WO2019119254A1

WO2019119254A1 - Heat dissipation structure of charging pile power module

Info

Publication number: WO2019119254A1
Application number: PCT/CN2017/117091
Authority: WO
Inventors: 黄银辉
Original assignee: 深圳市万景华科技有限公司
Priority date: 2017-12-19
Filing date: 2017-12-19
Publication date: 2019-06-27

Abstract

A heat dissipation structure of a charging pile power module, comprising a power supply housing (1), at least one integrated circuit board (2) that is provided within the power supply housing (1), a heat-generating component that is disposed on the integrated circuit board (2), and a heat transfer module that is in contact with the heat-generating component, the heat transfer module comprising a thermally conductive structure having a liquid cooling channel, and the liquid cooling channel being provided with a liquid inlet and a liquid outlet. The heat-generating component acts as the main heat source of the heat dissipation structure of a charging pile power module, and is the key part of the heat dissipation structure of a charging pile power module; the heat transfer module is directly in contact with the heat-generating component or thermally conductively contacts the same, thus ensuring that the heat generated by the heat-generating component may be quickly transmitted to the heat transfer module, the heat transfer module transferring the absorbed heat to an external heat-dissipation module, thereby achieving the effect of directly transferring heat generated by severely heated components to the outside.

Description

Heat dissipation structure of charging pile power module

Technical field

The solution belongs to the technical field of electric vehicle charging equipment, and more specifically relates to a heat dissipation structure of a charging pile power module.

Background technique

With the development of the economy, energy and environmental protection issues have become increasingly prominent. Countries all over the world have turned their attention to environmentally friendly and energy-saving electric vehicles. Electric vehicles have developed rapidly. As an energy supply station for new energy electric vehicles, the demand for electric vehicle charging piles continues to increase. In order to improve the charging efficiency, it is necessary to increase the power of the heat dissipation structure of the charging pile power module in the charging pile. While increasing the power of the heat dissipation structure of the charging pile power module, the components of the PCB circuit assembly in the heat dissipation structure of the charging pile power module, such as a MOS tube (metal oxide) The semiconductor and the inductive heating situation are intensified. In order to ensure the continuous and safe use of the charging pile, it is necessary to provide an efficient heat dissipation structure for the heat dissipation structure of the charging pile power module.

At present, the heat dissipation structure of the charging pile power module is external heat dissipation or heat dissipation of the housing, that is, the external cooling device or the cooling medium is used to cool the outer casing of the heat dissipation structure of the charging pile power module, and these methods are not directly related to heat generation. Severe components are dissipated, and the heat generated by the components with severe heat cannot be directly transmitted out by the heat conduction, which cannot meet the demand of the heat dissipation structure of the charging pile power module, thereby limiting the development of the heat dissipation structure of the charging pile power module.

technical problem

The purpose of the solution is to provide a heat dissipation structure of the charging pile power module, so as to solve the technical problem that the heat dissipation in the heat dissipation structure of the charging pile power module cannot be directly performed in the prior art.

Technical solution

To achieve the above objectives, the technical solution adopted by the solution is to provide a heat dissipation structure of the charging pile power module, including:

Power supply housing

At least one integrated circuit board, the integrated circuit board being located in the power supply housing;

a heat generating component, the heat generating component being disposed on the integrated circuit board;

a heat transfer module, the heat transfer module being disposed in contact with the heat generating component, the heat transfer module comprising a heat conductive structure having a liquid cooling passage, the liquid cooling passage having a liquid inlet and a liquid outlet.

Further, the heat transfer module further includes a liquid inlet end disposed at the liquid inlet, a liquid outlet end disposed at the liquid outlet, and the heat generating component includes a MOS tube, an inductor, and a transformer.

Further, the heat conducting structure includes a heat conducting plate having the liquid cooling passage, and two heat pipes respectively disposed in contact with the inductor and the heat conducting plate, the heat conducting plate including an upper plate with a liquid tank and A lower plate of the MOS tube is fixed, and a side of the lower plate adjacent to the upper plate is provided with a plurality of ribs, and a top of the rib is attached to a bottom of the liquid tank. The bottom of the rib is integrated with the lower plate.

Further, a gap is formed between both ends of the rib and a sidewall of the liquid tank, and the liquid inlet end and the liquid outlet end are respectively located at opposite ends of the liquid tank.

Further, one end of the rib is disposed in contact with the side wall of the liquid tank, and the other end of the rib has a gap between the side wall of the liquid tank, adjacent to the rib and the liquid tank The fitting portions are respectively located at both ends of the liquid tank.

Further, a side of the lower plate adjacent to the upper plate is provided with a plurality of heat dissipating fins.

Further, a side of the lower plate adjacent to the upper plate is provided with a plurality of heat dissipation columns.

Further, a sealing ring is disposed between the upper plate and the lower plate, and the upper plate and the lower plate are screwed or welded.

Further, the heat conducting structure comprises a plurality of copper tubes, an inlet diverter connected to the liquid inlet end, and an outlet flow splitter connected to the liquid outlet end, wherein the two ends of the copper tube are respectively The inlet splitter is connected to the outlet splitter.

Further, a heat conducting fixing plate for fixing the MOS tube is further included, and the MOS tube is screwed to the heat conducting fixing plate, and the copper tube penetrates the heat conducting fixing plate.

Further, a heat conduction fixing base for fixing the inductance is further included, and the copper tube penetrates the heat conduction fixing table.

Further, the heat conducting structure and the integrated circuit board are encapsulated by a thermal conductive potting compound.

Further, the upper plate is provided with a sealing groove, and the sealing ring is disposed in the sealing groove.

Beneficial effect

The heat dissipation structure of the charging pile power module provided by the solution has the beneficial effects that the heat generating component is the main heat source of the heat dissipation structure of the charging pile power module, and the heat transfer module is directly in contact with the heat generating component or is in thermal conduction through the solid medium. Ensure that the heat generated by the heating components can be quickly transferred to the heat transfer module (unlike the traditional air transfer or non-contact type), the heat transfer module transfers the absorbed heat to the heat dissipation module, thus achieving direct heat generation The heat generated by the heating components is transferred outwards.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description are only the solutions of the present embodiment. For some embodiments, other drawings may be obtained from those of ordinary skill in the art in light of the inventive workability.

1 is an exploded view of a heat dissipation structure of a charging post power module according to an embodiment of the present disclosure;

2 is an exploded view of a heat transfer module according to an embodiment of the present invention in a bottom view direction;

3 is a schematic structural view of a heat transfer module according to an embodiment of the present invention (when the liquid cooling channel is composed of a plurality of parallel channels);

4 is a schematic structural view of a heat transfer module according to an embodiment of the present invention (when the liquid cooling channel is a rotary type);

5 is an exploded view of a heat transfer module according to an embodiment of the present invention (when a heat dissipating fin is provided);

6 is an exploded view of a heat transfer module according to an embodiment of the present invention (when a heat dissipating column is provided);

7 is an overall view of a heat dissipation structure of a charging post power module according to an embodiment of the present disclosure;

8 is a schematic structural view of a heat transfer module according to an embodiment of the present invention (when the liquid cooling channel is composed of a copper pipe);

Among them, the various reference numerals in the figure:

1, power supply housing; 2, integrated circuit board; 3, MOS tube; 4, inductance; 5, liquid inlet end; 6, liquid outlet end; 7, upper plate; 701, liquid trough; 8, lower plate; 801, ribs; 802, heat-dissipating fins; 803, heat-dissipating column; 9, copper tube; 10, liquid inlet splitter; 11, liquid-flow splitter; 12, heat-conducting fixed plate;

Embodiments of the invention

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present solution more clear, the present embodiment will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to be limiting.

It is to be noted that when an element is referred to as being "fixed" or "in" another element, it can be directly on the other element or indirectly. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top" The orientation or positional relationship of the "bottom", "inside", "outside" and the like is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present scheme and simplified description, and does not indicate or imply the indicated device. Or the components must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention. In the description of the present scheme, the meaning of "a plurality" is two or more unless specifically and specifically defined.

Please refer to FIG. 1 to FIG. 8 together. The heat dissipation structure of the charging post power module provided by the present solution will be described. The heat dissipation structure of the charging post power module includes a power supply housing 1, at least one integrated circuit board 2 disposed in the power supply housing 2, a heat generating component disposed on the integrated circuit board 2, and heat transfer disposed in contact with the heat generating component. The module, the heat transfer module comprises a heat conducting structure having a liquid cooling passage having a liquid inlet and a liquid outlet.

Compared with the prior art, the heat dissipation structure of the charging pile power module provided by the solution has the beneficial effects that the heat generating component is the main heat source of the heat dissipation structure of the charging pile power module, and is the key to heat dissipation of the heat dissipation structure of the charging pile power module. The heat exchange module is directly in contact with the heat-generating component or is in thermal conduction contact with the solid medium, so that the heat generated by the heat-generating component can be quickly transmitted to the heat transfer module (different from the conventional air transfer or non-contact type). The heat transfer module transfers the absorbed heat to the external heat dissipation module, thereby achieving the effect of directly transferring the heat generated by the components with more severe heat. Specifically, the heat conducting structure on the heat transfer module directly contacts the heat generating component, and the coolant flowing from the liquid inlet into the liquid cooling channel in the heat conducting structure absorbs heat and then flows out from the liquid outlet, and then flows to the charging pile power module for heat dissipation. Thermal module outside the structure. Since the charging pile is mainly used for outdoor roads and is in a dust environment for a long time, except for the liquid inlet and the liquid outlet protruding from the power supply housing 1, other, for example, the integrated circuit board 2 and the heat transfer module are all sealed in the power supply housing 1. Internally, and the power supply housing 1 has no through holes for installing the liquid inlet and the liquid outlet, and the other effectively avoids the problem that the heat dissipation structure of the charging pile power module enters the dust during use. .

Further, referring to FIG. 2, FIG. 5 and FIG. 6, as a specific implementation manner of the heat dissipation structure of the charging post power module provided by the present solution, the heat transfer module further includes a liquid inlet end 5 disposed at the liquid inlet. The heat-generating component comprises a MOS tube 3, an inductor 4, a transformer and the like, and the heat-conducting structure comprises a heat-conducting plate having a liquid-cooling passage, and a heat pipe provided at both ends in contact with the inductor 4 and the heat-conducting plate respectively. The heat conducting plate includes an upper plate 7 having a liquid tank 701 and a lower plate 8 for fixing the MOS tube 3. The side of the lower plate 8 adjacent to the upper plate 7 is provided with a plurality of ribs 801, the top of the rib 801 and the liquid tank 701. Bottom fit. The bottom of the rib 801 is integral with the lower plate 8. Specifically, the rib 801 on the lower plate 8 is attached to the bottom of the liquid tank 701 on the upper plate 7 (that is, sealedly connected), so that the rib 801 forms a liquid cooling passage in the liquid tank 701, and the coolant passes through the rib 801. The gap between them flows. At the same time, the heat pipe directs the heat on the inductor 4 to the heat conducting plate to achieve heat dissipation to the inductor 4. Preferably, the heat conducting plate is selected from an aluminum plate, and the aluminum plate has better thermal conductivity while reducing the weight of the overall structure.

Further, referring to FIG. 3 and FIG. 5 , as one embodiment of the heat dissipation structure of the charging post power module provided by the present solution, both ends (both ends in the longitudinal direction) of the rib 801 are opposite to the sidewall of the liquid tank 701 . There is a gap therebetween, and the liquid inlet end 5 and the liquid discharge end 6 are respectively located at opposite ends of the liquid tank 701. That is, the coolant enters the liquid tank 701 through the liquid inlet end 5 at one end and then passes through a plurality of parallel passages to the other end of the liquid tank 701. The passage is composed of a gap between adjacent ribs 801, and a plurality of parallel passages are formed. The liquid cooling channel (that is, a plurality of parallel channels constitute the liquid cooling channel). At the same time, each row of MOS tubes 3 corresponds to one channel to ensure the effect of heat transfer.

Preferably, referring to FIG. 4 and FIG. 6 , as a specific implementation manner of the heat dissipation structure of the charging post power module provided by the present solution, the rib 801 can be disposed in the following manner: one end of the rib 801 and the side wall of the liquid tank 701 In the fitting arrangement (that is, the completely sealed connection), the other end of the rib 801 has a gap with the side wall of the liquid tank 701, and the end of the rib 801 is the both ends of the rib 801 in the longitudinal direction, and the adjacent rib 801 and the liquid tank The bonding portions of 701 are respectively located at both ends of the liquid tank 701. That is, the liquid cooling passage formed by the rib 801 in the liquid tank 701 is a reciprocating cycle type (the coolant returns from the one end to the other end and then returns to the opposite section until flowing out from the liquid discharge end 6, that is, several end to end The channels are connected in series to form the liquid cooling passages. For example, when the number of the ribs 801 is two, the liquid cooling passage formed by the ribs 801 in the liquid tank 701 is S-shaped.

Further, referring to FIG. 5 and FIG. 6 , as one embodiment of the heat dissipation structure of the charging post power module provided by the present solution, the lower plate 8 is provided with a plurality of heat dissipating fins 802 or a plurality of heat dissipations on a side of the upper plate 7 . The column 803 is provided with a sealing ring between the upper plate 7 and the lower plate 8, and the upper plate 7 is screwed or welded to the lower plate 8. Specifically, the heat dissipating fins 802 or the heat dissipating post 803 are provided, the contact area of the lower plate 8 with the cooling liquid is increased, the rate of heat transfer is accelerated, and the heat transfer speed to the MOS tube 3 is increased.

Further, as a specific implementation manner of the heat dissipation structure of the charging post power module provided by the present solution, the heat conducting structure and the integrated circuit board 2 are encapsulated by a thermal conductive potting compound. Specifically, the heat conductive structure and the integrated circuit board 2 are packaged together by the thermal conductive potting glue, which not only can increase the heat conduction efficiency but also prevent the dust from adhering to the integrated circuit board 2 and affect the normal operation of the components (the charging pile is mainly used for outdoor use). The roadside, long-term in the dust environment, is susceptible to dust, so the heat dissipation structure of the charging pile power module provided by this scheme has good practicability).

Further, as a specific implementation manner of the heat dissipation structure of the charging post power module provided by the present solution, the upper plate 7 is provided with a sealing groove, and the sealing ring is disposed in the sealing groove.

Preferably, referring to FIG. 1 and FIG. 8 , as a specific implementation manner of the heat dissipation structure of the charging post power module provided by the present solution, the heating component includes a MOS tube 3 and an inductor 4, and the heat conducting structure can be set as follows: The heat conducting structure comprises a plurality of copper tubes 9 (the copper tubes 9 constitute the liquid cooling passages), an inlet diverter 10 connected to the inlet end 5, an outlet diverter 11 connected to the outlet end 6, and a copper tube 9 Both ends are connected to the liquid inlet splitter 10 and the liquid discharge splitter 11, respectively. Specifically, the coolant first enters the inflow diverter 10 from the inlet end 5, and the inlet diverter 10 divides the coolant into the plurality of copper tubes 9 through a plurality of outlets, and the coolant in the plurality of copper tubes 9 After passing through the liquid discharge splitter 11, it flows out through the liquid discharge end 6.

Further, as a specific implementation manner of the heat dissipation structure of the charging post power module provided by the present solution, the heat conduction fixing plate 12 for fixing the MOS tube 3 is further included, and the MOS tube 3 is screwed to the heat conduction fixing plate 12, and the copper tube 9 is connected. The heat conducting fixing plate 12 is penetrated. The non-connecting end of the MOS tube 3 is connected to the heat-conductive fixing plate 12 by screws, and the heat of the MOS tube 3 is transferred to the copper tube 9 by the heat-conductive fixing plate 12. Further, a heat conduction fixing table 13 for fixing the inductor 4 is further included, and the copper tube 9 penetrates the heat conduction fixing table 13. The inductor 4 is covered and fixed by the heat-conducting fixing table 13, and the heat-transfer fixing table 13 transmits the heat generated by the inductor 4 to the copper tube 9.

The above description is only for the preferred embodiment of the present solution, and is not intended to limit the present solution. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present solution should be included in the protection of the present solution. Within the scope.

Claims

The heat dissipation structure of the charging pile power module is characterized in that it comprises:

Power supply housing

At least one integrated circuit board located in the power supply housing;

a heating component disposed on the integrated circuit board;

The heat transfer module is disposed in contact with the heat generating component, and the heat transfer module includes a heat conductive structure having a liquid cooling passage, and the liquid cooling passage has a liquid inlet and a liquid outlet.
The heat dissipation structure of the charging post power module of claim 1 , wherein the heat transfer module further comprises a liquid inlet end disposed at the liquid inlet, and a liquid outlet end disposed at the liquid outlet The heat generating component includes a MOS transistor, an inductor, and a transformer.
The heat dissipation structure of a charging post power module according to claim 2, wherein the heat conducting structure comprises a heat conducting plate having the liquid cooling passage, and heat pipes respectively disposed at two ends in contact with the inductor and the heat conducting plate The heat conducting plate includes an upper plate having a liquid tank and a lower plate for fixing the MOS tube, and a side of the lower plate adjacent to the upper plate is provided with a plurality of ribs, a top of the rib and the rib The bottom of the tank is fitted.
The heat dissipation structure of a charging post power module according to claim 3, wherein both ends of the rib have a gap with a sidewall of the liquid tank, the liquid inlet end and the liquid discharge The ends are respectively located at opposite ends of the liquid tank.
The heat dissipation structure of a charging post power module according to claim 3, wherein one end of the rib is disposed in contact with a side wall of the liquid tank, and the other end of the rib and a side wall of the liquid tank There is a gap therebetween, and the abutting portions of the adjacent ribs and the liquid tank are respectively located at both ends of the liquid tank.
The heat dissipation structure of the charging post power module according to any one of claims 3 to 5, characterized in that: a side of the lower plate adjacent to the upper plate is provided with a plurality of heat dissipating fins.
The heat dissipation structure of the charging post power module according to any one of claims 3 to 5, wherein a plurality of heat dissipating columns are disposed on a side of the lower plate adjacent to the upper plate.
The heat dissipation structure of the charging post power module according to any one of claims 3 to 5, wherein a sealing ring is disposed between the upper plate and the lower plate, and the upper plate and the lower plate are The screws are connected or welded.
The heat dissipation structure of a charging post power module according to claim 2, wherein the heat conducting structure comprises a plurality of copper tubes, an inlet diverter connected to the liquid inlet end, and the liquid discharging end The liquid discharge splitter has two ends of the copper pipe connected to the liquid inlet splitter and the liquid discharge splitter, respectively.
The heat dissipation structure of a charging post power module according to claim 9, further comprising a heat conducting fixing plate for fixing the MOS tube, wherein the MOS tube is screwed to the heat conducting fixing plate, the copper tube Through the heat conducting fixing plate.
The heat dissipation structure of a charging post power module according to claim 9, further comprising a heat conduction fixing base for fixing the inductance, wherein the copper tube penetrates the heat conduction fixing base.
The heat dissipation structure of the charging post power module according to any one of claims 1 to 5 and 9-11, wherein the heat conducting structure and the integrated circuit board are encapsulated by a thermal conductive potting compound.
The heat dissipation structure of the charging post power module according to claim 8, wherein the upper plate is provided with a sealing groove, and the sealing ring is disposed in the sealing groove.
The heat dissipation structure of the charging post power module according to claim 3, wherein the heat conducting plate is an aluminum plate.
The heat dissipation structure of a charging post power module according to claim 1, wherein the number of the integrated circuit boards is two, and the two integrated circuit boards are respectively located above and below the heat transfer module.