WO2019176431A1 - Machine de traitement au laser et procédé de traitement au laser - Google Patents

Machine de traitement au laser et procédé de traitement au laser Download PDF

Info

Publication number
WO2019176431A1
WO2019176431A1 PCT/JP2019/005195 JP2019005195W WO2019176431A1 WO 2019176431 A1 WO2019176431 A1 WO 2019176431A1 JP 2019005195 W JP2019005195 W JP 2019005195W WO 2019176431 A1 WO2019176431 A1 WO 2019176431A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet metal
beam spot
laser
vibration
distance
Prior art date
Application number
PCT/JP2019/005195
Other languages
English (en)
Japanese (ja)
Inventor
山梨　貴昭
厚司 舟木
Original Assignee
株式会社アマダホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アマダホールディングス filed Critical 株式会社アマダホールディングス
Publication of WO2019176431A1 publication Critical patent/WO2019176431A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Definitions

  • the present disclosure relates to a laser processing machine and a laser processing method for processing a sheet metal with a laser beam.
  • Laser processing machines that manufacture a product having a predetermined shape by cutting a sheet metal with a laser beam emitted from a laser oscillator have become widespread.
  • the laser processing machine is configured to blow an assist gas from the nozzle to the sheet metal to discharge molten metal within the kerf width.
  • the laser processing machine cuts an acute corner of a product (cutting area), for example, 90 degrees or smaller, the cutting speed is reduced at the corner as described in Patent Document 1, or the corner is By making it a minute round shape, processing defects are prevented.
  • the laser processing machine changes the laser output and assist gas conditions in accordance with the reduction of the cutting speed. Even if the conditions of the laser output and the assist gas are changed, the direction of the kerf width changes at the corners. Therefore, the flow of the assist gas within the kerf width may be disturbed and the molten metal may not be discharged properly. Therefore, processing defects are likely to occur when the corners are cut.
  • One or more embodiments are due to disturbances in the flow of assist gas when cutting corners without reducing the cutting speed as much as possible at the corners of the region to be cut and without making the corners rounded.
  • An object of the present invention is to provide a laser processing machine and a laser processing method capable of reducing the occurrence of processing defects.
  • a processing head having a nozzle that emits a laser beam from an opening attached to a tip thereof is provided in the processing head, and the laser beam is focused to form a sheet metal
  • a focusing lens that forms a beam spot on the surface of the sheet metal
  • a moving mechanism that moves a relative position of the processing head with respect to the surface of the sheet metal, and the laser beam emitted from the opening.
  • a beam vibration mechanism that vibrates the beam spot on the surface of the sheet metal, and an assist gas supply that supplies an assist gas for spraying the sheet metal from the opening when the sheet metal is processed.
  • the relative position of the processing head is moved by an apparatus and the moving mechanism, and the sheet metal is irradiated with the laser beam.
  • a control device for controlling the beam vibration mechanism so as to vibrate the beam spot with a vibration pattern including a vibration component in a direction orthogonal to the cutting progress direction by a distance of.
  • the sheet metal is irradiated to irradiate a focused laser beam onto the surface of the sheet metal from an opening of a nozzle and cut a cut region having a corner from the sheet metal.
  • a beam spot formed on the surface of the substrate is moved along the edge of the region to be cut, and an assist gas is blown onto the sheet metal so as to discharge the molten metal melted by the movement of the beam spot, and the beam spot moves.
  • vibration including a vibration component in a direction orthogonal to the cutting progress direction at least for a first distance after the beam spot reaches the corner portion.
  • the corner portion is cut without reducing the cutting speed as much as possible at the corner portion of the region to be cut without making the corner portion into a round shape. Occurrence of processing defects due to disturbance of the assist gas flow can be reduced.
  • FIG. 1 is a diagram showing an overall configuration example of a laser processing machine according to one or more embodiments.
  • FIG. 2 is a perspective view illustrating a detailed configuration example of a collimator unit and a processing head in a laser processing machine according to one or more embodiments.
  • FIG. 3 is a diagram for explaining the displacement of the irradiation position of the laser beam on the metal plate by the beam vibration mechanism.
  • FIG. 4 is a diagram for explaining an operation when the laser processing machine according to one or more embodiments cuts a rectangular product from a sheet metal.
  • FIG. 5 is a diagram showing a cutting method when a corner portion of a product is cut by a normal laser processing method.
  • FIG. 6A is a diagram showing a parallel vibration pattern of a laser beam.
  • FIG. 6A is a diagram showing a parallel vibration pattern of a laser beam.
  • FIG. 6B is a diagram illustrating an orthogonal vibration pattern of a laser beam.
  • FIG. 6C is a diagram illustrating a circular vibration pattern of a laser beam.
  • FIG. 6D is a diagram showing an 8-shaped vibration pattern of a laser beam.
  • FIG. 6E is a diagram showing a C-shaped vibration pattern of the laser beam.
  • FIG. 6F is a diagram illustrating an inverted C-shaped vibration pattern of a laser beam.
  • FIG. 7 is a diagram showing an actual vibration pattern when the orthogonal vibration pattern shown in FIG. 6B is used.
  • FIG. 8 is a diagram illustrating a cutting method according to a first example of a laser processing method according to one or more embodiments when the region to be cut is a product having a corner.
  • FIG. 8 is a diagram illustrating a cutting method according to a first example of a laser processing method according to one or more embodiments when the region to be cut is a product having a corner.
  • FIG. 9 is a diagram illustrating a cutting method according to the second example of the laser processing method according to one or more embodiments when the region to be cut is a product having a corner.
  • FIG. 10 is a flowchart showing a cutting process of a product from a sheet metal by a laser processing machine and a laser processing method according to one or more embodiments.
  • FIG. 11 is a perspective view for explaining the operation when the laser beam machine forms a rectangular opening inside the sheet metal.
  • FIG. 12 is a cross-sectional view for explaining the operation when the laser beam machine forms a rectangular opening inside the sheet metal.
  • FIG. 13 is a diagram for explaining a problem that occurs when a normal laser beam machine forms a rectangular opening inside a sheet metal.
  • FIG. 14 is a diagram illustrating a cutting method according to the first example of the laser processing method according to one or more embodiments when the region to be cut is scrap having corners.
  • a laser processing machine 100 includes a laser oscillator 10 that generates and emits a laser beam, a laser processing unit 20, and a process fiber 12 that transmits the laser beam emitted from the laser oscillator 10 to the laser processing unit 20.
  • the laser processing machine 100 includes an operation unit 40, an NC device 50, a processing program database 60, a processing condition database 70, and an assist gas supply device 80.
  • the NC device 50 is an example of a control device that controls each part of the laser processing machine 100.
  • the laser oscillator 10 is preferably a laser oscillator that amplifies excitation light emitted from a laser diode and emits a laser beam having a predetermined wavelength, or a laser oscillator that directly uses a laser beam emitted from a laser diode.
  • the laser oscillator 10 is, for example, a solid laser oscillator, a fiber laser oscillator, a disk laser oscillator, or a direct diode laser oscillator (DDL oscillator).
  • the laser oscillator 10 emits a 1 ⁇ m band laser beam having a wavelength of 900 nm to 1100 nm.
  • the fiber laser oscillator emits a laser beam having a wavelength of 1060 nm to 1080 nm
  • the DDL oscillator emits a laser beam having a wavelength of 910 nm to 950 nm.
  • the laser processing unit 20 includes a processing table 21 on which a sheet metal W to be processed is placed, a portal X-axis carriage 22, a Y-axis carriage 23, a collimator unit 30 fixed to the Y-axis carriage 23, and a processing head 35.
  • the X-axis carriage 22 is configured to be movable in the X-axis direction on the processing table 21.
  • the Y-axis carriage 23 is configured to be movable in the Y-axis direction perpendicular to the X-axis on the X-axis carriage 22.
  • the X-axis carriage 22 and the Y-axis carriage 23 serve as a moving mechanism that moves the machining head 35 along the surface of the sheet metal W in the X-axis direction, the Y-axis direction, or any combination direction of the X-axis and the Y-axis. Function.
  • the position of the machining head 35 may be fixed and the sheet metal W may be moved.
  • the laser processing machine 100 only needs to include a moving mechanism that moves the processing head 35 relative to the surface of the sheet metal W.
  • the processing head 35 is provided with a nozzle 36 having a circular opening 36a at the tip and emitting a laser beam from the opening 36a.
  • the laser beam emitted from the opening 36 a of the nozzle 36 is applied to the sheet metal W.
  • the assist gas supply device 80 supplies nitrogen or air as an assist gas to the machining head 35.
  • the assist gas is blown onto the sheet metal W through the opening 36a.
  • the assist gas discharges molten metal within the kerf width in which the sheet metal W is melted.
  • the collimator unit 30 includes a collimation lens 31 that converts a diverging laser beam emitted from the process fiber 12 into parallel light (collimated light).
  • the collimator unit 30 includes a galvano scanner unit 32 and a bend mirror 33 that reflects the laser beam emitted from the galvano scanner unit 32 downward in the Z-axis direction perpendicular to the X-axis and the Y-axis.
  • the processing head 35 includes a focusing lens 34 that focuses the laser beam reflected by the bend mirror 33 and irradiates the sheet metal W.
  • the laser beam machine 100 is centered so that the laser beam emitted from the opening 36a of the nozzle 36 is positioned at the center of the opening 36a. In the reference state, the laser beam is emitted from the center of the opening 36a.
  • the galvano scanner unit 32 functions as a beam vibration mechanism that vibrates the laser beam emitted from the opening 36a after traveling through the machining head 35. How the galvano scanner unit 32 vibrates the laser beam will be described later.
  • the galvano scanner unit 32 includes a scan mirror 321 that reflects the laser beam emitted from the collimation lens 31 and a drive unit 322 that rotates the scan mirror 321 at a predetermined angle.
  • the galvano scanner unit 32 includes a scan mirror 323 that reflects the laser beam emitted from the scan mirror 321 and a drive unit 324 that rotates the scan mirror 323 at a predetermined angle.
  • the driving units 322 and 324 can reciprocate the scan mirrors 321 and 323 in a predetermined angular range based on the control by the NC device 50, respectively.
  • the galvano scanner unit 32 vibrates the laser beam applied to the sheet metal W by reciprocally vibrating either or both of the scan mirror 321 and the scan mirror 323.
  • the galvano scanner unit 32 is an example of a beam vibration mechanism, and the beam vibration mechanism is not limited to the galvano scanner unit 32 having a pair of scan mirrors.
  • FIG. 3 shows a state in which one or both of the scan mirror 321 and the scan mirror 323 is tilted and the position of the laser beam applied to the sheet metal W is displaced.
  • a thin solid line bent by the bend mirror 33 and passing through the focusing lens 34 indicates the optical axis of the laser beam when the laser processing machine 100 is in the reference state.
  • the angle of the optical axis of the laser beam incident on the bend mirror 33 is changed by the operation of the galvano scanner unit 32 located in front of the bend mirror 33, and the optical axis is changed from the center of the bend mirror 33. Come off.
  • the incident position of the laser beam on the bend mirror 33 is the same before and after the operation of the galvano scanner unit 32.
  • the optical axis of the laser beam is displaced from the position indicated by the thin solid line to the position indicated by the thick solid line by the action of the galvano scanner unit 32. If the laser beam reflected by the bend mirror 33 is tilted at an angle ⁇ , the irradiation position of the laser beam on the sheet metal W is displaced by a distance ⁇ s.
  • the focal length of the focusing lens 34 is EFL (EffectiveEFocal Length)
  • the distance ⁇ s is calculated as EFL ⁇ sin ⁇ .
  • the galvano scanner unit 32 tilts the laser beam by an angle ⁇ in the direction opposite to the direction shown in FIG. 3, the irradiation position of the laser beam on the sheet metal W is displaced by a distance ⁇ s in the direction opposite to the direction shown in FIG. be able to.
  • the distance ⁇ s is a distance less than the radius of the opening 36a, and is preferably a distance equal to or less than the maximum distance with a distance obtained by subtracting a predetermined margin from the radius of the opening 36a as a maximum distance.
  • the NC apparatus 50 can vibrate the laser beam in a predetermined direction within the surface of the sheet metal W by controlling the drive units 322 and 324 of the galvano scanner unit 32. By oscillating the laser beam, the beam spot formed on the surface of the sheet metal W can be oscillated.
  • the laser beam machine 100 configured as described above cuts the sheet metal W with the laser beam emitted from the laser oscillator 10 to produce a product having a predetermined shape.
  • a product cut from the sheet metal W is an example of a region to be cut.
  • the laser processing machine 100 opens a piercing with a laser beam at a position outside the product 200 of the sheet metal W, and a predetermined outer periphery of the product from the piercing 201.
  • the straight approach 202 to the position of is cut.
  • the laser beam machine 100 cuts the sheet metal W along the outer periphery of the product 200 from the end of the approach 202 on the product 200 side.
  • the machining program database 60 stores a machining program for cutting the sheet metal W as shown in FIG.
  • the NC device 50 reads a machining program from the machining program database 60 and selects one of a plurality of machining conditions stored in the machining condition database 70.
  • the NC device 50 controls the laser processing machine 100 to cut the sheet metal W based on the read processing program and the selected processing conditions.
  • the laser processing machine 100 moves the beam spot Bs of the laser beam applied to the sheet metal W along the outer end portion 200e of the product 200 in the cutting progress direction indicated by the arrow.
  • a groove 203 having a kerf width K1 approximately the diameter of the beam spot Bs is formed.
  • the laser processing machine 100 bends the cutting progress direction by 90 degrees at the corner portion C1, and subsequently cuts the end portion 200e of the product 200. Immediately after the corner C1 bent in the cutting progress direction, the flow of the assist gas is disturbed, and processing defects are likely to occur.
  • 6A to 6F show examples of vibration patterns in which the NC apparatus 50 vibrates the laser beam by the galvano scanner unit 32.
  • FIG. 6A to 6F the cutting progress direction of the sheet metal W is the x direction, and the direction orthogonal to the x direction in the plane of the sheet metal W is the y direction.
  • the NC device 50 can select any vibration pattern in accordance with an operator instruction from the operation unit 40.
  • FIG. 6A to 6F show vibration patterns in a state where the machining head 35 is not moved in the x direction so that the vibration patterns can be easily understood.
  • FIG. 6A shows a vibration pattern in which the beam spot Bs is vibrated in the x direction in the groove 203 formed by the progression of the beam spot Bs.
  • the vibration pattern shown in FIG. 6A is referred to as a parallel vibration pattern. If the frequency that vibrates the beam spot Bs in the direction parallel to the cutting progress direction is Fx, and the frequency that vibrates in the direction orthogonal to the cutting progress direction is Fy, the parallel vibration pattern is a vibration pattern in which Fx: Fy is 1: 0. .
  • FIG. 6B is a vibration pattern for vibrating the beam spot Bs in the y direction.
  • the groove 203 has a kerf width K2 wider than the kerf width K1.
  • the vibration pattern shown in FIG. 6B is referred to as an orthogonal vibration pattern.
  • the orthogonal vibration pattern is a vibration pattern in which Fx: Fy is 0: 1.
  • FIG. 6C shows a vibration pattern for vibrating the beam spot Bs so that the beam spot Bs draws a circle.
  • the groove 203 has a kerf width K3 wider than the kerf width K1.
  • the vibration pattern shown in FIG. 6C is referred to as a circular vibration pattern.
  • the circular vibration pattern is a vibration pattern in which Fx: Fy is 1: 1.
  • FIG. 6D shows a vibration pattern that vibrates the beam spot Bs so that the beam spot Bs draws the numeral 8.
  • the groove 203 has a kerf width K4 wider than the kerf width K1 by oscillating the beam spot Bs in a figure-eight shape.
  • the vibration pattern shown in FIG. 6D will be referred to as an 8-shaped vibration pattern.
  • the figure 8 vibration pattern is a vibration pattern in which Fx: Fy is 2: 1.
  • FIG. 6E shows a vibration pattern that vibrates the beam spot Bs so that the beam spot Bs draws alphabet C.
  • the groove 203 has a kerf width K5 wider than the kerf width K1.
  • the vibration pattern shown in FIG. 6E is referred to as a C-shaped vibration pattern.
  • the C-shaped vibration pattern is a vibration pattern in which Fx: Fy is 2: 1.
  • FIG. 6F shows a vibration pattern in which the beam spot Bs vibrates so as to draw a reverse C in which the alphabet C is reversed left and right.
  • the groove 203 By vibrating the beam spot Bs in an inverted C shape, the groove 203 has a kerf width K6 wider than the kerf width K1.
  • the vibration pattern shown in FIG. 6F is referred to as an inverted C-shaped vibration pattern.
  • the inverted C-shaped vibration pattern is a vibration pattern in which Fx: Fy is 2: 1.
  • the vibration pattern is a vibration pattern obtained by adding a displacement in the cutting progress direction (x direction) to the vibration patterns shown in FIGS. 6A to 6F. It becomes.
  • the orthogonal vibration pattern shown in FIG. 6B as an example, the beam spot Bs vibrates in the y direction while moving in the x direction, so the actual orthogonal vibration pattern becomes a vibration pattern as shown in FIG.
  • the NC device 50 cuts the sheet metal W using any vibration pattern including a vibration component in the y direction as shown in FIGS. 6B to 6F.
  • the galvano scanner unit 32 is controlled.
  • FIG. 8 illustrates a cutting method according to a first example of a laser processing method according to one or more embodiments.
  • FIG. 8 shows a case where the corner C ⁇ b> 1 in FIG. 4 is cut as in FIG. 5.
  • the laser beam machine 100 moves the beam spot Bs irradiated to the sheet metal W along the end portion 200e of the product 200 in the cutting progress direction indicated by the arrow.
  • a groove 203 having a kerf width K1 approximately the diameter of the beam spot Bs is formed.
  • the laser beam machine 100 may vibrate the beam spot Bs with the parallel vibration pattern shown in FIG. 6A when cutting the periphery of the product 200 other than the corners.
  • the NC device 50 causes the galvano scanner unit 32 to start vibration of the laser beam in an orthogonal vibration pattern.
  • the laser processing machine 100 may immediately vibrate the scan mirror 321 and / or 323 with the maximum amplitude, or gradually increase the amplitude. And may be vibrated so that the maximum amplitude is obtained after a predetermined time.
  • the groove 203 has a kerf width K2 wider than the kerf width K1 by vibrating the laser beam in an orthogonal vibration pattern.
  • the laser beam machine 100 bends the cutting progress direction by 90 degrees at the corner C1, and subsequently cuts the outer periphery of the product 200.
  • the NC device 50 stops the vibration of the laser beam when the beam spot Bs reaches a position advanced by a predetermined distance L2 from the corner C1.
  • the NC device 50 may immediately return the scan mirror 321 and / or 323 to the reference angle to stop the vibration.
  • the vibration may be stopped by gradually decreasing the amplitude and returning to the reference angle after a predetermined time.
  • the diameter of the beam spot Bs is the tool width in the portion of the groove 203 with the kerf width K1.
  • the width of the kerf width K2 when the beam spot Bs is vibrated in the orthogonal vibration pattern is the tool width.
  • the NC device 50 forms the groove 203 having the kerf width K2, as in the case of forming the groove 203 having the kerf width K1, the center of the opening 36a is separated from the end portion 200e by a distance corresponding to the radius of the beam spot Bs.
  • the machining head 35 is moved so as to be positioned on the line indicated by the broken line. Then, the NC device 50 vibrates the beam spot Bs with the orthogonal vibration pattern by the galvano scanner unit 32 in order to form the groove 203 having the kerf width K2.
  • the kerf width can be changed only by the vibration of the laser beam by the galvano scanner unit 32. Accordingly, it is possible to realize a stable control system by suppressing excessive inertia vibration without generating displacement of the machining head 35.
  • the beam spot Bs is at a predetermined distance immediately before reaching the corner and immediately after the traveling direction of the beam spot Bs is bent at the corner. Due to the wide kerf width K2, the flow of the assist gas is hardly disturbed. Therefore, if the sheet metal W is cut according to the first example, the occurrence of processing defects can be reduced.
  • FIG. 9 illustrates a cutting method according to a second example of a laser processing method according to one or more embodiments.
  • the laser beam machine 100 starts the vibration of the laser beam with the orthogonal vibration pattern by the galvano scanner unit 32 while the beam spot Bs reaches the corner C1 and the cutting progress direction is bent.
  • the laser beam machine 100 may start vibration in an orthogonal vibration pattern after the beam spot Bs reaches the corner C1 and bends the cutting direction.
  • the laser beam machine 100 may start the vibration in the orthogonal vibration pattern by bending the cutting direction from the apex of the corner portion C1 after the beam spot Bs once passes the corner portion C1.
  • the laser beam machine 100 may be controlled to change to the tool diameter during or immediately after the corner C1 so as to obtain a kerf shape as shown in FIG.
  • the groove 203 has a kerf width K2 by a distance L2 from the corner C1.
  • the traveling direction of the beam spot Bs becomes a wide kerf width K2 at a predetermined distance immediately after being bent at the corner of the product 200.
  • the flow of the assist gas is not easily disturbed. Therefore, if the sheet metal W is cut according to the second example, the occurrence of processing defects can be reduced.
  • the first example is preferable because the first example can further reduce the disturbance of the flow of the assist gas and can further reduce the occurrence of processing defects. . Even in the second example, as compared with the cutting by the ordinary laser processing method shown in FIG. 5, the disturbance of the flow of the assist gas can be reduced and the occurrence of processing defects can be reduced.
  • the NC device 50 has a vibration pattern including a vibration component in a direction perpendicular to the cutting progress direction at least for the first distance (distance L2) after the beam spot Bs reaches the corner.
  • the galvano scanner unit 32 may be controlled to vibrate.
  • the NC device 50 vibrates the beam spot Bs including a vibration component in a direction orthogonal to the cutting progress direction. It is preferable to control the galvano scanner unit 32 so as to vibrate in a pattern.
  • the distances L1 and L2 are distances greater than or equal to the radius of the opening 36a of the nozzle 36.
  • the distance L1 and the distance L2 may be the same distance or different distances.
  • the distances L1 and L2 may be increased as the thickness of the sheet metal W is increased.
  • the amplitude of the vibration component in the direction orthogonal to the cutting progress direction of the beam spot Bs is preferably 1.6% or more of the sheet thickness of the sheet metal W.
  • FIG. 10 shows processing when the above-described first example is adopted. In FIG. 10, the processing of piercing and approach processing is omitted.
  • step S2 when the laser processing machine 100 starts the cutting process of the sheet metal W, the cutting of the outer periphery of the product is started based on the control by the NC device 50 in step S1.
  • the NC device 50 determines whether or not the cutting position has reached a position before the distance L1 from the corner of the product. If the cutting position has not reached the position before the distance L1 (NO), the NC device 50 returns the process to step S2.
  • the NC device 50 operates the galvano scanner unit 32 in step S3 to start the vibration of the laser beam in the y direction.
  • the vibration pattern in step S3 may be any one of the vibration patterns shown in FIGS. 6B to 6F.
  • the NC device 50 determines whether or not the cutting position has reached a position advanced by a distance L2 from the corner of the product in step S4. If the cutting position has not reached the position advanced by the distance L2 from the corner of the product (NO), the NC device 50 returns the process to step S3.
  • the NC device 50 stops the operation of the galvano scanner unit 32 in step S5, and the y direction of the laser beam End vibration to.
  • step S6 the NC device 50 determines whether the cutting of the outer periphery of the product has been completed. If the cutting of the outer periphery of the product has not been completed (NO), the NC device 50 returns the process to step S2. If the cutting of the outer periphery of the product has been completed (YES), the NC device 50 ends the cutting process of the product.
  • the laser processing machine 100 and the laser processing method according to one or more embodiments are also used in the following cases. Demonstrate the effect.
  • the laser processing machine 100 cuts the area 210 inside the sheet metal W with a laser beam, and the cut area. 210 may be dropped as scrap.
  • the area 210 which is scrap is another example of the area to be cut.
  • the region 210 when the region 210 is cut from the sheet metal W, a piercing is opened inside the region 210, the approach is cut from the pierce to any position at the end of the region 210, and then the region 210 is cut. What is necessary is just to cut
  • the cutting plate on which the scrap caught on the base material is not shown when the sheet metal W moves on the processing table 21. You may get caught in. Then, there is a risk that processing defects may occur or the base material may be scratched.
  • the laser processing machine 100 may cut the sheet metal W as shown in FIG. In FIG. 14, the laser processing machine 100 moves the beam spot Bs irradiated to the sheet metal W along the end 210 e of the region 210 in the cutting progress direction indicated by the arrow. Around the region 210, a groove 213 having a kerf width K1 approximately the diameter of the beam spot Bs is formed.
  • the NC device 50 causes the galvano scanner unit 32 to start oscillation of the laser beam in an orthogonal vibration pattern.
  • the galvano scanner unit 32 vibrates the beam spot Bs based on the control by the NC device 50 while keeping the distance from the end 210 e of the processing head 35 constant.
  • the groove 213 has a kerf width K2 wider than the kerf width K1.
  • the laser beam machine 100 bends the cutting progress direction by 90 degrees at the corner C1, and subsequently cuts the outer periphery of the product 200.
  • the NC device 50 stops the vibration of the laser beam when the beam spot Bs reaches a position advanced by a predetermined distance L2 from the corner C1.
  • the region 210 may be cut by the cutting method according to the second example shown in FIG.
  • the first or second example of the laser processing method according to one or more embodiments is used to cut the corner area 210 by cutting the scraped region 210 in order to form the opening 211 inside the sheet metal W. It is possible to reduce the occurrence of processing defects when cutting. Therefore, the possibility that scrap is caught on the base material can be reduced.
  • the corners can be obtained without reducing the cutting speed at the corners of the region to be cut, Occurrence of processing defects when cutting a part can be reduced.
  • the cutting speed may be reduced at the corner of the region to be cut, or the corner may be intentionally rounded. Even if the cutting speed is reduced at the corner, even if the corner is rounded, at the corner, the beam spot Bs is vibrated with a vibration pattern including a vibration component in a direction orthogonal to the cutting progress direction. If the kerf width formed on the sheet metal W is widened, it is within the scope of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

La machine de traitement au laser selon l'invention est dotée d'un mécanisme de vibration de faisceau permettant de faire vibrer un point de faisceau (Bs) sur une surface d'un métal en feuille (W). La machine de traitement au laser découpe à partir du métal en feuille (W) une région devant être découpée (produit 200) présentant une partie de coin (C1) tout en pulvérisant le métal en feuille (W) avec un gaz d'assistance. Un dispositif de commande commande le mécanisme de vibration de faisceau de manière à amener le point de faisceau (Bs) à vibrer sur au moins une première distance (distance L2) après que le point de faisceau (Bs) a atteint la partie de coin (C1) selon un motif de vibration incluant une composante de vibration dans une direction perpendiculaire à une direction de progression de découpe.
PCT/JP2019/005195 2018-03-12 2019-02-14 Machine de traitement au laser et procédé de traitement au laser WO2019176431A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018044109A JP6638011B2 (ja) 2018-03-12 2018-03-12 レーザ加工機及びレーザ加工方法
JP2018-044109 2018-03-12

Publications (1)

Publication Number Publication Date
WO2019176431A1 true WO2019176431A1 (fr) 2019-09-19

Family

ID=67906716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/005195 WO2019176431A1 (fr) 2018-03-12 2019-02-14 Machine de traitement au laser et procédé de traitement au laser

Country Status (2)

Country Link
JP (1) JP6638011B2 (fr)
WO (1) WO2019176431A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020085073A1 (fr) * 2018-10-22 2020-04-30 株式会社アマダホールディングス Machine à faisceau laser, procédé d'usinage par faisceau laser
EP3871826A4 (fr) * 2018-10-22 2021-12-29 Amada Co., Ltd. Machine à faisceau laser, procédé de réglage de conditions d'usinage et dispositif de commande pour machine à faisceau laser
CN114746206A (zh) * 2019-12-02 2022-07-12 株式会社天田集团 坐标图案文件制作装置、轨迹图案制作装置及激光加工机的控制方法
DE102022118284A1 (de) 2022-07-21 2024-02-01 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneidverfahren mit oszillierendem Laserstrahl
DE102022118281A1 (de) 2022-07-21 2024-02-01 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneidverfahren mit oszillierendem Laserstrahl und optimierter Schneidgaszufuhr
DE102022118283A1 (de) 2022-07-21 2024-02-01 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneidverfahren mit oszillierendem Laserstrahl

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112059432A (zh) * 2020-07-23 2020-12-11 马鞍山市中亚机床制造有限公司 激光切割与剪、折联合设备
DE102021005295A1 (de) 2021-10-25 2023-04-27 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zur Herstellung von Werkstückteilen mit angefasten Schnittkanten
JP7470764B1 (ja) * 2022-10-14 2024-04-18 株式会社アマダ レーザ加工機、レーザ加工方法、加工プログラム作成方法、及び加工プログラムの構成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09267187A (ja) * 1996-03-29 1997-10-14 Nippei Toyama Corp レーザ加工方法
JP2007021579A (ja) * 2005-06-17 2007-02-01 Nippon Steel Corp 倣いレーザビーム振動装置及びビーム振動レーザ加工装置
JP2011025272A (ja) * 2009-07-23 2011-02-10 Nippon Steel Corp レーザ切断装置及びレーザ切断方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09267187A (ja) * 1996-03-29 1997-10-14 Nippei Toyama Corp レーザ加工方法
JP2007021579A (ja) * 2005-06-17 2007-02-01 Nippon Steel Corp 倣いレーザビーム振動装置及びビーム振動レーザ加工装置
JP2011025272A (ja) * 2009-07-23 2011-02-10 Nippon Steel Corp レーザ切断装置及びレーザ切断方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020085073A1 (fr) * 2018-10-22 2020-04-30 株式会社アマダホールディングス Machine à faisceau laser, procédé d'usinage par faisceau laser
JP2020066011A (ja) * 2018-10-22 2020-04-30 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
EP3871826A4 (fr) * 2018-10-22 2021-12-29 Amada Co., Ltd. Machine à faisceau laser, procédé de réglage de conditions d'usinage et dispositif de commande pour machine à faisceau laser
US11666991B2 (en) 2018-10-22 2023-06-06 Amada Co., Ltd. Laser machining apparatus and laser machining method
US11975406B2 (en) 2018-10-22 2024-05-07 Amada Co., Ltd. Laser machining apparatus, method for setting machining conditions, and control device for laser machining apparatus
CN114746206A (zh) * 2019-12-02 2022-07-12 株式会社天田集团 坐标图案文件制作装置、轨迹图案制作装置及激光加工机的控制方法
CN114746206B (zh) * 2019-12-02 2024-03-19 株式会社天田集团 坐标图案文件制作装置、轨迹图案制作装置及激光加工机的控制方法
DE102022118284A1 (de) 2022-07-21 2024-02-01 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneidverfahren mit oszillierendem Laserstrahl
DE102022118281A1 (de) 2022-07-21 2024-02-01 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneidverfahren mit oszillierendem Laserstrahl und optimierter Schneidgaszufuhr
DE102022118283A1 (de) 2022-07-21 2024-02-01 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneidverfahren mit oszillierendem Laserstrahl

Also Published As

Publication number Publication date
JP2019155404A (ja) 2019-09-19
JP6638011B2 (ja) 2020-01-29

Similar Documents

Publication Publication Date Title
WO2019176431A1 (fr) Machine de traitement au laser et procédé de traitement au laser
JP6968294B2 (ja) レーザ加工機及びレーザ加工方法
WO2020008827A1 (fr) Dispositif d'usinage au laser et procédé d'usinage au laser
WO2020085279A1 (fr) Dispositif d'usinage laser et procédé d'usinage laser
WO2020036021A1 (fr) Machine de traitement par laser et procédé de traitement par laser
EP3766630B1 (fr) Machine de traitement au laser et procédé de traitement au laser
WO2020085073A1 (fr) Machine à faisceau laser, procédé d'usinage par faisceau laser
JP6643442B1 (ja) レーザ加工機及びレーザ加工方法
JP6638032B1 (ja) レーザ加工機及びレーザ加工方法
WO2020008833A1 (fr) Dispositif d'usinage au laser et procédé d'usinage au laser
WO2022202797A1 (fr) Dispositif d'usinage au laser et procédé d'usinage au laser
WO2019176292A1 (fr) Machine de traitement au laser et procédé de traitement au laser
WO2023085160A1 (fr) Procédé de traitement au laser et dispositif de traitement au laser
JP7291527B2 (ja) レーザ加工機及びレーザ加工方法
WO2023085156A1 (fr) Procédé de traitement laser et machine de traitement laser
WO2022244649A1 (fr) Dispositif d'usinage laser et procédé d'usinage laser
WO2020085074A1 (fr) Machine à faisceau laser, procédé de réglage de conditions d'usinage et dispositif de commande pour machine à faisceau laser
WO2020021924A1 (fr) Dispositif et procédé d'usinage par laser
WO2020045081A1 (fr) Dispositif d'usinage au laser et procédé d'usinage au laser

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19767244

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19767244

Country of ref document: EP

Kind code of ref document: A1