WO2019225982A1 - Thermosyphon having curved perforated plate - Google Patents

Thermosyphon having curved perforated plate Download PDF

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Publication number
WO2019225982A1
WO2019225982A1 PCT/KR2019/006197 KR2019006197W WO2019225982A1 WO 2019225982 A1 WO2019225982 A1 WO 2019225982A1 KR 2019006197 W KR2019006197 W KR 2019006197W WO 2019225982 A1 WO2019225982 A1 WO 2019225982A1
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curved
thermosiphon
heat transfer
evaporator
liquid
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PCT/KR2019/006197
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French (fr)
Korean (ko)
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김석광
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에스디(주)
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Definitions

  • the present invention relates to the expansion of the heat transfer area of a thermosiphon, and more particularly, to a technology for promoting heat transfer by increasing the heat transfer area in an evaporation part and a condensation part of a thermosiphon.
  • thermosyphon is a continuous transfer of heat through the boiling and condensation of the working fluid.
  • the working fluid continuously flows between the two ends of the vessel through a phase-change process between vapor and liquid at a relatively low temperature. It absorbs and releases a large amount of heat with a small temperature difference.
  • the heat return is performed by the wick of the liquid, and the heat return by the gravity is called thermosiphon. Also known as heat pipe.
  • thermosiphon theoretically has thousands of times higher effective thermal conductivity than copper, so it is not only required for cooling electronic devices with a large amount of heat generated per unit area, or for cooling high-heating electronic equipment of eco-friendly vehicles, but also for industrial facilities and household boilers, some of which are used for high temperature waste heat. Although it is recovered and used in the case of the low-temperature waste heat, a high-efficiency heat exchanger is required.
  • thermosiphons have different temperatures and densities depending on the distance between the heating part of the evaporator and the fluid, and act as a combination of the boiling mechanism of the internal working fluid and the gas-liquid flow to change the local heat transfer characteristics.
  • the liquid pool there is a problem of stabilization due to flow oscillation occurring in the liquid pool toward the condensation part, causing slow start-up and mixing of vaporized vapor and dropped droplets.
  • the greater the greater the effect the greater the heat transfer efficiency.
  • thermosiphon is reduced by reducing the flow vibration when the thermosiphon is maintained at a constant inclination angle according to the working fluid and shape, and reducing the phenomenon that a part of the liquid film is sucked into the vapor flow field in the form of droplets. It was possible to improve the heat transfer performance.
  • thermosiphons using nanofluids containing nanometal particles Prior art for improving the performance of thermosiphons using nanofluids containing nanometal particles is disclosed in ⁇ Patent Publication No. 10-2005-0017738, Name / Two-phase flow vertical rod thermosiphon using nanofluids ''. It is started.
  • nanofluids are expected to increase heat transfer area and improve performance such as effective conductivity and boiling promotion
  • nanoparticles are deposited on the surface to reduce the boiling heat transfer coefficient, and due to precipitation and agglomeration of nanopowders It is becoming a problem to be solved.
  • An object of the present invention is to increase the heat transfer area in the evaporator and the condenser to increase the heat transfer efficiency.
  • Another object of the present invention is to prevent the vaporized vapor and condensed droplets are mixed with the vaporized vapor in the evaporation unit while falling.
  • Another object of the present invention is to prevent the flow vibration of the gas-liquid due to the load change in the evaporator.
  • the present invention is a means for solving the above problems by installing a plurality of curved perforated plate at the upper and lower intervals in the evaporation portion of the thermosiphon to expand the heat transfer area to increase the heat transfer efficiency and to disperse local high temperature superheat, • Take techniques to prevent liquid from flowing to the upper layer.
  • thermosiphon by installing a plurality of curved perforated plate at intervals up and down at the condensation portion of the thermosiphon, a technology for expanding the heat transfer area to increase the latent heat of condensation.
  • the heat transfer area is increased in the same volume, thereby increasing the latent heat of evaporation and condensation and increasing heat transfer efficiency.
  • the curved perforated plate in the evaporator is uniform in temperature of the working fluid to disperse local high temperature superheat, the gas-liquid flows to the upper layer, it is stabilized in a relatively short time by preventing the oscillation vibration and has a feature that is quick to start .
  • the vaporized vapor and the condensed droplets are dropped and mixed with the vaporized vapor in the evaporator to provide an effect that can prevent the reduction in heat transfer efficiency.
  • FIG. 2 is a front sectional view showing the internal structure of the thermosiphon of the present invention
  • Figure 3 is a plan cross-sectional view of the installation state of the curved porous plate of the present invention
  • the evaporator 20 the heat insulating portion 30, the condensation portion 40, as a component of the plurality of curved porous plate 50 You can see that it is easy.
  • the present invention is to enlarge the heat transfer area of the evaporation unit 20 and the condensation unit 40 of the thermosiphon to improve the heat transfer efficiency, it is operated in the interior of the closed metal tube 10 having good thermal conductivity The fluid is filled and sealed in a vacuum state.
  • the hermetic pipe 10 is divided into an evaporator 20, a condenser 40, and an insulation part 30 connecting the evaporator 20 and the condenser 40 to change the phase of the working fluid. It is a device that transfers heat from the heat source (Heat Source, 1) to the heat sink (Heat Sink).
  • the working fluid When heat is applied to the working fluid in the evaporator 20 through the outer wall of the sealed tube 10, the working fluid causes boiling to evaporate and the vaporized working fluid is higher than the steam of the condensation part 40, thereby causing the temperature difference.
  • the pressure difference is transferred to the condensation unit 40 via the heat insulation unit 30.
  • the heat insulating part 30 blocks the outflow of heat from the inside when the working fluid vaporized in the evaporator 20 moves to the condensation part 40.
  • the heat insulating part 30 may be omitted when the distance between the evaporator 20 and the condenser 40 is short.
  • the vapor transferred to the condenser 40 discharges heat from the wall surface of the condenser 40 of the closed tube 10 and condenses to the inner wall of the closed tube 10 by gravity toward the evaporator 20. In return, heat transfer is achieved by repeating this evaporation and condensation process.
  • the porous plate is composed of a curved porous plate 50 having a uniform radius of curvature.
  • the plurality of curved porous plates 50 installed on the inner wall and the inner side of the evaporator 20 are conducted from the heat source of the outer wall of the evaporator to evaporate.
  • the area is enlarged to increase the amount of convective heat transfer of the working fluid, and the evaporation effect can be greatly improved by uniformly heating.
  • the curved porous plate 50 transfers heat to the working fluid by conduction at the outer surface of the evaporator 20 to prevent local high temperature overheating by increasing the convective area, thereby preventing the gas-liquid from the liquid pool 60. It is also possible to prevent oscillating oscillation toward the condensation unit.
  • the vapor evaporated in the evaporator 20 is introduced into the condenser 40 after passing through the heat insulator 30, and the steam introduced into the condenser 40 is cooled in an inner wall having a relatively low temperature to release heat. And condense to liquid.
  • the inner circumferential surface of the condensation unit 40 passes through the inner surface of the condensation unit 40 and the plurality of curved porous plates 50a by additionally incorporating a technology in which a plurality of curved porous plates 50a are installed at vertical intervals.
  • the curved porous plate 50a installed in the condensation unit 40 in the process of being condensed while providing a special effect of dissipating a large amount of heat on the outer circumferential surface while increasing the amount of condensation heat is increased.
  • a plurality of curved porous plates 50 and 50a installed in the evaporator 20 and the condenser 40 are formed with curved surfaces 51 which are convex toward the upper center, as shown in FIGS. 2 to 4.
  • a plurality of vapor holes 52 are formed in the part 51, and a plurality of liquid holes 53 are radially penetrated through the outer circumferential surface of the curved part 51 at equal intervals, and the liquid holes 53 are sealed. It is installed to contact the inner surface of the tube (10).
  • the liquid hole 53 is preferably larger in diameter than the vapor hole 52 so that the liquid can be sufficiently returned from the condenser to the evaporator.
  • the liquid condensed while passing through the curved porous plate 50a is guided to the inner wall of the condensation unit 40 along the curved portion 51 and then flows down the inner wall, passing through the liquid hole 53, and sequentially insulated.
  • the portion 30 may be recovered to the evaporator 20 by gravity.
  • the curved porous plate 50, 50a of the present invention is not the vapor hole 52 and the liquid hole 53 is not located on the same line up and down, and alternately arranged alternately alternately in the vertical direction as shown in FIG.
  • the vaporized vapor and the condensed droplets are prevented from mixing with the vaporized vapor in the evaporator 20, the curved porous plate 50 in the evaporator 20 to uniform the temperature of the working fluid to a local high temperature It disperses the superheat and not only prevents the gas-liquid from flowing to the upper layer but also provides a special effect of preventing oscillation vibration.
  • the present invention prevents flow and vibration while uniformly heating the working fluid in the evaporator 20 by installing the curved porous plates 50 and 50a in the thermosiphon, and the rate of change of temperature with time, evaporation and condensation Large latent heat allows for efficient mass heat transport.
  • the increase in the convective area is characterized by stabilization in a relatively short time and rapid start-up when heated from a heat source by making the temperature of the working fluid uniform in the evaporator.
  • heat source 10 airtight tube
  • condensation unit 50, 50a curved porous plate

Abstract

The present invention relates to the expansion of a heat transfer area of a thermosyphon having a curved perforated plate and, more particularly, to a technology for promoting heat transfer by increasing a heat transfer area in evaporation and condensation portions of a thermosyphon. A thermosyphon disclosed in the conventional art has a problem in stabilizing as the local heat transfer characteristics are varied such that gas-liquid is entrained in a liquid pool of an evaporation portion and a flow vibration is generated toward a condensation portion, thereby resulting in slow startup and mixing of vaporized vapor and dropped droplets, and this phenomenon is more affected as the heating load is more greatly changed, thereby causing a problem of the heat transfer efficiency being greatly reduced. In order to solve the problems, a technology is devised in which a plurality of curved perforated plates are installed at intervals of up and down in the evaporation portion of the thermosyphon to expand the heat transfer area to increase the heat transfer efficiency and to disperse local high temperature superheat, thereby preventing the gas-liquid from flowing to an upper layer portion.

Description

곡면 다공판을 구비한 열사이펀Thermosiphons with curved perforated plates
본 발명은 열사이펀의 전열면적 확대에 관한 것으로, 특히 열사이펀의 증발부와 응축부에서 전열면적을 증대시켜 열전달을 촉진하는 기술에 관한 것이다.The present invention relates to the expansion of the heat transfer area of a thermosiphon, and more particularly, to a technology for promoting heat transfer by increasing the heat transfer area in an evaporation part and a condensation part of a thermosiphon.
열사이펀(thermosyphon)은 작동유체의 비등과 응축을 통해 열을 연속적으로 전달하는 것으로 밀폐용기 내부를 진공으로 하면 비교적 낮은 온도에서 작동유체가 연속적으로 증기-액체간의 상변화과정을 통하여 용기양단 사이에 작은 온도차로 대량의 열을 흡수하고 방출하는 것으로, 액체의 귀환이 윅(wick)에 의해 이루어지는 경우를 히트파이프(heat pipe), 액체의 귀환이 중력에 의해서 귀환하는 경우를 열사이펀(thermosyphon)이라 하며 통칭하여 히트파이프(heat pipe)라고도 한다. Thermosiphon (thermosyphon) is a continuous transfer of heat through the boiling and condensation of the working fluid. When the inside of the closed container is vacuumed, the working fluid continuously flows between the two ends of the vessel through a phase-change process between vapor and liquid at a relatively low temperature. It absorbs and releases a large amount of heat with a small temperature difference. The heat return is performed by the wick of the liquid, and the heat return by the gravity is called thermosiphon. Also known as heat pipe.
상기 열사이펀은 이론적으로 구리보다 유효 열전도율이 수천 배로 높기 때문에 단위면적당 발열량이 큰 전자장비 냉각이나, 친환경자동차의 고발열 전자 장비들의 냉각에 필요할 뿐만 아니라, 산업체의 설비 및 가정용 보일러 등에서 일부는 고온 폐열의 경우 회수 및 이용하고 있으나, 중저온 폐열의 경우 버려지고 있기 때문에 고효율 열교환기가 요구되고 있다.The thermosiphon theoretically has thousands of times higher effective thermal conductivity than copper, so it is not only required for cooling electronic devices with a large amount of heat generated per unit area, or for cooling high-heating electronic equipment of eco-friendly vehicles, but also for industrial facilities and household boilers, some of which are used for high temperature waste heat. Although it is recovered and used in the case of the low-temperature waste heat, a high-efficiency heat exchanger is required.
그러나 기존의 열사이펀은 증발부의 가열부 표면과 유체의 거리에 따라 온도 및 밀도가 다르고 내부 작동 유체의 비등 메커니즘과 기-액 유동 등 복합적으로 작용하여 국부적인 열전달 특성을 변화시켜 증발부의 액체 풀(liquid pool)에서 기-액이 동반하여 응축부를 향해 유동 진동이 발생하여 안정화하는데 문제가 있어 시동이 느리고, 기화된 증기와 낙하한 액적(droplet)이 혼합되는 현상이 발생하는데, 이것은 가열부하 변화가 클수록 큰 영향을 받아 열전달 효율을 크게 감소하는 문제점이 있었다.However, conventional thermosiphons have different temperatures and densities depending on the distance between the heating part of the evaporator and the fluid, and act as a combination of the boiling mechanism of the internal working fluid and the gas-liquid flow to change the local heat transfer characteristics. In the liquid pool, there is a problem of stabilization due to flow oscillation occurring in the liquid pool toward the condensation part, causing slow start-up and mixing of vaporized vapor and dropped droplets. There was a problem in that the greater the greater the effect, the greater the heat transfer efficiency.
따라서 기존에 열사이펀 성능을 향상시키기 위한 연구에서 작동유체 및 형태에 따라 열사이펀을 일정한 경사각으로 유지했을 때 유동진동을 감소시키고 액막의 일부가 액적상태로 증기 유동장내로 흡입되는 현상을 감소시켜 열사이펀의 열전달 성능을 향상시킬 수 있었다.Therefore, in the past studies to improve the thermosiphon performance, the thermosiphon is reduced by reducing the flow vibration when the thermosiphon is maintained at a constant inclination angle according to the working fluid and shape, and reducing the phenomenon that a part of the liquid film is sucked into the vapor flow field in the form of droplets. It was possible to improve the heat transfer performance.
「조동현, 이종선, 경사 열사이폰 열교환기의 비등열전달 성능에 관한 연구, 한국산학기술학회논문지, Vol.6, No. 2, pp. 202-209, 2005“A Study on the Boiling Heat Transfer Performance of Inclined Thermosiphon Heat Exchanger, Journal of the Korean Academic Industrial Society, Vol. 6, No. 2, pp. 202-209, 2005
K. S. Ong, W. L. Tong, J. S. Gan, N. Hisham, Axial temperature distribution and performance of R410a and water filled thermosyphon at various fill ratios and inclinations, Frontiers in Heat Pipes, 5-2, 2014」K. S. Ong, W. L. Tong, J. S. Gan, N. Hisham, Axial temperature distribution and performance of R410a and water filled thermosyphon at various fill ratios and inclinations, Frontiers in Heat Pipes, 5-2, 2014 ''
그러나 최적의 경사각을 유지하더라도 비등열전달의 성능향상에는 한계가 있으며, 증발부 및 응축부에서 작동유체와 전열면의 접촉 면적이 한정되어 있기 때문에 이를 극복하기 위해 나노유체를 적용하여 열전달 성능을 향상시키기 연구가 진행되고 있다.However, even if the optimum inclination angle is maintained, the performance of boiling heat transfer is limited, and since the contact area between the working fluid and the heat transfer surface is limited in the evaporator and the condenser, the nanofluid is applied to improve the heat transfer performance. Research is ongoing.
나노금속입자가 함유된 나노유체를 이용하여 열사이펀의 성능을 향상시키기 위한 선행기술로는 「특허공개 제10-2005-0017738호, 명칭/ 나노유체를 이용한 2상 유동 수직막대형 서모사이펀」이 개시되고 있다. Prior art for improving the performance of thermosiphons using nanofluids containing nanometal particles is disclosed in `` Patent Publication No. 10-2005-0017738, Name / Two-phase flow vertical rod thermosiphon using nanofluids ''. It is started.
그러나 나노유체는 열전달 면적을 증가시키고 유효전도성 및 비등촉진 등의 성능향상을 예상하지만, 실제 열교환 시스템에서 나노입자들이 표면에 침착되어 비등열전달 계수가 감소하고, 나노분말의 침전과 뭉침 현상으로 인하여 향후 해결해야할 문제점으로 되고 있다.However, although nanofluids are expected to increase heat transfer area and improve performance such as effective conductivity and boiling promotion, in the actual heat exchange system, nanoparticles are deposited on the surface to reduce the boiling heat transfer coefficient, and due to precipitation and agglomeration of nanopowders It is becoming a problem to be solved.
「M.M. Sarafraz, F. Hormozi, S.M. Peyghambarzadeh, Role of nanofluid fouling on thermal performance of a thermosyphon: Are nanofluids reliable working fluid?, Applied Thermal Engineering 82, 212-224, 2015.`` M.M. Sarafraz, F. Hormozi, S.M. Peyghambarzadeh, Role of nanofluid fouling on thermal performance of a thermosyphon: Are nanofluids reliable working fluid ?, Applied Thermal Engineering 82, 212-224, 2015.
김우중, 양용우, 김영훈, 박성식, 김남진, 나노유체에서 파울링 현상이 유동 비등 열전달에 미치는 영향에 대한 연구, 설비공학논문집 Vol.28, No.03, 95-102, 2016.」Kim, Woo-Joong, Yang-Woo Yang, Young-Hoon Kim, Sung-Sik Park, Nam-Jin Kim, A Study on the Effect of Fouling Phenomenon on the Flow Boiling Heat Transfer in Nanofluids, Vol.28, No.03, 95-102, 2016.
본 발명의 주목적은 증발부 및 응축부에서 전열면적을 증가시켜 열전달 효율을 증가시키는데 있다.An object of the present invention is to increase the heat transfer area in the evaporator and the condenser to increase the heat transfer efficiency.
아울러, 본 발명의 다른 목적은 기화된 증기와 응축된 액적이 낙하하면서 증발부에서 기화된 증기와 혼합되는 것을 방지하는데 있다.In addition, another object of the present invention is to prevent the vaporized vapor and condensed droplets are mixed with the vaporized vapor in the evaporation unit while falling.
또한, 본 발명의 다른 목적은 증발부에서 부하변동으로 인한 기-액의 유동진동을 방지하는데 있다. In addition, another object of the present invention is to prevent the flow vibration of the gas-liquid due to the load change in the evaporator.
본 발명은 상기한 과제를 해결하기 위한 수단으로 열사이펀의 증발부에 상하 간격을 두고 다수의 곡면 다공판을 설치하여 전열면적을 확장시켜 열전달 효율을 증대함과 아울러 국부적 고열과열을 분산시키고, 기-액이 상층부로 유동됨을 방지하도록 하는 기술을 강구한다.The present invention is a means for solving the above problems by installing a plurality of curved perforated plate at the upper and lower intervals in the evaporation portion of the thermosiphon to expand the heat transfer area to increase the heat transfer efficiency and to disperse local high temperature superheat, • Take techniques to prevent liquid from flowing to the upper layer.
또한, 열사이펀의 응축부에 상하 간격을 두고 다수의 곡면 다공판을 설치하여 전열면적을 확장시켜 응축잠열을 높일 수 있도록 하는 기술을 강구한다.In addition, by installing a plurality of curved perforated plate at intervals up and down at the condensation portion of the thermosiphon, a technology for expanding the heat transfer area to increase the latent heat of condensation.
본 발명에 따르면, 증발부 및 응축부에 다수의 곡면 다공판이 설치됨으로써 동일 체적에서 전열면적이 확대되어 증발 및 응축잠열이 증가하고 열전달 효율을 증대시키는 효과가 있다.According to the present invention, since a plurality of curved porous plates are installed in the evaporator and the condenser, the heat transfer area is increased in the same volume, thereby increasing the latent heat of evaporation and condensation and increasing heat transfer efficiency.
또한, 상기 증발부에서 곡면 다공판은 작동유체의 온도를 균일하게 하여 국부적 고열 과열을 분산시키고, 기-액이 상층부로 유동하여, 요동 진동을 방지함으로써 비교적 단시간에 안정화되고 시동이 빠른 특징이 있다.In addition, the curved perforated plate in the evaporator is uniform in temperature of the working fluid to disperse local high temperature superheat, the gas-liquid flows to the upper layer, it is stabilized in a relatively short time by preventing the oscillation vibration and has a feature that is quick to start .
아울러, 기화된 증기와 응축된 액적이 낙하하면서 증발부에서 기화된 증기와 혼합되어 열전달 효율을 감소하는 것을 방지할 수 있는 효과를 제공한다.In addition, the vaporized vapor and the condensed droplets are dropped and mixed with the vaporized vapor in the evaporator to provide an effect that can prevent the reduction in heat transfer efficiency.
도 1은 본 발명 열사이펀의 증기 및 액체의 흐름도1 is a flow chart of the vapor and liquid of the present invention thermosiphon
도 2는 본 발명 열사이펀의 내부구조를 나타낸 정단면도Figure 2 is a front sectional view showing the internal structure of the thermosiphon of the present invention
도 3은 본 발명 곡면 다공판의 설치상태 평단면도Figure 3 is a plan cross-sectional view of the installation state of the curved porous plate of the present invention
도 4는 본 발명 곡면 다공판의 평면도4 is a plan view of the curved porous plate of the present invention
본 발명이 해결하고자 하는 과제의 해결수단을 보다 구체적으로 구현하기 위한 바람직한 실시 예에 대하여 설명하기로 한다.A preferred embodiment for more specifically implementing the solution of the problem to be solved by the present invention will be described.
본 발명의 바람직한 실시 예에 따른 전체적인 구성을 첨부된 도면에 의거 개략적으로 살펴보면, 증발부(20), 단열부(30), 응축부(40), 다수의 곡면 다공판(50)의 구성요소로 대분됨을 확인할 수 있다.Looking at the overall configuration according to the preferred embodiment of the present invention based on the accompanying drawings, the evaporator 20, the heat insulating portion 30, the condensation portion 40, as a component of the plurality of curved porous plate 50 You can see that it is easy.
이하, 상기 개략적인 구성으로 이루어진 본 발명을 실시 용이하도록 좀더 상세하게 설명하기로 한다.Hereinafter, the present invention made of the schematic configuration will be described in more detail.
본 발명은 열사이펀의 증발부(20) 및 응축부(40)의 전열면적을 확대하여 열전달 효율을 향상함을 특징적인 요지로 하는 것으로, 열전도성이 좋은 금속재 밀폐관(10)의 내부에 작동유체를 충전하고 진공상태로 밀봉 처리한 구조를 이루고 있다.The present invention is to enlarge the heat transfer area of the evaporation unit 20 and the condensation unit 40 of the thermosiphon to improve the heat transfer efficiency, it is operated in the interior of the closed metal tube 10 having good thermal conductivity The fluid is filled and sealed in a vacuum state.
상기 밀폐관(10)은 증발부(20)와, 응축부(40)와, 상기 증발부(20)와 응축부(40)를 연결하는 단열부(30)로 구분되며 작동유체의 상변화를 통해 열원(Heat Source, 1)으로부터 방열부(Heat Sink)로 열을 전달하는 장치이다.The hermetic pipe 10 is divided into an evaporator 20, a condenser 40, and an insulation part 30 connecting the evaporator 20 and the condenser 40 to change the phase of the working fluid. It is a device that transfers heat from the heat source (Heat Source, 1) to the heat sink (Heat Sink).
밀폐관(10) 외벽을 통해 증발부(20) 내의 작동유체에 열이 가해지면 작동유체는 비등을 일으켜 기화시키고 기화된 작동유체는 응축부(40)의 증기보다 온도가 높으므로 온도차에 의해 유발되는 압력차로 단열부(30)를 거쳐 응축부(40)로 이송된다.When heat is applied to the working fluid in the evaporator 20 through the outer wall of the sealed tube 10, the working fluid causes boiling to evaporate and the vaporized working fluid is higher than the steam of the condensation part 40, thereby causing the temperature difference. The pressure difference is transferred to the condensation unit 40 via the heat insulation unit 30.
상기 단열부(30)는 증발부(20)에서 기화한 작동유체가 응축부(40)로 이동할 때 내부로부터 열의 유출을 차단한다.The heat insulating part 30 blocks the outflow of heat from the inside when the working fluid vaporized in the evaporator 20 moves to the condensation part 40.
그러나 단열부(30)는 증발부(20)와 응축부(40)의 사이의 거리가 짧은 경우에는 생략할 수 있다.However, the heat insulating part 30 may be omitted when the distance between the evaporator 20 and the condenser 40 is short.
상기 응축부(40)로 이송된 증기는 밀폐관(10)의 응축부(40) 벽면에서 열을 방출하고 응축되어 중력에 의해 상기 밀폐관(10)의 내벽을 타고 상기 증발부(20) 쪽으로 귀환하며, 이러한 증발과 응축과정을 반복하면서 열전달이 이루어진다.The vapor transferred to the condenser 40 discharges heat from the wall surface of the condenser 40 of the closed tube 10 and condenses to the inner wall of the closed tube 10 by gravity toward the evaporator 20. In return, heat transfer is achieved by repeating this evaporation and condensation process.
상기 증발부(20)의 내주면에는 본 발명의 핵심기술인 다수의 다공판이 상하 간격을 두고 설치된다. 바람직하게는 상기 다공판은 일전한 곡률 반경을 가지는 곡면 다공판(50)으로 이루어진다.On the inner circumferential surface of the evaporator 20, a plurality of porous plates, which are the core technologies of the present invention, are installed at vertical intervals. Preferably, the porous plate is composed of a curved porous plate 50 having a uniform radius of curvature.
이러한 본 발명은 상기 열원(1)이 증발부(30)의 외측면을 가열하면 증발부(20)의 내벽 및 내측에 설치된 다수의 곡면 다공판(50)은 증발부 외벽의 열원으로부터 전도되어 증발면적이 확대되어 작동유체의 대류 열전달량이 증가하고, 균일하게 가열함으로써 증발효과를 크게 향상시킬 수 있다.According to the present invention, when the heat source 1 heats the outer surface of the evaporator 30, the plurality of curved porous plates 50 installed on the inner wall and the inner side of the evaporator 20 are conducted from the heat source of the outer wall of the evaporator to evaporate. The area is enlarged to increase the amount of convective heat transfer of the working fluid, and the evaporation effect can be greatly improved by uniformly heating.
또한, 상기 곡면 다공판(50)은 증발부(20)의 외표면에서 전도에 의해 열을 작동유체에 전달하여 대류면적의 증가로 국부적 고열과열을 방지함으로 액체 풀(60)에서 기-액이 동반하여 응축부를 향해 요동 진동하는 것을 방지할 수도 있게 된다.In addition, the curved porous plate 50 transfers heat to the working fluid by conduction at the outer surface of the evaporator 20 to prevent local high temperature overheating by increasing the convective area, thereby preventing the gas-liquid from the liquid pool 60. It is also possible to prevent oscillating oscillation toward the condensation unit.
그리고 상기 증발부(20)에서 기화된 증기는 단열부(30)를 지나 응축부(40)로 유입되고, 응축부(40)로 유입된 증기는 상대적으로 온도가 낮은 내벽에서 냉각되어 열을 방출하고 액체로 응축된다.The vapor evaporated in the evaporator 20 is introduced into the condenser 40 after passing through the heat insulator 30, and the steam introduced into the condenser 40 is cooled in an inner wall having a relatively low temperature to release heat. And condense to liquid.
여기에서 상기 응축부(40)의 내주면에는 상하 간격을 두고 다수의 곡면 다공판(50a)이 설치되는 기술이 추가로 접목됨으로써 응축부(40)의 내면 및 다수의 곡면 다공판(50a)을 통과하면서 응측되는 과정에서 응축부(40)에 설치된 곡면 다공판(50a)은 응축 전열면적이 확대되어 응축수량이 증대되는 동시에 외주면에 대량의 열을 방열하는 특별한 효과를 제공한다.Here, the inner circumferential surface of the condensation unit 40 passes through the inner surface of the condensation unit 40 and the plurality of curved porous plates 50a by additionally incorporating a technology in which a plurality of curved porous plates 50a are installed at vertical intervals. The curved porous plate 50a installed in the condensation unit 40 in the process of being condensed while providing a special effect of dissipating a large amount of heat on the outer circumferential surface while increasing the amount of condensation heat is increased.
이와 같이 증발부(20) 및 응축부(40)에 설치되는 다수의 곡면 다공판(50)(50a)은 도 2 내지 도 4와 같이 상부 중앙으로 볼록한 곡면부(51)가 형성되고, 상기 곡면부(51)에는 다수의 증기홀(52)이 형성되며, 상기 곡면부(51)의 외주면에는 방사상으로 다수의 액체홀(53)이 등간격으로 관통 형성되고, 상기 액체홀(53)은 밀폐관(10)의 내면과 접하도록 설치된다.As described above, a plurality of curved porous plates 50 and 50a installed in the evaporator 20 and the condenser 40 are formed with curved surfaces 51 which are convex toward the upper center, as shown in FIGS. 2 to 4. A plurality of vapor holes 52 are formed in the part 51, and a plurality of liquid holes 53 are radially penetrated through the outer circumferential surface of the curved part 51 at equal intervals, and the liquid holes 53 are sealed. It is installed to contact the inner surface of the tube (10).
액체홀(53)은 증기홀(52)에 비해 직경을 더 크게하여 응축부에서 증발부로 액체가 충분히 귀환할 수 있도록 하는 것이 바람직하다.The liquid hole 53 is preferably larger in diameter than the vapor hole 52 so that the liquid can be sufficiently returned from the condenser to the evaporator.
상기 곡면 다공판(50a)을 통과하면서 응측된 액체는 곡면부(51)를 따라 응축부(40)의 내벽으로 유도된 후 내벽을 따라 흘러내리면서 액체홀(53)을 통과하고, 순차적으로 단열부(30)를 지나 중력에 의해 증발부(20)로 회수될 수 있게 된다.The liquid condensed while passing through the curved porous plate 50a is guided to the inner wall of the condensation unit 40 along the curved portion 51 and then flows down the inner wall, passing through the liquid hole 53, and sequentially insulated. The portion 30 may be recovered to the evaporator 20 by gravity.
한편, 본 발명의 곡면 다공판(50)(50a)은 증기홀(52) 및 액체홀(53)이 상하 동일선상에 위치하지 않고, 도 2와 같이 상하방향으로 상호 교대로 반복하여 엇갈리게 배치됨으로써 기화된 증기와 응축된 액적이 낙하하면서 증발부(20)에서 기화된 증기와 혼합되는 것을 방지하고, 상기 증발부(20)에서 곡면 다공판(50)은 작동유체의 온도를 균일하게 하여 국부적 고열 과열을 분산시키며, 기-액이 상층부로 유동됨을 방지할 뿐만 아니라 요동 진동을 방지할 수 있는 특별한 효과를 제공한다.On the other hand, the curved porous plate 50, 50a of the present invention is not the vapor hole 52 and the liquid hole 53 is not located on the same line up and down, and alternately arranged alternately alternately in the vertical direction as shown in FIG. The vaporized vapor and the condensed droplets are prevented from mixing with the vaporized vapor in the evaporator 20, the curved porous plate 50 in the evaporator 20 to uniform the temperature of the working fluid to a local high temperature It disperses the superheat and not only prevents the gas-liquid from flowing to the upper layer but also provides a special effect of preventing oscillation vibration.
이러한 본 발명은 열사이펀에 곡면 다공판(50)(50a)을 설치함으로써 증발부(20) 내의 작동유체를 균일하게 가열하면서 유동·진동을 방지하고, 시간에 따른 온도 변화율이 빠르며, 증발 및 응축 잠열이 크기 때문에 효과적으로 대량 열 수송이 가능하다.The present invention prevents flow and vibration while uniformly heating the working fluid in the evaporator 20 by installing the curved porous plates 50 and 50a in the thermosiphon, and the rate of change of temperature with time, evaporation and condensation Large latent heat allows for efficient mass heat transport.
또한, 대류면적의 증가는 증발부에서 작동유체의 온도를 균일하게 함으로써 열원으로부터 가열되면 비교적 단시간에 안정화되고 시동이 빠른 특징이 있다.In addition, the increase in the convective area is characterized by stabilization in a relatively short time and rapid start-up when heated from a heat source by making the temperature of the working fluid uniform in the evaporator.
1: 열원 10: 밀폐관1: heat source 10: airtight tube
20: 증발부 30: 단열부20: evaporation unit 30: heat insulation unit
40: 응축부 50, 50a: 곡면 다공판40: condensation unit 50, 50a: curved porous plate
51: 곡면부 52: 증기홀51: curved portion 52: steam hole
53: 액체홀 60: 액체풀53: liquid hole 60: liquid pool

Claims (8)

  1. 증발부(20)와 응축부(40)로 이루어진 밀폐관(10)을 가지는 열사이펀에 있어서,In the thermosiphon having a closed tube 10 consisting of an evaporation unit 20 and a condensation unit 40,
    상기 밀폐관(10)의 내부에 다수의 구멍이 형성된 다수의 곡면 다공판(50)(50a)이 설치된 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.Thermosiphon having a curved porous plate, characterized in that a plurality of curved porous plate (50, 50a) is formed in the interior of the hermetic pipe (10).
  2. 제 1항에 있어서,The method of claim 1,
    상기 곡면 다공판(50)은 증발부(20)에 설치된 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.The curved porous plate 50 is a thermosiphon having a curved porous plate, characterized in that installed on the evaporator (20).
  3. 제 1항에 있어서,The method of claim 1,
    상기 곡면 다공판(50)(50a)은 증발부(20) 및 응축부(40)에 각각 설치된 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.The curved porous plate 50, 50a is a thermosiphon having a curved porous plate, characterized in that installed in the evaporator 20 and the condenser 40, respectively.
  4. 제 1항에 있어서,The method of claim 1,
    상기 증발부(20)는 금속재 밀폐관(10)의 외부 열원으로부터 열을 흡수하여 작동유체를 가열하여 기화시키고, 상기 다수의 곡면 다공판(50)(50a)은 증발부(20) 및 응축부(40)의 내주면에 상하 간격을 두고 설치되는 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.The evaporator 20 absorbs heat from an external heat source of the metal hermetic pipe 10 to heat and evaporate the working fluid, and the plurality of curved porous plates 50 and 50a may include an evaporator 20 and a condenser. A thermosiphon having a curved perforated plate, characterized in that it is provided with a vertical interval on the inner peripheral surface of the (40).
  5. 제 1항에 있어서,The method of claim 1,
    상기 곡면 다공판(50)(50a)은 상부 중앙으로 볼록한 곡면부(51)에 다수의 증기홀(52)이 형성되고, 상기 곡면부(51)의 외주면에는 방사상으로 다수의 액체홀(53)이 등간격으로 관통 형성되며, 상기 액체홀(53)은 밀폐관(10)의 내면과 접하는 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.The curved porous plates 50 and 50a have a plurality of vapor holes 52 formed in the curved surface portion 51 convex toward the upper center thereof, and a plurality of liquid holes 53 radially on the outer circumferential surface of the curved surface portion 51. It is formed through the equal intervals, the liquid hole 53 is a thermosiphon having a curved porous plate, characterized in that in contact with the inner surface of the closed tube (10).
  6. 제 5항에 있어서,The method of claim 5,
    상기 다수의 곡면 다공판(50)(50a)은 증기홀(52) 및 액체홀(53)이 상하 동일선상에 위치하지 않고, 상하방향으로 상호 교대로 반복하여 엇갈리게 배치된 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.The curved curved plates 50 and 50a of the plurality of curved surfaces are characterized in that the steam holes 52 and the liquid holes 53 are not disposed on the same upper and lower lines, but are alternately arranged alternately in the vertical direction. Thermosiphon with stencil.
  7. 제 5항에 있어서,The method of claim 5,
    상기 액체홀(53)은 증기홀(52)에 비해 직경을 더 크게 하여 응축부(40)에서 증발부(20)로 액체가 충분히 귀환할 수 있도록 하는 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.The liquid hole 53 has a larger diameter than that of the steam hole 52 so that the liquid can be sufficiently returned from the condensation part 40 to the evaporation part 20. siphon.
  8. 제 1항에 있어서,The method of claim 1,
    상기 증발부(20)와 응축부(40)의 사이에는 단열부(30)가 형성되고, 상기 단열부(30)는 증발부(20)에서 기화한 작동유체가 응축부(40)로 이동할 때 내부로부터 열의 유출을 차단하는 것을 특징으로 하는 곡면 다공판을 구비한 열사이펀.A heat insulation part 30 is formed between the evaporator 20 and the condenser 40, and the heat insulation part 30 moves when the working fluid vaporized in the evaporator 20 moves to the condenser 40. A thermosiphon having a curved perforated plate, characterized in that blocking outflow of heat from the inside.
PCT/KR2019/006197 2017-06-16 2019-05-23 Thermosyphon having curved perforated plate WO2019225982A1 (en)

Applications Claiming Priority (3)

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KR20170076802 2017-06-16
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