WO2019127522A1 - 激光对位系统及激光对位方法 - Google Patents

激光对位系统及激光对位方法 Download PDF

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Publication number
WO2019127522A1
WO2019127522A1 PCT/CN2017/120253 CN2017120253W WO2019127522A1 WO 2019127522 A1 WO2019127522 A1 WO 2019127522A1 CN 2017120253 W CN2017120253 W CN 2017120253W WO 2019127522 A1 WO2019127522 A1 WO 2019127522A1
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WIPO (PCT)
Prior art keywords
laser
substrate
target
center
laser beam
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PCT/CN2017/120253
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English (en)
French (fr)
Inventor
包春贵
胡康军
Original Assignee
深圳市柔宇科技有限公司
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780097401.5A priority Critical patent/CN111433558B/zh
Priority to PCT/CN2017/120253 priority patent/WO2019127522A1/zh
Publication of WO2019127522A1 publication Critical patent/WO2019127522A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes

Definitions

  • the invention relates to a laser alignment system and a laser alignment method.
  • the substrates need to be aligned before being assembled and assembled.
  • the glass cover in the display device is attached to the touch screen or the bonding between the boards.
  • an embodiment of the present invention discloses a laser alignment system and a laser alignment method.
  • a laser alignment system comprising:
  • a laser emitting device for emitting a laser beam
  • a first driving device for driving the first substrate to move on the first positioning platform to change a relative position between the first substrate and the laser emitting device, a first target corresponding to the laser emitting device is disposed on a substrate;
  • the second driving device is configured to drive the second substrate to move on the second positioning platform to change the relative position between the second substrate and the laser emitting device, and the second substrate is provided with a second target.
  • the second target corresponds to the first target;
  • a laser receiving device and the laser emitting device are respectively located at two sides of the first substrate and the second substrate, for receiving a laser beam emitted by the laser emitting device;
  • control device for controlling the laser emitting device, the first driving device, the second driving device, and the laser receiving device, the control device according to the intensity of the laser beam received by the laser receiving device Determining a position of the first substrate and the second substrate;
  • the laser alignment system further includes a storage device, wherein the storage device stores a preset first intensity value and a second intensity value; when the intensity of the laser beam received by the laser receiving device is The first intensity values are equal, the control device determines that the laser beam emitted by the laser emitting device passes through the center of the corresponding first target, the first substrate is located at the first position, and the center of the first target Located at a first central position; when the intensity value of the laser beam received by the laser receiving device is equal to the second intensity value, the control device determines that the laser beam emitted by the laser emitting device passes through the corresponding center The center of the second target, the second substrate is located at the second position, and the center of the second target is located at the second center position.
  • a laser alignment method for aligning a first substrate with a second substrate comprising the following steps
  • Step 1 controlling the first driving device to move the first substrate to adjust a relative position of the first substrate and the laser emitting device, where the first substrate is provided with a first target, when it is determined that the laser receiving device receives
  • the laser beam of the laser emitting device passes through the center of the first target, the first substrate is located at the first position, and each of the first targets The center is located at the corresponding first central position;
  • Step 2 controlling the first driving device to move the first substrate from the first position to a waiting area
  • Step 3 controlling the second driving device to move the second substrate to adjust a relative position of the second substrate and the laser emitting device, where the second target is corresponding to the first target, and the second target is Determining that when the intensity value of the laser beam received by the laser receiving device coincides with the second intensity value, the laser beam of the laser emitting device passes through the second target, and the second substrate is located at the second position, The center of the second target is located at the corresponding second central position;
  • Step 4 controlling the first driving device to move the first substrate from the waiting area to the first position, and returning a center of the first target to the first center position.
  • the laser alignment system and the laser alignment method provided by the invention use the concentrated laser to align the first substrate and the second substrate, and the manual alignment is well solved without setting a mark. And the problem of low CCD alignment accuracy.
  • FIG. 1 is a structural block diagram of a laser alignment system according to an embodiment of the present invention.
  • FIG 2 is a schematic view of the first substrate in alignment with the second substrate.
  • 3 is a side view showing the alignment of the first substrate and the second substrate.
  • FIG. 4 is a schematic plan view of a first target and a second target.
  • FIG. 5 is a flowchart of a laser alignment method in an embodiment of the present invention.
  • Figure 6 is a flow chart of step 1 shown in Figure 5.
  • FIG. 7 is a flow chart of step 101 shown in FIG. 6.
  • FIG. 8 is a schematic diagram of the laser beam emitted by the laser emitting device in the step 102 shown in FIG. 6 as the first laser beam.
  • FIG. 9 is a schematic diagram of the laser beam emitted by the laser emitting device in the step 103 shown in FIG. 6 as the second laser beam.
  • Figure 10 is a flow chart of step 3 shown in Figure 5.
  • Figure 11 is a flow chart of step 301 shown in Figure 10.
  • Figure 12 is a schematic diagram of the laser beam emitted by the laser emitting device in the step 302 shown in Figure 10 as the third laser beam.
  • the present invention provides a laser alignment system 100.
  • the laser alignment system 100 is used to align the first substrate 10 and the second substrate 50.
  • At least one first target 12 for setting a position on the first substrate 10 is provided.
  • a second target 52 for positioning is also provided at a position on the second substrate 50 corresponding to the first target 12, that is, the first target 12 on the first substrate 10 corresponds to the second target 52 on the second substrate 50.
  • the laser alignment system 100 includes at least one laser emitting device 30, at least one laser receiving device 70, a first driving device 81, a second driving device 83, and a control device 85. Among them, the laser emitting device 30 can emit a laser beam.
  • the first driving device 81 drives the first substrate 10 to move on the first positioning platform (not shown), so that the relative position between the first substrate 10 and the laser emitting device 30 is changed, and each of the first targets 12 is A laser emitting device 30 corresponds.
  • the second driving device 83 drives the second substrate 50 to move on a second positioning platform (not shown) such that each of the second targets 52 corresponds to one laser emitting device 30. It will be appreciated that the position of the laser emitting device 30 is fixed.
  • the laser receiving device 70 and the laser emitting device 30 are respectively located at two sides of the first substrate 10 and the second substrate 50 for receiving the laser beam emitted by the corresponding laser emitting device 30, and transmitting the intensity value of the received laser beam to Control device 85.
  • the intensity value of the laser beam can be characterized by the energy value of the laser, and the intensity value of the laser beam is proportional to the energy of the laser, that is, the stronger the received laser beam, the greater the energy value of the laser beam .
  • the control device 85 is connected to the laser emitting device 30, the first driving device 81, the second driving device 83, and the laser receiving device 70.
  • the control device 85 receives the intensity value of the laser beam transmitted by the laser receiving device 70 and determines whether the first substrate 10 and the second substrate 50 are positioned accurately based on the intensity value of the laser beam.
  • the control device 85 can be a device with data processing capability, such as a server or a terminal device.
  • the control device 85 can be a processor that can perform data processing, such as a central processing unit (CPU) of a device.
  • CPU central processing unit
  • the laser alignment system 100 includes a storage device 87.
  • the storage device 87 stores preset first intensity values and second intensity values.
  • the control device 85 determines that the laser beam of each of the laser emitting devices 30 passes through the corresponding first target 12 At the same time, the control device 85 determines that the first substrate 10 is located at a preset first position, and the center of each of the first targets 12 is located at the first center position.
  • the control device 85 determines that the laser beam of each of the laser emitting devices 30 passes through the corresponding At the center of the second target 52, at this time, the control device 85 determines that the second substrate 50 is at the preset second position, and the center of each of the second targets 52 is located at the second center position.
  • the second intensity value is smaller than the first intensity value. In other embodiments, the second intensity value is greater than the first intensity value.
  • the laser receiving device 70 is a laser power device.
  • the intensity of the laser beam is proportional to the power of the laser power.
  • the power of the laser power device is also larger, and the signal corresponding to the output is also stronger. Therefore, the laser power generator sends signals of different intensity values to the control device 85 according to the intensity values of the received laser beams.
  • the first signal is sent to the control device 85; when the laser power device receives the light beam
  • the second signal is sent to the control device 85; if it is another intensity value, the control device 85 is not sent a signal.
  • the intensity values of the first signal and the second signal are different.
  • the first substrate 10 is substantially rectangular.
  • the first substrate 10 is a glass cover plate in a display panel (not shown) for protecting the display screen in the display device.
  • Each of the first targets 12 is disposed in a aligning region of the first substrate 10.
  • the number of the first targets 12 is two, and the two first targets 12 are located on a pair of corner lines of the first substrate 10.
  • each of the first targets 12 includes a light transmitting region 122 and a light blocking region 124 .
  • the light blocking region 124 surrounds the light transmitting region 122, and the light blocking region 124 can block the passage of the laser beam.
  • the first target 12 has a circular shape
  • the light-transmitting region 122 has a circular shape
  • the light-blocking region 124 has a circular shape.
  • the first target 12 is attached to the first substrate 10.
  • the outer circumference of the light blocking region 124 is the outer circumference of the first target 12.
  • the center of the light transmitting region 122 is the center of the first target 12.
  • the second substrate 50 is substantially rectangular. In the present embodiment, the second substrate 50 is a touch panel in the display panel.
  • Each of the second targets 52 is disposed on the alignment area of the second substrate 50, and each of the second targets 52 is disposed corresponding to a first target 12.
  • the number of second targets 52 is two, and the two second targets 52 are located on a pair of corner lines of the second substrate 50.
  • Each of the second targets 52 includes a light transmitting region 522 and a light blocking region 524.
  • the light blocking region 524 surrounds the light transmitting region 522, and the light blocking region 524 can block the passage of the laser beam.
  • the second target 52 is circular, the light transmissive region 522 is located at the center of the second target 52, and the light transmissive region 522 is circular.
  • the light blocking region 124 is a circular shape surrounding the light transmitting region 522.
  • a range of intensity values of the laser beam received by the laser receiving device 70 when the self-alignment between the laser emitting device 30 and the laser receiving device 70 is determined is stored in the storage device 87.
  • the control device 85 determines that laser self-alignment is achieved between the laser emitting device 30 and the corresponding laser receiving device 70.
  • the control device 85 controls the movement of the laser emitting device 30 and/or the corresponding laser receiving device 70 to adjust the laser emitting device.
  • the laser emitting device 30 and the relative position of the corresponding laser receiving device 70 until the laser intensity value received by the laser receiving device 70 is within a range of preset intensity values.
  • the position of the laser emitting device 30 and the laser receiving device 70 is fixed.
  • Each laser emitting device 30 first self-aligns with the corresponding laser receiving device 70 before the laser emitting device 30 is aligned with the corresponding first target 12, when the laser receiving device 70 receives the corresponding laser emitting device 30.
  • the control device 85 determines that laser self-alignment is achieved between the laser emitting device 30 and the corresponding laser receiving device 70.
  • Each laser emitting device 30 is set to be in a first firing position prior to alignment with a corresponding first target 12.
  • the first emission position is a position where each laser emitting device 30 is located after each laser emitting device 30 performs laser self-alignment with the corresponding laser receiving device 70.
  • the control device 85 can calculate a first pre-alignment position of the first substrate 10 according to the first emission position, and the first pre-alignment position is that the central axis of the laser beam emitted by the laser emitting device 30 passes through the first The position of the first substrate 10 when the center of the corresponding first target 12 on the substrate 10 is located.
  • the control device 85 first controls the first driving device 81 to drive the first substrate 10 to move to adjust the relative position between the first substrate 10 and the laser emitting device 30.
  • the intensity value of the laser beam received by each of the laser receiving devices 70 is the first intensity value, it indicates that the laser beam emitted by each of the laser emitting devices 30 passes through the corresponding first target 12, and each of the first targets 12
  • the center is coaxial with the central axis of the laser beam emitted by the corresponding laser emitting device 30. That is, the first substrate 10 is now at the first pre-alignment position.
  • the first pre-alignment position is the same position as the first position.
  • the control device 85 is capable of calculating a second pre-alignment position according to the first emission position, the second pre-alignment position being when the central axis of the laser beam emitted by the laser emitting device 30 passes through the center of the second target 52 The position where the second substrate 50 is located. Specifically, the control device 85 controls the first driving device 81 to remove the first substrate 10 to the waiting area. At this time, the control device 85 records the moving path of the first substrate 10 from the first position to the waiting area. . In another embodiment, the control device 85 records the driving manner of the first driving device 81 when the first substrate 10 is moved from the first position to the waiting region, including the driving direction and the driving power.
  • the control device 85 controls the second driving device 83 to drive the second substrate 50 to move to adjust the relative position between the second substrate 50 and the laser emitting device 30.
  • the intensity value of the laser beam received by each of the laser receiving devices 70 is the second intensity value
  • the second substrate 50 is moved to the second position.
  • the center of each of the second targets 52 is coaxial with the central axis of the laser beam emitted from the corresponding laser emitting device 30.
  • control device 85 determines the first preset path of the first substrate 10 according to the first center position where the first target 12 is located, and determines the second substrate 50 according to a second target 52 at the corresponding second center position.
  • the second preset path The control device 85 controls the first driving device 81 to drive the first substrate 10 to move along the first predetermined path, and/or the second driving device 83 drives the second substrate 50 along the second
  • the preset movement path moves until the first substrate 10 and the second substrate 50 are attached together.
  • the first preset path and the second preset path are parallel to a line passing the first center position and the corresponding second center position.
  • the first driving device 81 drives the first substrate 10 to move down along the first predetermined path; the second driving device 83 drives the second substrate 50 along the second pre- Let the path move up.
  • control device 85 determines a preset movement path according to a first target 12 at a first central position and a second central position of the corresponding second target 52, and the control device 85 controls to move at least the first substrate 10 And moving along one of the second substrates 50 along the moving path until the first substrate 10 and the second substrate 50 are attached together.
  • the preset moving path is a straight line passing through the center of the first target 12 and the center of the corresponding second target 52.
  • the storage device 87 stores a preset first detection value.
  • the control device 85 controls the first driving device 81 to move slowly so that the position of the first substrate 10 is slightly adjusted.
  • the control device 85 determines that the laser receiving device 70 captures a detection point on the outer circumference of the corresponding first target 12.
  • the control device 85 continues to control the first driving device 81 to slowly move and slightly adjust the position of the first substrate 10.
  • the intensity value of the laser beam received by the control device 85 on the laser receiving device 70 is the same as the first A detected value is compared until control device 85 determines that laser receiving device 70 captures the position of at least three different detected points on the corresponding first target 12.
  • the control device 85 calculates the position of the center of the corresponding first target 12 based on the at least three detection points and the radius of the first target 12.
  • the control device 85 stores a preset first detection value. When the laser intensity value received by the laser receiving device 70 is equal to the first detection value, the control device 85 determines that the laser receiving device 70 captures The first detected point is on the outer circumference of the first target 12. The control device 85 continues to control the position of the first substrate 10, and the control device 85 controls the laser receiving device 70 to acquire the intensity value of the received laser beam in real time and compare it with the first detected value until the control device 85 It is determined that the laser receiving device 70 captures the position of at least two of the first detection points on the corresponding first target 12. The positions of the captured first detection points are all different. The control device 85 continues to control the position of the first substrate 10.
  • the control device 85 determines that the second detection point captured by the laser receiving device 70 is at the first position.
  • the control device 85 can control the position of the micro-adjusted laser emitting device 30, and acquire at least two first detecting points on the first target 12 and at least two second detecting points on the first target 12, and the control device 85 is according to the first A first detection point of at least two of the target 12, a second detection point of at least two of the first target 12, a radius of the first target 12, and a radius of the light transmissive area 122, and the corresponding first target 12 is calculated. The location of the center.
  • the captured first detection points are located at different locations on the outer circumference of the first target 12, and the captured second detection points are located at different locations on the interface.
  • the storage device 87 stores a predetermined first detection range for determining that the laser beam emitted by the laser emitting device 30 passes through a detection point on the outer circumference of the first target 12.
  • the control device 85 controls the first driving device 81 to drive the first substrate 10 to move slightly, and controls the laser receiving device 70 to acquire the intensity value of the received laser beam in real time during the slight movement of the first substrate 10.
  • the control device 85 determines that the laser receiving device 70 captures a detection point.
  • the position of the first substrate 10 is continuously fine-tuned until at least three different detection points are captured.
  • the captured detection points are located at different positions on the outer circumference of the first target 12, and the control device 85 calculates the center of the corresponding first target 12 according to the at least three detection points and the radius of the first target 12. position.
  • the storage device 87 pre-stores a second detection for determining that the laser beam emitted by the laser emitting device 30 passes through at least three detection points on the boundary between the light-transmitting region 122 of the first target 12 and the light-blocking region 124. range.
  • the position at which the first driving device 81 drives the first substrate 10 is controlled to change slowly, and the intensity value of the laser beam acquired by the laser receiving device 70 is acquired in real time while the position of the first substrate 10 is slowly changing.
  • the control device 85 determines that the laser receiving device 70 acquires a detection point of the boundary, and the control device 85 continues to control the
  • the first driving device 81 slightly adjusts the position of the first substrate 10, and the control device 85 controls the laser receiving device 70 to acquire the intensity value of the received laser beam in real time until at least three of the detection points are captured, and the captured The detection points are located at different positions of the interface.
  • the control device 85 can calculate the center of the first target 12 according to the three detection points on the transparent area 122 and the radius of the transparent area 122.
  • the laser alignment system 100 further includes a CCD camera connected to the control device 85.
  • the image of the first target 12 is acquired by the CCD camera, and the control device 85 processes and analyzes the image of the first target 12 to calculate the first The center of a target 12 is located.
  • the storage device 87 stores a preset third detection range.
  • the third detection range is for determining that the laser receiving device 70 captures a detection point on the outer circumference of the second target 52.
  • the control device 85 controls the position of the second driving member 83 to drive the second substrate 50 to be finely adjusted and performs the process of acquiring the laser light received by the laser receiving device during the fine adjustment of the position of the second substrate 50.
  • the intensity value of the bundle When the intensity value of the laser beam received by the laser receiving device 70 is within the third detection range, the control device 85 determines that the laser receiving device 70 captures a detection point on the outer circumference of the second target 52.
  • the position of the second substrate 50 is continuously fine-tuned until at least three of the detection points are captured.
  • the control device 85 calculates the position of the center of the corresponding second target 52 based on the radii of at least three of the detection points and the second target 52.
  • the storage device 87 stores a preset fourth detection range value, and the fourth detection range is used to determine that the laser receiving device 70 captures the resistance of the transparent region 522 and the second target 52 of the second target 52. At least three detection points on the interface of the light regions 524.
  • the control of the position at which the second driving device 83 drives the second substrate 50 is gradually changed and the intensity value of the laser beam acquired by the laser receiving device 70 is acquired in real time during the process in which the position of the second substrate 50 is gradually changed.
  • the control device 85 determines that the laser receiving device 70 acquires the light blocking region 522 of the second target 52 and the light blocking of the second target 52.
  • the laser alignment system 100 further includes a CCD camera.
  • the image of the second target 52 is acquired by the CCD camera, and the control device 85 processes and analyzes the image of the second target 52 to calculate the center of the second target 52. position.
  • control device 85 further presets a first preset compensation range, and the control device 85 can control the first driving device 81 to drive the movement of the first substrate 10 to adjust the relative position between the first substrate 10 and the laser emitting device 30, When it is determined that the difference between the maximum intensity value of the laser receiving device 70 and the first intensity value is within the first preset compensation range, the center of the corresponding first target 12 is located at the first center position.
  • control device 85 also presets a second preset compensation range.
  • the control device 85 can control the first driving device 81 to drive the movement of the second substrate 50 to adjust the relative position between the second substrate 50 and the laser emitting device 30.
  • the center of the corresponding second target 52 is located at the second center position.
  • the laser emitting device 30 includes a drive mechanism (not shown) coupled to the control device 85 for movement under the control of the control device 85.
  • the laser receiving device 70 includes a drive mechanism (not shown) coupled to the control device 85 for movement under the control of the control device 85. It will be appreciated that two or more laser emitting devices 30 are driven by a common drive mechanism; two or more laser receiving devices 70 are driven by a common drive mechanism.
  • the laser alignment method is applied to the above laser alignment system to achieve alignment between at least two substrates.
  • the laser alignment method includes the following steps:
  • Step 1 controlling the first driving device 81 to drive the first substrate 10 to move to adjust the relative position of the first substrate 10 and the at least one laser emitting device 30 , and the first substrate 10 is provided with at least one first target 12 , each first The target 12 corresponds to a laser emitting device 30 and a laser receiving device 70.
  • each laser receiving device 70 coincides with the first intensity value
  • the laser beam per laser emitting device 30 is worn.
  • the center of the corresponding first target 12 is located at a first position, and the center of each of the first targets 12 is located at a corresponding first central position.
  • the control device 85 pre-stores a preset first intensity value, and controls the first driving device 81 to drive the movement of the first substrate 10 by the control device 85, thereby adjusting the relative position of the first substrate 10 and the at least one laser emitting device 30.
  • the control device 85 determines that the intensity value of the received laser beam coincides with the first intensity value
  • the control device 85 determines that the laser beam of each of the laser emitting devices 30 passes through the corresponding first target 12, the first substrate 10 is located at the first position, and the center of the first target 12 is located at the corresponding first central position.
  • the first central position is a position where the center of the corresponding first target 12 is located when the laser beam of the laser emitting device 30 passes through the center of the corresponding first target 12.
  • step 2 the first driving device 81 is controlled to move the first substrate 10 from the first position to the waiting area (not shown).
  • the first driving device 81 is controlled by the control device 85 to drive the first substrate 10 to move from the first position to the waiting area.
  • the control device 85 records the movement path of the first substrate 10 from the first position to the waiting area.
  • the control device 85 records the driving manner of the first driving device 81 when the first substrate 10 is moved from the first position to the waiting region, including the driving direction and the driving power.
  • Step 3 controlling the second driving device 83 to move the second substrate 50 to adjust the relative position of the second substrate 50 and the laser emitting device 30.
  • the second substrate 50 is provided with at least one second target 52 corresponding to the at least one first target 12, When it is determined that the intensity value of the laser beam received by each of the laser receiving devices 70 coincides with the second intensity value, the laser beam of each of the laser emitting devices 30 passes through the corresponding second target 52, and the second substrate 50 is located at the In two positions, the center of each of the second targets 52 is located at a corresponding second central position.
  • the second driving device 83 is controlled by the control device 85 to drive the movement of the second substrate 50, thereby adjusting the relative position of the second substrate 50 and the laser emitting device 30.
  • the second target 52 is disposed on the alignment area on the second substrate 50.
  • the second central position is a position where the center of the corresponding second target 52 is located when the laser beam of the laser emitting device 30 passes through the center of the corresponding second target 52; the second target 52 and the first The structure of the target 12 is the same.
  • Step 4 controlling the first driving device 81 to move the first substrate 10 from the waiting area to the first position, and the center of each first target returns to the corresponding first central position.
  • the control device 85 controls the first driving device 81 to move the center of each of the first targets 12 of the first substrate 10 to return to the corresponding first center position.
  • the step 1 includes the following steps:
  • step 101 the first driving device 81 is controlled to move the first substrate 10 to the first pre-alignment position to pre-align each of the first targets 12 with the corresponding laser emitting device 30.
  • Step 102 controlling each laser emitting device 30 to emit a laser beam, controlling the first driving device 81 to finely adjust the position of the first substrate 10, and determining the laser beam when the corresponding laser receiving device 70 detects the intensity value of the laser beam. At least partially passing through the corresponding first target 12.
  • Step 103 determining the location of the center of each of the first targets 12.
  • Step 104 controlling the first driving device 81 to finely adjust the position of the first substrate 12.
  • each of the laser emitting devices 30 The emitted laser beam passes through a corresponding first target 12, the first substrate 10 is located at the first position, and the center of each of the first targets 12 is located at the corresponding first central position.
  • each of the laser emitting devices 30 is located at the first transmitting position before being aligned with the first target 12.
  • the step 101 specifically includes the following steps:
  • Step 1011 Calculate the first pre-alignment position according to the first emission position where each laser emitting device 30 is located.
  • Step 1012 controlling the first driving device 81 to move the first substrate 10 to the first pre-alignment position.
  • the first pre-alignment position is calculated by the control device 85 according to the corresponding first emission position, when the central axis of the laser beam emitted by the laser emitting device 30 passes through the center of the corresponding first target 12 The theoretical position at which a substrate 10 is located.
  • the first substrate 10 is a transparent substrate
  • the corresponding first target 12 can be determined. The approximate location.
  • the radius of the laser beam is greater than the radius of the light-transmitting region 122 of the first target 12, and the laser beam is at least partially capable of passing through the light-transmitting region 122 of the first target 122 when the laser receiving device 70 detects the laser light.
  • the intensity value of the beam is obtained, the approximate position of the corresponding first target 12 can be determined.
  • determining the position of the center of each of the first targets 12 includes: controlling the first driving device 81 to finely adjust the position of the first substrate 10, and the intensity value of the laser beam received by the laser receiving device 70 and When the first detection values are equal, it is determined that a detection point on the outer circumference of the corresponding first target 12 is captured, and the first driving device 81 is further controlled to finely adjust the position of the first substrate 10, and at least three locations are captured.
  • the center of the corresponding first target is calculated according to the at least three detection points and the radius of the first target. For example, by capturing the detection point A, the detection point B, and the detection point C shown in FIG. 3, and according to the radius of the first target 12, the position of the center of the first target 12 can be calculated.
  • the step 103 includes: capturing at least two first detection points and at least two second detection points, wherein the first detection point is located on an outer circumference of the first target 12, The second detection point is located at a boundary between the light blocking region 124 of the first target 12 and the light transmitting region 12 of the first target 12; calculated by at least two of the first detection points and at least two second detection points The center of the first target is located.
  • the “capturing at least two first detection points and at least two second detection points” includes:
  • the first driving device 81 is controlled to finely adjust the position of the first substrate 10, and when the intensity value of the laser beam received by the laser receiving device 70 is equal to the first detected value, it is determined that one of the outer circumferences of the first target 12 is captured. a first detection point, and continue to finely adjust the position of the first substrate 10 until at least two of the first detection points are captured; continue to control the first driving device 81 to finely adjust the position of the first substrate 10, and acquire a corresponding laser
  • the intensity value of the receiving device 70 when the intensity value of the laser beam received by the laser receiving device 70 is equal to the second detection value, determines that one of the second detection points is captured, and continues to control the position of the micro-adjusting the first substrate 10.
  • the first detection point and the second detection point on the first target 12 are characterized, and information is collected by the detecting device, such as a CCD camera, and then calculated to obtain the detection point position.
  • an image including the first target 12 is acquired by a CCD camera, and then the image of the first target 12 is processed and analyzed, and the corresponding position is calculated according to the position of the laser emitting device 30.
  • the center of the first target 12 is located. Since the first substrate 10 is a transparent substrate, the light blocking region 124 and the light transmitting region 122 of the first target 12 in the image of the first target 12 collected by the CCD camera have a clear boundary line, and after processing and analyzing, The position of the laser emitting device 30 can calculate the position of the center of the corresponding first target 12.
  • each laser emitting device 30 is controlled to emit a first laser beam having a radius larger than a radius of the transparent region 122 of the first target 12.
  • the radius of the first laser beam is smaller than the radius of the first target 12, and the radius of the laser beam is greater than the difference between the transparent region 122 of the first target 12 and the radius of the first target 12;
  • the first laser beam is controlled to finely adjust the position of the first substrate 10, and if the corresponding laser receiving device 70 detects the intensity value of the laser beam, it is determined that the first laser beam at least partially passes through the corresponding first target 12 Light transmissive area 122.
  • the light blocking region 124 of the first target 12 can block at least part of the first laser beam, thereby quickly determining the first The location of the target 12.
  • each laser emitting device 30 is controlled to emit a second laser beam having a radius not less than that of the transparent region 122 of the first target 12. a radius, a radius of the second laser beam is greater than a difference between a transmittance of the first target 12 and a radius of the first target 12, and a radius of the second laser beam is smaller than a radius of the first laser beam And controlling the position of the first substrate 10 to be finely adjusted according to the second laser beam emitted by the laser emitting device 30, and determining the intensity value and the intensity of the second laser beam detected by each of the laser receiving devices 70; When the first intensity values are equal, the laser beam emitted by each of the laser emitting devices 30 passes through the corresponding first target 12, and the center of each of the first targets 12 is located at the corresponding first central position.
  • the radius of the second laser beam is greater than the difference between the transparent region 122 of the first target 12 and the radius of the first target 12, the radius of the second laser beam is smaller than the radius of the first laser beam, In turn, the detection points can be quickly captured, and the alignment accuracy is improved.
  • the method specifically includes the following steps: controlling the first driving device 81 to finely adjust the position of the first substrate 10, when determining the maximum intensity value generated by each laser receiving device 70 and a first intensity value When the difference is within the first preset compensation range, it is determined that the first substrate 10 is located at the first position, and the center of each of the first targets 12 is located at the corresponding first central position.
  • step 103 although it is calculated that the center of the first target 12 is located, it is still difficult to ensure that the central axis of the laser beam passing through the first target 12 and the laser emitting device 30 of the first target 12 are further fine-tuned.
  • the position of the first substrate 10 is compensated, thereby achieving fine adjustment, and the alignment accuracy is improved.
  • step 3 please refer to FIG. 10, which specifically includes the following steps:
  • Step 301 controlling the second driving device 83 to move the second substrate 50 to the second pre-alignment position to pre-align each of the second targets 52 with the corresponding laser emitting device 30.
  • Step 302 controlling each laser emitting device 30 to emit a laser beam, controlling the second driving device 83 to finely adjust the position of the second substrate 50, and determining the laser beam when the corresponding laser receiving device 70 detects the intensity value of the laser beam. At least partially passes through the corresponding second target 52.
  • step 303 the location of the center of each of the second targets 52 is determined.
  • Step 304 controlling the second driving device 83 to finely adjust the second substrate 52.
  • each laser emitting device 30 emits The central axis of the laser beam passes through the center of the corresponding second target 52, the second substrate 50 is located at the second position, and the center of each of the second targets 52 is located at the corresponding second central position.
  • Step 301 referring to FIG. 11, specifically includes the following steps:
  • the second pre-alignment position is calculated by the control device 85 according to the corresponding first emission position, when the central axis of the laser beam emitted by the laser emitting device 30 passes through the center of the corresponding second target 52.
  • the second substrate 50 is a transparent substrate, in the step 302, when at least part of the laser beam is blocked by the light blocking region 524 of the second target 52, the corresponding second target 52 can be determined. The approximate location.
  • the radius of the laser beam is greater than the radius of the light transmissive region 522 of the second target 52, and the laser beam is at least partially capable of passing through the light transmissive region 522 of the second target 522, when the laser receiver 70 detects the laser When the intensity value of the beam is obtained, the approximate location of the corresponding second target 52 can be determined.
  • each laser emitting device 30 is controlled to emit a third laser beam having a radius larger than a radius of the light transmitting region 522 of the second target 52.
  • the radius of the third laser beam is smaller than the radius of the second target 52, and the radius of the laser beam is greater than the difference between the radius of the transparent region 522 of the second target 52 and the radius of the second target 52;
  • the third laser beam is controlled to finely adjust the position of the second substrate 50. If the corresponding laser receiving device 70 detects the intensity value of the third laser beam, it is determined that the third laser beam at least partially passes through the corresponding second target 52. Light transmissive area 522.
  • the light blocking region 524 of the second target 52 can block at least part of the third laser beam, thereby quickly determining the second The location of the target 52.
  • each laser emitting device 30 is controlled to emit a fourth laser beam having a radius not less than a radius of the light transmitting region 522 of the second target 52, a radius of the fourth laser beam
  • the difference between the transparent region 522 of the second target 52 and the radius of the second target 52 is smaller than the radius of the third laser beam, thereby improving the alignment accuracy.
  • the radius of the third laser beam is the same as the radius of the first laser beam
  • the fourth laser beam has the same radius as the second laser beam.
  • the step of determining the location of the center of each of the second targets 52 is similar to the step 102.
  • the step 304 includes: controlling a position of at least one of the micro-adjustment laser emitting device 30 and the second substrate 10, and determining a maximum intensity value and a second intensity value generated by each laser receiving device 70. When the difference between the two ranges is within the second preset compensation range, it is determined that the center of each of the second targets 52 is located at the corresponding second center position.
  • step 303 although the position of the center of the second target 52 is determined by calculation, it is still difficult to ensure that the central axis of the laser beam passing through the second target 52 is coaxial with the center of the second target 52, by further fine adjustment
  • the positions of the two substrates 50 and/or the corresponding laser emitting devices 30 are compensated to achieve fine adjustment, which improves the alignment accuracy.
  • the first substrate 10 is not a transparent substrate, and may be a substrate such as a printed circuit board.
  • the first target 12 may be a through hole formed in the first substrate 10 .
  • the second substrate 50 is not a transparent substrate, and may be a substrate such as a printed circuit board.
  • the second target 52 may be a through hole formed in the second substrate 50.
  • the first substrate 10 is not a transparent substrate, and may be a substrate such as a printed circuit board.
  • the first substrate 10 has a through hole in the alignment area, and the first target 12 is attached to the through hole.
  • the light transmissive region 122 of the first substrate 10 is disposed corresponding to the through hole.
  • the second substrate 50 is not a transparent substrate, and may be a substrate such as a printed circuit board.
  • the second substrate 50 has a through hole in the alignment area, and the second target 52 is attached to the through hole.
  • the light transmitting region 522 of the second substrate 50 is disposed corresponding to the through hole.
  • the first target 12 and the second target 52 may be different in size.
  • the first substrate 10 may be a touch screen or other substrate in the display panel
  • the second substrate 50 may be a glass cover or other substrate in the display panel.
  • the method further includes the step of: controlling at least one of the first substrate 10 and the second substrate 50 to move along the preset moving path until the first substrate 10 and the first The two substrates 50 are attached together, wherein, in the movement, a center of the first target 12 and a center of the corresponding second target 52 are always located on the preset moving path.
  • step 1 further comprising the steps of: performing laser self-alignment on each of the laser emitting devices 30 and the corresponding laser receiving device 70, when the intensity value of the laser beam received by the laser receiving device 70 is in advance Determining the laser emitting device 30 and the corresponding laser receiving device when determining a range of intensity values of the laser beam received by the laser receiving device 70 when the laser emitting device 30 and the laser receiving device 70 are self-aligned 70 achieves laser self-alignment.
  • the laser alignment method and the laser alignment system 100 provided by the present invention use the concentrated laser to align the first substrate 10 and the second substrate 50 without setting a mark, thereby solving the manual alignment and the CCD pair well.
  • the problem of low bit accuracy since the position of the center of each of the first target 12 and the second target 52 is determined by using a laser during the alignment process, the first substrate 10 and the second substrate 50 are aligned, and the alignment accuracy is further improved. Further, in the alignment process, the compensation alignment is further performed, and the accuracy is further improved, thereby improving the bonding precision of the first substrate 10 and the second substrate 50.
  • the first target 12 and the second target 52 have the same structure, and therefore can be prepared by the same mask, thereby saving manufacturing costs.

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Abstract

一种激光对位系统（100），包括：激光发射装置（30），用于出射激光束；第一驱动装置（81），用于驱动第一基板（10），第一基板上设第一靶标（12）；第二驱动装置（83），用于驱动第二基板（50），第二基板上对应第一靶标设第二靶标（52）；激光接收装置（70），与激光发射装置分别位于第一基板与第二基板的两侧，用于接收激光发射装置发射的激光束；控制装置（85），用于控制激光发射装置、第一驱动装置、第二驱动装置及激光接收装置。还提供了一种激光对位系统的激光对位方法。

Description

激光对位系统及激光对位方法 技术领域
本发明涉及一种激光对位系统及激光对位方法。
背景技术
基板之间贴合组装前需进行对位，例如，显示装置中的玻璃盖板与触摸屏贴合，或者是电路板之间的贴合。对位方法，通常有两种，一种是人工对位，其精度较低；另一种是CCD相机对位，然CCD相机对位对制作标示的精度要求高。
发明内容
为解决上述问题，本发明实施例公开一种激光对位系统及激光对位方法。
一种激光对位系统，其包括：
激光发射装置，用于出射激光束；第一驱动装置，用于驱动第一基板在第一定位平台上移动使所述第一基板与所述激光发射装置之间的相对位置改变，所述第一基板上设有与所述激光发射装置相对应的第一靶标；
第二驱动装置用于驱动第二基板在第二定位平台上移动使所述第二基板与所述激光发射装置之间的相对位置方式改变，所述第二基板上设有第二靶标，所述第二靶标与所述第一靶标相对应；
激光接收装置，与所述激光发射装置分别位于所述第一基板与所述第二基板的两侧，用于接收激光发射装置发射的激光束；及
控制装置，用于控制所述激光发射装置、所述第一驱动装置、所述第二驱动装置及所述激光接收装置，所述控制装置根据所述激光接收装置所接收到的激光束的强度值判断所述第一基板与所述第二基板的位置；
其中，所述激光对位系统还包括存储装置，所述存储装置内存储有预设的第一强度值及第二强度值；当所述激光接收装置所接收到的激光束的强度值与所述第一强度值相等，所述控制装置确定所述激光发射装置射出的激光束穿过对应的所述第一靶标的中心，所述第一基板位于第一位置，所述第一靶标的中心位于第一中心位置；当所述激光接收装置所接收到的激光束的强度值与所述第二强度值相等时，所述控制装置确定所述激光发射装置射出的激光束穿过对应的所述第二靶标的中心，所述第二基板位于第二位置，所述第二靶标的中心位于第二中心位置。
一种激光对位方法，用于实现第一基板与第二基板对位，所述激光对位方法包括以下步骤
步骤1，控制第一驱动装置移动所述第一基板，以调节所述第一基板与激光发射装置的相对位置，所述第一基板上设第一靶标，当确定所述激光接收装置接收到的激光束的强度值与第一强度值一致时，则所述激光发射装置的激光束穿过所述第一靶标的中心，所述第一基板位于第一位置，每个所述第一靶标的中心位于对应的第一中心位置；
步骤2，控制所述第一驱动装置移动所述第一基板从所述第一位置至等待区；
步骤3，控制第二驱动装置移动所述第二基板，以调节所述第二基板与所述激光发射装置的相对位置，所述第二基板上对应所述第一靶标设第二靶标，当确定所述激光接收装置接收到的激光束的强度值 与第二强度值一致时，所述激光发射装置的激光束穿过所述第二靶标，所述第二基板位于第二位置，所述第二靶标的中心位于对应的第二中心位置；
步骤4，控制所述第一驱动装置将所述第一基板从所述等待区移回至所述第一位置，所述第一靶标的中心回复至所述第一中心位置。
本发明提供的激光对位系统及其激光对位方法，运用集中性强的激光对所述第一基板及所述第二基板进行对位，且无需设置标示，很好地解决了人工对位及CCD对位精度不高的问题。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的激光对位系统的结构框图。
图2为第一基板与第二基板对位时的示意图。
图3为第一基板与第二基板对位时的侧视示意图。
图4为第一靶标与第二靶标的平面示意图。
图5为本发明实施例中的激光对位方法的流程图。
图6为图5所示步骤1的流程图。
图7为图6所示步骤101的流程图。
图8为图6所示的步骤102中，激光发射装置发射的激光束为第一激光束的示意图。
图9为图6所示的步骤103中，激光发射装置发射的激光束为第二激光束的示意图。
图10为图5所示步骤3的流程图。
图11为图10所示步骤301的流程图。
图12为图10所示的步骤302中，激光发射装置发射的激光束为第三激光束的示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，本发明提供一种激光对位系统100。请一并参阅图2及图3，激光对位系统100用于对第一基板10及第二基板50进行对位。第一基板10上设定位用的至少一第一靶标12。第二基板50上与第一靶标12相对应的位置处也设有定位用的第二靶标52，即第一基板10上的第一靶标12与第二基板50上的第二靶标52相对应。激光对位系统100包括：至少一激光发射装置30、至少一激光接收装置70、第一驱动装置81、第二驱动装置83、以及控制装置85。其中，激光发射装置30可出射激光束。
第一驱动装置81驱动第一基板10在第一定位平台(图未示)上移动，使第一基板10与激光发射装置30之间的相对位置发生改变，并使每个第一靶标12与一个激光发射装置30相对应。
第二驱动装置83驱动第二基板50在第二定位平台(图未示)上移动，使每个第二靶标52与一个激光发射装置30相对应。可以理解的，激光发射装置30的位置是固定不变的。
激光接收装置70与激光发射装置30分别位于第一基板10与第二基板50的两侧用于接收对应的激 光发射装置30发射的激光束，并将所接收到的激光束的强度值发送给控制装置85。其中，该激光束的强度值可通过激光的能量值来表征，且激光束的强度值与激光的能量呈正比，即当所接收到的激光束越强，该激光束的能量值也就越大。
控制装置85，与激光发射装置30、第一驱动装置81、第二驱动装置83及激光接收装置70连接。控制装置85接收激光接收装置70发送的激光束的强度值并根据该激光束的强度值判断第一基板10与第二基板50是否定位准确。在本实施方式中，该控制装置85可为一具有数据处理能力的设备，例如服务器或终端设备等。在其他实施方式中，该控制装置85可为可进行数据处理的处理器，例如一设备的中央处理器(Center Processor Unit，CPU)。
具体的，激光对位系统100包括有存储装置87。该存储装置87内存储有预设的第一强度值与第二强度值。当每个激光接收装置70所接收到的激光束的强度值与所述第一强度值相一致时，所述控制装置85确定每个激光发射装置30的激光束穿过对应的第一靶标12的中心，此时，控制装置85判断该第一基板10位于预设的第一位置，每个所述第一靶标12的中心位于第一中心位置。当每个所述激光接收装置70所接收到的激光束的强度值与所述第二强度值相一致时，所述控制装置85确定每个激光发射装置30的激光束穿过对应的所述第二靶标52的中心，此时，控制装置85判断第二基板50位于预设的第二位置，每个所述第二靶标52的中心位于第二中心位置。在本实施方式中，第二强度值小于第一强度值。在其他实施方式中，第二强度值大于第一强度值。
本实施方式中，激光接收装置70为激光功率器。激光束的强度值与激光功率器的功率成正比。当激光束的强度值越大，该激光功率器的功率也越大，对应输出的信号也更强。故此，激光功率器会根据所接收到的激光束的强度值发送不同强度值的信号给控制装置85。在一具体的实施方式中，当激光功率器所接收到的激光束的强度值与第一激光强度值相一致时，则发送第一信号给控制装置85；当激光功率器所接收到的光束的强度值与第二激光强度值相一致时，则发送第二信号给控制装置85；若为其他强度值，则不给控制装置85发送信号。其中，第一信号与第二信号的强度值不同。
第一基板10大致呈矩形。在本实施方式中，第一基板10为显示面板(图未示)中的玻璃盖板，用于保护显示装置中的显示屏。每一第一靶标12设于第一基板10的对位区域。第一靶标12的数量为两个，两个第一靶标12位于第一基板10的一对角线上。请参阅图4，每个第一靶标12包括透光区域122及阻光区域124。阻光区域124环绕该透光区域122，阻光区域124能够阻挡所述激光束的穿过。第一靶标12呈圆形，透光区域122为圆形，阻光区域124为圆环形，第一靶标12贴设于第一基板10上。阻光区域124的外圆周为第一靶标12的外圆周。透光区域122的中心为第一靶标12的中心。
第二基板50大致呈矩形。在本实施方式中，第二基板50为显示面板中的触摸屏。每一第二靶标52设于第二基板50的对位区域，每个第二靶标52与一第一靶标12对应设置。第二靶标52的数量为两个，两个第二靶标52位于第二基板50的一对角线上。每个第二靶标52包括透光区域522及阻光区域524。阻光区域524环绕透光区域522，阻光区域524能够阻挡所述激光束的穿过。第二靶标52为圆形，透光区域522位于第二靶标52的中心，透光区域522为圆形。阻光区域124为环绕透光区域522的圆环形。
进一步地，存储装置87内存储有预设的用于判断激光发射装置30与激光接收装置70之间实现自对准时激光接收装置70所接收到的激光束的强度值的范围。当激光接收装置70所接收到的激光束的强度值在所述预设的强度值的范围内时，控制装置85确定激光发射装置30与对应的激光接收装置70之间实现激光自对准。当激光接收装置70所接收到的激光束的强度值在所述预设的强度值的范围外时，控制装置85控制激光发射装置30及/或对应的激光接收装置70运动，调节激光发射装置30及对应的激 光接收装置70的相对位置，直至所述激光接收装置70所接收到的激光强度值在所预设的强度值的范围内。当激光发射装置30与激光接收装置70之间实现了自对准后，该激光发射装置30与激光接收装置70的位置固定不变。
每个激光发射装置30在与对应的第一靶标12对位前，每个激光发射装置30与对应激光接收装置70先进行自对准，当激光接收装置70接收到对应激光发射装置30发射的激光束的强度值在预设的强度值的范围时，控制装置85即判断激光发射装置30与对应的激光接收装置70之间实现了激光自对准。
设定每个激光发射装置30在与对应的第一靶标12对位前位于第一发射位置。本实施方式中，所述第一发射位置为，每个激光发射装置30与对应激光接收装置70进行激光自对准后，每个激光发射装置30所在的位置。控制装置85能够依据所述第一发射位置计算得出第一基板10的第一预对位位置，所述第一预对位位置为激光发射装置30出射的激光束的中轴线穿过第一基板10上对应的第一靶标12的中心时，第一基板10所在的位置。
在对第一基板10与第二基板50进行对位时，控制装置85先控制第一驱动装置81驱动第一基板10移动，以调节第一基板10与激光发射装置30之间的相对位置。当每个激光接收装置70所接收到的激光束的强度值为第一强度值时，表明每个激光发射装置30射出的激光束穿过对应的第一靶标12，且每个第一靶标12的中心与对应的激光发射装置30发射的激光束的中轴线同轴。也即，所述第一基板10此时正位于第一预对位位置。该第一预对位位置与第一位置为同一位置。
控制装置85能够依据所述第一发射位置计算得出第二预对位位置，所述第二预对位位置为激光发射装置30出射的激光束的中轴线穿过第二靶标52的中心时，第二基板50所在的位置。具体的，控制装置85控制第一驱动装置81移开第一基板10至所述等待区，此时，控制装置85记录第一基板10从所述第一位置移动至所述等待区的移动路径。在另一实施方式中，控制装置85记录第一基板10从所述第一位置移动至所述等待区时该第一驱动装置81的驱动方式，包括驱动的方向及驱动的动力。在第一基板10移动至所述等待区之后，控制装置85再控制第二驱动装置83驱动第二基板50移动，以调节第二基板50与激光发射装置30之间的相对位置。当每个激光接收装置70所接收到的激光束的强度值为第二强度值时，该第二基板50移动到了所述第二位置。此时，每个第二靶标52的中心与对应的激光发射装置30发射的激光束的中轴线同轴。
进一步地，控制装置85依据一第一靶标12所在的第一中心位置确定第一基板10的第一预设路径，以及依据一第二靶标52在对应的第二中心位置确定第二基板50的第二预设路径。控制装置85控制所述第一驱动装置81驱动所述第一基板10沿所述第一预设路径移动，及/或所述第二驱动装置83驱动所述第二基板50沿所述第二预设移动路径移动，直至所述第一基板10与第二基板50贴合于一起。其中，所述第一预设路径与第二预设路径与过所述第一中心位置与对应的第二中心位置的直线平行。在本实施方式中，所述第一驱动装置81驱动所述第一基板10沿该第一预设路径往下移动；所述第二驱动装置83驱动所述第二基板50沿该第二预设路径为往上移动。
在一实施例中，控制装置85依据一第一靶标12在第一中心位置及对应的第二靶标52的第二中心位置确定预设移动路径，控制装置85控制至少移动所述第一基板10与所述第二基板50中的其中之一沿所述移动路径移动，直至所述第一基板10与所述第二基板50贴合于一起。其中，所述预设移动路径为经过所述第一靶标12的中心与对应的所述第二靶标52的中心的直线。
在一实施例中，存储装置87内存储有预设的第一检测值。控制装置85控制第一驱动装置81慢慢移动，使得所述第一基板10的位置微微调整。当激光接收装置70所接收到的激光强度值等于所述第一 检测值时，控制装置85确定激光接收装置70捕捉到处于对应的第一靶标12的外圆周上的一个检测点。控制装置85继续控制第一驱动装置81慢慢移动并使所述第一基板10的位置微微调整，所述控制装置85对所述激光接收装置70接收到的激光束的强度值与所述第一检测值作对比，直至控制装置85确定激光接收装置70捕捉到对应的第一靶标12上的至少三个不相同的所述检测点的位置。控制装置85依据至少三个所述检测点及第一靶标12的半径，计算得出对应的第一靶标12的中心所在位置。
在一实施例中，控制装置85内存储有预设的第一检测值，当激光接收装置70所接收到的激光强度值等于所述第一检测值时，控制装置85确定激光接收装置70捕捉到的第一检测点处于第一靶标12的外圆周上。控制装置85继续控制调节第一基板10的位置，所述控制装置85控制所述激光接收装置70实时获取接收到的激光束的强度值并与所述第一检测值作对比，直至控制装置85确定激光接收装置70捕捉到对应的第一靶标12上的至少两个所述第一检测点的位置。所捕捉到的所述第一检测点的位置均不相同。控制装置85继续控制调节第一基板10的位置，当激光接收装置70所接收到的激光强度值等于第二检测值时，控制装置85确定激光接收装置70捕捉到的第二检测点处于第一靶标12的透光区域122与阻光区域124的交界上。控制装置85能够控制微调节激光发射装置30的位置，且获取第一靶标12上的至少两个第一检测点第一靶标12上的及至少两个第二检测点，控制装置85依据第一靶标12上的至少两个的第一检测点、第一靶标12的至少两个的第二检测点、第一靶标12的半径及透光区域122的半径，计算得出对应的第一靶标12的中心所在位置。捕捉到的第一检测点位于所述第一靶标12外圆周上的不同位置，捕捉到的第二检测点位于所述交界上的不同位置。
在一实施例中，存储装置87内存储有预设的用于确定激光发射装置30发射的激光束穿过第一靶标12外圆周上的一个检测点的第一检测范围。控制装置85控制第一驱动装置81驱动第一基板10微微移动，并在第一基板10微微移动的过程中控制激光接收装置70实时获取所接收到的激光束的强度值。当激光接收装置70所接收到激光束的强度值在所述第一检测范围内时，控制装置85确定激光接收装置70捕捉到一个检测点。继续微调节第一基板10的位置，直至捕捉到至少三个不相同的所述检测点。捕捉到的检测点位于所述第一靶标12外圆周上的不同位置，控制装置85依据至少三个所述检测点及第一靶标12的半径，计算得出对应的第一靶标12的中心所在位置。
在一实施例中，存储装置87预存储用于确定激光发射装置30发射的激光束穿过第一靶标12的透光区域122与阻光区域124交界上的至少三个检测点的第二检测范围。控制第一驱动装置81驱动第一基板10的位置慢慢变化，并在第一基板10的位置慢慢变化的过程中实时获取激光接收装置70所获取到的激光束的强度值。当激光接收装置70所接收到激光束的强度值在所述第二检测范围内时，控制装置85确定激光接收装置70获取到所述交界的一个检测点，所述控制装置85继续控制所述第一驱动装置81微调节所述第一基板10的位置，所述控制装置85控制激光接收装置70实时获取所接收到的激光束的强度值直至捕捉到至少三个所述检测点，捕捉到的检测点位于所述交界的不同位置，如此，控制装置85依据透光区域122上的三个检测点及透光区域122的半径，即可计算得出第一靶标12的中心所在位置。
在一实施例中，激光对位系统100还包括与控制装置85连接的CCD相机，通过CCD相机采集第一靶标12的图像，控制装置85对第一靶标12的图像进行处理分析，计算出第一靶标12的中心所在位置。
在一实施例中，存储装置87内存储有预设的第三检测范围。其中，第三检测范围用于判断激光接收装置70捕捉到第二靶标52外圆周上的一个检测点。在对第二基板50对位时，控制装置85控制第二 驱动件83驱动第二基板50的位置微微调整并在第二基板50的位置微调的过程中实施获取激光接收装置所接收到的激光束的强度值。当激光接收装置70所接收到的激光束的强度值在所述第三检测范围内时，控制装置85确定激光接收装置70捕捉到处于第二靶标52的外圆周上的一个检测点。继续微调节第二基板50的位置，直至捕捉到至少三个所述检测点。控制装置85依据至少三个所述检测点及第二靶标52的半径，计算得出对应的第二靶标52的中心所在位置。
在一实施例中，存储装置87内存储有预设的第四检测范围值，第四检测范围用于判断激光接收装置70捕捉到第二靶标52的透光区域522与第二靶标52的阻光区域524的交界上的至少三个检测点。继续控制第二驱动装置83驱动第二基板50的位置慢慢变化并在第二基板50的位置慢慢变化的过程中实时获取激光接收装置70所获取到的激光束的强度值。当激光接收装置70所接收到激光束的强度值在所述第四检测范围内时，控制装置85确定激光接收装置70获取到第二靶标52的透光区域522与第二靶标52的阻光区域524的交界上的至少三个所述检测点，如此，控制装置85依据透光区域522上的三个检测点及透光区域522的半径，即可计算得出第二靶标12的中心所在位置。在一实施例中，激光对位系统100还包括CCD相机，通过CCD相机采集第二靶标52的图像，控制装置85对第二靶标52的图像进行处理分析，计算出第二靶标52的中心所在位置。
进一步地，控制装置85还预设第一预设补偿范围，控制装置85能够控制第一驱动装置81驱动第一基板10运动，以调节第一基板10与激光发射装置30之间的相对位置，当确定激光接收装置70的最大强度值与第一强度值之间的差值在第一预设补偿范围内时，对应的第一靶标12的中心位于所述第一中心位置。
进一步地，控制装置85还预设第二预设补偿范围。控制装置85能够控制第一驱动装置81驱动第二基板50运动，以调节第二基板50与激光发射装置30之间的相对位置。当确定激光接收装置70的最大强度值与第二强度值之间的差值在第二预设补偿范围内时，对应的第二靶标52的中心位于所述第二中心位置。
激光发射装置30包括与控制装置85连接的驱动机构(图未示)，以在控制装置85的控制下移动。激光接收装置70包括与控制装置85连接的驱动机构(图未示)，以在控制装置85的控制下移动。可以理解，两个或两个以上的激光发射装置30通过一个共同的驱动机构驱动；两个或两个以上的激光接收装置70通过一个共同的驱动机构驱动。
请参阅图5，为本发明提供一种应用上述激光对位系统100的激光对位方法。该激光对位方法应用于上述激光对位系统，实现至少两基板之间的对位。所述激光对位方法包括以下步骤：
步骤1，控制第一驱动装置81驱动第一基板10移动，以调节第一基板10与至少一个激光发射装置30的相对位置，第一基板10上设至少一个第一靶标12，每个第一靶标12对应一个激光发射装置30及一个激光接收装置70，当确定每个激光接收装置70接收到的激光束的强度值与第一强度值一致时，则每个激光发射装置30的激光束穿过对应的第一靶标12的中心，所述第一基板10位于第一位置，每个所述第一靶标12的中心位于对应的第一中心位置。
具体地，控制装置85预存储有预设的第一强度值，通过控制装置85控制第一驱动装置81驱动第一基板10运动，进而调节第一基板10与至少一个激光发射装置30的相对位置，通过控制装置85确定接收到的激光束的强度值与第一强度值一致时，则控制装置85确定每个激光发射装置30的激光束穿过对应的第一靶标12，所述第一基板10位于第一位置，所述第一靶标12的中心位于对应的所述第一中心位置。本实施例中，所述第一中心位置为，激光发射装置30的激光束穿过对应的第一靶标12的中心时， 对应的第一靶标12的中心所在位置。
步骤2，控制第一驱动装置81移动第一基板10从所述第一位置至等待区(图未示)。
具体地，通过控制装置85控制第一驱动装置81驱动第一基板10从所述第一位置移动至所述等待区。控制装置85记录第一基板10从所述第一位置移动至所述等待区的移动路径。在另一实施方式中，控制装置85记录第一基板10从所述第一位置移动至所述等待区时该第一驱动装置81的驱动方式，包括驱动的方向及驱动的动力。
步骤3，控制第二驱动装置83移动第二基板50，以调节第二基板50与激光发射装置30的相对位置，第二基板50上对应至少一个第一靶标12设至少一个第二靶标52，当确定每个激光接收装置70接收到的激光束的强度值与第二强度值一致时，每个激光发射装置30的激光束穿过对应的第二靶标52，所述第二基板50位于第二位置，每个所述第二靶标52的中心位于对应的第二中心位置。
具体地，通过控制装置85控制第二驱动装置83驱动第二基板50运动，进而调节第二基板50与激光发射装置30的相对位置。第二靶标52设于第二基板50上的对位区域。本实施例中，所述第二中心位置为，激光发射装置30的激光束穿过对应的第二靶标52的中心时，对应的第二靶标52的中心所在位置；第二靶标52与第一靶标12的结构相同。
步骤4，控制第一驱动装置81将第一基板10从所述等待区移回至所述第一位置，每个第一靶标的中心回复至对应的所述第一中心位置。
控制装置85控制第一驱动装置81移动第一基板10的每个第一靶标12的中心回复至对应的所述第一中心位置。
其中，请参阅图6，所述步骤1中，具体包括以下步骤：
步骤101，控制第一驱动装置81移动第一基板10至第一预对位位置，以对每个第一靶标12与对应的激光发射装置30进行预对位。
步骤102，控制每个激光发射装置30发射激光束，控制第一驱动装置81微调节第一基板10的位置，当对应的激光接收装置70检测到激光束的强度值时，确定所述激光束至少部分穿过对应的第一靶标12。
步骤103，确定每个第一靶标12的中心所在位置。
步骤104，控制第一驱动装置81微调节第一基板12的位置，当确定每个激光接收装置70接收到的激光束的强度值与所述第一强度值一致时，每个激光发射装置30发射的激光束穿过对应的第一靶标12，所述第一基板10位于所述第一位置，每个所述第一靶标12的中心位于对应的所述第一中心位置。
其中，设每个激光发射装置30在与第一靶标12对位前位于第一发射位置，请参阅图7，所述步骤101具体包括以下步骤：
步骤1011，依据每个激光发射装置30所位于的所述第一发射位置，计算得出所述第一预对位位置。
步骤1012，控制第一驱动装置81移动第一基板10至所述第一预对位位置。
所述第一预对位位置为，控制装置85根据对应的所述第一发射位置计算得出的，激光发射装置30出射的激光束的中轴线穿过对应的第一靶标12的中心时第一基板10所在的理论位置。
本实施方式中，由于第一基板10为透明基板，在所述步骤102中，当至少部分所述激光束被第一靶标12的阻光区域124遮挡时，即能够确定对应的第一靶标12的大致所在位置。
进一步地，所述激光束的半径大于第一靶标12的透光区域122的半径，且所述激光束至少部分能够穿过第一靶标122的透光区域122，当激光接收装置70检测到激光束的强度值时，即能够确定对应的第一靶标12的大致所在位置。
在所述步骤103中，即确定每个第一靶标12的中心所在位置，包括：控制第一驱动装置81微调节第一基板10的位置，在激光接收装置70接收的激光束的强度值与第一检测值相等时，则确定捕捉到处于对应的第一靶标12的外圆周上的一个检测点，继续控制第一驱动装置81微调节第一基板10的位置，在捕捉到至少三个所述检测点后，根据至少三个所述检测点以及所述第一靶标的半径，计算得出对应的所述第一靶标的中心所在位置。例如，通过捕捉图3中所示的检测点A、检测点B及检测点C，及依据第一靶标12的半径，即可计算得出第一靶标12的中心所在位置。
在一实施例中，在所述步骤103中，包括：捕捉至少两个第一检测点及至少两个第二检测点，其中，所述第一检测点位于第一靶标12的外圆周上，所述第二检测点位于第一靶标12的阻光区域124与第一靶标12的透光区域12的交界上；通过至少两个所述第一检测点及至少两个第二检测点计算得到所述第一靶标的中心所在位置。其中，所述“捕捉至少两个第一检测点及至少两个第二检测点”，包括：
控制第一驱动装置81微调节第一基板10的位置，在激光接收装置70接收的激光束的强度值与第一检测值相等时，则确定捕捉到处于第一靶标12的外圆周上的一个第一检测点，并继续微调节第一基板10的位置，直到捕捉到至少两个所述第一检测点；继续控制第一驱动装置81微调节第一基板10的位置，并获取对应的激光接收装置70的强度值，在激光接收装置70接收的激光束的强度值与第二检测值相等时，则确定捕捉到一个所述第二检测点，并继续控制微调节第一基板10的位置，直到捕捉到至少两个所述第二检测点；在捕捉到至少两个所述第一检测点及至少两个所述第二检测点后，依据至少两个所述第一检测点及至少两个所述第二检测点计算得出对应的第一靶标12的中心所在位置。在其他实施例中，可通过于第一靶标12上的第一检测点及第二检测点作特征标示，通过侦测装置采集信息，例如CCD相机，再进行计算处理得到检测点位置。
在一实施例中，在所述步骤103中，通过CCD相机采集包括第一靶标12的图像，再对第一靶标12的图像进行处理分析，依据一激光发射装置30的所在位置，计算出对应的第一靶标12的中心所在位置。由于第一基板10为透明基板，所述CCD相机采集的包括第一靶标12的图像中的第一靶标12的阻光区域124及透光区域122具有明显的分界线，经处理分析后，依据激光发射装置30的所在位置，能够计算出对应的第一靶标12的中心所在位置。
进一步地，在所述步骤102中，请参阅图8，控制每个激光发射装置30发射第一激光束，所述第一激光束的半径大于第一靶标12的透光区域122的半径，所述第一激光束的半径小于第一靶标12的半径，所述激光束的半径大于第一靶标12的透光区域122与第一靶标12的半径之间的差值；根据激光发射装置30发射的第一激光束，控制微调节第一基板10的位置，若对应的激光接收装置70检测到激光束的强度值，则确定所述第一激光束至少部分穿过对应的第一靶标12的透光区域122。由于所述第一激光束的半径大于透光区域122的半径，在移动激光发射装置30时，第一靶标12的阻光区域124能够阻挡至少部分所述第一激光束，进而快速确定第一靶标12的所在位置。
在所述步骤103及所述步骤104中，请参阅图9，控制每个激光发射装置30发射第二激光束，所述第二激光束的半径不小于第一靶标12的透光区域122的半径，所述第二激光束的半径大于第一靶标12的透光区域122与第一靶标12的半径之间的差值，所述第二激光束的半径小于所述第一激光束的半径；及根据所述激光发射装置30发射的第二激光束，控制微调节所述第一基板10的位置，当确定每个所述激光接收装置70检测到的第二激光束的强度值与所述第一强度值相等时，每个所述激光发射装置30发射的激光束穿过对应的所述第一靶标12，每个所述第一靶标12的中心位于对应的所述第一中心位置。由于所述第二激光束的半径大于第一靶标12的透光区域122与第一靶标12的半径之间的差值，所述第 二激光束的半径小于所述第一激光束的半径，进而能够快速捕捉到所述检测点，且在提高对位精准度。
其中，在所述步骤104中，具体包括以下步骤：控制第一驱动装置81微调节第一基板10的位置，当确定每个激光接收装置70生成的最大强度值与一第一强度值之间的差值在第一预设补偿范围内时，确定第一基板10位于所述第一位置，每个所述第一靶标12的中心位于对应的所述第一中心位置。
在所述步骤103中，虽然经过计算确定第一靶标12的中心所在位置，依然难以保证穿过第一靶标12的激光束的中轴线与第一靶标12的激光发射装置30，通过进一步微调节第一基板10的位置进行补偿，进而达到精微调整，提高了对位精度。
其中，在步骤3中，请参阅图10，具体包括以下步骤：
步骤301，控制第二驱动装置83移动第二基板50至第二预对位位置，以对每个第二靶标52与对应的激光发射装置30进行预对位。
步骤302，控制每个激光发射装置30发射激光束，控制第二驱动装置83微调节第二基板50的位置，当对应的激光接收装置70检测到激光束的强度值时，确定所述激光束至少部分穿过对应的第二靶标52。
步骤303，确定每个第二靶标52的中心所在位置。
步骤304，控制第二驱动装置83微调节所述第二基板52，当确定每个激光接收装置70接收到的激光束的强度值与第二强度值一致时时，每个激光发射装置30发射的激光束的中轴线穿过对应的第二靶标52的中心，所述第二基板50位于所述第二位置，每个所述第二靶标52的中心位于对应的所述第二中心位置。
所述步骤301，请参阅图11，具体包括以下步骤：
依据每个激光发射装置30所位于的第一发射位置，计算得出所述第二预对位位置；及控制第二驱动装置83移动第二基板50至所述第二预对位位置。
所述第二预对位位置为，控制装置85根据对应的所述第一发射位置计算得出的，激光发射装置30出射的激光束的中轴线穿过对应的第二靶标52的中心时第二基板50所在的理论位置。
本实施方式中，由于第二基板50为透明基板，在所述步骤302中，当至少部分所述激光束被第二靶标52的阻光区域524遮挡时，即能够确定对应的第二靶标52的大致所在位置。
进一步地，所述激光束的半径大于第二靶标52的透光区域522的半径，且所述激光束至少部分能够穿过第二靶标522的透光区域522，当激光接收器70检测到激光束的强度值时，即能够确定对应的第二靶标52的大致所在位置。
进一步地，在所述步骤302中，请参阅图12，控制每个激光发射装置30发射第三激光束，所述第三激光束的半径大于第二靶标52的透光区域522的半径，所述第三激光束的半径小于第二靶标52的半径，所述激光束的半径大于第二靶标52的透光区域522与第二靶标52的半径之间的差值；根据激光发射装置30发射的第三激光束，控制微调节第二基板50的位置，若对应的激光接收装置70检测到第三激光束的强度值，确定所述第三激光束至少部分穿过对应的第二靶标52的透光区域522。由于所述第三激光束的半径大于透光区域522的半径，在移动激光发射装置30时，第二靶标52的阻光区域524能够阻挡至少部分所述第三激光束，进而快速确定第二靶标52的所在位置。
在所述步骤304中，控制每个激光发射装置30发射第四激光束，所述第四激光束的半径不小于第二靶标52的透光区域522的半径，所述第四激光束的半径大于第二靶标52的透光区域522与第二靶标52的半径之间的差值，所述第四激光束的半径小于所述第三激光束的半径，进而能够提高对位精准度。本实施方式中，所述第三激光束的半径与所述第一激光束的半径相同，所述第四激光束与所述第二激光 束的半径相同。
所述确定每个第二靶标52的中心所在位置的步骤中，与所述步骤102类似。
所述步骤304，具体包括：控制微调节激光发射装置30与所述第二基板10两者中至少其中之一的位置，当确定每个激光接收装置70生成的最大强度值与第二强度值之间的差值在第二预设补偿范围内时，确定每个所述第二靶标52的中心位于对应的所述第二中心位置。
在所述步骤303中，虽然经过计算确定第二靶标52的中心所在位置，依然难以保证穿过第二靶标52的激光束的中轴线与第二靶标52的中心同轴，通过进一步微调节第二基板50及/或对应的激光发射装置30的位置以进行补偿，进而达到精微调整，提高了对位精度。
在一实施例中，第一基板10不为透明基板，其可以为印刷电路板等基板，第一靶标12可以为开设于第一基板10上的通孔。
在一实施例中，第二基板50不为透明基板，其可以为印刷电路板等基板，第二靶标52可以为开设于第二基板50上的通孔。
在一实施例中，第一基板10不为透明基板，其可以为印刷电路板等基板，第一基板10上于对位区域开设通孔，第一靶标12对应所述通孔贴设于第一基板10上，第一基板10的透光区域122对应所述通孔设置。
在一实施例中，第二基板50不为透明基板，其可以为印刷电路板等基板，第二基板50上于对位区域开设通孔，第二靶标52对应所述通孔贴设于第二基板50上，第二基板50的透光区域522对应所述通孔设置。
在一实施例中，第一靶标12与第二靶标52大小形状可以不相同。
在一实施例中，第一基板10可以为触摸屏或者显示面板中的其他基板，第二基板50可以为玻璃盖板或者显示面板中的其他基板。
进一步地，在步骤4后，还包括步骤：沿预设移动路径，控制移动所述第一基板10与所述第二基板50的至少其中之一，直至所述第一基板10与所述第二基板50贴合于一起，其中，在移动中，一所述第一靶标12的中心与对应的所述第二靶标52的中心一直位于所述预设移动路径上。
进一步地，在步骤1前，还包括步骤：对每个激光发射装置30与对应的激光接收装置70进行激光自对准，当一激光接收装置70所接收到的激光束的强度值，在预设的用于判断激光发射装置30与激光接收装置70之间实现自对准时激光接收装置70所接收到的激光束的强度值的范围时，确定所述激光发射装置30与对应的激光接收装置70实现激光自对准。
本发明提供的激光对位方法及激光对位系统100，运用集中性强的激光对第一基板10及第二基板50进行对位，无需设置标示，很好地解决了人工对位及CCD对位精度不高的问题。另外，由于在对位过程中，运用激光确定第一靶标12及第二靶标52各自的中心所在位置，再对第一基板10及第二基板50进行对位，进一步提高了对位精度。进一步地，在对位过程中，还进行了补偿对位，更进一步提高了精准度，进而提高了第一基板10与第二基板50的贴合精度。更甚者，第一靶标12与第二靶标52的结构相同，因此，能够通过同样的光罩制备，进而节约了制造成本。
以上所述是本发明的优选实施例，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (15)

  1. 一种激光对位系统，其包括：
    激光发射装置，用于出射激光束；第一驱动装置，用于驱动第一基板在第一定位平台上移动使所述第一基板与所述激光发射装置之间的相对位置改变，所述第一基板上设有与所述激光发射装置相对应的第一靶标；
    第二驱动装置用于驱动第二基板在第二定位平台上移动使所述第二基板与所述激光发射装置之间的相对位置改变，所述第二基板上设有第二靶标，所述第二靶标与所述第一靶标相对应；
    激光接收装置，与所述激光发射装置分别位于所述第一基板与所述第二基板的两侧，用于接收激光发射装置发射的激光束；及
    控制装置，用于控制所述激光发射装置、所述第一驱动装置、所述第二驱动装置及所述激光接收装置，所述控制装置根据所述激光接收装置所接收到的激光束的强度值判断所述第一基板与所述第二基板的位置；
    其中，所述激光对位系统还包括存储装置，所述存储装置内存储有预设的第一强度值及第二强度值；当所述激光接收装置所接收到的激光束的强度值与所述第一强度值相等，所述控制装置确定所述激光发射装置射出的激光束穿过对应的所述第一靶标的中心，所述第一基板位于第一位置，所述第一靶标的中心位于第一中心位置；当所述激光接收装置所接收到的激光束的强度值与所述第二强度值相等时，所述控制装置确定所述激光发射装置射出的激光束穿过对应的所述第二靶标的中心，所述第二基板位于第二位置，所述第二靶标的中心位于第二中心位置。
  2. 如权利要求1所述的激光对位系统，其中，所述存储装置内还存储有用于判断所述激光发射装置与对应的所述激光接收装置之间实现自对准时所述激光接收装置所接收到的激光束的强度值的范围；在所述第一基板与所述第二基板进行对位之前，所述控制装置控制所述激光接收装置与对应的激光发射装置之间进行自对准；当所述激光接收装置所接收到的激光束的强度值在所述预设的强度值的范围内时，所述控制装置确定所述激光发射装置与所述激光接收装置之间实现激光自对准。
  3. 如权利要求1所述的激光对位系统，其中，所述存储装置还预存储预设的第一预设补偿范围，所述控制装置控制所述第一驱动装置调节所述第一基板的位置，当所述控制装置确定所述激光接收装置的最大强度值与所述第一强度值之间的差值在所述第一预设补偿范围内时，所述控制装置确定所述第一基板位于所述第一位置，所述第一靶标的中心位于对应的所述第一中心位置。
  4. 如权利要求1所述的激光对位系统，其特征在于，所述控制装置依据所述第一靶标的第一中心位置与对应的所述第二靶标的第二中心位置，计算出预设移动路径，所述控制装置控制所述第一驱动装置驱动所述第一基板及/或所述第二驱动装置驱动所述第二基板沿所述预设移动路径移动，直至所述第一基板与所述第二基板贴合于一起，其中所述预设移动路径经过所述第一靶标的中心与对应的所述第二靶标的中心所在的直线。
  5. 如权利要求1所述的激光对位系统，其中，所述第一靶标为圆形，所述存储装置存储有预设的第一检测值，所述控制装置控制所述第一驱动装置微调节所述第一基板的位置，当所述激光接收装置接收到的激光束的强度值与所述第一检测值相等时，所述控制装置确定所述激光接收装置捕捉到处于所述第一靶标的外圆周上的一个检测点，所述控制装置继续控制所述第一驱动装置微调节所述第一基板的位置，所述控制装置控制所述激光接收装置实时获取接收到的激光束的强度值并与所述第一检测值作对 比，直至所述控制装置确定所述激光接收装置在捕捉到至少三个不相同的所述检测点后，依据至少三个所述检测点及所述第一靶标的半径，所述控制装置计算得出对应的所述第一靶标的中心所在位置。
  6. 如权利要求1所述的激光对位系统，其中，每个所述第一靶标包括透光区域及阻光区域，所述透光区域位于所述第一靶标的中心，所述阻光区域环绕所述透光区域。
  7. 如权利要求6所述的激光对位系统，其中，所述第一靶标为圆形，所述第一靶标的透光区域为圆形，所述控制装置通过至少两个第一检测点、至少两个第二检测点及所述第一靶标的半径计算得到第一靶标的中心所在位置，其中，所述第一检测点位于所述第一靶标的外圆周上，所述第二检测点位于所述第一靶标的阻光区域与所述第一靶标的透光区域的交界上。
  8. 如权利要求7所述的激光对位系统，其中，所述存储装置存储有预设的第一检测值及预设的第二检测值，所述控制装置控制所述第一驱动装置微调节所述第一基板的位置，当所述激光接收装置接收到的激光束的强度值与所述第一检测值相等时，所述控制装置确定所述激光接收装置捕捉到一个所述第一检测点，所述控制装置继续控制所述第一驱动装置微调节所述第一基板的位置，所述控制装置对所述激光接收装置接收到的激光束的强度值与所述第一检测值作对比，直至所述控制装置确定所述激光接收装置捕捉到至少两个第一检测点；当所述激光接收装置接收到的激光束的强度值与所述第二检测值相等时，所述控制装置确定所述激光接收装置捕捉到一个所述第二检测点，所述控制装置继续控制所述第一驱动装置微调节所述第一基板的位置，所述控制装置控制所述激光接收装置实时获取接收到的激光束的强度值并与所述第一检测值作对比，直至所述控制装置确定所述激光接收装置捕捉到至少两个第二检测点。
  9. 如权利要求6所述的激光对位系统，其中，所述存储装置存储用于确定所述激光发射装置发射的激光束穿过对应的第一靶标的透光区域与所述第一靶标的阻光区域的交界上的至少三个检测点的第二检测范围，当所述激光接收装置所接收到激光束的强度值在所述第二检测范围内时，所述控制装置确定所述激光接收装置捕捉到所述交界上一个所述检测点，所述控制装置继续控制所述第一驱动装置微调节所述第一基板的位置，所述控制装置控制所述激光接收装置实时获取所接收到的激光束的强度值，直至捕捉到至少三个所述检测点，所述控制装置依据所述第一靶标上的透光区域上的至少三个所述检测点，及所述第一靶标的透光区域的半径，计算得出所述第一靶标的中心所在位置。
  10. 如权利要求1所述的激光对位系统，其中，所述激光对位系统还包括与所述控制装置连接的CCD相机，通过所述CCD相机采集所述第一靶标的图像，所述控制装置对所述第一靶标的图像进行处理分析，计算出所述第一靶标的中心所在位置。
  11. 一种激光对位方法，用于实现第一基板与第二基板对位，所述激光对位方法包括以下步骤：
    步骤1，控制第一驱动装置移动所述第一基板，以调节所述第一基板与激光发射装置的相对位置，所述第一基板上设第一靶标，当确定所述激光接收装置接收到的激光束的强度值与第一强度值一致时，则所述激光发射装置的激光束穿过所述第一靶标的中心，所述第一基板位于第一位置，每个所述第一靶标的中心位于对应的第一中心位置；
    步骤2，控制所述第一驱动装置移动所述第一基板从所述第一位置至等待区；
    步骤3，控制第二驱动装置移动所述第二基板，以调节所述第二基板与所述激光发射装置的相对位置，所述第二基板上对应所述第一靶标设第二靶标，当确定所述激光接收装置接收到的激光束的强度值与第二强度值一致时，所述激光发射装置的激光束穿过所述第二靶标，所述第二基板位于第二位置，所述第二靶标的中心位于对应的第二中心位置；
    步骤4，控制所述第一驱动装置将所述第一基板从所述等待区移回至所述第一位置，所述第一靶标的中心回复至所述第一中心位置。
  12. 如权利要求11所述的激光对位方法，其中，在所述步骤1中，包括以下步骤：
    控制所述第一驱动装置移动所述第一基板至第一预对位位置，以对所述第一靶标与所述激光发射装置进行预对位；
    控制所述激光发射装置发射激光束，控制所述第一驱动装置微调节所述第一基板的位置，当所述激光接收装置检测到激光束的强度值时，确定所述激光束至少部分穿过所述第一靶标；
    确定所述第一靶标的中心所在位置；及
    控制所述第一驱动装置微调节所述第一基板的位置，当确定所述激光接收装置接收到的激光束的强度值与所述第一强度值一致时，所述激光发射装置发射的激光束穿过所述第一靶标，所述第一基板位于所述第一位置，所述第一靶标的中心位于所述第一中心位置。
  13. 如权利要求12所述的激光对位方法，其中，所述“控制所述第一驱动装置移动所述第一基板至第一预对位位置，以对所述第一靶标与所述激光发射装置进行预对位”，包括以下步骤：
    依据所述激光发射装置所位于的第一发射位置，计算得出所述第一预对位位置；及
    控制所述第一驱动装置移动所述第一基板至所述第一预对位位置。
  14. 如权利要求11所述的激光对位方法，其中，在所述步骤4之后，所述激光对位方法还包括：沿预设移动路径，控制移动所述第一基板与所述第二基板的至少其中之一，直至所述第一基板与所述第二基板贴合于一起，其中，在移动中，所述第一靶标的中心与所述第二靶标的中心一直位于所述预设移动路径上。
  15. 如权利要求11所述的激光对位方法，其中，在所述步骤1之前，所述激光对位方法还包括：对所述激光发射装置与所述激光接收装置进行激光自对准，当所述激光接收装置所接收到的激光束的强度值，在预设的用于判断所述激光发射装置与所述激光接收装置之间实现自对准时激光接收装置所接收到的激光束的强度值的范围时，确定所述激光发射装置与所述激光接收装置实现激光自对准。
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