WO2019148356A1 - 一种用于内置防火墙的交换机散热系统 - Google Patents

一种用于内置防火墙的交换机散热系统 Download PDF

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Publication number
WO2019148356A1
WO2019148356A1 PCT/CN2018/074700 CN2018074700W WO2019148356A1 WO 2019148356 A1 WO2019148356 A1 WO 2019148356A1 CN 2018074700 W CN2018074700 W CN 2018074700W WO 2019148356 A1 WO2019148356 A1 WO 2019148356A1
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WIPO (PCT)
Prior art keywords
heat dissipation
switch
outer casing
heat
air outlet
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PCT/CN2018/074700
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English (en)
French (fr)
Inventor
黄友华
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成都市宏山科技有限公司
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Publication date
Application filed by 成都市宏山科技有限公司 filed Critical 成都市宏山科技有限公司
Priority to PCT/CN2018/074700 priority Critical patent/WO2019148356A1/zh
Priority to CN201810750132.4A priority patent/CN108934149B/zh
Publication of WO2019148356A1 publication Critical patent/WO2019148356A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control

Definitions

  • the present invention relates to a heat dissipation system, and in particular to a switch heat dissipation system for a built-in firewall.
  • a switch is a device that performs information exchange functions in a communication system and is widely used in network deployment of various operators.
  • Firewalls Infections and attacks force firewalls to become necessary devices for enterprise networks.
  • Common firewalls generally act as an outlet for enterprise networks, filter viruses, prevent attacks, and perform encryption and decryption functions to protect enterprise information security.
  • firewalls have increased enterprise information security, but it has increased the network structure level and maintenance complexity, and also reduced the enterprise network export bandwidth, and also increased a lot of network investment.
  • a switch with a firewall and a routing function is provided, and the firewall is placed inside as a service module of the rack switch, and the routing switching function and the firewall function are integrated into one device, which can simplify the network structure and reduce the network device.
  • the advantage of this built-in firewall switch is that there is no connection line between the firewall and the internal network, which reduces the possible key failure points of the network and enhances the stability of the network; but its disadvantages are also obvious, due to the increase.
  • the firewall function the data processing capacity of the switch is large, and the heat generated by the processing chip is large, and the heat dissipation effect of the switch is often limited, the heat dissipation performance is not good, and the chip is easily burned.
  • the object of the present invention is to provide a switch heat dissipation system for a built-in firewall, which improves the heat dissipation performance of the switch by improving the heat dissipation structure of the switch, and solves the problem that the heat dissipation effect of the switch of the built-in firewall is limited.
  • a switch heat dissipation system for a built-in firewall comprising a switch body, the switch body comprising a casing, a main board disposed in the casing, and a central processor disposed on the main board; and a first heat dissipating component disposed inside the casing, a second heat dissipating component and a cooling box disposed outside the outer casing;
  • the first heat dissipating component includes a heat collecting plate, an oil inlet pipe, an oil outlet pipe, a heat dissipation fan, a pump, and a temperature sensor;
  • the heat collecting plate is internally provided with a cavity Both the oil pipe and the oil discharge pipe extend out of the outer casing to communicate with the cooling box, and the other end communicates with the cavity inside the heat collecting plate;
  • the cavity and the cooling box in the heat collecting plate are filled with cooling oil;
  • the pump is disposed at On the oil inlet pipe, when the pump is started, the cooling oil in the cooling tank flows into the cavity inside the heat collecting plate through
  • the temperature sensor collects the temperature signal in the housing and sends it to the central processing unit.
  • the central processor determines whether the temperature inside the housing is Go to the set threshold, turn on the switch of the pump when the temperature reaches the set threshold, and turn off the switch of the pump when the temperature is lower than the set threshold;
  • the air outlet is opened on the outer casing, and the heat dissipation fan is An air outlet;
  • a side of the outer casing is further provided with a mounting plate and a mounting bracket, the cooling box is fixed on the mounting plate;
  • the mounting bracket, the mounting plate and the air outlet are located on the same side of the outer casing, and the mounting bracket and the air outlet are both Located above the cooling box;
  • the second heat dissipating component includes a cooling fan fixed on the mounting frame, and a wind collecting device disposed at a lower portion of the side of the outer casing where the air outlet is located;
  • the air collecting device includes a collecting hood and is connected to the collecting hood a lower end of the
  • the central processing unit also known as the CPU
  • the heat generated by itself is relatively large. If the firewall function is also used to process the data, the more powerful the function, the easier it is to run. Produce more heat.
  • the firewall function is directly implemented by the CPU or a separate processing chip is used, the heat dissipation of the CPU requires special attention, and the heat dissipation system of the present application is applicable.
  • the heat generated by the CPU and other chips inside the chassis needs to be first radiated to the inside of the case, and this part of the heat needs to be transferred to the outside of the case.
  • the heat dissipation system of the switch of the present invention provides two heat dissipation channels inside the switch: one heat dissipation channel is composed of a heat dissipation fan and an air outlet located on the outer casing, and provides the most basic heat dissipation mode, and accelerates the air inside and outside the switch through the operation of the heat dissipation fan.
  • the second heat dissipation passage is a circulating closed passage formed by a cooling box, an oil inlet pipe, a cavity inside the heat collecting plate, and an oil outlet pipe, and the heat dissipation principle is through a circulating closed passage.
  • the flow of cooling oil brings the heat generated by the central processing unit in contact with the heat collecting plate to the cooling box outside the outer casing of the switch, and dissipates heat through heat exchange between the cooling box and the external environment.
  • the first cooling channel that is, the cooling fan must be turned on
  • the opening of the second cooling channel mainly depends on the temperature inside the switch
  • the cooling system is designed with a temperature sensor inside the switch. Collecting the temperature information inside the switch, controlling the opening of the heat dissipation channel through the central processor, and the opening of the heat dissipation channel mainly depends on whether the pump on the oil inlet pipe is turned on, so the control of the central processing unit is mainly when the temperature reaches the set threshold. Turn on the pump switch and turn off the pump switch when the temperature is below the set threshold.
  • the second heat dissipation channel is added to accelerate heat dissipation and lower the internal temperature to prevent the chip from being burnt.
  • the second heat dissipation channel can also be used as a backup device for the heat dissipation fan.
  • the heat dissipation fan fails, the second heat dissipation channel is directly used for heat dissipation to prevent the chip from being burnt out. In the case of emergency use, it is not necessary to immediately stop the inspection to ensure the switch. Normal use.
  • the inventors have also found that the temperature outside the outer casing of the switch also affects the heat dissipation inside the switch to a certain extent, especially in the machine room where multiple devices are concentrated. In view of this, the inventors have specially designed the air cooler and the wind collector.
  • the external heat dissipation system is composed of a device, the cooling fan is located above the air outlet and the cooling box, and the air collecting cover of the air collecting device is located below the air outlet and the cooling box, and one end of the air outlet of the air collecting device is connected to the air collecting cover, and the other end is extendable
  • the cooling fan is started, the heat from the air outlet and the cooling box is blown into the air collecting hood, and the hot air is discharged out of the machine room through the air outlet pipe; on the other hand, the cold air blown by the air cooler can also serve as a cooling box.
  • the cooling effect can effectively reduce the ambient temperature in the equipment room and the temperature of the cooling oil in the cooling box.
  • the heat dissipation system of the present invention is provided with three sets of heat dissipation mechanisms, which cooperate with each other to have a good heat dissipation effect on the switch.
  • the inventor sets the air outlet, the mounting bracket and the mounting plate on the same side of the outer casing, on the one hand, it is convenient for the wind collecting cover to gather wind, and on the other hand, the switch is installed and the installation space of the switch is saved.
  • the collecting hood adopts a semi-tapered cylinder to facilitate collecting hot air on the one hand, and is convenient to be directly mounted on the side of the switch casing on the other hand, and the side of the outer casing of the switch as a collecting passage can also effectively reduce the manufacturing cost.
  • the mounting bracket includes a first support plate, a second support plate and at least two uprights, and the first support plate and the second support plate are fixed on a side of the outer casing where the air outlet is located and perpendicular to The side, the first support plate is located above the second support plate, the chiller is disposed on the second support plate, the upright is connected between the first support plate and the second support plate; in the vertical direction, the The air outlet is opposite to the midpoint of the column; the first support plate and the second support plate are uniformly provided with a plurality of ventilation holes, the ventilation holes having a diameter of not less than 2 cm and an axial direction of the vertical direction.
  • the structure of the mounting bracket can effectively support the cooling fan without causing excessive blocking of the cold air blown by the cooling fan.
  • the mounting plate is perpendicular to the side of the outer casing where the air outlet is located.
  • outer casing and the cooling box are made of metal, so that the heat dissipation of the outer casing and the external environment and the cooling effect of the cooling box and the external environment are better.
  • a heat dissipating metal plate is disposed at a lower portion of the side of the outer casing where the air outlet is located, and the heat dissipating metal plate is made of copper and aluminum, and the mass percentage of the copper and aluminum is 1.5 to 2:1, and the heat dissipation prepared according to the ratio is prepared.
  • the metal plate simultaneously considers the problem of heat dissipation performance and cost. The cost of copper is high but the heat dissipation is good. Therefore, the heat dissipation metal plate is prepared by incorporation of aluminum at 1.5 to 2:1.
  • the central processing unit includes:
  • a sensing signal receiving module configured to receive a temperature signal collected by the temperature sensor
  • a threshold voltage setting module for providing a reference voltage as a set threshold
  • the temperature comparison module is configured to compare the temperature signal received by the sensing signal receiving module with a threshold set by the threshold voltage setting module, and output a high level signal to the control module when the temperature signal is equal to or higher than the threshold, at a low temperature Outputting a low level signal to the control module at a threshold;
  • the pump start control module is configured to turn on the control switch of the pump when receiving the high level signal of the temperature comparison module, and turn off the control switch of the pump when receiving the low level signal of the temperature comparison module.
  • the present invention has the following advantages and beneficial effects:
  • a switch heat dissipation system for a built-in firewall of the present invention provides two heat dissipation channels inside the switch, and one heat dissipation channel is composed of a heat dissipation fan and an air outlet located on the outer casing, and the inside of the switch casing is operated by the heat dissipation fan.
  • the second heat dissipation passage is a circulating closed passage formed by the cooling tank, the oil inlet pipe, the cavity inside the heat collecting plate, and the oil discharge pipe, and the flow of the cooling oil in the circulating closed passage will be combined with the heat collecting plate
  • the heat generated by the central processor in contact is brought to the cooling box outside the outer casing of the switch, and is cooled by heat exchange between the cooling box and the external environment; the two heat dissipation channels effectively dissipate heat inside the switch, and the internal temperature of the outer casing is excessively burned out. a chip within the housing;
  • a switch heat dissipation system for a built-in firewall of the present invention wherein the second heat dissipation channel starts and stops according to the internal temperature of the switch, and can save power while ensuring the heat dissipation performance of the switch;
  • the second heat dissipation channel can also be used as a backup device for the heat dissipation fan.
  • the second heat dissipation channel is directly used for heat dissipation to prevent the chip from being burned out. In the case of emergency use, there is no need to immediately stop the inspection to ensure the normal use of the switch;
  • the heat dissipation system of the switch for the built-in firewall of the present invention also designs an external heat dissipation system composed of an air cooler and a wind collecting device.
  • an air cooler When the air cooler is started, the heat generated by the air outlet and the cooling box is blown into the air collecting hood. The hot air is discharged from the engine room through the air outlet pipe, and the cooling box is cooled at the same time, thereby effectively reducing the ambient temperature in the machine room and the temperature of the cooling oil in the cooling box.
  • the heat dissipation system of the switch for the built-in firewall of the present invention has the air outlet, the mounting bracket and the mounting plate disposed on the same side of the outer casing, so as to facilitate the collecting of the wind collecting cover, and also facilitate the installation of the switch and save the installation space of the switch. .
  • the hood of the heat dissipation system of the switch for the built-in firewall of the present invention adopts a semi-tapered cylinder to facilitate collecting hot air, and is convenient to be directly mounted on the side of the switch casing, thereby effectively reducing manufacturing costs.
  • FIG. 1 is a schematic structural diagram of a heat dissipation system of a switch for a built-in firewall according to the present invention
  • FIG. 2 is a top plan view of a heat dissipation system for a switch with a built-in firewall according to the present invention
  • Embodiment 3 is a schematic block diagram of a central processing unit in Embodiment 3;
  • Figure 4 is a schematic view of the structure of the collector hood.
  • a switch heat dissipation system for a built-in firewall of the present invention includes a switch body, a first heat dissipation component, a second heat dissipation component, and a cooling box 9.
  • the switch body includes a casing 1, a main board 2 disposed in the casing 1, and a central processing unit (ie, a CPU) disposed on the main board 2.
  • a central processing unit ie, a CPU
  • Some switches in the prior art use the CPU to implement the firewall function.
  • the heat generated by such CPUs is relatively large; some switches use separate chips to implement the firewall function, and the CPU and firewall chips of such switches have relatively large heat dissipation. Regardless of whether the firewall function is implemented directly by the CPU or by using a separate processing chip, the heat dissipation system of the present application is applicable.
  • the left side of the switch housing 1 is provided with a mounting bracket, a mounting plate 17, and an air outlet 18, the mounting plate 17 is mounted perpendicular to the left side of the outer casing 1, and the cooling box 9 is fixed on the mounting plate 17; And the air outlet 18 are located above the cooling box 9.
  • the cooling box 9 and the outer casing 1 are made of iron.
  • the aluminum can be made of other metals such as aluminum or copper. The metal has good heat dissipation performance and can enhance heat exchange between the inside and the outside of the switch.
  • the top of the cooling box 9 is provided with an oil inlet, and the oil inlet is provided with a sealing plug 10, so that the cooling tank 9 can replenish the cooling oil through the oil inlet.
  • the first heat dissipating component is disposed inside the outer casing 1, and the second heat dissipating component is disposed outside the outer casing 1.
  • the first heat dissipation assembly includes a heat collecting plate 3, an oil inlet pipe 5, an oil delivery pipe 4, a heat dissipation fan 6, a pump 16, and a temperature sensor 15.
  • the heat dissipation fan 6 is facing the air outlet 18.
  • the heat collecting plate 3 is internally provided with a cavity (not shown), and both the oil inlet pipe 5 and the oil outlet pipe 4 extend from the outer casing 1 to communicate with the cooling box 9, and the other end communicates with the cavity inside the heat collecting plate 3;
  • the cavity in the heat collecting plate 3 and the cooling box 9 are filled with cooling oil, and the connection between the oil inlet pipe 5 and the oil delivery pipe 4 and the heat collecting plate 4 is sealed, so that the oil inlet pipe 5, the oil delivery pipe 4, and the set
  • the cavity inside the hot plate 4 constitutes a sealed passage to prevent leakage of the heat transfer oil;
  • the pump 16 is disposed on the oil inlet pipe 5, and when the pump 16 is started, the cooling oil in the cooling tank 9 flows into the heat collecting plate 3 through the oil
  • the heat collecting plate 3 is partially in contact with the main board 2; the switch 16 of the pump 16 and the temperature sensor 15 are connected to the central processing unit 15, and the temperature sensor 15 collects the temperature signal in the outer casing 1 and sends it to the central processing unit, the central processing unit. It is determined whether the temperature in the outer casing 1 has reached a set threshold, the switch of the pump 16 is turned on when the temperature reaches the set threshold, and the switch of the pump 16 is turned off when the temperature is lower than the set threshold.
  • the heat generated by the CPU and other chips inside the casing 1 needs to be first radiated to the inside of the casing 1, and this part of the heat needs to be transferred to the outside of the casing 1 even if it is transferred.
  • the heat dissipation system of the switch of the present invention provides two heat dissipation channels inside the switch: one heat dissipation channel is composed of a heat dissipation fan 16 and an air outlet 18 located on the outer casing 1 to provide the most basic heat dissipation, and the operation of the heat dissipation fan 6 accelerates the inside and outside of the switch.
  • the air flow carries the heat inside the switch casing 1 out of the casing 1;
  • the second heat dissipation passage is a circulating closed passage formed by the cooling tank 9, the oil inlet pipe 5, the cavity inside the heat collecting plate 3, and the oil discharge pipe 4,
  • the heat dissipation principle is to bring the heat generated by the central processing unit on the main board 2 in contact with the heat collecting plate 3 to the cooling box 9 outside the switch housing 1 through the flow of the cooling oil in the circulating closed passage, and through the cooling box 9 and the outside.
  • the heat exchange of the environment is to dissipate heat.
  • the first cooling channel that is, the cooling fan 6 must be turned on
  • the opening of the second cooling channel mainly depends on the temperature inside the switch
  • the cooling system is designed with temperature inside the switch.
  • the sensor 15 collects the temperature information inside the switch, and controls the opening of the heat dissipation channel through the central processor, and the opening of the heat dissipation channel mainly depends on whether the pump 16 is turned on the oil inlet pipe 5, so the control of the central processor is mainly at the temperature
  • the switch of the pump 16 is turned on when the threshold is set, and the switch of the pump 16 is turned off when the temperature is below the set threshold.
  • the internal temperature of the switch when the internal temperature of the switch is not high, only turning on the cooling fan 6 can not only ensure the heat dissipation inside the switch, but also save the power consumed by the operation of the pump 16.
  • the internal CPU of the switch runs at a high speed and generates more heat.
  • the second heat dissipation channel is added to accelerate heat dissipation, lower the internal temperature, and prevent the chip from being burnt.
  • the second heat dissipation channel can also serve as a backup device for the heat dissipation wind, 6.
  • the second heat dissipation channel is directly used for heat dissipation to prevent the chip from being burned out, and in the case of emergency use, it is not necessary to immediately stop the inspection. To ensure the normal use of the switch.
  • the second heat dissipating assembly includes a cooling fan 14 fixed on the mounting frame, and a wind collecting device 8 disposed at a lower portion of the left side surface of the outer casing 1.
  • the air collecting device 8 includes a wind collecting cover 81 and is connected to a lower end of the wind collecting cover 81.
  • the air outlet duct 82 is a semi-tapered cylinder, and the diameter of the semi-conical cylinder is gradually reduced from top to bottom; the left and right sides of the semi-conical cylinder and the outer casing of the air outlet 18 are located 1 side connected to form an air flow path. As shown in FIG.
  • the aforementioned semi-tapered cylinder refers to one half of the cone, and a cone is divided into two according to a plane in which the central axis is located, and is inevitably divided into exactly the same.
  • the collecting hood 81 adopts a semi-tapered cylinder to facilitate collecting hot air on the one hand, and is convenient to be directly mounted on the side of the switch casing 1 on the other hand, and one side of the outer casing 1 of the switch can be effectively reduced as a collecting passage. manufacturing cost.
  • the inventor has also found that the temperature outside the outer casing of the switch also affects the heat dissipation inside the switch to a certain extent, especially in a machine room where a plurality of devices are concentrated. In view of this, the inventor has specially designed the air cooler 14 and the wind collector. An external heat dissipation system is formed by the device 8.
  • the air cooler 14 is located above the air outlet 18 and the cooling box 9, and the air collecting cover 81 of the air collecting device is located below the air outlet 18 and the cooling box 9, and the air outlet tube 82 of the air collecting device is connected at one end.
  • the windshield 81 has the other end extending out of the machine room.
  • the heat dissipation system of the embodiment has three sets of heat dissipation mechanisms, which cooperate with each other to have a good heat dissipation effect on the switch.
  • the inventor arranges the air outlet 18, the mounting bracket, and the mounting plate 17 on the same side of the outer casing 1. On the one hand, it facilitates the collection of the windshield 81, and on the other hand, facilitates the installation of the switch and saves the installation space of the switch.
  • the pump 16, the air cooler 14, and the heat dissipation fan 6 used in this embodiment are all prior art devices.
  • the specific structure and principle are not described in detail in this embodiment, and the switch of the air cooler 14 can be manually controlled by an operator.
  • the heat collecting plate 3 in this embodiment can be made of graphene, and has good thermal conductivity, and can quickly transfer the temperature on the main board 2 when it is in contact with the main board 2.
  • the contact manner between the main board 2 and the heat collecting plate 3 is not limited, as long as it can be contacted, the larger the contact area, the better.
  • the mounting bracket includes a first support plate 11, a second support plate 13, and at least two uprights 12, and the first support plate 11 and the second support plate 13 are fixed on the side of the outer casing 1 where the air outlet 18 is located and perpendicular to
  • the first support plate 11 is located above the second support plate 13
  • the chiller 14 is disposed on the second support plate 13
  • the vertical column 12 is connected between the first support plate 11 and the second support plate 13 ;
  • the air outlet 18 is opposite to the midpoint of the column 12
  • the second support plate 13 and the first support plate 11 are uniformly provided with a plurality of ventilation holes, and the axial direction of the ventilation holes is vertical Direction, and the diameter of the vent is 2cm.
  • This structure of the mounting bracket can effectively support the air cooler 14 without causing excessive blocking of the cold air blown by the air cooler 14.
  • the air outlet 18 directly opposite the center of the column 12 can also prevent the first support plate 11 or the second support plate 13 from blocking the air outlet 18.
  • Embodiment 1 also improves on the basis of Embodiment 1 as follows:
  • a heat dissipating metal plate 7 is disposed on a lower portion of the left side of the outer casing 1.
  • the heat dissipating metal plate 7 is made of copper and aluminum, and the mass percentage of the copper and aluminum is 1.5 to 2:1.
  • the cost of copper is high but the heat dissipation is good, the relative cost of aluminum is relatively low, but the heat dissipation performance is lower than that of copper.
  • the heat dissipation metal plate prepared according to this ratio not only considers the heat dissipation performance and cost, but also the inventors have found
  • the heat dissipation performance of the heat-dissipating metal plate prepared by incorporating aluminum into the copper ratio is much higher than other ratios, and the heat dissipation effect is 1.4 times or more of the heat dissipation effect of the heat-dissipating metal plate prepared by other ratios.
  • the central processing unit includes:
  • a sensing signal receiving module configured to receive a temperature signal collected by the temperature sensor 15;
  • a threshold voltage setting module for providing a certain reference voltage as a set threshold
  • the temperature comparison module is configured to compare the temperature signal received by the sensing signal receiving module with a threshold set by the threshold voltage setting module, and output a high level signal to the control module when the temperature signal is equal to or higher than the threshold, at a low temperature Outputting a low level signal to the control module at a threshold;
  • the pump start control module is configured to turn on the control switch of the pump 16 when receiving the high level signal of the temperature comparison module, and turn off the control switch of the pump 16 when receiving the low level signal of the temperature comparison module.
  • the sensing signal receiving module when the temperature sensor outputs an analog signal, the sensing signal receiving module includes an AD converter; when the temperature sensor outputs a digital signal, the sensing signal receiving module does not have to use an AD converter, and is only a digital signal interface;
  • the temperature sensor may be an analog temperature sensor or a digital temperature sensor, which is different from the temperature sensor on the CPU in the prior art, and the temperature sensor is mainly used to read the temperature of the air inside the casing 1 instead of the chip temperature.
  • the position of the temperature sensor can be set at any position within the housing 1 that does not affect the operation of other modules.
  • the threshold voltage setting module can employ a voltage dividing circuit.
  • the pump start control module can be implemented using a comparison circuit.
  • the pump start control module can be, but is not limited to, a switch circuit.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
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Abstract

一种用于内置防火墙的交换机散热系统包括交换机本体，交换机本体包括外壳（1）、设置在外壳（1）内的主板（2）和设置在主板（2）上的中央处理器，还包括设置在外壳（1）内部的第一散热组件、设置在外壳外部的第二散热组件和冷却箱（9）。第一散热组件包括集热板（3）、进油管（5）、出油管（4）、散热风机（6）、泵（16）和温度传感器（15）；集热板（3）内部设置有空腔，进油管（5）和出油管（4）均一端与冷却箱（9）连通，另一端与集热板（3）内部的空腔连通，泵（16）设置在进油管（5）上，集热板（3）部分与主板（2）相接触；中央处理器根据温度传感器（15）采集的温度信号控制泵（16）；外壳（1）侧面还设置有安装架，第二散热组件包括固定在安装架上的冷风机（14）、设置在外壳（1）下部的集风装置（8）。该散热系统设置了3套散热机构，相互配合，对交换机的散热效果好。

Description

一种用于内置防火墙的交换机散热系统 技术领域
本发明涉及散热系统，具体涉及一种用于内置防火墙的交换机散热系统。
背景技术
交换机是一种在通信系统中完成信息交换功能的设备，在各运营商的网络部署中得到广泛的应用。
网络病毒和攻击迫使防火墙成为企业网络的必需设备，普通防火墙一般作为企业网络的出口，过滤病毒，防范攻击以及执行加密、解密等功能，保护企业信息安全。
防火墙的引入增加了企业信息安全，但是增加了网络结构层次和维护复杂性，同时也降低了企业网络出口带宽，还增加了不少网络投资。
现有技术中已有带防火墙及路由功能的交换机，将防火墙置于内部作为机架交换机的一个业务模块，将路由交换功能和防火墙功能集成到一台设备中，可以简化网络结构，减少网络设备，降低网络投资，这种内置防火墙的交换机的优点在于由于没有了防火墙和内部网络的连接线路，减少了网络可能的关键故障点，增强了网络的稳定性；但是其缺点也比较明显，由于增加了防火墙功能后，交换机的数据处理量较大，处理芯片产生的热量较大，而交换机的散热效果往往有限、散热性能不佳，容易烧坏芯片。
发明内容
本发明的目的在于提供一种用于内置防火墙的交换机散热系统，其通过对交换机散热结构的改进，改善交换机的散热性能，解决内置防火墙的交换机的散热效果有限的问题。
本发明通过下述技术方案实现：
一种用于内置防火墙的交换机散热系统，包括交换机本体，所述交换机本体包括外壳、设置在外壳内的主板和设置在主板上的中央处理器；还包括设置在外壳内部的第一散热组件、设置在外壳外部的第二散热组件和冷却箱；所述第一散热组件包括集热板、进油管、出油管、散热风机、泵和温度传感器；所述集热板内部设置有空腔，进油管和出油管均一端伸出外壳与冷却箱连通，另一端与集热板内部的空腔连通；所述集热板内的空腔和冷却箱内均填充有冷却油；所述泵设置在进油管上，在泵启动时，冷却箱中的冷却油经进油管流入集热板内部的空腔再通过出油管流回冷却箱；所述集热板至少部分与主板相接触；所述泵的开关、温度传感器均与中央处理器相连，温度传感器采集外壳内的温度信号并发送给中央处理器，中央处理器判断外壳内的温度是否达到设定的阈值，在温度达到设定的阈值时打开泵的开关，并在温度低于设定的阈值时关闭泵的开关；所述外壳上开设有出风口，所述散热风机正对该出 风口；所述外壳侧面还设置有安装板和安装架，所述冷却箱固定在安装板上；所述安装架、安装板、出风口位于外壳的同一侧面上，且安装架和出风口均位于冷却箱上方；所述第二散热组件包括固定在安装架上的冷风机、设置在出风口所在的外壳侧面下部的集风装置；所述集风装置包括集风罩和连接在集风罩下端的出风管；所述集风罩为一个半锥形筒，半锥形筒的直径自上而下逐渐减小；所述半锥形筒的左右两侧与出风口所在的外壳侧面连接，从而构成一个空气流道。
上述技术方案中，中央处理器(也即CPU)作为交换机内部的核心控制芯片，其本身产生的热量都比较大，如果还兼具防火墙功能对数据进行处理，其功能越强大，越容易在运行中产生更多的热量。当然，无论防火墙功能直接通过CPU实现或者是另外采用单独的处理芯片，CPU的散热都需要特别关注，而且本申请的散热系统都适用。
CPU和机壳内部的其他芯片产生的热量都需要首先散发到机壳内部，这部分热量需要即使被转移到机壳外部。本发明的交换机散热系统在交换机内部提供了2个散热通道：一个散热通道由散热风机和位于外壳上的出风口构成，提供最基础散热的散热方式，通过散热风机的运转，加快交换机内外的空气流动，将交换机外壳内部的热量带出外壳；第二个散热通道是由冷却箱、进油管、集热板内部的空腔和出油管构成的循环密闭通路，其散热原理是通过循环密闭通路内的冷却油的流动将与集热板接触的中央处理器产生的热量带到交换机外壳外的冷却箱中，并通过冷却箱与外部环境的热交换进行散热。本方案中，为了节省运营成本以及节能减排，第一个散热通道即散热风机必须开启，而第二个散热通道的开启主要取决于交换机内部的温度，因此散热系统在交换机内部设计了温度传感器采集交换机内部的温度信息，通过中央处理器进行控制散热通道的开启，而散热通道的开启的主要在于是否被开启进油管上的泵，因此中央处理器的控制主要为在温度达到设定的阈值时打开泵的开关，并在温度低于设定的阈值时关闭泵的开关。这样，在交换机内部温度不高的时候，只开启散热风扇既能保证交换机内部的散热，又能节省泵运行所耗的电量，而在交换机内部CPU等芯片高速运转、产生的热量较多导致外壳内部温度较高时第二散热通道加入，加速散热，降低内部温度防止烧坏芯片。此外，第二散热通道还可以作为散热风机的备用设备，当散热风机发生故障时，直接使用第二散热通道进行散热，防止烧坏芯片，在紧急使用的情况下，不用立即停机检查以保障交换机的正常使用。
此外，发明人还发现，交换机外壳外的温度也在一定程度上影响着交换机内部的散热，尤其是在多个设备集中的机房中，鉴于此，发明人还特别设计了由冷风机和集风装置构成的外部散热系统，冷风机位于出风口和冷却箱上方，而集风装置的集风罩位于出风口和冷却箱下方，集风装置的出风管一端连接集风罩，另一端可伸出机房，冷风机启动时一方面将出风 口和冷却箱散发出的热量吹入集风罩，通过出风管将热空气排出机房；另一方面冷风机吹出的冷风还可以起到对冷却箱的冷却作用，可以有效降低机房内的环境温度和冷却箱内的冷却油温度。
总的来说，本发明的散热系统设置了3套散热机构，相互配合，对交换机的散热效果好。发明人将出风口、安装架、安装板设置在外壳的同一侧面上，一方面便于集风罩集风，另一方面也便于交换机的安装、节省交换机的安装空间。集风罩采用半锥形筒一方面便于收集热空气，另一方面便于直接安装在交换机外壳的侧面，将交换机的外壳的一个侧面作为集风通道也能有效降低制造成本。
作为本发明的进一步改进，所述安装架包括第一支撑板、第二支撑板和至少2根立柱，所述第一支撑板和第二支撑板固定在出风口所在的外壳侧面上并垂直于该侧面，第一支撑板位于第二支撑板上方，所述冷风机设置在第二支撑板上，所述立柱连接在第一支撑板和第二支撑板之间；在垂直方向上，所述出风口正对立柱的中点；所述第一支撑板和第二支撑板上均匀开设有多个通风孔，所述通风孔的直径不小于2cm且其轴向为竖直方向。本技术方案中，安装架的这种结构既能够有效支撑冷风机，又不至于对冷风机吹出的冷风造成过大的阻挡。
进一步，所述安装板垂直于出风口所在的外壳侧面。
进一步，所述外壳和冷却箱采用金属制成，使得外壳与外界环境的散热以及冷却箱与外界环境的散热效果更好。
进一步，所述出风口所在的外壳侧面下部设置有一个散热金属板，该散热金属板采用铜和铝制成，所述铜和铝的质量百分比为1.5～2:1，按此比例制备的散热金属板同时考虑了散热性能和成本的问题，铜的成本较高但是散热性好优良，因此按1.5～2:1掺入铝制备了该散热金属板。
进一步，所述中央处理器包括：
传感信号接收模块，用于接收温度传感器采集的温度信号；
阈值电压设定模块，用于提供参考电压作为设定的阈值；
温度比较模块，用于将传感信号接收模块接收的温度信号与阈值电压设定模块设定的阈值进行比较，在温度信号等于或高于阈值时向控制模块输出高电平信号，在温度低于阈值时向控制模块输出低电平信号；
泵启动控制模块，用于在收到温度比较模块的高电平信号时开启泵的控制开关，以及在收到温度比较模块的低电平信号时关闭泵的控制开关。
本发明与现有技术相比，具有如下的优点和有益效果：
1、本发明的一种用于内置防火墙的交换机散热系统在交换机内部提供了2个散热通道, 一个散热通道由散热风机和位于外壳上的出风口构成，通过散热风机的运转，将交换机外壳内部的热量带出外壳；第二个散热通道是由冷却箱、进油管、集热板内部的空腔和出油管构成的循环密闭通路，通过循环密闭通路内的冷却油的流动将与集热板接触的中央处理器产生的热量带到交换机外壳外的冷却箱中，并通过冷却箱与外部环境的热交换进行散热；2个散热通道对交换机内部进行有效散热，能够外壳内部温度过高烧坏外壳内的芯片；
2、本发明的一种用于内置防火墙的交换机散热系统，其第二散热通道根据交换机内部温度情况启停，在保障交换机的散热性能的情况下能够节省电能；
3、本发明的一种用于内置防火墙的交换机散热系统，其第二散热通道还可以作为散热风机的备用设备，当散热风机发生故障时，直接使用第二散热通道进行散热，防止烧坏芯片，在紧急使用的情况下，不用立即停机检查以保障交换机的正常使用；
4、本发明的一种用于内置防火墙的交换机散热系统还设计了由冷风机和集风装置构成的外部散热系统，冷风机启动时将出风口和冷却箱散发出的热量吹入集风罩，通过出风管将热空气排出机房，同时对冷却箱进行冷却作用，可以有效降低机房内的环境温度和冷却箱内的冷却油温度。
5、本发明的一种用于内置防火墙的交换机散热系统将出风口、安装架、安装板设置在外壳的同一侧面上，便于集风罩集风，也便于交换机的安装、节省交换机的安装空间。
6、本发明的一种用于内置防火墙的交换机散热系统的集风罩采用半锥形筒便于收集热空气，同时便于直接安装在交换机外壳的侧面，有效降低制造成本。
附图说明
此处所说明的附图用来提供对本发明实施例的进一步理解，构成本申请的一部分，并不构成对本发明实施例的限定。在附图中：
图1为本发明的一种用于内置防火墙的交换机散热系统的结构示意图；
图2为本发明的一种用于内置防火墙的交换机散热系统的俯视图；
图3为实施例3中的中央处理器的原理框图；
图4位集风罩的结构示意图。
附图标记及对应的零部件名称：
1-外壳，2-主板，3-集热板，4-出油管，5-进油管，6-散热风机，7-散热金属板，8-集风装置，81-集风罩，82-出风管，9-冷却箱，10-密封塞，11-第一支撑板，12-立柱，13-第二支撑板，14-冷风机，15-温度传感器，16-泵，17-安装板，18-出风口。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明白，下面结合实施例和附图，对本发明 作进一步的详细说明，本发明的示意性实施方式及其说明仅用于解释本发明，并不作为对本发明的限定。
【实施例1】
如图1和图2所示，本发明的一种用于内置防火墙的交换机散热系统，包括交换机本体、第一散热组件、第二散热组件和冷却箱9。
所述交换机本体包括外壳1、设置在外壳1内的主板2和设置在主板2上的中央处理器(即CPU)。现有技术中部分交换机将其防火墙功能采用CPU实现，这类CPU产生的热量比较大；部分交换机采用单独的芯片实现防火墙功能，这类交换机的CPU和防火墙芯片的散热量都比较大。无论防火墙功能直接通过CPU实现或者是另外采用单独的处理芯片，而且本申请的散热系统都适用。
所述交换机外壳1的左侧设置有安装架、安装板17、出风口18，所述安装板17垂直于外壳1的左侧侧面安装，所述冷却箱9固定在安装板17上；安装架和出风口18均位于冷却箱9上方。所述冷却箱9和外壳1采用铁制成，实际应用中，所述还可以采用铝或者铜等其他金属制成，金属散热性能良好，可以增强交换机内部与外部的热交换。冷却箱9顶部设置有进油口，该进油口上设置有密封塞10，因此冷却箱9可以通过进油口补充冷却油。
第一散热组件设置在外壳1内部，第二散热组件设置在外壳1外部。
所述第一散热组件包括集热板3、进油管5、出油管4、散热风机6、泵16和温度传感器15。所述散热风机6正对该出风口18。所述集热板3内部设置有空腔(图中未示)，进油管5和出油管4均一端伸出外壳1与冷却箱9连通，另一端与集热板3内部的空腔连通；所述集热板3内的空腔和冷却箱9内均填充有冷却油，且进油管5和出油管4与集热板4的连接为密封连接，使得进油管5、出油管4、集热板4内部的空腔构成一个密封通路，防止导热油泄露；所述泵16设置在进油管5上，在泵16启动时，冷却箱9中的冷却油经进油管5流入集热板3内部的空腔再通过出油管4流回冷却箱9。
所述集热板3部分与主板2相接触；所述泵16的开关、温度传感器15均与中央处理器相连，温度传感器15采集外壳1内的温度信号并发送给中央处理器，中央处理器判断外壳1内的温度是否达到设定的阈值，在温度达到设定的阈值时打开泵16的开关，并在温度低于设定的阈值时关闭泵16的开关。
CPU和机壳1内部的其他芯片产生的热量都需要首先散发到机壳1内部，这部分热量需要即使被转移到机壳1外部。本发明的交换机散热系统在交换机内部提供了2个散热通道：一个散热通道由散热风机16和位于外壳1上的出风口18构成，提供最基础的散热，通过散热风机6的运转，加快交换机内外的空气流动，将交换机外壳1内部的热量带出外壳1；第 二个散热通道是由冷却箱9、进油管5、集热板3内部的空腔和出油管4构成的循环密闭通路，其散热原理是通过循环密闭通路内的冷却油的流动将与集热板3接触的主板2上的中央处理器产生的热量带到交换机外壳1外的冷却箱9中，并通过冷却箱9与外部环境的热交换进行散热。本方案中，为了节省运营成本以及节能减排，第一个散热通道即散热风机6必须开启，而第二个散热通道的开启主要取决于交换机内部的温度，因此散热系统在交换机内部设计了温度传感器15采集交换机内部的温度信息，通过中央处理器进行控制散热通道的开启，而散热通道的开启的主要在于是否被开启进油管5上的泵16，因此中央处理器的控制主要为在温度达到设定的阈值时打开泵16的开关，并在温度低于设定的阈值时关闭泵16的开关。这样，在交换机内部温度不高的时候，只开启散热风扇6既能保证交换机内部的散热，又能节省泵16运行所耗的电量，而在交换机内部CPU等芯片高速运转、产生的热量较多导致外壳1内部温度较高时第二散热通道加入，加速散热，降低内部温度，防止烧坏芯片。此外，第二散热通道还可以作为散热风,6的备用设备，当散热风机6发生故障时，直接使用第二散热通道进行散热，防止烧坏芯片，在紧急使用的情况下，不用立即停机检查以保障交换机的正常使用。
所述第二散热组件包括固定在安装架上的冷风机14、设置在外壳1左侧面下部的集风装置8；所述集风装置8包括集风罩81和连接在集风罩81下端的出风管82；所述集风罩81为一个半锥形筒，半锥形筒的直径自上而下逐渐减小；所述半锥形筒的左右两侧与出风口18所在的外壳1侧面连接，从而构成一个空气流道。如图4所示，前述的半锥形筒是指锥形筒的一半，将一个锥形筒沿着其中心轴所在的一个平面对锥形筒一分为二，则必然分为完全相同的两个结构，这两个结构即为本申请所指的半锥形筒；半锥形筒的截面为半圆，且沿半锥形筒的轴线方向，半锥形筒的直径逐渐减小或逐渐增大。本实施例中，集风罩81采用半锥形筒一方面便于收集热空气，另一方面便于直接安装在交换机外壳1的侧面，将交换机的外壳1的一个侧面作为集风通道也能有效降低制造成本。发明人还发现，交换机外壳1外的温度也在一定程度上影响着交换机内部的散热，尤其是在多个设备集中的机房中，鉴于此，发明人还特别设计了由冷风机14和集风装置8构成的外部散热系统，冷风机14位于出风口18和冷却箱9上方，而集风装置的集风罩81位于出风口18和冷却箱9下方，集风装置的出风管82一端连接集风罩81，另一端可伸出机房，冷风机启动时一方面将出风口18和冷却箱9散发出的热量吹入集风罩81，通过出风管82将热空气排出机房；另一方面冷风机14吹出的冷风还可以起到对冷却箱9的冷却作用，可以有效降低机房内的环境温度和冷却箱9内的冷却油温度。
总的来说，本实施例的散热系统设置了3套散热机构，相互配合，对交换机的散热效果 好。发明人将出风口18、安装架、安装板17设置在外壳1的同一侧面上，一方面便于集风罩81集风，另一方面也便于交换机的安装、节省交换机的安装空间。
本实施例中使用的泵16、冷风机14、散热风扇6都是现有技术的设备，本实施例中不在详述其具体结构和原理，冷风机14的开关可由操作人员人为控制。本实施例中的集热板3可采用石墨烯制成，其导热性好，与主板2部分接触也能迅速转移主板2上的温度。主板2与集热板3的接触方式不限，只要可以接触即可，接触面积越大越好。
所述安装架包括第一支撑板11、第二支撑板13和至少2根立柱12，所述第一支撑板11和第二支撑板13固定在出风口18所在的外壳1侧面上并垂直于该侧面，第一支撑板11位于第二支撑板13上方，所述冷风机14设置在第二支撑板13上，所述立柱12连接在第一支撑板11和第二支撑板13之间；在垂直方向上，所述出风口18正对立柱12的中点；所述第二支撑板13和第一支撑板11上均匀开设有多个通风孔，所述通风孔的轴向为竖直方向，且通风孔的直径为2cm。安装架的这种结构既能够有效支撑冷风机14，又不至于对冷风机14吹出的冷风造成过大的阻挡。出风口18正对立柱12的中点也能防止第一支撑板11或第二支撑板13对出风口18进行遮挡。
【实施例2】
本实施例在实施例1的基础上还进行了如下改进：
所述外壳1左侧面下部设置有一个散热金属板7，该散热金属板7采用铜和铝制成，所述铜和铝的质量百分比为1.5～2:1。铜的成本较高但是散热性好优良，铝相对成本较低，但是散热性能低于铜，按此比例制备的散热金属板不仅同时考虑了散热性能和成本的问题，此外，发明人还发现上上述比例在铜中掺入铝制备的散热金属板的散热性能远远高于其他比例，其散热效果是其他比例制备的散热金属板的散热效果的1.4倍以上。
【实施例3】
本实施例在实施例1或实施例2的基础上还对中央处理器进行如下改进：
如图3所示，所述中央处理器包括：
传感信号接收模块，用于接收温度传感器15采集的温度信号；
阈值电压设定模块，用于提供一定的参考电压作为设定的阈值；
温度比较模块，用于将传感信号接收模块接收的温度信号与阈值电压设定模块设定的阈值进行比较，在温度信号等于或高于阈值时向控制模块输出高电平信号，在温度低于阈值时向控制模块输出低电平信号；
泵启动控制模块，用于在收到温度比较模块的高电平信号时开启泵16的控制开关，以及在收到温度比较模块的低电平信号时关闭泵16的控制开关。
本实施例中，当温度传感器输出模拟信号时，传感信号接收模块包括AD转换器；当温度传感器输出数字信号时，传感信号接收模块不必采用AD转换器，仅仅为一个数字信号接口；因此温度传感器可以采用模拟温度传感器也可以采用数字温度传感器，该温度传感器不同于现有技术中的CPU上的温度传感器，该温度传感器主要用于读出外壳1内的空气的温度而不是芯片温度，温度传感器的位置可以设置在外壳1内任意一个不影响其他模块工作的位置。阈值电压设定模块可以采用分压电路。泵启动控制模块可采用比较电路实现。泵启动控制模块可以但不限于采用开关电路。
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 一种用于内置防火墙的交换机散热系统，包括交换机本体和第一散热组件；所述交换机本体包括外壳(1)、设置在外壳(1)内的主板(2)和设置在主板(2)上的中央处理器；所述第一散热组件包括设置在外壳(1)内部的散热风机(6)；所述外壳(1)上开设有出风口(18)，所述散热风机(6)正对该出风口(18)；其特征在于，所述交换机散热系统还包括设置在外壳(1)外部的第二散热组件和冷却箱(9)；
    所述第一散热组件还包括设置在外壳(1)内部的集热板(3)、进油管(5)、出油管(4)、泵(16)和温度传感器(15)；所述集热板(3)内部设置有空腔，进油管(5)和出油管(4)均一端伸出外壳(1)与冷却箱(9)连通，另一端与集热板(3)内部的空腔连通；所述集热板(3)内的空腔和冷却箱(9)内均填充有冷却油；所述泵(16)设置在进油管(5)上，在泵(16)启动时，冷却箱(9)中的冷却油经进油管(5)流入集热板(3)内部的空腔再通过出油管(4)流回冷却箱(9)；所述集热板(3)至少部分与主板(2)相接触；
    所述泵(16)的开关、温度传感器(15)均与中央处理器相连，温度传感器(15)采集外壳(1)内的温度信号并发送给中央处理器，中央处理器判断外壳(1)内的温度是否达到设定的阈值，在温度达到设定的阈值时打开泵(16)的开关，并在温度低于设定的阈值时关闭泵(16)的开关；
    所述外壳(1)侧面还设置有安装板(17)和安装架，所述冷却箱(9)固定在安装板(17)上；所述安装架、安装板(17)、出风口(18)位于外壳(1)的同一侧面上，且安装架和出风口(18)均位于冷却箱(9)上方；
    所述第二散热组件包括固定在安装架上的冷风机(14)、设置在出风口(18)所在的外壳(1)侧面下部的集风装置(8)；所述集风装置(8)包括集风罩(81)和连接在集风罩(81)下端的出风管(82)；所述集风罩(81)为一个半锥形筒，半锥形筒的直径自上而下逐渐减小；所述半锥形筒的左右两侧与出风口(18)所在的外壳(1)侧面连接，从而构成一个空气流道。
  2. 根据权利要求1所述的一种用于内置防火墙的交换机散热系统，其特征在于，所述安装架包括第一支撑板(11)、第二支撑板(13)和至少2根立柱(12)，所述第一支撑板(11)和第二支撑板(13)固定在出风口(18)所在的外壳(1)侧面上并垂直于该侧面，第一支撑板(11)位于第二支撑板(13)上方，所述冷风机(14)设置在第二支撑板(13)上，所述立柱(12)连接在第一支撑板(11)和第二支撑板(13)之间；在垂直方向上，所述出风口(18)正对立柱(12)的中点；所述第一支撑板(11)和第二支撑板(13)上均匀开设有多个通风孔，所述通风孔的轴向为竖直方向。
  3. 根据权利要求2所述的一种用于内置防火墙的交换机散热系统，其特征在于，所述通风孔的直径不小于2cm。
  4. 根据权利要求2所述的一种用于内置防火墙的交换机散热系统，其特征在于，所述安装板(17)垂直于出风口(18)所在的外壳(1)侧面。
  5. 根据权利要求1所述的一种用于内置防火墙的交换机散热系统，其特征在于，所述外壳(1)和冷却箱(9)均采用金属制成。
  6. 根据权利要求5所述的一种用于内置防火墙的交换机散热系统，其特征在于，所述出风口(18)所在的外壳(1)侧面下部设置有一个散热金属板(7)，该散热金属板(7)采用铜和铝制成，所述铜和铝的质量百分比为1.5～2:1。
  7. 根据权利要求1所述的一种用于内置防火墙的交换机散热系统，其特征在于，所述中央处理器包括：
    传感信号接收模块，用于接收温度传感器(15)采集的温度信号；
    阈值电压设定模块，用于提供参考电压作为设定的阈值；
    温度比较模块，用于将传感信号接收模块接收的温度信号与阈值电压设定模块设定的阈值进行比较，在温度信号等于或高于阈值时向控制模块输出高电平信号，在温度低于阈值时向控制模块输出低电平信号；
    泵启动控制模块，用于在收到温度比较模块的高电平信号时开启泵(16)的控制开关，以及在收到温度比较模块的低电平信号时关闭泵(16)的控制开关。
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