WO2019123655A1

WO2019123655A1 - Method for manufacturing display device, and apparatus for manufacturing display device

Info

Publication number: WO2019123655A1
Application number: PCT/JP2017/046227
Authority: WO
Inventors: 達岡部; 信介齋田; 遼佑郡司; 博己谷山; 市川　伸治; 浩治神村; 芳浩仲田; 彬井上
Original assignee: シャープ株式会社
Priority date: 2017-12-22
Filing date: 2017-12-22
Publication date: 2019-06-27

Abstract

A method for manufacturing a display device, the method including a step for applying a photosensitive substance onto an anode, and a step for exposing the photosensitive substance in a first region and a second region using a gray-tone mask. A region of a semi-translucent part of the gray-tone mask that transmits less light than other regions is disposed in a region in which the first region and the second region overlap.

Description

Display device manufacturing method and display device manufacturing apparatus

The present invention relates to a method of manufacturing a display device and the like.

DESCRIPTION OF RELATED ART Conventionally, the display device provided with OLED (Organic Light Emitting Diode: Organic light emitting diode) is known. For example, Patent Document 1 discloses a method of manufacturing a display device provided with an OLED.

Japanese Patent Publication "Japanese Patent Application Laid-Open No. 2015-22914 (released on February 2, 2015)"

However, patent document 1 does not describe about manufacturing a display device provided with a large-sized display part.

An aspect of the present invention aims to realize a method for manufacturing a display device and a manufacturing apparatus capable of preferably manufacturing a display device including a large display portion.

In order to solve the above-mentioned subject, the manufacturing method of the display device concerning one mode of the present invention is insulating that covers the edge of the light emitting element containing a lower electrode, a luminous layer, and an upper electrode, and the lower electrode. 1. A method of manufacturing a display device comprising a cover film, comprising the steps of: applying a photosensitive material to the lower electrode; and exposing the photosensitive material in a first region using a first photomask. And a second exposure step of exposing the photosensitive material in a second region using a second photomask, wherein the first photomask and the second photomask are a light shielding portion that shields light. A gray-tone mask having a light transmitting portion for transmitting light, and a half light transmitting portion having a transmittance between the light shielding portion and the light transmitting portion, and a first region to be exposed in the first exposure step; Dew in the second exposure step The second regions correspond to different regions of the display region of the display device, and the half light transmitting portion includes a first portion and a second portion having a light transmittance smaller than that of the first portion. In the overlapping region where the first region and the second region overlap at their respective end portions, the second portion of the half light transmitting portion is disposed in each of the first exposure step and the second exposure step. .

In order to solve the above-mentioned subject, a manufacturing device of a display device concerning one mode of the present invention is insulating which covers an edge of a light emitting element containing a lower electrode, a luminous layer, and an upper electrode, and the lower electrode. 1. A manufacturing apparatus of a display device comprising a cover film, comprising: a cover film forming apparatus for forming the cover film, wherein the cover film forming apparatus applies a photosensitive material to the lower electrode; And a second exposure step of exposing the photosensitive material of the second region using the second photomask, the first exposure step of exposing the photosensitive material of the first region using the photomask, and a second exposure step of exposing the photosensitive material of the second region using the second photomask. The first photomask and the second photomask each include a light blocking portion that blocks light, a light transmitting portion that transmits light, and a half light transmitting portion having a transmittance between the light blocking portion and the light transmitting portion. It is a gray tone mask that The first area to be exposed in the first exposure step and the second area to be exposed in the second exposure step correspond to different areas of the display area of the display device, and the half light transmitting portion is The first exposure step and the first exposure step, in the overlapping area including the first area and the second area having a light transmittance smaller than that of the first area, and the first area and the second area overlap at each end. In each of the second exposure steps, the second portion of the semi-transmissive portion is disposed.

According to the method for manufacturing a display device or the apparatus for manufacturing a display device according to one aspect of the present invention, a display device including a large display portion can be preferably manufactured.

5 is a flowchart illustrating an example of a method of manufacturing a display device according to Embodiment 1. It is sectional drawing which shows the structural example of the display part of the said display device. It is a flowchart which shows an example of the formation process of a light emitting element layer. It is a flowchart which shows an example of an anode cover film formation process. It is a top view which shows the structure of a gray tone mask. It is an enlarged view of the area | region D1 of FIG. It is an enlarged view of the area | region D6 of FIG. It is a top view which shows the anode cover film formed by performing the exposure process using the said gray tone mask, development process, and a heat process process. It is a conceptual diagram of the exposure process with respect to the area | region adjacent to the front-back direction. This shows the state of the photosensitive organic material after the exposure processing and the development processing are performed on the overlapping region using the half light transmitting portion of the gray tone mask in the first exposure processing and the second exposure processing, respectively. a) is a figure which shows the state of the photosensitive organic material M at the time of using the conventional gray tone mask, (b) is a figure which shows the state of the photosensitive organic material at the time of using the said gray tone mask. . (A) is an enlarged view of the area | region D2 in FIG. 5, (b) is an enlarged view of the area | region D3 in FIG. It is a conceptual diagram of the exposure process with respect to the area | region adjacent to the left-right direction. (A) is an enlarged view of the area | region D4 in FIG. 5, (b) is an enlarged view of the area | region D5 in FIG. It is a block diagram which shows the structure of the display device manufacturing apparatus which manufactures the said display device. (A) is an enlarged view which shows the structure of the edge part of the back side of the gray tone mask which concerns on Embodiment 2, (b) is an enlarged view which shows the structure of the edge part of the front side of the said gray tone mask. . (A) is an enlarged view which shows the structure of the edge part of the right side of the gray tone mask which concerns on Embodiment 3, (b) is an enlarged view which shows the structure of the edge part of the left side of the said gray tone mask.

Embodiment 1
Hereinafter, Embodiment 1 of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a flowchart showing an example of a method of manufacturing the display device 2 in the present embodiment. FIG. 2 is a cross-sectional view showing a configuration example of the display unit 2 a of the display device 2. In the following, “same layer” means being formed of the same material in the same process, and “lower layer” means being formed in a process prior to the layer to be compared , "Upper layer" means that it is formed in a later process than the layer to be compared.

In the manufacture of the display device 2, as shown in FIG. 1 and FIG. 2, first, the resin layer 12 is formed on a translucent support substrate (for example, a mother glass substrate) 10 (step S1). Next, the barrier layer 3 is formed (step S2). Next, the TFT layer 4 is formed (step S3). Next, a top emission type light emitting element layer (for example, an OLED element layer) 5 is formed (step S4). Details of step S4 will be described later. Next, the sealing layer 6 is formed (step S5). Next, the functional film 39 is attached to the upper surface of the sealing layer 6 (step S6). Then, an electronic circuit board (for example, an IC chip) is mounted on the terminal for external connection, and the display device 2 is obtained (step S7). The above steps are performed by the display device manufacturing apparatus.

Examples of the material of the resin layer 12 include polyimide resin, acrylic resin, and epoxy resin. Examples of the material of the lower film 10 include polyethylene terephthalate (PET).

The barrier layer 3 is a layer that prevents foreign matter such as water and oxygen from permeating the TFT layer 4 and the light emitting element layer 5 when the display device is used, and is formed by, for example, a chemical vapor deposition (CVD) method. A silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a stacked film thereof can be used.

The TFT layer 4 includes the semiconductor film 15, the inorganic insulating film 16 (gate insulating film) above the semiconductor film 15, the gate electrode GE above the inorganic insulating film 16, and the inorganic insulating layer above the gate electrode GE. A film 18, a capacitance wire CE above the inorganic insulating film 18, an inorganic insulating film 20 above the capacitance wire CE, a source wire SH above the inorganic insulating film 20, and a layer above the source wire SH And a planarization film 21.

The thin film transistor (TFT) Tr is configured to include the semiconductor film 15, the inorganic insulating film 16 (gate insulating film), and the gate electrode GE.

The semiconductor film 15 is made of, for example, low temperature polysilicon (LTPS) or an oxide semiconductor. Although FIG. 2 shows a TFT in which the semiconductor film 15 is a channel in a top gate structure, it may have a bottom gate structure (for example, when the channel of the TFT is an oxide semiconductor).

The gate electrode GE, the capacitance electrode CE, and the source wiring SH are made of, for example, aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu) It is comprised by the single layer film or laminated film of the metal containing at least one.

The inorganic

insulating films

16, 18 and 20 can be formed of, for example, a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, or a laminated film thereof formed by a CVD method. The planarizing film (interlayer insulating film) 21 can be made of, for example, a coatable photosensitive organic material such as polyimide or acrylic.

A light emitting element layer (light emitting element) 5 (for example, an organic light emitting diode layer) has an anode (anode, lower electrode) 22 above the planarization film 21 and an anode cover film (cover film) covering the edge of the anode 22. , An EL (electroluminescent) layer 24 above the anode 22, and a cathode 25 above the EL layer 24, and for each sub-pixel, an island-like anode 22, an island-like EL layer 24, and A light emitting element (for example, OLED: organic light emitting diode) including a cathode (cathode, upper electrode) 25 and a sub-pixel circuit for driving the same are provided.

The anode cover film 23 is an organic insulating film, and is formed, for example, by applying a photosensitive organic material (photosensitive material) M such as polyimide or acrylic and then patterning it by a photolithography method. Details of the method of forming the anode cover film 23 will be described later.

The EL layer 24 is configured, for example, by laminating a hole transport layer, a light emitting layer, and an electron transport layer in order from the lower layer side. The light emitting layer is formed in a region (sub-pixel region) surrounded by the partition wall formed of the anode cover film 23 by a vapor deposition method or an inkjet method. The hole transport layer and the electron transport layer may be formed in an island shape for each sub-pixel, or may be formed in a solid shape as a common layer of a plurality of sub-pixels.

The anode 22 is formed of, for example, a laminate of ITO (Indium Tin Oxide) and an alloy containing Ag, and has light reflectivity. The cathode 25 can be made of a light-transmitting conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zincum Oxide).

When the light emitting element layer 5 is an OLED layer, the drive current between the anode 22 and the cathode 25 causes holes and electrons to recombine in the EL layer 24 and the resulting excitons fall to the ground state, whereby light is generated. Released. Since the cathode 25 is translucent and the anode 22 is light reflective, the light emitted from the EL layer 24 is directed upward to be top emission.

The sealing layer 6 includes an inorganic sealing film 26 above the cathode 25, an organic sealing film 27 above the inorganic sealing film 26, and an inorganic sealing film 28 above the organic sealing film 27. To prevent the penetration of foreign substances such as water and oxygen into the light emitting element layer 5. The

inorganic sealing films

26 and 28 can be formed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminated film thereof formed by a CVD method. The organic sealing film 27 can be made of a coatable photosensitive organic material such as polyimide or acrylic.

The functional film 39 has, for example, an optical compensation function, a touch sensor function, a protection function, and the like.

(Method of forming light emitting element layer 5)
FIG. 3 is a flowchart showing an example of the process of forming the light emitting element layer 5 (step S4 described above). The formation process of the light emitting element layer 5 is, as shown in FIG. 3, (1) Anode formation process (step S11), (2) anode cover film formation process (step S12), (3) EL layer formation process (step S13) And (4) a cathode formation step (step S14), and the respective steps are performed in this order.

The anode formation step is a step of forming the anode 22 by laminating ITO and an alloy containing Ag using sputtering. The anodes 22 are formed in an island according to the sub-pixels of the EL layer 24.

The anode cover film forming step is a step of forming an insulating anode cover film 23 which covers the edge region of the anode 22.

FIG. 4 is a flow chart showing an example of an anode cover film forming step. In the anode cover film forming step, as shown in FIG. 4, (a) a photosensitive organic material M (for example, photosensitive polyimide, photosensitive acrylic, etc.) as a raw material of the anode cover film 23 is applied on the upper surface of the anode 22 The photosensitive organic material M is patterned into a predetermined shape by performing an exposure process (also referred to as a shot in the following description) and a development process on the coating step (step S21) and (b) photosensitive organic material M. And (c) heat treatment (baking) the photosensitive organic material M patterned into a predetermined shape to form the anode cover film 23 (step S23).

The photosensitive organic material M in the present embodiment is a positive type material, and when irradiated with light, the solubility in the developer used in the above development processing is increased, and the photosensitive organic material M is removed in the above development processing.

The above patterning process will be described in detail. In the present embodiment, in order to realize the large display unit 2a, exposure processing is performed on a plurality of regions using a gray tone mask (photomask) 40 (a first photomask and a second photomask).

FIG. 5 is a plan view showing the structure of the gray tone mask 40 used in the exposure process. FIG. 6 is an enlarged view of a region D1 in FIG. FIG. 7 is an enlarged view of a region D6 in FIG. In the following description, the + X axis direction in FIG. 5 may be described as the right direction, the −X axis direction as the left direction, the + Y axis direction as the front direction, and the −Y axis direction as the rear direction. FIG. 6 is an enlarged view of the region D1 of FIG.

As shown in FIG. 5, the gray tone mask 40 has a rectangular shape. As shown in FIG. 6, the gray tone mask 40 has a light transmitting portion 41 for transmitting light, a half having a light transmittance between the light transmittance of the light transmitting portion 41 and the light transmittance of the light shielding portion 43 described later. A light transmitting portion 42 and a light shielding portion 43 which shields light by forming a light shielding film in a solid state are provided. As shown in FIG. 7, the half light transmitting portion 42 is a region in which a fine pattern is formed on the light shielding film below the exposure limit, and specifically, a strip pattern 42A (a region where the light shielding film is left) , And slits 42B (apertures, fine slits) are alternately formed.

FIG. 8 is a plan view showing an anode cover film 23 formed by performing exposure processing using a gray tone mask 40, development processing, and thermal processing. FIG. 8 shows the anode cover film 23 in the region shown in the enlarged view of the gray tone mask 40 shown in FIG.

As shown in FIG. 8, the photosensitive organic material M is exposed by a large amount of light in the exposure process at the portion corresponding to the light transmitting portion 41 of the gray tone mask 40, and the photosensitive organic material M is removed by the development process. . As a result, an opening 23 a is formed in the anode cover film 23 at the corresponding portion. The opening 23 a is an opening in which the EL layer 24 is directly formed on the upper surface of the anode 22 and which becomes a light emitting region.

The photosensitive organic material M is exposed with a small amount of light in the exposure process at a portion corresponding to the semi-light transmitting portion 42 of the gray tone mask 40, so a part of the photosensitive organic material M is removed by the developing process. As a result, a flat portion 23 c is formed in the anode cover film 23 at the corresponding portion.

Since the photosensitive organic material M is not exposed in the exposure processing at the portion corresponding to the light shielding portion 43 of the gray tone mask 40, it is not removed by the development processing. As a result, a protruding portion 23d that protrudes upward from the flat portion 23c is formed. The protrusion 23 d is formed to prevent the mask used for vapor deposition and the anode cover film 23 from coming in contact with each other in an EL layer forming process described later.

In the above description, the formation of the anode cover film 23 in the central region of the gray tone mask 40 has been described. In the following description, formation of the anode cover film 23 in a region other than the central region (superposed region PD described later) will be described.

In order to realize a large display unit, the exposure process using the gray tone mask 40 needs to be performed multiple times. Hereinafter, a method of performing exposure processing on different regions of the display region of the display device will be described.

First, performing the first exposure process and the second exposure process on an area adjacent in the front-rear direction will be described. FIG. 9 is a conceptual view of exposure processing (hereinafter referred to as first exposure processing and second exposure processing) on regions adjacent in the front-rear direction. Thereafter, as shown in FIG. 9, the rear region exposed by the first exposure processing (first exposure step) is exposed by the first region D7 and the second exposure processing (second exposure step). The area is described as a second area D8.

As shown in FIG. 9, when the exposure processing is performed on the first area D7 and the second area D8 adjacent to each other, the areas exposed in the first exposure processing and exposed in the second exposure processing (following In the description, the overlapping region PD is called). A problem that occurs when the overlapping region PD is subjected to the exposure processing using the half light transmitting portion 42 of the gray tone mask 40 in the first exposure processing and the second exposure processing will be described with reference to FIG. FIG. 10 shows the photosensitive organic material M after the exposure processing and the development processing have been performed on the overlapping region PD using the half light transmitting portion 42 of the gray tone mask 40 in the first exposure processing and the second exposure processing, respectively. 7A shows a state of the photosensitive organic material M when using a conventional gray tone mask, and FIG. 7B shows using the gray tone mask 40 according to the present embodiment. It is a figure which shows the state of the photosensitive organic material M in the case.

In the conventional gray tone mask, in the semi-light transmitting portion 42, the area occupied by the strip pattern 42A and the area occupied by the slits 42B are constant in all the regions. Therefore, when the overlapping region PD is exposed using the half light transmitting portion 42 of the gray tone mask 40 in the first exposure processing and the second exposure processing, the photosensitive organic material M is exposed twice. . When development processing is performed on such a photosensitive organic material M, as shown in FIG. 10A, in the photosensitive organic material M, the region corresponding to the overlapping region PD is a semi-transmissive portion 42. Compared to the area subjected to one exposure process using Even if the heat treatment step (step S23) is performed on such a photosensitive organic material M, the recessed portion can not be completely filled, and a groove is formed in the anode cover film. Therefore, there is a problem that it causes a display defect of the display device.

To address this problem, the gray tone mask 40 in the present embodiment is formed as follows. (A) of FIG. 11 is an enlarged view of the area D2 in FIG. 5, and (b) is an enlarged view of the area D3 in FIG. As shown in (a) and (b) of FIG. 11, when the semi-light transmitting portion 42 is formed at the end in the front-rear direction, the gray tone mask 40 in the present embodiment has a strip shape in the other region. A band-like pattern 42C (second part) having a width in the front-rear direction wider than the pattern 42A (first part) is formed at an end in the front-rear direction. Then, when performing exposure processing on the superimposed region PD using the half light transmitting portion 42 of the gray tone mask 40, the strip-shaped pattern 42C having a light transmittance of 0% is disposed to the superimposed region PD. A first exposure process and a second exposure process are performed. Thereby, in the first exposure process and the second exposure process, the light is not substantially irradiated to the photosensitive organic material M located in the overlapping region PD (however, the light is slightly irradiated by the light diffraction) ). Thereby, as shown in (b) of FIG. 10, the photosensitive organic material M after the development processing was subjected to one exposure processing using the semi-light transmitting portion 42 in the region corresponding to the overlapping region PD. It has a shape protruding upward compared to the region (however, the shape is lower than the height of the photosensitive organic material M in the region corresponding to the light shielding portion 43). When the above-described heat treatment step (step S23) is performed on the photosensitive organic material M having such a shape, the portion protruding upward is flattened by heat dripping. This makes it possible to prevent display defects of the display device 2 from occurring.

Next, performing exposure processing on each of the regions adjacent in the left-right direction will be described. FIG. 12 is a conceptual diagram of exposure processing (hereinafter referred to as third exposure processing and fourth exposure processing) on regions adjacent in the left-right direction. Thereafter, as shown in FIG. 12, the area on the left side exposed by the third exposure process (the first exposure step) is the third area D9, and the area on the right side exposed by the fourth exposure process (the second exposure process) Will be described as a fourth area D10.

(A) of FIG. 13 is an enlarged view of the region D4 in FIG. 5, and (b) is an enlarged view of the region D5 in FIG. As shown in (a) and (b) of FIG. 13, in the gray-tone mask 40 in the present embodiment, the slits 42B are formed to extend in the front-rear direction at the end in the left-right direction (in other words, It is formed parallel to the longitudinal direction of the overlapping area PD). Thus, the band-like pattern 42A also extends in the front-rear direction. Further, at an end in the left-right direction of the gray tone mask 40, a band-shaped pattern 42C whose width in the left-right direction is wider than the band-shaped patterns 42A in the other regions is formed at the end in the left-right direction. And when performing exposure processing to superposition field PD using half light penetration part 42 of gray tone mask 40, beltlike pattern 42C is arranged to superposition field PD, and the 1st exposure processing and the 2nd exposure Do the processing. Thereby, in the first exposure process and the second exposure process, the light is not substantially irradiated to the photosensitive organic material M located in the overlapping region PD (however, the light is slightly irradiated by the light diffraction) ). Thereby, as shown in (b) of FIG. 10, the photosensitive organic material M after the development processing was subjected to one exposure processing using the semi-light transmitting portion 42 in the region corresponding to the overlapping region PD. It has a shape projecting upward relative to the region. When the above-described heat treatment step (step S23) is performed on the photosensitive organic material M having such a shape, the portion protruding upward is flattened by heat dripping. This makes it possible to prevent display defects of the display device 2 from occurring.

In the EL layer forming step, the hole transport layer, the light emitting layer, and the electron transport layer are laminated in order from the lower layer side. As described above, the light emitting layer is formed in an island shape for each sub-pixel by a vapor deposition method or an inkjet method. More specifically, the light emitting layer is formed by the vapor deposition method or the ink jet method in a state where the mask is in contact with the protrusion 23 d formed in the anode cover film forming step. As a result, the mask can be prevented from coming into contact with the anode cover film 23, and thus the anode cover film 23 can be prevented from peeling off.

The cathode forming step is a step of forming the cathode 25 using sputtering.

FIG. 14 is a block diagram showing a configuration of a display device manufacturing apparatus 70 (manufacturing apparatus) for manufacturing the display device 2 in the present embodiment. As shown in FIG. 14, the display device manufacturing apparatus 70 controls the barrier layer forming apparatus 72, the TFT layer forming apparatus 73, the light emitting element layer forming apparatus 74, the sealing layer forming apparatus 76, and these devices. And a controller 71. The light emitting element layer forming device 74 includes an anode cover film forming device (cover film forming device) 75. The barrier layer forming device 72 performs step S2 in FIG. The TFT layer forming device 73 performs step S3 in FIG. The light emitting element layer forming device 74 performs step S4 in FIG. 1 (ie, steps S11 to S14 in FIG. 3). The anode cover film forming apparatus 75 performs step S12 in FIG. 3 (ie, S21 to S23 in FIG. 4). The sealing layer forming device 76 performs step S5 in FIG.

As described above, in the present embodiment, in the case of performing the exposure process on the overlapping area PD using the half light transmitting portion 42 of the gray tone mask 40 in the exposure process on the adjacent area, another process is performed on the overlapping area PD. A band-shaped pattern 42C wider than the band-shaped pattern 42A in the area is disposed. Thereby, the photosensitive organic material M in the overlapping region PD after development processing can be shaped so as to protrude upward (however, the shape is lower than the height of the photosensitive organic material M in the region corresponding to the light shielding portion 43). ). As a result, when the heat treatment is performed on the photosensitive organic material M, the convex portions of the overlapping region PD are flattened by the heat transfer. This makes it possible to prevent display defects of the display device 2 from occurring.

Second Embodiment
Another embodiment of the present invention will be described. In addition, about the member which has the same function as the member demonstrated in the said embodiment for convenience of explanation, the same code | symbol is appended and the description is abbreviate | omitted.

The present embodiment is different from the first embodiment in that a gray tone mask 40A described later is used in place of the gray tone mask 40 in the first embodiment.

FIG. 15A is an enlarged view showing the structure of the rear end of the gray tone mask 40A in the present embodiment, and FIG. 15B is an enlarged view showing the structure of the front end of the gray tone mask 40A. FIG. As shown in (a) and (b) of FIG.
In the vicinity of the end in the front-rear direction, the distance between the slits 42B of the semi-light transmitting portion 42 is larger than the distance between the slits 42B in the other region. In other words, a strip-shaped pattern 42D which is wider than the strip-shaped patterns 42A in the other regions is formed at the corresponding portion. More specifically, the end of the light is transmitted so that the amount of light transmission (light transmission) of the half light transmitting portion 42 in the vicinity of the end is 50% or less of the light transmission of the half light transmitting portion 42 in the other region. An interval between the slits 42B in the vicinity of the portion is set. In the subsequent area, the area of the semi-transmissive portion 42 where the strip pattern 42D is formed is referred to as an area D11 (second portion).

In the present embodiment, in the case where exposure processing is performed on the overlapping region PD using the half light transmitting portion 42 of the gray tone mask 40A, the region D11 is arranged on the overlapping region PD to perform the first exposure processing and the 2 Perform exposure processing. Thereby, in the first exposure processing and the second exposure processing, the irradiation amount of light to the photosensitive organic material M located in the overlapping region PD is set to the irradiation amount of light in one exposure processing using the half light transmitting portion 42 It can be Thereby, as shown in (b) of FIG. 10, the photosensitive organic material M after the development processing was subjected to one exposure processing using the semi-light transmitting portion 42 in the region corresponding to the overlapping region PD. It has a shape projecting upward relative to the region. When the above-described heat treatment step (step S23) is performed on the photosensitive organic material M having such a shape, the portion protruding upward is flattened by heat dripping. This makes it possible to prevent display defects of the display device 2 from occurring.

Third Embodiment
Another embodiment of the present invention will be described. In addition, about the member which has the same function as the member demonstrated in the said embodiment for convenience of explanation, the same code | symbol is appended and the description is abbreviate | omitted.

The present embodiment is different from the first embodiment in that a gray tone mask 40B described later is used instead of the gray tone mask 40 in the first embodiment.

FIG. 16A is an enlarged view showing the structure of the right end of the gray tone mask 40B in the present embodiment, and FIG. 16B is an enlarged view showing the structure of the left end of the gray tone mask 40B. It is. As shown in (a) and (b) of FIG.
Near the end in the left-right direction, slits 42E extending in the front-rear direction are formed, and the distance between the slits 42E is larger than the distance between the slits in other regions. In other words, a strip-shaped pattern 42F and a strip-shaped pattern 42D, which are wider than the strip-shaped patterns 42A in the other regions, are formed at the locations. More specifically, the light transmission amount (light transmission amount) of the semi-light transmission portion 42 in the vicinity of the end in the left-right direction is 50% or less of the light transmission amount of the semi-light transmission portion 42 in the other region The distance between the slits 42E in the vicinity of the end is set.

In the present embodiment, when the overlapping region PD is exposed using the half light transmitting portion 42 of the gray tone mask 40B, the slits 42E, the band-shaped patterns 42F, and the band-shaped patterns 42D with respect to the overlapping region PD. The first exposure process and the second exposure process are performed by arranging a part of Thereby, in the first exposure processing and the second exposure processing, the irradiation amount of light to the photosensitive organic material M located in the overlapping region PD is set to the irradiation amount of light in one exposure processing using the half light transmitting portion 42 It can be Thereby, as shown in (b) of FIG. 10, the photosensitive organic material M after the development processing was subjected to one exposure processing using the semi-light transmitting portion 42 in the region corresponding to the overlapping region PD. It has a shape protruding upward compared to the region (however, the shape is lower than the height of the photosensitive organic material M in the region corresponding to the light shielding portion 43). When the above-described heat treatment step (step S23) is performed on the photosensitive organic material M having such a shape, the portion protruding upward is flattened by heat dripping. This makes it possible to prevent display defects of the display device 2 from occurring.

[Summary]
A method of manufacturing a display device according to aspect 1 comprises a light emitting element including a lower electrode (anode 22), a light emitting layer (EL layer 24), and an upper electrode (cathode 25), and an insulating material covering an edge of the lower electrode. A method of manufacturing a display device 2 comprising a cover film (anode cover film 23), comprising: applying a photosensitive substance (photosensitive organic material M) to the lower electrode; and a first photomask (grey tone mask) 40, 40A) exposing the photosensitive material in the first region, and exposing the photosensitive material in the second region using the second photomask (

grey tone mask

40, 40A) And a second exposure step, wherein the first photomask and the second photomask are a light shielding portion 43 for shielding light, a light transmitting portion 41 for transmitting light, and the light shielding portion and the light transmitting portion. Transparency between A first region to be exposed in the first exposure step and a second region to be exposed in the second exposure step are each a display of the display device The semi-transmissive portion includes a first portion (strip pattern 42A) and a second portion (strip pattern 42C, region D11) having a light transmittance smaller than that of the first portion. In a region where the first region and the second region overlap at respective end portions, the second portion of the semitransparent portion is disposed in each of the first exposure step and the second exposure step.

Here, in the overlapping region, the two-time exposure process of the first exposure process and the second exposure process is performed. Therefore, the overlapping region is more influenced by the exposure processing than the region other than the overlapping region.

According to the above configuration, by arranging the second part of the half light transmitting part, the photosensitive material after development processing is subjected to a single exposure process using the half light transmitting part in the region corresponding to the overlapping region. It has a shape that protrudes upward as compared to the region where it has been performed. When a heat treatment is performed on the photosensitive material having such a shape, the protruding portion is flattened by heat dripping. This makes it possible to prevent display defects of the display device.

In a second aspect, the photosensitive material is a positive photosensitive material.

In the third aspect, the half light transmitting portion includes a plurality of fine slits, and the second portion has a smaller distance between adjacent fine slits than the first portion.

In the fourth aspect, the semi-light transmitting portion is formed with a strip-shaped pattern formed of a light shielding portion between the plurality of fine slits, and the second portion has a width of the strip-shaped pattern more than the first portion. wide.

In the fifth aspect, the first photomask and the second photomask have a rectangular shape, and at the end portions of the first photomask and the second photomask, the belt-like pattern is the first photomask and It is formed in parallel with the side of the end of the second photomask.

In the sixth aspect, in the overlapping area, the band-like pattern is disposed in each of the first exposure process and the second exposure process.

In the seventh aspect, in the overlapping region, the light shielding portion is disposed in any one of the first exposure process and the second exposure process.

In an eighth aspect, when the first photomask and the second photomask have a first direction, in which the strip-shaped patterns in the first photomask and the second photomask extend, the first photomask and the second photomask are The direction in which the strip pattern extends at the end of the vertical side is formed so as to be parallel to the sides of the first photomask and the second photomask by rotating 90 ° in the extending direction, and the width of the strip pattern is the first It is larger than the width of the strip pattern inside the photomask and the second photomask.

In a ninth aspect, the light transmittance in the second part is 50% or less of the light transmission amount of the first part.

In the tenth aspect, the overlapping region is in a rectangular shape, and the fine slits are formed in parallel with the longitudinal direction of the overlapping region.

In an eleventh aspect, the method further includes a heat treatment step of heat treating the patterned photosensitive material after the first exposure step and the second exposure step, and the first heat treatment step is performed in the region other than the overlapping region. An opening in which a light emitting layer of the display device is formed is formed in a region corresponding to the light transmitting portion of the mask or the second photomask, and the light shielding portion of the first photomask or the second photomask is formed. In the region corresponding to a, a protrusion protruding upward with respect to the cover film is formed.

A display device manufacturing apparatus (75) according to aspect 10 includes a light emitting element including a lower electrode, a light emitting layer, and an upper electrode, and an insulating cover film covering an edge of the lower electrode. A cover film forming apparatus for forming the cover film, wherein the cover film forming apparatus includes the steps of: applying a photosensitive material to the lower electrode; and using the first photomask to form the cover film. A first exposure process for exposing a photosensitive material; and a second exposure process for exposing the photosensitive material in a second region using a second photomask, the first photomask and the second photomask A gray tone mask having a light shielding portion for shielding light, a light transmitting portion for transmitting light, and a half light transmitting portion having a transmittance between the light shielding portion and the light transmitting portion; Exposure in the exposure process The first area and the second area to be exposed in the second exposure step correspond to different areas of the display area of the display device, and the semi-transmissive portion includes a first portion and the first portion. The region including the second portion having a light transmittance smaller than that of the second region and the first region and the second region overlap at each end portion is the region in the first exposure step and the second exposure step. The second part of the half light transmitting part is disposed.

2 Display Device 5 Light Emitting Element Layer (Light Emitting Element)
22 anode (lower electrode)
23 Anode cover membrane (cover membrane)
24 EL layer (emitting layer)
25 cathode (upper electrode)
M Photosensitive organic material (photosensitive substance)
40, 40A gray tone mask (first photomask, second photomask)
41 light transmitting portion 42 half light transmitting portion 42A strip-like pattern (part 1)
42B slit (fine slit)
42C Strip Pattern (Part 2)
43 Light Shield 70 Display Device Manufacturing Device (Manufacturing Device)
75 Anode cover film forming device (cover film forming device)
D11 area (Part 2)
PD overlapping area

Claims

A method of manufacturing a display device, comprising: a light emitting element including a lower electrode, a light emitting layer, and an upper electrode; and an insulating cover film covering an edge of the lower electrode,
Applying a photosensitive substance to the lower electrode;
A first exposure step of exposing the photosensitive material in a first area using a first photomask;
Exposing the photosensitive material in a second area using a second photomask;
The first photomask and the second photomask are a half light transmitting portion having a light shielding portion for shielding light, a light transmitting portion for transmitting light, and a light transmittance between the light shielding portion and the light transmitting portion. A gray tone mask with
The first area to be exposed in the first exposure step and the second area to be exposed in the second exposure step correspond to different areas of the display area of the display device, respectively.
The half light transmitting portion includes a first portion and a second portion having a light transmittance smaller than that of the first portion,
In the overlapping region where the first region and the second region overlap at each end, the second portion of the semitransparent portion is disposed in each of the first exposure step and the second exposure step. A method of manufacturing a display device characterized by the above.
The method according to claim 1, wherein the photosensitive material is a positive photosensitive material.
The semi-transmissive portion includes a plurality of fine slits,
The method according to claim 1, wherein the second part has a smaller distance between adjacent fine slits than the first part.
In the semi-light transmitting portion, a band-like pattern including a light shielding portion is formed between the plurality of fine slits,
The method of manufacturing a display device according to any one of claims 1 to 3, wherein the width of the strip-shaped pattern is wider than that of the first part.
The first photomask and the second photomask have a rectangular shape, and at the end portions of the first photomask and the second photomask, the belt-like patterns are the first photomask and the second photo. The method of manufacturing a display device according to claim 4, wherein the method is formed in parallel with the side of the end of the mask.
The method for manufacturing a display device according to claim 4, wherein in the overlapping area, the band-like pattern is disposed in each of the first exposure process and the second exposure process.
The method for manufacturing a display device according to any one of claims 1 to 5, wherein the light shielding portion is disposed in any of the first exposure step and the second exposure step in the overlapping region. .
The first photomask and the second photomask have a side perpendicular to the first direction, when a direction in which the strip-shaped patterns in the first photomask and the second photomask extend is a first direction. The strip pattern is formed so that the direction in which the strip pattern extends in the end portion is rotated by 90 ° and becomes parallel to the sides of the first photomask and the second photomask, and the width of the strip pattern is the first photomask and the The method for manufacturing a display device according to any one of claims 4 to 6, characterized in that the width is larger than the width of the strip pattern inside the second photomask.
The method of manufacturing a display device according to any one of claims 2 to 8, wherein the light transmittance in the second part is 50% or less of the light transmission amount of the first part.
The overlapping area is rectangular,
The method according to claim 3, wherein the fine slits are formed in parallel with a longitudinal direction of the overlapping region.
After the first exposure step and the second exposure step,
Including a heat treatment step of heat treating the patterned photosensitive material;
In the region other than the overlapping region by the heat treatment step,
An opening in which a light emitting layer of the display device is formed is formed in a region corresponding to the light transmitting portion of the first photomask or the second photomask.
The projection part which protrudes upwards with respect to the said cover film is formed in the area | region corresponding to the said light-shielding part of a said 1st photomask or a said 2nd photomask, It is characterized by the above-mentioned. The manufacturing method of the display device of any one of-.
A display device manufacturing apparatus comprising: a light emitting element including a lower electrode, a light emitting layer, and an upper electrode; and an insulating cover film covering an edge of the lower electrode,
A cover film forming apparatus for forming the cover film,
The cover film forming apparatus is
Applying a photosensitive substance to the lower electrode;
A first exposure step of exposing the photosensitive material in a first area using a first photomask;
Exposing the photosensitive material in a second area using a second photomask;
The first photomask and the second photomask are a half light transmitting portion having a light shielding portion for shielding light, a light transmitting portion for transmitting light, and a light transmittance between the light shielding portion and the light transmitting portion. A gray tone mask with
The first area to be exposed in the first exposure step and the second area to be exposed in the second exposure step correspond to different areas of the display area of the display device, respectively.
The half light transmitting portion includes a first portion and a second portion having a light transmittance smaller than that of the first portion,
In the overlapping region where the first region and the second region overlap at each end, the second portion of the semitransparent portion is disposed in each of the first exposure step and the second exposure step. The manufacturing apparatus of the display device characterized by the above.