WO2019128605A1 - Module de sortie, module d'entrée et de sortie et appareil électronique - Google Patents

Module de sortie, module d'entrée et de sortie et appareil électronique Download PDF

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Publication number
WO2019128605A1
WO2019128605A1 PCT/CN2018/117920 CN2018117920W WO2019128605A1 WO 2019128605 A1 WO2019128605 A1 WO 2019128605A1 CN 2018117920 W CN2018117920 W CN 2018117920W WO 2019128605 A1 WO2019128605 A1 WO 2019128605A1
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WO
WIPO (PCT)
Prior art keywords
light source
infrared light
light
infrared
output module
Prior art date
Application number
PCT/CN2018/117920
Other languages
English (en)
Chinese (zh)
Inventor
吴安平
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201711435422.1A external-priority patent/CN108183990B/zh
Priority claimed from CN201711437437.1A external-priority patent/CN108200235B/zh
Priority claimed from CN201711433092.2A external-priority patent/CN108183984B/zh
Priority claimed from CN201711437124.6A external-priority patent/CN108023984B/zh
Priority claimed from CN201711437415.5A external-priority patent/CN108173992B/zh
Priority claimed from CN201711433413.9A external-priority patent/CN108040148B/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019128605A1 publication Critical patent/WO2019128605A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present invention relates to the field of consumer electronics, and more particularly to an output module, an input and output module, and an electronic device.
  • Embodiments of the present invention provide an output module, an input and output module, and an electronic device.
  • the output module of the embodiment of the present invention includes a package housing, a first infrared light source, and a second infrared light source disposed around the first infrared light source, the package housing includes a package substrate, and the first infrared light source and the The second infrared light source is encapsulated in the package housing and carried on the package substrate. When the second infrared light source is turned off, the first infrared light source emits infrared light outside the package housing with a first power.
  • the output module is used as a proximity infrared lamp; when the first infrared light source and the second infrared light source are both turned on and emit infrared light outside the package housing with a second power, the output module is used Make infrared fill light.
  • An electronic device includes a casing and an output module of the above embodiment, and the output module is disposed in the casing.
  • An electronic device includes a casing, an output module of the above embodiment, a vibration module, and a piezoelectric element, wherein the output module is disposed in the casing, and the vibration module is installed in the On the casing, the piezoelectric element is coupled to the vibration module and spaced apart from the output module, and the piezoelectric element is configured to deform when an electrical signal is applied to vibrate the vibration module.
  • An electronic device includes a casing, an output module of the above embodiment, a display screen, and a light sensor, wherein the output module is mounted on the casing, and the display screen is disposed in the casing
  • the display screen is formed with a light-transmissive physical area and includes a front surface capable of displaying a picture and a back surface opposite to the front surface, the light sensor being disposed on a side of the back side of the display screen,
  • the light sensor corresponds to the transparent solid region, and the light sensor is configured to receive light incident on the light sensor and output a target light intensity of the light.
  • An input/output module includes a package housing, a first infrared light source, a second infrared light source disposed around the first infrared light source, and a proximity sensor, the package housing including a package substrate, the first An infrared light source, the second infrared light source and the proximity sensor are both enclosed in the package housing and carried on the package substrate, and when the second infrared light source is turned off, the first infrared light source is first When the power is emitted to the outside of the package housing, the input/output module is used for infrared ranging; when the first infrared source and the second infrared source are both turned on and the second power is applied to the package
  • the infrared input light is used for infrared fill light when the infrared light is emitted in vitro; the proximity sensor is configured to receive infrared light reflected by the object to detect the distance of the object.
  • An input/output module includes a casing and an input/output module according to the above embodiment, and the input/output module is disposed in the casing.
  • An input/output module includes a package housing, a first infrared light source, a second infrared light source disposed around the first infrared light source, and a light sensor, the package housing including a package substrate, The first infrared light source, the second infrared light source and the light sensor are both enclosed in the package housing and carried on the package substrate.
  • the first infrared light source When the second infrared light source is turned off, the first infrared light source is When the first power emits infrared light to the outside of the package housing, the input/output module is used for infrared ranging; when the first infrared light source and the second infrared light source are both turned on and the second power is When the infrared light is emitted outside the package housing, the input/output module is used for infrared light filling; the light sensor is configured to receive visible light in ambient light and detect the intensity of the visible light.
  • An input/output module includes a casing and an input/output module according to the above embodiment, and the input/output module is disposed in the casing.
  • An input/output module includes a package housing, a first infrared light source, a second infrared light source disposed around the first infrared light source, a proximity sensor, and a light sensor, and the package housing includes a package substrate.
  • the first infrared light source, the second infrared light source, the proximity sensor, and the light sensor are both packaged in the package housing and carried on the package substrate, and when the second infrared light source is turned off, When the first infrared light source emits infrared light to the outside of the package housing at a first power, the input/output module is used for infrared ranging; when the first infrared light source and the second infrared light source are both turned on and When the two powers emit infrared light to the outside of the package housing, the input/output module is used for infrared fill light; the proximity sensor is configured to receive infrared light emitted by the first infrared light source reflected by the object to detect the The distance from the object to the input and output module, the photo sensor is configured to receive visible light in ambient light, and detect the intensity of the visible light.
  • An input/output module includes a casing and an input/output module according to the above embodiment, and the input/output module is disposed in the casing.
  • the output module by controlling the opening and closing of the first infrared light source and the second infrared light source, the output module can be used as a near-infrared lamp or as an Infrared fill light, which combines the function of emitting infrared light with infrared ranging and infrared fill light.
  • the first infrared light source and the second infrared light source are integrated into a single package structure, and the output module has high integration degree and small volume, and the output module saves space for realizing infrared fill light and infrared ranging function.
  • the first infrared light source and the second infrared light source are carried on the same package substrate, and the infrared fill light and the near-infrared light of the conventional process need to be respectively fabricated by different wafers and then assembled onto the PCB substrate for packaging, thereby improving Packaging efficiency.
  • FIG. 1 is a schematic structural view of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of an output module of an electronic device according to an embodiment of the present invention.
  • FIG. 4 are schematic diagrams showing states of an output module of an electronic device according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing an output module of an electronic device according to an embodiment of the present invention.
  • FIG. 6 to FIG. 8 are schematic diagrams showing distributions of a first infrared light source and a second infrared light source of an output module according to an embodiment of the present invention
  • FIG. 9 is a partial perspective view of an output module of an electronic device according to an embodiment of the present invention.
  • FIG. 10 is a partial cross-sectional view showing an electronic device according to an embodiment of the present invention.
  • FIG. 11 is a perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention.
  • FIG. 12 is a schematic view showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention.
  • FIG. 13 is a schematic cross-sectional view showing an output module of an electronic device according to an embodiment of the present invention.
  • FIG. 14 is a perspective view of a proximity sensor and an imaging module according to an embodiment of the present invention.
  • 15 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • 16 is a partial cross-sectional view showing an electronic device according to an embodiment of the present invention.
  • FIG. 17 is a perspective view of a receiving module and an imaging module according to an embodiment of the present invention.
  • 18 to 25 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention.
  • 26 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • Figure 27 is a cross-sectional view of the electronic device of Figure 26 taken along line A-A;
  • Figure 28 is a partial cross-sectional view of the electronic device of Figure 26 taken along line B-B;
  • 29 is a schematic view showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention.
  • FIG. 30 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • 31 to 32 are schematic diagrams showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention.
  • Figure 34 is a partial cross-sectional view of the electronic device of Figure 33 taken along line C-C;
  • 35 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
  • FIG. 36 is a schematic cross-sectional view of the electronic device of FIG. 35 taken along line D-D;
  • FIG. 37 is a perspective view of a proximity sensor and an imaging module of an electronic device according to some embodiments of the present invention.
  • 39 to 46 are perspective views of a proximity sensor and an imaging module of an electronic device according to some embodiments of the present invention.
  • 47 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
  • FIG. 48 is a perspective view of an input/output module of an electronic device according to some embodiments of the present invention.
  • FIG. 50 are schematic diagrams showing states of an input/output module of an electronic device according to some embodiments of the present invention.
  • 51 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the present invention.
  • FIG. 52 to FIG. 54 are schematic diagrams showing distributions of a first infrared light source and a second infrared light source of an input/output module according to some embodiments of the present invention.
  • 55 is a partial perspective view of an input/output module of an electronic device according to some embodiments of the present invention.
  • Figure 56 is a partial cross-sectional view showing an electronic device according to some embodiments of the present invention.
  • 57 is a perspective view of a photosensor and an imaging module of an electronic device according to some embodiments of the present invention.
  • FIG. 58 is a schematic diagram showing the arrangement of electronic components of an electronic device according to some embodiments of the present invention.
  • FIG. 59 is a schematic cross-sectional view showing an input/output module of an electronic device according to some embodiments of the present invention.
  • FIG. 60 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
  • 61 to 62 are partial cross-sectional views of an electronic device according to some embodiments of the present invention.
  • 63 to 70 are perspective views of a photosensor and an imaging module of an electronic device according to some embodiments of the present invention.
  • 71 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
  • FIG. 72 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
  • FIG. 73 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
  • FIG. 74 is a perspective view of an input/output module of an electronic device according to some embodiments of the present invention.
  • 75 to 76 are schematic diagrams showing states of an input/output module of an electronic device according to some embodiments of the present invention.
  • 77 is a cross-sectional view showing an input/output module of an electronic device according to some embodiments of the present invention.
  • FIG. 78 is a partial perspective view of an input/output module of an electronic device according to some embodiments of the present invention.
  • 79 is a partial cross-sectional view of an electronic device according to some embodiments of the present invention.
  • FIG. 80 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the present invention.
  • 81 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
  • 82-84 are partial cross-sectional views of an electronic device in accordance with some embodiments of the present invention.
  • the first feature "on” or “under” the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • an electronic device 100 includes a casing 20 , a cover 30 , and electronic components.
  • the electronic components include an output module 10, a receiving module 50 (Fig. 11), an imaging module 60 (Fig. 11), a receiver 70, and a structured light projector 80.
  • the electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc.
  • the embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.
  • the output module 10 is a single package structure, including a package housing 11 , a first infrared light source 12 , and a second infrared light source 13 .
  • the package housing 11 is used to simultaneously package the first infrared light source 12 and the second infrared light source 13, or the first infrared light source 12 and the second infrared light source 13 are simultaneously packaged in the package housing 11.
  • the package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113.
  • the package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the output module 10.
  • EMI electromagnetic interference
  • the package substrate 111 is used to carry the first infrared light source 12 and the second infrared light source 13.
  • the first infrared light source 12 and the second infrared light source 13 may be formed on one chip 14, and the first infrared light source 12, the second infrared light source 13 and the chip 14 are disposed together on the package substrate 111.
  • the chip 14 can be bonded to the package substrate 111.
  • the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the output module 10 in the electronic device 100.
  • the package sidewalls 112 may be disposed around the first infrared light source 12 and the second infrared light source 13.
  • the package sidewalls 112 extend from the package substrate 111, and the package sidewalls 112 may be combined with the package substrate 111.
  • the package sidewalls 112 and the package The substrate 111 is detachably connected to facilitate inspection of the first infrared light source 12 and the second infrared light source 13 after the package sidewalls 112 are removed.
  • the material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the first infrared source 12 and the second infrared source 13 from passing through the package sidewall 112.
  • the package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112.
  • the package top 113 is formed with a light-emitting window 1131 corresponding to the first infrared light source 12 and the second infrared light source 13, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light-emitting window 1131.
  • the package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed.
  • the light-emitting window 1131 is a through-hole
  • the material of the package top 113 is made of a material that is impermeable to infrared light.
  • the package top portion 113 is made of a material that is not transparent to infrared light and a material that transmits infrared light.
  • the light-emitting window 1131 is made of a material that transmits infrared light, and the rest is made of infrared-impermeable light. The material is made.
  • the light-emitting window 1131 may be formed with a lens structure to improve the infrared light emission angle emitted from the light-emitting window 1131.
  • the light-emitting window 1131 is formed with a concave lens structure to diverge the light passing through the light-emitting window 1131.
  • the light-emitting window 1131 is formed with a convex lens structure so that the light passing through the light-emitting window 1131 is gathered and emitted outward.
  • the first infrared light source 12 and the second infrared light source 13 may be formed on one chip 14 to further reduce the volume of the integrated first infrared light source 12 and the second infrared light source 13, and the preparation process is relatively simple.
  • the first infrared light source 12 and the second infrared light source 13 can emit infrared light.
  • both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11 (as shown in FIG. 3 )
  • the infrared light passes through the illumination window 1131 to be projected onto the surface of the object, and the electronic device 100
  • the infrared light camera 62 shown in FIG.
  • the output module 10 receives infrared light reflected by the object to acquire image information of the object.
  • the output module 10 is used as an infrared fill light (ie, for infrared fill light), and the first The infrared light source 12 and the second infrared light source 13 jointly emit infrared light for covering light, and the light-emitting area is larger, and the field of view ⁇ of the infrared light for filling light may be 60 degrees to 90 degrees, for example, infrared light for fill light.
  • the angle of view ⁇ of the light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees.
  • the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 51 of the electronic device 100 (As shown in FIG. 11) receiving infrared light reflected by the object to detect the distance of the object to the electronic device 100.
  • the output module 10 is used as a proximity infrared lamp (ie, for infrared ranging), and the first infrared light source 12
  • the infrared light area for infrared ranging is smaller, and the field of view ⁇ of infrared light is 10 degrees -30 degrees.
  • the field of view ⁇ of infrared light for infrared ranging is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees.
  • the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.
  • the output module 10 When the output module 10 is used as an infrared fill light and when used as a near-infrared light, it can emit infrared light to the outside of the package housing 11 with different power.
  • the output module 10 When the output module 10 is used as the infrared light, the infrared light is emitted to the outside of the package housing 11 by the first power, and when the output module 10 is used as the infrared fill light, the infrared light is emitted to the outside of the package housing 11 with the second power.
  • the first power may be less than the second power.
  • the second infrared light source 13 is disposed around the first infrared light source 12.
  • the first infrared light source 12 and the second infrared light source 13 may be represented as a circle, a ring, a square, a regular polygon or the like as a whole.
  • the first infrared light source 12 is a point light source
  • the second infrared light source 13 is also a point light source and the number is multiple (as shown in FIG. 6); or the first infrared light source 12 is a point light source
  • the second infrared light source 13 is a circular light source (as shown in FIG.
  • the first infrared light source 12 is a plurality of point light sources surrounding the ring shape
  • the second infrared light source 13 is a ring light source
  • the first infrared light source 12 is a plurality of point light sources surrounding the ring shape
  • the second infrared light source 13 is a point light source and has a plurality of numbers (as shown in FIG. 8); or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is plural; or the first infrared
  • the light source 12 is an annular light source; the second infrared light source 13 is an annular light source.
  • the output module 10 is formed with a ground pin 15 , a fill light pin 16 , and a proximity lamp pin 17 .
  • the ground pin 15, the fill lamp pin 16 and the proximity lamp pin 17 may be formed on the package substrate 111 when the ground pin 15 and the fill lamp pin 16 are enabled (ie, the ground pin 15 and the complement
  • the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (ie, the ground pin 15)
  • the first infrared light source 12 emits infrared light.
  • the casing 20 can be used as a mounting carrier for the output module 10 , or the output module 10 can be disposed in the casing 20 .
  • the casing 20 may be an outer casing of the electronic device 100.
  • the display 20 of the electronic device 100 may be disposed in the casing 20.
  • the output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100.
  • the casing 20 includes a top portion 21 and a bottom portion 22.
  • the display screen 90 and the output module 10 are disposed between the top portion 21 and the bottom portion 22.
  • the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100.
  • the output module 10 can be disposed between the display screen 90 and the top portion 21.
  • the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.
  • the casing 20 also has an organic casing through hole 23.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the casing through hole 23.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the through hole 23 of the casing, and the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the through hole 23 of the casing.
  • An infrared light source 12 and a second infrared light source 13 are opposite to the through hole 23 of the casing, and the light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the through hole 23 of the casing through the light guiding element.
  • the cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like.
  • the cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 coupled to the casing 20, and an outer surface 31 opposite the inner surface 32.
  • the light emitted by the output module 10 sequentially passes through the inner surface 32 and The outer surface 31 is then passed through the cover 30.
  • the cover plate 30 covers the through hole 23 of the casing, and the inner surface 32 of the cover plate 30 is coated with infrared ray transmitting ink 40, and the infrared ray transmitting ink 40 has a high infrared light.
  • the transmittance can be, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the infrared light transmitting ink on the electronic device 100 in normal use. Covered area.
  • the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.
  • the infrared transmission ink 40 can also block the through hole 23 of the casing (as shown in FIG. 10 ). It is difficult for the user to see the internal structure of the electronic device 100 through the through hole 23 of the casing, and the electronic device 100 has a beautiful appearance.
  • the receiving module 50 is integrated with a proximity sensor 51 and a light sensor 52.
  • the proximity sensor 51 and the light sensor 52 together form a single package structure.
  • the output module 10 is used as an infrared light emitted outwardly when the infrared lamp is emitted.
  • the proximity sensor 51 receives the infrared light between the external object and the electronic device 100. the distance.
  • the light sensor 52 receives visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90.
  • the proximity sensor 51 and the photo sensor 52 are collectively packaged into the receiving module 50 to reduce the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.
  • the imaging module 60 may be one or both of a visible light camera 61 and an infrared light camera 62 .
  • the imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65.
  • the lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63.
  • the mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65.
  • the receiving module 50 is disposed on the mounting surface 631 . Specifically, the orthographic projection of the receiving module 50 on the plane where the mounting surface 631 is located at least partially falls onto the mounting surface 631 .
  • the receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small.
  • the receiver 70 is configured to emit an acoustic signal when excited by a power source, and the user can make a call through the receiver 70.
  • the structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected.
  • the reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • the center of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located.
  • the output module 10 the infrared light camera 62, the receiver 70, the visible light camera 61, the structured light projector 80 shown in FIG.
  • the infrared light camera 62 and the output module from one end to the other end of the line segment.
  • the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circular arc shape. The center is arranged in a shape such as a rectangle.
  • the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62 or on the mounting surface 631 of the visible light camera 61. Of course, the receiving module 50 may not be installed. On the surface 631, the receiving module 50 can be disposed adjacent to the output module 10.
  • the proximity sensor 51 can easily receive the infrared light emitted by the output module 10 when it is used as an infrared light, and reflected by an external object; the receiving module The 50 can also be placed adjacent to the receiver 70, and when the user answers the call, the proximity sensor 51 can easily detect that the user's ear is close to the receiver 70.
  • the output module 10 can be used as a near-infrared light or as an infrared fill light.
  • the lamp combines the functions of emitting infrared light with infrared ranging and infrared filling.
  • the first infrared light source 12 and the second infrared light source 13 are integrated into a single package structure, and the output module 10 has a high integration degree and a small volume, and the output module 10 saves the infrared fill light and the infrared distance measurement. Functional space.
  • the infrared fill light and the near-infrared light of the conventional process need to be separately fabricated and assembled on the PCB substrate by using different wafers. Packaging improves package efficiency.
  • the output module 10 further includes a lens 18.
  • the lens 18 is disposed within the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13.
  • the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is concentrated by the lens 18 to be emitted into the light-emitting window 1131, and the amount of light emitted to the package side wall 112 and other areas of the package top 113 is reduced, and only needs to be satisfied.
  • the infrared field light for supplemental light emitted by the infrared light source 12 and the second infrared light source 13 passes through the lens 18 and has an angle of view ⁇ of 60 degrees to 90 degrees.
  • the infrared light emitted by the first infrared light source 12 is used for infrared ranging.
  • the angle of view ⁇ of the light after passing through the lens 18 is 10 degrees -30 degrees.
  • the lens 18 can be located on a transparent substrate, and more specifically, the lens 18 can be integrally formed with the transparent substrate.
  • the output module 10 may not be provided with the lens 18.
  • the output module 10 further includes an optical enclosure 19 .
  • the optical enclosure 19 is made of a light transmissive material, and an optical enclosure 19 is formed on the package substrate 111 and located within the package housing 11.
  • the optical enclosure 19 encases the first infrared source 12 and the second infrared source 13.
  • the optical enclosure 19 can be formed by a potting injection molding process, the optical enclosure 19 can be made of a transparent thermosetting epoxy resin to be hard to soften in use, and the optical enclosure 19 can fix the first infrared source 12 And the position of the second infrared light source 13, and the first infrared light source 12 and the second infrared light source 13 are not easily shaken in the package housing 11.
  • the proximity sensor 51 and the light sensor 52 may not be integrated in the receiving module 50 , or the proximity sensor 51 and the light sensor 52 may be separately disposed.
  • the proximity sensor 51 may be disposed on the mounting surface 631 of the lens holder 63; the light sensor 52 may also be disposed on the mounting surface 631 of the lens holder 63; or the proximity sensor 51 and the light sensor 52 may be disposed at the mirror holder 63 at the same time.
  • the mirror mount 63 may be the mirror mount 63 of the infrared light camera 62 or the mirror mount 63 of the visible light camera 61.
  • the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case.
  • the centers of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.
  • the center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30.
  • the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.
  • the cover plate 30 may further be provided with a cover through hole 33.
  • the cover through hole 33 corresponds to the through hole 23 of the casing, and the first infrared light source 12 and the second infrared light source are provided.
  • the infrared light emitted by the 13 passes through the through hole 23 of the casing to pass through the electronic device 100 from the through hole 33 of the cover.
  • the imaging module 60 further includes a substrate 66 .
  • the image sensor 65 is disposed on the substrate 66 , and the receiving module 50 can also be fixed on the substrate 66 .
  • the substrate 66 is provided with an FPC.
  • a part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63.
  • One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected.
  • the receiving module 50 is disposed on the substrate 66, the receiving module 50 is disposed outside the lens holder 63, and the receiving module 50 can also be connected to the FPC.
  • the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52.
  • the proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately, and saves electrons.
  • the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 or/and a light sensor 52, each of which is a single package structure.
  • the receiving module 50 disposed on the substrate 66 is a proximity sensor 51 having a single package structure; or the receiving module 50 disposed on the substrate 66 is a single package structure photo sensor 52; or, disposed on the substrate 66
  • the receiving module 50 is a proximity sensor 51 of a single package structure and a photosensor 52 of a single package structure.
  • the imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62.
  • the receiving module 50 can be fixed on the substrate 66 of the visible light camera 61; the receiving module 50 can be fixed on the substrate 66 of the infrared light camera 62.
  • the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61, and the light sensor 52 may be fixed on the substrate 66 of the infrared light camera 62; or, the light sensor 52 may be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62; or the proximity sensor 51 and the light sensor 52 may be fixed on the substrate 66 of the visible light camera 61; or Both the proximity sensor 51 and the light sensor 52 are fixed to the substrate 66 of the infrared light camera 62.
  • the substrate 66 further includes a reinforcing plate disposed on a side opposite to the receiving module 50 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the receiving module 50 is (or close to) When the sensor 51 or the photo sensor 52) is disposed on the substrate 66, it is less likely to be shaken.
  • the receiving module 50 (or the proximity sensor 51 or the light sensor 52) may also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 .
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface
  • the 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671.
  • the third sub-top surface 673 is obliquely connected to the second sub-top surface 672.
  • the second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected.
  • the angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle
  • the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the third sub-top surface 673 is provided with a light-emitting through hole 674.
  • the lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674.
  • the image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68.
  • the light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the image sensor 65 transmits the light signal. Converted to an electrical signal.
  • the receiving module 50 is disposed at the first sub-top surface 671, and the receiving module 50 includes a proximity sensor 51 and a photo sensor 52.
  • the imaging module 60 may be a visible light camera 61, and the receiving module 50 is a single package structure formed by the proximity sensor 51 and the light sensor 52.
  • the direction in which the proximity sensor 51 and the photosensor 52 are connected may coincide with the extending direction of the slit 675 (as shown in FIG. 18); or, the direction in which the proximity sensor 51 and the photosensor 52 are connected may be extended with the slit 675.
  • the angle formed by the direction perpendicular or both is an acute angle or an obtuse angle.
  • the imaging module 60 can be an infrared camera 62.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are relatively compact.
  • the space is small, and the installation space in the electronic device 100 is saved.
  • the proximity sensor 51 and the light sensor 52 are collectively packaged into the receiving module 50 to reduce the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.
  • the receiving module 50 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67. Specifically, the entire receiving module 50 is perpendicular to The projection of the first sub-top surface 671 may be located in the first sub-top surface 671 (as shown in FIG. 18); or, the partial receiving module 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671. Within 671. That is to say, at least a part of the receiving module 50 is located directly above the first sub-top surface 671.
  • the receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving The installation space in the electronic device 100.
  • the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures.
  • the proximity sensor 51 is a single package structure.
  • the photo sensor 52 can also be disposed on the first sub top surface 671.
  • the receiving module 50 of the above embodiment includes only the proximity sensor 51, and does not include the light sensor 52.
  • Each of the 52 is a single package structure, the proximity sensor 51 is disposed on the first sub-top surface 671, and the photo sensor 52 is disposed at any other position than the first sub-top surface 671.
  • the receiving module 50 of the above embodiment only includes the light sensor 52, and does not include the proximity sensor 51.
  • the light sensor 52 (or the receiving module 50) and The proximity sensors 51 are each a single package structure, the light sensor 52 is disposed on the first sub top surface 671, and the proximity sensor 51 is disposed at any other position than the first sub top surface 671.
  • the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.
  • the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676.
  • the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the photosensor 52.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.
  • the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the light transmission hole 676 may be a light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart and respectively The light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50.
  • the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures.
  • the proximity sensor 51 is a single package structure.
  • the light sensor 52 may also be disposed in the camera housing 67 and correspond to the light transmission hole 676.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.
  • the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the receiving module 50 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the receiving module 50 can also be connected to the FPC.
  • the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52.
  • the proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately. The installation space in the electronic device 100 is saved.
  • the receiving module 50 only includes the proximity sensor 51.
  • the light sensor 52 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the proximity sensor 51.
  • the device 52 is also a single package structure, and the light sensor 52 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67 and another portion is from the camera housing 67 When extended, the light sensor 52 can also be attached to the substrate 66 and located outside of the camera housing 67.
  • the receiving module 50 only includes the photo sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the photo sensor 52.
  • the proximity sensor 51 is also a single package structure, and the proximity sensor 51 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67, another portion is from the camera housing 67.
  • the proximity sensor 51 may also be fixed to the substrate 66 and located outside the camera housing 67 when projecting inside.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20;
  • the imaging module 60 is provided with a substrate 66 and the receiving module 50 is disposed on the substrate 66 so that the receiving module 50 can be stably mounted in the camera housing 67.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68.
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a.
  • the first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678.
  • the first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and
  • the second step 678 is connected between the first step 677 and the second step 678.
  • the angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle
  • the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675.
  • the center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675.
  • the two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674.
  • the two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68.
  • Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the imaging module 60 may be a visible light camera 61.
  • the two lens modules 68 are lens modules corresponding to the visible light camera 61.
  • the receiving module 50 is disposed on the second step 678 and located outside the camera housing 67.
  • the receiving module 50 is a single package structure formed by the proximity sensor 51 and the photo sensor 52.
  • the direction in which the proximity sensor 51 and the photosensor 52 are connected may coincide with the extending direction of the slit 675; or, the direction in which the proximity sensor 51 and the photosensor 52 are connected may be perpendicular to the extending direction of the slit 675 (as shown in FIG. 22).
  • the angle formed by either or both is an acute or obtuse angle.
  • the imaging module 60 may be an infrared camera 62.
  • the two lens modules 68 are lens modules corresponding to the infrared camera 62.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • One lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Corresponding lens module.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the receiving module 50 is disposed on the second step 678, so that the receiving module 50 and the imaging module 60 are relatively compact, and the horizontal space occupied by the two together The installation space is reduced in the electronic device 100.
  • the proximity sensor 51 and the photo sensor 52 are collectively packaged into the receiving module 50, which reduces the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.
  • the slit 675 of the above embodiment is disposed at an intermediate position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface.
  • 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on
  • the lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675.
  • the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b.
  • the first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface.
  • the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678.
  • the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b.
  • the angle is an obtuse angle.
  • the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle.
  • the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the setting of the receiving module 50 on the second surface. 678.
  • the receiving module 50 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67 .
  • the projection of the entire receiving module 50 along the second ladder surface 678 may be located in the second ladder surface 678; or, the partial receiving module 50 is vertical.
  • the projection of the second step 678 is located within the second step 678 (shown in Figure 22). That is, at least a portion of the receiving module 50 is located directly above the second step 678.
  • the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure.
  • the photo sensor 52 can also be disposed on the second step 678.
  • the receiving module 50 of the above embodiment includes only the proximity sensor 51, and the receiving module 50 does not include the light sensor 52.
  • the proximity sensor 51 (or the receiving module 50)
  • the photosensors 52 are each provided in a single package structure, the proximity sensor 51 is disposed on the second step 678, and the photosensor 52 is disposed on the casing 20 outside the imaging module 60.
  • the receiving module 50 of the above embodiment includes only the light sensor 52, and the receiving module 50 does not include the proximity sensor 51.
  • the proximity sensor 51 is each a single package structure, the light sensor 52 is disposed on the second step 678, and the proximity sensor 51 is disposed on the casing 20 outside the imaging module 60.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the photosensor 52.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676
  • the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the light transmission hole 676 may be a light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart and respectively The light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50.
  • the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures.
  • the proximity sensor 51 is a single package structure.
  • the light sensor 52 may also be disposed in the camera housing 67 and correspond to the light transmission hole 676.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676
  • the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the receiving module 50 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the receiving module 50 can also be connected to the FPC.
  • the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52.
  • the proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately. The installation space in the electronic device 100 is saved.
  • the receiving module 50 only includes the proximity sensor 51.
  • the light sensor 52 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the proximity sensor 51.
  • the device 52 is also a single package structure, and the light sensor 52 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67 and another portion is from the camera housing 67 When extended, the light sensor 52 can also be attached to the substrate 66 and located outside of the camera housing 67.
  • the receiving module 50 only includes the photo sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the photo sensor 52.
  • the proximity sensor 51 is also a single package structure, and the proximity sensor 51 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67 and another portion is inside the camera housing 67 The proximity sensor 51 can also be fixed to the substrate 66 and located outside the camera housing 67 when extended.
  • the receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20;
  • the imaging module 60 is provided with a substrate 66 and the receiving module 50 is disposed on the substrate 66 so that the receiving module 50 can be stably mounted in the camera housing 67.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • an electronic device 100 includes a casing 20, a cover 30, and electronic components.
  • the electronic component includes an output module 10, a vibration module 30a (as shown in FIG. 27), a piezoelectric element 70, a receiving module 50 (FIG. 11), an imaging module 60 (FIG. 11), and a structured light projector 80.
  • the electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc.
  • the embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.
  • the following is a description of the parts of the electronic device 100 of the present embodiment that are different from the electronic device 100 of the first embodiment. For the same parts, refer to the related description of the electronic device 100 of the first embodiment.
  • the output module 10 of the present embodiment has the same structure as that of the output module 10 described in the first embodiment, and details are not described herein again.
  • the casing 20 can be used as a mounting carrier for the output module 10 , or the output module 10 can be disposed in the casing 20 .
  • the casing 20 may be an outer casing of the electronic device 100.
  • the casing 20 includes a top portion 21 and a bottom portion 22. At a position corresponding to the electronic component, the casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a. .
  • the first infrared light source 12 and the second infrared light source 13 correspond to the casing infrared through hole 23.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the infrared through hole 23 of the casing, and the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the infrared through hole 23 of the casing.
  • the first infrared light source 12 and the second infrared light source 13 may be opposite to the infrared through hole 23 of the casing, or the light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the casing through the light guiding element. Infrared through hole 23.
  • the vibration module 30a is mounted on the casing 20.
  • the vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 is combined with the cover plate 30 to form a vibration module 30a to increase the rigidity of the vibration module 30a.
  • the display screen 90 is disposed on the casing 20 and forms a receiving cavity 91 with the casing 20.
  • the cover plate 30 is disposed on the casing 20 and located on a side of the display screen 90 away from the receiving cavity 91 to protect the display screen 90. Since the output module 10 of the embodiment of the present invention can occupy a small volume, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100.
  • the display screen 90, the output module 10, and the piezoelectric element 70 are disposed between the top portion 21 and the bottom portion 22.
  • the top portion 21 is located above the bottom portion 22, as shown in FIG.
  • the output module 10 can be disposed between the display screen 90 and the top portion 21.
  • the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.
  • the piezoelectric element 70 is made of a ceramic or quartz crystal material, and the piezoelectric element 70 may be a single wafer, a bimorph or a laminated piezoelectric element 70.
  • the piezoelectric element 70 is coupled to the vibration module 30a and spaced apart from the output module 10. Specifically, the piezoelectric element 70 is received in the vibration through hole 2a of the casing and combined with the cover plate 30, and is spaced apart from the casing 20, and the piezoelectric element 70 may be partially received in the vibration through hole 2a of the casing, or pressed.
  • the electrical component 70 is completely housed in the vibration hole 2a of the casing.
  • the piezoelectric element 70 When an electric signal (voltage) is applied to both ends of the piezoelectric element 70, the piezoelectric element 70 undergoes mechanical deformation such as expansion or contraction due to the inverse piezoelectric effect, thereby driving the vibration module coupled with the piezoelectric element 70.
  • 30a vibrates according to the frequency of the electrical signal.
  • the processor of the electronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal at both ends of the piezoelectric element 70.
  • the traditional receiver structure uses air-conducted sound, and the local sound pressure is generally between 90dB and 100dB when the receiver is working, and the sound is quiet even in the surrounding environment (such as the general office environment of about 50dB).
  • the retention is about 50dB ⁇ 60dB, which causes the conversation content between the callers to be perceived by the surroundings, resulting in private leakage.
  • the electronic device 100 of the embodiment of the present invention uses the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission.
  • the sound of the conversation is mainly perceived by the user through the vibration of the bone conduction, and the privacy of the conversation content can be effectively ensured.
  • the piezoelectric element 70 and display screen 90 are each attached to the cover 30 by a joint 30b.
  • the joining member 30b is an adhesive having heat curing characteristics, ultraviolet curing characteristics, double-sided tape, adhesive, or the like.
  • the joining member 30b may be an optically elastic resin (a colorless and transparent ultraviolet curable acrylic adhesive).
  • the area of the cover plate 30 that is coupled to the piezoelectric element 70 and the area of the cover plate 30 that is joined to the display screen 90 are spaced to prevent the display of the display screen 90 from being disturbed by the piezoelectric element 70.
  • the cover plate 30 can also be coupled to the casing 20 through the joint member 30b, and the cover plate 30 can be directly disposed on the casing 20, so that the vibration of the vibration module 30a can be prevented from being directly transmitted to the casing 20 to reduce The possibility that the user drops the electronic device 100 because the vibration amplitude of the casing 20 is excessive.
  • the cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like.
  • the cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 coupled to the casing 20, and an outer surface 31 opposite the inner surface 32.
  • the light emitted by the output module 10 sequentially passes through the inner surface 32 and The outer surface 31 is then passed through the cover 30.
  • the cover plate 30 covers the infrared through hole 23 of the casing, and the inner surface 32 of the cover plate 30 is coated with infrared ray transmitting ink 40, and the infrared ray transmitting ink 40 has a higher infrared light.
  • the transmittance can be, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the infrared transmission ink on the electronic device 100 in normal use. 40 covered areas.
  • the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.
  • the infrared transmission ink 40 can also block at least one of the infrared through hole 23 of the casing and the vibration through hole 2a of the casing, that is, the infrared transmission ink 40 can simultaneously cover the infrared through hole 23 of the casing and the vibration through hole 2a of the casing ( As shown in FIG. 28, it is difficult for the user to see the internal structure of the electronic device 100 through the infrared through-hole 23 of the casing and the vibration through-hole 2a of the casing.
  • the appearance of the electronic device 100 is beautiful; the infrared transmission ink 40 can also cover the casing.
  • the infrared through hole 23 does not cover the vibration through hole 2a of the casing; the infrared transmission ink 40 can also cover the vibration through hole 2a of the casing, and does not cover the infrared through hole 23 of the casing.
  • the receiving module 50 and the imaging module 60 of the present embodiment have the same structure and mutual positional relationship as the receiving module 50 and the imaging module 60 described in the first embodiment, and are not described herein again.
  • the structure light projector 80 of the present embodiment has the same structure as that of the structure light projector 80 described in the first embodiment, and details are not described herein again.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, an output module 10, an infrared light camera 62, a visible light camera 61, a piezoelectric element 70, and a structured light projector 80.
  • the center is on the same line segment. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the piezoelectric element 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG.
  • an output module 10 an infrared camera 62, a piezoelectric element 70, a visible light camera 61, and a structured light projector 80 (as shown in FIG. 26); or an infrared camera 62 from one end of the line to the other end.
  • the arrangement of the output module 10, the infrared light camera 62, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circle.
  • the arc shape and the center are arranged in a shape such as a rectangle.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • the centers of the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the casing 20.
  • the output module 10, the structured light projector 80, the infrared light camera 62, and the visible light camera 61 are sequentially arranged; or the output module 10 and the infrared light camera are sequentially from one end of the line segment to the other end.
  • the output module 10 is not limited to the above examples.
  • the center of the piezoelectric element 70 is not located on the line segment, which saves the electronic components on the cover 30 (output module 10, infrared camera 62, visible light camera 61, structured light projector 80, etc.) ) The horizontal space occupied.
  • the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62 or on the mounting surface 631 of the visible light camera 61. Of course, the receiving module 50 may not be installed. On the surface 631, the receiving module 50 can be disposed adjacent to the output module 10.
  • the proximity sensor 51 can easily receive the infrared light emitted by the output module 10 when it is used as an infrared light, and reflected by an external object; the receiving module 50 may also be disposed adjacent to the piezoelectric element 70, which is not limited herein.
  • the output module 10 can be used as a near-infrared light or as an infrared fill light.
  • the lamp combines the functions of emitting infrared light with infrared ranging and infrared filling.
  • the first infrared light source 12 and the second infrared light source 13 are integrated into a single package structure, and the output module 10 has a high integration degree and a small volume, and the output module 10 saves the infrared fill light and the infrared distance measurement. Functional space.
  • the electronic device 100 uses the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, instead of the traditional air-conducting sound receiver structure, on the one hand, can effectively ensure the privacy of the call content; The original receiver is eliminated, and the through hole corresponding to the receiver is avoided on the cover 30. The process is simpler, the appearance is more beautiful, and dust or moisture can be prevented from entering the electronic device 100.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 .
  • the casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a which are spaced apart from each other.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the casing infrared through hole 23.
  • the number of the piezoelectric elements 70 is plural, and the number of the chassis vibration through holes 2a is plural, and the plurality of piezoelectric elements 70 correspond to the plurality of casing vibration through holes 2a, and each of the piezoelectric elements 70 is housed in the corresponding machine.
  • the shell vibrates in the through hole 2a.
  • the output module 10, the infrared light camera 62, the visible light camera 61, the plurality of piezoelectric elements 70, and the structure light projector 80 are located on the same line segment, and an output module 10 is disposed between two adjacent piezoelectric elements 70. At least one of the infrared light camera 62, the visible light camera 61, and the structured light projector 80. For example, the number of the piezoelectric elements 70 is two, and the piezoelectric element 70, the output module 10, the structured light projector 80, the infrared light camera 62, the visible light camera 61, and the piezoelectric element 70 are sequentially arranged from one end of the line segment to the other end. (As shown in FIG.
  • the piezoelectric element 70, the output module 10, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80, and the like are sequentially arranged from one end of the line segment to the other end. 61.
  • Piezoelectric element 70 shown in FIG.
  • piezoelectric element 70 or from one end of the line segment to the other end, piezoelectric element 70, output module 10, piezoelectric element 70, infrared light camera 62, visible light camera 61, piezoelectric Element 70, structured light projector 80, and the like.
  • the number of piezoelectric elements 70 and the arrangement of the piezoelectric elements 70, the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples.
  • a plurality of piezoelectric elements 70 are combined with the cover plate 30, specifically, the plurality of piezoelectric elements 70 are attached to the cover plate 30 by the joint members 30b, respectively.
  • the processor of the electronic device 100 is configured to acquire a sound signal, and simultaneously apply an electrical signal corresponding to the sound signal at both ends of the plurality of piezoelectric elements 70, and the plurality of piezoelectric elements 70 are mechanically deformed, thereby, a plurality of pressures
  • the electrical component 70 drives the vibration module 30a from a plurality of different positions coupled to the cover 30 to vibrate according to the frequency of the electrical signal.
  • the vibration module 30a When the user's body comes into contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through the portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, the teeth).
  • the plurality of piezoelectric elements 70 simultaneously vibrate the vibration module 30a from a plurality of different positions combined with the cover plate 30.
  • the vibration of the vibration module 30a is relatively uniform and the strength is stronger, which is beneficial to the bone conduction sound. Stable conduction to the user's auditory nerve.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • the casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a which are spaced apart from each other.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the casing infrared through hole 23.
  • the piezoelectric element 70 includes a piezoelectric body 71 and a piezoelectric bump 72 extending from the piezoelectric body 71.
  • the number of the piezoelectric bumps 72 is plural, and the number of the chassis vibration through holes 2a is plural, and the plurality of pressures
  • the electric bump 72 corresponds to the plurality of casing vibration through holes 2a, and each of the piezoelectric bumps 72 is partially housed in the corresponding casing vibration through hole 2a and combined with the cover plate 30.
  • the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover 30 and the piezoelectric body 71.
  • the output module 10 the infrared light camera 62, the visible light camera 61, the plurality of piezoelectric bumps 72, and the structure light projector 80 are located on the same line segment, and an output module is disposed between the adjacent two piezoelectric bumps 72. 10. At least one of an infrared light camera 62, a visible light camera 61, and a structured light projector 80.
  • the number of the piezoelectric bumps 72 is two, from one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the structured light projector 80, the infrared light camera 62, the visible light camera 61, and the piezoelectric The bump 72; or from one end of the line segment to the other end, is a piezoelectric bump 72, an output module 10, an infrared light camera 62, a visible light camera 61, a piezoelectric bump 72, a structured light projector 80, and the like.
  • the number of the piezoelectric bumps 72 is three.
  • the piezoelectric bump 72, the output module 10, the structured light projector 80, the piezoelectric bump 72, and the infrared light camera 62 are sequentially arranged.
  • the number of the piezoelectric bumps 72 is five.
  • the piezoelectric bump 72, the output module 10, the piezoelectric bump 72, the structured light projector 80, and the piezoelectric bump are sequentially arranged.
  • the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72, the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples.
  • a plurality of piezoelectric bumps 72 are combined with the cover plate 30, and more specifically, a plurality of piezoelectric bumps 72 are attached to the cover plate 30 by the joint members 30b, respectively.
  • the processor of the electronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bump 72 is mechanically deformed.
  • the plurality of piezoelectric bumps 72 drive the vibration module 30a from a plurality of different positions combined with the cover plate 30 to vibrate according to the frequency of the electrical signal.
  • the bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, teeth).
  • the casing 20 is provided with a casing vibration through hole 2a, an output through hole 25, a structural light through hole 26, an infrared light through hole 27, and a visible light through hole 28 which are spaced apart from each other.
  • the chassis vibration through hole 2a corresponds to the piezoelectric bump 72
  • the output through hole 25 corresponds to the output module 10
  • the structural light through hole 26 corresponds to the structured light projector 80
  • the infrared light through hole 27 corresponds to the infrared light camera 62.
  • the visible light through hole 28 corresponds to the visible light camera 61.
  • the output through hole 25 is the above-mentioned casing infrared through hole 23.
  • the structured light through hole 26 corresponds to the structured light projector 80.
  • the structured light emitted by the structured light projector 80 can pass through the structured light through hole 26.
  • the infrared light through hole 27 and the infrared light camera 62 correspond to the infrared light camera 62.
  • the infrared light reflected by the object can be received from the infrared light through hole 27, and the visible light through hole 28 corresponds to the visible light camera 61, and the visible light camera 61 can receive the visible light reflected by the object from the visible light through hole 28.
  • the plurality of piezoelectric bumps 72 drive the vibration module 30a from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is relatively uniform and stronger, which is beneficial to the bone conduction sound. Stablely transmitted to the user's auditory nerve; in addition, a plurality of piezoelectric bumps 72 extend from the same piezoelectric body 71, thereby facilitating simultaneous application of electrical signals to the plurality of piezoelectric bumps 72 to simultaneously drive the vibration from a plurality of different positions.
  • the module 30a is vibrated; further, the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover 30 and the piezoelectric body 71, and are provided with piezoelectric bumps 72 interposed therebetween.
  • the overall size of the electronic device 100 is small, saving space.
  • the output module 10 further includes an infrared lens 18.
  • the infrared lens 18 is disposed within the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13.
  • the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is concentrated by the infrared lens 18 to be emitted into the light-emitting window 1131, and the amount of light emitted to the package side wall 112 and other areas of the package top 113 is reduced, and only needs to be satisfied.
  • the field of view ⁇ of the infrared light for supplemental light emitted by the first infrared light source 12 and the second infrared light source 13 after passing through the infrared lens 18 is 60 degrees to 90 degrees, and the first infrared light source 12 is used for infrared ranging.
  • the infrared field of the infrared light passes through the infrared lens 18 and has an angle of view ⁇ of 10 to 30 degrees.
  • the infrared lens 18 can be located on a transparent substrate, and more specifically, the infrared lens 18 can be integrally formed with the transparent substrate.
  • the output module 10 may not be provided with the infrared lens 18.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • an electronic device 100 includes a casing 20, a cover 30, a display screen 90, and electronic components.
  • the electronic components include an output module 10, a proximity sensor 51 (Fig. 37), a light sensor 52, an imaging module 60 (Fig. 37), a receiver 70, and a structured light projector 80.
  • the electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc.
  • the embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.
  • the following is a description of the parts of the electronic device 100 of the present embodiment that are different from the electronic device 100 of the first embodiment. For the same parts, refer to the related description of the electronic device 100 of the first embodiment.
  • the output module 10 of the present embodiment has the same structure as that of the output module 10 described in the first embodiment, and details are not described herein again.
  • the casing 20 can be used as a mounting carrier of the output module 10 , or the output module 10 can be disposed in the casing 20 .
  • the casing 20 includes a top portion 21 and a bottom portion 22, and the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100, as shown in FIG.
  • the output module 10 is disposed between the top 21 and the bottom 22.
  • the casing 20 is provided with a mounting groove 25 which is opened between the top portion 21 and the bottom portion 22.
  • the casing 20 may be a middle case or an outer casing of the electronic device 100.
  • the display screen 90 is disposed on the casing 20 and closes the mounting groove 25 to form a closed installation space. Specifically, the display screen 90 is disposed between the top portion 21 and the bottom portion 22.
  • the display screen 90 is formed with a transparent solid region 91 and a non-transmissive region 94.
  • the transparent solid region 91 does not include image pixels and is surrounded by a plurality of image pixels.
  • the image pixels are distributed in the non-transmissive region 94, in other words, non-transparent.
  • the area 94 is the display area of the display screen 90, and the non-light transmitting area 94 is used to implement the display function of the display screen 90.
  • Materials for the light transmissive solid region 91 include, but are not limited to, glass.
  • the display screen 90 includes a front side 92 that is capable of displaying a picture and a back side 93 that is opposite the front side 92. Specifically, when the display screen 90 emits light and displays a picture, light emitted from the display screen 90 is emitted from the front surface 92 from the display screen 90; when the display screen 90 is mounted to the casing 20, the mounting groove 25 and the front surface 92 are located on the back side 93. The back sides (ie, the back side 93 is located between the front side 92 and the mounting groove 25).
  • the output module 10 can be disposed between the edge of the display screen 90 and the top portion 21. Since the output module 10 of the embodiment of the present invention occupies a small volume, the casing 20 is used for setting display. The volume of the screen 90 will be correspondingly increased to increase the screen ratio of the electronic device 100.
  • the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.
  • the light transmissive solid region 91 is thick and continuous with the surrounding non-transmissive region 94.
  • cover 30 and the casing 20 of the present embodiment are the same as those of the cover 30 and the casing 20 described in the first embodiment, and are not described herein again.
  • the photo sensor 52 is a single package structure.
  • the light sensor 52 is mounted in the mounting groove 25 and on the side where the back surface 93 of the display screen 90 is located, in other words, the light sensor 52 is located below the display screen 90.
  • the light sensor 52 corresponds to the light transmitting solid region 91. Specifically, the visible light outside the electronic device 100 can pass through the light transmitting solid region 91 and be transmitted to the light sensor 52.
  • the light sensor 52 receives visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90.
  • the light sensor 52 is first installed in the mounting groove 25 and then the display screen 90 is mounted on the casing 20.
  • the light sensor 52 can be placed in contact with or spaced apart from the display screen 90. In other embodiments, the light sensor 52 can be first mounted on the display screen 90 and the light sensor 52 is corresponding to the light-transmissive physical area 91, and then the display screen 90 and the light sensor 52 are simultaneously mounted on the casing 20. .
  • the proximity sensor 51 is a single package structure.
  • the infrared light emitted from the first infrared light source 12 is reflected by the external object and received by the proximity sensor 51.
  • the proximity sensor 51 determines the distance between the external object and the electronic device 100 according to the received infrared light reflected by the object.
  • the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 .
  • the imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65.
  • the lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63.
  • the mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65.
  • the proximity sensor 51 is disposed on the mounting surface 631. Specifically, the proximity projection 51 is projected at least partially onto the mounting surface 631 at the plane in which the mounting surface 631 is located, such that the proximity sensor
  • the imaging module 60 is relatively compact and the lateral space occupied by the two is relatively small.
  • the receiver 70 and the structured light projector 80 of the present embodiment are the same as the receiver 70 and the structured light projector 80 described in the first embodiment, and are not described herein again.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • the center of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located.
  • the optical camera 62 may constitute a dual camera (as shown in FIG.
  • the output module 10 or from one end of the line to the other end, the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 (eg, Figure 35); or from one end of the line segment to the other end of the infrared camera 62, the output module 10, the receiver 70, the visible light camera 61, the structured light projector 80; or from the end of the line to the other end of the infrared
  • the optical camera 62, the visible light camera 61, the receiver 70, the output module 10, and the structured light projector 80 can constitute a dual camera (as shown in FIG. 43).
  • the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circular arc shape. The center is arranged in a shape such as a rectangle.
  • the proximity sensor 51 may be disposed on the mounting surface 631 of the infrared light camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61. Of course, the proximity sensor 51 may not be disposed on the mounting surface 631.
  • the proximity sensor 51 can be disposed adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted by the output module 10 when it is used as an infrared light, and reflected by an external object; the proximity sensor 51 can also be The receiver 70 is disposed adjacent to each other, and when the user answers the call, the proximity sensor 51 easily detects that the user's ear is close to the receiver 70.
  • the output module 10 can be used as a near-infrared light or as an infrared fill light.
  • the lamp combines the functions of emitting infrared light with infrared ranging and infrared filling.
  • the first infrared light source 12 and the second infrared light source 13 are integrated into a single package structure, and the output module 10 has a high integration degree and a small volume, and the output module 10 saves the infrared fill light and the infrared distance measurement. Functional space.
  • the infrared fill light and the near-infrared light of the conventional process need to be separately fabricated and assembled on the PCB substrate by using different wafers.
  • Packaging improves package efficiency.
  • the light sensor 52 is disposed on the side of the back surface 93 of the display screen 90 (below the display screen 90), so that the light sensor 52 does not occupy the space between the edge of the display screen 90 and the edge of the casing 20, and the display
  • the gap between the edge of the screen 90 and the edge of the casing 20 can be made smaller, that is, the display area of the display screen 90 can be increased to increase the screen ratio of the electronic device 100.
  • the transparent solid area 91 includes image pixels
  • the electronic device 100 further includes a processor 96.
  • the light sensor 52 receives light incident on the light sensor 52 to output including The initial light intensity of the ambient light intensity information outside the electronic device 100.
  • the processor 96 is configured to process the initial light intensity to obtain a target light intensity that includes only ambient light intensity information external to the electronic device 100.
  • the transparent solid area 91 includes image pixels, and the transparent solid area 91 can be used to display image information, and ambient light can pass through the transparent solid area 91 and enter the electronic device 100.
  • the light transmissive solid region 91 may have a light transmittance of 50% or more. It can be understood that the light incident on the photosensor 52 includes both the portion of the ambient light passing through the transparent solid region 91 and the image pixels of the transparent solid region 91 being emitted to the inside of the electronic device 100 when the content is displayed. Shows the portion of the light.
  • the processor 96 can determine the display light emitted by the light-transmitting physical region 91 received by the light sensor 52 to the light sensor 52 according to the content displayed by the light-transmissive physical region 91, so that the processor 96 can be based on the initial light intensity and the light sensor. 52 receives the light intensity generated by the display light to collectively determine the target light intensity including only the ambient light intensity information outside the electronic device 100.
  • the electronic device 100 of the present embodiment can obtain ambient light intensity information outside the electronic device 100 as a basis for controlling the display brightness of the display screen 90.
  • the initial light intensity includes ambient light intensity information and display light intensity information received by the light sensor 52 when the display screen 90 displays an image
  • the processor 96 is configured to acquire the display screen in real time.
  • the display light intensity information received by the photo sensor 52 when the image is displayed is 90, and the display light intensity information is removed when the initial light intensity is processed to obtain the target light intensity.
  • the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case.
  • the centers of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.
  • the center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30.
  • the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66, and the proximity sensor 51 can also be fixed on the substrate 66.
  • the substrate 66 is provided with an FPC.
  • a part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63.
  • One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected.
  • the proximity sensor 51 is disposed on the substrate 66, the proximity sensor 51 is disposed outside the lens holder 63, and the proximity sensor 51 can also be connected to the FPC.
  • the imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62.
  • the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62.
  • the substrate 66 further includes a reinforcing plate disposed on a side opposite to the proximity sensor 51 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the proximity sensor 51 is disposed on the substrate 66. It is not easy to shake when it is.
  • the proximity sensor 51 can also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 .
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface
  • the 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671.
  • the third sub-top surface 673 is obliquely connected to the second sub-top surface 672.
  • the second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected.
  • the angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle
  • the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the third sub-top surface 673 is provided with a light-emitting through hole 674.
  • the lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674.
  • the image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68.
  • the light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the image sensor 65 transmits the light signal. Converted to an electrical signal.
  • the proximity sensor 51 is disposed at the first sub top surface 671.
  • the imaging module 60 may be a visible light camera 61. In other embodiments, the imaging module 60 can be an infrared camera 62.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 51 is disposed on the first sub-top surface 671, so that the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. Small, saving installation space in the electronic device 100.
  • the proximity sensor 51 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67. Specifically, the entire proximity sensor 51 is perpendicular to the first
  • the projections of the sub-top surface 671 can all be located within the first sub-top surface 671 (as shown in FIG. 40); alternatively, the partial proximity sensor 51 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is to say, at least a portion of the proximity sensor 51 is located directly above the first sub-top surface 671.
  • the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving electrons. The installation space within the device 100.
  • the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51.
  • the proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 51 and the imaging module 60 to the casing 20.
  • the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the proximity sensor 51 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the proximity sensor 51 can also be coupled to the FPC.
  • the proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting the proximity sensor 51 and the imaging module 60 to the casing 20;
  • the group 60 sets the substrate 66 and places the proximity sensor 51 on the substrate 66 so that the proximity sensor 51 can be stably mounted in the camera housing 67.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68.
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a.
  • the first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678.
  • the first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and
  • the second step 678 is connected between the first step 677 and the second step 678.
  • the angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle
  • the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675.
  • the center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675.
  • the two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674.
  • the two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68.
  • Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the imaging module 60 may be a visible light camera 61.
  • the two lens modules 68 are lens modules corresponding to the visible light camera 61.
  • the proximity sensor 51 is disposed on the second step 678 and outside the camera housing 67.
  • the imaging module 60 may be an infrared camera 62.
  • the two lens modules 68 are lens modules corresponding to the infrared camera 62.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • the lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Lens module.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 51 is disposed on the second step 678, so that the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. The installation space in the electronic device 100 is saved.
  • the slit 675 of the above embodiment is disposed at an intermediate position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface.
  • 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on
  • the lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675.
  • the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b.
  • the first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface.
  • the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678.
  • the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b.
  • the angle is an obtuse angle.
  • the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle.
  • the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the placement of the proximity sensor 51 on the second step 678. on.
  • the proximity sensor 51 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67 .
  • the projection of the entire proximity sensor 51 along the second ladder surface 678 may be located in the second ladder surface 678 (as shown in FIG. 43); or, part
  • the proximity sensor 51 is located within the second step 678 along a projection perpendicular to the second step 678. That is, at least a portion of the proximity sensor 51 is located directly above the second step 678.
  • the projection of the entire proximity sensor 51 along the second plane 678 can be located within the second step 678 (as shown in FIG. 44).
  • the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51.
  • the proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 51 and the imaging module 60 to the casing 20.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676
  • the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the proximity sensor 51 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the proximity sensor 51 can also be coupled to the FPC.
  • the proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting the proximity sensor 51 and the imaging module 60 to the casing 20;
  • the group 60 sets the substrate 66 and places the proximity sensor 51 on the substrate 66 so that the proximity sensor 51 can be stably mounted in the camera housing 67.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • an electronic device 100 includes a casing 20, a cover 30, and electronic components.
  • the electronic components include an input and output module 10, a photosensor 50 (Fig. 57), an imaging module 60 (Fig. 57), a receiver 70, and a structured light projector 80.
  • the electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc.
  • the embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.
  • the input/output module 10 is a single package structure including a package housing 11, a first infrared light source 12, a second infrared light source 13, and a proximity sensor 1a.
  • the package housing 11 is for simultaneously packaging the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a, or the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a are both packaged in the package housing 11 at the same time.
  • the package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113.
  • the package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the input/output module 10.
  • EMI electromagnetic interference
  • the package substrate 111 is used to carry the first infrared light source 12, the second infrared light source 13, and the proximity sensor 1a.
  • the first infrared light source 12, the second infrared light source 13, and the proximity sensor 1a may be formed on one chip 14, and then the first infrared light source 12, the second infrared light source 13, the proximity sensor 1a, and
  • the chip 14 is disposed on the package substrate 111 together. Specifically, the chip 14 can be bonded to the package substrate 111.
  • the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the input/output module 10 in the electronic device 100.
  • the package sidewalls 112 may be disposed around the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a.
  • the package sidewalls 112 extend from the package substrate 111, and the package sidewalls 112 may be combined with the package substrate 111.
  • the package side The wall 112 is detachably connected to the package substrate 111 to facilitate inspection of the first infrared light source 12, the second infrared light source 13, and the proximity sensor 1a after the package sidewall 112 is removed.
  • the material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the first infrared source 12 and the second infrared source 13 from passing through the package sidewall 112.
  • the package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112.
  • the package top 113 is formed with a light-emitting window 1131 and a proximity sensing window 1132.
  • the light-emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13.
  • the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is emitted from the light-emitting window.
  • 1131 is passed out;
  • the proximity sensing window 1132 corresponds to the proximity sensor 1a, and infrared light reflected by the object can pass through the proximity sensing window 1132 and be incident on the proximity sensor 1a.
  • the package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed.
  • the light-emitting window 1131 and the proximity sensing window 1132 are both through-holes, and the package top portion 113 is made of a material that is impermeable to infrared light and visible light.
  • the package top 113 is made of a material that is not transparent to infrared light, infrared light, and a material that is not transparent to visible light.
  • the light emitting window 1131 and the proximity sensing window 1132 are made of infrared light transmissive material. The remaining portion is made of a material that is opaque to infrared light and opaque to visible light.
  • the light-emitting window 1131 may be formed with a lens structure to improve an infrared light emission angle emitted from the light-emitting window 1131.
  • the light-emitting window 1131 is formed. a concave lens structure for diverging and emitting light rays passing through the light-emitting window 1131; the light-emitting window 1131 is formed with a convex lens structure to cause the light passing through the light-emitting window 1131 to be gathered and emitted outward; the proximity sensing window 1132 may also be formed with a lens structure.
  • the proximity sensing window 1132 has a convex lens structure to cause the light incident from the proximity sensing window 1132 to be gathered and projected onto the proximity sensor 1a.
  • the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a may be formed on one chip 14, further reducing the volume of the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a after integration, and the preparation process It's simpler.
  • the first infrared light source 12 and the second infrared light source 13 can emit infrared light. When both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11 (as shown in FIG.
  • infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the electronic device 100
  • the infrared light camera 62 (shown in FIG. 47) receives infrared light reflected by the object to acquire image information of the object.
  • the input/output module 10 is used for infrared fill light, and the first infrared light source 12 and the second infrared light source are used. 13
  • the common light emitted by the infrared light for supplemental light has a large light-emitting area, and the field of view ⁇ of the infrared light for fill light may be 60 degrees to 90 degrees. For example, the field of view ⁇ of the infrared light for fill light is 60.
  • the second infrared light source 13 When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11 (as shown in FIG. 50), the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 1a of the electronic device 100 Receiving infrared light reflected by the object to detect the distance of the object to the electronic device 100.
  • the input/output module 10 is used for infrared ranging, and the infrared light covered by the first infrared light source 12 is used for infrared light coverage.
  • the area is small, and the field of view ⁇ of infrared light for infrared ranging is 10 degrees -30 degrees.
  • the field of view ⁇ of infrared light for infrared ranging is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees. Degrees, etc.
  • the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.
  • Light sensor 50 (shown in Figure 57) receives visible light in ambient light and detects the intensity of visible light.
  • the input/output module 10 is used for infrared fill light and for emitting infrared light to the outside of the package housing 11 with different power when used for near infrared ranging.
  • the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 at a first power when approaching the infrared ranging, and the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 with the second power when the infrared fills the light.
  • the first power may be less than the second power.
  • the second infrared light source 13 is disposed around the first infrared light source 12.
  • the first infrared light source 12 and the second infrared light source 13 may be represented as a circle, a ring, a square, a regular polygon or the like as a whole.
  • the first infrared light source 12 is a point light source
  • the second infrared light source 13 is also a point light source and the number is multiple (as shown in FIG. 51); or the first infrared light source 12 is a point light source
  • the second infrared light source 13 is An annular light source (as shown in FIG.
  • the first infrared light source 12 is a plurality of point light sources surrounding the ring shape, and the second infrared light source 13 is an annular light source; or the first infrared light source 12 is a plurality of point light sources surrounding the ring shape
  • the second infrared light source 13 is a point light source and has a plurality of numbers (as shown in FIG. 53); or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is plural; or the first infrared
  • the light source 12 is an annular light source; the second infrared light source 13 is an annular light source.
  • the proximity sensor 1a is disposed on one side of the first infrared light source 12 and the second infrared light source 13, that is, the proximity sensor 1a is disposed outside the space surrounded by the second infrared light source 13.
  • the input/output module 10 is formed with a ground pin 15, a fill light pin 16, a proximity lamp pin 17, and a proximity sensor pin 1c.
  • the ground pin 15, the fill lamp pin 16, the proximity lamp pin 17, and the proximity sensing pin 1c may be formed on the package substrate 111 when the ground pin 15 and the fill lamp pin 16 are enabled (ie, When the ground pin 15 and the fill lamp pin 16 are connected to the circuit, the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (ie, when the ground pin 15 and the proximity lamp pin 17 are connected to the circuit, the first infrared light source 12 emits infrared light; when the ground pin 15 and the proximity sensing pin 1c are enabled (ie, grounded) When the pin 15 and the proximity sensing pin 1c are connected to the circuit, the proximity sensor 1a receives the infrared light reflected by the object to detect the distance of
  • the casing 20 can be used as a mounting carrier for the input/output module 10, or the input/output module 10 can be disposed in the casing 20.
  • the casing 20 can be the outer casing of the electronic device 100.
  • the casing 20 can also be used to set the display 90 of the electronic device 100.
  • the input and output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100.
  • the casing 20 includes a top portion 21 and a bottom portion 22, and the display screen 90 and the input/output module 10 are disposed between the top portion 21 and the bottom portion 22.
  • the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100.
  • the input/output module 10 can be disposed between the display screen 90 and the top portion 21.
  • the display screen 90 may be provided with a gap for the full screen, the display screen 90 encloses the input and output module 10, and the input and output module 10 is exposed from the gap of the display screen 90.
  • the casing 20 also has an organic shell light source through hole 23 and a casing close to the sensing through hole 24.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the casing light source through hole 23, and the proximity sensor 1a corresponds to the casing proximity sensing through hole 24.
  • the first infrared light source 12 and the second infrared light source 13 and the casing light source through hole 23 respectively mean that the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the through hole 23 of the casing light source, specifically, The first infrared light source 12 and the second infrared light source 13 are opposite to the casing light source through hole 23, and the light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the casing light source after being acted upon by the light guiding element. Through hole 23.
  • the proximity sensor 1a and the casing proximity sensing through hole 24 correspond to the infrared light reflected by the object, which can pass through the casing from the sensing through hole 24 and is incident on the proximity sensor 1a.
  • the proximity sensor 1a and the machine can be The shell is adjacent to the sensing through hole 24, and the light incident from the infrared light passes through the casing and approaches the sensing through hole 24 and is incident on the proximity sensor 1a through the light guiding element.
  • the casing light source through hole 23 and the casing proximity sensing through hole 24 may be spaced apart from each other. Of course, in other embodiments, the casing light source through hole 23 and the casing proximity sensing through hole 24 may also be connected to each other. .
  • the cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like.
  • the cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 combined with the casing 20, and an outer surface 31 opposite to the inner surface 32.
  • the light emitted by the input/output module 10 sequentially passes through the inner surface 32.
  • the cover plate 30 is then passed through the outer surface 31.
  • the cover plate 30 covers the casing light source through hole 23 and the casing is close to the sensing through hole 24.
  • the inner surface 32 of the cover plate 30 is coated with infrared transmitting ink 40, and the infrared is transparent.
  • the ink 40 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see it in normal use.
  • the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.
  • the infrared transmission ink 40 can also block at least one of the casing light source through hole 23 and the casing proximity sensing through hole 24, that is, the infrared transmission ink 40 can block the casing light source through hole 23 and the casing proximity sensing at the same time.
  • the through hole 24 (shown in FIG. 56) is difficult for the user to see the internal structure of the electronic device 100 through the casing light source through hole 23 and the casing close to the sensing through hole 24.
  • the electronic device 100 has a beautiful appearance; the infrared transmission ink 40 can also block the casing light source through hole 23, and the unobstructed casing approaches the sensing through hole 24; or the infrared transmitting ink can also block the casing from approaching the sensing through hole 24 without blocking the casing light source through hole 23.
  • the photo sensor 50 is a single package structure.
  • the photosensor 50 receives visible light in ambient light and detects the intensity of visible light as a basis for controlling the display brightness of the display screen 90.
  • the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 .
  • the imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65.
  • the lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63.
  • the mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65.
  • the photo sensor 50 is disposed on the mounting surface 631. Specifically, the orthographic projection of the photosensor 50 on the plane where the mounting surface 631 is located at least partially falls onto the mounting surface 631.
  • the photosensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small.
  • the receiver 70 is configured to emit an acoustic signal when excited by the power source, and the user can make a call through the receiver 70.
  • the structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected.
  • the reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, an input/output module 10, an infrared light camera 62, a visible light camera 61, a receiver 70, and a center of the structured light projector 80.
  • the input/output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 are sequentially, at this time, the visible light camera 61 and The infrared camera 62 may constitute a dual camera (as shown in FIG.
  • the visible light camera 61 and the infrared light camera 62 can constitute a dual camera (as shown in FIG. 67).
  • the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in an arc.
  • the shape and the center are arranged in a shape such as a rectangle.
  • the light sensor 50 may be disposed on the mounting surface 631 of the infrared light camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61. Of course, the light sensor 50 may not be installed. On the surface 631, for example, the photo sensor 50 may be disposed adjacent to the input/output module 10 or adjacent to the receiver 70, which is not limited herein.
  • the electronic device 100 and the input/output module 10 of the embodiment of the present invention turn on the first infrared light source 12 and the proximity sensor 1a
  • the electronic device 100 and the proximity sensor 1a can be used for proximity infrared ranging while the first infrared light source 12 and the second infrared light source 13 are turned on.
  • It can be used for infrared fill light, in other words, the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a are integrated into a single package structure, so that the input and output module 10 collects and emits infrared light for infrared ranging. Function, and infrared fill light function.
  • the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a are integrated into a single package structure, and the input/output module 10 has a high integration degree and a small volume, and the input/output module 10 saves the infrared compensation.
  • the first infrared light source 12, the second infrared light source 13, and the proximity sensor 1a are both carried on the same package substrate 111, the infrared fill light, the near infrared light, and the proximity sensor 1a of the conventional process need to be respectively adopted. Different wafer fabrications are combined into packages on the PCB substrate to improve packaging efficiency.
  • the input and output module 10 further includes a light source lens 18 and a proximity sensor lens 1b.
  • the light source lens 18 is disposed within the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13.
  • the proximity sensor lens 1b is disposed in the package housing 11 and corresponds to the proximity sensor 1a.
  • the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is concentrated by the light source lens 18 to be emitted into the light-emitting window 1131, and the amount of light emitted to the package side wall 112 and other areas of the package top 113 is reduced, and only needs to be satisfied.
  • the field of view ⁇ of the infrared light for supplemental light emitted by the first infrared light source 12 and the second infrared light source 13 after passing through the light source lens 18 is 60 degrees to 90 degrees, and the first infrared light source 12 emits infrared distance measurement.
  • the field of view ⁇ of the infrared light passing through the light source lens 18 is 10 to 30 degrees.
  • the proximity sensing lens 1b concentrates the infrared light on the proximity sensor 1a, reducing the transmission of infrared light to the proximity sensor. The amount of light in areas other than 1a.
  • the light source lens 18 and the proximity sensing lens 1b may be located on a transparent substrate, and more specifically, the light source lens 18 and the proximity sensing lens 1b may be integrally formed with the transparent substrate.
  • the input/output module 10 may be provided with only one of the light source lens 18 and the proximity sensor lens 1b; or the input/output module 10 may not be provided with the light source lens 18 and the proximity sensor lens 1b.
  • the input/output module 10 further includes a metal shielding plate 1d.
  • the metal shielding plate 1d is located in the package housing 11 and located between the second infrared light source 13 and the proximity sensor 1a, in other words, The first infrared light source 12 and the second infrared light source 13 are located on one side of the metal shielding plate 1d, and the proximity sensor 1a is located on the other side of the metal shielding plate 1d.
  • the metal shielding plate 1d is located between the second infrared light source 13 and the proximity sensor 1a, and can prevent the first infrared light source 12 and the second infrared light source 13 from being incident on the proximity sensor 1a when the initially emitted infrared light is incident, and can also shield the first infrared light source. 12 electromagnetic interference with the proximity sensor 1a and electromagnetic interference between the second infrared light source 13 and the proximity sensor 1a.
  • the input and output module 10 further includes an optical enclosure 19.
  • the optical enclosure 19 is made of a light transmissive material, and an optical enclosure 19 is formed on the package substrate 111 and located within the package housing 11.
  • the optical enclosure 19 encloses the first infrared source 12, the second infrared source 13, and the proximity sensor 1a.
  • the optical enclosure 19 can be formed by a potting injection molding process, the optical enclosure 19 can be made of a transparent thermosetting epoxy resin to be hard to soften in use, and the optical enclosure 19 can fix the first infrared source 12
  • the relative position between the second infrared light source 13 and the proximity sensor 1a, and the first infrared light source 12, the second infrared light source 13, and the proximity sensor 1a are not easily shaken in the package housing 11.
  • the input/output module 10 further includes a light exiting partition 1e formed in the optical enclosure 19 and located between the second infrared light source 13 and the proximity sensor 1a.
  • the light exiting partition 1e can block the first infrared light source 12 and the second infrared light source 13 from being incident on the proximity sensor 1a when the initially emitted infrared light is incident, while blocking the infrared light that enters from the proximity sensing window 1132 and is incident on the proximity sensor 1a. Illumination of an infrared light source 12 and a second infrared light source 13.
  • the photosensor 50 of the above embodiment may be disposed on the mounting surface 631 of the lens holder 63.
  • the mirror mount 63 may be the mirror mount 63 of the infrared light camera 62 or the mirror mount 63 of the visible light camera 61.
  • the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case.
  • the centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.
  • the center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30.
  • the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.
  • the cover plate 30 may further be provided with a cover light source through hole 33.
  • the cover light source through hole 33 corresponds to the casing light source through hole 23, and the first infrared light source 12 and the first The infrared light emitted by the two infrared light sources 13 passes through the through-hole 23 of the casing light source to pass through the electronic device 100 from the cover light source through-holes 33.
  • the cover 30 can also be provided with a cover close to the sensing through hole 35.
  • the cover is close to the sensing through hole 35 and the casing is close to the sensing through hole 24 and the proximity sensor 1a.
  • the infrared light reflected by the object outside the electronic device 100 passes through the cover plate to approach the sensing through hole 35 and the casing approaches the sensing through hole 24, and can be incident on the proximity sensor 1a.
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66, and the photo sensor 50 can also be fixed on the substrate 66.
  • the substrate 66 is provided with an FPC.
  • a part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63.
  • One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected.
  • the photo sensor 50 is disposed on the substrate 66, the photo sensor 50 is disposed outside the lens holder 63, and the photo sensor 50 may be connected to the FPC.
  • the imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62.
  • the photo sensor 50 may be fixed on the substrate 66 of the visible light camera 61; the photo sensor 50 may be fixed on the substrate 66 of the infrared light camera 62.
  • the substrate 66 further includes a reinforcing plate disposed on a side opposite to the photosensor 50 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the photosensor 50 is disposed on the substrate. When it is 66, it is not easy to shake.
  • the photosensor 50 can also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 .
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface
  • the 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671.
  • the third sub-top surface 673 is obliquely connected to the second sub-top surface 672.
  • the second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected.
  • the angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle
  • the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the third sub-top surface 673 is provided with a light-emitting through hole 674.
  • the lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674.
  • the image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68.
  • the light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the image sensor 65 transmits the light signal. Converted to an electrical signal.
  • the photo sensor 50 is disposed at the first sub top surface 671.
  • the imaging module 60 may be a visible light camera 61, and the light sensor 50 has a single package structure. In other embodiments, the imaging module 60 can be an infrared camera 62.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the photo sensor 50 is disposed on the first sub-top surface 671, so that the photo sensor 50 and the imaging module 60 are relatively compact.
  • the space is small, saving installation space in the electronic device 100.
  • the photosensor 50 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67. Specifically, the entire photo sensor 50 is perpendicular to The projection of the first sub-top surface 671 can be located in the first sub-top surface 671 (as shown in FIG. 64); or, the partial photosensor 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671. Within 671. That is to say, at least a part of the photo sensor 50 is located directly above the first sub-top surface 671.
  • the photo sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving The installation space in the electronic device 100.
  • the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the photo sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the photosensor 50.
  • the photosensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the photosensor 50 and the camera housing 67 more stable and to facilitate mounting the photosensor 50 and the imaging module 60 to the casing 20.
  • the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the photo sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the photo sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the light sensor 50 can also be coupled to an FPC.
  • the photosensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the photo sensor 50 and the camera housing 67 more stable and to facilitate mounting the photo sensor 50 and the imaging module 60 to the casing 20;
  • the imaging module 60 is provided with a substrate 66 and the photosensor 50 is disposed on the substrate 66 so that the photosensor 50 can be stably mounted in the camera housing 67.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68.
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a.
  • the first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678.
  • the first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and
  • the second step 678 is connected between the first step 677 and the second step 678.
  • the angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle
  • the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675.
  • the center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675.
  • the two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674.
  • the two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68.
  • Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the imaging module 60 may be a visible light camera 61.
  • the two lens modules 68 are lens modules corresponding to the visible light camera 61.
  • the photosensor 50 is disposed on the second step 678 and outside the camera housing 67.
  • the photosensor 50 is a single package structure.
  • the imaging module 60 may be an infrared camera 62.
  • the two lens modules 68 are lens modules corresponding to the infrared camera 62.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • One lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Corresponding lens module.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the photo sensor 50 is disposed on the second step 678, so that the photo sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is shared. Smaller, saving installation space in the electronic device 100.
  • the slit 675 of the above embodiment is disposed at an intermediate position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface.
  • 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on
  • the lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675.
  • the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b.
  • the first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface.
  • the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678.
  • the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b.
  • the angle is an obtuse angle.
  • the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle.
  • the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the placement of the photosensor 50 on the second surface. 678.
  • the photosensor 50 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67 .
  • the projection of the entire photosensor 50 along the second ladder surface 678 may be located in the second ladder surface 678; or, the partial photo sensor 50 is vertical.
  • the projection of the second step 678 is located within the second step 678. That is, at least a portion of the photosensor 50 is located directly above the second step 678.
  • the projection of the entire photosensor 50 along the second plane 678 can be located in the second step 678 (as shown in FIGS. 67 and 68).
  • the photo sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676.
  • the light sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the photosensor 50.
  • the photosensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the photosensor 50 and the camera housing 67 more stable and to facilitate mounting the photosensor 50 and the imaging module 60 to the casing 20.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676
  • the light sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the photo sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the light sensor 50 can also be coupled to an FPC.
  • the photosensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the photo sensor 50 and the camera housing 67 more stable and to facilitate mounting the photo sensor 50 and the imaging module 60 to the casing 20;
  • the imaging module 60 is provided with a substrate 66 and the photosensor 50 is disposed on the substrate 66 so that the photosensor 50 can be stably mounted in the camera housing 67.
  • Embodiment 5 is a diagrammatic representation of Embodiment 5:
  • an electronic device 100 includes a casing 20, a cover 30, and electronic components.
  • the electronic components include an input and output module 10, a proximity sensor 50 (Fig. 57), an imaging module 60 (Fig. 57), a receiver 70, and a structured light projector 80.
  • the electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc.
  • the embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.
  • the drawings for describing the present embodiment will be the same as those of the above-mentioned fourth embodiment. It can be understood that the same reference numerals in the drawings may have different meanings in the present embodiment and the fourth embodiment. description of.
  • the input/output module 10 is a single package structure, including a package housing 11, a first infrared light source 12, a second infrared light source 13, and a light sensor 1a.
  • the package housing 11 is used to simultaneously package the first infrared light source 12, the second infrared light source 13 and the light sensor 1a, or the first infrared light source 12, the second infrared light source 13 and the light sensor 1a are both packaged in the package housing 11 at the same time.
  • the package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113.
  • the package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the input/output module 10.
  • EMI electromagnetic interference
  • the package substrate 111 is used to carry the first infrared light source 12, the second infrared light source 13, and the light sensor 1a.
  • the first infrared light source 12, the second infrared light source 13 and the light sensor 1a may be formed on one chip 14, and then the first infrared light source 12, the second infrared light source 13, and the light sensor 1a.
  • the chip 14 is disposed on the package substrate 111 together, and specifically, the chip 14 can be bonded to the package substrate 111.
  • the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the input/output module 10 in the electronic device 100.
  • the package sidewalls 112 may be disposed around the first infrared light source 12, the second infrared light source 13 and the photosensor 1a.
  • the package sidewalls 112 extend from the package substrate 111, and the package sidewalls 112 may be combined with the package substrate 111.
  • the package side The wall 112 is detachably connected to the package substrate 111 to facilitate the inspection of the first infrared light source 12, the second infrared light source 13 and the light sensor 1a after the package sidewall 112 is removed.
  • the material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the first infrared source 12 and the second infrared source 13 from passing through the package sidewall 112.
  • the package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112.
  • the package top 113 is formed with a light-emitting window 1131 and a light-sensing window 1132.
  • the light-emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13.
  • the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is emitted from the light-emitting window 1131.
  • the light sensing window 1132 corresponds to the light sensor 1a, and the visible light can pass through the light sensing window 1132 and enter the light sensor 1a.
  • the package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed.
  • the light-emitting window 1131 and the light-sensing window 1132 are both through holes, and the package top portion 113 is made of a material that is opaque to infrared light and opaque to visible light.
  • the package top 113 is made of a material that is not transparent to infrared light, infrared light, opaque light, and visible light.
  • the light emitting window 1131 is made of a material that transmits infrared light.
  • the light sensing window 1132 is made of a material that transmits visible light, and the remaining portion is made of a material that is impermeable to infrared light and is not transparent to visible light. Further, the light emitting window 1131 may be formed with a lens structure to improve infrared light emitted from the light emitting window 1131.
  • the illumination window 1131 is formed with a concave lens structure such that the light passing through the illumination window 1131 is diverged and emitted outward; the illumination window 1131 is formed with a convex lens structure to cause the light passing through the illumination window 1131 to be gathered and emitted outward;
  • the window 1132 may also be formed with a lens structure to improve the visible light emission angle incident from the light sensing window 1132.
  • the light sensing window 1132 has a convex lens structure to cause the light incident from the light sensing window 1132 to be gathered and projected onto the light sensor 1a.
  • the first infrared light source 12, the second infrared light source 13 and the light sensor 1a may be formed on one chip 14, further reducing the volume of the first infrared light source 12, the second infrared light source 13 and the light sensor 1a after integration, and the preparation process It's simpler.
  • the first infrared light source 12 and the second infrared light source 13 can emit infrared light. When both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11 (as shown in FIG.
  • infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the electronic device 100
  • the infrared light camera 62 (shown in FIG. 47) receives infrared light reflected by the object to acquire image information of the object.
  • the input/output module 10 is used for infrared fill light, and the first infrared light source 12 and the second infrared light source are used. 13
  • the common light emitted by the infrared light for supplemental light has a large light-emitting area, and the field of view ⁇ of the infrared light for fill light may be 60 degrees to 90 degrees. For example, the field of view ⁇ of the infrared light for fill light is 60.
  • the second infrared light source 13 When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11 (as shown in FIG. 50), the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 50 of the electronic device 100 (As shown in FIG. 57) receiving infrared light reflected by the object to detect the distance of the object to the electronic device 100. At this time, the input/output module 10 is used for infrared ranging, and the first infrared light source 12 is used for infrared measurement.
  • the infrared light coverage area of the infrared light is small, and the infrared field of the infrared distance measurement has an angle of view ⁇ of 10 degrees -30 degrees.
  • the field of view ⁇ of infrared light for infrared ranging is 10 degrees, 15 degrees, 20 degrees. Degree, 25 degrees, or 30 degrees.
  • the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.
  • the photosensor 1a receives visible light in ambient light incident from the light sensing window 1132 and detects the intensity of visible light.
  • the input/output module 10 is used for infrared fill light and for emitting infrared light to the outside of the package housing 11 with different power when used for near infrared ranging.
  • the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 at a first power when approaching the infrared ranging, and the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 with the second power when the infrared fills the light.
  • the first power may be less than the second power.
  • the second infrared light source 13 is disposed around the first infrared light source 12.
  • the first infrared light source 12 and the second infrared light source 13 may be represented as a circle, a ring, a square, a regular polygon or the like as a whole.
  • the first infrared light source 12 is a point light source
  • the second infrared light source 13 is also a point light source and the number is multiple (as shown in FIG. 52); or the first infrared light source 12 is a point light source
  • the second infrared light source 13 is An annular light source (as shown in FIG.
  • the first infrared light source 12 is a plurality of point light sources surrounding the ring shape, and the second infrared light source 13 is a ring light source; or the first infrared light source 12 is a plurality of point light sources surrounding the ring shape
  • the second infrared light source 13 is a point light source and has a plurality of numbers (as shown in FIG. 54); or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is plural; or the first infrared
  • the light source 12 is an annular light source; the second infrared light source 13 is an annular light source.
  • the photosensor 1a is disposed on one side of the first infrared light source 12 and the second infrared light source 13, that is, the photosensor 1a is disposed outside the space surrounded by the second infrared light source 13.
  • the input/output module 10 is formed with a ground pin 15, a fill light pin 16, a proximity lamp pin 17, and a light sensing pin 1c.
  • the ground pin 15, the fill lamp pin 16, the proximity lamp pin 17 and the light sensing pin 1c may be formed on the package substrate 111 when the ground pin 15 and the fill lamp pin 16 are enabled (ie, grounded)
  • the first infrared light source 12 and the second infrared light source 13 emit infrared light
  • the ground pin 15 and the proximity lamp pin 17 are enabled (ie, When the ground pin 15 and the proximity lamp pin 17 are connected to the circuit, the first infrared light source 12 emits infrared light;
  • the ground pin 15 and the light sensing pin 1c are enabled (ie, the ground pin 15 and the light)
  • the photosensor 1a detects the visible light intensity as a basis for controlling the display brightness of
  • the casing 20 can be used as a mounting carrier for the input/output module 10, or the input/output module 10 can be disposed in the casing 20.
  • the casing 20 can be the outer casing of the electronic device 100.
  • the casing 20 can also be used to set the display 90 of the electronic device 100.
  • the input and output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100.
  • the casing 20 includes a top portion 21 and a bottom portion 22, and the display screen 90 and the input/output module 10 are disposed between the top portion 21 and the bottom portion 22.
  • the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100.
  • the input/output module 10 can be disposed between the display screen 90 and the top portion 21.
  • the display screen 90 may be provided with a gap for the full screen, the display screen 90 encloses the input and output module 10, and the input and output module 10 is exposed from the gap of the display screen 90.
  • the casing 20 also has an organic shell light source through hole 23 and a casing light inductive hole 24.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the casing light source through hole 23, and the light sensor 1a corresponds to the casing light inductive hole 24.
  • the first infrared light source 12 and the second infrared light source 13 and the casing light source through hole 23 respectively mean that the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the through hole 23 of the casing light source, specifically, The first infrared light source 12 and the second infrared light source 13 are opposite to the casing light source through hole 23, and the light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the casing light source after being acted upon by the light guiding element. Through hole 23.
  • the light sensor 1a corresponds to the light-sensitive through-hole 24 of the casing, and the visible light can pass through the light-sensitive through-hole 24 of the casing and enter the photosensor 1a.
  • the light sensor 1a and the casing can be light-sensible.
  • the hole 24 is facing right, and the light incident on the visible light passes through the light-sensitive through hole 24 of the casing and is incident on the photosensor 1a after being acted upon by the light guiding element.
  • the casing light source through hole 23 and the casing light inducting hole 24 may be spaced apart from each other. Of course, in other embodiments, the casing light source through hole 23 and the casing light inducting hole 24 may also be in communication with each other.
  • the cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like.
  • the cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 combined with the casing 20, and an outer surface 31 opposite to the inner surface 32.
  • the light emitted by the input/output module 10 sequentially passes through the inner surface 32.
  • the cover plate 30 is then passed through the outer surface 31.
  • the cover plate 30 covers the casing light source through hole 23 and the casing light inductive hole 24, and the inner surface 32 of the cover plate 30 is coated with infrared transmitting ink 40 for infrared transmission.
  • the ink 40 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the electrons in normal use.
  • the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.
  • the infrared light transmitting ink 40 can also block the through hole 23 of the casing light source (as shown in FIG. 56). It is difficult for the user to see the internal structure of the electronic device 100 through the through hole 23 of the casing light source, and the electronic device 100 has a beautiful appearance.
  • the proximity sensor 50 is a single package.
  • the first infrared light source 12 and the second infrared light source 13 are used as infrared light emitted outwardly when the infrared light is emitted.
  • the first infrared light source 12 and the second infrared light source 13 are received by the proximity sensor 50, and the proximity sensor 50 is based on the received infrared light reflected by the object. The distance between the foreign object and the electronic device 100 is judged.
  • the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 .
  • the imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65.
  • the lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63.
  • the mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65.
  • the proximity sensor 50 is disposed on the mounting surface 631. Specifically, the proximity projection 50 is projected onto the mounting surface 631 at least partially on the plane in which the mounting surface 631 is located.
  • the proximity sensor The imaging module 60 is relatively compact and the lateral space occupied by the two is relatively small.
  • the receiver 70 is configured to emit an acoustic signal when excited by the power source, and the user can make a call through the receiver 70.
  • the structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected.
  • the reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, an input/output module 10, an infrared light camera 62, a visible light camera 61, a receiver 70, and a center of the structured light projector 80.
  • the input/output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 are sequentially, at this time, the visible light camera 61 and The infrared camera 62 may constitute a dual camera (as shown in FIG.
  • the visible light camera 61 and the infrared light camera 62 can constitute a dual camera (as shown in FIG. 67).
  • the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in an arc.
  • the shape and the center are arranged in a shape such as a rectangle.
  • the proximity sensor 50 may be disposed on the mounting surface 631 of the infrared light camera 62 , or may be disposed on the mounting surface 631 of the visible light camera 61 . Of course, the proximity sensor 50 may not be disposed on the mounting surface 631 .
  • the proximity sensor 50 can be disposed adjacent to the input/output module 10, and the proximity sensor 50 can easily receive the infrared light emitted by the input/output module 10 for near infrared ranging and reflected by an external object; the proximity sensor 50 It may also be disposed adjacent to the receiver 70, and when the user answers the call, the proximity sensor 50 easily detects that the user's ear is close to the receiver 70.
  • the electronic device 100 of the embodiment of the present invention when the electronic device 100 of the embodiment of the present invention only turns on the first infrared light source 12, it can be used for near infrared ranging, and when the first infrared light source 12 and the second infrared light source 13 are turned on, it can be used for infrared fill light, and light.
  • the sensor 1a can also be used for visible light intensity detection.
  • the first infrared light source 12, the second infrared light source 13 and the light sensor 1a are integrated into a single package structure, so that the input and output module 10 is combined to emit infrared light to infrared.
  • the function of ranging, infrared fill light and intensity detection of visible light are described infrared.
  • the first infrared light source 12, the second infrared light source 13 and the light sensor 1a are integrated into a single package structure, and the input/output module 10 has a high integration degree and a small volume, and the input/output module 10 saves the infrared.
  • the space for the function of fill light, infrared ranging, and intensity detection of visible light since the first infrared light source 12, the second infrared light source 13 and the light sensor 1a are all carried on the same package substrate 111, the infrared fill light, the near infrared light, and the light sensor 1a of the conventional process need to be respectively adopted. Different wafer fabrications are combined into packages on the PCB substrate to improve packaging efficiency.
  • the input and output module 10 further includes a light source lens 18 and a light sensitive lens 1b.
  • the light source lens 18 is disposed within the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13.
  • the photo-sensitive lens 1b is disposed in the package casing 11 and corresponds to the photosensor 1a.
  • the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is concentrated by the light source lens 18 to be emitted into the light-emitting window 1131, and the amount of light emitted to the package side wall 112 and other areas of the package top 113 is reduced, and only needs to be satisfied.
  • the field of view ⁇ of the infrared light for supplemental light emitted by the first infrared light source 12 and the second infrared light source 13 after passing through the light source lens 18 is 60 degrees to 90 degrees, and the first infrared light source 12 emits infrared distance measurement.
  • the field of view ⁇ of the infrared light passing through the light source lens 18 is 10 to 30 degrees.
  • the photosensitive lens 1b concentrates the visible light on the photosensor 1a, reducing the amount of light transmitted to the region other than the photosensor 1a.
  • the light source lens 18 and the light sensitive lens 1b may be located on a transparent substrate, and more specifically, the light source lens 18 and the light sensitive lens 1b may be integrally formed with the transparent substrate.
  • the input/output module 10 may be provided with only one of the light source lens 18 and the light-sensitive lens 1b; or the input/output module 10 may not be provided with the light source lens 18 and the light-sensitive lens 1b.
  • the input/output module 10 further includes a metal shielding plate 1d.
  • the metal shielding plate 1d is located in the package housing 11 and located between the second infrared light source 13 and the photosensor 1a.
  • the metal shielding plate 1d is located between the second infrared light source 13 and the light sensor 1a, and can prevent the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from entering the light sensor 1a, and can also shield the first infrared light source. 12 electromagnetic interference with the photosensor 1a, and shielding electromagnetic interference between the second infrared light source 13 and the photosensor 1a.
  • the input and output module 10 further includes an optical enclosure 19.
  • the optical enclosure 19 is made of a light transmissive material, and an optical enclosure 19 is formed on the package substrate 111 and located within the package housing 11.
  • the optical enclosure 19 encloses the first infrared source 12, the second infrared source 13, and the photosensor 1a.
  • the optical enclosure 19 can be formed by a potting injection molding process, the optical enclosure 19 can be made of a transparent thermosetting epoxy resin to be hard to soften in use, and the optical enclosure 19 can fix the first infrared source 12
  • the relative position between the second infrared light source 13 and the light sensor 1a is such that the first infrared light source 12, the second infrared light source 13 and the light sensor 1a are not easily shaken in the package housing 11.
  • the input/output module 10 further includes a light-emitting partition 1e formed in the optical enclosure 19 and located between the second infrared light source 13 and the light sensor 1a.
  • the light exiting partition 1e can block the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from entering the light sensor 1a, while blocking the visible light entering from the light sensing window 1132 and incident on the light sensor 1a, affecting the first infrared light.
  • the proximity sensor 50 of the above embodiment may be disposed on the mounting surface 631 of the mirror mount 63.
  • the mirror mount 63 may be the mirror mount 63 of the infrared light camera 62 or the mirror mount 63 of the visible light camera 61.
  • the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case.
  • the centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.
  • the center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30.
  • the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.
  • the cover plate 30 may further be provided with a cover light source through hole 33.
  • the cover light source through hole 33 corresponds to the casing light source through hole 23, and the first infrared light source 12 and the first The infrared light emitted by the two infrared light sources 13 passes through the through-hole 23 of the casing light source to pass through the electronic device 100 from the cover light source through-holes 33.
  • the cover 30 can also have a cover light-sensitive through hole 35, and the cover light-sensitive through-hole 35 corresponds to the cover light-sensitive through hole 24 and the photosensor 1a.
  • the visible light outside the electronic device 100 passes through the cover light-sensitive through hole 35 and the chassis light-sensitive through hole 24, and can be incident on the photosensor 1a.
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 can also be fixed on the substrate 66.
  • the substrate 66 is provided with an FPC.
  • a part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63.
  • One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected.
  • the proximity sensor 50 is disposed on the substrate 66, the proximity sensor 50 is disposed outside the lens holder 63, and the proximity sensor 50 may be coupled to the FPC.
  • the imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62.
  • the proximity sensor 50 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 50 may be fixed on the substrate 66 of the infrared light camera 62.
  • the substrate 66 further includes a reinforcing plate disposed on a side opposite to the proximity sensor 50 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the proximity sensor 50 is disposed on the substrate 66. It is not easy to shake when it is.
  • the proximity sensor 50 can also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 .
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface
  • the 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671.
  • the third sub-top surface 673 is obliquely connected to the second sub-top surface 672.
  • the second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected.
  • the angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle
  • the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the third sub-top surface 673 is provided with a light-emitting through hole 674.
  • the lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674.
  • the image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68.
  • the light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the image sensor 65 transmits the light signal. Converted to an electrical signal.
  • the proximity sensor 50 is disposed at the first sub-top surface 671.
  • the imaging module 60 may be a visible light camera 61, and the proximity sensor 50 is a single package. In other embodiments, the imaging module 60 can be an infrared camera 62.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 50 is disposed on the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. Small, saving installation space in the electronic device 100.
  • the proximity sensor 50 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67. Specifically, the entire proximity sensor 50 is perpendicular to the first
  • the projections of the sub-top surface 671 can all be located within the first sub-top surface 671 (as shown in FIG. 64); alternatively, the partial proximity sensor 50 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is to say, at least a portion of the proximity sensor 50 is located directly above the first sub-top surface 671.
  • the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving electrons. The installation space within the device 100.
  • the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676.
  • the proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 50.
  • the proximity sensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 50 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 50 and the imaging module 60 to the casing 20.
  • the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676
  • the proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the proximity sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the proximity sensor 50 can also be coupled to the FPC.
  • the proximity sensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 50 and the camera housing 67 more stable and to facilitate mounting the proximity sensor 50 and the imaging module 60 to the casing 20;
  • the group 60 sets the substrate 66 and places the proximity sensor 50 on the substrate 66 so that the proximity sensor 50 can be stably mounted in the camera housing 67.
  • the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68.
  • the top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a.
  • the first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678.
  • the first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and
  • the second step 678 is connected between the first step 677 and the second step 678.
  • the angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle
  • the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle.
  • the slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670.
  • the two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675.
  • the center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675.
  • the two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674.
  • the two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68.
  • Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65.
  • the imaging module 60 may be a visible light camera 61.
  • the two lens modules 68 are lens modules corresponding to the visible light camera 61.
  • the proximity sensor 50 is disposed on the second step 678 and outside the camera housing 67.
  • the proximity sensor 50 is a single package.
  • the imaging module 60 may be an infrared camera 62.
  • the two lens modules 68 are lens modules corresponding to the infrared camera 62.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • One lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Corresponding lens module.
  • the imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 50 is disposed on the second step 678, so that the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. The installation space in the electronic device 100 is saved.
  • the slit 675 of the above embodiment is disposed at an intermediate position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface.
  • 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on
  • the lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675.
  • the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b.
  • the first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface.
  • the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678.
  • the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b.
  • the angle is an obtuse angle.
  • the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle.
  • the slit 675 of the present embodiment is opened at an intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the placement of the proximity sensor 50 on the second step 678. on.
  • the proximity sensor 50 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67. Specifically, when the slit 675 is opened at the edge position of the top surface 670, the projection of the entire proximity sensor 50 along the second ladder surface 678 may be located in the second ladder surface 678; or, the partial proximity sensor 50 is perpendicular to the first The projection of the second step 678 is located within the second step 678. That is, at least a portion of the proximity sensor 50 is located directly above the second step 678.
  • the projection of the entire proximity sensor 50 along the second plane 678 can be located in the second step 678 (as shown in FIGS. 67 and 68).
  • the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676.
  • the proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 50.
  • the proximity sensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 50 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 50 and the imaging module 60 to the casing 20.
  • the second step 678 of the above embodiment is provided with a light transmission hole 676
  • the proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 .
  • the imaging module 60 further includes a substrate 66.
  • the image sensor 65 is disposed on the substrate 66.
  • the proximity sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67.
  • an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.
  • the proximity sensor 50 can also be coupled to the FPC.
  • the proximity sensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 50 and the camera housing 67 more stable and to facilitate mounting the proximity sensor 50 and the imaging module 60 to the casing 20;
  • the group 60 sets the substrate 66 and places the proximity sensor 50 on the substrate 66 so that the proximity sensor 50 can be stably mounted in the camera housing 67.
  • an electronic device 100 includes a casing 20, a cover 30, and electronic components.
  • the electronic components include an input and output module 10, an imaging module 60, a receiver 70, and a structured light projector 80.
  • the electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc.
  • the embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.
  • the parts of the drawings for describing the present embodiment will be the same as those of the above-mentioned fourth embodiment. It can be understood that the different reference numerals in the drawings may have different meanings in the present embodiment, and the description of the characters is specifically required.
  • the input/output module 10 is a single package structure, including a package housing 11, a first infrared light source 12, a second infrared light source 13, a proximity sensor 50, and a light sensor 1a.
  • the package housing 11 is for simultaneously packaging the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the light sensor 1a, or the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the light sensor 1a. Both are packaged in the package housing 11 at the same time.
  • the package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113.
  • the package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the input/output module 10.
  • EMI electromagnetic interference
  • the package substrate 111 is used to carry the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the light sensor 1a.
  • the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the light sensor 1a may be formed on one chip 14, and then the first infrared light source 12, the second infrared light source 13, The proximity sensor 50, the photosensor 1a, and the chip 14 are disposed together on the package substrate 111.
  • the chip 14 can be bonded to the package substrate 111.
  • the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the input/output module 10 in the electronic device 100.
  • the package sidewalls 112 may be disposed around the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the light sensor 1a.
  • the package sidewalls 112 extend from the package substrate 111, and the package sidewalls 112 may be combined with the package substrate 111.
  • the package sidewalls 112 are detachably connected to the package substrate 111 to facilitate the inspection of the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the photosensor 1a after the package sidewalls 112 are removed.
  • the material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the first infrared source 12 and the second infrared source 13 from passing through the package sidewall 112.
  • the package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112.
  • the package top 113 is formed with a light-emitting window 1131, a proximity sensor window 1134, and a light-sensing window 1132.
  • the light-emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13
  • the light passes through the light-emitting window 1131;
  • the proximity sensor window 1134 corresponds to the proximity sensor 50, and the infrared light emitted by the first infrared light source 12 can be reflected by the object and can pass through the proximity sensor window 1134 and be incident on the proximity sensor 50;
  • the light-sensing window 1132 corresponds to the photosensor 1a, and visible light can pass through the light sensing window 1132 and enter the photosensor 1a.
  • the package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed.
  • the light-emitting window 1131, the proximity sensor window 1134, and the light-sensing window 1132 are both through holes, and the package top portion 113 is made of a material that is impermeable to infrared light and visible light.
  • the package top 113 is made of a material that is not transparent to infrared light, infrared light, opaque light, and visible light.
  • the light emitting window 1131 is made of a material that transmits infrared light.
  • the proximity sensing window 1134 and the light sensing window 1132 are made of a material that transmits visible light, and the remaining portion is made of a material that is opaque to infrared light and opaque to visible light.
  • the light-emitting window 1131 may be formed with a lens structure to improve illumination.
  • the infrared light emission angle emitted by the window 1131 for example, the light-emitting window 1131 is formed with a concave lens structure to cause the light passing through the light-emitting window 1131 to diverge outwardly; the light-emitting window 1131 is formed with a convex lens structure to gather the light passing through the light-emitting window 1131.
  • the proximity sensor window 1134 is formed with a convex lens mechanism to cause the infrared light passing through the proximity sensor window 1134 to be gathered inward and projected onto the proximity sensor 50; the light sensing window 1132 may also be formed with a lens structure to improve the light.
  • the visible light emission angle incident on the sensing window 1132 for example, the light sensing window 1132 has a convex lens structure such that the light sensing window 113 2 The incident light is collected and projected onto the photosensor 1a.
  • the first infrared light source 12 , the second infrared light source 13 , the proximity sensor 50 , and the light sensor 1 a may be formed on one chip 14 to further reduce the first infrared light source 12 and the second infrared light source 13 .
  • the volume integrated with the photosensor 1a, and the preparation process is relatively simple.
  • the first infrared light source 12 and the second infrared light source 13 can emit infrared light.
  • both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the infrared light camera 62 of the electronic device 100 receives the object.
  • the reflected infrared light is used to acquire the image information of the object.
  • the input/output module 10 is used for infrared fill light, and the first infrared light source 12 and the second infrared light source 13 jointly emit the infrared light for the fill light.
  • the area is large, and the angle of view ⁇ of the infrared light for fill light may be 60 degrees to 90 degrees.
  • the angle of view ⁇ of the infrared light for fill light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees.
  • the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 50 receives the infrared light reflected by the object to detect the object to the object.
  • the distance between the input and output modules 10, at this time, the input and output module 10 is used for infrared ranging, and the infrared light area of the infrared light source 12 for infrared ranging is smaller, and the infrared distance is infrared.
  • the field of view angle ⁇ of the light is 10 degrees -30 degrees.
  • the field of view angle ⁇ of the infrared light for infrared ranging is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees.
  • the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.
  • the photosensor 1a receives visible light in ambient light incident from the light sensing window 1132 and detects the intensity of visible light.
  • the input/output module 10 is used for infrared fill light and for emitting infrared light to the outside of the package housing 11 with different power when used for near infrared ranging.
  • the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 at a first power when approaching the infrared ranging, and the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 with the second power when the infrared fills the light.
  • the first power may be less than the second power.
  • the second infrared light source 13 is disposed around the first infrared light source 12.
  • the first infrared light source 12 and the second infrared light source 13 may be represented as a circle, a ring, a square, a regular polygon or the like as a whole.
  • the first infrared light source 12 is a point light source, the second infrared light source 13 is also a point light source and the number is plural; or the first infrared light source 12 is a point light source, and the second infrared light source 13 is a ring light source; or the first infrared light
  • the light source 12 is a plurality of point light sources surrounding the ring shape, and the second infrared light source 13 is an annular light source; or the first infrared light source 12 is a plurality of point light sources surrounding the ring shape, and the second infrared light source 13 is a point light source and the number is multiple Or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is plural; or the first infrared light source 12 is a ring light source; and the second infrared light source 13 is a ring light source.
  • the proximity sensor 50 and the photosensor 1a are disposed on one side of the first infrared light source 12 and the second infrared light source 13, that is, the proximity sensor 50 and the photosensor 1a are disposed outside the space surrounded by the second infrared light source 13.
  • the input/output module 10 is formed with a ground pin 15, a fill light pin 16, a proximity lamp pin 17, a proximity sensor pin 1g, and a light sensing pin 1c.
  • the ground pin 15, the fill lamp pin 16, the proximity lamp pin 17, the proximity sensor pin 1g, and the light sensing pin 1c may be formed on the package substrate 111 when the ground pin 15 and the fill lamp pin 16 are enabled
  • the first infrared light source 12 and the second infrared light source 13 emit infrared light
  • the ground pin 15 and the proximity lamp pin 17 When enabled (ie, when ground pin 15 and proximity lamp pin 17 are connected to the circuit), first infrared source 12 emits infrared light; when ground pin and proximity sensor pin 1g are enabled, close
  • the sensor 50 receives the infrared light emitted by the first infrared light source 12 reflected by the object; when
  • the casing 20 can be used as a mounting carrier for the input/output module 10, or the input/output module 10 can be disposed in the casing 20.
  • the casing 20 can be the outer casing of the electronic device 100.
  • the casing 20 can also be used to set the display 90 of the electronic device 100.
  • the input and output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100.
  • the casing 20 includes a top portion 21 and a bottom portion 22, and the display screen 90 and the input/output module 10 are disposed between the top portion 21 and the bottom portion 22.
  • the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100.
  • the input/output module 10 can be disposed between the display screen 90 and the top portion 21.
  • the display screen 90 may be provided with a gap for the full screen, the display screen 90 encloses the input and output module 10, and the input and output module 10 is exposed from the gap of the display screen 90.
  • the casing 20 also has an organic shell light source through hole 23, a casing proximity sensor through hole 26, and a casing light inductive hole 24.
  • the first infrared light source 12 and the second infrared light source 13 correspond to the casing light source through hole 23
  • the proximity sensor 50 corresponds to the casing proximity sensor through hole 26, and the light sensor 1a Corresponding to the light-sensitive through hole 24 of the casing.
  • the first infrared light source 12 and the second infrared light source 13 and the casing light source through hole 23 respectively mean that the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the through hole 23 of the casing light source, specifically, The first infrared light source 12 and the second infrared light source 13 are opposite to the casing light source through hole 23, and the light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the casing light source after being acted upon by the light guiding element. Through hole 23.
  • the light sensor 1a corresponds to the light-sensitive through-hole 24 of the casing, and the visible light can pass through the light-sensitive through-hole 24 of the casing and enter the photosensor 1a.
  • the light sensor 1a and the casing can be light-sensible.
  • the hole 24 is facing right, and the light incident on the visible light passes through the light-sensitive through hole 24 of the casing and is incident on the photosensor 1a after being acted upon by the light guiding element.
  • the proximity sensor 50 is similar to the case proximity sensor through hole 26, and will not be described herein.
  • the casing light source through hole 23 and the casing light inducting hole 24 may be spaced apart from each other. Of course, in other embodiments, the casing light source through hole 23, the casing proximity sensor through hole 26, and the casing light inductive hole 24 It can also be connected to each other.
  • the cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like.
  • the cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 combined with the casing 20, and an outer surface 31 opposite to the inner surface 32.
  • the light emitted by the input/output module 10 sequentially passes through the inner surface 32.
  • the cover plate 30 is then passed through the outer surface 31.
  • the cover plate 30 covers the casing light source through hole 23, the casing proximity sensor through hole 26 and the casing light inductive hole 24.
  • the inner surface 32 of the cover plate 30 is coated with infrared transmitting ink 40, and the infrared transmitting ink 40 is paired.
  • the infrared light has a high transmittance, for example, can reach 85% or more, and has a high attenuation rate for visible light, for example, can reach 70% or more, so that the user can hardly see the electronic device 100 in normal use.
  • the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.
  • the infrared transmission ink 40 can also block at least one of the casing light source through hole 23 and the casing proximity sensor through hole 26, that is, the infrared transmission ink 40 can simultaneously cover the casing light source through hole 23 and the casing proximity sensor through hole.
  • the user is difficult to see the internal structure of the electronic device 100 through the casing light source through hole 23 and the casing proximity sensor through hole 26
  • the electronic device 100 has a beautiful appearance
  • the infrared transmission ink 40 can also cover the casing light source through hole 23
  • the cover sensor through hole 26 is not covered; or the infrared light transmitting ink can cover the case sensor through hole 26 without covering the case light source through hole 23.
  • the receiver 70 is configured to emit an acoustic signal when excited by the power source, and the user can make a call through the receiver 70.
  • the structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected.
  • the reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.
  • the imaging module 60 includes a visible light camera 61 and an infrared light camera 62.
  • the centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located on the same line segment. Specifically, from one end of the line segment to the other end, the input/output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 are sequentially formed. At this time, the visible light camera 61 and the infrared light camera 62 can form a double.
  • the input/output module 10 the infrared light camera 62, the receiver 70, the visible light camera 61, the structured light projector 80; or the infrared light camera from one end of the line segment to the other end 62, the input/output module 10, the receiver 70, the visible light camera 61, the structured light projector 80; or from one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the receiver 70, the input and output module 10, the structure
  • the light projector 80, at this time, the visible light camera 61 and the infrared light camera 62 can constitute a dual camera.
  • the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in an arc.
  • the shape and the center are arranged in a shape such as a rectangle.
  • the electronic device 100 of the embodiment of the present invention can be used for the near infrared sensor when only the first infrared light source 12 is turned on, and can be used for the infrared compensation when the first infrared light source 12 and the second infrared light source 13 are turned on.
  • Light, and the light sensor 1a can also be used for visible light intensity detection, in other words, the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50 and the light sensor 1a are integrated into a single package structure, so that the input and output modes Group 10 combines the functions of emitting infrared light with infrared ranging, infrared fill light, and visible light intensity detection.
  • the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50 and the light sensor 1a are integrated into a single package structure, and the input/output module 10 has a high integration degree and a small volume, and the input and output modules are 10 saves space for the functions of infrared fill, infrared ranging, and visible light intensity detection.
  • the proximity light sensor 50, and the light sensor 1a are all carried on the same package substrate 111, compared with the conventional process, the infrared fill light, the near infrared light, and the close light
  • the sensor 50 and the photosensor 1a need to be fabricated by different wafers and then assembled onto the PCB substrate to improve packaging efficiency.
  • the input/output module 10 further includes a light source lens 18, a proximity light sensor lens 1h, and a light sensitive lens 1b.
  • the light source lens 18 is disposed within the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13.
  • the proximity photosensor lens 1h is disposed in the package housing 11 and corresponds to the proximity sensor 50.
  • the photo-sensitive lens 1b is disposed in the package casing 11 and corresponds to the photosensor 1a.
  • the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is concentrated by the light source lens 18 to be emitted into the light-emitting window 1131, and the amount of light emitted to the package side wall 112 and other areas of the package top 113 is reduced, and only needs to be satisfied.
  • the field of view ⁇ of the infrared light for supplemental light emitted by the first infrared light source 12 and the second infrared light source 13 after passing through the light source lens 18 is 60 degrees to 90 degrees, and the first infrared light source 12 emits infrared distance measurement.
  • the field of view ⁇ of the infrared light passing through the light source lens 18 is 10 to 30 degrees.
  • the proximity sensor lens 1h reduces the amount of light transmitted back to the proximity sensor 50 by the reflected infrared light.
  • the photosensitive lens 1b concentrates the visible light on the photosensor 1a, reducing the amount of light transmitted to the outside of the photosensor 1a.
  • the light source lens 18, the proximity sensor lens 1h, and the light sensitive lens 1b may be located on a transparent substrate, and more specifically, the light source lens 18 and the light sensitive lens 1b may be integrally formed with the transparent substrate.
  • the input/output module 10 may be provided with only one or more of the light source lens 18, the proximity sensor lens 1h, and the light-sensitive lens 1b. Alternatively, the input/output module 10 may not be provided with the light source lens 18 and the proximity sensor lens 1h. Light sensitive lens 1b.
  • the input/output module 10 further includes a metal shielding plate 1d.
  • the metal shielding plate 1d is located in the package housing 11 and is located between the second infrared light source 13 and the proximity sensor 50 and the proximity sensor 50. Between the light sensors 1a.
  • the metal shielding plate 1d is located between the second infrared light source 13 and the light sensor 1a, and can prevent the first infrared light source 12 and the second infrared light source 13 from emitting infrared light onto the light sensor 1a, and can also shield the first infrared light source 12 Electromagnetic interference with the photosensor 1a, between the second infrared light source 13 and the photosensor 1a, and between the proximity sensor 50 and the photosensor 1a.
  • the input and output module 10 further includes an optical enclosure 19.
  • the optical enclosure 19 is made of a light transmissive material, and an optical enclosure 19 is formed on the package substrate 111 and located within the package housing 11.
  • the optical enclosure 19 encloses the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the light sensor 1a.
  • the optical enclosure 19 can be formed by a potting injection molding process, the optical enclosure 19 can be made of a transparent thermosetting epoxy resin to be hard to soften in use, and the optical enclosure 19 can fix the first infrared source 12 The relative position between the second infrared light source 13, the proximity sensor 50, and the light sensor 1a, and makes the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the light sensor 1a difficult in the package housing 11. Shake.
  • the input/output module 10 further includes a plurality of light exiting partitions 1 e formed in the optical enclosure 19 and located in the second infrared light source 13 and the proximity sensor 50 . And between the proximity sensor 50 and the photosensor 1a.
  • the light exiting partition 1e can block the first infrared light source 12 and the second infrared light source 13 from emitting infrared light onto the proximity sensor 50 and the light sensor 1a, while blocking the visible light influence from the light sensing window 1132 and incident on the light sensor 1a.
  • the illumination of the infrared source 12 and the second infrared source 13 and the proximity sensor 50 receive the reflected infrared rays.
  • the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, the receiver 70 and the cover.
  • the sound hole 34 corresponds to the position of the sound hole of the casing.
  • the centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.
  • the center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30.
  • the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.
  • the cover plate 30 may further be provided with a cover light source through hole 33, and the cover light source through hole 33 corresponds to the casing light source through hole 23, and the first infrared light source 12 The infrared light emitted by the second infrared light source 13 passes through the through-hole 23 of the casing light source to pass through the electronic device 100 from the cover light source through hole 33.
  • the cover 30 can also have a cover proximity sensor through hole 37.
  • the cover proximity sensor through hole 37 corresponds to the case proximity sensor through hole 26, and the infrared light emitted by the first infrared lamp 12 passes through the object. After being reflected, it passes through the casing proximity sensor through hole 26 and can be incident on the proximity sensor 50 from the cover proximity sensor through hole 37.
  • the infrared light transmitting ink 40 may be disposed on the cover 30 at a position corresponding to the casing proximity sensor through hole 26, and it is difficult for the user to see the proximity sensor 50 inside the electronic device 100 through the casing proximity sensor through hole 26, the electronic device.
  • the shape of the 100 is more beautiful.
  • the cover 30 can also be provided with a cover light-sensitive through hole 35.
  • the cover light-sensitive through-hole 35 corresponds to the light-sensitive through-hole 24 of the casing and the light sensor 1a, and is external to the electronic device 100.
  • the visible light passes through the cover light-sensitive through hole 35 and the chassis light-sensitive through hole 24, and can be incident on the photosensor 1a.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • a plurality means at least two, for example two, three, unless specifically defined otherwise.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un module de sortie (10). Le module de sortie (10) comprend un boîtier d'encapsulation (11), une première source de lumière infrarouge (12), et une seconde source de lumière infrarouge (13) agencée autour de la première source de lumière infrarouge (12). Le boîtier d'encapsulation (11) comprend un substrat d'encapsulation (111). La première source de lumière infrarouge (12) et la seconde source de lumière infrarouge (13) sont encapsulées à l'intérieur du boîtier d'encapsulation (11) et sont portées sur le substrat d'encapsulation (111). Lorsque la seconde source de lumière infrarouge (13) est éteinte, et la première source de lumière infrarouge (12) émet des rayons lumineux infrarouges vers l'extérieur du boîtier d'encapsulation (11) à une première puissance, le module de sortie (10) est utilisé en tant que lampe infrarouge de proximité ; et lorsque la première source de lumière infrarouge (12) et la seconde source de lumière infrarouge (13) sont toutes deux allumées et émettent des rayons lumineux infrarouges vers l'extérieur du boîtier d'encapsulation (11) à une seconde puissance, le module de sortie (10) est utilisé en tant que lampe de supplémentation infrarouge.
PCT/CN2018/117920 2017-12-26 2018-11-28 Module de sortie, module d'entrée et de sortie et appareil électronique WO2019128605A1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
CN201711435422.1A CN108183990B (zh) 2017-12-26 2017-12-26 电子装置
CN201711437437.1A CN108200235B (zh) 2017-12-26 2017-12-26 输出模组和电子装置
CN201711433092.2A CN108183984B (zh) 2017-12-26 2017-12-26 输入输出模组和电子装置
CN201711433413.9 2017-12-26
CN201711435422.1 2017-12-26
CN201711437124.6A CN108023984B (zh) 2017-12-26 2017-12-26 输入输出模组和电子装置
CN201711437124.6 2017-12-26
CN201711437415.5 2017-12-26
CN201711433092.2 2017-12-26
CN201711437415.5A CN108173992B (zh) 2017-12-26 2017-12-26 电子装置
CN201711433413.9A CN108040148B (zh) 2017-12-26 2017-12-26 输入输出模组和电子装置
CN201711437437.1 2017-12-26

Publications (1)

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WO2019128605A1 true WO2019128605A1 (fr) 2019-07-04

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CN108023984A (zh) * 2017-12-26 2018-05-11 广东欧珀移动通信有限公司 输入输出模组和电子装置
CN108040148A (zh) * 2017-12-26 2018-05-15 广东欧珀移动通信有限公司 输入输出模组和电子装置
CN108173992A (zh) * 2017-12-26 2018-06-15 广东欧珀移动通信有限公司 电子装置
CN108183984A (zh) * 2017-12-26 2018-06-19 广东欧珀移动通信有限公司 输入输出模组和电子装置
CN108183990A (zh) * 2017-12-26 2018-06-19 广东欧珀移动通信有限公司 电子装置
CN108200235A (zh) * 2017-12-26 2018-06-22 广东欧珀移动通信有限公司 输出模组和电子装置

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US20130251215A1 (en) * 2012-03-21 2013-09-26 Authentec, Inc. Electronic device configured to apply facial recognition based upon reflected infrared illumination and related methods
CN107463877A (zh) * 2017-07-05 2017-12-12 广东欧珀移动通信有限公司 虹膜采集方法、电子装置和计算机可读存储介质
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CN108023984A (zh) * 2017-12-26 2018-05-11 广东欧珀移动通信有限公司 输入输出模组和电子装置
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