Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
  • C09K5/08—Materials not undergoing a change of physical state when used
  • C09K5/14—Solid materials, e.g. powdery or granular
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/10—Esters; Ether-esters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/544—Silicon-containing compounds containing nitrogen
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/65—Means for temperature control structurally associated with the cells
  • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/66—Heat-exchange relationships between the cells and other systems, e.g. central heating systems or fuel cells
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
  • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
  • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
  • H01M50/233—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions
  • H01M50/24—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/001—Conductive additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2205/00—Polymer mixtures characterised by other features
  • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
  • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M2220/00—Batteries for particular applications
  • H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/10—Energy storage using batteries

Definitions

• heat is generated which has to be dissipated quickly and effectively from the heat-generating unit.
• a fixed mechanical contact is conventionally produced either by means of screws, clamps or materially by means of soldering or welding.
• the mechanical fixing has the advantage that the connection is releasable again.
• the heat transfer only takes place via a few contact points. Since there is an air layer in between, which is a very poor conductor of heat, the heat generated is dissipated only incomplete.
• thermally conductive materials are introduced into the joint between the active components, i. E. between the heat-generating and the heat-dissipating component.
• thermally conductive materials are known, for example, in the form of heat conductive pastes from microelectronics and enable the heat dissipation from semiconductor chips there.
• heat-conducting pastes usually consist of a heat-conductive filler of metallic or ceramic particles, such as alumina, and a silicone-containing base oil as a binder.
• thermal paste for electronic components which contains alumina as a filler and a silicone-containing base oil.
• Such heat-conducting pastes generally meet the requirements given in microelectronics by being able to be introduced into the joint between the active components in a simple manner and, owing to their pas- property are also removable again. Furthermore, they can also be used in large-volume technical applications, such as for thermal contacting in heat exchangers. Due to their paste-like property, however, such heat-conducting pastes are not very suitable for applications which are exposed to mechanical stresses. Mechanical loads, such as vibrations or movements, can cause the thermal compound to escape from the joint between the active components, causing air to enter the joint. Such mechanical stresses play an essential role, for example, in vehicles, which is why, when cooling vehicle components, a suitable operational stability of the thermally conductive materials under impact, vibration and oblique position is desirable. The formation of an air layer between the active components can result in local overheating of the heat-dissipating components, thereby limiting their functionality. Thus, the escape of the thermal compound from the joint can cause a failure of the heat-generating component.
• the present invention is therefore based on the object of specifying a thermal contact and filling material which is suitable for large-volume applications in comparison with the heat-conducting pastes known from the prior art and, in particular, better withstands potential mechanical stresses.
• a thermal contact and filling material according to the invention has at least one heat-conducting filler and at least one silicone-free base oil. It is essential here that the heat-conductive filler is a metal hydroxide, in particular an aluminum hydroxide, and that the thermal contact and filling material furthermore has at least one chemically crosslinkable prepolymer mixture.
• the thermal contact and filling material according to the invention has the advantage over the thermal paste known from the prior art that a metal hydroxide is used as heat-conducting filler, which is typically specific light and inexpensive.
• the metal hydroxide is aluminum hydroxide, which has a substantially lower density of only 2.4 g / cm 3 compared to the density of 3.9 g / cm 3 of the commonly used alumina.
• a lower density of the components of the thermal contact and filling material used preferably has an effect on its range of application.
• a lower density and concomitant reduction in the weight of the thermal contact and fill material is desirable.
• the invention is not limited thereto.
• the metal hydroxides used are typically much less abrasive compared to the metal oxides, so that not only the active components, but also any components of metering systems are protected, with which the thermal contact and filling material according to the invention is processed.
• premature wear of the active components as well as of the metering systems can advantageously be avoided.
• the inventive thermal contact and filling material contains a silicone-free base oil as a binder.
• silicone-containing base oils contain small amounts of volatile silicone compounds which can be released from the base oil into the ambient air. These volatile silicone compounds can be deposited on surfaces surrounding the active components. If subsequent coating or adhesion processes are to be carried out on these contaminated surfaces, there is a risk that the adhesion of the paint or adhesive layers will be lost.
• the volatile silicone compounds reach electrical contacts, they are decomposed by sparks and form insulating oxide layers, which impairs or destroys the func- tionality of the contacts.
• the use of a silicone-free base oil therefore advantageously avoids the contamination of surrounding surfaces with volatile silicone compounds.
• a binder in the form of a silicone-free base oil makes it possible to adjust the viscosity and thus the flowability of the thermal see contact and filling material to a desired value.
• the viscosity and flowability of the thermal contact and filler material can be adjusted with respect to the intended application.
• a chemically cross-linkable prepolymer mixture advantageously makes it possible for the thermal contact and filler material, after being filled into a gap between two active components, to cure by chemical crosslinking to form a polymer.
• this avoids the thermal contact and filling material escaping from the joint as a result of mechanical loads due to vibrations and movements and changing its position, whereby air is again introduced into the joint between the active layers Components of the heat-generating components may occur. This avoids local overheating of the heat-generating component, which ultimately prolongs the service life of these components.
• the chemical crosslinking of the polymer preferably takes place by means of water, in particular in the form of atmospheric moisture.
• the invention is not limited thereto.
• the described thermal contact and filling material may preferably be provided for such applications in energy and electrical engineering, in which larger volumes or gaps must be thermally conductive and potentially reversibly filled. This is primarily the case with traction batteries for electric vehicles, where it is about the metered and repairable thermal contacting of Li-ion cells or modules.
• the thermal contact and filling material can be preferably used for other applications in industrial heating and cooling technology, in electrical engineering, electronics and mechanical engineering.
• the chemically crosslinkable prepolymer mixture has at least one prepolymer and at least one crosslinker. It has proven to be advantageous if the prepolymer is preferably an alkoxysilane-functionalized polyether. By the polymerization of an alkoxysilane-functionalized polyether, a solid and at the same time elastic thermal contact and filling material can typically be formed.
• a prepolymer and a crosslinker allows the formation of a three-dimensional polymeric network and thus the formation of an elastic, dimensionally stable mass. This leads to an even clearer optimization of the operating strength under impact, vibration, tilt and changing temperatures of the heat-generating components. It is within the scope of the invention that the proportion of the crosslinking agent in relation to the prepolymer can be adjusted in such a way that a desired elasticity of the thermal contact and filling material is maintained after crosslinking, so that the material can be easily removed again from the heat-generating components. can be solved and removed.
• the crosslinker is an organofunctional silane.
• organofunctional silanes are considered to be hybrid chemical compounds which are silanes provided with reactive organic groups, as a result of which they act as crosslinkers, i. H . can serve as a "molecular bridge" between prepolymers.
• Commercially available silanes available include, for example, amino, epoxy, glycidoxy, mercapto and sulfido, isocyanato, methacryloxy and vinyl groups.
• organofunctional silane can be selected from the group vinyltrimethoxysilane,
• the thermal contact and filling material comprises a polymerization catalyst.
• a polymerization catalyst optimizes the rate of cure of the thermal contact and fill material. It is within the scope of the invention that the type of polymerization catalyst can be selected as a function of the composition of the prepolymer mixture and of the desired properties of the crosslinked end product.
• thermal contact and filling material Since the thermal contact and filling material must have sufficient flowability for automatic processability, a further advantageous embodiment of the thermal contact and filling material provides that the proportion of the heat-conducting filler in the thermal contact and filling material in the Range of 50 to 90 percent by weight. Investigations by the Applicant have shown that an optimum viscosity and thus flowability can be achieved by using a proportion of the heat-conductive filler in the range from 50 to 90 percent by weight in the thermal contact and filling material.
• the flowability and the viscosity of the thermal contact and filling material can be influenced by the proportion of the base oil. Therefore, the proportion of the silicone-free base oil in the thermal contact and Medmate- rial in a further advantageous embodiment in the range of 5 bis
• a further advantageous embodiment of the thermal contact and filling material provides that the proportion of the chemically cross-linkable prepolymer mixture in the thermal contact and filling material is in the range from 1 to 15% by weight.
• a smaller proportion of the chemically crosslinkable prepolymer mixture leads to a lower hardness and stability of the thermal contact and filling material in the polymerized state.
• a higher proportion of the chemically crosslinkable prepolymer mixture leads accordingly to a higher hardness and stability.
• the silicone-free base oil of the thermal contact and filling material is preferably high-boiling, in particular, the silicone-free base oil preferably has a vapor pressure of ⁇ 1 0 4 h Pa at a temperature of 20 ° C.
• the silicone-free base oil of the thermal contact and filler material is preferably an ester.
• esters as a base oil is well known, for example in the manufacture of lubricants. These can be subdivided into synthetic products and such natural origins as, for example, vegetable oils or animal fats.
• the ester used for the thermal contact and filling material is preferably a high-boiling, synthetic ester which is distinguished by a high oxidation stability and low tendency to evaporate and therefore also at elevated temperatures in the range from 50 ° C. to 1 50 ° C can be used.
• high boiling ester refers to esters with a vapor pressure of ⁇ 1 0 4 h Pa at a temperature of 20 ° C.
• the thermal contact and filling material in a further advantageous embodiment has a curing rate of 0.1 mm / day to 10 mm / Day, preferably from 0.5 mm / day to 7 mm / day, more preferably from 1 mm / day to 5 mm / day.
• the thermal contact and filling material can be introduced without time pressure in the joint between the active components and at the same time a long curing time can be avoided. This ultimately has a positive effect on the processability of the thermal contact and filling material.
• thermal contact and filling material has a dynamic viscosity in the range of 50 to 500 Pa-s (measured with ei - A rotary viscometer at 40 ° C).
• the flowability of the thermal contact and filling material can be adjusted to a desired value by the addition of rheology additives.
• rheology additives are present in the thermal contact and filler material in the range of 0.1 to 5% by weight and serve to increase the viscosity of the thermal contact and filler material.
• the invention is not limited thereto.
• the thermal contact and filling material has a thermal conductivity in the range from 1 to 5 W / m-K.
• the thermal conductivity of the thermal contact and filling material is dependent on its composition and can be adjusted accordingly by a suitable choice of components. This allows the thermal conductivity to be chosen depending on the application and at the same time a cost-optimized material can be produced.
• thermo contact and Grep-rials provides that this has a specific gravity in the range of 1, 5 to 2.5 g / cm 3 .
• the thermal contact and filling material according to the invention is characterized in that it has a silicone-free base oil.
• the thermal contact and filling material is silicone-free. This ensures that contamination of the surrounding surfaces by volatile silicone compounds from the base oil as well as from other components of the thermal contact and filling material is avoided. Thus, impairment of the functionality of other components in the vicinity of the heat-generating element can be prevented.
• Another aspect of the present invention provides an accumulator arrangement, in particular for a vehicle, which has at least one carrier, at least one accumulator element and with at least one bottom plate.
• the accumulator element is arranged on the carrier, wherein the carrier is arranged on the bottom plate.
• Accumulator arrangements such as, for example, the lithium-ion accumulator are well known in the automotive industry as drive batteries for electric vehicles. H here, individual lithium-ion cells are mounted on a carrier, wherein a plurality of carriers are attached to a bottom plate with lithium-ion cells to increase the battery capacity of the lithium-ion battery. In order to effectively dissipate the heat generated in the lithium-ion cells, both the carrier and the bottom plate serve as heat-dissipating elements.
• Conventional cooling systems are based on liquid cooling or on the thermal compounds described in the prior art. In the case of liquid cooling, the problem arises that the liquid does not flow evenly in the joint between the active components, whereby no uniform heat dissipation can be ensured. Consequently, a malfunction of the accumulator arrangement may occur.
• WO 2012/01 3789 A1 discloses an accumulator arrangement having a plurality of accumulator elements connected to one another and arranged parallel to one another, wherein the heat generated by the accumulator elements is dissipated by a thermal paste which contains a silicone-containing base oil.
• silicone-containing base oils contain small amounts of volatile silicone compounds which can be released from the base oil into the ambient air.
• the volatile silicone compounds reach electrical contacts, they are decomposed by sparking to form insulating oxide layers, impairing or destroying the func- tionality of the contacts. This has a negative effect on the life of the accumulator arrangement.
• the accumulator arrangement according to the invention therefore provides, as an essential aspect, a thermally conductive layer which, at least between the base plate and the carrier and / or between the accumulator element and the carrier is arranged.
• the thermally conductive layer is formed from a thermal filling and contact material according to one of claims 1 to 1 3.
• the individual accumulator elements on the carrier and / or the carrier on the bottom plate prefferably fixed.
• the required shock resistance of the accumulator Tor arrangement ensured in the operating state.
• the invention is not limited thereto.
• a first advantageous embodiment of the accumulator arrangement provides that the thermally conductive layer is detachably arranged between the base plate and the carrier. This allows the thermal contact and filling material to be removed using moderate forces in the event of correction, repair or recycling of the accumulator assembly, whereby the carrier and / or the bottom plate are reusable.
• the thermally conductive layer furthermore preferably has thixotropic properties.
• thixotropic properties can preferably be achieved by a suitable choice of the composition of the thermal contact and filling material.
• a thixotropic thermally conductive layer may preferably be formed by the proportion of the prepolymer mixture and / or the crosslinker and / or the base oil in which the thermal contact and filling material.
• the thixotropic properties of the thermally conductive layer can also have a positive effect on the stability of the layer, whereby the service life of the thermally conductive layer is increased and the formation of a poorly thermally conductive air layer is prevented.
• the thermal contact and filling material, from which the thermally conductive layer is formed further additives such as stabilizers in the form of rheology additives.
• the addition of such additives makes it possible to adjust the viscosity of the thermally conductive layer or the thermal contact and Gremateri- as and preferably also affects the stability of the thermally conductive layer.
• An advantageous embodiment of the accumulator arrangement is that the thermally conductive layer has a layer thickness in the range of 0, 1 mm to 1 0 mm, preferably from 0.5 mm to 5 mm, particularly preferably from 1 mm to 3 mm.
• the layer thickness can be optimally adapted to the size of the joint between active components.
• FIG. 1 shows a first embodiment of an accumulator lator arrangement according to the invention in a perspective, schematic representation
• FIG. 2 shows a detailed view of the exemplary embodiment of an accumulator arrangement according to the invention as a sectional illustration
• FIG. 1 shows a first embodiment of an accumulator lator arrangement according to the invention in a perspective, schematic representation
• FIG. 2 shows a detailed view of the exemplary embodiment of an accumulator arrangement according to the invention as a sectional illustration
• FIG. 1 shows a first embodiment of an accumulator lator arrangement according to the invention in a perspective, schematic representation
• FIG. 2 shows a detailed view of the exemplary embodiment of an accumulator arrangement according to the invention as a sectional illustration
• FIG. 1 shows a first embodiment of an accumulator lator arrangement according to the invention in a perspective, schematic representation
• FIG. 2 shows a detailed view of the exemplary embodiment of an accumulator arrangement according to the invention as a sectional illustration
• FIG. 1 shows a first embodiment of an
• FIG. 3 shows a detailed view of a second embodiment of an inventive accumulator arrangement as a sectional view.
• FIG. 1 shows a first exemplary embodiment of an accumulator arrangement 1 according to the invention.
• the accumulator arrangement 1 has a plurality of accumulator elements 21, 22, 23, 24, a plurality of carriers 31, 32, 33, 34, 35, 36 and a bottom plate 4.
• the carrier 31 is formed as a thermally conductive plate and in turn applied to the bottom plate and bolted thereto. As a result, the stability of the accumulator assembly 1 is ensured against impact or imbalance of the arrangement during operation.
• the carrier 31 and the bottom plate 4 are formed from metal. However, the invention is not limited thereto.
• the carrier 31 and / or the bottom plate 4 may also be formed of other thermally conductive materials such as graphite.
• the accumulator elements 21, 22, 23, 24 are arranged parallel to one another in series and designed as lithium-ion cells. However, the invention is not limited to this. It is therefore also within the scope of the invention that other accumulator types can be used. Furthermore, the accumulator elements 21, 22, 23, 24 can also be arranged in a different orientation to one another on the carrier 31, 32, 33, 34, 35, 36.
• a thermally conductive layer 5 H here the heat generated by the accumulator elements 21, 22, 23, 24 and discharged to the carrier heat dissipated to the bottom plate 4. It is within the scope of the invention that a thermally conductive layer 5 is also introduced between the accumulator elements 21, 22, 23, 24 and the carriers 31, 32, 33, 34, 35, 36 (not visible in FIG. 1). ,
• the thermally conductive layer 5 consists in the present embodiment of a thermal contact and filling material according to the invention, which contains, inter alia, aluminum hydroxide as a filler and a high-boiling synthetic ester as a silicone-free base oil.
• the thermally conductive layer 5 is applied over the entire surface between the six supports 31, 32, 33, 34, 35, 36 and the bottom plate 4. Furthermore, the layer has a layer thickness of 1 mm (not visible in FIG. 1). Hereby, optimal heat removal is made possible in the present exemplary embodiment. However, it is also within the scope of the invention for the thermally conductive layer 5 to be punctiform and / or strike fenartig between the six supports 31, 32, 33, 34, 35, 36 and the bottom plate 4 is applied with a layer thickness in the range of 0, 1 to 5 mm.
• FIG. 2 shows a detailed view of the already described embodiment of an accumulator assembly 1 according to the invention in a sectional view.
• the accumulator arrangement 1 has an identical construction to the embodiment described in FIG. Also in this case, four accumulator elements 21, 22, 23, 24 are mounted on a carrier 31 and screwed thereto (screw connection not shown).
• the carrier 31 is formed as a heat-conducting plate and in turn applied to the bottom plate 4 and screwed with this (screw also not shown). H hereby ensures the stability of the accumulator assembly 1 against shock or tilt of the arrangement during operation.
• a thermally conductive layer 5 is located between the carrier 31 and the bottom plate 4.
• the heat generated by the accumulator elements 21, 22, 23, 24 and dissipated to the carriers is applied derived the bottom plate 4.
• FIG. 3 shows a detailed view of a second exemplary embodiment of an accumulator arrangement 1 according to the invention in a sectional illustration.
• the accumulator arrangement 1 in a detailed view has an identical construction to the embodiment described in FIG. 2, for which reason further details are not to be considered initially.
• a difference from the embodiment described above is that not only between the carrier 31 and the bottom plate 4, a thermally conductive layer 51 is formed. Rather, between the individual accumulator elements 21, 22, 23, 24, a thermally conductive layer 52, 53, 54 perpendicular to the carrier 31 is introduced.
• the heat generated by the individual accumulator elements 21, 22, 23, 24 is uniformly distributed by convection to the surrounding accumulator elements 21, 22, 23, 24, whereby the heat dissipation to the carrier 31 and the bottom plate 4 is optimized.
• the thermally conductive layer 52, 53, 54 which is formed perpendicular to the carrier 31 between the individual accumulator elements 21, 22, 23, 24, introduced as a continuous layer or only selectively.
• This thermally conductive layer 52, 53, 54 is made of a thermal capacitor according to the invention. formed clock and filling material, in the present case, the layer is the same design as the thermally conductive layer. 5

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• 2018
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