WO2019178744A1 - 柔性盖板、柔性部件及电子装置 - Google Patents

柔性盖板、柔性部件及电子装置 Download PDF

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Publication number
WO2019178744A1
WO2019178744A1 PCT/CN2018/079616 CN2018079616W WO2019178744A1 WO 2019178744 A1 WO2019178744 A1 WO 2019178744A1 CN 2018079616 W CN2018079616 W CN 2018079616W WO 2019178744 A1 WO2019178744 A1 WO 2019178744A1
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WIPO (PCT)
Prior art keywords
layer
flexible cover
flexible
adhesion
reducing
Prior art date
Application number
PCT/CN2018/079616
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English (en)
French (fr)
Inventor
温胜山
张琨
施文杰
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201880090444.5A priority Critical patent/CN112041991A/zh
Priority to PCT/CN2018/079616 priority patent/WO2019178744A1/zh
Publication of WO2019178744A1 publication Critical patent/WO2019178744A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling

Definitions

  • the present invention relates to the field of flexible display technologies, and in particular, to a flexible cover, a flexible member, and an electronic device.
  • the flexible display device is made of a flexible material, which is capable of bending and bending.
  • the flexible display device has the characteristics of low power consumption and light weight, and has wide application prospects.
  • the display panel of the flexible display device includes a flexible cover for protection.
  • the existing flexible cover has insufficient hardness, wear resistance and scratch resistance, which has become one of the bottlenecks in the development of flexible display technology.
  • embodiments of the present invention disclose a flexible cover, a flexible member, and an electronic device.
  • a flexible cover plate comprising a hard layer disposed on one side and a connection layer disposed on the other side away from the hard layer.
  • connection layer includes an adhesion reducing layer for reducing adhesion.
  • the attachment shape of the adhesion-reducing layer may be a whole surface or a pattern.
  • the adhesion reducing layer reduces the adhesion force when the first condition is satisfied, and the adhesion force remains unchanged when the first condition is not satisfied.
  • the first condition includes at least one of ultraviolet light irradiation, infrared light irradiation, laser irradiation, application of an electric field, application of a force field, application of a magnetic field, and heating.
  • the flexible cover plate further includes a protective layer for reducing energy transmission.
  • the protective layer is used to reduce energy transmission in the stacking direction of the flexible cover.
  • the protective layer is interposed between the adhesion reducing layer and the hard layer.
  • the protective layer includes an energy absorbing layer, and the energy input under the first condition is absorbed through the protective layer.
  • the protective layer comprises polyethylene terephthalate to which reinforcing fibers are added.
  • the protective layer includes a heat dissipation layer, and the energy input under the first condition includes heat, and the heat dissipation layer blocks heat transferred along a stacking direction of the flexible cover plate and is perpendicular to the stacking direction of the flexible cover plate. The direction of the heat is emitted.
  • the material of the heat dissipation layer includes at least one of heat conductive graphene, thermal conductive adhesive, thermal conductive silicone, thermal conductive silicone, thermal conductive rubber, and thermally conductive molybdenum sulfide.
  • the material of the energy absorbing layer includes at least one of amorphous silicon, indium tin oxide, indium zinc oxide, aluminum titanium oxide, and porous silica.
  • the energy absorbing layer is doped with an organic heterocyclic compound.
  • the flexible cover plate further includes a substrate sandwiched between the hard layer and the protective layer.
  • the flexible cover plate further includes a shielding layer, the shielding layer is disposed on a side of the protective layer away from the adhesion reducing layer and is a patterned shape, and the substrate is formed on the shielding layer and the On the protective layer.
  • the material of the substrate comprises polyethylene terephthalate, polyimide, cycloolefin polymer, polymethyl methacrylate, epoxy resin compound, organic alcohol ester and inorganic amine At least one of the mixtures.
  • the flexible cover plate further includes an optical adhesive layer formed between the hard layer and the protective layer.
  • the adhesion reducing layer comprises at least one of an ultraviolet visbreaking layer, an infrared visbreaking layer, a laser visbreaking layer, a force visbreaking layer, an electric visbreaking layer, a magnetic visbreaking layer, and a thermal visbreaking layer.
  • the hard layer includes at least one of an acrylate, a polyethylene terephthalate, a titanium nitride, a titanium aluminide compound, and a tungsten sulfide.
  • the flexible cover plate further includes a release film layer attached to a side of the adhesion reducing layer away from the hard layer.
  • the flexible cover plate further includes a protective film layer attached to a side of the hard layer away from the connection layer.
  • a flexible component includes a flexible module and a flexible cover as described above, the flexible cover and the flexible module being bonded together by the connecting layer.
  • the flexible module includes at least two functional layers stacked in a stack, the at least two functional layers include a display function layer and a support layer disposed in a stack, and the display function layer is disposed on the flexible module and the The adjacent side of the connection layer.
  • the display function layer includes a polarizing layer, a thin film transistor layer and an organic light emitting layer which are sequentially stacked, and the polarizing layer is disposed adjacent to the connecting layer.
  • the at least two functional layers further include a touch layer disposed on a side of the display function layer away from the support layer and bonded to the connection layer.
  • An electronic device comprising a flexible member as described above.
  • the flexible cover plate, the flexible member and the electronic device provided by the invention have a hard layer and a connecting layer respectively on both sides of the flexible cover plate, in other words, one side of the flexible cover plate has the characteristics of hardness, wear resistance and scratch resistance.
  • the flexible cover has the required hardness, wear resistance and scratch resistance and extends the service life of the flexible cover.
  • the first condition such as ultraviolet light / infrared light / laser irradiation / heating / pressurization / power / magnetic, etc.
  • the adhesion of the adhesion-reducing layer to the flexible module is reduced, facilitating the replacement of flexible parts Flexible cover.
  • FIG. 1 is a schematic cross-sectional view of a flexible member according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a flexible member according to an embodiment of the present invention.
  • FIG 3 is a schematic cross-sectional view of a flexible member according to a second embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a flexible member according to a third embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of a flexible member according to a fourth embodiment of the present invention.
  • Figure 6 is a cross-sectional view showing a flexible member according to a fifth embodiment of the present invention.
  • FIG. 7 is a schematic view showing the flexible cover plate of FIG. 6 with a release film layer and a protective film layer.
  • Figure 8 is a cross-sectional view showing a flexible member according to a sixth embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of a flexible member according to a seventh embodiment of the present invention.
  • Figure 10 is a schematic illustration of an electronic device having flexible components.
  • FIG. 11 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
  • a first embodiment of the present invention provides a flexible component 10 that includes a flexible cover 11 and a flexible module 13 .
  • the flexible cover 11 is attached to the flexible module 13 for protecting the flexible module 13.
  • the flexible module 13 is a flexible display module.
  • the flexible module 13 can be a flexible touch module or both a flexible display module and a flexible touch module.
  • the flexible cover 13 can be attached to other modules or structures, such as a rigid display module or a rigid touch module.
  • the flexible cover 11 can also be disposed on the rear case of an electronic device such as a mobile phone or a tablet computer as a rear case protection cover.
  • connection layer 116 One side of the flexible cover 11 is provided with a hard layer 111, and the flexible cover 11 is provided with a connection layer 116 away from the other side of the hard layer 111.
  • the flexible cover 11 and the flexible module 13 are connected together by a connection layer 116.
  • the connecting layer 116 includes a reduced adhesion layer 117, and the flexible cover 11 and the flexible module 13 are bonded together by the adhesion reducing layer 117.
  • the connection layer 116 may also be a layer that serves as a bonding layer, a support layer, or the like.
  • the flexible cover 11 further includes at least one of a substrate 113, an optical adhesive layer 114, and a protective layer 115, and at least one of the substrate 113, the optical adhesive layer 114, and the protective layer 115.
  • the hard layer 111 may be formed by coating a hard coating material on a layer structure farthest from the adhesion reducing layer 117 to enhance the strength, hardness, and wear resistance of the flexible cover sheet 11.
  • the hard layer 117 includes an organic compound such as an acrylate or a polyethylene terephthalate, and an inorganic compound such as titanium nitride, a titanium aluminum carbonitride compound or tungsten sulfide.
  • a hard layer 111 is formed on the side of the substrate 113 away from the adhesion-reducing layer 117 by a coating technique, wherein the coating technique may be: Roll to Roll Coating technology, spin coating ( Spin coating method, Slit and Spin coating method, slit coating method, and the like.
  • the coating technique may be: Roll to Roll Coating technology, spin coating ( Spin coating method, Slit and Spin coating method, slit coating method, and the like.
  • the material of the hard layer 117 is an organic compound
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • the material of the hard layer 117 is electrically conductive
  • a sputtering method, an ink jet printing method, a screen printing method, or the like can be employed.
  • the flexible cover 11 includes a hard layer 111 , a substrate 113 , an optical adhesive layer 114 , a protective layer 115 , and a connection layer 116 which are sequentially stacked.
  • the hard layer 111 is formed by applying a hard coating material to the substrate 113 to enhance the strength, hardness, wear resistance, scratch resistance, and the like of the flexible cover 11.
  • the flexible cover 11 may include only the substrate 113 and the optical adhesive layer 114 disposed between the hard layer 111 and the adhesion reducing layer 117, or only include the interlayer.
  • a protective layer 115 between the hard layer 111 and the adhesion reducing layer 117 is described.
  • the flexible cover 11 includes only the protective layer 115 interposed between the hard layer 111 and the adhesion reducing layer 117, the hard layer 111 is coated by applying a hard coating material. Formed on the protective layer 115.
  • the material of the substrate 113 includes polyethylene terephthalate (PET). It can be understood that the substrate 113 includes PET, polyimide (PI), and cycloolefin.
  • the protective layer 115 serves to reduce energy transmission. Further, the protective layer 115 serves to reduce the transmission of energy in the stacking direction of the flexible cover 11 .
  • the stacking direction is a stacking direction of the layers of the flexible cover 11 .
  • the stacking direction is a hard layer 111 , a substrate 113 , an optical adhesive layer 114 , a protective layer 115 , and a reduced adhesion layer .
  • the protective layer 115 is adhered to the substrate 113 through the optical adhesive layer 114 for preventing excessive energy from entering the flexible module 13 and avoiding damage to the function/performance of the functional device of the flexible module 13.
  • the adhesive layer 117 is bonded between the flexible module 13 and the protective layer 115 for adhering the flexible cover 11 to the flexible module 13.
  • the thickness of the flexible cover 11 can be prepared according to the product requirements (the flexible cover is preferably 200 ⁇ m or less), and the thickness of the hard layer 111 and the reduced adhesion layer 117 are different according to product requirements (flexible component is preferred) Thickness 50 ⁇ m or less).
  • the adhesion reducing layer 117 has a reduced adhesion force when the first condition is satisfied, and the adhesion force remains unchanged when the first condition is not satisfied.
  • the first condition is applied to provide energy to the adhesion-reducing layer 117, so that the adhesion of the adhesion-reducing layer 117 to the flexible module 13 is lowered, so that the adhesive layer can be easily peeled off from the flexible module 13. 117.
  • the adhesion of the adhesion-reducing layer 117 to the flexible module 13 is reduced from 0.1 to 3 kg/inch to 100 g/inch and below, for example, 8 g/inch, 36 g/ Inch, to ensure that the flexible cover 11 can be easily peeled off from the flexible module 13, the peeling method can be manually manual tear film and the machine automatically tear film, the tear film angle is 10 to 80 degrees (more favorable angle 30 to 60 degrees) Within the range, the tear film speed is in the range of 100-1000 mm/min (more preferably 300-600 mm/min), and no damage or partial residue to the flexible module 13 is caused under the tear film condition. on.
  • Applying the first condition is that the adhesion-reducing layer 117 is placed in a light field (such as ultraviolet/infrared light/laser irradiation), and the adhesion-reducing layer 117 absorbs a certain energy, thereby causing the adhesion-reduction layer 117 to adhere to the flexible module 13
  • the adhesion force is lowered; or the adhesion reducing layer 117 is placed in an electric field (current voltage is applied, heat is generated), and the viscosity reducing layer 117 absorbs a certain amount of energy, resulting in adhesion of the adhesion reducing layer 117 to the flexible module 13.
  • the lowering layer 117 absorbs a certain amount of energy, causing the adhesion-reducing layer 117 to adhere to the flexible module 13 in a magnetic field (a magnetic field is applied, a magnetic field is converted into an electric field, and an electric field generates heat).
  • the force field is reduced; or the force field, for example, the adhesion-reducing layer 117 is made of a viscous piezoelectric material, and when the piezoelectric material is applied, the piezoelectric material generates a voltage, which is equivalent to a reduced-viscosity layer.
  • the first condition includes at least one of ultraviolet light irradiation, infrared light irradiation, laser irradiation, application of an electric field, application of a force field, application of a magnetic field, and heating.
  • the adhesion-reducing layer 117 is an ultraviolet-viscosity layer capable of absorbing ultraviolet light of a certain wavelength, for example, a wavelength in the range of 200 to 400 nm.
  • the material of the adhesion-reducing layer 117 comprises a pressure sensitive adhesive (referred to as a pressure sensitive adhesive, PSA for short).
  • PSA pressure sensitive adhesive
  • the flexible module component of the PSA is polyacrylate (commonly known as acrylic-acrylic).
  • the polyacrylate is a polymer, and when it is irradiated with ultraviolet light, the polyacrylate is decomposed, so that the bonding interface adhesion force of the debonding layer 117 is greatly reduced, so that the flexible module 13 is easily separated.
  • the ultraviolet light-reducing layer can be made of other acrylates, for example, an acrylate can release nitrogen under ultraviolet light irradiation, that is, using a gas-generating peeling mechanism to reduce the adhesion of the adhesion-reducing layer 117. Adhesion force on the flexible module 13.
  • the adhesion-reducing layer 117 includes one of acrylates, silica gels, rubbers, and polyurethanes doped with photoresponsive supramolecules, and the adhesion-reducing layer 117 has reduced adhesion after being irradiated by ultraviolet light. small.
  • the adhesion reducing layer comprises one of an acrylate type, a silica gel type, a rubber type, and a polyurethane type, and the acrylate generates nitrogen gas after being irradiated with ultraviolet light to reduce adhesion.
  • the adhesion-reducing layer 117 may include at least one of an ultraviolet visbreaking layer, an infrared visbreaking layer, a laser visbreaking layer, a force reducing layer, an electric visbreaking layer, a magnetic visbreaking layer, and a thermal visbreaking layer.
  • the adhesive layer 117 can also select other materials whose adhesion force is reduced under the action of heat, and the heat can be realized by electric conversion, magnetic conversion, force conversion, and the like.
  • the protective layer 115 includes an energy absorbing layer 1151.
  • the energy input under the first condition is absorbed by the energy absorbing layer 1151, for example, reducing or reducing the energy of the ultraviolet/infrared light/laser entering the flexible module 13 to reduce damage to the function/performance of the flexible module 13.
  • the material of the energy absorbing layer 1151 includes amorphous silicon, indium tin oxide, indium zinc oxide, aluminum titanium oxide, porous silica gel, and the like.
  • the energy absorbing layer 1151 is amorphous silicon ( ⁇ -Si), and since amorphous silicon ( ⁇ -Si) absorbs energy (laser/ultraviolet light irradiation) and is converted into a bond energy, the bonding between atoms is changed, resulting in The properties of the material change to achieve the absorption layer (absorbing light/energy, etc.).
  • the energy absorbing layer 1151 includes one of a polyethylene terephthalate compound, a cycloolefin polymer, and a polymethyl methacrylate compound to which reinforcing fibers are added.
  • the energy absorbing layer 1151 may also be formed by doping an organic heterocyclic compound such as hydroxybenzenetriazine with a gel material, and the chemical bond of the organic heterocyclic compound is changed from a ground state (low energy level) by ultraviolet light irradiation. It forms a non-ground state (high energy level) and generates ions, and the process is a reversible chemical bond change; the organic heterocyclic compound of the final hydroxy-triazine can sufficiently absorb ultraviolet light to block ultraviolet light.
  • an organic heterocyclic compound such as hydroxybenzenetriazine
  • a gel material a gel material
  • the chemical bond of the organic heterocyclic compound is changed from a ground state (low energy level) by ultraviolet light irradiation. It forms a non-ground state (high energy level) and generates ions, and the process is a reversible chemical bond change; the organic heterocyclic compound of the final hydroxy-triazine can sufficiently absorb ultraviolet light to block ultraviolet light.
  • the protective layer 115 further includes a heat dissipation layer 1153 laminated with the energy absorbing layer 1151.
  • the energy input under the first condition includes heat, and the heat dissipation layer 1153 blocks heat transferred in the stacking direction of the flexible cover 11 and dissipates heat in a direction perpendicular to the stacking direction of the flexible cover 11.
  • the heat dissipation layer 1153 is located between the energy absorbing layer 1151 and the adhesion reducing layer 117 for heat dissipation to prevent excessive energy from entering the flexible module 13 and causing damage to the function/performance/structure of the flexible module 13.
  • the heat dissipation layer 1153 adopts heat conductive graphenes, thermal conductive adhesives, thermal conductive silicones, thermal conductive silicones, thermal conductive rubbers, and thermally conductive molybdenum sulfide to achieve lateral heat dissipation/heat transfer and longitudinal heat dissipation/heat transfer effects. Achieve two-dimensional plane heat dissipation, vertical direction insulation effect.
  • the longitudinal direction is the direction of the substantially vertical flexible cover panel 11, which is the direction of the substantially parallel flexible cover panel 11.
  • the protective layer 115 has two energy reducing layers of the energy absorbing layer 1151 and the heat dissipation layer 1153.
  • the energy absorbing layer 1151 functions as: one can regulate ultraviolet energy; the second can be used as a protective layer, and the heat dissipation layer 1153 can also serve as a protective layer.
  • the thermal excitation is used to reduce the viscosity
  • the heat dissipation layer 1153 serves as a protection; therefore, the energy absorption layer 1151 and the heat dissipation layer 1153 can form a double protection for the flexible module 13.
  • the energy absorbing layer 1151 can be disposed between the heat dissipation layer 1153 and the adhesion reducing layer 117.
  • the protective layer 115 includes at least one of the energy absorbing layer 1151 and the heat dissipation layer 1153, for example, only the heat dissipation layer 1153 is included.
  • the protective layer 115 can be disposed according to the performance of the adhesion reducing layer 117.
  • the adhesion reducing layer 117 is an infrared light reducing layer
  • the protective layer 115 is correspondingly disposed as a film capable of blocking infrared light to prevent infrared light from entering the protection layer.
  • the protective layer 115 may be provided as a heat-dissipating layer, and the like.
  • the flexible cover 11 further includes a shielding layer 119 formed on the side of the optical adhesive layer 114 away from the protective layer 115.
  • the shielding layer 119 is disposed on the edge region of the optical adhesive layer 114 to block the structure such as the wiring disposed on the edge region of the flexible module 13, thereby improving the appearance of the flexible member 10, thereby improving the user experience.
  • the patterned mask layer 119 is formed by applying ink to the optical adhesive layer 114, and the substrate 113 is formed on the optical adhesive layer 114 and the mask layer 119.
  • the shielding layer 119 can be made of other materials that are opaque or have a low light transmittance, and can achieve the purpose of shielding.
  • the ink can also be applied to the side of the substrate 113 away from the hard layer 111 to form the shielding layer 119.
  • the shielding layer 119 has a patterned shape and may be formed on the substrate 113 of the flexible cover 11 or may be formed on another film.
  • the flexible module 13 includes at least two functional layers 130 disposed in a stack, and the at least two functional layers 130 include a display functional layer 135 and a support layer 137.
  • the display function layer 135 includes a polarization layer 1351, a thin film transistor layer 1353, and an organic light-emitting layer 1355 which are sequentially stacked, wherein the polarization layer 1351 is disposed adjacent to the adhesion-reduction layer 117.
  • the at least two functional layers 130 further include a touch layer 131.
  • the touch layer 131 is disposed on a side of the display function layer 135 where the polarizing layer 1351 is away from the support layer 137.
  • the touch layer 131 and the adhesion reducing layer 117 are bonded together. In other words, the adhesion-reducing layer 117 is adhered between the touch layer 131 and the protective layer 115, and the side of the adhesion-preventing layer 117 away from the protective layer 115 is bonded to the touch layer 131.
  • the touch layer 131 is used to provide a touch input function.
  • the first condition for example, ultraviolet/infrared/laser irradiation
  • the first condition for example, ultraviolet/infrared/laser irradiation
  • the first condition for example, ultraviolet/infrared/laser irradiation
  • the first condition for example, ultraviolet/infrared/laser irradiation
  • the first condition for example, ultraviolet/infrared/laser irradiation
  • the hard cover layer 11 and the subtractive layer 117 are respectively disposed on both sides of the flexible cover 11 , in other words, one side of the flexible cover 11 has the characteristics of hardness, wear resistance, scratch resistance, and the other side has characteristics such as viscosity and flexibility.
  • the flexible cover plate 11 is resistant to bending while being provided with the required hardness, wear resistance, and scratch resistance, and also prolongs the service life of the flexible cover 11 and the flexible member 10.
  • the first condition for example, ultraviolet light/infrared light/laser irradiation/heating/pressurization/powering/magnetic addition, etc.
  • the flexible member 10 is conveniently replaced with the flexible cover 11. Further, the flexible cover 11 is provided with a protective layer 115 to prevent excessive energy entering the flexible module 13 from causing damage to the function/performance of the flexible module 13 during the process of providing energy to the adhesion reducing layer 117.
  • the adhesion-reducing layer 117 is attached after being attached or patterned on the entire surface.
  • the attachment shape of the adhesion reducing layer 117 may be the whole surface or the pattern, that is, the adhesion reducing layer 117 is at least partially bonded to the flexible module 13, for example, completely for the adhesion reducing layer 117.
  • the groove 1171 may be disposed through the entire adhesion reducing layer 117 or may not be disposed through the entire adhesion reducing layer 117. Forming the at least one groove 1171 by the adhesion-reducing layer 117 can improve the flexibility of the flexible cover sheet 11.
  • a second embodiment of the present invention provides a flexible member 20 including a flexible cover 21 and a flexible module 23 bonded to the flexible cover 21.
  • the structure of the flexible cover 21 is substantially the same as that of the flexible cover 11 provided by the first embodiment.
  • the flexible cover 21 includes a hard layer 211, a base material 213, a protective layer 215, and a reduced adhesion layer 217 which are sequentially laminated. The difference is that the flexible cover 21 omits the optical adhesive layer, and the protective layer 215 is directly in contact with the substrate 213, thereby reducing the thickness of the flexible cover 21.
  • the material of the substrate 213 includes polyethylene terephthalate, polymethyl methacrylate, polyimide, cycloolefin polymer, polymethyl methacrylate, epoxy resin compound, organic alcohol ester and A mixture such as an inorganic amine or the like to ensure that the flexible cover 21 has sufficient strength and hardness.
  • the protective layer 215 is a heat dissipation layer, which realizes lateral heat dissipation by using heat conductive graphenes, thermal conductive adhesives, thermal conductive silicones, thermal conductive silicones, thermally conductive rubbers, and thermally conductive molybdenum sulfide. Heat transfer, longitudinal heat dissipation / heat transfer effect, two-dimensional plane heat dissipation, vertical direction insulation effect.
  • the flexible cover plate 21 further includes a shielding layer 219 formed on the protective layer 215 away from the adhesion reducing layer 217.
  • a third embodiment of the present invention provides a flexible member 30 including a flexible cover 31 and a flexible module 33 .
  • the flexible cover 31 is adhered to the flexible module 33 for protecting the flexible module 33.
  • the flexible cover 31 includes a hard layer 311 and a reduced adhesion layer 317 which are sequentially stacked.
  • the adhesion-reducing layer 317 includes a laminated base layer 3171 and a glue layer 3173.
  • the adhesion-reducing layer 317 is a single-sided glue
  • the hard layer 311 is formed on the base layer 3171 away from the glue layer 3173. side.
  • the adhesion-reducing layer 317 can be a double-sided adhesive layer, and the hard layer 311 is directly disposed on one of the adhesive surfaces of the adhesion-reducing layer 317.
  • the flexible module 33 includes a protective layer 331 and a functional layer 333 which are stacked.
  • the glue layer 3173 is bonded to the side of the protective layer 331 away from the functional layer 333.
  • the protective layer 331 serves to prevent excessive energy from entering the functional layer 333 and causing damage to the functional layer 333.
  • the function layer 333 may include a touch layer, a display function layer, a support layer, and the like which are stacked in a stack, and are not described herein.
  • the flexible cover 31 is provided only with the hard layer 311 and the adhesive layer 317, thereby reducing the thickness of the flexible cover 30.
  • the flexible cover 31 has a certain hardness, wear resistance, scratch resistance, and facilitates the replacement of the flexible cover 31 by the flexible member 30, and the protective layer 331 is disposed on the side of the flexible module 33 adjacent to the flexible cover 31. Excessive energy enters the functional layer 333 and causes damage to the functional layer 333.
  • the flexible cover 31 is only provided with the hard layer 311 and the adhesive layer 317, and the flexible layer is provided.
  • the protective layer 331 is disposed on the flexible module 33, which is beneficial to the flexible cover 31 being attached to the flexible module 33. The flatness of the time to avoid the generation of air bubbles.
  • the flexible module 33 further includes a shielding layer 339.
  • a shielding layer 339 is formed on an edge region of the protective layer 331 away from the side of the flexible cover 31.
  • the shielding layer 339 is disposed corresponding to the edge region of the functional layer 333 to block the structure of the flexible module 33, and the flexible member is improved. The appearance of 30, thereby improving the user experience.
  • the shielding layer 339 is formed by applying ink to the edge region of the protective layer 331 away from the side of the flexible cover 31.
  • a fourth embodiment of the present invention provides a flexible component 40 that includes a flexible cover 41 and a flexible module 43 .
  • the flexible cover 41 is adhered to the flexible module 43 for protecting the flexible module 43.
  • the flexible cover 41 includes a hard layer 411, and the flexible module 43 includes a laminated adhesive layer 431 and a functional layer 433.
  • the adhesion reducing layer 431 is formed on the functional layer 433.
  • the flexible cover 41 is bonded to the flexible module 43 by the adhesion-reducing layer 431.
  • the adhesive layer 431 is disposed on the flexible module 43 to reduce the thickness of the flexible cover 41.
  • the functional layer 443 may include at least one of a touch layer, a display function layer, a support layer, and an optical adhesive layer.
  • the flexible module 43 further includes a shielding layer 439.
  • the occlusion layer 439 is formed in an edge region of the side of the adhesion-preventing layer 431 away from the flexible cover 41. In other words, the occlusion layer 439 is disposed corresponding to the edge region of the functional layer 433.
  • the flexible cover 41 further includes a substrate 413.
  • the hard layer 411 is formed on the substrate 413. It can be understood that the substrate 413 can be replaced with at least the optical adhesive layer and the protective layer. One.
  • a fifth embodiment of the present invention provides a flexible member 50 including a flexible cover 51 and a flexible module 53 .
  • the flexible display cover 51 includes a laminated substrate 511 and a reduced adhesion layer 513 .
  • the flexible module 53 includes a protective layer 530 and at least one functional layer 531.
  • the at least one functional layer 531 includes a first optical adhesive layer 533, a touch layer 534, a second optical adhesive layer 535, and a display functional layer 537 which are sequentially stacked.
  • the protective layer 530 is bonded to the adhesion reducing layer 513.
  • each layer of the flexible cover 51 the thickness of the protective layer 530 in the flexible module 53, and the thickness of each functional layer are set according to practical applications.
  • the adhesion-reducing layer 513 is an ultraviolet-viscosity layer capable of absorbing ultraviolet light of a certain wavelength, for example, a wavelength in the range of 200 to 400 nm.
  • the material of the adhesion reducing layer 513 includes a pressure sensitive adhesive.
  • the flexible module component of the pressure sensitive adhesive is a polyacrylate. When exposed to ultraviolet light, the polyacrylate decomposes, causing the debonding layer 513 to easily detach from the flexible module 53.
  • the ultraviolet light-reducing layer can be made of other acrylates, for example, an acrylate which can release nitrogen under ultraviolet light, that is, using a gas-producing stripping mechanism to reduce the viscosity-reducing layer 513. Adhesion force attached to the flexible module 53.
  • the protective layer 530 includes an ultraviolet light absorbing layer.
  • the material of the protective layer 530 includes PET.
  • PET has excellent mechanical properties and friction and wear properties.
  • reinforcing fibers such as ultraviolet absorbers
  • the heat resistance and ultraviolet light resistance of the PET are improved, thereby blocking excessive ultraviolet light from entering the underside of the protective layer 530.
  • adding different additives to PET, or blending PET with other materials for example, by blending to form a polymer alloy
  • improving the performance of PET and enhancing the required properties for example, heat dissipation performance, ultraviolet light resistance, Anti-infrared light performance, etc.
  • the material of the protective layer 530 includes at least one of PET, PI, COP, and PMMA to which reinforcing fibers are added.
  • the protective layer 530 can be set according to the performance of the adhesion reducing layer 513.
  • the adhesion reducing layer 513 includes an infrared light reducing layer
  • the protective layer 530 is correspondingly disposed as a film capable of blocking infrared light, avoiding infrared rays.
  • the light enters the structure on the underside of the protective layer 530; for example, in the application of the electric heating to the adhesion reducing layer 513, the protective layer 530 may be provided as a heat dissipation layer, and the like.
  • the flexible cover 51 further includes a release film layer 515.
  • the release film layer 515 covers the side of the adhesion-reduction layer 513 away from the substrate 511 for protecting the adhesion-reducing layer 513, thereby preventing the adhesive layer 513 from being removed when the flexible cover 51 is not attached to the flexible module 53 (for example, flexible)
  • the cover plate 51 When the cover plate 51 is not in use, it is contaminated, that is, adheres to other impurities, to avoid causing poor adhesion of the reduced-viscosity layer 513 and the flexible module 53, and to avoid affecting the use effect of the flexible member 50.
  • the flexible cover 51 further includes a hard layer 517 disposed on a side of the substrate 511 away from the adhesion-reducing layer 513.
  • the hard layer 517 can be formed by applying a hard coating material to the side of the substrate 511 away from the adhesion-reducing layer 513.
  • a hard layer 517 is formed on the side of the substrate 511 away from the adhesion-reducing layer 513 by a coating technique.
  • the coating technique may be a Roll to Roll Coating technique or a spin coating (Spin). Coating method, slit spin coating method, slit coating method, and the like.
  • the material of the hard layer 117 is an organic compound
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • a sputtering method, an ink jet printing method, a screen printing method, or the like can be employed.
  • the flexible cover 51 further includes a protective film layer 519 covering the side of the hard layer 517 away from the substrate 511 for protecting the hard layer 517, thereby avoiding the hard layer of the flexible cover 51.
  • 517 eg, when the flexible cover 51 is not in use
  • the flexible module 53 further includes a shielding layer 539 formed on an edge region of the protective layer 530 away from the side of the flexible cover 51 , and the shielding layer 539 is disposed around the first optical adhesive layer 533 .
  • the shielding layer 539 is formed by printing ink on the edge region of the protective layer 530 away from the side of the flexible cover 51.
  • the protective layer 530 and the shielding layer 539 can be well bonded together.
  • a thinning layer 513 is added to the flexible cover 51.
  • the adhesive layer 513 ensures that the flexible cover 51 can be easily peeled off from the flexible module 53.
  • a protective layer 530 is disposed on a side of the flexible module 53 adjacent to the flexible cover 51. The protective layer 530 avoids excessive energy entering the functional layer 531 on the lower side of the protective layer 530 during ultraviolet/infrared/laser illumination.
  • the protective layer 530 only transfers heat laterally under thermal excitation to avoid thermal longitudinal The transfer affects the performance and function of each functional layer 550, or causes damage to the structure of each functional layer 550. Further, in the process of peeling off the flexible cover 51 from the flexible module 53, the protective layer 530 can prevent the other functional layers 531 on the lower side of the protective layer 530 from being stuck by the adhesion-reducing layer 513 without being broken.
  • a sixth embodiment of the present invention provides a flexible member 60 including a flexible cover 61 and a flexible module 63 .
  • the flexible cover 61 is adhered to the flexible module 63 for protecting the flexible module 63.
  • the structure of the flexible cover 61 is substantially the same as that of the flexible cover 21 provided by the second embodiment.
  • the flexible cover 61 includes a hard layer 611, an optical adhesive layer 613, a protective layer 615, and a reduced adhesion layer 617 which are sequentially stacked. It is apparent that the flexible cover 61 is different from the flexible cover 21 in that the substrate 213 is replaced with an optical adhesive layer 613.
  • the flexible cover 61 has excellent bending properties and can reduce the cost of the flexible cover 61.
  • the flexible cover plate 61 further includes a shielding layer 619.
  • the shielding layer 619 is formed on a side of the protective layer 615 away from the adhesion reducing layer 617.
  • a seventh embodiment of the present invention provides a flexible member 70 including a flexible cover 71 and a flexible module 73 .
  • the flexible cover 71 is adhered to the flexible module 73 for protecting the flexible module 73.
  • the structure of the flexible cover 71 is substantially the same as that of the flexible cover 21 provided by the second embodiment.
  • the flexible cover 71 includes a hard layer 711, a protective layer 713, a substrate 715, and a reduced adhesion layer 717 which are sequentially stacked. It is apparent that the flexible cover 71 is different from the flexible cover 21 in that the substrate 715 is interposed between the protective layer 713 and the adhesion-preventing layer 717.
  • the flexible member 10 provided by the first embodiment of the present invention, the flexible member 20 provided by the second embodiment, the flexible member 30 provided by the third embodiment, the flexible member 40 provided by the fourth embodiment, and the flexibility provided by the fifth embodiment are integrated.
  • the discussion of the component 50, the flexible component 60 provided by the sixth embodiment, and the flexible component 70 provided by the seventh embodiment clearly shows that the adhesive layer can be disposed on the flexible cover or on the flexible module.
  • one of the flexible cover and the flexible module includes a release layer to adhere the flexible cover to the flexible module.
  • the protective layer can be disposed on the flexible cover plate or on the flexible module.
  • at least one of the flexible cover plate and the flexible module includes a protective layer to avoid excessive energy. Entering the flexible module affects the structure/function/performance of the flexible module, and thus the quality of the flexible component.
  • the adhesive layer is laminated with the protective layer, and the adhesive layer may be directly laminated with the protective layer, and the adhesive layer may also be combined with the protective layer.
  • Indirect stacking in other words, the adhesion reducing layer may be in direct contact with the protective layer, and the adhesion reducing layer may not be in contact with the protective layer.
  • the present invention further provides an electronic device 200 having a flexible component, which may be provided by the flexible component 10 provided by the first embodiment, the flexible component 20 provided by the second embodiment, and the third embodiment.
  • a flexible component which may be provided by the flexible component 10 provided by the first embodiment, the flexible component 20 provided by the second embodiment, and the third embodiment.
  • the device 200 can be a mobile phone, a tablet, a television, a reader, a navigator, a game console, or the like.
  • the present invention further provides a method for peeling off the flexible cover plate, which specifically includes the following steps:
  • Step 201 applying a first condition to a component having the flexible cover plate, providing energy to the adhesion-reducing layer of the component, and reducing adhesion of the adhesion-preventing layer, the first condition including ultraviolet light irradiation, infrared light At least one of irradiation, laser irradiation, application of an electric field, application of a force field, application of a magnetic field, and heating;
  • Step 202 peeling the flexible cover from the component.
  • the component is the flexible component
  • the flexible component comprises a flexible module as described above
  • the flexible cover is bonded to the flexible module by the flexible module.
  • the component may include a flexible cover and a rigid module, such as a rigid display module, or a rigid touch module, or a rigid display touch module or the like.
  • the adhesion of the viscosity-reducing layer is reduced from 0.1 to 3 kg/inch to 100 g/inch or less.
  • the “separating the flexible cover plate from the component” may be performed by a manual manual tear film and a machine automatic tear film, and the angle of the tear film of the flexible cover plate peeled off from the component is 10 In the range of ⁇ 80 degrees (more preferably 30-60 degrees), the flexible member is not damaged or partially left on the flexible member under the tear film condition.
  • the tear film speed at which the flexible cover sheet is peeled off from the member is in the range of 100 to 1000 mm/min (more preferably 300 to 600 mm/min).

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Abstract

一种柔性盖板、柔性部件及电子装置。柔性盖板包括设于一侧的硬质层及设于远离硬质层的另一侧的连接层。柔性盖板的一面具备硬度、耐磨、耐刮等特性。

Description

柔性盖板、柔性部件及电子装置 技术领域
本发明涉及柔性显示技术领域，特别涉及一种柔性盖板、柔性部件及电子装置。
背景技术
柔性显示装置是由柔性材料制成，其能够进行弯折绕曲，此外，柔性显示装置还具备低功耗、质量轻等特点，具有广泛的应用前景。柔性显示装置的显示面板包括作保护用的柔性盖板。然而，现有的柔性盖板的硬度、耐磨、耐刮特性不足，成为柔性显示技术发展的瓶颈之一。
发明内容
为解决上述问题，本发明实施例公开一种柔性盖板、柔性部件及电子装置。
一种柔性盖板，包括设于一侧的硬质层，及设于远离所述硬质层的另一侧的连接层。
进一步地，所述连接层包括用于减少黏附力的减黏层。
进一步地，所述减黏层的贴附形状可以是整面也可以是图案化。
进一步地，所述减黏层在满足第一条件时黏附力减小，在不满足所述第一条件时黏附力保持不变。
进一步地，所述第一条件包括紫外光照射、红外光照射、激光照射、施加电场、施加力场、施加磁场及加热的其中至少一种。
进一步地，所述柔性盖板还包括用于减少能量透过的保护层。
进一步地，所述保护层用于减少能量沿柔性盖板的堆叠方向透过。
进一步地，所述保护层夹设于所述减黏层与所述硬质层之间。
进一步地，所述保护层包括能量吸收层，第一条件下输入的能量经由所述保护层吸收。
进一步地，所述保护层包括添加有增强纤维的聚对苯二甲酸乙二醇酯。
进一步地，所述保护层包括散热层，第一条件下输入的能量包括热量，所 述散热层阻隔沿所述柔性盖板的堆叠方向传输的热量，并沿垂直于所述柔性盖板堆叠方向的方向散发热量。
进一步地，所述散热层的材质包括导热石墨烯类、导热粘合剂类、导热硅酯类、导热硅胶类、导热橡胶类、导热硫化钼类中的至少一种。
进一步地，所述能量吸收层的材质包括非晶硅类、氧化铟锡类、铟稼锌氧化物类、铝钛氧化物类、多孔硅胶类中的至少一种。
进一步地，所述能量吸收层内掺杂有机杂环化合物。
进一步地，所述柔性盖板还包括基材，所述基材夹设于所述硬质层与所述保护层之间。
进一步地，所述柔性盖板还包括遮挡层，所述遮挡层设于所述保护层远离所述减黏层一侧且是图案化形状，所述基材形成于所述遮挡层及所述保护层上。
进一步地，所述基材的材质包括聚对苯二甲酸乙二醇酯、聚酰亚胺、环烯烃聚合物、聚甲基丙烯酸甲酯、环氧树脂化合物、有机醇酯类与无机胺类等混合物中的至少一种。
进一步地，所述柔性盖板还包括光学胶层，所述光学胶层形成于所述硬质层与所述保护层之间。
进一步地，所述减黏层包括紫外减黏层、红外减黏层、激光减黏层、力减黏层、电减黏层、磁减黏层、热减黏层中的至少一种。
进一步地，所述硬质层包括丙烯酸酯类、聚对苯二甲酸乙二醇酯类、氮化钛、碳氮铝钛化合物、硫化钨中的至少一种。
进一步地，所述柔性盖板还包括离型膜层，所述离型膜层贴附于所述减黏层远离所述硬质层的一侧。
进一步地，所述柔性盖板还包括保护膜层，所述保护膜层贴附于所述硬质层远离所述连接层的一侧。
一种柔性部件，包括柔性模组及如上所述的柔性盖板，所述柔性盖板与所述柔性模组通过所述连接层黏接于一起。
进一步地，所述柔性模组包括层叠设置的至少两个功能层，所述至少两个功能层包括层叠设置的显示功能层及支撑层，所述显示功能层设于所述柔性模 组与所述连接层相邻的一侧。
进一步地，所述显示功能层包括依次层叠设置的偏振层、薄膜晶体管层及有机发光层，所述偏振层邻近所述连接层设置。
进一步地，所述至少两个功能层还包括触控层，所述触控层设于所述显示功能层远离所述支撑层的一侧并与所述连接层粘接于一起。
一种电子装置，包括如上所述的柔性部件。
本发明提供的柔性盖板、柔性部件及电子装置，由于柔性盖板的两侧分别设有硬质层与连接层，换句话说，柔性盖板的一面具备硬度、耐磨、耐刮等特性，使得柔性盖板具备符合要求的硬度、耐磨、耐刮的特性亦延长了柔性盖板的使用寿命。另外，在施加第一条件(例如紫外光/红外光/激光照射/加热/加压/加电/加磁等)下，减黏层粘附于柔性模组的黏附力下降，方便柔性部件更换柔性盖板。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明第一实施方式提供的柔性部件的剖面示意图。
图2为本发明一实施例提供的柔性部件的剖面示意图。
图3为本发明第二实施方式提供的柔性部件的剖面示意图。
图4为本发明第三实施方式提供的柔性部件的剖面示意图。
图5为本发明第四实施方式提供的柔性部件的剖面示意图。
图6为本发明第五实施方式提供的柔性部件的剖面示意图。
图7为图6中所述的柔性盖板附有离型膜层及保护膜层的示意图。
图8为本发明第六实施方式提供的柔性部件的剖面示意图。
图9为本发明第七实施方式提供的柔性部件的剖面示意图。
图10为具有柔性部件的电子装置的示意图。
图11为本发明实施方式提供的剥离方法的流程示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，本发明第一实施方式提供一种柔性部件10，柔性部件10包括柔性盖板11及柔性模组13。柔性盖板11贴附于柔性模组13上，用以保护柔性模组13。本实施方式中，柔性模组13为一柔性显示模组。在其他实施例中，柔性模组13可以为柔性触控模组或同时包括柔性显示模组和柔性触控模组。显然，柔性盖板13能够贴附于其他模组或结构上，例如刚性显示模组，或者刚性触控模组。在一些实施例中，所述柔性盖板11也可设置于手机、平板电脑等电子装置的后壳上，而作为后壳保护盖板。
柔性盖板11的一侧设有硬质层111，所述柔性盖板11远离所述硬质层111的另一侧设有连接层116。柔性盖板11与柔性模组13通过连接层116连接于一起。本实施方式中，所述连接层116包括减黏层117，柔性盖板11与柔性模组13通过减黏层117黏接于一起。在其他实施方式中，连接层116也可以为粘结层、支撑层等起连接作用的层。
在一实施例中，所述柔性盖板11还包括基材113、光学胶层114、保护层115中的至少一个，所述基材113、光学胶层114、保护层115中的至少一个夹设于所述硬质层111与所述减黏层117之间。所述硬质层111可以通过将硬性涂层材料涂覆于最远离所述减黏层117的一层结构上形成用以增强柔性盖板11的强度、硬度及耐磨性能。所述硬质层117包括丙烯酸酯类、聚对苯二甲酸乙二醇酯类等有机化合物，以及氮化钛、碳氮铝钛化合物、硫化钨等无机化合物。本实施例中，采用涂布(Coating)技术于基材113远离减黏层117的一侧形成硬质层111，其中，涂布技术可以是：滚轮(Roll to Roll Coating)技术、 旋涂(Spin coating)法，狭缝旋涂(Slit and Spin coating)法、狭缝式涂(Slit coating)法等。当所述硬质层117的材质为有机化合物时，可采用化学气相沉积(Chemical Vapor Deposition，CVD)技术、物理气相沉积(Physical Vapor Deposition，PVD)技术。当所述硬质层117的材质具有导电性时，可采用溅镀(Sputtering)法，喷墨印刷(Ink jet printing)法，丝网印刷(Screen printing)术等方式。
在如图1所示的具体实施例中，所述柔性盖板11包括依次层叠设置的硬质层111、基材113、光学胶层114、保护层115及连接层116。硬质层111通过将硬性涂层材料涂覆于基材113形成，用以增强柔性盖板11的强度、硬度及耐磨、耐刮等性能。
在其他实施例中，所述柔性盖板11可仅包括层叠设置于所述硬质层111与所述减黏层117之间的基材113及光学胶层114，或仅包括夹设于所述硬质层111与所述减黏层117之间的保护层115。显然，当所述柔性盖板11仅包括夹设于所述硬质层111与所述减黏层117之间的保护层115时，则所述硬质层111为通过将硬性涂层材料涂覆于保护层115上形成。基材113的材质包括聚对苯二甲酸乙二醇酯(Polyethylene terephthalate，简称PET)，可以理解，基材113包括PET、聚酰亚胺(Polyimide，PI)、环烯烃聚合物(Cyclo-olefin polymer，COP)、聚甲基丙烯酸甲酯(Poly Methyl Methacrylatemethacrylic Acid，PMMA)、环烯烃聚合物、聚甲基丙烯酸甲酯、环氧树脂化合物、有机醇酯类等有机化合物，以及薄化玻璃等无机材料。
保护层115用于减少能量透过。进一步地，保护层115用于减少能量沿柔性盖板11的堆叠方向透过。所述堆叠方向为所述柔性盖板11各层结构的堆叠方向，在本实施方式中，所述堆叠方向为硬质层111、基材113、光学胶层114、保护层115及减黏层117层叠设置的方向。保护层115通过光学胶层114粘接于基材113上，用于阻止过多能量进入柔性模组13，避免对柔性模组13的功能器件的功能/性能造成损坏。减黏层117粘接于柔性模组13与保护层115之间，用于将柔性盖板11粘附于柔性模组13。本实施方式中，柔性盖板11的厚度根据产品需求可制备不同厚度(柔性盖板优选厚度200μm及以下)，硬质层111和减黏层117的厚度根据产品需求制备不同厚度(柔性部件优选厚度 50μm及以下)。
所述减黏层117在满足第一条件时黏附力减小，在不满足所述第一条件时黏附力保持不变。施加所述第一条件，以向减黏层117提供能量，致使减黏层117粘附于柔性模组13上的黏附力下降，进而能够轻易从所述柔性模组13剥离所述减黏层117。本实施方式中，施加所述第一条件后，减黏层117粘附于柔性模组13上的黏附力从0.1～3kg/inch下降至100g/inch及以下，例如，8g/inch，36g/inch，确保能够轻易将柔性盖板11从柔性模组13剥离下来，剥离方式可采用人工手动撕膜以及机台自动撕膜，撕膜角度在10～80度(更优角度30～60度)范围内，撕膜速度在100～1000mm/min(更优速度300～600mm/min)范围内，在此撕膜条件下亦不会对柔性模组13造成任何损坏或部分残留于柔性模组13上。
施加所述第一条件为，将减黏层117置于光场(如紫外光/红外光/激光照射)中，减黏层117吸收一定能量，导致减黏层117粘附于柔性模组13上的黏附力下降；或者将减黏层117置于电场(施加电流电压，电产生热)中，减黏层117吸收一定能量，导致减黏层117粘附于柔性模组13上的黏附力下降；或者将减黏层117置于磁场(施加磁场，将磁场转变为电场，电场产生热)中，减黏层117吸收一定能量，导致减黏层117粘附于柔性模组13上的黏附力下降；或者力场，例如，减黏层117由一具粘性的压电材料制成，施力给所述压电材料时，所述压电材料会产生电压，即相当于向减黏层117施加电场，减黏层117吸收一定能量，导致减黏层117粘附于柔性模组13上的黏附力下降；又或者，对减黏层117进行加热，减黏层117吸收一定能量，导致减黏层117粘附于柔性模组13上的黏附力下降。所述第一条件包括紫外光照射、红外光照射、激光照射、施加电场、施加力场、施加磁场及加热的其中至少一种。
本实施方式中，减黏层117为紫外减黏层，其能够吸收一定波长的紫外光，例如200～400nm范围内的波长。具体的，本实施方式中，减黏层117的材质包括压敏胶(全称为压力敏感型胶黏剂，Pressure sensitive adhesion，简称PSA)制成。所述PSA的柔性模组成分为聚丙烯酸酯(俗称亚克力--acrylic)。所述聚丙烯酸酯为聚合物，当受到紫外光照射时，所述聚丙烯酸酯会发生分解，致使减黏层117的粘接界面黏附力大大降低，从而易脱离柔性模组13。
可以理解，所述紫外减黏层可以由其它丙烯酸酯类制成，例如，一种丙烯酸酯类在紫外光照射下能够释放氮气，即利用气体产生型的剥离机理，降低减黏层117粘附于柔性模组13上的黏附力。
可以理解，所述减黏层117包括掺杂有光响应超分子的丙烯酸酯类、硅胶类、橡胶类、聚氨酯类中的一种，所述减黏层117在受到紫外光照射后黏附力减小。可以理解，所述减黏层包括丙烯酸酯类、硅胶类、橡胶类、聚氨酯类中的一种，所述丙烯酸酯在受到紫外光照射后产生氮气而减小黏附力。
可以理解，减黏层117可以包括紫外减黏层、红外减黏层、激光减黏层、力减黏层、电减黏层、磁减黏层、热减黏层中的至少一种，减黏层117还可以选择其他在热力作用下黏附力降低的材料，热力可通过电转换、磁转换、力转换等方式实现。
进一步地，保护层115包括能量吸收层1151。第一条件下输入的能量经由所述能量吸收层1151吸收，例如，减少或降低紫外光/红外光/激光进入柔性模组13的能量，以减少对柔性模组13的功能/性能造成损坏。能量吸收层1151的材质包括非晶硅类、氧化铟锡类、铟稼锌氧化物类、铝钛氧化物类、多孔硅胶类等。例如，能量吸收层1151为非晶硅(α-Si)，由于非晶硅(α-Si)吸收能量(激光/紫外光照射)后转化成键能，促使原子间成键情况发生变化，致使材料性质发生改变以达到吸收层(吸收光/能量等)作用。
在一实施例中，所述能量吸收层1151包括添加有增强纤维的聚对苯二甲酸乙二醇酯化合物、环烯烃聚合物、聚甲基丙烯酸甲酯化合物中的一种。
在一实施例中，能量吸收层1151还可以由胶材料掺杂羟基苯三嗪之类的有机杂环化合物形成，此类有机杂环化合物的化学键经紫外光照射后从基态(低能级)变成非基态(高能级)并产生离子，且该过程是一个可逆化学键变化；最终羟基本三嗪的有机杂环化合物可充分吸收紫外光，达到阻隔紫外光作用。
进一步地，保护层115还包括与能量吸收层1151层叠设置的散热层1153。第一条件下输入的能量包括热量，所述散热层1153阻隔沿所述柔性盖板11的堆叠方向传输的热量，并沿垂直于所述柔性盖板11堆叠方向的方向散发热量。散热层1153位于能量吸收层1151与减黏层117之间用于散热，以避免过多能量进入柔性模组13，对柔性模组13的功能/性能/结构造成损坏。散热层1153 采用导热石墨烯类、导热粘合剂类、导热硅酯类、导热硅胶类、导热橡胶类、导热硫化钼类等，实现横向散热/传热，纵向不散热/传热的效果，实现二维平面散热，垂直方向隔热的效果。所述纵向为大致垂直柔性盖板11的方向，所述横向为大致平行柔性盖板11的方向。
由于保护层115具能量吸收层1151与散热层1153两个能量降低层。其中，使用紫外线照射进行减黏时，能量吸收层1151的作用：一，是可调控紫外线能量；二，是可作为保护层，散热层1153亦可作为保护层。使用热激发进行减黏时，散热层1153起到保护作用；因此能量吸收层1151和散热层1153可对柔性模组13形成双重保护。可以理解，可以将能量吸收层1151设置于位于散热层1153与减黏层117之间。
可以理解，保护层115包括能量吸收层1151与散热层1153中的至少其中之一，例如，仅包括散热层1153。保护层115可以依据减黏层117的性能进行设置，例如，若减黏层117为一红外光减黏膜层，则保护层115对应设置为一能够阻隔红外光的膜层，避免红外光进入保护层115下侧的结构中；又例如，在电加热对减黏层117进行减黏应用中，保护层115可以设置成散热层，等等。
进一步地，柔性盖板11还包括遮挡层119，遮挡层119形成于光学胶层114远离保护层115一侧。遮挡层119设于光学胶层114的边缘区域，以遮挡设置于柔性模组13边缘区域的走线等结构，提高柔性部件10的外观，进而提高用户的使用体验。本实施方式中，通过将油墨涂覆于光学胶层114形成图案化的遮挡层119，再于光学胶层114及遮挡层119上形成基材113。可以理解，遮挡层119可以由其他不透光的材质或是透光率很低的材质制成，能够达到遮挡的目的即可。可以理解，亦可以将油墨涂覆于基材113远离硬质层111一侧形成遮挡层119。换而言之，所述遮挡层119是图案化形状，可在柔性盖板11的基材113上形成，也可以在其他膜材上形成。
柔性模组13包括层叠设置的至少两个功能层130，所述至少两个功能层130包括显示功能层135及支撑层137。显示功能层135包括依次层叠设置的偏振层1351、薄膜晶体管层1353及有机发光层1355，其中，偏振层1351邻近减黏层117设置。
所述至少两个功能层130还包括触控层131。触控层131设于显示功能层 135的偏振层1351远离支撑层137的一侧。触控层131与减黏层117粘接于一起。换句话说，减黏层117粘接于触控层131与保护层115之间，减黏层117远离保护层115的一侧粘接于触控层131上。触控层131用以提供触控输入功能。
当柔性部件10在使用一段时间后，柔性盖板11因过多磨损、破裂、产生气泡等原因需进行更换时，向柔性部件10施加所述第一条件(例如紫外光/红外光/激光照射/加热/加压/加电/加磁等)提供能量，减黏层117吸收一定能量后，减黏层117粘附于柔性模组13上的黏附力下降，通过设备或人工将柔性盖板11从柔性模组13上剥离。再通过设备或人工将新的柔性盖板11贴附于柔性模组13上。
由于柔性盖板11两侧分别设有硬质层111与减黏层117，换句话说，柔性盖板11的一面具备硬度、耐磨、耐刮等特性，另一面具备粘性、柔性等特性，使得柔性盖板11在具备符合要求的硬度、耐磨、耐刮的特性的同时，又耐弯折，亦延长了柔性盖板11及柔性部件10的使用寿命。另外，在施加所述第一条件(例如紫外光/红外光/激光照射/加热/加压/加电/加磁等)下，减黏层117粘附于柔性模组13上的黏附力下降，方便柔性部件10更换柔性盖板11。进一步地，柔性盖板11设有保护层115，避免在提供能量给所述减黏层117的过程中过多能量进入柔性模组13对柔性模组13的功能/性能造成损坏。
所述减黏层117为整面贴附或图案化之后再贴附。换而言之，所述减黏层117的贴附形状可以是整面也可以是图案化，即所述减黏层117至少部分与柔性模组13粘接，例如，对于减黏层117完全覆盖触控层131上；或者，请参阅图2，减黏层117形成至少一个沟槽1171，即对减黏层117进行图案化。所述沟槽1171可以设置成贯穿整个减黏层117，也可以设置成不贯穿整个减黏层117。减黏层117形成至少一个沟槽1171能够提高所述柔性盖板11的柔性能力。
请参阅图3，本发明第二实施方式提供一种柔性部件20，包括柔性盖板21及与柔性盖板21粘接于一起的柔性模组23。柔性盖板21的结构大致与第一实施方式提供的柔性盖板11大致相同。柔性盖板21包括依次层叠设置的硬质层211、基材213、保护层215及减黏层217。区别在于，柔性盖板21省略 了光学胶层，保护层215直接与基材213接触，进而降低了柔性盖板21的厚度。基材213的材质包括聚对苯二甲酸乙二醇酯、聚甲基丙烯酸甲酯、聚酰亚胺、环烯烃聚合物、聚甲基丙烯酸甲酯、环氧树脂化合物、有机醇酯类与无机胺类等混合物等，以确保柔性盖板21具备足够的强度及硬度。本实施方式中，保护层215为一散热层，其通过采用导热石墨烯类、导热粘合剂类、导热硅酯类、导热硅胶类、导热橡胶类、导热硫化钼类等，实现横向散热/传热，纵向不散热/传热的效果，实现二维平面散热，垂直方向隔热的效果。
进一步地，柔性盖板21还包括形成于保护层215远离减黏层217上的遮挡层219。
请参阅图4，本发明第三实施方式提供一种柔性部件30，其包括柔性盖板31及柔性模组33。柔性盖板31粘附于柔性模组33上，用以保护柔性模组33。
柔性盖板31包括依次层叠设置的硬质层311及减黏层317。本实施方式中，减黏层317包括层叠设置的基体层3171及胶层3173，换句话说，减黏层317为一单面胶，硬质层311形成于基体层3171远离胶层3173的一侧。可以理解，减黏层317可以为一双面胶层，将硬质层311直接设于减黏层317的其中一胶面上。
柔性模组33包括层叠设置的保护层331及功能层333。胶层3173与保护层331远离功能层333的一侧粘接于一起。保护层331用于防止过多能量进入功能层333，而对功能层333造成损坏。功能层333可以包括层叠设置的触控层、显示功能层、支撑层等，在此不作赘述。
相较于第一实施方式提供的柔性部件10，第三实施方式提供的柔性部件30中，柔性盖板31仅设硬质层311及减黏层317，进而减小了柔性盖板30的厚度，但同时柔性盖板31具备一定硬度、耐磨、耐刮性能，且方便了柔性部件30更换柔性盖板31，将保护层331设置于柔性模组33邻近柔性盖板31的一侧能够阻止过多能量进入功能层333而对功能层333造成损坏。另外，柔性盖板31仅设硬质层311及减黏层317，其柔性能力较大，保护层331设置于柔性模组33上，有利于提高柔性盖板31贴附于柔性模组33上时的平整度，避免产生气泡。
进一步地，柔性模组33还包括遮挡层339。在保护层331远离柔性盖板 31一侧的边缘区域形成遮挡层339，换句话说，遮挡层339对应功能层333的边缘区域设置，以遮挡柔性模组33的走线等结构，提高柔性部件30的外观，进而提高用户的使用体验。本实施方式中，通过将油墨涂覆于保护层331远离柔性盖板31一侧的边缘区域形成遮挡层339。
请参阅图5，本发明第四实施方式提供一种柔性部件40，其包括柔性盖板41及柔性模组43。柔性盖板41粘附于柔性模组43上，用以保护柔性模组43。柔性盖板41包括硬质层411，柔性模组43包括层叠设置的减黏层431及功能层433。减黏层431形成于功能层433上。柔性盖板41通过减黏层431与柔性模组43粘接。将减黏层431设于柔性模组43上，有利于降低柔性盖板41的厚度。所述功能层443可以包括触控层、显示功能层、支撑层、光学胶层中的至少一种。
进一步地，柔性模组43还包括遮挡层439。在减黏层431远离柔性盖板41一侧的边缘区域形成遮挡层439，换句话说，遮挡层439对应功能层433的边缘区域设置。
进一步地，柔性盖板41还包括基材413，本实施方式中，硬质层411形成于所述基材413上，可以理解，可以将基材413替换为光学胶层、保护层中的至少一个。
请参阅图6，本发明第五实施方式提供一种柔性部件50，包括柔性盖板51及柔性模组53，柔性显示盖板51包括层叠设置的基材511及减黏层513。柔性模组53包括保护层530及至少一个功能层531。至少一个功能层531包括依次层叠设置的第一光学胶层533、触控层534、第二光学胶层535及显示功能层537。保护层530与减黏层513粘接于一起。
可以理解，柔性盖板51的各层厚度，柔性模组53中保护层530的厚度以及各功能层的厚度依据实际应用进行设置。
本实施方式中，减黏层513为紫外减黏层，其能够吸收一定波长的紫外光，例如200～400nm范围内的波长。具体的，本实施方式中，减黏层513的材质包括压敏胶。所述压敏胶的柔性模组成分为聚丙烯酸酯。当受到紫外光照射时，所述聚丙烯酸酯会发生分解，致使减黏层513易脱离柔性模组53。可以理解，所述紫外减黏层可以由其它丙烯酸酯类制成，例如，一种丙烯酸酯类其在紫外 光照射下能够释放氮气，即利用气体产生型的剥离机理，降低减黏层513粘附于柔性模组53上的黏附力。
保护层530包括一紫外光吸收层。本实施方式中，保护层530的材质包括PET。PET具有优越的力学性能和摩擦、磨损性能。通过于PET中添加增强纤维(如紫外吸收剂)，改善PET的耐热性及抗紫外光特性，进而阻挡过多紫外光进入保护层530下侧。可以理解，于PET添加不同的添加剂，或者将PET与其他材料进行共混(例如通过共混形成聚合物合金)，改善PET的性能，增强所需性能，例如，散热性能、抗紫外光性能、抗红外光性能等。可以理解，保护层530的材质包括添加有增强纤维的PET、PI、COP、PMMA中的至少一种。
可以理解，保护层530可以依据减黏层513的性能进行设置，例如，若减黏层513包括一红外光减黏膜层，则保护层530对应设置为一能够阻隔红外光的膜层，避免红外光进入保护层530下侧的结构中；又例如，在电加热对减黏层513进行减黏应用中，保护层530可以设置成散热层，等等。
在一实施例中，请参阅图7，柔性盖板51还包括离型膜层515。离型膜层515覆盖于减黏层513远离基材511的一侧，用于保护减黏层513，进而避免柔性盖板51未贴合于柔性模组53上时减黏层513(例如柔性盖板51未使用时)受到污染，即粘附其他杂质，避免造成减黏层513与柔性模组53贴合不良，以及避免影响柔性部件50的使用效果。
进一步地，柔性盖板51还包括硬质层517，硬质层517设于基材511远离减黏层513的一侧。本实施例中，可以通过将硬性涂层材料涂覆于基材511远离减黏层513的一侧形成硬质层517。本实施例中，采用涂布(Coating)技术于基材511远离减黏层513的一侧形成硬质层517，其中，涂布技术可以是滚轮(Roll to Roll Coating)技术、旋涂(Spin coating)法，狭缝旋涂(Slit and Spin coating)法、狭缝式涂(Slit coating)法等。当所述硬质层117的材质为有机化合物时，可采用、化学气相沉积(CVD)技术、物理气相沉积(PVD)技术。当硬质层117的材质具有导电性，可采用溅镀(Sputtering)法，喷墨印刷法(Ink jet printing)，丝网印刷术(Screen printing)等。
进一步地，柔性盖板51还包括保护膜层519，保护膜层519覆盖于硬质 层517远离基材511的一侧，用于保护硬质层517，进而避免柔性盖板51的硬质层517(例如柔性盖板51未使用时)受到磨损刮花，影响柔性部件50的外观。
进一步地，请再次参阅图6，柔性模组53还包括遮挡层539，遮挡层539形成于保护层530远离柔性盖板51一侧的边缘区域，遮挡层539环绕第一光学胶层533设置。本实施方式中，通过将油墨印刷于保护层530远离柔性盖板51一侧的边缘区域形成遮挡层539。保护层530与遮挡层539之间能够很好地结合于一起。
在柔性盖板51上增加一层减黏层513，此减黏层513保证柔性盖板51可以轻易从柔性模组53上剥离。此外，柔性模组53邻近柔性盖板51的一侧上增加设置保护层530，保护层530在紫外光/红外光/激光照射的过程，避免过多能量进入保护层530下侧的功能层531及结构，造成温度过高，影响各功能层550的性能及功能，或对各功能层550的结构造成损坏等；或者保护层530在热激发作用下，只将热量进行横向传递，避免热量纵向传递影响各功能层550的性能及功能，或对各功能层550的结构造成损坏等。进一步地，从柔性模组53剥离柔性盖板51的过程中，保护层530能够避免保护层530的下侧的其他功能层531被减黏层513粘连起而不被破坏。
请参阅图8，本发明第六实施方式提供一种柔性部件60，其包括柔性盖板61及柔性模组63。柔性盖板61粘附于柔性模组63上，用以保护柔性模组63。柔性盖板61的结构大致与第二实施方式提供的柔性盖板21大致相同。柔性盖板61包括依次层叠设置的硬质层611、光学胶层613、保护层615及减黏层617。显然，柔性盖板61与柔性盖板21的区别在于，将基材213替换为光学胶层613。柔性盖板61具备优良的弯折性能，且能够降低柔性盖板61的成本。
进一步地，柔性盖板61还包括遮挡层619。遮挡层619形成于保护层615远离减黏层617的一侧。
请参阅图9，本发明第七实施方式提供一种柔性部件70，其包括柔性盖板71及柔性模组73。柔性盖板71粘附于柔性模组73上，用以保护柔性模组73。柔性盖板71的结构大致与第二实施方式提供的柔性盖板21大致相同。柔性盖板71包括依次层叠设置的硬质层711、保护层713、基材715及减黏层717。 显然，柔性盖板71与柔性盖板21的区别在于，将基材715夹设于保护层713与减黏层717之间。
综合对本发明第一实施方式提供的柔性部件10、第二实施方式提供的柔性部件20、第三实施方式提供的柔性部件30、第四实施方式提供的柔性部件40、第五实施方式提供的柔性部件50、第六实施方式提供的柔性部件60及第七实施方式提供的柔性部件70的论述，显然可见，减黏层既可以设于柔性盖板，又可以设于柔性模组上，换句话说，所述柔性盖板及所述柔性模组中的其中之一包括减黏层，以将所述柔性盖板粘附于所述柔性模组。
可以理解，保护层可以设于柔性盖板，又可以设于柔性模组上，换句话说，所述柔性盖板及所述柔性模组中的至少其中之一包括保护层，避免过多能量进入所述柔性模组，而对所述柔性模组的结构/功能/性能等造成影响，进而柔性部件的品质。
综上，在所述柔性部件中，所述减黏层与所述保护层层叠设置，所述减黏层可以与所述保护层直接层叠设置，所述减黏层也可以与所述保护层间接层叠设置，换句话说，所述减黏层可以直接与所述保护层直接接触，所述减黏层也可以不与所述保护层接触。
请参阅图10，本发明还提供一种具柔性部件的电子装置200，所述柔性部件可以为第一实施方式提供的柔性部件10、第二实施方式提供的柔性部件20、第三实施方式提供的柔性部件30、第四实施方式提供的柔性部件40、第五实施方式提供的柔性部件50、第六实施方式提供的柔性部件60及第七实施方式提供的柔性部件70中的一种，电子装置200可以为手机、平板电脑、电视、阅读器、导航仪、游戏机等。
请参阅图11，本发明还提供一种上述柔性盖板剥离方法，具体包括以下步骤：
步骤201，对具所述柔性盖板的部件施加第一条件，向所述部件的减黏层提供能量，所述减黏层的黏附力下降，所述第一条件包括紫外光照射、红外光照射、激光照射、施加电场、施加力场、施加磁场及加热的其中至少一种；
步骤202，将所述柔性盖板从所述部件剥离。
其中，所述部件为上述柔性部件，所述柔性部件包括如上所述的柔性模组， 所述柔性盖板通过所述与所述柔性模组粘接。可以理解，在一实施例中，所述部件可以包括柔性盖板及刚性模组，例如，刚性显示模组，或者刚性触控模组，或者刚性显示触控模组等等。
其中，所述“所述减粘层的黏附力下降”中，所述减粘层的黏附力从0.1～3kg/inch下降至100g/inch及以下。
其中，所述“将所述柔性盖板从所述部件剥离”，剥离方式可采用人工手动撕膜以及机台自动撕膜，将所述柔性盖板从所述部件剥离的撕膜角度在10～80度(更优角度30～60度)范围内，在此撕膜条件下亦不会对所述柔性部件造成任何损坏或部分残留于所述柔性部件上。
进一步地，将所述柔性盖板从所述部件剥离的撕膜速度在100～1000mm/min(更优速度300～600mm/min)范围内。
以上所述是本发明的优选实施例，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (27)

  1. 一种柔性盖板，其特征在于，所述柔性盖板包括设于一侧的硬质层，及设于远离所述硬质层的另一侧的连接层。
  2. 如权利要求1所述的柔性盖板，其特征在于，所述连接层包括用于减少黏附力的减黏层。
  3. 如权利要求2所述的柔性盖板，其特征在于，所述减黏层为整面贴附或图案化之后再贴附。
  4. 如权利要求2所述的柔性盖板，其特征在于，所述减黏层在满足第一条件时黏附力减小，在不满足所述第一条件时黏附力保持不变。
  5. 如权利要求4所述的柔性盖板，其特征在于，所述第一条件包括紫外光照射、红外光照射、激光照射、施加电场、施加力场、施加磁场及加热的其中至少一种。
  6. 如权利要求1所述的柔性盖板，其特征在于，所述柔性盖板还包括用于减少能量透过的保护层。
  7. 如权利要求6所述的柔性盖板，其特征在于，所述保护层用于减少能量沿柔性盖板的堆叠方向透过。
  8. 如权利要求6所述的柔性盖板，其特征在于，所述保护层夹设于所述减黏层与所述硬质层之间。
  9. 如权利要求6所述的柔性盖板，其特征在于，所述保护层包括能量吸收层，第一条件下输入的能量经由所述保护层吸收。
  10. 如权利要求6所述的柔性盖板，其特征在于，所述保护层包括添加有增强纤维的聚对苯二甲酸乙二醇酯。
  11. 如权利要求6所述的柔性盖板，其特征在于，所述保护层包括散热层，第一条件下输入的能量包括热量，所述散热层阻隔沿所述柔性盖板的堆叠方向传输的热量，并沿垂直于所述柔性盖板堆叠方向的方向散发热量。
  12. 如权利要求11所述的柔性盖板，其特征在于，所述散热层的材质包括导热石墨烯类、导热粘合剂类、导热硅酯类、导热硅胶类、导热橡胶类、导热硫化钼类中的至少一种。
  13. 如权利要求9所述的柔性盖板，其特征在于，所述能量吸收层的材质包括非晶硅类、氧化铟锡类、铟稼锌氧化物类、铝钛氧化物类、多孔硅胶类中的至少一种。
  14. 如权利要求12所述的柔性盖板，其特征在于，所述能量吸收层内掺杂有机杂环化合物。
  15. 如权利要求6所述的柔性盖板，其特征在于，所述柔性盖板还包括基材，所述基材夹设于所述硬质层与所述保护层之间。
  16. 如权利要求15所述的柔性盖板，其特征在于，所述柔性盖板还包括遮挡层，所述遮挡层设于所述保护层远离所述减黏层一侧且是图案化形状，所述基材形成于所述遮挡层及所述保护层上。
  17. 如权利要求15所述的柔性盖板，其特征在于，所述基材的材质包括聚对苯二甲酸乙二醇酯、聚酰亚胺、环烯烃聚合物、聚甲基丙烯酸甲酯、环氧树脂化合物、有机醇酯类与无机胺类中的至少一种。
  18. 如权利要求6所述的柔性盖板，其特征在于，所述柔性盖板还包括光学胶层，所述光学胶层形成于所述硬质层与所述保护层之间。
  19. 如权利要求2-18项任意一项所述的柔性盖板，其特征在于，所述减黏层包括紫外减黏层、红外减黏层、激光减黏层、力减黏层、电减黏层、磁减黏层、热减黏层中的至少一种。
  20. 如权利要求1-18项任意一项所述的柔性盖板，其特征在于，所述硬质层包括丙烯酸酯类、聚对苯二甲酸乙二醇酯类、氮化钛、碳氮铝钛化合物、硫化钨中的至少一种。
  21. 如权利要求1-18项任意一项所述的柔性盖板，其特征在于，所述柔性盖板还包括离型膜层，所述离型膜层贴附于所述连接层远离所述硬质层的一侧。
  22. 如权利要求1-18项任意一项所述的柔性盖板，其特征在于，所述柔性盖板还包括保护膜层，所述保护膜层贴附于所述硬质层远离所述连接层的一侧。
  23. 一种柔性部件，其特征在于，包括柔性模组及如权利要求1-20项任意一项所述的柔性盖板，所述柔性盖板与所述柔性模组通过所述连接层黏接于 一起。
  24. 如权利要求23所述的柔性部件，其特征在于，所述柔性模组包括层叠设置的至少两个功能层，所述至少两个功能层包括层叠设置的显示功能层及支撑层，所述显示功能层设于所述柔性模组与所述连接层相邻的一侧。
  25. 如权利要求24所述的柔性部件，其特征在于，所述显示功能层包括依次层叠设置的偏振层、薄膜晶体管层及有机发光层，所述偏振层邻近所述连接层设置。
  26. 如权利要求24所述的柔性部件，其特征在于，所述至少两个功能层还包括触控层，所述触控层设于所述显示功能层远离所述支撑层的一侧并与所述连接层粘接于一起。
  27. 一种电子装置，其特征在于，所述电子装置包括如权利要求23-26项任意一项所述的柔性部件。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114578906A (zh) * 2022-03-16 2022-06-03 上海天马微电子有限公司 一种显示装置
US20220216448A1 (en) * 2021-01-05 2022-07-07 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display device
CN114900948A (zh) * 2022-04-25 2022-08-12 京东方科技集团股份有限公司 柔性电路板模组及其补强方法、显示装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113035067A (zh) * 2021-03-11 2021-06-25 京东方科技集团股份有限公司 柔性膜和显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872035A (zh) * 2010-06-18 2010-10-27 欧浦登(福建)光学有限公司 一种液晶屏的硬屏偏光板
US20120218503A1 (en) * 2011-02-25 2012-08-30 Chimei Innolux Corporation Display and method for manufacturing the same
JP2013069769A (ja) * 2011-09-21 2013-04-18 Ulvac Japan Ltd Ｔｆｔ基板の製造方法およびレーザーアニール装置
CN106954370A (zh) * 2017-04-10 2017-07-14 东莞市万丰纳米材料有限公司 散热手机盖板及其加工工艺
CN107545848A (zh) * 2017-08-25 2018-01-05 武汉华星光电半导体显示技术有限公司 柔性盖板及其制作方法、柔性oled显示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106339116B (zh) * 2015-07-11 2023-07-14 宸新科技(厦门)有限公司 触控面板及其制作方法
EP3293568A1 (en) * 2016-09-09 2018-03-14 Young Su Kim Display device having detachable layer and method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872035A (zh) * 2010-06-18 2010-10-27 欧浦登(福建)光学有限公司 一种液晶屏的硬屏偏光板
US20120218503A1 (en) * 2011-02-25 2012-08-30 Chimei Innolux Corporation Display and method for manufacturing the same
JP2013069769A (ja) * 2011-09-21 2013-04-18 Ulvac Japan Ltd Ｔｆｔ基板の製造方法およびレーザーアニール装置
CN106954370A (zh) * 2017-04-10 2017-07-14 东莞市万丰纳米材料有限公司 散热手机盖板及其加工工艺
CN107545848A (zh) * 2017-08-25 2018-01-05 武汉华星光电半导体显示技术有限公司 柔性盖板及其制作方法、柔性oled显示装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220216448A1 (en) * 2021-01-05 2022-07-07 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display device
US11997868B2 (en) * 2021-01-05 2024-05-28 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display device including buffer filled indented glass region
CN114578906A (zh) * 2022-03-16 2022-06-03 上海天马微电子有限公司 一种显示装置
CN114900948A (zh) * 2022-04-25 2022-08-12 京东方科技集团股份有限公司 柔性电路板模组及其补强方法、显示装置

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