WO2019205549A1 - 双面显示面板及其制备方法 - Google Patents

双面显示面板及其制备方法 Download PDF

Info

Publication number
WO2019205549A1
WO2019205549A1 PCT/CN2018/113044 CN2018113044W WO2019205549A1 WO 2019205549 A1 WO2019205549 A1 WO 2019205549A1 CN 2018113044 W CN2018113044 W CN 2018113044W WO 2019205549 A1 WO2019205549 A1 WO 2019205549A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
substrate
light
display unit
light reflecting
Prior art date
Application number
PCT/CN2018/113044
Other languages
English (en)
French (fr)
Inventor
冯雪欢
李永谦
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/475,303 priority Critical patent/US11289564B2/en
Publication of WO2019205549A1 publication Critical patent/WO2019205549A1/zh

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/128Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/856Arrangements for extracting light from the devices comprising reflective means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/86Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80522Cathodes combined with auxiliary electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8791Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3031Two-side emission, e.g. transparent OLEDs [TOLED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/878Arrangements for extracting light from the devices comprising reflective means

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a double-sided display panel and a method of fabricating the same.
  • a double-sided display panel including:
  • first display unit located between the second substrate and the first substrate, the first display unit comprising a first light emitting layer and a first light reflecting layer disposed closer to the second substrate than the first light emitting layer The light emitted by the first luminescent layer is emitted from the first substrate by being reflected by the first reflective layer;
  • a second display unit is disposed between the first substrate and the second substrate, and the second display unit includes a second luminescent layer, wherein light emitted by the second luminescent layer is emitted through the second substrate.
  • the double-sided display panel further includes:
  • a black matrix that sets a side of the second substrate facing the first substrate.
  • the first display unit includes a transparent electrode, a conductive contact layer, and a layer disposed between the black matrix and the first light emitting layer from the first light emitting layer to the black matrix.
  • the first light reflecting layer wherein at least a portion of the conductive contact layer is in contact with the black matrix layer, and the conductive contact layer forms an electrical connection between the first light reflecting layer and the transparent electrode.
  • the first display unit includes a transparent electrode, a conductive contact layer, and a second layer disposed between the black matrix and the first light emitting layer from the first light emitting layer to the black matrix. a light reflecting layer and a spacer layer, at least a portion of the conductive contact layer being in contact with the black matrix, and the conductive contact layer forming an electrical connection between the first light reflecting layer and the transparent electrode.
  • the first display unit includes a transparent electrode, a conductive contact layer, and a spacer disposed between the black matrix and the first light emitting layer from the first light emitting layer to the black matrix. a layer of material and the first light reflecting layer, the spacer layer being located between a portion of the first light reflecting layer and the conductive contact layer, at least a portion of the conductive contact layer being in contact with the first light reflecting layer and The conductive contact layer forms an electrical connection between the first light reflecting layer and the transparent electrode.
  • the black matrix includes a light blocking region and an open region.
  • the first display unit is located between the light shielding region of the black matrix and the first substrate.
  • the second display unit further includes an array circuit layer between the first substrate and the second light emitting layer, the array circuit layer configured to control the first display unit and the The light output of the second display unit is described.
  • the first display unit further includes a first color filter layer; and/or the second display unit further includes a second color filter layer.
  • the second display unit further includes a second color filter layer, and the second color filter layer is located in an open area of the black matrix.
  • the first light reflecting layer is an auxiliary cathode metal layer made of a metal material.
  • the first light reflecting layer comprises a plurality of strips or a plurality of dots made of a metal material that is opaque; or the first light reflecting layer comprises a metal material that is opaque A single layer made.
  • the second display unit further includes a thin film encapsulation layer between the second color filter layer and the second luminescent layer.
  • the second display unit further includes an encapsulant layer between the color filter layer and the second luminescent layer.
  • a method of preparing a double-sided display panel including:
  • first display unit Forming a first display unit between the second substrate and the first substrate, the first display unit including a first luminescent layer and a first one disposed closer to the second substrate than the first luminescent layer a light reflecting layer, wherein light emitted by the first light emitting layer is emitted from the first substrate by being reflected by the first light reflecting layer;
  • a second display unit is formed between the first substrate and the second substrate, the second display unit includes a second luminescent layer, wherein light emitted by the second luminescent layer is emitted through the second substrate.
  • the method before the step of forming the first display unit between the second substrate and the first substrate, the method further includes:
  • a black matrix is formed on a side of the second substrate facing the first substrate.
  • the step of forming a first display unit between the second substrate and the first substrate comprises sequentially forming the first light reflecting layer and covering the first layer on the black matrix a conductive contact layer of the light reflecting layer, the conductive contact layer being pressed together with a transparent electrode on the first light emitting layer by a pressing process and electrically connecting the first light reflecting layer and the transparent electrode.
  • the step of forming a first display unit between the second substrate and the first substrate comprises sequentially forming a spacer layer on the black matrix, the a first light reflecting layer and a conductive contact layer covering the spacer layer and the first light reflecting layer, the conductive contact layer being pressed and electrically connected to a transparent electrode on the first light emitting layer by a pressing process
  • the first light reflecting layer and the transparent electrode are described.
  • the step of forming a first display unit between the second substrate and the first substrate comprises sequentially forming the first light reflecting layer on the black matrix, at the first a spacer layer on a portion of the light reflecting layer, a conductive contact layer covering the spacer layer, the conductive contact layer being pressed together with a transparent electrode on the first light emitting layer by a pressing process and electrically connected to the first a light reflecting layer and the transparent electrode.
  • the first luminescent layer and the second luminescent layer are luminescent layers fabricated by the same patterning process.
  • the method further includes:
  • a space between the black matrix and the second luminescent layer is encapsulated with an encapsulant layer.
  • FIG. 1A illustrates a schematic diagram of a pixel structure of an OLED double-sided display panel according to an embodiment of the present disclosure
  • FIG. 1B illustrates a cross-sectional structural view of an OLED double-sided display panel according to an embodiment of the present disclosure
  • FIG. 1C illustrates a cross-sectional structural view of an OLED double-sided display panel according to an embodiment of the present disclosure
  • FIG. 2 illustrates a cross-sectional structural view of an OLED double-sided display panel in accordance with an embodiment of the present disclosure
  • FIG. 3 illustrates a cross-sectional structural view of an OLED double-sided display panel according to an embodiment of the present disclosure.
  • the relative positional relationship may also be Change accordingly.
  • an element such as a layer, a film, a region, or a substrate is referred to as being “on” or “under” another element, the element may be "directly" There are intermediate components.
  • FIG. 1A illustrates a schematic diagram of a pixel structure of an OLED double-sided display panel according to an embodiment of the present disclosure.
  • Nine display pixels are shown in FIG. 1A, each display pixel comprising two adjacent display units, namely a first display unit 30 and a second display unit 40.
  • the OLED double-sided display panel may further include other numbers of display pixels, and each display pixel may also include other numbers of display units than two, such as phase. Multiple display units in two or more adjacent columns. That is, the present disclosure does not limit the display pixels of the OLED double-sided display panel and the distribution of the display unit.
  • the first display unit 30 and the second display unit 40 are shown in different figures in FIG. 1A for differentiation.
  • FIG. 1B illustrates a cross-sectional structural view of an OLED double-sided display panel according to an embodiment of the present disclosure.
  • the OLED double-sided display panel 100 includes a first substrate 10 and a second substrate 20 which are disposed opposite to each other, and a first display unit 30 and a second display unit 40 interposed therebetween.
  • the first substrate 10 and the second substrate 20 are respectively disposed as substrates capable of transmitting light, such as a glass substrate.
  • a black matrix 36 is disposed between the first substrate 10 and the second substrate 20, for example, a black matrix 36 is disposed on a side of the first substrate 10 and the second substrate 20 adjacent to the second substrate 20,
  • the black matrix 36 includes a light shielding region 38 and an opening region 47, and the first display unit 30 is located between the light shielding region 38 of the black matrix 36 and the first substrate 10.
  • a positional relationship is not absolute, and for example, a majority of the first display unit 30 may be located between the light-shielding region 38 of the black matrix 36 and the first substrate 10.
  • the first display unit 30 includes a first OLED light emitting layer 323 , a first light reflecting layer 35 disposed closer to the light shielding region 38 of the black matrix 36 than the first OLED light emitting layer 323 , wherein the first OLED light emitting layer 323 The emitted light is emitted from the first substrate 10 by being reflected by the first light reflecting layer 35.
  • the black matrix 36 is directly disposed on the second substrate 20, and the first light reflecting layer 35 is directly disposed on the light shielding region 38 of the black matrix 36.
  • the second display unit 40 is located between the first substrate 10 and the open area 47 of the black matrix 36.
  • a positional relationship is not absolute, and for example, a majority of the second display unit 40 may be located between the first substrate 10 and the open area 47 of the black matrix 36.
  • the second display unit 40 includes a second OLED light emitting layer 423 , wherein light emitted by the second OLED light emitting layer 423 is emitted from the second substrate 20 through the opening 47 of the black matrix 36 .
  • the OLED double-sided display panel of the present disclosure can realize double-sided display.
  • the black matrix 36 is disposed on a side of the second substrate 20 facing the first substrate 10, and the first display unit 30 is disposed between the light shielding region 38 of the black matrix 36 and the first substrate 10, Therefore, the light emitted by the first OLED light emitting layer 323 is blocked and reflected by the first light reflecting layer 35, so that the light emitted by the first OLED light emitting layer 323 can be emitted from the first substrate 10 and cannot be emitted from the second substrate 20;
  • the second display unit 40 is disposed between the opening region 47 of the black matrix 36 and the first substrate 10, so that light emitted from the second OLED light-emitting layer 423 is not blocked by the black matrix 36 and can be directly emitted from the second substrate 20.
  • the black matrix 36 may not be disposed between the first substrate 10 and the second substrate 20 as long as the light emitted from the first display unit 30 and the second display unit 40 can be made from the first substrate 10 and the second substrate, respectively. 20 shots can be.
  • one first display unit 30 and one second display unit 40 are disposed adjacent to each other. They can be placed adjacent to each other along the same row or column, or they can be placed in two or more adjacent columns. In some embodiments, the first display unit 30 and the second display unit 40 may also be disposed in two rows or two columns that are not adjacent, respectively. It will be understood that those skilled in the art can appropriately set the specific positions of the first display unit 30 and the second display unit 40 as needed, without being limited to the specific examples described in the present disclosure.
  • first display unit 30 and one second display unit 40 may further include more first display unit 30 and second display unit 40.
  • the plurality of first display units 30 and the second display unit 40 are not necessarily arranged to be adjacent to one first display unit 30 and one second display unit 40. Those skilled in the art can set their arrangement forms as needed, for example. Arranged in a matrix or in any pattern preset.
  • both sides of the OLED double-sided display panel 100 need to have light emitted therefrom.
  • the two faces described herein refer to the side on which the first substrate 10 of the OLED double-sided display panel 100 is located and the side on which the second substrate 20 is located, which may also be referred to as front and back.
  • the first substrate 10 and the second substrate 20 described herein and the front or the back are not intended to be limiting, only to distinguish them in the description, so that those skilled in the art can The inventive concept of the present disclosure will be more clearly understood. Or, you can replace each other as needed.
  • first display unit 30 and the second display unit 40 are spaced apart by a pixel defining layer 50.
  • first display unit 30 and the second display unit 40 described in the present disclosure may be one pixel, for example, including three sub-pixels of red, green and blue (RGB); of course, they may also be one sub-pixel, respectively.
  • the first display unit 30 includes a first color filter layer 31, a first OLED device layer 32, a conductive contact layer 33, a spacer layer 34, and a first light reflecting layer 35. These film layers are sequentially disposed between them in the direction from the first substrate 10 to the second substrate 20.
  • the first color filter layer 31 is directly on the first substrate 10 and includes a red filter layer 311, a green filter layer 312, and a blue filter layer 313.
  • the first OLED device layer 32 is on the first color filter layer 31.
  • the first display unit 30 further includes a first planarization layer 37 between the first OLED device layer 32 and the first color filter layer 31.
  • the first OLED device layer 32 includes a transparent cathode 321, a transparent anode 322, and a first OLED light-emitting layer 323 therebetween.
  • the transparent anode 322 is located on the first planarization layer 37 or on the first color filter layer 31, and the conductive contact layer 33 contacts the transparent cathode 321 at one end and the first reflective layer 35 at the other end.
  • the transparent cathode 321 and the conductive contact layer 33 are both made of indium tin oxide material (ITO), which may be formed by the same process or different processes.
  • ITO indium tin oxide material
  • the transparent cathode 321 and the conductive contact layer 33 may be formed by different processes and then pressed together by a pressing process, thereby finally electrically connecting the transparent cathode 321 and the first light reflecting layer 35 through the conductive contact layer 33.
  • the second substrate 20 is directly provided with a black matrix 36 on one surface of the first substrate 10, and the black matrix 36 includes a light shielding region 38 and an opening region 47.
  • a first light reflecting layer 35 is disposed on the light shielding region 38 of the black matrix 36.
  • a spacer layer 34 is disposed on a portion of the first light reflecting layer 35, and the conductive contact layer 33 at least partially covers the spacer layer 34.
  • the conductive contact layer 33 completely covers the spacer layer 34 and a portion thereof contacts the surface of the first light reflecting layer 35, or the spacer layer 34 is located at a portion of the first light reflecting layer 35 and the conductive contact layer. Between 33.
  • the orthographic projection of the spacer layer 34 on the first light reflecting layer 35 is less than the orthographic projection of the conductive contact layer 33 on the first light reflecting layer 35.
  • the first light reflecting layer 35 is made of a metal material.
  • the first light reflecting layer 35 is also referred to as an auxiliary cathode metal layer.
  • the first light reflecting layer 35 includes a plurality of strips or a plurality of dots made of a metal material that is opaque; or the first light reflecting layer 35 includes a metal that is opaque A single layer made of material.
  • the downwardly propagating light emitted by the first OLED device layer 32 is directly emitted from the second substrate 10, while a portion of the upwardly propagating light is reflected by the transparent cathode 321 and another portion of the light is transmitted by the first reflective layer 35. reflection.
  • the light reflected by the first light reflecting layer 35 sequentially passes through the conductive contact layer 33, the first OLED device layer 32, the first planarizing layer 37, the first color filter layer 31, and is emitted from the first substrate 10 (as shown in FIG. The solid arrow is shown).
  • the light reflected by the transparent cathode 321 sequentially passes through the first planarization layer 37, the first color filter layer 31, and is emitted from the first substrate 10 (indicated by solid arrows in the drawing). Finally, the user can be made to see the displayed image from the outside or the front of the first substrate 10.
  • this form of display unit or illuminating area is sometimes referred to as a bottom emission area because light is first emitted upwards and ultimately downwardly out of the display panel.
  • the second display unit 40 includes a second color filter layer 41, a second OLED device layer 42, a second light reflecting layer 45, and an array circuit layer 43. These layers are sequentially disposed between the first substrate 10 and the second substrate 20 in the direction from the second substrate 20 to the first substrate 10.
  • the second color filter layer 41 is disposed on a side of the open region 47 of the black matrix 36 close to the first substrate 10, and includes a red filter layer 411, a green filter layer 412, and a blue filter layer 413, see FIG. 1B.
  • the second color filter layer 41 is disposed in the opening region 47 of the black matrix 36, that is, on a surface of the second substrate 20 corresponding to the opening region 47 facing the first substrate 10, and includes a red filter layer 411, green filter layer 412 and blue filter layer 413, see FIG. 1C.
  • the second display unit 40 is directly located between the first substrate 10 and the second substrate 20.
  • a sealant layer 44 is further disposed between the second color filter layer 41 and the second OLED device layer 42.
  • the sealant layer 44 can be made of a transparent dry encapsulant.
  • the second light reflecting layer 45 between the second OLED device layer 42 and the array circuit layer 43 is made of a metal material that is opaque to light. In some examples, the second light reflecting layer 45 acts as a metal reflective anode to at least partially reflect light emitted from the second OLED device layer 42.
  • the second display unit 40 may further include a second planarization layer 46 disposed between the second light reflecting layer 45 and the array circuit layer 43.
  • the second OLED device layer 42 includes a transparent cathode 421, a transparent anode 422, and a second OLED luminescent layer 423 therebetween.
  • the transparent anode 422 is on the second light reflecting layer 45, and the transparent cathode 421 is in contact with the sealant layer 44.
  • the second light reflecting layer 45 may be provided in the same form as the first light reflecting layer 35, for example, including a plurality of strips, a plurality of dots, or a single layer. In the following embodiments, the second light reflecting layer 45 may be disposed as described above, and therefore will not be described again.
  • the light emitted from the second OLED device layer 42 is as shown by the solid arrows in the figure, and the upwardly propagating light is directly incident on the second color filter layer 41 and emitted from the second substrate 20 while being propagated downward.
  • the light is reflected by the second light reflecting layer 45 toward the second substrate 20 to be emitted from the second substrate 20, thus allowing the user to see the displayed image from the outside or the rear of the second substrate 20.
  • this form of display unit or light-emitting area is sometimes referred to as a top emission area because light directly exits the display panel.
  • the array circuit layer 43 may be configured to control the light output of the first display unit 30 and the second display unit 40, and may include various semiconductor devices, such as thin film transistors, to implement adjacent first display units 30 and The second display unit 40 simultaneously displays the same image on the front or the back of the OLED double-sided display panel.
  • various semiconductor devices such as thin film transistors, to implement adjacent first display units 30 and The second display unit 40 simultaneously displays the same image on the front or the back of the OLED double-sided display panel.
  • those skilled in the art can also set the array circuit layer 43 as needed so that different images are displayed in front of or behind the OLED double-sided display panel.
  • the spacer layer 34 and the conductive contact layer 33 which are stacked together are disposed between the first light reflecting layer 35 and the transparent cathode 321, the light emitted from the first OLED device layer 32 is caused. Light must be reflected over a long distance. In this way, the intensity of light emitted in the area of the first display unit 30 is reduced. However, the light emitted from the second OLED device layer 42 in the second display unit 40 does not need any reflection to directly exit the second substrate 20, and thus the light intensity of the first display unit 30 and the light intensity of the second display unit 40. Compared to the significantly lower. That is, the light intensity of the bottom emission area is low.
  • the spacer layer 34 and the conductive contact layer 33 are stacked on each other, the cell gap of the OLED double-sided display panel is also increased to some extent.
  • one embodiment of the present disclosure provides an OLED double-sided display panel.
  • FIG. 2 shows a schematic structural view of an OLED double-sided display panel 200 according to an embodiment of the present disclosure.
  • the OLED double-sided display panel 200 includes a first substrate 110 and a second substrate 120 disposed opposite to each other and a first display unit 130 and a second display unit 140 between the first substrate 110 and the second substrate 120.
  • the adjacent first display unit 130 and second display unit 140 are spaced apart by a pixel defining layer 150.
  • a black matrix 136 is disposed between the first substrate 110 and the second substrate 120, for example, a black matrix 136 is disposed on a side of the first substrate 110 and the second substrate 201 adjacent to the second substrate 120, The black matrix 136 includes a light blocking area and an opening area 147.
  • the first display unit 130 includes a first OLED light emitting layer 1323 and a first light reflecting layer 135 disposed closer to the black matrix 136 than the first OLED light emitting layer 1323, wherein the first OLED emits light. The light emitted by the layer 1323 is reflected from the first substrate 110 through the first light reflecting layer 135.
  • the black matrix 136 is directly disposed on one surface of the second substrate 20, the spacer layer 134 is disposed on the black matrix 136, and the first light reflecting layer 135 is disposed on the spacer layer 134.
  • the second display unit 140 is located between the first substrate 110 and the second substrate 120.
  • the second display unit 140 includes a second OLED light emitting layer 1423, wherein light emitted by the second OLED light emitting layer 1423 is emitted from the second substrate 120 through the open region 147 of the black matrix 136.
  • first display unit 130 and second display unit 140 are shown here, as an example.
  • the first display unit 130 includes a first color filter layer 131, a first OLED light emitting device 132, a conductive contact layer 133, a first light reflecting layer 135, and a spacer layer 134, respectively, along the first substrate 110.
  • the direction to the second substrate 120 is sequentially disposed between the first substrate 110 and the second substrate 120.
  • the upwardly propagating light emitted by the first OLED light emitting layer 1323 is reflected by the first light reflecting layer 135 or by the transparent cathode 1321 toward the first substrate 110, and the light reflected by the first light reflecting layer 135 sequentially passes through the conductive contact layer 133.
  • the first OLED light emitting device 132 and the first color filter layer 131 are emitted from the first substrate 110, as indicated by solid arrows in the figure, and only partially reflected light is schematically shown. route.
  • light reflected by the transparent cathode 1321 sequentially passes through the first OLED light emitting device 132, the first color filter layer 131, and is emitted from the first substrate 110; and the downward propagating light is directly worn.
  • the first color filter layer 131 is passed through and emitted from the first substrate 110.
  • the spacer layer 134 is directly disposed on the light shielding region of the black matrix 136, the first light reflecting layer 135 is located on the spacer layer 134, and the conductive contact layer 133 covers the spacer stacked with the first light reflecting layer 135. On layer 134. In other words, at least a portion (both sides of the drawing) of the conductive contact layer 133 is in contact with the black matrix 136 (specifically, the light-shielding region of the black matrix 136).
  • the spacer layer 134 is made to have a larger surface area than the OLED double-sided display panel 100 shown in FIGS. 1B, 1C, at least partially The cell gap of the illustrated OLED double-sided display panel 200 is reduced, and/or the aperture ratio is increased.
  • the optical path of the light reflected by the first light reflecting layer 135 in the first display unit 30 is also reduced while reducing the cell gap as described above, the light extraction efficiency of the first display unit 30 is also increased.
  • the conductive contact layer 133 surrounds the structure of the first light reflecting layer 135, and has at least one or a part of the following functions: a reflective electrode that can be used as the first OLED device layer 132, lifting the first OLED light emitting layer 1323 or the light emitting unit
  • the light extraction efficiency is further such that in the first display unit 130, the conductive contact layer 133 is substantially in contact with the entire surface of the transparent cathode 1321, so that not only the resistance voltage drop but also the contact between the conductive contact layer 133 and the transparent cathode 1321 can be reduced.
  • the interface can also increase the reflection effect at least to some extent. For this reason, the thickness of the transparent cathode 1321 can be at least partially reduced without increasing the resistance voltage drop.
  • the first light reflecting layer 135 includes a plurality of strip portions, a plurality of dot portions or an entire layer, which is made of a metal material.
  • the present disclosure does not limit the shape of the first light reflecting layer 135 as long as the light emitted from the first OLED device layer 132 can be reflected.
  • the first color filter layer 131 is directly on the first substrate 10 and includes a red filter layer 1311, a green filter layer 1312, and a blue filter layer 1313.
  • the first OLED device layer 132 is located on the first color filter layer 131.
  • the first display unit 130 further includes a first planarization layer 137 between the first OLED device layer 132 and the first color filter layer 131.
  • the first OLED device layer 132 includes a transparent cathode 1321, a transparent anode 1322, and a first OLED light emitting layer 1323 therebetween.
  • the transparent anode 1322 is located on the first planarization layer 137 or on the first color filter layer 131, and the conductive contact layer 133 is in contact with the transparent cathode 1321 at one end and the black matrix 136 at the other end.
  • the transparent cathode 1321 and the electrically conductive contact layer 133 are both made of indium tin oxide material (ITO), which may be formed by the same process or by different processes.
  • ITO indium tin oxide material
  • the transparent cathode 1321 and the conductive contact layer 133 may be formed by different processes and then pressed together by a pressing process, thereby finally electrically connecting the transparent cathode 1321 and the first light reflecting layer 135 through the conductive contact layer 133.
  • the second substrate 120 is directly provided with a black matrix 136 on one surface of the first substrate 110, and the black matrix 136 includes a light shielding region and an opening region 147.
  • a spacer layer 134 is disposed on the light shielding region of the black matrix 136, and the spacer layer 134 is provided with a first light reflecting layer 135.
  • the conductive contact layer 133 on the first light reflecting layer 135 at least partially covers the spacer layer 134. In the illustrated example, the conductive contact layer 133 completely covers the spacer layer 134.
  • the orthographic projection of the spacer layer 134 on the black matrix 136 is slightly less than the orthographic projection of the conductive contact layer 133 on the black matrix 136.
  • the first light reflecting layer 135 is made of a metal material that is opaque to light.
  • the first light reflecting layer 135 is also referred to as an auxiliary cathode metal layer.
  • a portion of the light emitted by the first OLED device layer 132 is reflected by the transparent cathode 1321 while another portion of the light is reflected by the first light reflecting layer 135 toward the first substrate 110.
  • the light reflected by the first light reflecting layer 135 passes through the conductive contact layer 133, the first OLED device layer 132, the first planarizing layer 137, the first color filter layer 131, and is emitted from the first substrate 110.
  • the user can be made to see the displayed image from the outside or the front of the first substrate 110.
  • the second display unit 140 includes a second color filter layer 141, a second OLED device layer 142, a second light reflecting layer 145, and an array circuit layer 143.
  • the layers are sequentially disposed between the first substrate 110 and the second substrate 120 in a direction from the second substrate 120 to the first substrate 110.
  • the second color filter layer 141 is disposed on the surface of the second substrate 120 facing the first substrate 110, in the opening region 147 where the black matrix 136 is disposed, and includes a red filter layer 1411, a green filter layer 1412, and a blue filter. Layer 1413.
  • a sealant layer 144 is further disposed between the second color filter layer 141 and the second OLED device layer 142.
  • the sealant layer 144 can be made of a transparent dry encapsulant.
  • the second light reflecting layer 145 between the second OLED device layer 142 and the array circuit layer 143 is made of a light-tight metal material, and the second light reflecting layer 145 may be disposed to be reflective with the first light.
  • Layer 135 has the same or similar structure or shape.
  • the second light reflecting layer 145 functions as a metal reflective anode to at least partially reflect light emitted from the second OLED device layer 142.
  • the second display unit 40 may further include a second planarization layer 146 disposed between the second light reflecting layer 145 and the array circuit layer 143.
  • the second OLED device layer 142 includes a transparent cathode 1421, a transparent anode 1422, and a second OLED light emitting layer 1423 therebetween.
  • the transparent anode 1422 is located on the second light reflecting layer 145, and the transparent cathode 1421 is in contact with the sealant layer 144.
  • the light emitted from the second OLED device layer 142 as indicated by the arrow shown, the upwardly propagating light is directed toward the second color filter layer 141 and is emitted from the second substrate 120 and propagates downward by the second light.
  • the light reflecting layer 145 reflects and is emitted from the second substrate 120 so that the user can see the displayed image from the outside or the back of the second substrate 120.
  • the array circuit layer 143 may be configured to simultaneously control the light output of the first display unit 130 and the second display unit 140, and may include various semiconductor devices, such as thin film transistors, to implement adjacent first display units 130. And the second display unit 140 simultaneously displays the same image on the front or the back of the OLED double-sided display panel.
  • the array circuit layer 143 can also set the array circuit layer 143 as needed to display different images in front of or behind the OLED dual-sided display panel.
  • FIG. 3 illustrates a schematic structural view of an OLED double-sided display panel according to an embodiment of the present disclosure.
  • the structure of the OLED double-sided display panel 200' is substantially the same as that of the OLED double-sided display panel 200 shown in FIG. Recombination of the components common to them will not be repeated below, but for the sake of brevity they are denoted by the same reference numerals.
  • the first display unit 130 of the OLED double-sided display panel 200' no longer includes the spacer layer 134, and thus the first light reflecting layer 135 is disposed directly on the black matrix 136.
  • the first light reflecting layer 135 is provided with a conductive contact layer 133 surrounding or covering it. In other words, at least a portion of the conductive contact layer 133 (eg, both sides of the illustration) is in contact with the black matrix 136.
  • a thin film encapsulation layer 144' is disposed between the second color filter layer 141 and the second OLED device layer 142.
  • the thin film encapsulation layer 144' will have a smaller thickness than the encapsulation layer 144, such as made of glass.
  • the spacer layer 134 for planarization can be omitted, further reducing the cell gap of the double-sided display panel, thereby reducing the absorption of light by the black matrix 136, so that the first display unit 130 has a higher light output. effectiveness.
  • the use of the thin film encapsulation layer 144' in the second display unit 140 also makes it possible to make the cell gap of the OLED double-sided display panel smaller.
  • the thin film encapsulation layer itself can be made to have a smaller thickness than the sealant layer made of a transparent dry encapsulant.
  • Such an arrangement can further reduce the distance between the first light reflecting layer and the first OLED device layer, so that the light extraction efficiency is higher while at least partially reducing the cell gap and increasing the aperture ratio.
  • One embodiment of the present disclosure provides a method of preparing an OLED double-sided display panel, as shown in FIGS. 1-3, including the following steps:
  • first display unit 30, 130 Forming a first display unit 30, 130 between the light-shielding region 38 of the black matrix 36, 136 and the first substrate 10, 110, the first display unit 30, 130 including the first OLED light-emitting layer 323, 1323 and The first OLED light emitting layer 323, 1323 is closer to the first light reflecting layer 35, 135 disposed by the black matrix 36, 136, wherein light emitted by the first OLED light emitting layer 323, 1323 is reflected by the first light reflecting layer 35, 135 Ejected from the first substrate 10, 110;
  • the second display unit 40, 140 Forming a second display unit 40, 140 between the first substrate 10, 110 and the open areas 47, 147 of the black matrix 36, 136, the second display unit 40, 140 comprising a second OLED light emitting layer 423, 1423 The light emitted by the second OLED light-emitting layers 423, 1423 is emitted from the second substrate through the open regions 47, 147 of the black matrix 36, 136.
  • the method further includes sequentially forming the first light reflecting layer 35 on the black matrix 36, and the spacer layer 34 on a portion of the first light reflecting layer 35. Covering the conductive contact layer 33 of the spacer layer 34, the conductive contact layer 33 is transparent to a transparent electrode on the first OLED light-emitting layer 323 by a pressing process (for example, one of the transparent anode 322 and the transparent cathode 321) The electrodes are pressed together and electrically connected to the first light reflecting layer 35 and the transparent electrode (ie, the illustrated transparent cathode 321).
  • the encapsulation layer 44 may also be used to encapsulate the color filter layer 41 located in the opening region 37 of the black matrix 36 and the transparent electrode (ie, the illustrated transparent cathode 421). space.
  • the method further includes sequentially forming a spacer layer 134 on the black matrix 136, the first light reflecting layer 135 on the spacer layer 134, and covering the spacer layer 134 and the a conductive contact layer 133 of the first light reflecting layer 135, which is pressed by a pressing process with a transparent electrode (for example, one of the transparent anode 1322 and the transparent cathode 1321) on the first OLED light emitting layer 1323
  • a transparent electrode for example, one of the transparent anode 1322 and the transparent cathode 1321
  • the first light reflecting layer 135 and the transparent electrode are electrically connected together.
  • the encapsulation layer 144 may also be used to encapsulate the space between the color filter layer 141 and the transparent electrode 1421 in the open region 137 of the black matrix 136.
  • the method further includes sequentially forming the first light reflecting layer 135 and the conductive contact layer 133 covering the first light reflecting layer 135 on the black matrix 136, and the conductive contact layer 133 passes The pressing process is pressed together with a transparent electrode (for example, one of the transparent anode 1322 and the transparent cathode 1321) on the first OLED light-emitting layer 1323 and electrically connects the first light-reflecting layer 135 and the transparent electrode.
  • a transparent electrode for example, one of the transparent anode 1322 and the transparent cathode 1321
  • the space between the color filter layer 141 and the transparent electrode 1421 in the open region 137 of the black matrix 136 may also be encapsulated by the thin film encapsulation layer 144'.
  • the first OLED light emitting layers 323, 1323 and the second OLED light emitting layers 423, 1423 are OLED light emitting layers fabricated by the same patterning process.
  • they may be the same OLED luminescent layer, or they may be different OLED luminescent layers having the same structure.
  • the first light reflecting layer 35 may also be made of a plurality of strips or dots from a metal material, for example, distributed in a pattern such as a dot matrix or the like.
  • the foregoing embodiment describes a double-sided display panel according to the present disclosure and a method of fabricating the same with reference to an OLED display panel.
  • the double-sided display structure according to the present disclosure is also applicable to a QLED (quantum dot light emitting diode) display panel, This can construct a QLED double-sided display panel and a method of preparing a QLED double-sided display panel, which will not be described herein.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种双面显示面板及其制备方法。所述双面显示面板包括:第一基板;第二基板,与所述第一基板相对;第一显示单元,位于所述第二基板和第一基板之间,所述第一显示单元包括第一发光层和比所述第一发光层更靠近所述第二基板设置的第一反光层,其中所述第一发光层发出的光经由所述第一反光层反射从第一基板射出;第二显示单元,位于所述第一基板和第二基板之间,所述第二显示单元包括第二发光层,其中所述第二发光层发出的光通过第二基板射出。

Description

双面显示面板及其制备方法
相关申请的交叉引用
本申请要求于2018年4月23日递交的中国专利申请CN201810370090.1的权益,其全部内容通过参考并入本文中。
技术领域
本公开涉及显示技术领域,尤其涉及一种双面显示面板及其制备方法。
背景技术
目前,随着显示面板的不断发展,特别是OLED显示面板以其高的对比度和低的功耗成为未来显示面板的发展趋势。
在显示领域中,特别是OLED显示面板对双面显示的要求越来越迫切。
公开内容
根据本公开的一个方面,提供了一种双面显示面板,包括:
第一基板;
第二基板,与所述第一基板相对;
第一显示单元,位于所述第二基板和第一基板之间,所述第一显示单元包括第一发光层和比所述第一发光层更靠近所述第二基板设置的第一反光层,其中所述第一发光层发出的光经由所述第一反光层反射从第一基板射出;
第二显示单元,位于所述第一基板和第二基板之间,所述第二显示单元包括第二发光层,其中所述第二发光层发出的光通过第二基板射出。
在一些实施例中,所述双面显示面板还包括:
黑矩阵,所述黑矩阵设置第二基板的面向第一基板的一侧。
在一些实施例中,所述第一显示单元包括位于所述黑矩阵和所述第 一发光层之间从所述第一发光层向所述黑矩阵依次设置的透明电极、导电接触层和所述第一反光层,其中所述导电接触层的至少一部分与所述黑矩阵层接触,并且所述导电接触层在所述第一反光层和所述透明电极之间形成电连接。
在一些实施例中,所述第一显示单元包括位于所述黑矩阵和所述第一发光层之间从所述第一发光层向所述黑矩阵依次设置的透明电极、导电接触层、第一反光层和间隔物层,所述导电接触层的至少一部分与所述黑矩阵接触,并且所述导电接触层在所述第一反光层和所述透明电极之间形成电连接。
在一些实施例中,所述第一显示单元包括位于所述黑矩阵和所述第一发光层之间从所述第一发光层向所述黑矩阵依次设置的透明电极、导电接触层、间隔物层和所述第一反光层,所述间隔物层位于所述第一反光层的一部分和所述导电接触层之间,所述导电接触层的至少一部分与所述第一反光层接触并且所述导电接触层在所述第一反光层和所述透明电极之间形成电连接。
在一些实施例中,所述黑矩阵包括遮光区域和开口区域。
在一些实施例中,所述第一显示单元位于黑矩阵的遮光区域与第一基板之间。
在一些实施例中,所述第二显示单元还包括位于所述第一基板和所述第二发光层之间的阵列电路层,所述阵列电路层配置成控制所述第一显示单元和所述第二显示单元的出光。
在一些实施例中,所述第一显示单元还包括第一彩色滤光层;和/或,所述第二显示单元还包括第二彩色滤光层。
在一些实施例中,所述第二显示单元还包括第二彩色滤光层,并且所述第二彩色滤光层位于黑矩阵的开口区域中。
在一些实施例中,所述第一反光层为由金属材料制成的辅助阴极金属层。
在一些实施例中,所述第一反光层包括由不透光的金属材料制成的多个条状部或多个点状部;或所述第一反光层包括由不透光的金属材料制成的单个层。
在一些实施例中,所述第二显示单元还包括第二彩色滤光层和所述第二发光层之间的薄膜封装层。
在一些实施例中,所述第二显示单元还包括彩色滤光层和所述第二发光层之间的封装胶层。
根据本公开的另一方面,提供了一种制备双面显示面板的方法,包括:
设置对置的第一基板和第二基板;
在所述第二基板和所述第一基板之间形成第一显示单元,所述第一显示单元包括第一发光层和比所述第一发光层更靠近所述第二基板设置的第一反光层,其中第一发光层发出的光经由所述第一反光层反射从第一基板射出;
在所述第一基板和第二基板之间形成第二显示单元,所述第二显示单元包括第二发光层,其中所述第二发光层发出的光通过第二基板射出。
在一些实施例中,在所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤之前,所述方法还包括:
在所述第二基板的面向第一基板的一侧形成黑矩阵。
在一些实施例中,所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤包括在所述黑矩阵上依次形成所述第一反光层和覆盖所述第一反光层的导电接触层,所述导电接触层通过压制工艺与位于所述第一发光层上的透明电极压制在一起并电连接所述第一反光层和所述透明电极。
在一些实施例中,所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤包括在所述黑矩阵上依次形成间隔物层、位于间隔物层上的所述第一反光层以及覆盖所述间隔物层和所述第一反光层的导电接触层,所述导电接触层通过压制工艺与位于所述第一发光层上的透明电极压制在一起并电连接所述第一反光层和所述透明电极。
在一些实施例中,所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤包括在所述黑矩阵上依次形成所述第一反光层、位于所述第一反光层的一部分上的间隔物层、覆盖所述间隔物层的导电接触层,所述导电接触层通过压制工艺与位于所述第一发光层上的透明电极 压制在一起并电连接所述第一反光层和所述透明电极。
在一些实施例中,所述第一发光层和所述第二发光层是由同一图案化工艺制造的发光层。
在一些实施例中,所述方法还包括:
利用薄膜封装层封装位于所述黑矩阵和所述第二发光层之间的空间;或
利用封装胶层封装位于所述黑矩阵和所述第二发光层之间的空间。
附图说明
为了更清楚地说明本公开文本的实施例的技术方案,下面将对实施例的附图进行简要说明,应当知道,以下描述的附图仅仅涉及本公开文本的一些实施例,而非对本公开文本的限制,其中:
图1A示出根据本公开的一个实施例的一种OLED双面显示面板的像素结构示意图;
图1B示出根据本公开的一个实施例的一种OLED双面显示面板的截面结构示意图;
图1C示出根据本公开的一个实施例的一种OLED双面显示面板的截面结构示意图;
图2示出根据本公开的一个实施例的一种OLED双面显示面板的截面结构示意图;和
图3示出根据本公开的一实施例的一种OLED双面显示面板的截面结构示意图。
具体实施方式
为更清楚地阐述本公开的目的、技术方案及优点,以下将结合附图对本公开的实施例进行详细的说明。应当理解,下文对于实施例的描述旨在对本公开的总体构思进行解释和说明,而不应当理解为是对本公开的限制。在说明书和附图中,相同或相似的附图标记指代相同或相似的部件或构件。为了清晰起见,附图不一定按比例绘制,并且附图中可能省略了一些公知部件和结构。
除非另外定义,本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。措词“一”或“一个”不排除多个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”、“顶”或“底”等等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。当诸如层、膜、区域或衬底之类的元件被称作位于另一元件“上”或“下”时,该元件可以“直接”位于另一元件“上”或“下”,或者可以存在中间元件。
图1A示出根据本公开的一个实施例的一种OLED双面显示面板的像素结构示意图。图1A中示出了九个显示像素,每个显示像素包括两个相邻的显示单元,即第一显示单元30和第二显示单元40。可以理解,图1A所显示的结构仅是示例性的,该OLED双面显示面板还可以包括其它数量的显示像素,每个显示像素也可以包括除两个以外的其它数量的显示单元,例如相邻的两行或两列中的多个显示单元。也就是说,本公开并不限制OLED双面显示面板的显示像素以及显示单元的分布。图1A中为了区分而将第一显示单元30和第二显示单元40用不同的图形示出。
图1B示出根据本公开的一个实施例的一种OLED双面显示面板的截面结构示意图。该OLED双面显示面板100包括相对设置的第一基板10和第二基板20,以及位于它们之间的第一显示单元30和第二显示单元40。在本公开的一些实施例中,为了实现双面显示,第一基板10和第二基板20分别设置成能够透光的基板,例如玻璃基板。
在一些实施例中,在第一基板10和第二基板20之间设置黑矩阵36,例如黑矩阵36设置在第一基板10和第二基板20之间的靠近第二基板20的一侧,黑矩阵36包括遮光区域38和开口区域47,第一显示单元30位于所述黑矩阵36的遮光区域38和第一基板10之间。然而,这种位置关系并不是绝对的,例如可以是第一显示单元30的大部分位于所述黑矩阵 36的遮光区域38和第一基板10之间。第一显示单元30包括第一OLED发光层323、比所述第一OLED发光层323更靠近所述黑矩阵36的遮光区域38设置的第一反光层35,其中所述第一OLED发光层323发出的光经由所述第一反光层35反射从第一基板10射出。在本实施例中,黑矩阵36直接设置在第二基板20上,而第一反光层35直接设置在该黑矩阵36的遮光区域38上。
在一些实施例中,第二显示单元40位于所述第一基板10和黑矩阵36的开口区域47之间。然而,这种位置关系并不是绝对的,例如可以是第二显示单元40的大部分位于所述第一基板10和黑矩阵36的开口区域47之间。所述第二显示单元40包括第二OLED发光层423,其中所述第二OLED发光层423发出的光通过所述黑矩阵36的开口47从第二基板20射出。
通过上述的结构布置,由于第一显示单元30和第二显示单元40分别从第一基板10和第二基板20射出光,故本公开的OLED双面显示面板可以实现双面显示。在前述的实施例中,在第二基板20的面向第一基板10的一侧设置了黑矩阵36,而第一显示单元30设置在黑矩阵36的遮光区域38和第一基板10之间,因此第一OLED发光层323发出的光被阻挡并被第一反光层35反射,从而使得第一OLED发光层323发出的光能够从第一基板10射出,而不能从第二基板20射出;第二显示单元40设置在黑矩阵36的开口区域47和第一基板10之间,因此第二OLED发光层423发出的光没有被黑矩阵36阻挡而能够直接从第二基板20射出。由此,实现了第一显示单元30和第二显示单元40分别从第一基板10和第二基板20射出光。
替代地,在第一基板10和第二基板20之间也可以不设置黑矩阵36,只要能够使第一显示单元30和第二显示单元40发出的光分别从第一基板10和第二基板20射出即可。
如图1B所示,一个第一显示单元30和一个第二显示单元40彼此相邻设置。它们可以沿着同一行或同一列相邻设置,还可以设置成分别位于相邻的两行或两列中。在一些实施例中,所述第一显示单元30和第二显示单元40还可以设置成分别在不相邻的两行或两列中。可以理解,本 领域技术人员可以根据需要适当设置第一显示单元30和第二显示单元40的具体位置,而不限于本公开所描述的具体示例。
虽然仅示出一个第一显示单元30和一个第二显示单元40,但是可以理解,本公开的OLED双面显示面板还可以包括更多的第一显示单元30和第二显示单元40。该多个第一显示单元30和第二显示单元40并非必须要设置成一个第一显示单元30和一个第二显示单元40相邻,本领域技术人员可以根据需要设置它们的排布形式,例如呈矩阵或以预先设定的任何图案布置。
为了能够实现双面显示,该OLED双面显示面板100的两个面都需要有光从其中射出。此处所述的两个面是指该OLED双面显示面板100的第一基板10所在的一面和第二基板20所在的一面,它们有时还可以称为前面和后面。需要说明的是,此处所述的第一基板10和第二基板20以及前面或后面并不是要起到任何限定作用,仅是为了在描述中对它们进行区分,以便于本领域技术人员能够更加清楚地理解本公开的发明构思。或者说,可以根据需要相互替换使用。
下面以将第一显示单元30和第二显示单元40设置成在同一行或同一列中且彼此相邻为例进行说明。相邻的第一显示单元30和第二显示单元40之间通过像素界定层50间隔开。可以理解,本公开所述的第一显示单元30和第二显示单元40可以分别是一个像素,例如包括红绿蓝(RGB)三个子像素;当然他们还可以分别是一个子像素。
第一显示单元30包括第一彩色滤光层31、第一OLED器件层32、导电接触层33、间隔物层34、第一反光层35。这些膜层沿从第一基板10至第二基板20的方向依次设置在它们之间。具体地,第一彩色滤光层31直接位于第一基板10上,并且包括红色滤光层311、绿色滤光层312以及蓝色滤光层313。第一OLED器件层32位于第一彩色滤光层31上。在一些实施例中,该第一显示单元30还包括位于第一OLED器件层32和第一彩色滤光层31之间的第一平坦化层37。
该第一OLED器件层32包括透明阴极321、透明阳极322以及位于它们之间的第一OLED发光层323。该透明阳极322位于第一平坦化层37上或位于第一彩色滤光层31上,而导电接触层33则一端接触透明阴 极321,另一端接触第一反光层35。在一些实施例中,该透明阴极321和导电接触层33都由氧化铟锡材料(ITO)制成,它们可以通过同一工艺或不同工艺形成。例如,透明阴极321和导电接触层33可以由不同工艺形成,之后通过压制工艺压制在一起,最终实现通过导电接触层33电连接透明阴极321和第一反光层35。
在一些实施例中,第二基板20朝向第一基板10的一个表面上直接设置有黑矩阵36,黑矩阵36包括遮光区域38和开口区域47。该黑矩阵36的遮光区域38上设置有第一反光层35。该第一反光层35的一部分上设置有间隔物层34,并且所述导电接触层33至少部分地覆盖住该间隔物层34。在图示的示例中,该导电接触层33完全覆盖住该间隔物层34并且其一部分接触第一反光层35的表面,或者说间隔物层34位于第一反光层35的一部分和导电接触层33之间。在一些实施例中,该间隔物层34在第一反光层35上的正投影小于该导电接触层33在第一反光层35上的正投影。
在一些实施例中,该第一反光层35由金属材料制成。因而,该第一反光层35也被称为辅助阴极金属层。在一些示例中,所述第一反光层35包括由不透光的金属材料制成的多个条状部或多个点状部;或所述第一反光层35包括由不透光的金属材料制成的单个层。
在图示的情形中,该第一OLED器件层32发出的向下传播的光直接从第二基板10射出,而向上传播的光一部分被透明阴极321反射而另外一部分光被第一反光层35反射。这样,被第一反光层35反射的光依次穿过导电接触层33、第一OLED器件层32、第一平坦化层37、第一彩色滤光层31并从第一基板10射出(如图中实线箭头所示)。相应地,被透明阴极321反射的光依次穿过第一平坦化层37、第一彩色滤光层31并从第一基板10射出(如图中实线箭头所示)。最终,可以使得用户能够从第一基板10的外侧或前面看到显示的图像。在一些实施例中,这种形式的显示单元或发光区域由于光首先向上发出并最终向下射出显示面板,因此有时称为底发射区域。
第二显示单元40包括第二彩色滤光层41、第二OLED器件层42、第二反光层45和阵列电路层43。这些层沿从第二基板20至第一基板10 的方向依次设置在第一基板10和第二基板20之间。第二彩色滤光层41设置黑矩阵36的开口区域47的靠近第一基板10的一侧,并且包括红色滤光层411、绿色滤光层412以及蓝色滤光层413,参见图1B。
可选地,第二彩色滤光层41设置黑矩阵36的开口区域47中,即在对应于该开口区域47的第二基板20朝向第一基板10的一个表面上,并且包括红色滤光层411、绿色滤光层412以及蓝色滤光层413,参见图1C。在这种情况下,第二显示单元40直接位于第一基板10和第二基板20之间。
在一些实施例中,第二彩色滤光层41和第二OLED器件层42之间还设置有封框胶层44。例如,该封框胶层44可以由透明干燥封装胶制成。
在一些实施例中,在第二OLED器件层42和阵列电路层43之间的第二反光层45由不透光的金属材料制成。在一些示例中,该第二反光层45用作金属反射阳极,以至少反射部分从第二OLED器件层42发出的光。第二显示单元40还可以包括设置在第二反光层45和阵列电路层43之间的第二平坦化层46。
该第二OLED器件层42包括透明阴极421、透明阳极422以及位于它们之间的第二OLED发光层423。该透明阳极422位于第二反光层45上,而透明阴极421接触封框胶层44。第二反光层45可以设置成例如与第一反光层35相同的形式,即包括多个条状部、多个点状部、或单个层。下面的实施例中,也可以这样设置第二反光层45,故不再重述。
这样,从第二OLED器件层42发出的光,如图示的实线箭头所示,向上传播的光直接射向第二彩色滤光层41并从第二基板20射出,同时向下传播的光由第二反光层45向第二基板20反射而从第二基板20射出,因此使得用户可以从第二基板20的外侧或后面看到显示的图像。如上所述,这种形式的显示单元或发光区域由于光直接向上射出显示面板,因此有时称为顶发射区域。
需要说明的是,该阵列电路层43可以配置成控制第一显示单元30和第二显示单元40的出光,并且可以包括各种半导体器件,例如薄膜晶体管以实现相邻的第一显示单元30和第二显示单元40在该OLED双面显示面板的前面或后面同时显示相同的图像。当然,本领域技术人员还 可以根据需要设置该阵列电路层43,以使得在该OLED双面显示面板的前面或后面显示不同的图像。
然而,在第一显示单元30内,由于第一反光层35和透明阴极321之间设置有叠置在一起的间隔物层34和导电接触层33,从而造成从第一OLED器件层32射出的光要通过很长距离才能被反射。这样,导致降低了在第一显示单元30的区域内出光的强度。然而,在第二显示单元40内从第二OLED器件层42射出的光基本上不需要任何反射直接射出第二基板20,因此第一显示单元30的出光强度与第二显示单元40的出光强度相比明显偏低。也即底发射区域的光强较低。
此外,由于间隔物层34和导电接触层33彼此叠置在一起,在一定程度上也增大了所述OLED双面显示面板的盒间隙。
为了能够至少部分地增强在第一显示单元30内的发光强度和/或减小所述OLED双面显示面板的盒间隙,本公开的一个实施例提供了一种OLED双面显示面板。
图2示出根据本公开的一个实施例的一种OLED双面显示面板200的结构示意图。所述OLED双面显示面板200包括相对设置的第一基板110和第二基板120以及位于第一基板110和第二基板120之间的第一显示单元130和第二显示单元140。相邻的第一显示单元130和第二显示单元140之间通过像素界定层150间隔开。
在一些实施例中,在第一基板110和第二基板120之间设置黑矩阵136,例如黑矩阵136设置在第一基板110和第二基板201之间的靠近第二基板120的一侧,黑矩阵136包括遮光区域和开口区域147。在一些实施例中,第一显示单元130包括第一OLED发光层1323和比所述第一OLED发光层1323更靠近所述黑矩阵136设置的第一反光层135,其中所述第一OLED发光层1323发出的光经由所述第一反光层135反射从第一基板110射出。在本实施例中,该黑矩阵136直接设置在第二基板20的一个表面上,间隔物层134设置在该黑矩阵136上并且第一反光层135位于该间隔物层134上。
在一些实施例中,第二显示单元140位于所述第一基板110和第二基板120之间。所述第二显示单元140包括第二OLED发光层1423,其 中所述第二OLED发光层1423发出的光通过所述黑矩阵136的开口区域147从第二基板120射出。
如上所述,此处仅示出一个第一显示单元130和第二显示单元140,作为示例进行说明。
具体地,第一显示单元130包括第一彩色滤光层131、第一OLED发光器件132、导电接触层133、第一反光层135、间隔物层134,它们分别沿从所述第一基板110至第二基板120的方向依次设置在第一基板110和第二基板120之间。第一OLED发光层1323发出的向上传播的光被所述第一反光层135或被透明阴极1321朝向第一基板110反射,被第一反光层135反射的光依次穿过所述导电接触层133、所述第一OLED发光器件132、所述第一彩色滤光层131并从所述第一基板110射出,如图中的实线箭头所示,仅示意性地示出了部分区域反射光的路线。相比,被透明阴极1321反射的光依次穿过所述第一OLED发光器件132、所述第一彩色滤光层131并从所述第一基板110射出;而向下传播的光则直接穿过所述第一彩色滤光层131并从所述第一基板110射出。
在本实施例中,间隔物层134直接设置在黑矩阵136的遮光区域上,第一反光层135位于间隔物层134上,导电接触层133覆盖在叠置有第一反光层135的间隔物层134上。或者说,导电接触层133的至少一部分(图示的两侧)与黑矩阵136(具体地,黑矩阵136的遮光区域)接触。
在这样的结构布置的情况下,与图1B、1C显示的OLED双面显示面板100相比,至少由于间隔物层134被制作成具有更大的表面积因此可以做的很薄,从而至少部分地减少了所示出的OLED双面显示面板200的盒间隙,和/或增大了开口率。
另外,由于在上述的减小盒间隙的同时,还缩小第一显示单元30内的由第一反光层135反射光的光程,因此也增大了第一显示单元30的出光效率。
所述导电接触层133包围第一反光层135的结构,至少具有以下作用中的至少一个或一部分:可以用作第一OLED器件层132的反射电极,提升第一OLED发光层1323或发光单元的出光效率;另外使得在第一显示单元130内,导电接触层133基本上与透明阴极1321的整个表面接触, 这样不但可以减小电阻压降而且该导电接触层133与透明阴极1321之间的接触界面也可以至少在一定程度上增加了反射效果。基于这样的原因,可以在不增电阻压降的情况下,至少部分地减少透明阴极1321的厚度。
需要说明的是,该第一反光层135包括多个条状部、多个点状部或者一整个层,其由金属材料制成。当然,本公开不限定第一反光层135的形状,只要能够反射来自第一OLED器件层132发出的光即可。
具体地,第一彩色滤光层131直接位于第一基板10上,并且包括红色滤光层1311、绿色滤光层1312以及蓝色滤光层1313。第一OLED器件层132位于第一彩色滤光层131上。在一些实施例中,该第一显示单元130还包括位于第一OLED器件层132和第一彩色滤光层131之间的第一平坦化层137。
该第一OLED器件层132包括透明阴极1321、透明阳极1322以及位于它们之间的第一OLED发光层1323。该透明阳极1322位于第一平坦化层137上或位于第一彩色滤光层131上,而导电接触层133则一端接触透明阴极1321,另一端接触黑矩阵136。在一些实施例中,该透明阴极1321和导电接触层133都由氧化铟锡材料(ITO)制成,它们可以通过同一工艺或不同工艺形成。例如,透明阴极1321和导电接触层133可以由不同工艺形成,之后通过压制工艺压制在一起,最终实现通过导电接触层133电连接透明阴极1321和第一反光层135。
第二基板120朝向第一基板110的一个表面上直接设置有黑矩阵136,黑矩阵136包括遮光区域和开口区域147。该黑矩阵136的遮光区域上设置有间隔物层134,该间隔物层134上设置有第一反光层135。在第一反光层135上的导电接触层133至少部分地覆盖住该间隔物层134。在图示的示例中,该导电接触层133完全覆盖住该间隔物层134。在一些实施例中,该间隔物层134在黑矩阵136上的正投影略小于该导电接触层133在黑矩阵136上的正投影。
在一些实施例中,该第一反光层135由不透光的金属材料制成。因而,该第一反光层135也被称为辅助阴极金属层。在图示的情形中,该第一OLED器件层132发出的光的一部分光被透明阴极1321反射,而另一部分光被第一反光层135朝向第一基板110反射。这样,被第一反光 层135反射的光穿过导电接触层133、第一OLED器件层132、第一平坦化层137、第一彩色滤光层131并从第一基板110射出。最终,可以使得用户能够从第一基板110的外侧或前面看到显示的图像。
第二显示单元140包括第二彩色滤光层141、第二OLED器件层142、第二反光层145和阵列电路层143。这些层沿从第二基板120至第一基板110的方向依次设置在第一基板110和第二基板120之间。第二彩色滤光层141设置在第二基板120朝向第一基板110的一个表面上、设置黑矩阵136的开口区域147中并且包括红色滤光层1411、绿色滤光层1412以及蓝色滤光层1413。
在一些实施例中,第二彩色滤光层141和第二OLED器件层142之间还设置有封框胶层144。例如,该封框胶层144可以由透明干燥封装胶制成。
在一些实施例中,在第二OLED器件层142和阵列电路层143之间的第二反光层145由不透光的金属材料制成,并且该第二反光层145可以设置成与第一反光层135相同或类似的结构或形状。在一些示例中,该第二反光层145用作金属反射阳极,以至少反射部分从第二OLED器件层142发出的光。第二显示单元40还可以包括设置在第二反光层145和阵列电路层143之间的第二平坦化层146。
该第二OLED器件层142包括透明阴极1421、透明阳极1422以及位于它们之间的第二OLED发光层1423。该透明阳极1422位于第二反光层145上,而透明阴极1421接触封框胶层144。
这样,从第二OLED器件层142发出的光,如图示的箭头所示,向上传播的光射向第二彩色滤光层141并从第二基板120射出而向下传播的光由第二反光层145反射并从第二基板120射出,以使得用户可以从第二基板120的外侧或后面看到显示的图像。
需要说明的是,该阵列电路层143可以配置成同时控制第一显示单元130和第二显示单元140的出光,并且可以包括各种半导体器件,例如薄膜晶体管以实现相邻的第一显示单元130和第二显示单元140在该OLED双面显示面板的前面或后面同时显示相同的图像。当然,本领域技术人员还可以根据需要设置该阵列电路层143,以使得在该OLED双 面显示面板的前面或后面显示不同的图像。
图3示出根据本公开的一个实施例的一种OLED双面显示面板的结构示意图。该OLED双面显示面板200’的结构大体与图2显示的OLED双面显示面板200的结构相同。下面将不再针对它们之间共同的部件进行重述,但是为了简明起见,它们被用相同的附图标记示出。
该OLED双面显示面板200’的第一显示单元130不再包括间隔物层134,因此该第一反光层135直接设置在黑矩阵136上。第一反光层135上设置有包围住或覆盖住其的导电接触层133。或者说,导电接触层133的至少一部分(例如图示的两侧)与黑矩阵136接触。
可以理解,这样的布置将进一步减小第一反光层135与第一OLED器件层132之间的距离。相应地,第二显示单元140中,第二彩色滤光层141与第二OLED器件层142之间设置有薄膜封装层144’。在一些实施例中,该薄膜封装层144’将可以具有比例如由玻璃制成的封框胶层144更小的厚度。
在这样的布置中,可以省去用于平坦化的间隔物层134,进一步减少双面显示面板的盒间隙,从而减少黑矩阵136对光的吸收,使得第一显示单元130具有更高的出光效率。
在一些实施例中,还通过在第二显示单元140中使用薄膜封装层144’,使得可以将OLED双面显示面板的盒间隙做成更小。或者说,由于与透明干燥的封装胶做成的封框胶层相比,该薄膜封装层本身可以制作成具有更小的厚度。
这样的布置可以进一步减小第一反光层和第一OLED器件层之间的距离,使得出光效率更高,同时至少部分地减小盒间隙,增大了开口率。
本公开的一个实施例提供了一种制备OLED双面显示面板的方法,结合图1-3所示,包括以下步骤:
设置对置的第一基板10、110和第二基板20、120;
在所述第二基板20、120的一个表面上形成黑矩阵36、136;
在黑矩阵36、136的遮光区域38和第一基板10、110之间形成第一显示单元30、130,所述第一显示单元30、130包括第一OLED发光层323、1323和比所述第一OLED发光层323、1323更靠近所述黑矩阵36、 136设置的第一反光层35、135,其中第一OLED发光层323、1323发出的光经由所述第一反光层35、135反射从第一基板10、110射出;
在所述第一基板10、110和黑矩阵36、136的开口区域47、147之间形成第二显示单元40、140,所述第二显示单元40、140包括第二OLED发光层423、1423,其中所述第二OLED发光层423、1423发出的光通过所述黑矩阵36、136的开口区域47、147从第二基板射出。
在一些实施例中,如图1所示,所述方法还包括在所述黑矩阵36上依次形成所述第一反光层35、位于所述第一反光层35的一部分上的间隔物层34、覆盖所述间隔物层34的导电接触层33,所述导电接触层33通过压制工艺与位于所述第一OLED发光层323上的透明电极(例如透明阳极322和透明阴极321中的一个透明电极)压制在一起并电连接所述第一反光层35和所述透明电极(即图示的透明阴极321)。另外,在一些实施例中,还可以利用封装胶层44封装位于所述黑矩阵36的开口区域37中的彩色滤光层41和所述透明电极(即图示的透明阴极421)之间的空间。
在一些实施例中,所述方法还包括在所述黑矩阵136上依次形成间隔物层134、位于间隔物层134上的所述第一反光层135以及覆盖所述间隔物层134和所述第一反光层135的导电接触层133,所述导电接触层133通过压制工艺与位于所述第一OLED发光层1323上的透明电极(例如透明阳极1322和透明阴极1321中的一个透明电极)压制在一起并电连接所述第一反光层135和所述透明电极。在一些实施例中,还可以利用封装胶层144封装位于所述黑矩阵136的开口区域137中的彩色滤光层141和所述透明电极1421之间的空间。
在另外一些实施例中,所述方法还包括在所述黑矩阵136上依次形成所述第一反光层135和覆盖所述第一反光层135的导电接触层133,所述导电接触层133通过压制工艺与位于所述第一OLED发光层1323上的透明电极(例如透明阳极1322和透明阴极1321中的一个透明电极)压制在一起并电连接所述第一反光层135和所述透明电极。在一些实施例中,还可以利用薄膜封装层144’封装位于所述黑矩阵136的开口区域137中的彩色滤光层141和所述透明电极1421之间的空间。
另外,在一些实施例中,所述第一OLED发光层323、1323和所述第二OLED发光层423、1423是由同一图案化工艺制造的OLED发光层。例如,它们可以是同一OLED发光层,或也可以是具有相同结构的不同的OLED发光层。
在另一实施例中,还可以将第一反光层35由金属材料制成多个条状部或点状部,例如呈一定图案形式分布,诸如点阵等。
鉴于本公开中的OLED双面显示面板的其他结构和布置已经在上文进行详细论述,故在此不再重复。
前述实施例参照OLED显示面板描述了根据本公开的双面显示面板及其制备方法,然而,需要说明的是根据本公开的双面显示结构同样适用于QLED(量子点发光二极管)显示面板,由此能够构造出QLED双面显示面板以及制备QLED双面显示面板的方法,在此不再赘述。
上述实施例仅例示性的说明了本公开的原理及构造,而非用于限制本公开,本领域的技术人员应明白,在不偏离本公开的总体构思的情况下,对本公开所作的任何改变和改进都在本公开的范围内。本公开的保护范围,应如本申请的权利要求书所界定的范围为准。

Claims (20)

  1. 一种双面显示面板,包括:
    第一基板;
    第二基板,与所述第一基板相对;
    第一显示单元,位于所述第二基板和第一基板之间,所述第一显示单元包括第一发光层和比所述第一发光层更靠近所述第二基板设置的第一反光层,其中所述第一发光层发出的光经由所述第一反光层反射从第一基板射出;
    第二显示单元,位于所述第一基板和第二基板之间,所述第二显示单元包括第二发光层,其中所述第二发光层发出的光通过第二基板射出。
  2. 根据权利要求1所述的双面显示面板,还包括:
    黑矩阵,所述黑矩阵设置第二基板的面向第一基板的一侧。
  3. 根据权利要求2所述的双面显示面板,其中,所述第一显示单元包括位于所述黑矩阵和所述第一发光层之间从所述第一发光层向所述黑矩阵依次设置的透明电极、导电接触层和所述第一反光层,其中所述导电接触层的至少一部分与所述黑矩阵层接触,并且所述导电接触层在所述第一反光层和所述透明电极之间形成电连接。
  4. 根据权利要求2所述的双面显示面板,其中,所述第一显示单元包括位于所述黑矩阵和所述第一发光层之间从所述第一发光层向所述黑矩阵依次设置的透明电极、导电接触层、第一反光层和间隔物层,所述导电接触层的至少一部分与所述黑矩阵接触,并且所述导电接触层在所述第一反光层和所述透明电极之间形成电连接。
  5. 根据权利要求2所述的双面显示面板,其中,所述第一显示单元包括位于所述黑矩阵和所述第一发光层之间从所述第一发光层向所述黑矩阵依次设置的透明电极、导电接触层、间隔物层和所述第一反光层, 所述间隔物层位于所述第一反光层的一部分和所述导电接触层之间,所述导电接触层的至少一部分与所述第一反光层接触并且所述导电接触层在所述第一反光层和所述透明电极之间形成电连接。
  6. 根据权利要求2所述的双面显示面板,其中,所述黑矩阵包括遮光区域和开口区域。
  7. 根据权利要求6所述的双面显示面板,其中,所述第一显示单元位于黑矩阵的遮光区域与第一基板之间。
  8. 根据权利要求1所述的双面显示面板,其中,所述第二显示单元还包括位于所述第一基板和所述第二发光层之间的阵列电路层,所述阵列电路层配置成控制所述第一显示单元和所述第二显示单元的出光。
  9. 根据权利要求1所述的双面显示面板,其中,所述第一显示单元还包括第一彩色滤光层;和/或,所述第二显示单元还包括第二彩色滤光层。
  10. 根据权利要求6所述的双面显示面板,其中,所述第二显示单元还包括第二彩色滤光层,并且所述第二彩色滤光层位于黑矩阵的开口区域中。
  11. 根据权利要求1-10中任一项所述的双面显示面板,其中,所述第一反光层为由金属材料制成的辅助阴极金属层。
  12. 根据权利要求11所述的双面显示面板,其中,所述第一反光层包括由不透光的金属材料制成的多个条状部或多个点状部;或所述第一反光层包括由不透光的金属材料制成的单个层。
  13. 根据权利要求10所述的双面显示面板,其中,所述第二显示单 元还包括第二彩色滤光层和所述第二发光层之间的薄膜封装层。
  14. 根据权利要求10所述的双面显示面板,其中,所述第二显示单元还包括彩色滤光层和所述第二发光层之间的封装胶层。
  15. 一种制备双面显示面板的方法,包括:
    设置对置的第一基板和第二基板;
    在所述第二基板和所述第一基板之间形成第一显示单元,所述第一显示单元包括第一发光层和比所述第一发光层更靠近所述第二基板设置的第一反光层,其中第一发光层发出的光经由所述第一反光层反射从第一基板射出;
    在所述第一基板和第二基板之间形成第二显示单元,所述第二显示单元包括第二发光层,其中所述第二发光层发出的光通过第二基板射出。
  16. 根据权利要求15所述的方法,其中,在所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤之前,所述方法还包括:
    在所述第二基板的面向第一基板的一侧形成黑矩阵。
  17. 根据权利要求16所述的方法,其中,所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤包括在所述黑矩阵上依次形成所述第一反光层和覆盖所述第一反光层的导电接触层,所述导电接触层通过压制工艺与位于所述第一发光层上的透明电极压制在一起并电连接所述第一反光层和所述透明电极。
  18. 根据权利要求16所述的方法,其中,所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤包括在所述黑矩阵上依次形成间隔物层、位于间隔物层上的所述第一反光层以及覆盖所述间隔物层和所述第一反光层的导电接触层,所述导电接触层通过压制工艺与位于所述第一发光层上的透明电极压制在一起并电连接所述第一反光层和所述透明电极。
  19. 根据权利要求16所述的方法,其中,所述在所述第二基板和所述第一基板之间形成第一显示单元的步骤包括在所述黑矩阵上依次形成所述第一反光层、位于所述第一反光层的一部分上的间隔物层、覆盖所述间隔物层的导电接触层,所述导电接触层通过压制工艺与位于所述第一发光层上的透明电极压制在一起并电连接所述第一反光层和所述透明电极。
  20. 根据权利要求15-19中任一项所述的方法,其中,所述第一发光层和所述第二发光层是由同一图案化工艺制造的发光层。
PCT/CN2018/113044 2018-04-23 2018-10-31 双面显示面板及其制备方法 WO2019205549A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/475,303 US11289564B2 (en) 2018-04-23 2018-10-31 Double-sided display panel and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810370090.1 2018-04-23
CN201810370090.1A CN108400155B (zh) 2018-04-23 2018-04-23 Oled双面显示面板及其制备方法

Publications (1)

Publication Number Publication Date
WO2019205549A1 true WO2019205549A1 (zh) 2019-10-31

Family

ID=63100409

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/113044 WO2019205549A1 (zh) 2018-04-23 2018-10-31 双面显示面板及其制备方法

Country Status (3)

Country Link
US (1) US11289564B2 (zh)
CN (1) CN108400155B (zh)
WO (1) WO2019205549A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108400155B (zh) 2018-04-23 2020-06-05 京东方科技集团股份有限公司 Oled双面显示面板及其制备方法
CN109555983A (zh) * 2018-12-28 2019-04-02 北京夏禾科技有限公司 透明oled照明组装
TWI689910B (zh) * 2019-02-12 2020-04-01 友達光電股份有限公司 顯示裝置
CN110120404B (zh) * 2019-04-18 2021-04-27 深圳市华星光电半导体显示技术有限公司 双面白光有机发光二极管显示装置及其制造方法
WO2020237507A1 (zh) * 2019-05-28 2020-12-03 深圳市柔宇科技有限公司 Oled双面显示面板
CN110970546B (zh) * 2019-12-19 2021-10-15 京东方科技集团股份有限公司 显示基板及其制作方法、拼接显示装置
CN111564570B (zh) * 2020-05-22 2023-04-11 京东方科技集团股份有限公司 显示面板及显示装置
KR20220062919A (ko) * 2020-11-09 2022-05-17 엘지디스플레이 주식회사 발광표시패널 및 이를 이용한 발광표시장치
CN113097286B (zh) * 2021-04-15 2024-05-24 京东方科技集团股份有限公司 一种阵列基板、双面显示装置以及制作方法
CN113690392B (zh) * 2021-08-25 2023-08-04 京东方科技集团股份有限公司 一种透明显示面板及其制备方法、显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101373576A (zh) * 2007-08-24 2009-02-25 统宝光电股份有限公司 图像显示系统
CN104155791A (zh) * 2014-07-11 2014-11-19 京东方科技集团股份有限公司 一种双面显示面板以及双面显示装置
CN205092271U (zh) * 2015-10-14 2016-03-16 南京高光半导体材料有限公司 一种oled结构
KR20170059333A (ko) * 2015-11-20 2017-05-30 황창훈 유기소자 생산용 면증발원과 면증발 증착기
CN108400155A (zh) * 2018-04-23 2018-08-14 京东方科技集团股份有限公司 Oled双面显示面板及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566902B2 (en) * 2003-05-16 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and electronic device
JP4289332B2 (ja) * 2004-09-30 2009-07-01 セイコーエプソン株式会社 El表示装置、el表示装置の製造方法、及び電子機器
CN102023435B (zh) * 2009-09-23 2013-01-02 北京京东方光电科技有限公司 液晶显示器及其制造方法
KR101788285B1 (ko) * 2010-10-22 2017-10-20 삼성디스플레이 주식회사 유기 발광 표시 장치
CN102749752B (zh) * 2012-06-08 2015-06-17 京东方科技集团股份有限公司 集成彩膜的阵列基板及其制造方法和液晶显示器
US9173272B2 (en) * 2012-09-18 2015-10-27 Lg Display Co., Ltd. Organic electroluminescent display device and method for driving the same
KR102113179B1 (ko) * 2013-10-14 2020-05-21 삼성디스플레이 주식회사 유기발광표시장치 및 그 제조방법
KR102637151B1 (ko) * 2015-02-06 2024-02-15 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN107634012B (zh) * 2017-09-13 2021-05-07 京东方科技集团股份有限公司 一种封装基板及其制备方法、显示面板、显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101373576A (zh) * 2007-08-24 2009-02-25 统宝光电股份有限公司 图像显示系统
CN104155791A (zh) * 2014-07-11 2014-11-19 京东方科技集团股份有限公司 一种双面显示面板以及双面显示装置
CN205092271U (zh) * 2015-10-14 2016-03-16 南京高光半导体材料有限公司 一种oled结构
KR20170059333A (ko) * 2015-11-20 2017-05-30 황창훈 유기소자 생산용 면증발원과 면증발 증착기
CN108400155A (zh) * 2018-04-23 2018-08-14 京东方科技集团股份有限公司 Oled双面显示面板及其制备方法

Also Published As

Publication number Publication date
US20210335960A1 (en) 2021-10-28
US11289564B2 (en) 2022-03-29
CN108400155B (zh) 2020-06-05
CN108400155A (zh) 2018-08-14

Similar Documents

Publication Publication Date Title
WO2019205549A1 (zh) 双面显示面板及其制备方法
TWI580022B (zh) Organic EL display device and manufacturing method thereof
JP6416854B2 (ja) 有機発光表示装置及びその製造方法
TWI637657B (zh) 有機發光二極體顯示器
WO2016015385A1 (zh) 一种透明显示面板及其制作方法、透明显示装置
KR20120059575A (ko) 가요성 기판과 중첩되는 타일 디스플레이
JP2015050011A (ja) エレクトロルミネセンス装置およびその製造方法
CN111048569B (zh) 一种显示面板及显示装置
KR100753258B1 (ko) 상면 발광형 디스플레이
US11133294B2 (en) Transparent display panel
KR20210021216A (ko) 표시 장치
KR20150039487A (ko) 디스플레이 장치
JP2014086259A (ja) エレクトロルミネセンス表示装置
KR20150065143A (ko) 유기 전계 발광 표시장치
US11695101B2 (en) Display panel, method for manufacturing the display panel, and display device
TW201432898A (zh) 具有太陽能電池之有機發光顯示器
WO2017198074A1 (zh) 背光源及其制作方法、显示基板、显示装置及其显示方法
CN110459567B (zh) 发光装置
TW201114316A (en) Organic el panel and panel - combined light- emitting device
TW201838171A (zh) 頂部發光型微發光二極體顯示器與底部發光型微發光二極體顯示器及其形成方法
CN111048655B (zh) 发光二极管芯片、显示面板及其制备方法和显示装置
US11616099B2 (en) Display substrate with two-side light emitting components, preparation method thereof, and display apparatus
TWI790827B (zh) 微型發光二極體顯示裝置
CN116632030B (zh) 显示装置
WO2023276295A1 (ja) 半導体装置及び表示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18916771

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18916771

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 06/05/2021)

122 Ep: pct application non-entry in european phase

Ref document number: 18916771

Country of ref document: EP

Kind code of ref document: A1