WO2019128153A1 - 封装结构及包括封装结构的显示装置 - Google Patents

封装结构及包括封装结构的显示装置 Download PDF

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WO2019128153A1
WO2019128153A1 PCT/CN2018/092304 CN2018092304W WO2019128153A1 WO 2019128153 A1 WO2019128153 A1 WO 2019128153A1 CN 2018092304 W CN2018092304 W CN 2018092304W WO 2019128153 A1 WO2019128153 A1 WO 2019128153A1
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layer
package structure
graphene
graphene oxide
oxide layer
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French (fr)
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杜佳梅
刘金强
吴耀燕
邢振华
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present application relates to the field of display technologies, and in particular, to a package structure and a display device including the package structure.
  • the flexible screen has the characteristics of being flexible, strong and flexible, and has many advantages such as light weight, low power consumption, convenient carrying, strong plasticity and beautiful colors.
  • the TFE (ie, thin film packaging technology) package structure of the existing flexible screen is mainly a laminated structure of an inorganic layer-organic layer-inorganic layer, wherein the inorganic layer is mainly a SiN material for blocking external water and oxygen; the organic layer is mainly an acrylic material. Used to reduce defects and stresses in the inorganic layer. Due to the large stress of the inorganic layer of the existing package structure, delamination or fault phenomenon is highly likely to occur between the inorganic layer and the organic layer of the package structure during the actual bending process.
  • the embodiments of the present application provide a package structure and a display device including the package structure to solve the problem that the existing package structure is prone to delamination or fault phenomenon during the bending process.
  • an embodiment of the present application provides a package structure including a graphene layer and a graphene oxide layer stacked in a stack.
  • the package structure further includes a second graphene layer disposed adjacent to the graphene oxide layer and stacked on the opposite side of the side of the graphene layer on which the graphene oxide layer is disposed.
  • an adjacent surface between the graphene oxide layer and the graphene layer or an adjacent surface between the graphene oxide layer and the second graphene layer is a mutually conforming uneven structure.
  • the package structure further includes a second graphene oxide layer disposed adjacent to the graphene layer and stacked on the opposite side of the side of the graphene oxide layer on which the graphene layer is disposed.
  • an adjacent surface between the graphene layer and the graphene oxide layer or an adjacent surface between the graphene layer and the second graphene oxide layer is a mutually conforming uneven structure.
  • the package structure further includes a stacked periodic structure adjacent to the graphene layer or the graphene oxide layer, and the lamination period is a stacked graphene layer and a graphene oxide layer.
  • the graphene oxide layer has a thickness of 10 nm to 1000 nm.
  • the graphene layer has a thickness of 10 nm to 100 nm.
  • the graphene layer is prepared by chemical vapor deposition or atomic layer deposition; and/or the graphene oxide layer is prepared by inkjet printing.
  • an embodiment of the present application further provides a display device, including: a display layer, a display driving layer, and a substrate layer; and any one of the foregoing embodiments disposed adjacent to the display layer and stacked The package structure described.
  • the package structure provided by the embodiment of the present invention utilizes the method of laminating the graphene oxide layer on the graphene layer, fully utilizes the amphiphilicity and high toughness of the graphene oxide, and improves the bending resistance mechanical property of the package structure. Moreover, the use of the amphiphilicity of the graphene oxide effectively avoids the occurrence of delamination or faulting of the package structure.
  • FIG. 1 is a schematic structural diagram of a package structure according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a package structure according to another embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a package structure according to another embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a display device according to an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a package structure according to an embodiment of the present application.
  • the package structure provided by the embodiment of the present application includes a stacked graphene layer 1 (ie, a first graphene layer) and a graphene oxide layer 2 (ie, a first graphene oxide layer).
  • the graphene material itself has the characteristics of high flexibility, high light transmittance, excellent water and oxygen barrier capability, the inclusion of the graphene layer 1 in the package structure can sufficiently improve the packaging effect and bending resistance of the package structure. performance.
  • Graphene and graphene oxide have good lattice matching ability due to the uniform lattice structure of graphene and graphene oxide.
  • graphite oxide due to the hydrophilic to hydrophobic property distribution of the graphene layer from the edge to the center, graphite oxide
  • the olefin layer is capable of adhering itself to the graphene layer by virtue of its own amphiphilic nature. Therefore, the package structure formed by laminating the graphene oxide layer 2 on the graphene layer 1 can easily cope with high-strength bending and folding operations without delamination or layering.
  • the graphene layer 1 is prepared by chemical vapor deposition (ie, CVD) or atomic layer deposition (ie, ALD) or inkjet printing (ie, IJP) or other methods, and the graphene oxide layer 2 is inkjet. Prepared by printing method (ie IJP) or other methods.
  • the graphene layer 1 may be disposed adjacent to the display layer of the display device, and the graphene oxide layer 2 may be disposed adjacent to the display layer of the display device, which is not uniformly limited in this embodiment of the present application. .
  • the package structure provided by the embodiment of the present invention utilizes the method of laminating the graphene oxide layer on the graphene layer, fully utilizes the amphiphilicity and high toughness of the graphene oxide, and improves the bending resistance mechanical property of the package structure. Moreover, the use of the amphiphilicity of the graphene oxide effectively avoids the occurrence of delamination or faulting of the package structure.
  • FIG. 2 is a schematic structural diagram of a package structure according to another embodiment of the present application.
  • the embodiments of the present application are extended on the basis of the embodiment shown in FIG. 1 of the present application. The differences will be described below, and the details are not described again.
  • the second graphene layer 3 is disposed adjacent to the display layer of the display device.
  • the graphene layer 1 and the second graphene layer 3 are prepared by chemical vapor deposition (ie, CVD) or atomic layer deposition (ie, ALD) inkjet printing (ie, IJP) or other methods, using inkjet
  • the graphene oxide layer 2 is prepared by a printing method (i.e., IJP) or other liquid phase method.
  • the graphene oxide layer prepared by the ink jet printing method i.e., IJP
  • other liquid phase method is preferable in film quality and low in cost.
  • the package structure is set to a film structure of a graphene layer-graphene oxide layer-graphene layer, and the package structure can be packaged by the excellent barrier water oxygen capacity of the graphene layer provided on the top layer and the bottom layer.
  • the effect is that the flexibility of the package structure can be increased by means of the graphene oxide layer provided in the intermediate layer.
  • the uniform lattice structure of the graphene oxide layer and the graphene layer and the amphiphilicity of the graphene oxide it is possible to effectively prevent the package structure by disposing the graphene oxide layer between the two graphene layers. The purpose of the stratification or faulting of the film layer.
  • the package structure provided by the embodiment of the present application further improves the barrier oxygen barrier capability of the package structure by sequentially laminating the graphene layer, the graphene oxide layer and the second graphene layer, and utilizes the amphiphilicity of the graphene oxide. Layering or faulting of the package structure is sufficiently avoided.
  • the second graphene layer 3 includes, but is not limited to, other film layers having high flexibility, high light transmittance or excellent water-oxygen barrier or water-oxygen absorption capability, as a reinforcing layer to enhance the packaging effect of the package structure. .
  • FIG. 3 is a schematic structural diagram of a package structure according to another embodiment of the present application.
  • the embodiments of the present application are extended on the basis of the embodiment shown in FIG. 1 of the present application. The differences will be described below, and the details are not described again.
  • the package side disposed adjacent to the graphene layer 1 and disposed on the opposite side of the side of the graphene oxide layer 2 on which the graphene oxide layer 2 is disposed is further included.
  • the graphene oxide layer 2 is disposed adjacent to the display layer of the display device.
  • the graphene oxide layer 2 and the second graphene oxide layer 4 are prepared by inkjet printing (ie, IJP) or other methods, using chemical vapor deposition (ie, CVD) or atomic layer deposition (ie, ALD).
  • the graphene layer 1 is prepared by an inkjet printing technique (i.e., IJP) or other methods.
  • the package structure includes a stacked periodic structure, and the lamination period of the stacked periodic structure is a stacked graphene layer and a graphene oxide layer.
  • the package structure is configured to include a stacked periodic structure to further improve the package structure packaging capability and bending resistance mechanical properties provided by the embodiments of the present application.
  • the adjacent face between the graphene layer and the graphene oxide layer or the adjacent face between the graphene oxide layer and the graphene oxide layer is a mutually adapted jagged sawtooth structure. Setting the adjacent faces to the mutually matching concave-convex sawtooth structure can further improve the bonding between the respective film layers of the package structure, thereby further effectively preventing the occurrence of delamination or a fault phenomenon.
  • concave and convex structures capable of being mutually adapted may also be applied to adjacent faces or graphene oxide layers between the graphene layer and the graphene oxide layer of the package structure of the embodiment of the present application and Adjacent faces between the graphene oxide layers to further prevent delamination or faulting of the package structure provided by the embodiments of the present application.
  • materials capable of matching other lattice interfaces can also be applied to adjacent faces or graphene oxide layers and graphene oxide layers between the graphene layer and the graphene oxide layer of the package structure of the embodiment of the present application. Adjacent faces between them to further prevent delamination or faulting of the package structure provided by the embodiments of the present application.
  • FIG. 4 is a schematic structural diagram of a display device according to an embodiment of the present application.
  • the embodiments of the present application are extended on the basis of the embodiments shown in FIG. 2 of the present application, and the differences will be described below, and the details are not described again.
  • the display device provided by the embodiment of the present application includes the package structure provided by the embodiment shown in FIG. 2 of the present application, and the package structure is sequentially top-down (such as the display device shown in FIG. 4).
  • the display (OLED) layer 5, the display drive (TFT) layer 6, and the substrate (PI) layer 7 are stacked.
  • the display device provided by the embodiment of the present application improves the bending resistance mechanical performance and the ability to block water oxygen by providing a package structure adjacent to the display layer and including the stacked graphene layer and the graphene oxide layer. And the use of the amphiphilicity of graphene oxide effectively avoids the occurrence of delamination or faulting of the package structure.
  • an electronic device including a display device includes the display device provided in the above embodiment.
  • the electronic device includes, but is not limited to, an electronic device such as a mobile phone, a tablet computer, or a display.
  • the graphene oxide layer has a thickness of 10 nm to 1000 nm. Setting the thickness of the graphene oxide layer to 10 nm to 1000 nm can fully exert the water vapor absorbing ability, flexibility, and amphiphilicity of the graphene oxide layer, thereby improving the encapsulation effect and bending resistance mechanical property of the package structure, and utilizing oxidation. The amphiphilicity of graphene can effectively avoid the delamination of the package structure or the occurrence of faults.
  • the graphene layer has a thickness of 10 nm to 100 nm. Setting the thickness of the graphene to 10 nm to 100 nm can fully exert the barrier oxygen barrier property and flexibility of the graphene layer, thereby improving the encapsulation effect and bending resistance mechanical properties of the package structure.

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  • Optics & Photonics (AREA)
  • Carbon And Carbon Compounds (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种封装结构及包括封装结构的显示装置，该封装结构包括层叠设置的石墨烯层（1）和氧化石墨烯层（2）。该封装结构通过在石墨烯层（1）上层叠设置氧化石墨烯层（2）的方式，充分利用了氧化石墨烯的两亲性以及高韧性的特点，提高了封装结构的耐弯折力学性能，并且利用氧化石墨烯的两亲性有效避免了封装结构的分层或断层现象的发生。

Description

封装结构及包括封装结构的显示装置
本申请要求2017年12月29日提交的申请号为No.201721917717.8的中国申请的优先权，通过引用将其全部内容并入本文。
技术领域
本申请涉及显示技术领域，具体涉及一种封装结构及包括封装结构的显示装置。
发明背景
随着电子显示技术的不断发展，用户对电子设备显示屏的要求越来越高，而作为电子设备显示屏重要发展方向之一的柔性屏，也逐渐受到了越来越多的关注。柔性屏具备可弯曲、强柔韧性等特点，并且具备体积轻薄、功耗低、携带方便、可塑性强、色彩绚丽等多重优势。
现有柔性屏的TFE(即薄膜封装技术)封装结构主要为无机层-有机层-无机层的层叠结构，其中，无机层主要为SiN材料，用于阻隔外界水氧；有机层主要为亚克力材料，用于减小无机层的缺陷和应力。由于现有封装结构的无机层存在较大应力，因此在实际的弯折过程中，封装结构的无机层和有机层之间极易出现分层或断层现象。
发明内容
有鉴于此，本申请实施例提供一种封装结构及包括封装结构的显示装置，以解决现有封装结构在弯折过程中极易出现分层或断层现象的问题。
第一方面，本申请一实施例提供一种封装结构，该封装结构包括层叠设置的石墨烯层和氧化石墨烯层。
在本申请一实施例中，该封装结构进一步包括与氧化石墨烯层相邻且层叠设置的、设置在氧化石墨烯层的石墨烯层所在侧的相反侧的第二石墨烯层。
在本申请一实施例中，氧化石墨烯层和石墨烯层之间的相邻面或氧化石墨烯层和第二石墨烯层之间的相邻面为相互适配的凹凸结构。
在本申请一实施例中，该封装结构进一步包括与石墨烯层相邻且层叠设置的、设置在石墨烯层的氧化石墨烯层所在侧的相反侧的第二氧化石墨烯层。
在本申请一实施例中，石墨烯层和氧化石墨烯层之间的相邻面或石墨烯层和第二氧化石墨烯层之间的相邻面为相互适配的凹凸结构。
在本申请一实施例中，该封装结构进一步包括与石墨烯层或氧化石墨烯层相 邻的层叠周期结构，层叠周期为层叠设置的石墨烯层和氧化石墨烯层。
在本申请一实施例中，氧化石墨烯层的厚度为10nm至1000nm。
在本申请一实施例中，石墨烯层的厚度为10nm至100nm。
在本申请一实施例中，石墨烯层采用化学气相沉积法或原子层沉积法制备；和/或氧化石墨烯层采用喷墨打印法制备。
第二方面，本申请一实施例还提供一种显示装置，该显示装置包括：层叠设置的显示层、显示驱动层和衬底层；以及与显示层相邻且层叠设置的上述任一实施例所描述的封装结构。
本申请实施例提供的封装结构通过在石墨烯层上层叠设置氧化石墨烯层的方式，充分利用了氧化石墨烯的两亲性以及高韧性的特点，提高了封装结构的耐弯折力学性能，并且利用氧化石墨烯的两亲性有效避免了封装结构的分层或断层现象的发生。
附图简要说明
图1所示为本申请一实施例提供的封装结构的结构示意图。
图2所示为本申请另一实施例提供的封装结构的结构示意图。
图3所示为本申请又一实施例提供的封装结构的结构示意图。
图4所示为本申请一实施例提供的显示装置的结构示意图。
实施本申请的方式
为使本申请的目的、技术手段和优点更加清楚明白，以下结合附图对本申请作进一步详细说明。
图1所示为本申请一实施例提供的封装结构的结构示意图。如图1所示，本申请实施例提供的封装结构包括层叠设置的石墨烯层1(即第一石墨烯层)和氧化石墨烯层2(即第一氧化石墨烯层)。
应当理解，由于石墨烯材料本身具备高柔韧性、高透光率、优异的水氧阻隔能力等特点，因此在封装结构中设置石墨烯层1能够充分提高封装结构的封装效果和耐弯折力学性能。
由于石墨烯和氧化石墨烯具备一致的晶格结构，因此石墨烯和氧化石墨烯具备良好的晶格匹配能力，此外，由于石墨烯层从边缘至中央呈现亲水至疏水的性质分布，氧化石墨烯层借助其自身两亲性的特点能够使其自身与石墨烯层紧密贴合。因此，在石墨烯层1上层叠设置氧化石墨烯层2后形成的封装结构能够轻松应对高强度的弯曲和折叠操作，并且不会出现分层或断层现象。
实际制备过程中，石墨烯层1采用化学气相沉积法(即CVD)或者原子层沉 积法(即ALD)或喷墨打印技术(即IJP)或其他方法进行制备，氧化石墨烯层2采用喷墨打印法(即IJP)或其他方法制备。
注意，实际应用过程中，可设置将石墨烯层1与显示装置的显示层相邻，亦可设置将氧化石墨烯层2与显示装置的显示层相邻，本申请实施例对此不作统一限定。
本申请实施例提供的封装结构通过在石墨烯层上层叠设置氧化石墨烯层的方式，充分利用了氧化石墨烯的两亲性以及高韧性的特点，提高了封装结构的耐弯折力学性能，并且利用氧化石墨烯的两亲性有效避免了封装结构的分层或断层现象的发生。
图2所示为本申请另一实施例提供的封装结构的结构示意图。在本申请图1所示的实施例的基础上拓展出本申请实施例，下面着重叙述不同之处，相同之处不再赘述。
如图2所示，在本申请实施例提供的封装结构中，进一步包括与氧化石墨烯层2相邻且层叠设置的、设置在氧化石墨烯层2的石墨烯层1所在侧的相反侧的第二石墨烯层3。
实际应用过程中，第二石墨烯层3与显示装置的显示层相邻设置。
实际制备过程中，采用化学气相沉积法(即CVD)或者原子层沉积法(即ALD)喷墨打印技术(即IJP)或其他方法制备石墨烯层1和第二石墨烯层3，采用喷墨打印法(即IJP)或其他液相法制备氧化石墨烯层2。
应当理解，采用喷墨打印法(即IJP)或其他液相法制备的氧化石墨烯层的膜质较好且成本低廉。
应当理解，将封装结构设定为石墨烯层-氧化石墨烯层-石墨烯层的膜层结构，既能借助设置于顶层和底层的石墨烯层的优异的阻隔水氧能力实现封装结构的封装效果，又能借助设置于中间层的氧化石墨烯层增加封装结构的柔韧性。此外，由于氧化石墨烯层和石墨烯层所具备的一致的晶格结构以及氧化石墨烯具备的两亲性，将氧化石墨烯层设置到两石墨烯层之间能够实现有效防止封装结构的各膜层出现分层或断层的情况的目的。
本申请实施例提供的封装结构通过将石墨烯层、氧化石墨烯层和第二石墨烯层依次层叠设置的方式，进一步提高了封装结构的阻隔水氧能力，并利用氧化石墨烯的两亲性充分避免了封装结构的分层或断层现象。
应当理解，第二石墨烯层3包括但不限于为其他具备高柔韧性、高透光率或优异的水氧阻隔或水氧吸收能力的膜层，以作为补强层增强封装结构的封装效果。
图3所示为本申请又一实施例提供的封装结构的结构示意图。在本申请图1所示的实施例的基础上拓展出本申请实施例，下面着重叙述不同之处，相同之处不再赘述。
如图3所示，在本申请实施例提供的封装结构中，进一步包括与石墨烯层1相邻且层叠设置的、设置在石墨烯层1的氧化石墨烯层2所在侧的相反侧的第二氧化石墨烯层4。
实际应用过程中，氧化石墨烯层2与显示装置的显示层相邻设置。
实际制备过程中，采用喷墨打印法(即IJP)或其他方法制备氧化石墨烯层2和第二氧化石墨烯层4，采用化学气相沉积法(即CVD)或者原子层沉积法(即ALD)喷墨打印技术(即IJP)或其他方法制备石墨烯层1。
在本申请一实施例中，封装结构包括层叠周期结构，该层叠周期结构的层叠周期为层叠设置的石墨烯层和氧化石墨烯层。将封装结构设置为包括层叠周期结构以便进一步提高本申请实施例提供的封装结构封装能力和耐弯折力学性能。
在本申请一实施例中，石墨烯层和氧化石墨烯层之间的相邻面或氧化石墨烯层和氧化石墨烯层之间的相邻面为相互适配的凹凸锯齿结构。将相邻面设定为相互适配的凹凸锯齿结构能够进一步提高封装结构的各膜层之间的结合性，从而进一步有效防止分层或断层现象的发生。
应当理解，其他能够进行相互适配的凹凸结构(比如其他榫卯结构)亦可以应用到本申请实施例的封装结构石墨烯层和氧化石墨烯层之间的相邻面或氧化石墨烯层和氧化石墨烯层之间的相邻面，以进一步防止本申请实施例提供的封装结构出现分层或断层现象。
此外，应当理解，其他晶格界面能够相互匹配的材料亦可以应用到本申请实施例的封装结构的石墨烯层和氧化石墨烯层之间的相邻面或氧化石墨烯层和氧化石墨烯层之间的相邻面，以进一步防止本申请实施例提供的封装结构出现分层或断层现象。
图4所示为本申请一实施例提供的显示装置的结构示意图。在本申请图2所示的实施例的基础上拓展出本申请实施例，下面着重叙述不同之处，相同之处不再赘述。
如图4所示，本申请实施例提供的显示装置包括本申请图2所示的实施例提供的封装结构，以及与该封装结构依次自上而下(如图4所示的显示装置的上下方向)层叠设置的显示(OLED)层5、显示驱动(TFT)层6和衬底(PI)层7。
应当理解，本使用新型实施例提供的显示装置中的封装结构亦可替换为其他实施例中的封装结构，本申请实施例对此不作统一限定。
本申请实施例提供的显示装置通过设置与显示层相邻且包括层叠设置的石墨烯层和氧化石墨烯层的封装结构的方式，提高了显示装置的耐弯折力学性能和阻隔水氧的能力，并且利用氧化石墨烯的两亲性有效避免了封装结构分层或断层现象的发生。
在本申请一实施例中，还提供一种具备显示装置的电子设备，该电子设备包 括上述实施例所提供的显示装置。其中，该电子设备包括但不限于为手机、平板电脑、显示器等电子设备。
在本申请一实施例中，氧化石墨烯层的厚度为10nm至1000nm。将氧化石墨烯层的厚度设定为10nm至1000nm能够充分发挥氧化石墨烯层的吸附水氧能力、柔韧性以及两亲性，从而提高封装结构的封装效果以及耐弯折力学性能，并且利用氧化石墨烯的两亲性能够有效避免封装结构分层或断层现象的发生。
在本申请一实施例中，石墨烯层的厚度为10nm至100nm。将石墨烯的厚度设定为10nm至100nm能够充分发挥石墨烯层的阻隔水氧能力以及柔韧性，从而提高封装结构的封装效果以及耐弯折力学性能。
以上仅为本申请的较佳实施例而已，并非用于限定本申请的保护范围。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种封装结构，其中，所述封装结构包括层叠设置的石墨烯层和氧化石墨烯层。
  2. 如权利要求1所述的封装结构，其中，所述封装结构进一步包括：与所述氧化石墨烯层相邻且层叠设置的、设置在所述氧化石墨烯层的所述石墨烯层所在侧的相反侧的第二石墨烯层。
  3. 如权利要求2所述的封装结构，其中，所述氧化石墨烯层和所述石墨烯层之间的相邻面或所述氧化石墨烯层和所述第二石墨烯层之间的相邻面为相互适配的凹凸结构。
  4. 如权利要求1所述的封装结构，其中，所述封装结构进一步包括：与所述石墨烯层相邻且层叠设置的、设置在所述石墨烯层的所述氧化石墨烯层所在侧的相反侧的第二氧化石墨烯层。
  5. 如权利要求4所述的封装结构，其中，所述石墨烯层和所述氧化石墨烯层之间的相邻面或所述石墨烯层和所述第二氧化石墨烯层之间的相邻面为相互适配的凹凸结构。
  6. 如权利要求1至5任一所述的封装结构，其中，所述封装结构进一步包括：与所述石墨烯层或所述氧化石墨烯层相邻的层叠周期结构，层叠周期为层叠设置的石墨烯层和氧化石墨烯层。
  7. 如权利要求1至6任一所述的封装结构，其中，所述氧化石墨烯层的厚度为10nm至1000nm。
  8. 如权利要求1至7任一所述的封装结构，其中，所述石墨烯层的厚度为10nm至100nm。
  9. 如权利要求1至8任一所述的封装结构，其中，所述石墨烯层采用化学气相沉积法或原子层沉积法制备；和/或
    所述氧化石墨烯层采用喷墨打印法制备。
  10. 一种显示装置，其中，所述显示装置包括：
    层叠设置的显示层、显示驱动层和衬底层；以及
    与所述显示层相邻且层叠设置的权利要求1至9任一所述的封装结构。
PCT/CN2018/092304 2017-12-29 2018-06-22 封装结构及包括封装结构的显示装置 Ceased WO2019128153A1 (zh)

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