WO2019128613A1

WO2019128613A1 - Output module and electronic device

Info

Publication number: WO2019128613A1
Application number: PCT/CN2018/118356
Authority: WO
Inventors: 吴安平
Original assignee: Oppo广东移动通信有限公司
Priority date: 2017-12-26
Filing date: 2018-11-30
Publication date: 2019-07-04

Abstract

Provided are an output module (10) and an electronic device (100). The output module (10) comprises a package housing (11), an infrared lamp (12), and a light-passing assembly (13). The package housing (11) comprises a package substrate (111). The infrared lamp (12) and the light-passing assembly (13) are packaged in the package housing (11). The infrared lamp (12) is carried on the package substrate (111). The light-passing assembly (13) is located on a light-emitting path of the infrared lamp (12). The light-passing assembly (13) comprises a base body (131) and a stretchable film (133). The base body (131) is provided with a light passing hole (132), and the stretchable film (133) is housed in the light passing hole (132). The stretchable film (133) is deformable by an electric field and changes an area in which the light-passing hole (132) is blocked. The infrared light emitted by the infrared lamp (12) can exit the package housing (11) at different field angles.

Description

Output module and electronic device

Priority information

This application claims priority to and the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of

Technical field

The present invention relates to the field of consumer electronics, and in particular, to an output module and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and number of functional devices that mobile phones need to be set are also increasing. In order to realize functions such as distance detection, ambient light detection and facial 3D feature recognition of users, it is necessary to use electronic devices. In the middle of the configuration of proximity sensors, ambient light sensors, infrared light cameras, structured light projectors and other functional devices, in order to arrange a large number of functional devices, it will take up too much space on the phone.

Summary of the invention

Embodiments of the present invention provide an output module and an electronic device.

The output module of the embodiment of the present invention includes a package housing, an infrared lamp, and a light-passing component, the package housing includes a package substrate, and the infrared lamp and the light-passing component are encapsulated in the package housing, The infrared light is carried on the package substrate, the light-passing component is located on the light-emitting path of the infrared light, the light-passing component comprises a base body and a stretch film, the base body is provided with a light-passing hole, and the elastic film is accommodated In the light-passing hole, the telescopic film can be deformed under the action of an electric field and change an area that blocks the light-passing hole, and the infrared light emitted by the infrared lamp can be from the package at different angles of view. The housing exits.

An electronic device according to an embodiment of the present invention includes a casing and an output module of the above embodiment, and the output module is disposed in the casing.

An electronic device according to another embodiment of the present invention includes a casing, an output module of the above embodiment, a vibration module, and a piezoelectric element, wherein the output module is disposed in the casing, and the vibration module is installed in the In the housing, the piezoelectric element is coupled to the vibration module and spaced apart from the output module, and the piezoelectric element is configured to deform when an electrical signal is applied to vibrate the vibration module.

An electronic device according to still another embodiment of the present invention includes a casing, an output module of the above embodiment, a display screen, and a light sensor, wherein the output module is mounted on the casing, and the display screen is disposed on the machine On the housing, the display screen is formed with a light transmissive physical area and includes a front surface capable of displaying a picture and a back side opposite to the front surface, the light sensor being disposed on a side of the display screen on which the back side is located, The light sensor corresponds to the transparent solid region, and the light sensor is configured to receive light incident on the light sensor and output a target light intensity of the light.

In the output module and the electronic device of the embodiment of the present invention, by changing the area of the light-transmitting hole by the expansion film, the infrared light emitted by the infrared light can be emitted from the package housing at different angles of view, corresponding to different angles of view, The output module can be used as a proximity infrared lamp or an infrared fill light, and the output module integrates the function of emitting infrared light to infrared ranging and infrared filling. Secondly, compared with the current electronic device, the near-infrared lamp and the infrared fill lamp need to be disposed at the same time, the output module of the embodiment of the invention only needs to set an infrared lamp, and the volume is small, thereby saving infrared light and infrared. The space for the ranging function. Furthermore, since only one infrared lamp needs to be disposed on the package substrate for packaging, the infrared fill light and the near-infrared lamp of the conventional process need to be separately assembled by different wafers and assembled onto the PCB substrate, thereby improving the package. effectiveness.

The additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic structural view of an electronic device according to an embodiment of the present invention;

2 is a perspective view of an output module of an electronic device according to an embodiment of the present invention;

3 and FIG. 4 are schematic diagrams showing states of an output module of an electronic device according to an embodiment of the present invention;

5 is a schematic cross-sectional view showing an output module of an electronic device according to an embodiment of the present invention;

6 is a schematic view showing a state of a light-passing component of an electronic device according to an embodiment of the present invention;

7 and FIG. 8 are partial schematic views showing a state of a light-passing component of an electronic device according to another embodiment of the present invention;

9 is a partial cross-sectional view showing an electronic device according to an embodiment of the present invention;

10 is a perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;

11 is a schematic view showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention;

12 is a schematic cross-sectional view showing an output module of an electronic device according to an embodiment of the present invention;

13 is a perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;

14 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

15 is a partial cross-sectional view showing an electronic device according to an embodiment of the present invention;

16 to 24 are schematic perspective views of a receiving module and an imaging module according to an embodiment of the present invention;

25 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

Figure 26 is a cross-sectional view of the electronic device of Figure 25 taken along line A-A;

Figure 27 is a partial cross-sectional view of the electronic device of Figure 25 taken along line B-B;

28 is a schematic view showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention;

29 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

30 and 31 are schematic diagrams showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention;

32 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

Figure 33 is a partial cross-sectional view of the electronic device of Figure 32 taken along line C-C;

FIG. 34 is a schematic structural diagram of an electronic device according to some embodiments of the present invention; FIG.

Figure 35 is a cross-sectional view taken along line D-D of the electronic device of Figure 34;

36 is a perspective view of a proximity sensor and an imaging module of an electronic device according to some embodiments of the present invention;

37 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

38 to 45 are perspective views of a proximity sensor and an imaging module of an electronic device according to some embodiments of the present invention.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are merely illustrative of the embodiments of the invention, and are not to be construed as limiting.

In the present invention, the first feature "on" or "under" the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

Embodiment 1:

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a casing 20 , a cover 30 , and electronic components. The electronic components include an output module 10, a receiving module 50 (Fig. 10), an imaging module 60 (Fig. 10), a receiver 70, and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.

Referring to FIG. 2 and FIG. 5 , the output module 10 is a single package structure, and the output module 10 includes a package housing 11 , an infrared lamp 12 , and a light passing assembly 13 .

The package housing 11 is used to simultaneously package the infrared lamp 12 and the light-passing component 13, or the infrared lamp 12 and the light-passing component 13 are simultaneously packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the output module 10.

Referring to FIG. 5, the package substrate 111 is used to carry the infrared lamp 12. When the output module 10 is manufactured, the infrared lamp 12 can be formed on the chip 14, and the infrared lamp 12 and the chip 14 are disposed on the package substrate 111. Specifically, the chip 14 can be bonded to the package substrate 111. At the same time, the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the output module 10 in the electronic device 100.

The package sidewalls 112 can be disposed around the infrared lamp 12 and the light-passing component 13. The package sidewalls 112 extend from the package substrate 111, and the package sidewalls 112 can be combined with the package substrate 111. Preferably, the package sidewalls 112 and the package substrate 111 are The infrared lamp 12 and the light-passing component 13 are inspected after being detachably connected to remove the package sidewall 112. The material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the infrared lamp 12 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. The package top 113 is formed with a light exit window 1131. The light exit window 1131 corresponds to the infrared light 12, and the infrared light emitted by the infrared light 12 passes through the light exit window 1131. The package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed. In one example, the light exit window 1131 is a through hole, and the package top portion 113 is made of a material that is impermeable to infrared light. In another example, the package top 113 is made of a material that is not transparent to infrared light and a material that transmits infrared light. Specifically, the light exit window 1131 is made of a material that transmits infrared light, and the rest is made of infrared light. Further, the light-emitting window 1131 may be formed with a lens structure to improve the infrared light emission angle emitted from the light-emitting window 1131. For example, the light-emitting window 1131 is formed with a concave lens structure to diverge the light passing through the light-emitting window 1131. The light exit window 1131 is formed with a convex lens structure so that the light passing through the light exit window 1131 is gathered and emitted outward.

Referring to FIG. 5 and FIG. 6, the light-passing component 13 is located on the light-emitting path of the infrared lamp 12. The infrared light emitted by the infrared lamp 12 passes through the light-passing component 13 and is emitted from the light-emitting window 1131. The light passing assembly 13 includes a base 131 and a stretch film 133.

The base 131 may be made of a material that is impermeable to infrared light and is electrically conductive. The base 131 may be connected to the package sidewall 112 via a connector 15, and the connector 15 may be used to lay a circuit such as a drive circuit of the light-passing component 13. The base 131 can also be embedded in the light exit window 1131. The overall shape of the base 131 may be circular, rectangular, elliptical or the like. A light-passing hole 132 is defined in the base 131. The light-passing hole 132 extends through the base 131. The infrared light emitted by the infrared lamp 12 passes through the light-passing hole 132 and passes through the light-passing component 13.

The stretch film 133 is housed in the light-passing hole 132. Specifically, the stretch film 133 can be fixed in the light-passing hole 132, and the stretch film 133 blocks at least the light-emitting area of the light-passing hole 132. The infrared light cannot pass through the stretch film 133 or the stretch film 133 has a low transmittance to infrared light. The stretch film 133 may be made of a material having an electrostrictive effect, such as Polyvinylidene Fluoride (PVDE), and the stretch film 133 can be deformed by an electric field. It can be understood that when the stretch film 133 is deformed, the area of the light-transmitting film 133 blocking the light-passing hole 132 also changes, that is, the area of the light-passing hole 132 that can pass through the light changes, resulting in the amount of light passing through the light-passing component 13. The distribution of light and light changes accordingly. In one example, by controlling the deformation of the stretch film 133, the infrared light emitted by the infrared lamp 12 can be emitted from the package housing 11 at different angles of view, and by obtaining different angles of view, it can be removed from the package housing 11. The infrared light that is worn out is used for different purposes. For example, as shown in FIG. 3, when the infrared light emitted by the infrared lamp 12 is emitted from the package housing 11 at a viewing angle α ranging from 60 degrees to 90 degrees (hereinafter referred to as a first angle of view), the first angle of view is Can be 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, etc., infrared light can be used for infrared fill light, infrared light passes through the light window 1131 to project to the object The infrared light camera 62 of the electronic device 100 (shown in FIG. 1) receives infrared light reflected by the object to acquire image information of the object; as shown in FIG. 4, when the infrared light emitted by the infrared light 12 is in the field of view angle β range When 10 degrees -30 degrees (hereinafter referred to as the second angle of view) is emitted from the package housing 11, the second field of view angle may be 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, etc., infrared light It can be used for infrared ranging, infrared light passes through the light exit window 1131 and reaches the surface of the object, and the proximity sensor 51 of the electronic device 100 (shown in FIG. 10) receives the infrared light reflected by the object to detect the distance of the object from the electronic device 100. In the embodiment of the present invention, the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light exit window 1131.

Referring to FIG. 6 , specifically, the stretch film 133 includes a first surface 1331 and a second surface 1332 , and the first surface 1331 is coupled to the inner wall of the light passing hole 132 , and the second surface 1332 is opposite to the first surface 1331 . In the embodiment shown in FIG. 6, two light-transmitting holes 132 are accommodated in one of the light-passing holes 132, and the two stretchable films 133 may be symmetrically disposed in the light-passing holes 132. As shown in FIG. 6(a), when no electric field is applied, the stretch film 133 is in a natural state, and a gap 1321 is formed between the two second surfaces 1332, and infrared rays can pass through the gap 1321; as shown in FIG. 6(b) As shown, when an electric field is applied to the stretch film 133, specifically, the base 131 may be connected to the negative electrode of the power source, the stretch film 133 may be connected to the positive electrode of the power source, or the base 131 may be connected to the positive electrode of the power source, the stretch film 133 and the power source. The negative electrode is connected, the stretch film 133 is deformed by the electric field, the first surface 1331 is combined with the inner wall of the light passing hole 132 to be difficult to move relative to the inner wall, and the second surface 1332 has a higher degree of freedom, and the second surface 1332 will be The extension occurs and the size of the void 1321 is gradually reduced, that is, the area where the stretch film 133 blocks the light passing hole 132 is increased. By controlling the strength of the electric field, the amount of extension of the second surface 1332 can be controlled to control the light-passing area of the light-passing aperture 132, that is, the size of the control gap 1321. In one example, as shown in FIG. 6(c), when the two second surfaces 1332 are completely attached, the light-passing area of the light-passing holes 132 is zero, and infrared light cannot pass through the light-passing holes 132. Certainly, a plurality of stretchable films 133 may be disposed in one of the light passing holes 132, for example, one, three, four, five, six, etc., and the specific shape of the stretch film 133 may also depend on the shape of the light passing hole 132 and the like. Adjustments are made and there are no restrictions here.

In the embodiment shown in FIG. 6, the number of the light-passing holes 132 formed in the base 131 is single, and the shape of the elastic film 133 is changed by controlling the magnitude of the electric field, thereby changing the size of the gap 1321 to change the infrared light. The angle of view, for example, makes the field of view angle the first field of view angle or the second field of view angle described above.

In the embodiment shown in FIGS. 7 and 8, the number of the light-passing holes 132 is at least two, and the stretch film 133 can also change the number of the blocked light-passing holes 132 under the action of the electric field. In this embodiment, the plurality of light-passing holes 132 are distributed in a radial array, and the light-passing holes 132 at the center may correspond to the light-emitting center of the infrared lamp 12, and the remaining light-passing holes 132 are distributed around the light-passing holes 132 of the center. The stretch film 133 in the different light passing holes 132 can be independently turned on or off from the power source. When all the stretchable films 133 are not energized, the pass light component 13 has the highest passing rate of infrared rays, and the angle of view is also the largest (as shown in FIG. 7); when it is required to reduce the amount of light passing through, or reduce the angle of view At this time, the stretch film 133 in the light-passing hole 132 at the edge of the array can be controlled to deform and block the corresponding light-passing hole 132 (as shown in FIG. 8). Certainly, in other embodiments, the plurality of light-passing holes 132 may be distributed in other ways, and the manner in which the blocked light-passing holes 132 are distributed may also be set according to user requirements, for example, by controlling the plurality of light-passing holes 132. The open/close state is such that the light emitted from the output module 10 has an animal shape, a heart shape, or the like.

Referring to FIG. 1 and FIG. 9 , the casing 20 can be used as a mounting carrier for the output module 10 , or the output module 10 can be disposed in the casing 20 . The casing 20 may be an outer casing of the electronic device 100. In the embodiment of the present invention, the display 20 of the electronic device 100 may be disposed in the casing 20. The output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100. Specifically, the casing 20 includes a top portion 21 and a bottom portion 22. The display screen 90 and the output module 10 are disposed between the top portion 21 and the bottom portion 22. The top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100. As shown in FIG. 1, the output module 10 can be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.

The casing 20 also has an organic casing through hole 23. When the output module 10 is disposed in the casing 20, the infrared lamp 12 corresponds to the casing through hole 23. The infrared lamp 12 and the through hole 23 of the casing correspond to the light emitted by the infrared lamp 12 and can pass through the through hole 23 of the casing. Specifically, the infrared lamp 12 can be directly opposite to the through hole 23 of the casing, or can be an infrared lamp. The emitted light passes through the casing through-hole 23 after being acted upon by the light guiding element.

The cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like. The cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 coupled to the casing 20, and an outer surface 31 opposite the inner surface 32. The light emitted by the output module 10 sequentially passes through the inner surface 32 and The outer surface 31 is then passed through the cover 30. In the embodiment shown in FIG. 9, the cover plate 30 covers the through hole 23 of the casing, and the inner surface 32 of the cover plate 30 is coated with infrared ray transmitting ink 40, and the infrared ray transmitting ink 40 has a high infrared light. The transmittance can be, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the infrared light transmitting ink on the electronic device 100 in normal use. Covered area. In particular, the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.

The infrared transmission ink 40 can also block the through hole 23 of the casing (as shown in FIG. 9 ). It is difficult for the user to see the internal structure of the electronic device 100 through the through hole 23 of the casing, and the electronic device 100 has a beautiful appearance.

Referring to FIG. 10, the receiving module 50 is integrated with a proximity sensor 51 and a light sensor 52. The proximity sensor 51 and the light sensor 52 together form a single package structure. When the infrared lamp 12 is used as an infrared light emitted outwardly when the infrared lamp is used, it is received by the proximity sensor 51 after being reflected by the external object, and the proximity sensor 51 determines the relationship between the external object and the electronic device 100 according to the received reflected infrared light. distance. The light sensor 52 receives visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90. The proximity sensor 51 and the photo sensor 52 are collectively packaged into the receiving module 50 to reduce the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.

Referring to FIGS. 1 and 10 , the imaging module 60 may be one or both of a visible light camera 61 and an infrared light camera 62 . The imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65. In the embodiment shown in FIG. 10, the receiving module 50 is disposed on the mounting surface 631. Specifically, the orthographic projection of the receiving module 50 on the plane where the mounting surface 631 is located at least partially falls onto the mounting surface 631. The receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small.

Referring to FIG. 1, the receiver 70 is configured to emit an acoustic signal when excited by a power source, and the user can make a call through the receiver 70. The structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected. The reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.

In the embodiment shown in FIG. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The center of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located. On the same line segment. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG. 11); or from one end of the line segment to the other end In order, the output module 10, the infrared light camera 62, the receiver 70, the visible light camera 61, the structured light projector 80 (shown in FIG. 1); or the infrared light camera 62 and the output module from one end to the other end of the line segment. 10. The receiver 70, the visible light camera 61, and the structured light projector 80; or from one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the receiver 70, the output module 10, and the structured light projector 80. Of course, the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circular arc shape. The center is arranged in a shape such as a rectangle.

Further, the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62 or on the mounting surface 631 of the visible light camera 61. Of course, the receiving module 50 may not be installed. On the surface 631, the receiving module 50 can be disposed adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted by the infrared lamp 12 when it is used as an infrared light, and reflected by an external object; the receiving module 50 It is also possible to be disposed adjacent to the receiver 70, and when the user answers the call, the proximity sensor 51 easily detects that the user's ear is close to the receiver 70.

In summary, in the electronic device 100 of the embodiment of the present invention, by changing the area of the light-transmitting hole 132 by the expansion and contraction film 133, the infrared light emitted by the infrared lamp 12 can be emitted from the package housing 11 at different angles of view, corresponding to different The output module 10 can be used as a near-infrared light or an infrared fill light, and the output module 10 integrates the functions of emitting infrared light to perform infrared ranging and infrared filling. Furthermore, since only one infrared lamp 12 needs to be disposed on the package substrate 111 for packaging, compared with the conventional process, the infrared fill lamp and the near-infrared lamp need to be separately fabricated and assembled on the PCB substrate, thereby improving the package. Packaging efficiency.

It can be understood that the position setting of the light-passing component 13 is not limited to the above embodiment. In other embodiments, the light-passing component 13 may also be disposed on the inner surface of the package top 113 by gluing and block the light-emitting window 1131. Alternatively, the light-passing component 13 may also be disposed in the light-emitting window 1131.

Referring to FIG. 12, in some embodiments, the output module 10 further includes an optical enclosure 16. The optical enclosure 16 is made of a light transmissive material, and an optical enclosure 16 is formed on the package substrate 111 and within the package housing 11. The optical enclosure 16 encases the infrared lamp 12. Specifically, the optical enclosure 16 can be formed by a potting injection molding process, the optical enclosure 16 can be made of a transparent thermosetting epoxy resin to be less susceptible to softening in use, and the optical enclosure 16 can fix the position of the infrared lamp 12 And the infrared lamp 12 is not easily shaken in the package housing 11. At this time, the light-passing component 13 may be disposed in the optical enclosure 16 or may be disposed outside the optical enclosure 16.

Referring to FIG. 13 , in some embodiments, the proximity sensor 51 and the light sensor 52 may not be integrated in the receiving module 50 , or the proximity sensor 51 and the light sensor 52 may be separately disposed. At this time, the proximity sensor 51 may be disposed on the mounting surface 631 of the lens holder 63; the light sensor 52 may also be disposed on the mounting surface 631 of the lens holder 63; or the proximity sensor 51 and the light sensor 52 may be disposed at the mirror holder 63 at the same time. On the mounting surface 631. The mirror mount 63 may be the mirror mount 63 of the infrared light camera 62 or the mirror mount 63 of the visible light camera 61.

Referring to FIG. 14 , in some embodiments, the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case. The centers of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30. In the embodiment shown in FIG. 14, the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.

Referring to FIG. 15 , in some embodiments, the cover plate 30 can also be provided with a cover through hole 33 . The cover through hole 33 corresponds to the through hole 23 of the casing, and the infrared light emitted by the infrared lamp 12 passes through the casing. After the through hole 23, the electronic device 100 can be passed through the cover through hole 33.

Referring to FIG. 16 , in some embodiments, the imaging module 60 further includes a substrate 66 . The image sensor 65 is disposed on the substrate 66 , and the receiving module 50 can also be fixed on the substrate 66 . Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the lens holder 63, and another part is protruded from the lens holder 63. One end of the FPC is located in the lens holder 63 and is used for carrying the image sensor 65, and the other end can be The main board of the electronic device 100 is connected. When the receiving module 50 is disposed on the substrate 66, the receiving module 50 is disposed outside the lens holder 63, and the receiving module 50 can also be connected to the FPC.

Further, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52. The proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately, and saves electrons. The installation space within the device 100. In other embodiments, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 or/and a light sensor 52, each of which is a single package structure. That is, the receiving module 50 disposed on the substrate 66 is a proximity sensor 51 having a single package structure; or the receiving module 50 disposed on the substrate 66 is a single package structure photo sensor 52; or, disposed on the substrate 66 The receiving module 50 is a proximity sensor 51 of a single package structure and a photosensor 52 of a single package structure.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62. Specifically, the receiving module 50 can be fixed on the substrate 66 of the visible light camera 61; the receiving module 50 can be fixed on the substrate 66 of the infrared light camera 62. When the proximity sensor 51 and the photo sensor 52 are separately packaged, the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61, and the light sensor 52 may be fixed on the substrate 66 of the infrared light camera 62; or, the light sensor 52 may be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62; or the proximity sensor 51 and the light sensor 52 may be fixed on the substrate 66 of the visible light camera 61; or Both the proximity sensor 51 and the light sensor 52 are fixed to the substrate 66 of the infrared light camera 62.

Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the receiving module 50 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the receiving module 50 is (or close to) When the sensor 51 or the photo sensor 52) is disposed on the substrate 66, it is less likely to be shaken. In one example, the receiving module 50 (or the proximity sensor 51 or the light sensor 52) may also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.

Referring to FIG. 17 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface The 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671. The third sub-top surface 673 is obliquely connected to the second sub-top surface 672. The second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected. The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674. The lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68. The light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. Converted to an electrical signal. The receiving module 50 is disposed at the first sub-top surface 671, and the receiving module 50 includes a proximity sensor 51 and a photo sensor 52. In the embodiment, the imaging module 60 may be a visible light camera 61, and the receiving module 50 is a single package structure formed by the proximity sensor 51 and the light sensor 52. The direction in which the proximity sensor 51 and the photosensor 52 are connected may coincide with the extending direction of the slit 675 (as shown in FIG. 17); or, the direction in which the proximity sensor 51 and the photosensor 52 are connected may be extended with the slit 675. The angle formed by the direction perpendicular or both is an acute angle or an obtuse angle. In other embodiments, the imaging module 60 can be an infrared camera 62.

The imaging module 60 of the present embodiment is provided with a slit 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are relatively compact. The space is small, and the installation space in the electronic device 100 is saved. At the same time, the proximity sensor 51 and the light sensor 52 are collectively packaged into the receiving module 50 to reduce the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.

Referring to FIG. 17 , in some embodiments, the receiving module 50 of the above embodiment is disposed on the first sub top surface 671 and located outside the camera housing 67 . Specifically, the entire receiving module 50 is perpendicular to The projection of the first sub-top surface 671 may be located in the first sub-top surface 671 (as shown in FIG. 17); or, the partial receiving module 50 is located on the first sub-top surface along a projection perpendicular to the first sub-top surface 671. Within 671. That is to say, at least a part of the receiving module 50 is located directly above the first sub-top surface 671. Thus, the receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving The installation space in the electronic device 100. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The photo sensor 52 can also be disposed on the first sub top surface 671.

Referring to FIG. 18, in some embodiments, the receiving module 50 of the above embodiment includes only the proximity sensor 51, and does not include the light sensor 52. At this time, the proximity sensor 51 (or the receiving module 50) and the light sensor Each of the 52 is a single package structure, the proximity sensor 51 is disposed on the first sub-top surface 671, and the photo sensor 52 is disposed at any other position than the first sub-top surface 671.

Referring to FIG. 18, in some embodiments, the receiving module 50 of the above embodiment includes only the light sensor 52, and does not include the proximity sensor 51. At this time, the light sensor 52 (or the receiving module 50) and The proximity sensors 51 are each a single package structure, the light sensor 52 is disposed on the first sub top surface 671, and the proximity sensor 51 is disposed at any other position than the first sub top surface 671.

Referring to FIG. 19 , the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 includes only the proximity sensor 51 and no photo sensor 52, and the photo sensor 52 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 19 , the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the photosensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 20 , in some embodiments, the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light transmission hole 676 may be a light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart and respectively The light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The light sensor 52 may also be disposed in the camera housing 67 and correspond to the light transmission hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 20 , in some embodiments, the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The receiving module 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the receiving module 50 can also be connected to the FPC. In the embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52. The proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51. The light sensor 52 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the proximity sensor 51. The device 52 is also a single package structure, and the light sensor 52 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67 and another portion is from the camera housing 67 When extended, the light sensor 52 can also be attached to the substrate 66 and located outside of the camera housing 67.

In another embodiment, the receiving module 50 only includes the photo sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the photo sensor 52. The proximity sensor 51 is also a single package structure, and the proximity sensor 51 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67, another portion is from the camera housing 67. The proximity sensor 51 may also be fixed to the substrate 66 and located outside the camera housing 67 when projecting inside.

The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20; The imaging module 60 is provided with a substrate 66 and the receiving module 50 is disposed on the substrate 66 so that the receiving module 50 can be stably mounted in the camera housing 67.

Referring to FIG. 21, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a. The first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678. The first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and The second step 678 is connected between the first step 677 and the second step 678. The angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle, and the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675. The center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675. The two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674. The two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68. Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65. In this embodiment, the imaging module 60 may be a visible light camera 61. In this case, the two lens modules 68 are lens modules corresponding to the visible light camera 61. The receiving module 50 is disposed on the second step 678 and located outside the camera housing 67. The receiving module 50 is a single package structure formed by the proximity sensor 51 and the photo sensor 52. The direction in which the proximity sensor 51 and the photosensor 52 are connected may coincide with the extending direction of the slit 675; or the direction in which the proximity sensor 51 and the photosensor 52 are connected may be perpendicular to the extending direction of the slit 675 (as shown in FIG. 21). The angle formed by either or both is an acute or obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62. In this case, the two lens modules 68 are lens modules corresponding to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. One lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Corresponding lens module.

The imaging module 60 of the present embodiment is provided with a slit 675, and the receiving module 50 is disposed on the second step 678, so that the receiving module 50 and the imaging module 60 are relatively compact, and the horizontal space occupied by the two together The installation space is reduced in the electronic device 100. At the same time, the proximity sensor 51 and the photo sensor 52 are collectively packaged into the receiving module 50, which reduces the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.

Referring to FIG. 22, in some embodiments, the slit 675 of the above embodiment is opened at a middle position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface. 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on The lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675. At this time, the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b. The first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface. Between the top surface 677a and the second step surface 678, the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678. In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b. The angle is an obtuse angle. In other embodiments, the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle. With respect to the opening of the slit 675 at the edge position of the top surface 670, the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the setting of the receiving module 50 on the second surface. 678.

Referring to FIG. 21 and FIG. 22 , in some embodiments, the receiving module 50 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67 . Specifically, when the slit 675 is opened at the edge position of the top surface 670, the projection of the entire receiving module 50 along the second ladder surface 678 may be located in the second ladder surface 678; or, the partial receiving module 50 is vertical. The projection of the second step 678 is located within the second step 678 (shown in Figure 21). That is, at least a portion of the receiving module 50 is located directly above the second step 678. When the slit 675 is opened in the middle of the top surface 670, the projection of the entire receiving module 50 along the second plane 678 can be located in the second step 678 (as shown in FIG. 22). In this way, the receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The photo sensor 52 can also be disposed on the second step 678.

Referring to FIG. 22, in some embodiments, the receiving module 50 of the above embodiment includes only the proximity sensor 51, and the receiving module 50 does not include the light sensor 52. At this time, the proximity sensor 51 (or the receiving module 50) The photosensors 52 are each provided in a single package structure, the proximity sensor 51 is disposed on the second step 678, and the photosensor 52 is disposed on the casing 20 outside the imaging module 60.

Referring to FIG. 22, in some embodiments, the receiving module 50 of the above embodiment includes only the light sensor 52, and the receiving module 50 does not include the proximity sensor 51. At this time, the light sensor 52 (or the receiving module) 50) The proximity sensor 51 is each a single package structure, the light sensor 52 is disposed on the second step 678, and the proximity sensor 51 is disposed on the casing 20 outside the imaging module 60.

Referring to FIG. 23 , the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 includes only the proximity sensor 51 and no photo sensor 52, and the photo sensor 52 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 23 , the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the photosensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 24 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light transmission hole 676 may be a light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart and respectively The light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The light sensor 52 may also be disposed in the camera housing 67 and correspond to the light transmission hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 24 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The receiving module 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the receiving module 50 can also be connected to the FPC. In the embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52. The proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately. The installation space in the electronic device 100 is saved.

In another embodiment, the receiving module 50 only includes the photo sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the photo sensor 52. The proximity sensor 51 is also a single package structure, and the proximity sensor 51 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67 and another portion is inside the camera housing 67 The proximity sensor 51 can also be fixed to the substrate 66 and located outside the camera housing 67 when extended.

Embodiment 2:

Referring to FIG. 25 and FIG. 26, an electronic device 100 according to another embodiment of the present invention includes a casing 20, an electronic component, a vibration module 30a, and a piezoelectric element 70. The electronic components include an output module 10, a receiving module 50 (Fig. 10), an imaging module 60 (Fig. 10), and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc., and the electronic device 100 is a mobile phone as an example. It can be understood that the specific form of the electronic device 100 can be other. There are no restrictions here. The following is a description of the parts of the electronic device 100 of the present embodiment that are different from the electronic device 100 of the first embodiment. For the same parts, refer to the related description of the electronic device 100 of the first embodiment.

The output module 10 of the present embodiment has the same structure as that of the output module 10 described in the first embodiment, and details are not described herein again.

Referring to FIG. 25 and FIG. 26, the casing 20 can be used as a mounting carrier for the output module 10, or the output module 10 can be disposed in the casing 20. The casing 20 may be an outer casing of the electronic device 100.

Referring to FIG. 25 to FIG. 27 together, the casing 20 includes a top portion 21 and a bottom portion 22. In a position corresponding to the electronic component, the casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a. . When the output module 10 is disposed in the casing 20, the infrared lamp 12 corresponds to the infrared through hole 23 of the casing. The infrared lamp 12 and the infrared through hole 23 of the casing correspond to that the light emitted by the infrared lamp 12 can pass through the infrared through hole 23 of the casing. Specifically, the infrared lamp 12 and the infrared through hole 23 of the casing can be directly opposite. The light emitted by the infrared lamp 12 may pass through the infrared through hole 23 of the casing through the light guiding element.

The vibration module 30a is mounted on the casing 20. The vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 is combined with the cover plate 30 to form a vibration module 30a to increase the rigidity of the vibration module 30a. The display screen 90 is disposed on the casing 20 and forms a receiving cavity 91 with the casing 20. The cover plate 30 is disposed on the casing 20 and located on a side of the display screen 90 away from the receiving cavity 91 to protect the display screen 90. Since the output module 10 of the embodiment of the present invention can occupy a small volume, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100. Specifically, the display screen 90, the output module 10, and the piezoelectric element 70 are disposed between the top portion 21 and the bottom portion 22. In a state where the user normally uses the electronic device 100, the top portion 21 is located above the bottom portion 22, as shown in FIG. The output module 10 can be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.

The piezoelectric element 70 is made of a ceramic or quartz crystal material, and the piezoelectric element 70 may be a single wafer, a bimorph or a laminated piezoelectric element 70. The piezoelectric element 70 is coupled to the vibration module 30a and spaced apart from the output module 10. Specifically, the piezoelectric element 70 is received in the vibration through hole 2a of the casing and combined with the cover plate 30, and is spaced apart from the casing 20, and the piezoelectric element 70 may be partially received in the vibration through hole 2a of the casing, or pressed. The electrical component 70 is completely housed in the vibration hole 2a of the casing. When an electric signal (voltage) is applied to both ends of the piezoelectric element 70, the piezoelectric element 70 undergoes mechanical deformation such as expansion or contraction due to the inverse piezoelectric effect, thereby driving the vibration module coupled with the piezoelectric element 70. 30a vibrates according to the frequency of the electrical signal. When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, teeth). In this way, the user can implement functions such as voice call and listening to music through the piezoelectric element 70 and the vibration module 30a. In the embodiment of the present invention, the processor of the electronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal at both ends of the piezoelectric element 70.

It can be understood that the traditional receiver structure uses air-conducted sound, and the local sound pressure is generally between 90dB and 100dB when the receiver is working, and the sound is quiet even in the surrounding environment (such as the general office environment of about 50dB). The retention is about 50dB~60dB, which causes the conversation content between the callers to be perceived by the surroundings, resulting in private leakage. The electronic device 100 of the present embodiment uses the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and the sound of the conversation is mainly perceived by the user through the vibration of the bone conduction, and the privacy of the conversation content can be effectively ensured.

Referring again to FIGS. 26 and 27, the piezoelectric element 70 and the display screen 90 are each attached to the cover 30 by a joint 30b. The joining member 30b is an adhesive having heat curing characteristics, ultraviolet curing characteristics, double-sided tape, adhesive, or the like. For example, the joining member 30b may be an optically elastic resin (a colorless and transparent ultraviolet curable acrylic adhesive). The area of the cover plate 30 that is coupled to the piezoelectric element 70 and the area of the cover plate 30 that is joined to the display screen 90 are spaced to prevent the display of the display screen 90 from being disturbed by the piezoelectric element 70. Of course, the cover plate 30 can also be coupled to the casing 20 through the joint member 30b, and the cover plate 30 can be directly disposed on the casing 20, so that the vibration of the vibration module 30a can be prevented from being directly transmitted to the casing 20 to reduce The possibility that the user drops the electronic device 100 because the vibration amplitude of the casing 20 is excessive.

The cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like. The cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 coupled to the casing 20, and an outer surface 31 opposite the inner surface 32. The light emitted by the output module 10 sequentially passes through the inner surface 32 and The outer surface 31 is then passed through the cover 30. In the embodiment shown in FIG. 27, the cover plate 30 covers the infrared through hole 23 of the casing, and the inner surface 32 of the cover plate 30 is coated with infrared ray transmitting ink 40, and the infrared ray transmitting ink 40 has a higher infrared light. The transmittance can be, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the infrared transmission ink on the electronic device 100 in normal use. 40 covered areas. In particular, the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.

The infrared transmission ink 40 can also block at least one of the infrared through hole 23 of the casing and the vibration through hole 2a of the casing, that is, the infrared transmission ink 40 can simultaneously cover the infrared through hole 23 of the casing and the vibration through hole 2a of the casing ( As shown in FIG. 27, it is difficult for the user to see the internal structure of the electronic device 100 through the infrared through hole 23 of the casing and the vibration through hole 2a of the casing. The appearance of the electronic device 100 is beautiful; the infrared transmission ink 40 can also cover the casing. The infrared through hole 23 does not cover the vibration through hole 2a of the casing; the infrared transmission ink 40 can also cover the vibration through hole 2a of the casing, and does not cover the infrared through hole 23 of the casing.

The receiving module 10 and the imaging module 30 of the present embodiment have the same structure and mutual positional relationship as the receiving module 10 and the imaging module 30 described in the first embodiment, and are not described herein again.

The structure light projector 80 of the present embodiment has the same structure as that of the structure light projector 80 described in the first embodiment, and details are not described herein again.

In the embodiment shown in FIG. 25, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, an output module 10, an infrared light camera 62, a visible light camera 61, a piezoelectric element 70, and a structured light projector 80. The center is on the same line segment. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the piezoelectric element 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG. 28); or from one end of the line segment to The other end is an output module 10, an infrared camera 62, a piezoelectric element 70, a visible light camera 61, a structured light projector 80 (shown in FIG. 25), or an infrared camera 62 from one end of the line to the other end. The output module 10, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80; or from one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70, the output module 10, Structure light projector 80. Of course, the arrangement of the output module 10, the infrared light camera 62, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circle. The arc shape and the center are arranged in a shape such as a rectangle.

Referring to FIG. 29, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The centers of the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the casing 20. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the infrared light camera 62, and the visible light camera 61 are sequentially arranged; or the output module 10 and the infrared light camera are sequentially from one end of the line segment to the other end. 62, a visible light camera 61, a structured light projector 80 (shown in Figure 29); or from one end of the line segment to the other end is an infrared light camera 62, an output module 10, a visible light camera 61, a structured light projector 80; or From one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the output module 10, and the structured light projector 80 are sequentially arranged. Of course, the arrangement of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 is not limited to the above examples. In the embodiment of the present invention, the center of the piezoelectric element 70 is not located on the line segment, which saves the electronic components on the cover 30 (output module 10, infrared camera 62, visible light camera 61, structured light projector 80, etc.) ) The horizontal space occupied.

Further, the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62 or on the mounting surface 631 of the visible light camera 61. Of course, the receiving module 50 may not be installed. On the surface 631, the receiving module 50 can be disposed adjacent to the output module 10. The proximity sensor 51 can easily receive the infrared light emitted by the output module 10 when it is used as an infrared light, and reflected by an external object; the receiving module 50 may also be disposed adjacent to the piezoelectric element 70, which is not limited herein.

In the electronic device 100 of the present embodiment, by changing the area of the light-transmitting hole 132 by the expansion and contraction film 133, the infrared light emitted by the infrared lamp 12 can be emitted from the package housing 11 at different angles of view, corresponding to different angles of view, The output module 10 can be used as a proximity infrared lamp or an infrared fill light, and the output module 10 integrates the function of emitting infrared light to perform infrared ranging and infrared filling. Furthermore, since only one infrared lamp 12 needs to be disposed on the package substrate 111 for packaging, compared with the conventional process, the infrared fill lamp and the near-infrared lamp need to be separately fabricated and assembled on the PCB substrate, thereby improving the package. Packaging efficiency. Finally, the electronic device 100 uses the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, instead of the traditional air-conducting sound receiver structure, on the one hand, can effectively ensure the privacy of the call content; The original receiver is eliminated, and the through hole corresponding to the receiver is avoided on the cover 30. The process is simpler, the appearance is more beautiful, and dust or moisture can be prevented from entering the electronic device 100.

Referring to FIGS. 27 and 30 , in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 . The casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a which are spaced apart from each other. The infrared lamp 12 corresponds to the infrared through hole 23 of the casing. The number of the piezoelectric elements 70 is plural, and the number of the chassis vibration through holes 2a is plural, and the plurality of piezoelectric elements 70 correspond to the plurality of casing vibration through holes 2a, and each of the piezoelectric elements 70 is housed in the corresponding machine. The shell vibrates in the through hole 2a. The output module 10, the infrared light camera 62, the visible light camera 61, the plurality of piezoelectric elements 70, and the structure light projector 80 are located on the same line segment, and an output module 10 is disposed between two adjacent piezoelectric elements 70. At least one of the infrared light camera 62, the visible light camera 61, and the structured light projector 80. For example, the number of the piezoelectric elements 70 is two, and the piezoelectric element 70, the output module 10, the structured light projector 80, the visible light camera 61, the infrared light camera 62, and the piezoelectric element 70 are sequentially arranged from one end of the line segment to the other end. (As shown in FIG. 30); or from one end of the line segment to the other end, the piezoelectric element 70, the output module 10, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80, and the like. For another example, the number of the piezoelectric elements 70 is three, and the piezoelectric element 70, the output module 10, the structured light projector 80, the piezoelectric element 70, the infrared light camera 62, and the visible light camera are sequentially arranged from one end of the line segment to the other end. 61. Piezoelectric element 70 (shown in FIG. 31); or from one end of the line segment to the other end, piezoelectric element 70, output module 10, piezoelectric element 70, infrared light camera 62, visible light camera 61, piezoelectric Element 70, structured light projector 80, and the like. Of course, the number of piezoelectric elements 70 and the arrangement of the piezoelectric elements 70, the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, a plurality of piezoelectric elements 70 are combined with the cover plate 30, specifically, the plurality of piezoelectric elements 70 are attached to the cover plate 30 by the joint members 30b, respectively. The processor of the electronic device 100 is configured to acquire a sound signal, and simultaneously apply an electrical signal corresponding to the sound signal at both ends of the plurality of piezoelectric elements 70, and the plurality of piezoelectric elements 70 are mechanically deformed, thereby, a plurality of pressures The electrical component 70 drives the vibration module 30a from a plurality of different positions coupled to the cover 30 to vibrate according to the frequency of the electrical signal. When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, teeth).

In the embodiment of the present invention, the plurality of piezoelectric elements 70 simultaneously vibrate the vibration module 30a from a plurality of different positions combined with the cover plate 30. The vibration of the vibration module 30a is relatively uniform and the strength is stronger, which is beneficial to the bone conduction sound. Stable conduction to the user's auditory nerve.

Referring to FIG. 27, FIG. 32 and FIG. 33, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a which are spaced apart from each other. The infrared lamp 12 corresponds to the infrared through hole 23 of the casing. The piezoelectric element 70 includes a piezoelectric body 71 and a piezoelectric bump 72 extending from the piezoelectric body 71. The number of the piezoelectric bumps 72 is plural, and the number of the chassis vibration through holes 2a is plural, and the plurality of pressures The electric bump 72 corresponds to the plurality of casing vibration through holes 2a, and each of the piezoelectric bumps 72 is partially housed in the corresponding casing vibration through hole 2a and combined with the cover plate 30. The output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover 30 and the piezoelectric body 71. The output module 10, the infrared light camera 62, the visible light camera 61, the plurality of piezoelectric bumps 72, and the structure light projector 80 are located on the same line segment, and an output module is disposed between the adjacent two piezoelectric bumps 72. 10. At least one of an infrared light camera 62, a visible light camera 61, and a structured light projector 80. For example, the number of the piezoelectric bumps 72 is two, and from one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the structured light projector 80, the visible light camera 61, the infrared light camera 62, and the piezoelectric The bump 72; or from one end of the line segment to the other end, is a piezoelectric bump 72, an output module 10, an infrared light camera 62, a visible light camera 61, a piezoelectric bump 72, a structured light projector 80, and the like. For another example, the number of the piezoelectric bumps 72 is three. From one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the structured light projector 80, the piezoelectric bump 72, and the infrared light camera 62 are sequentially arranged. The visible light camera 61 and the piezoelectric bump 72; or from the one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the piezoelectric bump 72, the infrared light camera 62, the visible light camera 61, and the piezoelectric bump Block 72, structured light projector 80, and the like. For example, the number of the piezoelectric bumps 72 is five. From one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the piezoelectric bump 72, the structured light projector 80, and the piezoelectric bump are sequentially arranged. 72. A visible light camera 61, a piezoelectric bump 72, an infrared light camera 62, and a piezoelectric bump 72 (shown in FIG. 33). Of course, the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72, the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, a plurality of piezoelectric bumps 72 are combined with the cover plate 30, and more specifically, a plurality of piezoelectric bumps 72 are attached to the cover plate 30 by the joint members 30b, respectively. The processor of the electronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bump 72 is mechanically deformed. Thus, the plurality of piezoelectric bumps 72 drive the vibration module 30a from a plurality of different positions combined with the cover plate 30 to vibrate according to the frequency of the electrical signal. When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, teeth).

In the embodiment shown in FIG. 33, the casing 20 is provided with a casing vibration through hole 2a, an output through hole 25, a structural light through hole 26, an infrared light through hole 27, and a visible light through hole 28 which are spaced apart from each other. The chassis vibration through hole 2a corresponds to the piezoelectric bump 72, the output through hole 25 corresponds to the output module 10, the structural light through hole 26 corresponds to the structured light projector 80, and the infrared light through hole 27 corresponds to the infrared light camera 62. The visible light through hole 28 corresponds to the visible light camera 61. The output through hole 25 is the above-mentioned casing infrared through hole 23. In addition, the structured light through hole 26 corresponds to the structured light projector 80. The structured light emitted by the structured light projector 80 can pass through the structured light through hole 26. The infrared light through hole 27 and the infrared light camera 62 correspond to the infrared light camera 62. The infrared light reflected by the object can be received from the infrared light through hole 27, and the visible light through hole 28 corresponds to the visible light camera 61, and the visible light camera 61 can receive the visible light reflected by the object from the visible light through hole 28.

In the embodiment of the present invention, the plurality of piezoelectric bumps 72 drive the vibration module 30a from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is relatively uniform and stronger, which is beneficial to the bone conduction sound. Stablely transmitted to the user's auditory nerve; in addition, a plurality of piezoelectric bumps 72 extend from the same piezoelectric body 71, thereby facilitating simultaneous application of electrical signals to the plurality of piezoelectric bumps 72 to simultaneously drive the vibration from a plurality of different positions. The module 30a is vibrated; further, the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover 30 and the piezoelectric body 71, and are provided with piezoelectric bumps 72 interposed therebetween. The overall size of the electronic device 100 is small, saving space.

Embodiment 3:

Referring to FIG. 34, the electronic device 100 of the present embodiment includes a casing 20, a cover 30, and electronic components. The electronic components include an output module 10, a proximity sensor 51 (Fig. 36), a light sensor 52, an imaging module 60 (Fig. 36), a receiver 70, and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here. The following is a description of the parts of the electronic device 100 of the present embodiment that are different from the electronic device 100 of the first embodiment. For the same parts, refer to the related description of the electronic device 100 of the first embodiment.

Referring to FIG. 9 , FIG. 34 and FIG. 35 , the casing 20 can be used as a mounting carrier of the output module 10 , or the output module 10 can be disposed in the casing 20 . The casing 20 includes a top portion 21 and a bottom portion 22, and the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100, as shown in FIG. The output module 10 is disposed between the top 21 and the bottom 22. The casing 20 is provided with a mounting groove 25 which is opened between the top portion 21 and the bottom portion 22. The casing 20 may be a middle case or an outer casing of the electronic device 100.

Referring to FIGS. 34 and 35, the display screen 90 is disposed on the casing 20 and closes the mounting groove 25 to form a closed installation space. Specifically, the display screen 90 is disposed between the top portion 21 and the bottom portion 22. The display screen 90 is formed with a transparent solid region 91 and a non-transmissive region 94. The transparent solid region 91 does not include image pixels and is surrounded by a plurality of image pixels. The image pixels are distributed in the non-transmissive region 94, in other words, non-transparent. The area 94 is the display area of the display screen 90, and the non-light transmitting area 94 is used to implement the display function of the display screen 90. Materials for the light transmissive solid region 91 include, but are not limited to, glass. Light outside the electronic device 100 can enter the electronic device 100 through the light transmissive physical area 91 without damaging the integrity of the display screen 90. The display screen 90 includes a front side 92 that is capable of displaying a picture and a back side 93 that is opposite the front side 92. Specifically, when the display screen 90 emits light and displays a picture, light emitted from the display screen 90 is emitted from the front surface 92 from the display screen 90; when the display screen 90 is mounted to the casing 20, the mounting groove 25 and the front surface 92 are located on the back side 93. The back sides (ie, the back side 93 is located between the front side 92 and the mounting groove 25). In the embodiment of the present invention, the output module 10 can be disposed between the edge of the display screen 90 and the top portion 21. Since the output module 10 of the embodiment of the present invention occupies a small volume, the casing 20 is used for setting display. The volume of the screen 90 will be correspondingly increased to increase the screen ratio of the electronic device 100. In other embodiments, the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90. In some embodiments, the light transmissive solid region 91 is thick and continuous with the surrounding non-transmissive region 94.

The other structures of the cover 30 and the casing 20 of the present embodiment are the same as those of the cover 30 and the casing 20 described in the first embodiment, and are not described herein again.

Referring to FIG. 35, the photosensor 52 is a single package structure. The light sensor 52 is mounted in the mounting groove 25 and on the side where the back surface 93 of the display screen 90 is located, in other words, the light sensor 52 is located below the display screen 90. The light sensor 52 corresponds to the light transmitting solid region 91. Specifically, the visible light outside the electronic device 100 can pass through the light transmitting solid region 91 and be transmitted to the light sensor 52. The infrared light 12 is used as an infrared light emitted outwardly when the infrared light is emitted. After being reflected by an external object, the infrared light is received by the proximity sensor 51. The proximity sensor 51 determines the external object and the electronic device 100 according to the intensity of the received reflected infrared light. The distance between them. The light sensor 52 receives visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90. In this embodiment, the light sensor 52 is first installed in the mounting groove 25 and then the display screen 90 is mounted on the casing 20. The light sensor 52 can be placed in contact with or spaced apart from the display screen 90. In other embodiments, the light sensor 52 can be first mounted on the display screen 90 and the light sensor 52 is corresponding to the light-transmissive physical area 91, and then the display screen 90 and the light sensor 52 are simultaneously mounted on the casing 20. .

The proximity sensor 51 is a single package. The infrared light emitted from the infrared lamp 13 is reflected by the external object and received by the proximity sensor 51. The proximity sensor 51 determines the distance between the external object and the electronic device 100 according to the received infrared light reflected by the object.

Referring to FIGS. 34 and 36, the imaging module 60 may be one or both of a visible light camera 61 and an infrared light camera 62. The imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65. In the embodiment shown in FIG. 36, the proximity sensor 51 is disposed on the mounting surface 631. Specifically, the proximity projection 51 is projected at least partially on the mounting surface 631 at the plane in which the mounting surface 631 is located, such that the proximity sensor The imaging module 60 is relatively compact and the lateral space occupied by the two is relatively small.

The receiver 70 and the structured light projector 80 of the present embodiment are the same as the receiver 70 and the structured light projector 80 described in the first embodiment, and are not described herein again.

In the embodiment shown in FIG. 34, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The center of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located. On the same line segment. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG. 11), at this time, the visible light camera 61 and the infrared The optical camera 62 may constitute a dual camera (as shown in FIG. 42); or from one end of the line to the other end, the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 (eg Figure 34); or from one end of the line segment to the other end of the infrared camera 62, the output module 10, the receiver 70, the visible light camera 61, the structured light projector 80; or from the end of the line to the other end of the infrared The optical camera 62, the visible light camera 61, the receiver 70, the output module 10, and the structured light projector 80. At this time, the visible light camera 61 and the infrared light camera 62 can constitute a dual camera (as shown in FIG. 42). Of course, the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circular arc shape. The center is arranged in a shape such as a rectangle.

Further, please refer to FIG. 36, the proximity sensor 51 may be disposed on the mounting surface 631 of the infrared light camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61. Of course, the proximity sensor 51 may not be disposed on the mounting surface 631. The proximity sensor 51 can be disposed adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted by the infrared lamp 12 when it is used as the proximity infrared lamp, and reflected by the external object; the proximity sensor 51 can also be connected to the receiver. 70 is adjacently arranged, and when the user answers the call, the proximity sensor 51 easily detects that the user's ear is close to the receiver 70.

In summary, in the electronic device 100 of the embodiment of the present invention, by changing the area of the light-transmitting hole 132 by the expansion and contraction film 133, the infrared light emitted by the infrared lamp 12 can be emitted from the package housing 11 at different angles of view, corresponding to different The output module 10 can be used as a near-infrared light or an infrared fill light, and the output module 10 integrates the functions of emitting infrared light to perform infrared ranging and infrared filling. Furthermore, since only one infrared lamp 12 needs to be disposed on the package substrate 111 for packaging, compared with the conventional process, the infrared fill lamp and the near-infrared lamp need to be separately fabricated and assembled on the PCB substrate, thereby improving the package. Packaging efficiency. At the same time, the light sensor 52 is disposed on the side of the back surface 93 of the display screen 90 (below the display screen 90), so that the light sensor 52 does not occupy the space between the edge of the display screen 90 and the edge of the casing 20, and the display The gap between the edge of the screen 90 and the edge of the casing 20 can be made smaller, that is, the display area of the display screen 90 can be increased to increase the screen ratio of the electronic device 100.

Referring to FIG. 34 and FIG. 35, in some embodiments, the transparent solid area 91 includes image pixels, and the electronic device 100 further includes a processor 96. The light sensor 52 receives the light incident on the light sensor 52 for output including The initial light intensity of the ambient light intensity information outside the electronic device 100. The processor 96 is configured to process the initial light intensity to obtain a target light intensity that includes only ambient light intensity information external to the electronic device 100.

Specifically, the transparent solid area 91 includes image pixels, and the transparent solid area 91 can be used to display image information, and ambient light can pass through the transparent solid area 91 and enter the electronic device 100. In some embodiments, the light transmissive solid region 91 may have a light transmittance of 50% or more. It can be understood that the light incident on the photosensor 52 includes both the portion of the ambient light passing through the transparent solid region 91 and the image pixels of the transparent solid region 91 being emitted to the inside of the electronic device 100 when the content is displayed. Shows the portion of the light. The processor 96 can determine the display light emitted by the light-transmitting physical region 91 received by the light sensor 52 to the light sensor 52 according to the content displayed by the light-transmissive physical region 91, so that the processor 96 can be based on the initial light intensity and the light sensor. 52 receives the light intensity generated by the display light to collectively determine the target light intensity including only the ambient light intensity information outside the electronic device 100. The electronic device 100 of the present embodiment can obtain ambient light intensity information outside the electronic device 100 as a basis for controlling the display brightness of the display screen 90.

Referring to FIG. 34 and FIG. 35, in some embodiments, the initial light intensity includes ambient light intensity information and display light intensity information received by the light sensor 52 when the display screen 90 displays an image, and the processor 96 is configured to acquire the display screen in real time. The display light intensity information received by the photo sensor 52 when the image is displayed is 90, and the display light intensity information is removed when the initial light intensity is processed to obtain the target light intensity.

Referring to FIG. 37, in some embodiments, the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case. The centers of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30. In the embodiment shown in FIG. 37, the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.

Referring to FIG. 38, in some embodiments, the imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66, and the proximity sensor 51 can also be fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC. A part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63. One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected. When the proximity sensor 51 is disposed on the substrate 66, the proximity sensor 51 is disposed outside the lens holder 63, and the proximity sensor 51 may be connected to the FPC.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62. Specifically, the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62.

Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the proximity sensor 51 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the proximity sensor 51 is disposed on the substrate 66. It is not easy to shake when it is. In one example, the proximity sensor 51 can also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.

Referring to FIG. 39 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: The imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface The 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671. The third sub-top surface 673 is obliquely connected to the second sub-top surface 672. The second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected. The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674. The lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68. The light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. Converted to an electrical signal. The proximity sensor 51 is disposed at the first sub top surface 671. In the embodiment, the imaging module 60 may be a visible light camera 61. In other embodiments, the imaging module 60 can be an infrared camera 62.

The imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 51 is disposed on the first sub-top surface 671, so that the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. Small, saving installation space in the electronic device 100.

Referring to FIG. 39, in some embodiments, the proximity sensor 51 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67. Specifically, the entire proximity sensor 51 is perpendicular to the first The projections of the sub-top surface 671 can all be located within the first sub-top surface 671 (as shown in FIG. 39); alternatively, the partial proximity sensor 51 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is to say, at least a portion of the proximity sensor 51 is located directly above the first sub-top surface 671. Thus, the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving electrons. The installation space within the device 100.

Referring to FIG. 40 , the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 51 and the imaging module 60 to the casing 20.

Referring to FIG. 41 , in some embodiments, the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The proximity sensor 51 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the proximity sensor 51 can also be coupled to the FPC.

The proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting the proximity sensor 51 and the imaging module 60 to the casing 20; The group 60 sets the substrate 66 and places the proximity sensor 51 on the substrate 66 so that the proximity sensor 51 can be stably mounted in the camera housing 67.

Referring to FIG. 42 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a. The first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678. The first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and The second step 678 is connected between the first step 677 and the second step 678. The angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle, and the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675. The center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675. The two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674. The two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68. Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65. In this embodiment, the imaging module 60 may be a visible light camera 61. In this case, the two lens modules 68 are lens modules corresponding to the visible light camera 61. The proximity sensor 51 is disposed on the second step 678 and outside the camera housing 67. In other embodiments, the imaging module 60 may be an infrared camera 62. In this case, the two lens modules 68 are lens modules corresponding to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Lens module.

The imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 51 is disposed on the second step 678, so that the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. The installation space in the electronic device 100 is saved.

Referring to FIG. 43, in some embodiments, the slit 675 of the above embodiment is disposed at an intermediate position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface. 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on The lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675. At this time, the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b. The first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface. Between the top surface 677a and the second step surface 678, the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678. In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b. The angle is an obtuse angle. In other embodiments, the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle. With respect to the opening position of the slit 675 at the edge of the top surface 670, the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the placement of the proximity sensor 51 on the second step 678. on.

Referring to FIGS. 42 and 43 , in some embodiments, the proximity sensor 51 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67 . Specifically, when the slit 675 is opened at the edge position of the top surface 670, the projection of the entire proximity sensor 51 along the second plane 678 may be located in the second step 678 (as shown in FIG. 42); or, part The proximity sensor 51 is located within the second step 678 along a projection perpendicular to the second step 678. That is, at least a portion of the proximity sensor 51 is located directly above the second step 678. When the slit 675 is opened in the middle of the top surface 670, the projection of the entire proximity sensor 51 along the second plane 678 can be located in the second step 678 (as shown in FIG. 43). As such, the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100.

Referring to FIG. 44 , the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 51 and the imaging module 60 to the casing 20.

Referring to FIG. 45 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The proximity sensor 51 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.

In the description of the present specification, the description with reference to the terms "some embodiments", "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the examples or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present invention, "a plurality" means at least two, for example two, three, unless specifically defined otherwise.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The scope of the invention is defined by the claims and their equivalents.

Claims

An output module includes a package housing, an infrared lamp, and a light-passing component, the package housing includes a package substrate, and the infrared lamp and the light-passing component are packaged in the same In the package housing, the infrared lamp is carried on the package substrate, the light-passing component is located on the light-emitting path of the infrared lamp, the light-passing component comprises a base body and a stretch film, and the base body is provided with light a hole, the telescopic film is received in the light-passing hole, and the stretch film can be deformed under the action of an electric field and change an area that blocks the light-passing hole, and the infrared light emitted by the infrared lamp can be different An angle of view exits from the package housing.
The output module according to claim 1, wherein said stretch film comprises a first surface bonded to an inner wall of said light passing hole, and a second surface opposite said first surface, in an electric field The second surface is deformable relative to the first surface to change an area of the light-transmitting film that blocks the light-passing aperture.
The output module according to claim 1 or 2, wherein the number of the light-passing holes is single, and the stretch film can be deformed under the action of an electric field to change the area of the single light-passing hole. ;or

The number of the light-passing holes is at least two, and the stretch film can also change the number of the light-blocking holes that are blocked by the electric field.
The output module according to claim 1, wherein the output module further comprises a chip, and the infrared lamp is formed on the chip.
The output module of claim 1 , wherein the package housing further comprises a package sidewall and a package top, the package sidewall extending from the package substrate and connected to the package top and the Between the package substrates, a light exit window is formed on the top of the package, and the light exit window corresponds to the infrared light.
The output module of claim 1 , wherein the output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located in the package Within the housing, the optical enclosure encases the infrared light.
An electronic device, comprising:

Case; and

The output module according to any one of claims 1 to 6, wherein the output module is disposed in the casing.
The electronic device according to claim 7, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing.
The electronic device according to claim 7, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing, and the surface of the cover plate and the casing is formed with infrared transmission ink that transmits only infrared light, and the infrared transmission ink blocks the through hole of the casing .
The electronic device according to claim 7, wherein the electronic device further comprises a receiving module and an imaging module, the receiving module is integrated with a proximity sensor and a light sensor, and the imaging module comprises a lens holder, a lens barrel mounted on the lens holder, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, the receiving module being disposed On the mounting surface.
The electronic device according to claim 7, wherein the electronic device further comprises a proximity sensor, a light sensor, and an imaging module, the imaging module comprising a lens holder and a mirror mounted on the lens holder a cartridge, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, and the proximity sensor and at least one of the light sensors are disposed On the mounting surface.
The electronic device according to claim 7, wherein the electronic device further comprises a receiver, an infrared camera, a visible light camera, a structured light projector, and a transparent cover plate, wherein the casing has an organic shell sound a hole, the cover plate is provided with a cover sound hole, the receiver corresponds to a position of the cover sound hole and the sound hole of the casing, the output module, the infrared light camera, the The center of the visible light camera and the structured light projector are located on the same line segment, and the receiver is located between the line segment and the top of the casing.
The electronic device according to claim 7, wherein the electronic device further comprises a receiving module and an imaging module, the imaging module is mounted on the casing, and the imaging module comprises a lens holder, a lens barrel mounted on the lens holder and a substrate partially disposed in the lens holder; the receiving module being disposed on the substrate, the receiving module comprising a proximity sensor and/or a light sensor.
An electronic device, comprising:

cabinet;

The output module according to any one of claims 1 to 6, wherein the output module is disposed in the casing;

a vibration module, the vibration module being mounted on the casing; and

a piezoelectric element coupled to the vibration module and spaced apart from the output module, the piezoelectric element being configured to deform when an electrical signal is applied to vibrate the vibration module.
The electronic device according to claim 14, wherein the vibration module comprises a display screen and a light-transmissive cover plate, and the display screen is disposed on the casing and forms a receiving cavity together with the casing The cover plate is disposed on the casing and located on a side of the display screen away from the receiving cavity, the display screen is combined with the cover plate, and the casing is provided with a casing spaced apart from each other The infrared through hole and the casing vibrate the through hole, and the infrared lamp corresponds to the infrared through hole of the casing, and the piezoelectric element is received in the vibration through hole of the casing and combined with the cover plate.
The electronic device according to claim 15, wherein said piezoelectric element and said display screen are attached to said cover by an engaging member.
The electronic device according to claim 15, wherein a surface of the cover plate combined with the casing is formed with infrared transmission ink that transmits only infrared light, and the infrared transmission ink blocks the casing. At least one of an infrared through hole and the chassis vibration through hole.
The electronic device according to claim 15, wherein the electronic device further comprises an infrared light camera, a visible light camera, and a structured light projector, the output module, the infrared light camera, the visible light camera, The piezoelectric element and the center of the structured light projector are located on the same line segment, and from one end to the other end of the line segment are:

The output module, the structured light projector, the piezoelectric element, the infrared light camera, the visible light camera; or

The output module, the infrared light camera, the piezoelectric element, the visible light camera, the structured light projector; or

The infrared light camera, the output module, the piezoelectric element, the visible light camera, the structured light projector; or

The infrared light camera, the visible light camera, the piezoelectric element, the output module, and the structured light projector.
The electronic device according to claim 15, wherein the electronic device further comprises an infrared light camera, a visible light camera, a structured light projector, the output module, the infrared light camera, the visible light camera, and the The center of the structured light projector is located on the same line segment, and the piezoelectric element is located between the line segment and the top of the casing.
The electronic device according to claim 15, wherein the electronic device further comprises an infrared light camera, a visible light camera, and a structured light projector, wherein the number of the piezoelectric elements is plural, and the casing vibrates a plurality of the plurality of piezoelectric elements corresponding to the plurality of the vibration through holes of the casing, each of the piezoelectric elements being housed in a corresponding vibration through hole of the casing, the output mode a group, the infrared light camera, the visible light camera, a plurality of the piezoelectric elements, and a center of the structured light projector are located on a same line segment, and the output is disposed between two adjacent piezoelectric elements At least one of a module, the infrared camera, the visible light camera, and the structured light projector.
The electronic device according to claim 15, wherein the electronic device further comprises an infrared light camera, a visible light camera, and a structured light projector, the piezoelectric element comprising a piezoelectric body and extending from the piezoelectric body Piezoelectric bumps, the number of the vibration through holes of the casing is plural, and the plurality of the piezoelectric bumps correspond to the plurality of the vibration through holes of the casing, and each of the piezoelectric bumps is partially received In the corresponding vibration through hole of the casing and combined with the cover plate, the output module, the infrared light camera, the visible light camera, and the structured light projector are located at the cover plate and the cover Between the piezoelectric bodies, the center of the output module, the infrared light camera, the visible light camera, the plurality of the piezoelectric bumps, and the structured light projector are located on the same line segment, adjacent to two At least one of the output module, the infrared camera, the visible light camera, and the structured light projector is disposed between the piezoelectric bumps.
The electronic device according to claim 14, wherein the electronic device further comprises a receiving module and an imaging module, the receiving module is integrated with a proximity sensor and a light sensor, and the imaging module comprises a lens holder, a lens barrel mounted on the lens holder, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, the receiving module being disposed On the mounting surface.
The electronic device according to claim 14, wherein the electronic device further comprises a proximity sensor, a light sensor, and an imaging module, the imaging module comprising a lens holder and a mirror mounted on the lens holder a cartridge, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, and the proximity sensor and at least one of the light sensors are disposed On the mounting surface.
The electronic device according to claim 22 or 23, wherein the imaging module comprises at least one of a visible light camera and an infrared light camera.
An electronic device, comprising:

cabinet;

The output module according to any one of claims 1 to 6, wherein the output module is mounted on the casing;

a display screen, the display screen is disposed on the casing, the display screen is formed with a light transmissive physical area and includes a front surface capable of displaying a picture and a back surface opposite to the front surface;

a light sensor, the light sensor is disposed on a side of the back surface of the display screen, the light sensor corresponds to the light transmissive physical area, and the light sensor is configured to receive incident light to the light Light on the sensor and output the target intensity of the light.
The electronic device according to claim 25, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing.
The electronic device according to claim 25, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing, and the surface of the cover plate and the casing is formed with infrared transmission ink that transmits only infrared light, and the infrared transmission ink blocks the through hole of the casing .
The electronic device according to claim 25, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module comprising a lens holder, a lens barrel mounted on the lens holder, and a housing An image sensor in the lens holder, the lens holder includes a mounting surface between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.
The electronic device according to claim 25, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module comprises a camera housing and a lens module, and a top surface of the camera housing is a step surface and including a connected first sub-top surface and a second sub-top surface, the second sub-top surface being inclined with respect to the first sub-top surface and forming a slit with the first sub-top surface, the top surface Having a light-emitting through hole, the lens module being received in the camera housing and corresponding to the light-emitting through hole; the proximity sensor being disposed at the first sub-top surface; or

The electronic device further includes a proximity sensor and an imaging module, the imaging module includes a camera housing and two lens modules, and the top surface of the camera housing is provided with a slit to form a stepped top surface. The top surface includes a first step surface and a second step surface lower than the first step surface, and the first step surface is provided with two through holes, each of the through holes corresponding to the lens module The proximity sensor is disposed at the second step.
The electronic device according to claim 25, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module comprising a lens holder, a lens barrel mounted on the lens holder, and a portion disposed on a substrate within the lens holder; the proximity sensor is disposed on the substrate.
The electronic device according to claim 25, wherein the light transmissive area comprises a light transmissive physical area, the light transmissive physical area comprises image pixels, and the electronic device further comprises a processor, the light sensor receiving The light is outputting an initial light intensity including ambient light intensity information outside the electronic device; the processor is configured to process the initial light intensity to obtain a target including only the ambient light intensity information outside the electronic device Light intensity.
The electronic device according to claim 31, wherein the initial light intensity comprises the ambient light intensity information and display light intensity information when the display screen displays an image, and the processor is configured to acquire the display in real time. The display light intensity information is displayed when the screen displays the image, and the display light intensity information is removed when the initial light intensity is processed to obtain the target light intensity.
The electronic device of claim 25, wherein the light transmissive region comprises a light transmissive solid region, the light transmissive solid region not containing image pixels and surrounded by a plurality of image pixels.