WO2019160355A1

WO2019160355A1 - Film touch sensor and structural body for film touch sensor

Info

Publication number: WO2019160355A1
Application number: PCT/KR2019/001826
Authority: WO
Inventors: 조성훈; 김상국
Original assignee: 동우화인켐 주식회사
Priority date: 2018-02-14
Filing date: 2019-02-14
Publication date: 2019-08-22
Also published as: KR102492919B1; KR20190098482A

Abstract

The present invention relates to a film touch sensor and a structural body for a film touch sensor for which a process is proceeded by forming a separation layer formed of a certain ingredient on a carrier substrate and in which an insulation layer used as a planarization layer, an adhesive layer, or a base layer is formed on a transparent conductive film pattern.

Description

Film touch sensor and structure for film touch sensor

The present invention relates to a film touch sensor and a structure for a film touch sensor.

As the touch input method has been spotlighted as the next generation input method, attempts have been made to introduce touch input methods to a wider variety of electronic devices. Therefore, research and development on touch sensors that can be applied to various environments and enable accurate touch recognition have been actively made. ought.

For example, in the case of an electronic device having a touch type display, an ultra-thin flexible display that achieves ultra-light weight, low power, and improved portability has attracted attention as a next-generation display, and development of a touch sensor applicable to such a display has been required.

A flexible display means a display manufactured on a flexible substrate that can bend, bend, or roll without loss of properties, and technologies are being developed in the form of flexible LCDs, flexible OLEDs, and electronic paper.

In order to apply a touch input method to such a flexible display, a touch sensor having excellent bending and resilience and excellent flexibility and elasticity is required.

In the film touch sensor for manufacturing such a flexible display, the wiring board which contains the wiring embedded in the transparent resin base material is proposed.

A wiring forming step of forming a metal wiring on the substrate, a lamination step of forming a transparent resin substrate by coating and drying a transparent resin solution to cover the metal wiring, and a peeling step of peeling the transparent resin substrate from the substrate. .

In such a manufacturing method, in order to perform the peeling process smoothly, an inorganic releasing material such as an organic releasing agent such as a silicone resin or a fluororesin, a diamond like carbon thin film (DLC) thin film or a zirconium oxide thin film is preliminarily formed on the surface of the substrate. Forming method is used.

However, in the case of using the inorganic release agent, when the substrate and the metal wiring are peeled off from the substrate, there is a problem that the peeling of the wiring and the substrate does not proceed smoothly and some of the metal wiring and the substrate remain on the surface of the substrate. There is a problem that the material adheres to the surface of the wiring and the substrate.

In other words, even if a release agent is used, there is a problem that the metal wiring of the wiring board cannot be completely peeled from the board.

In order to solve this problem, the method proposed in Korean Patent No. 10-1191865 includes a sacrificial layer, a metal wiring, and a metal layer, which may be removed by light or a solvent in the manufacturing of a flexible substrate having a metal wiring embedded therein. After the polymer material (flexible substrate) is formed on the substrate, the metal wiring and the polymer material (flexible substrate) are peeled off from the substrate by removing the sacrificial layer using light or a solvent.

However, this method is difficult to remove the sacrificial layer in a large size, there is a problem that can not use a variety of film substrates because the high temperature process is impossible.

The present invention is excellent in peelability on the carrier substrate, and proceeds the process by forming a separation layer formed of a specific component that prevents electrode damage and crack generation, when separated from the carrier substrate to be used as a wiring coating layer It is an object to provide a film touch sensor and a structure for a film touch sensor.

Since the present invention implements a touch sensor on a carrier substrate, a film touch sensor and a film touch sensor that can secure a fine pitch and heat resistance, which are impossible in a process of implementing a touch sensor directly on a film substrate, and can diversify the film substrate. Its purpose is to provide a structure.

The present invention proceeds by forming a separation layer of a specific component with controlled peel force and thickness on the carrier substrate, and does not remove the separation layer even after separation from the carrier substrate, there is no separate layer removal process And to provide a structure for a film touch sensor.

The present invention has easy peelability, can withstand heating up to 150 ° C, preferably can withstand heating up to 230 ° C, and is also resistant to solvents used in photoresist solutions, and is an alkaline developer It is an object of the present invention to provide a film touch sensor and a structure for a film touch sensor including a separation layer that can withstand.

1. Separation layer; An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode; And an insulating layer formed on the electrode pattern layer and covering part or all of the electrode pattern layer, wherein the separation layer contains an alcoholic secondary or tertiary OH group or a phenolic OH group. A chain polymer having a side chain having a group and a crosslinking agent, wherein the chain polymer includes a unit derived from at least one monomer selected from a monomer represented by Formula 1 and a monomer represented by Formula 2 below It is formed of a resin composition, The crosslinking agent is a triazine compound, its condensate and mixtures thereof; Glycoluril compounds, their condensates, and mixtures thereof; And an imidazolidinone-based compound, a condensate thereof, and a mixture thereof.

[Formula 1]

(Formula 1, R ^1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl group and substituted or unsubstituted alkenyl group,

L ¹ is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group, and a substituted or unsubstituted alkenylene group,

L ² is O or NH,

R ^2a , R ^3a and R ^4a are each independently selected from the group consisting of hydrogen and a substituted or unsubstituted hydrocarbon group,

Provided that at least one of R ^2a , R ^3a and R ^4a is a substituted or unsubstituted alcoholic secondary or tertiary OH-containing group or phenolic OH-containing group,

Or a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, substituted with at least two of R ^2a , R ^3a and R ^4a and containing an alcoholic secondary or tertiary OH or phenolic OH Or an unsubstituted aromatic group, a substituted or unsubstituted hetero aromatic group, and a polycyclic including them)

[Formula 2]

(Formula 2, R ^1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl group and substituted or unsubstituted alkenyl group,

R ^5a to R ^14a are each independently selected from the group consisting of hydrogen, a hydroxy group, and a functional group represented by the following formula (3), or one to form a ring, provided that at least one of R ^5a to R ^14a or a substituent of the ring is Hydroxy group)

[Formula 3]

In Formula 3, R ^15a is a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group, and a substituted or unsubstituted heteroaromatic. Selected from the group consisting of flags)

2. In the above 1, wherein L ¹ is selected from the group consisting of a substituted or unsubstituted alkylene group and a substituted or unsubstituted alkenylene group, the film touch sensor.

3. In the above 1, wherein L ¹ is a substituted or unsubstituted alkylene group, the touch sensor film.

4. In the above 1, wherein L ¹ is a methylene group, the film touch sensor.

5. In the above 1, wherein the chain polymer comprises a monomer unit represented by the following formula (6), film touch sensor:

[Formula 6]

(In formula 6,

R ^1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group and a substituted or unsubstituted alkenyl group,

R ^19a is selected from the group consisting of a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group, and a substituted or unsubstituted heteroaromatic group)

6. In the above 5, wherein L ¹ is a substituted or unsubstituted alkylene group, the touch sensor film.

7. In the above 5, wherein L ¹ is a methylene group, the film touch sensor.

8. In the above 5, wherein R ^19a is a phenyl group, the film touch sensor.

9. In the above 1, wherein the cross-linking agent is selected from the group consisting of triazine-based compound, triazine-based compound condensate, and mixtures thereof, film touch sensor.

10. In the above 1, wherein the crosslinking agent is a compound represented by the following formula B-1, film touch sensor:

[Formula B-1]

11. The film touch sensor according to the above 1, wherein L ¹ is a single bond.

12. In the above 1, wherein any two or more of the R ^5a to R ^14a is a hydroxy group, the remainder is hydrogen, the film touch sensor.

13. In the above 1, wherein any one of the R ^5a to R ^14a is a hydroxyl group, the rest is hydrogen, the film touch sensor.

14. In the above 1, wherein R ^5a to R ^13a is hydrogen, R ^14a is a hydroxy group, the film touch sensor.

15. The method according to the above 1, wherein the crosslinking agent is selected from the group consisting of glycouril-based compounds, glycouril-based compounds, and mixtures thereof, the film touch sensor.

16. In the above 1, wherein the crosslinking agent is a compound represented by the following formula B-2, the film touch sensor:

[Formula B-2]

17. In the above 1, wherein the cross-linking agent is a compound represented by the following formula B-3, film touch sensor:

[Formula B-3]

18. In the above 1, wherein the curable resin composition is provided as a solution, the film touch sensor.

19. The touch sensor of claim 18, wherein the solvent of the solution comprises an alcohol.

20. The method according to the above 19, wherein the alcohol comprises a primary alcohol, film touch sensor.

21. The film touch sensor according to the above 19, wherein the alcohol comprises ethanol.

22. The method according to the above 19, wherein the alcohol content is present in more than 10% by weight of the solvent weight, the film touch sensor.

23. The method according to the above 1, wherein the crosslinking agent, a full or partial alkoxymethylated melamine, its condensate and mixtures thereof; Fully or partially alkoxymethylated guanamines, their condensates and mixtures thereof; Fully or partially alkoxymethylated acetoguanamine, its condensates and mixtures thereof; Fully or partially alkoxymethylated benzoguanamine, condensates thereof and mixtures thereof; Fully or partially alkoxymethylated glycolurils, their condensates and mixtures thereof; And fully or partially alkoxymethylated imidazolidinone, condensates thereof, and mixtures thereof.

24. The method according to 1 above, wherein the crosslinking agent includes a compound selected from the group consisting of compounds represented by the following Chemical Formulas 7, 9 and 10 and their respective condensates, the film touch sensor:

[Formula 7]

In Formula 7, R ^1b is a substituted or unsubstituted alkyl group having 1 to 25 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 25 carbon atoms, a substituted or unsubstituted aromatic group having 6 to 25 carbon atoms, substituted with 4 to 25 carbon atoms, or It is selected from the group consisting of an unsubstituted hetero aromatic group, and a disubstituted amine represented by the formula (8),

R ^2b , R ^3b , R ^4b and R ^5b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms)

[Formula 8]

(In Formula 8, R ^6b and R ^7b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.)

[Formula 9]

(In Formula 9, R ^8b , R ^9b , R ^10b and R ^11b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.)

[Formula 10]

In Formula 10, R ^12b and R ^13b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms,

R ^14b and R ^15b are each independently selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms)

25. The method according to the above 24, wherein the condensate in the crosslinking agent comprises a polymer of the compound represented by Formula 7, Formula 9 or Formula 10, film touch sensor.

26. The method according to the above 24, wherein the condensate in the crosslinking agent comprises at least one of a dimer, a trimer and a quaternary or higher polymer of the compound represented by Formula 7, Formula 9 or Formula 10, film touch sensor.

27. In the above 24, wherein the crosslinking agent will have a weight average polymerization degree of 1.3 to 1.8 for the compound represented by the formula 7, Formula 9 or Formula 10, respectively, the film touch sensor.

28. The above 24,

R ^1b is selected from the group consisting of a substituted or unsubstituted aromatic group having 6 to 25 carbon atoms, a disubstituted amine represented by the following formula (11),

R ^2b to R ^13b are each independently a substituted or unsubstituted alkyl having 1 to 10 carbon atoms,

Touch film sensors wherein R ^14b and R ^15b are independently of each other hydrogen:

[Formula 11]

29. The method according to the above 1, wherein the mass ratio of the chain polymer and the crosslinking agent is 1: 0.05 to 1: 2, the film touch sensor.

30. In the above 1, wherein the curable resin composition further comprises an acid catalyst, film touch sensor.

31. The film touch sensor according to the above 30, wherein the acid catalyst is selected from the group consisting of Bronsted acid, Lewis acid and mixtures thereof, salts thereof and solvates thereof.

32. The method of 1 above, wherein the curable resin composition further comprises at least one selected from the group consisting of surfactants, fillers, additives and blowing agents, film touch sensor.

33. The method of 1 above, wherein the curable resin composition further comprises a surfactant, film touch sensor.

34. The method of 1 above, wherein the curable resin composition further comprises a foaming agent, the film touch sensor.

35. In the above 1, wherein the curable resin composition has a curability that is cured by heating for 1 minute at 150 ℃, film touch sensor.

36. The touch sensor of 1 above, wherein the separation layer has a transmittance (% T) of 99% or more at 400 nm and a b * of 0.1 or less.

37. In the above 1, wherein the separation layer has a heat resistance of 230 ℃ to 300 ℃, film touch sensor.

38. The above 1, wherein the separation layer has a heat resistance of 1 to 2 hours, 230 ℃ to 260 ℃, film touch sensor.

39. The method of 1 above, wherein the separation layer has a heat resistance of 8 hours or more at 230 ℃, film touch sensor.

40. The method of 1 above, wherein the separation layer has a heat resistance of 1 to 2 hours at 230 ℃, film touch sensor.

41. The touch sensor of 1 above, wherein the separation layer has a peel force of 0.5 N / mm ² or less on a soda glass substrate or an alkali free glass substrate.

42. The touch sensor of 1 above, wherein the separation layer has a peel force of 0.1 N / mm ² or less on a soda glass substrate or an alkali free glass substrate.

43. The method of 1 above, wherein the film touch sensor further comprises a protective layer formed between the separation layer and the electrode pattern layer, the film touch sensor.

44. The touch sensor according to the above 1, further comprising an optical film disposed on the insulating layer.

45. The method of 1 above, wherein the electrode pattern layer is formed of at least one selected from the group consisting of metal, metal nanowires, metal oxides, carbon nanotubes, graphene, conductive polymers and conductive inks, film touch sensor.

46. The method according to the above 1, further comprising a functional film layer formed via a pressure-sensitive adhesive or an adhesive on the opposite side on which the electrode pattern layer of the separation layer is formed.

47. The touch sensor of claim 46, wherein the functional film layer is at least one functional film selected from the group consisting of a transparent film, a retardation film, an isotropic film, a protective film, a polarizer, a polarizer, and a barrier film.

48. The method according to the above 46, wherein the functional film layer is a film having a functional coating layer formed on the base film, the functional coating layer comprises a coating organic film layer, a coating retardation layer, a coating polarizer layer or a coating alignment film layer, Film touch sensor.

49. (i) preparing a chain polymer comprising a side chain having an alcoholic secondary or tertiary OH containing group or a phenolic OH containing group and a crosslinking agent; (ii) applying a curable resin composition comprising the chain polymer and the crosslinking agent onto a substrate to form a curable resin composition coating film; And (iii) forming a separation layer by performing a polymerization reaction on the curable resin composition coating film to cure the film.

50. The method of claim 49, wherein the manufacturing method further comprises the step of (iv) peeling the separation layer formed on the substrate from the substrate.

51. The film touch according to 49 above, wherein the ratio of monomer units including alcoholic secondary or tertiary OH-containing groups or phenolic OH-containing groups in the monomer units constituting the chain polymer is 30 to 100 mol%. Method of manufacturing the sensor.

52. The method of 49 above, wherein the crosslinking agent is fully or partially alkoxymethylated melamine, fully or partially alkoxymethylated guanamine, fully or partially alkoxymethylated acetoguanamine, or fully or partially alkoxymethylated benzoguanamine, and fully or partially alkoxymethylated Will be selected from the group consisting of glycoluril, the method of manufacturing a touch sensor film.

53. The method of claim 49, wherein the mass ratio of the chain polymer and the crosslinking agent is 1: 0.05 to 1: 2, the film touch sensor manufacturing method.

54. carrier substrate; A separation layer formed on the carrier substrate; An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode; An insulating layer formed on the electrode pattern layer and covering a part or the entirety of the electrode pattern layer; and including a side chain having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group. A chain polymer and a crosslinking agent, wherein the chain polymer is formed of a curable resin composition comprising a unit derived from at least one monomer selected from a monomer represented by Formula 1 and a monomer represented by Formula 2 below, The crosslinking agent may include a triazine compound, a condensate thereof, and a mixture thereof; Glycoluril compounds, their condensates, and mixtures thereof; And an imidazolidinone-based compound, a condensate thereof, and a mixture thereof.

[Formula A]

In Formula A, R ^1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group,

L ² is O or NH,

[Formula B]

In Formula 11, R ^1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group,

R ^5a to R ^14a are each independently selected from the group consisting of hydrogen, a hydroxy group, and a functional group represented by the following general formula (C), or one to form a ring, provided that at least one of R ^5a to R ^14a or a substituent of the ring is Hydroxy group)

[Formula C]

In Formula C, R ^15a is a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group, and a substituted or unsubstituted heteroaromatic Selected from the group consisting of flags)

55. The structure of claim 54, wherein the film touch sensor structure further comprises a protective layer formed between the separation layer and the electrode pattern layer.

The present invention can increase the efficiency of the touch sensor manufacturing process by forming an insulating layer used as a planarization layer, an adhesive layer or a substrate layer on the transparent conductive film pattern.

The present invention is excellent in peelability on the carrier substrate, and proceeds the process by forming a separation layer of a specific component that prevents electrode damage and crack generation, and when separated from the carrier substrate so that the separation layer is used as a wiring coating layer Increase efficiency and productivity.

According to the present invention, a process for implementing a touch sensor on a carrier substrate may be performed to ensure fine pitch and heat resistance, and to diversify the film substrate.

The present invention does not perform a separate separation layer removal process after separation from the carrier substrate, thereby simplifying the process and solving the problem applied to the touch sensor region in the removal process.

The present invention can suppress curl generation occurring in the film touch sensor after separation from the carrier substrate.

The present invention may include a separation layer thin film (eg, several hundred nm thick) that can be easily peeled off without difficulty by applying a specific curable resin composition to a carrier substrate and curing the carrier substrate. In addition, the separation layer thin film thus formed on the substrate can withstand heating up to 150 ° C, preferably can withstand heating up to 230 ° C, furthermore, is resistant to the solvent used in the photoresist solution, and is an alkaline developer. Since it can endure, it can be advantageously used as a resin base film for circuit manufacture by the photolithography method. In addition, since the separation layer thin film formed according to the present invention has easy peelability even after heating at such a temperature, the separation layer thin film can be provided to a circuit fabrication process including a high temperature firing step, compared to the conventional thin film. It is advantageous for the preservation of properties and can be easily peeled off from the substrate even after fabrication of the circuit, thereby providing a touch sensor or a touch sensor structure having excellent peel force characteristics and crack suppression characteristics.

1 to 4 are structural cross-sectional views of a film touch sensor according to an embodiment of the present invention.

5A to 5F are cross-sectional views illustrating a method of manufacturing a film touch sensor according to the present invention.

6A and 6B are cross-sectional views illustrating a method of manufacturing a film touch sensor according to the present invention.

7A and 7B are cross-sectional views illustrating a method of manufacturing a film touch sensor according to the present invention.

8 is a structural cross-sectional view of a film touch sensor according to an embodiment of the present invention.

One embodiment of the invention the separation layer; An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode; And an insulating layer formed on the electrode pattern layer and covering a part or all of the electrode pattern layer, wherein the separation layer includes an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group. A chain polymer having a branched side chain and a crosslinking agent, wherein (a) the side chain contains 3 to 30 carbon atoms and includes at least one saturated or unsaturated hydrocarbon group, or further includes at least one aromatic group And, by including a bond selected from the group consisting of -COO-, -O-, and -CO- connecting between the carbon atoms, excellent peelability on the carrier substrate, preventing electrode damage and cracks Forming a separation layer of a specific component and proceeding a touch sensor formation process, and when separated from the carrier substrate, the separation layer is used as a wiring coating layer to implement a touch sensor directly on the film substrate A fixed three (fine pitch) can not be in the process, it is possible to ensure heat resistance, diversify film substrate.

The present invention is excellent in peelability on the carrier substrate, forming a separation layer to prevent electrode damage and cracks to proceed the touch sensor forming process, to form an insulating layer to use as an adhesive layer for subsequent film adhesion, It can be used as an optical (film) layer or a planarization layer. The insulating layer used as the planarization layer prevents the corrosion of the electrode pattern and the surface is planarized, thereby suppressing the occurrence of microbubbles during adhesion to the film substrate through an adhesive or an adhesive.

In the present invention, when there is an isomer of a repeating unit, compound or resin represented by the formula, the repeating unit, compound or resin represented by the formula means a representative formula including the isomer.

In the present invention, each repeating unit represented by the first and second resins should not be construed as limited as indicated, and the sub-repeating units in parentheses may be freely positioned at any position of the chain within a predetermined mole% range. That is, the parentheses of each repeating unit are represented by one block to express mol%, but each sub-repeating unit may be positioned in blocks or separately, without limitation, if it is in the resin.

(1) Definition of terms

As used herein, "heat resistance" means that the film obtained by curing the curable resin composition can withstand heating up to 150 ° C, preferably it can withstand heating up to 230 ° C and does not substantially cause decomposition or other deterioration. Say. The temperature of 230 ° C is a high temperature sufficient to be used as a firing temperature in the production of electronic circuits by the photolithography method.

As used herein, the term "peelable film" means that a film formed by coating and curing a substrate, particularly a glass substrate, can be easily peeled off from the substrate without breaking the film (that is, without difficulty). "Is the nature of such a film. As a glass substrate, a suitable glass substrate, such as a soda glass substrate and an alkali free glass substrate, is mentioned, for example. Soda glass substrates are particularly preferred examples.

As used herein, the "separation layer" is not limited in width. When used as a base film for circuit fabrication, the preferred thickness is 200 to 400 nm, for example about 300 nm, which corresponds to the current thinning request for electronic components, and the performance of the separation layer itself is not limited to this thickness range. Therefore, the thickness of the separation layer described herein is arbitrary.

As used herein, the term "side chain" refers to a structural moiety branched from the main chain, and the term "main chain" refers to a chain composed of atoms connected in the one-dimensional direction of a monomer unit which is repeated in the structure of the polymer. Thus, for example, when the polymer is a polymer of (meth) acrylate, "-COO-", which is a part involved in the formation of an ester bond in each monomer, is included in a part of the "side chain". On the other hand, the notation of "(meth) acrylate" denotes acrylate and methacrylate without distinction.

As used herein, "-O-" and "-CO-" include the case where they are part of "-COO-". In addition, "-COO-" represents the ester in the case where the base of both ends of an ester is not fixed, and contains both "-COO-" and "-O-CO-". However, if the base of both ends of the ester is fixed, "-COO-" and "-O-CO-" is used separately.

As used herein, "alkyl" refers to a monovalent group resulting from the removal of one hydrogen atom from an aliphatic hydrocarbon (alkane) such as methane, ethane, propane, and is generally represented by C _n H _{2n + 1} (n is a positive integer). Alkyl may be straight or branched. As an alkyl (C _1-4 alkyl) group having 1 to 4 carbon atoms, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, sec- Although a butyl group etc. are mentioned, this invention is not limited only to this illustration. As an alkyl (C _1-6 alkyl) group having _{1 to 6} carbon atoms, for example, an alkyl group having 1 to 4 carbon atoms, tert-butyl group, sec-butyl group, n-pentyl group, isoamyl group, Although n-hexyl group, isohexyl group, cyclohexyl group, etc. are mentioned, This invention is not limited only to this illustration. As an alkyl (C _1-10 alkyl) group having _{1 to 10} carbon atoms, for example, an alkyl group having 1 to 6 carbon atoms, n-octyl group, n-nonyl group, n-decanyl group, etc. may be mentioned. The present invention is not limited only to these examples.

As used herein, an "alkenyl group" refers to a monovalent group formed by removing one hydrogen atom from an aliphatic hydrocarbon (alkene) containing at least one double bond such as ethene, propene, butene, and is generally represented by C _m H _2m-1 . (M is an integer of 2 or more). Alkenyl groups can be straight or branched. Examples of the alkenyl group having 2 to 6 carbon atoms include ethenyl group, 1-propenyl group, 2-propenyl group, butenyl group, pentenyl group, hexenyl group, and the like, but the present invention is limited to these examples. It is not. Examples of alkenyl groups having 2 to 10 carbon atoms include alkenyl groups, heptenyl groups, octenyl groups, nonenyl groups, and dekenyl groups having 2 to 6 carbon atoms, but the present invention is not limited to these examples. .

As used herein, "alkynyl group" refers to a monovalent group resulting from the removal of one hydrogen atom from an aliphatic hydrocarbon (alkyne) containing at least one triple bond such as ethine (acetylene), propene, butene, and generally C _m H _2m-3 (M is an integer of 2 or more). Alkynyl groups can be straight or branched. Examples of the alkynyl group having 2 to 6 carbon atoms include ethynyl group, 1-propynyl group, 2-propynyl group, butynyl group, pentynyl group, hexynyl group, and the like, but the present invention is not limited to these examples. no. Examples of the alkynyl group having 2 to 10 carbon atoms include, for example, an alkynyl group having 2 to 6 carbon atoms, heptynyl group, octynyl group, noninyl group, and decinyl group, but the present invention is not limited to these examples. no.

As used herein, an "alkylene group" refers to a divalent group resulting from the loss of two hydrogen atoms from an aliphatic hydrocarbon (alkane) such as methane, ethane, or propane, and can generally be expressed _as- (C _m H _2m )-(m is an amount Integer). The alkylene group group may be straight or branched chain. Examples of the alkylene group having 1 to 10 carbon atoms include methylene group, ethylene group, n-propylene group, isopropylene group, n-butylene group, isobutylene group, tert-butylene group, n-pentylene group, n -Hexylene group, isohexylene group and the like, but the present invention is not limited only to these examples. The alkylene group is preferably an alkylene group having 1 to 6 carbon atoms, more preferably an alkylene group having 1 to 4 carbon atoms, still more preferably a methylene group and an ethylene group, even more preferably Preferably an ethylene group.

As used herein, "alkenylene group" refers to a divalent group resulting from the loss of two hydrogen atoms in an aliphatic hydrocarbon (alkene) containing at least one double bond, such as ethenylene, propenylene, butenylene, and generally-(C _m H2 _m-2 )-(m is an integer of 2 or more). Alkenylene groups may be straight or branched. As an alkenylene group having 2 to 10 carbon atoms, for example, an ethenylene group, n-propenylene group, isophenylene group, n-butenylene group, isobutenylene group, n-pentenylene group, n-hexenylene group And an isohexenylene group, but the present invention is not limited only to these examples. The alkenylene group may preferably be an alkenylene group having 2 to 6 carbon atoms, more preferably an alkenylene group having 2 to 4 carbon atoms, and more preferably an ethenylene group or an n-propenylene group. And even more preferably may be an ethenylene group.

As used herein, "alkoxy" refers to a monovalent group resulting from the loss of a hydrogen atom of an hydroxy group of an alcohol, and can generally be expressed as C _n H _{2n + 1} O-(n is an integer of 1 or more). The alkoxy group having 1 to 6 carbon atoms is, for example, methoxy, ethoxy, n-propyl oxy group, isopropyl oxy group, n-butyl oxy group, isobutyl oxy group, tert-butyloxy group, sec-butyl An oxy group, n-pentyloxy group, iso amyl oxy group, n-hexyloxy group, isohexyloxy group, etc. are mentioned, but this invention is not limited only to this illustration.

As used herein, "haloalkyl group" refers to an alkyl group in which one or a plurality of hydrogen atoms of the alkyl group are substituted with halogen atoms. In addition, "perhalogenated alkyl" refers to an alkyl group in which all hydrogen atoms of the alkyl group are substituted with halogen atoms. Examples of the haloalkyl group having 1 to 6 carbon atoms include trifluoromethyl group, trifluoroethyl, perfluoroethyltrifluoro n-propyl group, perfluoro n-propyl group, trifluoroisopropyl group, Perfluoroisopropyl group, trifluoro n-butyl group, perfluoro n-butyl group, trifluoroisobutyl group, perfluoro isobutyl group, trifluoro tert-butyl group, perfluoro tert- Butyl group, trifluoro n-pentyl group, perfluoro n-pentyl group, trifluoro n-hexyl group, perfluoro n-hexyl group, etc. can be mentioned, but this invention is not limited only to this illustration. .

As used herein, "cycloalkyl group" means a monocyclic or polycyclic saturated hydrocarbon group, and includes a crosslinked structure. For example, "C _3-12 cycloalkyl group" means a cyclic alkyl group having 3 to 12 carbon atoms. Specific examples of the "C _6-12 cycloalkyl group" include cyclohexyl group, cycloheptyl group, cyclooctyl group, adamantyl group, isobonyl group and the like. In the case of a "C _3-12 cycloalkyl group", a cyclopropyl group, cyclobutyl group, pentyl group, C _6-12 cycloalkyl group, etc. are mentioned. As said cycloalkyl group, Preferably, a C _6-12 cycloalkyl group is mentioned.

As used herein, "cycloalkenyl group" means a monocyclic or polycyclic unsaturated hydrocarbon group including a double bond, and includes a crosslinked structure. For example, "C _3-12 cyclo alkenyl group" means a cyclic alkenyl group having 3 to 12 carbon atoms. As a specific example, in the case of the "C _6-12 cyclo alkenyl group", 1-cyclohexenyl group, 2-cyclohexenyl group, 3-cyclohexenyl group, cycloheptenyl group, cyclooctenyl group, cykuronenyl group, etc. Can be mentioned. In the case of a "C _3-12 cycloalkyl group", a cyclopropenyl group, a cyclobutenyl group, a cyclopentenyl group, a C _6-12 cyclo alkenyl group, etc. are mentioned. The cyclo alkenyl group may preferably be a C _6-12 cyclo alkenyl group.

As used herein, the term "hydrocarbon group" refers to a monovalent group resulting from the loss of one hydrogen atom in a compound consisting solely of carbon and hydrogen. Hydrocarbon radicals include the above "alkyl groups", "alkenyl groups", "alkylene groups", "alkenylene groups", "cycloalkyl groups", "cyclo alkenyl groups", "aromatic groups", "alicyclic groups" and the like. Hydrocarbon groups can be saturated or unsaturated. Hydrocarbon groups are classified into chain hydrocarbon groups and cyclic hydrocarbon radicals according to the method of bonding carbon, and the cyclic hydrocarbon groups can be further divided into alicyclic hydrocarbon groups and aromatic hydrocarbon radicals. Examples of saturated or unsaturated hydrocarbon groups include methyl, ethyl, n-propyl, isopropyl, butyl, pentyl, hexyl, cyclohexyl, dicyclo pentadienyl, decarinyl, adamantyl, butenyl, hexenyl, cyclo Hexenyl, decyl and other side chains include, but are not limited to, various linear, branched, monocyclic, condensed ring bases within the limits of the number of carbon atoms. Each group may be a divalent or more group depending on the bonding relationship with the other group when not located at the terminal.

As used herein, the term "aromatic group" refers to a group resulting from the departure of one hydrogen atom bonded to an aromatic hydrocarbon ring. For example, a phenyl group (C ₆ H _5- ) in benzene, a tolyl group (CH ₃ C ₆ H _4- ) in toluene, a xylenyl group ((CH ₃ ) ₂ C ₆ H _3- ) in xylene, naph in naphthalene Til group (C ₁₀ H _8- ) is induced. In addition, the term "heteroaromatic group" used herein means a monocyclic or polycyclic hetero atom-containing aromatic group, and the functional group may have one or more heteroatoms of the same or different kind selected from a nitrogen atom, a sulfur atom and an oxygen atom (eg, For example, 1 to 4) can be included. Said "aromatic group" also includes "heteroaromatic group". Examples of aromatic groups include carbocyclic aromatic groups (monocyclic and condensed ring groups) such as phenyl, biphenyl, naphthyl and the like and heteroaromatic groups (monocyclic groups and condensed) such as pyridyl, pyrimidinyl, quinolinyl, triazinyl, etc. Ring groups) and each aromatic group may be a divalent or more group depending on the bonding relationship with other groups when not located at the terminal. Also used herein are groups having saturated or unsaturated hydrocarbon chain moieties that form rings together with the aromatic ring moiety (eg, tetrahydronaphthyl or dihydronaphthyl) as understood by bonding to aromatic groups and saturated or unsaturated hydrocarbon groups. do.

As used herein, "alicyclic (group)" refers to a moiety (or functional group) resulting from the departure of one hydrogen atom bonded to a ring having no aromaticity, consisting of only carbon and hydrogen. The alicyclic group includes the cycloalkyl group and the cyclo alkenyl group. The alicyclic group may be saturated or unsaturated. Examples of saturated or unsaturated alicyclic groups include various monocyclic, condensed cyclic groups within the limits of the number of carbon atoms of cyclohexyl, dicyclopentadienyl, decarinyl, adamantyl, cyclohexenyl and other side chains. It is not limited to this. Each group may be a divalent or more group depending on the bonding relationship with the other group when not located at the terminal.

In general, the term “substitution” refers to the conversion of a specific substituent radical, one or more hydrogens, into a radical in a given structure. The number of basic substituents defined herein is not particularly limited as long as it can be substituted, and means one or more. In addition, the description of each group also applies when the functional group is a part or substituent of another group except the case mentioned especially. Also, in the specification, the substituent content that does not specifically specify the term substitution means an unsubstituted substituent. In addition, the phrase substitution or unsubstitution in this specification was used by the expression which may be substituted.

"Substituted alkyl group", "substituted alkenyl group", "substituted alkynyl group", "substituted cycloalkyl group", "substituted cycloalkenyl group", "substituted hydrocarbon group", "substituted aromatic group", "substituted heteroaromatic group", " Examples of substituents to the criteria described herein, including "substituted alkylene groups", "substituted alkenylene groups", "groups with substituted or unsubstituted secondary or tertiary hydroxyl groups" and "substituted adamantyl groups" halogen, hydroxy, C _1-10 alkyl group, C _{1 ~ 10} alkoxy group, C _2-10 alkenyl, C _6-12 cycloalkyl, C _6-12 cycloalkenyl group, C _1-10 haloalkyl group, C _{2- 10} haloalkenyl group, C _6-18 hydrocarbon group, C _6-18 aromatic group, C _6-18 heteroaromatic group, C _1-10 alkyl group substituted with C _6-12 aromatic group, C _6-12 hydrocarbon group substituted _1-10 alkyl, C _6-12 aromatic a C _2-10 alkenyl group, a C _2-10 alkenyl group, -CN, an oxo group (= O) substituted with a C _6-12 hydrocarbon group substituted with a -O (CH ₂₎ ₂ O-, -OC (CH ₃ ) ₂ O-, -OCH ₂ O-,- O-, ester group (-COO- or -O-CO-), ester group substituted with C _6-12 hydrocarbon group, ester group substituted with C _6-12 aromatic group, C _6-18 hydrocarbon group substituted with ester group, C _1-10 alkyl group, C _1-6 alkylene group, C _2-6 alkenylene group substituted with an ester group, and the like, but the present invention is not limited only to these examples. Preferred examples of the substituent include a hydroxy group, C _6-18 hydrocarbon group, C _1-10 alkyl, C _6-12 aromatic group-substituted C _1-10 alkyl, C _6-12 A C _1-10 alkyl group substituted by a hydrocarbon, an ester C _6-18 hydrocarbon group substituted by group, C _1-10 alkyl group substituted by ester group, ester group (-COO- or -O-CO-), ester group substituted by C _6-12 hydrocarbon group, C _6-12 aromatic group substituted with an ester group, C _2-10 alkenyl, C _6-12 aromatic group substituted C _2-10 alkenyl group, a C _2-10 alkenyl substituted with C _6-12 hydrocarbon group, a C _1-10 alkoxy group, C _6-12 cycloalkyl group, C _6-12 cyclo alkenyl group, and more specific examples thereof may be a benzoyloxy group, a phenyl group, a cyclohexyl group, a cyclo hexenyl group, an adamantyl group, or an adamantyl group substituted with a hydroxy group. Can be heard.

As used herein, an "α-substituted (meth) acrylic monomer" forms a double bond next to the ester group -COO-carbon, as shown in CH ₂ = C (R ^1a ) -COO-R ¹ . Refers to an acrylic monomer in which carbon is replaced. Similarly, "α-substituted vinyl ester monomer" refers to a double bond immediately next to the ester group -O-CO- oxygen (α position), as shown in CH ₂ = C (R ^1a ) -O-CO-R ³ . The acrylic monomer to which carbon to be formed is replaced is pointed out. "Al Substituted Vinyl Ether Monomer" is an acrylic based carbon which forms a double bond next to the ether group -O- oxygen (α position), as shown in CH ₂ = C (R ^1a ) -OR ⁴ Point to monomer. "α-substituted vinyl monomer" refers to an acrylic monomer in which internal carbon, not terminal carbon of a vinyl group, is replaced, as shown in CH ₂ = C (R ^1a ) -R ⁵ . R ¹ , R ³ , R ⁴ , R ⁵ and R ^1a are as defined in the preferred Example (2-1) curable resin composition described below.

The alcoholic secondary or tertiary OH-containing group herein refers to a functional group containing one or two or more alcoholic secondary or tertiary OH groups. The alcoholic secondary or tertiary OH-containing groups therefore also include the alcoholic secondary or tertiary OH groups themselves. Substituted or unsubstituted in the substituted or unsubstituted alcoholic secondary or tertiary OH-containing group includes one or two or more alcoholic secondary or tertiary OH groups, and the part other than the corresponding OH group is substituted or substituted. It is not shown, and does not show whether the said OH group is substituted or unsubstituted.

The phenolic OH-containing group herein refers to a functional group containing one or two or more phenolic OH groups. The phenolic OH containing group or thus also includes the phenolic OH group itself. Substituted or unsubstituted in the substituted or unsubstituted phenolic OH-containing group indicates that one or two or more phenolic OH groups are included, and the portion other than the hydroxy group is substituted or unsubstituted, It does not indicate that it is not substituted.

As used herein, "solvate" means a compound or salt thereof that further comprises a solvent in a maintenance or indefinite amount bound by non-covalent intermolecular forces that are not particularly rejected. If the solvent is water, the solvate is a hydrate.

As used herein, "or" is used when employing "one or more" of the matters listed in the sentence. The same is true of "or". When specified herein as "range of two values", the range also includes the two values themselves. Therefore, the range "X to Y" means "X or more and Y or less" and "Weight" and "mass", "wt%" or "wt%" and "mass%" unless otherwise specified. The terms "about" refer to all ranges of values obtained by rounding the significant digits or one digit below the displayed digit, especially if the measurement value has a tolerance of 10% which does not reject.

(2) Description of Preferred Embodiments

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is only an example and the present invention is not limited thereto. Therefore, it is clear that a person of ordinary skill in the art to which the invention pertains (hereinafter referred to as a person skilled in the art) may appropriately modify the present invention in consideration of the description herein. In addition, embodiments of the present invention may be used alone or in combination.

1 and 2, the film touch sensor according to example embodiments may include a separation layer 20, a protection layer 30, an electrode pattern layer 40, and an insulating layer.

3 and 4, the film touch sensor according to example embodiments may further include an adhesive layer 60 and / or an optical film 100.

(2-1) curable resin composition

The separation layer 20 which concerns on this invention can contain the cured resin film formed from the following curable resin composition.

The curable resin composition includes a chain polymer having a side chain having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group; And a crosslinking agent;

(a) The side chain includes -COO-,-containing from 3 to 30 carbon atoms, containing at least one saturated or unsaturated hydrocarbon group, or further containing at least one aromatic group, and connecting the carbon atoms; O-, and -CO- may comprise a bond selected from the group consisting of

If necessary, (b) the said crosslinking agent is a triazine type compound, its condensate, and mixtures thereof; Glycoluril compounds, their condensates, and mixtures thereof; And imidazolidinone-based compounds, condensates thereof, and mixtures thereof.

The separation layer of the present invention may be referred to as a thermosetting resin composition cured by heat treatment.

The chain polymer which is one of the components of the curable resin composition of this invention is equipped with the side chain which has an alcoholic secondary or tertiary OH containing group or phenolic OH containing group.

In the present invention, the number of carbon atoms contained in the side chain having an alcoholic secondary or tertiary OH-containing group or phenolic OH-containing group of the chain polymer is preferably 3 to 30. The number of hydroxyl groups in the side chain having an alcoholic secondary or tertiary OH containing group or a phenolic OH containing group may be one or two or more.

Said side chain consists of at least 1 saturated or unsaturated hydrocarbon group of carbon atoms, or further contains at least 1 aromatic group. The side chain may contain one or two or more bonds selected from the group consisting of -COO-, -O- and -CO-. The saturated or unsaturated hydrocarbon group constituting the side chain may be, for example, one group alone or may occupy all carbon atoms in the side chain, and a plurality of saturated or unsaturated carbon groups may be composed of -COO-, -O-, and -CO-. It may be connected through a combination selected from. When the side chain contains an aromatic group in addition to a saturated or unsaturated hydrocarbon group, the saturated or unsaturated hydrocarbon group and the aromatic group may be directly bonded, or may be connected via a bond selected from the group consisting of -COO-, -O- and -CO-. do.

In the present invention, the side chain alcoholic secondary and tertiary OH-containing groups or phenolic OH-containing groups are applied by the curable resin composition of the present invention on a glass substrate and cured to form a separation layer, which is separated from the substrate even after firing. This is a decisive factor in making it sustainable. In addition, it is more preferable that the alcoholic secondary or tertiary OH-containing group or phenolic OH-containing group of the side chain is bonded to the alicyclic portion of the side chain, and the alicyclic portion of the side chain can also maintain the peeling property of the separation layer. It is a decisive factor. Chain polymers having such side chains include suitable crosslinking agents, in particular triazine-based compounds, their condensates and mixtures thereof; Glycoluril compounds, their condensates, and mixtures thereof; And when hardened | cured with the resin composition of what was chosen from the group which consists of an imidazolidinone type compound, its condensate, and mixtures thereof, a heat resistant peeling film can be provided.

In the present invention, the chain polymer having the side chain having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group is more preferably an unsubstituted or α-substituted (meth) acrylic monomer, an unsubstituted or α-substituted vinyl. At least one selected from the group consisting of an ester monomer, an unsubstituted or α-substituted vinyl ether monomer, and an unsubstituted or α-substituted vinyl monomer other than the above may be included as a monomer.

In the present invention, the chain polymer having the side chain having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group is more preferably a (meth) acrylate monomer, a vinyl ester monomer, or a vinyl ether system. It consists of including at least 1 sort (s) of a monomer and other vinyl-type monomers as a monomer unit.

Preferably, the chain polymer of the present invention is CH ₂ = C (R ^1a ) -COO-R ¹ , CH ₂ = C (R ^1a ) -O-CO-R ³ , CH ₂ = C (R ^1a ) -OR ⁴ And CH ₂ = C (R ^1a ) -R ⁵ , wherein R ¹ , R ³ , R ⁴ and R ⁵ independently of each other include the ester bond constituent carbon atoms when they are bonded to each vinyl group through an ester bond. It has 3 to 30 carbon atoms, more preferably 3 to 25 carbon atoms, even more preferably 3 to 20 carbon atoms, and has an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group, and at least one It may comprise a saturated or unsaturated hydrocarbon group, or may further comprise at least one aromatic group, and may have a bond selected from the group consisting of —COO—, —O—, and —CO—, which connects carbon atoms. It includes a monomer selected from the group consisting of compounds represented by).

More preferably, the chain polymer of the present invention is CH ₂ = CH-COO-R ¹ , CH ₂ = C (CH ₃ ) -COO-R ² , CH ₂ = CH-O-CO-R ³ , CH ₂ = CH-0-R ⁴ and CH ₂ = CH-R ⁵ (wherein R ¹ , R ² , R ³ , R ⁴ and R ⁵ are independently of each other, the ester when each vinyl group is bonded via an ester bond) Groups having 3 to 30 carbon atoms, more preferably 3 to 25 carbon atoms, even more preferably 3 to 20 carbon atoms, including constituent carbon atoms, and an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group It has at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group, selected from the group consisting of -COO-, -O- and -CO- which connects the carbon atoms Comprising monomer units selected from the group consisting of compounds It is broken.

In the above, examples of the saturated or unsaturated hydrocarbon group include methyl, ethyl, n-propyl, isopropyl, butyl, pentyl, hexyl, cyclohexyl, dicyclopentadienyl, decarinyl, adamantyl, butenyl, hexenyl And cyclohexenyl, decyl, and other linear, branched, monocyclic, and condensed cyclic groups within the limits of the number of carbon atoms in the side chain, but are not limited thereto. When each group is not located at the terminal, it may contribute more than bivalent according to the bonding relationship with another group. Examples of the aromatic group include carbocyclic aromatic groups (monocyclic and condensed cyclic groups) such as phenyl, biphenylyl, naphthyl and the like, and heteroaromatic groups such as pyridyl, pyrimidinyl, quinolinyl, triazinyl (monocyclic groups and Condensed cyclic group), and each aromatic group may be a divalent or more group depending on the bonding relationship with other groups. On the other hand, in the present specification, a group having a saturated or unsaturated hydrocarbon chain portion which forms a ring together with an aromatic ring portion (for example, tetrahydronaphthyl or dihydronaphthyl) is a combination of an aromatic group and a saturated or unsaturated hydrocarbon group. Figure out.

In the present invention, the alcoholic secondary or tertiary hydroxy group is a hydroxy group substituted with a hydrogen atom on any secondary or tertiary carbon atom of the saturated or unsaturated hydrocarbon group constituting the side chain.

The hydroxyl group of the side chain of the chain polymer is preferably an alcoholic secondary or tertiary OH group or a phenolic OH group, and more preferably bonded to an alicyclic group constituting part or all of the side chain.

More preferably, the side chain polymer of the present invention may include a monomer represented by the following formula (1).

[Formula 1]

In formula 1, R ^1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group and a substituted or unsubstituted alkenyl group,

L ² is O or NH,

Or a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, substituted with at least two of R ^2a , R ^3a and R ^4a and containing an alcoholic secondary or tertiary OH or phenolic OH Or an unsubstituted aromatic group, a substituted or unsubstituted hetero aromatic group, and a polycyclic including them.

More preferably, the side chain polymer of the present invention is selected from the group consisting of hydrogen and a substituted or unsubstituted alkyl group R ^1a in Formula 1, L1 is selected from the group consisting of a single bond and a substituted or unsubstituted alkylene group. R ^2a , R ^3a and R ^4a are each independently selected from the group consisting of hydrogen and a substituted or unsubstituted hydrocarbon radical, wherein at least one of R ^2a , R ^3a and R ^4a is an alcoholic secondary or tertiary OH It may include a monomer selected from the group consisting of a containing group, a phenolic OH-containing group, a substituted or unsubstituted alcoholic secondary or tertiary OH-containing hydrocarbon radical, and a phenolic OH-containing hydrocarbon radical.

More preferably, in the side chain polymer of the present invention, in Formula 1, R ^1a is selected from the group consisting of hydrogen and an unsubstituted alkyl group, L1 is selected from the group consisting of a single bond and an unsubstituted alkylene group, and R ^2a , R ^3a And R ^4a are each independently selected from the group consisting of hydrogen and a substituted or unsubstituted hydrocarbon radical, wherein at least one of R ^2a , R ^3a and R ^4a contains an alcoholic secondary or tertiary OH-containing group, containing phenolic OH Groups, substituted or unsubstituted alcoholic secondary or tertiary OH-containing hydrocarbon radicals and phenolic OH-containing hydrocarbon radicals, the other two being independently of one another hydrogen and substituted or unsubstituted hydrocarbon radicals It may include a monomer unit selected from.

More preferably, the side chain polymer of the present invention may include a monomer represented by the following formula (2).

[Formula 2]

In Formula 2,

R ^5a to R ^14a are each independently selected from the group consisting of hydrogen, a hydroxy group, and a functional group represented by the following formula (3), or one to form a ring,

At least one of the substituents of R ^5a to R ^14a or the ring may be a hydroxy group.

[Formula 3]

In formula (3), R ^15a is a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group, and a substituted or unsubstituted heteroaromatic group. It may be selected from the group consisting of.

More preferably, the side chain polymer of the present invention is selected from the group consisting of hydrogen and a substituted or unsubstituted alkyl group R ^1a in Formula 2, L1 is selected from the group consisting of a single bond and a substituted or unsubstituted alkylene group R ^5a to R ^14a are each independently selected from the group consisting of hydrogen, a hydroxy group, and a functional group represented by Formula 3, or become one to form a ring, wherein at least one of R ^5a to R ^14a or a substituent of the ring is Hydroxy group, R ^15a in Formula 3 is a monomer selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group It may include.

More preferably, the side chain polymer of the present invention is selected from the group consisting of hydrogen and an unsubstituted alkyl group R ^1a in Formula 2, L1 is selected from the group consisting of a single bond and an unsubstituted alkylene group, R ^5a to In R ^14a , R ^7a is a hydroxy group, R ^9a is a functional group represented by Formula 3 above, otherwise, it is hydrogen or R ^5a to R ^14a become one to form a ring substituted with one hydroxy group, and in Formula 3 R ^15a may include a monomer selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, and a substituted or unsubstituted phenyl group. More preferably, the ring substituted with one hydroxy group may be adamantane substituted with at least one hydroxy group.

More preferably, the side chain polymer of the present invention may include a monomer represented by the following formula (4).

[Formula 4]

In Formula 4,

L ² is selected from the group consisting of a substituted or unsubstituted alkylene group and a substituted or unsubstituted alkenylene group, and R ^16a is selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, and a substituted or unsubstituted alkynyl group. R ^17a may be selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, and a substituted or unsubstituted alkynyl group.

More preferably, the side chain polymer of the present invention is selected from the group consisting of hydrogen and substituted or unsubstituted alkyl group R ^1a in Formula 4, L1 is selected from a substituted or unsubstituted alkylene group, R ^16a is substituted or It may be selected from an unsubstituted alkyl group, R ^17a may include a monomer selected from the group consisting of hydrogen and a substituted or unsubstituted alkyl group.

More preferably, the side chain polymer of the present invention may include a monomer represented by the following formula (5).

[Formula 5]

In Formula 5,

R ^1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group and a substituted or unsubstituted alkenyl group, L ¹ is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group and a substituted or unsubstituted alkenylene group, R ^18a may comprise a monomer which is an adamantyl group substituted with at least one hydroxy group.

More preferably, in the side chain polymer of the present invention, R ^1a in Formula 5 is selected from the group consisting of hydrogen and a substituted or unsubstituted alkyl group, L1 is selected from a single bond and a substituted or unsubstituted alkylene group, and R ^18a May include a monomer which is an adamantyl group substituted with at least one hydroxy group.

More preferably, the side chain polymer of the present invention may include a monomer represented by the following formula (6).

[Formula 6]

In Chemical Formula 6,

R ^1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group and a substituted or unsubstituted alkenyl group, L ¹ is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group and a substituted or unsubstituted alkenylene group, R ^19a may be selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted halo alkyl group and a substituted or unsubstituted cyclo alkenyl group.

More preferably, in the side chain polymer of the present invention, R ^1a in Formula 6 is selected from the group consisting of hydrogen and a substituted or unsubstituted alkyl group, L1 is selected from a single bond and a substituted or unsubstituted alkylene group, and R ^19a May include a monomer selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, and a substituted or unsubstituted cyclo alkenyl group.

More preferably, R ^19a in Chemical Formula 6 may be a substituted or unsubstituted adamantyl group.

Preferably, R ^1a in the monomer unit may be hydrogen or methyl, more preferably R ^1a may be methyl.

Preferred side chains having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group of the chain polymer of the present invention include the followings, but such OH groups may be included. It doesn't work.

(1a) AO-CO-type (A represents the remainder of the side chain. The same below.) Side chain: 2-hydroxyethoxycarbonyl, 2-hydroxypropoxycarbonyl, 4- (hydroxymethyl) cyclohex Silmethoxycarbonyl, 2-hydroxy-3- (cyclohexylcarbonyloxy) propoxycarbonyl, 3-benzoyloxy-2-hydroxypropoxycarbonyl, 4-benzoyloxy-3-hydroxycyclohexylme Methoxycarbonyl, 3-hydroxy-1-adamantyloxycarbonyl, 2-hydroxycyclohexyloxycarbonyl, 4-undecanoyloxy-3-hydroxycyclohexylmethoxycarbonyl, 4-buta Noyloxy-3-hydroxycyclohexylmethoxycarbonyl and the like.

(2a) A-CO-O-type side chain: 2-hydroxypropylcarbonyloxy, 2-hydroxy-3- (cyclohexylcarbonyloxy) propylcarbonyloxy, 3-benzoyloxy-2-hydroxypropyl Carbonyloxy, 4-benzoyloxy-3-hydroxycyclohexylmethylcarbonyloxy, 3-hydroxy-1-adamantylcarbonyloxy, 2-hydroxycyclohexoxycarbonyloxy, 4-undecano Yloxy-3-hydroxycyclohexylmethylcarbonyloxy, 4-butanoyloxy-3-hydroxycyclohexylmethylcarbonyloxy and the like.

(3a) AO-type side chains: 2-hydroxypropoxy, 2-hydroxy-3- (cyclohexylcarbonyloxy) propoxy, 3-benzoyloxy-2-hydroxypropoxy, 4-benzoyloxy-3 -Hydroxycyclohexylmethoxy, 3-hydroxy-1-adamantyloxy, 2-hydroxycyclohexoxyoxy, 4-undecanoyloxy-3-hydroxycyclohexylmethoxy, 4-butanoyloxy -3-hydroxycyclohexylmethoxy and the like.

(4a) Others: 2-hydroxypropyl, 2-hydroxy-3- (cyclohexylcarbonyloxy) propyl, 3-benzoyloxy-2-hydroxypropyl, 4-benzoyloxy-3-hydroxycyclohexylmethyl , 3-hydroxy-1-adamantyl, 2-hydroxycyclohexyl, 4-undecanoyloxy-3-hydroxycyclohexylmethyl, 4-butanoyloxy-3-hydroxycyclohexylmethyl and the like.

Preferred examples of the monomer which gives these side chains to the chain polymer include, but are not limited to the following.

(1b) 2-hydroxypropyl (meth) acrylate, 2-hydroxy-3- (cyclohexylcarbonyloxy) propyl (meth) acrylate, 3-benzoyloxy-2-hydroxypropyl (meth) acrylate , 4-benzoyloxy-3-hydroxycyclohexylmethyl (meth) acrylate, 1,3-adamantyldiol mono (meth) acrylate and 2-hydroxycyclohexyl (meth) acrylate, 4-undecano (Meth) acrylates, such as yloxy-3-hydroxycyclohexylmethyl (meth) acrylate and 4-butanoyloxy-3-hydroxycyclohexylmethyl (meth) acrylate.

(2b) 2-hydroxybutanoic acid vinyl ester, 2-hydroxy-3- (cyclohexylcarbonyloxy) butanoic acid vinyl ester, 3-benzoyloxy-2-hydroxybutanoic acid vinyl ester, 4-benzoyloxy- 3-hydroxycyclohexyl acetate vinyl ester, 3-hydroxy-1-adamantyl carboxylic acid vinyl ester, 2-hydroxycyclohexyl carboxylic acid vinyl ester, 4-undecanoyloxy-3-hydroxycyclo Vinyl esters such as hexyl acetate vinyl ester and 4-butanoyloxy-3-hydroxycyclohexyl acetate vinyl ester.

(3b) 2-hydroxypropyl vinyl ether, 2-hydroxy-3- (cyclohexylcarbonyloxy) propyl vinyl ether, 3-benzoyloxy-2-hydroxypropyl vinyl ether, 4-benzoyloxy-3-hydroxy Hydroxycyclohexyl methyl vinyl ether, 3-hydroxy-1-adamantyl vinyl ether, 2-hydroxycyclohexyl vinyl ether, 4-undecanoyloxy-3-hydroxycyclohexyl methyl ether, 4-butanoyloxy Vinyl ether, such as 3-hydroxycyclohexyl methyl ether.

(4b) 1-penten-4-ol, 4-hydroxy-5- (cyclohexylcarbonyloxy) -1-pentene, 5-benzoyloxy-4-hydroxy-1-pentene, 3- (4-benzoyl Oxy-3-hydroxycyclohexyl) -1-propene, (3-hydroxy-1-adamantyl) ethene, (2-hydroxycyclohexyl) ethene, 3- (4-undecanoyloxy-3 Vinyl monomers such as -hydroxycyclohexyl) -1-propene and 3- (4-butanoyloxy-3-hydroxycyclohexyl) -1-propene.

(5b) Maleic anhydride and maleimide each having the above (1a) to (4a) as a substituent.

In addition to the above-mentioned alcoholic secondary or tertiary OH-containing group or phenolic OH-containing group, the chain polymer of the present invention has no hydroxyl group and unsubstituted or α-substituted having 1 to 15 carbon atoms in the side chain. (Meth) acrylic monomer, unsubstituted or α-substituted vinyl ester monomer, unsubstituted or α-substituted vinyl ether monomer, and at least one of other unsubstituted or α-substituted vinyl monomer may be included as an additional monomer unit have. Such further monomeric units are preferably CH ₂ = C (R ^1a ) -COO-R ⁶ , CH ₂ = C (R ^1a ) -COO-R ⁷ , CH ₂ = C (R ^1a ) -O-CO-R ⁸ , (wherein R ⁶ , R ⁷ and R ⁸ independently of one another have 1 to 15 carbon atoms, have no hydroxyl group, comprise at least one saturated or unsaturated hydrocarbon group, or at least 1 It further comprises two aromatic groups, may have a bond selected from the group consisting of -COO-, -O- and -CO- connecting between the carbon atoms, the hydrocarbon group or aromatic group may have an amino group. ), CH ₂ = C (R ^1a ) -0-R ⁹ , CH ₂ = C (R ^1a ) -R ¹⁰ (wherein R ⁹ and R ¹⁰ have, independently of each other, having 3 to 15 carbon atoms, It does not have a hydroxy group, comprises at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group, a carbon source . It is possible to have a combination selected from the group consisting of -COO-, -O- and -CO- connecting the said hydrocarbon group or an aromatic group may have an amino _{^{group), C 4 (R 1a)}} O 3 - R ¹¹ and C ₄ (R ^1a ) HNO ₂ —R ¹² wherein C ₄ (R ^1a ) O ₃ − represents a maleic anhydride group, C ₄ (R ^1a ) HNO ₂ − represents a maleimide group, and R ¹¹ And R ¹² independently of each other, have a hydrogen atom or 1 to 15 carbon atoms, do not have an alcoholic secondary or tertiary OH group or phenolic OH group, and comprises at least one saturated or unsaturated hydrocarbon group Or at least one aromatic group, and may have a bond selected from the group consisting of —COO—, —O—, and —CO— that connects carbon atoms, and the hydrocarbon or aromatic group is an amino group. It may have a compound represented by You can choose from the military.

The chain polymer of the present invention is a (meth) acrylic monomer having 1 to 15 carbon atoms in the side chain without having a hydroxyl group in addition to the monomer having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group. , A vinyl ester monomer, a vinyl ether monomer, and at least one of other vinyl monomers may be included as an additional monomer unit. Such further monomeric units are preferably CH ₂ = CH-COO-R ⁶ , CH ₂ = C (CH ₃ ) -COO-R ⁷ , CH ₂ = CH-O-CO-R ⁸ , wherein R ⁶ , R ⁷ and R ⁸ independently of each other, having 1 to 15 carbon atoms, do not have a hydroxyl group, comprises at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group May have a bond selected from the group consisting of —COO—, —O—, and —CO— that connects carbon atoms, and the hydrocarbon or aromatic group may have an amino group.), CH ₂ = CH-0 —R ⁹ , CH ₂ ═CH—R ¹⁰ wherein R ⁹ and R ¹⁰ independently of one another have 3 to 15 carbon atoms, have no hydroxyl group, and include at least one saturated or unsaturated hydrocarbon group Or at least one aromatic group, and connect carbon atoms. And may have a bond selected from the group consisting of -COO-, -O- and -CO-, wherein the hydrocarbon group or the aromatic group may have an amino _{_{group.), C 4 HO 3 -R}} 11 and C ₄ H ₂ NO ₂ -R ¹² (wherein C ₄ HO ₃ -represents a maleic anhydride group, C ₄ H ₂ NO ₂ -represents a maleimide group, and R ¹¹ and R ¹² independently of each other, a hydrogen atom or a carbon number of 1 to 15 carbon atoms, having no alcoholic secondary or tertiary OH group or phenolic OH group, including at least one saturated or unsaturated hydrocarbon group, or further comprising at least one aromatic group, and containing carbon atoms It may have a bond selected from the group consisting of -COO-, -O- and -CO- to connect between, and the hydrocarbon group or aromatic group may have an amino group) can be selected from the group consisting of compounds represented by have.

Preferable examples of the monomer unit having no hydroxyl group include, but are not limited to the following.

(1) Methyl (meth) acrylate, propyl (meth) acrylate, glycidyl (meth) acrylate, butyl (meth) acrylate, ethoxyethyl (meth) acrylate, pentyl (meth) acrylate, tetra Hydrofurfuryl (meth) acrylate, cyclohexyl (meth) acrylate, phenyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, octyl (meth) acrylate, benzyl (meth) acrylate, N (Meth) acrylates, such as N, dimethylaminoethyl (meth) acrylate and N, N-dimethylaminopropyl (meth) acrylate.

(2) vinyl esters such as vinyl acetate, vinyl butyrate, vinyl pentanate, vinyl hexanoate, vinyl ester of cyclohexanecarboxylic acid, vinyl ester of benzoic acid, vinyl ester of cyclopentadienylcarboxylic acid and vinyl nonanoic acid .

(3) propyl vinyl ether, butyl vinyl ether, ethoxy ethyl vinyl ether, glycidyl vinyl ether, pentyl vinyl ether, tetrahydrofurfuryl vinyl ether, cyclohexyl vinyl ether, phenyl vinyl ether, cyclopentadienyl vinyl ether, Vinyl ethers such as octyl vinyl ether, benzyl vinyl ether, 2- (vinyloxy) ethyldimethylamine, and 3- (vinyloxy) propyl dimethylamine.

(4) vinyl derivatives such as 1-butene, 4-ethoxy-1-butene, 1-pentene, 1-hexene, vinylcyclohexane, styrene, vinyltoluene, 1-nonene and 3-phenylpropene.

(5) Maleic anhydride derivatives such as maleic anhydride, methylmaleic anhydride, butylmaleic anhydride, hexylmaleic anhydride, cyclohexylmaleic anhydride, phenylmaleic anhydride and octylmaleic anhydride.

(6) maleimide derivatives such as maleimide, methyl maleimide, ethyl maleimide, butyl maleimide, hexyl maleimide, cyclohexyl maleimide, phenyl maleimide, benzyl maleimide and octyl maleimide.

The linear polymer of the present invention may be a homopolymer of monomer units, and may be a copolymer including two, three or four or more kinds of monomer units, but at least one of the monomer units of the copolymer is an alcoholic agent. It is a monomer which has a secondary or tertiary OH containing group or a phenolic OH containing group. Preferably the copolymer comprises a monomer having at least one alcoholic secondary or tertiary OH containing group or a phenolic OH containing group and an additional monomer having no at least one hydroxyl group.

In the chain polymer of the present invention, the proportion of the monomeric unit having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group is preferably 30 to 100 mol%, more preferably 50 to 100 mol%. More preferably, it is 60-100 mol%, More preferably, it is 80-100 mol%, Especially preferably, it is 90-100 mol%.

In the present invention, the chain polymer is produced by using a raw material monomer and polymerized by a conventional method using, for example, a conventional radical polymerization catalyst such as 2,2'-azobisisobutyronitrile (AIBN). can do. The molecular weight of the linear polymer is usually in the range of 10000 to 100000 (measured by gel filtration chromatography), but is not particularly limited to this range.

As a crosslinking agent in curable resin composition of this invention, a triazine crosslinking agent, a glycoluril crosslinking agent, or an imidazolidinone type crosslinking agent is preferable. More specifically, triazine compounds, their condensates and mixtures thereof; Glycoluril compounds, their condensates, and mixtures thereof; And imidazolidinone compounds, condensates thereof, and mixtures thereof.

Preferred embodiments of these crosslinkers include fully or partially alkoxy (eg methoxy, ethoxy) methylated melamines, their condensates and mixtures thereof; Fully or partially alkoxy (eg methoxy, ethoxy) methylated guanamine, its condensates and mixtures thereof; Fully or partially alkoxy (eg methoxy, ethoxy) methylated acetoguanamine, condensates thereof and mixtures thereof; Fully or partially alkoxymethylated benzoguanamine, condensates thereof and mixtures thereof; Fully or partially alkoxy (eg methoxy, ethoxy) methylated glycuril condensates thereof and mixtures thereof; Full or partial alkoxy (eg methoxy, ethoxy) methylated imidazolidinones, condensates thereof and mixtures thereof; and the like. It is preferable here that "alkoxy" has 1 to 4 carbon atoms.

As such a crosslinking agent, More specifically, for example, hexamethoxymethylmelamine, hexaethoxymethylmelamine, tetramethoxymethylmethylolmelamine, tetramethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylguanamine, Tetramethoxymethylacetoguanamine, tetramethoxymethylbenzoguanamine, trimethoxymethylbenzoguanamine, tetraethoxymethylbenzoguanamine, tetramethylolbenzoguanamine, 1,3,4,6-tetrakis ( Methoxymethyl) glycoluril, 1,3,4,6-tetrakis (butoxymethyl) glycoluril, 4,5-dihydroxy-1,3-dimethoxy methyl-2-imidazolidinone, 4, 5-dimethoxy-1,3-dimethoxymethyl-2-imidazolidinone and the like, but are not limited thereto.

In one embodiment, preferably, the crosslinking agent may be selected from the group consisting of a compound represented by the following Formula 7, a condensate thereof, and a mixture thereof.

[Formula 7]

In Formula 7, R ^1b is a substituted or unsubstituted alkyl group having 1 to 25 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 25 carbon atoms, a substituted or unsubstituted aromatic group having 6 to 25 carbon atoms, substituted or unsubstituted carbon atoms at 4 to 25 carbon atoms. Ring heteroaromatic group, and a disubstituted amine represented by the following formula (8);

R ^2b , R ^3b , R ^4b and R ^5b may be independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.

[Formula 8]

In Formula 8, R ^6b and R ^7b may be independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.

More preferably, the crosslinking agent of the present invention, R ^1b of Formula 7 is a substituted or unsubstituted alkyl group having 1 to 25 carbon atoms, a substituted or unsubstituted aromatic group having 6 to 25 carbon atoms, and a disubstituted amine represented by Formula 8 And R ^2b to R ^7b may be each independently selected from a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, condensates thereof, and mixtures thereof.

In another embodiment, preferably, the crosslinking agent may be selected from the group consisting of a compound represented by the following formula (9), a condensate thereof, and a mixture thereof.

[Formula 9]

In Formula 9, R ^8b to R ^11b may be independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.

More preferably, the crosslinking agent of the present invention may be a compound selected from R ^8b to R ^11b of Formula 9 independently from a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a condensate thereof and a mixture thereof.

In another embodiment, preferably, the crosslinking agent may be selected from the group consisting of a compound represented by the following Chemical Formula 10, a condensate thereof, and a mixture thereof.

[Formula 10]

In formula (10), R ^12b and R ^13b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, and R ^14b and R ^15b are independent from each other And hydrogen, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.

More preferably, the crosslinking agent of the present invention, R ^12b and R ^13b of Formula 10 are independently selected from a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and R ^14b and R ^15b are each independently hydrogen, C 1 It may be selected from the group consisting of compounds selected from substituted or unsubstituted alkyl group of 10 to 10, a condensate thereof and mixtures thereof.

More preferably, in Formula 10, R ^14b and R ^15b may be hydrogen.

More preferred specific examples of the crosslinking agent of the present invention may be selected from the group consisting of compounds represented or listed in the following structural formula, condensates thereof and mixtures thereof:

Hexamethoxymethylmelamine; Hexabutoxymethylmelamine; 1,3,4,6-tetrakis (methoxymethyl) glycoluril; 1,3,4,6-tetrakis (butoxymethyl) glycoluril; Tetramethoxymethylbenzoguanamine; 4,5-dihydroxy-1,3-bis (alkoxymethyl) imidazolidin-2-one.

The condensate in the crosslinking agent may preferably include a polymer of compounds represented by Formula 7, 9 or 10, and more preferably at least 1 of a dimer, trimer and quaternary higher order polymer of the compounds. May include a dog.

The crosslinking agent preferably has a weight average degree of polymerization of 1 or more with respect to the compounds represented by Formula 7, 9 or 10, more preferably 1 to 1.8, more preferably 1.3 to 1.8, especially 1.5 It is preferred to have an average degree of polymerization, but is not limited thereto.

When the weight average degree of polymerization of the condensate of the compound is 1, it means that the condensate is the compound itself. The weight average degree of polymerization is preferably 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 3, 4 or greater, and more preferably 1.3, 1.4, 1.5, 1.6, 1.7 , 1.8, and more preferably 1.5.

In the curable resin composition according to an embodiment of the present invention, the mass ratio of the chain polymer and the crosslinking agent is, for example, 1: 0.03 to 1: 2, preferably 1: 0.05 to 1: 2, 1: 0.05 to 1: 1, 1: 0.03 to 1: 1, more preferably 1: 0.09 to 1: 1, 1: 0.1 to 1: 0.5, more preferably 1: 0.09 to 1: 0.3, 1: 0.1 to 1: 0.3.

In the present invention, the curable resin composition also includes an acid catalyst. The acid catalyst is included as necessary as a polymerization catalyst for the reaction between the monomer and the crosslinking agent. The said acid catalyst can use suitably the conventional thing as a polymerization catalyst. The acid catalyst may be a compound selected from the group consisting of Bronsted acid, Lewis acid and mixtures thereof, or may be a salt or solvate thereof. As the acid catalyst, for example, dinonyl naphthalene disulfonic acid, dinonyl naphthalene (mono) sulfonic acid, dodecyl benzene sulfonic acid, p-toluene sulfonic acid (PTS), proton acids such as phosphoric acid, sulfuric acid and acetic acid, and acid eido Compounds selected from the group consisting of thermal acid generators such as SI-100L, SI-150L, SI-60L, and SI-80L (Samshin Chemical Co., Ltd.), or salts or solvates thereof may be mentioned, but are not limited thereto. It doesn't work. Preferably, the acid catalyst is a compound selected from the group consisting of p-toluene sulfonic acid (PTS), dodecyl benzene sulfonic acid, and a thermal acid generator acid A. SI-100L (Samshin Chemical Co., Ltd.), or a salt thereof, Or solvates thereof. More preferably, the acid catalyst may be pyridinium-p-toluenesulfonic acid, p-toluene sulfonic acid or a hydrate thereof.

When the curable resin composition according to an embodiment of the present invention further includes an acid catalyst, the mass ratio of the chain polymer, the crosslinking agent and the acid catalyst is preferably 1: 0.03: 0.05 to 1: 2: 0.1, more preferably. 1: 0.05: 0.05 to 1: 2: 0.1, more preferably 1: 0.09: 0.05 to 1: 1: 0.08.

In the present invention, the curable resin composition may be diluted to an appropriate concentration with a solvent. As long as a boiling point is too low or high, and a curable resin composition is apply | coated to the board | substrate, such as glass, there is no problem in formation of a uniform coating film by drying, A common aprotic solvent can be selected suitably, and can be used. For example, propylene glycol monomethyl ether is a suitable solvent, but it is not limited to this. Dilution with a solvent is for handling convenience in the polymerization reaction of a monomer, the application | coating of curable resin composition which added the crosslinking agent, a catalyst, etc., and there is no special upper limit and a minimum in dilution degree.

(2-2) Separation layer (cured resin film)

The present invention may include a cured resin film formed by curing the curable resin composition of the above (2-1) as a separation layer.

Moreover, this invention can provide the easily peelable separation layer which hardens curable resin composition of said (2-1) in film form on the board | substrate surface.

The separation layer formed by the curable resin film of the present invention not only has "heat resistance" defined in the present specification, but also has a peeling property even after heat treatment in a heat resistant temperature range.

The curable resin composition of the present invention typically applies a chain polymer, a crosslinking agent, and a solution in which an acid catalyst is further dissolved in a solvent, if necessary, onto a glass substrate (preferably soda lime glass), followed by heat treatment (100 ° C. to 230 ° C. for 1 minute). The above-mentioned) hardening | curing can form the transparent peeling thin film of the peelable separation layer of several hundred nm thickness (preferably about 200 nm-about 300 nm). Although not wishing to be bound by theory, structurally, the hydroxyl group and the crosslinking agent of the side chain of the chain polymer are peelable films for curing shrinkage upon crosslinking by heating.

A well-known coating method can be used as a method of apply | coating a composition to the said glass substrate. For example, spin coating, spinless coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating and grabar coating may be mentioned. Preferably spin coating is mentioned.

The separation layer deposited on the substrate can withstand heating up to 150 ° C. and preferably withstand 230 ° C. heating (firing). Moreover, it is resistant to a photoresist solvent, can withstand an alkaline developing solution, and can be advantageously used as a resin base film for circuit fabrication. In addition, the separation layer of the present invention has a dissociation property even after heating (firing), and can be used in a circuit fabrication process including a sintering step at a high temperature in comparison with a conventional film, and is advantageous in maintaining the characteristics of a circuit. In addition, it can be easily peeled off from the substrate even after fabrication of the circuit.

The separation layer of the present invention can be prepared according to the method described in the following (3) method for producing a separation layer.

The peeling force of the separation layer of this invention can be measured, for example through the following measuring method. The curable resin composition of this invention is typically apply | coated on a glass substrate (preferably soda lime glass) the linear polymer, the crosslinking agent, and the solution which melt | dissolved the acid catalyst further in the solvent as needed, and heat-processing (100-230 degreeC, 1 minute or more) and hardening | curing, a separation layer is formed on a glass substrate. As a measuring device, for example, a UR-100N-D type is used as a TENSILON RTG-1310 (A & Day) load cell. A niche half tape (24 mm width) was affixed to the separating layer on a glass substrate, and peeling speed is pulled at the constant speed of 300 mm / min, and peeling force is measured by peeling angle 90 degrees.

The separation layer of the present invention preferably has a peel force on a soda glass substrate or an alkali free glass substrate of 0.5 N / mm ² or less. The separation layer of the present invention more preferably has a peel force on a soda glass substrate or an alkali free glass substrate of 0.1 N / mm ² or less. The separation layer of the present invention more preferably has a peel force on a soda glass substrate or an alkali-free glass substrate of 0.09 N / mm ² or less.

A preferred value for the peel force of the soda glass substrate is 0.5N / mm ² or less, 0.4N / mm ² or less, 0.3N / mm ² or less 0.2N / mm ² or less 0.1N / mm ² or less 0.09N / mm ² or less , 0.08N / mm ² or less, 0.07N / mm ² or less, 0.06N / mm ² or less, 0.05N / mm ² or less, 0.04N / mm ² or less, 0.03N / mm ² or less, 0.02N / mm ² or less, It is 0.01 N / mm <^2> or less.

A non-preferred values of the peel force of the alkali glass substrate is 5N / mm ² or less, 0.04N / mm ² or less, 0.03N / mm ² or less, 0.02N / mm ² or less, 0.01N / mm ² or less.

When the peeling force in a soda glass substrate or an alkali free glass substrate is 0.5 N / mm ² or less, the separation layer may be regarded as having a peeling property.

(3) Manufacturing method of separation layer

In some embodiments, the present invention is a method for producing a separation layer of the curable resin composition of the above (2-1),

(i) preparing the chain polymer and the crosslinking agent comprising a side chain having an alcoholic secondary or tertiary OH containing group or a phenolic OH containing group;

(ii) applying the curable resin composition containing the chain polymer and the crosslinking agent onto a substrate to form a curable resin composition coating film; And

(iii) it provides a manufacturing method comprising the step of forming a separation layer by curing the polymerization reaction in the curable resin composition coating film.

The manufacturing method may further include (iv) peeling the separation layer formed on the substrate from the substrate.

The preparation method can be carried out not only by the method described in the following examples, but also by a method known to those skilled in the art.

In some embodiments, the method may further include preparing the chain polymer by polymerizing (i ′) at least one raw material monomer before step (i).

As a method of polymerizing a monomer, for example, a bulk polymerization method, a solution neutralization method, an emulsion polymerization method, a suspension polymerization method, etc. may be mentioned, but the present invention is not limited to these examples. In such a polymerization method, the block polymerization method and the solution polymerization method are preferable.

In addition, the polymerization of the monomer can be carried out by a method such as a radical polymerization method, a living radical polymerization method, an anion polymerization method, a cation polymerization method, an addition polymerization method or a polycondensation method.

When the monomer is polymerized by the solution polymerization method, for example, a solution obtained by dissolving the monomer in a solvent may be added to the solution while stirring the monomer to polymerize the monomer, and the solution obtained by dissolving the polymerization initiator in the solvent. The monomer can be added to the solution while stirring to polymerize the monomer. It is preferable that a solvent is an organic solvent compatible with a monomer.

When the monomer is polymerized, a chain transfer agent for adjusting the molecular weight can be used. A chain transfer agent can be used in mixture with a monomer normally. Examples of the chain transfer agent include 2- (dodecylthiocarbonothioylthio) -2-methylpropionic acid, 2- (dodecylthiocarbonothioylthio) propionic acid, and methyl 2- (dodecylthiocarbono). Thioylthio) -2-methylpropionate, 2- (dodecylthiocarbonothioylthio) -2-methylpropionic acid 3-azido-1-propanol ester, 2- (dodecylthiocarbonothioylthio Mercaptan group-containing compounds such as) -2-methylpropionic acid pentafluorophenyl ester, lauryl mercaptan, dodecyl mercaptan, thioglycerol, inorganic salts such as sodium hypophosphite, sodium bisulfite, and the like. The invention is not limited only to this example. These chain transfer agents may be used independently, respectively and may use two or more types together. Although the quantity of a chain transfer agent is not specifically limited, Generally, what is necessary is just about 0.01 weight part-10 weight part per 100 weight part of total monomers.

When polymerizing a monomer, it is preferable to use a polymerization initiator. As the polymerization initiator, for example, a thermal polymerization initiator, a photopolymerization initiator, a redox polymerization initiator, an ATRP (atomic transfer radical polymerization) initiator, an ICAR ATRP initiator, an ARGET ATRP initiator, a RAFT (reversible addition-cleavage chain transfer polymerization) Agent, NMP (polymerization via nitro oxide) agent, a polymer polymerization initiator, etc. are mentioned. These polymerization initiators may be used independently, respectively and may use two or more types together.

Examples of the thermal initiator include azo polymerization initiators such as azoisobutyronitrile, methyl azoisobutyrate and azobisdimethylvaleronitrile, peroxide polymerization initiators such as benzoyl peroxide, potassium persulfate and ammonium persulfate. Although these etc. are mentioned, this invention is not limited only to this illustration. These polymerization initiators may be used independently, respectively and may use two or more types together.

When using a thermal polymerization initiator as a polymerization initiator, it is preferable that the quantity of the thermal polymerization initiator is generally about 0.01 to 20 parts by weight per 100 parts by weight of the total monomers.

As a photoinitiator, for example, 2-oxoglutaric acid, 1-hydroxy cyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-methyl [4- (methyl Thio) phenyl] -2-morpholinopropane-1-one, 2,2-dimethoxy-1,2-diphenylethan-1-one, benzophenone, 1- [4- (2-hydroxyethoxy ) Phenyl] -2-hydroxy-2-methyl 1-propan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one, bis (2,6 -Dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide and the like, but the present invention is not limited to this example. These polymerization initiators may be used independently, respectively and may use two or more types together.

When using a photoinitiator as a polymerization initiator, it is preferable that the quantity of the said photoinitiator is generally about 0.01 weight part-20 weight part per 100 weight part of total monomers.

As another polymerization initiator usable in the present invention, for example, ATRP (atomic transfer radical polymerization) initiator metals using alkyl halides under redox polymerization initiator metal catalysts such as hydrogen peroxide and iron (II) salts, persulfates and sodium hydrogen sulfite Using a nitrogen-containing ligand with ICAR ATRP initiator and ARGET ATRP initiator, RAFT (reversible addition-cleavage chain transfer polymerization) agent, NMP (polymerization through nitrooxide) agent, polydimethyl siloxane unit containing polymer azo polymerization initiator, polyethylene glycol unit containing Although polymeric polymerization initiators, such as a polymeric azo polymerization initiator, etc. can be mentioned, This invention is not limited only to this illustration. These polymerization initiators may be used independently, respectively and may use two or more types together.

When using the above-mentioned usable polymerization initiator as a polymerization initiator, it is preferable that the quantity of the said polymerization initiator is generally about 0.01 weight part-20 weight part per 100 weight part of total monomers.

In some embodiments, electron beam polymerization can proceed by irradiating an electron beam to the monomer.

There is no restriction | limiting in particular about the polymerization reaction temperature and atmosphere at the time of superposing | polymerizing a monomer. Generally, the polymerization temperature is about 50 ° C to about 120 ° C. It is preferable that the atmosphere at the time of a polymerization reaction is inert gas atmosphere, such as nitrogen gas, for example. In addition, since the polymerization reaction time of the monomer varies depending on the polymerization reaction temperature and the like, it cannot be determined uniformly, but is generally about 3 to 20 hours.

In one embodiment, the substrate in step (ii) of the manufacturing method is preferably a glass substrate, more preferably soda glass (soda lime glass) or alkali-free glass (eg EAGLE-XG, Corning ), And more preferably soda glass.

In one embodiment, a known coating method may be used as a method of applying the curable resin composition to the substrate in step (ii) of the manufacturing method. For example, spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, gravure coating, and the like, but are not limited thereto. Preferably it can be applied using spin coating.

In another embodiment, in step (ii) of the preparation method, preferably, the composition may also comprise an acid catalyst. Although not wishing to be bound by theory, the curable resin composition coating film includes an acid catalyst because the acid catalyst can act as a polymerization catalyst in the polymerization reaction in step (iii) and promote the reaction. Therefore, in another embodiment, step (i) of the preparation method may further comprise preparing an acid catalyst.

In another embodiment, the manufacturing method may further comprise the step of heat-treating the curable resin composition coating film in step (iii). As said heat processing temperature, Preferably it is 100 degreeC-230 degreeC, More preferably, 150 degreeC-230 degreeC is mentioned as an example. The heat treatment time is preferably 1 minute or more, more preferably 10 minutes, 20 minutes, 30 minutes, 40 minutes, 50 minutes, 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours and the like. But is not limited thereto. Particularly preferred heat treatment time is 10 minutes to 2 hours.

The separation layer prepared by the manufacturing method may have a property of the separation layer of the above (2-2), and may be a thin film having peelability.

(4) film touch sensor and film touch sensor structure

In the present exemplary embodiment, the separation layer 20 is formed on the carrier substrate 10, and after forming an electrode pattern layer or the like thereon, is finally separated from the carrier substrate 10.

The carrier substrate 10 and separation during the peel force of the separation layer 20 is preferably 0.5N / mm ² or less, and more preferably 0.1N / mm ² or less. That is, a material such that the physical force applied when the separation layer 20 and the carrier substrate 10 are separated does not exceed 1 N / mm ² , preferably 0.5 N / mm ² , particularly preferably 0.1 N / mm ² . The separation layer 20 is preferably formed.

When the separation force of the separation layer 20 from the carrier substrate 10 is greater than 1 N / mm ² , the separation layer 20 may not be neatly separated upon separation from the carrier substrate, and the separation layer 20 may remain on the carrier substrate. In addition, cracks may occur in at least one of the separation layer 20, the protective layer 30, the electrode pattern layer 40, and the insulating layer 50.

In particular, the curl (curl) caused on the film after peeling the peel force is together more preferably 0.1N / mm ² or less, if 0.1N / mm ² or less, the carrier substrate from the separation layer 20 than the side that controllably desirable. Curls do not cause problems in terms of film touch sensor functionality, but it is advantageous to generate less curl because it may lower the process efficiency in processes such as bonding and cutting processes.

Here, the thickness of the separation layer 20 is preferably 10 to 1000 nm, more preferably 50 to 500 nm. If the thickness of the separation layer 20 is less than 10 nm, the uniformity during application of the separation layer may be poor, or the electrode pattern may be unevenly formed, or the peeling force may be locally increased to cause tearing, or after separation from the carrier substrate, There is a problem that curl is not controlled. And when the thickness exceeds 1000nm, there is a problem that the peeling force is no longer lowered, there is a problem that the flexibility of the film is lowered.

As another embodiment of the present invention, it may not be separated in the separation layer 20 from the carrier substrate 10. In this case, the present invention provides a structure for a film touch sensor having a carrier substrate 10 attached to one surface of the separation layer 20.

Meanwhile, an electrode pattern layer 40 is formed on the separation layer 20, and the separation layer 20 functions as a coating layer covering the electrode pattern layer 40 after separation from the carrier substrate or the electrode pattern layer. It functions as a protective layer that protects the 40 from external contact.

At least one protective layer 30 may be further formed on the separation layer 20. Since the separation layer 20 alone may be difficult to protect the electrode pattern against contact or impact from the outside, one or more protective layers 30 may be formed on the separation layer 20.

The protective layer 30 may include at least one of an organic insulating layer and an inorganic insulating layer, and may be formed by a method of coating and curing or deposition.

The protective layer may be formed except for a portion where a pad electrode is to be removed or a portion where a pad electrode is to be formed for circuit connection. In addition, a pad pattern layer may be formed under the pad electrode, and the protective layer may be formed by coating and patterning the entire top of the separation layer to form the pad pattern layer, or by applying a portion except the part where the pad pattern layer is to be formed. have.

The electrode pattern layer 40 is formed on the separation layer 20 or the protection layer 30. The electrode pattern layer 40 includes a sensing electrode SE for detecting whether a touch is detected and a pad electrode PE formed at one end of the sensing electrode. Here, the sensing electrode may include not only an electrode for sensing a touch but also a wiring pattern connected to the electrode.

The pad pattern layer may be formed on or under the pad electrode. The pad electrode may be electrically connected to the circuit board through the pad pattern layer, and serves to lower the contact resistance when connected to the circuit board. When the circuit board is bonded in the insulating layer direction, the pad pattern layer may be formed on the pad electrode, and when the circuit board is bonded in the separation layer direction, the pad pattern layer may be formed below the pad electrode. The pad pattern layer may be omitted if the pad electrode is sufficiently low in contact resistance when connected to the circuit board.

The pad pattern layer may be formed of one or more materials selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphene, conductive polymers, and conductive inks.

The electrode pattern layer 40 may be formed of one or more materials selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphene, conductive polymers, and conductive inks.

Here, the metal may be any one of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), aluminum, palladium, neodium, and silver-palladium-copper alloy (APC).

The metal nanowires may be any one of silver nanowires, copper nanowires, zirconium nanowires, and gold nanowires.

In addition, the metal oxide is indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), florin tin oxide (FTO), zinc oxide (ZnO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide-silver-indium zinc tin oxide ( IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO).

In addition, the electrode pattern layer 40 may be formed of a carbon-based material including carbon nanotubes (CNT) or graphene.

The conductive polymer includes polypyrrole, polythiophene, polyacetylene, PODOT, and polyaniline, and may be formed of such conductive polymer.

The conductive ink is an ink in which a metal powder and a curable polymer binder are mixed, and an electrode may be formed using the ink.

In order to reduce the electrical resistance, the electrode pattern layer 40 may be formed of two or more conductive layers in the form of the first electrode layer 41 and the second electrode layer 42 as shown in FIG. 2A.

In one embodiment, the electrode pattern layer 40 may be formed of one layer of ITO, AgNW (silver nanowire), or a metal mesh. In the case of forming two or more layers, the first electrode layer 41 may be formed of a transparent metal such as ITO. The second electrode layer 42 may be formed of an oxide, and a metal or AgNW may be formed on the ITO electrode layer to further lower the electrical resistance. In addition, the electrode pattern layer 40 may further include a third electrode layer 43 formed of a transparent metal oxide such as ITO on the second electrode layer 42 as shown in FIG. 2B.

In order to improve the electrical conductivity of the electrode pattern layer 40, at least one electrode pattern layer made of metal or metal oxide may be included. More specifically, the electrode pattern layer is formed on the separation layer or the protective layer with a conductive layer of a metal or metal oxide, and then further laminated a transparent conductive layer to form an electrode pattern, or one layer on the separation layer or protective layer After the above-mentioned transparent conductive layer is laminated, a conductive layer may be further formed of a metal or a metal oxide to form an electrode pattern. Specific examples of the laminated structure of the electrode pattern is as follows. A structure in which a metal or metal oxide pattern layer is further formed between the separation layer and the electrode pattern layer, a structure in which a metal or metal oxide pattern layer is further formed between the electrode pattern layer and the insulating layer, a metal or between the protective layer and the electrode pattern layer The metal oxide pattern layer may be further formed, and may further include at least one electrode pattern layer made of a transparent conductive material.

Specific examples of the laminated structure of the applicable electrode pattern layer 40 are as follows.

Lamination of metal oxides and lamination of silver nanowires on top of them, lamination of metal oxides and lamination of metals on top of them, lamination of metal oxides and lamination of metal mesh electrodes on top of them, lamination of silver nanowires, A structure for laminating a metal oxide on the top, a structure for laminating a metal and a metal oxide on the top, a structure for laminating a metal mesh electrode and a metal oxide on the top, a metal oxide and a silver nanowire on the top And a structure in which a metal or metal oxide is further stacked on the top, a silver nanowire is laminated, a metal oxide is stacked on the top, and a metal layer is further stacked on the top. It may be changed in consideration of signal processing and resistance, and is not limited to the above-described laminated structure.

In the electrode pattern layer, an electrical insulation layer may be formed between the first electrode pattern layer and the second electrode pattern layer, and the second conductive layer may be formed as a bridge electrode by patterning the electrical insulation layer to form a contact hole. .

In addition, the structure of the electrode pattern layer will be described below in terms of the touch sensor method.

The pattern structure of the electrode pattern layer is preferably an electrode pattern structure used in the capacitive method, a mutual capacitance method (self-capacitance) or a self-capacitance method (self-capacitance) may be applied.

In the case of mutual capacitance, the grid electrode structure may have a horizontal axis and a vertical axis. The intersection of the horizontal and vertical electrodes may include a bridge electrode, or the horizontal and vertical electrode pattern layers may be formed to be electrically spaced apart from each other.

In the case of self-capacitance, the electrode layer structure may be a method of reading capacitance change by using one electrode at each point.

An insulating layer 50 is formed on the electrode pattern layer 40. The insulating layer may serve to prevent corrosion of the electrode pattern and protect the surface of the electrode pattern. The insulating layer 50 is preferably formed to a certain thickness to fill the gap between the electrode and the wiring.

That is, the surface opposite to the surface in contact with the electrode pattern layer 40 is preferably formed flat so that the unevenness of the electrode is not exposed.

Here, the insulating layer 50 is formed to expose at least a portion of the pad electrode portion to provide a space in which the pad electrode or the pad pattern layer is connected to the circuit board, and to cover all the sensing electrodes to protect the sensing electrode. Can be.

It is preferable that the elastic modulus difference in 25 degreeC of the said protective layer 30 and the said insulating layer 50 is 300 Mpa or less. This is to suppress the occurrence of cracks due to the difference in stress solving ability of each layer, the reason for the elastic modulus difference between the protective layer and the insulating layer to be less than 300MPa at 25 ℃ when the elastic modulus difference exceeds 300MPa, deformation between the two layers This is because cracks occur due to an imbalance in energy and stress resolving ability.

In addition, the reason for measuring the elastic modulus difference at 25 ℃ is because the crack should not occur in the environment used by the user.

The insulating layer is not particularly limited as long as it is an organic insulating material satisfying that the difference in elastic modulus from the protective layer is 300 Mpa or less, but the insulating layer is preferably a thermosetting or UV curing organic polymer. The insulating layer may be formed of one or more materials selected from materials, such as an epoxy compound, an acrylic compound, and a melanin compound.

The insulating layer may also be formed of one or more materials selected from curable prepolymers, curable polymers, and plastic polymers, in terms of material form.

The insulating layer 50 may itself serve as an optical film. In this case, it is preferable that the film is made of a varnish-type material, and the varnish-type material is polysilicon or polyimide such as polydimethylsiloxane (PDMS), polyorganosiloxane (POS), or the like. It may be formed of one or more materials selected from materials such as polyurethane-based, such as spandex.

In addition, the insulating layer 50 may be formed using an inorganic material such as silicon oxide (SiOx), and in this case, the insulating layer 50 may be formed by deposition, sputtering, or the like.

In the film touch sensor of the present invention, the pad electrode may be electrically connected to the circuit board.

The circuit board may be a flexible printed circuit board (FPCB) as an example, and serves to electrically connect the touch control circuit and the film touch sensor of the present invention.

An electrode corresponding to the pad electrode is formed at one end of the circuit board, and the pad electrode and the circuit board may be electrically connected by the conductive adhesive. In addition, the film touch sensor may be connected to the circuit board through at least a part of the open area on the pad electrode, or through the separation layer. A pad pattern layer made of a material having a low resistance may be formed on or below the pad electrode, and in this case, the circuit board may be connected to the pad electrode through the pad pattern layer.

And another embodiment of the film touch sensor according to the present invention, as shown in Figure 3, the separation layer; An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode; An insulating layer formed on the electrode pattern and covering a part or all of the electrode pattern layer; An optical film formed directly on the insulating layer; Characterized in that it comprises a.

The insulating layer 50 may itself function as an adhesive layer made of an adhesive or an adhesive. This insulating layer may be formed including one or more materials selected from the group consisting of polyester, polyether, polyurethane, epoxy, silicone and acrylic. In addition, when the insulating layer 50 functions as an adhesive layer, the optical film 100 may be directly bonded on the insulating layer 50.

Here, the optical film 100 may be a transparent film or a polarizing plate.

As the transparent film, a film having excellent transparency, mechanical strength and thermal stability may be used. Specific examples thereof include polyester-based resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; Cellulose resins such as diacetyl cellulose and triacetyl cellulose; Polycarbonate resins; Acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; Styrene resins such as polystyrene and acrylonitrile-styrene copolymers; Polyolefin-based resins such as polyethylene, polypropylene, cyclo-based or norbornene-structured polyolefins, ethylene-propylene copolymers; Vinyl chloride-based resins; Amide resins such as nylon and aromatic polyamides; Imide resin; Polyether sulfone resin; Sulfone resins; Polyether ether ketone resins; Sulfided polyphenylene resins; Vinyl alcohol-based resins; Vinylidene chloride-based resins; Vinyl butyral resin; Allyl resins; Polyoxymethylene resin; And films composed of thermoplastic resins such as epoxy resins, and the like, and films composed of blends of the above thermoplastic resins may also be used. Moreover, the film of thermosetting resin or ultraviolet curable resin, such as (meth) acrylic-type, urethane type, acrylurethane type, epoxy type, and silicone type, can also be used. Although the thickness of such a transparent film can be determined suitably, it is about 1-500 micrometers generally from the point of workability, thinness, etc., such as strength and handleability. 1-300 micrometers is especially preferable, and 5-200 micrometers is more preferable.

Such a transparent film may contain a suitable one or more additives. As an additive, a ultraviolet absorber, antioxidant, a lubricant, a plasticizer, a mold release agent, a coloring agent, a flame retardant, a nucleating agent, an antistatic agent, a pigment, a coloring agent, etc. are mentioned, for example. The transparent film may have a structure including various functional layers such as a hard coating layer, an antireflection layer, and a gas barrier layer on one or both surfaces of the film, and the functional layer is not limited to the above-described ones. It may include.

In addition, if necessary, the transparent film may be surface treated. Such surface treatments include dry treatments such as plasma treatments, corona treatments, primer treatments, and chemical treatments such as alkali treatments including saponification treatments.

In addition, the transparent film may be an isotropic film, a retardation film or a protective film.

In the case of an isotropic film, in-plane retardation (Ro, Ro = [(nx-ny) × d], nx, ny is the major refractive index in the film plane, d is the film thickness) is 40 nm or less, preferably 10 nm or less, and the thickness direction Retardation (Rth, Rth = [(nx + ny) / 2-nz) × d, nx, ny is the major refractive index in the film plane, nz is the refractive index in the film thickness direction, d is the film thickness) from -90 nm to +75 nm And preferably -80 nm to +60 nm, particularly -70 nm to +45 nm.

Retardation film is a film manufactured by the method of uniaxial stretching, biaxial stretching, polymer coating, liquid crystal coating of polymer film, and is generally used for improving and adjusting optical characteristics such as viewing angle compensation, color improvement, light leakage improvement, color taste control of display. do.

The type of retardation film includes a wave plate such as 1/2 or 1/4, a positive C plate, a negative C plate, a positive A plate, a negative A plate, and a biaxial wave plate.

The protective film may be a film including an adhesive layer on at least one surface of a film made of a polymer resin, or a film having a self-adhesive property such as polypropylene, and may be used for protecting the touch sensor surface and improving processability.

As a polarizing plate, a well-known thing used for a display panel can be used.

Specifically, a polyvinyl alcohol film is drawn to form a protective layer on at least one surface of a polarizer dyed with iodine or a dichroic dye, a liquid crystal is oriented so as to have a polarizer performance, and a polyvinyl alcohol on a transparent film And those made by coating an orientation resin such as the like and stretching and dyeing the same, but are not limited thereto.

And another embodiment of the film touch sensor according to the present invention, as shown in Figure 4, the separation layer; An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode; An insulating layer formed on the electrode pattern and covering a part or all of the electrode pattern layer; An adhesive layer formed on the insulating layer; An optical film formed on the adhesive layer; Characterized in that it comprises a.

The optical film may be further included on the insulating layer 50. In this case, a separate adhesive layer 60 may be formed between the insulating layer 50 and the optical film 100 to thereby be bonded. The adhesive layer 60 is formed of an adhesive or an adhesive, and may be either a thermosetting type or a UV curing type.

The adhesive or pressure-sensitive adhesive used for bonding the optical film 100 is preferably polyester, polyether, polyurethane, epoxy, silicone, or acrylic material.

The manufacturing process of the film touch sensor according to the present invention having the above structure will be described with reference to FIGS. 5A to 5F.

5A to 5F are cross-sectional views illustrating a process of manufacturing a film touch sensor according to a first embodiment of the present invention, and a method of manufacturing the film touch sensor according to the present invention will be described in detail with reference to the drawings.

As shown in FIG. 5A, first, a chain polymer having a side chain having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group and a crosslinking agent are mixed on the carrier substrate 10, and applied to a separation layer ( 20).

Specifically, (a) the side chain is -COO containing 3 to 30 carbon atoms, containing at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group, and -COO to connect between the carbon atoms May include a bond selected from the group consisting of-, -O-, and -CO-,

If necessary, (b) the crosslinking agent may be formed of a curable resin composition selected from a triazine crosslinking agent or a glycuril crosslinking agent.

Here, as a method of applying the separation layer, a known coating method can be used.

For example, spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, gravure coating, etc. are mentioned.

The curing process for forming the separation layer 20 may be used by heat curing or UV curing alone, or a combination of thermosetting and UV curing.

The carrier substrate 10 is preferably a glass substrate, but is not limited to the glass substrate and other substrates may be used as the carrier substrate 10. However, a material having heat resistance that does not deform even at high temperatures, that is, maintains flatness, is preferable to withstand the process temperature at the time of electrode formation.

Subsequently, as shown in FIG. 5B, the protective layer 30 is formed by applying an organic insulating layer on the separation layer 20 formed on the carrier substrate 10.

The protective layer 30 may be removed by patterning or the like to form a pad pattern layer for circuit connection, or may be applied except for a portion where the pad pattern layer is to be formed. In addition, although the pad pattern layer for connection with a circuit board can be formed in the part in which the protective layer is not formed, it demonstrates that there is no pad pattern layer in this Example.

An electrode pattern layer is then formed on the protective layer 30. In this embodiment, the electrode pattern layer will be described as having a single layer laminated structure.

First, an ITO transparent electrode layer is formed as a transparent conductive layer as shown in FIG. 5C, and a photosensitive resist (not shown) is formed thereon. Thereafter, the electrode pattern layer 40 is formed by selectively patterning the photolithography process as illustrated in FIG. 5D.

The transparent conductive layer is a sputtering process such as chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma enhanced chemical vapor deposition (PECVD), screen printing, gravure printing, reverse offset, and reverse offset. , Printing process such as ink jet, dry or wet plating process

In the case of forming a film by a sputtering process, an electrode pattern layer may be formed by placing a mask having a desired electrode pattern shape on the substrate and performing a sputtering process. In addition, a conductive layer may be formed over the entire surface by the film forming method, and an electrode pattern may be formed using a photolithography method.

As the photosensitive resist, a negative type photosensitive resist or a positive type photosensitive resist may be used, and after completing the patterning process, the photosensitive resist may remain on the electrode pattern layer 40 as necessary and be removed. You may be. In this embodiment, a positive photosensitive resist is used to describe the structure removed on the electrode pattern after the patterning process.

Next, as shown in FIG. 5E, the insulating layer 50 is formed to cover the electrode pattern layer 40. The thickness of the insulating layer 50 is equal to or thicker than the thickness of the electrode so that the top surface of the insulating layer is formed to have a flat shape. That is, an insulating material having proper viscoelasticity should be used so that the unevenness of the electrode is not transferred.

Specifically, a liquid material that becomes an insulating layer is coated on the electrode pattern layer, and an insulating layer is formed through a coating film forming step.

A well-known coating method can be used here as a method of apply | coating an insulating layer.

The insulating layer coating may be performed by at least one of thermal curing, UV curing, thermal drying, vacuum drying, and the like, and is selected according to the characteristics of the insulating layer material.

The insulating layer can itself function as a support. In this case, since the insulating layer functions as an optical film, there is no need to attach an additional optical film. If the top surface of the insulating layer is not flat, the insulating layer is impossible to play the role of the optical film due to irregularities. When the optical film is additionally attached on the insulating layer, uniform bonding is impossible and a problem occurs that the performance of the touch sensor is degraded.

The method of forming the insulating layer 50 so that the pad electrode is exposed may be formed by coating and patterning the insulating layer to cover the upper part of the electrode pattern layer or by applying the insulating layer except the pad electrode region to expose the pad electrode. There is a method to form.

The pad pattern layer may be formed after the insulating layer is formed. In this embodiment, a structure without the pad pattern layer will be described.

In the manufacturing method of the film touch sensor of the present invention, after the insulating layer forming step, (a) the optical film attaching step of attaching the optical film on the insulating layer, (b) the circuit board bonding for bonding the electrode pattern layer and the circuit board One or more steps selected from step (c) and carrier substrate removal step of separating the separation layer from the carrier substrate may be performed in any order.

Specific methods for carrying out one or more steps selected from steps (a), (b) and (c) are described separately below.

After the insulating layer is formed, the separation layer 20 on which the electrode is formed is separated from the carrier substrate 10 used for the process of manufacturing the touch sensor as shown in FIG. 5F.

In the present invention, the separation layer 20 is separated using a method of peeling from the carrier substrate 10.

The peeling method is a method of lift-off or peel-off, but is not limited thereto.

In this case, the size of the force applied during the peeling force, but may vary depending on the peel force of the separation layer, 1N / mm ² or less are preferred and, 0.5N / mm ² or less are more preferable and, 0.1N / mm ² or less is more than desirable. When the peeling force exceeds 1 N / mm ² , a problem may occur in that the film touch sensor is torn during peeling from the carrier substrate. Excessive force is applied to the film touch sensor so that the film touch sensor is deformed and cannot function as a device. Can be.

Next, although a film touch sensor and a circuit board can be bonded together, it can bond with a circuit board using a conductive adhesive at this time.

A conductive adhesive means that conductive fillers, such as silver, copper, nickel, carbon, aluminum, plating, are disperse | distributed to binders, such as epoxy, a silicone, urethane, an acryl, and polyimide resin.

The circuit board may be bonded before or after separating the carrier board and the touch sensor.

When the circuit board is bonded before separating from the carrier substrate, the laminate structure is formed to expose a part of the pad electrode in at least one of the insulating layer coating step, the insulating layer coating step, and the optical film attachment step, or a separate structure The stacking structure may be formed to expose a portion of the pad electrode through the patterning step. The circuit board is bonded to the exposed pad electrode and separated from the carrier substrate. When the pad pattern layer is formed on the pad electrode, the circuit board is bonded to the pad pattern layer and the substrate is separated.

When the circuit board is bonded after separation from the carrier substrate, the pad substrate may be bonded to the pad electrode through the separation layer in the separation layer direction, wherein a pad pattern layer may be formed under the pad electrode, in which case the circuit board may be padded. It is connected to the pad electrode through the pattern layer. In addition, the circuit board may be bonded to the pad electrode or the pad pattern layer exposed in the insulating layer or the optical film direction.

The method of connecting through the pad pattern layer when the circuit board is connected with the pad electrode is to lower the contact resistance between the circuit board and the pad electrode and may be selectively applied according to the manufacturing process and the product specification.

6A and 6B are cross-sectional views illustrating a method of manufacturing the film touch sensor according to the present invention, with reference to this, a second embodiment of the method of manufacturing the film touch sensor according to the present invention will be described.

The process of forming the isolation layer 20 on the carrier substrate 10 and forming the electrode pattern layer 40 and the insulating layer 50 after forming the protective layer 30 is substantially the same as in the first embodiment. .

However, in the second embodiment of the present invention, the optical film 100 may be attached on the insulating layer 50. Since the insulating layer includes the function of the adhesive layer, the optical film 100 is directly bonded to the insulating layer as shown in FIG. 6A.

As such, the pressure conditions for attaching the optical film to the insulating layer in the step of bonding the optical film, the pressure applied to the film is a condition of 1 to 200kg / cm ² , preferably 10 to 100kg / cm ² conditions. .

Thereafter, the separation layer is separated using a method of peeling from the carrier substrate 10 as shown in FIG. 6B. Thereafter, the circuit board is bonded to the pad electrode or the pad pattern layer.

7A and 7B are cross-sectional views illustrating a method of manufacturing the film touch sensor according to the present invention, with reference to this, a third embodiment of the method of manufacturing the film touch sensor according to the present invention will be described.

According to the third embodiment of the present invention, after the insulating layer 50 is formed, the adhesive layer 60 is formed on the insulating layer 50 to attach the optical film 100. In this case, the adhesive layer 60 may be formed by first coating or bonding to one surface of the optical film 100, or may attach the optical film 100 by coating or bonding an adhesive layer on an upper surface of the insulating layer.

As shown in FIG. 7A, an adhesive layer was formed on an insulating layer to show a laminated structure in which an optical film was bonded.

Next, as shown in FIG. 7B, the separation layer is separated using a method of peeling from the carrier substrate 10. Thereafter, the circuit board is bonded to the pad electrode or the pad pattern layer.

And another embodiment of the film touch sensor according to the present invention, as shown in Figure 8, the separation layer; An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode; And an insulating layer formed on the electrode pattern and covering a part or the whole of the electrode pattern layer, wherein the insulating layer is formed on the opposite side on which the electrode pattern layer of the separation layer is formed through an adhesive or an adhesive. It may further include a functional film layer 80.

An adhesive layer 70 may be further included between the separation layer 20 and the functional film layer 80, and the adhesive layer 70 may be formed of an adhesive or an adhesive, wherein the adhesive or the adhesive is known in the art. The adhesive or adhesive may be used without particular limitation, but the adhesive or adhesive may be an adhesive or adhesive of at least one of a thermosetting type and a UV curing type.

The functional film layer 80 may be a functional film layer known in the art without particular limitation, but may be a film having a functional coating layer formed on a functional film or a base film, and at least one film selected from the group consisting of Alternatively, the coating layer may be formed in a single layer or multiple layers. For example, the functional film may be a transparent film, a retardation film, an isotropic film, a protective film, a polarizer, a polarizer, a barrier film, and the like, the barrier film may be a single layer film, and at least one inorganic film and an organic film on the base film. It may be a multilayered film. Examples of the multilayer barrier film include inorganic film / COP (Cyclo-olefin Polymer) film / inorganic film / organic film, inorganic film / hard coating / COP film / hard coating / inorganic film, inorganic film / hard coating / TAC ( Triacetyl cellulose) film / hard coating / inorganic film / organic film, organic film / hard coating / TAC film / hard coating / inorganic film / organic film and the like.

The functional coating layer may be coating layers having the same function as the above-described functional film, and may be, for example, a coating organic film layer, a coating retardation layer, a coating polarizer layer, or a coating alignment film layer. In addition, a film known in the art may be applied without particular limitation, and the above-described functional film may be used.

On the other hand, the functional film layer 80 may be a film selected from the same group as the optical film 100, used with the optical film 100 as needed, or in the lower portion of the separation layer without the optical film 100 When the film touch sensor manufactured by the present invention is bent, bent or rolled out by the laminated structure as described above, the electrode pattern layer 40 may be further protected from external number or expansion stress applied thereto. It can provide a desirable effect in that it can.

The adhesive layer 70 may be formed by first coating or bonding one surface of the functional film layer 80 or by coating or bonding the adhesive layer on the bottom surface of the separation layer 20 to attach the functional film layer 80.

Although not described in the embodiments of the present invention, the order of the processes for laminating each layer may be changed.

The film touch sensor manufactured according to the present invention may be used to be disposed so that the functional film layer is positioned at the viewer side when the film touch sensor is bonded to the display panel, and may be arranged to be attached to the display panel.

Such a film touch sensor and a manufacturing method thereof according to the present invention implements a touch sensor on a carrier substrate, thereby securing a fine pitch and heat resistance, which are impossible in a process of implementing a touch sensor directly on a film substrate, and diversifying the film substrate. It is to be done. That is, the optical film and the functional film layer which are weak in heat resistance can also be used because they are bonded after electrode formation.

In addition, the efficiency of the process may be improved by attaching the circuit board to the pad pattern layer after separation from the carrier substrate or before separation without removing the separation layer formed on the carrier substrate.

In addition, by forming an additional control layer of the elastic modulus controlled between the separation layer and the insulating layer to suppress the occurrence of cracks due to the stress resolving power difference and to prevent the curl (Curl) of the film touch sensor.

Hereinafter, preferred examples are provided to aid the understanding of the present invention, but these examples are merely illustrative of the present invention and are not intended to limit the scope of the appended claims, which are within the scope and spirit of the present invention. It is apparent to those skilled in the art that various changes and modifications can be made to the present invention, and such modifications and changes belong to the appended claims.

제조예 및 합성예Preparation and Synthesis Examples

1. 경화성 수지 조성물의 구성 요소로서 중합체의 제조1. Preparation of Polymer as Component of Curable Resin Composition

As a component of the curable resin composition, a polymer was prepared as follows.

Preparation Example 1 Preparation of Polymer A-1

2-hydroxypropyl methacrylate of the following Chemical Formula 1-1 was used as a monomer, and 100 parts by mass thereof were dissolved in propylene glycol monomethyl ether (PGME) so as to be 30% by mass. It heated up to 80 degreeC, blowing in nitrogen gas to the obtained solution, 5 mol% of 2,2'- azobisisobutyronitrile (AIBN) was added with respect to monomer total amount, and reaction was performed at 80 degreeC for 8 hours, and the polymer A was carried out. -1 was obtained. It was 25,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-1]

Preparation Example 2 Preparation of Polymer A-2

Polymer A-2 was obtained in the same manner as in Production Example 1 except that 3-benzoyloxy-2-hydroxypropyl methacrylate of the following formula 1-2 was used as a monomer. It was 22000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-2]

Preparation Example 3 Preparation of Polymer A-3

Polymer A-3 was obtained in the same manner as in Production Example 1 except that 4-benzoyloxy-3-hydroxycyclohexylmethyl methacrylate of the following formula 1-3 was used as a monomer. It was 32,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-3]

Preparation Example 4 Preparation of Polymer A-4

Polymer A-4 was obtained in the same manner as in Production Example 1 except that 1,3-adamantyldiol monomethacrylate of the formula (1-4) was used as a monomer. It was 18,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-4]

Production Example 5 Polymer A-5

Polymer A-5 was obtained in the same manner as in Production Example 1 except that 2-hydroxycyclohexyl methacrylate of the formula (1-5) was used as a monomer. It was 36,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-5]

Preparation Example 6 Preparation of Polymer A-6

Polymer A-6 was obtained in the same manner as in Production Example 1 except that 2-hydroxyethyl methacrylate of the following Chemical Formula 1-6 was used as the monomer. It was 42,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-6]

Preparation Example 7 Preparation of Polymer A-7

Polymer A-7 was obtained in the same manner as in Production Example 1 except that 4- (hydroxymethyl) cyclohexylmethylmethacrylate of the formula (1-7) was used as a monomer. It was 18,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-7]

Preparation Example 8 Preparation of Polymer A-8

2-hydroxypropyl methacrylate and n-butyl acrylate of the general formula (1-1) were used as monomers, and 50 parts by mass of these were dissolved in propylene glycol monomethyl ether (PGME) so that the total was 30% by mass. It heated up to 80 degreeC, blowing in nitrogen gas to the obtained solution, 5 mol% of 2,2'- azobisisobutyronitrile (AIBN) was added with respect to monomer total amount, and reaction was performed at 80 degreeC for 8 hours, and the polymer A was carried out. Got -8. It was 18,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 9 Preparation of Polymer A-9

Polymer A-9 was obtained in the same manner as in Production Example 8 except that 2-hydroxypropyl methacrylate and methyl methacrylate of Formula 1-1 were used as monomers. It was 25,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 10 Preparation of Polymer A-10

Polymer A-10 was obtained in the same manner as in Production Example 8 except that 2-hydroxypropyl methacrylate and styrene represented by Chemical Formula 1-1 were used as monomers. It was 22,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 11 Preparation of Polymer A-11

Polymer A-11 was obtained in the same manner as in Production Example 8 except that 4-benzoyloxy-3-hydroxycyclohexylmethyl methacrylate and dicyclopentadienyl methacrylate of the formula 1-3 were used as monomers. It was 35,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 12 Preparation of Polymer A-12

Polymer A-12 was obtained in the same manner as in Production Example 8 except that 2-hydroxycyclohexyl methacrylate and dicyclopentadienyl methacrylate of the formula (1-5) were used as monomers. It was 25,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 13 Preparation of Polymer A-13

Polymer A-13 was obtained in the same manner as in Production Example 8 except for using 2-hydroxyethyl methacrylate and butyl acrylate of Formula 1-6 as monomers. It was 38,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 14 Preparation of Polymer A-14

Polymer A-14 was obtained in the same manner as in Production Example 8 except that 2-hydroxyethyl methacrylate and methyl methacrylate of Formula 1-6 were used as monomers. It was 36,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 15 Preparation of Polymer A-15

Polymer A-15 was obtained in the same manner as in Production Example 8 except that 2-hydroxyethyl methacrylate and dicyclopentadienyl methacrylate of the formula (1-6) were used as the monomers. It was 39,000 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 16 Preparation of Polymer A-16

Except for using 4- (4-methoxyphenylpropenyl) oxy-3-hydroxycyclohexylmethyl methacrylate of the following Chemical Formula 1-8 as the monomer, the same procedure as in Preparation Example 1 was given to the following Chemical Formula 1-8-1 Polymer A-16 was obtained. It was 27,700 when the average molecular weight (MW) of the A-16 polymer was measured by gel filtration chromatography.

[Formula 1-8]

[Formula 1-8-1]

Preparation Example 17 Preparation of Polymer A-17

Polymer A-17 of Chemical Formula 1-9-1 was obtained in the same manner as in Production Example 1 except that 4-adamantanecarboxyoxy-3-hydroxycyclohexylmethyl methacrylate of Chemical Formula 1-9 was used as a monomer. . It was 31,700 when the average molecular weight (MW) of the A-17 polymer was measured by the gel filtration chromatography.

[Formula 1-9]

[Formula 1-9-1]

Preparation Example 18 Preparation of Polymer A-18

Polymer A-18 of the following formula was obtained in the same manner as in Production Example 8 except that 2-hydroxycyclohexyl methacrylate of the formula (1-5) was used as the monomer. It was 25,500 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 19 Preparation of Polymer A-19

Polymer A-19 of formula 1-10-1 was obtained in the same manner as in Preparation Example 1 except that 3-hydroxyadamantyl methyl-2-methacrylate of formula 1-10 was used as a monomer. It was 35,700 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-10]

[Formula 1-10-1]

Preparation Example 20 Preparation of Polymer A-20

The same procedure as in Preparation Example 1 was repeated except for using 2-hydroxy-4-methacryloxymethyl-cyclohexyl-3-cyclohexene-1-carboxylate of Chemical Formula 1-11 as a monomer. Polymer A-20 of 1 was obtained. It was 26,700 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-11]

[Formula 1-11-1]

Preparation Example 21 Preparation of Polymer A-21

The polymer of Formula 1-12-1 in the same manner as in Production Example 1 except that 4- (2-cyclohexylacetyl) oxy-3-hydroxycyclohexanemethyl 2-methacrylate of Formula 1-12 was used as a monomer. A-21 was obtained. It was 30,700 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-12]

[Formula 1-12-1]

Preparation Example 22 Preparation of Polymer A-22

Polymer A-22 of the following formula was obtained in the same manner as in Production Example 8 except that 2-hydroxycyclohexyl methacrylate and benzyl methacrylate of the formula (1-5) were used as the monomers. It was 32,700 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

Preparation Example 23 Preparation of Polymer A-23

4- (4-methoxyphenylpropenyl) oxy-3-hydroxycyclohexylmethyl methacrylate of formula 1-8 and 3,4-epoxycyclohexylmethyl methacrylate of formula 1-13 as monomers And 100 mass parts of it was melt | dissolved so that it may become 20 mass% in propylene glycol monomethyl ether (PGME). The mixture was heated to 80 ° C while blowing nitrogen gas into the solution, and 4 mol% of 2,2'-azobisisobutyronitrile (AIBN) was added to the total amount of the monomers, followed by reaction at 80 ° C for 8 hours. Got it. Thereafter, 99 parts by weight and 1 part by mass of 4-methoxycyanamic acid and methacrylic acid were added, and 3 mol% of tetraethylammonium bromide was added thereto, the temperature was raised to 100 ° C, and the reaction was carried out for 38 hours to give a polymer. A-23 of 1-13-1 was obtained. It was 42,900 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

[Formula 1-13]

[Formula 1-13-1]

Preparation Example 24 Preparation of Polymer A-24

Polymer A-24 of the following formula was obtained in the same manner as in Production Example 8 except that methyl methacrylate, glycidyl methacrylate and dicyclopentadienyl methacrylate were used as monomers. It was 35,700 when the average molecular weight (MW) of this polymer was measured by the gel filtration chromatography.

2. 분리층의 형성2. Formation of Separation Layer

Various curable resin compositions of this invention were manufactured as follows, apply | coated on two types of glass substrates, and heat-hardened and formed into a film.

Synthesis Example 1

4.4 parts by mass of polymer A-1, 0.4 parts by mass of hexamethoxymethylmelamine (NicarakkMW-30, Samwha Chemical Co., Ltd.) as a crosslinking agent and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst And 95 parts by mass of propylene glycol monomethyl ether (PGME). This solution was applied onto a 0.7 mm thick soda glass and a 0.5 mm alkali free glass (EAGLE-XG, Corning) by spin coating, and heated at 150 DEG C or higher for 30 minutes to form a film thickness of about 300 nm. .

[Formula B-1]

Synthesis Example 2

3.2 parts by mass of polymer A-1, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 3

2.4 parts by mass of polymer A-1, 2.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 4

4.4 parts by mass of polymer A-2, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 5

4.4 parts by mass of polymer A-3, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 6

4.4 parts by mass of polymer A-4, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 7

4.4 parts by mass of polymer A-5, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 8

4.4 parts by mass of polymer A-8, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 9

4.4 parts by mass of polymer A-9, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 10

95 mass parts of propylene glycol monomethyl ether (PGME) as 4.4 mass parts of polymer A-10, 0.4 mass part of crosslinking agent hexamethoxymethyl melamine (formula B-1), and 0.2 mass part of pyridinium-p-toluenesulfonic acid as a polymerization catalyst. Dissolved in parts. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 11

4.4 parts by mass of polymer A-11, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 12

4.4 parts by mass of polymer A-12, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 13

4.4 parts by mass of polymer A-1, 0.4 parts by mass of 1,3,4,6-tetrakis (methoxymethyl) glycoluril (Nikarakku MW-270, Samwha Chemical Co., Ltd.) and polymerization as the crosslinking agent As a catalyst, 0.2 mass part of pyridinium-p-toluenesulfonic acid was melt | dissolved in 95 mass parts of propylene glycol monomethyl ether (PGME). Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

[Formula B-2]

Synthesis Example 14

4.4 parts by mass of polymer A-1, 0.4 parts by mass of tetramethoxymethylbenzoguanamine of the formula (B-3) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, propylene glycol monomethyl ether (PGME) It melt | dissolved in 95 mass parts. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

[Formula B-3]

Synthesis Example 15

4.4 parts by mass of polymer A-1, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of laurylbenzenesulfonic acid were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME) as a polymerization catalyst. . Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 16

4.4 parts by mass of polymer A-1, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1), and 0.2 parts by mass of thermal acid generator acid aid SI-100L (Samshin Chemical Co., Ltd.) as propylene glycol It melt | dissolved in 95 mass parts of monomethyl ether (PGME). Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Comparative Example 1

4.4 parts by mass of polymer A-6, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Comparative Example 2

4.4 parts by mass of polymer A-7, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Comparative Example 3

4.4 parts by mass of polymer A-13, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Comparative Example 4

4.4 parts by mass of polymer A-14, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Comparative Example 5

4.4 parts by mass of polymer A-15, 0.4 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as the polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Comparative Example 6

4.4 parts by mass of polymer A-1, 0.4 parts by mass of duranate TPA-100 (isomer), and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, and propylene glycol monomethyl ether (PGME ) Was dissolved in 95 parts by mass. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 17

3.2 parts by mass of polymer A-16, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 18

3.2 parts by mass of polymer A-17, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 19

3.2 parts by mass of polymer A-18, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 20

3.2 parts by mass of polymer A-19, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 21

3.2 parts by mass of polymer A-20, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 22

3.2 parts by mass of polymer A-21, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 23

3.2 parts by mass of polymer A-22, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Synthesis Example 24

3.2 parts by mass of polymer A-23, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

Comparative Example 7

3.2 parts by mass of polymer A-24, 0.8 parts by mass of crosslinking agent hexamethoxymethylmelamine (Formula B-1) and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst, 95 parts by mass of propylene glycol monomethyl ether (PGME) Dissolved in. Using this solution, a film thickness of about 300 nm was formed by coating and heat-treating on soda glass and an alkali free glass similarly to the synthesis example 1, respectively.

실시예 및 비교예Examples and Comparative Examples

After coating and curing an organic insulating film as a protective layer on the separation layers formed in Synthesis Examples 1 to 23 and Comparative Synthesis Examples 1 to 7, ITO was deposited and an electrode pattern layer was formed using a photoresist. Thereafter, the photoresist is applied and cured again, and a part of the pad electrode part is exposed through a normal photolithography process, and then the polyethylene terephthalate (PET) to which the pressure-sensitive adhesive is bonded is bonded using a roll laminator. Film touch sensors of Examples 1 to 23 and Comparative Examples 1 to 7 were prepared.

시험예: 실시예 1 내지 19 및 비교예 1 내지 6의 분리층의 물성 평가Test Example: Evaluation of physical properties of the separation layers of Examples 1 to 19 and Comparative Examples 1 to 6

1. 박리력 측정1. Peel force measurement

The magnitude of the force (peel force) required to peel the film touch sensors of the Experimental and Comparative Examples from the glass was measured quantitatively by the following method. For measurement using TENSILON RTG-1310 (A & Day Co., Ltd.) and load cell type UR-100N-D as measuring equipment, attach a niche half tape (24 mm width) to a film touch sensor formed on a glass substrate, and peel at 90 ° peeling angle. The speed is measured by peeling force at a constant speed of 300 mm / min and the values are shown in Table 1 below. Peel force of Examples 1 to 16 was expressed by three decimal places, and the rest was displayed to two decimal places.

구분division	기판: 소다 유리 박리력(N/mm²)Substrate: Soda Glass Peeling Force (N / mm ² )	기판:EAGLE-XG박리력(N/mm²)Substrate: EAGLE-XG Peeling Force (N / mm ² )
실시예 1Example 1	0.0210.021	0.0310.031
실시예 2Example 2	0.0310.031	0.0350.035
실시예 3Example 3	0.0410.041	0.0420.042
실시예 4Example 4	0.0320.032	0.0350.035
실시예 5Example 5	0.0130.013	0.0380.038
실시예 6Example 6	0.0780.078	0.0850.085
실시예 7Example 7	0.0190.019	0.0360.036
실시예 8Example 8	0.0620.062	0.0840.084
실시예 9Example 9	0.0480.048	0.0640.064
실시예 10Example 10	0.0350.035	0.0450.045
실시예 11Example 11	0.0240.024	0.0390.039
실시예 12Example 12	0.0180.018	0.0280.028
실시예 13Example 13	0.0250.025	0.0420.042
실시예 14Example 14	0.0310.031	0.0510.051
실시예 15Example 15	0.0360.036	0.0380.038
실시예 16Example 16	0.0580.058	0.0740.074
비교예 1Comparative Example 1	3.03.0	4.24.2
비교예 2Comparative Example 2	3.83.8	5.25.2
비교예 3Comparative Example 3	4.24.2	4.64.6
비교예 4Comparative Example 4	2.82.8	3.73.7
비교예 5Comparative Example 5	2.22.2	3.23.2
비교예 6Comparative Example 6	8.78.7	9.29.2

As shown in Table 1, the peeling forces of Comparative Examples 1 to 6 were 2.2 to 8.7 N / mm ² (soda glass substrate) and 3.2 to 9.2 N / mm ² (EAGLE-XG substrate), while Examples 1 to 16 were used. The peel force of was 0.013 to 0.078 N / mm ² (soda glass substrate) and 0.028 to 0.085 N / mm ² (EAGLE-XG substrate), which was two orders of magnitude smaller than the comparative example. In fact, while the film touch sensor of the comparative example was damaged due to the high peel force, the film touch sensor or the substrate was broken, and each film touch sensor of the example could be easily peeled off without difficulty.

2. 소성 후 경화 수지 박막에 대한 박리력 평가2. Evaluation of Peeling Force on Cured Resin Thin Films after Firing

The baking process at the time of circuit preparation by patterning using the photolithography method or the printing method on the cured resin thin film was assumed, and the peeling force at the time of baking a cured resin thin film was measured. That is, for Examples 1 and 7, Comparative Examples 1 and 2, the cured resin thin film formed on the soda glass substrate was calcined at 230 ° C. for 1 hour or 3 hours, and the peeling force of each of the above-described apparatuses and methods was used. Was measured. The result is shown in Table 2 with the peeling force (initial peeling force) value before baking in the Example and the comparative example.

구분division	초기 박리력(N/mm²)Initial Peel Force (N / mm ² )	230℃가열 1시간 후 박리력 (N/mm²)Peeling force after 1 hour of heating at 230 ℃ (N / mm ² )	230℃가열 3시간 후 박리력 (N/mm²)Peeling force after 3 hours of heating at 230 ℃ (N / mm ² )
실시예 1Example 1	0.0210.021	0.0210.021	0.0310.031
실시예 7Example 7	0.0190.019	0.0370.037	0.0420.042
비교예 1Comparative Example 1	3.03.0	4.54.5	5.75.7
비교예 2Comparative Example 2	3.83.8	4.64.6	7.27.2

As shown in Table 2, in Examples 1 and 7, even after firing at 230 ° C. for 1 hour or 3 hours, the peeling force was two orders of magnitude lower than that of Comparative Examples 1 and 2 before firing. The substrate could be easily peeled off without difficulty. On the other hand, in Comparative Examples 1 and 2, the adhesive was more strongly adhered to the glass substrate than before firing.

The peeling force at the time of baking a cured resin thin film was measured by assuming the baking process at the time of circuit preparation by the patterning using the photolithography method or the printing method on the cured resin thin film in the same way as said 2 above. That is, about Example 12, 17-24, and the comparative example 7, the cured resin thin film formed on the soda glass board | substrate was baked at 230 degreeC for 20 minutes, and each peeling force was measured with the apparatus and method of the said 1st. . The result is shown in Table 3 with the peeling force (initial peeling force) value before baking in the Example and the comparative example.

구분division	초기 박리력(N/mm²)Initial Peel Force (N / mm ² )	230℃에서 20분 소성 후 박리력(N/mm²)Peeling force after firing at 230 ℃ for 20 minutes (N / mm ² )
실시예 12Example 12	0.030.03	0.030.03
실시예 17Example 17	0.040.04	0.040.04
실시예 18Example 18	0.040.04	0.040.04
실시예 19Example 19	0.040.04	0.040.04
실시예 20Example 20	0.040.04	0.040.04
실시예 21Example 21	0.050.05	0.050.05
실시예 22Example 22	0.070.07	0.070.07
실시예 23Example 23	0.080.08	0.080.08
실시예 24Example 24	0.050.05	0.050.05
비교예 7Comparative Example 7	3.83.8	3.83.8

As shown in Table 3, Examples 12, 17 to 24, after firing at 230 ° C. for 20 minutes, exhibited two orders of magnitude lower peeling force as compared to Comparative Example 7 before firing, and was easily removed without difficulty on the substrate. It could peel off. On the other hand, Comparative Example 7 had a high peel force as before firing, and could not be easily removed from the glass substrate.

3. 가교제 및 혼합 비율을 변화시킨 경우의 소성 후 박리력 평가3. Evaluation of Peeling Force After Firing When Crosslinking Agent And Mixing Ratio Are Changed

When the type of crosslinking agent and the mixing ratio of the polymer / crosslinking agent were changed as shown in Table 5 below, the peeling force of Examples 25 to 27 and Comparative Examples 8 to 10 was measured.

Substrate: Soda glass (coated on the tinned surface)

Production: 30 minutes baking at spin coat> 150 ° C or 230 ° C

※ finish film thickness 50-200nm

Peel test conditions: Peel test was carried out with niche half tape (24 mm width).

The polymer used was polymer A-3.

The crosslinking agents used are shown in Table 4. In Table 4, MW-30 is hexamethoxymethylmelamine of the formula (B-1) (Nikarakku MW-30, Samwha Chemical Co., Ltd.), MW-30LF is hexamethoxymethylmelamine (low glass formaldehyde) Product) (Nikarakku MW-30LF, Samwha Chemical Co., Ltd.), MX-270 is 1,3,4,6-tetrakis (methoxymethyl) glycoluril of the formula (B-2) (Nikarakku MW) -270, Samhwa Chemical Co., Ltd.

	MW-30MW-30	MW-30LFMW-30LF	MX-270MX-270
구조rescue
중앙골격Central skeleton	트리아진Triazine		글리코루릴Glycoril

Using MW-30 as a reference compound, the peeling force and the peeling characteristics were examined while changing the mixing ratio of other compounds (Examples 25 to 27 and Comparative Examples 8 to 10). The experimental results are shown in Table 5. In Table 5, "○" in the peel test item means that the formed film touch sensor peeled easily without difficulty and exhibited peeling property, and "Х" means that it was not easily detachable and did not have peeling property.

	폴리머Polymer	가교제Crosslinking agent	혼합비율(폴리머/가교제)Mixing ratio (polymer / crosslinking agent)	박리특성Peeling Characteristics
	폴리머Polymer	가교제Crosslinking agent	혼합비율(폴리머/가교제)Mixing ratio (polymer / crosslinking agent)	박리력(N/mm²)Peel force (N / mm ² )	박리시험Peel Test
실시예 25Example 25	중합체A-3Polymer A-3	MW-30MW-30	45/5045/50	0.020.02	○○
비교예 8Comparative Example 8		MW-30MW-30	90/1090/10	7.57.5	ХХ
비교예 9Comparative Example 9		MW-30LFMW-30LF	45/5045/50	8.18.1	ХХ
비교예 10Comparative Example 10		MW-30LFMW-30LF	91/1091/10	7.27.2	ХХ
실시예 26Example 26		MX-270MX-270	45/5045/50	0.020.02	○○
실시예 27Example 27		MX-270MX-270	90/1090/10	0.020.02	○○

As can be seen in Table 5, when MW-30 was used, the peel force was as low as 0.02 when the polymer / crosslinking agent mixture ratio was 45/50. When the mixing ratio was 90/10, the peeling force was large as 7.5, and no peeling property was shown. When the MX-270 was used, the peeling force and the peeling property were low in both the mixing ratio of 45/50 and 90/10. On the other hand, MW-30LF had a high peeling force in both the mixing ratio of 45/50 and 90/10, and showed no peeling property. It is assumed that MW-30LF has less formaldehyde and lacks a methylol moiety (thermal crosslinking reaction point) compared to MW-30.

4. 분리층의 박리력의 역치 측정4. Measurement of threshold value of peeling force of separation layer

The weight ratio (wt%) of the polymer, the crosslinking agent and the acid catalyst was changed, and the peel force of the prepared separation layer was measured. That is, for Examples 28 to 38 and Comparative Examples 11 to 15, a solution prepared using a polymer, a crosslinking agent, and an acid catalyst at a weight ratio shown in Table 6 was applied onto a soda glass substrate, and baked at 230 ° C. for 20 minutes. Except for the formation of the separation layer in the same manner as in Example 1, and then by measuring the peel force of each according to the apparatus and method described in the above 1 was compared. The results are shown in Table 6.

	폴리머Polymer		가교제Crosslinking agent		산촉매함량(wt%)Acid catalyst content (wt%)	박리력(N/mm²)Peel force (N / mm ² )
	성분ingredient	함량(wt%)Content (wt%)	성분ingredient	함량(wt%)Content (wt%)	산촉매함량(wt%)Acid catalyst content (wt%)	박리력(N/mm²)Peel force (N / mm ² )
비교예 11Comparative Example 11	A-3A-3	9090	B-1B-1	55	55	5.235.23
비교예 12Comparative Example 12	A-3A-3	8787	B-1B-1	88	55	2.122.12
실시예 28Example 28	A-3A-3	8585	B-1B-1	1010	55	0.020.02
실시예 29Example 29	A-3A-3	6363	B-1B-1	3232	55	0.030.03
실시예 30Example 30	A-3A-3	4545	B-1B-1	5050	55	0.020.02
비교예 13Comparative Example 13	A-3A-3	9090	B-2B-2	55	55	5.205.20
비교예 14Comparative Example 14	A-3A-3	9494	B-2B-2	1One	55	7.907.90
실시예 31Example 31	A-3A-3	8787	B-2B-2	88	55	0.020.02
실시예 32Example 32	A-3A-3	8585	B-2B-2	1010	55	0.030.03
비교예 15Comparative Example 15	A-5A-5	9494	B-2B-2	1One	55	8.398.39
실시예 33Example 33	A-5A-5	9292	B-2B-2	33	55	0.060.06
실시예 34Example 34	A-5A-5	9090	B-2B-2	55	55	0.020.02
실시예 35Example 35	A-5A-5	8787	B-2B-2	88	55	0.030.03
실시예 36Example 36	A-5A-5	8585	B-2B-2	1010	55	0.020.02
실시예 37Example 37	A-16A-16	7070	B-1B-1	2525	55	0.020.02
실시예 38Example 38	A-17A-17	7070	B-1B-1	2525	55	0.020.02

As shown in Table 6, the crosslinking agent B-1 exhibited dissociation property when the content was 10% by weight or more based on the total amount of the polymer, the crosslinking agent and the acid catalyst (Examples 28 to 30), and the crosslinking agent B-2 was a polymer. When the content was 3% by weight or more based on the total amount of the crosslinking agent and the acid catalyst, the peeling property was expressed (Examples 33 to 38).

In Comparative Example 8 of Table 5, when the polymer / crosslinking agent mixture ratio was 90/10, no dissociation property was observed. In Example 28 of Table 6 of Table 6, which was about the same mixing ratio (85/10) using an acid catalyst, Peelability was expressed. Therefore, it can be said that the peeling property easily appears when the acid catalyst is added.

As mentioned above, although this invention was illustrated using the preferable Example of this invention, it is understood that the scope should be interpreted only by the claim, and should not be limited to the above-mentioned preferred embodiment. .

Claims

Separation layer;

An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode; And

And an insulating layer formed on the electrode pattern layer and covering a part or all of the electrode pattern layer.

The separation layer,

A chain polymer having a side chain having an alcoholic secondary or tertiary OH containing group or a phenolic OH group containing group and a crosslinking agent,

The chain polymer is formed of a curable resin composition comprising a unit derived from at least one monomer selected from a monomer represented by Formula 1 and a monomer represented by Formula 2 below,

The crosslinking agent may include a triazine compound, a condensate thereof, and a mixture thereof; Glycoluril compounds, their condensates, and mixtures thereof; And an imidazolidinone-based compound, a condensate thereof, and a mixture thereof.

[Formula 1]

(Formula 1, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl group and substituted or unsubstituted alkenyl group,

L 1 is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group, and a substituted or unsubstituted alkenylene group,

L 2 is O or NH,

R 2a , R 3a and R 4a are each independently selected from the group consisting of hydrogen and a substituted or unsubstituted hydrocarbon group,

Provided that at least one of R 2a , R 3a and R 4a is a substituted or unsubstituted alcoholic secondary or tertiary OH-containing group or phenolic OH-containing group,

Or a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, substituted with at least two of R 2a , R 3a and R 4a and containing an alcoholic secondary or tertiary OH or phenolic OH Or an unsubstituted aromatic group, a substituted or unsubstituted hetero aromatic group, and a polycyclic including them)

[Formula 2]

(Formula 2, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl group and substituted or unsubstituted alkenyl group,

L 1 is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group, and a substituted or unsubstituted alkenylene group,

R 5a to R 14a are each independently selected from the group consisting of hydrogen, a hydroxy group, and a functional group represented by the following formula (3), or one to form a ring, provided that at least one of R 5a to R 14a or a substituent of the ring is Hydroxy group)

[Formula 3]

In Formula 3, R 15a is a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group, and a substituted or unsubstituted heteroaromatic. Selected from the group consisting of flags)
The film touch sensor according to claim 1, wherein L 1 is selected from the group consisting of a substituted or unsubstituted alkylene group and a substituted or unsubstituted alkenylene group.
The film touch sensor according to claim 1, wherein L 1 is a substituted or unsubstituted alkylene group.
The film touch sensor according to claim 1, wherein L 1 is a methylene group.
The method according to claim 1, wherein the chain polymer comprises a monomer unit represented by the following formula (6), the film touch sensor:

[Formula 6]

(In formula 6,

R 1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group and a substituted or unsubstituted alkenyl group,

L 1 is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group, and a substituted or unsubstituted alkenylene group,

R 19a is selected from the group consisting of a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group, and a substituted or unsubstituted heteroaromatic group)
The film touch sensor according to claim 5, wherein L 1 is a substituted or unsubstituted alkylene group.
The film touch sensor of claim 5, wherein L 1 is a methylene group.
The film touch sensor of claim 5, wherein R 19a is a phenyl group.
The film touch sensor of claim 1, wherein the crosslinking agent is selected from the group consisting of triazine-based compounds, condensates of triazine-based compounds, and mixtures thereof.
The method according to claim 1, wherein the crosslinking agent is a compound represented by the formula B-1, the touch sensor film:

[Formula B-1]
The film touch sensor of claim 1, wherein L 1 is a single bond.
2. The film touch sensor according to claim 1, wherein any two or more of R 5a to R 14a are hydroxyl groups, and others are hydrogen.
The film touch sensor according to claim 1, wherein any one of R 5a to R 14a is a hydroxy group, and the other is hydrogen.
The film touch sensor of claim 1, wherein R 5a to R 13a are hydrogen and R 14a is a hydroxy group.
The film touch sensor of claim 1, wherein the crosslinking agent is selected from the group consisting of glycouril compounds, condensates of glycouril compounds, and mixtures thereof.
The method according to claim 1, wherein the crosslinking agent is a film touch sensor, which is a compound represented by the formula B-2:

[Formula B-2]
The film touch sensor of claim 1, wherein the crosslinking agent is a compound represented by Chemical Formula B-3:

[Formula B-3]
The film touch sensor of claim 1, wherein the curable resin composition is provided in a solution.
The film touch sensor of claim 18, wherein the solvent of the solution comprises an alcohol.
The film touch sensor of claim 19, wherein the alcohol comprises a primary alcohol.
The film touch sensor of claim 19, wherein the alcohol comprises ethanol.
The film touch sensor of claim 19, wherein the content of alcohol is present in at least 10% by weight of the weight of the solvent.
The method of claim 1, wherein the crosslinking agent is selected from the group consisting of fully or partially alkoxymethylated melamine, condensates thereof and mixtures thereof; Fully or partially alkoxymethylated guanamines, their condensates and mixtures thereof; Fully or partially alkoxymethylated acetoguanamine, its condensates and mixtures thereof; Fully or partially alkoxymethylated benzoguanamine, condensates thereof and mixtures thereof; Fully or partially alkoxymethylated glycolurils, their condensates and mixtures thereof; And fully or partially alkoxymethylated imidazolidinone, condensates thereof, and mixtures thereof.
The method according to claim 1, wherein the crosslinking agent comprises a compound represented by the following formula 7, 9 and 10 and selected from the group consisting of each condensate thereof, the film touch sensor:

[Formula 7]

In Formula 7, R 1b is a substituted or unsubstituted alkyl group having 1 to 25 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 25 carbon atoms, a substituted or unsubstituted aromatic group having 6 to 25 carbon atoms, substituted with 4 to 25 carbon atoms, or It is selected from the group consisting of an unsubstituted hetero aromatic group, and a disubstituted amine represented by the formula (8),

R 2b , R 3b , R 4b and R 5b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms)

[Formula 8]

(In Formula 8, R 6b and R 7b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.)

[Formula 9]

(In Formula 9, R 8b , R 9b , R 10b and R 11b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms.)

[Formula 10]

In Formula 10, R 12b and R 13b are each independently selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms,

R 14b and R 15b are each independently selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms)
The film touch sensor of claim 24, wherein the condensate in the crosslinking agent comprises a polymer of a compound represented by Formula 7, Formula 9, or Formula 10.
25. The film touch sensor of claim 24, wherein the condensate in the crosslinker comprises at least one of dimers, trimers, and quaternary or higher order polymers of the compounds represented by Formula 7, Formula 9 or Formula 10.
The film touch sensor according to claim 24, wherein the crosslinking agent has a weight average polymerization degree of 1.3 to 1.8 with respect to the compound represented by Chemical Formula 7, Chemical Formula 9 or Chemical Formula 10, respectively.
The method of claim 24,

R 1b is selected from the group consisting of a substituted or unsubstituted aromatic group having 6 to 25 carbon atoms and a disubstituted amine represented by the following formula (11),

R 2b to R 13b are each independently a substituted or unsubstituted alkyl having 1 to 10 carbon atoms,

Touch film sensors wherein R 14b and R 15b are independently of each other hydrogen:

[Formula 11]
The film touch sensor of claim 1, wherein a mass ratio of the chain polymer and the crosslinking agent is 1: 0.05 to 1: 2.
The film touch sensor of claim 1, wherein the curable resin composition further comprises an acid catalyst.
31. The film touch sensor of claim 30, wherein the acid catalyst is selected from the group consisting of Bronsted acid, Lewis acid, mixtures thereof, salts thereof, and solvates thereof.
The film touch sensor of claim 1, wherein the curable resin composition further comprises at least one selected from the group consisting of a surfactant, a filler, an additive, and a blowing agent.
The film touch sensor of claim 1, wherein the curable resin composition further comprises a surfactant.
The film touch sensor of claim 1, wherein the curable resin composition further comprises a blowing agent.
The film touch sensor according to claim 1, wherein the curable resin composition has curability that is cured by heating at 150 ° C. for 1 minute.
The film touch sensor of claim 1, wherein the separation layer has a transmittance (% T) of at least 99% and a b * of at most 0.1 at 400 nm.
The film touch sensor of claim 1, wherein the separation layer has heat resistance of 230 ° C. to 300 ° C. 3.
The film touch sensor according to claim 1, wherein the separation layer has heat resistance of 1 to 2 hours at 230 ° C to 260 ° C.
The film touch sensor according to claim 1, wherein the separation layer has heat resistance at 230 ° C. for at least 8 hours.
The film touch sensor of claim 1, wherein the separation layer has heat resistance at 230 ° C. for 1 to 2 hours.
The film touch sensor according to claim 1, wherein the separation layer has a peel force of 0.5 N / mm 2 or less on a soda glass substrate or an alkali free glass substrate.
The film touch sensor according to claim 1, wherein the separation layer has a peel force of 0.1 N / mm 2 or less on a soda glass substrate or an alkali free glass substrate.
The film touch sensor of claim 1, wherein the film touch sensor further comprises a protective layer formed between the separation layer and the electrode pattern layer.
The film touch sensor of claim 1, further comprising an optical film disposed on the insulating layer.
The film touch sensor of claim 1, wherein the electrode pattern layer is formed of at least one selected from the group consisting of metal, metal nanowires, metal oxides, carbon nanotubes, graphene, conductive polymers, and conductive inks.
The film touch sensor of claim 1, further comprising a functional film layer formed on the opposite side of the separation layer on which the electrode pattern layer is formed by using an adhesive or an adhesive.
The film touch sensor of claim 46, wherein the functional film layer is at least one functional film selected from the group consisting of a transparent film, a retardation film, an isotropic film, a protective film, a polarizing plate, a polarizer, and a barrier film.
The method according to claim 46, wherein the functional film layer is a film having a functional coating layer formed on a base film,

The functional coating layer is a film touch sensor comprising a coating organic film layer, a coating type retardation layer, a coating polarizer layer or a coating alignment film layer.
(i) preparing a chain polymer and a crosslinking agent comprising a side chain having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group;

(ii) applying a curable resin composition comprising the chain polymer and the crosslinking agent onto a substrate to form a curable resin composition coating film; And

(iii) forming a separation layer by performing a polymerization reaction on the curable resin composition coating film to cure the film.
The method of claim 49, wherein the manufacturing method

(iv) peeling the separation layer formed on the substrate from the substrate.
The film touch sensor as set forth in claim 49, wherein a monomer unit comprising an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group is 30 to 100 mol% in the monomer unit constituting the chain polymer. Manufacturing method.
The method of claim 49, wherein the crosslinker is fully or partially alkoxymethylated melamine, fully or partially alkoxymethylated guanamine, fully or partially alkoxymethylated acetoguanamine, or fully or partially alkoxymethylated benzoguanamine, and fully or partially alkoxymethylated glycoluril Will be selected from the group consisting of, the manufacturing method of the film touch sensor.
The method of claim 49, wherein the mass ratio of the chain polymer and the crosslinking agent is from 1: 0.05 to 1: 2.
A carrier substrate;

A separation layer formed on the carrier substrate;

An electrode pattern layer formed on the separation layer, the electrode pattern layer including a sensing electrode and a pad electrode formed at one end of the sensing electrode;

And an insulating layer formed on the electrode pattern layer and covering a part or all of the electrode pattern layer.

A chain polymer having a side chain having an alcoholic secondary or tertiary OH-containing group or a phenolic OH-containing group and a crosslinking agent,

The chain polymer is formed of a curable resin composition comprising a unit derived from at least one monomer selected from a monomer represented by Formula 1 and a monomer represented by Formula 2 below,

The crosslinking agent may include a triazine compound, a condensate thereof, and a mixture thereof; Glycoluril compounds, their condensates, and mixtures thereof; And an imidazolidinone-based compound, a condensate thereof, and a mixture thereof.

[Formula A]

In Formula A, R 1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group,

L 1 is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group, and a substituted or unsubstituted alkenylene group,

L 2 is O or NH,

R 2a , R 3a and R 4a are each independently selected from the group consisting of hydrogen and a substituted or unsubstituted hydrocarbon group,

Provided that at least one of R 2a , R 3a and R 4a is a substituted or unsubstituted alcoholic secondary or tertiary OH-containing group or phenolic OH-containing group,

Or a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, substituted with at least two of R 2a , R 3a and R 4a and containing an alcoholic secondary or tertiary OH or phenolic OH Or an unsubstituted aromatic group, a substituted or unsubstituted hetero aromatic group, and a polycyclic including them)

[Formula B]

In Formula 11, R 1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group,

L 1 is selected from the group consisting of a single bond, a substituted or unsubstituted alkylene group, and a substituted or unsubstituted alkenylene group,

R 5a to R 14a are each independently selected from the group consisting of hydrogen, a hydroxy group, and a functional group represented by the following general formula (C), or one to form a ring, provided that at least one of R 5a to R 14a or a substituent of the ring is Hydroxy group)

[Formula C]

In Formula C, R 15a is a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted cycloalkenyl group, a substituted or unsubstituted aromatic group, and a substituted or unsubstituted heteroaromatic Selected from the group consisting of flags)
55. The structure of claim 54, wherein the structure for film touch sensors further comprises a protective layer formed between the separation layer and the electrode pattern layer.