算出された値（ＰＺＴ－ＯＦＳに２０μｍを加えた値）だけ、圧電素子３９１を下端位置から駆動する（ステップＳ２４）。 戻 る Return to the description of FIG. The control unit 201a drives the piezoelectric element 391 from the lower end position by the value calculated in step S22 (PZT-OFS plus 20 μm) for each of the piezoelectric elements 391 provided in the light irradiation units 30a to 30g. (Step S24).
　次に、制御部２０１ａは、光照射部３０ａ～３０ｇのそれぞれに対して、ＡＦ処理部３４を介してマスクＭへ照射される光の焦点がマスクＭに合っているかどうかを確認しながら、回転駆動部１６１ｆを駆動して支持部１５ａを高さ方向へ移動させる（ステップＳ２６）。 Next, the control unit 201a rotates each of the light irradiation units 30a to 30g while checking whether or not the light irradiated to the mask M via the AF processing unit 34 is in focus on the mask M. The driving unit 161f is driven to move the support unit 15a in the height direction (Step S26).
　ステップＳ１４において第２吸着力で支持部１５ａを吸着したため、永電磁石１６３は、継続して支持部１５ａを第２吸着力で吸着している。したがって、ステップＳ２６においても、摺動面１６１ｄと摺動面１６１ｅとが当接しており、摺動面１６１ｄに沿って摺動面１６１ｅが摺動する。 (4) Since the support portion 15a is attracted by the second attractive force in step S14, the permanent magnet 163 continuously attracts the support portion 15a by the second attractive force. Therefore, also in step S26, the sliding surface 161d is in contact with the sliding surface 161e, and the sliding surface 161e slides along the sliding surface 161d.
　ＡＦ処理部３４では、合焦位置までどの程度移動させる必要があるか連続的に求め、制御部２０１ａは、その結果を連続的に取得する。制御部２０１ａは、計測部１６４での計測結果を連続的に取得しながら回転駆動部１６１ｆを駆動し、ＡＦ処理部３４で求められた移動距離だけ支持部１５ａを高さ方向へ移動させる。 The AF processing unit 34 continuously determines how much it needs to be moved to the in-focus position, and the control unit 201a continuously obtains the result. The control unit 201a drives the rotation drive unit 161f while continuously acquiring the measurement result of the measurement unit 164, and moves the support unit 15a in the height direction by the movement distance obtained by the AF processing unit 34.
　ステップＳ２４で、圧電素子３９１が下端位置からＰＺＴ－ＯＦＳに２０μｍを加えた値だけ駆動されているため、ステップＳ２６で支持部１５ａが移動された結果、圧電素子３９１がストロークセンターにあるときに光照射部３０から照射される光が厚みセンターに合焦する。これにより、マスクＭの高さが変化しても、圧電素子３９１の移動により、常にマスクＭに光照射部３０の焦点を合わせることができる。 In step S24, since the piezoelectric element 391 is driven by the value obtained by adding 20 μm to PZT-OFS from the lower end position, the light is output when the piezoelectric element 391 is at the stroke center as a result of the movement of the support 15a in step S26. Light emitted from the irradiation unit 30 is focused on the thickness center. Thus, even if the height of the mask M changes, the focus of the light irradiation unit 30 can be always adjusted to the mask M by the movement of the piezoelectric element 391.
　その後制御部２０１ａは、ＡＦ処理部３４を介して光照射部３０から照射される光がマスクＭに合焦しているかどうかを判定する（ステップＳ２８）。ステップＳ２４、Ｓ２６で光照射部３０が移動されているため、ステップＳ２８では、通常、光照射部３０から照射される光はマスクＭに合焦する。仮に合焦していると判断される位置に光照射部３０が位置していない場合（ステップＳ２８でＮＯ）には、制御部２０１ａは処理をステップＳ２６に戻す。 {After that, the control unit 201a determines whether the light irradiated from the light irradiation unit 30 via the AF processing unit 34 is focused on the mask M (Step S28). Since the light irradiation unit 30 has been moved in steps S24 and S26, the light irradiated from the light irradiation unit 30 is usually focused on the mask M in step S28. If the light irradiation unit 30 is not located at the position where it is determined that the camera is in focus (NO in step S28), the control unit 201a returns the process to step S26.
　合焦していると判断される位置に光照射部３０が位置している場合（ステップＳ２８でＹＥＳ）には、制御部２０１ａは、電磁石１６３ｂのコイルに電流を流して、永電磁石１６３に第１吸着力で支持部１５ａを吸着させて、摺動面１６１ｄと摺動面１６１ｅとを密着させる（ステップＳ３０）。その結果、摺動面１６１ｄと摺動面１６１ｅとの間に摩擦が発生し、摩擦力により支持部１５ａが柱１５ｃに固定される。 When the light irradiation unit 30 is located at the position where it is determined that the object is in focus (YES in step S28), the control unit 201a supplies a current to the coil of the electromagnet 163b to cause The sliding portion 161d and the sliding surface 161e are brought into close contact with each other by adsorbing the support portion 15a with one suction force (step S30). As a result, friction occurs between the sliding surface 161d and the sliding surface 161e, and the support portion 15a is fixed to the column 15c by the frictional force.
　ステップＳ１４で永電磁石１６３が第２吸着力で支持部１５ａを吸着したため、ステップＳ３０の前までは永電磁石１６３が第２吸着力で支持部１５ａを吸着し続けている。この状態で調整ダイヤル１６３ｃの値を“１０”に移動すると、電磁石１６３ｂのコイルに流れる電流値が上がり、永電磁石１６３の吸着力が第２吸着力から第１吸着力に変化する。永電磁石１６３の性質上、吸着力を第２吸着力から第１吸着力へ上げることは可能である（吸着力を第１吸着力から第２吸着力へ下げることはできない）。 (4) Since the permanent magnet 163 attracts the support 15a with the second attractive force in step S14, the permanent magnet 163 continues to attract the support 15a with the second attractive force before step S30. When the value of the adjustment dial 163c is moved to "10" in this state, the value of the current flowing through the coil of the electromagnet 163b increases, and the attraction force of the permanent magnet 163 changes from the second attraction force to the first attraction force. Due to the nature of the permanent magnet 163, the attraction force can be increased from the second attraction force to the first attraction force (the attraction force cannot be reduced from the first attraction force to the second attraction force).
　本実施の形態では、支持部１５ａの移動時に摺動面１６１ｄと摺動面１６１ｅとが当接し、摺動面１６１ｅに沿って摺動面１６１ｄが摺動するため、永電磁石１６３の吸着力により摺動面１６１ｄと摺動面１６１ｅとを密着させたとしても、摺動面１６１ｄすなわち支持部１５ａが傾かない。そのため、支持部１５ａが移動していても移動していなくても計測部１６４での計測結果が変わらない。 In the present embodiment, the sliding surface 161d and the sliding surface 161e come into contact with each other when the supporting portion 15a moves, and the sliding surface 161d slides along the sliding surface 161e. Even if the sliding surface 161d and the sliding surface 161e are brought into close contact, the sliding surface 161d, that is, the support portion 15a does not tilt. Therefore, the measurement result of the measurement unit 164 does not change regardless of whether the support unit 15a is moving or not.
　例えば図１６（Ｂ）、（Ｃ）に示すように、柱１５ｃに対して支持部１５ａが傾いた状態（摺動面１６１ｅに対して摺動面１６１ｄが傾いた状態）で支持部１５ａを高さ方向に移動させる場合（図１６（Ｂ）、（Ｃ）の白抜き矢印参照）には、摺動面１６１ｄと摺動面１６１ｅとを密着させたときに支持部１５ａが回転し（図１６（Ｂ）、（Ｃ）の太矢印参照）、計測部１６４での計測結果が変わってしまう。このときの摺動面１６１ｄの傾きが１度以下の微小な角度であったり、摺動面１６１ｄと摺動面１６１ｅとの間の隙間が数μｍ程度と小さかったとしても、支持部１５ａが大きく、また計測部１６４を永電磁石１６３が設けられた面と反対側の面に設けなければならないという制約から、計測部１６４での測定結果に無視できない誤差が生じてしまう。それに対し、図１６（Ａ）に示すように（本実施の形態）、摺動面１６１ｄと摺動面１６１ｅとを当接させながら支持部１５ａを高さ方向に移動させると、摺動面１６１ｄと摺動面１６１ｅとを密着させたときに支持部１５ａが傾かないため、支持部１５ａが移動していても移動していなくても計測部１６４での計測結果が変わらない。このように本実施の形態では、支持部１５ａの傾きに起因する誤差を無くすことができる。 For example, as shown in FIGS. 16 (B) and 16 (C), when the support portion 15a is inclined with respect to the column 15c (the slide surface 161d is inclined with respect to the slide surface 161e), the support portion 15a is raised. 16B (see the white arrows in FIGS. 16B and 16C), when the sliding surface 161d and the sliding surface 161e are brought into close contact with each other, the support portion 15a rotates (FIG. 16). (See the bold arrows in (B) and (C)), and the measurement result by the measurement unit 164 changes. Even if the inclination of the sliding surface 161d at this time is a small angle of 1 degree or less, or the gap between the sliding surface 161d and the sliding surface 161e is as small as about several μm, the support portion 15a is large. In addition, since the measurement unit 164 must be provided on the surface opposite to the surface on which the permanent magnet 163 is provided, a non-negligible error occurs in the measurement result of the measurement unit 164. On the other hand, as shown in FIG. 16A (this embodiment), when the support portion 15a is moved in the height direction while the sliding surface 161d and the sliding surface 161e are in contact with each other, the sliding surface 161d Since the support portion 15a does not tilt when the support portion 15a is brought into close contact with the sliding surface 161e, the measurement result of the measurement portion 164 does not change regardless of whether the support portion 15a is moving or not. As described above, in the present embodiment, it is possible to eliminate an error caused by the inclination of the support portion 15a.
　支持部１５ａの高さを固定（ステップＳ３０）したら、制御部２０１ａは、駆動部８１、８２を介してマスク保持部２０をｘ方向、ｙ方向に移動させながら、ＡＦ処理部３４ａ～３４ｇのそれぞれを用いて、光照射部３０ａ～３０ｇから照射される光をマスクＭ上に合焦させるためにどの程度移動させる必要があるかを示すＡＦマップを作成し、圧電素子３９１の駆動量が±２０μｍを超えないかどうか確認する（ステップＳ３２）。ＡＦマップの作成は既に公知であるため、説明を省略する。 After fixing the height of the support unit 15a (Step S30), the control unit 201a moves the mask holding unit 20 in the x direction and the y direction via the driving units 81 and 82, and controls the AF processing units 34a to 34g. Is used to create an AF map indicating how much the light irradiated from the light irradiation units 30a to 30g needs to be moved to focus on the mask M, and the driving amount of the piezoelectric element 391 is ± 20 μm (Step S32). Since the creation of the AF map is already known, the description is omitted.
　仮に圧電素子３９１の駆動量が±２０μｍを超えてしまった場合には、制御部２０１ａは、圧電素子３９１の駆動量が±２０μｍを超えてしまった方向に支持部１５ａを移動させる。 If the driving amount of the piezoelectric element 391 exceeds ± 20 μm, the control unit 201a moves the support unit 15a in the direction in which the driving amount of the piezoelectric element 391 exceeds ± 20 μm.
　これにより、図１４に示す処理を終了する。なお、図１４に示す処理は一例であり、処理の順番や処理内容はこれに限られない。 With this, the processing shown in FIG. 14 ends. Note that the processing illustrated in FIG. 14 is an example, and the order of processing and processing contents are not limited thereto.
　その後、図示しない描画処理が行われる。制御部２０１ａは、位置測定部４１、４２の測定結果に基づいてマスク保持部２０をｘ方向及びｙ方向に移動させる。制御部２０１ａは、マスク保持部２０を移動させつつ、光照射部３０の下側をマスクＭが通過するときに光照射部３０から光を照射して、描画処理を行う。描画処理は、マスク保持部２０にマスクＭを載置してから数時間経過した後に行なわれるため、制御部２０１ａがステップＳ３２の処理を行う余裕は十分にある。 (4) Thereafter, a drawing process (not shown) is performed. The control unit 201a moves the mask holding unit 20 in the x direction and the y direction based on the measurement results of the position measurement units 41 and 42. The control unit 201a irradiates light from the light irradiating unit 30 when the mask M passes below the light irradiating unit 30 while moving the mask holding unit 20, and performs a drawing process. Since the drawing process is performed several hours after the mask M is placed on the mask holding unit 20, there is enough room for the control unit 201a to perform the process of step S32.
　本実施の形態によれば、ラック１６１ａ及びピニオン１６１ｂを含む移動機構１６１を用いて光照射部３０が設けられた支持部１５ａを上下動させるため、ボールねじを用いる場合と異なり酔歩誤差が発生しない。したがって、光照射部の高さ調整を正確に行うことができる。 According to the present embodiment, since the support unit 15a provided with the light irradiation unit 30 is moved up and down by using the moving mechanism 161 including the rack 161a and the pinion 161b, a random walking error does not occur unlike the case where a ball screw is used. . Therefore, the height of the light irradiation unit can be accurately adjusted.
　また、本実施の形態によれば、永電磁石１６３を用いて第１吸着力で支持部１５ａを吸着し、摺動面１６１ｄと摺動面１６１ｅとを密着させて摺動面１６１ｄと摺動面１６１ｅとの間の油膜を排除することで、摺動面１６１ｄと摺動面１６１ｅとの間に発生する摩擦力で支持部１５ａ保持することができる。また、永電磁石１６３を用いて第２吸着力（第２吸着力＜第１吸着力）で支持部１５ａを吸着し、摺動面１６１ｄと摺動面１６１ｅとを当接させた状態で支持部１５ａを上下動させることで、支持部１５ａが移動している時もしていない時も計測部１６４での計測結果が変わらず、支持部１５ａの傾きに起因する誤差を無くすことができる。 In addition, according to the present embodiment, the supporting portion 15a is attracted by the first attracting force using the permanent magnet 163, and the sliding surface 161d and the sliding surface 161e are brought into close contact with each other, so that the sliding surface 161d and the sliding surface By removing the oil film between the sliding surface 161e and the sliding surface 161e, the supporting portion 15a can be held by the frictional force generated between the sliding surface 161d and the sliding surface 161e. Further, the supporting portion 15a is attracted by the second attracting force (second attracting force <first attracting force) using the permanent magnet 163, and the supporting portion 15a is brought into contact with the sliding surface 161d and the sliding surface 161e. By moving the support 15a up and down, the measurement result of the measurement unit 164 does not change whether the support 15a is moving or not, and errors caused by the inclination of the support 15a can be eliminated.
　また、本実施の形態によれば、永電磁石１６３を用いるため、通電時間が短く、熱による支持部１５ａの変形、膨張等が発生しない。したがって、支持部１５ａ、すなわち光照射部の高さ調整を正確に行うことができる。 According to the present embodiment, since the permanent magnet 163 is used, the energization time is short, and the deformation and expansion of the support portion 15a due to heat do not occur. Therefore, the height of the support portion 15a, that is, the height of the light irradiation portion can be accurately adjusted.
　以上、この発明の実施形態を、図面を参照して詳述してきたが、具体的な構成はこの実施形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計変更等も含まれる。当業者であれば、実施形態の各要素を、適宜、変更、追加、変換等することが可能である。 As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiments, and includes a design change or the like without departing from the gist of the present invention. . Those skilled in the art can appropriately change, add, or convert each element of the embodiment.
　また、本発明において、「略」とは、厳密に同一である場合のみでなく、同一性を失わない程度の誤差や変形を含む概念である。例えば、略水平とは、厳密に水平の場合には限られず、例えば数度程度の誤差を含む概念である。また、例えば、単に平行、直交等と表現する場合において、厳密に平行、直交等の場合のみでなく、略平行、略直交等の場合を含むものとする。また、本発明において「近傍」とは、基準となる位置の近くのある範囲（任意に定めることができる）の領域を含むことを意味する。例えば、Ａの近傍という場合に、Ａの近くのある範囲の領域であって、Ａを含んでもいても含んでいなくてもよいことを示す概念である。 Also, in the present invention, “substantially” is a concept including not only the case of exactly the same but also an error or a deformation that does not lose the identity. For example, “substantially horizontal” is not limited to a strictly horizontal case, and is a concept that includes, for example, an error of about several degrees. Also, for example, the expression “parallel, orthogonal, etc.” includes not only the case of strictly parallel, orthogonal, etc., but also the case of approximately parallel, approximately orthogonal, etc. Further, in the present invention, “near” means that a region in a certain range (can be arbitrarily determined) near a reference position is included. For example, when the term “near A” is used, it is a concept indicating that it is a region in a certain range near “A” and may or may not include “A”.
１　　　　：露光装置
１１　　　：定盤
１１ａ　　：上面
１２　　　：板状部
１２ａ　　：上面
１３、１４：レール
１５　　　：枠体
１５ａ　　：支持部
１５ｃ　　：柱
２０　　　：マスク保持部
２０ａ　　：上面
２１、２２、２３：バーミラー
３０（３０ａ～３０ｇ）：光照射部
３１（３１ａ～３１ｇ）：ＤＭＤ
３２（３２ａ～３２ｇ）：対物レンズ
３３（３３ａ～３３ｇ）：光源部
３４（３４ａ～３４ｇ）：ＡＦ処理部
３５（３５ａ～３５ｇ）：筒状部
３６（３６ａ～３６ｇ）：フランジ
３７（３７ａ～３７ｇ）、３８（３８ａ～３８ｇ）：取付部
３９（３９ａ～３９ｇ）：駆動部
４０　　　：測定部
４１、４２：位置測定部
４１ａ、４２ａ：スケール
４１ｂ、４２ｂ：検出ヘッド
５０、５１（５１ａ、５１ｂ、５１ｃ）、５２（５２ａ、５２ｇ）：レーザ干渉計
５５ａ、５５ｂ、５５ｃ、５６ａ、５６ｇ：ミラー
６０　　　：読取部
６１（６１ａ、６１ｄ、６１ｇ）：測定部
７０、７０Ａ：ガイド部材
７４、７４Ａ：取付孔
７５、７６、７７、７８：孔
７９Ａ、７９Ｂ、７９Ｃ、７９Ｄ：切抜き孔
７９Ａａ、７９Ｂａ、７９Ｃａ、７９Ｄａ：端部領域
８１、８２　：駆動部
８５、８６　：ねじ
１５１　　：底板
１５２、１５４：側板
１５２ａ～１５２ｉ、１５４ａ～１５４ｉ：孔
１５３　　：支持板
１５５ａ～１５５ｇ、１５６ａ～１５６ｇ：丸孔
１５６ｈ　：ねじ孔
１５７ａ～１５７ｇ：丸孔
１５８　　：凸部
１５９　　：仕切り壁
１６０　　：弾性部材
１６１　　：移動機構
１６１ａ　：ラック
１６１ｂ　：ピニオン
１６１ｃ　：凸部
１６１ｄ、１６１ｅ：摺動面
１６１ｆ　：回転駆動部
１６２　　：位置決め部材
１６２ａ　：凹部
１６３　　：永電磁石
１６３ａ　：永久磁石
１６３ｂ　：電磁石
１６３ｃ　：調整ダイヤル
１６４　　：計測部
１６４ａ　：スケール
１６４ｂ　：検出ヘッド
２０１　　：ＣＰＵ
２０１ａ　：制御部
２０２　　：ＲＡＭ
２０３　　：ＲＯＭ
２０４　　：入出力インターフェース
２０５　　：通信インターフェース
２０６　　：メディアインターフェース
２１１　　：入出力装置
２１２　　：ネットワーク
２１３　　：記憶媒体
３３１　　：光源
３３２　　：レンズ
３３３　　：フライアイレンズ
３３４、３３５：レンズ
３３６　　：ミラー
３４１　　：ＡＦ用光源
３４２　　：コリメータレンズ
３４３　　：ＡＦ用シリンドリカルレンズ
３４４、３４５：ペンタプリズム
３４６　　：レンズ
３４７、３４８：センサ
３７１　　：ねじ孔
３７２　　：中空部
３８１　　：ねじ孔
３９１　　：圧電素子
３９２　　：連結部
３９３　　：凸部
３９４　　：溝
３９５　　：取付部 1: Exposure device 11: Surface plate 11a: Upper surface 12: Plate portion 12a: Upper surface 13, 14: Rail 15: Frame 15a: Support portion 15c: Column 20: Mask holding portion 20a: Upper surface 21, 22, 23: Bar mirror 30 (30a-30g): Light irradiator 31 (31a-31g): DMD
32 (32a to 32g): Objective lens 33 (33a to 33g): Light source section 34 (34a to 34g): AF processing section 35 (35a to 35g): Cylindrical section 36 (36a to 36g): Flange 37 (37a to 37g) 37g), 38 (38a to 38g): mounting part 39 (39a to 39g): driving part 40: measuring part 41, 42: position measuring part 41a, 42a: scale 41b, 42b: detecting head 50, 51 (51a, 51b) , 51c), 52 (52a, 52g): laser interferometers 55a, 55b, 55c, 56a, 56g: mirror 60: reading unit 61 (61a, 61d, 61g): measuring unit 70, 70A: guide members 74, 74A: Mounting holes 75, 76, 77, 78: holes 79A, 79B, 79C, 79D: cutout holes 79Aa, 79Ba, 79Ca, 79Da: end region 81, 2: Drive parts 85, 86: Screw 151: Bottom plate 152, 154: Side plate 152a to 152i, 154a to 154i: Hole 153: Support plate 155a to 155g, 156a to 156g: Round hole 156h: Screw hole 157a to 157g: Round hole 158: convex portion 159: partition wall 160: elastic member 161: moving mechanism 161a: rack 161b: pinion 161c: convex portion 161d, 161e: sliding surface 161f: rotation driving portion 162: positioning member 162a: concave portion 163: permanent magnet 163a : Permanent magnet 163b: electromagnet 163c: adjustment dial 164: measuring unit 164a: scale 164b: detection head 201: CPU
201a: control unit 202: RAM
203: ROM
204: input / output interface 205: communication interface 206: media interface 211: input / output device 212: network 213: storage medium 331: light source 332: lens 333: fly-eye lens 334, 335: lens 336: mirror 341: AF light source 342 : Collimator lens 343: AF cylindrical lenses 344 and 345: Penta prism 346: Lenses 347 and 348: Sensor 371: Screw hole 372: Hollow portion 381: Screw hole 391: Piezoelectric element 392: Connecting portion 393: Convex portion 394: Groove 395: Mounting part

Claims (7)

  1. 　基板が載置される基板保持部と、
    　磁性材料で形成された略棒状の支持部であって、長手方向が略水平方向となるように設けられた支持部と、前記支持部の両端にそれぞれ長手方向が略鉛直方向となるように設けられた棒状の柱と、を有する枠体であって、前記支持部には支持部側摺動面が形成され、前記柱には柱側摺動面が前記支持部側摺動面と対向する位置に形成された枠体と、
    　前記支持部を鉛直方向に移動させる移動機構であって、前記支持部に設けられたラックと、前記柱に回転可能に設けられ、前記ラックと噛み合うピニオンと、前記ピニオンを回転させる回転駆動部と、を有する移動機構と、
    　前記支持部に設けられ、前記基板に光を照射する光学装置と、
    　前記柱に設けられ、永久磁石と電磁石とを有する永電磁石と、
    　前記回転駆動部を駆動して前記支持部を移動させ、かつ、前記電磁石のコイルに電流を流して前記永久磁石に前記支持部を吸着させる制御部と、
    　を備え、
    　前記永電磁石が前記支持部を吸着して前記支持部側摺動面と前記柱側摺動面とを密着させ、前記支持部側摺動面と前記柱側摺動面との間の摩擦力により前記支持部を前記柱に固定することを特徴とする露光装置。     A substrate holding unit on which the substrate is placed,
    A substantially rod-shaped support portion formed of a magnetic material, a support portion provided so that the longitudinal direction is substantially horizontal, and provided at both ends of the support portion such that the longitudinal direction is substantially vertical. A rod-shaped column, wherein the supporting portion has a supporting portion-side sliding surface, and the column has a column-side sliding surface facing the supporting portion-side sliding surface. A frame formed at the position,
    A moving mechanism for moving the support portion in a vertical direction, a rack provided on the support portion, a pinion rotatably provided on the column, meshes with the rack, and a rotation drive unit for rotating the pinion. A moving mechanism having
    An optical device provided on the support portion, for irradiating the substrate with light,
    A permanent electromagnet provided on the column and having a permanent magnet and an electromagnet,
    A control unit that drives the rotation drive unit to move the support unit, and allows a current to flow through the coil of the electromagnet to attract the support unit to the permanent magnet;
    With
    The permanent electromagnet attracts the support portion to bring the support portion side sliding surface into close contact with the column side sliding surface, and a frictional force between the support portion side sliding surface and the column side sliding surface. An exposure apparatus, wherein the support is fixed to the pillar by means of:
  2. 　前記支持部に設けられた計測部であって、鉛直方向に略沿って設けられたスケールと、前記スケールの値を読み取って位置情報を出力するヘッドと、を有する計測部と、備え、
    　前記支持部の移動時には、前記永電磁石は、前記移動機構が前記支持部を移動させないときの吸着力である第１吸着力より弱い第２吸着力で前記支持部を吸着し、前記計測部は、前記支持部の高さを連続して計測し、前記支持部側摺動面は、前記柱側摺動面に沿って摺動する
    　ことを特徴とする請求項１に記載の露光装置。     A measurement unit provided on the support unit, a scale provided substantially along the vertical direction, and a head for reading the value of the scale and outputting position information, and a measurement unit,
    When the support unit moves, the permanent electromagnet attracts the support unit with a second attraction force that is weaker than a first attraction force that is an attraction force when the moving mechanism does not move the support unit. The exposure apparatus according to claim 1, wherein the height of the support portion is continuously measured, and the slide surface on the support portion slides along the slide surface on the column side.
  3. 　前記第２吸着力は、前記第１吸着力の略２０％から略３０％である
    　ことを特徴とする請求項２に記載の露光装置。     The exposure apparatus according to claim 2, wherein the second suction force is approximately 20% to approximately 30% of the first suction force.
  4. 　前記支持部と前記光学装置との間に設けられる略薄板状のガイド部材と、
    　前記枠体に設けられ、前記光学装置を鉛直方向に移動させる駆動部と、
    　を備え、
    　前記支持部は、略水平に配置された板状部を有し、
    　前記板状部には略鉛直方向に貫通する丸孔が形成され、
    　前記ガイド部材は、平面視略円板形状であり、前記丸孔を覆うように前記板状部に設けられ、
    　前記ガイド部材には、略中央に取付孔が形成され、
    　前記取付孔は、前記丸孔と略同心円状に配置され、
    　前記光学装置は、光軸が前記取付孔の中心と略一致するように前記取付孔に挿入されて前記ガイド部材に固定されている
    　ことを特徴とする請求項１から３のいずれか一項に記載の露光装置。     A substantially thin plate-shaped guide member provided between the support portion and the optical device,
    A drive unit provided on the frame, for moving the optical device in a vertical direction;
    With
    The support portion has a plate-like portion arranged substantially horizontally,
    A circular hole is formed in the plate-like portion to penetrate in a substantially vertical direction,
    The guide member has a substantially disc shape in a plan view, and is provided on the plate portion so as to cover the round hole.
    In the guide member, a mounting hole is formed substantially at the center,
    The mounting hole is disposed substantially concentrically with the round hole,
    The optical device according to any one of claims 1 to 3, wherein the optical device is inserted into the mounting hole and fixed to the guide member such that an optical axis substantially coincides with the center of the mounting hole. Exposure apparatus according to the above.
  5. 　前記基板保持部を走査方向に移動させる移動部と、
    　前記支持部に設けられ、前記基板までの距離を測定する測定部と、
    　を備え、
    　前記制御部は、前記移動部を介して前記基板保持部を前記走査方向に移動させながら前記測定部を介して前記基板までの距離を測定し、当該基板までの距離の最大値と最小値とから中央値を求め、当該中央値に基づいて前記駆動部の駆動量を求める
    　ことを特徴とする請求項４に記載の露光装置。     A moving unit that moves the substrate holding unit in a scanning direction;
    A measurement unit that is provided on the support unit and measures a distance to the substrate.
    With
    The control unit measures a distance to the substrate via the measurement unit while moving the substrate holding unit in the scanning direction via the moving unit, and a maximum value and a minimum value of the distance to the substrate. 5. The exposure apparatus according to claim 4, wherein a median value is obtained from, and a driving amount of the driving unit is obtained based on the median value.
  6. 　前記光学装置は、下向きの光を照射するＡＦ用光源と、反射光が入射するＡＦセンサと、を有するＡＦ処理部を有し、
    　前記制御部は、前記ＡＦ処理部を動作させながら前記支持部を移動させ、合焦していると判断される位置に前記光学装置が位置したら前記支持部側摺動面と前記柱側摺動面とを密着させる
    　ことを特徴とする請求項１から５のいずれか一項に記載の露光装置。     The optical device has an AF processing unit having an AF light source that emits downward light, and an AF sensor that receives reflected light,
    The control unit moves the support unit while operating the AF processing unit, and when the optical device is located at a position where it is determined that the AF unit is in focus, the support unit side slide surface and the column side slide The exposure apparatus according to claim 1, wherein the exposure apparatus makes close contact with a surface.
  7. 　基板が載置される基板保持部と、
    　磁性材料で形成された略棒状の支持部であって、長手方向が略水平方向となるように設けられた支持部と、前記支持部の両端にそれぞれ長手方向が略鉛直方向となるように設けられた棒状の柱と、を有する枠体であって、前記支持部には支持部側摺動面が形成され、前記柱には柱側摺動面が前記支持部側摺動面と対向する位置に形成された枠体と、
    　前記支持部を鉛直方向に移動させる移動機構であって、前記支持部に鉛直方向に略沿って設けられたラックと、前記柱に回転可能に設けられ、前記ラックと噛み合うピニオンと、前記ピニオンを回転させる回転駆動部と、を有する移動機構と、
    　前記支持部に設けられた計測部と、
    　前記支持部に設けられ、前記基板に光を照射する光学装置と、
    　前記柱に設けられ、永久磁石と電磁石とを有する永電磁石と、
    　を有する装置を用いて前記支持部の高さを調整する高さ調整方法であって、
    　前記電磁石のコイルに電流を流して前記永電磁石に前記支持部を第２吸着力で吸着させて、前記支持部側摺動面と前記柱側摺動面と当接させるステップと、
    　前記計測部で前記支持部の高さを計測しながら、前記回転駆動部を駆動して前記ピニオンを回転させて、前記支持部を高さ方向に移動させるステップと、
    　前記コイルに電流を流して前記永電磁石に前記支持部を前記第２吸着力より強い第１吸着力で吸着させて、前記支持部側摺動面と前記柱側摺動面と密着させて前記支持部を前記柱に固定するステップと、
    　を含むことを特徴とする高さ調整方法。     A substrate holding unit on which the substrate is placed,
    A substantially rod-shaped support portion formed of a magnetic material, a support portion provided so that the longitudinal direction is substantially horizontal, and provided at both ends of the support portion such that the longitudinal direction is substantially vertical. A rod-shaped column, wherein the supporting portion has a supporting portion-side sliding surface, and the column has a column-side sliding surface facing the supporting portion-side sliding surface. A frame formed at the position,
    A moving mechanism for moving the support portion in a vertical direction, a rack provided substantially along the support portion in a vertical direction, a pinion rotatably provided on the column, and a pinion that meshes with the rack; and A movement mechanism having a rotation drive unit for rotating,
    A measurement unit provided on the support unit,
    An optical device provided on the support portion, for irradiating the substrate with light,
    A permanent electromagnet provided on the column and having a permanent magnet and an electromagnet,
    A height adjustment method for adjusting the height of the support portion using a device having,
    Flowing a current through the coil of the electromagnet to cause the permanent magnet to attract the support portion with a second attraction force, to contact the support portion side sliding surface and the column side sliding surface;
    While measuring the height of the support unit in the measurement unit, driving the rotation drive unit to rotate the pinion, moving the support unit in the height direction,
    An electric current is applied to the coil to cause the permanent magnet to adsorb the support portion with a first attraction force stronger than the second attraction force, so that the support portion side sliding surface and the column side sliding surface are in close contact with each other. Fixing a support to the column;
    A height adjustment method comprising:
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