WO2019186693A1

WO2019186693A1 - Method of cutting glass substrate

Info

Publication number: WO2019186693A1
Application number: PCT/JP2018/012416
Authority: WO
Inventors: 菊池芳郎; 柴田宏之
Original assignee: 日本碍子株式会社
Priority date: 2018-03-27
Filing date: 2018-03-27
Publication date: 2019-10-03
Also published as: JPWO2019186693A1

Abstract

The present invention relates to a method of cutting a glass substrate (10) which has a plurality of cavities (60) formed on one surface thereof. A lower surface (58) on which the cavities (60) are formed of the glass substrate (10) which is to be cut is bonded to an upper surface (14a) of a fixed substrate (14) that is formed from a material having a Young's modulus that is equal to or higher than the Young's modulus of the glass substrate (10), and the glass substrate (10) is cut using a dicing device (100).

Description

Glass substrate cutting method

The present invention relates to a method for cutting a glass substrate used for manufacturing optical components such as LEDs (light emitting diodes) and LDs (laser diodes).

In recent years, optical components including optical elements (such as LEDs and LDs) that emit ultraviolet light have attracted attention because of their potential application in sterilization and purification applications. In such an optical component, a transparent sealing member is used to protect the optical element from outside air and moisture. For the transparent sealing member, ultraviolet light transmissive glass, quartz glass, or the like is desirable from the viewpoint of ultraviolet light permeability and durability.

Japanese Unexamined Patent Application Publication No. 2014-216532 discloses a semiconductor optical element package having a non-transparent substrate having a semiconductor element mounted on the upper surface and a translucent protective material having a cavity opened below.

Incidentally, in order to efficiently produce a transparent sealing member, it is conceivable to produce a glass substrate formed by collectively forming the transparent sealing member in an array and to cut the glass substrate. For such cutting of the glass substrate, a general cutting method can be used in which the glass substrate is bonded to a pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet is fixed to a vacuum chuck, and cut by a dicing apparatus.

However, it has been found that when a glass substrate having a cavity opened below is cut by the above method, chipping or scratches (also referred to as chipping) are likely to occur on the end face of the cut portion. Such chippings and scratches are the starting point of cracks, so that there is a problem that cracks are likely to occur in the transparent sealing member during long-term use, leading to a decrease in durability.

Moreover, in order to improve the productivity of the transparent sealing member, it is preferable to use a large-area glass substrate that can form a larger number of transparent sealing members at one time. It has been clarified that the larger the area of the glass substrate, the more easily it occurs.

Therefore, a method for cutting a glass substrate that is unlikely to cause chipping or scratches on the end face of the cut portion is desired.

[1] One aspect of the present invention relates to a method for cutting a glass substrate in which a plurality of cavities are formed on one surface, and a fixed substrate made of a material having a Young's modulus equivalent to or higher than that of the glass substrate. A plurality of steps formed on the glass substrate using a dicing device, a step of bonding the surface of the glass substrate facing the surface on which the cavity is formed, and affixing the lower surface of the fixed substrate to a base; And cutting the plurality of cavities by cutting a cutting region between the cavities.

When a glass substrate having a cavity is cut by a conventional method, the bonding area between the glass substrate and the pressure-sensitive adhesive sheet is reduced by the area of the cavity, and the fixing becomes unstable. Furthermore, the adhesive sheet having a low Young's modulus vibrates due to the cutting resistance during processing. As a result, chipping and scratches (chipping) frequently occur on the cut surface of the glass substrate. In contrast, in the method for cutting a glass substrate according to the above aspect, the glass substrate is attached to a fixed substrate made of a material having a Young's modulus equal to or higher than that of glass to perform cutting. Thereby, the vibration of the glass substrate at the time of a cutting | disconnection is suppressed and generation | occurrence | production of chipping can be suppressed significantly.

[2] In the glass substrate cutting method according to the above aspect, the entire lower surface of the fixed substrate may be fixed to the base.

¡Vibration of the fixed substrate is suppressed when the entire lower surface of the fixed substrate is in close contact with the adhesive sheet. As a result, the vibration of the fixed substrate and the glass substrate is suppressed, which is effective for preventing chipping.

[3] In the glass substrate cutting method according to the above aspect, the fixed substrate may be a material having a Young's modulus of 50 GPa to 500 GPa.

Since the Young's modulus of glass is 50 GPa to 100 GPa, it is preferable to use a material having a Young's modulus larger than 50 GPa for the fixed substrate. In addition, since a material having a Young's modulus exceeding 500 GPa is difficult to cut, the Young's modulus of the fixed substrate is preferably 500 GPa or less.

[4] In the glass substrate cutting method according to the above aspect, the glass substrate may be made of quartz glass, and the fixed substrate may be a material having a Young's modulus of 70 GPa to 340 GPa.

[5] In the glass substrate cutting method according to the above aspect, the fixed substrate may be any of a silicon substrate, a glass substrate, an alumina substrate, and an aluminum nitride substrate.

[6] In the glass substrate cutting method according to the above aspect, the thickness of the fixed substrate may be equal to or less than the thickness of the cutting region of the glass substrate.

When using a fixed substrate having a Young's modulus higher than the Young's modulus of the glass substrate to be cut, the effect of preventing chipping can be obtained even if the thickness of the fixed substrate is made thinner than the thickness of the cutting region of the glass substrate. It turned out to be obtained. Thus, when a fixed substrate thinner than the glass substrate is used, the cutting resistance when cutting the fixed substrate together with the glass substrate is reduced, and the time required for cutting can be shortened.

[7] In the glass substrate cutting method according to the above aspect, the thickness of the cutting region of the glass substrate may be 0.2 mm to 3.0 mm.

[8] In the glass substrate cutting method according to the above aspect, the thickness of the fixed substrate may be 0.2 mm to 2.0 mm.

[9] In the glass substrate cutting method according to the above aspect, the ratio of the area occupied by the cavity of the glass substrate in the glass substrate may be 10% to 60%.

[10] In the cutting method of a glass substrate of the aspect, the area of the glass substrate may be 400mm ^² ~ 3600mm ^2.

The inventor of the present application has found that chipping tends to occur as the area of the glass substrate increases. When the area of the glass substrate is 400 mm ² or more, chipping is likely to occur. Further, if the area of the glass substrate is in the range of up to 3600 mm ² , the warp is small and the adhesion with the fixed substrate is good, which is preferable.

[11] In the glass substrate cutting method according to the above aspect, the glass substrate may be bonded to the fixed substrate with an adhesive.

By fixing with an adhesive, the glass substrate can be fixed to the fixed substrate more firmly than the adhesive sheet.

[12] In the glass substrate cutting method according to the above aspect, the fixed substrate may be fixed to the base via an adhesive sheet.

In the case of cutting without completely cutting the fixed substrate, the fixed substrate may be fixed to the base via the adhesive sheet in this way.

[13] In the method for cutting a glass substrate according to the above aspect, in the step of cutting the cavity, the fixed substrate may be cut together with the glass substrate.

Since no cavity is formed on the lower surface of the fixed substrate, vibrations of the fixed substrate and the glass substrate can be suppressed even if the fixed substrate is separated. Therefore, even when the fixed substrate is cut together with the glass substrate, the effect of preventing chipping can be obtained.

[14] In the glass substrate cutting method according to the above aspect, an optical element may be mounted on an upper surface of the fixed substrate at a portion facing the cavity.

By cutting a fixed substrate on which an optical element (for example, LED or LD) is mounted together with a glass substrate, the transparent sealing member and the mounting substrate on which the optical element is mounted are cut together. Thereby, the package of an optical element can be manufactured easily. Further, by separating the transparent sealing member and the mounting substrate in a lump, positioning of the plurality of transparent sealing members and the mounting substrate can be performed only once, and generation of defective products due to misalignment can be suppressed.

[15] In the glass substrate cutting method according to the above aspect, a concave portion may be formed on the upper surface of the fixed substrate other than a portion bonded to the glass substrate.

According to the method for cutting a glass substrate according to the present invention, chipping such as chipping or scratching can be prevented at the cut portion of the glass substrate during cutting.

It is a schematic diagram which shows the cutting method of the glass substrate which uses the dicing apparatus which concerns on the 1st Embodiment of this invention. It is a perspective view of the lower surface side of the glass substrate of FIG. 3A is a perspective view of the upper surface side of the transparent sealing member obtained by cutting the glass substrate of FIG. 1, and FIG. 3B is a perspective view of the lower surface side. It is sectional drawing which shows the cutting method of the glass substrate which concerns on the 1st Embodiment of this invention. 5A is a cross-sectional view illustrating a glass substrate cutting method according to Modification 1 of the first embodiment, and FIG. 5B is a perspective view of a transparent sealing member obtained by the glass substrate cutting method of FIG. 5A. . 6A is a bottom view of a glass substrate according to Modification 2 of the first embodiment, FIG. 6B is a perspective view showing a state where the glass substrate of FIG. 6A is attached to a fixed substrate, and FIG. It is sectional drawing which shows the cutting method of the glass substrate which concerns on embodiment. It is sectional drawing which shows the glass substrate and fixed substrate which concern on the modification 3 of the 1st Embodiment of this invention. FIG. 8A is a cross-sectional view showing the glass substrate cutting step (first cutting step) in FIG. 7, and FIG. 8B is a cross-sectional view showing the fixed substrate cutting step (second cutting step) in FIG. . 9A is a cross-sectional view of an optical component obtained by the cutting process of FIGS. 8A and 8B, and FIG. 9B is an enlarged cross-sectional view of a region T surrounded by a broken line in FIG. 9A. It is sectional drawing which shows the cutting method of the glass substrate which concerns on the modification 4 of the 1st Embodiment of this invention. 3 is a table showing glass substrates according to Examples 1 to 8, Comparative Examples, and Reference Examples. 6 is a table showing adhesives and fixed substrates according to Examples 1 to 8, Comparative Examples, and Reference Examples. 6 is a table showing evaluation results of cutting conditions and chipping occurrence rates according to Examples 1 to 8, Comparative Examples, and Reference Examples. FIG. 14A is a perspective view of a glass substrate according to the second embodiment of the present invention, and FIG. 14B is a plan view of the glass substrate of FIG. 14A. FIG. 14B is an enlarged perspective view showing the lens in the vicinity of the second mark in FIG. 14A by cutting.

Hereinafter, preferred embodiments of the present invention will be given and described in detail with reference to the accompanying drawings. In addition, the dimension ratio of drawing is exaggerated on account of description, and may differ from an actual ratio. In the following description, the direction from the fixed substrate toward the glass substrate is referred to as “upper side” or upper side, and the opposite direction is referred to as “lower side” or lower side. In each member, a surface appearing on the upper side is called an upper surface, and a surface appearing on the lower side is called a lower surface.

(First embodiment)
In the glass substrate cutting method according to the first embodiment of the present invention, the glass substrate 10 shown in FIG. 1 is cut. The glass substrate 10 has a plurality of lenses 56 arranged in a matrix on the upper surface thereof. As shown in FIG. 2, a plurality of cavities 60 are formed on the lower surface of the glass substrate 10. These cavities 60 are provided corresponding to the respective lenses 56, and the positions of the cavities 60 in the plane of the glass substrate 10 coincide with the positions of the lenses 56. That is, the cavities 60 are arranged in a matrix like the lens 56.

The ratio of the area occupied by the cavity 60 in the lower surface 58 of the glass substrate 10 can be set in the range of 10% to 60%, for example. The planar shape of the cavity 60 is not limited to a rectangle, and may be a circle or a polygon.

As shown in FIG. 1, a flat pedestal portion 54 is formed between the lens 56 and the cavity 60, and a part of the pedestal portion 54 becomes a cutting region 54a. In the following description, the thickness of the pedestal portion 54 (cutting region 54a) is referred to as the thickness of the glass substrate 10.

The glass substrate 10 is formed of a hard material such as quartz glass, and is cut by a dicing apparatus 100 as shown in FIG. When the cutting region 54a of the glass substrate 10 is cut into a lattice shape by the dicing apparatus 100, a transparent sealing member 50 as shown in FIG. 3A is obtained. The transparent sealing member 50 includes a rectangular pedestal 54, and a lens 56 protruding in a hemispherical or bun-shaped dome shape is formed at the center of the upper surface 57 of the pedestal 54. The Further, as shown in FIG. 3B, a cavity 60 is formed in the central portion of the lower surface 58 of the pedestal portion 54.

Such a transparent sealing member 50 is used by bonding the lower surface 58 to a mounting substrate on which optical elements such as LEDs and LDs are mounted. Optical elements such as LEDs and LDs are sealed in the cavity 60 of the transparent sealing member 50 and are protected from the outside air and moisture. The length of one piece of the transparent sealing member 50 can be about 3.5 mm, for example. The area of the cavity 60 is, for example, 2 mm ² to 10 mm ² .

The glass substrate 10 (see FIG. 1) used for manufacturing the transparent sealing member 50 is not particularly limited, but can be a square having a side length of about 20 mm to 60 mm. The shape of the glass substrate 10 is not limited to a square shape, and may be a rectangular shape or a polygonal shape. In the glass substrate 10, several tens to hundreds of lenses 56 and cavities 60 are formed according to the area.

Area of the glass substrate 10 can be, for example, a 400mm ^² ~ 3600mm ^2. As the area of the glass substrate 10 is smaller, chipping is less likely to occur, but the number of transparent sealing members 50 obtained from one glass substrate 10 is reduced. On the other hand, as the area of the glass substrate 10 increases, the occurrence rate of chipping increases. When the area of the glass substrate 10 is 400 mm ² or more, the chipping occurrence rate increases. Therefore, it is preferable to use the cutting method of the present embodiment for the glass substrate 10 larger than the area. On the other hand, if the glass substrate 10 is too large, the warpage of the glass substrate 10 and the fixed substrate 14 tends to increase, and the adhesion between the fixed substrate 14 and the glass substrate 10 decreases and chipping is likely to occur.

The thickness of the pedestal 54 (and the cutting region 54a) of the glass substrate 10 is substantially the same value as the depth of the cavity 60, and can be, for example, in the range of 0.2 mm to 2 mm. The thinner the cutting region 54 a of the glass substrate 10 is, the lower the cutting resistance is and the easier it is to cut. However, from the viewpoint of securing the depth of the cavity 60, the thickness is preferably 0.2 mm or more. Further, the value of the warp (in-plane height difference) of the glass substrate 10 is preferably set to 0.25 mm or less from the viewpoint of ensuring adhesion with the fixed substrate 14 described later.

Such a glass substrate 10 can be formed by a powder sintering method. In the powder sintering method, a molding slurry containing silica powder, a dispersant, and an organic compound as a curing agent is cast into a mold and solidified by a chemical reaction of the curing agent. Then, it can produce by releasing from a shaping | molding die and baking.

Here, as the silica powder used for the molding slurry of the glass substrate 10, for example, one having an average particle diameter of 0.5 μm can be used. Moreover, as a dispersing agent, a carboxylic acid copolymer can be used, for example. As the solvent, dimethyl malonate and ethylene glycol can be used, and as the curing agent, diphenylmethane diisocyanate can be used. Further, triethylamine may be added as a catalyst.

The above slurry is poured into a mold at room temperature, allowed to solidify for a certain time, and then released. The released molded body is left in an atmosphere of about 100 ° C. for a certain period of time to remove the solvent, and then calcined at 500 ° C. in the air. Further, the glass substrate 10 is obtained by densification and transparency by baking at 1600 ° C. to 1700 ° C. in a hydrogen atmosphere.

The glass substrate 10 is cut using a dicing apparatus 100 shown in FIG.

In the method for cutting the glass substrate 10 of the present embodiment, the glass substrate 10 is attached to the fixed substrate 14 and then fixed to the adhesive sheet 16 and cut in order to prevent chipping. That is, prior to cutting by the dicing apparatus 100, first, the glass substrate 10 is bonded to the upper surface 14 a of the fixed substrate 14.

As shown in FIG. 4, the glass substrate 10 is attached to the fixed substrate 14, for example, by applying the adhesive 12 to the upper surface 14 a of the fixed substrate 14 and applying the lower surface 58 of the glass substrate 10 on the adhesive 12. This is done by pasting. Further, instead of applying the adhesive 12 to the upper surface 14 a of the fixed substrate 14, the adhesive 12 is applied to the lower surface 58 of the glass substrate 10, and the lower surface 58 of the glass substrate 10 is bonded to the upper surface 14 a of the fixed substrate 14. Also good. The adhesive 12 can be an epoxy adhesive or wax, and can be applied to the upper surface 14a of the fixed substrate 14 or the lower surface 58 of the glass substrate 10 by a method such as a coating method, a printing method, a spin coating method, or a spray method. Good.

The fixed substrate 14 is preferably made of a material having a Young's modulus equal to or higher than the Young's modulus of the glass substrate 10, for example, a material having a Young's modulus of 50 GPa to 500 GPa. When the glass substrate 10 is made of quartz glass (Young's modulus: 72 GPa), a material having a Young's modulus of 70 GPa to 340 GPa can be used for the fixed substrate 14. In this case, for example, a glass substrate (Young's modulus: 70 GPa), a silicon substrate (Young's modulus: 180 GPa), an aluminum nitride substrate (Young's modulus: 320 GPa), or an alumina substrate (Young's modulus: 340 GPa) is used as the fixed substrate 14. be able to.

Further, the thickness of the fixed substrate 14 can be appropriately set according to the Young's modulus of the material. The higher the Young's modulus, the thinner the fixed substrate 14 can be made. If the material has a sufficiently high Young's modulus, the fixed substrate 14 may be thinner than the glass substrate 10. When the thickness of the cutting region 54a of the glass substrate 10 is 0.2 mm to 3.0 mm, the thickness of the fixed substrate 14 can be set to, for example, about 0.2 mm to 2.0 mm. When the fixed substrate 14 is cut together with the glass substrate 10, the thinner the fixed substrate 14, the lower the cutting resistance and the easier the cutting. Therefore, the thinner fixed substrate 14 is preferable.

The area of the fixed substrate 14 may be equal to or larger than the area of the glass substrate 10 so as to cover the entire area of the glass substrate 10. Specifically, it may be 400 mm ² or more, for example. The lower limit 400 mm ² of the area of the fixed substrate 14 is based on the lower limit of the area of the glass substrate 10. The upper limit value of the area of the fixed substrate 14 can be appropriately set according to the size of the mounting surface of the vacuum chuck 20 (see FIG. 1) to be used.

Note that the lower surface 14b of the fixed substrate 14 is preferably a flat surface. As a result, the entire lower surface 14b of the fixed substrate 14 is bonded to the adhesive sheet 16, and the fixing by the adhesive sheet 16 is ensured. In addition, it is preferable to use the fixed substrate 14 having a warp of 0.25 mm or less in order to ensure adhesion with the adhesive sheet 16. The warpage of the fixed substrate 14 is a value obtained by the difference between the highest portion and the lowest portion on the line segment drawn diagonally of the fixed substrate. That is, the height difference of the lower surface 14b of the fixed substrate 14 is preferably 0.25 mm or less. Further, from the viewpoint of securing the adhesion between the fixed substrate 14 and the glass substrate 10, it is preferable that the warpage of the fixed substrate 14 is small. That is, by using the fixed substrate 14 with less warpage, the glass substrate 10 can be reliably fixed to the fixed substrate 14 and is suitable for preventing chipping.

Next, the lower surface 14 b of the fixed substrate 14 to which the glass substrate 10 is bonded is bonded to the upper surface of the adhesive sheet 16. The adhesive sheet 16 (also referred to as a dicing sheet or dicing tape) has an adhesive layer on the upper surface, and the entire lower surface 14b of the fixed substrate 14 is in close contact with the adhesive layer. As described above, the fixed substrate 14 is bonded and fixed to the adhesive sheet 16 on the entire surface of the lower surface 14b.

As shown in FIG. 1, the pressure-sensitive adhesive sheet 16 is formed in a disk shape, for example, and is attached to the vacuum chuck 20 (base) of the dicing apparatus 100 with its peripheral edge pressed by a stainless steel frame 18. Adsorbed and fixed. As the pressure-sensitive adhesive sheet 16, a polyethylene terephthalate resin (PET) film having an upper surface coated with an acrylic adhesive that loses its tackiness when irradiated with ultraviolet rays can be used.

The method for fixing the fixed substrate 14 to the base of the dicing apparatus 100 is not limited to the method using the adhesive sheet 16. For example, the fixed substrate 14 may be fixed to the base using wax that melts by heat between the fixed substrate 14 and the base. Alternatively, the fixed substrate 14 may be fixed to the base of the dicing apparatus 100 using an adhesive that loses adhesive force due to irradiation of electromagnetic waves or heat. If the fixed substrate 14 is not completely cut, the fixed substrate 14 may be directly placed and sucked using a vacuum chuck or an electrostatic chuck as a base.

The dicing apparatus 100 includes a vacuum chuck 20 (base), a blade 24, and a blade driving unit 22. The glass substrate 10 to be cut is fixed to the vacuum chuck 20 via the fixed substrate 14 and the adhesive sheet 16.

Thereafter, the cutting region 54 a of the glass substrate 10 is cut by the blade 24 driven by the blade driving unit 22. The cutting of the glass substrate 10 by the blade 24 is performed by inserting the blade 24 to a depth that penetrates the pedestal 54 of the glass substrate 10 as shown in FIG. Thereby, the chipping of the cut surface 52 (refer FIG. 3A) of the glass substrate 10 can be prevented.

Note that the width of the cutting region 54 a is determined according to the width of the blade 24. The width of the cutting region 54a can be set to 0.01 mm to 0.5 mm, for example. The moving speed of the blade 24 can be set to 1 mm / second to 10 mm / second, for example.

The fixed substrate 14 may be cut together with the glass substrate 10. In this case, a first cutting process is performed in which the blade 24 is inserted and cut to a depth that penetrates the pedestal 54 of the glass substrate 10 and does not penetrate the fixed substrate 14. Thereby, since the glass substrate 10 is being fixed on the hard fixed board | substrate which is not cut | disconnected at the time of the cutting | disconnection of the glass substrate 10, generation | occurrence | production of chipping can be prevented. Thereafter, a second cutting process is performed on the same portion to cut the fixed substrate 14 by inserting the blade 24 to a depth penetrating the fixed substrate 14. In the second cutting step, the fixed substrate 14 is cut. However, since the lower surface 14b of the fixed substrate 14 is a flat adhesive surface, vibration is unlikely to occur and chipping does not occur. Note that the second cutting step may be performed a plurality of times depending on the hardness and thickness of the fixed substrate 14. Thus, the fixed board | substrate 14 harder than the glass substrate 10 can be cut | disconnected by dividing | segmenting into multiple times.

The glass substrate 10 and the fixed substrate 14 may be cut in a single cutting process. Even in this case, the entire lower surface 14 b of the fixed substrate 14 is in close contact with the adhesive sheet 16, so that chipping can be suppressed.

As described above, even when the fixed substrate 14 is completely cut, since the entire lower surface 14b of the fixed substrate 14 is in close contact with the adhesive sheet 16, the fixed substrate 14 is securely fixed by the adhesive sheet 16. . Therefore, the vibration at the time of cutting of the fixed substrate 14 and the glass substrate 10 can be suppressed, and chipping can be prevented from occurring in the glass substrate 10.

After the glass substrate 10 and the fixed substrate 14 are cut, ultraviolet light is irradiated from the lower surface side of the adhesive sheet 16. Thereby, the adhesiveness of the adhesive layer of the adhesive sheet 16 is lost, and the glass substrate 10 and the fixed substrate 14 can be easily detached from the adhesive sheet 16. Further, the glass substrate 10 and the fixed substrate 14 can be separated by removing the adhesive 12 with a solvent or the like. Thus, the cutting of the glass substrate 10 is completed.

Hereinafter, various modifications of the present embodiment will be described.
(Modification 1)
As shown in FIG. 5A, the glass substrate 30 according to Modification 1 has an upper surface 37 that is a flat surface, and no lens is provided on the upper surface 37 of the glass substrate 30. A plurality of cavities 34 are formed in a matrix on the lower surface 38 side of the glass substrate 30. The cutting area 35 of the glass substrate 30 is formed between cavities 34 arranged in a matrix. The thickness of the glass substrate 30 of Modification 1 is thicker than the thickness of the glass substrate 10 (pedestal portion 54) in FIG. Other portions are the same as those of the glass substrate 10 of FIG.

Also in Modification 1, the glass substrate 30 is bonded to the upper surface 14 a of the fixed substrate 14 using the adhesive 12, and the lower surface 14 b of the fixed substrate 14 is bonded to the adhesive sheet 16. The material and thickness of the fixed substrate 14 can be the same as those described with reference to FIG. Thereafter, the glass substrate 30 is cut using the dicing apparatus 100 of FIG. 1 to obtain a transparent sealing member 36 having no lens as shown in FIG. 5B.

Also in Modification 1, since the glass substrate 30 is attached to the fixed substrate 14 and cut, the occurrence rate of chipping can be suppressed.

(Modification 2)
As for the glass substrate 40 which concerns on the modification 2, as shown to FIG. 6A and 6B, the cavity 60 is formed in the lower surface 58 at the array form. A plurality of grooves 42 extending in the vertical direction and the horizontal direction are formed in the lower surface 58. The grooves extending in the vertical direction and the grooves extending in the horizontal direction intersect each other. These grooves 42 are composed of a first groove 42a and a second groove 42b. The first groove 42 a communicates with the cavity 60. Further, the second groove 42 b is formed in an intermediate region of the cavity 60. These first and

second grooves

42 a and 42 b constitute a discharge path for excess refractive index matching agent when the cavity 60 is filled with the refractive index matching agent. Thereby, bubbles of the refractive index matching agent in the cavity 60 can be removed.

The area of the lower surface 58 of the glass substrate 40 of the modified example 2 is narrower than that of the glass substrate 10 shown in FIG. Therefore, since it is difficult to fix, chipping is likely to occur during cutting. Even with such a glass substrate 40, chipping can be suppressed by attaching and cutting to the fixed substrate 14 as shown in FIG. 6C. Note that the fixed substrate 14 of Modification 3 is the same as the fixed substrate 14 of FIG.

As described above, even when the plurality of grooves 42 are formed on the lower surface as in the glass substrate 40 of Modification 2, the occurrence rate of chipping can be suppressed by being attached to the fixed substrate 14 and cutting. .

(Modification 3)
In Modification 3, as shown in FIG. 7, the glass substrate 10 is cut using a fixed substrate 14A (mounting substrate) on which an optical element 62 such as an LED or LD is mounted on the upper surface. The optical element 62 is an element that emits ultraviolet light. For example, a GaN crystal layer having a quantum well structure is stacked on a sapphire substrate. As a mounting method of the optical element 62, so-called face-up mounting is adopted in which the light emitting surface 62a is mounted facing the glass substrate 10. Terminals derived from the optical element 62 and circuit wiring (not shown) formed on the fixed substrate 14A are electrically connected by bonding wires.

For the fixed substrate 14A, alumina (Young's modulus: 340 GPa) or aluminum nitride (Young's modulus: 320 GPa) can be used. Since these materials have a higher Young's modulus than the quartz glass (Young's modulus: 72 GPa) constituting the glass substrate 10, they can be used in the same manner as the fixed substrate 14 of FIG.

The cavities 60 of the glass substrate 10 are arranged at the same pitch as the optical elements 62, and each cavity 60 is provided at a position corresponding to the optical element 62. The adhesive 12 is applied to the lower surface 58 of the glass substrate 10. Thereafter, the glass substrate 10 is positioned so that the cavity 60 covers the optical element 62 and is attached to the fixed substrate 14A. In Modification 3, it is preferable to use an epoxy adhesive having excellent adhesive strength and strength as the adhesive 12.

Thereafter, as shown in FIG. 8A, the fixed substrate 14A is bonded to the adhesive sheet 16, and further fixed to the upper surface of the vacuum chuck 20 via the adhesive sheet 16. Next, the glass substrate 10 and the fixed substrate 14A are cut using the dicing apparatus 100 shown in FIG. For cutting the glass substrate 10 and the fixed substrate 14A, first, as shown in FIG. 8A, the blade 24 of the dicing apparatus 100 is inserted to a depth penetrating the glass substrate 10 to cut the glass substrate 10 (first cutting). Process). Thereby, the vibration of the glass substrate 10 can be prevented and the chipping occurrence rate of the cut surface of the glass substrate 10 can be suppressed.

Thereafter, as shown in FIG. 8B, the blade 24 is inserted at a depth penetrating the fixed substrate 14A at the same position as in the first cutting step, and the fixed substrate 14A is completely cut (second cutting step). Since the lower surface of the fixed substrate 14A is flat, the fixing substrate 14A is securely fixed by the adhesive sheet 16, so that the vibration of cutting is small and cutting can be performed without causing chipping. The glass substrate 10 and the fixed substrate 14A may be cut in a single cutting process.

Further, when cutting the fixed substrate 14A, another fixed substrate that is not completely cut may be arranged below the fixed substrate 14A for cutting. Alternatively, the fixed substrate 14A may be cut by a so-called chocolate break method in which the fixed substrate 14A is cut to a predetermined depth without being cut completely, and then the bending is applied to the cut.

When the glass substrate 10 and the fixed substrate 14A are cut by the above method, the optical component 70 having the cross-sectional structure of FIG. 9A is obtained. The optical component 70 has circuit wiring formed on the upper surface, a fixed substrate 14S on which the optical element 62 is mounted, and a transparent sealing member 50 that seals the optical element 62. 9B, the end surface 52a of the transparent sealing member 50 and the end surface 14c of the fixed substrate 14S are formed flush with each other. The end surface 52a of the transparent sealing member 50 is a smooth surface having almost no chipping or scratches and having a smaller surface roughness than the end surface 14c of the fixed substrate 14S.

According to the method for cutting a glass substrate of Modification 3 as described above, the fixing substrate 14A on which the optical element 62 is mounted together with the glass substrate 10 is cut, so that the transparent sealing member 50 and the transparent sealing member 50 simultaneously seal it. The fixed substrate 14S having the optical element 62 thus obtained is obtained. As a result, the package of the optical component 70 can be easily manufactured. In addition, since the transparent sealing member 50 and the fixed substrate 14A are cut together, positioning of the individual transparent sealing member 50 and the fixed substrate 14S becomes unnecessary. Further, since the end surface 52a of the transparent sealing member 50 and the end surface 14c of the fixed substrate 14S are formed flush with each other, the possibility that the transparent sealing member 50 is detached from the fixed substrate 14S is reduced even when an impact is applied from the outside. In addition, it is possible to prevent the stress from concentrating on the transparent sealing member 50 and generating cracks.

(Modification 4)
In the modification 4, as shown in FIG. 10, the glass substrate 10 is cut | disconnected using the fixed board | substrate 14B in which the recessed part 64 was formed in the upper surface. A concave portion 64 is formed in the fixed substrate 14B at a portion corresponding to the cavity 60 of the glass substrate 10. An optical element 62 that emits ultraviolet light is mounted in the recess 64. The upper surface 14a of the fixed substrate 14B other than the concave portion 64 is formed flat and joined to the lower surface 58 of the glass substrate 10 with the adhesive 12 interposed therebetween.

The bottom surface 15 of the fixed substrate 14B of Modification 4 is formed flat, and the entire bottom surface 15 is fixed in close contact with the adhesive sheet 16. Therefore, when the glass substrate 10 is cut by the blade 24 of the dicing apparatus 100, vibration due to cutting resistance can be suppressed by the fixed substrate 14B, and chipping can be prevented from occurring in the cutting region 54a.

Also, the method of cutting the glass substrate 10 according to the modified example 4 can easily manufacture an optical component package, and can suppress displacement between the transparent sealing member 50 and the fixed substrate 14B.

Hereinafter, the results of evaluating the chipping occurrence rate by cutting glass substrates using various fixed substrates will be described with reference to Examples 1 to 8, Comparative Examples, and Reference Examples. In Examples 1 to 8, Comparative Example, and Reference Example, a glass substrate made of quartz glass was used. These glass substrates were produced by a powder sintering method. The Young's modulus of these glass substrates is 72 GPa.

Example 1
As shown in FIG. 11, the glass substrate of Example 1 had a square shape with an area of 2025 mm ² , a side length of 45 mm, and a warpage of 0.05 mm. In addition, the warp measured the height of a board | substrate corner | angular part and a board | substrate center part using the confocal laser microscope, and made the difference the curvature. On the lower surface of the glass substrate, 100 square cavities having an area of 4.0 mm ² are formed. The ratio of the area of the cavity to the glass substrate is 20%. 100 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 0.5 mm.

Such a glass substrate was bonded with an epoxy adhesive to a substrate made of aluminum nitride (AlN) having a thickness of 0.3 mm as shown in FIG. The warpage of the fixed substrate in this example was 0.10 mm. Thereafter, the glass substrate and the fixed substrate were cut while being fixed to a vacuum chuck via an adhesive sheet and moving a blade having a width of 0.35 mm at 6 mm / second as shown in FIG. This cutting was performed in two cutting steps, a cutting step for cutting the glass substrate and a cutting step for cutting the fixed substrate.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 1, the chipping occurrence rate was 1%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

(Example 2)
In Example 2, the area and thickness were made smaller than the glass substrate of Example 1. That is, as shown in FIG. 11, the glass substrate of Example 2 had a square shape with an area of 625 mm ² , a side length of 25 mm, and a warpage of 0.02 mm. Twenty-five square cavities having an area of 4.0 mm ² are formed on the lower surface of the glass substrate. The ratio of the cavity area to the glass substrate is 16%. Twenty-five hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (thickness of the glass substrate) is 0.3 mm.

Such a glass substrate was bonded with an epoxy adhesive to a substrate made of aluminum nitride (AlN) having a thickness of 0.3 mm as shown in FIG. The warpage of the fixed substrate in this example was 0.05 mm. Thereafter, the glass substrate and the fixed substrate were cut while being fixed to a vacuum chuck via an adhesive sheet and moving a blade having a width of 0.40 mm at 6 mm / second as shown in FIG. This cutting was performed in two cutting steps, a cutting step for cutting the glass substrate and a cutting step for cutting the fixed substrate.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 2, the chipping occurrence rate was 0%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

Example 3
In Example 3, the thickness was made larger than that of the glass substrate of Example 1, the lens was removed, and the cavity was enlarged. That is, as shown in FIG. 11, the glass substrate of Example 3 had a square shape with an area of 1600 mm ² , a side length of 40 mm, and a warpage of 0.04 mm. On the lower surface of the glass substrate, 100 square cavities having an area of 6.8 mm ² are formed. The ratio of the area of the cavity to the glass substrate is 42%. A lens is not formed on the upper surface of the glass substrate and is flat. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 0.90 mm.

Such a glass substrate was bonded with an epoxy adhesive to a substrate made of aluminum nitride (AlN) having a thickness of 0.3 mm as shown in FIG. The warpage of the fixed substrate in this example was 0.08 mm. Thereafter, the glass substrate and the fixed substrate were cut while being fixed to a vacuum chuck via an adhesive sheet and moving a blade having a width of 0.20 mm at 3 mm / second as shown in FIG. This cutting was performed in two cutting steps, a cutting step for cutting the glass substrate and a cutting step for cutting the fixed substrate.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 3, the chipping occurrence rate was 4%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

Example 4
In Example 4, the area and thickness were made larger than those of the glass substrate of Example 1, the cavity was enlarged, and chipping was more likely to occur. That is, as shown in FIG. 11, the glass substrate of Example 4 had a square shape with an area of 3025 mm ² , a side length of 55 mm, and a warpage of 0.10 mm. On the lower surface of the glass substrate, 121 circular cavities having an area of 7.1 mm ² are formed. The ratio of the cavity area in the glass substrate is 28%. 121 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 2.00 mm.

Such a glass substrate was joined with an epoxy adhesive to a substrate made of alumina (Al ₂ O ₃ ) having a thickness of 0.3 mm as shown in FIG. The warpage of the fixed substrate in this example was 0.12 mm. Thereafter, the glass substrate and the fixed substrate were cut while being fixed to a vacuum chuck via an adhesive sheet and moving a blade having a width of 0.20 mm at 6 mm / second as shown in FIG. This cutting was performed in three cutting steps including two cutting steps for cutting the glass substrate and one cutting step for cutting the fixed substrate.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 4, the chipping occurrence rate was 6%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

(Example 5)
In Example 5, the larger cavity was cut from the glass substrate of Example 1. That is, as shown in FIG. 11, the glass substrate of Example 5 was a square shape with an area of 1600 mm ² , the length of one side was 40 mm, and the warpage was 0.04 mm. On the lower surface of the glass substrate, 121 square cavities having an area of 6.8 mm ² are formed. The ratio of the cavity area in the glass substrate is 51%. 121 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 0.50 mm.

Such a glass substrate was bonded with an epoxy adhesive to a substrate made of aluminum nitride (AlN) having a thickness of 0.3 mm as shown in FIG. The warpage of the fixed substrate in this example was 0.08 mm. Thereafter, the glass substrate and the fixed substrate were cut while being fixed to a vacuum chuck via an adhesive sheet and moving a blade having a width of 0.05 mm at 6 mm / second as shown in FIG. This cutting was performed in two cutting steps, a cutting step for cutting the glass substrate and a cutting step for cutting the fixed substrate.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 5, the chipping occurrence rate was 3%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

(Example 6)
In Example 6, what formed the groove | channel in the lower surface of the glass substrate of Example 5 was cut | disconnected. That is, as shown in FIG. 11, the glass substrate of Example 6 had a square shape with an area of 1600 mm ² , a side length of 40 mm, and a warpage of 0.04 mm. On the lower surface of the glass substrate, 121 square cavities having an area of 6.8 mm ² are formed. A plurality of grooves having the shape shown in FIG. 6A is formed on the lower surface of the glass substrate. The width of these grooves is 0.6 mm. The ratio of the area of the cavity and groove in the glass substrate is 57%. 121 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 0.50 mm.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 6, the chipping occurrence rate was 3%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

(Example 7)
In Example 7, the glass substrate equivalent to Example 1 was cut using a silicon substrate (silicon single crystal substrate) as a fixed substrate. That is, as shown in FIG. 11, the glass substrate of Example 7 was a square shape with an area of 2025 mm ² , the length of one side was 45 mm, and the warpage was 0.05 mm. On the lower surface of the glass substrate, 100 square cavities having an area of 4.0 mm ² are formed. The ratio of the area of the cavity to the glass substrate is 20%. 100 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 0.50 mm.

Such a glass substrate was bonded to a substrate made of silicon single crystal (Si) having a thickness of 0.5 mm using wax as shown in FIG. The warpage of the fixed substrate in this example was 0.00 mm. Then, it fixed to the vacuum chuck via the adhesive sheet, and as shown in FIG. 13, the glass substrate was cut | disconnected, moving a 0.35 mm-wide blade | blade at 6 mm / sec. This cutting was performed in a single cutting process in which the blade was inserted to a depth that penetrates the glass substrate and does not penetrate the fixed substrate.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 7, the chipping occurrence rate was 2%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

(Example 8)
In Example 8, the glass substrate equivalent to that of Example 1 was cut using glass as a fixed substrate. That is, as shown in FIG. 11, the glass substrate of Example 8 was a square shape with an area of 2025 mm ² , the length of one side was 45 mm, and the warpage was 0.05 mm. On the lower surface of the glass substrate, 100 square cavities having an area of 4.0 mm ² are formed. The ratio of the area of the cavity to the glass substrate is 20%. 100 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 0.50 mm.

Such a glass substrate was bonded to a substrate having a thickness of 1.00 mm made of glass (Young's modulus: 70 GPa) using wax as shown in FIG. The warpage of the fixed substrate in this example was 0.00 mm. Then, it fixed to the vacuum chuck via the adhesive sheet, and as shown in FIG. 13, the glass substrate was cut | disconnected, moving a 0.35 mm-wide blade | blade at 6 mm / sec. This cutting was performed in a single cutting process in which the blade was inserted to a depth that penetrates the glass substrate and does not penetrate the fixed substrate.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In Example 8, the chipping occurrence rate was 2%, and the effect of suppressing the chipping occurrence rate by the fixed substrate was confirmed.

(Comparative example)
In the comparative example, a glass substrate equivalent to the glass substrate of Example 1 was cut without using a fixed substrate. That is, as shown in FIG. 11, the glass substrate of the comparative example was a square shape with an area of 2025 mm ² , the length of one side was 45 mm, and the warpage was 0.05 mm. On the lower surface of the glass substrate, 100 square cavities having an area of 4.0 mm ² are formed. The ratio of the area of the cavity to the glass substrate is 20%. 100 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting area between the cavities (the thickness of the glass substrate) is 0.50 mm.

Such a glass substrate was attached and fixed to an adhesive sheet as shown in FIG. This pressure-sensitive adhesive sheet is obtained by forming a pressure-sensitive adhesive layer made of an acrylic adhesive on a PET resin (Young's modulus: 4 GPa). The adhesive sheet was fixed to a vacuum chuck, and the glass substrate was cut while moving a blade having a width of 0.35 mm at 6 mm / second as shown in FIG. This cutting was performed in a single cutting step in which the blade was inserted to a depth that penetrates the glass substrate and does not penetrate the adhesive sheet.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In the comparative example, the chipping occurrence rate is 60%, and it can be seen that chipping frequently occurs when a fixed substrate is not used.

(Reference example)
In the reference example, a glass substrate having no cavity formed on the lower surface is cut without using a fixed substrate. That is, as shown in FIG. 11, the glass substrate of the reference example had a square shape with an area of 2025 mm ² , a side length of 45 mm, and a warpage of 0.05 mm. No cavity is formed on the lower surface of the glass substrate, which is a flat surface. 100 hemispherical lenses are formed on the upper surface of the glass substrate. The thickness of the cutting region (the thickness of the glass substrate) is 0.50 mm.

Thereafter, the transparent sealing member obtained by cutting was observed with an optical microscope (50 times magnification), and the number of transparent sealing members on which chipping occurred was counted visually to determine the chipping occurrence rate. In the reference example, the chipping occurrence rate remains at 3%, and it can be seen that the chipping occurrence rate decreases when the cavity is eliminated. From this result, it can be seen that chipping occurs by providing a cavity in the glass substrate.

(Second Embodiment)
In the present embodiment, the glass substrate 10A shown in FIG. 14A is cut. The glass substrate 10A has a plurality of lenses 56 arranged in a matrix on the upper surface thereof. A plurality of mark patterns 80 are formed on the surface of the flat base portion 54 of the glass substrate 10A. As shown in FIG. 14B, the mark pattern 80 includes a relatively small first mark 82 and a relatively large second mark 84.

The first marks 82 are arranged in a matrix between the lenses 56 of the glass substrate 10A at the same arrangement interval as the lenses 56. These first marks 82 are arranged on the cutting area of the glass substrate 10A. The width of the first mark 82 in the X direction and the Y direction is smaller than the cutting area, and is removed together with the cutting area of the glass substrate 10 when the plurality of lenses 56 are cut. The width of the first mark 82 in the X direction and the Y direction can be set to, for example, about 0.1 mm to 0.5 mm.

As shown in FIG. 15, the first mark 82 can be formed as a rectangular recess, for example. The first mark 82 is not limited to the concave portion, and may be a convex portion. Further, the first mark 82 may be formed by applying a pigment by a printing method or the like. The shape of the first mark 82 is not limited to a rectangle, and may be a polygonal shape such as a cross, a circle, an ellipse, or a triangle. Furthermore, the installation position of the first mark 82 is not limited to the upper surface 57 of the glass substrate 10A, but may be formed on the lower surface 58 of the glass substrate 10A, or may be formed on both the upper surface 57 and the lower surface 58. Also good.

The above-mentioned first mark 82 can be used for cutting position alignment when the glass substrate 10A is placed on the dicing apparatus 100 (see FIG. 1). That is, the glass substrate 10 </ b> A is arranged so that the first mark 82 is positioned on the planned cutting line of the dicing apparatus 100, so that the alignment can be easily performed.

On the other hand, as shown in FIG. 14A and FIG. 14B, the second mark 84 is provided only in one corner at the corner of the rectangular glass substrate 10A. As shown in FIG. 15, the second mark 84 can be formed as a rectangular recess. Note that the second mark 84 is not limited to the concave portion, and may be a convex portion or may be formed by applying a pigment. The shape of the second mark 84 is not limited to a rectangular shape, and may be formed in a cross shape, a circular shape, an elliptical shape, a polygonal shape, or the like. The second mark 84 can be formed on one or both of the upper surface 57 and the lower surface 58 of the glass substrate 10A. The width in the X direction and the Y direction of the second mark 84 can be set to, for example, 0.3 mm to 3 mm.

The second mark 84 can be easily distinguished from the first mark 82 because the width in the X direction and the Y direction is larger than that of the first mark 82. By taking the position of the second mark 84 as a reference, the orientation of the glass substrate 10A can be easily specified. Further, the specific lens 56 can be identified by detecting the distance to each lens 56 with the position of the second mark 84 as a reference.

In the above description, the present invention has been described with reference to preferred embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. Yes.

Claims

A method of cutting a glass substrate (10) having a plurality of cavities (60) formed on one side,
The upper surface of the fixed substrate (14) made of a material having a Young's modulus equal to or higher than that of the glass substrate (10) faces the surface of the glass substrate (10) where the cavity (60) is formed. And pasting together,
Fixing the lower surface of the fixed substrate (14) to a base (20);
Cutting the plurality of cavities (60) by cutting a cutting region (54a) between the plurality of cavities (60) formed in the glass substrate (10) using a dicing apparatus (100). A method for cutting a glass substrate (10), comprising:
The method for cutting a glass substrate (10) according to claim 1, wherein the entire lower surface of the fixed substrate (14) is fixed to the base (20).
The method for cutting a glass substrate (10) according to claim 1 or 2, wherein the fixed substrate (14) is made of a material having a Young's modulus of 50 GPa to 500 GPa. .
The method for cutting a glass substrate (10) according to claim 3, wherein the glass substrate (10) is made of quartz glass, and the fixed substrate (14) is made of a material having a Young's modulus of 70 GPa to 340 GPa. A method for cutting the glass substrate (10).
The method for cutting a glass substrate (10) according to any one of claims 1 to 4, wherein the fixed substrate (14) is a silicon substrate, a glass substrate, an alumina substrate, and an aluminum nitride substrate. A method for cutting the glass substrate (10).
The glass substrate (10) cutting method according to any one of claims 1 to 5, wherein the thickness of the fixed substrate (14) is equal to the thickness of the cutting region (54a) of the glass substrate (10). A method for cutting a glass substrate (10), which is equivalent or thinner than the above.
The method for cutting a glass substrate (10) according to any one of claims 1 to 6, wherein the thickness of the cutting region (54a) of the glass substrate (10) is 0.2 mm to 3.0 mm. A method for cutting a glass substrate (10), comprising:
The method for cutting a glass substrate (10) according to claim 7, wherein the thickness of the fixed substrate (14) is 0.2 mm to 2.0 mm.
The method for cutting a glass substrate (10) according to any one of claims 1 to 8, wherein the area ratio of the cavity (60) of the glass substrate (10) to the glass substrate (10) is 10%. A method for cutting a glass substrate (10), characterized in that the percentage is from 60% to 60%.
A method for cutting a glass substrate (10) according to any one of claims 1 to 9, a glass substrate (10, wherein the area of the glass substrate (10) is 400mm 2 ~ 3600mm 2 ) Cutting method.
The method for cutting a glass substrate (10) according to any one of claims 1 to 10, wherein the glass substrate (10) is bonded to the fixed substrate (14) with an adhesive. A method for cutting the glass substrate (10).
The method for cutting a glass substrate (10) according to any one of claims 1 to 11, wherein the fixed substrate (14) is fixed to the base (20) via an adhesive sheet (16). A method for cutting a glass substrate (10), wherein:
The method for cutting a glass substrate (10) according to any one of claims 1 to 12, wherein in the step of cutting the cavity (60), the fixed substrate (14) is cut together with the glass substrate (10). A method for cutting a glass substrate (10), comprising:
The method for cutting a glass substrate (10) according to any one of claims 1 to 13, wherein an optical element (62) is provided on an upper surface of the fixed substrate (14) in a portion facing the cavity (60). Is mounted, A method for cutting a glass substrate (10).
The method for cutting a glass substrate (10) according to any one of claims 1 to 14, wherein a concave portion (64) is formed on an upper surface of the fixed substrate (14) other than an adhesive portion with the glass substrate (10). A method for cutting a glass substrate (10), wherein: