WO2019237876A1 - 摄像头模组和电子装置 - Google Patents

摄像头模组和电子装置 Download PDF

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Publication number
WO2019237876A1
WO2019237876A1 PCT/CN2019/086973 CN2019086973W WO2019237876A1 WO 2019237876 A1 WO2019237876 A1 WO 2019237876A1 CN 2019086973 W CN2019086973 W CN 2019086973W WO 2019237876 A1 WO2019237876 A1 WO 2019237876A1
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WO
WIPO (PCT)
Prior art keywords
cameras
package
camera module
light
light incident
Prior art date
Application number
PCT/CN2019/086973
Other languages
English (en)
French (fr)
Inventor
陈彪
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP19819572.9A priority Critical patent/EP3767937B1/en
Publication of WO2019237876A1 publication Critical patent/WO2019237876A1/zh
Priority to US17/069,281 priority patent/US11463568B2/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B35/00—Stereoscopic photography
    • G03B35/08—Stereoscopic photography by simultaneous recording
    • G03B35/12—Stereoscopic photography by simultaneous recording involving recording of different viewpoint images in different colours on a colour film
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present application relates to the field of consumer electronic products, and in particular, to a camera module and an electronic device.
  • the embodiments of the present application provide a camera module and an electronic device.
  • the camera module includes at least two cameras, at least two of the cameras are arranged side by side, the incident optical axes of the two cameras are parallel to each other, and each of the cameras includes a reflective element 2.
  • the reflected optical axes of the two camera heads are consistent or parallel to each other.
  • the incident light is reflected by the reflective element and passes through the optical lens group to form an image on the photosensitive element.
  • the electronic device includes a casing and the camera module of the foregoing embodiment, and the camera module is disposed on the casing.
  • FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • FIG. 2 is a schematic structural diagram of a camera module according to some embodiments of the present application.
  • FIG. 3 is a schematic cross-sectional view of a camera module according to some embodiments of the present application.
  • FIG. 4 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • FIG. 5 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • FIG. 6 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • FIG. 7 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • FIG. 8 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • FIG. 9 is a schematic plan view of a camera module according to some embodiments of the present application.
  • FIG. 10 is a schematic plan view of a camera module according to some embodiments of the present application.
  • the first feature "on” or “down” of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact.
  • the first feature is “above”, “above”, and “above” the second feature.
  • the first feature is directly above or obliquely above the second feature, or it only indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature.
  • the first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.
  • An embodiment of the present application provides a camera module 10.
  • the camera module 10 includes at least two cameras 12, two cameras 12 of the at least two cameras 12 are arranged in parallel, and the incident optical axes 124 of the two cameras 12 are parallel to each other.
  • Each camera 12 includes a reflective element 121, an optical lens group 122, and a photosensitive element 123.
  • the reflected optical axes 125 of the two cameras 12 are consistent or parallel to each other.
  • the incident light is reflected by the reflection element 121 and passes through the optical lens group 122 to form an image on the light receiving element 123.
  • each camera 12 further includes a package housing 126.
  • the reflective element 121, the optical lens group 122, and the light receiving element 123 are all enclosed in a package housing 126.
  • each camera 12 further includes a package housing 126 and a receiving member 127.
  • the receiving member 127 is used for receiving the optical lens group 122.
  • the reflective element 121, the receiving member 127, and the photosensitive element 123 are all enclosed in a packaging case 126.
  • the package housing 126 includes a package substrate 1261, a package sidewall 1262, and a package top 1263.
  • the package sidewall 1262 extends from the package substrate 1261 and is connected between the package top 1263 and the package substrate 1261.
  • a light incident window 12631 is formed on the top of the package 1263, and the light incident window 12631 corresponds to the reflective element 121.
  • the light incident windows 12631 of the two cameras 12 are flush, and the package substrates 1261 of the two cameras 12 are flush.
  • the package sidewalls 1262 of the two cameras 12 are in conflict with each other; or the package sidewalls 1262 of the two cameras 12 are spaced apart.
  • a gap 12625 is defined in the package sidewall 1262.
  • Each camera 12 further includes a circuit board assembly 128 that is electrically connected to the light receiving element 123 and exposed from the notch 12625.
  • the reflecting element 121 is a prism or a mirror.
  • the reflective element 121 is a prism.
  • the reflective element 121 includes a light incident surface 1211, a light exit surface 1212, and a reflective surface 1213.
  • the light incident surface 1211 is perpendicular to the light emitting surface 1212 and corresponds to the light incident window 12631.
  • the reflecting surface 1213 is connected to the light incident surface 1211 and the light emitting surface 1212. The reflecting surface 1213 is used to reflect the light beam entered by the light incident window 12631.
  • each camera 12 further includes a supporting member 129.
  • the support members 129 are in contact with the reflective element 121 and the package housing 126, respectively.
  • an embodiment of the present application further provides an electronic device 100.
  • the electronic device 100 includes a casing 30 and the camera module 10 according to any one of the above embodiments.
  • the camera module 10 is disposed on the casing 30.
  • an electronic device 100 includes a casing 30 and a camera module 10.
  • the camera module 10 is disposed on the casing 30.
  • the electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, a smart helmet, smart glasses, or the like.
  • the embodiment of the present application uses the electronic device 100 as a mobile phone as an example for description. It can be understood that the specific form of the electronic device 100 may be other, which is not limited herein.
  • the casing 30 can be used as a mounting carrier for the camera module 10, or the camera module 10 is disposed in the casing 30.
  • the casing 30 includes a top 32 and a bottom 34, and the camera module 10 is disposed between the top 32 and the bottom 34.
  • the camera module 10 includes at least two cameras 12. Specifically, the camera module 10 may include two cameras 12, three cameras 12, four cameras 12, or more cameras 12. In the embodiment of the present application, the camera module 10 includes two cameras 12 as an example for description. Referring to FIG. 2, the two cameras 12 are arranged in parallel. One camera 12 may be a black and white camera, and the other camera 12 is an RGB camera; or one camera 12 is an infrared camera, and the other camera 12 is an RGB camera; or one camera 12 is an RGB camera, and the other camera 12 is also an RGB camera; or One camera 12 is a wide-angle camera, and the other camera 12 is a telephoto camera. With reference to FIG. 3, each camera 12 includes a reflective element 121, an optical lens group 122, and a photosensitive element 123.
  • the incident optical axis 124 of the two cameras 12 (that is, the optical axis of the light incident on the reflective element 121) is parallel to each other (as shown in FIG. 2), and the reflected optical axis 125 of the two cameras 12 (that is, the light axis of the light reflected by the reflective element 121) Optical axis) are consistent or parallel to each other.
  • the reflected optical axes 125 of the two cameras 12 mean that the reflected optical axes 125 of the two cameras 12 are on the same straight line.
  • the direction along the top 32 to the bottom 34 of the casing 30 is the first direction, and the direction perpendicular to the first direction is the second direction.
  • the two cameras 12 may be arranged along the first direction. At this time, the reflected optical axis 125 of the two cameras 12 is parallel and the direction of the reflected optical axis 125 is the second direction. The two cameras 12 are in conflict or spaced from each other. Alternatively, referring to FIG. 1, two cameras 12 are arranged along the second direction. At this time, the reflected optical axis 125 of the two cameras 12 is parallel and the direction of the reflected optical axis 125 is the first direction.
  • the two cameras 12 are in conflict with each other or interval.
  • the two cameras 12 are arranged along the second direction.
  • the reflected optical axis 125 of the two cameras 12 is consistent and the direction of the reflected optical axis 125 is the second direction.
  • the two cameras 12 are in conflict with each other or At intervals, further, the reflective elements 121 of the two cameras 12 face each other, and the photosensitive elements 123 of the two cameras 12 face each other.
  • the two cameras 12 can be arranged along the first direction. At this time, the reflected optical axes 125 of the two cameras 12 are parallel and the directions of the reflected optical axes 125 are parallel. In the second direction, the two cameras 12 are in conflict or spaced from each other. Alternatively, referring to FIG. 7, two cameras 12 are arranged along the second direction. At this time, the reflected optical axis 125 of the two cameras 12 is parallel and the direction of the reflected optical axis 125 is the first direction. The two cameras 12 are in conflict with each other or interval. Alternatively, referring to FIG. 8, the two cameras 12 are arranged along the second direction.
  • the reflected optical axis 125 of the two cameras 12 is the same and the direction of the reflected optical axis 125 is the second direction.
  • the two cameras 12 are in conflict with each other or At intervals, further, the reflective elements 121 of the two cameras 12 face each other, and the photosensitive elements 123 of the two cameras 12 face each other.
  • the camera 12 uses a periscope lens, which reduces the overall height of the camera module 10, which facilitates making the electronic device 100 thinner, and the camera 12 does not protrude out of the housing.
  • the appearance of the electronic device 100 is relatively beautiful.
  • the distance between the two cameras 12 can be set closer, such as As shown in FIG. 1, FIG. 4, FIG. 6, and FIG. 7, when the camera module 10 is used to generate stereo vision, acquire the depth of field of an image, 3D imaging, assist focusing, and motion recognition, the distance between the two cameras 12 can be set Farther, as shown in Figures 5 and 8.
  • Each camera 12 further includes a package housing 126.
  • the packaging case 126 is used to package the reflective element 121, the optical lens group 122, and the photosensitive element 123 at the same time, or the reflective element 121, the optical lens group 122, and the photosensitive element 123 are simultaneously packaged in the packaging case 126.
  • the centers of the reflective element 121, the optical lens group 122, and the photosensitive element 123 are located on the same line segment in order.
  • each camera 12 may further include a ring-shaped receiving member 127.
  • the receiving member 127 is configured to be received in the optical lens group 122 so as to fix and protect the optical lens group 122.
  • the package case 126 packages the reflective element 121, the receiving member 127, and the photosensitive element 123.
  • the package housing 126 includes a package substrate 1261, a package sidewall 1262, and a package top 1263.
  • the package substrate 1261 is used to carry the reflective element 121, the optical lens group 122, and the photosensitive element 123.
  • the package side wall 1262 is disposed around the reflective element 121, the optical lens group 122, and the light receiving element 123.
  • the package side wall 1262 extends from the package substrate 1261.
  • the package side wall 1262 can be combined with the package substrate 1261.
  • the package side wall 1262 and the package The substrate 1261 is detachably connected to facilitate the assembly of the reflective element 121, the optical lens group 122, and the photosensitive element 123.
  • the package top 1263 is opposite to the package substrate 1261, and the package top 1263 is connected to the package sidewall 1262.
  • a light incident window 12631 is formed on the top of the package 1263, and the light incident window 12631 corresponds to the reflective element 121.
  • the light outside the package housing 126 is incident on the reflective element 121 through the light incident window 12631, and is reflected by the reflective element 121, and then is formed on the photosensitive element 123 through the optical lens group 122.
  • the light entrance window 12631 may be a through hole, and the material of the top of the package 1263 is a material that is not transparent to infrared light; in another example, the top of the package 1263 is made of light that is not transparent to infrared light
  • the material and the infrared light-transmitting material are jointly manufactured.
  • the light entrance window 12631 is made of an infrared light-transmitting material, and the remaining parts are made of an infrared light-impermeable material.
  • the camera 12 further includes an infrared pass filter located between the optical lens group 122 and the light receiving element 123. The infrared pass filter is used to adjust the wavelength range of the imaging light, and is specifically used to block visible light. The infrared light is allowed to enter the photosensitive element 123.
  • the light entrance window 12631 may be a through hole, and the material of the top 1263 of the package is an opaque material; in another example, the top of the package 1263 Manufactured from opaque materials and light-transmitting materials.
  • the light entrance window 12631 is made of a light-transmitting material, and the remaining parts are made of opaque material.
  • the camera 12 further includes an infrared cut-off filter located between the optical lens group 122 and the photosensitive element 123. The infrared cut-off filter is used to adjust the wavelength range of the imaging light, and is specifically used to block infrared light. It enters the photosensitive element 123 to prevent the infrared light from affecting the color and sharpness of the normal image.
  • the light-entry windows 12631 of the two cameras 12 are flush ("flat" herein means that the height is on the same horizontal line), and the package substrates 1261 of the two cameras 12 are also flush. In this way, the heights of the two cameras 12 are the same, which is beneficial to reduce the overall height of the camera module 10, facilitates making the electronic device 100 thinner, and the appearance of the electronic device 100 is more beautiful.
  • the reflective element 121 is disposed on the light incident side of the optical lens group 122.
  • the reflecting element 121 may be a prism or a mirror. Specifically, the prism and the mirror can be used to reflect light to change the direction of the light path, and have the advantages of compact structure and small volume, which is beneficial to miniaturization of the camera module 10.
  • the type of the reflective element 121 is not limited to this, and in other embodiments, other types of reflective elements 121 may be adopted as required.
  • the embodiment of the present application is described by taking the reflecting element 121 as a prism as an example.
  • the reflecting element 121 includes a light incident surface 1211, a light emitting surface 1212, and a reflective surface 1213.
  • the light incident surface 1211 is perpendicular to the light emitting surface 1212 and corresponds to the light incident window 12631.
  • the reflecting surface 1213 is connected to the light incident surface 1211 and the light emitting surface 1212. The reflecting surface 1213 is used to reflect the light beam entered by the light incident window 12631.
  • the optical lens group 122 may include one lens or a plurality of lenses arranged coaxially in order.
  • the surface type of each lens may be any one of an aspheric surface, a spherical surface, a Fresnel surface, and a binary optical surface.
  • the lenses can be made of glass materials to solve the problem of temperature drift of the lenses when the ambient temperature changes; or the lenses are made of plastic materials to make the cost lower and facilitate mass production.
  • the photosensitive element 123 can be a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) photosensitive element or a charge-coupled device (CCD, Charge-coupled Device) photosensitive element.
  • CMOS complementary metal oxide semiconductor
  • CCD Charge-coupled Device
  • the optical lens group 122 is set on the package substrate 1261, and then the reflective element 121 and the light receiving element 123 are set on both sides of the optical lens group 122, and the optical axis of the light beam reflected by the reflective element 121 is made. It is coincident with the optical axis of the optical lens group 122 and the center normal of the light receiving element 123.
  • the package side wall 1262 is provided with a notch 12625.
  • Each camera 12 further includes a circuit board assembly 128.
  • the circuit board assembly 128 is electrically connected to the photosensitive element 123 and is exposed from the notch 12625.
  • the circuit board assembly 128 includes a circuit board 1281.
  • the circuit board 1281 may be any one of a printed circuit board (PCB), a flexible circuit board (FPC), and a rigid-soft board.
  • One end of the circuit board 1281 may be located in the package housing 126 and electrically connected to the photosensitive element 123.
  • the circuit board The other end of 1281 protrudes from the notch 12625 and is connected to the motherboard 50 of the electronic device 100.
  • the circuit board 1281 may be a rigid-soft board.
  • the hard board of the circuit board 1281 is located in the package housing 126 and is electrically connected to the photosensitive element 123.
  • the soft board of the circuit board 1281 protrudes from the notch 12625. It is connected to the motherboard 50 of the electronic device 100.
  • the light receiving element 123 performs photoelectric conversion of the incident light and outputs it to the main board 50 of the electronic device 100 through the circuit board assembly 128 for processing such as imaging.
  • the package sidewall 1262 includes a first sidewall 12621, a second sidewall 12622, a third sidewall 12623, and a fourth sidewall 12624.
  • the first sidewall 12621 is opposed to the second sidewall 12622
  • the third sidewall 12623 is opposed to the fourth sidewall 12624.
  • the first sidewall 12621 and the second sidewall 12622 are perpendicular to the reflected optical axis 125 of the camera 12, and the third sidewall 12623 and the fourth sidewall 12624 are parallel to the reflected optical axis 125 of the camera 12.
  • the third side wall 12623 of one of the cameras 12 (hereinafter referred to as the first camera 11) is provided with a notch 12625, and the circuit board assembly 128 is disposed on the first side wall 12621 and extends from the third side 12621.
  • the notch 12625 of the side wall 12623 is exposed;
  • the fourth side wall 12624 of the other camera 12 (hereinafter referred to as the second camera 13) is provided with a notch 12625, and the circuit board assembly 128 is disposed on the first side wall 12621 and extends from the fourth side wall.
  • the 12624 gap 12625 is exposed.
  • the fourth sidewall 12624 of the first camera 11 is in contact with the third sidewall 12623 of the second camera 13. As such, the volume of the camera module 10 is small, which is beneficial to miniaturization of the electronic device 100.
  • the fourth sidewall 12624 of the first camera 11 may be spaced from the third sidewall 12623 of the second camera 13.
  • the third side wall 12623 of the first camera 11 is provided with a notch 12625, and the circuit board assembly 128 is disposed on the first side wall 12621 and exposed from the notch 12625 of the third side wall 12623; the second camera
  • the fourth side wall 12624 of 13 is provided with a notch 12625, and the circuit board assembly 128 is disposed on the first side wall 12621 and exposed from the notch 12625 of the fourth side wall 12624.
  • the fourth side wall 12624 of the first camera 11 is provided with a notch 12625
  • the circuit board assembly 128 is disposed on the first side wall 12621 and exposed from the notch 12625 of the fourth side wall 12624
  • the fourth side of the second camera 13 The wall 12624 is also provided with a notch 12625
  • the circuit board assembly 128 is disposed on the first side wall 12621 and exposed from the notch 12625 of the fourth side wall 12624.
  • the third side wall 12623 of the first camera 11 is provided with a notch 12625
  • the circuit board assembly 128 is disposed on the first side wall 12621 and exposed from the notch 12625 of the third side wall 12623
  • the third side of the second camera 13 The wall 12623 is also provided with a notch 12625
  • the circuit board assembly 128 is disposed on the first side wall 12621 and is exposed from the notch 12625 of the third side wall 12623.
  • the fourth side wall 12624 of the first camera 11 is provided with a notch 12625
  • the circuit board assembly 128 is disposed on the first side wall 12621 and exposed from the notch 12625 of the fourth side wall 12624
  • the third side wall of the second camera 13 12623 is provided with a notch 12625
  • the circuit board assembly 128 is disposed on the first side wall 12621 and is exposed from the notch 12625 of the third side wall 12623.
  • the two cameras 12 when the two cameras 12 are in conflict with each other (herein, the term “conflict” refers to being close to or attached to each other), the two cameras 12 may share the mutually opposing package sidewall 1262, or the two cameras 12 use one
  • the packaging case 126 performs packaging and the like.
  • each camera 12 further includes a supporting member 129, which is in contact with the reflecting element 121 and the package housing 126, respectively. Specifically, the support member 129 abuts the package substrate 1261 and the second side wall 12622. The supporting member 129 is used to support the reflective element 121 so that the reflective element 121 maintains a predetermined inclination angle. For example, the reflective surface 1213 of the reflective element 121 and the package substrate 1261 form an included angle of 45 degrees.
  • the reflecting element 121 can be fixed on the supporting member 129 by a curable adhesive. In this way, when the camera 12 is assembled, the inclination angle of the reflecting element 121 can be adjusted by adjusting the thickness of the curable adhesive at different positions on the supporting member 129, and the adjusting method simple.
  • the curable adhesive is first coated on the surface of the support member 129 for contacting the reflective element 121, and then the reflective element 121 is disposed on the surface and the reflective element 121 is connected to the curable adhesive. 121 performs active alignment to adjust the light entering the optical lens group 122. Finally, after the active alignment of the reflective element 121 is completed, the curable glue is cured.
  • the active alignment of the reflective element 121 includes: adjusting the inclination angle of the reflective element 121 by adjusting the thickness of the curable adhesive at different positions on the support 129, so that the reflected optical axis 125 of the camera 12 and the optical lens group 122 The optical axis and the center normal of the photosensitive element 123 coincide to ensure the imaging quality of the camera 12.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, for example, two, three, unless it is specifically and specifically defined otherwise.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)
  • Cameras In General (AREA)

Abstract

一种摄像头模组(10)和电子装置(100)。摄像头模组(10)包括至少两个摄像头(12)。至少两个摄像头(12)中的两个摄像头(12)并列设置。两个摄像头(12)的入射光轴(124)互相平行。每个摄像头(12)包括反射元件(121)、光学透镜组(122)和感光元件(123)。两个摄像头(12)的反射光轴(125)一致或互相平行。入射光经反射元件(121)反射后经过光学透镜组(122)在感光元件(123)上成像。

Description

摄像头模组和电子装置
优先权信息
本申请请求2018年6月14日向中国国家知识产权局提交的、专利申请号为201820929365.6的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及消费性电子产品领域，特别涉及一种摄像头模组和电子装置。
背景技术
近几年，随着智能手机的迅速发展，对手机摄像头的设计要求越来越高。目前，手机行业中的摄像头大多数采用立式镜头。
发明内容
本申请实施方式提供一种摄像头模组和电子装置。
本申请实施方式的摄像头模组包括至少两个摄像头，至少两个所述摄像头中的两个所述摄像头并列设置，两个所述摄像头的入射光轴互相平行，每个所述摄像头包括反射元件、光学透镜组和感光元件，两个所述摄像头的反射光轴一致或互相平行，入射光经所述反射元件反射后经过所述光学透镜组在所述感光元件上成像。
本申请实施方式的电子装置包括机壳和上述实施方式的摄像头模组，所述摄像头模组设置在所述机壳上。
本申请实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点可以从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请某些实施方式的电子装置的结构示意图；
图2是本申请某些实施方式的摄像头模组的结构示意图；
图3是本申请某些实施方式的摄像头模组的截面示意图；
图4是本申请某些实施方式的电子装置的结构示意图；
图5是本申请某些实施方式的电子装置的结构示意图；
图6是本申请某些实施方式的电子装置的结构示意图；
图7是本申请某些实施方式的电子装置的结构示意图；
图8是本申请某些实施方式的电子装置的结构示意图；
图9是本申请某些实施方式的摄像头模组的平面示意图；
图10是本申请某些实施方式的摄像头模组的平面示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
请一并参阅图1至图3，本申请实施方式提供一种摄像头模组10。摄像头模组10包括至少两个摄像头12，至少两个摄像头12中的两个摄像头12并列设置，两个摄像头12的入射光轴124互相平行。每个摄像头12包括反射元件121、光学透镜组122和感光元件123。两个摄像头12的反射光轴125一致或互相平行。入射光经反射元件121反射后经过光学透镜组122在感光元件123上成像。
请参阅图2及图3，在某些实施方式中，每个摄像头12还包括封装壳体126。反射元件121、光学透镜组122及感光元件123均封装在封装壳体126内。
请参阅图3，在某些实施方式中，每个摄像头12还包括封装壳体126和收容件127。收容件127用于收容光学透镜组122。反射元件121、收容件127及感光元件123均封装在封装壳体126内。
请参阅图3，在某些实施方式中，封装壳体126包括封装基板1261、封装侧壁1262及封装顶部1263。封装侧壁1262自封装基板1261延伸并连接在封装顶部1263与封装基板1261之间。封装顶部1263形成有入光窗口12631，入光窗口12631与反射元件121对应。
请参阅图2，在某些实施方式中，两个摄像头12的入光窗口12631齐平，两个摄 像头12的封装基板1261齐平。
请参阅图2及图9，在某些实施方式中，两个摄像头12的封装侧壁1262相互抵触；或者两个摄像头12的封装侧壁1262间隔。
请参阅图2及图3，在某些实施方式中，封装侧壁1262开设有缺口12625。每个摄像头12还包括电路板组件128，电路板组件128与感光元件123电连接并自缺口12625露出。
请参阅图3，在某些实施方式中，反射元件121为棱镜或面镜。
请参阅图3，在某些实施方式中，反射元件121为棱镜。反射元件121包括入光面1211、出光面1212和反射面1213。入光面1211与出光面1212垂直并与入光窗口12631对应，反射面1213连接入光面1211和出光面1212，反射面1213用于反射由入光窗口12631进入的光束。
请参阅图3，在某些实施方式中，每个摄像头12还包括支撑件129。支撑件129分别与反射元件121及封装壳体126抵触。
请参阅图1，本申请实施方式还提供一种电子装置100。电子装置100包括机壳30和上述任一实施方式的摄像头模组10。摄像头模组10设置在机壳30上。
请参阅图1，本申请实施方式的电子装置100包括机壳30和摄像头模组10。摄像头模组10设置在机壳30上。电子装置100可以是手机、平板电脑、笔记本电脑、智能手环、智能手表、智能头盔、智能眼镜等。本申请实施方式以电子装置100是手机为例进行说明，可以理解，电子装置100的具体形式可以是其他，在此不作限制。
机壳30可以作为摄像头模组10的安装载体，或者说摄像头模组10设置在机壳30内。机壳30包括顶部32和底部34，摄像头模组10设置在顶部32和底部34之间。
摄像头模组10包括至少两个摄像头12。具体地，摄像头模组10可以包括两个摄像头12、三个摄像头12、四个摄像头12或更多个摄像头12。本申请实施方式以摄像头模组10包括两个摄像头12为例进行说明，请参阅图2，两个摄像头12并列设置。一个摄像头12可以为黑白摄像头，另外一个摄像头12为RGB摄像头；或者一个摄像头12为红外摄像头，另外一个摄像头12为RGB摄像头；或者一个摄像头12为RGB摄像头，另外一个摄像头12也为RGB摄像头；或者一个摄像头12为广角摄像头，另外一个摄像头12为长焦摄像头等。请结合图3，每个摄像头12包括反射元件121、光学透镜组122和感光元件123。两个摄像头12的入射光轴124(即入射至反射元件121的光线的光轴)互相平行(如图2所示)，两个摄像头12的反射光轴125(即反射元件121反射的光线的光轴)一致或互相平行。其中，两个摄像头12的反射光轴125一致指的是两个摄像头12的反射光轴125处于同一直线上。
具体地，假设沿机壳30的顶部32至底部34的方向为第一方向，与第一方向垂直的方向为第二方向，当摄像头模组10用于手机前置拍摄时，请参阅图4，两个摄像头12可沿第一方向排列设置，此时，两个摄像头12的反射光轴125平行且反射光轴125的方向为第二方向，两个摄像头12相互抵触或间隔。或者，请参阅图1，两个摄像头12沿第二方向排列设置，此时，两个摄像头12的反射光轴125平行且反射光轴125的方向为第一方向，两个摄像头12相互抵触或间隔。或者，请参阅图5，两个摄像头12沿第二方向排列设置，此时，两个摄像头12的反射光轴125一致且反射光轴125的方向为第二方向，两个摄像头12相互抵触或间隔，进一步地，两个摄像头12的反射元件121相背，两个摄像头12的感光元件123相对。
当摄像头模组10用于手机后置拍摄时，请参阅图6，两个摄像头12可沿第一方向排列设置，此时，两个摄像头12的反射光轴125平行且反射光轴125的方向为第二方向，两个摄像头12相互抵触或间隔。或者，请参阅图7，两个摄像头12沿第二方向排列设置，此时，两个摄像头12的反射光轴125平行且反射光轴125的方向为第一方向，两个摄像头12相互抵触或间隔。或者，请参阅图8，两个摄像头12沿第二方向排列设置，此时，两个摄像头12的反射光轴125一致且反射光轴125的方向为第二方向，两个摄像头12相互抵触或间隔，进一步地，两个摄像头12的反射元件121相背，两个摄像头12的感光元件123相对。
可以理解，目前手机行业中的摄像头大多数采用立式镜头，镜头的高度较高导致手机整机的厚度难以降低，或者摄像头会凸出于手机整机本体，影响美观。即使在一些双摄头模组中，一个摄像头采用了潜望式镜头，但其他摄像头仍为立式镜头，也无法有效较低手机整机的厚度，而且两个摄像头的镜面会有较大高度的落差，潜望式镜头必须迁就于立式镜头的高度，不利于手机整机的结构设计和外观体验。
本申请实施方式的摄像头模组10中，摄像头12均采用潜望式镜头，降低了摄像头模组10整体的高度，便于将电子装置100做得更薄，且摄像头12不会凸出于壳体外，电子装置100的外形较为美观。
当摄像头模组10用于获取两张不同的图片信息进行融合以得到高分辨率、高动态范围的图像或者用于实现光学变焦时，两个摄像头12之间的距离可设置得较近，如图1、图4、图6、图7所示，当摄像头模组10用于产生立体视觉、获取影像的景深、3D成像、辅助对焦、动作识别时，两个摄像头12之间的距离可设置得较远，如图5、图8所示。
请再次参阅图2及图3，每个摄像头12还包括封装壳体126。封装壳体126用于同时封装反射元件121、光学透镜组122和感光元件123，或者说，反射元件121、光 学透镜组122和感光元件123同时封装在封装壳体126内。本申请实施方式中，反射元件121、光学透镜组122和感光元件123的中心依次位于同一线段上。在其他实施方式中，每个摄像头12还可以包括环形的收容件127，收容件127用于收容在光学透镜组122，以对光学透镜组122起到固定和保护的作用。此时，封装壳体126封装反射元件121、收容件127和感光元件123。
封装壳体126包括封装基板1261、封装侧壁1262和封装顶部1263。封装基板1261用于承载反射元件121、光学透镜组122和感光元件123。封装侧壁1262环绕反射元件121、光学透镜组122和感光元件123设置，封装侧壁1262自封装基板1261延伸，封装侧壁1262可与封装基板1261结合，较佳地，封装侧壁1262与封装基板1261为可拆卸地连接，以便于反射元件121、光学透镜组122和感光元件123的组装。封装顶部1263与封装基板1261相对，封装顶部1263与封装侧壁1262连接。封装顶部1263形成有入光窗口12631，入光窗口12631与反射元件121对应。封装壳体126外的光线由入光窗口12631入射到反射元件121，经反射元件121反射后，再经过光学透镜组122在感光元件123上成像。
当摄像头12为红外摄像头时，在一个例子中，入光窗口12631可为通孔，封装顶部1263的制作材料为不透红外光的材料；在另一个例子中，封装顶部1263由不透红外光的材料和透红外光的材料共同制造而成，具体地，入光窗口12631由透红外光的材料制成，其余部位由不透红外光的材料制成。在本申请实施方式中，摄像头12还包括位于光学透镜组122和感光元件123之间的红外通过滤光片，红外通过滤光片用于调整成像的光线波长区段，具体用于隔绝可见光而使红外光进入感光元件123。
当摄像头12不为红外摄像头时，例如为RGB摄像头，在一个例子中，入光窗口12631可为通孔，封装顶部1263的制作材料为不透光的材料；在另一个例子中，封装顶部1263由不透光的材料和透光的材料共同制造而成，具体地，入光窗口12631由透光的材料制成，其余部位由不透光的材料制成。在本申请实施方式中，摄像头12还包括位于光学透镜组122和感光元件123之间的红外截止滤光片，红外截止滤光片用于调整成像的光线波长区段，具体用于隔绝红外光进入感光元件123，从而防止红外光对正常影像色彩与清晰度造成影响。
在某些实施方式中，两个摄像头12的入光窗口12631齐平(本文中“齐平”是指高度位于同一水平线上)，两个摄像头12的封装基板1261也齐平。如此，两个摄像头12的高度一致，有利于降低摄像头模组10整体的高度，便于将电子装置100做得更薄，且电子装置100的外形较为美观。
请参阅图3，反射元件121设置在光学透镜组122的入光侧。反射元件121可以 为棱镜或者面镜。具体地，棱镜和面镜可以用于反射光线以改变光路的方向，且具有结构紧凑，体积小的优点，有利于摄像头模组10的小型化。当然，反射元件121的种类并不限于此，在其他实施方式中，可以根据需要采用其他种类的反射元件121。本申请实施方式以反射元件121是棱镜为例进行说明，反射元件121包括入光面1211、出光面1212和反射面1213。入光面1211与出光面1212垂直并与入光窗口12631对应，反射面1213连接入光面1211和出光面1212，反射面1213用于反射由入光窗口12631进入的光束。
光学透镜组122可包括一个透镜或多个共轴依次设置的透镜。每个透镜的面型可以为非球面、球面、菲涅尔面、二元光学面中的任意一种。透镜可均由玻璃材质制成，以解决环境温度变化时透镜会产生温漂现象的问题；或者透镜均由塑料材质制成，以使得成本较低、便于量产。
感光元件123可以采用互补金属氧化物半导体(CMOS，Complementary Metal Oxide Semiconductor)感光元件或者电荷耦合元件(CCD，Charge-coupled Device)感光元件。
在组装上述摄像头12时，先将光学透镜组122设置在封装基板1261上，再将反射元件121和感光元件123设置在光学透镜组122的两侧，并使得反射元件121反射的光束的光轴与光学透镜组122的光轴及感光元件123的中心法线重合。
请参阅图2及图3，在某些实施方式中，封装侧壁1262开设有缺口12625，每个摄像头12还包括电路板组件128，电路板组件128与感光元件123电连接并自缺口12625露出。电路板组件128包括电路板1281。电路板1281可以是印刷电路板(PCB)、柔性电路板(FPC)、软硬结合板的任意一种，电路板1281的一端可以位于封装壳体126内并与感光元件123电连接，电路板1281的另一端自缺口12625伸出并与电子装置100的主板50连接。在本申请实施方式中，电路板1281可以为软硬结合板，其中，电路板1281的硬板位于封装壳体126内并与感光元件123电连接，电路板1281的软板自缺口12625伸出并与电子装置100的主板50连接。感光元件123将入射的光线进行光电转换后通过电路板组件128输出到电子装置100的主板50中进行成像等处理。
请结合图9，封装侧壁1262包括第一侧壁12621、第二侧壁12622、第三侧壁12623和第四侧壁12624。第一侧壁12621与第二侧壁12622相对，第三侧壁12623与第四侧壁12624相对。第一侧壁12621和第二侧壁12622与摄像头12的反射光轴125垂直，第三侧壁12623和第四侧壁12624与摄像头12的反射光轴125平行。
在如图9所示的示例中，其中一个摄像头12(以下称为第一摄像头11)的第三 侧壁12623开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第三侧壁12623的缺口12625露出；另外一个摄像头12(以下称为第二摄像头13)的第四侧壁12624开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第四侧壁12624的缺口12625露出。第一摄像头11的第四侧壁12624与第二摄像头13的第三侧壁12623抵触。如此，摄像头模组10的体积较小，有利于电子装置100的小型化。
当然，在某些实施方式中，第一摄像头11的第四侧壁12624可与第二摄像头13的第三侧壁12623间隔。此时，请参阅图10，第一摄像头11的第三侧壁12623开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第三侧壁12623的缺口12625露出；第二摄像头13的第四侧壁12624开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第四侧壁12624的缺口12625露出。或者，第一摄像头11的第四侧壁12624开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第四侧壁12624的缺口12625露出，而第二摄像头13的第四侧壁12624也开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第四侧壁12624的缺口12625露出。或者，第一摄像头11的第三侧壁12623开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第三侧壁12623的缺口12625露出，而第二摄像头13的第三侧壁12623也开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第三侧壁12623的缺口12625露出。或者第一摄像头11的第四侧壁12624开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第四侧壁12624的缺口12625露出，而第二摄像头13的第三侧壁12623开设有缺口12625，电路板组件128设置在第一侧壁12621上并自第三侧壁12623的缺口12625露出。
在某些实施方式中，当两个摄像头12相互抵触(本文中“抵触”是指靠近或贴合)时，两个摄像头12可以共用相互抵触的封装侧壁1262，或者两个摄像头12采用一个封装壳体126进行封装等。
请一并参阅图3及图9，在某些实施方式中，每个摄像头12还包括支撑件129，支撑件129分别与反射元件121及封装壳体126抵触。具体地，支撑件129与封装基板1261和第二侧壁12622抵触。支撑件129用于支撑反射元件121，以使得反射元件121保持预定倾斜角度，例如，使得反射元件121的反射面1213与封装基板1261形成45度夹角。
反射元件121可通过可固化胶固定在支撑件129上，如此，在组装摄像头12时，可以通过调整可固化胶在支撑件129上不同位置的厚度来调整反射元件121的倾斜角度，并且调整方法简单。
具体地，先将可固化胶涂布于支撑件129的用于与反射元件121抵触的表面，然后将反射元件121设置在该表面上并使得反射元件121与可固化胶连接，再对反射元件121进行主动对位以调校进入光学透镜组122的光线，最后在反射元件121主动对位完成后，固化可固化胶。其中，对反射元件121进行主动对位包括：通过调整可固化胶在支撑件129上不同位置的厚度来调整反射元件121的倾斜角度，以使得摄像头12的反射光轴125与光学透镜组122的光轴及感光元件123的中心法线重合，以确保摄像头12的成像质量。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种摄像头模组，其特征在于，所述摄像头模组包括至少两个摄像头，至少两个所述摄像头中的两个所述摄像头并列设置，两个所述摄像头的入射光轴互相平行，每个所述摄像头包括反射元件、光学透镜组和感光元件，两个所述摄像头的反射光轴一致或互相平行，入射光经所述反射元件反射后经过所述光学透镜组在所述感光元件上成像。
  2. 根据权利要求1所述的摄像头模组，其特征在于，每个所述摄像头还包括封装壳体，所述反射元件、所述光学透镜组及所述感光元件均封装在所述封装壳体内。
  3. 根据权利要求1所述的摄像头模组，其特征在于，每个所述摄像头还包括封装壳体和收容件，所述收容件用于收容所述光学透镜组，所述反射元件、所述收容件及所述感光元件均封装在所述封装壳体内。
  4. 根据权利要求2或3所述的摄像头模组，其特征在于，所述封装壳体包括封装基板、封装侧壁及封装顶部，所述封装侧壁自所述封装基板延伸并连接在所述封装顶部与所述封装基板之间，所述封装顶部形成有入光窗口，所述入光窗口与所述反射元件对应。
  5. 根据权利要求4所述的摄像头模组，其特征在于，两个所述摄像头的所述入光窗口齐平，两个所述摄像头的封装基板齐平。
  6. 根据权利要求4所述的摄像头模组，其特征在于，两个所述摄像头的所述封装侧壁相互抵触；或者
    两个所述摄像头的所述封装侧壁间隔。
  7. 根据权利要求4所述的摄像头模组，其特征在于，所述封装侧壁开设有缺口，每个所述摄像头还包括电路板组件，所述电路板组件与所述感光元件电连接并自所述缺口露出。
  8. 根据权利要求1所述的摄像头模组，其特征在于，所述反射元件为棱镜或面镜。
  9. 根据权利要求4所述的摄像头模组，其特征在于，所述反射元件为棱镜，所述反射元件包括入光面、出光面和反射面，所述入光面与所述出光面垂直并与所述入光窗口对应，所述反射面连接所述入光面和所述出光面，所述反射面用于反射由所述入光窗口进入的光束。
  10. 根据权利要求2或3所述的摄像头模组，其特征在于，每个所述摄像头还包括支撑件，所述支撑件分别与所述反射元件及所述封装壳体抵触。
  11. 一种电子装置，其特征在于，包括：
    机壳；和
    摄像头模组，所述摄像头模组设置在所述机壳上，所述摄像头模组包括至少两个摄像头，至少两个所述摄像头中的两个所述摄像头并列设置，两个所述摄像头的入射光轴互相平行，每个所述摄像头包括反射元件、光学透镜组和感光元件，两个所述摄像头的反射光轴一致或互相平行，入射光经所述反射元件反射后经过所述光学透镜组在所述感光元件上成像。
  12. 根据权利要求11所述的电子装置，其特征在于，每个所述摄像头还包括封装壳体，所述反射元件、所述光学透镜组及所述感光元件均封装在所述封装壳体内。
  13. 根据权利要求11所述的电子装置，其特征在于，每个所述摄像头还包括封装壳体和收容件，所述收容件用于收容所述光学透镜组，所述反射元件、所述收容件及所述感光元件均封装在所述封装壳体内。
  14. 根据权利要求12或13所述的电子装置，其特征在于，所述封装壳体包括封装基板、封装侧壁及封装顶部，所述封装侧壁自所述封装基板延伸并连接在所述封装顶部与所述封装基板之间，所述封装顶部形成有入光窗口，所述入光窗口与所述反射元件对应。
  15. 根据权利要求14所述的电子装置，其特征在于，两个所述摄像头的所述入光窗口齐平，两个所述摄像头的封装基板齐平。
  16. 根据权利要求14所述的电子装置，其特征在于，两个所述摄像头的所述封装侧壁相互抵触；或者
    两个所述摄像头的所述封装侧壁间隔。
  17. 根据权利要求14所述的电子装置，其特征在于，所述封装侧壁开设有缺口，每个所述摄像头还包括电路板组件，所述电路板组件与所述感光元件电连接并自所述缺口露出。
  18. 根据权利要求11所述的电子装置，其特征在于，所述反射元件为棱镜或面镜。
  19. 根据权利要求14所述的电子装置，其特征在于，所述反射元件为棱镜，所述反射元件包括入光面、出光面和反射面，所述入光面与所述出光面垂直并与所述入光窗口对应，所述反射面连接所述入光面和所述出光面，所述反射面用于反射由所述入光窗口进入的光束。
  20. 根据权利要求12或13所述的电子装置，其特征在于，每个所述摄像头还包括支撑件，所述支撑件分别与所述反射元件及所述封装壳体抵触。
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