WO2019124574A1

WO2019124574A1 - Hardness variable carrier film

Info

Publication number: WO2019124574A1
Application number: PCT/KR2017/014984
Authority: WO
Inventors: 김광섭; 황보윤; 장봉균; 김경식; 김재현; 이학주; 최병익; 이승모
Original assignee: 한국기계연구원; 재단법인 파동에너지극한제어연구단
Priority date: 2017-12-19
Filing date: 2017-12-19
Publication date: 2019-06-27

Abstract

The present invention relates to a hardness variable carrier film which controls a pressing depth to which an element is pressed into a carrier film by controlling the hardness of the carrier film composed of a multilayer adhesive layer to transfer the element to the substrate. To this end, the present invention comprises a base film, a first adhesive layer, and a second adhesive layer. The first adhesive layer is formed on one surface of the base film, and an element to be transferred is attached to and pressed into the first adhesive layer. The second adhesive layer is formed between the base film and the first adhesive layer, and the hardness of the second adhesive layer changes to control whether the element is pressed or not. The magnitude of the adhesive force formed between the element and the first adhesive layer or the second adhesive layer is proportional to the pressing depth at which the element is pressed into the first adhesive layer or the second adhesive layer, when the second adhesive layer has a first hardness, the element is pressed into the first adhesive layer, and when the second adhesive layer has a second hardness lower than the first hardness, the element penetrates through the first adhesive layer and is pressed into the second adhesive layer.

Description

Hardness Variable Carrier Film

The present invention relates to a hardness-variable carrier film, and more particularly, to a hardness-variable carrier film for controlling transfer of an element by controlling the depth of penetration of the carrier film by controlling the hardness of the carrier film composed of a multilayer adhesive layer will be.

In general, displays using micro LEDs are emerging as next-generation advanced displays to replace conventional displays. In order to produce such a micro LED display, the technology of transferring each LED to a modular circuit board is the key.

The adhesive force of the adhesive carrier film used in the conventional transfer process can be controlled only by adjusting the chemical composition of the adhesive layer. In the case of the same chemical component, the adhesive force generally has the same adhesive force.

Therefore, in order to move the device using the difference in adhesion between the carrier film and the substrate, the carrier film and the substrate are pressed to move the device on the relatively weak adhesive side relatively to the adhesive force side, It was impossible to move the device when it was on a strong substrate.

Thus, by adjusting process conditions, physical properties, and thickness of the adhesive layer of the carrier film such as load, separation speed, and degree of curing, the adhesive layer has appropriate adhesive force according to the device to be transferred.

However, in the case of the above-mentioned pressure-sensitive adhesive layer, the range of the adjustable adhesive force is limited, and there is a problem in that the possibility of success of the transfer process is lowered depending on the type, shape and material of the device.

As a related prior art, Korean Patent Publication No. 10-2016-0080265 (entitled " transfer device for micro device, method for transferring micro device and method for manufacturing transfer device, publication date: July 7, 2016) have.

The object of the present invention is to provide a hardness-variable carrier film for controlling the penetration depth of the carrier film to control the hardness of the carrier film composed of a multilayer pressure-sensitive adhesive layer to transfer the device.

In order to solve the above-mentioned problems, the present invention provides a base film, A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein; And a second adhesive layer formed between the base film and the first adhesive layer, the second adhesive layer having a hardness varying to control the pressing of the device, and when the second adhesive layer has a first hardness, The element is press-fitted into the second adhesive layer through the first adhesive layer when the second adhesive layer has a second hardness lower than the first hardness. A hardness variable carrier film is provided.

The magnitude of the adhesive force formed between the device and the first adhesive layer or the second adhesive layer may be proportional to the indentation depth at which the device is press-fitted into the first adhesive layer or the second adhesive layer.

Wherein the second adhesive layer has a first hardness when a first temperature is applied to the second adhesive layer and a second hardness of the second adhesive layer is greater than a hardness of the second adhesive layer, The second adhesive layer may have the second hardness when a second temperature higher than the first temperature is applied.

The hardness of the second adhesive layer may be changed to the first hardness or the second hardness according to the temperature of the external heater that heats the second adhesive layer.

The hardness of the second adhesive layer can be changed to the first hardness or the second hardness according to the temperature of the heater roller for heating and pressing the second adhesive layer.

Further comprising a first mask layer having a first opening formed on the other surface of the base film, wherein the hardness of the second adhesive layer region opened by the first opening depends on the intensity of the laser radiated to the first mask layer Can be changed to the first hardness or the second hardness.

Further comprising a built-in heater formed in a predetermined area between the base film and the second adhesive layer to heat the second adhesive layer, wherein the hardness of the second adhesive layer region is changed according to the temperature of the built- 1 hardness or the second hardness.

Wherein the second adhesive layer has a first hardness when light is irradiated to the second adhesive layer at a first wavelength, and the second adhesive layer has the first hardness, The second adhesive layer may have the second hardness when light is irradiated to the second adhesive layer at a second wavelength longer than the first wavelength.

The first wavelength may be an ultraviolet ray, and the second wavelength may be a visible ray.

And a second mask layer having a second opening formed on the other surface of the base film, wherein a hardness of the second adhesive layer area opened by the second opening is changed according to a wavelength of light irradiated to the second mask layer Can be changed to the first hardness or the second hardness.

The second adhesive layer is divided into a region where the hardness changes in the first hardness or the second hardness and a region in which the hardness does not change, and the device may be located in the region where the hardness changes.

A base film; A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein; A second adhesive layer formed between the base film and the first adhesive layer and having a hardness varying to control whether the device is pressed or not; And a third adhesive layer formed between the base film and the second adhesive layer, the third adhesive layer being formed by varying the hardness to control the pressing of the device, wherein the second adhesive layer is stronger than the hardness of the first adhesive layer Wherein the first adhesive layer has a first hardness and the second adhesive layer has a second hardness that is equal to or less than a hardness of the first adhesive layer, And the third adhesive layer has a third hardness that is higher than the second hardness, the element penetrates through the first adhesive layer to be pressed into the second adhesive layer, and the second adhesive layer has the second hardness, 3 adhesive layer has the fourth hardness equal to or less than the second hardness, the element penetrates through the first adhesive layer and the second adhesive layer and is press-fitted into the third adhesive layer And a hardness variable carrier film.

Wherein the size of the adhesive force formed between the device and the first adhesive layer, the second adhesive layer, or the third adhesive layer is such that the device presses the first adhesive layer, the second adhesive layer, The depth of penetration can be proportional to the indentation depth.

Wherein the second adhesive layer has the first hardness when the first temperature is applied to the second adhesive layer and the second adhesive layer has the second hardness when the first temperature is applied to the second adhesive layer, When the second temperature is higher than the first temperature, the second adhesive layer has the second hardness, and when the second temperature is applied to the third adhesive layer, And the third adhesive layer may have the fourth hardness when a third temperature higher than the second temperature is applied to the third adhesive layer.

Wherein at least one of the second adhesive layer and the third adhesive layer is made of a material whose hardness changes depending on an applied temperature and the other of the second adhesive layer and the third adhesive layer has a wavelength Wherein the hardness of the second adhesive layer is determined by the temperature applied to the second adhesive layer or the third adhesive layer and the wavelength of the irradiated light to the first hardness or the second hardness, And the hardness of the third adhesive layer may be varied by the third hardness or the fourth hardness.

The second adhesive layer is divided into a plurality of areas, and adhesive layers having at least two hardnesses of the first through fourth hardnesses in the respective areas may be formed to overlap with each other.

When the micro-device is transferred using the hardness-variable carrier film according to the present invention, the following effects can be obtained.

First, there is an advantage in that a continuous process can be performed by combining rollers and flat plates on any desired substrate in a large amount of micro devices.

Secondly, there is an advantage in that the adhesive transfer layer is formed in a multilayer structure to have a more distinct adhesive force difference, thereby increasing the transfer yield of the device.

1A and 1B are cross-sectional views illustrating a carrier film according to an embodiment of the present invention.

Fig. 2 is a graph for explaining the temperature range in which the second adhesive layer is cured in the carrier film of Fig. 1a. Fig.

Figs. 3A and 3B are cross-sectional views showing a first embodiment of a second adhesive layer in the carrier film of Fig. 1A. Fig.

Figs. 4A and 4B are cross-sectional views showing a modified example of the first embodiment of the second adhesive layer in the carrier film of Fig. 1A.

Figs. 5A and 5B are cross-sectional views showing a second embodiment of the second adhesive layer in the carrier film of Fig. 1A. Fig.

Figs. 6A and 6B are cross-sectional views showing a modified example of the second embodiment of the second adhesive layer in the carrier film of Fig. 1A. Fig.

Figs. 7A, 7B and 7C are cross-sectional views showing a third embodiment of the second adhesive layer in the carrier film of Fig. 1A.

Figs. 8A, 8B and 8C are cross-sectional views showing a modified example of the third embodiment of the second adhesive layer in the carrier film of Fig. 1A.

Figs. 9A, 9B and 9C are cross-sectional views showing a fourth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

Figs. 10A, 10B and 10C are cross-sectional views showing a modified example of the fourth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

11A and 11B are cross-sectional views showing a fifth embodiment of the second adhesive layer in the carrier film of FIG. 1A.

Figs. 12A and 12B are cross-sectional views showing a modified example of the fifth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

Figs. 13A, 13B and 13C are cross-sectional views showing a sixth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

Figs. 14A, 14B, and 14C are cross-sectional views showing a modified example of the sixth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

15A, 15B and 15C are cross-sectional views illustrating a carrier film according to another embodiment of the present invention.

Figs. 16A, 16B and 16C are cross-sectional views showing modifications of the carrier film of Fig. 15A.

17A and 17B are cross-sectional views showing a carrier film according to another embodiment of the present invention.

18A and 18B are cross-sectional views showing a carrier film according to another embodiment of the present invention.

19A and 19B are cross-sectional views illustrating a carrier film according to another embodiment of the present invention.

* Explanation of symbols

D: element 19: base film

11: first adhesive layer 12: second adhesive layer

13: third adhesive layer 20: substrate

21: base surface 22: fifth adhesive layer

15: first mask layer 15a: first opening

16: second mask layer 16a: second opening

R1: first roller R2: second roller

30: Built-in heater

Hereinafter, preferred embodiments of the present invention in which the above-mentioned problems to be solved can be specifically realized will be described with reference to the accompanying drawings. In describing the embodiments, the same names and the same symbols are used for the same configurations, and additional description thereof will be omitted in the following.

When an element such as a layer, a film, an area, a plate, or the like is referred to as being "on" another element throughout the specification, it includes not only the element "directly above" another element but also the element having another element in the middle. And "above" means located above or below the object portion, and does not necessarily mean that the object is located on the upper side with respect to the gravitational direction.

When an element is referred to as "including" an element throughout the specification, it means that the element may further include other elements unless specifically stated otherwise. The sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not limited to the illustrated ones.

Hereinafter, embodiments of the carrier film according to the present invention will be described with reference to the drawings.

1A and 1B are cross-sectional views showing a carrier film according to an embodiment of the present invention.

1A, a carrier film according to the present invention is formed on one surface of a base film 19 and a base film 19 and includes a first adhesive layer 11 And a second adhesive layer 12 which is formed between the base film 19 and the first adhesive layer 11 and whose hardness changes to control whether the device D is pressed or not.

1A and 1B, when the second adhesive layer 12 has a first hardness H1 that is higher than the hardness of the first adhesive layer 11, the element D is bonded to the first adhesive layer 11, When the second adhesive layer 12 is the same as the hardness of the first adhesive layer 11 or has the second hardness H2 less than the hardness of the first adhesive layer 11, And penetrates through the first adhesive layer (11) and presses into the second adhesive layer (12).

That is, the indentation depth at which the element D is pressed into the adhesive layer is adjusted according to the hardness of the second adhesive layer 12, and the depth of the element D and the adhesive layer The magnitude of the adhesive force to be formed varies.

The larger the contact depth between the adhesive layer and the edge of the element D becomes, the larger the magnitude of the adhesive force formed between the element D and the adhesive layer becomes, as the depth of insertion of the element D into the adhesive layer becomes larger, The frictional force between the adhesive layer (D) and the adhesive layer is increased. Therefore, as the depth of indentation is increased, a greater frictional force is generated and the magnitude of the adhesive force formed between the device (D) and the adhesive layer is increased.

Fig. 2 is a graph for explaining the temperature range in which the second adhesive layer is cured in the carrier film of Fig. 1a. Fig. Figs. 3A and 3B are cross-sectional views showing a first embodiment of a second adhesive layer in the carrier film of Fig. 1A. Fig. Figs. 4A and 4B are cross-sectional views showing a modified example of the first embodiment of the second adhesive layer in the carrier film of Fig. 1A.

The first embodiment of the second adhesive layer 12 will be described with reference to FIGS. 2 to 4B.

First, the first indentation depth d1 refers to the indentation depth at which one side of the element D is pressed into the first adhesive layer 11 according to the hardness of the second adhesive layer 12 by an external pressing force, The second indentation depth d2 means the indentation depth at which one side of the element D penetrates through the first adhesive layer 11 and is press-fitted into the second adhesive layer 12 by an externally applied pressing force, The first adhesive layer F1 and the second adhesive layer F2 refer to the adhesive force formed between the device D and the first adhesive layer 11 and the second adhesive force F2 corresponds to the adhesive force between the device D and the first adhesive layer 11 and the second adhesive layer 11, 12). &Lt; / RTI >

The fifth adhesive force F5 is applied to the substrate 20 coated with the fifth adhesive layer 22 having a certain hardness on the other surface of the element D and the base surface 21 by an externally applied pressing force, Means the adhesive force formed between the other surface of the element D and the fifth adhesive layer 22.

Here, the portion in which the first adhesive force F1, the second adhesive force F2, and the fifth adhesive force F5 are mainly generated is a moiré pattern.

Before describing the first embodiment of the second adhesive layer 12, the temperature range at which the second adhesive layer 12 made of a material whose hardness changes according to the temperature applied through the FIG. 2 is cured will be described.

The second adhesive layer 12 may be composed of a liquid crystalline polymer material that changes from an elastic body to a viscoelastic body due to a rapid phase change near a specific temperature. In this specification, as shown in Fig. 2, A fluorinated polymer causing abrupt phase change in the first adhesive layer 12 is used as a material for forming the second adhesive layer 12 and a second adhesive layer 12 is bonded to the first adhesive layer 12 at a first hardness H1 according to the properties of the fluorinated polymer. And the second temperature T2 forming the second adhesive layer 12 at the second hardness H2 means a temperature of 45 deg. C or higher .

3A, the second adhesive layer 12 is heated to the first temperature T1 by an external heater (not shown) which heats the second adhesive layer 12 to form the first hardness H1 The one surface of the element D is pressed into the first adhesive layer 11 at the first indentation depth d1 by the externally applied pressing force to form the first adhesive layer 11 between the element D and the first adhesive layer 11, The adhesive force F1 is formed and the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to a release process. As shown in FIG. 3B, the device D is attached to the fifth adhesive layer 22 1 adhesive layer 11 is released.

Such a process can be utilized in a flaking process in which devices attached to a carrier film in a general semiconductor process are transferred to a target substrate.

4A and 4B, the second adhesive layer 12 is heated to the second temperature T2 by the external heater that heats the second adhesive layer 12, so that the second hardness H2 The one side of the element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 at the second indentation depth d2 in accordance with the pressing force applied from the outside, A second adhesive force F2 is formed between the first adhesive layer 11 and the second adhesive layer 12, as shown in FIG.

In addition, the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 is relatively larger than the fifth adhesive force F5 so that the device D is subjected to a release process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12, 22).

Such a process can be utilized in a picking process in which devices attached to a source substrate in a general semiconductor process are transferred to a carrier film.

As a result, the depth of indentation of the element D can be controlled by controlling the hardness of the second adhesive layer 12 in accordance with the temperature of the external heater for heating the second adhesive layer 12, It is possible to determine the direction in which the light is incident.

Figs. 5A and 5B are cross-sectional views showing a second embodiment of the second adhesive layer in the carrier film of Fig. 1A. Fig. Figs. 6A and 6B are cross-sectional views showing a modified example of the second embodiment of the second adhesive layer in the carrier film of Fig. 1A. Fig.

A second embodiment of the second adhesive layer 12 will be described with reference to FIGS. 5A to 6B.

A first roller R1 for externally pressing the base film 19 toward the substrate 20 and heating the second adhesive layer 12 to the first temperature T1 and a second roller R1 for heating the second adhesive layer 12 to the first temperature T1, The second adhesive layer 12 has the first hardness H1 by the heater roller including the second roller R2 pressing the substrate 20 toward the first adhesive layer 11, D is pressed into the first adhesive layer 11 at the first indentation depth d1 to form a first adhesive force F1 between the element D and the first adhesive layer 11, Is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to a release process and the device D is attached to the fifth adhesive layer 22 as shown in FIG. 1 adhesive layer 11 is released.

On the other hand, as shown in Figs. 6A and 6B, a first roller R1 (which presses the base film 19 toward the substrate 20 side from the outside and heats the second adhesive layer 12 to the second temperature T2) And the second roller R2 pressing the substrate 20 toward the first adhesive layer 11 from the outside so that the second adhesive layer 12 has the second hardness H2 One side of the element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 at the second indentation depth d2 in accordance with the pressing force applied by the heater roller, A second adhesive force F2 is formed between the first adhesive layer 11 and the second adhesive layer 12.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 Is relatively larger than the fifth adhesive force F5 and is subjected to a releasing process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12 to form the fifth adhesive layer 22 ).

As a result, by controlling the hardness of the second adhesive layer 12 according to the temperature at which the second adhesive layer 12 is heated in the heater roller, it is possible to control the depth of indentation of the element D, It is possible to determine the direction in which the light is incident.

The base film 19, the first adhesive layer 11 and the second adhesive layer 12 are arranged so as to be surrounded by cylindrical rollers having a heating function, and the temperature of the base film 19, the first adhesive layer 11 and the second adhesive layer 12 By changing the hardness of the second adhesive layer 12, the transport direction of the element D may be determined.

Figs. 7A, 7B and 7C are cross-sectional views showing a third embodiment of the second adhesive layer in the carrier film of Fig. 1A. Figs. 8A, 8B and 8C are cross-sectional views showing a modified example of the third embodiment of the second adhesive layer in the carrier film of Fig. 1A.

A third embodiment of the second adhesive layer 12 will be described with reference to FIGS. 7A to 8C.

As shown in FIGS. 7A to 8C, the second adhesive layer 12 is made of a material whose hardness varies according to the intensity of the emitted laser, and a first intensity L1 is applied to the second adhesive layer 12 The second adhesive layer 12 is heated to the first temperature T1 to have the first hardness H1 and the second adhesive layer 12 is relatively stronger than the first intensity L1 The second adhesive layer 12 is heated to the second temperature T2 to have the second hardness H2 when the laser is radiated in the weak second intensity L2.

A first mask layer 15 having a first opening 15a formed on the other surface of the base film 19 and a first mask layer 15 having a first intensity L1 The area 12a of the second adhesive layer 12 opened by the first opening 15a is heated to the first temperature T1 to change to the first hardness H1.

The element D is attached to one surface of the first adhesive layer 11 corresponding to the first opening 15a and one surface of the element D is adhered to the surface of the first adhesive layer 11 by a first pressing The first adhesive force F1 is formed between the element D and the first adhesive layer 11 while the other surface of the element D is pressed into the fifth adhesive layer 22 to form a fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, and the device D is subjected to a release process, and the device D is attached to the fifth adhesive layer 22 And is released from the first adhesive layer 11.

On the other hand, as shown in FIGS. 8A to 8C, a laser beam having a second intensity (L2) weaker than the first intensity (L1) is emitted to the first mask layer 15, The hardness of the region 12b of the second adhesive layer 12 changes to the second hardness H2.

The element D is attached to one surface of the fifth adhesive layer 22 corresponding to the first opening 15a and one side of the element D penetrates through the first adhesive layer 11 The second adhesive force F2 between the element D and the first adhesive layer 11 and the second adhesive layer 12 is applied to the second adhesive layer 12 at the second indentation depth d2 .

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 Is relatively larger than the fifth adhesive force F5 and the device D is subjected to a release process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12, 22).

Figs. 9A, 9B and 9C are cross-sectional views showing a fourth embodiment of the second adhesive layer in the carrier film of Fig. 1A. Figs. 10A, 10B and 10C are cross-sectional views showing a modified example of the fourth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

A fourth embodiment of the second adhesive layer 12 will be described with reference to FIGS. 9A to 10C.

A built-in heater 30 for heating the second adhesive layer 12 in a predetermined area between the base film 19 and the second adhesive layer 12 as shown in FIGS. 9A to 10C, The hardness of a certain region of the second adhesive layer 12 varies depending on the temperature of the first adhesive layer 30.

The region 12c of the second adhesive layer 12 corresponding to the built-in heater 30 is heated to the first temperature T1 by the built-in heater 30 to form the first hardness H1 9b, one surface of the element D is pressed into the first adhesive layer 11 at the first indentation depth d1 by the externally applied pressing force, A first adhesive force F1 is formed between the first adhesive layer 11 and the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to a release process. As shown in FIG. 9C, the device D is attached to the fifth adhesive layer 22 1 adhesive layer 11 is released.

10A to 10C, the built-in heater 30 that heats a certain region of the second adhesive layer 12 is heated by the built-in heater 30 in the region of the second adhesive layer 12 corresponding to the built- When one surface of the element D is heated to the second temperature T2 to have the second hardness H2, one side of the element D passes through the first adhesive layer 11, The second adhesive force F2 is formed between the element D and the first adhesive layer 11 and the second adhesive layer 12 so as to be pressed into the layer 12 at the second indentation depth d2.

As a result, by controlling the hardness of the second adhesive layer 12 according to the temperature at which the second adhesive layer 12 is heated in the built-in heater 30, it is possible to adjust the indentation depth of the element D, ) Can be determined, and such a transfer process can be utilized for selective transfer, which selectively picks or flicks the micro LED device.

11A and 11B are cross-sectional views showing a fifth embodiment of the second adhesive layer in the carrier film of FIG. 1A. Figs. 12A and 12B are cross-sectional views showing a modified example of the fifth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

A fifth embodiment of the second adhesive layer 12 will be described with reference to FIGS. 11A to 12B.

11A to 12B, the second adhesive layer 12 is made of a material whose hardness changes depending on the wavelength of the applied light, and the second adhesive layer 12 is formed of a material having a first wavelength W1 The second adhesive layer 12 has the first hardness H1 and the second adhesive layer 12 is irradiated with the light having the second wavelength W2 whose wavelength is relatively longer than the first wavelength W1, The second adhesive layer 12 has the second hardness H2.

In the present specification, the second adhesive layer 12 is made of azobenzene-based polymer whose hardness changes according to a specific wavelength, and the first wavelength W1 means ultraviolet rays and the second wavelength (W2) means visible light.

The second adhesive layer 12 may be made of a material whose hardness changes according to a specific wavelength band other than the azobenzene-based polymer, and the material of the second adhesive layer 12 The first wavelength W1 may have a wavelength of a visible light ray and the second wavelength W2 may have a wavelength of infrared rays.

11A, when the second adhesive layer 12 is irradiated with light having the first wavelength W1 to the second adhesive layer 12 to have the first hardness H1, One side of the element D is pressed into the first adhesive layer 11 by the first pressing depth d1 by the pressing force so that the first adhesive force F1 is formed between the element D and the first adhesive layer 11 , The other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

On the other hand, as shown in FIGS. 12A and 12B, when the second adhesive layer 12 is irradiated with light having the second wavelength W2 and the second adhesive layer 12 has the second hardness H2 , One side of the element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 at the second indentation depth d2 in accordance with the pressing force applied from the outside, A second adhesive force F2 is formed between the first adhesive layer 11 and the second adhesive layer 12.

As a result, by controlling the hardness of the second adhesive layer 12 in accordance with the wavelength of the light applied to the second adhesive layer 12, the depth of insertion of the element D can be controlled, The direction can be determined.

Figs. 13A, 13B and 13C are cross-sectional views showing a sixth embodiment of the second adhesive layer in the carrier film of Fig. 1A. Figs. 14A, 14B, and 14C are cross-sectional views showing a modified example of the sixth embodiment of the second adhesive layer in the carrier film of Fig. 1A.

The sixth embodiment of the second adhesive layer 12 will be described with reference to FIGS. 13A to 14C.

13A, a second mask layer 16 having a second opening 16a formed on the other surface of the base film 19 and a second mask layer 16 having a first wavelength W1 The hardness of the region 12e of the second adhesive layer 12 opened by the second opening portion 16a is changed to the first hardness H1 by irradiating the light with the light.

The element D is attached to one surface of the first adhesive layer 11 corresponding to the second opening 16a and one side of the element D is pressed by an externally applied pressing force as shown in FIG. The first adhesive force F1 is formed between the element D and the first adhesive layer 11 by the first pressing depth d1 into the first adhesive layer 11 and the other surface of the element D is pressed by the fifth adhesive Layer 22 to form a fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to a release process. As shown in FIG. 13C, the device D is attached to the fifth adhesive layer 22 1 adhesive layer 11 is released.

On the other hand, as shown in FIGS. 14A to 14C, by irradiating light having the second wavelength W2 to the second mask layer 16, the second adhesive layer 12 opened by the second opening portion 16a The hardness of the region 12f changes to the second hardness H2.

The element D is attached to one surface of the fifth adhesive layer 22 corresponding to the second opening 16a and one surface of the element D penetrates through the first adhesive layer 11 The second adhesive force F2 between the element D and the first adhesive layer 11 and the second adhesive layer 12 is applied to the second adhesive layer 12 at the second indentation depth d2 .

15A, 15B and 15C are cross-sectional views illustrating a carrier film according to another embodiment of the present invention. Figs. 16A, 16B and 16C are cross-sectional views showing modifications of the carrier film of Fig. 15A.

Another embodiment of the carrier film according to the present invention will be described with reference to FIGS. 15A to 16C.

The structure in which the first adhesive layer 11 and the second adhesive layer 12 varying in hardness according to temperature or light wavelength are formed on one surface of the base substrate according to the present embodiment is substantially the same as the above- The detailed description thereof will be omitted.

However, the carrier film according to this embodiment is formed between the base film 19 and the second adhesive layer 12 as shown in Figs. 15A to 16C, And a third adhesive layer (13) in which the second adhesive layer (13) is controlled.

15A to 16C, when the second adhesive layer 12 has the first hardness H1 which is higher than the hardness of the first adhesive layer 11, the element D is bonded to the first adhesive layer 11, The second adhesive layer 12 is pressed into the first adhesive layer 11 and has the second hardness H2 equal to or less than the hardness of the first adhesive layer 11, The element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 when the first adhesive layer 13 has a third hardness H3 that is stronger than the second hardness H2, When the layer 12 has the second hardness H2 and the third adhesive layer 13 has the fourth hardness H4 which is equal to the second hardness H2 or less than the second hardness H2, Is pushed through the first adhesive layer 11 and the second adhesive layer 12 to the third adhesive layer 13.

15A to 15C, the third adhesive layer 13 is made of a material whose hardness varies depending on the applied temperature, and the third adhesive layer 13 is provided with a first temperature T1 or a second temperature When the temperature T2 is applied, the third adhesive layer 13 has the third hardness H3. When the third temperature T3, which is relatively higher than the second temperature T2, is applied, the third adhesive layer 13 13 has a fourth hardness H4.

When the third temperature T3 is applied to the second adhesive layer 12, the second adhesive layer 12 has the second hardness H2.

15A, when the second adhesive layer 12 and the third adhesive layer 13 are heated to the first temperature T1, the second adhesive layer 12 has the first hardness H1 The third adhesive layer 13 has the third hardness H3 and the one surface of the element D is pressed into the first adhesive layer 11 at the first indentation depth d1 by the pressing force externally applied The first adhesive force F1 is formed between the element D and the first adhesive layer 11 and the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5 so that the device D is adhered to the fifth adhesive layer 22, and the first adhesive layer 11, Is released.

15B, when the second adhesive layer 12 and the third adhesive layer 13 are heated to the second temperature T2, the second adhesive layer 12 has the second hardness H2, The third adhesive layer 13 has the third hardness H3 and one side of the element D penetrates through the first adhesive layer 11 by the externally applied pressing force to form the second adhesive layer 12 The second adhesive force F2 is formed between the element D and the first adhesive layer 11 and the second adhesive layer 12. As a result,

The other side of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5 and the transfer direction of the element D is the second adhesive force F2 and the fifth adhesive force F5, As shown in Fig.

15C, when the second adhesive layer 12 and the third adhesive layer 13 are heated to the third temperature T3, the second adhesive layer 12 has the second hardness H2, And the third adhesive layer 13 has a fourth hardness H4 and one surface of the device D is bonded to the first adhesive layer 11 and the second adhesive layer 12 according to a pressing force externally applied thereto The first adhesive layer 11, the second adhesive layer 12, and the third adhesive layer 13 (the first adhesive layer 13, the third adhesive layer 13, and the third adhesive layer 13) The third adhesive force F3 is formed.

The other side of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5 and the transfer direction of the element D is the third adhesive force F3 and the fifth adhesive force F5, As shown in Fig.

16A to 16C, the second adhesive layer 12 may be made of a material whose hardness changes depending on the applied temperature, and the third adhesive layer 13 may be formed of a material having a hardness When the first wavelength W1 is applied to the third adhesive layer 13, the third adhesive layer 13 has the third hardness H3, and the third adhesive layer 13 , The third adhesive layer 13 has the fourth hardness H4 when the second wavelength W2 is applied.

16A, the second adhesive layer 12 is made of a material whose hardness changes according to the temperature to be heated, and is heated to the first temperature T1 to have the first hardness H1, One side of the element D is pressed into the first adhesive layer 11 by the first pressing depth d1 and the first adhesive force F1 is formed between the element D and the first adhesive layer 11 And the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The transfer direction of the element D is determined by the relative difference between the first adhesive force F1 and the fifth adhesive force F5.

16B, the second adhesive layer 12 is heated to the second temperature T2 to have the second hardness H2, and the third adhesive layer 13 has the first wavelength W1, One side of the element D penetrates through the first adhesive layer 11 and reaches the second adhesive layer 12 by the second pressing depth d2 according to the pressing force externally applied, The second adhesive force F2 is formed between the element D and the first adhesive layer 11 and the second adhesive layer 12 and the other surface of the element D is bonded to the fifth adhesive layer 22 to form a fifth adhesive force F5.

The transfer direction of the element D is determined by the relative difference between the second adhesive force F2 and the fifth adhesive force F5.

16C, the second adhesive layer 12 is heated to the second temperature T2 to have the second hardness H2, and the third adhesive layer 13 has the second wavelength W2, And the fourth hardness H4 is applied to the first adhesive layer 11 and the second adhesive layer 12 so that one side of the element D passes through the first adhesive layer 11 and the second adhesive layer 12, The third adhesive force F3 is applied between the element D and the first adhesive layer 11, the second adhesive layer 12 and the third adhesive layer 13, .

The transfer direction of the element D is determined by the relative difference between the third adhesive force F3 and the fifth adhesive force F5.

17A, in the carrier film of the present embodiment, the second adhesive layer formed on the base film 19 is composed of the second adhesive layer 12a formed to have the first hardness H1, And a second adhesive layer 12b. That is, in the second adhesive layer of the present embodiment, the adhesive layer 12a having the first hardness H1 is formed only in a specific region, and the region where the adhesive layer 12a having the first hardness is formed May be formed so as to be equal to or larger than the area of the element (D).

In the present embodiment, the second adhesive layer is formed to have the first hardness H1. This is because, as described in the previous embodiments, only the adhesive layer in the corresponding region is subjected to a rapid phase change near a specific temperature And may be formed by applying a specific temperature or by heating with a heater roller.

Alternatively, the entirety of the second adhesive layer may be formed by heating with a heater roller to which a specific temperature is applied only to the corresponding region.

That is, in this embodiment, there is no limitation on the method in which the second adhesive layer is formed to have the first hardness H1.

As described above, when the adhesive layer 12a having the first hardness H1 of the second adhesive layer is formed only in a specific region and the element D is pressed into the region, as shown in Fig. 17A, The one side of the element D is pressed into the first adhesive layer 11 at the first pressing depth d1 by the pressing force so that the first adhesive layer F1 is pressed against the element D and the first adhesive layer 11, And the fifth adhesive layer 22 is adhered to the other surface of the device D to form a fifth adhesive force F5.

In this case, as described above, although not separately shown, since the first adhesive force F1 is relatively smaller than the fifth adhesive force F5, the device D can be easily separated from the fifth adhesive layer 22 and the first adhesive layer 11 in a state of being attached thereto.

Referring to FIG. 17B, the second adhesive layer formed on the base film 19 is divided into a second c adhesive layer 12c having a second hardness and a second adhesive layer 12b not having the second hardness. That is, in the second adhesive layer in the present embodiment, the adhesive layer 12c having the second hardness H2 is formed only in a specific region, and the region in which the adhesive layer 12c having the second hardness is formed is May be formed so as to be equal to or larger than the area of the element (D).

In this case, the second adhesive layer is formed to have the second hardness H2, as described in the foregoing embodiments, the same method is not limited thereto.

Accordingly, when the adhesive layer 12c having the second hardness H2 is formed only in a specific region and the element D is press-fitted into the region, as shown in Fig. 17B, One surface of the element D is pressed by the pressing force to the second indentation depth d2 through the first and second curable adhesive layers 11 and 12c to form the first and second c- A second adhesive force F2 is formed between the

layers

11 and 12c and a fifth adhesive force F5 is formed on the other surface of the device D by bonding to the fifth adhesive layer 22. [

In this case, since the second adhesive force F2 is relatively larger than the fifth adhesive force F5, the device D is not bonded to the fifth adhesive layer (not shown) 22 and adhered to the first and second curable adhesive layers 11, 12c.

18A, in the carrier film according to the present embodiment, the second adhesive layer formed on the base film 19 has the second adhesive layer 12a formed to have the first hardness H1, And a second c-adhesive layer 12c formed to have a hardness H2. That is, a region where the second adhesive layer 12a is formed and a region where the second c adhesive layer 12c is formed can be distinguished.

In this case, with respect to the first hardness and the second hardness, as described with reference to the above-described embodiments, different temperatures are applied to the regions separated from each other or heated by different heater rollers A method of maintaining different phase shifts can be applied, and a method of deriving the phase shift is not limited.

Meanwhile, in the present embodiment, the first and second elements D1 and D2 having different heights may be mounted on the fifth adhesive layer 22, respectively.

Thus, when the fifth adhesive layer 22 on which the first and second elements D1 and D2 are mounted is pressed toward the 2a and 2c

adhesive layers

12a and 12c, The first element D1 is pressed into the second adhesive layer 12a at the first indentation depth d1 by the pressing force and is pressed against the first adhesive layer 11 by the first adhesive force F1 And the fifth adhesive layer 22 and the fifth adhesive force F5 are formed on the other surface of the first element D1.

Alternatively, the second element D2 may be press-fitted into the second c pressure-sensitive adhesive layer 12c at a second indentation depth d2 to form a second adhesive force with the first and second c pressure layers 11 and 12c, And the fifth adhesive layer 22 and the fifth adhesive force F5 are formed on the other surface of the second element D2.

In this case, since the first adhesive force F1 is smaller than the fifth adhesive force F5 and the second adhesive force F2 is larger than the fifth adhesive force F5, the first element D1 Is released in a state of being attached to the fifth adhesive layer 22 and the second element D2 is releasably attached to the first and second curable adhesive layers 11 and 12c.

That is, as described above, the carrier film in this embodiment can be applied to a process for selectively releasing and adhering to a plurality of elements having different heights.

In the carrier film according to the present embodiment, the adhesive layer vertically stacked on the base film 19 is formed to have different hardness, and at the same time, a plurality of regions And a pressure sensitive adhesive layer laminated in a combination of different hardness is formed in each of the regions.

19A, in this embodiment, the adhesive layer between the first adhesive layer 11 and the base film 19 is divided into, for example, three regions, and 2 Adhesive layers having different hardnesses can be stacked and formed.

Thus, in the first region, the second adhesive layer 12a having the first hardness H1 overlaps with the third adhesive layer 13 having the third hardness H3, and in the second region, the second hardness H2 A second adhesive layer 12b having a first hardness H2 and a third adhesive layer 13 having a third hardness H3 are overlapped with each other and a second adhesive layer 12b having a second hardness H2 And a fourth adhesive layer 14 having a fourth hardness H4 are superimposed.

15A to 16C, the third adhesive layer 13 may have a third hardness H3 or a fourth hardness H4. However, in the present embodiment, for convenience of description, The third adhesive layer 13 has the third hardness H3 and the fourth adhesive layer 14 has the fourth hardness H4.

In this case, it is apparent that the number of the regions to be partitioned, the number of the superimposed adhesive layers, and the combination of the respective hardnesses can be variously changed.

Further, in the present embodiment, in the case of the method in which the overlapping adhesive layers are formed so as to have different hardness, a method of forming the adhesive layers in the embodiments described above with reference to FIGS. 15A to 16C to have different hardness , And the method is applied to each of the areas partitioned from each other.

On the other hand, in the present embodiment, the first to third elements D1, D2, and D3 having different heights, which are located in the three regions partitioned from each other, are mounted on the fifth adhesive layer 22, .

Thus, when the fifth adhesive layer 22 on which the first to third elements D1, D2, and D3 are mounted is pressed toward the first adhesive layer 11, as shown in FIG. 19A, The first element D1 is pressed into the second adhesive layer 12a at the first indentation depth d1 by the pressing force to form the first adhesive force F1 with the first adhesive layer 11 The other surface of the first element D1 is formed with the fifth adhesive layer 22 and the fifth adhesive force F5.

The one surface of the second element D2 is pressed into the second cured adhesive layer 12c at a second indentation depth d2 to form a second adhesive force (d2) with the first and second curable adhesive layers 11 and 12c F2) is formed on the other side of the second element (D2) and the fifth adhesive layer (F5) is formed on the other side of the second element (D2).

Further, the third element D3 is pressed into the fourth adhesive layer 14 at the third indentation depth d3 to form the first, second, and fourth

adhesive layers

11, 12c, and 14, And the fifth adhesive layer 22 and the fifth adhesive force F5 are formed on the other surface of the third element D3.

In this case, since the first adhesive force F1 is smaller than the fifth adhesive force F5 and the second and third adhesive forces F2 and F3 are larger than the fifth adhesive force F5, The first element D1 is released while attached to the fifth adhesive layer 22 and the second element D2 is attached to the first and second curable adhesive layers 11 and 12c And the third element D3 is releasably attached to the first, second, and fourth

adhesive layers

11, 12c, and 14, respectively.

The number of the adhesive layers deposited on one surface of the base film 19 can be freely changed according to the size, shape and material of the device D to be transferred.

As described above, the present invention is not limited to the above-described specific preferred embodiments, and various changes and modifications may be made by those skilled in the art without departing from the scope of the present invention as claimed in the claims. And such variations are within the scope of the present invention.

Claims

A base film;

A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein; And

And a second adhesive layer formed between the base film and the first adhesive layer, the second adhesive layer having a hardness changed so as to control the pressing of the device,

Wherein when the second adhesive layer has a first hardness that is stronger than the hardness of the first adhesive layer, the element is pressed into the first adhesive layer, and the second adhesive layer has a second hardness Wherein the element is press-fitted into the second adhesive layer through the first adhesive layer.
The method according to claim 1,

Wherein the magnitude of the adhesive force formed between the element and the first adhesive layer or the second adhesive layer is proportional to the indentation depth at which the element is pressed into the first adhesive layer or the second adhesive layer. Carrier film.
The method according to claim 1,

The second adhesive layer is made of a material whose hardness changes depending on the applied temperature,

Wherein the second adhesive layer has the first hardness when a first temperature is applied to the second adhesive layer and the second adhesive layer has a second hardness when a second temperature higher than the first temperature is applied to the second adhesive layer, And a second hardness.
The method of claim 3,

Wherein the hardness of the second adhesive layer is changed by the first hardness or the second hardness according to the temperature of the external heater for heating the second adhesive layer.
The method of claim 3,

Wherein the hardness of the second adhesive layer is changed by the first hardness or the second hardness according to the temperature of the heater roller for heating and pressing the second adhesive layer.
The method of claim 3,

And a first mask layer having a first opening formed on the other surface of the base film,

Wherein the hardness of the second adhesive layer region opened by the first opening varies with the first hardness or the second hardness according to the intensity of the laser radiated to the first mask layer film.
The method of claim 3,

And a built-in heater formed in a predetermined region between the base film and the second adhesive layer to heat the second adhesive layer,

Wherein the hardness of the second adhesive layer region varies with the first hardness or the second hardness according to the temperature of the built-in heater.
The method according to claim 1,

The second adhesive layer is made of a material whose hardness changes according to the wavelength of the applied light,

Wherein the second adhesive layer has the first hardness when light is irradiated to the second adhesive layer at a first wavelength and irradiates light to the second adhesive layer at a second wavelength longer than the first wavelength Wherein the second adhesive layer has the second hardness.
9. The method of claim 8,

And a second mask layer having a second opening formed on the other surface of the base film,

Wherein the hardness of the second adhesive layer region opened by the second opening varies with the first hardness or the second hardness according to the wavelength of light irradiated to the second mask layer film.
The method according to claim 1,

Wherein the second adhesive layer is divided into a region where the hardness changes in the first hardness or the second hardness and a region in which the hardness does not change,

Wherein said element is located in a region where said hardness changes.
A base film;

A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein;

A second adhesive layer formed between the base film and the first adhesive layer and having a hardness varying to control whether the device is pressed or not; And

And a third adhesive layer which is formed between the base film and the second adhesive layer and whose hardness changes to control whether the device is pressed or not,

And the second adhesive layer is pressed into the first adhesive layer when the second adhesive layer has a first hardness that is higher than the hardness of the first adhesive layer and the second adhesive layer is the same as the hardness of the first adhesive layer, When the third adhesive layer has a third hardness that is weaker than the hardness of the first adhesive layer and the third adhesive layer has a third hardness that is stronger than the second hardness, the element penetrates through the first adhesive layer to be pressed into the second adhesive layer And the second adhesive layer has the second hardness and the third adhesive layer has the fourth hardness equal to or less than the second hardness, the device further comprises a first adhesive layer and a second adhesive layer, Wherein the hardness-variable carrier film is press-fitted into the third adhesive layer through the adhesive layer.
12. The method of claim 11,

Wherein the size of the adhesive force formed between the device and the first adhesive layer, the second adhesive layer, or the third adhesive layer is such that the device presses the first adhesive layer, the second adhesive layer, Wherein the hardness variable carrier film is proportional to the indentation depth.
12. The method of claim 11,

Wherein the second adhesive layer and the third adhesive layer are made of a material whose hardness changes according to an applied temperature,

Wherein the second adhesive layer has the first hardness when a first temperature is applied to the second adhesive layer and the second adhesive layer has a second hardness when a second temperature higher than the first temperature is applied to the second adhesive layer, Having a second hardness,

And the third adhesive layer has the third hardness when the second temperature is applied to the third adhesive layer, and when a third temperature higher than the second temperature is applied to the third adhesive layer, And the fourth hardness.
12. The method of claim 11,

Wherein at least one of the second adhesive layer and the third adhesive layer is made of a material whose hardness changes depending on an applied temperature and the other of the second adhesive layer and the third adhesive layer has a wavelength And is made of a material whose hardness changes,

The hardness of the second adhesive layer is varied by the first hardness or the second hardness by the temperature applied to the second adhesive layer or the third adhesive layer and the wavelength of the irradiated light, Wherein the hardness of the hardness-varying carrier film is varied by the third hardness or the fourth hardness.
12. The method of claim 11,

Wherein the second adhesive layer is divided into a plurality of regions and adhesive layers having at least two hardnesses of the first to fourth hardnesses in the respective regions are overlapped with each other.