WO2019164444A8 - Optimized top contact grid design for thin film solar cells and method of producing the same - Google Patents
Optimized top contact grid design for thin film solar cells and method of producing the same Download PDFInfo
- Publication number
- WO2019164444A8 WO2019164444A8 PCT/SE2019/050163 SE2019050163W WO2019164444A8 WO 2019164444 A8 WO2019164444 A8 WO 2019164444A8 SE 2019050163 W SE2019050163 W SE 2019050163W WO 2019164444 A8 WO2019164444 A8 WO 2019164444A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- producing
- thin film
- contact grid
- same
- solar cells
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/951—Lift-off
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electromagnetism (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
The present invention relates to a solar cell comprising a top contact grid provided on top of a transparent front contact. The top contact grid comprises a plurality of branches, wherein at least one branch has a first side surface and a second side surface extending upwards from the surface of the transparent front contact, a fractured top surface parallel to the surface of the transparent front contact and a first branch edge joining the first side surface and the fractured top surface and a second branch edge joining the second side surface and the fractured top surface. The cross section of the branch is very near a rectangular shape.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE1850194-0 | 2018-02-22 | ||
SE1850194A SE541452C2 (en) | 2018-02-22 | 2018-02-22 | Method for patterning a surface with a metal by controlling the generation of cracks or gaps in a deposited metal layer |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2019164444A1 WO2019164444A1 (en) | 2019-08-29 |
WO2019164444A8 true WO2019164444A8 (en) | 2019-11-14 |
WO2019164444A9 WO2019164444A9 (en) | 2020-01-02 |
Family
ID=65685934
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE2019/050162 WO2019164443A1 (en) | 2018-02-22 | 2019-02-22 | Method for patterning a surface with a metal by controlling the generation of cracks or gaps in a deposited metal layer |
PCT/SE2019/050163 WO2019164444A1 (en) | 2018-02-22 | 2019-02-22 | Optimized top contact grid design for thin film solar cells and method of producing the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE2019/050162 WO2019164443A1 (en) | 2018-02-22 | 2019-02-22 | Method for patterning a surface with a metal by controlling the generation of cracks or gaps in a deposited metal layer |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3821298A1 (en) |
SE (1) | SE541452C2 (en) |
WO (2) | WO2019164443A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021260084A1 (en) | 2020-06-26 | 2021-12-30 | Evolar Ab | Photovoltaic top module |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4119483A (en) * | 1974-07-30 | 1978-10-10 | U.S. Philips Corporation | Method of structuring thin layers |
US4115120A (en) * | 1977-09-29 | 1978-09-19 | International Business Machines Corporation | Method of forming thin film patterns by differential pre-baking of resist |
JPS5669835A (en) * | 1979-11-09 | 1981-06-11 | Japan Electronic Ind Dev Assoc<Jeida> | Method for forming thin film pattern |
JPS59211289A (en) * | 1983-05-16 | 1984-11-30 | Fuji Electric Corp Res & Dev Ltd | Manufacture of amorphous silicon solar battery |
US4662989A (en) * | 1985-10-04 | 1987-05-05 | Honeywell Inc. | High efficiency metal lift-off process |
US7297470B2 (en) * | 2004-01-05 | 2007-11-20 | Hitachi Global Storage Technologies Netherlands B.V. | Image transfer process for thin film component definition |
US8357244B1 (en) * | 2007-06-28 | 2013-01-22 | Western Digital (Fremont), Llc | Method for lifting off photoresist beneath an overlayer |
US20110277816A1 (en) * | 2010-05-11 | 2011-11-17 | Sierra Solar Power, Inc. | Solar cell with shade-free front electrode |
KR101835293B1 (en) * | 2010-09-03 | 2018-03-06 | 테트라썬, 아이엔씨. | Fine line metallization of photovoltaic devices by partial lift-off of optical coatings |
DE102013111981A1 (en) * | 2013-10-30 | 2015-04-30 | Hanergy Holding Group Ltd. | Method for producing a thin-film solar cell module and thin-film solar cell module |
-
2018
- 2018-02-22 SE SE1850194A patent/SE541452C2/en not_active IP Right Cessation
-
2019
- 2019-02-22 WO PCT/SE2019/050162 patent/WO2019164443A1/en unknown
- 2019-02-22 EP EP19710175.1A patent/EP3821298A1/en active Pending
- 2019-02-22 WO PCT/SE2019/050163 patent/WO2019164444A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2019164443A1 (en) | 2019-08-29 |
SE1850194A1 (en) | 2019-08-23 |
EP3821298A1 (en) | 2021-05-19 |
WO2019164444A9 (en) | 2020-01-02 |
WO2019164444A1 (en) | 2019-08-29 |
SE541452C2 (en) | 2019-10-08 |
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