WO2019196188A1 - Method and system for creating steel mesh library on basis of eda package library, and storage medium and terminal - Google Patents

Method and system for creating steel mesh library on basis of eda package library, and storage medium and terminal Download PDF

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Publication number
WO2019196188A1
WO2019196188A1 PCT/CN2018/090381 CN2018090381W WO2019196188A1 WO 2019196188 A1 WO2019196188 A1 WO 2019196188A1 CN 2018090381 W CN2018090381 W CN 2018090381W WO 2019196188 A1 WO2019196188 A1 WO 2019196188A1
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Prior art keywords
library
steel mesh
creating
eda
pattern data
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PCT/CN2018/090381
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French (fr)
Chinese (zh)
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钱胜杰
瞿永建
刘丰收
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上海望友信息科技有限公司
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Publication of WO2019196188A1 publication Critical patent/WO2019196188A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225Screens or stencils; Holders therefor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00Details relating to the application field
    • G06F2113/18Chip packaging
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18Manufacturability analysis or optimisation for manufacturability
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the technical field of data processing, and in particular, to a method and system for creating a steel mesh library based on an EDA package library, a storage medium and a terminal.
  • SMD Surface Mounted Devices
  • SMT Surface Mount Technology
  • stencil design has been slowly taken seriously by the industry as an important part of the assembly process of SMD components. As the pace of automation advances, traditional stencil designs move from manual or semi-automatic designs to automated designs.
  • the traditional stencil design is to design the stencil opening at the same time as the SMT program is made after the PCB layout is completed.
  • the method is insufficient as follows:
  • an object of the present invention is to provide a method and system for creating a steel mesh library based on an EDA package library, a storage medium and a terminal, and a steel mesh library according to the EDA package library, thereby being able to be automated Complete the design of the stencil and prepare the stencil opening to the design stage.
  • the present invention provides a method for creating a steel mesh library based on an EDA package library, comprising the steps of: acquiring land pattern data in an EDA package library; and based on the land pattern data and presets
  • the opening algorithm creates stencil opening graphic data; and saves the stencil opening graphic data.
  • the land pattern data includes a length and a width of the pad.
  • the stencil opening pattern data is saved to the EDA package library or the pad steel mesh relation database.
  • the stencil opening pattern data includes a package name, land pattern data, and stencil opening pattern data.
  • the present invention provides a system for creating a steel mesh library based on an EDA package library, including an acquisition module, a creation module, and a storage module;
  • the obtaining module is configured to acquire pad graphic data in an EDA package library
  • the creating module is configured to create stencil opening graphic data based on the land pattern data and a preset opening algorithm
  • the saving module is configured to save the stencil opening graphic data.
  • the land pattern data includes a length and a width of the pad.
  • the saving module saves the stencil opening pattern data to the EDA package library or the pad steel mesh relation database.
  • the stencil opening pattern data includes a package name, land pattern data, and stencil opening pattern data.
  • the present invention provides a storage medium having stored thereon a computer program that, when executed by a processor, implements the above-described method of creating a steel mesh library based on an EDA package library.
  • the present invention provides a terminal, including: a processor and a memory;
  • the memory is for storing a computer program
  • the processor is configured to execute the computer program stored in the memory to cause the terminal to execute the method for creating a steel mesh library based on the EDA package library.
  • the method and system for creating a steel mesh library based on the EDA package library of the present invention have the following beneficial effects:
  • FIG. 1 is a flow chart showing an embodiment of a method for creating a steel mesh library based on an EDA package library of the present invention
  • FIG. 2 is a schematic structural view showing a system for creating a steel mesh library based on an EDA package library according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of a terminal according to an embodiment of the present invention.
  • the method and system for creating a steel mesh library based on the EDA package library, the storage medium and the terminal realize the creation of the steel mesh library based on the EDA package library, thereby automatically completing the design of the steel mesh, and preparing the steel mesh opening to advance to the design
  • the stage greatly shortens the design time.
  • a method for creating a steel mesh library based on an EDA package library of the present invention includes the following steps:
  • Step S1 Acquire pad pattern data in the EDA package library.
  • EDA Electronic Design Automation
  • the designer uses the hardware description language VerilogHDL to complete the design file on the EDA software platform. Then the computer automatically completes the logic compilation, simplification, segmentation, synthesis and optimization. , layout, routing, and simulation until adaptation, logic mapping, and program downloads for specific target chips.
  • VerilogHDL hardware description language
  • the relevant parameters of the circuit design are stored in the EDA package library.
  • land pattern data is extracted from the EDA package library.
  • the pad image data includes size data such as a length and a width of the pad.
  • Step S2 creating stencil opening graphic data based on the land pattern data and a preset opening algorithm.
  • the opening algorithm is a mature prior art, and can be implemented in a manual or automatic manner, and therefore will not be described herein.
  • stencil opening pattern data is created based on the acquired land image data and the opening algorithm employed. Using different opening algorithms, different stencil opening graphic data will be generated.
  • Step S3 saving the stencil opening graphic data.
  • the obtained stencil opening pattern data is saved, thereby realizing the construction of the stencil library.
  • different stencil opening graphic data will be obtained for different package data. Therefore, the above operations are continuously repeated, and the contents of the steel mesh library will be continuously enriched.
  • the stencil opening pattern data includes a package name, a land pattern data, and a stencil opening pattern data, so that the relationship between the stencil opening pattern data and the package name can be utilized in the design of the stencil.
  • Automated stencil openings for all PCBs greatly simplify the design process.
  • the stencil opening pattern data is saved to the EDA package library or the pad steel mesh relation database.
  • the system for creating a steel mesh library based on the EDA package library of the present invention includes an acquisition module 21, a creation module 22, and a storage module 23.
  • the acquisition module 21 is configured to acquire pad pattern data in the EDA package library.
  • EDA Electronic Design Automation
  • the designer uses the hardware description language VerilogHDL to complete the design file on the EDA software platform. Then the computer automatically completes the logic compilation, simplification, segmentation, synthesis and optimization. , layout, routing, and simulation until adaptation, logic mapping, and program downloads for specific target chips.
  • VerilogHDL hardware description language
  • the relevant parameters of the circuit design are stored in the EDA package library.
  • land pattern data is extracted from the EDA package library.
  • the pad image data includes size data such as a length and a width of the pad.
  • the creation module 22 is coupled to the acquisition module 21 for creating stencil opening graphic data based on the land pattern data and the preset opening algorithm.
  • the opening algorithm is a mature prior art, and can be implemented in a manual or automatic manner, and therefore will not be described herein.
  • stencil opening pattern data is created based on the acquired land image data and the opening algorithm employed. Using different opening algorithms, different stencil opening graphic data will be generated.
  • the save module 23 is connected to the creation module 22 for storing the stencil opening graphic data.
  • the obtained stencil opening pattern data is saved, thereby realizing the construction of the stencil library.
  • different stencil opening graphic data will be obtained for different package data. Therefore, the above operations are continuously repeated, and the contents of the steel mesh library will be continuously enriched.
  • the stencil opening pattern data includes a package name, a land pattern data, and a stencil opening pattern data, so that the relationship between the stencil opening pattern data and the package name can be utilized in the design of the stencil.
  • Automated stencil openings for all PCBs greatly simplify the design process.
  • the stencil opening pattern data is saved to the EDA package library or the pad steel mesh relation database.
  • each module of the above system is only a division of logical functions, and the actual implementation may be integrated into one physical entity in whole or in part, or may be physically separated.
  • these modules can all be implemented by software in the form of processing component calls; or all of them can be implemented in hardware form; some modules can be realized by processing component calling software, and some modules are realized by hardware.
  • the x module may be a separately set processing element, or may be integrated in one of the above-mentioned devices, or may be stored in the memory of the above device in the form of program code, by a processing element of the above device. Call and execute the functions of the above x modules.
  • the implementation of other modules is similar.
  • all or part of these modules can be integrated or implemented independently.
  • the processing elements described herein can be an integrated circuit with signal processing capabilities. In the implementation process, each step of the above method or each of the above modules may be completed by an integrated logic circuit of hardware in the processor element or an instruction in a form of software.
  • the above modules may be one or more integrated circuits configured to implement the above method, for example, one or more specific integrated circuits (ASICs), or one or more microprocessors (digitalsingnal processors, referred to as DSP), or one or more Field Programmable Gate Arrays (FPGAs).
  • ASICs application specific integrated circuits
  • DSP digital signal processors
  • FPGAs Field Programmable Gate Arrays
  • the processing component may be a general-purpose processor, such as a central processing unit (CPU) or other processor that can call the program code.
  • these modules can be integrated and implemented in the form of a system-on-a-chip (SOC).
  • SOC system-on-a-chip
  • the storage medium of the present invention stores a computer program that, when executed by the processor, implements the above-described method of creating a steel mesh library based on the EDA package library.
  • the storage medium includes various media that can store program codes, such as a ROM, a RAM, a magnetic disk, a USB flash drive, a memory card, or an optical disk.
  • the terminal of the present invention includes a processor 31 and a memory 32.
  • the memory 32 is used to store a computer program.
  • the memory 32 includes various media that can store program codes, such as a ROM, a RAM, a magnetic disk, a USB flash drive, a memory card, or an optical disk.
  • program codes such as a ROM, a RAM, a magnetic disk, a USB flash drive, a memory card, or an optical disk.
  • the processor 31 is coupled to the memory 32 for executing a computer program stored by the memory 32 to cause the terminal to execute the above-described method for creating a steel mesh library based on an EDA package library.
  • the processor 31 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), and the like; or a digital signal processor (DSP).
  • CPU central processing unit
  • NP network processor
  • DSP digital signal processor
  • ASIC Application Specific Integrated Circuit
  • FPGA Field-Programmable Gate Array
  • Cadence software is employed.
  • the library file is packaged as a *.dra or *.psm file in the Cadence allegro software, and the cadence API is used to obtain the pad pattern size information in each *.dra file.
  • the stencil opening is generated according to the opening algorithm model to generate a stencil opening pattern.
  • the stencil opening graphic data can be written into the c1206.dra using the API of the Cadence allegro software, and the stencil opening graphic data is generated in a new data layer and the storage package is updated.
  • the recommended data layer is named Stencil_TOP.
  • both the land pattern data and the stencil opening pattern data are saved in a database, and the package is named as a unique key field, as shown in Table 1.
  • wiring design software used in the present invention is not limited to Cadence, and may be Altium Designer, Mentor Graphics, Zuken, and the like.
  • the method and system for creating a steel mesh library based on the EDA package library, the storage medium and the terminal create a steel mesh library according to the EDA package library, and can automatically obtain all the relationships between the opening pattern data of the steel mesh and the package name.
  • PCB stencil opening which can automate the design of stencil; advance the stencil opening preparation to the design stage, rather than in the manufacturing stage, greatly shortening the design cycle; since any component on the PCB will be used
  • the pad package in the wiring package library so that no stencil opening is missed, so that the steel mesh library can be maintained more systematically. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

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Abstract

A method and system for creating a steel mesh library on the basis of an EDA package library, and a storage medium and a terminal. The method comprises the following steps: obtaining bonding pad graph data in an EDA package library (S1); creating steel mesh opening graph data on the basis of the bonding pad graph data and a preset opening algorithm (S2); and storing the steel mesh opening graph data (S3). According to the method and system for creating a steel mesh library on the basis of an EDA package library, and the storage medium and the terminal, a steel mesh library is created according to an EDA package library, and therefore, the design of a steel mesh can be automatically completed, and steel mesh opening preparation can be advanced to a design stage.

Description

基于EDA封装库创建钢网库的方法及系统、存储介质及终端Method and system for creating steel mesh library based on EDA package library, storage medium and terminal 技术领域Technical field
本发明涉及数据处理的技术领域,特别是涉及一种基于EDA封装库创建钢网库的方法及系统、存储介质及终端。The present invention relates to the technical field of data processing, and in particular, to a method and system for creating a steel mesh library based on an EDA package library, a storage medium and a terminal.
背景技术Background technique
表面贴装器件(Surface Mounted Devices,SMD)是表面组装技术(Surface Mount Technology,SMT)元器件中的一种。SMD元器件组装工艺最重要的环节之一就是钢网设计。钢网,即SMT模板(SMT Stencil),是一种SMT专用模具,其主要功能是帮助锡膏的沉积,目的是将准确数量的锡膏转移到空PCB上的准确位置。Surface Mounted Devices (SMD) is one of the Surface Mount Technology (SMT) components. One of the most important aspects of the SMD component assembly process is the stencil design. Stencil, or SMT Stencil, is an SMT-specific mold whose primary function is to help deposit solder paste in order to transfer an accurate amount of solder paste to an exact location on an empty PCB.
现有技术中,钢网设计作为SMD元器件组装工艺的一个重要环节已经被业界慢慢地重视起来。随着自动化步伐的推进,传统的钢网设计由手动或半自动设计逐步转向自动化设计。In the prior art, stencil design has been slowly taken seriously by the industry as an important part of the assembly process of SMD components. As the pace of automation advances, traditional stencil designs move from manual or semi-automatic designs to automated designs.
传统的钢网设计是在PCB布线完成后在SMT程序制作的同时进行钢网开口设计。该方法以下不足:The traditional stencil design is to design the stencil opening at the same time as the SMT program is made after the PCB layout is completed. The method is insufficient as follows:
(1)钢网设计的时间节点滞后,导致设计周期较长;(1) The time node of the stencil design is delayed, resulting in a longer design cycle;
(2)钢网设计中开口的方式没有形成可重复利用的库,导致重复化设计,效率低下;(2) The way of opening in the stencil design does not form a reusable library, resulting in repetitive design and low efficiency;
(3)对钢网设计人员的经验要求非常高。(3) The experience of steel mesh designers is very high.
发明内容Summary of the invention
鉴于以上所述现有技术的缺点,本发明的目的在于提供一种基于EDA封装库创建钢网库的方法及系统、存储介质及终端,根据EDA封装库来创建钢网库,从而能够自动化的完成钢网的设计,并且将钢网开口准备提前至设计阶段。In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a method and system for creating a steel mesh library based on an EDA package library, a storage medium and a terminal, and a steel mesh library according to the EDA package library, thereby being able to be automated Complete the design of the stencil and prepare the stencil opening to the design stage.
为实现上述目的及其他相关目的,本发明提供一种基于EDA封装库创建钢网库的方法,包括以下步骤:获取EDA封装库中的焊盘图形数据;基于所述焊盘图形数据和预设开口算法创建钢网开口图形数据;保存所述钢网开口图形数据。To achieve the above and other related objects, the present invention provides a method for creating a steel mesh library based on an EDA package library, comprising the steps of: acquiring land pattern data in an EDA package library; and based on the land pattern data and presets The opening algorithm creates stencil opening graphic data; and saves the stencil opening graphic data.
于本发明一实施例中,所述焊盘图形数据包括焊盘的长度和宽度。In an embodiment of the invention, the land pattern data includes a length and a width of the pad.
于本发明一实施例中,将所述钢网开口图形数据保存至所述EDA封装库或焊盘钢网关系数据库中。In an embodiment of the invention, the stencil opening pattern data is saved to the EDA package library or the pad steel mesh relation database.
于本发明一实施例中,所述钢网开口图形数据包括封装名、焊盘图形数据和钢网开口图形数据。In an embodiment of the invention, the stencil opening pattern data includes a package name, land pattern data, and stencil opening pattern data.
对应地,本发明提供一种基于EDA封装库创建钢网库的系统,包括获取模块、创建模块和保存模块;Correspondingly, the present invention provides a system for creating a steel mesh library based on an EDA package library, including an acquisition module, a creation module, and a storage module;
所述获取模块用于获取EDA封装库中的焊盘图形数据;The obtaining module is configured to acquire pad graphic data in an EDA package library;
所述创建模块用于基于所述焊盘图形数据和预设开口算法创建钢网开口图形数据;The creating module is configured to create stencil opening graphic data based on the land pattern data and a preset opening algorithm;
所述保存模块用于保存所述钢网开口图形数据。The saving module is configured to save the stencil opening graphic data.
于本发明一实施例中,所述焊盘图形数据包括焊盘的长度和宽度。In an embodiment of the invention, the land pattern data includes a length and a width of the pad.
于本发明一实施例中,所述保存模块将所述钢网开口图形数据保存至所述EDA封装库或焊盘钢网关系数据库中。In an embodiment of the invention, the saving module saves the stencil opening pattern data to the EDA package library or the pad steel mesh relation database.
于本发明一实施例中,所述钢网开口图形数据包括封装名、焊盘图形数据和钢网开口图形数据。In an embodiment of the invention, the stencil opening pattern data includes a package name, land pattern data, and stencil opening pattern data.
本发明提供一种存储介质,其上存储有计算机程序,该程序被处理器执行时实现上述的基于EDA封装库创建钢网库的方法。The present invention provides a storage medium having stored thereon a computer program that, when executed by a processor, implements the above-described method of creating a steel mesh library based on an EDA package library.
最后,本发明提供一种终端,包括:处理器及存储器;Finally, the present invention provides a terminal, including: a processor and a memory;
所述存储器用于存储计算机程序;The memory is for storing a computer program;
所述处理器用于执行所述存储器存储的计算机程序,以使所述终端执行上述的基于EDA封装库创建钢网库的方法。The processor is configured to execute the computer program stored in the memory to cause the terminal to execute the method for creating a steel mesh library based on the EDA package library.
如上所述,本发明的基于EDA封装库创建钢网库的方法及系统、存储介质及终端,具有以下有益效果:As described above, the method and system for creating a steel mesh library based on the EDA package library of the present invention, the storage medium and the terminal have the following beneficial effects:
(1)根据EDA封装库来创建钢网库,能够利用钢网开口图像数据和封装名的关系自动得到所有PCB的钢网开口,从而能够自动化的完成钢网的设计;(1) Create a steel mesh library according to the EDA package library, and automatically obtain the stencil openings of all PCBs by using the relationship between the image data of the stencil opening and the package name, thereby automatically completing the design of the steel mesh;
(2)将钢网开口准备提前至设计阶段,而不是在制造阶段,极大地缩短了设计周期;(2) Advance the stencil opening preparation to the design stage, rather than in the manufacturing stage, greatly shortening the design cycle;
(3)由于任何一个PCB上的元器件都会用到布线封装库中的焊盘封装,因此不会遗漏任何一个钢网开口,从而能够更加系统性的维护钢网库。(3) Since the components on any PCB will use the pad package in the wiring package library, no stencil opening will be missed, so that the steel mesh library can be more systematically maintained.
附图说明DRAWINGS
图1显示为本发明的基于EDA封装库创建钢网库的方法于一实施例中的流程图;1 is a flow chart showing an embodiment of a method for creating a steel mesh library based on an EDA package library of the present invention;
图2显示为本发明的基于EDA封装库创建钢网库的系统于一实施例中的结构示意图;2 is a schematic structural view showing a system for creating a steel mesh library based on an EDA package library according to an embodiment of the present invention;
图3显示为本发明的终端于一实施例中的结构示意图。FIG. 3 is a schematic structural view of a terminal according to an embodiment of the present invention.
元件标号说明Component label description
21  获取模块21 Get module
22  创建模块22 Creating modules
23  保存模块23 Save module
31  处理器31 processor
32  存储器32 memory
具体实施方式detailed description
以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用,本说明书中的各项细节也可以基于不同观点与应用,在没有背离本发明的精神下进行各种修饰或改变。需说明的是,在不冲突的情况下,以下实施例及实施例中的特征可以相互组合。The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can readily understand other advantages and effects of the present invention from the disclosure of the present disclosure. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. It should be noted that the features in the following embodiments and embodiments may be combined with each other without conflict.
需要说明的是,以下实施例中所提供的图示仅以示意方式说明本发明的基本构想,遂图式中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制,其实际实施时各组件的型态、数量及比例可为一种随意的改变,且其组件布局型态也可能更为复杂。It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the drawings, rather than the number and shape of components in actual implementation. Dimensional drawing, the actual type of implementation of each component's type, number and proportion can be a random change, and its component layout can be more complicated.
本发明的基于EDA封装库创建钢网库的方法及系统、存储介质及终端基于EDA封装库实现钢网库的创建,从而能够自动化的完成钢网的设计,并且将钢网开口准备提前至设计阶段,极大地缩短了设计时间。The method and system for creating a steel mesh library based on the EDA package library, the storage medium and the terminal realize the creation of the steel mesh library based on the EDA package library, thereby automatically completing the design of the steel mesh, and preparing the steel mesh opening to advance to the design The stage greatly shortens the design time.
如图1所示,于一实施例中,本发明的基于EDA封装库创建钢网库的方法包括以下步骤:As shown in FIG. 1, in an embodiment, a method for creating a steel mesh library based on an EDA package library of the present invention includes the following steps:
步骤S1、获取EDA封装库中的焊盘图形数据。Step S1: Acquire pad pattern data in the EDA package library.
电子设计自动化(Electronics Design Automation,EDA)就是以计算机为工具,设计者在EDA软件平台上,用硬件描述语言VerilogHDL完成设计文件,然后由计算机自动地完成逻辑编译、化简、分割、综合、优化、布局、布线和仿真,直至对于特定目标芯片的适配编译、逻辑映射和编程下载等工作。EDA技术的出现,极大地提高了电路设计的效率和可操作性,减轻了设计者的劳动强度。在EDA封装库中存储有电路设计的相关参数。在本发明中,从所述EDA封装库中提取焊盘图形数据。其中,所述焊盘图像数据包括焊盘的长度、宽度等尺寸数据。Electronic Design Automation (EDA) is a computer-based tool. The designer uses the hardware description language VerilogHDL to complete the design file on the EDA software platform. Then the computer automatically completes the logic compilation, simplification, segmentation, synthesis and optimization. , layout, routing, and simulation until adaptation, logic mapping, and program downloads for specific target chips. The emergence of EDA technology has greatly improved the efficiency and operability of circuit design and reduced the labor intensity of designers. The relevant parameters of the circuit design are stored in the EDA package library. In the present invention, land pattern data is extracted from the EDA package library. The pad image data includes size data such as a length and a width of the pad.
步骤S2、基于所述焊盘图形数据和预设开口算法创建钢网开口图形数据。Step S2, creating stencil opening graphic data based on the land pattern data and a preset opening algorithm.
对于本领域技术人员而言,开口算法是成熟的现有技术,可以采用手动或自动的方式来 实现,故在此不再赘述。For those skilled in the art, the opening algorithm is a mature prior art, and can be implemented in a manual or automatic manner, and therefore will not be described herein.
具体地,根据所获取的焊盘图像数据和所采用的开口算法来创建钢网开口图形数据。采用不同的开口算法,将产生不同的钢网开口图形数据。Specifically, stencil opening pattern data is created based on the acquired land image data and the opening algorithm employed. Using different opening algorithms, different stencil opening graphic data will be generated.
步骤S3、保存所述钢网开口图形数据。Step S3, saving the stencil opening graphic data.
具体地,将所获取的钢网开口图形数据进行保存,从而实现了钢网库的构建。其中,针对不同的封装数据,将得到不同的钢网开口图形数据。因此,不断地重复上述操作,将不断地丰富钢网库的内容。Specifically, the obtained stencil opening pattern data is saved, thereby realizing the construction of the stencil library. Among them, different stencil opening graphic data will be obtained for different package data. Therefore, the above operations are continuously repeated, and the contents of the steel mesh library will be continuously enriched.
于本发明一实施例中,所述钢网开口图形数据包括封装名、焊盘图形数据和钢网开口图形数据,从而在钢网的设计时,能够利用钢网开口图形数据和封装名的关系自动得到所有PCB的钢网开口,极大地简化了设计流程。In an embodiment of the invention, the stencil opening pattern data includes a package name, a land pattern data, and a stencil opening pattern data, so that the relationship between the stencil opening pattern data and the package name can be utilized in the design of the stencil. Automated stencil openings for all PCBs greatly simplify the design process.
于本发明一实施例中,将所述钢网开口图形数据保存至所述EDA封装库或焊盘钢网关系数据库中。In an embodiment of the invention, the stencil opening pattern data is saved to the EDA package library or the pad steel mesh relation database.
如图2所示,于一实施例中,本发明的基于EDA封装库创建钢网库的系统包括获取模块21、创建模块22和保存模块23。As shown in FIG. 2, in an embodiment, the system for creating a steel mesh library based on the EDA package library of the present invention includes an acquisition module 21, a creation module 22, and a storage module 23.
获取模块21用于获取EDA封装库中的焊盘图形数据。The acquisition module 21 is configured to acquire pad pattern data in the EDA package library.
电子设计自动化(Electronics Design Automation,EDA)就是以计算机为工具,设计者在EDA软件平台上,用硬件描述语言VerilogHDL完成设计文件,然后由计算机自动地完成逻辑编译、化简、分割、综合、优化、布局、布线和仿真,直至对于特定目标芯片的适配编译、逻辑映射和编程下载等工作。EDA技术的出现,极大地提高了电路设计的效率和可操作性,减轻了设计者的劳动强度。在EDA封装库中存储有电路设计的相关参数。在本发明中,从所述EDA封装库中提取焊盘图形数据。其中,所述焊盘图像数据包括焊盘的长度、宽度等尺寸数据。Electronic Design Automation (EDA) is a computer-based tool. The designer uses the hardware description language VerilogHDL to complete the design file on the EDA software platform. Then the computer automatically completes the logic compilation, simplification, segmentation, synthesis and optimization. , layout, routing, and simulation until adaptation, logic mapping, and program downloads for specific target chips. The emergence of EDA technology has greatly improved the efficiency and operability of circuit design and reduced the labor intensity of designers. The relevant parameters of the circuit design are stored in the EDA package library. In the present invention, land pattern data is extracted from the EDA package library. The pad image data includes size data such as a length and a width of the pad.
创建模块22与获取模块21相连,用于基于所述焊盘图形数据和预设开口算法创建钢网开口图形数据。The creation module 22 is coupled to the acquisition module 21 for creating stencil opening graphic data based on the land pattern data and the preset opening algorithm.
对于本领域技术人员而言,开口算法是成熟的现有技术,可以采用手动或自动的方式来实现,故在此不再赘述。For the person skilled in the art, the opening algorithm is a mature prior art, and can be implemented in a manual or automatic manner, and therefore will not be described herein.
具体地,根据所获取的焊盘图像数据和所采用的开口算法来创建钢网开口图形数据。采用不同的开口算法,将产生不同的钢网开口图形数据。Specifically, stencil opening pattern data is created based on the acquired land image data and the opening algorithm employed. Using different opening algorithms, different stencil opening graphic data will be generated.
保存模块23与创建模块22相连,用于保存所述钢网开口图形数据。The save module 23 is connected to the creation module 22 for storing the stencil opening graphic data.
具体地,将所获取的钢网开口图形数据进行保存,从而实现了钢网库的构建。其中,针 对不同的封装数据,将得到不同的钢网开口图形数据。因此,不断地重复上述操作,将不断地丰富钢网库的内容。Specifically, the obtained stencil opening pattern data is saved, thereby realizing the construction of the stencil library. Among them, different stencil opening graphic data will be obtained for different package data. Therefore, the above operations are continuously repeated, and the contents of the steel mesh library will be continuously enriched.
于本发明一实施例中,所述钢网开口图形数据包括封装名、焊盘图形数据和钢网开口图形数据,从而在钢网的设计时,能够利用钢网开口图形数据和封装名的关系自动得到所有PCB的钢网开口,极大地简化了设计流程。In an embodiment of the invention, the stencil opening pattern data includes a package name, a land pattern data, and a stencil opening pattern data, so that the relationship between the stencil opening pattern data and the package name can be utilized in the design of the stencil. Automated stencil openings for all PCBs greatly simplify the design process.
于本发明一实施例中,将所述钢网开口图形数据保存至所述EDA封装库或焊盘钢网关系数据库中。In an embodiment of the invention, the stencil opening pattern data is saved to the EDA package library or the pad steel mesh relation database.
需要说明的是,应理解以上系统的各个模块的划分仅仅是一种逻辑功能的划分,实际实现时可以全部或部分集成到一个物理实体上,也可以物理上分开。且这些模块可以全部以软件通过处理元件调用的形式实现;也可以全部以硬件的形式实现;还可以部分模块通过处理元件调用软件的形式实现,部分模块通过硬件的形式实现。例如,x模块可以为单独设立的处理元件,也可以集成在上述装置的某一个芯片中实现,此外,也可以以程序代码的形式存储于上述装置的存储器中,由上述装置的某一个处理元件调用并执行以上x模块的功能。其它模块的实现与之类似。此外这些模块全部或部分可以集成在一起,也可以独立实现。这里所述的处理元件可以是一种集成电路,具有信号的处理能力。在实现过程中,上述方法的各步骤或以上各个模块可以通过处理器元件中的硬件的集成逻辑电路或者软件形式的指令完成。It should be noted that the division of each module of the above system is only a division of logical functions, and the actual implementation may be integrated into one physical entity in whole or in part, or may be physically separated. And these modules can all be implemented by software in the form of processing component calls; or all of them can be implemented in hardware form; some modules can be realized by processing component calling software, and some modules are realized by hardware. For example, the x module may be a separately set processing element, or may be integrated in one of the above-mentioned devices, or may be stored in the memory of the above device in the form of program code, by a processing element of the above device. Call and execute the functions of the above x modules. The implementation of other modules is similar. In addition, all or part of these modules can be integrated or implemented independently. The processing elements described herein can be an integrated circuit with signal processing capabilities. In the implementation process, each step of the above method or each of the above modules may be completed by an integrated logic circuit of hardware in the processor element or an instruction in a form of software.
例如,以上这些模块可以是被配置成实施以上方法的一个或多个集成电路,例如:一个或多个特定集成电路(ApplicationSpecificIntegratedCircuit,简称ASIC),或,一个或多个微处理器(digitalsingnalprocessor,简称DSP),或,一个或者多个现场可编程门阵列(FieldProgrammableGateArray,简称FPGA)等。再如,当以上某个模块通过处理元件调度程序代码的形式实现时,该处理元件可以是通用处理器,例如中央处理器(CentralProcessingUnit,简称CPU)或其它可以调用程序代码的处理器。再如,这些模块可以集成在一起,以片上系统(system-on-a-chip,简称SOC)的形式实现。For example, the above modules may be one or more integrated circuits configured to implement the above method, for example, one or more specific integrated circuits (ASICs), or one or more microprocessors (digitalsingnal processors, referred to as DSP), or one or more Field Programmable Gate Arrays (FPGAs). For another example, when one of the above modules is implemented by the processing component dispatcher code, the processing component may be a general-purpose processor, such as a central processing unit (CPU) or other processor that can call the program code. As another example, these modules can be integrated and implemented in the form of a system-on-a-chip (SOC).
本发明的存储介质上存储有计算机程序,该程序被处理器执行时实现上述的基于EDA封装库创建钢网库的方法。The storage medium of the present invention stores a computer program that, when executed by the processor, implements the above-described method of creating a steel mesh library based on the EDA package library.
所述存储介质包括:ROM、RAM、磁碟、U盘、存储卡或者光盘等各种可以存储程序代码的介质。The storage medium includes various media that can store program codes, such as a ROM, a RAM, a magnetic disk, a USB flash drive, a memory card, or an optical disk.
如图3所示,于一实施例中,本发明的终端包括:处理器31及存储器32。As shown in FIG. 3, in an embodiment, the terminal of the present invention includes a processor 31 and a memory 32.
所述存储器32用于存储计算机程序。The memory 32 is used to store a computer program.
所述存储器32包括:ROM、RAM、磁碟、U盘、存储卡或者光盘等各种可以存储程序代码的介质。The memory 32 includes various media that can store program codes, such as a ROM, a RAM, a magnetic disk, a USB flash drive, a memory card, or an optical disk.
所述处理器31与所述存储器32相连,用于执行所述存储器32存储的计算机程序,以使所述终端执行上述的基于EDA封装库创建钢网库的方法。The processor 31 is coupled to the memory 32 for executing a computer program stored by the memory 32 to cause the terminal to execute the above-described method for creating a steel mesh library based on an EDA package library.
优选地,所述处理器31可以是通用处理器,包括中央处理器(CentralProcessingUnit,简称CPU)、网络处理器(NetworkProcessor,简称NP)等;还可以是数字信号处理器(DigitalSignalProcessor,简称DSP)、专用集成电路(ApplicationSpecificIntegratedCircuit,简称ASIC)、现场可编程门阵列(Field-ProgrammableGateArray,简称FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。Preferably, the processor 31 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), and the like; or a digital signal processor (DSP). Application Specific Integrated Circuit (ASIC), Field-Programmable Gate Array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
下面通过具体实施例来进一步阐述本发明的基于EDA封装库创建钢网库的方法。The method of creating a steel mesh library based on the EDA package library of the present invention is further explained below by way of specific embodiments.
在该实施例中,采用Cadence软件。In this embodiment, Cadence software is employed.
(1)在Cadence allegro软件中封装库文件为*.dra或*.psm文件,利用cadence API获取每一个*.dra文件中的焊盘图形尺寸信息。(1) The library file is packaged as a *.dra or *.psm file in the Cadence allegro software, and the cadence API is used to obtain the pad pattern size information in each *.dra file.
(2)将封装名为c1206.dra文件通过API获取焊盘图形矢量数据。(2) The pad pattern vector data is acquired through the API by the package name c1206.dra file.
(3)选择一个开口算法模型。(3) Select an open algorithm model.
(4)利用焊盘本身的长宽等尺寸,根据开口算法模型对焊盘进行钢网开口生成,产生一个钢网开口图形。(4) Using the length and width of the pad itself, the stencil opening is generated according to the opening algorithm model to generate a stencil opening pattern.
(5)保存钢网开口图形数据。(5) Save the stencil opening graphic data.
于一实施例中,可以利用Cadence allegro软件的API将钢网开口图形数据写到c1206.dra中,将钢网开口图形数据生成在新的一个数据层并更新保存封装库。其中,推荐数据层命名为Stencil_TOP。In one embodiment, the stencil opening graphic data can be written into the c1206.dra using the API of the Cadence allegro software, and the stencil opening graphic data is generated in a new data layer and the storage package is updated. Among them, the recommended data layer is named Stencil_TOP.
于另一实施例中,将焊盘图形数据和钢网开口图形数据都保存到一个数据库中,以封装名为唯一关键字段,具体如表1所示。In another embodiment, both the land pattern data and the stencil opening pattern data are saved in a database, and the package is named as a unique key field, as shown in Table 1.
表1、钢网开口图形数据库字段Table 1, steel mesh opening graph database field
封装名Package name 焊盘图形Land pattern 钢网开口图形Steel mesh opening pattern
c1206C1206 图形数据Graphic data 图形数据Graphic data
重复上述操作,直至所有的设计焊盘封装库都处理完毕,从而完成钢网库的构建,能够在自动钢网设计时直接使用这些钢网开口图像数据。Repeat the above steps until all the design pad package libraries have been processed, thus completing the construction of the steel mesh library, which can directly use the stencil opening image data in the automatic stencil design.
需要说明的是,本发明所采用的布线设计软件不限于Cadence,还可以是Altium Designer, Mentor Graphics,Zuken等。It should be noted that the wiring design software used in the present invention is not limited to Cadence, and may be Altium Designer, Mentor Graphics, Zuken, and the like.
综上所述,本发明的基于EDA封装库创建钢网库的方法及系统、存储介质及终端根据EDA封装库来创建钢网库,能够利用钢网开口图形数据和封装名的关系自动得到所有PCB的钢网开口,从而能够自动化的完成钢网的设计;将钢网开口准备提前至设计阶段,而不是在制造阶段,极大地缩短了设计周期;由于任何一个PCB上的元器件都会用到布线封装库中的焊盘封装,因此不会遗漏任何一个钢网开口,从而能够更加系统性的维护钢网库。所以,本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。In summary, the method and system for creating a steel mesh library based on the EDA package library, the storage medium and the terminal create a steel mesh library according to the EDA package library, and can automatically obtain all the relationships between the opening pattern data of the steel mesh and the package name. PCB stencil opening, which can automate the design of stencil; advance the stencil opening preparation to the design stage, rather than in the manufacturing stage, greatly shortening the design cycle; since any component on the PCB will be used The pad package in the wiring package library, so that no stencil opening is missed, so that the steel mesh library can be maintained more systematically. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications or variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and scope of the invention will be covered by the appended claims.

Claims (10)

  1. 一种基于EDA封装库创建钢网库的方法,其特征在于,包括以下步骤:A method for creating a steel mesh library based on an EDA package library, comprising the steps of:
    获取EDA封装库中的焊盘图形数据;Obtaining pad pattern data in the EDA package library;
    基于所述焊盘图形数据和预设开口算法创建钢网开口图形数据;Creating stencil opening graphic data based on the land pattern data and a preset opening algorithm;
    保存所述钢网开口图形数据。The stencil opening graphic data is saved.
  2. 根据权利要求1所述的基于EDA封装库创建钢网库的方法,其特征在于,所述焊盘图形数据包括焊盘的长度和宽度。A method of creating a steel mesh library based on an EDA package library according to claim 1, wherein the land pattern data comprises a length and a width of the land.
  3. 根据权利要求1所述的基于EDA封装库创建钢网库的方法,其特征在于,将所述钢网开口图形数据保存至所述EDA封装库或焊盘钢网关系数据库中。The method for creating a steel mesh library based on an EDA package library according to claim 1, wherein the stencil opening pattern data is saved in the EDA package library or the pad steel mesh relation database.
  4. 根据权利要求1所述的基于EDA封装库创建钢网库的方法,其特征在于,所述钢网开口图形数据包括封装名、焊盘图形数据和钢网开口图形数据。The method for creating a steel mesh library based on an EDA package library according to claim 1, wherein the stencil opening pattern data comprises a package name, land pattern data, and stencil opening pattern data.
  5. 一种基于EDA封装库创建钢网库的系统,其特征在于,包括获取模块、创建模块和保存模块;A system for creating a steel mesh library based on an EDA package library, comprising: acquiring a module, creating a module, and saving a module;
    所述获取模块用于获取EDA封装库中的焊盘图形数据;The obtaining module is configured to acquire pad graphic data in an EDA package library;
    所述创建模块用于基于所述焊盘图形数据和预设开口算法创建钢网开口图形数据;The creating module is configured to create stencil opening graphic data based on the land pattern data and a preset opening algorithm;
    所述保存模块用于保存所述钢网开口图形数据。The saving module is configured to save the stencil opening graphic data.
  6. 根据权利要求5所述的基于EDA封装库创建钢网库的系统,其特征在于,所述焊盘图形数据包括焊盘的长度和宽度。A system for creating a steel mesh library based on an EDA package library according to claim 5, wherein the land pattern data comprises a length and a width of the land.
  7. 根据权利要求5所述的基于EDA封装库创建钢网库的系统,其特征在于,所述保存模块将所述钢网开口图形数据保存至所述EDA封装库或焊盘钢网关系数据库中。The system for creating a steel mesh library based on an EDA package library according to claim 5, wherein the saving module saves the stencil opening graphic data to the EDA package library or the pad steel mesh relation database.
  8. 根据权利要求5所述的基于EDA封装库创建钢网库的系统,其特征在于,所述钢网开口图形数据包括封装名、焊盘图形数据和钢网开口图形数据。The system for creating a steel mesh library based on an EDA package library according to claim 5, wherein the stencil opening pattern data comprises a package name, land pattern data, and stencil opening pattern data.
  9. 一种存储介质,其上存储有计算机程序,其特征在于,该程序被处理器执行时实现权利要求1至4中任一项所述的基于EDA封装库创建钢网库的方法。A storage medium having stored thereon a computer program, wherein the program is executed by a processor to implement a method of creating a steel mesh library based on an EDA package library according to any one of claims 1 to 4.
  10. 一种终端,其特征在于,包括:处理器及存储器;A terminal, comprising: a processor and a memory;
    所述存储器用于存储计算机程序;The memory is for storing a computer program;
    所述处理器用于执行所述存储器存储的计算机程序,以使所述终端执行权利要求1至4中任一项所述的基于EDA封装库创建钢网库的方法。The processor is configured to execute the computer program of the memory storage to cause the terminal to execute the method for creating a steel mesh library based on the EDA package library according to any one of claims 1 to 4.
PCT/CN2018/090381 2018-04-11 2018-06-08 Method and system for creating steel mesh library on basis of eda package library, and storage medium and terminal WO2019196188A1 (en)

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