WO2019146639A1

WO2019146639A1 - Method and device for manufacturing ceramic-metal joined body, and ceramic-metal joined body

Info

Publication number: WO2019146639A1
Application number: PCT/JP2019/002075
Authority: WO
Inventors: 丈嗣北原; 長友　義幸
Original assignee: 三菱マテリアル株式会社
Priority date: 2018-01-24
Filing date: 2019-01-23
Publication date: 2019-08-01
Also published as: JP7020137B2; TW201942092A; JP2019127408A

Abstract

The present invention has: a joining step for clamping, by a pair of pressure plates, a laminate in which metal plates composed of copper or a copper alloy are laminated on surfaces of a ceramic base with a Cu-P-based brazing material interposed therebetween, applying heat, and thereby joining the metal plates to both surfaces of the ceramic base and forming metal layers; and an etching step for etching the laminate along scribe lines and separating the metal layers into regions surrounded by the scribe lines. A plurality of relief surfaces that have a prescribed width and are set apart from the surface of the laminate are provided on a pressing surface of the pressure plates, at positions that are located along two sides forming one corner of the pressure plate and that do not come immediately above the scribe lines when the laminate is clamped. During the joining step, a brazing material reservoir space is formed between the surface of the laminate and the plurality of relief surfaces. There are thereby provided a method and device for manufacturing a ceramic-metal joined body, and a ceramic-metal joined body, with which it is possible to inhibit a brazing material from hardening immediately above scribe lines of a laminate.

Description

Method of manufacturing ceramic-metal joint, manufacturing apparatus and ceramic-metal joint

The present invention relates to a method of manufacturing a ceramic-metal joint body in which a metal layer made of copper or copper alloy is joined to the surface of a ceramic base material, a manufacturing apparatus, and ceramics forming a plurality of ceramic circuit boards by singulation. It relates to a metal joined body. Priority is claimed on Japanese Patent Application No. 2018-009276, filed Jan. 24, 2018, the contents of which are incorporated herein by reference.

Heretofore, it has been proposed to use a ceramic circuit board as a wiring board for a thermoelectric element or an LED element, in which a ceramic-metal joined body in which a metal layer is joined to the surface of a ceramic plate is separated. In this ceramic-metal bonded body, bonding between the ceramic plate and the metal plate constituting the metal layer is performed using a brazing material.

For example, a laminate of a ceramic plate and a metal plate is sandwiched between a pair of pressure plates, and heating is performed while pressing in the stacking direction between the pressure plates. The surplus portion of the brazing material melted by heating is pushed out from between the laminated ceramic substrate and the metal plate, adheres to the end face etc., and is solidified in a convex shape protruding in the surface direction and the lamination direction of the laminate, It forms a so-called fistula. The laminated body joined by such a brazing material is positioned on the positioning jig when forming the mask for etching, but if the bumps are formed, the laminated body can not be accurately positioned.

As a technique for suppressing the formation of bumps on the end face of such a laminate, for example, a method for manufacturing a power module substrate described in Patent Document 1 is known. In this manufacturing method, in the bonding step of heating the laminate between the pair of pressure plates and brazing the metal plate to the surface of the ceramic substrate, at least one surface of the pair of processed plates sandwiching the laminate is one A relief surface having a predetermined width spaced apart from the surface of the laminate along the two sides forming the corner is provided to form a brazing reservoir space between the surface and the relief surface of the laminate, and the molten brazing filler metal is accumulated. The flow into the space prevents the formation of bumps on the end face of the laminate.

When joining a ceramic substrate and a metal plate using a brazing material as described in Patent Document 2 and dividing it into pieces, a scribe line is provided in advance on the ceramic substrate, and the metal plate is brazed to the ceramic substrate. After etching, etch.

JP, 2011-29320, A JP, 2015-185606, A

In the method of manufacturing a power module described in Patent Document 1, a pair of laminates in which a metal plate is disposed on the surface of a ceramic substrate on which a scribe line is formed via a brazing material is provided with a relief surface on the periphery thereof. When held and heated by the pressure plate, the brazing material flowing out to the outside of the laminate flows into the wax accumulation space formed between the metal plate and the pressure plate and solidifies.

In this case, if copper or a copper alloy is used as the metal layer and a Cu—P-based brazing material is used as the brazing material, the etching rate of the brazing material is lower than the etching rate of the copper or copper alloy metal layer, The brazing material has a slow etching rate, and even if the metal layers are etched and separated individually, the brazing material is likely to remain in the brazing space without being etched. If the brazing material remaining in the brazing material space is disposed directly above the scribe line, it is difficult to divide the ceramic substrate at the scribe line.

The present invention has been made in view of such circumstances, and it is a ceramic-metal that can suppress the solidification of the solder right above the scribe line of the laminate including the ceramic base material and the metal layer in which the scribe line is formed. It is an object of the present invention to provide a method of manufacturing a bonded body, a manufacturing apparatus, and a ceramic-metal bonded body.

In the method for producing a ceramic-metal bonded body according to the present invention, a metal plate made of copper or copper alloy on the surface of a ceramic base material having one or more scribe lines for dividing into a plurality of ceramic substrates is a Cu—P brazing material Joining the metal plate to the surface of the ceramic base material to form a metal layer by sandwiching and heating a laminate formed by laminating through a pair of pressure plates; and the laminate Etching the metal layer along the scribe line to separate the metal layer into regions surrounded by the scribe line, and separating the metal layer from the surface of the laminate on the pressure surface of the pressure plate. A relief surface having a predetermined width is disposed along two sides forming one corner of the pressure plate, and when the laminated body is held, the position just above the scribe line is avoided. And provided with a plurality, in the bonding step, forming a plurality of wax reservoir space between said surface and a plurality of the relief surface of the laminate.

In the present invention, each of the escape surfaces is provided so as not to be directly above the scribe line, that is, since no escape surface is formed in the region where the scribe line is formed, it will be directly above the scribe line. No accumulation space is formed. Therefore, since the molten wax in the bonding step solidifies in the braze pool space along the side of the laminate and avoiding directly above the scribe line, it prevents the formation of bumps on the side of the laminate, It is possible to suppress the solidification of the solder right above the scribe line, and the laminate can be appropriately singulated.

In the apparatus for manufacturing a ceramic-metal bonded body according to the present invention, a metal plate made of copper or a copper alloy is Cu-P based on the surface of a ceramic base material on which one or more scribe lines for dividing a plurality of ceramic substrates are formed. An apparatus for manufacturing a ceramic-metal joint body brazed by a brazing material, comprising: a laminate in which the metal plate is laminated on the surface of the ceramic base material via the Cu—P brazing material. The pressing surface of the pressing plate has a pair of pressing plates sandwiching in the stacking direction, and the pressing surface of the pressing plate has a relief surface of a predetermined width separated from the surface of the laminate when the pressing member sandwiches the stack. A plurality of brazes are provided along two sides forming one corner and at positions avoiding directly above the scribe line, and a plurality of brazes are accumulated between the surface of the laminate and the plurality of escape surfaces. During it is formed.

The ceramic-metal bonded body of the present invention is bonded to the surface of the ceramic base material with a ceramic base material having one or more scribe lines for dividing into a plurality of ceramic substrates by a Cu-P based brazing material, copper or And a metal layer made of a copper alloy, and a surface of the metal layer opposite to the bonding surface with the ceramic base is along the two sides forming one corner and the scribe line is true. The solidified Cu-P-based brazing material adheres to the solidified solder after melting at a position away from the top.

In the present invention, since the braze does not solidify right above the scribe line, the ceramic-metal joint can be appropriately separated along the scribe line.

According to the present invention, it is possible to suppress the solidification of the solder right above the scribe line of the laminate including the ceramic base material and the metal layer in which the scribe line is formed.

FIG. 1 is a perspective view showing a ceramic-metal joint according to an embodiment of the present invention. It is a perspective view which shows the principal part of the manufacturing apparatus of the ceramic-metal joined body shown in FIG. It is a perspective view which shows the manufacturing method of the ceramic-metal joined body shown in FIG. FIG. 3 is a partial cross-sectional view taken along the line CC of FIG. 2; It is a longitudinal cross-sectional view which shows the example of a whole structure of a power module.

Hereinafter, an embodiment of the present invention will be described using the drawings.

[Composition of ceramics-metal joint]
FIG. 1 is a cross-sectional view showing a ceramic-metal joined body 10 that becomes a plurality of power module substrates 100 (see FIG. 5) by being singulated.

The ceramic-metal joint body 10 is formed by brazing a substantially rectangular metal plate 30 to both surfaces of a substantially rectangular ceramic base material 20. The solder marks 43 are formed from the end faces 11a and 11b to the surface (the surface of the metal plate 30 opposite to the bonding surface with the ceramic base 20) along the two sides forming the corner (positioning corner) 11 In addition, on the

end surfaces

12a and 12b of the opposite corner 12, a rub (not shown) is formed. Each of the wax spots 43 located on these surfaces is not formed right above the scribe line 22 formed on the ceramic base material 20 described later.

Here, the brazing material is solidified after melting the brazing material 40, and refers to a thin film-like deposit having a thickness of 0.1 mm or less and having a small unevenness. The rubbish refers to a bump-like deposit having a thickness of 1 mm or more that partially protrudes.

In the present embodiment, the ceramic base material 20 is a substantially rectangular plate formed using AlN (aluminum nitride) as a base material. The ceramic base material 20 may be made of, for example, a nitride-based ceramic such as AlN or Si ₃ N ₄ (silicon nitride), or an oxide-based ceramic such as Al ₂ O ₃ (alumina).

A scribe line 22 is formed on the surface of the ceramic base material 20. The scribe line 22 is formed, for example, by linearly removing the surface of the ceramic base material 20 by irradiating a laser beam. The scribe line 22 is a groove portion formed in the ceramic base material 20, and is a part that becomes a starting point of division of the ceramic base material 20. The scribe lines 22 are, as indicated by the broken lines in FIG. 1 and the solid lines in FIG. 3, four scribe lines extending in the direction along the end face 11a and three lines extending in the direction along the end face 11b. Of scribe lines.

The metal plate 30 joined to the ceramic base material 20 and to be a metal layer is formed of copper or a copper alloy in substantially the same shape as the ceramic base material 20.

The brazing material 40 (see FIG. 3) for joining the ceramic base material 20 and the metal plate 30 has a substantially rectangular foil shape, and is formed of a Cu—P-based alloy in the present embodiment. The brazing material 40 may contain, for example, Ag and Sn in addition to Cu and P.

The ceramic-metal joint 10 has a product portion 10A, the center of which constitutes the power module substrate 100, and an outer peripheral portion surrounding the product portion 10A, the dummy portion 10B. The dummy portion 10B is formed between the outermost scribe line 22 and the four end faces and is set in a frame shape having a predetermined width, and is finally removed after being used for handling or the like in each manufacturing process. . That is, while holding the dummy portion 10B and handling the ceramic-metal bonding body 10, a predetermined circuit pattern P is formed on the ceramic-metal bonding body 10 (see FIG. 5), and processing such as division into pieces is performed. By doing this, the power module substrate 100 is formed.

When such processing is performed, the ceramic-metal joint 10 can be positioned using the end faces 11a and 11b in which no bumps are formed. At this time, the wax stain 43 is a very thin flat deposit and does not disturb the positioning of the ceramic-metal joint 10, so it is not necessary to remove it.

On the other hand, since the end faces 12a and 12b along the two sides forming the corner 12 on the diagonal with the positioning corner 11 are not used for positioning, even if a hump is formed on the end faces 12a and 12b, There is no need to remove it.

[Configuration of manufacturing equipment]
FIG. 2 is a view showing a manufacturing apparatus 70 for performing a bonding process of the ceramic-metal joint 10.

The manufacturing apparatus 70 includes a plurality of pressure plates 60 and a pressure plate 60, which apply pressure while heating the laminate 50 in which the metal plate 30 is laminated on both sides of the ceramic base 20 with the brazing material 40 interposed therebetween in the laminating direction. It has four cross-sectional L-shaped support |

pillar

71a, 71b, 71c, 71d holding the laminated body 50. As shown in FIG. The pressure plate 60 is positioned by bringing the positioning corner portion 61 into contact with the support 71 a.

Specifically, of the two

end surfaces

61a and 61b forming the positioning corner portion 61, the pressure plate 60 brings the end surface 61a into contact with the inner surface of the substantially L-shaped

columns

71a and 71b, and the end surface 61b. Are positioned by bringing them into contact with the inner surfaces of the substantially L-shaped

columns

71a and 71d.

In the manufacturing apparatus 70, a plurality of ceramic-metal joints 10 are simultaneously manufactured by alternately laminating the plurality of pressure plates 60 and the stack 50. As the pressure plate 60, for example, a carbon plate excellent in flatness and thermal conductivity can be used. In the case where a porous material such as a carbon plate is used as the pressure plate 60, it is preferable that the material not be impregnated with molten wax generated by melting the brazing material 40.

In such a manufacturing apparatus 70, among the two end faces 21a and 21b forming the positioning corner portion 21, each ceramic base material 20 causes the end face 21a to abut against the

support

71a and 71b, and the end face 21b corresponds to the support 71a, It is positioned using the positioning corner 21 so as to abut on 71 d. Similarly, each metal plate 30 is positioned using the positioning corner 31 so that the end face 31a forming the positioning corner 31 is in contact with the

columns

71a and 71b and the end face 31b is in contact with the

columns

71a and 71d. Be done.

Each brazing material 40 is also positioned using the positioning corner 41 such that the end face 41a forming the positioning corner 41 is in contact with the

columns

71a and 71b, and the end face 41b is in contact with the

columns

71a and 71d. .

That is, in each laminate 50, the respective members are laminated such that the end faces 21a, 31a, 41a overlap the end face 61a of the pressure plate 60, and the end faces 21b, 31b, 41b overlap the end face 61b of the pressure plate 60. Ru.

In this embodiment, since the width dimension of each surface of each

support

71a, 71b, 71d in contact with each end surface is small, the

positioning corner portions

21, 31, 41, 61 are positioned at two positions in the end surface of each side. The three

columns

71a, 71b, 71d are used to abut each other, but, for example, the width dimension of the surface of the column 71a in contact with each end surface forms the

positioning corner portions

21, 31, 41, 61 It is also possible to position with only the support 71 a as long as the end surfaces can be reliably positioned.

The area of the pressure plate 60 is set to be larger than the area of the laminated body 50 (ceramic base material 20, metal plate 30, brazing material 40). Therefore, in the stacked body 50, the end faces which are not used for positioning are located inside the end faces of the pressure plate 60.

On the surface of each pressure plate 60, as shown in FIG. 3 and FIG. 4, a plurality of relief surfaces 63 of a predetermined width separated from the laminate 50 along the two end faces 61a, 61b forming the positioning corner 61. It is provided. Specifically, two escape surfaces 63 are formed on the surface on the end surface 61 a side of the pressure plate 60 with a predetermined gap L 4, and on the surface on the end surface 61 b side of the pressure plate 60, three escape surfaces 63 are provided. The predetermined intervals L4 are mutually formed. The escape surfaces 63 are formed at positions avoiding directly above the scribe line 22 formed in the ceramic base material 20. That is, each escape surface 63 is formed so as not to overlap the scribe line 22.

Each relief surface 63 has a width slightly smaller than the width of the dummy portion 10B of the ceramic-metal joint 10, and is provided by, for example, a step forming a recess having a depth of 5 to 20% of the thickness of the pressure plate 60. Be By laminating the laminated body 50 and the pressure plate 60, a brazing space 52 is formed between the escape surface 63 and the surface of the dummy portion 10B of the laminated body 50.

For example, in the present embodiment, the thickness of the metal plate 30 is 0.6 mm, the thickness of the ceramic base material 20 is 0.635 mm, the thickness of the pressure plate 60 is 1 mm, and the relief surface 63 of the pressure plate 60 is The width L2 is 2 mm or more and 4 mm or less, and the depth L3 is 0.05 mm or more and 2.0 mm or less. The predetermined interval L4 is set to 1 mm or more and 2 mm or less.

[Method of manufacturing ceramic-metal joint]
A metal plate is formed on the surface of the ceramic base material 20 by heating the laminated body 50 formed by laminating the ceramic base material 20, the metal plate 30, and the brazing material 40 between the pair of pressure plates 60 using the manufacturing apparatus 70. A bonding step of bonding 30 is performed. At this time, the surplus portion of the brazing filler metal 40 which is melted and joins the ceramic base material 20 and the metal plate 30 is pushed out from between the ceramic base material 20 and the metal plate 30 as shown by arrow A in FIG. And flows into the stagnation space 52 through the end faces 21 b and 31 b.

As a result, a wax stain 43 with a small thickness is formed in the wax accumulation space 52 in accordance with the amount of surplus wax. As described above, when the wax accumulation space 52 draws in the surplus wax, no galling is formed on each of the end faces 21a, 21b, 31a, 31b. Since the solder accumulation space 52 is not formed right above the scribe line 22 of the ceramic-metal joint 10, the solder stain 43 is not formed right above the scribe line 22.

With respect to the ceramic-metal joint 10 manufactured in this manner, positioning is performed using the end faces 11a and 11b (the end faces 21a, 21b, 31a, and 31b) of the corner portion 11 in which the wax is not formed. After a mask is printed on the surface of the metal plate 30 (metal layer), an etching process is performed to etch. The masks are provided to separate the metal plate 30 individually on the scribe lines 22 and to form a circuit pattern as needed. Then, after the etching, the ceramic base material 20 of the ceramic-metal joined body 10 is divided along the scribe line 22.

When the solder paste 43 is formed right above the scribe line 22 in the ceramic-metal joint 10 (metal plate 30), the etching rate of the solder paste 43 is higher than the etching rate of the metal plate 30 made of copper or copper alloy. Because of the low speed, the etching rate of the solder marks 43 is low, and even if the metal plates 30 are etched and separated individually, there is a possibility that the solder marks 43 remain just above the scribe line 22 without being etched.

On the other hand, in the present embodiment, since the wax stain 43 is not formed immediately above the scribe line 22, the ceramic-metal joint 10 can be reliably separated individually along the scribe line 22. As a result, it is possible to manufacture the power module substrate 100 in which the desired circuit pattern P or the like as shown in FIG. 5 is formed at an accurate position.

[Configuration of power module]
FIG. 5 is a cross-sectional view showing a power module 110 in which the power module substrate 100 is used.

The power module 110 is formed by bonding the cooler 113, soldering the electronic component 111, wire bonding and the like to the power module substrate 100. The power module 110 includes a power module substrate 100, an electronic component 111 such as a semiconductor chip mounted on the surface of the power module substrate 100, and a cooler 113 joined to the back surface of the power module substrate 100. Ru. The cooler 113 and the power module substrate 100 are joined by brazing, soldering, bolts or the like.

As described above, since it is possible to prevent the formation of bumps on the end face of the ceramic-metal joint of the power module substrate, positioning in the subsequent process can be facilitated. Since the molten wax can be prevented from solidifying (the formation of the wax stain) right above the scribe line, the ceramic-metal joint can be reliably divided along the scribe line.

[Modification of the embodiment]
The present invention is not limited to the configuration of the above-described embodiment, and various changes can be made in the detailed configuration without departing from the spirit of the present invention.

For example, as shown in the drawings, in the above embodiment, the pressure plate 60 having relief surfaces 63 formed on both sides and the pressure plate 60 having relief surfaces 63 formed on only one side are used in combination. For example, only the pressure plate 60 in which the escape surface 63 is formed on one side of the pressure plate 60 may be used in combination. In this case, as shown in FIG. 3, the bonding step is performed by overlapping a plurality of sets in which the stacked body 50 is held by the pair of pressure plates 60 in which the release surfaces 63 face each other.

A laminated body in which a metal plate made of a copper alloy is laminated on both sides of a 164.9 mm × 76.9 mm substantially rectangular ceramic base material formed using AlN (aluminum nitride) as a base material via a Cu-P based brazing material. Were held between a pair of pressure plates and heated in a pressurized state to produce a ceramic-metal joint. Ten ceramic-metal joints were manufactured for each of the conditions of Examples 1 to 8 and Comparative Example 1 shown in Table 1.

Specifically, the thickness L1 of the Cu—P brazing filler metal foil, the width L2 of the relief surface of the pressure plate made of carbon, the depth L3 of the relief surface, and the width between the relief surfaces (the predetermined distance L4) are shown in Table 1 While changing in accordance with the conditions shown in the above, ten ceramics-metal joints were manufactured for each condition, and an experiment was conducted to evaluate whether or not the solder was solidified immediately above the scribe line. The obtained samples of Examples 1 to 8 and Comparative Example 1 will be described with reference to Table 1.

In Examples 1 to 8, four scribe lines extending in the longitudinal direction and two scribe lines extending in the lateral direction were formed in the ceramic base material. The relief surface of the pressure plate was formed three in the lateral direction and one in the longitudinal direction along the two sides forming the positioning corner and avoiding directly above the scribe line. That is, in Examples 1 to 8, the escape surface was divided to avoid directly above the scribe line.

On the other hand, in Comparative Example 1, a relief surface was formed so as to surround the periphery of the ceramic base material. That is, in Comparative Example 1, the escape surface was continuous, was not divided as in Examples 1 to 8, and was formed directly above the scribe line.

(Evaluation)
If 10 ceramic-metal joints manufactured under each condition shown in Table 1 are observed, and a place where the wax is solidified is found just above the scribe line formed in the ceramic base material The case where no place where the braze had solidified was found just above the scribe line was judged as “good”. Under the present circumstances, when judged as "good" in all 10 ceramic-metal joined bodies, it is judged as "A", the number judged as "defective" is 5 or less, and the thickness of solidified wax is The case of 0.1 mm (thickness that does not affect the division in the scribe line) or less was judged as "B", and the case where it was judged as "defect" in all 10 ceramic-metal joints was judged as "C" .

In Examples 1 to 8 in which escape surfaces were formed along the two sides forming the positioning corner of the pressure plate and avoiding directly above the scribe line, the evaluation was “B” or higher in all. In particular, in each of Examples 1 to 5, the evaluation was “A”, and in all the ceramic-metal joints, no place where the wax was solidified was found just above the scribe line.

The width L2 of the relief surface and the height L3 of the relief surface affect the volume of the wax accumulation space for accumulating the excess brazing material, and a larger value both prevented the penetration of the brazing material onto the scribe line. That is, in Examples 1 to 3, the evaluation was “A” because the values of the width L2 and the height L3 were large and the volume of the brazed space was large. Although the values of the width L2 and the height L3 of the example 2 are smaller than those of the examples 1, 3 to 5, the evaluation is "A" because the thickness L1 of the brazing material foil is half that of the other examples. Met.

In Examples 7 and 8, since the width L2 or the height L3 is small and the volume of the braze pool space is small, the molten braze spreads on the scribe line and solidifies right above a part of the scribe lines. , The evaluation was "B".

If the width L4 between the escape surfaces is small, the molten wax tends to diffuse onto the scribe line. That is, in Example 6, although the values of the width L2 and the height L3 are large, the width L4 between the escape surfaces is small, the molten wax diffuses onto the scribe line and solidifies right above the partial scribe line. The evaluation was "B" because

In Comparative Example 1, since the escape surface is not divided, that is, the escape surface is formed just above the scribe line, the wax is solidified immediately above the scribe line in all the ceramic-metal joints. A part was recognized and evaluation was "C".

It is possible to suppress the solidification of the solder right above the scribe line of the laminate including the ceramic base material and the metal layer in which the scribe line is formed.

10 Ceramics-Metal Joint

10A Product Part

10B Dummy Part 11 Corner Part (Positioning Corner Part)
11a, 11b End face 20 Ceramic base material 21

Positioning corner

21a, 21b End face 22 Scribe line 30 Metal plate 31

Positioning corner

31a, 31b End face 40 Braze material 41

Positioning corner

41a, 41b End face 43 Wax stain 50 Stack 52 Wax body Space 60 Pressure plate 61

Positioning corner

61a, 61b End face 63 Relief surface 70

Manufacturing device

71a, 71b, 71c, 71d Support 100 Power module substrate 110 Power module 111 Electronic component 112 Solder material 113 Cooler 113a Flow path P Circuit pattern

Claims

A pair of metal plates made of copper or copper alloy is laminated via a Cu-P brazing material on the surface of a ceramic base material having one or more scribe lines for dividing into a plurality of ceramic substrates. A bonding step of bonding the metal plate to the surface of the ceramic base material to form a metal layer by sandwiching and heating by a pressure plate;
Etching the laminate along the scribe line to separate the metal layer into regions surrounded by the scribe line;
The scribing when the relief surface having a predetermined width separated from the surface of the laminate is held along the two sides forming one corner of the pressure plate and the laminate is sandwiched on the pressure surface of the pressure plate. A plurality of ceramics are provided at positions avoiding directly above the line, and in the bonding step, a plurality of brazing pool spaces are formed between the surface of the laminate and the plurality of escape surfaces. Method of manufacturing metal bonded body.
A ceramic-metal joint body in which a metal plate made of copper or copper alloy is brazed with a Cu-P brazing material on the surface of a ceramic base material on which one or more scribe lines for dividing a plurality of ceramic substrates are formed. A device for producing
It has a pair of pressure plates which sandwich in the laminating direction a laminated body in which the metal plate is laminated on the surface of the ceramic base material via the Cu-P brazing filler metal,
On the pressure surface of the pressure plate, a relief surface having a predetermined width, which is separated from the surface of the laminate when the laminated body is held, extends along two sides forming one corner of the pressure plate, and A plurality of ceramic-metal junctions, wherein a plurality of brazing material spaces are provided at positions avoiding directly above the scribe line, and a plurality of brazing fluid collecting spaces are formed between the surface of the laminate and the plurality of escape surfaces. Body manufacturing equipment.
A ceramic base material having one or more scribe lines for dividing into a plurality of ceramic substrates;
And a metal layer bonded to the surface of the ceramic base material with a Cu-P-based brazing material and made of copper or a copper alloy,
The Cu-P system is located on a surface of the metal layer opposite to the bonding surface with the ceramic base, along the two sides forming one corner and avoiding directly above the scribe line. A ceramic-metal joint characterized in that a braze material adheres after solidification and solidified after melting.