WO2019169783A1 - 可拉伸显示面板及其制造方法 - Google Patents

可拉伸显示面板及其制造方法 Download PDF

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Publication number
WO2019169783A1
WO2019169783A1 PCT/CN2018/091861 CN2018091861W WO2019169783A1 WO 2019169783 A1 WO2019169783 A1 WO 2019169783A1 CN 2018091861 W CN2018091861 W CN 2018091861W WO 2019169783 A1 WO2019169783 A1 WO 2019169783A1
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Prior art keywords
rigid
wire
pixel unit
sub
fence
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PCT/CN2018/091861
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English (en)
French (fr)
Inventor
刘会敏
邢汝博
韦冬
王建太
Original Assignee
昆山工研院新型平板显示技术中心有限公司
昆山国显光电有限公司
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Application filed by 昆山工研院新型平板显示技术中心有限公司, 昆山国显光电有限公司 filed Critical 昆山工研院新型平板显示技术中心有限公司
Priority to US16/503,497 priority Critical patent/US10707431B2/en
Publication of WO2019169783A1 publication Critical patent/WO2019169783A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display technologies, and in particular, to a stretchable display panel and a method of fabricating the same.
  • the display panel is a commonly used product in people's daily life.
  • the display panel is made of a rigid material such as glass, the size of the display panel is fixed, and the fragile structure is fragile, so the concept of a stretchable display panel has been proposed.
  • the existing stretchable display panel cannot effectively protect the pixel unit, and the pixel unit is easily broken during the stretching process, which causes the pixel unit to fail and affects the normal display of the display panel.
  • the technical problem to be solved by the present application is to provide a stretchable display panel and a manufacturing method thereof, which can effectively protect a pixel unit and avoid damage of a pixel unit caused by stretching.
  • a technical solution adopted by the present application is to provide a stretchable display panel comprising an elastic base layer and a plurality of array-distributed display units embedded in the elastic base layer, at least
  • the partial display unit includes a pixel unit and a rigid protective body, and the rigid protective body includes at least a rigid sidewall disposed on at least one side of the pixel unit.
  • a manufacturing method of a stretchable display panel comprising: forming a rigid substrate layer on a substrate; and etching the rigid substrate layer to form a rigid protection
  • the rigid protective body includes at least one rigid sidewall; a corresponding pixel unit is formed on one side of the rigid sidewall such that the pixel unit and its corresponding rigid protective body constitute the display unit; the elastic base layer is formed, and the elastic base layer is at least filled in the adjacent Between the display units.
  • the present application can embed or bend the display panel by embedding the display unit in the elastic base layer, and further, by setting in at least part of the display unit.
  • a pixel unit and a rigid protective body the rigid protective body at least comprising a rigid sidewall disposed on at least one side of the pixel unit, protected by a rigid sidewall in a thickness dimension of the pixel unit, and subjected to a tensile force or a bend in a thickness dimension The tension is applied to avoid damage to the pixel unit when the stretchable display panel is stretched or bent.
  • FIG. 1 is a cross-sectional structural view of a stretchable display panel of a first embodiment of the present application
  • FIG. 2 is a schematic top plan view of a stretchable display panel according to a second embodiment of the present application.
  • FIG. 3 is a cross-sectional view of the stretchable display panel of the second embodiment of the present application taken along line A-A of FIG. 2;
  • Figure 4 is a cross-sectional view of the stretchable display panel of the second embodiment of the present application taken along line B-B of Figure 3;
  • Figure 5 is a side elevational view showing the rigid protective body of the second embodiment of the present application.
  • FIG. 6 is a schematic top plan view of a stretchable display screen according to a third embodiment of the present application.
  • Figure 7 is a cross-sectional structural view taken along line C-C of Figure 6;
  • Figure 8 is a cross-sectional structural view taken along line D-D of Figure 6;
  • Figure 9 is a cross-sectional structural view of the E-E direction of Figure 6;
  • Figure 10 is a side elevational view showing the first and third rigid side walls in the third embodiment of the present application.
  • Figure 11 is a side elevational view showing the second rigid side wall and the fourth rigid side wall in the third embodiment of the present application.
  • FIG. 12 is a schematic flow chart of a first embodiment of a method for manufacturing a stretchable display panel of the present application
  • FIG. 13 is a schematic view showing a manufacturing process of a first embodiment of a method of manufacturing a stretchable display panel of the present application
  • FIG. 14 is a schematic flow chart of a second embodiment of a method of manufacturing a stretchable display panel of the present application.
  • 15 is a schematic view showing a manufacturing process of a second embodiment of a method of manufacturing a stretchable display panel of the present application.
  • FIG. 16 is a schematic flow chart of a third embodiment of a method of manufacturing a stretchable display panel of the present application.
  • FIG. 17 is a schematic view showing a part of a manufacturing process of a third embodiment of a method for manufacturing a stretchable display panel of the present application.
  • FIG. 18 is a schematic view showing another part of the manufacturing process of the third embodiment of the manufacturing method of the stretchable display panel of the present application.
  • FIG. 1 is a cross-sectional structural view of a stretchable display panel according to a first embodiment of the present application.
  • the stretchable display panel may include an elastic base layer 11 and a plurality of display units 12.
  • a plurality of display units 12 are embedded in the elastic base layer 11, and a plurality of display units 12 are distributed in an array.
  • the elastic base layer 11 has a first surface a and a second surface b which are parallel to each other.
  • the plurality of display units 12 are distributed in a matrix on a reference plane c parallel to the first surface a and the second surface b of the elastic base layer 11.
  • the reference plane c is located between the first surface a and the second surface b.
  • the first surface a is the upper surface of the elastic base layer 11
  • the second surface b is the lower surface of the elastic base layer 11.
  • each display unit 12 includes a pixel unit 121 and a rigid sidewall 122 disposed on one side of the pixel unit 121.
  • the rigid sidewalls 122 form a rigid protective body to protect the pixel cells.
  • only part of the display unit 12 may be disposed to include the pixel unit 121 and the rigid sidewall 122, and it is not necessary to set all of the display units of the stretchable display panel to include the pixel unit 121 and the rigid sidewall 122 This embodiment does not limit this.
  • the material of the rigid sidewall 122 may be PI (Polyimide, polyimide), PMMA (polymethyl methacrylate) or other rigid graphic materials.
  • the material of the elastic base layer 11 may be PDMS (polydimethylsiloxane), PU (polyurethane), TPE (thermoplastic elastomer) or other elastic or soft materials.
  • corresponding two rigid sidewalls may be respectively disposed on opposite sides of the pixel unit 121, or three corresponding rigid sidewalls may be respectively disposed on three sides of the pixel unit 121, or on the four sides of the pixel unit 121. Rigid sidewalls are provided.
  • the rigid sidewalls on the four sides may be connected to each other to form a rigid fence, as described in detail below.
  • the rigid sidewalls 122 are perpendicular to the first surface a and the second surface b of the resilient base layer 11. In other embodiments, the angle between the rigid sidewall 122 and the first surface a and the second surface b is between 60-90 degrees.
  • the stretchable display panel can be bent, stretched, etc., without being limited to stretching, and the rigid side wall 122 is perpendicular to the surface of the elastic base layer 11, which means the rigid side in the natural state in which the elastic base layer 11 is not deformed by external force.
  • the wall 122 is perpendicular to the surface of the elastic base layer 11.
  • the pixel unit 121 may be a light emitting layer, and the light emitting layer may be an LED (Light Emitting Diode), an OLED (Organic Light-Emitting Diode), or a Micro LED (Micro Light-Emitting Diode). Light-emitting diodes) or QLEDs (Quantum Dot Light Emitting Diodes) and the like.
  • the rigid sidewalls 122 located on at least one side of the pixel unit 121 are protected in the thickness dimension of the pixel unit 121 to withstand the tensile force or the bending tension in the thickness dimension to avoid the stretchable display.
  • the panel causes damage to the pixel unit when stretched or bent.
  • FIG. 2 is a schematic top view of a stretchable display panel according to a second embodiment of the present application
  • FIG. 3 is a view of the stretchable display panel of the second embodiment of the present application
  • FIG. 4 is a cross-sectional view of the stretchable display panel of the second embodiment of the present application taken along line BB of FIG. 3.
  • the stretchable display panel may include an elastic base layer 20, a plurality of display units 30, and wires 40.
  • a plurality of display units 30 are embedded in the elastic base layer 20, and a plurality of display units 30 are arranged in an array, and each display unit 30 includes a pixel unit 31 and a rigid protective body 32.
  • the display unit 30 may be arranged in a matrix on the same reference plane.
  • the display unit 30 may be arranged in a matrix on the same reference plane.
  • the rigid protective body 32 includes a rigid bearing wall 321 and four rigid side walls 322a, 322b, 322c, 322d.
  • the four rigid side walls 322a, 322b, 322c, 322d are connected to each other to form a rigid fence 322 surrounding the pixel unit 31.
  • the four rigid side walls 322a, 322b, 322c, 322d are a first rigid side wall 322a, a second rigid side wall 322b, a third rigid side wall 322c, and a fourth rigid side wall 322d, respectively.
  • the first rigid sidewall 322a is disposed opposite the third rigid sidewall 322c
  • the second rigid sidewall 322b is disposed opposite the fourth rigid sidewall 322d.
  • the first rigid side wall 322a, the second rigid side wall 322b, the third rigid side wall 322c, and the fourth rigid side wall 322d are connected end to end in sequence.
  • the first rigid sidewall 322a, the second rigid sidewall 322b, the third rigid sidewall 322c, and the fourth rigid sidewall 322d are each disposed perpendicular to a surface of the elastic substrate 20.
  • the rigid side walls 322a, 322b, 322c, 322d may be perpendicular to the upper or lower surface of the elastic base layer 20, and the rigid side walls 322a, 322b, 322c, 322d perpendicular to the elastic base layer 20 means that the elastic base layer 20 does not occur.
  • the rigid side walls 322a, 322b, 322c, 322d are perpendicular to the elastic base layer 20 in the natural state at the time of deformation.
  • the rigid sidewalls 322a, 322b, 322c, 322d may also be at other angles to the surface of the resilient base layer 20, without being limited to vertical.
  • the pixel unit 31 is at least partially housed in a space surrounded by the rigid receiving wall 321 and the rigid side walls 322a, 322b, 322c, 322d.
  • the rigid bearing wall 321 can be vertically bent and connected to the rigid side walls 322a, 322b, 322c, 322d, and the rigid bearing wall 321 and the rigid side walls 322a, 322b, 322c, 322d form an integrated box-like structure.
  • the pixel unit 31 is housed in the accommodating space of the box-like structure.
  • the rigid fence 322 around the pixel unit 31 can protect the pixel unit 31 in the thickness dimension of the stretchable display panel, and further provide the rigid bearing of the pixel unit 21 at the bottom of the pixel unit 31.
  • the wall 321 can protect the pixel unit 31 in two dimensions of the plane in which the panel of the display panel can be stretched, thereby achieving protection of the pixel unit 31 in three dimensions.
  • the pixel unit 31 can be protected from damage when the stretchable display panel is stretched in any one dimension or bent in any direction.
  • the pixel unit 31 is a light emitting layer, and single-sided passive display can be realized.
  • the luminescent layer can be an LED, an OLED, a MicroLED or a QLED.
  • the rigid sidewalls 322a, 322b, 322c, 322d are provided with a notch 323.
  • the wires 40 are connected from the outside of the rigid fence 322 to the corresponding pixel unit 31 through the notch 323.
  • a portion of the wire 40 outside the rigid fence 322 is embedded in the elastic base layer 20 and is disposed in a stretchable form.
  • the wire 40 is made of an elastic conductive material at least at a portion located outside the rigid fence 322.
  • the wires 40 may also be provided in other stretchable forms, for example, the portion of the wire 40 outside the rigid fence 322 is provided in a spirally extending shape and is made of a hard conductive material such as metal, which is also elastic
  • the stretchable form of the wire 40 is not limited to the various modes described above as long as it can be stretched.
  • a portion of the wire 40 located within the rigid fence 322 is disposed on a surface of the rigid carrier wall 321 adjacent to the pixel unit 31.
  • the portion of the wire 40 located in the rigid fence 322 may also be made of an elastic conductive material.
  • the elastic conductive material may be the same as the material of the portion of the wire 40 outside the rigid fence 322, thereby facilitating the integral molding of the wire 40 and facilitating the fabrication of the wire 40.
  • the specific fabrication process of the wires 40 may be a printing process or a photolithography process.
  • FIG. 5 is a schematic side view of the rigid protection body of the second embodiment of the present application.
  • the bottom of the notch 323 on the rigid side walls 322a, 322b, 322c, 322d is disposed flush with the surface of the rigid receiving wall 321 near the pixel unit 31, so that the wire 40 is in the rigid fence.
  • the 322 outer warp 323 remains flat as it extends into the rigid fence 322, avoiding the problem of wire breakage or poor reliability of the wire 40 when passing through the notch 323 when the wire 40 is formed.
  • the bottom of the notch 323 may also exceed a certain height of the surface of the rigid bearing wall 321 adjacent to the pixel unit 31, which is not limited in this embodiment of the present application.
  • the wire 40 includes a first wire 40a and a second wire 40b.
  • the number of the first wire 40a and the second wire 40b may be plural.
  • the plurality of first wires 40a are disposed in parallel with each other, and the plurality of second wires 40b are disposed in parallel with each other.
  • the first wire 40a may be perpendicular to the second wire 40b.
  • an insulating layer may be disposed between the first wire 40a and the second wire 40b.
  • Each of the rigid side walls 322a, 322b, 322c, 322d on each of the four sides of the pixel unit 31 is provided with a notch 323.
  • the first wire 40a is arranged in series with the pixel unit 31 arranged in a row, and the notch 323 on the opposite sides of the rigid fence 322 (for example, the first rigid sidewall 322a and the third rigid sidewall 322c) and the pixel respectively
  • the first electrode 311 of the unit 31 is connected.
  • the second wires 40b are arranged in series with the aligned pixel units 31, and the notches 323 on the remaining two opposite rigid sidewalls (for example, the second rigid sidewall 322b and the fourth rigid sidewall 322d) from the outside of the rigid fence 322 are respectively The second electrode 312 of the pixel unit 31 is connected.
  • one of the first electrode 311 and the second electrode 312 of the pixel unit 31 is a positive electrode, and the other is a negative electrode.
  • the pixel unit 31 is an OLED
  • one of the first electrode 311 and the second electrode 312 is the anode of the OLED
  • the other is the cathode of the OLED.
  • the wires to which the same type of electrodes are connected are disposed in parallel with each other, and the wires to which the different kinds of electrodes are connected are disposed to be perpendicular to each other, which can facilitate the design of the driving circuit of the display panel. It should be understood that, in other embodiments, all the wires may be disposed in parallel, which is not limited by the embodiment of the present application.
  • FIG. 6 is a schematic plan view of a stretchable display screen according to a third embodiment of the present application;
  • FIG. 7 is a cross-sectional structural view of the CC direction of FIG. 6 ;
  • 8 is a cross-sectional structural view in the DD direction of FIG. 6;
  • FIG. 9 is a cross-sectional structural view of the EE direction of FIG.
  • the stretchable display panel may include an elastic base layer 50, a plurality of display units 60, and wires 70.
  • a plurality of display units 60 are embedded in the elastic base layer 50, and a plurality of display units 60 are arranged in an array, and each display unit 60 includes a pixel unit 61 and a rigid protective body 62.
  • each display unit 60 includes a pixel unit 61 and a rigid protective body 62.
  • the rigid protective body 62 includes a rigid bearing wall 621 and four rigid side walls 622a, 622b, 622c, 622d.
  • the four rigid side walls 622a, 622b, 622c, 622d are connected to each other to form a rigid fence 622 surrounding the pixel unit 61.
  • the four rigid side walls 622a, 622b, 622c, 622d are a first rigid side wall 622a, a second rigid side wall 622b, a third rigid side wall 622c, and a fourth rigid side wall 622d, respectively.
  • the first rigid sidewall 622a is disposed opposite the third rigid sidewall 622c
  • the second rigid sidewall 622b is disposed opposite the fourth rigid sidewall 622d.
  • the first rigid sidewall 622a, the second rigid sidewall 622b, the third rigid sidewall 622c, and the fourth rigid sidewall 622d are connected end to end.
  • first rigid sidewall 622a, the second rigid sidewall 622b, the third rigid sidewall 622c, and the fourth rigid sidewall 622d are both disposed perpendicular to the surface of the elastic substrate 50.
  • first rigid sidewall 622a, the second rigid sidewall 622b, the third rigid sidewall 622c, and the fourth rigid sidewall 622d are both disposed perpendicular to the surface of the elastic substrate 50.
  • the rigid receiving wall 621 is coupled to the central portion of the rigid side walls 622a, 622b, 622c, 622d, thereby forming a first subspace S1 and a second subspace S2 separated by a rigid receiving wall 621.
  • the rigid bearing wall 621 is connected to the inner wall of the rigid fence 622 and is integrally formed with the rigid fence 622.
  • the rigid bearing wall 621 divides the space enclosed by the rigid fence 622 into the first subspace S1 and the second subspace S2. .
  • the rigid through wall 621 is provided with a first through hole H1 and a second through hole H2.
  • the pixel unit 61 includes a first sub-pixel unit 611 and a second sub-pixel unit 612, and the first sub-pixel unit 611 and the second sub-pixel unit 612 are respectively accommodated in the first subspace S1 and the second subspace S2.
  • the first sub-pixel unit 611 may be a light emitting layer
  • the second sub-pixel unit 612 may be a driving layer, such as a TFT (Thin Film Transistor) driving layer.
  • TFT Thin Film Transistor
  • the first sub-pixel unit 611 and the second sub-pixel unit 612 may be both light emitting layers.
  • the light emitting layer may be an LED, an OLED, a MicroLED, or a QLED.
  • the first sub-pixel unit 611 and the second sub-pixel unit 612 may adopt different types of light emitting layers. For example, the first sub-pixel unit adopts an OLED, and the second sub-pixel unit adopts a QLED.
  • the wire 70 includes a first wire 71, a second wire 72, a third wire 73, and a fourth wire 74.
  • FIG. 10 is a side view structural view of the first and third rigid side walls in the third embodiment of the present application
  • FIG. 11 is a second rigid side in the third embodiment of the present application.
  • the rigid fence 622 is provided with a plurality of notches 623 corresponding to the first wire 71, the second wire 72, and the third wire 73.
  • Each wire 70 corresponds to two rigid sidewalls 622a, 622b, 622c or 622d respectively located opposite to each other. Two notches 623 on the upper.
  • a portion of the first rigid side wall 622a on the upper side of the rigid receiving wall 621 is disposed away from the rigid receiving wall 621.
  • two notches 623 that penetrate the inside and outside of the rigid fence 622 A portion of the third rigid side wall 622c on the upper side of the rigid receiving wall 621 (ie, a portion of the third rigid side wall 622c at the side of the first sub-pixel unit 611) is provided with a rigid fence 622 facing away from the rigid receiving wall 621. Two notches 623 penetrating inside and outside.
  • a portion of the second rigid side wall 622b on the lower side of the rigid receiving wall 621 (ie, a portion of the second rigid side wall 622b on the side of the second sub-pixel unit 612) is provided with a rigid fence facing away from the rigid receiving wall 621.
  • Two notches 623 extending through the inside and outside of 622.
  • a portion of the fourth rigid side wall 622d located on the lower side of the rigid receiving wall 621 ie, a portion of the fourth rigid side wall 622d at the side of the second sub-pixel unit 612 is provided with a rigid fence facing away from the rigid receiving wall 621.
  • Two notches 623 extending through the inside and outside of 622.
  • each notch 623 is flush with the surface of the rigid receiving wall 621 adjacent the notch 623 to keep the corresponding wire 70 flat as it passes the notch 623.
  • the first wire 71 and the second wire 72 extend from the outside of the rigid fence 622 through the notch 623 into the first subspace S1. Portions of the first wire 71 and the second wire 72 located within the rigid fence 622 are all disposed on the rigid carrier wall 621.
  • the third wire 73 and the fourth wire 74 extend from the outside of the rigid fence 622 into the second subspace S2.
  • the first electrode P1 of the first sub-pixel unit 611 is connected to the first wire 71.
  • the second electrode P2 of the first sub-pixel unit 611 is connected to the third wire 73 via the first via hole H1.
  • the first electrode P3 of the second sub-pixel unit 612 is connected to the fourth wire 74.
  • the second electrode P4 of the second sub-pixel unit 612 is connected to the second wire 72 through the second via hole H2.
  • the first wire 71 is parallel to the second wire 72
  • the third wire 73 is parallel to the fourth wire 74
  • the first wire 71 is perpendicular to the third wire 73.
  • the first wire 71 is arranged in series with the first sub-pixel unit 611 arranged in a row, and passes from the outside of the rigid fence 622 through two opposite rigid sidewalls (for example, the first rigid sidewall 622a and the third rigid sidewall 622c)
  • the upper notch 623 is connected to the first electrode P1 of the first sub-pixel unit 611.
  • the second wire 72 is arranged in series with the second sub-pixel unit 612 arranged in a row, and is passed from the outside of the rigid fence 622 through two opposite rigid sidewalls (for example, the first rigid sidewall 622a and the third rigid sidewall 622c).
  • the notch 623 extends into the first sub-space S1, and the second wire 72 is connected to the second electrode P2 of the second sub-pixel unit 612 through the second via H2 disposed on the rigid carrier wall 621.
  • the second wire 72 is filled in the second via hole H2 while passing through the second via hole H2 and is connected to and electrically connected to the second electrode P4 of the second sub-pixel unit 612 in the second subspace S2.
  • the fourth wire 74 is arranged in series with the second sub-pixel unit 612 arranged in series, and passes through the gap 623 on the opposite rigid sidewalls (eg, the second rigid sidewall 622b and the fourth rigid sidewall 622d) from outside the rigid fence 622. It is connected to the first electrode P3 of the second sub-pixel unit 612.
  • the third wire 73 is arranged in series with the first sub-pixel unit 611 arranged in series, and passes through the gap 623 on the opposite rigid sidewalls (for example, the second rigid sidewall 622b and the fourth rigid sidewall 622d) from outside the rigid fence 622.
  • the third wire 73 is connected to the second electrode P2 of the first sub-pixel unit 611 through the first via hole H1 provided on the rigid carrier wall 621.
  • the third wire 73 is filled in the first via hole H1 and passes through the first via hole H1 and is connected to the second electrode P2 of the first sub-pixel unit 611 in the first sub-space S1 and is turned on.
  • the first electrode P1 and the second electrode P2 of the first sub-pixel unit 611 are one of a positive electrode and the other is a negative electrode.
  • one of the first electrode P3 and the second electrode P4 of the second sub-pixel unit 612 is a positive electrode and the other is a negative electrode.
  • one of the first electrode P3 and the second electrode P4 of the second sub-pixel unit 612 is a data line connection electrode and the other is a scan line connection electrode, for example, the second sub- One of the first electrode P3 and the second electrode P4 of the pixel unit 612 is the gate and the other is the drain.
  • the staggered arrangement of the wires in the same subspace can be avoided, and the insulating layer is added at the staggered position of the wires to insulate the wires.
  • the same kind of electrodes are further disposed. Parallel to each other facilitates the design of the peripheral drive circuit.
  • the plurality of wires may include a first wire, a second wire, a third wire, and a fourth wire, the first wire and the second wire extending from the outside of the rigid fence into the first subspace, and the third The wire and the fourth wire extend from the outside of the rigid fence into the second subspace, the first electrode of the first sub-pixel unit is connected to the first wire, and the second electrode of the first sub-pixel unit is connected to the second wire, the second sub- The first electrode of the pixel unit is connected to the third wire, and the second electrode of the second sub-pixel unit is connected to the fourth wire, the first wire is parallel to the third wire, and the second wire is parallel to the fourth wire, the first wire Vertical to the second wire.
  • the structures on the upper and lower sides of the rigid bearing wall are similar to the single layer structure (display unit 30) in the second embodiment, and will not be described herein.
  • the advantage of this arrangement is that there is no need to provide a through hole in the rigid bearing wall, and the wires connected by the same type of electrode are parallel, which can also achieve the effect of facilitating the design of the peripheral driving circuit.
  • the first sub-pixel unit 611 and the second sub-pixel unit 612 are both flush with or completely received in the rigid protection body 62, and do not exceed the first subspace S1 and the second subspace. S2, in this way, the first sub-pixel unit 611 and the second sub-pixel unit 612 can be prevented from being damaged by the force generated between the first sub-pixel unit 611 and the second sub-pixel unit 612 when the elastic base layer 50 is stretched.
  • the first sub-pixel unit 611 may exceed the first sub-space S1
  • the second sub-pixel unit 612 may exceed the second sub-pixel. Space S2.
  • each of the pixel units may further include a corresponding plurality of sub-pixel units, for example, each of the pixel units may include a red sub-pixel unit (R), a green sub-pixel unit (G), and a blue sub-pixel.
  • the unit (B), or each pixel unit may include a red sub-pixel unit (R), a green sub-pixel unit (G), a blue sub-pixel unit (B), and a white sub-pixel unit (W).
  • the two electrodes of the pixel unit or the sub-pixel unit are located in the same layer of the pixel unit. It should be understood that in other embodiments, the two electrodes of the pixel unit may also be located in different layers, in the pixel unit. When the electrodes are in different layers, the corresponding wires can be in different layers.
  • FIG. 12 is a schematic flow chart of a first embodiment of a method for manufacturing a stretchable display panel according to the present application
  • FIG. 13 is a manufacturing process of a first embodiment of a method for manufacturing a stretchable display panel of the present application.
  • the manufacturing method of the stretchable display panel may include the following steps:
  • Step S11 forming a rigid substrate layer on the substrate.
  • the rigid substrate layer 82 is formed on the substrate 81.
  • the rigid substrate layer 82 is made of a rigid material such as PI (Polyimide, polyimide), PMMA (polymethyl methacrylate) or other rigid materials. Graphical material.
  • Step S12 etching the rigid substrate layer to form a rigid protective body, the rigid protective body comprising at least one rigid sidewall.
  • the rigid substrate layer 82 is etched to form a rigid protective body 83.
  • the rigid protective body 83 includes a rigid sidewall 831.
  • the rigid protective body can include two or more rigid sidewalls.
  • the formed rigid protective bodies 83 may be distributed in a matrix on the substrate 81.
  • etching the rigid substrate layer 82 to form the rigid protective body 83 may include etching the rigid substrate layer 82 to form a plurality of rigid sidewalls corresponding to the four sides of the pixel unit formed in the subsequent step. A plurality of rigid sidewalls are connected to each other to form a rigid fence surrounding the pixel unit.
  • Step S13 forming corresponding pixel units on one side of the rigid sidewall such that the pixel unit and its corresponding rigid protective body constitute the display unit.
  • the corresponding pixel unit 84 is formed on the side of the rigid sidewall 831 such that the pixel unit 84 and its corresponding rigid protective body 83 constitute the display unit.
  • Step S14 forming an elastic base layer, the elastic base layer being at least filled between adjacent display units.
  • the elastic base layer 85 is formed, and the elastic base layer is filled at least between adjacent display units.
  • one portion of the elastic base layer 85 is filled between adjacent pixel units, and the other portion is located on the display unit, and the outer surface of the formed elastic base layer 85 is perpendicular to the rigid side wall 831.
  • Step S15 peeling off the substrate.
  • the substrate 81 is peeled off.
  • the manufacturing method of the stretchable display panel may further include:
  • Step S16 placing the exposed side of the elastic substrate on another substrate.
  • the exposed side of the elastic base layer 85 is placed on the other substrate 86.
  • Step S17 forming another elastic base layer on the display unit and the elastic base layer such that the elastic base layer and the other elastic base layer wrap the display unit.
  • another elastic base layer 87 is formed on the display unit and the elastic base layer 85 such that the elastic base layer 85 and the other elastic base layer 87 enclose the display unit.
  • the material of the elastic base layer 85 and the other elastic base layer 87 is an elastic material, and specifically may be PDMS (polydimethylsiloxane), PU (polyurethane), TPE (thermoplastic elastomer) or other elastic or soft. Material.
  • the surface of the other elastic base layer 87 formed may be perpendicular to the rigid side wall 831.
  • Step S18 peeling off another substrate.
  • the other substrate 86 is peeled off.
  • FIG. 14 is a flowchart of a second embodiment of a method for manufacturing a stretchable display panel of the present application
  • FIG. 15 is a manufacturing process of a second embodiment of a method for manufacturing a stretchable display panel of the present application. Schematic diagram.
  • the manufacturing method of the stretchable display panel may include the following steps:
  • Step S21 forming a rigid substrate layer on the substrate.
  • a rigid base material layer 91 is formed on the substrate 90.
  • the rigid substrate layer 91 is made of a rigid material such as PI (Polyimide, polyimide), PMMA (polymethyl methacrylate) or other rigid patternable material.
  • Step S22 etching a central region of one side of the rigid substrate layer facing away from the substrate, the etching depth is not greater than the thickness of the rigid substrate layer, so that the rigid substrate layer forms a groove away from the side of the substrate, and the peripheral wall of the groove Form a rigid fence.
  • the middle region of the side of the rigid substrate layer 91 facing away from the substrate 90 is etched to a depth not greater than the thickness of the rigid substrate layer 91 such that the rigid substrate layer 91 forms a recess 92 on the side opposite to the substrate 90.
  • the peripheral wall of the groove 92 forms a rigid fence 93.
  • the unetched portion of the bottom of the recess 92 forms a rigid wall 94.
  • the peripheral wall of the recess 92 is formed by a plurality of rigid side walls that are joined end to end to form a rigid fence 93.
  • the rigid substrate layer 91 outside the rigid fence 93 is also etched to a certain extent, the depth of the etching is the same as the depth of the groove 92, and the remaining portion forms the wire carrying layer 95, and the upper surface of the wire carrying layer 95 is The upper surface of the rigid wall 94 is flush.
  • Step S23 forming a notch on each of the rigid side walls of the rigid fence.
  • a notch 931 is formed on each of the rigid side walls of the rigid fence 93.
  • the other side views are similar to the A side view.
  • the bottom of the notch 931 is flush with the surface of the rigid carrier wall 94 away from the substrate 90.
  • Step S24 forming a first wire extending from the outside of the rigid fence through the notches on the opposite rigid side walls into the rigid fence.
  • a first wire 96 extending from the outside of the rigid fence 93 through the notch 931 on the opposite rigid side walls to the rigid fence 93 is formed on the wire carrying layer 95, the bottom of the notch 931, and the rigid receiving wall 94.
  • the first wire 96 can be stretched.
  • the material of the first wire 96 may be an elastic conductive material.
  • only the portion of the first wire 96 outside the rigid fence 93 may be made of an elastic wire material, and the portion located within the rigid fence 93. Made of hard conductive material.
  • Step S25 forming an insulating layer on a partial region of the first wire.
  • the insulating layer 97 is formed on a partial region of the first wire 96 so that the subsequently formed second wire 98 and the first wire 96 can be insulated from each other at overlapping positions.
  • Step S26 forming a second wire extending from the outside of the rigid fence through the gaps on the remaining two opposite rigid side walls into the rigid fence, and passing the second wire through the insulating layer.
  • the wire carrying layer 95, the bottom of the notch 931, and the rigid bearing wall 94 are formed with a second wire 98 extending from the outside of the rigid fence 93 through the notch 931 on the remaining two opposite rigid side walls to the rigid fence 93, and Two wires 98 pass over the insulating layer 97.
  • the second wire 98 is also stretchable, specifically similar to the first wire 96, except that the direction of the setting is different, and details are not described herein again.
  • Step S27 forming a pixel unit in the groove and connecting the first electrode of the pixel unit to the first wire and the second electrode to the second wire.
  • the pixel unit 99 is formed in the recess 92 and the first electrode of the pixel unit 99 is connected to the first wire 96 and the second electrode is connected to the second wire 98.
  • the pixel unit 99 may be a light emitting layer, and the light emitting layer may specifically be an LED, an OLED, a MicroLED, or a QLED.
  • the first electrode and the second electrode are not shown in the figure.
  • Step S28 pouring at least a portion of the elastic base layer between the pixel unit and the rigid fence.
  • the at least partially elastic base layer 100 is cast on the pixel unit 99 and the wire carrying layer 95, and the elastic base layer 100 defining the portion is the first sub-elastic base layer 100.
  • Step S29 the substrate is peeled off, and the exposed side of the elastic base layer is placed on the other substrate.
  • the exposed side of the elastic base layer 100 is placed on the other substrate 101.
  • Step S30 etching and removing the wire bearing layer, and forming a second sub-elastic base layer on the first sub-elastic base layer on the side of the rigid bearing wall away from the pixel unit.
  • the wire carrier layer 95 is etched away, and the second sub-elastic substrate 102 is formed on the first sub-elastic substrate 100 on the side of the rigid carrier wall 94 away from the pixel unit 99.
  • the first sub-elastic base layer 100 and the second sub-elastic base layer 102 constitute a complete elastic base layer, and the first wire 96 and the second wire 98 are wrapped in the elastic base layer.
  • Step S31 peeling off another substrate.
  • the other substrate 101 is peeled off.
  • This embodiment corresponds to the structure of the second embodiment of the above-mentioned stretchable display panel.
  • This embodiment corresponds to the structure of the second embodiment of the above-mentioned stretchable display panel.
  • FIG. 16 is a flowchart of a third embodiment of a method for manufacturing a stretchable display panel of the present application.
  • FIG. 17 is a third embodiment of a method for manufacturing a stretchable display panel of the present application.
  • FIG. 18 is a schematic view showing another part of the manufacturing process of the third embodiment of the manufacturing method of the stretchable display panel of the present application.
  • the manufacturing method of the stretchable display panel may include the following steps:
  • Step S41 forming a rigid substrate layer on the substrate.
  • a rigid base material layer 201 is formed on the substrate 200.
  • the rigid substrate layer 201 is made of a rigid material such as PI (Polyimide, polyimide), PMMA (polymethyl methacrylate) or other rigid patternable material.
  • Step S42 etching a central region of one side of the rigid substrate layer facing away from the substrate, the etching depth is not greater than the thickness of the rigid substrate layer, so that the rigid substrate layer forms a first groove on a side opposite to the substrate, first The peripheral wall of the groove forms a rigid fence.
  • the middle region of the side of the rigid substrate layer 201 facing away from the substrate 20 is etched to a depth not greater than the thickness of the rigid substrate layer 201, such that the rigid substrate layer 201 forms a first groove on a side opposite to the substrate. 202.
  • the peripheral wall of the first recess 202 forms a first sub-rigid fence 203 of the rigid fence.
  • the rigid substrate layer other than the first rigid fence 203 is also etched to a certain depth, and the remaining load-bearing portion is used to carry the subsequently formed wires.
  • Step S43 forming four first notches on the first sub-rigid fence.
  • two first notches 204 are respectively formed on the opposite two rigid side walls of the first sub-rigid fence 203.
  • Step S44 forming a first wire and a second wire extending from the outside of the first sub-rigid fence through the first notch into the first groove.
  • the first wire 205 is parallel to the second wire (not shown).
  • the first wire 205 passes through two opposite first notches 204, and the second wire passes through the other two opposite first notches 204.
  • Step S45 forming a first sub-pixel unit in the first recess and connecting the first electrode of the first sub-pixel unit to the first lead.
  • the first sub-pixel unit 206 is formed in the first recess 202, and the first electrode 207 of the first sub-pixel unit 206, the second electrode (not shown) of the first sub-pixel unit 206, and the first recess are formed.
  • the bottom of 202 abuts.
  • Step S46 forming an elastic base layer between the adjacent first rigid fences and the first sub-pixel unit.
  • a portion 208 of the elastic base layer is formed between the adjacent first rigid fences and the first sub-pixel unit 206.
  • Step S47 peeling off the substrate, and providing another substrate on the exposed side of the elastic base layer after casting.
  • the substrate 200 is peeled off, and a part 208 of the cast elastic base layer is inverted and the exposed side is bonded to the other substrate 209.
  • Step S48 etching a middle portion of the rigid substrate layer opposite to the side of the other substrate to form a second groove not penetrating the bottom of the first groove groove, the peripheral wall of the second groove forming a rigid fence, the first concave A rigid bearing wall is formed between the groove and the second groove.
  • the middle portion of the side of the rigid substrate layer 201 facing away from the other substrate 209 is etched to form a second groove 210 that does not penetrate the groove bottom of the first groove 202, and the peripheral wall of the second groove 210 forms a rigid fence
  • the second sub-rigid fence 211 is a rigid bearing wall 213 between the first recess 202 and the second recess 210.
  • Step S49 forming four second notches on the second sub-rigid fence, and forming a first via hole and a second via hole on the rigid bearing wall.
  • second notches are formed on the second sub-rigid fence 211. It is not difficult to understand that the second position can be determined according to the positional relationship between the third wire and the fourth wire and the first wire and the second wire. The location of the gap. For details, refer to the description of the stretchable panel of the third embodiment. The related description of the first via and the second via can also be referred to the description of the corresponding embodiment above.
  • Step S50 forming a third wire and a fourth wire extending from the outside of the second sub-rigid fence through the second notch into the second groove.
  • the third wire and the fourth wire 212 are formed on the rigid substrate layer outside the bottom of the second groove 210 and the second sub-rigid fence 211.
  • Step S51 etching and removing the rigid substrate layer remaining outside the second sub-rigid fence.
  • Step S52 forming a second sub-pixel unit in the second recess.
  • the first electrode 207 of the first sub-pixel unit 206 is connected to the first wire 205, and the second electrode of the first sub-pixel unit 206 is connected to the third wire via the first via, and the first of the second sub-pixel unit 215
  • the second electrode 212 is connected to the fourth wire 212, and the second electrode of the second sub-pixel unit 215 is connected to the second wire through the second via.
  • the first wire 205 is parallel to the second wire, and the third wire is parallel to the fourth wire 212.
  • the first wire 205 is perpendicular to the third wire.
  • Step S53 forming an elastic base layer between the adjacent second sub-rigid fences and the second sub-pixel unit.
  • Step S54 peeling off another substrate.
  • the manufacturing method of this embodiment corresponds to the stretchable panel of the third embodiment of the present application, and a more specific description can be referred to the above description.
  • the present application is provided by including at least part of the display unit including a pixel unit and a rigid protective body, the rigid protective body including at least a rigid sidewall disposed on at least one side of the pixel unit, and the rigid sidewall in the pixel unit
  • the thickness dimension is protected against the tensile force in the thickness dimension to avoid damage of the pixel unit caused by stretching.

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Abstract

本申请公开了一种可拉伸显示面板及其制造方法，该可拉伸显示面板包括：弹性基层和嵌设在弹性基层内的多个阵列分布的显示单元，至少部分显示单元包括像素单元和刚性保护体，刚性保护体至少包括设置于像素单元的至少一侧的刚性侧壁。通过上述方式，能够有效地保护像素单元，避免拉伸导致的像素单元的损坏。

Description

可拉伸显示面板及其制造方法 技术领域
本申请涉及显示技术领域，特别是涉及一种可拉伸显示面板及其制造方法。
背景技术
显示面板是人们日常生活中常用的产品，通常，显示面板是基于玻璃等刚性材质制成，显示面板的大小固定，且易碎结构脆弱，因此有人提出可拉伸显示面板的概念。
现有的可拉伸显示面板不能对像素单元进行有效的保护，导致可拉伸显示屏在拉伸的过程中，像素单元很容易破裂，导致像素单元失效，影响显示面板的正常显示。
发明内容
本申请主要解决的技术问题是提供一种可拉伸显示面板及其制造方法，能够有效的保护像素单元，避免拉伸导致的像素单元的损坏。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种可拉伸显示面板，该可拉伸显示面板包括弹性基层和嵌设在弹性基层内的多个阵列分布的显示单元，至少部分显示单元包括像素单元和刚性保护体，刚性保护体至少包括设置于像素单元的至少一侧的刚性侧壁。
为解决上述技术问题，本申请采用的另一个技术方案是：提供一种可拉伸显示面板的制造方法，其包括：在基板上形成刚性基材层；对刚性基材层进行蚀刻形成刚性保护体，刚性保护体包括至少一刚性侧壁；在刚性侧壁一侧形成对应的像素单元，使得像素单元及其对应的刚性保护体组成显示单元；形成弹性基层，弹性基层至少填充于相邻的显示单元之间。
本申请的有益效果是：区别于现有技术的情况，本申请通过将显示单元嵌设于弹性基层中，使得显示面板的可以拉伸或者弯折，进一步，通过在至少部分显示单元中设置包括像素单元和刚性保护体，刚性保护体至少包括设置于像素单元的至少一侧的刚性侧壁，由刚性侧壁在像素单元的厚度维度上进行保护，承受厚度维度上的拉伸力或者弯折曲张力，避免在可拉伸显示面板在拉伸或者弯折时导致像素单元的损坏。
附图说明
图1是本申请第一实施例的可拉伸显示面板的剖视结构示意图；
图2是本申请第二实施例的可拉伸显示面板的俯视结构示意图；
图3是本申请第二实施例的可拉伸显示面板沿图2中A-A方向的剖视示意图；
图4是本申请第二实施例的可拉伸显示面板沿图3中B-B方向的剖视图；
图5是本申请第二实施例的刚性保护体的侧视结构示意图；
图6是本申请第三实施例的可拉伸显示屏的俯视结构示意图；
图7是图6中C-C方向的剖视结构示意图；
图8是图6中D-D方向的剖视结构示意图；
图9是图6中E-E方向的剖视结构示意图；
图10是本申请第三实施例中的第一和第三刚性侧壁的侧视结构示意图；
图11是本申请第三实施例中的第二刚性侧壁和第四刚性侧壁的侧视结构示意图；
图12是本申请可拉伸显示面板的制造方法的第一实施例的流程示意图；
图13是本申请可拉伸显示面板的制造方法的第一实施例制造过程的示意图；
图14是本申请可拉伸显示面板的制造方法的第二实施例的流程示意图；
图15是本申请可拉伸显示面板的制造方法第二实施例的制造过程的示意图；
图16是本申请可拉伸显示面板的制造方法的第三实施例的流程示意图；
图17是本申请可拉伸显示面板的制造方法第三实施例的一部分制造过程的示意图；
图18是是本申请可拉伸显示面板的制造方法第三实施例的另一部分制造过程的示意图。
具体实施方式
下面结合附图和实施例对本申请进行详细的说明。
请参阅图1，图1是本申请第一实施例的可拉伸显示面板的剖视结构示意图。在本实施例中，可拉伸显示面板可以包括：弹性基层11和多个显示单元12。
多个显示单元12嵌设在弹性基层11内，并且多个显示单元12呈阵列分布。
例如，弹性基层11具有彼此平行的第一表面a和第二表面b。多个显示单元12在与弹性基层11的第一表面a和第二表面b平行的一个参照平面c上呈矩阵分布。该参照平面c位于第一表面a和第二表面b之间。
例如，第一表面a为弹性基层11的上表面，第二表面b为弹性基层11的下表面。
可选地，每一显示单元12包括像素单元121和刚性侧壁122，刚性侧壁122设置在像素单元121的一侧。刚性侧壁122形成刚性保护体对像素单元进行保护。在其他实施例中，可以仅将部分显示单元12设置为包括像素单元121和刚性侧壁122，并非一定要将可拉伸显示面板所有的显示单元均设置为包括像素单元121和刚性侧壁122，本实施例对此不做限定。
可选地，刚性侧壁122的材质可以是PI(Polyimide，聚酰亚胺)、PMMA(polymethyl methacrylate，聚甲基丙烯酸甲酯)或者其他刚性可图形化材料。
弹性基层11的材质可以是PDMS(polydimethylsiloxane，聚二甲基硅氧烷)、PU(聚氨酯,polyurethane)、TPE(热塑性弹性体)或者其他的弹性或者软性材质。
在其他实施例中，可以在像素单元121的相对两侧分别设置对应的两个刚性侧壁，或者在像素单元121三侧分别设置对应的三个刚性侧壁，或者在像素单元121的四侧均设置刚性侧壁。
可选地，在像素单元121的四侧均设置刚性侧壁的实施例中，四侧的刚性侧壁可彼此连接形成刚性围栏，具体参见下文的描述。
可选地，刚性侧壁122垂直于弹性基层11的第一表面a和第二表面b。在其他实施例中，刚性侧壁122可以与第一表面a和第二表面b之间的夹角在60-90度之间。
应理解，可拉伸显示面板可弯折、拉伸等，而不限于拉伸，刚性侧壁122垂直于弹性基层11的表面，是指在弹性基层11未受到外力变形的自然状态下刚性侧壁122垂直于弹性基层11的表面。
在本实施例中，像素单元121可以为发光层，发光层可以为LED(Light Emitting Diode，发光二极管)、OLED(Organic Light-Emitting Diode，有机发光二极管)、MicroLED(Micro Light-Emitting Diode，微型发光二极管)或者QLED(Quantum Dot Light Emitting Diodes,量子点发光二极管)等等。
在本实施例中，由位于像素单元121至少一侧的刚性侧壁122在像素单元121的厚度维度上进行保护，承受厚度维度上的拉伸力或者弯折曲张力，避免在可拉伸显示面板在拉伸或者弯折时导致像素单元的损坏。
请结合参阅图2、图3以及图4，图2是本申请第二实施例的可拉伸显示面板的俯视结构示意图；图3是本申请第二实施例的可拉伸显示面板沿图2中A-A方向的剖视示意图；图4是本申请第二实施例的可拉伸显示面板沿图3中B-B方向的剖视图。
在本实施例中，可拉伸显示面板可以包括：弹性基层20、多个显示单元30以及导线40。
多个显示单元30嵌设在弹性基层20内，并且多个显示单元30呈阵列分布，每一显示单元30包括像素单元31和刚性保护体32。
可选地，显示单元30可以矩阵分布于同一参考平面上，具体可以参照上文实施例中的描述，此处不再赘述。
在本实施例中，刚性保护体32包括刚性承壁321和四个刚性侧壁322a、322b、322c、322d。
四个刚性侧壁322a、322b、322c、322d彼此连接以形成围绕像素单元31的刚性围栏322。四个刚性侧壁322a、322b、322c、322d分别为第一刚性侧壁322a、第二刚性侧壁322b、第三刚性侧壁322c、第四刚性侧壁322d。第一刚性侧壁322a与第三刚性侧壁322c相对设置，第二刚性侧壁322b与第四刚性侧壁322d相对设置。第一刚性侧壁322a、第二刚性侧壁322b、第三刚性侧壁322c、第四刚性侧壁322d依次首尾连接。
可选地，第一刚性侧壁322a、第二刚性侧壁322b、第三刚性侧壁322c、第四刚性侧壁322d均垂直于弹性 基层20的表面设置。具体而言，刚性侧壁322a、322b、322c、322d可以垂直于弹性基层20的上表面或者下表面，刚性侧壁322a、322b、322c、322d垂直于弹性基层20是指在弹性基层20未发生变形时的自然状态下时，刚性侧壁322a、322b、322c、322d垂直于弹性基层20。在其他实施例中，刚性侧壁322a、322b、322c、322d也可以与弹性基层20的表面呈其他角度，而不限于垂直的情形。
像素单元31至少部分容置于刚性承壁321和刚性侧壁322a、322b、322c、322d所围成的空间内。具体而言，刚性承壁321可与刚性侧壁322a、322b、322c、322d均垂直弯折连接，且刚性承壁321与刚性侧壁322a、322b、322c、322d形成一体的盒状结构。像素单元31容置于盒状结构的容置空间内。
在本实施例中，通过上述方式，在像素单元31的周围刚性围栏322可以在可拉伸显示面板的厚度维度上保护像素单元31，进一步在像素单元31的底部设置承载像素单元21的刚性承壁321可以在可拉伸显示面板的面板所在平面的两个维度保护像素单元31，进而实现对像素单元31在三个维度上的保护。在可拉伸显示面板在任意一个维度进行拉伸或者任意方向的弯折时均可以保护像素单元31不被损坏。
在本实施例中，像素单元31为发光层，可实现单面无源显示。发光层可以为LED、OLED、MicroLED或者QLED。
可选地，刚性侧壁322a、322b、322c、322d上设置有缺口323。
导线40从刚性围栏322外通过缺口323与对应的像素单元31连接。
导线40位于刚性围栏322外的部分嵌设于弹性基层20内，且设置成可拉伸形式。例如，导线40至少在位于刚性围栏322外的部分由弹性导电材料制成。应理解，导线40还可以设置成其他的可拉伸形式，例如，将导线40在刚性围栏322外的部分设置为螺旋延伸的形状且由硬性导电材料(例如金属)制成，其同样具有弹性，当然，导线40的可拉伸形式不限于上述的各种方式，只要是可以拉伸即可。
可选地，导线40位于刚性围栏322内的部分设置于刚性承壁321靠近像素单元31的表面上。导线40位于刚性围栏322内的部分也可以由弹性导电材料制成，弹性导电材料可以与上述导线40位于刚性围栏322外的部分的材料相同，从而便于导线40的一体成型，便于导线40的制作。导线40的具体制作工艺可以是印刷工艺或者光刻工艺。
请进一步结合参阅图5，图5是本申请第二实施例的刚性保护体的侧视结构示意图。
可选地，在本实施例中，刚性侧壁322a、322b、322c、322d上的缺口323的底部设置成与刚性承壁321靠近像素单元31的表面平齐，以使得导线40在从刚性围栏322外经缺口323延伸至刚性围栏322内时保持平坦，避免在形成导线40时在经过缺口323时由于要跨过一定的台阶导致的断线或者导线40可靠性差的问题。
在其他实施例中，缺口323的底部也可以超出刚性承壁321靠近像素单元31的表面一定的高度，本申请实施例对此不做限定。
可选地，导线40包括第一导线40a和第二导线40b。第一导线40a和第二导线40b的数量可以均为多条。多条第一导线40a彼此平行设置，多条第二导线40b彼此平行设置。第一导线40a可与第二导线40b垂直。在第一导线40a和第二导线40b交叠处，可以在第一导线40a和第二导线40b之间设置绝缘层。
像素单元31四侧的每个刚性侧壁322a、322b、322c、322d上均设有缺口323。
第一导线40a串联行向排列的像素单元31，且从刚性围栏322外通过两相对的刚性侧壁(例如，第一刚性侧壁322a和第三刚性侧壁322c)上的缺口323分别与像素单元31的第一电极311连接。
第二导线40b串联列向排列的像素单元31，且从刚性围栏322外通过剩余两相对的刚性侧壁(例如，第二刚性侧壁322b和第四刚性侧壁322d)上的缺口323分别与像素单元31的第二电极312连接。
可选地，像素单元31的第一电极311和第二电极312的其中一者为正极，另一者为负极。例如，在像素单元31为OLED时，其第一电极311和第二电极312的其中一者为该OLED的正极，另一者为该OLED的负极。
在本实施例中，通过上述方式，将同一种电极连接的导线设置为彼此平行，不同种电极连接的导线设置为彼此垂直，可以便于显示面板的驱动电路的设计。应理解，在其他实施例中，可以将所有导线均设置为平行，本申请实施例对此不做限定。
请结合参阅图6、图7、图8以及图9，图6是本申请第三实施例的可拉伸显示屏的俯视结构示意图；图7 是图6中C-C方向的剖视结构示意图；图8是图6中D-D方向的剖视结构示意图；图9是图6中E-E方向的剖视结构示意图。
在本实施例中，可拉伸显示面板可以包括：弹性基层50、多个显示单元60以及导线70。
多个显示单元60嵌设在弹性基层50内，并且多个显示单元60呈阵列分布，每一显示单元60包括像素单元61和刚性保护体62。具体显示单元60如何在弹性基层50内阵列分布可以参见上文实施例的描述，此处不再赘述。
刚性保护体62包括刚性承壁621和四个刚性侧壁622a、622b、622c、622d。
四个刚性侧壁622a、622b、622c、622d彼此连接以形成围绕像素单元61的刚性围栏622。四个刚性侧壁622a、622b、622c、622d分别为第一刚性侧壁622a、第二刚性侧壁622b、第三刚性侧壁622c、第四刚性侧壁622d。第一刚性侧壁622a与第三刚性侧壁622c相对设置，第二刚性侧壁622b与第四刚性侧壁622d相对设置。第一刚性侧壁622a、第二刚性侧壁622b、第三刚性侧壁622c、第四刚性侧壁622d依次首尾连接。
可选地，第一刚性侧壁622a、第二刚性侧壁622b、第三刚性侧壁622c、第四刚性侧壁622d均垂直于弹性基层50的表面设置。具体可以参见上文实施例的描述，此处不再赘述。
在本实施例中，刚性承壁621与刚性侧壁622a、622b、622c、622d的中部连接，进而形成由刚性承壁621分隔的第一子空间S1和第二子空间S2。具体而言，刚性承壁621与刚性围栏622的内壁连接，且与刚性围栏622设置为一体，刚性承壁621将刚性围栏622围成的空间分隔为第一子空间S1和第二子空间S2。
可选地，刚性承壁621上设有第一过孔H1和第二过孔H2。
像素单元61包括第一子像素单元611和第二子像素单元612，第一子像素单元611和第二子像素单元612分别容置于第一子空间S1和第二子空间S2内。
可选地，第一子像素单元611可以为发光层，第二子像素单元612可以为驱动层，例如TFT(Thin Film Transistor，薄膜晶体管)驱动层。从而在第一子像素单元611所在的一面的单面有源显示。
在其他实施例中，第一子像素单元611和第二子像素单元612可以为均为发光层。发光层可以为LED、OLED、MicroLED或者QLED等。其中，第一子像素单元611和第二子像素单元612可以采用不同种类的发光层，例如，第一子像素单元采用OLED，第二子像素单元采用QLED。
导线70包括第一导线71、第二导线72、第三导线73以及第四导线74。
请进一步结合参阅图10和图11，图10是本申请第三实施例中的第一和第三刚性侧壁的侧视结构示意图；图11是本申请第三实施例中的第二刚性侧壁和第四刚性侧壁的侧视结构示意图。
刚性围栏622上设有与第一导线71、第二导线72、第三导线73对应的多个缺口623，每一导线70对应于分别位于相对的两个刚性侧壁622a、622b、622c或622d上的两个缺口623。
具体而言，第一刚性侧壁622a的位于刚性承壁621上侧的部分(即第一刚性侧壁622a在第一子像素单元611侧边的部分)上设有朝向远离刚性承壁621方向且使刚性围栏622内外贯通的两个缺口623。第三刚性侧壁622c的位于刚性承壁621上侧的部分(即第三刚性侧壁622c在第一子像素单元611侧边的部分)上设有朝向远离刚性承壁621方向且刚性围栏622内外贯通的两个缺口623。
第二刚性侧壁622b的位于刚性承壁621下侧的部分(即第二刚性侧壁622b在第二子像素单元612侧边的部分)上设有朝向远离刚性承壁621方向且使刚性围栏622内外贯通的两个缺口623。
第四刚性侧壁622d的位于刚性承壁621下侧的部分(即第四刚性侧壁622d在第二子像素单元612侧边的部分)上设有朝向远离刚性承壁621方向且使刚性围栏622内外贯通的两个缺口623。
可选地，每一缺口623的底部均与刚性承壁621靠近该缺口623的表面齐平，以使对应的导线70经过该缺口623时保持平坦。
第一导线71和第二导线72从刚性围栏622外经过缺口623延伸至第一子空间S1中。第一导线71和第二导线72位于刚性围栏622内的部分均设置在刚性承壁621上。第三导线73和第四导线74从刚性围栏622外延伸至第二子空间S2中。第一子像素单元611的第一电极P1与第一导线71连接。第一子像素单元611的第二电极P2经第一过孔H1与第三导线73连接。第二子像素单元612的第一电极P3与第四导线74连接。第二子像素单元612的第二电极P4通过第二过孔H2与第二导线72连接。第一导线71与第二导线72平行，第三 导线73与第四导线74平行，第一导线71与第三导线73垂直。
具体而言，第一导线71串联行向排列的第一子像素单元611，且从刚性围栏622外通过两相对的刚性侧壁(例如，第一刚性侧壁622a和第三刚性侧壁622c)上的缺口623与第一子像素单元611的第一电极P1连接。第二导线72串联行向排列的第二子像素单元612，且从刚性围栏622外通过两相对设置的刚性侧壁上(例如，第一刚性侧壁622a和第三刚性侧壁622c)上的缺口623延伸至第一子空间S1中，第二导线72通过设置在刚性承壁621上的第二过孔H2与第二子像素单元612的第二电极P2连接。第二导线72在经过第二过孔H2时填充于第二过孔H2并与第二子空间S2中的第二子像素单元612的第二电极P4连接并导通。
第四导线74串联列向排列的第二子像素单元612，且从刚性围栏622外通过两相对的刚性侧壁(例如，第二刚性侧壁622b和第四刚性侧壁622d)上的缺口623与第二子像素单元612的第一电极P3连接。第三导线73串联列向排列的第一子像素单元611，且从刚性围栏622外通过两相对的刚性侧壁(例如，第二刚性侧壁622b和第四刚性侧壁622d)上的缺口623延伸至第二子空间S2中，第三导线73通过设置在刚性承壁621上的第一过孔H1与第一子像素单元611的第二电极P2连接。第三导线73在经过第一过孔H1时填充于第一过孔H1并与第一子空间S1中的第一子像素单元611的第二电极P2连接并导通。
可选地，第一子像素单元611的第一电极P1和第二电极P2，其中一者为正极另一者为负极。
可选地，在第二子像素单元612为发光层时，第二子像素单元612的第一电极P3和第二电极P4其中一者为正极另一者为负极。在第二子像素单元612为驱动层时，第二子像素单元612的第一电极P3和第二电极P4其中一者为数据线连接电极另一者为扫描线连接电极，例如，第二子像素单元612的第一电极P3和第二电极P4其中一者为栅极另一者为漏极。
在本实施例中，通过在不同层设置不同种电极可以避免在同一子空间中的导线交错设置导致在导线交错位置增加绝缘层使导线之间绝缘，在此基础上，进一步设置同一种类的电极彼此平行能够方便周边的驱动电路的设计。
在另一种实施例中，多根导线可以包括第一导线、第二导线、第三导线以及第四导线，第一导线和第二导线从刚性围栏外延伸至第一子空间中，第三导线和第四导线从刚性围栏外延伸至第二子空间中，第一子像素单元的第一电极与第一导线连接，第一子像素单元的第二电极与第二导线连接，第二子像素单元的第一电极与第三导线连接，第二子像素单元的第二电极与所述第四导线连接，第一导线与第三导线平行，第二导线与第四导线平行，第一导线与第二导线垂直。在这种情况下，刚性承壁上下两侧的结构均与第二实施例中的单层结构(显示单元30)类似，此处不再赘述。这种设置方式的优点是不需要在刚性承壁上设置过孔，并且同一种的电极连接的导线平行，同样可以达到便于周边驱动电路设计的效果。
在本实施例中，第一子像素单元611和第二子像素单元612均是与刚性保护体62齐平或完全收容于刚性保护体62内，未超出第一子空间S1和第二子空间S2，这样可以避免弹性基层50在拉伸时与第一子像素单元611和第二子像素单元612之间产生力的作用而使第一子像素单元611和第二子像素单元612损坏。在其他实施例，为了便于第一子像素单元611和第二子像素单元612的安装或者制作，第一子像素单元611可以超出第一子空间S1，第二子像素单元612可以超出第二子空间S2。
在上述各个实施例中，每一个像素单元可以进一步包括对应的多个亚像素单元，例如，每一像素单元可以包括红色亚像素单元(R)、绿色亚像素单元(G)、蓝色亚像素单元(B)，或者每一像素单元可以包括红色亚像素单元(R)、绿色亚像素单元(G)、蓝色亚像素单元(B)、白色亚像素单元(W)。
在上述各个实施例中，像素单元或者子像素单元的两电极均是位于像素单元的同一层，应理解，在其他实施例中，像素单元的两电极也可以分别位于不同层，在像素单元的电极位于不同层时，对应的导线可以位于不同层。
请参阅图12和图13，图12是本申请可拉伸显示面板的制造方法的第一实施例的流程示意图，图13是本申请可拉伸显示面板的制造方法的第一实施例制造过程的示意图。在本实施例中，可拉伸显示面板的制造方法可以包括以下步骤：
步骤S11：在基板上形成刚性基材层。
其中，在基板81上形成刚性基材层82，刚性基材层82的材质为刚性材料，例如PI(Polyimide，聚酰亚 胺)、PMMA(polymethyl methacrylate，聚甲基丙烯酸甲酯)或者其他刚性可图形化材料。
步骤S12：对刚性基材层进行蚀刻形成刚性保护体，刚性保护体包括至少一刚性侧壁。
其中，对刚性基材层82进行蚀刻形成刚性保护体83，可选地，刚性保护体83包括一个刚性侧壁831，在其他实施例中刚性保护体可以包括两个或者多个刚性侧壁。形成的刚性保护体83可以在基板81上呈矩阵分布。
例如，在其他实施例中，对刚性基材层82进行蚀刻形成刚性保护体83可以包括：对刚性基材层82进行蚀刻形成对应在后续步骤中形成的像素单元四侧的多个刚性侧壁，多个刚性侧壁彼此连接以形成围绕像素单元的刚性围栏。
具体可以参见上文的描述。
步骤S13：在刚性侧壁一侧形成对应的像素单元，使得像素单元及其对应的刚性保护体组成显示单元。
其中，在刚性侧壁831一侧形成对应的像素单元84，使得像素单元84及其对应的刚性保护体83组成显示单元。
步骤S14：形成弹性基层，弹性基层至少填充于相邻的显示单元之间。
其中，形成弹性基层85，弹性基层至少填充于相邻的显示单元之间。可选地，弹性基层85一部分填充于相邻像素单元之间，另一部分位于显示单元上，形成的弹性基层85的外表面垂直于刚性侧壁831。
步骤S15：将基板剥离。
其中，将基板81剥离。
可选地，在步骤S15之后，该可拉伸显示面板的制造方法还可以包括：
步骤S16：将弹性基层裸露的一面放置在另一基板上。
其中，将弹性基层85裸露的一面放置在另一基板86上。
步骤S17：在显示单元和弹性基层上形成另一弹性基层，以使弹性基层和另一弹性基层将显示单元包裹。
其中，在显示单元和弹性基层85上形成另一弹性基层87，以使弹性基层85和另一弹性基层87将显示单元包裹。弹性基层85和另一弹性基层87的材质为弹性材质，具体可以为PDMS(polydimethylsiloxane，聚二甲基硅氧烷)、PU(聚氨酯,polyurethane)、TPE(热塑性弹性体)或者其他的弹性或者软性材质。形成的另一弹性基层87的表面可以垂直于刚性侧壁831。
步骤S18：将另一基板剥离。
其中，将另一基板86剥离。
请参阅图14和图15，图14是本申请可拉伸显示面板的制造方法的第二实施例的流程图；图15是本申请可拉伸显示面板的制造方法第二实施例的制造过程的示意图。
在本实施例中，可拉伸显示面板的制造方法可以包括以下步骤：
步骤S21：在基板上形成刚性基材层。
其中，在基板90上形成刚性基材层91。刚性基材层91的材质为刚性材料，例如PI(Polyimide，聚酰亚胺)、PMMA(polymethyl methacrylate，聚甲基丙烯酸甲酯)或者其他刚性可图形化材料。
步骤S22：对刚性基材层背对基板的一侧的中部区域进行蚀刻，蚀刻深度不大于刚性基材层的厚度，使得刚性基材层背对基板的一侧形成凹槽，凹槽的周壁形成刚性围栏。
其中，对刚性基材层91背对基板90的一侧的中部区域进行蚀刻，蚀刻深度不大于刚性基材层91的厚度，使得刚性基材层91背对基板90的一侧形成凹槽92，凹槽92的周壁形成刚性围栏93。凹槽92底部未蚀刻的部分形成刚性承壁94。凹槽92的周壁由多个刚性侧壁构成，多个刚性侧壁首尾连接形成刚性围栏93。
在蚀刻时，将刚性围栏93之外的刚性基材层91也进行一定程度的蚀刻，蚀刻的深度与凹槽92深度一致，保留的部分形成导线承载层95，导线承载层95的上表面与刚性承壁94的上表面齐平。
步骤S23：在刚性围栏的每个刚性侧壁上均形成缺口。
其中，在刚性围栏93的每个刚性侧壁上均形成缺口931。具体参见图中的刚性围栏93的A侧视图，其他侧的视图与A侧视图类似。可选地，缺口931的底部与刚性承壁94远离基板90的表面齐平。
步骤S24：形成从刚性围栏外通过两相对的刚性侧壁上的缺口延伸至刚性围栏内的第一导线。
其中，在导线承载层95、缺口931底部、刚性承壁94上形成从刚性围栏93外通过两相对的刚性侧壁上的 缺口931延伸至刚性围栏93内的第一导线96。第一导线96可拉伸。例如，第一导线96的材质可以为弹性导电材料，在其他实施例中，可以仅将第一导线96位于刚性围栏93外的部分由弹性导线材料制成，而位于刚性围栏93之内的部分由硬性导电材质制成。
步骤S25：在第一导线的部分区域上形成绝缘层。
其中，在第一导线96的部分区域上形成绝缘层97，以使后续形成的第二导线98与第一导线96在交叠的位置能够彼此绝缘。
步骤S26：形成从刚性围栏外通过剩余两相对的刚性侧壁上的缺口延伸至刚性围栏内的第二导线，并使第二导线从绝缘层上经过。
其中，在导线承载层95、缺口931底部、刚性承壁94上形成从刚性围栏93外通过剩余两相对的刚性侧壁上的缺口931延伸至刚性围栏93内的第二导线98，并使第二导线98从绝缘层97上经过。第二导线98也是可拉伸的，具体与第一导线96类似，只是设置的方向不同，此处不再赘述。
步骤S27：在凹槽内形成像素单元并使像素单元的第一电极与第一导线连接且第二电极与第二导线连接。
其中，在凹槽92内形成像素单元99并使像素单元99的第一电极与第一导线96连接且第二电极与第二导线98连接。像素单元99可以为发光层，发光层具体可以是LED、OLED、MicroLED或者QLED等。
在图中未示出第一电极和第二电极，具体的像素单元的电极与导线之间的连接关系可以参见上述可拉伸显示面板的第二实施例中的相关描述，此处不再赘述。
步骤S28：在像素单元和刚性围栏之间浇筑形成至少部分的弹性基层。
其中，在像素单元99、导线承载层95上浇筑形成至少部分的弹性基层100，定义该部分的弹性基层100为第一子弹性基层100。
步骤S29：将基板剥离，并将弹性基层裸露的一面设置于另一基板上。
其中，将弹性基层100裸露的一面设置于另一基板101上。
步骤S30：将导线承载层蚀刻去除，在刚性承壁远离像素单元的一面、第一子弹性基层上形成第二子弹性基层。
其中，将导线承载层95蚀刻去除，在刚性承壁94远离像素单元99的一面、第一子弹性基层100上形成第二子弹性基层102。第一子弹性基层100和第二子弹性基层102构成完整的弹性基层，并将第一导线96和第二导线98包裹在该弹性基层内。
步骤S31：将另一基板剥离。
其中，将另一基板101剥离。
本实施例对应于上述可拉伸显示面板的第二实施例的结构，更具体的描述可以参见上文的描述，此处不再赘述。
请参阅图16、图17以及图18，图16是本申请可拉伸显示面板的制造方法的第三实施例的流程图；图17是本申请可拉伸显示面板的制造方法第三实施例的一部分制造过程的示意图；图18是是本申请可拉伸显示面板的制造方法第三实施例的另一部分制造过程的示意图。
在本实施例中，可拉伸显示面板的制造方法可以包括以下步骤：
步骤S41：在基板上形成刚性基材层。
其中，在基板200上形成刚性基材层201。刚性基材层201的材质为刚性材料，例如PI(Polyimide，聚酰亚胺)、PMMA(polymethyl methacrylate，聚甲基丙烯酸甲酯)或者其他刚性可图形化材料。
步骤S42：对刚性基材层背对基板的一侧的中部区域进行蚀刻，蚀刻深度不大于刚性基材层的厚度，使得刚性基材层背对基板的一侧形成第一凹槽，第一凹槽的周壁形成刚性围栏。
其中，对刚性基材层201背对基板20的一侧的中部区域进行蚀刻，蚀刻深度不大于刚性基材层201的厚度，使得刚性基材层201背对基板的一侧形成第一凹槽202，第一凹槽202的周壁形成刚性围栏的第一子刚性围栏203。
在蚀刻时，将第一刚性围栏203之外的刚性基材层也进行蚀刻一定的深度的蚀刻，保留的承载部分用于承 载后续形成的导线。
步骤S43：在第一子刚性围栏上形成四个第一缺口。
其中，在第一子刚性围栏203的相对的两个刚性侧壁上分别形成两个第一缺口204。
步骤S44：形成从第一子刚性围栏之外通过第一缺口延伸至第一凹槽内的第一导线和第二导线。
其中，第一导线205与第二导线(图未示)平行，第一导线205经过两个相对设置的第一缺口204，第二导线经过另两个相对设置的第一缺口204。具体可以参见上文的可拉伸显示面板的第三实施例中的描述。
步骤S45：在第一凹槽内形成第一子像素单元并使第一子像素单元的第一电极连接第一导线。
其中，在第一凹槽202内形成第一子像素单元206并使第一子像素单元206的第一电极207，第一子像素单元206的第二电极(图未示)与第一凹槽202的底部抵接。
步骤S46：在相邻第一刚性围栏之间和第一子像素单元上浇筑形成弹性基层。
其中，在相邻第一刚性围栏之间和第一子像素单元206上浇筑形成弹性基层的一部分208。
步骤S47：将基板剥离，并在浇筑后的弹性基层裸露一侧设置另一基板。
其中，将基板200剥离，并将浇筑后的弹性基层的一部分208倒置并使其裸露的一侧与另一基板209键合。
步骤S48：在刚性基材层背对另一基板的一侧的中部区域进行蚀刻，形成不贯穿第一凹槽槽底的第二凹槽，第二凹槽的周壁形成刚性围栏，第一凹槽和第二凹槽之间为刚性承壁。
其中，在刚性基材层201背对另一基板209的一侧的中部区域进行蚀刻，形成不贯穿第一凹槽202槽底的第二凹槽210，第二凹槽210的周壁形成刚性围栏的第二子刚性围栏211，第一凹槽202和第二凹槽210之间为刚性承壁213。
步骤S49：在第二子刚性围栏上形成四个第二缺口，在刚性承壁上形成第一过孔和第二过孔。
其中，在第二子刚性围栏211上形成四个第二缺口(图未示)，不难理解，根据第三导线、第四导线与第一导线、第二导线的位置关系，可以确定第二缺口的位置。具体可以参见前文第三实施例的可拉伸面板的描述。第一过孔和第二过孔的相关描述也可以参见上文对应实施例的描述。
步骤S50：形成从第二子刚性围栏之外通过第二缺口延伸至第二凹槽内的第三导线和第四导线。
其中，在第二凹槽210底部和第二子刚性围栏211之外的刚性基材层上形成第三导线和第四导线212。
步骤S51：将第二子刚性围栏之外残留的刚性基材层蚀刻去除。
步骤S52：在第二凹槽内形成第二子像素单元。
其中，第一子像素单元206的第一电极207与第一导线205连接，第一子像素单元206的第二电极经第一过孔与第三导线连接，第二子像素单元215的第一电极214与第四导线212连接，第二子像素单元215的第二电极通过第二过孔与第二导线连接，第一导线205与第二导线平行，第三导线与第四导线212平行，第一导线205与第三导线垂直。具体可以参见前文第三实施例的可拉伸显示面板的描述。
步骤S53：在相邻第二子刚性围栏之间和第二子像素单元上浇筑形成弹性基层。
步骤S54：将另一基板剥离。
本实施例的制造方法对应于本申请第三实施例的可拉伸面板，更具体的说明可以参见上文的描述。
本申请的有益效果是：本申请通过在至少部分显示单元中设置包括像素单元和刚性保护体，刚性保护体至少包括设置于像素单元的至少一侧的刚性侧壁，由刚性侧壁在像素单元的厚度维度上进行保护，承受厚度维度上的拉伸力，避免拉伸导致的像素单元的损坏。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种可拉伸显示面板，包括弹性基层和嵌设在所述弹性基层内的多个阵列分布的显示单元，其中至少部分所述显示单元包括像素单元和刚性保护体，所述刚性保护体至少包括设置于所述像素单元的至少一侧的刚性侧壁。
  2. 根据权利要求1所述的可拉伸显示面板，其中，所述刚性侧壁垂直于所述弹性基层的表面设置。
  3. 根据权利要求1或2所述的可拉伸显示面板，其中，所述刚性保护体包括设置于所述像素单元外围的多个刚性侧壁，所述多个刚性侧壁彼此连接以形成围绕所述像素单元的刚性围栏。
  4. 根据权利要求3所述的可拉伸显示面板，其中，所述可拉伸显示面板进一步包括导线，所述刚性侧壁上设置有缺口，所述导线从所述刚性围栏外通过所述缺口与对应的所述像素单元连接。
  5. 根据权利要求4所述的可拉伸显示面板，其中，所述导线位于所述刚性围栏外的部分嵌设于所述弹性基层内，且设置成可拉伸形式。
  6. 根据权利要求4所述的可拉伸显示面板，其中，所述刚性保护体进一步包括与所述刚性侧壁一体成型且位于所述刚性围栏内的刚性承壁，所述像素单元至少部分容置于所述刚性承壁和所述刚性侧壁所围成的空间内。
  7. 根据权利要求6所述的可拉伸显示面板，其中，所述刚性承壁上设置有过孔，所述导线通过所述过孔与所述像素单元连接。
  8. 根据权利要求6所述的可拉伸显示面板，其中，所述导线位于所述刚性围栏内的部分设置于所述刚性承壁上，所述缺口的底部设置成与所述刚性承壁的表面平齐，以使得所述导线在从所述刚性围栏外经所述缺口延伸至所述刚性围栏内时保持平坦。
  9. 根据权利要求6所述的可拉伸显示面板，其中，所述导线包括第一导线和第二导线，所述像素单元四侧的每个所述刚性侧壁上均设有所述缺口，所述第一导线串联行向排列的所述像素单元，且从所述刚性围栏外通过两相对的所述刚性侧壁上的所述缺口分别与所述像素单元的第一电极连接，所述第二导线串联列向排列的所述像素单元，且从所述刚性围栏外通过剩余两相对的所述刚性侧壁上的所述缺口分别与所述像素单元的第二电极连接。
  10. 根据权利要求6所述的可拉伸显示面板，其中，所述刚性承壁与所述刚性侧壁的中部连接，进而形成由所述刚性承壁分隔的第一子空间和第二子空间，所述像素单元包括第一子像素单元和第二子像素单元，所述第一子像素单元和第二子像素单元分别容置于所述第一子空间和第二子空间内。
  11. 根据权利要求10所述的可拉伸显示面板，其中，所述刚性围栏上设有多个缺口，所述导线包括第一导线、第二导线、第三导线以及第四导线，所述刚性承壁上设有第一过孔和第二过孔，所述第一导线和第二导线从所述刚性围栏外通过一部分的所述缺口延伸至所述第一子空间中，所述第三导线和第四导线从所述刚性围栏外通过另一部分的所述缺口延伸至所述第二子空间中，所述第一子像素单元的第一电极与第一导线连接，第一子像素单元的第二电极经所述第一过孔与第三导线连接，所述第二子像素单元的第一电极与所述第四导线连接，所述第二子像素单元的第二电极通过所述第二过孔与所述第二导线连接，所述第一导线与所述第二导线平行，所述第三导线与所述第四导线平行，所述第一导线与所述第三导线垂直。
  12. 根据权利要求10所述的可拉伸显示面板，其中，所述刚性围栏上设有多个缺口，所述多根导线包括第一导线、第二导线、第三导线以及第四导线，所述第一导线和第二导线从所述刚性围栏外通过一部分的所述缺口延伸至所述第一子空间中，所述第三导线和第四导线从所述刚性围栏外通过另一部分的所述缺口延伸至所述第二子空间中，所述第一子像素单元的第一电极与所述第一导线连接，所述第一子像素单元的第二电极与所述第二导线连接，所述第二子像素单元的第一电极与所述第三导线连接，所述第二子像素单元的第二电极与所述第四导线连接，所述第一导线与所述第三导线平行，所述第二导线与所述第四导线平行，所述第一导线与所述第二导线垂直。
  13. 根据权利要求10-12任意一项所述的可拉伸显示面板，其中，所述第一子像素单元和所述第二子像素单元其中一者为发光层，另一者为驱动层；或者，所述第一子像素单元和所述第二子像素单元均为发光层。
  14. 一种可拉伸显示面板的制造方法，包括：
    在基板上形成刚性基材层；
    对所述刚性基材层进行蚀刻形成刚性保护体，所述刚性保护体包括至少一刚性侧壁；
    在所述刚性侧壁一侧形成对应的像素单元，使得所述像素单元及其对应的所述刚性保护体组成显示单元；
    形成弹性基层，所述弹性基层至少填充于相邻的所述显示单元之间；
    将所述基板剥离。
  15. 根据权利要求14所述的制造方法，其中，所述形成弹性基层包括：形成表面垂直于所述刚性侧壁的弹性基层；
    所述对所述刚性基材层进行蚀刻形成刚性保护体包括：
    对所述刚性基材层进行蚀刻形成对应所述像素单元四侧的多个刚性侧壁，所述多个刚性侧壁彼此连接以形成围绕所述像素单元的刚性围栏。
  16. 根据权利要求15所述的制造方法，其中，所述制造方法进一步包括：
    在所述刚性侧壁上形成缺口；
    形成从所述刚性围栏外通过所述缺口延伸至所述刚性围栏内的可拉伸的导线；
    所述在所述刚性侧壁一侧形成对应的像素单元包括：
    形成与所述导线连接的像素单元。
  17. 根据权利要求16所述的制造方法，其中，所述形成弹性基层包括：形成包裹位于所述刚性围栏外的部分所述导线的弹性基层；
    所述对所述刚性基材层进行蚀刻形成刚性保护体包括：
    对所述刚性基材层背对所述基板的一侧的中部区域进行蚀刻，蚀刻深度不大于所述刚性基材层的厚度，使得所述刚性基材层背对所述基板的一侧形成凹槽，所述凹槽的周壁形成所述刚性围栏；
    所述在所述刚性侧壁一侧形成对应的像素单元包括：
    在所述凹槽内形成至少部分的所述像素单元。
  18. 根据权利要求17所述的制造方法，其中，所述制造方法进一步包括：
    在所述凹槽底部形成过孔，以使形成的所述导线通过所述过孔与所述像素单元连接；
    或者，所述在所述刚性侧壁上形成缺口包括：
    在所述刚性围栏的每个所述刚性侧壁上均形成所述缺口；
    所述形成从所述刚性围栏外通过所述缺口延伸至所述刚性围栏内的导线包括：
    形成从所述刚性围栏外通过两相对的所述刚性侧壁上的所述缺口延伸至所述刚性围栏内的第一导线；
    在所述第一导线的部分区域上形成绝缘层；
    形成从所述刚性围栏外通过剩余两相对的所述刚性侧壁上的所述缺口延伸至所述刚性围栏内的第二导线，并使所述第二导线从所述绝缘层上经过；
    在所述刚性侧壁一侧形成对应的像素单元包括：
    形成所述像素单元并使所述像素单元的第一电极与所述第一导线连接且第二电极与所述第二导线连接。
  19. 根据权利要求17所述的制造方法，其中，
    所述在所述凹槽内形成至少部分的所述像素单元包括：
    在所述凹槽内形成所述像素单元的第一子像素单元，定义收容所述第一子像素单元的凹槽为第一凹槽；
    所述形成弹性基层包括：
    在所述刚性围栏之间和所述第一子像素单元上浇筑形成所述弹性基层；
    在所述将所述基板剥离之前、同时或之后包括：
    在浇筑后的所述弹性基层裸露一侧设置另一基板；
    在所述刚性基材层背对所述另一基板的一侧的中部区域进行蚀刻，形成不贯穿所述第一凹槽槽底的第二凹槽，所述第二凹槽的周壁形成刚性围栏，所述第一凹槽和第二凹槽之间为所述刚性承壁；
    在所述第二凹槽内形成所述像素单元的第二子像素单元；
    在所述刚性围栏之间和所述第二子像素单元上浇筑形成所述弹性基层；
    将所述另一基板剥离。
  20. 根据权利要求19所述的制造方法，其中，在形成第一子像素单元之前，所述制造方法包括：
    形成从所述刚性围栏外通过所述刚性围栏上的缺口延伸至所述第一凹槽内的第一导线和第二导线；
    在形成第二子像素单元之前，所述制造方法包括：
    在所述刚性围栏上形成另一部分的缺口；
    在所述刚性承壁上形成第一过孔和第二过孔；
    形成从所述刚性围栏外通过所述刚性围栏上的另一部分缺口延伸至所述第二凹槽内的第三导线和第四导线；
    其中，所述第一子像素单元的第一电极与第一导线连接，第一子像素单元的第二电极经所述第一过孔与第三导线连接，所述第二子像素单元的第一电极与所述第四导线连接，所述第二子像素单元的第二电极通过所述第二过孔与所述第二导线连接，所述第一导线与所述第二导线平行，所述第三导线与所述第四导线平行，所述第一导线与所述第三导线垂直。
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