WO2019114186A1 - 热保护型压敏电阻 - Google Patents

热保护型压敏电阻 Download PDF

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Publication number
WO2019114186A1
WO2019114186A1 PCT/CN2018/086142 CN2018086142W WO2019114186A1 WO 2019114186 A1 WO2019114186 A1 WO 2019114186A1 CN 2018086142 W CN2018086142 W CN 2018086142W WO 2019114186 A1 WO2019114186 A1 WO 2019114186A1
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WO
WIPO (PCT)
Prior art keywords
lead
varistor
protection type
conductive layer
thermal
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Application number
PCT/CN2018/086142
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English (en)
French (fr)
Inventor
徐忠厚
陈石
陈飞龙
陈祥洲
Original Assignee
厦门赛尔特电子有限公司
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Application filed by 厦门赛尔特电子有限公司 filed Critical 厦门赛尔特电子有限公司
Priority to US16/767,126 priority Critical patent/US20200373112A1/en
Publication of WO2019114186A1 publication Critical patent/WO2019114186A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors
    • H01C7/126—Means for protecting against excessive pressure or for disconnecting in case of failure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/20—Bases for supporting the fuse; Separate parts thereof
    • H01H85/2045—Mounting means or insulating parts of the base, e.g. covers, casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/20—Bases for supporting the fuse; Separate parts thereof
    • H01H85/205—Electric connections to contacts on the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/30—Means for indicating condition of fuse structurally associated with the fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/165—Casings

Definitions

  • the present application relates to a varistor, and in particular to a thermally protected varistor.
  • the thermal protection type varistor disclosed in the present application has the characteristics of small volume, fast response speed, high reliability, and the like, and can be widely used in the fields of household appliances, power adapters, circuit overvoltage protection of driving power sources, etc., and can be widely used instead of the application field. Unshielded varistor used.
  • the technical problem to be solved by the present application is to provide a thermal protection type varistor which is small in size, fast in response speed, high in reliability, and can be widely applied to various fields.
  • a thermal protection type varistor of the present application includes a varistor chip, a temperature fuse, and a lead, wherein the varistor chip has a first conductive layer and a second conductive layer, and the lead includes a first lead, a second lead and a third lead; the first lead is connected to the first conductive layer at one end and the other end is taken out; the first end of the thermal fuse is taken out as a second lead, and the second end of the thermal fuse is connected to the second conductive layer; One end of the lead is connected to the second conductive layer, and the other end is led out; the thermal fuse is an axial type thermal fuse and is placed close to the varistor chip. Connections referred to herein include, but are not limited to, solders commonly used in the field.
  • the first end of the thermal fuse described herein refers to the first end of the thermal fuse, and the second end of the thermal fuse refers to the second end of the thermal fuse.
  • the varistor chip is square.
  • the third lead and the thermal fuse are connected to different locations of the second conductive layer.
  • the third lead and the thermal fuse are soldered to each other and connected to the same position of the second conductive layer.
  • the third lead and the temperature fuse are flattened, which increases the connection contact area with the varistor chip and improves the sensitivity of heat conduction.
  • the second end of the thermal fuse is integrated with the third lead, that is, when the second end of the thermal fuse is sufficiently long, the second end lead is directly used as the third lead, and the second end lead is soldered to the first
  • the two conductive layers are led out as pins.
  • the third lead is diagonally across and in close contact with the upper surface of the varistor chip to more accurately and quickly transfer the temperature of the varistor.
  • the second lead is drawn straight out in a straight line.
  • the second lead extends at a right angle around the two adjacent sides of the varistor chip.
  • an encapsulating material is provided to encapsulate the varistor chip and the thermal fuse, the leads being drawn from the encapsulating material as pins. Specifically, the first lead, the second lead, and the third lead are respectively extracted from the encapsulating material into three pins.
  • the encapsulating material has a visible window on the thermal fuse, and the insulative housing is transparent or translucent through which the state of the fusible alloy can be observed.
  • the outer surface of the encapsulating material is provided with a casing, so that the MOV breakdown of the product under abnormal overvoltage may be invalidated during the process of disconnecting the thermal fuse, and there is no fire hazard on the surface of the product.
  • a heat insulating member is provided between the sealing material and the casing, and the heat insulator may be an inorganic material such as sandstone or an organic material commonly used for heat insulation.
  • the varistor chip has upper and lower end faces opposed in the thickness direction, and side end faces connecting the upper end face and the lower end face; the temperature fuse is disposed adjacent to the side end face of the varistor chip.
  • Such an arrangement minimizes the volume of the thermally protected varistor without increasing the thickness of the overall product.
  • the thermal protection type varistor of the present application can more effectively and accurately transfer the heat generated by the varistor chip to the temperature fuse when the varistor chip is abnormal, thereby shortening the time required for the temperature fuse to open the circuit;
  • the thermal protection type varistor is small in size and easy to install
  • the thermal protection type varistor is based on the existing varistor chip structure, has a simple structure, is easy to manufacture, and has low cost.
  • FIG. 1 is a structural view of a thermal protection type varistor according to Embodiment 1 of the present application.
  • FIG. 2 is a structural view of a thermal protection type varistor according to Embodiment 2 of the present application.
  • Fig. 3 is a structural view showing a thermal protection type varistor according to a third embodiment of the present application.
  • FIG. 1 shows a thermal protection type varistor comprising a square varistor chip 1 having a first conductive layer 11 and a second conductive layer 12.
  • the lead wires 4 are provided for connection and extraction, wherein the leads include a first lead 41, a second lead 42, and a third lead 43.
  • One end of the first lead 41 is soldered to the first conductive layer 11 of the varistor chip 1, and the other end is taken out as a lead.
  • the axial type thermal fuse 2 is disposed close to the upper end surface of the varistor chip 1, and includes a fusible alloy 21, the flux breaker 22 is coated on the outside of the fusible alloy 21, and the insulating shell 23 made of glass will be fusible alloy 21 and The flux breaker 22 is wrapped, and the insulating case 23 is sealed with a sealing resin 24.
  • the first end of the thermal fuse 2 extends as a second lead 42 at a right angle along the right end surface of the varistor chip 1, and protrudes from the lower side of the varistor chip 1 as a lead. This arrangement can be increased in product volume. In this case, the length of the second electrode 42 drawn from the thermal fuse 2 is increased, which improves the safety of the product by wave soldering.
  • the second end of the thermal fuse 2 is soldered to the third lead 43 and soldered together to the second conductive layer 12.
  • the encapsulating material 3 encloses the varistor chip 1 and the thermal fuse 2, and has a notch as a visible window at the thermal fuse 2, through which the thermal fuse can be directly observed and the fusible is observed through its transparent insulating casing.
  • the first lead 41, the second lead 42, and the third lead 43 are taken out from the encapsulating material 3 as pins, respectively.
  • the current flows from the first lead 41 through the first conductive layer 11 through the varistor chip 1, and after flowing out of the second conductive layer 12, a part is led out through the third lead 43, and a part flows to the temperature fuse 2, and then is taken out through the second lead 42.
  • the structure of the thermal protection type varistor is basically similar to that of Embodiment 1, except that the second end of the thermal fuse 2 is integrated with the third lead 43.
  • the third lead 43 is diagonally across the upper surface of the varistor chip 1 and is in close contact therewith.
  • the structure of the thermal protection type varistor is basically similar to that of Embodiment 2, except that the temperature fuse 2 is disposed close to the right end surface of the varistor chip 1, and one end of the second lead 42 is soldered to the temperature fuse. 2. The other end is directly drawn to the lower side of the varistor chip 1 as a pin.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Fuses (AREA)

Abstract

一种热保护型压敏电阻，其包括压敏电阻芯片（1）、温度保险丝（2）、引线（4），其中压敏电阻芯片（1）具有第一导电层（11）和第二导电层（12），引线（4）包括第一引线（41）、第二引线（42）和第三引线（43）；第一引线（41）一端连接至第一导电层（11），另一端引出；温度保险丝（2）的第一端作为第二引线（42）引出，温度保险丝（2）的第二端连接至第二导电层（12）；第三引线（43）一端连接至第二导电层（12），另一端引出；温度保险丝（2）为轴向型温度保险丝并紧贴压敏电阻芯片（1）设置。该热保护型压敏电阻在压敏电阻芯片（1）异常时，能够更加有效准确地将压敏电阻芯片（1）产生的热量传递到温度保险丝（2），缩短了温度保险丝（2）断开电路所需要的时间；体积小，便于安装，结构简单，制造容易，成本低。

Description

热保护型压敏电阻
本申请要求在2017年12月15日提交中国专利局、申请号为201721762171.3、名称为“热保护型压敏电阻”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及一种压敏电阻，特别地涉及一种热保护型压敏电阻。
背景技术
目前，各种各样家用电器已经成为人们日常生活必不可少的组成部分，当我们在享受各种功能繁多的家用电器给生活带来方便的同时，也存在着家用电器巨大的安全隐患，我们经常可以在国内外媒体上看到各种由于家用电器的安全问题引发的事故，主要有：烟雾、火灾、甚至爆炸等，这些事故的发生又多与压敏电阻失效后未能及时脱离电路相关。目前具有热保护功能的压敏电阻要么当压敏电阻发生劣化产生高温时热传导较慢，不能及时断开电路，导致着火危险的产生；要么体积较大，制造方法成本也高，不能适用于小型电源。本申请公开的热保护型压敏电阻具有体积小、响应速度快，可靠性高等特点，可以广泛用于家用电器、电源适配器、驱动电源的电路过压保护等领域，可以替代该应用领域现在广泛使用的无防护的压敏电阻。
发明内容
本申请要解决的技术问题在于提供一种热保护型压敏电阻，其体积小，响应速度快，可靠性高，可以广泛适用于多种领域。
为了解决上述技术问题，本申请的一种热保护型压敏电阻包括压敏电阻芯片、温度保险丝、引线，其中压敏电阻芯片具有第一导电层和第二导电层，引线包括第一引线、第二引线和第三引线；第一引线一端连接至第一导电层，另一端引出；温度保险丝的第一端作为第二引线引出，温度保险丝的第二端连接至第二导电层；第三引线一端连接至第二导电层，另一端引出；温度保险丝为轴向型温度保险丝并紧贴压敏电阻芯片设置。本文所指的连接包括但不仅限于该领域通常应用的焊接。此处所述的温度保险丝的第一端是指温度保险丝第一端引线，温度保险丝的第二端指温度保险丝第二端引线。
优选地，压敏电阻芯片为方形。
优选地，第三引线与温度保险丝连接至第二导电层的不同位置。
优选地，第三引线与温度保险丝相互焊接，连接至第二导电层的同一位置。
优选地，第三引线与温度保险丝焊接处为扁平状，增加了与压敏电阻芯片的连接接触面积，提升了热传导的灵敏度。
优选地，温度保险丝的第二端与所述第三引线为一体，即当温度保险丝第二端足够长时，直接将第二端引线作为第三引线，这时将第二端引线焊接至第二导电层上并引出作为引脚。优选使第三引线斜跨压敏电阻芯片的上表面并与其紧贴接触，以便更准确快速地传输压敏电阻的温度。
优选地，第二引线呈直线直接引出。
优选地，第二引线围绕压敏电阻芯片相邻的两个侧面呈直角延伸引出。
优选地，设置封装材料包覆所述压敏电阻芯片和所述温度保险丝，所述引线从所述封装材料中引出作为引脚。具体地，第一引线、第二引线和第三引线分别从封装材料中引出成为三个引脚。
优选地，封装材料在温度保险丝上有可视窗口，绝缘外壳为透明或半透明的，能够通过该窗口观察所述易熔合金状态。
优选地，封装材料外部设置有壳体，可以使产品在异常过电压下MOV击穿失效到温度保险丝断开的过程中，产品表面不会出现着火隐患。
优选地，在封装材料和壳体之间设置有隔热件，该隔热体可为沙石等无机材料或常用于隔热的有机材料等。
优选地，压敏电阻芯片具有在厚度方向上相对的上端面和下端面，以及连接上端面和下端面的侧端面；温度保险丝紧贴压敏电阻芯片的侧端面设置。这样的设置使热保护型压敏电阻体积最小化的同时不会增加整个产品的厚度。
本申请的有益效果：
1.本申请的热保护型压敏电阻在压敏电阻芯片异常时，能够更加有效准确地将压敏电阻芯片产生的热量传递到温度保险丝，缩短了温度保险丝断开电路所需要的时间；
2.热保护型压敏电阻的体积小，便于安装；
3.热保护型压敏电阻基于现有的压敏电阻芯片结构，其结构简单，制造容易，成本低。
附图说明
图1为本申请实施例1的热保护型压敏电阻的结构图；
图2为本申请实施例2的热保护型压敏电阻的结构图；
图3为本申请实施例3的热保护型压敏电阻的结构图。
其中：
1——压敏电阻芯片
11——第一导电层
12——第二导电层
2——温度保险丝
21——易熔合金
22——助熔断剂
23——绝缘外壳
24——封口树脂
3——封装材料
4——引线
41——第一引线
42——第二引线
43——第三引线
具体实施方式
下面结合实施例及附图对本申请作进一步详细的描述。应当理解，此处所描述的具体实施例仅用以解释本申请，不应视为对本申请的具体限制。
实施例1
图1示出了一种热保护型压敏电阻，其包括方形的压敏电阻芯片1，该压敏电阻芯片1具有第一导电层11和第二导电层12。设置引线4进行连接和引出，其中引线包括第一引线41、第二引线42、第三引线43。第一引线41一端焊接至压敏电阻芯片1的第一导电层11，另一端引出作为引脚。轴向型温度保险丝2紧贴压敏电阻芯片1的上侧端面设置，包括易熔合金21，助熔断剂22包覆在易熔合金21外面，玻璃制的绝缘外壳23将易熔合金21和助熔断剂22进行包裹，用封口树脂24对绝缘外壳23进行封口。温度保险丝2的第一端作为第二引线42沿压敏电阻芯片1的右侧端面呈直角延伸，伸出压敏电阻芯片1的下侧面作为引脚，这种设置能在产品体积不增加的情况下增加从温度保险丝2引出的第二电极42的长度，这样可以提升产品通过波峰焊接的安全性。温度保险丝2的第二端与第三引线43焊接在一起，并一同焊接至第二导电层12。
封装材料3包覆压敏电阻芯片1和温度保险丝2，并在温度保险丝2处具有缺口作为可视窗口，通过该缺口可以直接观察到温度保险丝，并透过其透明的绝缘外壳观察到易熔合金21的 情况。第一引线41、第二引线42和第三引线43从封装材料3中引出分别作为引脚。电流从第一引线41经过第一导电层11通过压敏电阻芯片1，从第二导电层12流出后，一部分经过第三引线43引出，一部分流向温度保险丝2，然后通过第二引线42引出。
实施例2
如图2所示，热保护型压敏电阻的结构与实施例1基本相似，其不同在于温度保险丝2的第二端与第三引线43为一体。第三引线43斜跨压敏电阻芯片1的上表面并与其紧贴接触。
实施例3
如图3所示，热保护型压敏电阻的结构与实施例2基本相似，其不同在于该温度保险丝2紧贴压敏电阻芯片1的右侧端面设置，第二引线42一端焊接至温度保险丝2，另一端向压敏电阻芯片1的下侧方呈直线直接引出，作为引脚。
应当理解，本申请的上述实施例仅仅是为清楚地说明本申请所举例，而并非是对本申请的实施方式的限定。对于本领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无法对所有的实施方式予以穷举。凡是属于本申请的技术方案所引申出的显而易见的变化或改变仍处于本申请的保护范围之列。

Claims (13)

  1. 一种热保护型压敏电阻，包括压敏电阻芯片、温度保险丝、引线，其中所述压敏电阻芯片具有第一导电层和第二导电层，其特征在于，所述引线包括第一引线、第二引线和第三引线；所述第一引线一端连接至所述第一导电层，另一端引出；所述温度保险丝的第一端作为第二引线引出，所述温度保险丝的第二端连接至第二导电层；所述第三引线一端连接至第二导电层，另一端引出；所述温度保险丝为轴向型温度保险丝并紧贴所述压敏电阻芯片设置。
  2. 根据权利要求1所述的热保护型压敏电阻，其特征在于，所述压敏电阻芯片为方形。
  3. 根据权利要求1或2所述的热保护型压敏电阻，其特征在于，所述第三引线与所述温度保险丝连接至所述第二导电层的不同位置。
  4. 根据权利要求1或2所述的热保护型压敏电阻，其特征在于，所述第三引线与所述温度保险丝相互焊接，连接至所述第二导电层的同一位置。
  5. 根据权利要求4所述的热保护型压敏电阻，其特征在于，所述第三引线与所述温度保险丝焊接处为扁平状。
  6. 根据权利要求1或2所述的热保护型压敏电阻，其特征在于，所述温度保险丝的第二端与所述第三引线为一体。
  7. 根据权利要求1或2所述的热保护型压敏电阻，其特征在于，所述第二引线呈直线直接引出。
  8. 根据权利要求1或2所述的热保护型压敏电阻，其特征在于，所述第二引线围绕压敏电阻芯片相邻的两个侧面呈直角延伸引出。
  9. 根据权利要求1或2所述的热保护型压敏电阻，其特征在于，设置封装材料包覆所述压敏电阻芯片和所述温度保险丝，所述引线从所述封装材料中引出作为引脚。
  10. 根据权利要求9所述的热保护型压敏电阻，其特征在于，所述封装材料在所述温度保险丝上有可视窗口，所述绝缘外壳为透明或半透明的，能够通过该窗口观察所述易熔合金状态。
  11. 根据权利要求1或2所述的热保护型压敏电阻，其特征在于，所述的封装材料外部设置有壳体。
  12. 根据权利要求11所述的热保护型压敏电阻，其特征在于，所述在所述封装材料和所述壳体之间设置有隔热件。
  13. 根据权利要求1所述的热保护型压敏电阻，其特征在于，所述压敏电阻芯片具有在厚度方向上相对的上端面和下端面，以及连接所述上端面和下端面的侧端面；所述温度保险丝紧贴压敏电阻芯片的侧端面设置。
PCT/CN2018/086142 2017-11-10 2018-05-09 热保护型压敏电阻 WO2019114186A1 (zh)

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