WO2019242667A1 - 光模块 - Google Patents

光模块 Download PDF

Info

Publication number
WO2019242667A1
WO2019242667A1 PCT/CN2019/091991 CN2019091991W WO2019242667A1 WO 2019242667 A1 WO2019242667 A1 WO 2019242667A1 CN 2019091991 W CN2019091991 W CN 2019091991W WO 2019242667 A1 WO2019242667 A1 WO 2019242667A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
optical module
waveguide grating
arrayed waveguide
array
Prior art date
Application number
PCT/CN2019/091991
Other languages
English (en)
French (fr)
Inventor
谢一帆
傅钦豪
刘维伟
付孟博
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Priority to US16/563,196 priority Critical patent/US10877213B2/en
Publication of WO2019242667A1 publication Critical patent/WO2019242667A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide

Definitions

  • the present disclosure relates to the field of optical communication technologies, and in particular, to an optical module.
  • Optical modules are key components in optical networks.
  • the optical module includes a transmitting end and a receiving end.
  • the transmitting end converts an electrical signal into an optical signal and transmits it through an optical fiber.
  • the receiving end converts the received optical signal into an electrical signal.
  • the receiving end and the transmitting end are staggered on the circuit board, and the distance between the receiving end and the transmitting end is increased. Reduce signal crosstalk between the two.
  • the present disclosure provides an optical module capable of increasing a coupling space of an arrayed waveguide grating in a height direction of a circuit board.
  • the present disclosure provides an optical module including a circuit board and an arrayed waveguide grating.
  • a sinker is provided on the surface of the circuit board, and the recessed direction of the sinker is consistent with the height direction of the circuit board.
  • the array waveguide grating is disposed above the sinker and opposite to the sinker.
  • 1a is a schematic structural diagram of a receiving end and a transmitting end in an optical module in the related art
  • FIG. 1b is an enlarged schematic cross-sectional view of an optical module in the related art
  • FIG. 2a is a schematic structural diagram of an optical module according to an embodiment of the present disclosure.
  • FIG. 2b is a top view of an optical module according to an embodiment of the present disclosure.
  • FIG. 3 is an enlarged schematic cross-sectional view of an optical module according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present disclosure
  • FIG. 5 is a schematic structural diagram of an arrayed waveguide grating and a reflector in an optical module according to an embodiment of the present disclosure.
  • the receiving end and the transmitting end are staggered on the circuit board, and the receiving end and the The distance between the transmitters, but because there are many components on the transmitters and the rear side is equipped with a driver chip. Furthermore, due to the width of the circuit board, it is not possible to increase the transmitter and receiver in the width direction (see Y direction in Figure 1a). The distance between the terminals is shown in FIG. 1a.
  • the receiving terminal 100 is disposed along the side facing the electrical port of the circuit board 300, that is, the receiving terminal is disposed away from the transmitting terminal 200 in the X direction in FIG. 1a.
  • a reflector 120 is provided at the rear end of the arrayed waveguide grating 110.
  • the optical signal output by the optical fiber passes through the arrayed waveguide grating 110 and is emitted by the reflector 120. This optical signal enables the receiving end 100 to receive the optical signal.
  • a cover plate 140 for protecting the waveguide is provided at the bottom of the arrayed waveguide grating 110, and the arrayed waveguide grating 110 at the receiving end 100 is located above the circuit board 300, so that the coupling space of the arrayed waveguide grating 110 in the Z direction is limited and cannot be further reduced
  • the distance from the bottom surface of the mirror to the receiving chip of the PD array (refer to L in Figure 1b), which will directly affect the coupling performance at the receiving end.
  • the array waveguide grating is coupled toward the surface of the circuit board, the array waveguide grating is in the Z direction.
  • the coupling space is limited, and the height dimension of the rubber filled between the circuit board and the arrayed waveguide grating cannot be guaranteed, which reduces the fixed stability of the arrayed waveguide grating.
  • the optical module provided by the present disclosure includes a circuit board and an arrayed waveguide grating.
  • the surface of the circuit board is provided with a sinker, and the recessed direction of the sinker is consistent with the height direction of the circuit board.
  • the arrayed waveguide grating is disposed above the sinker and opposite to the sinker.
  • the optical module further includes a reflecting mirror, which is arranged above the circuit board and opposite to the circuit board in a height direction of the circuit board, and the reflecting mirror is connected to the array waveguide grating.
  • a reflecting mirror which is arranged above the circuit board and opposite to the circuit board in a height direction of the circuit board, and the reflecting mirror is connected to the array waveguide grating.
  • the optical module provided by the embodiment of the present disclosure includes a circuit board 10 and an arrayed waveguide grating 20, a reflector 30, and a PD array receiving chip 40 provided on the circuit board 10.
  • the receiving end of the optical module includes an array waveguide grating 20, a mirror 30, and a PD array receiving chip 40. The receiving end receives the optical signal and converts the optical signal into an electrical signal.
  • the circuit board 10 generally includes pads, vias, mounting holes, wires, components, and connectors, etc., and is a support for components in the optical module, that is, carriers for various circuit chips and signal lines.
  • the arrayed waveguide grating 20 and the reflection mirror 30 are disposed on the circuit board 10, and the circuit board 10 realizes a bearing and supporting effect on the arrayed waveguide grating 20 and the reflection mirror 30.
  • the PD array receiving chip 40 is electrically connected to the circuit board 10 to implement electrical signal transmission.
  • the arrayed waveguide grating 20 is connected to the reflecting mirror 30, or the arrayed waveguide grating 20 and the reflecting mirror 30 are integrally provided to realize the arrayed waveguide grating 20 and the reflecting mirror 30 at the same time. Coupling to other devices, such as the PD array receiving chip 40, reduces the workload of optical path coupling operations.
  • the arrayed waveguide grating 20 and the reflector 30 are disposed along the length direction of the circuit board 10 (see the X direction in FIG. 3).
  • the arrayed waveguide grating 20 and the mirror 30 are disposed opposite to the circuit board 10 in the height direction (see the Z direction in FIG. 3) of the circuit board 10.
  • the bottom surface 31 of the reflector 30 and the PD array receiving chip 40 are oppositely disposed in the height direction of the circuit board 10.
  • the arrayed waveguide grating 20 is connected to an optical fiber to receive an optical signal.
  • the received optical signal is reflected by the end surface of the reflecting mirror 30 to change its transmission optical path, and is emitted through the bottom surface 31 of the reflecting mirror 30.
  • the emitted optical signal is received by the PD array receiving chip 40, and the PD array receiving chip 40 realizes the conversion of the photoelectric signal.
  • the “X direction”, “Y direction”, and “Z direction” in this application do not have positive and negative directions.
  • the "X direction” refers to a direction parallel to the X axis, and the direction may be the same as or opposite to the direction of the arrow of the X axis.
  • the "Y direction” refers to a direction parallel to the Y axis, and the direction may be the same as or opposite to that of the Y axis arrow.
  • the "Z direction” refers to a direction parallel to the Z axis, and the direction may be the same as or opposite to the direction of the arrow of the Z axis.
  • the distance L in the height direction of the circuit board 10 between the bottom surface 31 of the reflector 30 and the surface of the PD array receiving chip 40 will directly affect the optical signal receiving performance.
  • the reason is that when light is transmitted in the reflecting mirror 30, it is reflected by the inclined end surface of the reflecting mirror 30. The reflected light is emitted to the air layer through the bottom surface 31. Due to the change of the transmission medium of the emitted light, the light passes through the bottom surface 31 along the If it is emitted at an angle of outward diffusion, if L is too large, it will cause less light to be received by the PD array receiving chip 40 and reduce the optical signal receiving performance.
  • the distance between the bottom surface 31 of the reflector 30 and the PD array receiving chip 40 is shortened, that is, the L value is reduced. Effectively improve the transmission performance of the optical module at the receiving end.
  • the bottom surface 31 of the reflector 30 specifically refers to the surface of the reflector 30 opposite to the circuit board 10, and the light reflected by the reflector 30 is emitted from the bottom surface 31 to the outside.
  • a sinker 11 is provided on the surface of the circuit board 10, and the sinker 11 is formed in a depression along the height direction of the circuit board 10.
  • the sinker 11 and the arrayed waveguide grating 20 are oppositely disposed in the height direction of the circuit board 10.
  • the arrayed waveguide grating 20 may be fixedly disposed in the sink 11.
  • the slot 11 provides a coupling space for the arrayed waveguide grating 20 in the height direction of the circuit board 10, so that the arrayed waveguide grating 20 moves toward the surface of the circuit board 10, thereby shortening the bottom surface of the reflector 30 connected to the arrayed waveguide grating 20.
  • the distance between 31 and the PD array receiving chip 40 is the L value.
  • a cover plate 21 is provided on the bottom surface (that is, the surface of the arrayed waveguide grating 20 facing the circuit board 10), and the cover plate 21 is used to realize security protection of the arrayed waveguide grating 20.
  • the cover plate 21 is accommodated in the sink groove 11, and the cover plate 21 is even fixedly disposed in the sink groove 11, so as to realize the fixed setting of the array waveguide grating 20 on the circuit board 10.
  • a protective case (not shown in the figure) is provided above the arrayed waveguide grating 20 and the reflection mirror 30.
  • the provided sinker 11 has the following beneficial effects for fixing the arrayed waveguide grating 20 on the circuit board 10:
  • the recessed groove 11 provided on the surface of the circuit board 10 can increase the size of the rubber to fill the space between the array waveguide grating 20 and the circuit board 10, specifically, it can increase the height size of the provided rubber, and further On the premise of ensuring that the L value meets the transmission performance at the receiving end, the setting of the sink 11 can further provide filling space for the rubber material to ensure the stability of the arrayed waveguide grating 20 on the circuit board 10;
  • the sink 11 can limit the filling space of the glue, and the glue for fixing the arrayed waveguide grating 20 is restricted in the sink 11 to prevent the glue from flowing freely on the circuit board 10. On the one hand, it is not possible to ensure a fixed amount of glue.
  • the array waveguide grating 20 has a good fixing performance. On the other hand, the randomly flowing rubber will damage other electronic components on the circuit board 10 and affect the working performance of the electronic components. Therefore, the sink 11 can limit the flow area of the rubber for fixing the array waveguide grating 20 while ensuring the size of the rubber filling space, and can improve the performance of the fixing and coupling processes.
  • the separation distance between the transmitting end and the receiving end can be enlarged to reduce the crosstalk between the signals emitted by the transmitting end and the receiving end, but Because the arrayed waveguide grating 20 and the reflection mirror 30 are both located inside the optical module, the arrayed waveguide grating 20 and the reflection mirror 30 are limited in the height direction by the circuit board 10 provided below, and the reflection mirror cannot be reduced. The distance between the bottom of 30 and the PD array receiving chip 40 reduces the transmission performance at the receiving end.
  • the sinkhole 11 provided on the surface of the circuit board 10 in the embodiment of the present disclosure can shorten the distance between the bottom surface 31 of the reflector 30 and the PD array receiving chip 40, that is, reduce the L value and effectively improve the optical module. Transmission performance at the receiving end.
  • the setting of the sink groove 11 can further provide a filling space for the rubber material and limit the moving space of the applied rubber material on the circuit board 10. While increasing the size of the rubber material filling space, it can also limit the space for the rubber material to move. Furthermore, the fixing area of the rubber material is restricted, and the fixing stability of the arrayed waveguide grating 20 on the circuit board 10 is effectively improved.
  • the present disclosure provides an optical module including a circuit board and an arrayed waveguide grating, a mirror, and a PD array receiving chip disposed on the circuit board.
  • the arrayed waveguide grating and the reflective mirror are connected, and the PD array receiving chip is connected. It is electrically connected to the circuit board.
  • the PD array receiving chip is used to receive the light transmitted through the array waveguide grating and emitted by the reflector.
  • the array waveguide grating and the reflector are arranged opposite to the circuit board in the height direction of the circuit board.
  • the sink groove is formed in a recess along the height direction of the circuit board.
  • the array waveguide grating is disposed opposite the sink groove in the height direction of the circuit board.
  • the array waveguide grating is fixedly disposed in the sink groove. Therefore, the sink provided on the circuit board can increase the coupling space of the array waveguide grating and the reflector in the height direction, so as to shorten the distance from the bottom surface of the mirror to the PD array receiving chip and improve the coupling performance at the receiving end.
  • the slot can increase the space for fixing the arrayed waveguide grating on the circuit board, and improve the fixing stability of the arrayed waveguide grating.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

一种光模块。作为一个示例，光模块包括电路板（10）和阵列波导光栅（20）。电路板（10）的表面设有沉槽（11），沉槽（11）的凹陷方向与电路板（10）的高度方向一致，阵列波导光栅（20）设置在沉槽（11）的上方且与沉槽（11）相对设置。

Description

光模块
相关申请的交叉引用
本专利申请要求于2018年6月20日提交的、申请号为2018106361251的中国专利申请的优先权，该申请的全文以引用的方式并入本文中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
光模块是光网络中的关键器件。光模块包括发射端和接收端，由发射端将电信号转换为光信号，并通过光纤传送，接收端将接收到的光信号转换为电信号。为保证发射端与接收端的信号隔离，以降低由发射端、接收端所传输的信号的相互串扰，将接收端与发射端在电路板上错开布设，增大接收端与发射端的间隔距离，以降低二者之间的信号串扰。
发明内容
本公开提供一种光模块，能够增大阵列波导光栅在电路板高度方向上的耦合空间。
本公开提供一种光模块，包括电路板和阵列波导光栅。电路板的表面设有沉槽，所述沉槽的凹陷方向与所述电路板的高度方向一致，阵列波导光栅设置在所述沉槽的上方且与所述沉槽相对设置。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
为了更清楚地说明本公开的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1a为相关技术中光模块中接收端与发射端的结构示意图；
图1b为相关技术中光模块截面放大示意图；
图2a为本公开实施例提供的光模块的结构示意图；
图2b为本公开实施例提供的光模块的俯视图；
图3为本公开实施例提供的光模块截面放大示意图；
图4为本公开实施例提供的光模块中电路板的结构示意图；
图5为本公开实施例提供的光模块中阵列波导光栅和反射镜的结构示意图。
具体实施方式
在光模块结构中，为保证发射端与接收端的信号隔离，以降低由发射端、接收端所传输的信号的相互串扰，将接收端与发射端在电路板上错开布设，增大接收端与发射端的间隔距离，但由于发射端的部件较多且其后方布设有驱动芯片，再者，受限于电路板的宽度尺寸，无法在宽度方向(请参见图1a中Y向)增加发射端与接收端的间隔距离，请参照图1a，将接收端100沿朝向电路板300电口的一侧设置，即，将接收端沿图1a中X向远离于发射端200设置。继续参照图1b，阵列波导光栅110的后端设置反射镜120，光纤所输出的光信号经阵列波导光栅110后由反射镜120出射，由PD(Photo-Diode，光电二极管)阵列接收芯片130接收该光信号，实现接收端100对于光信号的接收。阵列波导光栅110底部设置用于保护波导的盖板140，而接收端100的阵列波导光栅110因位于电路板300的上方，使得阵列波导光栅110在Z向上的耦合空间受限，无法进一步地缩小反射镜底面至PD阵列接收芯片的距离(参考图1b中L)，由此会直接影响接收端的耦合性能，再者，当阵列波导光栅朝向于电路板表面耦合时，因阵列波导光栅在Z向上的耦合空间受限，无法保证电路板与阵列波导光栅之间所填充胶料的高度尺寸，降低阵列波导光栅的固定稳定性。
本公开提供的光模块包括电路板和阵列波导光栅。电路板的表面设有沉槽，该沉槽的凹陷方向和电路板的高度方向一致。阵列波导光栅设置在沉槽的上方且与该沉槽相对设置。通过设置沉槽能够增大电路板上用于容纳阵列波导光栅的空间，进而增大电路板与阵列波导光栅之间所填充胶料的高度尺寸，提升阵列波导光栅的固定稳定性。
此外，光模块还包括反射镜，反射镜设置在所述电路板的上方且在电路板的高度方向上与电路板相对设置，反射镜与阵列波导光栅连接。通过在电路板上设置沉槽，可增大阵列波导光栅和反射镜在高度方向上的耦合空间，以缩短反射镜底面至PD阵列接收 芯片的距离，提高接收端的耦合性能。
下面以具体实施例结合附图的方式对本公开提供的光模块进行详细描述。
图2a、2b示出了本公开实施例提供的光模块的结构示意图。本公开实施例提供的光模块包括电路板10和设置在电路板10上的阵列波导光栅20、反射镜30和PD阵列接收芯片40。光模块的接收端包括阵列波导光栅20、反射镜30和PD阵列接收芯片40，由接收端接收光信号将光信号转换成电信号。
电路板10通常包括焊盘、过孔、安装孔、导线、元器件以及接插件等，为光模块中元器件的支撑体，即为各种电路芯片和信号线等的载体。在本公开实施例中，阵列波导光栅20和反射镜30设置在电路板10上，由电路板10实现对阵列波导光栅20和反射镜30的承载和支撑作用。PD阵列接收芯片40与电路板10电连接以实现电信号传输。
具体的，请参见图2a、2b和图3所示，阵列波导光栅20与反射镜30相连接，或阵列波导光栅20与反射镜30为一体设置，以实现阵列波导光栅20和反射镜30同时耦合到其他器件，例如，PD阵列接收芯片40，降低光路耦合操作工作量。阵列波导光栅20与反射镜30沿电路板10的长度方向(参见图3中X向)设置。阵列波导光栅20和反射镜30与电路板10在电路板10的高度方向(参见图3中Z向)上相对设置。反射镜30的底面31与PD阵列接收芯片40在电路板10的高度方向上相对设置。阵列波导光栅20与光纤相连以接收光信号。所接收的光信号经反射镜30的端面反射后改变其传输光路，经反射镜30的底面31射出。所射出的光信号由PD阵列接收芯片40接收，由PD阵列接收芯片40实现光电信号的转换。
可理解，本申请中的“X方向”、“Y方向”、“Z方向”不具有正向性和负向性。换言之，“X方向”是指与X轴向平行的方向，该方向可以与X轴的箭头指向相同或相反。“Y方向”是指与Y轴向平行的方向，该方向可以与Y轴的箭头指向相同或相反。“Z方向”是指与Z轴向平行的方向，该方向可以与Z轴的箭头指向相同或相反。
在接收端进行光信号的接收过程中，反射镜30底面31与PD阵列接收芯片40的表面在电路板10高度方向上的距离尺寸L将会直接影响光信号接收性能。其原因是，光线在反射镜30内传输时，经反射镜30的倾斜端面而发生反射，反射后的光线经底面31向空气层射出，因射出光线的传输介质发生改变，光线经底面31沿向外扩散的角度出射，若L过大，则会导致PD阵列接收芯片40所接收的光线较少，降低光信号的接收性能。因此，对于接收端中阵列波导光栅20与反射镜30位于电路板10上方且相连接 的光模块而言，缩短反射镜30底面31与PD阵列接收芯片40之间的距离，即降低L值，有效提高光模块在接收端的传输性能。需要说明的是，反射镜30的底面31具体是指反射镜30与电路板10相对的表面，经反射镜30反射后的光线由底面31向外界射出。
参见图4所示，电路板10的表面设置沉槽11，沉槽11沿电路板10的高度方向凹陷形成。沉槽11与阵列波导光栅20在电路板10的高度方向上相对设置。阵列波导光栅20可固定设置在的沉槽11内。由沉槽11为阵列波导光栅20在电路板10的高度方向上提供耦合空间，以使阵列波导光栅20朝向电路板10的表面移动，进而可缩短与阵列波导光栅20相连的反射镜30的底面31与PD阵列接收芯片40的距离尺寸，即L值。可防止为提升反射镜30与PD阵列接收芯片40的耦合性能，将阵列波导光栅20、反射镜30朝向电路板10移动时与电路板10发生运动干涉，甚者会对电路板10的表面造成划伤。
为实现对阵列波导光栅20内的波导结构进行保护，避免在阵列波导光栅20的耦合过程中与其他元件如电路板发生划伤，请参见图3和图5所示，在阵列波导光栅20的底面(即，阵列波导光栅20朝向于电路板10的表面)设置盖板21，由盖板21实现对阵列波导光栅20的安全防护。盖板21容纳于沉槽11内，甚至将盖板21固定设置在沉槽11内，以实现对阵列波导光栅20在电路板10上的固定设置。
进一步地，为避免阵列波导光栅20和反射镜30受到外界划伤和冲击，在阵列波导光栅20和反射镜30的上方设置保护壳(图中未示出)。
为实现对阵列波导光栅20在电路板10上的固定设置，在沉槽11内设置胶料以使得阵列波导光栅20与电路板10固定相连。进一步的，设置在阵列波导光栅20底部的盖板11与沉槽11通过所设置的胶料而固定相连。在本公开实施例中，所设置的沉槽11对阵列波导光栅20在电路板10上的固定具有如下有益效果：
1.在电路板10的表面凹陷设置的沉槽11可增大胶料在阵列波导光栅20与电路板10之间填充空间，具体是指可增大所设置的胶料的高度尺寸，进而在保证L值满足接收端传输性能的前提下，沉槽11的设置可进一步为胶料提供填充空间，以保证阵列波导光栅20在电路板10上的稳定性；
2.沉槽11可限制胶料的填充空间，将用于固定阵列波导光栅20的胶料限制在沉槽11内，防止胶料在电路板10任意流动，一方面无法保证定量设置的胶料对阵列波导光栅20起到良好的固定性能，另一方面任意流动的胶料会对电路板10上的其他电子元 件造成破坏，影响电子元件的工作性能。因此，沉槽11在保证胶料填充空间尺寸的同时，可限制用于固定阵列波导光栅20的胶料的流动区域，提高固定和耦合工艺性能。
对于为接收端与发射端沿电路板的长度方向错开布设的光模块而言，可扩大发射端与接收端的间隔距离，以降低由发射端和接收端所发出的信号之间的相互串扰，但因阵列波导光栅20与反射镜30均设置于光模块的内部，使得阵列波导光栅20、反射镜30因下方设置电路板10使其在高度方向上的移动距离受限，进而无法减小反射镜30底部与PD阵列接收芯片40之间的距离，进而降低接收端的传输性能，同时，阵列波导光栅20与电路板10之间的固定空间减小，不利于阵列波导光栅20在电路板10上的稳妥固定。针对以上问题，本公开实施例针对性地在电路板10表面上设置的沉槽11，可缩短反射镜30底面31与PD阵列接收芯片40之间的距离，即降低L值，有效提高光模块在接收端的传输性能。进一步的，沉槽11的设置可进一步为胶料提供填充空间并限制所施加的胶料在电路板10上的移动空间，在增加胶料填充空间大小的同时，又可限制胶料的活动空间进而限制胶料的固定区域，有效提高阵列波导光栅20在电路板10上的固定稳定性。
综上所述，本公开提供一种光模块，包括电路板和设置于所述电路板上的阵列波导光栅、反射镜和PD阵列接收芯片，阵列波导光栅和反射镜相连接，PD阵列接收芯片与电路板电连接，PD阵列接收芯片用于接收经阵列波导光栅所传输并由反射镜出射的光线，阵列波导光栅和反射镜在电路板的高度方向上与电路板相对设置，电路板上设置沉槽，沉槽沿电路板的高度方向凹陷形成，阵列波导光栅在电路板的高度方向上与沉槽相对设置，阵列波导光栅固定设置于沉槽内。由此，在电路板上设置的沉槽可增大阵列波导光栅和反射镜在高度方向上的耦合空间，以缩短反射镜底面至PD阵列接收芯片的距离，提高接收端的耦合性能，所开设的沉槽可增大电路板上用于固定阵列波导光栅的空间，提高阵列波导光栅的固定稳定性。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
以上仅为本公开的较佳实施例而已，并不用以限制本公开，凡在本公开的精神和原 则之内所作的任何修改、等同替换和改进等，均应包含在本公开的保护范围之内。

Claims (8)

  1. 一种光模块，包括：
    电路板，所述电路板的表面设有沉槽，所述沉槽的凹陷方向与所述电路板的高度方向一致；和
    阵列波导光栅，设置在所述沉槽的上方且与所述沉槽相对设置。
  2. 根据权利要求1所述的光模块，其中，所述沉槽沿所述电路板的高度方向凹陷设置于所述电路板的表面，所述阵列波导光栅与所述沉槽在所述电路板的高度方向上相对设置。
  3. 根据权利要求1所述的光模块，其中，所述光模块还包括盖板，所述阵列波导光栅朝向于所述电路板的表面设置所述盖板，所述盖板容纳于所述沉槽内。
  4. 根据权利要求1所述的光模块，其中，所述光模块还包括：
    反射镜；和
    光电二极管PD阵列接收芯片；所述PD阵列接收芯片设置在所述电路板上，且所述PD阵列接收芯片与所述电路板电连接，所述PD阵列接收芯片与所述反射镜的一部分底面相对设置。
  5. 根据权利要求1所述的光模块，其中，所述光模块还包括胶料，所述阵列波导光栅通过所述胶料固定设置于所述沉槽内。
  6. 根据权利要求3所述的光模块，其中，所述光模块还包括胶料，所述盖板通过所述胶料固定设置于所述沉槽内。
  7. 根据权利要求1所述的光模块，其中，所述光模块还包括：
    反射镜，所述反射镜设置在所述电路板的上方且在所述电路板的高度方向上与所述电路板相对设置，所述反射镜与所述阵列波导光栅连接。
  8. 根据权利要求7所述的光模块，其中，所述光模块还包括：
    保护壳，设置在所述阵列波导光栅和所述反射镜的上方。
PCT/CN2019/091991 2018-06-20 2019-06-20 光模块 WO2019242667A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/563,196 US10877213B2 (en) 2018-06-20 2019-09-06 Optical module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810636125.1A CN108828731A (zh) 2018-06-20 2018-06-20 一种光模块
CN201810636125.1 2018-06-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/563,196 Continuation US10877213B2 (en) 2018-06-20 2019-09-06 Optical module

Publications (1)

Publication Number Publication Date
WO2019242667A1 true WO2019242667A1 (zh) 2019-12-26

Family

ID=64142771

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/091991 WO2019242667A1 (zh) 2018-06-20 2019-06-20 光模块

Country Status (2)

Country Link
CN (1) CN108828731A (zh)
WO (1) WO2019242667A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108761670A (zh) * 2018-06-14 2018-11-06 青岛海信宽带多媒体技术有限公司 一种光模块
CN108828731A (zh) * 2018-06-20 2018-11-16 青岛海信宽带多媒体技术有限公司 一种光模块
US10877213B2 (en) * 2018-06-20 2020-12-29 Hisense Broadband Multimedia Technologies Co., Ltd. Optical module
CN109407231A (zh) * 2018-12-07 2019-03-01 青岛海信宽带多媒体技术有限公司 光模块
CN110596833B (zh) * 2019-10-21 2021-05-14 青岛海信宽带多媒体技术有限公司 一种光模块
CN112904495A (zh) * 2019-12-04 2021-06-04 讯芯电子科技（中山）有限公司 光模块装置
CN113419316A (zh) * 2021-07-23 2021-09-21 广东瑞谷光网通信股份有限公司 一种光接收器件外置的光模块

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100111478A1 (en) * 2008-11-04 2010-05-06 Aidi Corporation Non-linear fiber array having opposing v-groove structures
CN102692684A (zh) * 2011-03-24 2012-09-26 源杰科技股份有限公司 光电模组
CN105278056A (zh) * 2015-11-06 2016-01-27 武汉电信器件有限公司 一种波分复用/解复用光组件
CN105425351A (zh) * 2015-12-14 2016-03-23 博创科技股份有限公司 一种光接收/发射次模块的封装结构及其制备方法
CN105866904A (zh) * 2016-05-23 2016-08-17 宁波环球广电科技有限公司 多通道并行的光接收器件
CN107991743A (zh) * 2018-01-11 2018-05-04 绍兴柯芯光电技术有限公司 一种集成plc平面波导型器件的光收发模块
CN108828731A (zh) * 2018-06-20 2018-11-16 青岛海信宽带多媒体技术有限公司 一种光模块

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6607400B1 (en) * 2002-10-22 2003-08-19 Hon Hai Precision Ind. Co., Ltd. Low profile RF connector assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100111478A1 (en) * 2008-11-04 2010-05-06 Aidi Corporation Non-linear fiber array having opposing v-groove structures
CN102692684A (zh) * 2011-03-24 2012-09-26 源杰科技股份有限公司 光电模组
CN105278056A (zh) * 2015-11-06 2016-01-27 武汉电信器件有限公司 一种波分复用/解复用光组件
CN105425351A (zh) * 2015-12-14 2016-03-23 博创科技股份有限公司 一种光接收/发射次模块的封装结构及其制备方法
CN105866904A (zh) * 2016-05-23 2016-08-17 宁波环球广电科技有限公司 多通道并行的光接收器件
CN107991743A (zh) * 2018-01-11 2018-05-04 绍兴柯芯光电技术有限公司 一种集成plc平面波导型器件的光收发模块
CN108828731A (zh) * 2018-06-20 2018-11-16 青岛海信宽带多媒体技术有限公司 一种光模块

Also Published As

Publication number Publication date
CN108828731A (zh) 2018-11-16

Similar Documents

Publication Publication Date Title
WO2019242667A1 (zh) 光模块
US20190081707A1 (en) Integrated Transceiver With Lightpipe Coupler
CN107045166B (zh) 光模块
JP5681566B2 (ja) 光導波路構造を有する信号伝送モジュール
US9217835B2 (en) Photoelectric conversion module and transmission apparatus using the same
CN111313969B (zh) 一种光模块
CN113009650B (zh) 一种光模块
KR101929465B1 (ko) 광학모듈
CN111694112A (zh) 一种光模块
JP2010122311A (ja) レンズブロック及びそれを用いた光モジュール
WO2020181938A1 (zh) 一种光模块
US20240146417A1 (en) Optical Module
CN112904494B (zh) 一种光模块
CN102141660A (zh) 光收发一体装置
TWM603968U (zh) 光學收發模組及光纖纜線模組
TWI498619B (zh) 雙向光傳輸次組件
US10877213B2 (en) Optical module
CN210465769U (zh) 一种具有至少两路激光器的光模块
CN112904493B (zh) 一种光模块
CN115016074B (zh) 一种光模块
TWI776311B (zh) 光通訊模組
TW201323963A (zh) 光學元件封裝結構及其封裝方法
KR20110070036A (ko) 인터포저를 이용한 광전변환모듈
WO2019173999A1 (zh) 收发光器件、光模块及通讯设备
CN215072418U (zh) 一种光模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19823659

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19823659

Country of ref document: EP

Kind code of ref document: A1