WO2019121772A1 - Dispositif de chauffage plat souple et procédé pour le fabriquer - Google Patents

Dispositif de chauffage plat souple et procédé pour le fabriquer Download PDF

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Publication number
WO2019121772A1
WO2019121772A1 PCT/EP2018/085638 EP2018085638W WO2019121772A1 WO 2019121772 A1 WO2019121772 A1 WO 2019121772A1 EP 2018085638 W EP2018085638 W EP 2018085638W WO 2019121772 A1 WO2019121772 A1 WO 2019121772A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible
planar heater
circuit board
heater according
conductor tracks
Prior art date
Application number
PCT/EP2018/085638
Other languages
German (de)
English (en)
Inventor
Leonhard Vetter
Jürgen PROKOP
Moritz Hamacher
Nico Fischer
Sebastian Lange
Original Assignee
Dbk David + Baader Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dbk David + Baader Gmbh filed Critical Dbk David + Baader Gmbh
Priority to EP18825674.7A priority Critical patent/EP3729909A1/fr
Publication of WO2019121772A1 publication Critical patent/WO2019121772A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/006—Heaters using a particular layout for the resistive material or resistive elements using interdigitated electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient

Definitions

  • the invention relates to a flexible planar heater according to the preamble of patent claim 1 and a method for its production.
  • Applicant's EP 1 648 199 A1 shows a heater in which the actual heating element is provided with e.g. is structured heat conductor foil produced by stamping or etching. This is fixed on a Mikanitteil and is therefore not flexible.
  • PTC heating elements have a positive temperature coefficient, so that their ohmic resistance increases with increasing heat, and thus the heating power is throttled. This makes PTC heating elements self-regulating.
  • a disadvantage of such heaters is that they are rigid and must always be installed in a flat position.
  • the document EP 0 320 862 A2 discloses PTC heating elements which are arranged between two flat metal nets and thus electrically contacted. On insulating housing closes to the outside. The heater thus formed is considered flexible and the PTC heating elements are disclosed as relatively small.
  • the invention is based on the object to provide a flexible planar heater and a method for its production, in which the production cost is reduced, and the flexibility in assembly is improved.
  • the invention is based on the object to improve the heat dissipation of the SMD components and the heat distribution over the surface of the heater or its flexible printed circuit board.
  • the claimed flexible planar heater has a flexible printed circuit board consisting of a carrier film preferably of polyimide, conductor tracks (for example of copper) and preferably at least partially applied solder mask or a cover film.
  • a carrier film preferably of polyimide
  • conductor tracks for example of copper
  • solder mask for example of copper
  • cover film On a first side several PTC heating elements are attached.
  • the PTC heating elements are formed by SMD components. These can be mounted by an SMD placement machine, whereby the installation cost of the heater is reduced.
  • the conductor tracks of the heater are made wider than is necessary for conducting the current for the SMD components.
  • the width of the conductor tracks can be greater than the length of the SMD components. This increases the heat dissipation from the SMD components to the printed conductors. From there, the heat - preferably transmitted through the carrier film - to the component to be heated.
  • its power supply is implemented via an SMD plug. This mounting technology can also be mounted particularly easily by the SMD placement machine on the printed circuit board.
  • an adhesive layer is preferably provided, via which the heater can be glued to a component to be heated.
  • the component to be heated is e.g. a pipe, on the outside of the heater of the invention is adhered.
  • the heater can also be clamped or pressed against the component to be heated. So it is e.g. possible to dimension a distance between two mutually opposite edges of the heater so that this distance corresponds approximately to the circumference of the pipe to be heated. Then the heater is bent on the outer circumference of the pipe and the two mentioned edges come into close proximity to each other. Finally, the two edges are passed over a tensioning element, e.g. a clamping clasp made of spring steel, stretched together.
  • a tensioning element e.g. a clamping clasp made of spring steel
  • a heat distribution layer On the second side of the flexible circuit board and a heat distribution layer may be preferably made of copper.
  • the heat distribution layer is attached directly to the second side of the circuit board, while the adhesive layer is attached to the heat distribution layer.
  • an electrical and / or thermal insulation layer is preferably made of silicone, which covers the conductor tracks and SMD components. In the case of electrical insulation, this serves as a contact protection. In the case of thermal insulation, the heat of the heater is delivered toward the second side (e.g., bottom).
  • the conductor tracks are made thicker than is necessary for conducting the current for the SMD components.
  • the heat dissipation from the SMD components to the conductor tracks further increased. From there, the heat is transferred to the component to be heated, preferably through the carrier film.
  • the interconnects are separated by main recesses, wherein preferably the elongated interconnects and the elongated main recesses are arranged parallel to each other. Then, the SMD components can extend transversely across the main recesses, in each case from one conductor track to the other conductor track.
  • the main recesses, together with connection recesses form a meandering, continuous, overall recess. This can be easily produced by etching production technology.
  • the tracks can be divided into two groups.
  • the interconnects of the first group are connected to one another via a first interconnect conductor, while the interconnects of the second group are connected to one another via a second interconnect interconnect.
  • Those in the interconnect traces with their respective groups of traces may be connected to a respective electrical potential.
  • the conductor tracks of the first group can be arranged with the conductor tracks of the second group, in particular parallel to one another and alternately.
  • the interconnect traces may be wider and / or thicker than necessary to conduct the current to the traces and the SMD components.
  • the width of the interconnect tracks can be greater than the length of the SMD components. This increases the heat dissipation from the SMD components via the conductor tracks to the interconnect tracks. From there, a portion of the heat - preferably transmitted through the flexible circuit board - to the component to be heated.
  • the two connecting tracks are arranged transversely to the conductor tracks and transversely to the main slots.
  • the two interconnect interconnects extend along two mutually parallel edges of the flexible printed circuit board.
  • the interconnects and optionally also the interconnect traces may be perforated to increase the flexibility of the heater.
  • a modular development of the heater according to the invention has a plurality of first groups of conductor tracks, which are electrically contacted with each other, and a plurality of second groups of conductor tracks, which are electrically contacted with each other.
  • the heater or its modules can be simply rectangular in terms of device technology and manufacturing technology. However, deviating forms are also conceivable for optimally covering corresponding shapes of components or surfaces to be heated.
  • the heater according to the invention whose heat distribution is distributed unevenly over its surface.
  • the SMD components may have different power consumption and heat dissipation and / or be distributed unevenly distributed over the surface.
  • the variability of the heater according to the invention is increased.
  • the tracks are always parallel to each other so that they can be bridged by the SMD components. In this case, a straight extension but also a curved extension of the tracks is possible. This also increases the variability of the heater according to the invention.
  • the method according to the invention serves to produce a heater as described above and has the step of: automatically loading the SMD components by means of an SMD placement machine. Thus, the installation cost of the heater is reduced.
  • a preferred embodiment of the method comprises the preceding step: etching a continuous overall recess. This step is associated with the manufacture of the flexible circuit board. With this step, the conductor tracks are manufactured.
  • an insulating layer is attached to the first side of the flexible conductor plate, which also covers the PTC heating elements. This serves as a contact protection and / or to direct the heat flow of the PTC heating elements down.
  • the size and / or the power of the heater is flexibly selected or reduced by the step: disconnecting an unnecessary part of the printed circuit board, e.g. by cutting parallel to the conductor tracks and main recesses.
  • the separation is preferably carried out in modules, the separated part then has a first and a second group of conductor tracks.
  • FIG. 1 shows a perspective view of part of the heater according to the invention according to a first embodiment consisting of two modules
  • FIG. 2 shows a plan view of the heater according to the invention from FIG. 1 without SMD components
  • FIG. 3 shows in a cross-section a part of the heater from FIGS. 1 and 2,
  • Figure 1 shows a perspective view of the embodiment of the flexible planar heater 1, which has a substantially rectangular flexible printed circuit board 2. At its upper side (visible in FIG. 1), two heating units or modules 3 which are adjacent to one another are provided, the dividing line of which is shown in dashed lines, and which are explained in greater detail with reference to FIG.
  • Each module 3 has a multiplicity of PTC heating elements 4, which are arranged in the manner of a matrix and are each formed by SMD components 4. They were positioned on the flexible circuit board 2 with an SMD placement machine and then soldered in an oven.
  • the heater 1 is arranged on the outer circumference of a tube 6, whereby a fluid to be heated flows through the tube 6 approximately along the longitudinal axis 8 of the tube 6.
  • the heater 1 is so bendable by the flexible design of its printed circuit board 2 that he or she can be easily adapted to the curvature according to the outer radius R of the tube 6.
  • the SMD components 4 (theoretically) are arranged tangentially to the outer wall of the tube 6.
  • the length of the SMD components 4 is dimensioned so short that a comparatively small radius of curvature R and thus a strong curvature of the heater 1 is possible.
  • SMD components 4 of the housing 1210 form.
  • the electrical contacting and thus power supply of the module 3 takes place via two so-called O-ohm resistors formed as SMD bridge components 12, which have a distance (shown in FIG. 2) between the two modules 3 bridged.
  • FIG. 2 shows a plan view of the top of the non-curved flexible printed circuit board 2 of the heater 1 with its two modules 3, wherein the SMD components. 4 have been omitted or are not yet set up.
  • FIG. 2 shows for each module 3 (uncovered) printed conductors 14 of a first group which alternate with printed conductors 16 of a second group.
  • the interconnects 14 of the first group are formed integrally with a first interconnect conductor 18, while the interconnects 16 of the second group are formed integrally with a second interconnect interconnect 20.
  • the two first interconnection interconnects 18 of the two modules 3 extend along a first edge 22 of the flexible printed circuit board 2, while the two second interconnect interconnects 20 of the two modules 3 extend along a second edge 24 of the flexible printed circuit board 2.
  • the two mutually parallel edges 22, 24 of the flexible printed circuit board 2 are curved in the assembly of the heater 1 on the outside of the tube 6 (see Figure 1) corresponding to the outer radius R of the tube 6.
  • Each module 3 has a continuous meandering overall recess, at which the top of the flexible printed circuit board 2 is not covered with copper.
  • Each overall recess consists of an alternating sequence of main recesses 26, the length of which approximately correspond to those of the conductor tracks 14, 16, and connection recesses 28, the length of which corresponds approximately to the width of the conductor tracks 14, 16.
  • the main recesses 26 are aligned parallel to the conductor tracks 14, 16, while the connection recesses 28 are aligned perpendicular thereto and thus parallel to the two edges 22, 24 of the carrier film 5 and parallel to the SMD components 4.
  • the main recesses 26 provide an alternating series of wider main recesses 26 across which extend a plurality (six in the illustrated embodiment) of SMD components 4 and respective narrower main recesses 26 which do not extend SMD components.
  • a further main recess 30 is provided, which not only separates a conductor track 14 of the first group from a conductor track 16 of the second group, but also separates the two first connection conductor tracks 18 and the two second connection conductor tracks 20 from each other. To do this extends the other main recess 30 over the full width of the heater 1 and the flexible circuit board. 2
  • the first module 3 is provided with an SMD connector 10, are supplied via the two modules 3 with power.
  • the further main recess 30 is bridged by two O-ohm resistors designed as SMD bridge components 12 (shown in FIG. 1). More specifically, the two first connection patterns 18 and the two second connection patterns 20 are connected to each other.
  • each SMD bridge component 12 two circular solder pads can be seen, to which leads (not shown) can be soldered, in order to electrically connect the two modules 3 with each other.
  • the heater can be significantly more curved in the transition region between the two modules 3, as allow the populated areas of the modules 3.
  • the heater can also be applied on both sides of a rounded edge of a component to be heated.
  • the dashed line from FIG. 1 then extends along the rounded edge of the component to be heated. On both sides of the rounded edge, e.g. respective level to be heated surfaces.
  • the interconnects 14, 16 and the interconnect tracks 18, 20 are perforated to maximize the flexibility of the two modules 3.
  • FIG. 3 shows, in a sectional view, a single PTC heating element designed as an SMD component 4, which is fastened to a small section of the flexible printed circuit board 2.
  • the two terminal regions of the SMD component 4 are soldered to a respective solder pad 34 with a respective solder 32.
  • the two solder pads 34 of SMD components 4 are formed from copper and in each case formed integrally with the conductor tracks 14, 16 of two different groups. Between the two solder pads 34, one of the main recesses 26 is provided.
  • FIG. 3 shows that solder resist 36 is provided in the main recess 26. Also between the solder pads 34 and the associated (not shown in Figure 3) printed conductors 14, 16 Lötstopplack 36 is provided. In contrast, the solder pads 34 are of course not covered with solder mask 36.
  • FIG. 3 shows the flexible printed circuit board 2, on the upper side of which the SMD components 4 are arranged, and through which the heat (in FIG. 3 downwards) is emitted to the tube 6 during operation of the heater 1 according to the invention.
  • the entire upper side of the heater 1 is coated with an insulating layer 38 made of silicone.
  • the insulating layer 38 forms a substantially flat surface upwards.
  • FIG. 4 shows a cross section through a small section of the heater 1 according to the invention with the flexible printed circuit board 2, wherein one of the conductor tracks 14 or
  • solder stop 36 can also be a Cover be provided.
  • the insulating layer 38 described with reference to FIG. 3 is shown.
  • FIG. 4 shows that these main recesses 26 and the printed conductors 14, 16 are completely covered with solder mask 36, wherein only the solder pads 34 (shown in FIG. 3) remain free, so that the contact regions of the SMD components 4 pass through the solder 32 can be contacted electrically.
  • 5 shows in a sectional view a section of a second embodiment of the heater according to the invention comparable to the illustration of Figure 3.
  • the difference to the first embodiment according to Figures 1 to 4 is seen in that at the bottom of the flexible circuit board 2 is a full-surface Heat distribution layer 40 is mounted made of copper.
  • a self-adhesive layer may be applied.
  • the heater 1 is simply glued to the component to be heated, in the illustrated embodiments of the pipe 6.
  • solder mask 36 it is also possible to provide a cover film instead of solder mask 36.
  • a flexible planar heater with a plurality of PTC heating elements which are formed by SMD components, and a method for producing such heaters.
  • the strip conductors are made wider than a length of the SMD components.

Landscapes

  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)

Abstract

L'invention concerne un dispositif de chauffage plat souple comportant plusieurs éléments chauffants CTP qui sont constitués de composants SMD ainsi qu'un procédé pour fabriquer des dispositifs de chauffage de ce type. Pour assurer la conduction thermique et/ou optimiser de la distribution de chaleur, les pistes conductrices sont conçues plus larges qu'une longueur des composants SMD.
PCT/EP2018/085638 2017-12-19 2018-12-18 Dispositif de chauffage plat souple et procédé pour le fabriquer WO2019121772A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18825674.7A EP3729909A1 (fr) 2017-12-19 2018-12-18 Dispositif de chauffage plat souple et procédé pour le fabriquer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017130508.4A DE102017130508A1 (de) 2017-12-19 2017-12-19 Flexibler flächiger Heizer und Verfahren zu dessen Herstellung
DE102017130508.4 2017-12-19

Publications (1)

Publication Number Publication Date
WO2019121772A1 true WO2019121772A1 (fr) 2019-06-27

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ID=64755563

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/085638 WO2019121772A1 (fr) 2017-12-19 2018-12-18 Dispositif de chauffage plat souple et procédé pour le fabriquer

Country Status (3)

Country Link
EP (1) EP3729909A1 (fr)
DE (1) DE102017130508A1 (fr)
WO (1) WO2019121772A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0320862A2 (fr) 1987-12-14 1989-06-21 Thermon Manufacturing Company Support pour thermistance chauffante à coefficient de température positif
DE29922947U1 (de) * 1999-12-29 2000-04-06 Wu, Chia-Hsiung, Taipeh/T'ai-pei Vorrichtung zur Wärmeisolierung
EP1544869A1 (fr) * 2002-06-19 2005-06-22 Matsushita Electric Industrial Co., Ltd. Element chauffant a thermistance a coefficient de temperature positif (ptc) souple et procede de fabrication d'element chauffant
EP1648199A1 (fr) 2004-10-18 2006-04-19 DBK David + Baader GmbH Elément chauffant avec conductivité thermique améliorée
JP2007227830A (ja) * 2006-02-27 2007-09-06 Matsushita Electric Ind Co Ltd 柔軟性ｐｔｃ発熱体
WO2008009283A1 (fr) * 2006-07-20 2008-01-24 Epcos Ag Dispositif de résistance et procédé de fabrication associé
DE102011000765A1 (de) 2011-02-16 2012-08-16 Dbk David + Baader Gmbh Heizeinrichtung und Leiterplatte
WO2013087511A1 (fr) 2011-12-15 2013-06-20 Iee International Electronics & Engineering S.A. Élément chauffant ohmique de type feuille
WO2014001414A1 (fr) * 2012-06-26 2014-01-03 Iee International Electronics & Engineering S.A. Dispositif de chauffage ptc sans commande de puissance électronique

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202011004140U1 (de) * 2010-04-06 2012-06-25 W.E.T. Automotive Systems Ag Multifunktionsprodukt

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0320862A2 (fr) 1987-12-14 1989-06-21 Thermon Manufacturing Company Support pour thermistance chauffante à coefficient de température positif
DE29922947U1 (de) * 1999-12-29 2000-04-06 Wu, Chia-Hsiung, Taipeh/T'ai-pei Vorrichtung zur Wärmeisolierung
EP1544869A1 (fr) * 2002-06-19 2005-06-22 Matsushita Electric Industrial Co., Ltd. Element chauffant a thermistance a coefficient de temperature positif (ptc) souple et procede de fabrication d'element chauffant
EP1648199A1 (fr) 2004-10-18 2006-04-19 DBK David + Baader GmbH Elément chauffant avec conductivité thermique améliorée
JP2007227830A (ja) * 2006-02-27 2007-09-06 Matsushita Electric Ind Co Ltd 柔軟性ｐｔｃ発熱体
WO2008009283A1 (fr) * 2006-07-20 2008-01-24 Epcos Ag Dispositif de résistance et procédé de fabrication associé
DE102011000765A1 (de) 2011-02-16 2012-08-16 Dbk David + Baader Gmbh Heizeinrichtung und Leiterplatte
WO2013087511A1 (fr) 2011-12-15 2013-06-20 Iee International Electronics & Engineering S.A. Élément chauffant ohmique de type feuille
DE112012005238T5 (de) 2011-12-15 2014-10-09 Iee International Electronics & Engineering S.A. Flächengebildeartiges Ohmsches Heizelement
WO2014001414A1 (fr) * 2012-06-26 2014-01-03 Iee International Electronics & Engineering S.A. Dispositif de chauffage ptc sans commande de puissance électronique

Also Published As

Publication number Publication date
DE102017130508A1 (de) 2019-06-19
EP3729909A1 (fr) 2020-10-28

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