WO2019159959A1 - Soupape entraînée par un élément piézoélectrique et dispositif de régulation de débit volumétrique - Google Patents

Soupape entraînée par un élément piézoélectrique et dispositif de régulation de débit volumétrique Download PDF

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Publication number
WO2019159959A1
WO2019159959A1 PCT/JP2019/005082 JP2019005082W WO2019159959A1 WO 2019159959 A1 WO2019159959 A1 WO 2019159959A1 JP 2019005082 W JP2019005082 W JP 2019005082W WO 2019159959 A1 WO2019159959 A1 WO 2019159959A1
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WIPO (PCT)
Prior art keywords
piezoelectric element
valve
heat insulating
insulating spacer
control device
Prior art date
Application number
PCT/JP2019/005082
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English (en)
Japanese (ja)
Inventor
土肥　亮介
勝幸 杉田
薫 平田
川田　幸司
池田　信一
西野　功二
Original Assignee
株式会社フジキン
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Application filed by 株式会社フジキン filed Critical 株式会社フジキン
Priority to JP2020500515A priority Critical patent/JPWO2019159959A1/ja
Publication of WO2019159959A1 publication Critical patent/WO2019159959A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K49/00—Means in or on valves for heating or cooling
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/06—Drive circuits; Control arrangements or methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Definitions

  • the present invention relates to a piezoelectric element drive type valve that controls opening and closing of a valve element using a piezoelectric element, and a flow rate control device that uses this to control the flow rate.
  • the pressure type flow rate control device can control the flow rate of various fluids with high accuracy by a relatively simple mechanism that combines a piezoelectric element driven valve and a throttle (for example, an orifice plate). Widely used in plants (for example, Patent Document 1).
  • Patent Document 2 discloses a piezoelectric element drive type valve configured to open and close a valve body (for example, a metal diaphragm valve body) with an actuator using a piezoelectric element (hereinafter, also referred to as “piezoelectric actuator”). It is disclosed. Piezoelectric element-driven valves are classified into a normal open type and a normal close type, and a mechanism for converting the expansion of the piezoelectric actuator into the opening / closing operation of the valve body is provided according to each type.
  • a general piezoelectric actuator built in a piezoelectric element driven valve has a structure in which a laminated piezoelectric element or a single piezoelectric element is sealed in a metal case, and the allowable temperature range of the piezoelectric element is For example, it is set to ⁇ 20 to 120 ° C. For this reason, there is a limit to the temperature of the fluid to be controlled.
  • Patent Document 3 discloses a high-temperature heat-resistant piezoelectric element-driven valve for enabling control of a fluid having a temperature exceeding the allowable temperature range of the piezoelectric actuator.
  • a heat dissipation spacer is provided between the piezoelectric actuator and the valve body, and a configuration in which heat from the fluid is not easily transmitted to the piezoelectric element is employed.
  • the present invention has been made in view of the above problems, and has as its main object to provide a piezoelectric element-driven valve capable of controlling even a fluid having a temperature exceeding the allowable temperature range of the piezoelectric actuator, and a flow rate control device including the same.
  • a piezoelectric element driven valve includes a piezoelectric element for detaching and seating a valve body from a valve seat, a heat insulating spacer disposed between the valve body and the piezoelectric element, and a piezoelectric element.
  • the heat insulating spacer is provided with a plurality of holes penetrating along the direction intersecting the stacking direction of the heat insulating spacer and the piezoelectric element.
  • a flow rate control device is provided in a valve body in which a flow path is formed, a piezoelectric element drive type valve provided in the flow path, and a flow path on the downstream side of the piezoelectric element drive type valve.
  • a pressure sensor provided between the piezoelectric element driven valve and the throttle part, and the piezoelectric element driven valve is extendable to allow the valve body to be separated from and seated on the valve seat.
  • the heat insulating spacer includes the heat insulating spacer and the piezoelectric element.
  • a plurality of holes penetrating along the direction crossing the stacking direction is formed.
  • the strain sensor includes a first strain gauge that detects displacement in the extension direction of the piezoelectric element and a second strain gauge that detects displacement in a direction orthogonal to the extension direction.
  • the plurality of holes formed in the heat insulating spacer are a hole extending along a first direction intersecting the stacking direction, and a second direction intersecting the stacking direction and the first direction. And a hole extending along a second direction different from the first direction.
  • the heat insulating spacer is formed of an invar material.
  • the piezoelectric element driven valve has a support cylinder body that accommodates the piezoelectric element and the heat insulating spacer and is supported so as to move up and down with respect to the valve body, and the piezoelectric element extends.
  • the normally closed type valve is configured such that the support cylinder moves.
  • an opening that overlaps at least partially with a hole provided in the heat insulating spacer is formed in the support cylinder.
  • the heat insulating spacer has a temperature at an upper end portion equal to or lower than a heat resistant temperature of the piezoelectric element by heat insulation while heat received from a fluid flowing through the flow path is transferred from the lower end portion to the upper end portion of the heat insulating spacer. Thus, a length between the lower end and the upper end is set.
  • FIG. 4 is a diagram illustrating an exemplary bridge circuit for obtaining a strain sensor output used in an embodiment of the present invention. It is a figure which shows the attachment aspect of a some strain sensor, (a) and (b) show another aspect, respectively. It is a typical figure showing composition of a flow control device by an embodiment of the present invention. It is a partial cross section figure which shows the piezoelectric element drive type valve which concerns on another embodiment of this invention.
  • FIG. 1 shows a piezoelectric element driven valve 100 according to an embodiment of the present invention.
  • the piezoelectric element driven valve 100 is attached to the valve body 1 in which the flow path F is formed, and is provided so as to control the flow rate of the fluid flowing through the flow path F.
  • the valve body 1 is made of, for example, stainless steel, and includes a hole that forms part of the valve chamber, a fluid inlet, a fluid outlet, a fluid passage, a valve chamber, a valve seat 5, and the like.
  • a metal diaphragm as the valve body 2 of the piezoelectric element driven valve 100 is disposed so as to be detachable from the valve seat 5 through the flow path F.
  • the valve body 2 is formed of, for example, a thin plate of nickel chrome alloy steel, and is formed in an inverted dish shape with a central portion slightly bulging upward.
  • the shape of the valve body 2 may be flat, and the material may be stainless steel, Inconel alloy, or other alloy steel.
  • the valve body 2 may be formed of a single diaphragm or may be formed by laminating two to three diaphragms.
  • the valve body (metal diaphragm) 2 is disposed in the valve chamber so as to be opposed to the valve seat 5, and the peripheral portion of the valve body 2 with respect to the valve body 1 by the presser adapter 4, the split base 26 and the cylinder body fixing / guide body 25. Holding fixed.
  • the presser adapter 4, the cylinder fixing / guide body 25, the split base 26 and the like are made of metal such as stainless steel. Further, the central portion of the valve body 2 is in contact with a valve body presser 3 fixed to a support cylinder 23 described later, and the valve body 2 is moved to and detached from the valve seat 5 by moving the valve body presser 3. be able to.
  • the heat insulating spacer 40 is disposed between the valve body 2 and the piezoelectric actuator 10, and these are accommodated inside the support cylinder 23.
  • the support cylinder 23 is formed by connecting the upper cylinder 23U that accommodates the piezoelectric actuator 10 and the lower cylinder 23L that accommodates the heat insulating spacer, but the support cylinder 23 is integrated. It may be provided as a typical cylinder.
  • the support cylinder 23 is formed in a cylindrical shape, and a cylindrical diameter-reduced portion having a reduced diameter for accommodating the lower cradle 9, the elastic member 18, and the like is formed in a lower portion of the support cylinder 23. . Further, an opening for fitting the valve body presser 3 is formed at the lowermost end portion of the support cylinder 23, and the valve body presser 3 is inserted and fixed therein.
  • FIG. 2A is a longitudinal sectional view of the supporting cylinder 23 (here, the lower cylinder 23L), and FIG. 2B is a sectional view taken along the line AA in FIG. 2A.
  • both side portions of the outer wall portion are removed over a certain length and depth, so that the split base pieces constituting the split base 26 are disposed on both sides.
  • a hole 23a is formed for insertion and combination in an opposing manner. That is, from both sides of the hole 23a, the half-divided split base pieces forming the split base 26 are assembled so as to face each other, and are integrally held and fixed as the split base 26 by the cylinder fixing / guide body 25.
  • the elastic member 18 is inserted into the bottom 23b of the reduced diameter portion 23d before the split base piece is assembled.
  • the valve body 1 to which the piezoelectric element driving valve 100 is attached is fixed to the primary connection portion 29A and the secondary connection portion 29B via a gasket 29C.
  • the piezoelectric element drive type valve 100, the valve body 1, the primary connection portion 29A, and the secondary connection portion 29B may be integrally accommodated in a protective case (not shown). Further, a control circuit board connected to the piezoelectric actuator 10 may be accommodated in the protective case. Furthermore, when incorporating in a pressure type flow control device, the valve body 1 may be provided with a pressure sensor communicating with the flow path.
  • the piezoelectric element drive type valve 100 can be assembled by a method similar to the method described in Patent Document 3, for example.
  • the piezoelectric element drive type valve 100 of the present embodiment is a normally closed type valve.
  • a valve opening signal is input from a control circuit (not shown) through the connector 15 (for example, input voltage: 0 to 120 V)
  • the piezoelectric actuator 10 extends by a set value (for example, 0 to 45 ⁇ m).
  • a pushing force of 40 to 80 kgf acts on the support cylinder 23, and the support cylinder 23 receives the elastic force of the elastic member 18 in a state where the shaft core is held by the O-ring inside the cylinder fixing / guide body 25.
  • it increases by the set value.
  • the valve body 2 is separated from the valve seat 5 by its elastic force and opened.
  • the piezoelectric actuator 10 returns to the original length dimension.
  • the elastic force of the elastic member 18 causes the piezoelectric actuator to The bottom portion of the support cylinder 23 is pushed downward, and the valve body 2 is brought into contact with the valve seat 5 by the valve body presser 3 to be closed.
  • a metal sealed laminated piezoelectric actuator in which a piezo stack in which piezoelectric elements are laminated is sealed in a metal container can be used.
  • This type of metal sealed laminated piezoelectric actuator is, for example, Nippon Special Ceramics Co., Ltd. What is marketed from etc. can be used.
  • the piezoelectric element drive type valve 100 of the present embodiment lifts and supports the valve body 2, the piezoelectric actuator 10 for opening and closing the valve body 2, and the piezoelectric actuator 10 so as to be away from the fluid flow path.
  • a heat insulating spacer 40 for insulating heat transmitted from the fluid flowing through the fluid flow path to the piezoelectric actuator 10 is provided.
  • the piezoelectric actuator 10 and the heat insulating spacer 40 are accommodated in the support cylinder 23.
  • at least a portion for accommodating the heat insulating spacer 40 is formed of the same material as the heat insulating spacer 40.
  • the heat insulating spacer 40 is preferably formed of a material having a low thermal expansion coefficient (preferably 2 ⁇ 10 ⁇ 6 / K or less) such as invar material such as invar, super invar, and stainless invar.
  • the lower cylindrical body 23L is also made of the same material as the heat insulating spacer 40, that is, a material having a low coefficient of thermal expansion (preferably 2 ⁇ 10 ⁇ 6 / K or less, such as invar material such as invar, super invar, and stainless invar).
  • the upper cylindrical body 23U is preferably formed of a material having a small thermal expansion coefficient, and can be formed of the same material as the lower cylindrical body 23L.
  • the heat insulating spacer 40 is preferably formed from a highly heat conductive material such as a metal or an alloy from the viewpoint of heat insulating efficiency, and an Invar material is also suitable in this respect.
  • a highly heat conductive material such as a metal or an alloy from the viewpoint of heat insulating efficiency
  • an Invar material is also suitable in this respect.
  • Specific examples of the invar material include an Fe-36 wt% Ni alloy.
  • the invar material has a low thermal conductivity, it can be suitably used for a heat insulating material.
  • the heat insulating spacer 40 insulates the heat received from the fluid flowing through the flow path F from the lower end portion of the heat insulating spacer 40 to the upper end portion, whereby the temperature of the upper end portion of the heat insulating spacer 40, that is, in the illustrated example, the heat insulating
  • the length (height dimension) of the heat insulating spacer 40 is set so that the temperature at the location where the spacer 40 and the piezoelectric actuator 10 are in contact with each other is equal to or lower than the heat resistant temperature of the piezoelectric actuator 10.
  • the heat insulating spacer 40 is formed in a columnar shape having the same height and diameter as the piezoelectric actuator 10 as shown in the illustrated example.
  • the lower cylindrical body 23L can use the supporting cylindrical body that has been used for housing the piezoelectric actuator 10 in the related art as it is.
  • the heat insulating spacer 40 supports the piezoelectric actuator 10 at a lifted position so as to be away from the flow path F, a part of the heat of the high-temperature fluid flowing through the flow path F is transferred to the piezoelectric actuator 10. Before, it is insulated by the heat insulating spacer 40. As a result, even if the temperature of the fluid flowing through the flow path F exceeds the allowable temperature range of the piezoelectric actuator 10, the temperature of the piezoelectric actuator 10 can be suppressed within the allowable temperature range.
  • the support cylinder 23 that accommodates and supports the heat insulating spacer 40 and the piezoelectric actuator 10 is formed of the same material as the heat insulating spacer 40, the heat insulation of the heat insulating spacer 40 and the portion surrounding the heat insulating spacer 40 are surrounded.
  • the thermal elongation of the support cylinder 23 can be made equal or substantially equal. As a result, even when a valve lift of a minute lift of 50 ⁇ m or less, for example, can be controlled with high accuracy.
  • the heat insulating spacer 40 in this embodiment has a stacking direction of the heat insulating spacer 40 and the piezoelectric actuator 10 (or a stacking direction of a plurality of piezoelectric elements when a piezo stack is used).
  • a plurality of holes 40H are formed along a direction intersecting the vertical direction D1 (in the figure, the orthogonal horizontal direction). More specifically, the first hole 40H1 penetrating along the first horizontal direction D2 and the second hole penetrating along the second horizontal direction D3 orthogonal to the first hole 40H1 (the frontward direction in FIG. 1). Holes 40H2.
  • a rod-like heat insulating spacer 40 extending in the longitudinal direction is used, and the vertical direction D1 corresponds to the longitudinal direction of the heat insulating spacer 40.
  • the heat insulation spacer 40 the thing of the aspect which laminated
  • the surface area of the heat insulating spacer 40 can be increased, and the heat conducted can be dissipated to the outside and the heat insulating property can be improved.
  • the temperature of the piezoelectric element of the piezoelectric actuator 10 can be maintained at 100 ° C. or lower due to the heat insulating effect of the heat insulating spacer 40.
  • the piezoelectric element drive type valve 100 can be suitably used even in applications where the temperature is higher than conventional.
  • the drilling of the plurality of holes 40H can be performed relatively easily using a drill or the like, even if the insulating spacer 40 is made of Invar material. For this reason, high temperature tolerance can be improved effectively at low cost.
  • an opening 23H is also provided in the support cylinder 23 at a position corresponding to the hole 40H provided in the heat insulating spacer 40.
  • the opening 23 ⁇ / b> H of the support cylinder 23 is preferably formed so as to at least partially overlap the hole 40 ⁇ / b> H provided in the heat insulating spacer 40.
  • the number and shape of the holes 40H may be various as long as desired rigidity is maintained in the heat insulating spacer 40, and may be, for example, 2 to 10 round holes.
  • the shape of the hole may be, for example, a long hole, a square hole, a triangular hole, or the like.
  • the hole may be formed by the screw hole, and thereby the surface area of the hole can be expanded, and the heat insulation efficiency can be improved.
  • the drilling directions of the plurality of holes may be different from each other or the same direction.
  • a piezoelectric element drive type valve 110 according to another embodiment shown in FIG. 7 shows an example in which the hole 40H is a long hole and the upper hole 40H1 and the lower hole 40H2 are parallel to each other. It is.
  • the strain sensor 20 for directly detecting the degree of expansion of the piezoelectric element constituting the piezoelectric actuator 10 is fixed to the side surface of the piezoelectric element.
  • the piezoelectric actuator 10 used in the present embodiment will be described.
  • FIG. 3A is an exploded view of the outer cylinder 10a and a plurality of piezoelectric elements 10b (hereinafter sometimes referred to as piezo stacks) accommodated in a line in the cylinder 10a.
  • FIG. 3B shows a state in which the connector portion 10c shown in FIG.
  • the strain sensor 20 is directly attached to at least one of the plurality of piezoelectric elements 10b by an adhesive or the like.
  • the strain sensor 20 is disposed on the side surface of the piezoelectric element.
  • the strain sensor 20 includes a first strain gauge 20z that detects strain in the stacking direction of the piezoelectric elements, that is, the z direction that is the main extension direction of the piezo stack.
  • the second strain gauge 20x detects strain in the x direction orthogonal to the main extension direction.
  • KFR-02N, KFGS-1, and KFGS-3 manufactured by Kyowa Denki Co., Ltd. can be used.
  • the piezoelectric actuator 10 may be configured by a single piezoelectric element housed in a cylindrical body and a strain sensor attached to this side surface.
  • the first strain gauge 20z is attached to the side surface of the piezoelectric element so that the entire first strain gauge 20z is in contact with the piezoelectric element, and the second strain gauge 20x crosses the central portion of the first strain gauge 20z. Affixed to the piezoelectric element.
  • the first strain gauge 20z and the second strain gauge 20x can detect the extension amount of the piezoelectric element as a change in electric resistance of the first strain gauge 20z and the second strain gauge 20x.
  • the connector portion 10c is connected to a pair of drive voltage terminals 22a and 22b for applying a drive voltage to the piezo stack 10b and one terminal of the first strain gauge 20z.
  • the first strain sensor output terminal 24a, the strain sensor common output terminal 24c commonly connected to the other terminal of the first strain gauge 20z and one terminal of the second strain gauge 20x, and the second strain gauge 20x.
  • a second strain sensor output terminal 24b connected to the other terminal is provided.
  • the plurality of piezoelectric elements constituting the piezo stack 10b are electrically connected to the drive voltage terminals 22a and 22b by a known circuit configuration, and all of the piezoelectric elements are applied by applying a voltage to the drive voltage terminals 22a and 22b. Can be extended in the stacking direction.
  • the first and second strain sensor output terminals 24a and 24b and the strain sensor common output terminal 24c are connected to a circuit provided on the external substrate, and a bridge circuit including the first strain gauge 20z and the second strain gauge 20x is provided. Is formed. In this bridge circuit, changes in the resistance values of the first strain gauge 20z and the second strain gauge 20x can be detected.
  • FIG. 4 shows an exemplary equivalent circuit for detecting resistance value changes of the first strain gauge 20z and the second strain gauge 20x.
  • resistors R1 and R2 provided between the branch points AD and between the branch points CD correspond to fixed resistors of known resistance values provided on the external substrate.
  • the resistor R3 provided between A and B corresponds to the first strain gauge 20z
  • the resistance values of the first strain gauge 20z and the second strain gauge 20x and the resistance values of the two fixed resistors R1 and R2 are set to be the same. For example, both are set to 120 ohms or 350 ohms. Is set.
  • the branch point A corresponds to the first strain sensor output terminal 24a
  • the branch point B corresponds to the strain sensor common output terminal 24c
  • the branch point C corresponds to the second strain sensor output terminal 24b.
  • the change in the resistance value of the first strain gauge 20z or the second strain gauge 20x in a state where a predetermined bridge applied voltage is applied between the branch points AC is the bridge output signal (branch point B- D (potential difference between D) is detected.
  • the bridge output signal is typically zero in the initial state in which no stress is generated in the first and second strain gauges 20z and 20x. Show.
  • the piezoelectric element to which the strain sensor 20 is attached expands in the z direction and contracts in the x direction orthogonal thereto.
  • the resistance value of the first strain gauge 20z increases corresponding to the expansion amount of the piezoelectric element
  • the resistance value of the second strain gauge 20x decreases corresponding to the contraction amount of the piezoelectric element.
  • the bridge output signal increases as the amount of distortion in decreases. For this reason, when the piezo stack is displaced, the bridge output signal fluctuates corresponding to the sum of the increased amount of strain of the first strain gauge 20z and the decreased amount of strain of the second strain gauge 20x. As a result, the bridge output signal can be amplified.
  • the bridge circuit by configuring the bridge circuit using the first strain gauge 20z and the second strain gauge 20x orthogonal to the first strain gauge 20z, it is possible to correct the resistance value change of the strain sensor 20 due to the temperature change. It is. This is because, for example, when the piezoelectric element expands due to a rise in temperature, the expansion works as an element for increasing the bridge output signal for the first strain gauge 20z, whereas This is because a bridge output signal that acts as an element for reducing the bridge output signal and in which the increase and decrease elements due to temperature are offset is obtained. For this reason, even when the piezoelectric element itself expands or contracts due to a change in temperature, the influence on the bridge output signal is reduced, and the extension degree of the piezoelectric element can be accurately measured. become.
  • strain sensors 20 may be attached to the side surfaces of the plurality of piezoelectric elements 10b.
  • the strain sensor 20 may be attached to each of two side surfaces that intersect at 90 ° of the piezoelectric element 10b.
  • the strain sensor 20 may be attached to each of two opposing side surfaces of the piezoelectric element 10b.
  • FIG. 6 is a schematic diagram showing the configuration of the flow control device 200.
  • the flow control device 200 includes a pressure control valve 66 provided in the flow path F on the inflow side of the gas G0, a flow control valve 68 provided on the downstream side of the pressure control valve 66, a downstream side of the pressure control valve 66, and A first (or upstream) pressure sensor 63 that detects an upstream pressure P 1 on the upstream side of the flow control valve 68 and a throttle portion 62 disposed on the downstream side of the pressure control valve 66 are provided.
  • the throttle unit 62 is configured by an orifice plate disposed on the upstream side of the flow control valve 68. Since the orifice plate has a fixed orifice area, the orifice plate functions as a throttle with a fixed opening.
  • the “throttle section” is a portion in which the cross-sectional area of the flow path is limited to be smaller than the cross-sectional area of the front and rear flow paths, and includes, for example, an orifice plate, a critical nozzle, a sonic nozzle However, it can also be configured using other things.
  • the throttle portion includes a valve structure as a variable orifice whose opening is the distance between the valve seat of the valve and the valve body. Such a valve structure functions as a throttle portion having a variable opening.
  • the flow control device 200 of the present embodiment also detects a second (or downstream) pressure sensor 64 that measures a downstream pressure P 2 downstream of the flow control valve 68 and a pressure P 0 upstream of the pressure control valve 66.
  • the inflow pressure sensor 65 is provided.
  • the flow control device 200 may not include the second pressure sensor 64 or the inflow pressure sensor 65 in another aspect.
  • the first pressure sensor 63 can measure the upstream pressure P 1 which is the fluid pressure between the pressure control valve 66 and the throttle unit 62 or the flow rate control valve 68, and the second pressure sensor 64 can measure the throttle unit 62 or The downstream pressure P 2 of the flow control valve 68 can be measured.
  • the inflow pressure sensor 65 measures an inflow pressure P 0 of a material gas, an etching gas, a carrier gas, or the like supplied to the flow rate control device 200 from a connected gas supply device (for example, a raw material vaporizer or a gas supply source). can do.
  • the inflow pressure P 0 can be used to control the gas supply amount and gas supply pressure from the gas supply device.
  • the downstream side of the flow rate control valve 68 is typically connected to, for example, a process chamber of a semiconductor manufacturing apparatus via a downstream valve (not shown).
  • a vacuum pump is connected to the process chamber.
  • the gas G1 whose flow rate is controlled is supplied from the flow rate control device 200 to the process chamber while the inside of the process chamber is evacuated.
  • the downstream valve for example, a known air driven valve whose opening / closing operation is controlled by compressed air, an electromagnetic valve, or the like can be used.
  • the flow path F of the flow control device 200 may be constituted by a pipe or a flow path hole formed in a metal block.
  • the first and second pressure sensors 63 and 64 may include, for example, a silicon single crystal sensor chip and a diaphragm.
  • the pressure control valve 66 may be, for example, a known piezoelectric element drive type valve that drives a metal diaphragm valve body with a piezoelectric actuator. As will be described later, the opening degree of the pressure control valve 66 is controlled in accordance with a signal output from the first pressure sensor 63. For example, the upstream pressure P 1 output from the first pressure sensor 63 is input. Feedback control is performed to maintain the set value.
  • the flow control valve 68 includes a valve element disposed so as to be attached to and detached from the valve seat, a piezoelectric element for moving the valve element, and a strain sensor 20 that detects an extension amount of the piezoelectric element.
  • the piezoelectric element driving type valve is provided with the piezoelectric element driving type valve 100 shown in FIG.
  • the flow rate control valve 68 is feedback controlled to drive the piezoelectric element based on a signal output from the strain sensor 20.
  • the flow control device 200 includes a first control circuit 67 that controls the opening / closing operation of the pressure control valve 66 based on the output of the first pressure sensor 63.
  • the first control circuit 67 is configured to feedback control the pressure control valve 66 so that the difference between the set upstream pressure received from the outside and the output of the first pressure sensor 63 becomes zero.
  • the upstream pressure P 1 on the downstream side of the pressure control valve 66 and the upstream side of the flow rate control valve 68 can be maintained at the set value.
  • the flow control device 200 also has a second control circuit 69 that receives the output from the strain sensor 20 provided in the flow control valve 68 as a piezo valve displacement and controls the drive of the flow control valve 68 based on this output. ing.
  • FIG. 6 shows a mode in which the first control circuit 67 and the second control circuit 69 are separately provided, but these may be provided integrally.
  • the first control circuit 67 and the second control circuit 69 may be built in the flow control device 200 or may be provided outside the flow control device 200.
  • the first control circuit 67 and the second control circuit 69 are typically constituted by a CPU, a memory (storage device) M such as a ROM or a RAM, an A / D converter, and the like, and execute a flow rate control operation described later.
  • the computer program comprised in this may be included.
  • the first control circuit 67 and the second control circuit 69 can be realized by a combination of hardware and software.
  • the flow control device 200 controls the flow control valve 66 while the first control circuit 67 and the second control circuit 69 control the pressure control valve 66 so that the upstream pressure P 1 output from the first pressure sensor 63 becomes a set value.
  • the flow rate of the fluid flowing downstream of the flow rate control valve 68 is controlled by controlling the driving of the 68 piezoelectric elements 10b.
  • the flow rate control device 200 has a critical expansion condition P 1 / P 2 ⁇ about 2 (P 1 : fluid pressure upstream of the throttle (upstream pressure), P 2 : fluid pressure downstream of the throttle (downstream pressure)).
  • P 1 fluid pressure upstream of the throttle
  • P 2 fluid pressure downstream of the throttle (downstream pressure)
  • the flow rate Q is considered to be approximately proportional to the upstream pressure P 1 and the valve opening Av of the flow control valve 68. Further, when the second pressure sensor 64 is provided, the flow rate can be calculated even when the difference between the upstream pressure P 1 and the downstream pressure P 2 is small and the above critical expansion condition is not satisfied.
  • FIG. 1 in the flow control device including the pressure control valve, the flow control valve provided on the downstream side of the pressure control valve, and the throttle unit provided on the downstream side of the pressure control valve, FIG.
  • the illustrated piezoelectric element drive type valve 100 of the present embodiment may be used as the pressure control valve 66 in the flow rate control device 200 shown in FIG.
  • the piezoelectric element drive type valve 100 may be used for both the pressure control valve 66 and the flow rate control valve 68.
  • the present invention is not limited to the above embodiment, and can be modified without departing from the spirit of the present invention.
  • the pressure control type flow control device has been described in the above embodiment, the present invention can be applied to a control method other than the pressure control method, for example, a thermal flow control device using a thermal sensor.
  • the fluid control device including the self-elastic elastic return type metal diaphragm valve body has been described.
  • those skilled in the art can apply the present invention to valve bodies other than the metal diaphragm. It is self-evident.
  • a flow control device includes a pressure control valve and a throttle unit, and pressure controls feedback control of the pressure control valve based on an output from a pressure sensor provided between the pressure control valve and the throttle unit.
  • the pressure control valve may use the piezoelectric element drive type valve 100 shown in FIG.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Electrically Driven Valve-Operating Means (AREA)
  • Details Of Valves (AREA)

Abstract

L'invention concerne une soupape entraînée par un élément piézoélectrique (100) conçue pour pouvoir réguler un fluide ayant une température dépassant une température de plage d'utilisation d'un actionneur piézoélectrique. La soupape entraînée par un élément piézoélectrique (100) comprend : un élément piézoélectrique (10b) destiné à amener un corps de soupape (2) à être séparé d'un siège de soupape (5) ou installé sur celui-ci ; un élément d'entretoise thermo-isolant (40) disposé entre le corps de soupape (2) et l'élément piézoélectrique (10b) ; et un capteur de distorsion (20) fixé à l'élément piézoélectrique (10b). L'élément d'entretoise thermo-isolant (40) a une pluralité de trous (40H) qui pénètrent à travers celui-ci dans une direction croisant une direction d'empilement (D1) de l'élément d'entretoise thermo-isolant (40) et l'élément piézoélectrique (10b).
PCT/JP2019/005082 2018-02-19 2019-02-13 Soupape entraînée par un élément piézoélectrique et dispositif de régulation de débit volumétrique WO2019159959A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021117626A1 (fr) * 2019-12-11 2021-06-17 京セラ株式会社 Actionneur piézoélectrique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318388A (en) * 1976-08-03 1978-02-20 Nec Corp Air cooled heat sink for flat package type semiconductor device
JPH0211979A (ja) * 1988-06-28 1990-01-17 Kiyohara Masako 微流量制御装置
JP2004156720A (ja) * 2002-11-07 2004-06-03 Smc Corp ヒーター付きポペット弁
JP2004162733A (ja) * 2002-11-08 2004-06-10 Stec Inc 高温対応バルブ
JP2011117499A (ja) * 2009-12-01 2011-06-16 Fujikin Inc 圧電駆動式バルブ及び圧電駆動式流量制御装置
JP2016138844A (ja) * 2015-01-29 2016-08-04 パナソニックＩｐマネジメント株式会社 歪センサ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318388A (en) * 1976-08-03 1978-02-20 Nec Corp Air cooled heat sink for flat package type semiconductor device
JPH0211979A (ja) * 1988-06-28 1990-01-17 Kiyohara Masako 微流量制御装置
JP2004156720A (ja) * 2002-11-07 2004-06-03 Smc Corp ヒーター付きポペット弁
JP2004162733A (ja) * 2002-11-08 2004-06-10 Stec Inc 高温対応バルブ
JP2011117499A (ja) * 2009-12-01 2011-06-16 Fujikin Inc 圧電駆動式バルブ及び圧電駆動式流量制御装置
JP2016138844A (ja) * 2015-01-29 2016-08-04 パナソニックＩｐマネジメント株式会社 歪センサ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021117626A1 (fr) * 2019-12-11 2021-06-17 京セラ株式会社 Actionneur piézoélectrique

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