WO2019147100A1 - Test socket - Google Patents

Test socket Download PDF

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Publication number
WO2019147100A1
WO2019147100A1 PCT/KR2019/001212 KR2019001212W WO2019147100A1 WO 2019147100 A1 WO2019147100 A1 WO 2019147100A1 KR 2019001212 W KR2019001212 W KR 2019001212W WO 2019147100 A1 WO2019147100 A1 WO 2019147100A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
packer
cover
space
air
Prior art date
Application number
PCT/KR2019/001212
Other languages
French (fr)
Korean (ko)
Inventor
정영배
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Publication of WO2019147100A1 publication Critical patent/WO2019147100A1/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0458Details related to environmental aspects, e.g. temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages

Definitions

  • the present invention relates to a test socket, and more particularly, to a test socket capable of quickly adjusting a temperature of a test space during an electrical test performed in a high temperature or low temperature environment.
  • a semiconductor integrated circuit device for example, a plurality of integrated circuits are formed on a wafer made of silicon, and then each of these integrated circuits is checked for fundamental electric characteristics, A probe test is performed. Subsequently, the semiconductor chip is formed by cutting the wafer, and the semiconductor chip is housed in an appropriate package. Electrical inspection is performed to select semiconductor houses with potential defects by inspecting electrical characteristics of each packaged semiconductor integrated circuit device under a high temperature or low temperature environment.
  • devices to be inspected such as a semiconductor chip requiring inspection are not directly contacted with the inspection device but indirectly through the inspection connector including the inspection socket.
  • the device to be inspected is placed on the upper surface of the connector for inspection, and then the upper surface of the device to be inspected is pressed by the pusher device, thereby making sure contact with the connector for inspection.
  • Such a conventional inspection socket has the following problems.
  • the pressing surface of the pusher device is heated or cooled by air at a high or low temperature
  • the pressing surface conveys heat to the device to be inspected, thereby forming a high temperature or low temperature environment. In this process, Or it takes a long time to create a low-temperature environment.
  • the pusher apparatus is provided with the thermal control means, which causes a problem that the entire pusher apparatus becomes complicated.
  • the present invention has been made in order to solve the above-described problems, and more particularly, it is an object of the present invention to provide an air conditioner having a predetermined temperature, And to provide a socket for inspection which enables the socket to be manufactured.
  • the temperature of the accommodation space needs to be adjusted by air or a coolant having a predetermined temperature, the space in which the device to be inspected is sealed is reliably sealed, and there is no heat loss, And it is an object of the present invention to provide a test socket capable of making a test socket.
  • Another object of the present invention is to provide an inspection socket which can reliably prevent heat loss inside the housing by insulating the space between the housing space and the outside by vacuum.
  • a socket for inspection comprising: a housing having a housing space in which an inspected device requiring electrical inspection can be received;
  • a cover capable of opening and closing an open top of the housing
  • a pusher device which is provided on the cover and presses the device under test placed on the housing downward;
  • Temperature adjusting means for adjusting the temperature in the accommodating space by injecting air or a coolant at a predetermined temperature into the accommodating space;
  • sealing means for sealing the accommodation space from the outside when the cover closes the housing
  • the sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And a vacuum means for bringing the vacuum between the first packer and the second packer.
  • the first packer can be hermetically contacted with the lower surface of the cover while being seated on the upper surface of the housing.
  • the second packer can be hermetically contacted to the cover in a state of being seated on the upper surface of the housing.
  • the vacuum means may discharge the air between the first packer and the second packer to the outside.
  • a sealing space disposed between the first packer and the second packer
  • connection hole passing through the housing to communicate with the outside of the sealing space
  • suction means for sucking air between the first packer and the second packer through the connection hole.
  • the sealing space may be formed by recessing the upper surface of the housing while surrounding the first packer.
  • the vacuum means can uniformly adhere the lower surface of the cover to the upper surface of the housing.
  • the temperature regulating means may include a first air injecting portion for supplying high temperature air into the accommodating space and a second air injecting portion for supplying low temperature air or refrigerant into the accommodating space.
  • the temperature adjusting means may be installed on a side surface of the housing.
  • the cover is hingedly connected to the housing, and can be automatically opened and closed by the transmission means.
  • the cover may be hingedly connected to the housing and manually opened and closed.
  • a socket for inspection comprising: a housing having a housing space in which an inspected device requiring electrical inspection can be received;
  • a cover capable of opening and closing an open top of the housing
  • Temperature adjusting means for adjusting the temperature in the accommodating space by injecting air or a coolant at a predetermined temperature into the accommodating space;
  • sealing means for sealing the accommodation space from the outside when the cover closes the housing
  • the sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And vacuum means for discharging the air between the first packer and the second packer to the outside to insulate the accommodation space of the housing from the outside.
  • the inspection socket may include a pusher device provided on the cover and capable of pushing down the device to be inspected disposed in the accommodation space while being viewed from the lower surface of the cover.
  • the vacuum means can bring the cover into close contact with the housing without clearance.
  • a socket for inspection comprising: a housing having a housing space in which an inspected device requiring electrical inspection can be received;
  • a cover capable of opening and closing an open top of the housing
  • a pusher device which is provided on the cover and presses the device under test placed on the housing downward;
  • sealing means for sealing the accommodation space from the outside when the cover closes the housing
  • the sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And a vacuum means for bringing the vacuum between the first packer and the second packer.
  • the inspection socket according to the present invention provides an advantage that the inspection environment can be quickly made to a desired temperature condition by providing the air or the refrigerant having a predetermined temperature in the accommodation space of the inspection device.
  • the accommodation space is surely sealed with the outside by the sealing member, so that there is no heat loss and the desired temperature condition can be made quickly.
  • the vacuum means for discharging the air between the first packer and the second packer to the outside to maintain the vacuum state since the vacuum means for discharging the air between the first packer and the second packer to the outside to maintain the vacuum state is provided, heat loss of the housing can be reliably prevented.
  • FIG. 1 is an exploded perspective view of a test socket of the present invention.
  • Fig. 2 is a perspective view of the coupling of Fig. 1; Fig.
  • Figure 3 is a plan view of Figure 2;
  • Figure 4 is a side view of Figure 2;
  • Fig. 5 is a front view of Fig. 2
  • FIG. 6 is a sectional view taken along the line VI-VI of Fig. 3;
  • FIG. 7 is a cross-sectional view taken along line VII-VII of FIG. 3;
  • FIG. 8 is a view showing a state in which the cover is opened in the inspection socket of Fig. 2;
  • Figs. 9 to 11 are views showing the sealing structure in detail in the inspection socket of Fig. 8; Fig.
  • FIG. 12 is a sectional view showing an inspection state of the device to be inspected in the inspection socket of FIG. 2;
  • test socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
  • the inspection socket 10 is characterized in that the terminal of the device under test 81 is electrically connected to the pad of the inspection device (not shown) in order to conduct the electrical inspection of the device under test 81 such as a semiconductor chip .
  • an inspection apparatus to which a predetermined inspection signal is applied is disposed under the inspection socket 10, and an inspection signal applied from the inspection apparatus is transmitted to the inspection target device 10 mounted on the inspection socket 10 81 to perform a predetermined electrical inspection of the inspected device 81.
  • the inspection socket 10 includes a housing 20, a cover 30, a pusher device 40, a temperature regulating means 50, an air discharging portion 60 and a sealing means 70.
  • the housing 20 includes a body portion 21, a hinge means 22, and a locker 23.
  • the body part 21 is provided with a receiving space 20a in which the device under test 81 can be received, and the upper part is opened.
  • the body portion 21 of the housing 20 has a rectangular frame shape, and at the center thereof, a receiving space 20a in which the device under test 81 can be received is provided.
  • a first receiving groove 211 is formed on an upper surface of the body portion 21 of the housing 20 so as to surround the receiving space 20a and a first packer 71 is installed.
  • a second receiving groove 212 spaced apart from the first receiving groove 211 and provided with a second packer 72 is provided outside the first receiving groove 211.
  • a sealing space 731 is provided between the first receiving groove 211 and the second receiving groove 212.
  • the sealing space 731 is formed by recessing the upper surface of the body portion 21 of the housing 20 while enclosing the first packer 71.
  • the sealing space 731 is connected to a connection hole 732 passing through the housing 20 so as to communicate with an external suction means (not shown).
  • a first through hole 213 communicating with the accommodating space 20a is provided on the side surface of the body portion 21 of the housing 20 so that high temperature and low temperature air or refrigerant can be supplied from the outside,
  • a second through hole 214 is formed at a position adjacent to the one through hole 213 to allow air or refrigerant in the accommodating space 20a to be discharged to the outside.
  • the hinge means 22 comprises a hinge body 221 having a hinge pin 222 penetrating in the longitudinal direction and a hinge pin 222 coupled to the hinge body 221.
  • the cover 30 is coupled to both ends of the hinge pin 222 to enable the cover 30 to be opened and closed.
  • the locker 23 is installed at one side of the body 21 and functions to fix the closing position of the cover 30 when the cover 30 is placed in the closed position. Specifically, the locker 23 is configured to be hooked on the upper surface of the cover 30 so as to fix the cover 30 so that the cover 30 does not hinge from the closed position to the open position.
  • Such a locker 23 is a conventional fixing means and its detailed description is omitted.
  • the cover 30 is configured to open and close an opened upper portion of the housing 20 and constitutes a receiving space 20a in cooperation with the housing 20. [ That is, when the cover 30 closes the housing 20, the internal space of the cover 30 becomes the accommodating space 20a.
  • the cover 30 is coupled with the hinge pin 222 and is rotatable. When the inspected device 81 is inserted into or withdrawn from the accommodation space 20a, the cover 30 is opened and the accommodation space 20a of the housing 20 is opened. And closes the accommodating space 20a after the inspected device 81 is placed in the accommodating space 20a for inspection.
  • the cover 30 includes a door base 31 to which the hinge pin 222 is pivotally coupled and an upper base 32 which is fixedly installed on the lower side of the door base 31 and is capable of closing the upper surface of the housing 20 ).
  • the door base 31 is provided at its center with a first through hole 311 through which the pusher device 40 passes and at a position corresponding to the first through hole 311 in the upper base 32, And a second through hole 321 through which the first electrode 40 penetrates.
  • the pusher device 40 is provided on the cover 30 and presses the device under test 81 placed on the housing 20 downward. Specifically, the pusher device 40 presses the device under test 81 toward the inspection device so that the terminal of the device under test 81 is electrically and securely connected to the pad of the inspection device.
  • the pusher device 40 includes a pusher body 41, a cylinder rod 42, and a pressure plate 43.
  • the pusher body 41 is fixedly installed on the upper surface of the cover 30 so as to raise or lower the cylinder rod 42.
  • the pusher body 41 allows the cylinder rod 42 to move linearly by pneumatic or other various known driving methods.
  • the cylinder rod 42 is moved up or down by the pusher body 41 so that the pressure plate 43 presses or releases the upper surface of the device under test 81.
  • an upper portion of the cylinder rod 42 is coupled to the pusher body 41, a lower portion thereof is fixed to the pressure plate 43, and an intermediate portion thereof is connected to the first through hole 311 and the second through hole 311 of the cover 30, (321).
  • the cylinder rod 42 which is raised or lowered by the pusher body 41, can perform the pressing operation while raising or lowering the pressure plate 43 at the lower end.
  • the pressure plate 43 is coupled to the lower end of the cylinder rod 42 and is lifted or lowered together with the cylinder rod 42 to contact the upper surface of the device under test 81, .
  • This pressure plate 43 is disposed on the lower side of the cover 30.
  • the temperature regulating means 50 adjusts the temperature in the accommodating space 20a by injecting air or a coolant at a predetermined temperature into the accommodating space 20a.
  • the temperature regulating means 50 is fitted into the side surface of the housing 20, specifically, the first through hole 213 provided on one side of the base member 22, and communicates with the accommodating space 20a.
  • the present invention is not limited to adding a new structure to the housing 20 but merely forming a first through hole 213 in the housing 20 and connecting air or a means for injecting refrigerant to the first through hole 213, 81) is accommodated in the accommodating space 20a.
  • the temperature regulating means 50 may be provided on the side surface of the housing 20, but may be provided on the upper surface or the lower surface of the housing 20 as required.
  • the temperature regulating means 50 includes a first air injecting portion 51 for supplying high temperature air into the accommodating space 20a and a second air injecting portion 51 for supplying low temperature air or refrigerant into the accommodating space 20a. And an injection unit 52.
  • the refrigerant is a substance that causes a cooling action, and it means all media that act in such a way as to take the heat away from the surroundings and lower the ambient temperature at low temperature such as liquefied nitrogen.
  • low-temperature air or coolant flows from the second air injection unit 52 and is supplied to the accommodation space 20a, It goes down quickly.
  • the inside of the accommodation space 20a can be adjusted to a temperature of -40 to 150 degrees by the temperature control means 50, and the temperature can be precisely controlled within 1 degree.
  • the air discharging part 60 discharges air or refrigerant in the receiving space 20a to the outside and discharges air or refrigerant to the outside during or after the inspection is performed by supplying air or refrigerant .
  • high temperature air is continuously supplied into the accommodating space 20a through the first air injecting unit 51 while the electrical inspection of the inspected device is being received, So that the temperature inside the accommodation space 20a can be kept at a high temperature while being discharged to the outside through the heat exchanger 60.
  • the low-temperature air or refrigerant is continuously supplied through the second air injection unit 52, air or refrigerant in the accommodation space 20a is discharged to the outside through the air discharge unit 60, The internal temperature can be maintained at a low temperature.
  • the air discharge portion 60 is connected to the second through hole 214 provided on the side surface of the housing 20.
  • the sealing means 70 is capable of sealing the accommodating space 20a from the outside when the cover 30 closes the housing 20. That is, in order to raise or lower the temperature inside the accommodation space 20a by the high temperature air, the low temperature air or the coolant, the airtightness is required. In order to maintain the airtightness of the accommodation space 20a, .
  • This sealing means 70 includes a first packer 71, a second packer 72 and a vacuum means 73.
  • the first packer 71 is disposed on the upper surface of the housing 20 facing the cover 30 and is configured to surround the accommodation space 20a.
  • the first packer 71 may be made of a rubber material and fit into the first receiving groove 211 on the upper surface of the housing 20.
  • the first packer 71 is hermetically contacted with the lower surface of the cover 30 while being seated on the upper surface of the housing 20. Since the first packer 71 is disposed so as to surround the first accommodating space 20a, air or refrigerant in the first accommodating space 20a flows out through the gap between the cover 30 and the housing 20 .
  • the second packer 72 is spaced from the first packer 71 and disposed on the upper surface of the housing 20 so as to surround the first packer 71.
  • the second packer 72 may be made of a rubber material and fit into the second receiving groove 212 on the upper surface of the housing 20.
  • the second packer 72 is larger than the first packer 71 so as to surround the first packer 71.
  • the second packer 72 is hermetically contacted with the lower surface of the cover 30 while being seated on the upper surface of the housing 20. Since the second packer 72 is disposed so as to surround the first packer 71, it is possible to reliably prevent the air or the refrigerant flowing out through the first packer 71 from flowing out to the outside.
  • the vacuum means 73 allows the first packer 71 and the second packer 72 to be in a vacuum state. Specifically, the vacuum means 73 discharges air between the first packer 71 and the second packer 72 to the outside through a connection hole 732 through a separate suction means, 2 packers 72 can be placed in a vacuum state.
  • This vacuum means 73 is composed of a sealing space 731, a connection hole 732 and a suction means (not shown).
  • the sealing space 731 is disposed between the first packer 71 and the second packer 72 and is formed by recessing the upper surface of the housing 20 so as to surround the first packer 71.
  • connection hole 732 is formed to penetrate the housing 20 through the sealing space 731 and the outside.
  • the connection hole 732 functions as a passage through which the air in the sealing space 731 flows.
  • the suction means sucks air between the first packer 71 and the second packer 72 through the connection hole 732.
  • the suction means sucks air so that the first packer 71 and the second packer 72, (72) to be in a vacuum state.
  • the vacuum means 73 also functions to uniformly adhere the lower surface of the cover 30 to the upper surface of the housing 20.
  • the pusher device 40 presses the device under test 81 in a state in which the cover 30 is closed, due to the minute clearance existing in the connecting portion (hinge portion) of the cover 30 and the housing 20, 40 may not be able to uniformly press the semiconductor device because the cover 30 near the hinge is slightly moved due to the reaction of the pushing force of the pushing device 81, When the cover 30 is uniformly brought into close contact with the housing 20, the hinge portion is fixed and the clearance is not generated, so that the pusher device 40 is moved to the inspected device 81 ) Can be uniformly pressed.
  • reference numerals 82 and 90 denote inserts 82 and transmission means 90, respectively.
  • the insert 82 is inserted into the accommodation space 20a of the housing 20 and guides the inspected device 81 carried from the outside for inspection. That is, the accommodating space 20a has a somewhat large size to accommodate various types of inspected devices 81. In this accommodating space 20a, the device under test 81 is seated at the correct position, Thereby guiding the device under test 81 so that the inspection can be performed.
  • These inserts 82 have a square frame shape as a structure inserted into the housing space 20a and seated inside the housing 20. [ By changing the size of the center hole of the insert 82, it is possible to easily guide various types of devices to be inspected 81.
  • the transmission means (90) automatically opens and closes the cover (30) hingedly connected to the housing (20).
  • This transmission means 90 includes a motor 91 and a power transmission body 92 and transmits the rotational force of the motor 91 to the hinge pin 222 of the power transmission body 92 so that the cover 30 So that it can rotate automatically. That is, when the motor 91 rotates in one direction, the cover 30 opens the upper portion of the housing 20, and when the motor 91 rotates in the other direction, the cover 30 interlocks with the housing 20, As shown in Fig.
  • test socket 10 according to the present invention has the following actions and effects.
  • the device to be inspected 81 carried from the outside is inserted into the accommodating space 20a of the housing 20 with the cover 30 opened.
  • the lower surface of the device 81 to be inspected is electrically connected to the inspection apparatus.
  • the cover 30 is rotated to close the upper surface of the housing 20, and then the pusher device 40 is operated.
  • the pusher device 40 causes the lower surface of the pressure plate 43 to contact the upper surface of the device under test 81 as shown in FIG. 12 by lowering the cylinder rod 42, So that the inspected device 81 is brought into contact with the inspection connector 82 securely.
  • the inside of the containing space 20a is quickly changed to the environmental condition of the desired temperature.
  • the inside of the accommodation space 20a is subjected to a predetermined electrical inspection in a specific temperature environment of high temperature or low temperature.
  • high temperature, low temperature air or refrigerant is continuously injected into the accommodation space 20a, and at the same time, air or refrigerant is discharged through the air outlet 60, Can be maintained.
  • air or refrigerant in the accommodating space 20a is discharged to the outside through the air discharging portion 60, and then the pusher device 40 is operated to move the pressure plate 43 to the inspected device 81 .
  • the cover 30 is rotated to open the upper portion of the housing 20, the inspected device 81 that has been inspected is moved to the outside.
  • the above-described operation is repeated while carrying the new inspected device 81.
  • the inspecting socket 81 is used for inspecting the inspecting device 81 under a specific temperature environment of a high temperature or a low temperature in a housing space 20a in which the inspecting device 81 is accommodated, ,
  • the inspection time can be minimized by introducing low temperature air or refrigerant.
  • the inspection is performed through indirect heat transfer, which causes the heat of the pressure plate to be transmitted to the device under test 81.
  • This prior art technique And the inspection time takes a long time.
  • the present invention solves this problem.
  • the inspecting socket 10 is a housing 20 made of a plastic material which is resistant to heat and cold, and uses less air and refrigerant to reduce the time required to reach a desired temperature, And inspection switching time.
  • the inspection socket 10 takes in air or refrigerant at a predetermined temperature into the accommodation space 20a, the air or the refrigerant inside the accommodation space 20a is discharged to the outside
  • the sealing means 70 is disposed in the housing 20 in order to prevent the leakage of heat and to prevent the heat loss.
  • the inspection socket 10 of the prior art has a problem in that the structure of the pusher device 40 is complicated because the pusher device 40 must have a separate component for heating the pressure plate.
  • the electrical inspection of the device under test 81 is performed by adding a simple structure that allows the air to flow from one side of the housing 20 while utilizing the existing accommodating space 20a as it is. Accordingly, the present invention has the advantage of simplifying the overall structure of the apparatus, and also has an advantage of being easy to maintain because of its simple structure.
  • the present invention can further ensure airtightness by forming a pair of the first packer 71 and the second packer 72 spaced apart from each other between the housing 20 and the cover 30.
  • the space between the first packer 71 and the second packer 72 vacuum, the heat insulating performance can be further improved, and the heat control speed and time can be shortened.
  • TCU Temporal Control Unit
  • the socket for inspection according to the present invention is not limited to the above contents, but may be modified as follows.
  • the rotation of the cover is automatically performed by the driving means.
  • the present invention is not limited to this, and the cover may be opened and closed manually by a user.
  • the sealing means is provided only on the upper portion of the housing.
  • the present invention is not limited to this, and in order to prevent air or refrigerant from escaping through the space between the lower surface of the housing and the upper surface of the testing apparatus, It is also possible to add a packer between the lower surface of the inspection apparatus and the upper surface of the inspection apparatus.
  • sealing means is not limited to the above, and it is of course possible to additionally provide the sealing means in addition to the need for sealing.

Abstract

The present invention relates to a test socket and, more specifically, to a test socket comprising: a housing which has an accommodation space accommodating a device-to-be-tested on which an electrical test is to be performed, and which has an open upper part; a cover capable of opening/closing the open upper part of the housing; a pusher device provided in the cover so as to downwardly press the device-to-be-tested placed in the housing; a temperature control means for injecting air or a refrigerant of a predetermined temperature into the accommodation space so as to regulate the temperature in the accommodation space; and a sealing means capable of sealing the accommodation space from the outside when the cover closes the housing, wherein the sealing means comprises: a first packer which is disposed on the housing upper surface facing the cover and which encompasses the accommodation space; a second packer spaced apart from the first packer, and disposed on the housing upper surface so as to encompass the first packer; and a vacuuming means for forming a vacuum state between the first packer and the second packer.

Description

검사용 소켓Socket for inspection
본 발명은 검사용 소켓에 대한 것으로서, 더욱 상세하게는 고온 또는 저온 환경에서 수행되는 전기적 검사시 검사용 공간의 온도를 신속하게 조절할 수 있는 검사용 소켓에 대한 것이다.The present invention relates to a test socket, and more particularly, to a test socket capable of quickly adjusting a temperature of a test space during an electrical test performed in a high temperature or low temperature environment.
일반적으로, 반도체 집적 회로 장치의 제조 공정에서는, 예를 들면 실리콘으로 이루어지는 웨이퍼에 다수의 집적 회로를 형성하고, 그 후 이들 집적 회로의 각각에 대하여 기초적인 전기 특성을 검사함으로써, 결함을 갖는 집적 회로를 선별하는 프로브 시험이 행해진다. 이어서, 이 웨이퍼를 절단함으로써 반도체칩이 형성되고, 이 반도체칩이 적절한 패키지 내에 수납된다. 또한, 패키지화된 반도체 집적 회로 장치의 각각에 대하여 고온 또는 저온의 온도 환경하에서 전기적 특성을 검사함으로써, 잠재적 결함을 갖는 반도체집을 선별하는 전기적 검사가 행해진다. Generally, in a process of manufacturing a semiconductor integrated circuit device, for example, a plurality of integrated circuits are formed on a wafer made of silicon, and then each of these integrated circuits is checked for fundamental electric characteristics, A probe test is performed. Subsequently, the semiconductor chip is formed by cutting the wafer, and the semiconductor chip is housed in an appropriate package. Electrical inspection is performed to select semiconductor houses with potential defects by inspecting electrical characteristics of each packaged semiconductor integrated circuit device under a high temperature or low temperature environment.
이러한 검사 과정에서 검사가 필요한 반도체칩과 같은 피검사 디바이스는 직접적으로 검사장치에 접촉하는 것이 아니라 검사용 소켓이 포함된 검사용 커넥터를 통하여 간접적으로 접촉하게 된다.In this inspection process, devices to be inspected such as a semiconductor chip requiring inspection are not directly contacted with the inspection device but indirectly through the inspection connector including the inspection socket.
또한, 피검사 디바이스는 검사용 커넥터의 상면에 안착된 후에 푸셔장치에 의하여 피검사 디바이스의 상면이 눌림으로서 검사용 커넥터와 확실하게 접촉되어 검사가 수행되게 된다.In addition, the device to be inspected is placed on the upper surface of the connector for inspection, and then the upper surface of the device to be inspected is pressed by the pusher device, thereby making sure contact with the connector for inspection.
이러한 종래의 검사용 소켓은 다음과 같은 문제점이 있다.Such a conventional inspection socket has the following problems.
종래기술은 푸셔장치의 가압면을 고온 또는 저온의 공기에 의하여 가열 또는 냉각한 후에 가압면이 피검사 디바이스에 열을 전달함으로써 고온 또는 저온 환경을 이루게 되는데, 이 과정에서 열 손실이 많을 뿐 아니라 고온 또는 저온의 환경을 만드는데 오랜 시간이 걸리는 단점이 있다. In the prior art, after the pressing surface of the pusher device is heated or cooled by air at a high or low temperature, the pressing surface conveys heat to the device to be inspected, thereby forming a high temperature or low temperature environment. In this process, Or it takes a long time to create a low-temperature environment.
또한, 종래기술은 푸셔장치에 열제어 수단이 설치되어 있어서 전체적인 푸셔장치가 복잡해지는 문제점이 있다.Further, in the prior art, the pusher apparatus is provided with the thermal control means, which causes a problem that the entire pusher apparatus becomes complicated.
본 발명은 상술한 문제점을 해결하기 위하여 창출된 것으로서, 더욱 상세하게는 푸셔장치가 아닌 피검사 디바이스가 수용되는 수용공간 내에 소정의 온도를 가지는 공기 또는 냉매를 공급함으로서 신속하게 고온 또는 저온의 환경 조건을 만들 수 있게 하는 검사용 소켓을 제공하는 것을 목적으로 한다.The present invention has been made in order to solve the above-described problems, and more particularly, it is an object of the present invention to provide an air conditioner having a predetermined temperature, And to provide a socket for inspection which enables the socket to be manufactured.
또한, 본 발명은, 소정의 온도를 가지는 공기 또는 냉매에 의하여 수용공간의 온도를 조절해야 하므로 피검사 디바이스가 수용되는 공간을 확실하게 밀봉함으로서 열손실이 없을 뿐 아니라 신속하게 원하는 온도 조건을 만들 수 있도록 할 수 있는 검사용 소켓을 제공하는 것을 목적으로 한다.In addition, since the temperature of the accommodation space needs to be adjusted by air or a coolant having a predetermined temperature, the space in which the device to be inspected is sealed is reliably sealed, and there is no heat loss, And it is an object of the present invention to provide a test socket capable of making a test socket.
또한, 본 발명은 하우징의 수용공간과 외부 사이를 진공에 의하여 단열시킴으로서 하우징 내부의 열손실을 보다 확실하게 막을 수 있도록 하는 검사용 소켓을 제공하는 것을 목적으로 한다.Another object of the present invention is to provide an inspection socket which can reliably prevent heat loss inside the housing by insulating the space between the housing space and the outside by vacuum.
상술한 목적을 달성하기 위한 본 발명의 검사용 소켓은, 전기적 검사가 요구되는 피검사 디바이스가 수용될 수 있는 수용공간이 마련되고, 상부가 개방되어 있는 하우징;According to another aspect of the present invention, there is provided a socket for inspection comprising: a housing having a housing space in which an inspected device requiring electrical inspection can be received;
상기 하우징의 개방된 상부를 개폐할 수 있는 커버;A cover capable of opening and closing an open top of the housing;
상기 커버에 마련되며, 상기 하우징에 안착된 피검사 디바이스를 하측으로 가압하기 위한 푸셔장치;A pusher device which is provided on the cover and presses the device under test placed on the housing downward;
상기 수용공간 내로 소정온도의 공기 또는 냉매를 주입함으로서 수용공간 내의 온도를 조절하는 온도조절수단; 및Temperature adjusting means for adjusting the temperature in the accommodating space by injecting air or a coolant at a predetermined temperature into the accommodating space; And
상기 커버가 상기 하우징을 폐쇄하였을 때 상기 수용공간을 외부로부터 밀봉시킬 수 있는 밀봉수단을 포함하되,And sealing means for sealing the accommodation space from the outside when the cover closes the housing,
상기 밀봉수단은, 상기 커버와 마주보는 하우징 상면에 배치되고 상기 수용공간을 둘러싸는 제1패커와, 상기 제1패커와 이격되며 상기 제1패커를 둘러싸도록 상기 하우징 상면에 배치되는 제2패커와, 상기 제1패커와 제2패커 사이를 진공상태가 되도록 하는 진공수단을 포함한다.The sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And a vacuum means for bringing the vacuum between the first packer and the second packer.
상기 검사용 소켓에서,In the inspection socket,
상기 제1패커는, 상기 하우징의 상면에 안착된 상태에서, 상기 커버의 하면에 기밀성이 있게 접촉될 수 있다.The first packer can be hermetically contacted with the lower surface of the cover while being seated on the upper surface of the housing.
상기 검사용 소켓에서,In the inspection socket,
상기 제2패커는, 상기 하우징의 상면에 안착된 상태에서, 상기 커버에 기밀성이 있게 접촉될 수 있다.The second packer can be hermetically contacted to the cover in a state of being seated on the upper surface of the housing.
상기 검사용 소켓에서,In the inspection socket,
상기 진공수단은, 상기 제1패커와 제2패커 사이의 공기를 외부로 배출할 수 있다.The vacuum means may discharge the air between the first packer and the second packer to the outside.
상기 검사용 소켓에서, 상기 진공수단은,In the inspection socket,
상기 제1패커와 제2패커 사이에 배치되는 밀봉공간;A sealing space disposed between the first packer and the second packer;
상기 밀봉공간과 외부를 연통시키도록 상기 하우징을 관통하는 연결홀; 및A connection hole passing through the housing to communicate with the outside of the sealing space; And
상기 연결홀을 통하여 제1패커와 상기 제2패커 사이의 공기를 흡입하는 흡입수단을 포함할 수 있다.And suction means for sucking air between the first packer and the second packer through the connection hole.
상기 검사용 소켓에서, 상기 밀봉공간은, 상기 제1패커를 둘러싸면서 하우징의 상면을 오목하게 함입하여 형성될 수 있다.In the inspection socket, the sealing space may be formed by recessing the upper surface of the housing while surrounding the first packer.
상기 검사용 소켓에서, 상기 진공수단은, 상기 커버의 하면을 하우징의 상면에 균일하게 밀착시킬 수 있다.In the inspection socket, the vacuum means can uniformly adhere the lower surface of the cover to the upper surface of the housing.
상기 검사용 소켓에서,In the inspection socket,
상기 온도조절수단은, 고온의 공기를 상기 수용공간 내부로 공급하는 제1공기주입부와, 저온의 공기 또는 냉매를 상기 수용공간 내로 공급하는 제2공기주입부를 포함할 수 있다.The temperature regulating means may include a first air injecting portion for supplying high temperature air into the accommodating space and a second air injecting portion for supplying low temperature air or refrigerant into the accommodating space.
상기 검사용 소켓에서,In the inspection socket,
상기 온도조절수단은, 상기 하우징의 측면에 설치될 수 있다.The temperature adjusting means may be installed on a side surface of the housing.
상기 검사용 소켓에서, 상기 커버는 상기 하우징에 대해서 힌지식으로 연결되며 전동수단에 의하여 자동으로 개폐될 수 있다.In the inspection socket, the cover is hingedly connected to the housing, and can be automatically opened and closed by the transmission means.
상기 검사용 소켓에서, 상기 커버는 상기 하우징에 대해서 힌지식으로 연결되어 수동으로 개폐될 수 있다.In the inspection socket, the cover may be hingedly connected to the housing and manually opened and closed.
상술한 목적을 달성하기 위한 본 발명의 검사용 소켓은, 전기적 검사가 요구되는 피검사 디바이스가 수용될 수 있는 수용공간이 마련되고, 상부가 개방되어 있는 하우징;According to another aspect of the present invention, there is provided a socket for inspection comprising: a housing having a housing space in which an inspected device requiring electrical inspection can be received;
상기 하우징의 개방된 상부를 개폐할 수 있는 커버;A cover capable of opening and closing an open top of the housing;
상기 수용공간 내로 소정온도의 공기 또는 냉매를 주입함으로서 수용공간 내의 온도를 조절하는 온도조절수단; 및Temperature adjusting means for adjusting the temperature in the accommodating space by injecting air or a coolant at a predetermined temperature into the accommodating space; And
상기 커버가 상기 하우징을 폐쇄하였을 때 상기 수용공간을 외부로부터 밀봉시킬 수 있는 밀봉수단을 포함하되,And sealing means for sealing the accommodation space from the outside when the cover closes the housing,
상기 밀봉수단은, 상기 커버와 마주보는 하우징 상면에 배치되고 상기 수용공간을 둘러싸는 제1패커와, 상기 제1패커와 이격되며 상기 제1패커를 둘러싸도록 상기 하우징 상면에 배치되는 제2패커와, 상기 제1패커와 제2패커 사이의 공기를 외부로 배출하여 하우징의 수용공간을 외부에 대하여 단열시키는 진공수단을 포함한다.The sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And vacuum means for discharging the air between the first packer and the second packer to the outside to insulate the accommodation space of the housing from the outside.
상기 검사용 소켓은, 상기 커버에 마련되어 상기 커버의 하면에서 출몰하면서 수용공간 내에 배치된 피검사 디바이스를 하측으로 가압시킬 수 있는 푸셔장치를 포함할 수 있다.The inspection socket may include a pusher device provided on the cover and capable of pushing down the device to be inspected disposed in the accommodation space while being viewed from the lower surface of the cover.
상기 검사용 소켓에서,In the inspection socket,
상기 진공수단은 상기 커버를 상기 하우징에 유격없이 밀착시킬 수 있다.The vacuum means can bring the cover into close contact with the housing without clearance.
상술한 목적을 달성하기 위한 본 발명의 검사용 소켓은, 전기적 검사가 요구되는 피검사 디바이스가 수용될 수 있는 수용공간이 마련되고, 상부가 개방되어 있는 하우징;According to another aspect of the present invention, there is provided a socket for inspection comprising: a housing having a housing space in which an inspected device requiring electrical inspection can be received;
상기 하우징의 개방된 상부를 개폐할 수 있는 커버;A cover capable of opening and closing an open top of the housing;
상기 커버에 마련되며, 상기 하우징에 안착된 피검사 디바이스를 하측으로 가압하기 위한 푸셔장치; 및A pusher device which is provided on the cover and presses the device under test placed on the housing downward; And
상기 커버가 상기 하우징을 폐쇄하였을 때 상기 수용공간을 외부로부터 밀봉시킬 수 있는 밀봉수단을 포함하되,And sealing means for sealing the accommodation space from the outside when the cover closes the housing,
상기 밀봉수단은, 상기 커버와 마주보는 하우징 상면에 배치되고 상기 수용공간을 둘러싸는 제1패커와, 상기 제1패커와 이격되며 상기 제1패커를 둘러싸도록 상기 하우징 상면에 배치되는 제2패커와, 상기 제1패커와 제2패커 사이를 진공상태가 되도록 하는 진공수단을 포함한다.The sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And a vacuum means for bringing the vacuum between the first packer and the second packer.
본 발명에 따른 검사용 소켓은, 피검사 디바이스가 수용공간 내에 소정의 온도를 가지는 공기 또는 냉매를 제공함으로서 검사 환경을 원하는 온도 조건으로 신속하게 만들 수 있다는 장점이 있다.The inspection socket according to the present invention provides an advantage that the inspection environment can be quickly made to a desired temperature condition by providing the air or the refrigerant having a predetermined temperature in the accommodation space of the inspection device.
또한 수용공간을 밀봉부재에 의하여 외부와 확실하게 밀폐시켜서 열손실이 없을 뿐 아니라 원하는 온도 조건을 신속하게 만들 수 있는 장점이 있다.Further, the accommodation space is surely sealed with the outside by the sealing member, so that there is no heat loss and the desired temperature condition can be made quickly.
또한, 수용공간을 외부로부터 밀봉시키는 제1패커 및 제2패커를 마련하고 있어서 기밀성이 확실하게 유지될 수 있는 장점이 있다.Further, since the first packer and the second packer that seal the accommodation space from the outside are provided, there is an advantage that the airtightness can be reliably maintained.
또한, 제1패커와 제2패커 사이의 공기를 외부로 배출하여 진공상태를 유지하도록 하는 진공수단을 마련하고 있어서 하우징의 열손실을 확실하게 방지할 수 있는 장점이 있다.Further, since the vacuum means for discharging the air between the first packer and the second packer to the outside to maintain the vacuum state is provided, heat loss of the housing can be reliably prevented.
또한, 푸셔장치에 온도조절을 위한 별도의 부재를 부착할 필요가 없어서 푸셔장치의 구조를 전체적으로 간단하게 할 수 있는 장점이 있다.In addition, there is no need to attach a separate member for temperature control to the pusher device, which makes it possible to simplify the structure of the pusher device as a whole.
도 1은 본 발명의 검사용 소켓의 분리사시도를 나타내는 도면.1 is an exploded perspective view of a test socket of the present invention.
도 2는 도 1의 결합사시도.Fig. 2 is a perspective view of the coupling of Fig. 1; Fig.
도 3은 도 2의 평면도.Figure 3 is a plan view of Figure 2;
도 4는 도 2의 측면도.Figure 4 is a side view of Figure 2;
도 5는 도 2의 정면도Fig. 5 is a front view of Fig. 2
도 6은 도 3의 Ⅵ-Ⅵ 단면도.6 is a sectional view taken along the line VI-VI of Fig. 3;
도 7은 도 3의 Ⅶ-Ⅶ 단면도.7 is a cross-sectional view taken along line VII-VII of FIG. 3;
도 8은 도 2의 검사용 소켓에서 커버가 개방된 상태를 나타내는 도면.8 is a view showing a state in which the cover is opened in the inspection socket of Fig. 2;
도 9 내지 도 11은 도 8의 검사용 소켓에서 밀봉구조를 상세하게 나타내는 도면.Figs. 9 to 11 are views showing the sealing structure in detail in the inspection socket of Fig. 8; Fig.
도 12는 도 2의 검사용 소켓에서 피검사 디바이스의 검사모습을 나타내는 단면도.12 is a sectional view showing an inspection state of the device to be inspected in the inspection socket of FIG. 2;
이하, 본 발명의 일 실시예에 따른 검사용 소켓을 첨부된 도면을 참조하면서 상세하게 설명한다.Hereinafter, a test socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
본 발명에 따른 검사용 소켓(10)은 반도체칩과 같은 피검사 디바이스(81)의 전기적 검사를 수행하기 위하여 상기 피검사 디바이스(81)의 단자를 검사장치(미도시)의 패드와 전기적으로 접속시키기 위한 것이다. 구체적으로는 검사용 소켓(10)의 하측에는 소정의 검사용 신호가 인가되는 검사장치가 배치되어 있으며 상기 검사장치로부터 인가된 검사용 신호는 상기 검사용 소켓(10)에 안착된 피검사 디바이스(81)로 전달되어 피검사 디바이스(81)에 대한 소정의 전기적 검사를 수행하게 된다.The inspection socket 10 according to the present invention is characterized in that the terminal of the device under test 81 is electrically connected to the pad of the inspection device (not shown) in order to conduct the electrical inspection of the device under test 81 such as a semiconductor chip . Specifically, an inspection apparatus to which a predetermined inspection signal is applied is disposed under the inspection socket 10, and an inspection signal applied from the inspection apparatus is transmitted to the inspection target device 10 mounted on the inspection socket 10 81 to perform a predetermined electrical inspection of the inspected device 81. [
이러한 검사용 소켓(10)은, 하우징(20), 커버(30), 푸셔장치(40), 온도조절수단(50), 공기배출부(60) 및 밀봉수단(70)을 포함한다.The inspection socket 10 includes a housing 20, a cover 30, a pusher device 40, a temperature regulating means 50, an air discharging portion 60 and a sealing means 70.
상기 하우징(20)은, 몸체부(21) 및 힌지수단(22) 및 락커(23)를 포함하여 구성된다.The housing 20 includes a body portion 21, a hinge means 22, and a locker 23.
상기 몸체부(21)는, 상기 피검사 디바이스(81)가 수용될 수 있는 수용공간(20a)이 마련되고, 상부가 개방되어 있는 것이다. 구체적으로 하우징(20)의 몸체부(21)는 사각프레임의 형태를 가지고 있으며 그 중앙에는 피검사 디바이스(81)가 수용될 수 있는 수용공간(20a)이 마련되어 있게 된다.The body part 21 is provided with a receiving space 20a in which the device under test 81 can be received, and the upper part is opened. Specifically, the body portion 21 of the housing 20 has a rectangular frame shape, and at the center thereof, a receiving space 20a in which the device under test 81 can be received is provided.
상기 하우징(20)의 몸체부(21) 상면에는 상기 수용공간(20a)을 감싸면서 제1패커(71)가 설치되는 제1수용홈(211)이 마련되고, 상기 제1수용홈(211)의 외측으로는 상기 제1수용홈(211)과 이격되어 있으며 제2패커(72)가 설치되는 제2수용홈(212)이 마련되어 있게 된다.A first receiving groove 211 is formed on an upper surface of the body portion 21 of the housing 20 so as to surround the receiving space 20a and a first packer 71 is installed. A second receiving groove 212 spaced apart from the first receiving groove 211 and provided with a second packer 72 is provided outside the first receiving groove 211.
상기 제1수용홈(211)과 제2수용홈(212) 사이에는 밀봉공간(731)이 마련되어 있게 된다. 이러한 밀봉공간(731)은 제1패커(71)를 둘러싸면서 하우징(20)의 몸체부(21) 상면을 오목하게 함입하여 형성된 것이다. 이러한 밀봉공간(731)은 외부의 흡입수단(미도시)과 연통되도록 하우징(20)을 관통하는 연결홀(732)과 연결되어 있게 된다.A sealing space 731 is provided between the first receiving groove 211 and the second receiving groove 212. The sealing space 731 is formed by recessing the upper surface of the body portion 21 of the housing 20 while enclosing the first packer 71. The sealing space 731 is connected to a connection hole 732 passing through the housing 20 so as to communicate with an external suction means (not shown).
또한, 하우징(20)의 몸체부(21) 측면에는 고온, 저온의 공기 또는 냉매가 외부에서 공급될 수 있도록 수용공간(20a)과 외부를 연통시키는 제1통공(213)이 마련되고, 상기 제1통공(213)과 인접한 위치에는 수용공간(20a) 내부의 공기 또는 냉매가 외부로 배출될 수 있도록 하는 제2통공(214)이 마련되어 있게 된다.A first through hole 213 communicating with the accommodating space 20a is provided on the side surface of the body portion 21 of the housing 20 so that high temperature and low temperature air or refrigerant can be supplied from the outside, A second through hole 214 is formed at a position adjacent to the one through hole 213 to allow air or refrigerant in the accommodating space 20a to be discharged to the outside.
상기 힌지수단(22)은, 힌지핀(222)이 길이방향으로 관통되어 있는 힌지몸체(221)와, 상기 힌지몸체(221)에 결합된 힌지핀(222)으로 구성된다. 상기 힌지핀(222)의 양단에는 커버(30)가 결합되어 상기 커버(30)의 회동개폐를 가능하게 한다.The hinge means 22 comprises a hinge body 221 having a hinge pin 222 penetrating in the longitudinal direction and a hinge pin 222 coupled to the hinge body 221. The cover 30 is coupled to both ends of the hinge pin 222 to enable the cover 30 to be opened and closed.
상기 락커(23)는 상기 몸체부(21)의 일측에 설치되어 커버(30)가 폐쇄위치에 놓였을 때 상기 커버(30)의 폐쇄위치를 고정시키는 기능을 수행한다. 구체적으로 락커(23)는 커버(30)의 상면에 걸리도록 구성되어 상기 커버(30)가 폐쇄위치에서 개방위치로 힌지운동하지 않도록 상기 커버(30)를 고정시키는 기능을 수행한다. 이러한 락커(23)는 통상적인 고정수단으로서 자세한 설명은 생략한다.The locker 23 is installed at one side of the body 21 and functions to fix the closing position of the cover 30 when the cover 30 is placed in the closed position. Specifically, the locker 23 is configured to be hooked on the upper surface of the cover 30 so as to fix the cover 30 so that the cover 30 does not hinge from the closed position to the open position. Such a locker 23 is a conventional fixing means and its detailed description is omitted.
상기 커버(30)는 상기 하우징(20)의 개방된 상부를 개폐할 수 있도록 구성되며, 하우징(20)과 협동하여 수용공간(20a)을 구성한다. 즉, 커버(30)가 하우징(20)을 폐쇄하였을 때 그 내부공간이 수용공간(20a)이 될 수 있도록 한다. 이러한 커버(30)는 힌지핀(222)과 결합되어 회동가능한 상태로 되어 있으며 피검사 디바이스(81)를 수용공간(20a)에 삽입하거나 빼내는 경우에는 개방되어 하우징(20)의 수용공간(20a)을 상측으로 오픈시키고 검사를 위하여 피검사 디바이스(81)가 수용공간(20a)에 안착된 후에는 수용공간(20a)을 폐쇄하도록 구성된다. 이러한 커버(30)는 힌지핀(222)이 결합되어 회동하는 도어 베이스(31)와, 상기 도어 베이스(31)의 하측에 고정설치되어 하우징(20)의 상면을 밀폐시킬 수 있는 상부 베이스(32)를 포함한다. The cover 30 is configured to open and close an opened upper portion of the housing 20 and constitutes a receiving space 20a in cooperation with the housing 20. [ That is, when the cover 30 closes the housing 20, the internal space of the cover 30 becomes the accommodating space 20a. The cover 30 is coupled with the hinge pin 222 and is rotatable. When the inspected device 81 is inserted into or withdrawn from the accommodation space 20a, the cover 30 is opened and the accommodation space 20a of the housing 20 is opened. And closes the accommodating space 20a after the inspected device 81 is placed in the accommodating space 20a for inspection. The cover 30 includes a door base 31 to which the hinge pin 222 is pivotally coupled and an upper base 32 which is fixedly installed on the lower side of the door base 31 and is capable of closing the upper surface of the housing 20 ).
상기 도어 베이스(31)의 중앙에는 푸셔장치(40)가 관통하는 제1관통공(311)이 마련되고, 상기 상부 베이스(32)에서 상기 제1관통공(311)과 대응되는 위치에는 푸셔장치(40)가 관통하는 제2관통공(321)이 마련되어 있게 된다.The door base 31 is provided at its center with a first through hole 311 through which the pusher device 40 passes and at a position corresponding to the first through hole 311 in the upper base 32, And a second through hole 321 through which the first electrode 40 penetrates.
상기 푸셔장치(40)는, 상기 커버(30)에 마련되며, 상기 하우징(20)에 안착된 피검사 디바이스(81)를 하측으로 가압하기 위한 것이다. 구체적으로 푸셔장치(40)는 상기 피검사 디바이스(81)를 검사장치 측으로 가압하여 피검사 디바이스(81)의 단자가 검사장치의 패드와 전기적으로 확실하게 접속되도록 한다.The pusher device 40 is provided on the cover 30 and presses the device under test 81 placed on the housing 20 downward. Specifically, the pusher device 40 presses the device under test 81 toward the inspection device so that the terminal of the device under test 81 is electrically and securely connected to the pad of the inspection device.
이러한 푸셔장치(40)는, 푸셔몸체(41), 실린더 로드(42), 가압판(43)으로 이루어진다. 상기 푸셔몸체(41)는 상기 커버(30)의 상면측에 고정설치되어 있는 것으로서 상기 실린더 로드(42)를 상승 내지 하강시키도록 한다. 상기 푸셔몸체(41)는 공압 내지 기타 다양한 공지된 구동방식에 의하여 상기 실린더 로드(42)를 직선적으로 이동하게 한다.The pusher device 40 includes a pusher body 41, a cylinder rod 42, and a pressure plate 43. The pusher body 41 is fixedly installed on the upper surface of the cover 30 so as to raise or lower the cylinder rod 42. The pusher body 41 allows the cylinder rod 42 to move linearly by pneumatic or other various known driving methods.
상기 실린더 로드(42)는 상기 푸셔몸체(41)에 의하여 상승 내지 하강하면서 가압판(43)이 피검사 디바이스(81)의 상면을 가압하거나 가압해제하도록 한다. 구체적으로 상기 실린더 로드(42)의 상부는 푸셔몸체(41) 내부에 결합되고 하부는 가압판(43)에 고정되며 그 중간부분은 커버(30)의 제1관통공(311) 및 제2관통공(321)을 통과하도록 구성된다. 상기 푸셔몸체(41)에 의하여 상승 내지 하강하는 실린더 로드(42)는 하단의 가압판(43)을 상승 내지 하강시키면서 가압 동작을 수행할 수 있도록 한다.The cylinder rod 42 is moved up or down by the pusher body 41 so that the pressure plate 43 presses or releases the upper surface of the device under test 81. Specifically, an upper portion of the cylinder rod 42 is coupled to the pusher body 41, a lower portion thereof is fixed to the pressure plate 43, and an intermediate portion thereof is connected to the first through hole 311 and the second through hole 311 of the cover 30, (321). The cylinder rod 42, which is raised or lowered by the pusher body 41, can perform the pressing operation while raising or lowering the pressure plate 43 at the lower end.
상기 가압판(43)은 상기 실린더 로드(42)의 하단에 결합되어 상기 실린더 로드(42)와 함께 상승 내지 하강하는 것으로서 피검사 디바이스(81)의 상면에 접촉하여 상기 피검사 디바이스(81)의 가압을 수행하게 된다. 이러한 가압판(43)은 커버(30)의 하측에 배치된다.The pressure plate 43 is coupled to the lower end of the cylinder rod 42 and is lifted or lowered together with the cylinder rod 42 to contact the upper surface of the device under test 81, . This pressure plate 43 is disposed on the lower side of the cover 30.
상기 온도조절수단(50)은, 상기 수용공간(20a) 내로 소정온도의 공기 또는 냉매를 주입함으로서 수용공간(20a) 내의 온도를 조절하는 것이다. 이러한 온도조절수단(50)은 하우징(20)의 측면, 구체적으로는 베이스부재(22)의 일측에 마련된 제1통공(213)에 끼워져서 수용공간(20a)과 연통된다. 하우징(20)에 새로운 구조를 부가하는 것이 아니라 하우징(20)에는 단순하게 제1통공(213)만 형성하고 그 제1통공(213)에 공기 또는 냉매 주입을 위한 수단을 연결함으로서 피검사 디바이스(81)가 안착된 수용공간(20a) 내부의 온도를 조절한다. 상기 온도조절수단(50)은 하우징(20)의 측면에 설치되는 바람직하나, 필요에 따라서 하우징(20)의 상면 또는 하면에 설치되어 있는 것도 가능하다.The temperature regulating means 50 adjusts the temperature in the accommodating space 20a by injecting air or a coolant at a predetermined temperature into the accommodating space 20a. The temperature regulating means 50 is fitted into the side surface of the housing 20, specifically, the first through hole 213 provided on one side of the base member 22, and communicates with the accommodating space 20a. The present invention is not limited to adding a new structure to the housing 20 but merely forming a first through hole 213 in the housing 20 and connecting air or a means for injecting refrigerant to the first through hole 213, 81) is accommodated in the accommodating space 20a. The temperature regulating means 50 may be provided on the side surface of the housing 20, but may be provided on the upper surface or the lower surface of the housing 20 as required.
이러한 온도조절수단(50)은 고온의 공기를 상기 수용공간(20a) 내부로 공급하는 제1공기주입부(51)와, 저온의 공기 또는 냉매를 상기 수용공간(20a) 내로 공급하는 제2공기주입부(52)로 구성된다. 이때 냉매는 냉각작용을 일으키는 물질로써, 액화질소와 같이 저온상태에서 주위로부터 열을 빼앗아 주위의 온도를 낮추는 방식으로 작용하는 모든 매체를 의미한다. The temperature regulating means 50 includes a first air injecting portion 51 for supplying high temperature air into the accommodating space 20a and a second air injecting portion 51 for supplying low temperature air or refrigerant into the accommodating space 20a. And an injection unit 52. In this case, the refrigerant is a substance that causes a cooling action, and it means all media that act in such a way as to take the heat away from the surroundings and lower the ambient temperature at low temperature such as liquefied nitrogen.
수용공간(20a) 내부를 고온의 환경을 만들기 위해서 상기 제1공기주입부(51)로부터 고온의 공기가 유입되어 수용공간(20a)에 공급되고 이에 따라서 수용공간(20a) 내부 온도가 신속하게 올라간다.In order to create a high-temperature environment in the accommodation space 20a, hot air from the first air injection unit 51 flows into the accommodation space 20a, and thus the temperature inside the accommodation space 20a rapidly rises .
또한, 수용공간(20a) 내부에 저온의 환경을 만들기 위해서는 제2공기주입부(52)로부터 저온의 공기 또는 냉매가 유입되어 수용공간(20a)에 공급되고 이에 따라서 수용공간(20a) 내부 온도가 신속하게 내려간다. In order to create a low-temperature environment inside the accommodation space 20a, low-temperature air or coolant flows from the second air injection unit 52 and is supplied to the accommodation space 20a, It goes down quickly.
구체적으로 상기 온도조절수단(50)에 의하여 수용공간(20a) 내부를 -40 ~ 150 도의 온도로 조절할 수 있으며, 1도 이내에서 정밀하게 온도조절이 가능하다.Specifically, the inside of the accommodation space 20a can be adjusted to a temperature of -40 to 150 degrees by the temperature control means 50, and the temperature can be precisely controlled within 1 degree.
상기 공기배출부(60)는 수용공간(20a) 내부의 공기 또는 냉매를 외부로 배출하는 것으로서, 공기 또는 냉매가 공급되어 검사가 진행되는 동안 또는 완료된 후에 내부의 공기 또는 냉매를 외부로 배출시키는 기능을 수행하게 된다. 구체적으로 피검사 디바이스에 대한 전기적 검사가 수용되는 동안, 고온의 공기가 제1공기주입부(51)를 통하여 수용공간(20a) 내에 지속적으로 공급되면 수용공간(20a) 내부의 공기가 공기배출부(60)를 통하여 외부로 배출되면서 수용공간(20a) 내부의 온도가 고온상태를 유지할 수 있게 된다. 또한, 저온의 공기 또는 냉매가 제2공기주입부(52)를 통하여 지속적으로 공급되면 수용공간(20a) 내부의 공기 또는 냉매가 공기배출부(60)를 통하여 외부로 배출되면서 수용공간(20a) 내부의 온도가 저온상태를 유지할 수 있게 된다. 이러한 공기배출부(60)는 하우징(20)의 측면에 마련된 제2통공(214)과 연결되어 있게 된다.The air discharging part 60 discharges air or refrigerant in the receiving space 20a to the outside and discharges air or refrigerant to the outside during or after the inspection is performed by supplying air or refrigerant . When high temperature air is continuously supplied into the accommodating space 20a through the first air injecting unit 51 while the electrical inspection of the inspected device is being received, So that the temperature inside the accommodation space 20a can be kept at a high temperature while being discharged to the outside through the heat exchanger 60. When the low-temperature air or refrigerant is continuously supplied through the second air injection unit 52, air or refrigerant in the accommodation space 20a is discharged to the outside through the air discharge unit 60, The internal temperature can be maintained at a low temperature. The air discharge portion 60 is connected to the second through hole 214 provided on the side surface of the housing 20.
상기 밀봉수단(70)은, 상기 커버(30)가 하우징(20)을 폐쇄하였을 때 상기 수용공간(20a)을 외부로부터 밀봉시킬 수 있는 것이다. 즉, 고온의 공기, 저온의 공기 또는 냉매에 의하여 수용공간(20a) 내부의 온도를 상승 내지 하강시키기 위해서는 기밀성이 요구되는데, 수용공간(20a)의 기밀성을 유지하도록 하기 위하여 밀봉수단(70)을 마련한다.The sealing means 70 is capable of sealing the accommodating space 20a from the outside when the cover 30 closes the housing 20. That is, in order to raise or lower the temperature inside the accommodation space 20a by the high temperature air, the low temperature air or the coolant, the airtightness is required. In order to maintain the airtightness of the accommodation space 20a, .
이러한 밀봉수단(70)은, 제1패커(71), 제2패커(72) 및 진공수단(73)을 포함한다.This sealing means 70 includes a first packer 71, a second packer 72 and a vacuum means 73.
상기 제1패커(71)는 상기 커버(30)와 마주보는 하우징(20) 상면에 배치되고 상기 수용공간(20a)을 둘러싸도록 구성된다. 이러한 제1패커(71)는 고무소재로 이루어질 수 있으며, 상기 하우징(20) 상면의 제1수용홈(211)에 끼워져 있게 된다. 이러한 제1패커(71)는 하우징(20)의 상면에 안착된 상태에서 커버(30)의 하면에 기밀성이 있게 접촉되게 된다. 상기 제1패커(71)가 제1수용공간(20a)을 둘러싸도록 배치하고 있으므로 제1수용공간(20a) 내부의 공기 또는 냉매가 커버(30)와 하우징(20)의 틈새를 통하여 외부로 유출되는 것이 억제된다.The first packer 71 is disposed on the upper surface of the housing 20 facing the cover 30 and is configured to surround the accommodation space 20a. The first packer 71 may be made of a rubber material and fit into the first receiving groove 211 on the upper surface of the housing 20. The first packer 71 is hermetically contacted with the lower surface of the cover 30 while being seated on the upper surface of the housing 20. Since the first packer 71 is disposed so as to surround the first accommodating space 20a, air or refrigerant in the first accommodating space 20a flows out through the gap between the cover 30 and the housing 20 .
상기 제2패커(72)는, 상기 제1패커(71)와 이격되며 상기 제1패커(71)를 둘러싸도록 상기 하우징(20) 상면에 배치된다. 이러한 제2패커(72)는 고무소재로 이루어질 수 있으며, 상기 하우징(20) 상면의 제2수용홈(212)에 끼워져 있게 된다. 이러한 제2패커(72)는 제1패커(71)를 둘러싸도록 상기 제1패커(71)보다 크게 되어 있게 된다. 상기 제2패커(72)는 하우징(20)의 상면에 안착된 상태에서 상기 커버(30)의 하면에 기밀성이 있게 접촉된다. 상기 제2패커(72)가 제1패커(71)를 둘러싸도록 배치되어 있으므로 제1패커(71)를 통해 유출된 공기 또는 냉매가 외부로 유출되는 것을 확실하게 방지할 수 있게 된다.The second packer 72 is spaced from the first packer 71 and disposed on the upper surface of the housing 20 so as to surround the first packer 71. The second packer 72 may be made of a rubber material and fit into the second receiving groove 212 on the upper surface of the housing 20. The second packer 72 is larger than the first packer 71 so as to surround the first packer 71. The second packer 72 is hermetically contacted with the lower surface of the cover 30 while being seated on the upper surface of the housing 20. Since the second packer 72 is disposed so as to surround the first packer 71, it is possible to reliably prevent the air or the refrigerant flowing out through the first packer 71 from flowing out to the outside.
상기 진공수단(73)은, 제1패커(71)와 제2패커(72) 사이를 진공상태가 되도록 하는 것이다. 구체적으로 진공수단(73)은 제1패커(71)와 제2패커(72) 사이의 공기를 연결홀(732)을 통하여 별도의 흡입수단을 통하여 외부로 배출함으로서 제1패커(71)와 제2패커(72) 사이에 마련된 밀봉공간(731)이 진공상태에 놓이도록 할 수 있다.The vacuum means 73 allows the first packer 71 and the second packer 72 to be in a vacuum state. Specifically, the vacuum means 73 discharges air between the first packer 71 and the second packer 72 to the outside through a connection hole 732 through a separate suction means, 2 packers 72 can be placed in a vacuum state.
커버(30)를 닫아 밀폐한 상태에 외부에서 밀봉공간(731) 내부의 공기를 빨아들이게 되면 커버(30)와 하우징(20) 간에 밀착도가 높아져 제1패커(71) 및 제2패커(72)사이로 미세하게 빠져나가는 공기들마저 차단할 수 있기 때문에 열손실을 막아 테스트룸 내부의 열제어 속도가 향상되고 시간이 단축될 수 있게 된다.If the air inside the sealing space 731 is sucked from the outside in a state where the cover 30 is closed to close the first and second packers 71 and 72, This allows heat to escape from the air escaping through the air to improve heat control speed and time in the test room.
이러한 진공수단(73)은, 밀봉공간(731), 연결홀(732) 및 흡입수단(미도시)으로 구성된다. This vacuum means 73 is composed of a sealing space 731, a connection hole 732 and a suction means (not shown).
상기 밀봉공간(731)은, 제1패커(71)와 제2패커(72) 사이에 배치되고, 상기 제1패커(71)를 둘러싸도록 하우징(20)의 상면을 오목하게 함입하여 형성된 것이다.The sealing space 731 is disposed between the first packer 71 and the second packer 72 and is formed by recessing the upper surface of the housing 20 so as to surround the first packer 71.
상기 연결홀(732)은 상기 밀봉공간(731)과 외부를 연통시키는 것으로서 하우징(20)을 관통하여 형성된다. 이러한 연결홀(732)은 밀봉공간(731) 내부의 공기가 흐르는 통로의 기능을 수행하게 되는 것이다.The connection hole 732 is formed to penetrate the housing 20 through the sealing space 731 and the outside. The connection hole 732 functions as a passage through which the air in the sealing space 731 flows.
상기 흡입수단은, 연결홀(732)을 통하여 제1패커(71)와 제2패커(72) 사이의 공기를 흡입하는 것으로서, 흡입수단이 공기를 흡입함으로서 제1패커(71)와 제2패커(72) 사이가 진공 상태로 되게 한다.The suction means sucks air between the first packer 71 and the second packer 72 through the connection hole 732. The suction means sucks air so that the first packer 71 and the second packer 72, (72) to be in a vacuum state.
한편, 상기 진공수단(73)은 상기 커버(30)의 하면을 하우징(20)의 상면에 균일하게 밀착시키는 기능도 수행하게 된다. 커버(30)가 닫힌 상태에서, 푸셔장치(40)가 피검사 디바이스(81)를 가압할 때 커버(30)와 하우징(20)의 연결부분(힌지부분)에 존재하는 미세한 유격때문에 푸셔장치(40)가 피검사 디바이스(81)를 미는 힘의 반작용으로 힌지 근처의 커버(30)가 약간 들려서 푸셔장치(40)가 반도체 디바이스를 균일하게 누를수 없는 경우가 있을 수 있으나, 진공수단(73)에 의하여 밀봉공간(731) 내부의 공기를 배출하게 되어 커버(30)를 하우징(20)에 균일하게 밀착시키게 되면 힌지 부분이 고정되고 유격이 발생하지 않아 푸셔장치(40)가 피검사 디바이스(81)를 균일하게 눌러 줄 수 있다는 장점이 있게 된다.Meanwhile, the vacuum means 73 also functions to uniformly adhere the lower surface of the cover 30 to the upper surface of the housing 20. When the pusher device 40 presses the device under test 81 in a state in which the cover 30 is closed, due to the minute clearance existing in the connecting portion (hinge portion) of the cover 30 and the housing 20, 40 may not be able to uniformly press the semiconductor device because the cover 30 near the hinge is slightly moved due to the reaction of the pushing force of the pushing device 81, When the cover 30 is uniformly brought into close contact with the housing 20, the hinge portion is fixed and the clearance is not generated, so that the pusher device 40 is moved to the inspected device 81 ) Can be uniformly pressed.
본 발명에서 도면부호 82, 90은 각각 인서트(82) 및 전동수단(90)을 지칭한다.In the present invention, reference numerals 82 and 90 denote inserts 82 and transmission means 90, respectively.
상기 인서트(82)는, 상기 하우징(20)의 수용공간(20a) 내에 삽입되어 외부에서 검사를 위하여 운반되어 오는 피검사 디바이스(81)를 가이드하는 기능을 수행한다. 즉, 수용공간(20a)은 다양한 형태의 피검사 디바이스(81)를 수용할 수 있도록 다소 큰 크기를 가지게 되는데, 이러한 수용공간(20a) 내에서 피검사 디바이스(81)가 정확한 위치에 안착되어 전기적 검사가 수행될 수 있도록 상기 피검사 디바이스(81)를 가이드 하게 되는 것이다. 이러한 인서트(82)는 수용공간(20a) 내에 삽입되어 하우징(20) 내부에 안착되는 구성으로서 사각 프레임 형상을 가지게 된다. 상기 인서트(82)의 중앙구멍의 크기를 변경함으로서 다양한 형태의 피검사 디바이스(81)에 대한 가이드를 용이하게 실시할 수 있게 된다.The insert 82 is inserted into the accommodation space 20a of the housing 20 and guides the inspected device 81 carried from the outside for inspection. That is, the accommodating space 20a has a somewhat large size to accommodate various types of inspected devices 81. In this accommodating space 20a, the device under test 81 is seated at the correct position, Thereby guiding the device under test 81 so that the inspection can be performed. These inserts 82 have a square frame shape as a structure inserted into the housing space 20a and seated inside the housing 20. [ By changing the size of the center hole of the insert 82, it is possible to easily guide various types of devices to be inspected 81.
상기 전동수단(90)은, 하우징(20)에 힌지식으로 연결된 커버(30)를 자동으로 개폐가능하게 하는 것이다. 이러한 전동수단(90)은, 모터(91)와, 동력전달체(92)로 이루어지고, 상기 모터(91)의 회전력을 동력전달체(92)가 힌지핀(222)에 전달함으로서 커버(30)가 자동적으로 회전할 수 있게 한다. 즉, 모터(91)가 일방향으로 회전하면 연동하여 커버(30)가 하우징(20)의 상부를 오픈시키고, 모터(91)가 타방향으로 회전하면 이에 연동하여 커버(30)가 하우징(20)의 상부를 폐쇄할 수 있도록 구성된다.The transmission means (90) automatically opens and closes the cover (30) hingedly connected to the housing (20). This transmission means 90 includes a motor 91 and a power transmission body 92 and transmits the rotational force of the motor 91 to the hinge pin 222 of the power transmission body 92 so that the cover 30 So that it can rotate automatically. That is, when the motor 91 rotates in one direction, the cover 30 opens the upper portion of the housing 20, and when the motor 91 rotates in the other direction, the cover 30 interlocks with the housing 20, As shown in Fig.
이러한 본 발명에 따른 검사용 소켓(10)은 다음과 같은 작용효과를 가지게 된다.The test socket 10 according to the present invention has the following actions and effects.
먼저, 도 8에 도시된 바와 같이, 커버(30)를 오픈시킨 상태에서 외부에서 운반되어 오는 피검사 디바이스(81)를 하우징(20)의 수용공간(20a) 내에 삽입시킨다. 이때 피검사 디바이스(81)의 하면이 검사장치에 전기적으로 접속되도록 한다. 이후 커버(30)를 회동시켜 하우징(20)의 상면을 폐쇄한 후에, 푸셔장치(40)를 동작시킨다. 이때 푸셔장치(40)는 실린더 로드(42)를 하강시킴으로서 도 12에 도시된 바와 같이 가압판(43)의 하면이 상기 피검사 디바이스(81)의 상면에 접촉하게 하고 이후에 추가적으로 가압판(43)을 하강시키는 것에 의하여 피검사 디바이스(81)가 검사용 커넥터(82)에 확실하게 접촉되도록 한다.First, as shown in Fig. 8, the device to be inspected 81 carried from the outside is inserted into the accommodating space 20a of the housing 20 with the cover 30 opened. At this time, the lower surface of the device 81 to be inspected is electrically connected to the inspection apparatus. Thereafter, the cover 30 is rotated to close the upper surface of the housing 20, and then the pusher device 40 is operated. At this time, the pusher device 40 causes the lower surface of the pressure plate 43 to contact the upper surface of the device under test 81 as shown in FIG. 12 by lowering the cylinder rod 42, So that the inspected device 81 is brought into contact with the inspection connector 82 securely.
이후에, 전기적 검사를 위해서 온도조절수단(50)로부터 고온, 저온의 공기 또는 냉매를 수용공간(20a) 내로 유입시키면 수용공간(20a) 내부가 신속하게 원하는 온도의 환경조건으로 변경된다. 이와 같이 수용공간(20a) 내부가 고온 또는 저온의 특정한 온도 환경에 놓인 상태에서 소정의 전기적 검사를 수행하게 된다. 검사가 진행되는 동안, 수용공간(20a) 내부에 고온, 저온의 공기 또는 냉매가 지속적으로 주입되고 동시에 공기배출구(60)를 통해 공기 또는 냉매가 배출되면서 수용공간 내부의 온도가 최고/최저 상태가 유지될 수 있다. Thereafter, when hot or cold air or coolant is introduced into the containing space 20a from the temperature regulating means 50 for electrical inspection, the inside of the containing space 20a is quickly changed to the environmental condition of the desired temperature. In this way, the inside of the accommodation space 20a is subjected to a predetermined electrical inspection in a specific temperature environment of high temperature or low temperature. During the inspection, high temperature, low temperature air or refrigerant is continuously injected into the accommodation space 20a, and at the same time, air or refrigerant is discharged through the air outlet 60, Can be maintained.
이때, 진공수단(73)을 작동시켜 제1패커(71)와 제2패커(72) 사이에 존재하는 공기를 외부로 배출하게 되는 경우에는 제1패커(71)와 제2패커(72) 사이가 진공상태가 된다. 이와 같이 제1패커(71)와 제2패커(72) 사이가 진공상태가 되는 경우에는 열매체로 작용하는 공기가 제거됨으로서 열손실을 막아서 하우징(20)의 수용공간(20a) 내부의 열제어 속도가 향상되고 시간이 단축된다. 또한, 밀봉공간(731) 내에 공기가 외부로 배출되면서 커버(30)가 하우징(20)에 확실하게 접촉되면서 커버(30)에 고정된 푸셔장치(40)가 피검사 디바이스(81)를 검사장치 측으로 균일한 힘으로 가압할 수 있게 된다.At this time, when the air existing between the first packer 71 and the second packer 72 is discharged to the outside by operating the vacuum means 73, the air between the first packer 71 and the second packer 72 Is in a vacuum state. When the first packer 71 and the second packer 72 are in a vacuum state, the air serving as the heat medium is removed, thereby preventing the heat loss. Thus, the heat control speed in the housing space 20a of the housing 20 And time is shortened. The pusher device 40 fixed to the cover 30 while the cover 30 is reliably in contact with the housing 20 while the air is discharged to the outside in the sealing space 731, So that it can be pressed with a uniform force.
한편, 검사가 완료된 후에는 공기배출부(60)를 통하여 수용공간(20a) 내부의 공기 또는 냉매를 외부로 배출시킨 후에 푸셔장치(40)를 동작시켜 가압판(43)을 상기 피검사 디바이스(81)로부터 이격시킨다. 이후에 커버(30)를 회동시켜 하우징(20)의 상부가 오픈된 후에는 검사가 완료된 피검사 디바이스(81)를 외부로 이동시키게 된다. 한편, 추가적인 시험이 필요한 경우에는 새로운 피검사 디바이스(81)를 운반하면서 상술한 동작을 반복하게 된다.After the inspecting is completed, air or refrigerant in the accommodating space 20a is discharged to the outside through the air discharging portion 60, and then the pusher device 40 is operated to move the pressure plate 43 to the inspected device 81 . After the cover 30 is rotated to open the upper portion of the housing 20, the inspected device 81 that has been inspected is moved to the outside. On the other hand, when the additional test is required, the above-described operation is repeated while carrying the new inspected device 81.
이러한 본 발명에 따른 검사용 소켓(10)은, 피검사 디바이스(81)를 고온 또는 저온의 특정한 온도 환경하에서 검사가 이루어지도록 하기 위하여 피검사 디바이스(81)가 수용되는 수용공간(20a)에 고온, 저온의 공기 또는 냉매를 유입시키는 것에 의하여 검사시간을 최소화할 수 있다. 종래기술의 경우 푸셔장치(40)의 가압판을 가열 또는 냉각시킨 후에, 상기 가압판의 열이 피검사 디바이스(81)로 전달되게 하는 간접적인 열전달을 통하여 검사를 수행하게 되는데, 이러한 종래기술은 열손실의 문제점 및 검사시간이 장시간 소요되는 문제점이 있으나, 본 발명은 이러한 문제점을 해결한다.The inspecting socket 81 according to the present invention is used for inspecting the inspecting device 81 under a specific temperature environment of a high temperature or a low temperature in a housing space 20a in which the inspecting device 81 is accommodated, , The inspection time can be minimized by introducing low temperature air or refrigerant. In the prior art, after the pressure plate of the pusher device 40 is heated or cooled, the inspection is performed through indirect heat transfer, which causes the heat of the pressure plate to be transmitted to the device under test 81. This prior art technique, And the inspection time takes a long time. However, the present invention solves this problem.
특히 본 발명에 따른 검사용 소켓(10)은 내열 및 내한을 버티는 플라스틱 재질로 이루어진 하우징(20)으로 적은 공기 및 냉매를 사용하여 원하는 소정 온도에 도달하는 시간 및 변환 시간 단축을 통해 기존 대비 에너지 효율 및 검사 전환 시간에 대한 절감 효과를 가지고 있다.In particular, the inspecting socket 10 according to the present invention is a housing 20 made of a plastic material which is resistant to heat and cold, and uses less air and refrigerant to reduce the time required to reach a desired temperature, And inspection switching time.
또한, 본 발명에 따른 검사용 소켓(10)은, 소정 온도의 공기 또는 냉매를 수용공간(20a) 내에 유입시키는 방식을 취하고 있기 때문에 이 과정에서 수용공간(20a) 내부의 공기 또는 냉매가 외부로 유출되지 않도록 하여 열손실을 방지하기 위하여 밀봉수단(70)이 하우징(20)에 배치되어 있는데, 이로 인하여 신속하게 확실한 전기적 검사가 가능하게 한다.Since the inspection socket 10 according to the present invention takes in air or refrigerant at a predetermined temperature into the accommodation space 20a, the air or the refrigerant inside the accommodation space 20a is discharged to the outside The sealing means 70 is disposed in the housing 20 in order to prevent the leakage of heat and to prevent the heat loss.
또한, 종래 기술의 검사용 소켓(10)은, 푸셔장치(40)에 가압판을 가열시키기 위한 별도의 구성품이 존재해야 되기 때문에 푸셔장치(40)의 구조가 복잡하다는 문제점이 있었다. 그러나 본 발명에서는 기존에 존재하는 수용공간(20a)을 그대로 활용하면서 하우징(20)의 일측에서 공기가 유입되도록 하는 간단한 구조를 부가함으로서 피검사 디바이스(81)에 대한 전기적 검사를 수행한다. 이에 따라 본 발명은 전체적인 장치의 구조를 간단하게 할 수 있는 장점이 있으며, 구조가 간단하기 때문에 유지보수가 용이하다는 장점도 더불어 가지게 된다.In addition, the inspection socket 10 of the prior art has a problem in that the structure of the pusher device 40 is complicated because the pusher device 40 must have a separate component for heating the pressure plate. However, in the present invention, the electrical inspection of the device under test 81 is performed by adding a simple structure that allows the air to flow from one side of the housing 20 while utilizing the existing accommodating space 20a as it is. Accordingly, the present invention has the advantage of simplifying the overall structure of the apparatus, and also has an advantage of being easy to maintain because of its simple structure.
또한, 본 발명은 하우징(20)과 커버(30) 사이에 한 쌍의 서로 이격된 제1패커(71) 및 제2패커(72)를 형성함으로서 기밀성을 보다 확실하게 할 수 있다. 또한, 제1패커(71)와 제2패커(72) 사이를 진공상태로 만들어 놓음으로서 단열성능을 보다 향상시킬 수 있어서 열제어 속도 및 시간을 단축할 수 있다. 즉, 종래기술의 열 제어수단(TCU; Temperature control unit)를 사용하는 경우에는 140도의 온도에 도달하기 위해서 40분 정도 소요되고, -40도의 온도에 도달하기 위해서는 1시간 ~ 1시간 30분 정도 소요되는데 반해서, 본 발명의 경우에는 140도의 온도에 도달하기 위해서 1분 정도 시간이 소요되고, -40도의 온도에 도달하기 위해서는 2분 정도 시간이 소요되어 열제어 속도를 현저하게 빠르게 할 수 있는 장점이 있게 된다.In addition, the present invention can further ensure airtightness by forming a pair of the first packer 71 and the second packer 72 spaced apart from each other between the housing 20 and the cover 30. In addition, by making the space between the first packer 71 and the second packer 72 vacuum, the heat insulating performance can be further improved, and the heat control speed and time can be shortened. That is, in the case of using a conventional TCU (Temperature Control Unit), it takes about 40 minutes to reach a temperature of 140 degrees, and it takes about 1 hour to 1 hour and 30 minutes to reach a temperature of -40 degrees In contrast, in the case of the present invention, it takes about one minute to reach a temperature of 140 degrees, and it takes a time of about two minutes to reach a temperature of -40 degrees, .
이러한 본 발명에 따른 검사용 소켓은 위의 내용에 한정되는 것은 아니며 다음과 같이 변형되는 것도 가능하다.The socket for inspection according to the present invention is not limited to the above contents, but may be modified as follows.
먼저, 상술한 실시예에서는 커버의 회동이 전동수단에 의하여 자동적으로 이루어지게 하는 것을 설명하고 있으나, 이에 한정되는 것은 아니며 수동에 의하여 사용자가 직접 커버를 열고 닫도록 구성하는 것도 가능하다.First, in the above-described embodiment, the rotation of the cover is automatically performed by the driving means. However, the present invention is not limited to this, and the cover may be opened and closed manually by a user.
또한, 상술한 실시예에서는 하우징의 상부에만 밀봉수단을 설치하는 것을 예시하고 있으나, 이에 한정되는 것은 아니며 하우징의 하면과 검사장치의 상면 사이를 통하여 공기 또는 냉매가 외부로 빠져나가는 것을 방지하기 위하여 하우징의 하면과 검사장치의 상면 사이에 패커를 더 추가하는 것도 가능함은 물론이다.In addition, in the above-described embodiment, the sealing means is provided only on the upper portion of the housing. However, the present invention is not limited to this, and in order to prevent air or refrigerant from escaping through the space between the lower surface of the housing and the upper surface of the testing apparatus, It is also possible to add a packer between the lower surface of the inspection apparatus and the upper surface of the inspection apparatus.
또한, 밀봉수단은 위에 한정되는 것은 아니며 필요에 따라서 밀봉이 더 필요한 것에 추가로 설치하는 것도 가능한 것은 물론이다.Further, it is needless to say that the sealing means is not limited to the above, and it is of course possible to additionally provide the sealing means in addition to the need for sealing.
이상에서 다양한 실시예를 들어 본 발명의 검사용 소켓을 설명하였으나, 이에 한정되는 것은 아니며 본 발명의 권리범위로부터 합리적으로 해석될 수 있는 것이라면 무엇이나 본 발명의 권리범위에 속하는 것은 당연하다.While the present invention has been described with reference to the exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

Claims (15)

  1. 전기적 검사가 요구되는 피검사 디바이스가 수용될 수 있는 수용공간이 마련되고, 상부가 개방되어 있는 하우징;A housing provided with a housing space in which a device to be inspected requiring electrical inspection can be housed, and an upper portion of which is opened;
    상기 하우징의 개방된 상부를 개폐할 수 있는 커버;A cover capable of opening and closing an open top of the housing;
    상기 커버에 마련되며, 상기 하우징에 안착된 피검사 디바이스를 하측으로 가압하기 위한 푸셔장치;A pusher device which is provided on the cover and presses the device under test placed on the housing downward;
    상기 수용공간 내로 소정온도의 공기 또는 냉매를 주입함으로서 수용공간 내의 온도를 조절하는 온도조절수단; 및Temperature adjusting means for adjusting the temperature in the accommodating space by injecting air or a coolant at a predetermined temperature into the accommodating space; And
    상기 커버가 상기 하우징을 폐쇄하였을 때 상기 수용공간을 외부로부터 밀봉시킬 수 있는 밀봉수단을 포함하되,And sealing means for sealing the accommodation space from the outside when the cover closes the housing,
    상기 밀봉수단은, 상기 커버와 마주보는 하우징 상면에 배치되고 상기 수용공간을 둘러싸는 제1패커와, 상기 제1패커와 이격되며 상기 제1패커를 둘러싸도록 상기 하우징 상면에 배치되는 제2패커와, 상기 제1패커와 제2패커 사이를 진공상태가 되도록 하는 진공수단을 포함하는 것을 특징으로 하는 검사용 소켓.The sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And a vacuum means for bringing the vacuum between the first packer and the second packer.
  2. 제1항에 있어서,The method according to claim 1,
    상기 제1패커는, 상기 하우징의 상면에 안착된 상태에서, 상기 커버의 하면에 기밀성이 있게 접촉되는 것을 특징으로 하는 검사용 소켓.Wherein the first packer is hermetically contacted with the lower surface of the cover while being seated on the upper surface of the housing.
  3. 제1항에 있어서,The method according to claim 1,
    상기 제2패커는, 상기 하우징의 상면에 안착된 상태에서, 상기 커버에 기밀성이 있게 접촉되는 것을 특징으로 하는 검사용 소켓.Wherein the second packer is hermetically contacted to the cover while being seated on the upper surface of the housing.
  4. 제1항에 있어서,The method according to claim 1,
    상기 진공수단은, 상기 제1패커와 상기 제2패커 사이의 공기를 외부로 배출하는 것을 특징으로 하는 검사용 소켓.Wherein the vacuum means discharges the air between the first packer and the second packer to the outside.
  5. 제4항에 있어서,5. The method of claim 4,
    상기 진공수단은,Wherein the vacuum means comprises:
    상기 제1패커와 상기 제2패커 사이에 배치되는 밀봉공간;A sealing space disposed between the first packer and the second packer;
    상기 밀봉공간과 외부를 연통시키도록 상기 하우징을 관통하는 연결홀; 및A connection hole passing through the housing to communicate with the outside of the sealing space; And
    상기 연결홀을 통하여 제1패커와 제2패커 사이의 공기를 흡입하는 흡입수단을 포함하는 것을 특징으로 하는 검사용 소켓.And suction means for sucking air between the first packer and the second packer through the connection hole.
  6. 제5항에 있어서,6. The method of claim 5,
    상기 밀봉공간은, 상기 제1패커를 둘러싸면서 하우징의 상면을 오목하게 함입하여 형성된 것을 특징으로 하는 검사용 소켓.Wherein the sealing space is formed by recessing the upper surface of the housing while surrounding the first packer.
  7. 제4항에 있어서,5. The method of claim 4,
    상기 진공수단은, 상기 커버의 하면을 하우징의 상면에 균일하게 밀착시키는 것을 특징으로 하는 검사용 소켓.Wherein the vacuum means uniformly adheres the lower surface of the cover to the upper surface of the housing uniformly.
  8. 제1항에 있어서,The method according to claim 1,
    상기 온도조절수단은,Wherein the temperature adjusting means comprises:
    고온의 공기를 상기 수용공간 내부로 공급하는 제1공기주입부와,A first air injection unit for supplying high-temperature air into the accommodation space;
    저온의 공기 또는 냉매를 상기 수용공간 내로 공급하는 제2공기주입부를 포함하는 것을 특징으로 하는 검사용 소켓.And a second air injection unit for supplying low-temperature air or refrigerant into the accommodation space.
  9. 제1항에 있어서,The method according to claim 1,
    상기 온도조절수단은, 상기 하우징의 측면에 설치되는 것을 특징으로 하는 검사용 소켓.Wherein the temperature adjusting means is provided on a side surface of the housing.
  10. 제1항에 있어서,The method according to claim 1,
    상기 커버는 상기 하우징에 대해서 힌지식으로 연결되며 전동수단에 의하여 자동으로 개폐되는 것을 특징으로 하는 검사용 소켓.Wherein the cover is hingedly connected to the housing and is automatically opened and closed by a transmission means.
  11. 제1항에 있어서,The method according to claim 1,
    상기 커버는 상기 하우징에 대해서 힌지식으로 연결되어 수동으로 개폐되는 것을 특징으로 하는 검사용 소켓.Wherein the cover is hingedly connected to the housing and manually opened and closed.
  12. 전기적 검사가 요구되는 피검사 디바이스가 수용될 수 있는 수용공간이 마련되고, 상부가 개방되어 있는 하우징;A housing provided with a housing space in which a device to be inspected requiring electrical inspection can be housed, and an upper portion of which is opened;
    상기 하우징의 개방된 상부를 개폐할 수 있는 커버;A cover capable of opening and closing an open top of the housing;
    상기 수용공간 내로 소정온도의 공기 또는 냉매를 주입함으로서 수용공간 내의 온도를 조절하는 온도조절수단; 및Temperature adjusting means for adjusting the temperature in the accommodating space by injecting air or a coolant at a predetermined temperature into the accommodating space; And
    상기 커버가 상기 하우징을 폐쇄하였을 때 상기 수용공간을 외부로부터 밀봉시킬 수 있는 밀봉수단을 포함하되,And sealing means for sealing the accommodation space from the outside when the cover closes the housing,
    상기 밀봉수단은, 상기 커버와 마주보는 하우징 상면에 배치되고 상기 수용공간을 둘러싸는 제1패커와, 상기 제1패커와 이격되며 상기 제1패커를 둘러싸도록 상기 하우징 상면에 배치되는 제2패커와, 상기 제1패커와 제2패커 사이의 공기를 외부로 배출하여 하우징의 수용공간을 외부에 대하여 단열시키는 진공수단을 포함하는 것을 특징으로 하는 검사용 소켓.The sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And a vacuum means for discharging air between the first packer and the second packer to the outside to insulate the accommodation space of the housing from the outside.
  13. 제12항에 있어서,13. The method of claim 12,
    상기 커버에 마련되어 상기 커버의 하면에서 출몰하면서 수용공간 내에 배치된 피검사 디바이스를 하측으로 가압시킬 수 있는 푸셔장치를 포함하는 것을 특징으로 하는 검사용 소켓.And a pusher device provided on the cover, the pusher device being capable of pushing down the device to be inspected disposed in the accommodating space while protruding and retracting from the lower surface of the cover.
  14. 제13항에 있어서,14. The method of claim 13,
    상기 진공수단은 상기 커버를 상기 하우징에 유격없이 밀착시키는 것을 특징으로 하는 검사용 소켓.And the vacuum means makes the cover closely contact with the housing without clearance.
  15. 전기적 검사가 요구되는 피검사 디바이스가 수용될 수 있는 수용공간이 마련되고, 상부가 개방되어 있는 하우징;A housing provided with a housing space in which a device to be inspected requiring electrical inspection can be housed, and an upper portion of which is opened;
    상기 하우징의 개방된 상부를 개폐할 수 있는 커버;A cover capable of opening and closing an open top of the housing;
    상기 커버에 마련되며, 상기 하우징에 안착된 피검사 디바이스를 하측으로 가압하기 위한 푸셔장치; 및A pusher device which is provided on the cover and presses the device under test placed on the housing downward; And
    상기 커버가 상기 하우징을 폐쇄하였을 때 상기 수용공간을 외부로부터 밀봉시킬 수 있는 밀봉수단을 포함하되,And sealing means for sealing the accommodation space from the outside when the cover closes the housing,
    상기 밀봉수단은, 상기 커버와 마주보는 하우징 상면에 배치되고 상기 수용공간을 둘러싸는 제1패커와, 상기 제1패커와 이격되며 상기 제1패커를 둘러싸도록 상기 하우징 상면에 배치되는 제2패커와, 상기 제1패커와 제2패커 사이를 진공상태가 되도록 하는 진공수단을 포함하는 것을 특징으로 하는 검사용 소켓.The sealing means includes a first packer disposed on the upper surface of the housing facing the cover and surrounding the accommodation space, a second packer spaced apart from the first packer and disposed on the upper surface of the housing to surround the first packer, And a vacuum means for bringing the vacuum between the first packer and the second packer.
PCT/KR2019/001212 2018-01-29 2019-01-29 Test socket WO2019147100A1 (en)

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KR102171511B1 (en) * 2019-08-27 2020-10-29 주식회사 엘비엘 Socket for semiconductor chip test
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KR100864432B1 (en) * 2007-05-03 2008-10-20 미래산업 주식회사 Chamber for semiconductor temperature control and method of manufacturing semiconductor using the same
KR20110137558A (en) * 2010-06-17 2011-12-23 이재학 Test socket for semiconductor package
KR20140037394A (en) * 2012-09-17 2014-03-27 삼성전자주식회사 Test handler for realizing rapid temperature transition and semiconductor device test method using the same
JP2016095141A (en) * 2014-11-12 2016-05-26 合同会社Pleson Inspection unit for semiconductor device
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KR100864432B1 (en) * 2007-05-03 2008-10-20 미래산업 주식회사 Chamber for semiconductor temperature control and method of manufacturing semiconductor using the same
KR20110137558A (en) * 2010-06-17 2011-12-23 이재학 Test socket for semiconductor package
KR20140037394A (en) * 2012-09-17 2014-03-27 삼성전자주식회사 Test handler for realizing rapid temperature transition and semiconductor device test method using the same
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KR101671152B1 (en) * 2016-08-18 2016-11-01 주식회사 사트 Memory module temperature testing equipment

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