WO2019184085A1 - Système et procédé de transfert de micropuce - Google Patents

Système et procédé de transfert de micropuce Download PDF

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Publication number
WO2019184085A1
WO2019184085A1 PCT/CN2018/089747 CN2018089747W WO2019184085A1 WO 2019184085 A1 WO2019184085 A1 WO 2019184085A1 CN 2018089747 W CN2018089747 W CN 2018089747W WO 2019184085 A1 WO2019184085 A1 WO 2019184085A1
Authority
WO
WIPO (PCT)
Prior art keywords
microchip
magnetic
test
solenoid
electrode
Prior art date
Application number
PCT/CN2018/089747
Other languages
English (en)
Chinese (zh)
Inventor
杨涛
陶贤文
许晋源
Original Assignee
惠州雷通光电器件有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州雷通光电器件有限公司 filed Critical 惠州雷通光电器件有限公司
Publication of WO2019184085A1 publication Critical patent/WO2019184085A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the test device is not disposed with the main pick-up device, and the micro-element needs to be tested after positioning. Inaccurate positioning of the test device increases the risk of test errors in the test device.
  • test electrode is a metal material for enhancing the magnetic properties of the solenoid.
  • the qualified chip refers to a chip that has been tested for electrical performance by the electrical test device.
  • the electrical test apparatus includes a test circuit 31 and a test electrode 32.
  • the test circuit 31 is connected to the test electrode 32.
  • the principle of the electrical test device detecting the electrical performance of the microchip 70 is as follows: the microchip 70 includes a chip electrode 71. When the picking device picks up the magnetic pin of the microchip 70 through the solenoid 22, the test electrode 32 is connected to the chip electrode 71, and the test circuit 31 outputs an electrical signal to the chip electrode 71 through the test electrode 32, thereby testing the electrical performance of the microchip 70.
  • the electrical test device includes two test electrodes 32; the chip electrode 71 of the microchip 70 includes a first chip electrode 711 and a second chip electrode 722, two The test electrodes 32 are respectively inserted into two solenoids 22, and the first chip electrodes 711 and the second chip electrodes 722 are magnetic pins of the microchip 70.
  • the solenoid 22 picks up the magnetic pins of the microchip 70, that is, the first chip electrode 711 and the second chip electrode 722, the two test electrodes 32 inserted into the two solenoids 22 and the microchip 70 are respectively A chip electrode 711 is connected to the second chip electrode 722.
  • the electrical test device can test the electrical performance of the microchip 70 picked up by the pick-up device without performing a positioning operation, and reduce the electrical test device when the electrical test device is set independently of the pick-up device. The error caused by the positioning is not allowed.
  • the microchip 70 is a miniature light emitting diode; the first chip electrode 711 is a P pole, the second chip electrode 722 is an N pole, or the first chip electrode 711 is an N pole, and the second chip electrode 722 is a P
  • the voltage direction of the output of the second power source 30 is changed. According to the unidirectional conduction characteristic of the diode, whether the electrical parameters of the P pole, the N pole of the microchip 70 and the test microchip 70 meet the requirements, that is, whether it is qualified or not.
  • the microchip 70 whose electrical parameters do not meet the requirements belongs to the defective microchip 70 and is released by the pickup device.
  • the qualified microchip 70 refers to the microchip 70 which is qualified by both the electrical performance detected by the electrical testing device and the optical performance detected by the optical testing device 40.
  • the transfer system of the microchip includes an optical test device 40.
  • Step (21) and step (22) are further included between step (2) and step (3) of the microchip transfer method;
  • step (21) is an optical property test;
  • step (22) picks up an optical property failure.
  • the microchip pick-up device releases a microchip that fails optical performance.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un système de transfert de micropuce, comprenant un dispositif de stockage servant à placer une micropuce, un dispositif de prélèvement servant à prélever la micropuce, un dispositif de test électrique servant à tester la micropuce et un dispositif de réception servant à recevoir la micropuce. Le dispositif de test électrique comprend une électrode de test et un circuit de test; une extrémité de l'électrode de test est connectée au circuit de test, et l'autre extrémité est une extrémité libre; la micropuce comprend une électrode de puce et un support; le dispositif de test électrique et le dispositif de prélèvement sont montés de manière fixe sur le support; l'extrémité libre de l'électrode de test est connectée à l'électrode de puce lorsque le dispositif de saisie prélève la micropuce. Selon la présente invention, le montage fixe du dispositif de prélèvement et du dispositif de test électrique sur le support permet au dispositif de test électrique de tester les performances électriques de la micropuce prélevée par le dispositif de prélèvement sans opération de positionnement, ce qui permet de réduire l'erreur provoquée par un positionnement inexact du dispositif de test électrique.
PCT/CN2018/089747 2018-03-30 2018-06-04 Système et procédé de transfert de micropuce WO2019184085A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810293002.2A CN108490341B (zh) 2018-03-30 2018-03-30 微型芯片转移系统及方法
CN201810293002.2 2018-03-30

Publications (1)

Publication Number Publication Date
WO2019184085A1 true WO2019184085A1 (fr) 2019-10-03

Family

ID=63317824

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/089747 WO2019184085A1 (fr) 2018-03-30 2018-06-04 Système et procédé de transfert de micropuce

Country Status (2)

Country Link
CN (1) CN108490341B (fr)
WO (1) WO2019184085A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109273565B (zh) * 2018-10-15 2021-02-02 华映科技（集团）股份有限公司 一种微发光二极管芯片的转移方法
CN109449100B (zh) * 2018-10-16 2019-07-02 广东工业大学 一种电子元件的巨量转移方法及装置
CN111292631B (zh) * 2018-11-21 2022-03-25 成都辰显光电有限公司 微发光二极管显示面板及其制备方法
CN109548396B (zh) * 2018-11-29 2021-05-07 上海九山电子科技有限公司 微型发光二极管芯片的巨量转移系统以及方法
CN111244012A (zh) * 2018-11-29 2020-06-05 昆山工研院新型平板显示技术中心有限公司 转移装置以及微元件的转移方法
CN109541439B (zh) * 2018-12-10 2020-11-13 通富微电子股份有限公司 一种芯片测试进料方向的调整方法、检测装置、调整系统
CN109927403B (zh) * 2019-04-19 2021-06-29 成都辰显光电有限公司 一种转印装置、转印装置的制作方法和转印方法
CN110707015B (zh) * 2019-10-21 2022-05-03 京东方科技集团股份有限公司 一种检测基板及其制作方法、检测方法
CN112382034B (zh) * 2020-11-12 2022-10-28 深圳市华辰信科电子有限公司 一种防盗装置中射频芯片的安装装置及其防盗装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106601657A (zh) * 2016-12-12 2017-04-26 厦门市三安光电科技有限公司 微元件的转移系统、转移方法、制造方法、装置和电子设备
CN107039298A (zh) * 2016-11-04 2017-08-11 厦门市三安光电科技有限公司 微元件的转移装置、转移方法、制造方法、装置和电子设备
CN107783331A (zh) * 2017-10-20 2018-03-09 深圳市华星光电技术有限公司 器件转移装置及其转移器件的方法、器件转移板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208076668U (zh) * 2018-03-30 2018-11-09 惠州雷通光电器件有限公司 微型芯片转移系统

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039298A (zh) * 2016-11-04 2017-08-11 厦门市三安光电科技有限公司 微元件的转移装置、转移方法、制造方法、装置和电子设备
CN106601657A (zh) * 2016-12-12 2017-04-26 厦门市三安光电科技有限公司 微元件的转移系统、转移方法、制造方法、装置和电子设备
CN107783331A (zh) * 2017-10-20 2018-03-09 深圳市华星光电技术有限公司 器件转移装置及其转移器件的方法、器件转移板

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Publication number Publication date
CN108490341A (zh) 2018-09-04
CN108490341B (zh) 2019-10-08

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