WO2019184980A1 - Packaging module and package on package structure - Google Patents

Packaging module and package on package structure Download PDF

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Publication number
WO2019184980A1
WO2019184980A1 PCT/CN2019/080091 CN2019080091W WO2019184980A1 WO 2019184980 A1 WO2019184980 A1 WO 2019184980A1 CN 2019080091 W CN2019080091 W CN 2019080091W WO 2019184980 A1 WO2019184980 A1 WO 2019184980A1
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WO
WIPO (PCT)
Prior art keywords
connection point
package
package module
substrate
electronic component
Prior art date
Application number
PCT/CN2019/080091
Other languages
French (fr)
Chinese (zh)
Inventor
杨望来
Original Assignee
维沃移动通信有限公司
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Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2019184980A1 publication Critical patent/WO2019184980A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • H—ELECTRICITY
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    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1041—Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
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    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the present disclosure relates to the field of stacked packages, and in particular, to a package module and a stacked package structure.
  • the general packaging structure has a complicated production process, high production cost, and small layout design flexibility, and is only suitable for forward stacking between specific packages.
  • the package structure of the related art has a small applicable range, and is mostly used only for a stacked package structure between a central processing unit and a dynamic random access memory of a mobile terminal. Therefore, the range in which the package structure in the related art can be applied is quite limited, and is only applicable to a specific stacking method.
  • the embodiments of the present disclosure provide a package module and a stacked package structure to solve the problem of complicated manufacturing process and high production cost of the stacked package technology, and the known stacked package is only applicable to a specific product, and the package can be applied for stacking and packaging. Problems such as a small product range.
  • a package module includes a substrate, an adapter unit, an electronic component, and an encapsulant.
  • the bottom surface of the adapter unit is disposed on the substrate, the electronic component is disposed on the substrate, and the encapsulant is covered.
  • the adapter unit is wrapped by the encapsulant except for the top surface, and the electronic component is completely wrapped by the encapsulant.
  • a stacked package structure comprising: a substrate of one of the package modules having a first surface and a second surface facing away from each other, wherein the first surface is provided with a substrate connection point, and the switching unit has a body a first connection point and a second connection point, the body having a first body surface and a second body surface facing away from each other, the first connection point being disposed on the first body surface, the second connection point Provided on the second body surface, and the first connection point is electrically connected to the second connection point via the internal body of the body, and the second surface is provided with a bottom connection point, the bottom of the plate
  • the connection point is electrically connected to the substrate connection point via the substrate
  • the package module is represented by a first package module
  • the substrate of the other package module has a first surface and a second surface facing away from each other.
  • the first surface is provided with a substrate connection point
  • the switching unit has a body, a first connection point and a second connection point
  • the body has a first body surface and a second body surface facing away from each other, the first even a contact point is disposed on the first body surface, the second connection point is disposed on the second body surface, and the first connection point is electrically connected to the second connection point via the internal body of the body
  • the other package module is represented by a second package module; the second surface of the first package module faces the package colloid of the second package module, and the bottom connection point of the first package module Connected to the second connection point of the second package module.
  • Providing another stacked package structure includes: the substrate of the plurality of package modules having a first surface and a second surface facing away from each other, wherein the first surface is provided with a substrate connection point, the switching unit Having a body, a first connection point and a second connection point, the body having a first body surface and a second body surface facing away from each other, the first connection point being disposed on the first body surface, the second a connection point is disposed on the second body surface, and the first connection point is electrically connected to the second connection point via the internal body of the body; the package colloids of at least two adjacent package modules are oppositely disposed And the second connection points of the two package modules are connected to each other.
  • the electrical connection structure that is originally required to be subjected to the complicated process for stacking and packaging is designed as an electrical component of a single switching unit, and the switching unit is directly used as an electrical connection channel between the stacked package structures.
  • the step of electrically connecting the stacked packages by omitting a complicated process can be realized, and the production process of the switching unit is simple, and can be used in combination with various types of stacked package structures (such as LGA or BGA).
  • FIG. 1 is a schematic view of a package module of a first embodiment of the present disclosure.
  • FIG. 2 is a schematic diagram of a package module of a second embodiment of the present disclosure.
  • FIG 3 is a schematic view of a stacked package structure of a third embodiment of the present disclosure.
  • FIG. 4 is a schematic view of a stacked package structure of a fourth embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of a stacked package structure of a fifth embodiment of the present disclosure.
  • FIG. 1 is a schematic diagram of a package module according to a first embodiment of the present disclosure.
  • the present embodiment provides a package module 1 , wherein an internal electrical connection structure is designed as an electrical component.
  • the electrical component serves as an electrical connection channel between the stacked package structures to facilitate the subsequent stacking of the plurality of package modules 1 .
  • the package module 1 of the present embodiment includes a substrate 11, an adapter unit 13, an electronic component 15, and an encapsulant 17.
  • the bottom surface of the switching unit 13 is disposed on the substrate 11, the electronic component 15 is disposed on the substrate 11, the electronic component 15 is located on the side of the switching unit 13, and the encapsulant 17 covers the substrate 11.
  • the top surface is surrounded by the encapsulant 17, and the electronic component 15 is completely wrapped by the encapsulant 17.
  • the substrate 11 has a first surface 111 and a second surface 113 facing away from each other.
  • the first surface 111 is provided with a substrate connection point 115.
  • the adapter unit 13 has a body 131 and a first portion.
  • connection point 133 a connection point 133 and a second connection point 135,
  • the body 131 has a first body surface 1311 (ie, a bottom surface of the adapter unit 13) and a second body surface 1313 (ie, a top surface of the adapter unit 13) facing away from each other, first The connection point 133 is disposed on the first body surface 1311, the second connection point 135 is disposed on the second body surface 1313, and the first connection point 133 is electrically connected to the second connection point 135 via the body 131, and the encapsulant 17 is covered.
  • the first surface 111, the switching unit 13 is disposed on the first surface 111, the first body surface 1311 faces the first surface 111, and the first connection point 133 is connected to the substrate connection point 115, and the switching unit 13 has the second body surface All of the 1313 are wrapped by the encapsulant 17, and the electronic component 15 is placed on the first surface 111 and completely wrapped by the encapsulant 17.
  • the package module 1 further includes a bottom connection point 117 (see FIG. 3).
  • the bottom connection point 117 is disposed on the second surface 113, and the bottom connection point 117 is electrically connected to the substrate connection point 115 via the inside of the substrate 11.
  • the package structure of the second surface 113 in this embodiment may also be a grid array package structure (ie, LGA) or a ball grid array package (ie, BGA), which can be designed with different package structures according to user requirements.
  • the first connection point 133 and the second connection point 135 of the switching unit 13 are pads, which are respectively located on opposite sides of the body 131.
  • the electrically connected bracket is disposed inside the body 131 and electrically connected between the first connection point 133 and the second connection point 135 as an electrical path.
  • the first connection point 133 and the second connection point 135 are asymmetric or symmetric with respect to the body 131, that is, the electrical connection path between the first connection point 133 and the second connection point 135 may be a straight electrical path or The non-linear electrical path does not limit the structural form of the electrical path.
  • the electrical path can be electrically connected between the first connection point 133 and the second connection point 135.
  • the first connection point 133 is correspondingly disposed according to the position of the substrate connection point 115 of the substrate 11, and the second connection point 135 is disposed according to the electrical connection position that needs to be stacked according to the stacked package structure.
  • the switching unit 13 can re-change the position of the electrical connection point (ie, the I/O position) according to the needs of the user, and can also design the body 131 into different shapes.
  • stacking the plurality of switching units 13 can be used as a method of changing the position of the electrical connection points, and the flexibility of using the switching unit 13 for stacking and packaging is high.
  • the number of the first connection points 133 is plural, and the number of the second connection points 135 is plural, and the plurality of first connection points 133 and the plurality of second connection points 135 are asymmetric with respect to the body 131 or/and Symmetrical settings. That is, the positions of the first connection point 133 and the second connection point 135 of the same switching unit 13 can be flexibly designed according to the needs of the user.
  • the electronic component 15 of the embodiment can be a passive device or a chip.
  • the electronic component 15 is disposed on the substrate 11 according to the needs of the user, and does not limit the type of the electronic component 15.
  • the height of the adapter unit 13 is higher than that of the electronic component 15, so that the electronic component 15 is completely wrapped by the encapsulant 17, and the encapsulant 17 wraps the peripheral surface of the adapter unit 13 and leaves only the top surface (ie, The surface having the second connection point 135 is exposed.
  • FIG. 2 is a schematic diagram of a package module according to a second embodiment of the present disclosure. As shown in the figure, the difference between this embodiment and the first embodiment lies in the electronic component 15 .
  • the electronic component 15 of the embodiment includes a passive component.
  • FIG. 3 is a schematic diagram of a stacked package structure according to a third embodiment of the present disclosure.
  • the present embodiment is a package structure in which a package module of the first embodiment is stacked in a forward direction.
  • the two package modules 1 stacked are described in the first package module 1A and the second package module 1B, respectively.
  • the second surface 113 of the first package module 1A faces the encapsulant 17 of the second package module 1B, and the bottom connection point 117 of the first package module 1A is connected to the second connection point of the second package module 1B. 135.
  • the first package module 1A and the second package module 1B may be the same package module.
  • FIG. 4 is a schematic diagram of a stacked package structure of a fourth embodiment of the present disclosure; as shown in the figure, the difference between this embodiment and the third embodiment lies in the difference of stacked package modules.
  • different types of package modules such as LGA or BGA
  • substrates of different types of package modules are connected to the second connection point 135 of the adapter unit 13 .
  • FIG. 5 a schematic diagram of a stacked package structure of a fifth embodiment of the present disclosure; as shown in the figure, the package structure of the package module of the first embodiment is stacked back to the stack, and the two packages are stacked.
  • the module 1 is described with the first package module 1A and the second package module 1B, respectively.
  • the encapsulant 17 of the first package module 1A is disposed opposite to the encapsulant 17 of the second package module 1B, and the second connection point 135 of the first package module 1A and the second package module 1B are second.
  • the connection points 135 are connected to each other.
  • the first package module 1A and the second package module 1B may be the same package module.
  • the present disclosure provides a package module and a stacked package structure, which are designed as an electrical component of a single adapter unit by directly connecting an electrical connection structure that is required to be subjected to a complicated process, and directly connect the adapter unit
  • the step of electrically connecting the stacked packages by a complicated process can be omitted, and the production process of the switching unit is simple, and can be matched with various types of stacked package structures (such as LGA or BGA). It is used and provides various package stacking methods (such as forward stacking or back stacking) to provide users with more flexible stacking methods.

Abstract

Disclosed are a packaging module and a package on package structure, comprising a substrate, an adapter unit, an electronic component, and a packaging plastic. The bottom surface of the adapter unit is provided on the substrate. The electronic component is provided on the substrate. The packaging plastic covers the substrate. The adapter unit is wrapped by the packaging plastic except for the top surface. Also, the electronic component is completely wrapped by the packaging plastic.

Description

封装模块及堆叠封装结构Package module and stacked package structure
相关申请的交叉引用Cross-reference to related applications
本申请主张在2018年3月30日在中国提交的中国专利申请号No.201810275746.1的优先权，其全部内容通过引用包含于此。The present application claims priority to Chinese Patent Application No. 201810275746.1, filed on Jan.
技术领域Technical field
本公开涉及堆叠封装领域，尤其涉及一种封装模块及堆叠封装结构。The present disclosure relates to the field of stacked packages, and in particular, to a package module and a stacked package structure.
背景技术Background technique
随着科技的发展，越来越多的功能被集成到移动终端上。但是移动终端就一定要求便于携带，所以移动终端上的主板面积非常有限，为了在有限的主板面积上放更多的芯片，对堆叠式的封装结构(Package on Package，PoP)的使用则越来越流行。一般封装结构的生产工艺复杂、生产成本较高，布置设计灵活性小，只适合特定的封装间的正向堆叠。相关技术中的封装结构的可应用范围小，其大多只用于移动终端的中央处理器和动态随机存取存储器间的堆叠封装结构。故，相关技术中的封装结构可应用的范围相当受限，且仅适用于特定的堆叠方式。With the development of technology, more and more functions are integrated into mobile terminals. However, the mobile terminal must be portable, so the area of the motherboard on the mobile terminal is very limited. In order to put more chips on the limited motherboard area, the use of stacked package on package (PoP) is coming. The more popular. The general packaging structure has a complicated production process, high production cost, and small layout design flexibility, and is only suitable for forward stacking between specific packages. The package structure of the related art has a small applicable range, and is mostly used only for a stacked package structure between a central processing unit and a dynamic random access memory of a mobile terminal. Therefore, the range in which the package structure in the related art can be applied is quite limited, and is only applicable to a specific stacking method.
发明内容Summary of the invention
本公开实施例提供一种封装模块及堆叠封装结构，以解决堆叠封装技术生产工艺复杂与生产成本较高的问题，且已知的堆叠封装仅适用于特定的产品，其可应用进行堆叠封装的产品范围小等的问题。The embodiments of the present disclosure provide a package module and a stacked package structure to solve the problem of complicated manufacturing process and high production cost of the stacked package technology, and the known stacked package is only applicable to a specific product, and the package can be applied for stacking and packaging. Problems such as a small product range.
为了解决上述技术问题，本公开是这样实现的：In order to solve the above technical problems, the present disclosure is implemented as follows:
提供一种封装模块，其包括基板、转接单元、电子组件与封装胶体，所述转接单元的底面设置于所述基板上，所述电子组件设置于所述基板上，所述封装胶体覆盖所述基板上，所述转接单元除顶面之外均被所述封装胶体所包裹，并所述电子组件被所述封装胶体完全包裹。A package module includes a substrate, an adapter unit, an electronic component, and an encapsulant. The bottom surface of the adapter unit is disposed on the substrate, the electronic component is disposed on the substrate, and the encapsulant is covered. On the substrate, the adapter unit is wrapped by the encapsulant except for the top surface, and the electronic component is completely wrapped by the encapsulant.
提供一种堆叠封装结构，其包括：一个所述封装模块的所述基板具有相 背离的第一表面以及第二表面，所述第一表面上设置有基板连接点，所述转接单元具有本体、第一连接点与第二连接点，所述本体具有相互背离的第一本体面以及第二本体面，所述第一连接点设置在所述第一本体面上，所述第二连接点设置在所述第二本体面上，并且所述第一连接点经所述本体内部电性连接于所述第二连接点，所述第二表面上设置有板底连接点，所述板底连接点经所述基板内部电性连接于所述基板连接点，上述封装模块以第一封装模块表示；另一个所述封装模块的所述基板具有相背离的第一表面以及第二表面，所述第一表面上设置有基板连接点，所述转接单元具有本体、第一连接点与第二连接点，所述本体具有相互背离的第一本体面以及第二本体面，所述第一连接点设置在所述第一本体面上，所述第二连接点设置在所述第二本体面上，并且所述第一连接点经所述本体内部电性连接于所述第二连接点，上述另一个封装模块以第二封装模块表示；所述第一封装模块的所述第二表面朝向所述第二封装模块的所述封装胶体，所述第一封装模块的所述板底连接点连接于所述第二封装模块的所述第二连接点。A stacked package structure is provided, comprising: a substrate of one of the package modules having a first surface and a second surface facing away from each other, wherein the first surface is provided with a substrate connection point, and the switching unit has a body a first connection point and a second connection point, the body having a first body surface and a second body surface facing away from each other, the first connection point being disposed on the first body surface, the second connection point Provided on the second body surface, and the first connection point is electrically connected to the second connection point via the internal body of the body, and the second surface is provided with a bottom connection point, the bottom of the plate The connection point is electrically connected to the substrate connection point via the substrate, the package module is represented by a first package module, and the substrate of the other package module has a first surface and a second surface facing away from each other. The first surface is provided with a substrate connection point, the switching unit has a body, a first connection point and a second connection point, the body has a first body surface and a second body surface facing away from each other, the first even a contact point is disposed on the first body surface, the second connection point is disposed on the second body surface, and the first connection point is electrically connected to the second connection point via the internal body of the body, The other package module is represented by a second package module; the second surface of the first package module faces the package colloid of the second package module, and the bottom connection point of the first package module Connected to the second connection point of the second package module.
提供另一种堆叠封装结构，其包括：多个所述封装模块的所述基板具有相背离的第一表面以及第二表面，所述第一表面上设置有基板连接点，所述转接单元具有本体、第一连接点与第二连接点，所述本体具有相互背离的第一本体面以及第二本体面，所述第一连接点设置在所述第一本体面上，所述第二连接点设置在所述第二本体面上，并且所述第一连接点经所述本体内部电性连接于所述第二连接点；至少两个相邻的所述封装模块的封装胶体相对设置，且两个所述封装模块的所述第二连接点之间相互连接。Providing another stacked package structure includes: the substrate of the plurality of package modules having a first surface and a second surface facing away from each other, wherein the first surface is provided with a substrate connection point, the switching unit Having a body, a first connection point and a second connection point, the body having a first body surface and a second body surface facing away from each other, the first connection point being disposed on the first body surface, the second a connection point is disposed on the second body surface, and the first connection point is electrically connected to the second connection point via the internal body of the body; the package colloids of at least two adjacent package modules are oppositely disposed And the second connection points of the two package modules are connected to each other.
在本公开实施例中，通过将原本需要进行繁杂工艺进行堆叠封装的电性连接结构设计成单个转接单元的电性组件，并直接将转接单元作为堆叠封装结构间的电性连接通道，能够实现省略繁杂工艺将堆叠封装进行电性连接的步骤，且转接单元的生产工艺简单，并能够搭配各种类型的堆叠封装结构(如LGA或BGA)的进行使用。In the embodiment of the present disclosure, the electrical connection structure that is originally required to be subjected to the complicated process for stacking and packaging is designed as an electrical component of a single switching unit, and the switching unit is directly used as an electrical connection channel between the stacked package structures. The step of electrically connecting the stacked packages by omitting a complicated process can be realized, and the production process of the switching unit is simple, and can be used in combination with various types of stacked package structures (such as LGA or BGA).
附图说明DRAWINGS
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部 分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：The drawings described herein are provided to provide a further understanding of the present disclosure, and are intended to be a part of this disclosure. In the drawing:
图1是本公开的第一实施例的封装模块的示意图。1 is a schematic view of a package module of a first embodiment of the present disclosure.
图2是本公开的第二实施例的封装模块的示意图。2 is a schematic diagram of a package module of a second embodiment of the present disclosure.
图3是本公开的第三实施例的堆叠封装结构的示意图。3 is a schematic view of a stacked package structure of a third embodiment of the present disclosure.
图4是本公开的第四实施例的堆叠封装结构的示意图。4 is a schematic view of a stacked package structure of a fourth embodiment of the present disclosure.
图5是本公开的第五实施例的堆叠封装结构的示意图。FIG. 5 is a schematic diagram of a stacked package structure of a fifth embodiment of the present disclosure.
具体实施方式detailed description
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。The technical solutions in the embodiments of the present disclosure are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without departing from the inventive scope are the scope of the disclosure.
请参阅图1，其是本公开的第一实施例的封装模块的示意图；如图所示，本实施例提供一种封装模块1，其内部的电性连接结构设计成电性组件，将此电性组件作为堆叠封装结构间的电性连接通道，以利于后续将多个封装模块1进行堆叠封装的便利性。本实施例的封装模块1包括基板11、转接单元13、电子组件15与封装胶体17。Please refer to FIG. 1 , which is a schematic diagram of a package module according to a first embodiment of the present disclosure. As shown in the figure, the present embodiment provides a package module 1 , wherein an internal electrical connection structure is designed as an electrical component. The electrical component serves as an electrical connection channel between the stacked package structures to facilitate the subsequent stacking of the plurality of package modules 1 . The package module 1 of the present embodiment includes a substrate 11, an adapter unit 13, an electronic component 15, and an encapsulant 17.
承上所述，转接单元13的底面设置于基板11上，电子组件15设置于基板11上，电子组件15位于转接单元13一侧，封装胶体17覆盖基板11上，转接单元13除顶面之外均被封装胶体17所包裹，并电子组件15被封装胶体17完全包裹。As described above, the bottom surface of the switching unit 13 is disposed on the substrate 11, the electronic component 15 is disposed on the substrate 11, the electronic component 15 is located on the side of the switching unit 13, and the encapsulant 17 covers the substrate 11. The top surface is surrounded by the encapsulant 17, and the electronic component 15 is completely wrapped by the encapsulant 17.
于本实施方式中，更进一步对于结构进行说明，基板11具有相背离的第一表面111以及第二表面113，第一表面111上设置有基板连接点115，转接单元13具有本体131、第一连接点133与第二连接点135，本体131具有相互背离的第一本体面1311(即转接单元13的底面)以及第二本体面1313(即转接单元13的顶面)，第一连接点133设置在第一本体面1311上，第二连接点135设置在第二本体面1313上，并且第一连接点133经本体131内部电性连接于第二连接点135，封装胶体17覆盖第一表面111，转接单元13设置于 第一表面111上，第一本体面1311朝向第一表面111，并且第一连接点133连接于基板连接点115，转接单元13除第二本体面1313之外均被封装胶体17所包裹，并将电子组件15设置于第一表面111且被封装胶体17完全包裹。In the present embodiment, the structure is further described. The substrate 11 has a first surface 111 and a second surface 113 facing away from each other. The first surface 111 is provided with a substrate connection point 115. The adapter unit 13 has a body 131 and a first portion. a connection point 133 and a second connection point 135, the body 131 has a first body surface 1311 (ie, a bottom surface of the adapter unit 13) and a second body surface 1313 (ie, a top surface of the adapter unit 13) facing away from each other, first The connection point 133 is disposed on the first body surface 1311, the second connection point 135 is disposed on the second body surface 1313, and the first connection point 133 is electrically connected to the second connection point 135 via the body 131, and the encapsulant 17 is covered. The first surface 111, the switching unit 13 is disposed on the first surface 111, the first body surface 1311 faces the first surface 111, and the first connection point 133 is connected to the substrate connection point 115, and the switching unit 13 has the second body surface All of the 1313 are wrapped by the encapsulant 17, and the electronic component 15 is placed on the first surface 111 and completely wrapped by the encapsulant 17.
再者，封装模块1更包括板底连接点117(请参阅图3)。板底连接点117设置于第二表面113，板底连接点117经基板11的内部电性连接于基板连接点115。此外，本实施例中的第二表面113的封装结构也可为栅格阵列封装结构(即LGA)或球栅阵列封装(即BGA),其可依据用户需求搭配不同的封装结构设计。Furthermore, the package module 1 further includes a bottom connection point 117 (see FIG. 3). The bottom connection point 117 is disposed on the second surface 113, and the bottom connection point 117 is electrically connected to the substrate connection point 115 via the inside of the substrate 11. In addition, the package structure of the second surface 113 in this embodiment may also be a grid array package structure (ie, LGA) or a ball grid array package (ie, BGA), which can be designed with different package structures according to user requirements.
于本实施例中，转接单元13的第一连接点133与第二连接点135皆为焊盘，其分别位于本体131的相对面。电性连接的支架布置于本体131内部，其作为电性通路以电性连接于第一连接点133与第二连接点135之间。其中第一连接点133与第二连接点135相对于本体131为非对称或对称设置，即第一连接点133与第二连接点135间的电性连接通路可为直线的电性通路或为非直线的电性通路,但并不限制电性通路的结构形式，电性通路可达到电性连接于第一连接点133与第二连接点135间即可。上述第一连接点133是依据基板11的基板连接点115的位置作对应的设置，而第二连接点135则是依据堆叠封装结构需要进行堆叠的电性连接位置进行设置。如此转接单元13可以依据用户的需求重新改变电性连接点的位置(即I/O位置)，也可将本体131设计成不同形状。另外，将多个转接单元13进行堆叠，可以作为改变电性连接点的位置的方法，使用转接单元13进行堆叠封装的灵活性高。In the embodiment, the first connection point 133 and the second connection point 135 of the switching unit 13 are pads, which are respectively located on opposite sides of the body 131. The electrically connected bracket is disposed inside the body 131 and electrically connected between the first connection point 133 and the second connection point 135 as an electrical path. The first connection point 133 and the second connection point 135 are asymmetric or symmetric with respect to the body 131, that is, the electrical connection path between the first connection point 133 and the second connection point 135 may be a straight electrical path or The non-linear electrical path does not limit the structural form of the electrical path. The electrical path can be electrically connected between the first connection point 133 and the second connection point 135. The first connection point 133 is correspondingly disposed according to the position of the substrate connection point 115 of the substrate 11, and the second connection point 135 is disposed according to the electrical connection position that needs to be stacked according to the stacked package structure. Thus, the switching unit 13 can re-change the position of the electrical connection point (ie, the I/O position) according to the needs of the user, and can also design the body 131 into different shapes. In addition, stacking the plurality of switching units 13 can be used as a method of changing the position of the electrical connection points, and the flexibility of using the switching unit 13 for stacking and packaging is high.
又，第一连接点133的数量为多个，第二连接点135的数量为多个，则多个第一连接点133与多个第二连接点135相对于本体131为非对称或/及对称设置。即说明同一个转接单元13的第一连接点133与第二连接点135的位置可依据用户的需求进行灵活设计。本实施例的电子组件15可为被动器件或是芯片等，电子组件15是依据使用者的需求而设置于基板11，并不限制电子组件15的类型。其中转接单元13的高度高于电子组件15，如此有利于用封装胶体17将电子组件15完全的包裹，而封装胶体17将转接单元13的四周表面包裹，并仅留下顶面(即具有第二连接点135的表面)外露。Moreover, the number of the first connection points 133 is plural, and the number of the second connection points 135 is plural, and the plurality of first connection points 133 and the plurality of second connection points 135 are asymmetric with respect to the body 131 or/and Symmetrical settings. That is, the positions of the first connection point 133 and the second connection point 135 of the same switching unit 13 can be flexibly designed according to the needs of the user. The electronic component 15 of the embodiment can be a passive device or a chip. The electronic component 15 is disposed on the substrate 11 according to the needs of the user, and does not limit the type of the electronic component 15. Wherein the height of the adapter unit 13 is higher than that of the electronic component 15, so that the electronic component 15 is completely wrapped by the encapsulant 17, and the encapsulant 17 wraps the peripheral surface of the adapter unit 13 and leaves only the top surface (ie, The surface having the second connection point 135 is exposed.
请参阅图2，其是本公开的第二实施例的封装模块的示意图；如图所示， 本实施例与第一实施例的差异在于电子组件15，本实施例的电子组件15包括被动器件与打线的芯片结构。本实施例说明电子组件15是依据使用者的需求而设置于基板11，并不限制电子组件15的类型。Please refer to FIG. 2 , which is a schematic diagram of a package module according to a second embodiment of the present disclosure. As shown in the figure, the difference between this embodiment and the first embodiment lies in the electronic component 15 . The electronic component 15 of the embodiment includes a passive component. The chip structure with the wire. This embodiment illustrates that the electronic component 15 is disposed on the substrate 11 according to the needs of the user, and does not limit the type of the electronic component 15.
请参阅图3，其是本公开的第三实施例的堆叠封装结构的示意图；如图所示，本实施例为第一实施例的封装模块进行正向堆叠的封装结构。将堆叠的两个封装模块1分别以第一封装模块1A与第二封装模块1B进行说明。于本实施例中，第一封装模块1A的第二表面113朝向第二封装模块1B的封装胶体17，第一封装模块1A的板底连接点117连接于第二封装模块1B的第二连接点135。其中第一封装模块1A与第二封装模块1B可为相同的封装模块。Please refer to FIG. 3 , which is a schematic diagram of a stacked package structure according to a third embodiment of the present disclosure. As shown in the figure, the present embodiment is a package structure in which a package module of the first embodiment is stacked in a forward direction. The two package modules 1 stacked are described in the first package module 1A and the second package module 1B, respectively. In this embodiment, the second surface 113 of the first package module 1A faces the encapsulant 17 of the second package module 1B, and the bottom connection point 117 of the first package module 1A is connected to the second connection point of the second package module 1B. 135. The first package module 1A and the second package module 1B may be the same package module.
请参阅图4，其是本公开的第四实施例的堆叠封装结构的示意图；如图所示，本实施例与第三实施例的差异在于堆叠的封装模块的不同。于本实施例中，将不同类型的封装模块(如LGA或BGA)堆叠于封装模块1，并且不同类型的封装模块的基板连接于转接单元13的第二连接点135。Please refer to FIG. 4 , which is a schematic diagram of a stacked package structure of a fourth embodiment of the present disclosure; as shown in the figure, the difference between this embodiment and the third embodiment lies in the difference of stacked package modules. In this embodiment, different types of package modules (such as LGA or BGA) are stacked on the package module 1 , and substrates of different types of package modules are connected to the second connection point 135 of the adapter unit 13 .
请参阅图5，其实本公开的第五实施例的堆叠封装结构的示意图；如图所示，本实施例为第一实施例的封装模块进行背向堆叠的封装结构，将堆叠的两个封装模块1分别以第一封装模块1A与第二封装模块1B进行说明。于本实施例中，将第一封装模块1A的封装胶体17与第二封装模块1B的封装胶体17相对设置，且第一封装模块1A的第二连接点135与第二封装模块1B的第二连接点135之间相互连接。其中第一封装模块1A与第二封装模块1B可为相同的封装模块。Referring to FIG. 5 , a schematic diagram of a stacked package structure of a fifth embodiment of the present disclosure; as shown in the figure, the package structure of the package module of the first embodiment is stacked back to the stack, and the two packages are stacked. The module 1 is described with the first package module 1A and the second package module 1B, respectively. In this embodiment, the encapsulant 17 of the first package module 1A is disposed opposite to the encapsulant 17 of the second package module 1B, and the second connection point 135 of the first package module 1A and the second package module 1B are second. The connection points 135 are connected to each other. The first package module 1A and the second package module 1B may be the same package module.
综上所述，本公开提供一种封装模块及堆叠封装结构，其通过将原本需要进行繁杂工艺进行堆叠封装的电性连接结构设计成单个转接单元的电性组件，并直接将转接单元作为堆叠封装结构间的电性连接通道，能够实现省略繁杂工艺将堆叠封装进行电性连接的步骤，且转接单元的生产工艺简单，并能够搭配各种类型的堆叠封装结构(如LGA或BGA)的进行使用，且提供各种的封装堆叠方式(如正向堆叠或背向堆叠)，提供用户更灵活的堆叠使用方式。In summary, the present disclosure provides a package module and a stacked package structure, which are designed as an electrical component of a single adapter unit by directly connecting an electrical connection structure that is required to be subjected to a complicated process, and directly connect the adapter unit As an electrical connection channel between the stacked package structures, the step of electrically connecting the stacked packages by a complicated process can be omitted, and the production process of the switching unit is simple, and can be matched with various types of stacked package structures (such as LGA or BGA). It is used and provides various package stacking methods (such as forward stacking or back stacking) to provide users with more flexible stacking methods.
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包括，从而使得包括一系列要素的过程、方法、物品或 者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。It is to be understood that the term "comprises", "comprising", or any other variants thereof, is intended to encompass a non-exclusive inclusion, such that a process, method, article, or device that comprises a plurality of elements includes not only those elements. It also includes other elements that are not explicitly listed, or elements that are inherent to such a process, method, article, or device. An element that is defined by the phrase "comprising a ..." does not exclude the presence of additional equivalent elements in the process, method, item, or device that comprises the element.
上面结合附图对本公开的实施例进行了描述，但是本公开并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本公开的启示下，在不脱离本公开宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本公开的保护之内。The embodiments of the present disclosure have been described above with reference to the drawings, but the present disclosure is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative and not restrictive, and those skilled in the art In the light of the present disclosure, many forms may be made without departing from the scope of the disclosure and the scope of the appended claims.

Claims (8)

  1. 一种封装模块，包括：A package module comprising:
    基板、转接单元、电子组件与封装胶体，所述转接单元的底面设置于所述基板上，所述电子组件设置于所述基板上，所述封装胶体覆盖所述基板上，所述转接单元除顶面之外均被所述封装胶体所包裹，所述电子组件被所述封装胶体完全包裹。a substrate, an adapter unit, an electronic component, and an encapsulant, wherein a bottom surface of the adapter unit is disposed on the substrate, the electronic component is disposed on the substrate, and the encapsulant covers the substrate, and the turn The receiving unit is wrapped by the encapsulant except for the top surface, and the electronic component is completely wrapped by the encapsulant.
  2. 如权利要求1所述的封装模块，其中，所述基板具有相背离的第一表面以及第二表面，所述第一表面上设置有基板连接点，所述转接单元具有本体、第一连接点与第二连接点，所述本体具有相互背离的第一本体面以及第二本体面，所述第一连接点设置在所述第一本体面上，所述第二连接点设置在所述第二本体面上，并且所述第一连接点经所述本体内部电性连接于所述第二连接点。The package module of claim 1 , wherein the substrate has a first surface and a second surface facing away from each other, the first surface is provided with a substrate connection point, and the switching unit has a body, a first connection And a second connection point, the body has a first body surface and a second body surface facing away from each other, the first connection point is disposed on the first body surface, and the second connection point is disposed on the a second body surface, and the first connection point is electrically connected to the second connection point via the internal body of the body.
  3. 如权利要求2所述的封装模块，其中，所述第二表面上设置有板底连接点，所述板底连接点经所述基板内部电性连接于所述基板连接点。The package module of claim 2, wherein the second surface is provided with a bottom connection point, and the bottom connection point is electrically connected to the substrate connection point via the substrate.
  4. 如权利要求2或3所述的封装模块，其中，所述第二表面为栅格阵列封装结构或球栅阵列封装结构。The package module of claim 2 or 3, wherein the second surface is a grid array package structure or a ball grid array package structure.
  5. 如权利要求2或3所述的封装模块，其中，所述转接单元的高度高于所述电子组件。A package module according to claim 2 or 3, wherein the height of the adapter unit is higher than the electronic component.
  6. 如权利要求2或3所述的封装模块，其中，所述第一连接点与所述第二连接点为焊盘。The package module according to claim 2 or 3, wherein the first connection point and the second connection point are pads.
  7. 一种堆叠封装结构，包括：一个权利要求3所述的封装模块，以第一封装模块表示；一个权利要求2至6任一项所述的封装模块，以第二封装模块表示；所述第一封装模块的所述第二表面朝向所述第二封装模块的所述封装胶体，所述第一封装模块的所述板底连接点连接于所述第二封装模块的所述第二连接点。A package structure comprising: a package module according to claim 3, represented by a first package module; a package module according to any one of claims 2 to 6, represented by a second package module; The second surface of a package module faces the encapsulant of the second package module, and the bottom connection point of the first package module is connected to the second connection point of the second package module .
  8. 一种堆叠封装结构，包括：多个如权利要求2至6中任一项所述封装模块；至少两个相邻的所述封装模块的封装胶体相对设置，且两个所述封装模块的所述第二连接点之间相互连接。A stacked package structure comprising: a plurality of package modules according to any one of claims 2 to 6; at least two adjacent package modules of the package modules are oppositely disposed, and two of the package modules are The second connection points are connected to each other.
PCT/CN2019/080091 2018-03-30 2019-03-28 Packaging module and package on package structure WO2019184980A1 (en)

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CN1241032A (en) * 1998-06-26 2000-01-12 国际商业机器公司 Highly integrated chip-on-chip packaging
CN1499630A (en) * 2002-11-04 2004-05-26 矽品精密工业股份有限公司 Modularized device of stackable semiconductor package and preparing method
US20090273097A1 (en) * 2008-05-01 2009-11-05 Harry Hedler Semiconductor Component with Contact Pad
CN108630670A (en) * 2018-03-30 2018-10-09 维沃移动通信有限公司 A kind of package module and stack package structure

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Publication number Priority date Publication date Assignee Title
CN1241032A (en) * 1998-06-26 2000-01-12 国际商业机器公司 Highly integrated chip-on-chip packaging
CN1499630A (en) * 2002-11-04 2004-05-26 矽品精密工业股份有限公司 Modularized device of stackable semiconductor package and preparing method
US20090273097A1 (en) * 2008-05-01 2009-11-05 Harry Hedler Semiconductor Component with Contact Pad
CN108630670A (en) * 2018-03-30 2018-10-09 维沃移动通信有限公司 A kind of package module and stack package structure

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