WO2019211928A1

WO2019211928A1 - Method for manufacturing retention device

Info

Publication number: WO2019211928A1
Application number: PCT/JP2019/000152
Authority: WO
Inventors: 誠栗林; 真宏井上; 利真榊原
Original assignee: 日本特殊陶業株式会社
Priority date: 2018-05-01
Filing date: 2019-01-08
Publication date: 2019-11-07
Also published as: JPWO2019211928A1; JP6703646B2; TWI697072B; TW201946213A

Abstract

Provided is a retention device which is capable of controlling the temperature distribution on a first surface while enabling simplifying of steps for manufacturing said retention device. This method for manufacturing a retention device involves: preparing a pre-bonded ceramic member and a pre-bonded base member; and measuring a level difference distribution on a second surface of the pre-bonded ceramic member and/or a third surface of the pre-bonded base member. Next, prior to bonding the pre-bonded ceramic member and the pre-bonded base member together, a prediction is made, on the basis of the measurement result of the level difference distribution, of the temperature distribution on the first surface when bonding is performed between the pre-bonded ceramic member and the pre-bonded base member. Further, according to the prediction result of the temperature distribution on the first surface, a change is made to the configuration of at least one of the pre-bonded ceramic member, the pre-bonded base member, and a junction area therebetween.

Description

Method for manufacturing holding device

The technology disclosed in this specification relates to a method for manufacturing a holding device.

As the holding device, for example, an electrostatic chuck that holds and holds a wafer by electrostatic attraction is known. The electrostatic chuck includes a ceramic member, a base member, a joint portion for joining the ceramic member and the base member, and a chuck electrode provided inside the ceramic member, and a voltage is applied to the chuck electrode. The wafer is adsorbed and held on the surface of the ceramic member (hereinafter referred to as “adsorption surface”) by utilizing the electrostatic attractive force generated by this.

If the temperature of the wafer held on the chucking surface of the electrostatic chuck does not reach a desired temperature, the accuracy of each process (film formation, etching, etc.) on the wafer may be reduced. The ability to control the distribution is required.

Conventionally, an adjustment resin having a thermal conductivity different from the thermal conductivity of the joint is embedded in a position corresponding to the temperature distribution of the adsorption surface of the adhesion surface opposite to the adsorption surface of the ceramic member. An electric chuck is known (see, for example, Patent Documents 1 and 2).

JP 2016-1757 A JP 2013-247342 A

In the conventional electrostatic chuck described above, the temperature distribution on the bonding surface of the ceramic member alone becomes a desired temperature by embedding the adjustment resin in the bonding surface of the ceramic member before bonding the ceramic member to the base member. Even if the base member is bonded to the ceramic member, the temperature distribution on the bonding surface may fluctuate and deviate from a desired temperature. Then, for example, the ceramic member is peeled off from the base member, the adjustment resin embedded in the bonding surface of the ceramic member is adjusted, and the process of re-joining the ceramic member and the base member again increases. The manufacturing process may be complicated.

Note that such a problem is not limited to an electrostatic chuck that holds a wafer using electrostatic attraction, but is a problem common to holding devices in which a ceramic member and a base member are joined.

In this specification, a technique capable of solving the above-described problems is disclosed.

The technology disclosed in this specification can be realized as the following forms.

(1) A method for manufacturing a holding device disclosed in the present specification includes a ceramic having a first surface substantially perpendicular to a first direction and a second surface opposite to the first surface. A member, a base member having a third surface, the third surface being located on the second surface side of the ceramic member, the second surface of the ceramic member, and the A holding part that is disposed between the third surface of the base member and that joins the ceramic member and the base member, and holds the object on the first surface of the ceramic member In the apparatus manufacturing method, a pre-bonding ceramic member that is the ceramic member before being bonded via the bonding portion and a pre-bonding base member that is the base member before being bonded via the bonding portion are prepared. And the process Measuring a height difference distribution of at least one of the second surface of the ceramic member before bonding and the third surface of the base member before bonding; and the ceramic member before bonding and the base member before bonding. Predicting the temperature distribution of the first surface when the pre-joining ceramic member and the pre-joining base member are joined based on the measurement result of the height difference distribution before joining, A step of changing at least one configuration of the pre-bonding ceramic member, the pre-bonding base member, and the bonding portion in accordance with a prediction result of the surface temperature distribution. The inventor of the present application greatly affects the temperature distribution of the first surface of the ceramic member in the holding device completed by joining the ceramic member before joining and the base member before joining through the joint part, This is a variation in the thickness of the bonded portion, and the variation in the thickness of the bonded portion can be predicted from the height difference distribution of at least one of the second surface of the ceramic member before bonding and the third surface of the base member before bonding. , Found a new thing. Therefore, in the method of manufacturing the holding device, the height difference distribution of at least one of the second surface of the ceramic member before joining and the third surface of the base member before joining is measured, and the ceramic member and base portion before joining are measured. Before joining, based on the measurement result of the height difference distribution, the temperature distribution of the first surface when the ceramic member before joining and the base member before joining are joined is predicted, and the temperature distribution prediction result of the first surface is predicted. Accordingly, at least one of the structure of the ceramic member before bonding, the base member before bonding, and the bonding portion is changed. Therefore, according to the method for manufacturing the holding device, when the pre-bonding ceramic member and the base member before bonding are joined to complete the holding device, the temperature distribution of the first surface of the holding device is measured. As compared with the above, it is possible to provide a holding device capable of controlling the temperature distribution of the first surface while simplifying the manufacturing process of the holding device.

(2) In the method for manufacturing the holding device, the predicted result of the temperature distribution of the first surface is that the first surface has a relatively high temperature and a first region where the temperature is relatively low. 2 regions may be included. According to the method for manufacturing the holding device, it is possible to provide a holding device that can control the temperature distribution of the first surface while simplifying the manufacturing process of the holding device.

(3) In the manufacturing method of the holding device, a first joint that overlaps the first region in the first direction in the joint according to a prediction result of the temperature distribution of the first surface. The configuration of the joint portion is changed so that the thermal conductivity of the portion is higher than the thermal conductivity of the second joint portion that overlaps the second region in the first direction in the joint portion. May be. According to the manufacturing method of the holding device, it is possible to provide a holding device capable of controlling the temperature distribution of the first surface while simplifying the manufacturing process of the holding device by changing the configuration of the joint portion.

(4) In the manufacturing method of the holding device, a portion of the second surface of the ceramic member before bonding that overlaps the second region in the first direction view may be processed. According to the method for manufacturing the holding device, a holding device capable of controlling the temperature distribution of the first surface while simplifying the manufacturing process of the holding device by processing the second surface of the ceramic member before bonding is provided. can do.

(5) In the manufacturing method of the holding device, a portion of the third surface of the base member before joining that overlaps the second region in the first direction view may be processed. According to the manufacturing method of the holding device, the holding device capable of controlling the temperature distribution of the first surface while simplifying the manufacturing process of the holding device by processing the third surface of the base member before joining is provided. can do.

(6) A method for manufacturing a holding device disclosed in the present specification includes a first surface that is substantially perpendicular to a first direction, and a second surface that is opposite to the first surface. A member, a base member having a third surface, the third surface being located on the second surface side of the ceramic member, the second surface of the ceramic member, and the A holding part that is disposed between the third surface of the base member and that joins the ceramic member and the base member, and holds the object on the first surface of the ceramic member In the method of manufacturing an apparatus, a plurality of pre-joining base members including a pre-joining ceramic member that is the ceramic member before joining via the joining portion, and the base member before joining via the joining portion; Prepare Measuring the height difference distribution of the second surface of the pre-bonding ceramic member and the height difference distribution of the third surface of each of the plurality of base members before bonding, and the ceramic before bonding. Before joining the member and the base member before joining, the first surface when the ceramic member before joining and each of the plurality of base members before joining are joined based on the measurement result of the height difference distribution. Predicting the temperature distribution of the first surface, extracting one base member before joining from the plurality of base members before joining in accordance with a prediction result of the temperature distribution of the first surface, and joining the joints Joining the pre-ceramic member and the extracted pre-joining base member via the joint. In the method for manufacturing the holding device, based on the measurement result of the height difference between the second surface of the ceramic member before bonding and the third surface of each of the plurality of base members before bonding, the first holding device in the completed body of the holding device is used. It is possible to predict the temperature distribution of the surface of the base material and extract one base member before joining from a plurality of base members before joining according to the prediction result. For this reason, according to the manufacturing method of the holding device, after the pre-bonding ceramic member and each of the plurality of base members before bonding are joined to complete the holding device, the temperature distribution on the first surface of the holding device is As compared with the case of measurement, it is possible to provide a holding device that can control the temperature distribution of the first surface while simplifying the manufacturing process of the holding device.

(7) A method for manufacturing a holding device disclosed in the present specification includes a first surface that is substantially perpendicular to a first direction, and a second surface that is opposite to the first surface. A member, a base member having a third surface, the third surface being located on the second surface side of the ceramic member, the second surface of the ceramic member, and the A holding part that is disposed between the third surface of the base member and that joins the ceramic member and the base member, and holds the object on the first surface of the ceramic member In the method for manufacturing an apparatus, a plurality of pre-bonding ceramic members including the ceramic member before being bonded via the bonding portion, and a pre-bonding base member which is the base member before being bonded via the bonding portion; Prepare Measuring the height difference distribution of the second surface of each of the plurality of pre-bonding ceramic members and the height difference distribution of the third surface of the base member before bonding, and the ceramics before bonding. The first surface when each of the plurality of pre-joining ceramic members and the pre-joining base member are joined based on the measurement result of the height difference distribution before joining the member and the pre-joining base member. And a step of extracting one pre-joining ceramic member from the plurality of pre-joining ceramic members according to a prediction result of the temperature distribution of the first surface. Joining the ceramic member before joining and the base member before joining via the joining portion. In the manufacturing method of the holding device, the first holding device in the completed body of the holding device is based on the measurement result of the height difference distribution between the second surface of each of the plurality of pre-bonding ceramic members and the third surface of the base member before bonding. It is possible to predict the temperature distribution of the surface of the steel sheet and to extract one pre-joining ceramic member from among the plurality of pre-joining ceramic members according to the prediction result. For this reason, according to the manufacturing method of the holding device, after completing the holding device by joining each of the plurality of pre-bonding ceramic members and the base member before bonding, the temperature distribution on the first surface of the holding device is As compared with the case of measurement, it is possible to provide a holding device that can control the temperature distribution of the first surface while simplifying the manufacturing process of the holding device.

The technology disclosed in this specification can be realized in various forms. For example, a heater device such as an electrostatic chuck or a CVD heater, a vacuum chuck, or other ceramic member and a base member are joined. It can be realized in the form of a holding device, a manufacturing method thereof, and the like.

1 is a perspective view schematically showing an external configuration of an electrostatic chuck 100 according to a first embodiment. It is explanatory drawing which shows roughly the XZ cross-sectional structure of the electrostatic chuck 100 in 1st Embodiment. 3 is a flowchart illustrating a method for manufacturing the electrostatic chuck 100 according to the first embodiment. It is explanatory drawing which illustrates the correspondence of the height difference of ceramic side joining surface S2, and the temperature difference of adsorption | suction surface S1. It is explanatory drawing which shows temperature distribution of adsorption | suction surface S1, and XZ cross-sectional structure of the electrostatic chuck 100. FIG. It is a flowchart which shows the manufacturing method of the electrostatic chuck 100 in 2nd Embodiment. It is explanatory drawing which shows typically the one part process of the manufacturing method of the electrostatic chuck 100 in 2nd Embodiment.

A. First embodiment:
A-1. Configuration of the electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 in the first embodiment, and FIG. 2 is an explanatory diagram schematically showing an XZ cross-sectional configuration of the electrostatic chuck 100 in the first embodiment. It is. In each figure, XYZ axes orthogonal to each other for specifying the direction are shown. In this specification, for convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. However, the electrostatic chuck 100 is actually installed in a direction different from such a direction. May be.

The electrostatic chuck 100 is an apparatus for attracting and holding an object (for example, a wafer W) by electrostatic attraction, and is used for fixing the wafer W in a vacuum chamber of a semiconductor manufacturing apparatus, for example. The electrostatic chuck 100 includes a ceramic member 10 and a base member 20 that are arranged in a predetermined arrangement direction (in this embodiment, the vertical direction (Z-axis direction)). The ceramic member 10 and the base member 20 include a lower surface of the ceramic member 10 (hereinafter referred to as “ceramic side bonding surface S2”) and an upper surface of the base member 20 (hereinafter referred to as “base side bonding surface S3”). It arrange | positions so that the junction part 30 may be pinched | interposed in the said arrangement direction. That is, the base member 20 is disposed so that the base-side bonding surface S3 is positioned on the ceramic-side bonding surface S2 side of the ceramic member. The electrostatic chuck 100 further includes a bonding portion 30 disposed between the ceramic side bonding surface S2 of the ceramic member 10 and the base side bonding surface S3 of the base member 20. The vertical direction (Z-axis direction) corresponds to the first direction in the claims, the ceramic side bonding surface S2 corresponds to the second surface in the claims, and the base side bonding surface S3 is the patent. This corresponds to the third surface in the claims.

The ceramic member 10 is, for example, a circular flat plate-like member, and is formed of ceramics. The diameter of the ceramic member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic member 10 is, for example, about 1 mm to 10 mm.

Various ceramics can be used as a material for forming the ceramic member 10. From the viewpoint of strength, wear resistance, plasma resistance, and the like, for example, aluminum oxide (alumina, Al ₂ O ₃ ) or aluminum nitride (AlN) is used. It is preferable to use ceramics containing as a main component. In addition, the main component here means a component having the largest content ratio (weight ratio).

Inside the ceramic member 10, a pair of internal electrodes 40 formed of a conductive material (for example, tungsten or molybdenum) is provided. When a voltage is applied to the pair of internal electrodes 40 from a power source (not shown), an electrostatic attractive force is generated, and the wafer W causes the upper surface of the ceramic member 10 (hereinafter referred to as an “attracting surface S1”) by the electrostatic attractive force. It is fixed by adsorption. The suction surface S1 corresponds to the first surface in the claims.

Further, a heater 50 made of a resistance heating element including a conductive material (for example, tungsten or molybdenum) is provided inside the ceramic member 10. When a voltage is applied to the heater 50 from a power source (not shown), the ceramic member 10 is heated by the heater 50 generating heat, and the wafer W held on the suction surface S1 of the ceramic member 10 is heated. Thereby, the temperature control of the wafer W is realized. For example, the heater 50 is formed in a substantially concentric shape as viewed in the Z direction in order to warm the adsorption surface S1 of the ceramic member 10 as uniformly as possible.

The base member 20 is a circular flat plate-like member having the same diameter as the ceramic member 10 or having a larger diameter than the ceramic member 10. For example, the base member 20 is a material having a higher thermal conductivity than the ceramic member 10 (for example, It is made of metal (aluminum, aluminum alloy, etc.). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually about 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm.

A refrigerant flow path 21 is formed inside the base member 20. When a coolant (for example, a fluorine-based inert liquid or water) is supplied to the coolant channel 21, the base member 20 is cooled. When the base member 20 is cooled together with the heating of the ceramic member 10 by the heater 50 described above, the adsorption surface of the ceramic member 10 is transferred by heat transfer between the ceramic member 10 and the base member 20 via the joint portion 30. The temperature of the wafer W held in S1 is kept constant. Further, when heat input from the plasma is generated during the plasma processing, the temperature control of the wafer W is realized by adjusting the electric power applied to the heater 50.

The joint portion 30 includes an adhesive such as a silicone resin, an acrylic resin, and an epoxy resin, and joins the ceramic member 10 and the base member 20. The thickness of the joint portion 30 is, for example, not less than 0.1 mm and not more than 1 mm.

A-2. Method for manufacturing electrostatic chuck 100:
FIG. 3 is a flowchart showing a method for manufacturing the electrostatic chuck 100 according to the first embodiment.

(Preparation process of ceramic member 10P before joining and base member 20P before joining):
First, the pre-bonding ceramic member 10P and the pre-bonding base member 20P are prepared (S110). The pre-bonding ceramic member 10P is the ceramic member 10 before being bonded via the bonding portion 30, and when the pre-bonding ceramic member 10P is processed in the process of changing the configuration of the electrostatic chuck 100 described later, Including those before and after the processing. The base member 20P before joining is the base member 20 before joining via the joining part 30, and when the base member 20P before joining is processed in the process of changing the configuration of the electrostatic chuck 100 described later, Including those before and after the processing. The pre-bonding ceramic member 10P and the pre-bonding base member 20P can be manufactured by a known manufacturing method. For example, the pre-bonding ceramic member 10P is manufactured by the following method. That is, a plurality of ceramic green sheets (for example, alumina green sheets) are prepared, and each ceramic green sheet is printed with metallized ink for constituting the internal electrode 40, the heater 50, and the like, and then the plurality of ceramic green sheets. Are bonded to each other, thermocompression-bonded, cut into a predetermined disk shape, fired, and finally subjected to polishing or the like, whereby the pre-bonding ceramic member 10P is manufactured.

(Measurement process of height difference distribution of ceramic-side joining surface S2):
Next, the height difference distribution of the ceramic side bonding surface S2 of the pre-bonding ceramic member 10P is measured (S120). The height difference distribution of the ceramic side bonding surface S2 is a distribution of deviation amounts with respect to the average height in the vertical direction at a plurality of points in the ceramic side bonding surface S2. Specifically, for example, by using a 3D shape measuring machine, by measuring the heights of a plurality of points on the ceramic side bonding surface S2 (the height difference in the direction (vertical direction) substantially perpendicular to the adsorption surface S1), the ceramic side The height difference distribution (degree of unevenness) of the joint surface S2 is measured. It is difficult to form the ceramic-side bonding surface S2 in a complete plane. For example, the ceramic-side bonding surface S2 is caused by shrinkage of the ceramic green sheet laminate or variation in polishing during firing of the method for manufacturing the pre-bonding ceramic member 10P. As a result, undulation or the like occurs on the ceramic-side bonding surface S2. The degree of undulations is, for example, about ± 20 μm.

(Prediction process of temperature distribution of adsorption surface S1):
Next, before bonding the pre-bonding ceramic member 10P and the pre-bonding base member 20P, the pre-bonding ceramic member 10P and the pre-bonding base member 20P are bonded in advance based on the measurement result of the height difference distribution in S120. The temperature distribution of the attracting surface S1 in the case (completed body of the electrostatic chuck 100) is predicted (specified) (S130). Note that the temperature distribution of the suction surface S1 refers to a temperature distribution in a surface direction substantially parallel to the suction surface S1 (a direction substantially perpendicular to the vertical direction).

Here, the inventor of the present application has a great influence on the temperature distribution of the suction surface S1 of the ceramic member 10 in the completed electrostatic chuck 100, in particular, the variation in the thickness of the joint 30. It was newly found that the thickness variation of 30 can be predicted from the height difference distribution of at least one of the ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P and the base-side bonding surface S3 of the pre-bonding base member 20P. If the thickness of the joint portion 30 varies, the heat transfer from the ceramic member 10 to the base member 20 varies in the surface direction, and as a result, the temperature distribution on the adsorption surface S1 varies. Variations in heat transfer coefficient due to the internal structure of the ceramic member 10 and the base member 20 (for example, variations in the thickness of the ceramic member 10 itself and variations in the heat generation distribution of the heater 50) also affect the temperature distribution on the adsorption surface S1. However, the influence due to the variation in the heat transfer coefficient of the ceramic member 10 or the like is smaller than the influence due to the variation in the thickness of the joint portion 30. Further, the variation in the heat transfer coefficient due to the internal structure of the ceramic member 10 or the base member 20 is local, for example, causing a high temperature or low temperature singularity at a specific location on the adsorption surface S1. Even if the temperature distribution of the adsorption surface S1 of the pre-bonding ceramic member 10P alone can be controlled to be a desired distribution, the pre-bonding ceramic member 10P and the pre-bonding base member 20P are connected to each other via the bonding portion 30. When bonded, the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 after bonding may deviate from the desired distribution. More specifically, due to thermal deformation of the pre-bonding ceramic member 10P, the pre-bonding base member 20P, and the bonding portion 30 by heat treatment during bonding, the thickness of the bonding portion 30 varies, and the temperature distribution of the adsorption surface S1 is desired. May deviate from the distribution. Therefore, in order to efficiently control the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100, it is effective to suppress variations in the thickness of the joint portion 30 in the completed electrostatic chuck 100. The variation in the thickness of the joint portion 30 is mainly influenced by the ceramic side joining surface S2 of the ceramic member 10 and the base side joining surface S3 of the base member 20. That is, between the height difference distribution of the ceramic side bonding surface S2 of the ceramic member 10 and the height difference distribution of the base side bonding surface S3 of the base member 20, and the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100, Correlation is established. Since the metal pre-joining base member 20P is relatively easy to process as compared to the ceramic pre-joining ceramic member 10P, the base-side joining surface S3 has a higher processing accuracy than the ceramic-side joining surface S2. It can be formed in a substantially plane. Hereinafter, in the present embodiment, it is assumed that the base-side joining surface S3 of the base member 20P before joining is a substantially flat surface, and variations in the thickness of the joining portion 30 are mainly caused by the ceramic-side joining surface S2 of the ceramic member 10P before joining. It depends on the height difference distribution.

Therefore, in the present embodiment, by using correspondence information between the height difference distribution of the ceramic-side bonding surface S2 of the ceramic member 10P before bonding and the temperature distribution of the suction surface S1 in the completed electrostatic chuck 100, the information in S120 is used. From the measurement result of the height difference distribution, the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 is predicted. The correspondence relationship information includes, for example, the height difference of the ceramic side bonding surface S2 of the pre-bonding ceramic member 10P (hereinafter simply referred to as “the height difference of the ceramic side bonding surface S2”) and the electrostatic chuck 100 caused by the height difference. This is the relationship with the temperature difference of the suction surface S1 in the finished product (hereinafter simply referred to as “temperature difference of the suction surface S1”). The difference in height of the ceramic-side bonding surface S2 is the height in the direction (vertical direction) substantially perpendicular to the suction surface S1 with respect to a predetermined reference position on the ceramic-side bonding surface S2 for a plurality of target positions on the ceramic-side bonding surface S2. It is a difference. The plurality of target points are, for example, a plurality of points arranged in a lattice pattern on the ceramic side bonding surface S2 when viewed in the vertical direction. The temperature difference of the suction surface S1 is the difference in temperature at the position on the suction surface S1 corresponding to each target position with respect to the ambient temperature (or the temperature at the position on the suction surface S1 corresponding to the reference position). The correspondence information between the height difference of the ceramic side bonding surface S2 and the temperature difference of the adsorption surface S1 is, for example, the height difference of the ceramic side bonding surface S2 of the ceramic member 10P before bonding with respect to the plurality of electrostatic chucks 100. It can be obtained by measuring the temperature difference of the suction surface S1 in the finished product.

FIG. 4 is an explanatory diagram illustrating the correspondence between the height difference of the ceramic side bonding surface S2 of the pre-bonding ceramic member 10P and the temperature difference of the adsorption surface S1. From FIG. 4, as the height difference between the position on the ceramic side bonding surface S2 and the reference position is larger, the temperature of the position on the suction surface S1 corresponding to the position and the ambient temperature (the temperature of the position corresponding to the reference position). It can be seen that the difference between and increases. That is, the relatively large difference in height of the ceramic side bonding surface S2 means that the depth of the recess in the ceramic side bonding surface S2 is relatively large. As the depth of the dent increases, the thickness of the joint portion 30 in the completed electrostatic chuck 100 increases, and as a result, the heat transfer from the ceramic member 10 to the base member 20 decreases, thereby reducing the surface of the suction surface S1. The temperature of becomes relatively high.

From the measurement result of the height difference distribution in S120, the height difference of the ceramic side bonding surface S2 of the ceramic member 10P before bonding can be known. For this reason, from the measurement result of the height difference distribution in S120, using the correspondence information between the height difference of the ceramic-side joining surface S2 and the temperature difference of the suction surface S1, the suction surface S1 in the completed electrostatic chuck 100 is measured. The temperature distribution can be predicted.

(Change process of the configuration of the electrostatic chuck 100):
Next, the configuration of the electrostatic chuck 100 is changed according to the prediction result of the temperature distribution of the suction surface S1 in S130 (S140). Specifically, at least one of the pre-bonding ceramic member 10P, the pre-bonding base member 20P, and the bonding portion 30 so that the temperature distribution of the suction surface S1 approaches a desired distribution (for example, the temperature distribution in the surface direction is substantially uniform). Change one configuration. As the changing method, a known method can be used. A specific example is as follows.
(1) A plurality of members having different thermal conductivities are arranged inside the joint portion 30 so that variations in the temperature distribution of the adsorption surface S1 are suppressed. This method is performed during the joining process of the pre-joining ceramic member 10P and the pre-joining base member 20P described below.
(2) The ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P is processed so that variations in the temperature distribution of the adsorption surface S1 are suppressed. For example, the ceramic side bonding surface S2 is processed so that the variation in the thickness of the bonding portion 30 is suppressed. In this embodiment, the ceramic side bonding surface S2 is processed so that the height difference distribution of the ceramic side bonding surface S2 becomes higher.
(3) The base-side bonding surface S3 of the base member 20P before bonding is processed so that variations in the temperature distribution of the suction surface S1 are suppressed. For example, the base-side bonding surface S3 is processed so that the variation in the thickness of the bonding portion 30 is suppressed.

(Jointing process between pre-joining ceramic member 10P and pre-joining base member 20P):
Next, the ceramic member 10P before joining and the base member 20P before joining are joined (S150). Specifically, a curing process is performed in which the adhesive is cured in a state where the ceramic-side bonding surface S2 of the ceramic member 10P before bonding and the base-side bonding surface S3 of the base member 20P before bonding are bonded together with an adhesive. By doing so, the joint portion 30 is formed. Through the above steps, the manufacture of the electrostatic chuck 100 having the above-described configuration is completed.

A-3. Effects of this embodiment:
As described above, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, the height difference distribution of at least one of the ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P and the base-side bonding surface S3 of the pre-bonding base member 20P. Is measured (S120 in FIG. 3). Next, before joining the pre-joining ceramic member 10P and the pre-joining base member 20P, based on the measurement result of the height difference distribution, the pre-joining ceramic member 10P and the pre-joining base member 20P are joined. The temperature distribution of the suction surface S1 in the finished product is predicted (S130). Next, at least one configuration of the pre-bonding ceramic member 10P, the pre-bonding base member 20P, and the bonding portion 30 is changed according to the prediction result of the temperature distribution of the suction surface S1 (S140). For this reason, according to the manufacturing method of the present embodiment, when the pre-bonding ceramic member 10P and the pre-bonding base member 20P are bonded to complete the electrostatic chuck 100, the temperature distribution of the attracting surface S1 is measured. As compared with the above, it is possible to provide the electrostatic chuck 100 capable of controlling the temperature distribution of the attracting surface S1 while simplifying the manufacturing process of the electrostatic chuck 100. This will be specifically described below.

FIG. 5 is an explanatory diagram showing the temperature distribution of the attracting surface S1 and the XZ cross-sectional configuration of the electrostatic chuck 100. FIG. 5A shows the temperature distribution of the adsorption surface S1 before joining the pre-joining ceramic member 10P and the pre-joining base member 20P, and the XZ cross-sectional configuration of the pre-joining ceramic member 10P alone. In FIG. 2A, the configuration of the electrostatic chuck 100 other than the pre-bonding ceramic member 10P is indicated by a two-dot chain line. FIG. 5B shows the temperature distribution of the attracting surface S1 of the completed electrostatic chuck 100 after the bonding of the pre-bonding ceramic member 10P and the pre-bonding base member 20P, and the XZ cross-sectional configuration of the electrostatic chuck 100. It is shown.

As shown in FIG. 5 (A), the ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P is not a perfect plane but has irregularities (swells). Specifically, a portion of the ceramic side bonding surface S2 located immediately below the first region S1A on the adsorption surface S1 of the ceramic member 10P before bonding is convex, and the ceramic member 10P before bonding is adsorbed. A portion located immediately below the second region S1B on the surface S1 is concave. Here, for example, even if the temperature distribution of the adsorption surface S1 in the ceramic member 10P before bonding is measured, the measurement result does not reflect the influence on the temperature distribution due to the variation in the thickness of the bonding portion 30. The temperature distribution of the suction surface S1 in the completed electrostatic chuck 100 cannot be measured.

On the other hand, according to the manufacturing method of this embodiment, before joining the pre-joining ceramic member 10P and the pre-joining base member 20P, the thickness of the joint portion 30 is determined from the height difference distribution of the ceramic-side joining surface S2 and the like. A variation in temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 due to the variation is predicted. In the example of FIG. 5A, a portion of the ceramic side bonding surface S2 located immediately below the first region S1A on the suction surface S1 is convex, and the second region on the suction surface S1. The portion located immediately below S1B is concave. Therefore, in the completed body of the electrostatic chuck 100, the thickness D1 of the portion located immediately below the first region S1A in the joint portion 30 is the thickness D2 of the portion located directly below the second region S1B. It turns out that it becomes thin compared with. And from this magnitude relationship, it can be predicted that the temperature of the first region S1A is relatively high and the temperature of the second region S1B is relatively low on the suction surface S1.

Then, based on the prediction result of the temperature distribution of the suction surface S1, the electrostatic chuck 100 is configured to suppress the temperature variation of the suction surface S1 before or during the joining of the pre-joining ceramic member 10P and the pre-joining base member 20P. The configuration can be changed. Specifically, in the example of FIG. 5B, the first portion having a thermal conductivity lower than the thermal conductivity of the joint portion 30 in the portion located immediately below the first region S <b> 1 </ b> A in the joint portion 30. The second member 34 having a higher thermal conductivity than that of the bonding portion 30 is embedded in a portion located immediately below the second region S1B. Thereby, the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 can be made substantially uniform. The portion located immediately below the first region S1A corresponds to the first joint portion in the claims, and the portion located directly below the second region S1B is the second joint portion in the claims. It corresponds to.

B. Second embodiment:
FIG. 6 is a flowchart illustrating a method for manufacturing the electrostatic chuck 100 according to the second embodiment, and FIG. 7 is an explanatory diagram schematically illustrating some steps of the method for manufacturing the electrostatic chuck 100 according to the second embodiment. It is. Among the steps of the manufacturing method of the second embodiment, the same steps as those of the manufacturing method of the first embodiment described above are denoted by the same reference numerals, and the description thereof is omitted.

B-1. Method for manufacturing electrostatic chuck 100:
(Preparation step of the pre-bonding ceramic member 10P and the plurality of pre-bonding base members 20P):
First, the pre-bonding ceramic member 10P and the plurality of pre-bonding base members 20P before being bonded to each other are prepared (S110a). The manufacturing method of the pre-bonding ceramic member 10P and the pre-bonding base member 20P is as described in the first embodiment.

(Measurement process of height difference distribution of ceramic side bonding surface S2 and base side bonding surface S3):
Next, the height difference distribution of the ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P and the height difference distribution of the base-side bonding surfaces S3 of the plurality of pre-bonding base members 20P are measured (S120a). The method for measuring the height difference distribution of the ceramic side bonding surface S2 and the base side bonding surface S3 is as described in the first embodiment.

(Prediction process of temperature distribution of adsorption surface S1):
Next, before joining the pre-joining ceramic member 10P and the pre-joining base member 20P, each of the pre-joining ceramic member 10P and the plurality of pre-joining base members 20P based on the measurement results of the height difference distribution in S120 in advance. And the temperature distribution of the attracting surface S1 in the case of joining (a completed body of the electrostatic chuck 100) is predicted (S130a). Specifically, as in the first embodiment, the correspondence information between the height difference distribution of the ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P and the temperature distribution of the suction surface S1 of the completed electrostatic chuck 100 is obtained. Using the measurement result of the height difference distribution in S120a, the temperature distribution of the suction surface S1 in the completed electrostatic chuck 100 is predicted. In addition, using the correspondence information between the height difference distribution of the base-side bonding surfaces S3 of the plurality of base members 20P before bonding and the temperature distribution of the suction surface S1 in the completed electrostatic chuck 100, the height in S120a is determined. From the measurement result of the difference distribution, the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 is predicted.

(Third base member extraction step):
Next, before bonding the pre-bonding ceramic member 10P and the pre-bonding base member 20P, one of the plurality of pre-bonding base members 20P is pre-bonded according to the prediction result of the temperature distribution in S130a. The base member 20P is extracted (S140a). Specifically, among the plurality of pre-bonding base members 20P, the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 bonded to the pre-bonding ceramic member 10P is a desired distribution (for example, a temperature distribution in the surface direction). One pre-joining base member 20P that is the closest combination is extracted. In the present embodiment, for example, the pre-bonding ceramic member 10P and the pre-bonding base member 20P are connected in relation to the connection of the internal structure (gas path, conduction path, etc.) between the pre-bonding ceramic member 10P and the pre-bonding base member 20P. The positional relationship in the circumferential direction around the axis (Z axis) along the vertical direction cannot be changed. That is, it is not possible to employ a method of bringing the temperature distribution of the suction surface S1 closer to a desired distribution by changing the circumferential positional relationship between the pre-bonding ceramic member 10P and the pre-bonding base member 20P.

FIG. 7 shows a ceramic member 10P before bonding and three base members 20P (20A to 20C) before bonding. The three pre-joining base members 20A to 20C have different height distributions of the base-side joining surface S3. From the measurement results of the respective height difference distributions, the combination in which the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 is closest to the desired distribution is a combination of the pre-bonding ceramic member 10P and the pre-bonding base member 20A. Therefore, the base member 20A before joining was extracted. In the combination of the pre-bonding ceramic member 10P and the extracted pre-bonding base member 20A, one recess and the other protrusion are opposed to each other with respect to the ceramic-side bonding surface S2 and the base-side bonding surface S3. It becomes uneven. For this reason, in the combination of the pre-bonding ceramic member 10P and the pre-bonding base member 20A, compared with other combinations (pre-bonding ceramic member 10P and pre-bonding base member 20B, etc.), the bonded portion in the completed electrostatic chuck 100 The variation in the thickness in the 30 plane direction can be most suppressed.

(Jointing process between ceramic member 10P before joining and third base member):
Next, the pre-joining ceramic member 10P and the extracted pre-join base member 20A are joined (S150a). Specifically, a curing process is performed to cure the adhesive in a state where the ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P and the base-side bonding surface S3 of the pre-bonding base member 20A are bonded together with an adhesive. By doing so, the joint portion 30 is formed. Through the above steps, the manufacture of the electrostatic chuck 100 having the above-described configuration is completed.

B-2. Effects of this embodiment:
As described above, in the method of manufacturing the electrostatic chuck 100 according to the present embodiment, the level of the ceramic-side bonding surface S2 of the pre-bonding ceramic member 10P and the base-side bonding surfaces S3 of the plurality of pre-bonding base members 20P is different. Based on the measurement result of the difference distribution (S120a in FIG. 6), the temperature distribution of the attracting surface S1 in the completed electrostatic chuck 100 is predicted (S130a), and the plurality of base members 20P before bonding are determined according to the prediction result. One pre-joining base member 20P can be extracted from the inside (S140a). For this reason, according to the manufacturing method of this embodiment, the temperature distribution of the adsorption surface S1 of the electrostatic chuck 100 is completed after the pre-bonding ceramic member 10P and the pre-bonding base member 20P are bonded to complete the electrostatic chuck 100. As compared with the case where the measurement is performed, it is possible to provide the electrostatic chuck 100 capable of controlling the temperature distribution of the suction surface S1 while simplifying the manufacturing process of the electrostatic chuck 100.

C. Variation:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the gist thereof. For example, the following modifications are possible.

The configuration of the electrostatic chuck 100 in each of the above embodiments is merely an example, and can be variously modified. For example, at least one of the internal electrode 40 and the heater 50 may not be provided inside the ceramic member 10. The electrostatic chuck 100 includes, for example, a structure in which a metal, ceramics, resin, or the like is disposed between the ceramic member 10 and the base member 20, or between the ceramic member 10 and the base member 20. A configuration in which a heater is arranged separately from the heater 50 arranged inside is also possible.

The manufacturing method of the electrostatic chuck 100 in each of the above embodiments is merely an example, and various modifications can be made. For example, in the first embodiment, in S120 of FIG. 3, the height difference distribution of the base-side joining surface S3 of the base member 20 or the height difference distribution of the ceramic-side joining surface S2 of the ceramic member 10P before joining and before joining. Both the height difference distributions of the base-side joining surface S3 of the base member 20P may be measured. Further, with respect to the second embodiment, a plurality of pre-bonding ceramic members 10P and a pre-bonding base member 20P are prepared, and the height difference distribution of each ceramic-side bonding surface S2 of the plurality of pre-bonding ceramic members 10P and Based on the measurement result with the height difference distribution of the base-side joining surface S3 of the base member 20P before joining, the temperature distribution of the attracting surface S1 in the completed body of the electrostatic chuck 100 is predicted, and according to the prediction result, a plurality of One pre-bonding ceramic member (ceramic member to be bonded) may be extracted from the pre-bonding ceramic members.

Further, the present invention is not limited to the electrostatic chuck 100 that holds the wafer W by using electrostatic attraction, but can be applied to other holding devices (such as a vacuum chuck).

10: Ceramic member 10P: Ceramic member before joining 20 (20A to 20C): Base member 21: Refrigerant flow path 30: Joining portion 32: First member 34: Second member 40: Internal electrode 50: Heater 100: Static Electric chuck D1, D2: Thickness S1: Suction surface S1A: First region S1B: Second region S2: Ceramic side bonding surface S3: Base side bonding surface W: Wafer

Claims

A ceramic member having a first surface substantially perpendicular to the first direction and a second surface opposite to the first surface; a third surface, wherein the third surface is A base member disposed so as to be positioned on the second surface side of the ceramic member; and the ceramic member disposed between the second surface of the ceramic member and the third surface of the base member. In a manufacturing method of a holding device that includes a bonding portion that bonds a member and the base member, and holds an object on the first surface of the ceramic member,
Preparing a pre-bonding ceramic member that is the ceramic member before bonding through the bonding portion, and a pre-bonding base member that is the base member before bonding through the bonding portion;
Measuring a height difference distribution of at least one of the second surface of the ceramic member before bonding and the third surface of the base member before bonding;
Before joining the ceramic member before joining and the base member before joining, the first surface when the ceramic member before joining and the base member before joining are joined based on the measurement result of the height difference distribution. Predicting the temperature distribution of
Changing at least one configuration of the pre-bonding ceramic member, the pre-bonding base member, and the bonding portion according to a prediction result of the temperature distribution of the first surface;
including,
The manufacturing method of the holding | maintenance apparatus characterized by the above-mentioned.
In the manufacturing method of the holding device according to claim 1,
The prediction result of the temperature distribution of the first surface includes a first region where the first surface has a relatively high temperature and a second region where the temperature is relatively low.
The manufacturing method of the holding | maintenance apparatus characterized by the above-mentioned.
In the manufacturing method of the holding device according to claim 2,
According to the prediction result of the temperature distribution of the first surface, the thermal conductivity of the first joint portion that overlaps the first region in the first direction in the joint portion is Among them, the configuration of the joint portion is changed so as to be higher than the thermal conductivity of the second joint portion overlapping the second region in the first direction view.
The manufacturing method of the holding | maintenance apparatus characterized by the above-mentioned.
In the manufacturing method of the holding device according to claim 2,
Of the second surface of the ceramic member before bonding, a portion that overlaps the second region as viewed in the first direction is processed.
The manufacturing method of the holding | maintenance apparatus characterized by the above-mentioned.
In the manufacturing method of the holding device according to claim 2,
Of the third surface of the base member before bonding, a portion that overlaps the second region as viewed in the first direction is processed.
The manufacturing method of the holding | maintenance apparatus characterized by the above-mentioned.
A ceramic member having a first surface substantially perpendicular to the first direction and a second surface opposite to the first surface; a third surface, wherein the third surface is A base member disposed so as to be positioned on the second surface side of the ceramic member; and the ceramic member disposed between the second surface of the ceramic member and the third surface of the base member. In a manufacturing method of a holding device that includes a bonding portion that bonds a member and the base member, and holds an object on the first surface of the ceramic member,
Preparing a pre-bonding ceramic member that is the ceramic member before being bonded via the bonding portion, and a plurality of pre-bonding base members including the base member before being bonded via the bonding portion;
Measuring the height difference distribution of the second surface of the pre-bonding ceramic member and the height difference distribution of the third surface of each of the plurality of base members before bonding;
Before joining the ceramic member before joining and the base member before joining, the ceramic member before joining and each of the plurality of base members before joining are joined based on the measurement result of the height difference distribution. Predicting the temperature distribution of the first surface;
Extracting one of the pre-joining base members from the plurality of pre-joining base members according to a prediction result of the temperature distribution of the first surface;
Bonding the pre-bonding ceramic member and the extracted pre-bonding base member via the bonding portion;
including,
The manufacturing method of the holding | maintenance apparatus characterized by the above-mentioned.
A ceramic member having a first surface substantially perpendicular to the first direction and a second surface opposite to the first surface; a third surface, wherein the third surface is A base member disposed so as to be positioned on the second surface side of the ceramic member; and the ceramic member disposed between the second surface of the ceramic member and the third surface of the base member. In a manufacturing method of a holding device that includes a bonding portion that bonds a member and the base member, and holds an object on the first surface of the ceramic member,
Preparing a plurality of pre-bonding ceramic members including the ceramic member before being bonded via the bonding portion, and a pre-bonding base member being the base member before being bonded via the bonding portion;
Measuring the height difference distribution of the second surface of each of the plurality of pre-bonding ceramic members and the height difference distribution of the third surface of the base member before bonding;
Before joining the pre-joining ceramic member and the pre-joining base member, based on the measurement result of the height difference distribution, the plurality of pre-joining ceramic members and the pre-joining base member are joined together. Predicting the temperature distribution of the first surface;
A step of extracting one pre-bonding ceramic member from the plurality of pre-bonding ceramic members according to a prediction result of the temperature distribution of the first surface;
Bonding the extracted pre-bonding ceramic member and the pre-bonding base member via the bonding portion;
including,
The manufacturing method of the holding | maintenance apparatus characterized by the above-mentioned.