WO2019179159A1 - 功率馈入机构、旋转基座装置及半导体加工设备 - Google Patents

功率馈入机构、旋转基座装置及半导体加工设备 Download PDF

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Publication number
WO2019179159A1
WO2019179159A1 PCT/CN2018/117901 CN2018117901W WO2019179159A1 WO 2019179159 A1 WO2019179159 A1 WO 2019179159A1 CN 2018117901 W CN2018117901 W CN 2018117901W WO 2019179159 A1 WO2019179159 A1 WO 2019179159A1
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WO
WIPO (PCT)
Prior art keywords
conductive
feeding mechanism
power feeding
elastic
rotating member
Prior art date
Application number
PCT/CN2018/117901
Other languages
English (en)
French (fr)
Inventor
刘建生
李良
姜鑫先
陈鹏
文莉辉
Original Assignee
北京北方华创微电子装备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201820370506.5U external-priority patent/CN208014650U/zh
Priority claimed from CN201810224905.5A external-priority patent/CN108461387B/zh
Application filed by 北京北方华创微电子装备有限公司 filed Critical 北京北方华创微电子装备有限公司
Priority to SG11202008819VA priority Critical patent/SG11202008819VA/en
Priority to KR1020207025963A priority patent/KR102437306B1/ko
Priority to EP18910945.7A priority patent/EP3770947B1/en
Publication of WO2019179159A1 publication Critical patent/WO2019179159A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Definitions

  • the present invention relates to the field of semiconductor manufacturing technology, and in particular to a power feeding mechanism, a rotating base device, and a semiconductor processing device.
  • the power output from the sputtering power source is coupled into the process chamber through the electrode, and the process gas in the chamber is excited to form a plasma, and the action of electrons and ions in the plasma Next, the film deposition is completed.
  • PVD processes are increasingly demanding film deposition uniformity.
  • the uniformity of the deposited film can be significantly improved by the rotation of the susceptor, and has been widely used.
  • it is usually implemented by feeding RF into the pedestal. How to maintain a good and stable RF connection during the rotation of the susceptor is very challenging. Sex.
  • the transmission of RF power through the inductive coupling of the inductive coil may cause leakage magnetic problems, and the power transmission efficiency is low.
  • the present invention aims to at least solve one of the technical problems existing in the prior art, and proposes a power feeding mechanism, a rotating base device and a semiconductor processing device, which can not only improve power transmission efficiency, but also avoid the prior art. The risk of fire.
  • a power feeding mechanism for feeding the output power of a power source to a rotating component includes:
  • a conductive rotating member electrically connected to the rotating member and rotating synchronously with the rotating member
  • the electrically conductive connection structure is in electrical contact with the electrically conductive fixing member and the electrically conductive rotating member, respectively, and does not affect the rotational movement of the electrically conductive rotating member.
  • the conductive rotating member is opposite to the conductive fixing member and spaced apart; the conductive connecting structure is disposed in a space between the conductive rotating member and the conductive fixing member.
  • the vertical length of the interval is greater than or equal to 1 mm.
  • the opposite surfaces of the conductive rotating member and the conductive fixing member are parallel to each other or nested with each other.
  • the conductive connection structure comprises a first elastic conductive component.
  • the first elastic conductive member is a ring body, a plane spiral body or a columnar spiral body.
  • the first elastic conductive component comprises a soft alloy.
  • a mounting groove is disposed on at least one of opposite faces of the conductive rotating member and the conductive fixing member, and a portion of the first elastic conductive member is disposed in the mounting groove.
  • the conductive connection structure includes a second elastic conductive component, a third elastic conductive component, and a spring, wherein
  • Two ends of the spring are respectively connected to the conductive fixing member and the second elastic conductive member above thereof;
  • the third elastic conductive member is disposed on the second elastic conductive member and maintains electrical contact with the conductive rotating member under the elastic force of the spring;
  • the hardness of the second elastic conductive member is lower than the hardness of the third elastic conductive member.
  • a recess is disposed on the conductive rotating member, and at least a portion of the second elastic conductive member is located in the recess.
  • the conductive connection structure further includes a fixing base, and the fixing base is connected to the spring;
  • a mounting groove is disposed on the fixing base, and the second elastic conductive member is detachably fixed in the mounting groove.
  • the conductive connection structure comprises:
  • a second elastic conductive member connected to the conductive fixing member and being a ring body, the ring body surrounding the conductive rotating member;
  • a third elastic conductive member connected to the conductive rotating member and located between an inner peripheral surface of the ring body and an outer peripheral surface of the conductive rotating member, and electrically in contact with each other;
  • the hardness of the second elastic conductive member is lower than the hardness of the third elastic conductive member.
  • the second elastic conductive member comprises graphite or a soft alloy.
  • the third elastic conductive member is a ring body, a plane spiral body or a columnar spiral body.
  • the third elastic conductive member comprises a soft alloy.
  • the power feeding mechanism further includes a conductive liquid container, wherein a part of each of the conductive fixing member and the conductive rotating member is immersed in a conductive solution of the conductive liquid container, so that the conductive fixing member and the conductive member The electrically conductive rotating member is electrically conducted through the electrically conductive solution.
  • the conductive liquid container is connected to the conductive fixing member or the conductive rotating member.
  • the power feeding mechanism further includes a conductive liquid container, wherein a part of each of the conductive fixing member and the conductive rotating member is immersed in the conductive liquid of the conductive liquid container, so that the conductive fixing member and the conductive member The electrically conductive rotating member is electrically conducted through the electrically conductive liquid.
  • the rotating component comprises a base, a target or a coil.
  • the present invention also provides a rotating base device including a rotatable base, a bias power source and a power feeding mechanism for using the bias power source Output power is fed into the pedestal, and the power feeding mechanism employs the power feeding mechanism provided by the present invention.
  • it also includes:
  • a rotating shaft which is vertically disposed, and an upper end of the rotating shaft is coupled to the base, and a lower end of the rotating shaft is coupled to the power feeding mechanism;
  • a rotary drive mechanism coupled to an intermediate position between the upper end and the lower end of the rotary shaft for driving the rotary shaft to rotate.
  • the present invention also provides a semiconductor processing apparatus including a reaction chamber in which the above-described rotary base device provided by the present invention is disposed.
  • the conductive connecting structure satisfies: electrically contacting the conductive fixing member and the conductive rotating member respectively, and does not affect the rotating motion of the conductive rotating member, thereby Achieves transmission of power to a rotating rotating component.
  • the conductive connection structure since the conductive connection structure is electrically contacted with the conductive fixing member and the conductive rotating member, respectively, the power transmission efficiency is higher than that of the prior art, and the power transmission efficiency is higher, and the existing technology can be avoided. Risk of fire.
  • FIG. 1 is a structural diagram of a power feeding mechanism according to a first embodiment of the present invention
  • FIG. 2 is another structural diagram of a power feeding mechanism according to a first embodiment of the present invention.
  • FIG. 3 is still another structural diagram of a power feeding mechanism according to a first embodiment of the present invention.
  • FIG. 4 is a structural diagram of a power feeding mechanism according to a second embodiment of the present invention.
  • FIG. 5 is a structural diagram of a power feeding mechanism according to a third embodiment of the present invention.
  • FIG. 6 is a structural diagram of a power feeding mechanism according to a fourth embodiment of the present invention.
  • FIG. 7 is a structural diagram of a semiconductor processing apparatus according to a fifth embodiment of the present invention.
  • the invention provides a power feeding mechanism for feeding the output power of a power source into a rotating component.
  • the rotating member can be a base, a target or a coil, or the like.
  • the power source is usually a matcher and a power supply, wherein the matcher is used to dynamically adjust the variable capacitance in the matching circuit during the process so that the load impedance matches the output impedance of the power supply, thereby ensuring that the output power of the power supply is maximized.
  • the power supply includes RF power, low frequency power, intermediate frequency power supply or DC power supply.
  • the power feeding mechanism includes: a conductive fixing member, a conductive rotating member and a conductive connecting structure, wherein the conductive fixing member is electrically connected to the power source; the conductive rotating member is electrically connected to the rotating member, and rotates synchronously with the rotating member;
  • the connecting structure is in electrical contact with the conductive fixing member and the conductive rotating member, respectively, and does not affect the rotational movement of the conductive rotating member. In this way, it is possible to feed the rotating component that feeds the output power of the power source into rotation.
  • the conductive connection structure is electrically contacted with the conductive fixing member and the conductive rotating member, respectively, the power transmission efficiency is higher than that of the prior art, and the power transmission efficiency is higher, and the existing technology can be avoided. Risk of fire.
  • the conductive rotating member 2 is opposite to the conductive fixing member 1 and spaced apart.
  • the conductive connection structure is disposed in the space between the conductive rotating member 2 and the conductive fixing member 1 to electrically conduct the conductive rotating member 2 and the conductive fixing member 1 to realize power transmission.
  • the conductive rotating member 2 includes a first surface 21, and the conductive fixing member 1 includes a second surface 11 opposite to the second surface 11 and spaced apart, preferably, the conductive rotating member 2 is
  • the vertical length of the interval between the conductive fixing members 1 is greater than or equal to 1 mm, that is, a distance D is provided between the first surface 21 and the second surface 11, and D is greater than or equal to 1 mm. In this way, it can be ensured that the rotational movement of the conductive rotary member 2 is not affected.
  • the conductive fixing member 1 and the conductive rotating member 2 are preferably made of a material having good electrical conductivity such as copper.
  • the opposite faces (the first surface 21 and the second surface 11) of the conductive rotating member 2 and the conductive fixing member 1 are parallel or nested with each other, which can improve the stability of the structure.
  • the first surface 21 is provided with a concave portion 211, and correspondingly, the convex portion 111 is disposed on the second surface 11; and, the convex portion 111 is located in the concave portion 211, so that the conductive rotating member 2 and the conductive fixing
  • the pieces 1 form a structure that is nested with each other.
  • a convex portion may be provided on the first surface 21, and a concave portion may be provided on the second surface 11 correspondingly.
  • the conductive connection structure includes the first elastic conductive member 3, and since it has elasticity, the first elastic conductive member 3 can always maintain electrical contact with the conductive rotating member 2 during the rotation of the conductive rotating member 2, thereby The normal transmission of power is ensured while the first elastic conductive member 3 does not affect the rotational movement of the conductive rotating member.
  • the first elastic conductive member 3 may be made of a soft material such as a soft alloy such as an aluminum alloy, a stainless steel alloy or the like.
  • the first elastic conductive member 3 is located between the bottom surface of the concave portion 211 and the top surface of the convex portion 111, but the present invention is not limited thereto. In practical applications, as shown in FIG. 2 It is to be noted that the first elastic conductive member 3 may also be located between the inner circumferential surface of the concave portion 211 and the outer circumferential surface of the convex portion 111.
  • the conductive rotating member 2 and the conductive fixing member 1 form a nested structure by means of the concave portion 211 and the convex portion 111, but the present invention is not limited thereto, and in practical applications, such as As shown in FIG. 3, the first surface 21' and the second surface 11' may both be planar; the first elastic conductive member 3 is disposed between the first surface 21' and the second surface 11'.
  • the first elastic conductive member 3 is a ring body.
  • the first elastic conductive member 3 may be any other structure such as a plane spiral (a coil-like spiral) or a columnar spiral.
  • a mounting groove 22 is provided on the first surface 21, and a portion of the first elastic conductive member 3 is disposed in the mounting groove 22 to effect mounting of the first elastic conductive member 3. It is easily understood that the first elastic conductive member 3 has a portion outside the mounting groove 22 to ensure electrical contact with the second surface 11 of the conductive fixture 1.
  • the mounting grooves may be provided on the second surface 11, or the mounting grooves may be provided on the first surface 21 and the second surface 11, respectively.
  • the first elastic conductive member 3 is one, but the present invention is not limited thereto. In practical applications, the annular first elastic conductive member 3 may also be multiple and mutually Nested. Of course, for the first elastic conductive member 3 of other structures, any other arrangement may be adopted.
  • the power feeding mechanism provided by the second embodiment of the present invention as compared with the power feeding mechanism provided by the first embodiment, also includes a conductive fixing member, a conductive rotating member and a conductive connecting structure, and the difference lies in the structure of the conductive connecting structure. different. Only differences between the present embodiment and the above-described first embodiment will be described below.
  • the conductive connection structure includes: a spring 7, a second elastic conductive member 4, and a third elastic conductive member 5, wherein the first end of the spring 7 (the lower end of the spring 7 in FIG. 4) is electrically fixed Piece 1 is connected.
  • the second end of the spring 7 (the upper end of the spring 7 in Fig. 4) is connected to the second elastic conductive member 4.
  • the third elastic conductive member 5 is disposed on the second elastic conductive member 4, and is kept in electrical contact with the conductive rotating member 2 by the elastic force of the spring 7.
  • the hardness of the second elastic conductive member 4 is lower than the hardness of the third elastic conductive member 5.
  • the conductive rotating member 2 will drive the third elastic conductive member 5 to rotate together, resulting in relative motion between the third elastic conductive member 5 and the second elastic conductive member 4. Since the hardness of the second elastic conductive member 4 is lower than the hardness of the third elastic conductive member 5, this makes the second elastic conductive member 4, which is softer in texture, more likely to be worn by the third elastic conductive member 5, thereby reducing the third elastic conductive The loss of the component 5 increases the life of the third elastic conductive member 5.
  • the third elastic conductive member 5 can be kept in good electrical contact with the conductive rotary member 2, thereby ensuring stable transmission of power.
  • the second elastic conductive member 4 may be made of a soft material such as graphite or soft alloy, provided that the hardness of the second elastic conductive member 4 is lower than the hardness of the third elastic conductive member 5.
  • the third elastic conductive member 5 can be made of a soft material such as soft alloy. Among them, the graphite powder produced by the graphite during the operation can also lubricate the third elastic conductive member 5, so that the loss of the third elastic conductive member 5 can be further reduced.
  • the third elastic conductive member 5 may include a ring body, a plane spiral or a columnar spiral or the like.
  • the spring 7 may be an elastic member such as a cylindrical coil spring.
  • the conductive rotating member 2 is provided with a recess 23, at least a portion of the second elastic conductive member 4 is located in the recess 23, so that the conductive rotating member 2 and the second elastic conductive member 4 can be nested with each other. Improved structural stability.
  • the conductive connection structure further includes a fixing base 6 connected to the spring 7; and a mounting groove is disposed on the fixing base 6, and the second elastic conductive member 4 is detachably fixed in the mounting groove.
  • the second elastic conductive member 4 can be separated from the conductive rotating member 2 by pressing the fixing seat 6, and then the second elastic conductive member 4 can be taken out from the mounting groove. And replacing the new second elastic conductive member 4, which is easier than replacing the third elastic conductive member 5, so that work efficiency can be improved.
  • the power feeding mechanism provided by the third embodiment of the present invention as compared with the power feeding mechanism provided by the second embodiment, also includes a conductive fixing member, a conductive rotating member and a conductive connecting structure, except that the structure of the conductive connecting structure is different. . Only the differences between the present embodiment and the above second embodiment will be described below.
  • the conductive connection structure includes: a second elastic conductive member 4' and a third elastic conductive member 5', wherein the second elastic conductive member 4' is connected to the conductive fixing member 1, and is a ring body, The ring body surrounds the conductive rotating member 2.
  • the third elastic conductive member 5' is connected to the conductive rotary member 2, and is located between the inner peripheral surface of the ring body and the outer peripheral surface of the conductive rotary member 2, and is in electrical contact with each of them, respectively. Also, the hardness of the second elastic conductive member 4' is lower than the hardness of the third elastic conductive member 5'.
  • the third elastic conductive member 5' rotates in synchronization with the conductive rotary member 2. In this process, a relative movement is generated between the third elastic conductive member 5' and the second elastic conductive member 4'. Since the hardness of the second elastic conductive member 4' is lower than the hardness of the third elastic conductive member 5', the second elastic conductive member 4' having a softer texture is more easily worn by the third elastic conductive member 5', thereby reducing The loss of the third elastic conductive member 5' improves the life of the third elastic conductive member 5'.
  • the power feeding mechanism provided by the fourth embodiment of the present invention is an improvement based on the power feeding mechanism provided in the above respective embodiments.
  • the conductive connection structure includes a conductive liquid container 8 in which a conductive liquid 9 is contained, and a part of each of the conductive fixed member 1 and the conductive rotating member 2 is immersed in the conductive solution 9 of the conductive liquid container 8. So that the conductive fixing member 1 and the conductive rotating member 2 are electrically conducted through the conductive liquid. Since the conductive liquid has good electrical conductivity, it does not settle and agglomerate during long-term use, and can maintain stable electrical conductivity.
  • the conductive liquid may be mercury, a conductive carbon-based solvent, a conductive ion solution, or any other electrically conductive liquid.
  • the conductive liquid container 8 can be connected to the conductive fixing member 1 at this time, the conductive liquid container 8 is fixed with respect to the rotating conductive rotating member 2; alternatively, the conductive liquid container 8 can also be connected to the conductive rotating member 2. At this time, the conductive liquid container 8 rotates in synchronization with the conductive rotating member 2.
  • the conductive liquid container 8 is used in combination with the conductive connection structures in the above-described first to third embodiments.
  • the conductive liquid container 8 may be disposed such that the first surface 21 A conductive solution is filled between the second surface 11 and the second surface 11.
  • the conductive connection structure may also be only the conductive liquid container 8, that is, the conductive liquid container 8 is used to electrically conduct the conductive fixing member 1 and the conductive rotating member 2 separately.
  • the first elastic conductive member 3 in the first embodiment is replaced with a conductive liquid container 8.
  • the conductive fixing member 1 and the conductive rotating member 2 adopt the mutually nested structure adopted by the first embodiment described above, so that the conductive liquid 9 can fill the space between the conductive fixing member 1 and the conductive rotating member 2, thereby The conductive solution 9 can be uniformly distributed between the conductive fixture 1 and the conductive rotating member 2.
  • the power feeding mechanism provided by the above various embodiments of the present invention can be electrically contacted with the conductive fixing member and the conductive rotating member, respectively, without affecting the rotational movement of the conductive rotating member, thereby realizing the transmission to the rotating rotating component. power.
  • the conductive connection structure is electrically contacted with the conductive fixing member and the conductive rotating member, respectively, the power transmission efficiency is higher than that of the prior art, and the power transmission efficiency is higher, and the existing technology can be avoided. Risk of fire.
  • a rotating base device includes a rotatable base 101, a target 102, an upper RF power source 103, a bias power source, and a power feed.
  • the mechanism 105 in which the susceptor 101 is disposed in the reaction chamber 100, is the rotating member in the above embodiment.
  • the target 102 is disposed above the susceptor 101 and is electrically connected to the upper RF power source 103.
  • the bias power source includes a matcher 106 and a power source 107, wherein the matcher 106 is configured to ensure the power supply by matching the variable impedance in the matching circuit dynamically during the process so that the load impedance matches the output impedance of the power source 107.
  • the output power of 107 is applied to the plasma inside the chamber to the utmost extent.
  • the power source 107 includes a radio frequency power source, a low frequency power source, an intermediate frequency power source, or a direct current power source.
  • the power feed mechanism 105 is for feeding the output power of the bias power source to the susceptor 101, which employs the power feed mechanism provided by the various embodiments of the present invention.
  • the rotary base device further includes a rotating shaft 104 and a rotary driving mechanism 108, wherein the rotating shaft 104 is vertically disposed, and the upper end of the rotating shaft 104 is coupled to the base 101, and the lower end of the rotating shaft 104 and the power The feeding mechanism 105 is connected.
  • the rotating shaft 104 is electrically connected to the base 101 as the conductive rotating member, and the lower portion of the rotating shaft 104 is opposed to the conductive fixing member and spaced apart.
  • the above-mentioned conductive connection structure is disposed in the interval between the rotating shaft 104 and the conductive fixing member, thereby electrically connecting the rotating shaft 104 and the conductive fixing member to realize power transmission.
  • the rotary drive mechanism 108 is coupled to an intermediate position between the upper end and the lower end of the rotary shaft 104 for driving the rotary shaft 104 to rotate.
  • the rotary drive mechanism 108 described above may include a motor and a transmission mechanism that is coupled to the rotary shaft 104 via a transmission structure.
  • the transmission mechanism is, for example, a belt transmission mechanism, a gear transmission mechanism, or the like. It should be noted that the rotary drive mechanism 108 receives the weight of the rotating shaft 104 and the base 101 thereon.
  • the rotating base device provided by the embodiment of the present invention can not only improve the power transmission efficiency but also avoid the risk of sparking existing in the prior art by using the power feeding mechanism provided by the above various embodiments of the present invention.
  • an embodiment of the present invention further provides a semiconductor processing apparatus including a reaction chamber 100, and a rotary base provided by the above various embodiments of the present invention is disposed in the reaction chamber 100.
  • Seat device As another technical solution, referring to FIG. 7, an embodiment of the present invention further provides a semiconductor processing apparatus including a reaction chamber 100, and a rotary base provided by the above various embodiments of the present invention is disposed in the reaction chamber 100.
  • Seat device As another technical solution, referring to FIG. 7, an embodiment of the present invention further provides a semiconductor processing apparatus including a reaction chamber 100, and a rotary base provided by the above various embodiments of the present invention is disposed in the reaction chamber 100.
  • Seat device As another technical solution, referring to FIG. 7, an embodiment of the present invention further provides a semiconductor processing apparatus including a reaction chamber 100, and a rotary base provided by the above various embodiments of the present invention is disposed in the reaction chamber 100.
  • Seat device As another technical solution, referring to FIG. 7, an embodiment of the present invention further provides a
  • the semiconductor processing apparatus provided by the embodiment of the invention can not only improve the power transmission efficiency but also avoid the risk of sparking existing in the prior art by using the above-mentioned rotating base device provided by the embodiment of the invention.

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Abstract

本发明提供的功率馈入机构、旋转基座装置及半导体加工设备，该功率馈入机构用于将功率源的输出功率馈入旋转部件，包括：导电固定件，其与功率源电连接；导电旋转件，其与旋转部件电连接，且随旋转部件同步旋转；导电连接结构，分别与导电固定件和导电旋转件电接触，且不影响导电旋转件的旋转运动。本发明提供的功率馈入机构，其不仅可以提高功率传输效率，而且可以避免现有技术中存在的打火风险。

Description

功率馈入机构、旋转基座装置及半导体加工设备 技术领域
本发明涉及半导体制造技术领域，具体地，涉及一种功率馈入机构、旋转基座装置及半导体加工设备。
背景技术
在PVD(Physical Vapor Deposition，物理气相沉积)工艺中，溅射电源输出的功率通过电极耦合至工艺腔室中，并激发腔室中的工艺气体形成等离子体，在等离子体中电子和离子的作用下，完成薄膜沉积。
随着晶片(wafer)尺寸的增加，为了提高产品良率，PVD工艺对薄膜沉积均匀性的要求也越来越高。通过基座旋转的方式可以显著提高沉积薄膜的均匀性，现已被广泛采用。但是，为了提高等离子体中带电离子的能量，增强离子的轰击作用，通常采用向基座馈入射频的方式来实现，而在基座旋转的过程中，如何保持良好稳定的射频连接非常具有挑战性。
在现有技术中，通常是在可旋转的基座支撑件的周围环绕设置有相互嵌套的两个电感线圈，利用电感线圈产生的磁场，可以通过磁场耦合的方式将射频能量耦合至基座支撑件，从而实现向旋转中的基座传输射频功率。但是，这在实际应用中不可避免地存在以下问题：
其一，射频功率通过电感线圈采用电感耦合方式进行传输会存在漏磁问题，功率传输效率较低。
其二，为了提高向基座支撑件馈入的射频功率，就需要提高电感线圈的电压，当电压升高至某一阈值时会存在打火风险。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一，提出了一种功率馈入机构、旋转基座装置及半导体加工设备，其不仅可以提高功率传输效率，而且可以避免现有技术中存在的打火风险。
为实现本发明的目的而提供一种功率馈入机构，用于将功率源的输出功率馈入旋转部件，包括：
导电固定件，其与所述功率源电连接；
导电旋转件，其与所述旋转部件电连接，且随所述旋转部件同步旋转；
导电连接结构，分别与所述导电固定件和所述导电旋转件电接触，且不影响所述导电旋转件的旋转运动。
可选的，所述导电旋转件与所述导电固定件相对，且间隔设置；所述导电连接结构设置在所述导电旋转件与所述导电固定件之间的间隔中。
可选的，所述间隔的垂直长度大于或等于1mm。
可选的，所述导电旋转件与所述导电固定件的两个相对面相互平行或者相互嵌套。
可选的，所述导电连接结构包括第一弹性导电部件。
可选的，所述第一弹性导电部件为环体、平面螺旋体或者柱状螺旋体。
可选的，所述第一弹性导电部件包括软质合金。
可选的，在所述导电旋转件与所述导电固定件的两个相对面中的至少一个相对面上设置有安装槽，所述第一弹性导电部件的一部分设置在所述安装槽中。
可选的，所述导电连接结构包括第二弹性导电部件、第三弹性导电部件和弹簧，其中，
所述弹簧的两端分别与所述导电固定件和其上方的所述第二弹性导电部件连接；
所述第三弹性导电部件设置在所述第二弹性导电部件上，且在所述弹簧 的弹力作用下，与所述导电旋转件保持电接触；
所述第二弹性导电部件的硬度低于第三弹性导电部件的硬度。
可选的，在所述导电旋转件上设置有凹部，所述第二弹性导电部件的至少一部分位于所述凹部中。
可选的，所述导电连接结构还包括固定座，所述固定座与所述弹簧连接；
在所述固定座上设置有安装槽，所述第二弹性导电部件可拆卸的固定在所述安装槽中。
可选的，所述导电连接结构包括：
第二弹性导电部件，其与所述导电固定件连接，且为环体，所述环体环绕在所述导电旋转件的周围；
第三弹性导电部件，其与所述导电旋转件连接，且位于所述环体的内周面与所述导电旋转件的外周面之间，并且分别与二者电接触；
所述第二弹性导电部件的硬度低于第三弹性导电部件的硬度。
可选的，所述第二弹性导电部件包括石墨或者软质合金。
可选的，所述第三弹性导电部件为环体、平面螺旋体或者柱状螺旋体。
可选的，所述第三弹性导电部件包括软质合金。
可选的，所述功率馈入机构还包括导电液体容器，所述导电固定件和所述导电旋转件各自的一部分浸入所述导电液体容器的导电溶液中，以使所述导电固定件与所述导电旋转件通过所述导电溶液电导通。
可选的，所述导电液体容器与所述导电固定件或者所述导电旋转件连接。
可选的，所述功率馈入机构还包括导电液体容器，所述导电固定件和所述导电旋转件各自的一部分浸入所述导电液体容器的导电液体中，以使所述导电固定件与所述导电旋转件通过所述导电液体电导通。
可选的，所述旋转部件包括基座、靶材或者线圈。
作为另一个技术方案，本发明还提供一种旋转基座装置，包括可旋转的基座、偏压功率源和功率馈入机构，所述功率馈入机构用于将所述偏压功率源的输出功率馈入所述基座，所述功率馈入机构采用本发明提供的上述功率馈入机构。
可选的，还包括：
旋转轴，其竖直设置，且所述旋转轴的上端与所述基座连接，所述旋转轴的下端与所述功率馈入机构连接；
旋转驱动机构，其与位于所述旋转轴的上端和下端之间的中间位置连接，用于驱动所述旋转轴旋转。
作为另一个技术方案，本发明还提供一种半导体加工设备，包括反应腔室，在所述反应腔室中设置有本发明提供的上述旋转基座装置。
本发明具有以下有益效果：
本发明提供的功率馈入机构、旋转基座装置及半导体加工设备的技术方案中，导电连接结构满足：分别与导电固定件与导电旋转件电接触，且不影响导电旋转件的旋转运动，从而实现向旋转中的旋转部件传输功率。同时，由于导电连接结构分别与导电固定件与导电旋转件电接触，这与现有技术中采用电感耦合方式传输功率的方式相比，功率传输效率更高，而且可以避免现有技术中存在的打火风险。
附图说明
图1为本发明第一实施例提供的功率馈入机构的一种结构图；
图2为本发明第一实施例提供的功率馈入机构的另一种结构图；
图3为本发明第一实施例提供的功率馈入机构的又一种结构图；
图4为本发明第二实施例提供的功率馈入机构的结构图；
图5为本发明第三实施例提供的功率馈入机构的结构图；
图6为本发明第四实施例提供的功率馈入机构的结构图；
图7为本发明第五实施例提供的半导体加工设备的结构图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图来对本发明提供的功率馈入机构、旋转基座装置及半导体加工设备进行详细描述。
本发明提供的功率馈入机构，用于将功率源的输出功率馈入旋转部件。该旋转部件可以为基座、靶材或者线圈等等。功率源通常为匹配器和电源，其中，匹配器用于在工艺过程中，通过动态调节匹配电路中的可变电容，使得负载阻抗与电源的输出阻抗相匹配，从而保证电源的输出功率最大程度地施加到腔室内部的等离子体上。电源包括射频电源、低频电源、中频电源或者直流电源等等。
具体地，功率馈入机构包括：导电固定件、导电旋转件和导电连接结构，其中，导电固定件与功率源电连接；导电旋转件与旋转部件电连接，且同该旋转部件同步旋转；导电连接结构分别与导电固定件与导电旋转件电接触，且不影响导电旋转件的旋转运动。这样，可以实现将功率源的输出功率馈入旋转中的旋转部件。同时，由于导电连接结构分别与导电固定件与导电旋转件电接触，这与现有技术中采用电感耦合方式传输功率的方式相比，功率传输效率更高，而且可以避免现有技术中存在的打火风险。
下面对导电连接结构的具体实施方式进行详细描述。具体地，请参阅图1，在本发明第一实施例提供的功率馈入机构中，导电旋转件2与导电固定件1相对，且间隔设置。导电连接结构设置在导电旋转件2与导电固定件1之间的间隔中，从而将导电旋转件2与导电固定件1的电导通，以实现功率传输。
在本实施例中，导电旋转件2包括第一表面21，导电固定件1包括第二 表面11，该第一表面21与第二表面11相对，且间隔设置，优选的，导电旋转件2与导电固定件1之间的间隔的垂直长度大于或等于1mm，即，第一表面21与第二表面11之间设置有间距D，且D大于或等于1mm。这样，可以保证导电旋转件2的旋转运动不受影响。导电固定件1和导电旋转件2优选采用诸如紫铜等的导电性能良好的材料制作。
在本实施例中，导电旋转件2与导电固定件1的两个相对面(第一表面21和第二表面11)相互平行或者相互嵌套，这样可以提高结构的稳定性。在本实施例中，在第一表面21上设置有凹部211，且对应地在第二表面11上设置有凸部111；并且，凸部111位于凹部211内，从而导电旋转件2和导电固定件1形成相互嵌套的结构。当然，在实际应用中，也可以在第一表面21上设置有凸部，且对应地在第二表面11上设置有凹部。
在本实施例中，导电连接结构包括第一弹性导电部件3，由于其具有弹性，第一弹性导电部件3能够在导电旋转件2旋转的过程中，始终保持与导电旋转件2电接触，从而确保功率的正常传输，同时第一弹性导电部件3不会影响导电旋转件的旋转运动。第一弹性导电部件3可以采用软质材料制作，例如诸如铝合金、不锈钢合金等的软质合金。
需要说明的是，在本实施例中，第一弹性导电部件3位于凹部211的底面和凸部111的顶面之间，但是本发明并不局限于此，在实际应用中，如图2所示，第一弹性导电部件3还可以位于凹部211的内周面和凸部111的外周面之间。
还需要说明的是，在本实施例中，导电旋转件2和导电固定件1借助凹部211和凸部111形成相互嵌套的结构，但是本发明并不局限于此，在实际应用中，如图3所示，第一表面21’和第二表面11’还可以均为平面；第一弹性导电部件3设置在第一表面21’和第二表面11’之间。
在本实施例中，第一弹性导电部件3为环体。当然，在实际应用中，第 一弹性导电部件3也可以为诸如平面螺旋体(类似盘香型的螺旋体)或者柱状螺旋体等的其他任意结构。
在本实施例中，在第一表面21上设置有安装槽22，第一弹性导电部件3的一部分设置在安装槽22中，以实现对第一弹性导电部件3的安装。容易理解，第一弹性导电部件3具有位于安装槽22之外的部分，以保证能够与导电固定件1的第二表面11电接触。当然，实际应用中，也可以在第二表面11上设置安装槽，或者还可以对应地分别在第一表面21和第二表面11上设置安装槽。
需要说明的是，在本实施例中，第一弹性导电部件3为一个，但是本发明并不局限于此，在实际应用中，环形的第一弹性导电部件3也可以为多个，且相互嵌套。当然，对于其他结构的第一弹性导电部件3，还可以采用其他任意排布方式。
本发明第二实施例提供的功率馈入机构，其与上述第一实施例提供的功率馈入机构相比，同样包括导电固定件、导电旋转件和导电连接结构，区别在于导电连接结构的结构不同。下面仅对本实施例与上述第一实施例之间的不同点进行描述。
具体地，请参阅图4，导电连接结构包括：弹簧7、第二弹性导电部件4和第三弹性导电部件5，其中，弹簧7的第一端(图4中弹簧7的下端)与导电固定件1连接。弹簧7的第二端(图4中弹簧7的上端)与第二弹性导电部件4连接。第三弹性导电部件5设置在第二弹性导电部件4上，且在弹簧7的弹力作用下，与导电旋转件2保持电接触。
并且，第二弹性导电部件4的硬度低于第三弹性导电部件5的硬度。在实际使用的过程中，导电旋转件2会带动第三弹性导电部件5随之一起旋转，导致第三弹性导电部件5与第二弹性导电部件4之间产生相对运动。由于第二弹性导电部件4的硬度低于第三弹性导电部件5的硬度，这使得质地更软 的第二弹性导电部件4更容易被第三弹性导电部件5磨损，从而减少了第三弹性导电部件5的损耗，提高了第三弹性导电部件5的寿命。
同时，即使第二弹性导电部件4因磨损而变薄，在弹簧7的弹力作用下，也仍然能够保持第三弹性导电部件5与导电旋转件2电接触良好，从而保证功率的稳定传输。
在实际应用中，在满足第二弹性导电部件4的硬度低于第三弹性导电部件5的硬度的前提下，第二弹性导电部件4可以采用诸如石墨或者软质合金等的软质材料制作。第三弹性导电部件5可以采用诸如软质合金等的软质材料制作。其中，石墨在运行过程中产生的石墨粉还可以对第三弹性导电部件5起到润滑作用，从而可以进一步减少第三弹性导电部件5的损耗。
与上述第一实施例中的第一弹性导电部件3相类似的，第三弹性导电部件5可以包括环体、平面螺旋体或者柱状螺旋体等等。
可选的，上述弹簧7可以为柱状螺旋弹簧等弹性件。
在本实施例中，在导电旋转件2上设置有凹部23，第二弹性导电部件4的至少一部分位于凹部23中，从而可以使导电旋转件2与第二弹性导电部件4相互嵌套，进而提高了结构稳定性。
可选的，导电连接结构还包括固定座6，该固定座6与弹簧7连接；并且，在固定座6上设置有安装槽，第二弹性导电部件4可拆卸的固定在安装槽中。这样，在第二弹性导电部件4磨损到一定程度之后，可以通过下压固定座6，使第二弹性导电部件4与导电旋转件2分离，然后将第二弹性导电部件4自安装槽中取出，并更换新的第二弹性导电部件4，这相比于更换第三弹性导电部件5更容易，从而可以提高工作效率。
本发明第三实施例提供的功率馈入机构，其与上述第二实施例提供的功率馈入机构相比，同样包括导电固定件、导电旋转件和导电连接结构，除了导电连接结构的结构不同。下面仅对本实施例与上述第二实施例之间的不同 点进行描述。
具体地，请参阅图5，导电连接结构包括：第二弹性导电部件4’和第三弹性导电部件5’，其中，第二弹性导电部件4’与导电固定件1连接，且为环体，该环体环绕在导电旋转件2的周围。第三弹性导电部件5’与导电旋转件2连接，且位于环体的内周面与导电旋转件2的外周面之间，并且分别与二者电接触。并且，第二弹性导电部件4’的硬度低于第三弹性导电部件5’的硬度。
第三弹性导电部件5’随导电旋转件2同步旋转。在此过程中，第三弹性导电部件5’与第二弹性导电部件4’之间产生相对运动。由于第二弹性导电部件4’的硬度低于第三弹性导电部件5’的硬度，这使得质地更软的第二弹性导电部件4’更容易被第三弹性导电部件5’磨损，从而减少了第三弹性导电部件5’的损耗，提高了第三弹性导电部件5’的寿命。
本发明第四实施例提供的功率馈入机构，其是在上述第各个实施例提供的功率馈入机构的基础上所做的改进。
具体地，请参阅图6，导电连接结构包括导电液体容器8，导电容器8内盛放有导电液体9，导电固定件1和导电旋转件2各自的一部分浸入导电液体容器8的导电溶液9中，以使导电固定件1和导电旋转件2通过导电液体电导通。由于导电液体具有良好的导电性能，而且在长时间的使用过程中既不会沉降和凝聚，又能够保持稳定的导电性能。导电液体可以为水银、导电碳基类溶剂、导电离子溶液或者其他任意的可导电液体。
在实际应用中，导电液体容器8可以与导电固定件1连接，此时导电液体容器8相对于旋转中的导电旋转件2固定不动；或者，导电液体容器8也可以与导电旋转件2连接，此时导电液体容器8随导电旋转件2同步旋转。
在本实施例中，导电液体容器8与上述第一至第三实施例中的导电连接结构结合使用。以第一实施例为例，如图1所示，在第一表面21和第二表面 11之间设置第一弹性导电部件3的同时，可以设置上述导电液体容器8，以使第一表面21和第二表面11之间充满导电溶液。
但是，本发明并不局限于此，在实际应用中，导电连接结构也可以仅为导电液体容器8，即，单独使用导电液体容器8将导电固定件1和导电旋转件2电导通。例如，将第一实施例中的第一弹性导电部件3替换为导电液体容器8。可选的，导电固定件1和导电旋转件2采用上述第一实施例采用的相互嵌套的结构，以使导电液体9能够充满导电固定件1和导电旋转件2之间的间隔中，从而可以使导电溶液9均匀地分布在导电固定件1和导电旋转件2之间。
综上所述，本发明上述各个实施例提供的功率馈入机构，可以分别与导电固定件与导电旋转件电接触，且不影响导电旋转件的旋转运动，从而实现向旋转中的旋转部件传输功率。同时，由于导电连接结构分别与导电固定件与导电旋转件电接触，这与现有技术中采用电感耦合方式传输功率的方式相比，功率传输效率更高，而且可以避免现有技术中存在的打火风险。
作为另一个技术方案，请参阅图7，本发明第五实施例提供的旋转基座装置，其包括可旋转的基座101、靶材102、上射频电源103、偏压功率源和功率馈入机构105，其中，基座101设置在反应腔室100中，其即为上述实施例中的旋转部件。靶材102设置在基座101的上方，其与上射频电源103电连接。偏压功率源包括匹配器106和电源107，其中，匹配器106用于在工艺过程中，通过动态调节匹配电路中的可变电容，使得负载阻抗与电源107的输出阻抗相匹配，从而保证电源107的输出功率最大程度地施加到腔室内部的等离子体上。电源107包括射频电源、低频电源、中频电源或者直流电源等等。
功率馈入机构105用于将偏压功率源的输出功率馈入基座101，该功率馈入机构105采用本发明上述各个实施例提供的功率馈入机构。
在本实施例中，旋转基座装置还包括：旋转轴104和旋转驱动机构108，其中，旋转轴104竖直设置，且旋转轴104的上端与基座101连接，旋转轴104的下端与功率馈入机构105连接，这里，旋转轴104用作上述导电旋转件与基座101电连接，旋转轴104的下部与上述导电固定件相对，且间隔设置。上述导电连接结构设置在旋转轴104与导电固定件之间的间隔中，从而将旋转轴104与导电固定件的电导通，以实现功率传输。旋转驱动机构108与位于旋转轴104的上端和下端之间的中间位置连接，用于驱动旋转轴104旋转。
上述旋转驱动机构108可以包括电机和传动机构，电机通过传动结构与旋转轴104连接。传动机构例如为皮带传动机构，齿轮传动机构等等。需要说明的是，旋转驱动机构108承受旋转轴104及其上的基座101的重量。
本发明实施例提供的旋转基座装置，其通过采用本发明上述各个实施例提供的功率馈入机构，不仅可以提高功率传输效率，而且可以避免现有技术中存在的打火风险。
作为另一个技术方案，请参阅图7，本发明实施例还提供一种半导体加工设备，其包括反应腔室100，且在该反应腔室100中设置有本发明上述各个实施例提供的旋转基座装置。
本发明实施例提供的半导体加工设备，其通过采用本发明实施例提供的上述旋转基座装置，不仅可以提高功率传输效率，而且可以避免现有技术中存在的打火风险。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (22)

  1. 一种功率馈入机构，用于将功率源的输出功率馈入旋转部件，其特征在于，包括：
    导电固定件，其与所述功率源电连接；
    导电旋转件，其与所述旋转部件电连接，且随所述旋转部件同步旋转；
    导电连接结构，分别与所述导电固定件和所述导电旋转件电接触，且不影响所述导电旋转件的旋转运动。
  2. 根据权利要求1所述的功率馈入机构，其特征在于，所述导电旋转件与所述导电固定件相对，且间隔设置；所述导电连接结构设置在所述导电旋转件与所述导电固定件之间的间隔中。
  3. 根据权利要求2所述的功率馈入机构，其特征在于，所述间隔的垂直长度大于或等于1mm。
  4. 根据权利要求2所述的功率馈入机构，其特征在于，所述导电旋转件与所述导电固定件的两个相对面相互平行或者相互嵌套。
  5. 根据权利要求2述的功率馈入机构，其特征在于，所述导电连接结构包括第一弹性导电部件。
  6. 根据权利要求5所述的功率馈入机构，其特征在于，所述第一弹性导电部件为环体、平面螺旋体或者柱状螺旋体。
  7. 根据权利要求5所述的功率馈入机构，其特征在于，所述第一弹性导电部件包括软质合金。
  8. 根据权利要求5所述的功率馈入机构，其特征在于，在所述导电旋转件与所述导电固定件的两个相对面中的至少一个相对面上设置有安装槽，所述第一弹性导电部件的一部分设置在所述安装槽中。
  9. 根据权利要求1所述的功率馈入机构，其特征在于，所述导电连接结构包括第二弹性导电部件、第三弹性导电部件和弹簧，其中，
    所述弹簧的两端分别与所述导电固定件和其上方的所述第二弹性导电部件连接；
    所述第三弹性导电部件设置在所述第二弹性导电部件上，且在所述弹簧的弹力作用下，与所述导电旋转件保持电接触；
    所述第二弹性导电部件的硬度低于第三弹性导电部件的硬度。
  10. 根据权利要求9所述的功率馈入机构，其特征在于，在所述导电旋转件上设置有凹部，所述第二弹性导电部件的至少一部分位于所述凹部中。
  11. 根据权利要求9所述的功率馈入机构，其特征在于，所述导电连接结构还包括固定座，所述固定座与所述弹簧连接；
    在所述固定座上设置有安装槽，所述第二弹性导电部件可拆卸的固定在所述安装槽中。
  12. 根据权利要求1所述的功率馈入机构，其特征在于，所述导电连接结构包括：
    第二弹性导电部件，其与所述导电固定件连接，且为环体，所述环体环绕在所述导电旋转件的周围；
    第三弹性导电部件，其与所述导电旋转件连接，且位于所述环体的内周面与所述导电旋转件的外周面之间，并且分别与二者电接触；
    所述第二弹性导电部件的硬度低于第三弹性导电部件的硬度。
  13. 根据权利要求9或12所述的功率馈入机构，其特征在于，所述第二弹性导电部件包括石墨或者软质合金。
  14. 根据权利要求9或12所述的功率馈入机构，其特征在于，所述第三弹性导电部件为环体、平面螺旋体或者柱状螺旋体。
  15. 根据权利要求9或12所述的功率馈入机构，其特征在于，所述第三弹性导电部件包括软质合金。
  16. 根据权利要求1-12任意一项所述的功率馈入机构，其特征在于，所述功率馈入机构还包括导电液体容器，所述导电固定件和所述导电旋转件各自的一部分浸入所述导电液体容器的导电液体中，以使所述导电固定件与所述导电旋转件通过所述导电液体电导通。
  17. 根据权利要求16所述的功率馈入机构，其特征在于，所述导电液体容器与所述导电固定件或者所述导电旋转件连接。
  18. 根据权利要求1所述的功率馈入机构，其特征在于，所述导电连接机构包括导电液体容器，所述导电固定件和所述导电旋转件各自的一部分浸入所述导电液体容器的导电溶液中，以使所述导电固定件与所述导电旋转件通过所述导电液体电导通。
  19. 根据权利要求1所述的功率馈入机构，其特征在于，所述旋转部件包括基座、靶材或者线圈。
  20. 一种旋转基座装置，包括可旋转的基座、偏压功率源和功率馈入机构，所述功率馈入机构用于将所述偏压功率源的输出功率馈入所述基座，其特征在于，所述功率馈入机构采用权利要求1-18任意一项所述的功率馈入机构。
  21. 根据权利要求20所述的旋转基座装置，其特征在于，还包括：
    旋转轴，其竖直设置，且所述旋转轴的上端与所述基座连接，所述旋转轴的下端与所述功率馈入机构连接；
    旋转驱动机构，其与位于所述旋转轴的上端和下端之间的中间位置连接，用于驱动所述旋转轴旋转。
  22. 一种半导体加工设备，其特征在于，包括反应腔室，在所述反应腔室中设置有权利要求20或21所述的旋转基座装置。
PCT/CN2018/117901 2018-03-19 2018-11-28 功率馈入机构、旋转基座装置及半导体加工设备 WO2019179159A1 (zh)

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