WO2019165484A1 - Dispositif et procédé de détection optique d'une zone marginale d'un objet plat - Google Patents

Dispositif et procédé de détection optique d'une zone marginale d'un objet plat Download PDF

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Publication number
WO2019165484A1
WO2019165484A1 PCT/AT2019/060061 AT2019060061W WO2019165484A1 WO 2019165484 A1 WO2019165484 A1 WO 2019165484A1 AT 2019060061 W AT2019060061 W AT 2019060061W WO 2019165484 A1 WO2019165484 A1 WO 2019165484A1
Authority
WO
WIPO (PCT)
Prior art keywords
detector
optical devices
edge
optical
measuring
Prior art date
Application number
PCT/AT2019/060061
Other languages
German (de)
English (en)
Inventor
Robin PRIEWALD
Original Assignee
STRAPACOVA, Tatiana
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STRAPACOVA, Tatiana filed Critical STRAPACOVA, Tatiana
Publication of WO2019165484A1 publication Critical patent/WO2019165484A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry

Definitions

  • the invention relates to a device for optically detecting an edge region of a flat object, in particular a wafer, comprising at least one detector and a plurality of optical devices, each comprising a lighting unit, wherein between the at least one detector and the optical
  • Devices is a measuring range spanned in a measuring plane and with the optical devices in each case a rectilinear beam path through the measuring range to at least one detector can be generated and wherein the at least one detector and the cooperating with this optical devices are arranged on opposite sides of the measuring range.
  • the invention relates to a use of such a device.
  • the invention relates to a method for optical measurement of an edge of a flat object, in particular a wafer, wherein the edge of the
  • Lighting a wafer provided.
  • at least three cameras are provided which are directed from different sides onto the edge region of the wafer and with which in each case an image recording of the edge region takes place, wherein a defect to be recorded is illuminated in the bright field.
  • US 2006/0115142 A1 describes an apparatus and a method for inspecting an edge of a wafer, whereby at least one image of the edge is also recorded.
  • AT 510 605 B1 a device and a method for optical
  • the object of the invention is to provide a device of the type mentioned, which allows a shape and material-independent inspection of object edges.
  • Another object is to provide a use for such a device.
  • the first object is achieved if, in a device of the type mentioned, the at least one detector and the optical devices are arranged on a rigid carrier.
  • An advantage achieved by the invention is to be seen in particular in that a geometrical relationship between the at least one detector and the optical devices is fixed by the arrangement on a, in particular common, rigid carrier. Such a fixed geometric relationship allows a simple
  • the carrier has a recess open to one side.
  • the carrier may in particular be C-shaped. This allows easy insertion of an object to be measured in the device.
  • the at least one detector and the optical devices are at least partially positioned on opposite sides of the recess. This ensures that the object can be introduced between the at least one detector and the optical devices.
  • the at least one detector and / or the optical devices are preferably fixed in the measurement plane and / or adjustable perpendicular to the measurement plane. This ensures that the geometric relationship between the at least one detector and the optical devices is fixed in the measurement plane. By an adjustment perpendicular to the measuring plane production-related positional deviations can be compensated and / or a measurement accuracy can be increased.
  • the at least one detector is designed as a multi-line optoelectronic sensor.
  • a light from the optical devices in particular from tangential projection beams, can be detected in exact position as an electrical signal and on a surface which is larger in comparison with a single-line sensor.
  • the position of the signal or of the tangential projection beams on the detector is known, since thus an increased measurement accuracy can be achieved.
  • the position of the signal can be determined with improved accuracy.
  • one or more optical devices have a device for beam expansion and / or beam focusing. It is particularly advantageous if each optical device has a device for
  • Beam expansion and / or beam bundling has.
  • a means for beam expansion and / or beam focusing for example, a lens system may be provided.
  • the optical devices preferably each have at least one fixed and / or adjustable diaphragm. As a result, a lighting can be limited to a specific portion of the detector. Furthermore, it can be provided that the optical devices each comprise at least one light source which has a narrow-band emitting wavelength spectrum, for example with a maximum width at half maximum of 10 nm, in particular less than 5 nm, for example 3 nm. It is particularly advantageous if the
  • Wavelength spectrum is narrowband so that diffraction patterns are retained or diffraction phenomena arise in particular when lighting an object edge at the detector.
  • optical devices are each highly focusable
  • Light sources in particular lasers, laser diodes and / or superluminescent diodes, have.
  • At least one optical device a mirror is provided, which is positioned so that the beam path is deflected by the respective optical device and guided straight through the measuring plane to the detector.
  • virtual light sources can be positioned at locations that would be difficult to access for real light sources or that there is not enough space available for them. Such locations may be outside the carrier, for example.
  • a small carrier can be used and a compact design ensured, even if positioning of a light source in a region for which an enlarged carrier would otherwise be necessary is desired.
  • the carrier at least partially comprises a material which has a thermal conductivity of more than 100 W / (m K) and / or a
  • Thermal expansion coefficient of less than 100- 10 6 K 1 has.
  • a thermal conductivity may preferably be at least 300 W / (m K), in particular up to
  • the thermal expansion coefficient of the material is particularly preferably less than 50-10 6 K 1 , in particular about 10 -10 6 K 1 to
  • the carrier itself made of such a material or coated with such a material covered or encased is.
  • the carrier may be in good thermal contact with a heat sink.
  • Such a condition of the carrier ensures a thermal stability of the carrier or a deformation resistance, whereby temperature influences on a geometry of the device, in particular on a relative position of the at least one detector to the optical devices, and on the measurement accuracy are minimized.
  • temperature influences can be distributed by a high thermal conductivity of the material to the entire carrier and thereby homogenized.
  • a housing for housing the device is provided. As a result, the device against environmental influences such as dust or the like
  • the detector can be isolated from environmental or scattered light.
  • the carrier is connected to the housing mechanically decoupled. This reduces or minimizes external forces on the carrier. Such forces as occur, for example, in attaching the device can cause permanent deformation of the carrier when it is firmly connected to the housing. This would also result in a reduced measurement accuracy.
  • the carrier may for example be mounted or connected to the housing in only a small area. For this purpose, at least one fixation, in particular several
  • Fixations be provided, wherein a distance of a first fixation to a last fixation or a longitudinal extent of a single fixation is as small as possible and preferably less than 50 mm, in particular a maximum of 20 mm.
  • a fixation may include, for example, one or more screws, splices and / or welds. Alternatively, a mechanical decoupling of the carrier
  • the carrier is connected via spring elements or other elastic or movable elements with the housing.
  • the carrier could be connected to the housing, for example, with wires or rod-shaped connecting elements, which are movably mounted on the housing.
  • Beam path are positioned, at least partially a low reflection, in particular a diffuse surface. This ensures that the detector does not detect light from unwanted reflections. Moreover, it is also advantageous if components of the device, which are not positioned directly in the beam path, for example, the housing, the carrier, the optical devices themselves or optional
  • each optional mirror must have a reflective surface on at least one side.
  • the further object of the invention is in the use of such a device in an inspection of an edge and / or determination of a geometric
  • the object may in this case preferably be formed as a wafer.
  • the procedural object is achieved in that in a method of the type mentioned above, the edge of the object is illuminated sequentially with each at least one light source whose projections are detected by the at least one detector and evaluated diffraction phenomena, their positions on the at least one Detector can be determined.
  • a position on the at least one detector can be determined precisely and with a high position accuracy.
  • the edge of the object is illuminated simultaneously with a plurality of optical devices.
  • several tangential projection beams for calculating measurement points can be detected simultaneously and a measurement time can be reduced.
  • Measuring points is selected as a number of optical devices. As a result, a robustness of the measurement can be increased since existing redundancies become one
  • a maximum number of measuring points is limited by the number of optical devices.
  • a beam of the at least one light source is widened in a measurement plane and is bundled perpendicular to the measurement plane.
  • an elliptical illumination profile can be generated.
  • an illumination can be homogenized by a beam widening in the measurement plane, wherein an exposure energy to the respective sensor array and is maximized by bundling perpendicular to the measurement plane.
  • the beam is preferably expanded by means of a device for beam expansion in the measurement plane and bundled perpendicular to the measurement plane.
  • Fig. 1 shows an embodiment of a device with a detector
  • Fig. 2 shows an embodiment of a device with two detectors
  • FIG. 3 shows a further embodiment of a device with two detectors
  • FIG. 4 shows an embodiment of a device with a virtual light source
  • Fig. 5 is a side view of the device
  • Fig. 10 detector signals in sequential single exposure and simultaneously
  • FIG. 1 An embodiment of a device 1 is shown in Fig. 1.
  • a device 1 comprises a detector 3 and a plurality of optical devices which are positioned on a carrier 2.
  • the optical devices each comprise a lighting unit 4.
  • the carrier 2 is in this case designed as a plate with a recess 5 which is open toward one side.
  • Recess 5, as shown in Fig. 1 substantially rectangular, but also be shaped differently, for example, round or oval. It is advantageous if the
  • Recess 5 is positioned centrally in the carrier 2. Sometimes, a decentralized arrangement of the recess 5 may also be useful. Furthermore, it is expedient if the recess 5 is formed such that an object 15, for example a wafer, can be introduced into the recess 5.
  • the detector 3 and the optical devices are arranged on opposite sides of the recess 5 in this embodiment.
  • the illumination units 4 are aligned with a front substantially in the direction of detector 3, whereby a beam path is rectilinear and without deflection to the detector 3.
  • the detector 3 and the optical devices define a
  • Measuring plane 12 which is substantially parallel to the carrier 2 and in which a measuring range 6 is located.
  • the measuring range is just formed.
  • the optical devices are arranged substantially along a circular arc, so that a light of the optical devices in each case at a different angle to the edge region of the object 15 strikes or this touches. 1, two enveloping beams 7 of a light cone are shown for each illumination unit 4. To ensure a uniform measurement, it makes sense if the optical
  • Facilities are arranged at a uniform distance from each other.
  • For each optical device corresponds to a tangetial projection beam along an edge point on the object 15, which is why with increasing number of optical
  • the exemplary embodiment shown in FIG. 1 has six optical devices. However, any number of optical devices may be provided, in particular three to one hundred, particularly preferably five to fifty. A number of optical devices are essentially limited by a space available on the carrier 2. In order to be able to position a large number of optical devices on the carrier 2, it may be advantageous if they are arranged offset from one another. In Fig. 2, another embodiment is shown, wherein such
  • Device 1 has two detectors 3 and also six optical devices. These are hereby combined in groups of three optical devices, with one group and one detector 3 cooperating in each case. Accordingly, a group of optical devices and a corresponding detector 3 are respectively positioned on opposite sides of the recess 5.
  • the groups may each comprise any number of, in particular three to fifty, optical devices.
  • a group comprises more than one detector.
  • FIG. 3 shows a further embodiment wherein, compared to FIG. 2, only the positions of the lighting units 4 and the detectors 3 are interchanged.
  • Fig. 4 is a detail view of a device 1 with a plurality of optical
  • FIG. 1 Facilities and a detector 3 shown.
  • a lighting unit 4 of an optical device is positioned away from the detector 3, this optical device comprising a mirror 8 which is positioned such that it emits a light which originates from the remote lighting unit 4 , deflected to the detector 3.
  • a virtual light source 9 ' is generated, which is positioned away from the detector 3 beyond a support edge and along a rectilinear beam path.
  • a further illumination angle can be achieved, which can not be achieved by positioning a real light source 9. This can be done at different positions on the carrier 2 by arranging a mirror 8, in particular if there is not sufficient space for a lighting unit 4 or a real light source 9 at the desired position.
  • Fig. 5 shows a side view of the device 1, wherein a lighting unit 4 and a detector 3 are shown.
  • the illustrated illumination unit 4 comprises a light source 9, a field diaphragm 11 and a device for beam expansion 10.
  • the illumination unit 4 and the detector 3 are in this case opposite each other on the
  • Carrier 2 is arranged, wherein a measuring plane 12 extends parallel to the carrier 2.
  • the illustrated lighting unit 4 is perpendicular to the measuring plane 12 adjustable. One degree of freedom for a movement is indicated by double arrows.
  • FIG. 6 shows a lighting unit 4 which likewise has a light source 9, a field diaphragm 11 and a device for beam widening 10.
  • Device for beam expansion 10 is in particular designed such that it expands the beam 7 in the measuring plane 12 and perpendicular to the measuring plane 12 bundles.
  • the illumination unit 4 in addition to the device for beam expansion 10 have a device for beam focusing. This leads essentially to a highly elliptical Auswerferprofil 13.
  • the lighting unit 4 can also without field stop 11 or devices for
  • Beam expansion 10 and / or beam focusing may be formed.
  • Field diaphragm 11 is provided which limits the beam 7 substantially to a narrow band 14. As a result, a scattered light can be reduced, which can cause undesired effects, such as interferences on the detector 3. It may also be advantageous for a mathematical evaluation if only certain subareas of the detector 3 are illuminated. Alternatively, a plurality of field stops 11 may be provided to further restrict the illumination profile 13. In addition, in Fig. 6 envelope of the expanded beam 7 are shown.
  • FIG. 7 shows a device 1 with a disc-shaped, flat object 15 to be measured, which is partially inserted in the recess 5.
  • the object 15 is introduced into the recess 5 such that an object edge substantially in one
  • Measuring range 6 is positioned. As a result, light, which of the
  • Lighting units 4 goes out, bent at the edge of the object.
  • Diffraction phenomena 17 are shown in an electrical signal 16 of the detector 3.
  • the detector 3 can be designed as an optoelectronic sensor.
  • a detailed view of an illumination of the object edge with the beams 7 impinging on the detector 3 is shown in FIG. 8.
  • the detector 3 in this case detects projections of the light sources 9 and supplies a detector signal 16.
  • the detector signal 16 is also shown in FIG. 8, wherein an abscissa axis indicates a position on the detector 3 and an ordinate axis indicates a measured value detected by the detector 3, for example a voltage. a current or intensity is plotted.
  • the detector signal 16 shown in this case was detected in sequential single exposure, ie in a successive exposure of one edge point by one optical device. Light diffracted at the edge of the object creates a characteristic
  • Diffraction phenomenon 17 in the detector signal 16 From this diffraction phenomenon 17, an exact position of the respective projection on the detector 3 can be determined. As a result, from the determined positions on the detector 3, a shape and a
  • Property of the object edge can be determined.
  • An evaluation can be done here, for example, with a mathematical model.
  • a mathematical model In order to increase the measuring accuracy or to ensure a reliability of the mathematical model, it makes sense, if device parameters are calibrated beforehand.
  • a measurement accuracy is improved with increasing number of optical devices and an increased number of tangential projection beams, which can be used to calculate a selected number of measurement points.
  • the number of measurement points may be the same as or less than the number of tangential projection rays.
  • FIG. 9 shows a detail image of an edge profile scan of an object 15 with the beams 7 or projections, which respectively correspond to an optical device.
  • a detector signal 16 is sequential
  • a detector signal 16 at simultaneous double exposure Single exposure and shown in the lower illustration, a detector signal 16 at simultaneous double exposure.
  • Simultaneous double exposure here means that a simultaneous exposure of two edge points by one optical device takes place. Depending on the number of optical devices in this sense, simultaneous triple, quadruple or any multiple exposures are feasible.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un dispositif (1) permettant d'effectuer une détection optique d'une zone marginale d'un objet (15) plat, en particulier d'une plaquette, ledit dispositif comprenant au moins un détecteur (3) et une pluralité de dispositifs optiques, lesquels comprennent chacun une unité d'éclairage (4), une zone de mesure située entre ledit au moins un détecteur (3) et les dispositifs optiques étant définie dans un plan de mesure, et un chemin optique rectiligne traversant la zone de mesure jusqu'audit au moins un détecteur (3) pouvant être généré dans chaque cas avec les dispositifs optiques, et ledit au moins un détecteur (3) et les dispositifs optiques qui coopèrent avec lui étant montés sur des côtés de la zone de mesure situés à l'opposé les uns des autres, ledit au moins un détecteur (3) ainsi que les dispositifs optiques étant montés sur un support (2) rigide. L'invention concerne en outre une utilisation d'un tel dispositif (1) lors d'une inspection d'un bord et/ou d'une détermination d'une structure marginale géométrique d'un objet (15). L'invention concerne en outre un procédé de mesurage optique d'un bord d'un objet (15) plat, en particulier d'une plaquette, le bord dudit objet (15) étant éclairé par une pluralité de sources lumineuses et leur projection étant détectée par au moins un détecteur (3), le bord de l'objet (15) étant éclairé de manière séquentielle dans chaque cas par au moins une source lumineuse (9), les projections des sources lumineuses étant détectées par ledit au moins un détecteur (3) et d'éventuels phénomènes de diffraction étant évalués, leurs positions étant déterminées sur ledit au moins un détecteur (3).
PCT/AT2019/060061 2018-02-28 2019-02-25 Dispositif et procédé de détection optique d'une zone marginale d'un objet plat WO2019165484A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA50172/2018 2018-02-28
AT501722018A AT520964B1 (de) 2018-02-28 2018-02-28 Vorrichtung und Verfahren zur optischen Erfassung eines Randbereiches eines flachen Objektes

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Publication Number Publication Date
WO2019165484A1 true WO2019165484A1 (fr) 2019-09-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240041918A (ko) 2021-06-24 2024-04-01 카와사키 주코교 카부시키가이샤 얼라이너 장치

Citations (5)

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US5821423A (en) * 1994-09-06 1998-10-13 Harris Instrument Corporation Apparatus and method for binocular measurement system
US20020125448A1 (en) * 2001-03-06 2002-09-12 Samsung Electronics Co., Ltd. Multi-functioned wafer aligner
EP1418446A2 (fr) * 2002-11-05 2004-05-12 Leuze electronic GmbH + Co KG Capteur optique
US20050117162A1 (en) * 2003-09-30 2005-06-02 Bing Zhao Diffractive non-contact laser gauge
US20110299095A1 (en) * 2008-11-08 2011-12-08 Adaptive Automation Limited Shadow Sensing Apparatus

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Publication number Priority date Publication date Assignee Title
US5781649A (en) * 1996-04-15 1998-07-14 Phase Metrics, Inc. Surface inspection of a disk by diffraction pattern sampling
DE102005014596B3 (de) * 2005-03-31 2007-01-04 Leica Microsystems Jena Gmbh Vorrichtung und Verfahren zur Inspektion der Oberfläche eines Wafers
DE102007047352B4 (de) * 2007-10-02 2009-09-17 Vistec Semiconductor Systems Gmbh Beleuchtungseinrichtung und Inspektionseinrichtung mit Beleuchtungseinrichtung
US9645097B2 (en) * 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821423A (en) * 1994-09-06 1998-10-13 Harris Instrument Corporation Apparatus and method for binocular measurement system
US20020125448A1 (en) * 2001-03-06 2002-09-12 Samsung Electronics Co., Ltd. Multi-functioned wafer aligner
EP1418446A2 (fr) * 2002-11-05 2004-05-12 Leuze electronic GmbH + Co KG Capteur optique
US20050117162A1 (en) * 2003-09-30 2005-06-02 Bing Zhao Diffractive non-contact laser gauge
US20110299095A1 (en) * 2008-11-08 2011-12-08 Adaptive Automation Limited Shadow Sensing Apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240041918A (ko) 2021-06-24 2024-04-01 카와사키 주코교 카부시키가이샤 얼라이너 장치

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AT520964A1 (de) 2019-09-15

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